TCA0372 D

TCA0372, TCA0372B,
NCV0372B
1.0 A Output Current,
Dual Power Operational
Amplifiers
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The TCA0372 is a monolithic circuit intended for use as a power
operational amplifier in a wide range of applications, including servo
amplifiers and power supplies. No deadband crossover distortion
provides better performance for driving coils.
Features
•
•
•
•
•
•
•
•
•
•
PDIP−8
DP1 SUFFIX
CASE 626
8
Output Current to 1.0 A
Slew Rate of 1.3 V/ms
Wide Bandwidth of 1.1 MHz
Internal Thermal Shutdown
Single or Split Supply Operation
Excellent Gain and Phase Margins
Common Mode Input Includes Ground
Zero Deadband Crossover Distortion
NCV devices are AEC−Q100 Qualified and PPAP Capable
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
VCC
1
PDIP−16
DP2 SUFFIX
CASE 648
16
1
SOIC−16W
DW SUFFIX
CASE 751G
16
1
16
1
Current
Bias
Monitoring
SOEIAJ−16
DM2 SUFFIX
CASE 966
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 6 of this data sheet.
Inv.
Input
Output
DEVICE MARKING INFORMATION
See general marking information in the device marking
section on page 6 of this data sheet.
Noninv.
Input
Thermal
Protection
VEE
Figure 1. Representative Block Diagram
© Semiconductor Components Industries, LLC, 2013
May, 2013 − Rev. 11
1
Publication Order Number:
TCA0372/D
TCA0372, TCA0372B, NCV0372B
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
VS
40
V
Input Differential Voltage Range
VIDR
Note 1
V
Input Voltage Range
VIR
Note 1
V
Supply Voltage (from VCC to VEE)
Junction Temperature (Note 2)
TJ
+150
°C
Operating Temperature Range
TA
−40 to +125
°C
Storage Temperature Range
Tstg
−55 to +150
°C
IO
1.0
A
Peak Output Current (Nonrepetitive)
I(max)
1.5
Thermal Resistance, Junction−to−Air
Case 626
Case 648
Case 751G
RqJA
Thermal Resistance, Junction−to−Case
Case 626
Case 648
Case 751G
RqJC
DC Output Current
137
72
80
23
10
12
A
°C/W
°C/W
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. Either or both input voltages should not exceed the magnitude of VCC or VEE.
2. Power dissipation must be considered to ensure maximum junction temperature (TJ) is not exceeded.
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2
TCA0372, TCA0372B, NCV0372B
DC ELECTRICAL CHARACTERISTICS (VCC = +15 V, VEE = −15 V, RL connected to ground, TA = −40° to +125°C.)
Characteristics
Symbol
Min
Typ
Max
−
−
1.0
−
15
20
DVIO/DT
−
20
−
mV/°C
Input Bias Current (VCM = 0)
IIB
−
100
500
nA
Input Offset Current (VCM = 0)
IIO
−
10
50
nA
Large Signal Voltage Gain
VO = ±10 V, RL = 2.0 k
AVOL
30
100
−
V/mV
Output Voltage Swing (IL = 100 mA)
TA = +25°C
TA = Tlow to Thigh
TA = +25°C
TA = Tlow to Thigh
VOH
14.0
13.9
−
−
14.2
−
−14.2
−
−
−
−14.0
−13.9
Output Voltage Swing (IL = 1.0 A)
VCC = +24 V, VEE = 0 V, TA = +25°C
VCC = +24 V, VEE = 0 V, TA = Tlow to Thigh
VCC = +24 V, VEE = 0 V, TA = +25°C
VCC = +24 V, VEE = 0 V, TA = Tlow to Thigh
VOH
22.5
22.5
−
−
22.7
−
1.3
−
−
−
1.5
1.6
Input Common Mode Voltage Range
TA = +25°C
TA = Tlow to Thigh
VICR
Input Offset Voltage (VCM = 0)
TA = +25°C
TA, Tlow to Thigh
VIO
Average Temperature Coefficient of Offset Voltage
VOL
VOL
Unit
mV
V
V
V
VEE to (VCC −1.0)
VEE to (VCC −1.3)
Common Mode Rejection Ratio (RS = 10 k)
CMRR
70
90
−
dB
Power Supply Rejection Ratio (RS = 100 W)
PSRR
70
90
−
dB
−
−
−
−
5.0
8.0
−
−
10
10
14
14
Power Supply Current
TA = +25°C
TA = Tlow to Thigh
ID
TCA0372
TCA0372B/NCV0372B
TCA0372
TCA0372B/NCV0372B
mA
AC ELECTRICAL CHARACTERISTICS (VCC = +15 V, VEE = −15 V, RL connected to ground, TA = +25°C, unless otherwise noted.)
