TCA0372, TCA0372B, NCV0372B 1.0 A Output Current, Dual Power Operational Amplifiers http://onsemi.com The TCA0372 is a monolithic circuit intended for use as a power operational amplifier in a wide range of applications, including servo amplifiers and power supplies. No deadband crossover distortion provides better performance for driving coils. Features • • • • • • • • • • PDIP−8 DP1 SUFFIX CASE 626 8 Output Current to 1.0 A Slew Rate of 1.3 V/ms Wide Bandwidth of 1.1 MHz Internal Thermal Shutdown Single or Split Supply Operation Excellent Gain and Phase Margins Common Mode Input Includes Ground Zero Deadband Crossover Distortion NCV devices are AEC−Q100 Qualified and PPAP Capable These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant VCC 1 PDIP−16 DP2 SUFFIX CASE 648 16 1 SOIC−16W DW SUFFIX CASE 751G 16 1 16 1 Current Bias Monitoring SOEIAJ−16 DM2 SUFFIX CASE 966 ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 6 of this data sheet. Inv. Input Output DEVICE MARKING INFORMATION See general marking information in the device marking section on page 6 of this data sheet. Noninv. Input Thermal Protection VEE Figure 1. Representative Block Diagram © Semiconductor Components Industries, LLC, 2013 May, 2013 − Rev. 11 1 Publication Order Number: TCA0372/D TCA0372, TCA0372B, NCV0372B MAXIMUM RATINGS Rating Symbol Value Unit VS 40 V Input Differential Voltage Range VIDR Note 1 V Input Voltage Range VIR Note 1 V Supply Voltage (from VCC to VEE) Junction Temperature (Note 2) TJ +150 °C Operating Temperature Range TA −40 to +125 °C Storage Temperature Range Tstg −55 to +150 °C IO 1.0 A Peak Output Current (Nonrepetitive) I(max) 1.5 Thermal Resistance, Junction−to−Air Case 626 Case 648 Case 751G RqJA Thermal Resistance, Junction−to−Case Case 626 Case 648 Case 751G RqJC DC Output Current 137 72 80 23 10 12 A °C/W °C/W Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. Either or both input voltages should not exceed the magnitude of VCC or VEE. 2. Power dissipation must be considered to ensure maximum junction temperature (TJ) is not exceeded. http://onsemi.com 2 TCA0372, TCA0372B, NCV0372B DC ELECTRICAL CHARACTERISTICS (VCC = +15 V, VEE = −15 V, RL connected to ground, TA = −40° to +125°C.) Characteristics Symbol Min Typ Max − − 1.0 − 15 20 DVIO/DT − 20 − mV/°C Input Bias Current (VCM = 0) IIB − 100 500 nA Input Offset Current (VCM = 0) IIO − 10 50 nA Large Signal Voltage Gain VO = ±10 V, RL = 2.0 k AVOL 30 100 − V/mV Output Voltage Swing (IL = 100 mA) TA = +25°C TA = Tlow to Thigh TA = +25°C TA = Tlow to Thigh VOH 14.0 13.9 − − 14.2 − −14.2 − − − −14.0 −13.9 Output Voltage Swing (IL = 1.0 A) VCC = +24 V, VEE = 0 V, TA = +25°C VCC = +24 V, VEE = 0 V, TA = Tlow to Thigh VCC = +24 V, VEE = 0 V, TA = +25°C VCC = +24 V, VEE = 0 V, TA = Tlow to Thigh VOH 22.5 22.5 − − 22.7 − 1.3 − − − 1.5 1.6 Input Common Mode Voltage Range TA = +25°C TA = Tlow to Thigh VICR Input Offset Voltage (VCM = 0) TA = +25°C TA, Tlow to Thigh VIO Average Temperature Coefficient of Offset Voltage VOL VOL Unit mV V V V VEE to (VCC −1.0) VEE to (VCC −1.3) Common Mode Rejection Ratio (RS = 10 k) CMRR 70 90 − dB Power Supply Rejection Ratio (RS = 100 W) PSRR 70 90 − dB − − − − 5.0 8.0 − − 10 10 14 14 Power Supply Current TA = +25°C TA = Tlow to Thigh ID TCA0372 TCA0372B/NCV0372B TCA0372 TCA0372B/NCV0372B mA AC ELECTRICAL CHARACTERISTICS (VCC = +15 V, VEE = −15 V, RL connected to ground, TA = +25°C, unless otherwise noted.) Characteristics Slew Rate (Vin = −10 V to +10 V, RL = 2.0 k, CL = 100 pF) AV = −1.0, TA = Tlow to Thigh Gain Bandwidth Product (f = 100 kHz, CL = 100 pF, RL = 2.0 k) TA = 25°C TA = Tlow to Thigh Symbol Min Typ Max Unit SR 1.0 1.4 − V/ms 0.9 0.7 1.4 − − − GBW MHz Phase Margin TJ = Tlow to Thigh RL = 2.0 k, CL = 100 pF fm − 65 − Degrees Gain Margin RL = 2.0 k, CL = 100 pF Am − 15 − dB Equivalent Input Noise Voltage RS = 100 W, f = 1.0 to 100 kHz en − 22 − nV/ √ Hz THD − 0.02 − % Total Harmonic Distortion AV = −1.0, RL = 50 W, VO = 0.5 VRMS, f = 1.0 kHz NOTE: In case VEE is disconnected before VCC, a diode between VEE and Ground is recommended to avoid damaging the device. http://onsemi.com 3 TCA0372, TCA0372B, NCV0372B Vsat , OUTPUT SATURATION VOLTAGE (V) 5.5 4.5 3.5 0 2.0 4.0 6.0 8.0 10 12 14 16 18 VCC-1.0 VCC-2.0 VCC+2.0 VCC+1.0 VEE 20 0 0.5 1.0 IL, LOAD CURRENT (A) Figure 2. Supply Current versus Supply Voltage with No Load Figure 3. Output Saturation Voltage versus Load Current 80 VCC = +15 V VEE = -15 V RL = 2.0 kW 60 70 90 40 100 20 110 120 10 100 130 10000 1000 VCC = +15 V VEE = -15 V RL = 2.0 kW AV = -100 60 50 40 30 20 0 0.4 0.8 1.2 1.6 f, FREQUENCY (kHz) CL, OUTPUT LOAD CAPACITANCE (nF) Figure 4. Voltage Gain and Phase versus Frequency Figure 5. Phase Margin versus Output Load Capacitance VCC = +15 V VEE = -15 V AV = +1.0 RL = 2.0 kW VO, OUTPUT VOLTAGE (5.0 V/DIV) VCC = +15 V VEE = -15 V AV = +1.0 RL = 2.0 kW VO,OUTPUT VOLTAGE (50 mV/DIV) GAIN (dB) VCC = 24 V VEE = 0 V VCC, |VEE|, SUPPLY VOLTAGE (V) 80 -20 1.0 VCC φ m , PHASE MARGIN (DEGREES) 2.5 PHASE (DEGREES) ICC , SUPPLY CURRENT (mA) 6.5 t, TIME (1.0 ms/DIV) t, TIME (10 ms/DIV) Figure 6. Small Signal Transient Response Figure 7. Large Signal Transient Response http://onsemi.com 4 2.0 TCA0372, TCA0372B, NCV0372B 5.0 V/DIV VCC = +15 V VEE = -15 V AV = +100 RL = 50 W 200 mV/DIV VCC E1 + + VS/2 - - VS = Logic Supply Voltage Must Have VCC > VS E1, E2 = Logic Inputs t, TIME (100 ms/DIV) Figure 8. Sine Wave Response Figure 9. Bidirectional DC Motor Control with Microprocessor−Compatible Inputs VS 0.1 mF Rx 0.1 mF Vin R1 E2 + 10 k - R3 + 5.0 W R6 10 k R2 R5 10 k 10 k R7 10 k R8 10 k 2R3 @ R1 For circuit stability, ensure that Rx >where, RM = internal resistance of motor. RM VS The voltage available at the terminals of the motor is: VM + 2(V1– ) ) |Ro| @ IM 2 2R3 @ R1 where, |Ro| =and IM is the motor current. Rx Figure 10. Bidirectional Speed Control of DC Motors http://onsemi.com 5 TCA0372, TCA0372B, NCV0372B ORDERING INFORMATION Package Shipping† TCA0372DWG SOIC−16W (Pb−Free) 47 Units / Rail TCA0372DWR2G SOIC−16W (Pb−Free) 1000 / Tape & Reel TCA0372BDWR2G SOIC−16W (Pb−Free) 1000 / Tape & Reel NCV0372BDWR2G* SOIC−16W (Pb−Free) TCA0372DP1G PDIP−8 (Pb−Free) 50 Units / Rail TCA0372BDP1G PDIP−8 (Pb−Free) 50 Units / Rail TCA0372DP2G PDIP−16 (Pb−Free) 25 Units / Rail SOEIAJ−16 (Pb−Free) 2500 / Tape & Reel Device TCA0372DM2ELG 1000 / Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *AEC−Q100 Qualified and PPAP Capable MARKING DIAGRAMS PDIP−16 DP2 SUFFIX CASE 648 PDIP−8 DP1 SUFFIX CASE 626 8 8 0372DP1 AWL YYWWG 1 16 0372BDP1 AWL YYWWG TCA0372DP2 AWLYYWWG 1 1 SOIC−16W DW SUFFIX CASE 751G 16 16 TCA0372DW AWLYYWWG 1 SOEIAJ−16 DM2 SUFFIX CASE 966 16 TCA0372 ALYWG TCA0372BDW AWLYYWWG 1 1* *Also applies to NCV0372BDWR2G. A WL, L YY, Y WW, W G = Assembly Location = Wafer Lot = Year = Work Week = Pb−Free Package http://onsemi.com 6 TCA0372, TCA0372B, NCV0372B PIN CONNECTIONS 16 GND Output A 1 15 GND VCC 2 Output B 3 VEE/GND 4 - + Inputs B Inputs A Output A 1 VCC 2 - 8 + 7 14 GND Output B 3 + 6 13 GND VEE/GND 4 - 5 12 GND 5 CASE 751G CASE 626 CASE 648 Inputs A Inputs B 15 NC NC 3 14 NC VEE/GND (Top View) 16 Output A VCC 1 Output B 2 4 13 5 12 11 GND NC 6 7 10 GND 7 10 8 9 GND 8 9 6 + - Inputs B - + + - (Top View) (Top View) *Pins 4 and 9 to 16 are internally connected. CASE 966 16 VEE/GND VEE/GND 1 15 NC NC 2 Output A 3 - 14 VCC 4 + 13 Output B 5 + 12 NC 6 - 11 Inputs A Inputs B 10 NC NC 7 9 VEE/GND VEE/GND 8 (Top View) http://onsemi.com 7 VEE/GND 11 NC Inputs A TCA0372, TCA0372B, NCV0372B PACKAGE DIMENSIONS PDIP−8 DP1 SUFFIX CASE 626−05 ISSUE M D NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: INCHES. 3. DIMENSION E IS MEASURED WITH THE LEADS RESTRAINED PARALLEL AT WIDTH E2. 4. DIMENSION E1 DOES NOT INCLUDE MOLD FLASH. 