XC27x8X Errata Sheet

16/32-Bit
Architecture
XC27x8X Derivatives
16/32-Bit Single-Chip Microcontroller
with 32-Bit Performance
XC2000 Family / Premium Line
Errata Sheet
V1.2 2013-07
Microcontrollers
Edition 2013-07
Published by
Infineon Technologies AG
81726 Munich, Germany
© 2013 Infineon Technologies AG
All Rights Reserved.
Legal Disclaimer
The information given in this document shall in no event be regarded as a guarantee of conditions or
characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any
information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties
and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights
of any third party.
Information
For further information on technology, delivery terms and conditions and prices, please contact the nearest
Infineon Technologies Office (www.infineon.com).
Warnings
Due to technical requirements, components may contain dangerous substances. For information on the types in
question, please contact the nearest Infineon Technologies Office.
Infineon Technologies components may be used in life-support devices or systems only with the express written
approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure
of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support
devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain
and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may
be endangered.
16/32-Bit
Architecture
XC27x8X Derivatives
16/32-Bit Single-Chip Microcontroller
with 32-Bit Performance
XC2000 Family / Premium Line
Errata Sheet
V1.2 2013-07
Microcontrollers
XC27x8X Derivatives
XC2000 Family / Premium Line
Table of Contents
1
History List / Change Summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
2
General . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
3
Current Documentation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
4
4.1
4.2
4.3
4.4
Errata Device Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Functional Deviations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Deviations from Electrical and Timing Specification . . . . . . . . . . . . . . 11
Application Hints . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Documentation Updates . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
5
5.1
5.2
5.3
5.4
Short Errata Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Functional Deviations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Deviations from Electrical and Timing Specification . . . . . . . . . . . . .
Application Hints . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Documentation Updates . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
15
15
17
18
20
6
6.1
Detailed Errata Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Functional Deviations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
ADC_AI.002 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
ADC_X.001 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
ADC_X.002 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
BROM_TC.006 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
ESR_X.002 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
ESR_X.003 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
ESR_X.004 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
GPT12E_X.002 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
OCDS_X.003 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
PAD_X.001 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
RESET_X.003 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
RESET_X.004 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
SCU_X.012 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
StartUp_X.003 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
USIC_AI.004 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
USIC_AI.005 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
USIC_AI.016 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
USIC_AI.018 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
WDT_X.002 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Deviations from Electrical and Timing Specification . . . . . . . . . . . . . .
FLASH_X.P001 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
SWD_X.P001 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
SWD_X.P002 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
21
21
21
21
22
22
23
23
25
26
27
28
33
33
34
34
35
35
36
37
37
40
40
40
41
6.2
Errata Sheet
4
V1.2, 2013-07
XC27x8X Derivatives
XC2000 Family / Premium Line
6.3
6.4
Application Hints . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
ADC_AI.H002 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
ADC_AI.H003 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
CAPCOM12_X.H001 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
CC6_X.H001 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
ECC_X.H001 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
GPT12E_X.H002 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
INT_X.H002 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
INT_X.H004 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
MultiCAN_AI.H005 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
MultiCAN_AI.H006 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
MultiCAN_AI.H007 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
MultiCAN_AI.H008 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
MultiCAN_TC.H002 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
MultiCAN_TC.H003 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
MultiCAN_TC.H004 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
OCDS_X.H003 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
PVC_X.H001 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
RESET_X.H003 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
RTC_X.H003 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
SCU_X.H009 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
SWD_X.H001 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
USIC_AI.H001 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
USIC_AI.H002 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
USIC_AI.H003 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Documentation Updates . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
EBC_X.D001 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Errata Sheet
5
42
42
42
43
45
45
45
47
47
48
48
48
49
49
50
50
51
51
52
52
53
53
53
54
55
56
56
V1.2, 2013-07
XC27x8X Derivatives
XC2000 Family / Premium Line
History List / Change Summary
1
History List / Change Summary
Table 1
History List
Version
Date
Remark1)
1.0
21.02.2011
First Errata Sheet release.
1.1
29.09.2011
Errata No. 02063AERRA, new Marking/Step
(AA) added to Errata Sheet.
1.2
09.07.2013
Errata No. 02664AERRA.
1) Errata changes to the previous Errata Sheet are marked in Chapter 5 ”Short Errata
Description”.
Trademarks
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Errata Sheet
6
V1.2, 2013-07
XC27x8X Derivatives
XC2000 Family / Premium Line
General
2
General
This Errata Sheet describes the deviations of the XC27x8X Derivatives from the
current user documentation.
Each erratum identifier follows the pattern Module_Arch.TypeNumber:
•
•
•
•
Module: subsystem, peripheral, or function affected by the erratum
Arch: microcontroller architecture where the erratum was initially detected.
– AI: Architecture Independent
– TC: TriCore
– X: XC166 / XE166 / XC2000 Family
Type: category of deviation
– [none]: Functional Deviation
– P: Parametric Deviation
– H: Application Hint
– D: Documentation Update
Number: ascending sequential number within the three previous fields. As
this sequence is used over several derivatives, including already solved
deviations, gaps inside this enumeration can occur.
This Errata Sheet applies to all temperature and frequency versions and to all
memory size variants of this device, unless explicitly noted otherwise.
Note: This device is equipped with a C166S V2 Core. Some of the errata have
workarounds which are possibly supported by the tool vendors.
Some corresponding compiler switches need possibly to be set. Please
see the respective documentation of your compiler.
For effects of issues related to the on-chip debug system, see also the
documentation of the debug tool vendor.
Some errata of this Errata Sheet do not refer to all of the XC27x8X Derivatives,
please look to the overview:
Table 2 for Functional Deviations
Table 3 for Deviations from Electrical and Timing Specification
Table 4 for Application Hints
Table 5 for Documentation Updates
Errata Sheet
7
V1.2, 2013-07
XC27x8X Derivatives
XC2000 Family / Premium Line
Current Documentation
3
Current Documentation
The Infineon XC2000 Family comprises device types from the XC2200 group,
the XC2300 group and the XC2700 group. The XC27x8X device types belong
to the XC2700 group.
Device
XC27x8X
Marking/Step
EES-AA, ES-AA, AA
Package
PG-LQFP-100, PG-LQFP-144
This Errata Sheet refers to the following documentation:
•
•
•
•
XC27x8X Derivatives User’s Manual
XC2768X Data Sheet
XC2788X Data Sheet
Documentation Addendum (if applicable)
Make sure you always use the corresponding documentation for this device
available in category 'Documents' at www.infineon.com/xc2700.
