[AP1155ADL] AP1155ADL Suitable for High Power application Low Noise, Adjustable Voltage LDO Regulator 1. Genaral Description The AP1155ADL is a low dropout linear regulator with ON/OFF control, which can supply 1A load current. The AP1155ADL is housed in HSOP-8 with Exposed-Pad package, and therefore suitable for high power application. The AP1155ADL realizes high ripple rejection and low noise, because silicon monolithic bipolar structure is adopted. The suitable voltage for the set can be set from 1.3V to 13.5V by external resistors. The AP1155ADL realizes to downsize Printed Circuit Board, because the input and output capacitor is available to use a small ceramic capacitor. Also over-current protection circuit and thermal shut down are integrated. These functions will improve reliability of the system. 2. Features Operating Temperature Range -40~85℃ Operating Voltage Range 2.4~14.0V Output Current 1A Programmable Output Voltage 1.3~13.5V Reference Voltage Precision 1.21V ± 35mV Dropout Voltage 300mV at Iout=1A Ripple Rejection Ratio 80dB at 1kHz Available very low noise application Available to use a small ceramic capacitor Vout R1 24kΩ Cout 1uF NC Vout Vin FB Cin 1uF Vin 2.4~14V Exposed-Pad Cfb 1000pF R2 36kΩ On/Off control (High active) NC Vcont Vcont 1.8~14V GND NC Built-in Over Current Protection, Thermal Shutdown Protection Package HSOP-8pin with Exposed-Pad 3. Applications RF Power Supplies PLL, VCO, Mixers, LNA Low Noise Imaging Equipment Digital Camera High Speed/High Precision A-D, D-A, Amplifier Audio Equipment Medical Equipment Instrumentation Precision Power Supplies Post Regulator for Switching Supplies 016001036-E-01 -1- Car Infotainment 2016/02 [AP1155ADL] 4. Table of Contents 1. 2. 3. 4. 5. 6. 7. Genaral Description ........................................................................................................................................... 1 Features .............................................................................................................................................................. 1 Applications ....................................................................................................................................................... 1 Table of Contents ............................................................................................................................................... 2 Block Diagram ................................................................................................................................................... 3 Ordering Information ......................................................................................................................................... 3 Pin Configurations and Functions ...................................................................................................................... 3 ■ Pin Configurations ............................................................................................................................................ 3 ■ Function ............................................................................................................................................................ 4 8. Absolute Maximum Ratings .............................................................................................................................. 5 9. Recommended Operating Conditions ................................................................................................................ 