Characteristics
Slew Rate (Vin = −10 V to +10 V, RL = 2.0 k, CL = 100 pF)
AV = −1.0, TA = Tlow to Thigh
Gain Bandwidth Product (f = 100 kHz, CL = 100 pF, RL = 2.0 k)
TA = 25°C
TA = Tlow to Thigh
Symbol
Min
Typ
Max
Unit
SR
1.0
1.4
−
V/ms
0.9
0.7
1.4
−
−
−
GBW
MHz
Phase Margin TJ = Tlow to Thigh
RL = 2.0 k, CL = 100 pF
fm
−
65
−
Degrees
Gain Margin
RL = 2.0 k, CL = 100 pF
Am
−
15
−
dB
Equivalent Input Noise Voltage
RS = 100 W, f = 1.0 to 100 kHz
en
−
22
−
nV/ √ Hz
THD
−
0.02
−
%
Total Harmonic Distortion
AV = −1.0, RL = 50 W, VO = 0.5 VRMS, f = 1.0 kHz
NOTE: In case VEE is disconnected before VCC, a diode between VEE and Ground is recommended to avoid damaging the device.
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3
TCA0372, TCA0372B, NCV0372B
Vsat , OUTPUT SATURATION VOLTAGE (V)
5.5
4.5
3.5
0
2.0
4.0
6.0
8.0
10
12
14
16
18
VCC-1.0
VCC-2.0
VCC+2.0
VCC+1.0
VEE
20
0
0.5
1.0
IL, LOAD CURRENT (A)
Figure 2. Supply Current versus Supply
Voltage with No Load
Figure 3. Output Saturation Voltage
versus Load Current
80
VCC = +15 V
VEE = -15 V
RL = 2.0 kW
60
70
90
40
100
20
110
120
10
100
130
10000
1000
VCC = +15 V
VEE = -15 V
RL = 2.0 kW
AV = -100
60
50
40
30
20
0
0.4
0.8
1.2
1.6
f, FREQUENCY (kHz)
CL, OUTPUT LOAD CAPACITANCE (nF)
Figure 4. Voltage Gain and Phase
versus Frequency
Figure 5. Phase Margin versus Output
Load Capacitance
VCC = +15 V
VEE = -15 V
AV = +1.0
RL = 2.0 kW
VO, OUTPUT VOLTAGE (5.0 V/DIV)
VCC = +15 V
VEE = -15 V
AV = +1.0
RL = 2.0 kW
VO,OUTPUT VOLTAGE (50 mV/DIV)
GAIN (dB)
VCC = 24 V
VEE = 0 V
VCC, |VEE|, SUPPLY VOLTAGE (V)
80
-20
1.0
VCC
φ m , PHASE MARGIN (DEGREES)
2.5
PHASE (DEGREES)
ICC , SUPPLY CURRENT (mA)
6.5
t, TIME (1.0 ms/DIV)
t, TIME (10 ms/DIV)
Figure 6. Small Signal Transient Response
Figure 7. Large Signal Transient Response
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4
2.0
TCA0372, TCA0372B, NCV0372B
5.0 V/DIV
VCC = +15 V
VEE = -15 V
AV = +100
RL = 50 W
200 mV/DIV
VCC
E1
+
+
VS/2
-
-
VS = Logic Supply Voltage
Must Have VCC > VS
E1, E2 = Logic Inputs
t, TIME (100 ms/DIV)
Figure 8. Sine Wave Response
Figure 9. Bidirectional DC Motor Control with
Microprocessor−Compatible Inputs
VS
0.1 mF
Rx
0.1 mF
Vin
R1
E2
+
10 k
-
R3
+
5.0 W
R6
10 k
R2
R5
10 k
10 k
R7
10 k
R8
10 k
2R3 @ R1
For circuit stability, ensure that Rx >where,
RM = internal resistance of motor.