The specific test conditions for EES and ES are documented in a separate
Status Sheet.
Note: Devices marked with EES or ES are engineering samples which may not
be completely tested in all functional and electrical characteristics,
therefore they should be used for evaluation only.
Errata Sheet
8
V1.2, 2013-07
XC27x8X Derivatives
XC2000 Family / Premium Line
Errata Device Overview
4
Errata Device Overview
This chapter gives an overview of the dependencies of individual errata to
devices and steps. An X in the column of the sales codes shows that this
erratum is valid.
4.1
Functional Deviations
Table 2 shows the dependencies of functional deviations in the derivatives.
AA
1)
Functional
Deviation
XC27x8X
Errata Device Overview:
Functional Deviations
EES-AA
ES-AA
Table 2
ADC_AI.002
X
ADC_X.001
X
ADC_X.002
X
X
BROM_TC.006
X
X
ESR_X.002
X
X
ESR_X.004
X
X
GPT12E_X.002
X
X
OCDS_X.003
X
X
PAD_X.001
X
X
RESET_X.003
X
X
RESET_X.004
X
X
SCU_X.012
X
X
StartUp_X.003
X
USIC_AI.004
X
X
USIC_AI.005
X
X
Errata Sheet
X
9
V1.2, 2013-07
XC27x8X Derivatives
XC2000 Family / Premium Line
Errata Device Overview
AA
1)
Functional
Deviation
XC27x8X
Errata Device Overview:
Functional Deviations (cont’d)
EES-AA
ES-AA
Table 2
USIC_AI.016
X
X
USIC_AI.018
X
X
WDT_X.002
X
X
1) From EES/ES-AA step to AA step, 3 errata have been fixed.
Errata Sheet
10
V1.2, 2013-07
XC27x8X Derivatives
XC2000 Family / Premium Line
Errata Device Overview
4.2
Deviations from Electrical and Timing Specification
Table 3 shows the dependencies of deviations from the electrical and timing
specification in the derivatives.
Errata Device Overview:
Deviations from Electrical and Timing Specification
EES-AA
ES-AA
AA1)
AC/DC/ADC
Deviation
XC27x8X
Table 3
FLASH_X.P001
X
X
SWD_X.P001
X
SWD_X.P002
X
X
1) From EES/ES-AA step to AA step, 3 errata have been fixed.
Errata Sheet
11
V1.2, 2013-07
XC27x8X Derivatives
XC2000 Family / Premium Line
Errata Device Overview
4.3
Application Hints
Table 4 shows the dependencies of application hints in the derivatives.
XC27x8X
Errata Device Overview:
Application Hints
AA
EES-AA
ES-AA
Hint
1)
Table 4
ADC_AI.H002
X
X
ADC_AI.H003
X
X
CAPCOM12_X.H001
X
X
CC6_X.H001
X
X
ECC_X.H001
X
X
GPT12E_X.H002
X
X
INT_X.H002
X
X
INT_X.H004
X
X
MultiCAN_AI.H005
X
X
MultiCAN_AI.H006
X
X
MultiCAN_AI.H007
X
X
MultiCAN_AI.H008
X
X
MultiCAN_TC.H002
X
X
MultiCAN_TC.H003
X
X
MultiCAN_TC.H004
X
X
OCDS_X.H003
X
X
PVC_X.H001
X
X
RESET_X.H003
X
X
RTC_X.H003
X
X
Errata Sheet
12
V1.2, 2013-07
XC27x8X Derivatives
XC2000 Family / Premium Line
Errata Device Overview
XC27x8X
Errata Device Overview:
Application Hints (cont’d)
AA
EES-AA
ES-AA
Hint
1)
Table 4
SCU_X.H009
X
X
SWD_X.H001
X
X
USIC_AI.H001
X
X
USIC_AI.H002
X
X
USIC_AI.H003
X
X
1) From EES/ES-AA step to AA step, 3 errata have been fixed.
Errata Sheet
13
V1.2, 2013-07
XC27x8X Derivatives
XC2000 Family / Premium Line
Errata Device Overview
4.4
Documentation Updates
Table 5 shows the dependencies oft documentation updates in the derivatives.
XC27x8X
Errata Device Overview:
Documentation Updates
EBC_X.D001
X
AA
EES-AA
ES-AA
Hint
1)
Table 5
X
1) From EES/ES-AA step to AA step, 3 errata have been fixed.
Errata Sheet
14
V1.2, 2013-07
XC27x8X Derivatives
XC2000 Family / Premium Line
Short Errata Description
5
Short Errata Description
This chapter gives an overview on the deviations and application hints.
Changes to the last Errata Sheet are shown in the column “Chg”.
5.1
Functional Deviations
Table 6 shows a short description of the functional deviations.
Table 6
Functional Deviations
Functional
Deviation
Short Description
Chg Pg
ADC_AI.002
Result of Injected Conversion may be
wrong
New 21
ADC_X.001
Cross-Current between VAREF and
VAGND
21
ADC_X.002
Current Drawn on VAREF Pin can be
Unexpected High
22
BROM_TC.006
Baud Rate Detection for CAN Bootstrap
Loader
22
ESR_X.002
ESREXSTAT1 and ESREXSTAT2 Status
Bits can be Cleared after a Write Access
23
ESR_X.004
Wrong Value of SCU_RSTCONx Registers New 25
after ESRy Application Reset
GPT12E_X.002
Effects of GPT Module Microarchitecture
26
OCDS_X.003
Peripheral Debug Mode Settings cleared
by Reset
27
PAD_X.001
Additional Edges in the Input Signal
RESET_X.003
P2.[2:0] and P10.[12:0] Switch to Input
RESET_X.004
Sticky “Register Access Trap” forces
device into power-save mode after reset.