5 10. Electrical Characteristics ................................................................................................................................ 6 ■ Electrical Characteristics of Ta=Tj=25°C ........................................................................................................ 6 ■ Electrical Characteristics of Ta=-40°C~85℃................................................................................................... 6 11. Description ..................................................................................................................................................... 7 11.1 DC Characteristics ...................................................................................................................................... 7 11.2 Load Transient .......................................................................................................................................... 11 11.3 Line Transient........................................................................................................................................... 12 11.4 On / Off Transient .................................................................................................................................... 13 11.5 Ripple Rejection ....................................................................................................................................... 14 11.6 Output Noise ............................................................................................................................................ 15 11.7 Stability..................................................................................................................................................... 16 11.8 Operating Region and Power Dissipation ................................................................................................ 17 12. Definition of term ......................................................................................................................................... 18 13. Recommended External Circuits .................................................................................................................. 19 ■VOut,TYP=3.0V: Example of selection of external components. ....................................................................... 19 ■Recommended Layout ..................................................................................................................................... 19 ■Test Circuit ...................................................................................................................................................... 20 14. Package ........................................................................................................................................................ 21 ■ Outline Dimensions ........................................................................................................................................ 21 15. Revise History .............................................................................................................................................. 22 IMPORTANT NOTICE .......................................................................................................................................... 