5. ROUNDED CORNERS OPTIONAL. A D1 E 8 5 E1 1 DIM A A1 b C D D1 E E1 E2 E3 e L 4 NOTE 5 F c E2 END VIEW TOP VIEW NOTE 3 e/2 A INCHES NOM MAX −−−− 0.210 −−−− −−−− 0.018 0.022 0.010 0.014 0.365 0.400 −−−− −−−− 0.310 0.325 0.250 0.280 0.300 BSC −−−− −−−− 0.430 0.100 BSC 0.115 0.130 0.150 MIN −−−− 0.015 0.014 0.008 0.355 0.005 0.300 0.240 MILLIMETERS MIN NOM MAX −−−− −−−− 5.33 0.38 −−−− −−−− 0.35 0.46 0.56 0.20 0.25 0.36 9.02 9.27 10.02 0.13 −−−− −−−− 7.62 7.87 8.26 6.10 6.35 7.11 7.62 BSC −−−− −−−− 10.92 2.54 BSC 2.92 3.30 3.81 L A1 C SEATING PLANE E3 e 8X SIDE VIEW b 0.010 M C A END VIEW PDIP−16 DP2 SUFFIX CASE 648−08 ISSUE T NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL. 4. DIMENSION B DOES NOT INCLUDE MOLD FLASH. 5. ROUNDED CORNERS OPTIONAL. −A− 16 9 1 8 B F C L S −T− H SEATING PLANE K G D M J 16 PL 0.25 (0.010) M T A M http://onsemi.com 8 DIM A B C D F G H J K L M S INCHES MIN MAX 0.740 0.770 0.250 0.270 0.145 0.175 0.015 0.021 0.040 0.70 0.100 BSC 0.050 BSC 0.008 0.015 0.110 0.130 0.295 0.305 0_ 10 _ 0.020 0.040 MILLIMETERS MIN MAX 18.80 19.55 6.35 6.85 3.69 4.44 0.39 0.53 1.02 1.77 2.54 BSC 1.27 BSC 0.21 0.38 2.80 3.30 7.50 7.74 0_ 10 _ 0.51 1.01 TCA0372, TCA0372B, NCV0372B PACKAGE DIMENSIONS SOIC−16 WB CASE 751G−03 ISSUE D A D 9 1 8 h X 45 _ E 0.25 16X M T A MILLIMETERS DIM MIN MAX A 2.35 2.65 A1 0.10 0.25 B 0.35 0.49 C 0.23 0.32 D 10.15 10.45 E 7.40 7.60 e 1.27 BSC H 10.05 10.55 h 0.25 0.75 L 0.50 0.90 q 0_ 7_ S B S L A 0.25 NOTES: 1. DIMENSIONS ARE IN MILLIMETERS. 2. INTERPRET DIMENSIONS AND TOLERANCES PER ASME Y14.5M, 1994. 3. DIMENSIONS D AND E DO NOT INLCUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE. 5. DIMENSION B DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.13 TOTAL IN EXCESS OF THE B DIMENSION AT MAXIMUM MATERIAL CONDITION. B B 14X e A1 H 8X M B M 16 q C T SEATING PLANE SOLDERING FOOTPRINT* 16X 0.58 11.00 1 16X 1.27 PITCH 1.62 DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 9 TCA0372, TCA0372B, NCV0372B SOEIAJ−16 DM2 SUFFIX CASE 966 ISSUE A 16 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS AND ARE MEASURED AT THE PARTING LINE. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 5. THE LEAD WIDTH DIMENSION (b) DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE LEAD WIDTH DIMENSION AT MAXIMUM MATERIAL CONDITION. DAMBAR CANNOT BE LOCATED ON THE LOWER RADIUS OR THE FOOT. MINIMUM SPACE BETWEEN PROTRUSIONS AND ADJACENT LEAD TO BE 0.46 ( 0.018). LE 9 Q1 E HE 1 M_ L 8 Z DETAIL P D e VIEW P A A1 b 0.13 (0.005) c M 0.10 (0.004) DIM A A1 b c D E e HE L LE M Q1 Z MILLIMETERS MIN MAX --2.05 0.05 0.20 0.35 0.50 0.10 0.20 9.90 10.50 5.10 5.45 1.27 BSC 7.40 8.20 0.50 0.85 1.10 1.50 10 _ 0_ 0.70 0.90 --0.78 INCHES MIN MAX --0.081 0.002 0.008 0.014 0.020 0.007 0.011 0.390 0.413 0.201 0.215 0.050 BSC 0.291 0.323 0.020 0.033 0.043 0.059 10 _ 0_ 0.028 0.035 --0.031 ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. 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