SCU_X.012
Wake-Up Timer RUNCON Command
34
StartUp_X.003
Debug Interface Configuration from Flash
can Fail Upon Power-On
34
Errata Sheet
15
New 28
33
New 33
V1.2, 2013-07
XC27x8X Derivatives
XC2000 Family / Premium Line
Short Errata Description
Table 6
Functional Deviations (cont’d)
Functional
Deviation
Short Description
USIC_AI.004
Receive shifter baudrate limitation
35
USIC_AI.005
Only 7 data bits are generated in IIC mode
when TBUF is loaded in SDA hold time
35
USIC_AI.016
Transmit parameters are updated during
FIFO buffer bypass
New 36
USIC_AI.018
Clearing PSR.MSLS bit immediately
deasserts the SELOx output signal
New 37
WDT_X.002
Clearing the Internal Flag which Stores
Preceding WDT Reset Request
Errata Sheet
16
Chg Pg
37
V1.2, 2013-07
XC27x8X Derivatives
XC2000 Family / Premium Line
Short Errata Description
5.2
Deviations from Electrical and Timing Specification
Table 7 shows a short description of the electrical and timing deviations from
the specification.
Table 7
Deviations from Electrical and Timing Specification
AC/DC/ADC
Deviation
Short Description
FLASH_X.P001
Test Condition for Flash parameter NER in New 40
Data Sheets
SWD_X.P001
Supply Watchdog Level VSWD_min too
Low
SWD_X.P002
Supply Watchdog (SWD) Supervision
Level in Data Sheet.
Errata Sheet
17
Chg Pg
40
New 41
V1.2, 2013-07
XC27x8X Derivatives
XC2000 Family / Premium Line
Short Errata Description
5.3
Application Hints
Table 8 shows a short description of the application hints.
Table 8
Application Hints
Hint
ADC_AI.H002
Short Description
Chg Pg
Minimizing Power Consumption of an
ADC Module
42
ADC_AI.H003
Injected conversion may be performed
with sample time of aborted conversion
42
CAPCOM12_X.H001 Enabling or Disabling Single Event
Operation
43
CC6_X.H001
Modifications of Bit MODEN in Register
CCU6x_KSCFG
45
ECC_X.H001
ECC Error Indication Permanently Set
45
GPT12E_X.H002
Reading of Concatenated Timers
45
INT_X.H002
Increased Latency for Hardware Traps
47
INT_X.H004
SCU Interrupts Enabled After Reset
47
MultiCAN_AI.H005
TxD Pulse upon short disable request
MultiCAN_AI.H006
Time stamp influenced by
resynchronization
48
MultiCAN_AI.H007
Alert Interrupt Behavior in case of BusOff
48
MultiCAN_AI.H008
Effect of CANDIS on SUSACK
49
Upd
ate
48
MultiCAN_TC.H002
Double Synchronization of receive input
49
MultiCAN_TC.H003
Message may be discarded before
transmission in STT mode
50
MultiCAN_TC.H004
Double remote request
50
OCDS_X.H003
Debug Interface Configuration by User
Software
51
PVC_X.H001
PVC Threshold Level 2
51
Errata Sheet
18
V1.2, 2013-07
XC27x8X Derivatives
XC2000 Family / Premium Line
Short Errata Description
Table 8
Application Hints (cont’d)
Hint
Short Description
RESET_X.H003
How to Trigger a PORST after an Internal
Failure
52
RTC_X.H003
Changing the RTC Configuration
52
SCU_X.H009
WUCR.TTSTAT can be set after a PowerUp
53
SWD_X.H001
Application Influence on the SWD
53
USIC_AI.H001
FIFO RAM Parity Error Handling
53
USIC_AI.H002
Configuration of USIC Port Pins
New 54
USIC_AI.H003
PSR.RXIDLE Cleared by Software
New 55
Errata Sheet
19
Chg Pg
V1.2, 2013-07
XC27x8X Derivatives
XC2000 Family / Premium Line
Short Errata Description
5.4
Documentation Updates
Table 9 shows a short description of the documentation updates.
Table 9
Documentation Updates
AC/DC/ADC
Deviation
Short Description
Chg Pg
EBC_X.D001
Visibility of Internal LXBus Cycles on
External Address Bus
New 56
Errata Sheet
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V1.2, 2013-07
XC27x8X Derivatives
XC2000 Family / Premium Line
Detailed Errata Description
6
Detailed Errata Description
This chapter provides a detailed description for each erratum. If applicable a
workaround is suggested.
6.1
Functional Deviations
ADC_AI.002 Result of Injected Conversion may be wrong
In cancel-inject-repeat mode (GxARBPR.CSM* = 1B), the result of the higher
prioritized injected conversion cH may be wrong if it was requested within a
certain time window at the end of a lower prioritized conversion cL. The width of
the critical window depends on the divider factor DIVA for the analog internal
clock.
In cancel-inject-repeat mode (RSPR0.CSM* = 1B), the result of the higher
prioritized injected conversion cH may be wrong if it was requested within a
certain time window at the end of a lower prioritized conversion cL. The width of
the critical window depends on the divider factor DIVA for the analog internal
clock.
Workaround
Do not use cancel-inject-repeat mode. Instead, use wait-for-start mode
(GxARBPR.CSM* = 0B).
Do not use cancel-inject-repeat mode. Instead, use wait-for-start mode
(RSPR0.CSM* = 0B).
ADC_X.001 Cross-Current between VAREF and VAGND
The Early Engineering Samples (marked EES) and Engineering Samples
(marked ES) draw a cross-current during power-on reset (PORST = VSS) and in
standby mode.
Other operating modes are not affected. Later product versions have this
problem fixed.
Errata Sheet
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XC2000 Family / Premium Line
Detailed Errata Description
The cross-current depends on the applied reference voltage, see table below.
Table 10
Typical Current Values
VAGND / V
VAREF / V
IAREF AGND / mA
0
5.5
17.0
0
5.0
14.8
0
4.5
12.8
0
3.3
7.8
0
3.0
6.6
Workaround
None
ADC_X.002 Current Drawn on VAREF Pin can be Unexpected High
After Power-On with active PORST (PORST = VSS) it can happen that the
internal pull-up and/or a pull-down on the VAREF pin are activated randomly. This
has no functional impact but leads to a current consumption (<< 1 mA) which is
higher than expected during the PORST = VSS period. Once PORST is changed
to the high level, the internal pulls at VAREF are disabled. A next enable of the
pulls can occur only with the next Power-On.
Workaround
Release PORST for a short time to a high level.
BROM_TC.006 Baud Rate Detection for CAN Bootstrap Loader
In a specific corner case, the baud rate detected during reception of the
initialization frame for the CAN bootstrap loader may be incorrect. The
probability for this sporadic problem is relatively low, and it decreases with
decreasing CAN baud rate and increasing module clock frequency.