23 016001036-E-01 -2- 2016/02 [AP1155ADL] 5. Block Diagram VCont FB On/Off Control Thermal & Over Current Protection VRef VIn VOut GND Figure 1.Block Diagram 6. Ordering Information AP1155ADL Ta = -40 to 85°C HSOP-8 7. Pin Configurations and Functions NC Vin Vcont NC ■ Pin Configurations 8 7 6 5 (Top View) 016001036-E-01 Vout 3 4 GND 2 FB 1 NC Exposed Pad -3- 2016/02 [AP1155ADL] ■ Function Pin Number Symbol Internal Equivalent Circuit Description 1,5,8 NC - Non connection Terminal Output Terminal Connect resistance R1 between VOut terminal and Fb terminal, and resistance R2 between Fb terminal and GND. 2 VOut Output voltage VOut,TYP is determined by the following equation: VOut VIn R1 + R 2 R2 Connect a ceramic capacitor with a capacitance higher than the following values between VOut terminal and GND. VOut,TYP ≥ 2.4V : 1μF VOut,TYP < 2.4V : 2.2μF Feedback Terminal Connecting a capacitor between VOut terminal and Fb terminal reduces output noise. FB 3 VOut,TYP = VFb × FB This terminal features very high impedance; please note that it is susceptible to external noise, etc. 4 GND - GND Terminal VCont 300kΩ 6 VCont 500kΩ On/Off control Terminal The On/Off voltages are as follows: VCont ≥ 1.8V : VOut On state VCont ≤ 0.35V : VOut Off state Pull-down resistance (500kΩ) is built-in. Input Terminal 7 VIn - - Exposed Pad - 016001036-E-01 Connect a capacitor of 1µF or higher between VIn terminal and GND. Ground Terminal Heat dissipation pad Exposed Pad must be connected to GND. -4- 2016/02 [AP1155ADL] 8. Absolute Maximum Ratings Parameter Input Voltage Symbol VIn,MAX min Max Unit -0.4 16 V Reverse Bias Voltage FB Terminal Voltage VRev,MAX VFB,MAX -0.4 -0.4 14 5 V V Control Voltage VCont,MAX -0.4 16 V Tj - 150 °C TStg -55 150 °C Junction temperature Storage Temperature Range 2300 mW Power Dissipation PD Note 1. A 2-layer board is used(x=30mm, y=30mm,t=1.0mm). RθJA = 50°C/W. Please refer to Section 11.8 on page 17 for more information. Condition VOut-VIn Ta=25°C (Note 1) WARNING: The maximum ratings are the absolute limitation values with the possibility of the IC breakage. When the operation exceeds this standard quality cannot be guaranteed. 9. Recommended Operating Conditions Symbol min typ max Unit Operating Temperature Range Ta -40 - 85 °C Operating Voltage Range VOP 2.4 - 14.0 V Output Voltage Range VOut 1.3 - 13.5 V Parameter 016001036-E-01 -5- Condition 2016/02 [AP1155ADL] 10. Electrical Characteristics ■ Electrical Characteristics of Ta=Tj=25°C The parameters with min or max values will be guaranteed at Ta=Tj=25°C. (VIn=4.0V, R1=53kΩ, R2=36kΩ, Vcont=1.8V, Ta=Tj=25°C, unless otherwise specified.) Parameter Symbol Condition min typ max Unit Fb voltage VFB IOut=5mA 1.185 1.210 1.245 V Line Regulation LinReg ∆VIn=5V, IOut=5mA 0 10 mV I =5~500mA 6 20 Load Regulation (Note 2) LoaReg Out mV IOut=5~1000mA 20 35 IOut=500mA 150 260 Dropout Voltage (Note 3) VDrop mV IOut=1000mA 300 490 Maximum Output Current 1100 1400 1700 mA IOut,Max VOut=VOut,TYP×0.9 (Note 4) Output Short-Circuit Current IShort VOut=0V 1500 mA Quiescent Current Iq IOut=0mA 300 480 μA Standby Current IStandby VCont=0V 0.1 μA Control Current ICont VCont=1.8V 5 10 μA VOut On state 1.8 V Control Voltage VCont VOut Off state 0.35 V Note 2. Load Regulation changes with output voltage. The value mentioned above is guaranteed with the condition at VOut,TYP=3.0V (R1=53kΩ, R2=36kΩ). The standard value is displayed by the absolute value. Note 3. For VOut,TYP≤2.0V , no regulations. Note 4. The maximum output current is limited by power dissipation Note 5. Parameters with only typical values are just reference. (Not guaranteed) ■ Electrical Characteristics of Ta=-40°C~85℃ The parameters with min or max values will be guaranteed at Ta = -40 ~ 85°C. (VIn=4.0V, R1=53kΩ, R2=36kΩ, Vcont=1.8V, Ta= -40 ~ 85°C, unless otherwise specified.) Parameter Symbol Condition min typ max Unit Fb voltage