RM
VS
The voltage available at the terminals of the motor is: VM + 2(V1– ) ) |Ro| @ IM
2
2R3 @ R1
where, |Ro| =and
IM is the motor current.
Rx
Figure 10. Bidirectional Speed Control of DC Motors
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5
TCA0372, TCA0372B, NCV0372B
ORDERING INFORMATION
Package
Shipping†
TCA0372DWG
SOIC−16W
(Pb−Free)
47 Units / Rail
TCA0372DWR2G
SOIC−16W
(Pb−Free)
1000 / Tape & Reel
TCA0372BDWR2G
SOIC−16W
(Pb−Free)
1000 / Tape & Reel
NCV0372BDWR2G*
SOIC−16W
(Pb−Free)
TCA0372DP1G
PDIP−8
(Pb−Free)
50 Units / Rail
TCA0372BDP1G
PDIP−8
(Pb−Free)
50 Units / Rail
TCA0372DP2G
PDIP−16
(Pb−Free)
25 Units / Rail
SOEIAJ−16
(Pb−Free)
2500 / Tape & Reel
Device
TCA0372DM2ELG
1000 / Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*AEC−Q100 Qualified and PPAP Capable
MARKING DIAGRAMS
PDIP−16
DP2 SUFFIX
CASE 648
PDIP−8
DP1 SUFFIX
CASE 626
8
8
0372DP1
AWL
YYWWG
1
16
0372BDP1
AWL
YYWWG
TCA0372DP2
AWLYYWWG
1
1
SOIC−16W
DW SUFFIX
CASE 751G
16
16
TCA0372DW
AWLYYWWG
1
SOEIAJ−16
DM2 SUFFIX
CASE 966
16
TCA0372
ALYWG
TCA0372BDW
AWLYYWWG
1
1*
*Also applies to NCV0372BDWR2G.
A
WL, L
YY, Y
WW, W
G
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
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6
TCA0372, TCA0372B, NCV0372B
PIN CONNECTIONS
16 GND
Output A 1
15 GND
VCC 2
Output B 3
VEE/GND 4
- +
Inputs B
Inputs A
Output A 1
VCC 2
-
8
+
7
14 GND
Output B
3
+
6
13 GND
VEE/GND
4
-
5
12 GND
5
CASE 751G
CASE 626
CASE 648
Inputs A
Inputs B
15 NC
NC 3
14 NC
VEE/GND
(Top View)
16 Output A
VCC 1
Output B 2
4
13
5
12
11 GND
NC 6
7
10 GND
7
10
8
9 GND
8
9
6
+ -
Inputs B
- +
+ -
(Top View)
(Top View)
*Pins 4 and 9 to 16 are internally connected.
CASE 966
16 VEE/GND
VEE/GND 1
15 NC
NC 2
Output A 3
-
14
VCC 4
+
13
Output B 5
+
12
NC 6
-
11
Inputs A
Inputs B
10 NC
NC 7
9 VEE/GND
VEE/GND 8
(Top View)
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7
VEE/GND
11 NC
Inputs A
TCA0372, TCA0372B, NCV0372B
PACKAGE DIMENSIONS
PDIP−8
DP1 SUFFIX
CASE 626−05
ISSUE M
D
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: INCHES.