Errata Sheet
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XC2000 Family / Premium Line
Detailed Errata Description
Workaround:
If communication fails, the host should repeat the CAN bootstrap loader
initialization procedure after a reset of the device.
ESR_X.002 ESREXSTAT1 and ESREXSTAT2 Status Bits can be Cleared after a Write Access
During a write access to any register, bits in registers ESREXSTAT1/2 can be
cleared inadvertently.
ESREXSTAT1/2 store event(s) that can trigger various ESR functions.
Workaround
1. Make sure that the trigger signals are still active when the associated
service routine runs, so the trigger source can be evaluated by software.
2. Disable write access to registers CLRESREXSTAT1/2 by clearing bit 8 at
word address 00'F008H. Use a read-modify-write sequence for this purpose
to exclude other bits from this modification.
To clear the status bits, write access to registers CLRESREXSTAT1/2 can
be enabled by setting bit 8 at word location 00'F008H. Use a read-modifywrite sequence for this purpose to exclude other bits from this modification.
Write access is enabled by default.
ESR_X.003 Some Alternate ESRx Inputs Disabled in Stand-By Mode
The ESR1 and ESR2 inputs can be mapped to alternate input ports. Mappings
are controlled by the ESREXCON1 and ESREXCON2 registers.
When in stand-by mode the input port mappings marked DISABLED in the
following table are switched off. Consequently these ports can not be used as
wakeup trigger inputs.
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Detailed Errata Description
Table 11
Tables for XC2269I and XC228xI - ESREXCON1
ESREXCON1
selection
ESR1
Port
XC2269I
XC228xI
Input 0
Port 2.4
OK
OK
Input 1
Port 3.0
unused
DISABLED
Input 2
Port 10.0
OK
OK
Input 3
Port 1.0
unused
OK
Input 4
Port 1.2
unused
OK
Input 5
Port 2.1
OK
OK
Input 6
Port 6.1
OK
OK
Input 7
Port 11.0
unused
DISABLED
Input 8
Port 4.1
DISABLED
OK
Input 9
Port 10.4
OK
OK
Input 10
Port 2.5
OK
OK
Input 11
Port 0.0
DISABLED
OK
Table 12
Tables for XC2269I and XC228xI - ESREXCON2
ESREXCON2
selection
ESR2
Port
XC2269I
XC228xI
Input 0
Port 2.3
OK
OK
Input 1
Port 7.0
OK
OK
Input 2
Port 10.14
OK
OK
Input 3
Port 1.1
DISABLED
OK
Input 4
Port 1.3
DISABLED
OK
Input 5
Port 2.2
OK
OK
Input 6
Port 2.6
OK
OK
Input 7
Port 2.7
OK
OK
Input 8
Port 0.4
DISABLED
OK
Input 9
XTAL1
OK
OK
Errata Sheet
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V1.2, 2013-07
XC27x8X Derivatives
XC2000 Family / Premium Line
Detailed Errata Description
Table 12
Tables for XC2269I and XC228xI - ESREXCON2 (cont’d)
ESREXCON2
selection
ESR2
Port
XC2269I
XC228xI
Input 10
Port 4.5
unused
DISABLED
Input 11
Port 10.8
OK
OK
ESR_X.004 Wrong Value of SCU_RSTCONx Registers after ESRy Application Reset
SCU_RSTCONx registers are reset only by Power-On, but they may be wrongly
affected after a second application reset requested by an ESRy pin. This may
lead to the SCU_RSTCONx register values being set to zero, which could
unexpectedly disable reset sources within the user application. The conditions
which lead to this behavior are:
1. First, an application reset by SW (software), CPU (Central Processing Unit),
MP (Memory), WDT (Watchdog Timer) or ESRy (External Service Request
y) occurs.
2. Following this, an application reset on an ESRy pin occurs.
3. If the above mentioned ESRy reset occurs during a critical time window of
the SSW (startup software), then it’s possible that the application will
operate with the wrong SCU_RSTCONx register value. The critical time
window occurs when the SSW is writing the SCU_RSTCONx registers, and
at the same time, the ESRy reset request is processed by the reset circuitry.
The width of this critical window fcritical window is less than 13 cycles.
Application
Reset
t critical window
Reset
by ESRy pin
Start of
SSW
SSW
Write
RSTCON
Start of
SSW
Application Application
Runs
Software
End of
SSW
Application
Runs
ESR_X.004 Fig. 1
Figure 1
Errata Sheet
Critical application reset sequence
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Detailed Errata Description
Workaround
•
•
Initialize SCU_RSTCONx registers by user software after any reset, or
assure that a second application reset request with an ESR pin does not
occur during the critical time window.
GPT12E_X.002 Effects of GPT Module Microarchitecture
The present GPT module implementation provides some enhanced features
(e.g. block prescalers BPS1, BPS2) while still maintaining timing and functional
compatibility with the original implementation in the C166 Family of
microcontrollers.
Both the GPT1 and GPT2 blocks use a finite state machine to control the
actions within each block. Since multiple interactions are possible between the
timers (T2 .. T6) and register CAPREL, these elements are processed
sequentially within each block in different states. However, all actions are
normally completed within one basic clock cycle.
The GPT2 state machine has 4 states (2 states when BPS2 = 01B) and
processes T6 before T5. The GPT1 state machine has 8 states (4 states when
BPS1 = 01B) and processes the timers in the order T3 - T2 (all actions except
capture) - T4 - T2 (capture).
In the following, two effects of the internal module microarchitecture that may
require special consideration in an application are described in more detail.
1.) Reading T3 by Software with T2/T4 in Reload Mode
When T2 or T4 are used to reload T3 on overflow/underflow, and T3 is read by
software on the fly, the following unexpected values may be read from T3:
•
•
when T3 is counting up, 0000H or 0001H may be read from T3 directly after
an overflow, although the reload value in T2/T4 is higher (0001H may be
read in particular if BPS1 = 01B and T3I = 000B),
when T3 is counting down, FFFFH or FFFEH may be read from T3 directly
after an underflow, although the reload value in T2/T4 is lower (FFFEH may
be read in particular if BPS1 = 01B and T3I = 000B).
Errata Sheet
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Detailed Errata Description
Note: All timings derived from T3 in this configuration (e.g. distance between
interrupt requests, PWM waveform on T3OUT, etc.) are accurate except
for the specific case described under 2.) below.