VFB IOut=5mA 1.175 1.210 1.255 V Line Regulation LinReg ∆VIn=5V, IOut=5mA 0 16 mV IOut=5~500mA 6 37 Load Regulation (Note 6) LoaReg mV IOut=5~1000mA 20 95 IOut=500mA 150 335 Dropout Voltage (Note 7) VDrop mV IOut=1000mA 300 550 Maximum Output Current 1400 mA IOut,Max VOut=VOut,TYP×0.9 (Note 8) Output Short-Circuit Current IShort VOut=0V 1500 mA Quiescent Current Iq IOut=0mA 300 585 μA Standby Current IStandby VCont=0V 1.5 μA Control Current ICont VCont=1.8V 5 15 μA VOut On state 1.8 V Control Voltage VCont VOut Off state 0.35 V Note 6. Load Regulation changes with output voltage. The value mentioned above is guaranteed with the condition at VOut,TYP=3.0V (R1=53kΩ, R2=36kΩ). The standard value is displayed by the absolute value. Note 7. For VOut,TYP≤2.0V , no regulations. Note 8. The maximum output current is limited by power dissipation Note 9. Parameters with only typical values are just reference. (Not guaranteed) 016001036-E-01 -6- 2016/02 [AP1155ADL] 11. Description 11.1 DC Characteristics ∆VOut vs VIn (AP1155ADL) ∆VOut vs VIn (AP1155ADL) 100 10 600mA I Out = 0mA (100mA step) 0 ∆VOut [mV] ∆VOut [mV] 0 -10 -200 -20 -30 -100 0 2 4 8 6 10 12 14 -300 -100 16 200 100 0 400 300 500 VIn - VOut [mV] VIn [V] IQ vs VIn (AP1155ADL) IQ vs VIn (AP1155ADL) 350 12 340 10 330 320 IQ [µA] IQ [mA] 8 6 4 310 300 290 280 270 2 260 0 0 2 4 6 8 10 12 14 250 16 0 2 4 50 50 40 45 30 40 20 35 10 0 -10 10 -40 5 800 0 1000 0 200 400 600 800 1000 IOut [mA] IOut [mA] 016001036-E-01 16 20 -30 600 14 25 15 400 12 30 -20 200 10 IGND vs IOut (AP1155ADL) IGND [mA] ∆VOut [mV] ∆VOut vs IOut (AP1155ADL) 0 8 VIn [V] VIn [V] -50 6 -7- 2016/02 [AP1155ADL] VDrop vs IOut (AP1155ADL) 0 0 -50 -50 -100 -100 VDrop [mV] VDrop [mV] VDrop vs IOut (AP1155ADL) -150 -200 -150 -200 -250 -250 -300 -300 -350 0 200m 400m 600m 800m -350 1000 0 200 400 IOut [mA] 800 1000 IOut [mA] VOut vs IOut (AP1155ADL) ICont vs VCont (AP1155ADL) 4 100 3 75 I Cont [µA] VOut [V] 600 2 1 50 25 0 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 0 0 2 4 6 IOut [A] 8 10 12 14 16 10 12 14 16 VCont [V] VOut vs VCont (AP1155ADL) IStandby vs VIn (AP1155ADL) 4 1µ 100n 3 IStandby [A] VOut [V] 10n 2 1n 100p 1 10p 0 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 1p VCont [V] 016001036-E-01 0 2 4 6 8 VIn [V] -8- 2016/02 [AP1155ADL] ∆VOut vs Ta (AP1155ADL) IQ vs Ta (AP1155ADL) 400 30 380 360 340 10 IQ [mA] ∆VOut [mV] 20 0 -10 320 300 280 260 240 -20 220 -30 -40 -20 0 20 40 60 80 200 -40 100 -20 0 LoaReg vs Ta (AP1155ADL) IOut = 100mA, 200mA, 400mA, 600mA, 800mA, 1000mA 60 IGND [mA] LoaReg [mV] 100 70 I Out = 100mA, 200mA, 400mA, 600mA, 800mA, 1000mA 40 30 20 10 50 40 30 20 0 10 -20 0 20 40 60 80 0 -40 100 -20 0 20 40 60 80 100 80 100 Ta [°C] Ta [°C] VDrop vs Ta (AP1155ADL) VDrop vs Ta (AP1155ADL) 0 0 -100 -100 -200 -200 VDrop [mV] VDrop [mV] 80 80 50 -300 IOut = 100mA, 200mA, 400mA, 600mA, 800mA, 1000mA -500 -600 -40 60 IGND vs Ta (AP1155ADL) 60 -400 40 Ta [°C] Ta [°C] -10 -40 20 -300 -400 IOut = 100mA, 200mA, 400mA, 600mA, 800mA, 1000mA -500 -20 0 20 40 60 80 -600 -40 100 Ta [°C] 016001036-E-01 -20 0 20 40 60 Ta [°C] -9- 2016/02 [AP1155ADL] VOut On/Off Point vs Ta (AP1155ADL) ICont vs Ta (AP1155ADL) 25 1.6 1.4 20 VOut On Point 1.0 VOut Off Point ICont [µA] VCont [V] 1.2 0.8 0.6 0.4 VCont = 1.8V, 2.0V, 3.0V, 4.0V 15 10 5 0.2 0.0 -40 -20 0 20 40 60 80 0 -40 100 -20 0 Ta [°C] 60 80 100 Reverse Bias Current(IRev) vs Ta (AP1155ADL) 4.5 1500 4.0 1450 3.5 1400 IRev [mA] IOut,MAX [mA] 40 Ta [°C] IOut,MAX vs Ta (AP1155ADL) 1350 3.0 VRev = 3.0V VIn=0.0V VCont=0.0V 2.5 2.0 1.5 1300 1.0 1250 1200 -40 20 