3. DIMENSION E IS MEASURED WITH THE LEADS RESTRAINED PARALLEL AT WIDTH E2.
4. DIMENSION E1 DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
A
D1
E
8
5
E1
1
DIM
A
A1
b
C
D
D1
E
E1
E2
E3
e
L
4
NOTE 5
F
c
E2
END VIEW
TOP VIEW
NOTE 3
e/2
A
INCHES
NOM
MAX
−−−− 0.210
−−−−
−−−−
0.018 0.022
0.010 0.014
0.365 0.400
−−−−
−−−−
0.310 0.325
0.250 0.280
0.300 BSC
−−−−
−−−− 0.430
0.100 BSC
0.115 0.130 0.150
MIN
−−−−
0.015
0.014
0.008
0.355
0.005
0.300
0.240
MILLIMETERS
MIN
NOM
MAX
−−−−
−−−−
5.33
0.38
−−−−
−−−−
0.35
0.46
0.56
0.20
0.25
0.36
9.02
9.27 10.02
0.13
−−−−
−−−−
7.62
7.87
8.26
6.10
6.35
7.11
7.62 BSC
−−−−
−−−− 10.92
2.54 BSC
2.92
3.30
3.81
L
A1
C
SEATING
PLANE
E3
e
8X
SIDE VIEW
b
0.010
M
C A
END VIEW
PDIP−16
DP2 SUFFIX
CASE 648−08
ISSUE T
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS
WHEN FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE
MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
−A−
16
9
1
8
B
F
C
L
S
−T−
H
SEATING
PLANE
K
G
D
M
J
16 PL
0.25 (0.010)
M
T A
M
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8
DIM
A
B
C
D
F
G
H
J
K
L
M
S
INCHES
MIN
MAX
0.740 0.770
0.250 0.270
0.145 0.175
0.015 0.021
0.040
0.70
0.100 BSC
0.050 BSC
0.008 0.015
0.110 0.130
0.295 0.305
0_
10 _
0.020 0.040
MILLIMETERS
MIN
MAX
18.80 19.55
6.35
6.85
3.69
4.44
0.39
0.53
1.02
1.77
2.54 BSC
1.27 BSC
0.21
0.38
2.80
3.30
7.50
7.74
0_
10 _
0.51
1.01
TCA0372, TCA0372B, NCV0372B
PACKAGE DIMENSIONS
SOIC−16 WB
CASE 751G−03
ISSUE D
A
D
9
1
8
h X 45 _
E
0.25
16X
M
T A
MILLIMETERS
DIM MIN
MAX
A
2.35
2.65
A1 0.10
0.25
B
0.35
0.49
C
0.23
0.32
D 10.15 10.45
E
7.40
7.60
e
1.27 BSC
H 10.05 10.55
h
0.25
0.75
L
0.50
0.90
q
0_
7_
S
B
S
L
A
0.25
NOTES:
1. DIMENSIONS ARE IN MILLIMETERS.
2. INTERPRET DIMENSIONS AND TOLERANCES
PER ASME Y14.5M, 1994.
3. DIMENSIONS D AND E DO NOT INLCUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE.
5. DIMENSION B DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.13 TOTAL IN
EXCESS OF THE B DIMENSION AT MAXIMUM
MATERIAL CONDITION.
B
B
14X
e
A1
H
8X
M
B
M
16
q
C
T
SEATING
PLANE
SOLDERING FOOTPRINT*
16X
0.58
11.00
1
16X
1.27
PITCH
1.62
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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9
TCA0372, TCA0372B, NCV0372B
SOEIAJ−16
DM2 SUFFIX
CASE 966
ISSUE A
16
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH OR PROTRUSIONS AND ARE MEASURED
AT THE PARTING LINE. MOLD FLASH OR
PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006)
PER SIDE.
4. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
5. THE LEAD WIDTH DIMENSION (b) DOES NOT
INCLUDE DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08 (0.003)
TOTAL IN EXCESS OF THE LEAD WIDTH
DIMENSION AT MAXIMUM MATERIAL CONDITION.
DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OR THE FOOT. MINIMUM SPACE
BETWEEN PROTRUSIONS AND ADJACENT LEAD
TO BE 0.46 ( 0.018).
LE
9
Q1
E HE
1
M_
L
8
Z
DETAIL P
D
e
VIEW P
A
A1
b
0.13 (0.005)
c
M
0.10 (0.004)
DIM
A
A1
b
c
D
E
e
HE
L
LE
M
Q1
Z
MILLIMETERS
MIN
MAX
--2.05
0.05
0.20
0.35
0.50
0.10
0.20
9.90
10.50
5.10
5.45
1.27 BSC
7.40
8.20
0.50
0.85
1.10
1.50
10 _
0_
0.70
0.90
--0.78
INCHES
MIN
MAX
--0.081
0.002
0.008
0.014
0.020
0.007
0.011
0.390
0.413
0.201
0.215
0.050 BSC
0.291
0.323
0.020
0.033
0.043
0.059
10 _
0_
0.028
0.035
--0.031
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are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number of patents, trademarks,
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Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
TCA0372/D