Workaround:
•
•
When T3 counts up, and value_x < reload value is read from T3, value_x
should be replaced with the reload value for further calculations.
When T3 counts down, and value_x > reload value is read from T3, value_x
should be replaced with the reload value for further calculations.
Alternatively, if the intention is to identify the overflow/underflow of T3, the T3
interrupt request may be used.
2.) Reload of T3 from T2 with setting BPS1 = 01B and T3I = 000B
When T2 is used to reload T3 in the configuration with BPS1 = 01B and
T3I = 000B (i.e. fastest configuration/highest resolution of T3), the reload of T3
is performed with a delay of one basic clock cycle.
Workaround 1:
To compensate the delay and achieve correct timing,
•
•
increment the reload value in T2 by 1 when T3 is configured to count up,
decrement the reload value in T2 by 1 when T3 is configured to count down.
Workaround 2:
Alternatively, use T4 instead of T2 as reload register for T3. In this configuration
the reload of T3 is not delayed, i.e. the effect described above does not occur
with T4.
OCDS_X.003 Peripheral Debug Mode Settings cleared by Reset
The behavior (run/stop) of the peripheral modules in debug mode is defined in
bitfield SUMCFG in the KSCCFG registers. The intended behavior is, that after
an application reset has occurred during a debug session, a peripheral reenters the mode defined for debug mode.
Errata Sheet
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V1.2, 2013-07
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XC2000 Family / Premium Line
Detailed Errata Description
For some peripherals, the debug mode setting in SUMCFG is erroneously set
to normal mode upon any reset (instead upon a debug reset only). It remains in
this state until SUMCFG is written by software or the debug system.
Some peripherals will not re-enter the state defined for debug mode after an
application reset:
GPT12, CAPCOM2, and MultiCAN will resume normal operation like after
reset, i.e. they are inactive until they are initialized by software.
In case the RTC has been running before entry into debug mode, and it was
configured in SUMCFG to stop in debug mode, it will resume operation as
before entry into debug mode instead.
All other peripheral modules, i.e. ADC, CCU6 and USIC, will correctly re-enter
the state defined for debug mode after an application reset in debug mode.
For Flash and CPU, bitfield SUMCFG must be configured to normal mode
anyway, since they are required for debugging.
Workaround
None.
PAD_X.001 Additional Edges in the Input Signal
The digital input- and I/O-pins are designed using Schmitt trigger input
structures with hysteresis. Even with this structure, it is possible that very slow
rising edges may generate spikes, resulting in unexpected additional edges at
the input signal.
The next picture Figure 2 is an example for a slow input signal, with spikes
shown on the slow rising input signal.
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XC2000 Family / Premium Line
Detailed Errata Description
tr.
0.9 VDDP
0.7 VDDP
Input
Signal
0.3 VDDP
0.1 VDDP
Internal
Signal
Unexpected Edges
PAD_X.001 Fig. 1
Figure 2
Example for a Slow Input Signal
The first rising edge in Figure 2 of the internal signal is always valid. The edges
which are marked with “Unexpected Edges” must be ignored.
Measurements have shown that a spike can be generated under the following
conditions.
Table 13
Conditions for Additional Edges in the Input Signal
Parameter
Symbol
VDDP
Junction Temperature TJ
System frequency
fsys
Rising Slope
tr
Digital supply voltage
Typ. Value Unit Note
4.5 to 5.5
V
full range
°C
all
MHz
>1
µs
Upper Voltage Range
The reaction to this spike generation strongly depends on the application
(hardware, software, internal and external noise). Although it is not possible to
define how the application will react in all cases, it is possible to categorize how
applications are typically affected, as shown below.
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XC2000 Family / Premium Line
Detailed Errata Description
Applications which can be affected by a spike:
•
•
•
CCU6, CAPCOM2 and GPT inputs
Port inputs
Interrupts input
Applications which should not be affected by a spike due to faster rising slope
tr which is necessary for the application, due the interface protocol or due
multiple sampling of the hardware:
•
•
•
USIC
CAN
Others
Workaround for Input Capture Conditions
1. Workaround for all Affected Applications
Use rising edges with faster rising slope tr than defined in Table 13.
2. Workaround for CCU6, CAPCOM2 and GPT Inputs
No generic solution is available for these applications. Add or switch to a
software solution.
For example, the software could check whether the measured signal values are
in the expected range.
3. Workaround for Port Inputs
1. The captured time interval value should be checked whether it is in a
reasonable range.
2. The input pin should be read several times, and a majority decision may be
made to decide whether the edge was correct or erratic.
Only if 1) and 2) indicate that the edge was reliable, the captured value should
be used for further calculations. Otherwise, a substituted (extrapolated) value
might be used.
Errata Sheet
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XC2000 Family / Premium Line
Detailed Errata Description
4. Workaround for Interrupt Inputs
4.1 Falling Edge Detection Approach
1. Measure the time interval since the last interrupt (shown as in tinterval in
Figure 3 below) and check that it is in the expected time range.
In the example, an erratic edge would cause the measured time intervalt
erratic interval to be approximately 50% of the expected value.
2. The state of the input pin that caused the interrupt could be read several
times in the interrupt service routine and a majority decision made to check
if the input pin really is at a low level to determine whether this is a genuine
falling edge interrupt or whether the interrupt was triggered by a spike
generated by a slow rising edge.
0.7 VDDP
Input Signal
0.3 VDDP
Internal
Signal
Unexpected Edges
Unexpected Edges
terratic interval
tinterval
PAD_X.001 Fig. 2
Figure 3
Falling Edge Detection Approach
Only if 1) and/or 2) indicate that the edge was reliable, should the rest of the
interrupt service routine be executed.
4.2 Rising Edge Detection Approach
In case of rising edge detection multiple interrupts would be generated when the
spike occurs. The time interval since the last interrupt can be measured – if it is
very small compared to the expected value, this would indicate a spike and the
interrupt should be ignored.
Errata Sheet
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XC2000 Family / Premium Line
Detailed Errata Description
0.7 VDDP
Input Signal
0.3 VDDP
Internal
Signal
terratic interval
tinterval
Figure 4
PAD_X.001 Fig. 3
Rising Edge Detection Approach
If the time between the rising signal edge and the rising edge caused by a spike
terratic is less than the ISR service time, a workaround would be to clear the
interrupt request (IR) flag before the return from interrupt is done. The clearing
of the IR flag will avoid a further erratic interrupt.