0.5 -20 0 20 40 60 80 0.0 -40 100 Ta [°C] 016001036-E-01 -20 0 20 40 60 80 100 Ta [°C] - 10 - 2016/02 [AP1155ADL] 11.2 Load Transient IOut=0mA→1000mA, COut=1.0µF, 2.2µF, 4.7µF IOut=1000mA→0mA, COut=1.0µF, 2.2µF, 4.7µF 1000mA 1000mA IOut 1000mA/div 1000mA/div 0mA 0mA C Out= 4.7mF COut= 1.0mF VOut 500mV/div 200mV/div COut= 1.0mF 10msec/div 5msec/div Time Time IOut=0mA→500mA, 0mA→1000mA IOut=500mA→0mA, 1000mA→0mA 1000mA (500mA) 1000mA (500mA) 1000mA/div (500mA/div) IOut 1000mA/div (500mA/div) IOut 0mA 0mA IOut= 0mA VOut IOut= 1000mA IOut= 0mA IOut= 500mA VOut 200mV/div IOut= 1000mA IOut= 0mA IOut= 500mA IOut= 0mA Time Time IOut=0mA→1000mA, 10mA→1010mA IOut=1000mA→0mA, 1010mA→10mA 1000mA (1010mA) 1000mA (1010mA) IOut 1000mA/div IOut 1000mA/div 0mA (10mA) 0mA (10mA) IOut= 0mA IOut= 10mA IOut= 1000mA IOut= 1010mA 200mV/div VOut IOut= 1000mA IOut= 1010mA 016001036-E-01 500mV/div 5msec/div 10msec/div VOut C Out= 4.7mF 10msec/div 5msec/div Time Time - 11 - IOut= 0mA 200mV/div I Out= 10mA 2016/02 [AP1155ADL] 11.3 Line Transient IOut=100mA, 500mA, 1000mA COut=1.0µF, 2.2µF, 4.7µF 5V 5V 1V/div VIn VIn 4V 1V/div 4V IOut = 100mA, 500mA, 1000mA VOut COut = 1.0mF, 2.2mF, 4.7mF 10mV/div 10mV/div VOut 1msec/div 1msec/div Time Time CFb=none, 1000pF, 0.1µF 5V VIn 1V/div 4V CFB= none VOut C FB= 0.1mF 10mV/div 1msec/div Time 016001036-E-01 - 12 - 2016/02 [AP1155ADL] 11.4 On / Off Transient VCont=0.0V→2.0V, COut=1.0µF, 4.7µF, 10µF VCont=2.0V→0.0V, COut=1.0µF, 4.7µF, 10µF 2V 2V VCont VCont 2V/div 2V/div 0V 0V VOut 1V/div VOut 1V/div COut = 1.0mF, 4.7mF, 10mF COut= 10mF, 4.7mF, 1.0mF 5msec/div 250msec/div Time Time VCont=0.0V→2.0V, IOut=100mA, 500mA, 1000mA VCont=2.0V→0.0V, IOut=100mA, 500mA, 1000mA 2V 2V VCont VCont 2V/div 0V VOut 2V/div 0V IOut = 100mA, 500mA, 1000mA VOut 1V/div 1V/div IOut= 100mA, 500mA, 1000mA 25msec/div 5msec/div Time Time * * VCont=0.0V→2.0V, CFb=none~0.1µF VCont=0.0V→2.0V, CFb=none~0.1µF 2V 2V VCont 2V/div 2V/div VCont 0V 0V VOut 1V/div CFb= none 1V/div VOut CFb= 0.1mF CFb= none 2.5msec/div 5msec/div Time Time C Fb= 0.1mF ※ CFb=none, 100pF, 1000pF, 0.001µF, 0.01μF, 0.1μF 016001036-E-01 - 13 - 2016/02 [AP1155ADL] 11.5 Ripple Rejection COut=1.0μF, 2.2µF, 4.7µF, 10μF 0 0 -20 -20 -40 -40 RR [dB] RR [dB] IOut=100mA, 200mA, 500mA, 1000mA -60 -80 -60 COut= 1.0µF -80 IOut = 100mA, 200mA, 500mA, 1000mA -100 100 1k 10k 100k COut= 10µF -100 100 1M 1k Frequency [Hz] 100k 1M Frequency [Hz] IOut=1mA~1000mA, f=1kHz CFb=none, 0.1µF 0 0 -20 -20 -40 -40 RR [dB] RR [dB] 10k -60 -60 CFb= none -80 -80 -100 100 CFb= 0.1µF 1k 10k 100k -100 1M 200 400 600 800 1000 IOut [mA] Frequency [Hz] 016001036-E-01 0 - 14 - 2016/02 [AP1155ADL] 11.6 Output Noise VOut,TYP=3.0V, IOut=0.1mA~1000mA VOut,TYP=3.0V, CFb=1pF~0.1μF 100 120 80 80 VNoise [µVrµs] VNoise [mVrms] 100 60 40 40 20 20 0 60 0 200 400 600 800 0 1000 1p 10p 100p 0.001µ 0.01µ 0.1µ CFb [F] IOut [mA] VOut,TYP=1.3V ~ 12V 250 VNoise [µVrµs] 200 150 100 50 0 0 2 4 6 8 10 12 14 VOut,TYP [V] 016001036-E-01 - 15 - 2016/02 [AP1155ADL] 11.7 Stability The standard capacitor recommended for use on the output side is a ceramic capacitor equal to or greater than 1.0µF. For operations at 2.4V or less, use at least a 2.2µF capacitor. 