The preferred solution for interrupt handling is to use the rising edge detection.
4.3 Rising Edge and Falling Edge Detection Approach
The rising edge detection workaround works also if both edges are used as
trigger for interrupt and the following conditions are valid:
•
•
terratic interval << tinterval r and
terratic interval << tinterval f
0.7 VDDP
Input Signal
0.3 VDDP
Internal
Signal
Figure 5
Errata Sheet
terratic interval
tinterval r
tinterval f
PAD_X.001 Fig. 4
Rising Edge and Falling Edge Detection Approach
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Detailed Errata Description
RESET_X.003 P2.[2:0] and P10.[12:0] Switch to Input
During the execution of an Application Reset and Debug Reset the pins
P2.[2:0] and P10.[12:0] are intermediately switched to input.
These pins return to their previous mode approximately 35 system clock cycles
after the application reset counter has expired (approx. 0.6 µs with default reset
delay at 80 MHz).
If such a pin is used as output, make sure that this short interruption does not
lead to critical system conditions.
Workaround
External pull devices can be added to have a defined level on these pins during
Application and Debug Reset.
RESET_X.004 Sticky “Register Access Trap” forces device into powersave mode after reset.
The system control unit (SCU) provides trap generation, to respond to certain
system level events or faults. Certain trap sources maintain sticky trap flags
which are only cleared explicitly by software, or by a power-on reset. These
sticky trap flags are contained in the SCU register DMPMIT.
In case the “Register Access Trap” flag (DMPMIT.RAT) becomes set, but is not
cleared before a debug, internal application, or application reset occurs, then
the microcontroller will reset, but will fail to start-up correctly. The
microcontroller start-up software will detect that the sticky trap flag is set, and
will force the device into power-save mode with DMP_1 shut down and DMP_M
powered.
Workaround
In response to the trap event, software must explicitly clear the sticky trap flag
using the SCU register DMPMITCLR, before executing a debug, internal
application, or application reset.
Note that this workaround does not address unexpected debug, internal
application, or application resets which occur between the sticky trap event and
Errata Sheet
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V1.2, 2013-07
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XC2000 Family / Premium Line
Detailed Errata Description
the clearing of the sticky flags by software. To keep this exposure period as
short as possible, it is recommended to clear the flag early in the trap routine.
Note: Register DMPMITCLR is protected by the register security mechanism
after execution of the EINIT instruction and must be unlocked before
accessing.
SCU_X.012 Wake-Up Timer RUNCON Command
The Wake-Up Timer can be started and stopped by the WUCR.RUNCON bit field.
Under the precondition that the Wake-Up Timer is configured to stop when
reaching zero (WUCR.ASP=1B) and if two Wake-Up Timer commands are
executed successively (e.g. “start” is directly followed by “stop”) then the
second command will be ignored and will not change the state of the Wake-Up
Timer.
Workaround
After executing the first command wait at least 4 Wake-Up Timer cycles (fWUT)
before writing again to the WUCR.RUNCON bit field and requesting the second
command.
StartUp_X.003 Debug Interface Configuration from Flash can Fail Upon
Power-On
XC2000/XE166 devices allow the user to select between a number of debug
interface options including type (JTAG/DAP) and pin assignment.
The primary selection is done by configuration pins upon power-on, where one
of the supported options is to install the debug interface according to the value
taken from dedicated locations in user Flash (C001F0H..C001F3H). This option
is selected by configuration pin values (HWCFG) xxxxx111B (code start from
internal Flash) or x1100000B (code start from external memory). The other
configurations directly selecting a debug mode work correctly.
The start-up procedure reads the dedicated locations in Flash too early - before
Flash redundancy is installed - which can lead to an unrecoverable read error
and terminate the boot process. A limited number of devices is affected – rough
Errata Sheet
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XC2000 Family / Premium Line
Detailed Errata Description
estimation is below 1% from the production - and the (mis) behavior is constant.
That means any device is either always error free or always failing.
Note, that only the two mentioned modes upon power-on and only the read from
dedicated locations during start-up are affected but not in general Flash and
debug interface functionality.
Workaround
None.
If these start-up configurations are used during development, a device that does
not start-up in the desired debug configuration should be replaced by another
device.
Alternatively, select a debug interface not from Flash data but directly using
configuration pins - refer to the User’s Manual. With this it is not possible to start
from external memory, nor is JTAG position A available.
USIC_AI.004 Receive shifter baudrate limitation
If the frame length of SCTRH.FLE does not match the frame length of the
master, then the baudrate of the SSC slave receiver is limited to fsys/2 instead
of fsys.
Workaround
None.
USIC_AI.005 Only 7 data bits are generated in IIC mode when TBUF is
loaded in SDA hold time
When the delay time counter is used to delay the data line SDA (HDEL > 0), and
the empty transmit buffer TBUF was loaded between the end of the
acknowledge bit and the expiration of programmed delay time HDEL, only 7 data
bits are transmitted.
With setting HDEL=0 the delay time will be tHDEL = 4 x 1/fSYS + delay
(approximately 60ns @ 80MHz).
Errata Sheet
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XC2000 Family / Premium Line
Detailed Errata Description
Workaround
•
•
Do not use the delay time counter, i.e use only HDEL=0 (default),
or
write TBUF before the end of the last transmission (end of the acknowledge
bit) is reached.
USIC_AI.016 Transmit parameters are updated during FIFO buffer bypass
Transmit Control Information (TCI) can be transferred from the bypass structure
to the USIC channel when a bypass data is loaded into TBUF. Depending on
the setting of TCSR register bit fields, different transmit parameters are updated
by TCI:
•
•
•
•
•
When SELMD = 1, PCR.CTR[20:16] is updated by BYPCR.SELO
(applicable only in SSC mode)
When WLEMD = 1, SCTR.WLE and TCSR.EOF are updated by
BYPCR.BWLE
When FLEMD = 1, SCTR.FLE[4:0] is updated by BYPCR.BWLE
When HPCMD = 1, SCTR.HPCDIR and SCTR.DSM are updated by BHPC
When all of the xxMD bits are 0, no transmit parameters will be updated
However in the current device, independent of the xxMD bits setting, the
following are always updated by the TCI generated by the bypass structure,
when TBUF is loaded with a bypass data:
•
•
•
WLE, HPCDIR and DSM bits in SCTR register
EOF and SOF bits in TCSR register
PCR.CTR[20:16] (applicable only in SSC mode)
Workaround
The application must take into consideration the above behaviour when using
FIFO buffer bypass.