100 ESR [Ω] 10 Unstable Area 1 0.1 0.01 Stable Area 0 200 400 600 800 1000 IOut [mA] Figure 2. Stable operation area when VOut,TYP=3.0V The above graph indicates that operation is stable in the entire current range with a resistance of 1Ω or less (equivalent series resistance or ‘ESR’) connected in series to the output capacitor. Generally, the ESR of a ceramic capacitor is very low (several tens of mΩ), and no problems should arise in actual use. If an application requires use of a large ESR capacitor, connecting a ceramic capacitor with low ESR in parallel will enable operations at this level. When parallel output capacitors are used, be sure to position the ceramic capacitor as close to the IC as possible. The other capacitor connected in parallel may be located away from the IC. The IC will not be damaged by the increased capacitance. Input capacitors are necessary when the power supply impedance increases due to battery depletion or when the line to the power supply is particularly long. There is no general rule that can be used to determine the required number of capacitors used for such purposes. In some cases, only one capacitor is necessary for several regulator ICs. In some cases, one capacitor is required for each IC. To determine the required number of capacitors in a specific application, be sure to verify operation with all parts in the installed configuration. Capacitance vs Voltage 100 90 80 70 60 50 CAP(%) B Curve F Curve 0 2 4 6 8 10 12 Bias Voltage(V) Capacitance vs Temperature 100 90 80 70 60 50 CAP(%) B Curve F Curve -50 -25 0 25 50 75 100 Ta(°C) Figure 3. General characteristics of ceramic capacitors Ceramic capacitors normally have specific temperature and voltage characteristics. Be sure to take the operating voltage and temperature into consideration when selecting parts for use. We recommend parts featuring B characteristics. For evaluation Kyocera : CM05B104K10AB , CM05B224K10AB ,CM105B104K16A ,CM105B224K16A ,CM21B225K10A Murata : GRM36B104K10 , GRM42B104K10 ,GRM39B104K25 , GRM39B224K10 , GRM39B105K6.3 016001036-E-01 - 16 - 2016/02 [AP1155ADL] 11.8 Operating Region and Power Dissipation Power dissipation capability is limited by the junction temperature that triggers the built-in overheat protection circuit. Therefore, power dissipation capability is regarded as an internal limitation. The package itself does not offer high heat dissipation because of its small size. The package is, however, designed to release heat effectively when mounted on the PCB. Therefore, the heat-dissipation value will vary depending on the material, copper pattern, etc. of the PCB on which the package is mounted. When the regulator loss is large (high ambient temperature, poor heat radiation), the overheat protection circuit is activated. When this occurs, output current cannot be obtained, and an output voltage drop is observed. When the junction temperature reaches the set value, the IC stops operating. However, after the IC has stopped operation and the junction temperature lowers sufficiently, the IC restarts operation immediately. ・How to determine the thermal resistance when installation on PCB The chip junction temperature during operation is expressed by Tj = θ ja × PD + 25 The junction temperature of the AP1155ADL is limited to approximately 140°C by the overheat protection circuit. PD is the value observed when the overheat protection circuit is activated. The following example is based on an ambient temperature of 25°C. 140 = θ ja × PD + 25 θ ja × PD + 25 = 140 θ ja × PD = 115 θ ja = 115 (°C/W) PD Glass epoxy substrate with double-layer wiring (x=30mm, y=30mm, t=1.0mm, copper pattern thickness: 35µm) PD is 2300mW. If the temperature exceeds 25°C, be sure to derate at -20mW/°C. ・PD is easily calculated. With the output terminal shorted-circuited to GND, gradually increase the input voltage and measure the input current. Slowly increase the input voltage to about 10V. The initial input current value becomes the maximum instantaneous output current value, but gradually lowers as the chip temperature rises, and ultimately reaches a state of thermal equilibrium (through natural air cooling). PD is calculated using the input value for input current and the input voltage value in the equilibrium state. PD ≅ VIn × I In 2 PD (mW) PD 5 DPD 3 4 0 25 75 140 TA (℃) Procedure (conducted at the time of installation on PCB) 1: Obtain PD ( VIn × I In when output is short-circuited). 2: Plot PD on the 25°C line. 3: Draw a straight line between PD and the 140°C line. 4: Extend a straight-line perpendicular from the point of the designed maximum operating temperature (for example, 75°C). 5: Extend a line to the left from the intersection of the derating curve and the line drawn in 4, and read the PD value (this value is DPD). 6: DPD ÷ (VIn,MAX × VOut ) = I Out at 75°C The maximum operating current at the maximum temperature is as follows: I Out ≅ {DPD ÷ (VIn,MAX − VOut )} Try to achieve maximum heat dissipation in your design in order to minimize the part’s temperature during operation. Generally speaking, lower part temperatures result in higher reliability in operation. 016001036-E-01 - 17 - 2016/02 [AP1155ADL] 12. Definition of term Characteristics ・Output Voltage (VOut) The output voltage is specified with VIn=VOut,TYP+1V and IOut=5mA. ・Output Current (IOut) Output current, which can be used continuously (It is the range where overheating protection of the IC does not operate). ・Maximum output current (IOut,Max) The rated output current is specified under the condition where the output voltage drops 0.9V times the value specified with IOut=5mA by increasing the output current. The input voltage is set to VOutTYP+1V and the current is pulsed to minimize temperature effect. ・Dropout Voltage (VDrop) It is the difference between the input voltage and the output voltage when the circuit stops the stable operation by decreasing the input voltage. It is measured when the output voltage drops 100mV from its nominal value by decreasing the input voltage gradually. ・Line Regulation (LinReg) It is the fluctuations of the output voltage value when the input voltage is changed. ・Load Regulation (LoaReg) It is the fluctuations of the output voltage value when the input voltage is assumed to be VOut,TYP+1V, and the output current is changed. ・Ripple Rejection (RR) Ripple rejection is the ability of the regulator to attenuate the ripple content of the input voltage at the output. It is measured with the condition of VIn=VOut,TYP+1.5V. Ripple rejection is the ratio of the ripple content between the output vs. input and is expressed in dB ・Standby Current (IStandby) Standby current is the current which flows into the regulator when the output is turned off by the control function (VCont=0V). Protections ・Over Current Protection It is an function to protect the IC by limiting the output current when excessive current flows to IC, such as the output is connected to GND, ets. ・Thermal Protection It protects the IC not to exceed the permissible power consumption of the package in case of large power loss inside the regulator. The output is turned off when the chip reaches around 140°C, but it turns on again when the temperature of the chip decreases. ・ESD MM: 200pF 0Ω 200V or over HBM: 100pF 1.5kΩ 2000V or over 016001036-E-01 - 18 - 2016/02 [AP1155ADL] 4 NC GND 3 R2 36kΩ Cout 1uF Vout 1 NC 1uF NC Cfb 1000pF 2 FB Vout Cin 8 Vin 2.4~14V Vin 7 1.8~14V R1 24kΩ Exposed-Pad Vcont Vcout 6 5 13. Recommended External Circuits ■VOut,TYP=3.0V: Example of