Errata Sheet
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XC2000 Family / Premium Line
Detailed Errata Description
USIC_AI.018 Clearing PSR.MSLS bit immediately deasserts the SELOx
output signal
In SSC master mode, the transmission of a data frame can be stopped explicitly
by clearing bit PSR.MSLS, which is achieved by writing a 1 to the related bit
position in register PSCR.
This write action immediately clears bit PSR.MSLS and will deassert the slave
select output signal SELOx after finishing a currently running word transfer and
respecting the slave select trailing delay (Ttd) and next-frame delay (Tnf).
However in the current implementation, the running word transfer will also be
immediately stopped and the SELOx deasserted following the slave select
delays.
If the write to register PSCR occurs during the duration of the slave select
leading delay (Tld) before the start of a new word transmission, no data will be
transmitted and the SELOx gets deasserted following Ttd and Tnf.
Workaround
There are two possible workarounds:
•
•
Use alternative end-of-frame control mechanisms, for example, end-offrame indication with TSCR.EOF bit.
Check that any running word transfer is completed (PSR.TSIF flag = 1)
before clearing bit PSR.MSLS.
WDT_X.002 Clearing the Internal Flag which Stores Preceding WDT Reset
Request
The information that the WDT has already been exceeded once is stored in an
internal flag. In contrary to the documentation, that this flag can be cleared by
writing a 1B to bit WDTCS.CLRIRF at any time, clearing of the internal flag is only
possible, when the WDT is in Prewarning Mode.
Workaround 1
Applications following the proposal of Application Note AP16103 (section
`Using ESR pins to trigger a PORST reset`) to trigger a Power-on Reset upon
Errata Sheet
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V1.2, 2013-07
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XC2000 Family / Premium Line
Detailed Errata Description
a WDT event will find the internal flag cleared upon the Power-on Reset and
thus will have no issue with this limitation.
Workaround 2
In case the WDT triggers a User Reset upon a WDT overflow, the internal flag
will not be cleared by the reset itself. Any further overflow of the WDT will lead
to a permanent reset of the device.
Applications which intentionally let the WDT exceed once, e.g. in conjunction
with an initial self test, might want to have the internal flag cleared to prevent a
permanent reset upon a real WDT overflow.
If the internal flag shall be cleared by software, this must be done as a reaction
on a WDT overflow in the time frame the WDT is in Prewarning Mode before the
permanent User Reset will be triggered. The CPU is notified upon the WDT
entering Prewarning Mode by issuing an interrupt request. The application can
react on this request and clear the internal flag now by writing a 1B to bit
WDTCS.CLRIRF e.g. within an ISR.
Workaround 3
Some applications may not want to use or rely on the interrupt logic in
conjunction with a WDT overflow event. The proposed remedy in this case is,
to initiate a Power Reset to clear the internal flag by changing the settings of the
active Supply Watchdog (SWD) as follows:
1. Disable SFR protection.
2. Write the inverted value of bit LxALEV to register SWDCON0, where x stands
for the number of the comparator which currently would trigger a Power
Reset.
In doing so, a Power Reset for VDDI_1 and VDDI_M will be activated clearing
the internal flag. The application may store information on preceding WDT
events in the Standby-SRAM. This can be done any time after the WDT reset
without timing limitations or the need to use the interrupt logic.
Note: Although the supply for the DPRAM, DSRAM and PSRAM will be
switched off during the active reset phase, it depends on the external
buffer capacitance at the VDDI_1 pins, the actual system clock frequency
Errata Sheet
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XC2000 Family / Premium Line
Detailed Errata Description
and the environmental conditions, whether the content of these RAMs will
be preserved in this case or not. However, the Standby-RAM itself is not
cleared upon this reset.
Errata Sheet
39
V1.2, 2013-07
XC27x8X Derivatives
XC2000 Family / Premium Line
Detailed Errata Description
6.2
Deviations from Electrical and Timing Specification
FLASH_X.P001 Test Condition for Flash parameter NER in Data Sheets
The Flash endurance parameter NER `Number of erase cycles` for 15000 cycles
is documented with a wrong Test Condition.
The Test Condition states today: `tRET≥5 years; Valid for up to 64 user selected
sectors (data storage)`.
In fact the amount of Flash memory validated for this cycling rate is more limited
and the Test Condition must therefore state the following:
•
tRET≥5 years; Valid for Flash module 4 (up to 64 kbytes)
Note: The related use case for this parameter is data storage with high cycling
rate in general and EEPROM emulation in particular. For these
applications concurrent operation of data storage to and program
execution from Flash is assumed. Refer also to parameter NPP.
SWD_X.P001 Supply Watchdog Level VSWD_min too Low
The supply watchdog (SWD) has a built-in hysteresis. In the affected products,
this hysteresis is increased.
This leads to a decreased lower level, i.e. the threshold is lower than selected
(e.g. < 4.5 V for SWDCON.LEVxV = 1001B, or < 3.0 V for SWDCON.LEVxV =
0001B).
The functionality of the on-chip modules is not affected, as it is ensured by the
power validation circuits (PVC).
The IO timing can be marginally slower if VDDP is below the specified minimum
value.
Workaround
None.
Errata Sheet
40
V1.2, 2013-07
XC27x8X Derivatives
XC2000 Family / Premium Line
Detailed Errata Description
SWD_X.P002 Supply Watchdog (SWD) Supervision Level in Data Sheet.
The Supply Watchdog (SWD) Supervision Level VSWD tolerance boundaries for
5.5 V are changed from ± 0.15 V to ± 0.30 V.
Errata Sheet
41
V1.2, 2013-07
XC27x8X Derivatives
XC2000 Family / Premium Line
Detailed Errata Description
6.3
Application Hints
ADC_AI.H002 Minimizing Power Consumption of an ADC Module
For a given number of A/D conversions during a defined period of time, the total
energy (power over time) required by the ADC analog part during these
conversions via supply VDDPA is approximately proportional to the converter
active time.
Recommendation for Minimum Power Consumption:
In order to minimize the contribution of A/D conversions to the total power
consumption, it is recommended
1. to select the internal operating frequency of the analog part (fADCI) near the
maximum value specified in the Data Sheet, and
2. to switch the ADC to a power saving state (via ANON) while no conversions
are performed. Note that a certain wake-up time is required before the next
set of conversions when the power saving state is left.