selection of external components. Figure 4. External Circuit The output voltage value VOut,TYP is determined using the following equation: VOut,TYP = R1 + R 2 × VFB (1.21V ) R1 The minimum required current through resistance R1, R2 is 30µA, which is determined by VFB . R1 Only a ceramic capacitor should be used for COut. For CIn any type of capacitor may be selected. For COut and CIn, use capacitors rated at 1µF or higher. For details, refer to 11.7 Stability. The Fb terminal has high impedance and is therefore susceptible to external noise, etc. Connecting capacitor CFb between the VOut terminal and the Fb terminal minimizes the effects of external noise and also reduces output noise. ■Recommended Layout ① Cin should be located as close as possible to Vin pin and GND. ② Cout should be located as close as possible to VOUT pin and GND. ③ Feedback resistor R1, R2 should be placed as close as possible to the FB terminal. When connecting Vout and R2, please wiring from "+" terminal of Cout. ④ Cfb should be located as close as possible to VOUT pin and FB pin. ⑤ GND plane should be large as much as possible. ⑥ Exposed Pad is the ground and sharing of the IC. Exposed Pad must be connected to GND. ⑦ Via hall is effective to heat dissipation to each layer of PCB. Figure 5. Recommended Layout 016001036-E-01 - 19 - 2016/02 [AP1155ADL] ■Test Circuit Test circuit for DC characteristics A VIn CIn IIn VIn R1 A VCont ICont VCont VOut,TYP=3.0V(R1=53kΩ, R2=36kΩ) VIn=4.0V, VCont=1.8V, IOut=5mA CIn=1.0µF(Tantalum), CFb=0.001µF(Ceramic), COut=1.0µF(Ceramic), Ta=25°C VOut CFb COut Fb GND V VOut IOut R2 Test circuit for Load Transient VIn VOut IOut CIn VIn VOut,TYP=3.0V(R1=53kΩ, R2=36kΩ) VIn=4.0V, VCont=1.8V CIn=1.0µF(Tantalum), Ta=25°C R1 VCont VCont COut Fb GND 10Hz R2 Test circuit for Line Transient VIn VIn VOut,TYP=3.0V(R1=53kΩ, R2=36kΩ) VIn=4.0V↔5.0V(100Hz), VCont=1.8V, IOut=100mA CIn=1.0µF(Tantalum), CFb=none, Ta=25°C VOut CIn R1 VCont VCont CFb IOut COut Fb GND R2 Test circuit for On/Off Transient VIn CIn CFb R1 IOut COut Fb VCont R2 GND VCont VOut,TYP=3.0V(R1=53kΩ, R2=36kΩ) VIn=4.0V, VCont=0.0V↔2.0V(10Hz), IOut=100mA CIn=1.0µF(Tantalum), CFb=none, Ta=25°C VOut VIn Test circuit for Ripple Rejection VIn VIn VRippple= 500mVp-p R1 VCont VCont VOut,TYP=3.0V(R1=53kΩ, R2=36kΩ) VIn=4.5V, VCont=2.0V, VRipple=500mVp-p, IOut=100mA CIn=none, CFb=none, Ta=25°C VOut CFb COut Fb GND IOut R2 Test circuit for Output Noise VIn VIn CIn R1 VCont VCont 016001036-E-01 R2=36kΩ VIn=VOut,TYP+1.0V, VCont=2.0V, IOut=100mA BPF=400Hz~80kHz CIn=COut=1.0µF(Ceramic), CFb=none, Ta=25°C VOut GND CFb COut Fb IOut V VNoise R2 - 20 - 2016/02 [AP1155ADL] 14. Package ■ Outline Dimensions (Unit:mm) Mark 5 8 4.4 0.2 AC30 xxxX Green Product Mark 1 4 0.40 0.05 0 - 0.25 1.45 0.1 0.1 0.15 0.05 Lot No. 4.9 0.2 1.27 4 8 5 0.4 0.2 (2.7) 1 6.2 0.3 (2.9) 016001036-E-01 - 21 - 2016/02 [AP1155ADL] 15. Revise History Date (YY/MM/DD) 15/12/25 16/01/19 Revision Page Contents 00 1 1 First Edition Added a Recommend Circuit to “2.Features”. Fixed “3.Applications”. Added a Recommend Layout to “13. Recommended External Circuits”. 01 19 016001036-E-01 - 22 - 2016/02 [AP1155ADL] IMPORTANT NOTICE 0. Asahi Kasei Microdevices Corporation (“AKM”) reserves the right to make changes to the information contained in this document without notice. When you consider any use or application of AKM product stipulated in this document (“Product”), please make inquiries the sales office of AKM or authorized distributors as to current status of the Products. 1. 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