Note: The selected internal operating frequency of the analog part that
determines the conversion time will also influence the sample time tS. The
sample time tS can individually be adapted for the analog input channels
via bit field STC.
ADC_AI.H003 Injected conversion may be performed with sample time of
aborted conversion
For specific timing conditions and configuration parameters, a higher prioritized
conversion ci (including a synchronized request from another ADC kernel) in
cancel-inject-repeat mode may erroneously be performed with the sample time
parameters of the lower prioritized cancelled conversion cc. This may also shift
the starting point of following conversions.
The conditions for this behavior are as follows (all 3 conditions must be met):
Errata Sheet
42
V1.2, 2013-07
XC27x8X Derivatives
XC2000 Family / Premium Line
Detailed Errata Description
1. Sample Time setting: injected conversion ci and cancelled conversion cc
use different sample time settings, i.e. bit fields STC in the corresponding
Input Class Registers INPCRx (for cc) and INPCRy (for ci) are programmed
to different values.
2. Timing condition: conversion ci starts during the first fADCI clock cycle of the
sample phase of cc.
3. Configuration parameters: the ratio between the analog clock fADCI and
the arbiter speed is as follows:
NA > ND*(NAR+3),
with
a) NA = ratio fADC/fADCI (NA = 4 .. 63, as defined in bit field DIVA),
b) ND = ratio fADC/fADCD = number of fADC clock cycles per arbitration slot
(ND = 1 .. 4, as defined in bit field DIVD),
c) NAR = number of arbitration slots per arbitration round (NAR = 4, 8, 16, or
20, as defined in bit field ARBRND).
All bit fields mentioned above are located in register GLOBCTR.
As can be seen from the formula above, a problem typically only occurs when
the arbiter is running at maximum speed, and a divider NA > 7 is selected to
obtain fADCI.
Workaround 1
Select the same sample time for injected conversions ci and potentially
cancelled conversions cc, i.e. program all bit fields STC in the corresponding
Input Class Registers INPCRx (for cc) and INPCRy (for ci) to the same value.
Workaround 2
Select the parameters in register GLOBCTR according to the following relation:
NA ≤ ND*(NAR+3).
CAPCOM12_X.H001 Enabling or Disabling Single Event Operation
The single event operation mode of the CAPCOM1/2 unit eliminates the need
for software to react after the first compare match when only one event is
required within a certain time frame. The enable bit SEEy for a channel CCy is
Errata Sheet
43
V1.2, 2013-07
XC27x8X Derivatives
XC2000 Family / Premium Line
Detailed Errata Description
cleared by hardware after the compare event, thus disabling further events for
this channel.
One Channel in Single Event Operation
As the Single Event Enable registers CC1_SEE, CC2_SEE are not located in the
bit-addressable SFR address range, they can only be modified by instructions
operating on data type WORD. This is no problem when only one channel of a
CAPCOM unit is used in single event mode.
Two or more Channels in Single Event Operation
When two or more channels of a CAPCOM unit are independently operating in
single event mode, usually an OR instruction is used to enable one or more
compare events in register CCn_SEE, while an AND instruction may be used to
disable events before they have occurred. In these cases, the timing relation of
the channels must be considered, otherwise the following typical problem may
occur:
•
•
•
•
In the Memory stage, software reads register CCn_SEE with bit SEEy = 1B
(event for channel CCy has not yet occurred)
Meanwhile, event for CCy occurs, and bit SEEy is cleared to 0B by hardware
In the Write-Back stage, software writes CCn_SEE with bit SEEx = 1B
(intended event for CCx enabled via OR instruction) and bit SEEy = 1B
or, as inverse procedure, software writes CCn_SEE with bit SEEx = 0B
(intended event for CCx disabled via AND instruction) and bit SEEy = 1B
In these cases, another unintended event for channel CCy is enabled.
To avoid this effect, one of the following solutions - depending on the
characteristics of the application - is recommended to enable or disable further
compare events for CAPCOM channels concurrently operating in single event
mode:
•
•
•
Modify register CCn_SEE only when it is ensured that no compare event in
single event mode can occur, i.e. when CCn_SEE = 0x0000, or
Modify register CCn_SEE only when it is ensured that there is a sufficient
time distance to the events of all channels operating in single event mode,
such that none of the bits in CCn_SEE can change in the meantime, or
Use single event operation for one channel only (i.e. only one bit SEMx may
be = 1B), and/or
Errata Sheet
44
V1.2, 2013-07
XC27x8X Derivatives
XC2000 Family / Premium Line
Detailed Errata Description
•
Use one of the standard compare modes, and emulate single event
operation for a channel CCs by disabling further compare events in bit field
MODs (in register CCn_Mz) in the corresponding interrupt service routine.
Writing to register CCn_Mz is uncritical, as this register is not modified by
hardware.
CC6_X.H001 Modifications of Bit MODEN in Register CCU6x_KSCFG
For each module, setting bit MODEN = 0 immediately switches off the module
clock. Care must be taken that the module clock is only switched off when the
module is in a defined state (e.g. stop mode) in order to avoid undesired effects
in an application.
In addition, for a CCU6 module in particular, if bit MODEN is changed to 0 while
the internal functional blocks have not reached their defined stop conditions,
and later MODEN is set to 1 and the mode is not set to run mode, this leads to
a lock situation where the module clock is not switched on again.
ECC_X.H001 ECC Error Indication Permanently Set
The ECC error flag of the ECCSTAT register for the DPRAM, DSRAM, PSRAM
and SBRAM can not be cleared, if a memory location with an ECC error is
selected and the ECC is enabled. The memory can be selected by an active or
by the latest read or write access.
Workaround
Select a memory location without ECC error in the respective memory (e.g.
make a read to another address) and then clear the ECC error flag. Be aware
that the new selected address may also have an ECC error.
GPT12E_X.H002 Reading of Concatenated Timers
For measuring longer time periods, a core timer (T3 or T6) may be
concatenated with an auxiliary timer (T2/T4 or T5) of the same timer block. In
Errata Sheet
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V1.2, 2013-07
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XC2000 Family / Premium Line
Detailed Errata Description
this case, the core timer contains the low part, and the auxiliary timer contains
the high part of the extended timer value.
When reading the low and high parts of concatenated timers, care must be
taken to obtain consistent values in particular after a timer overflow/underflow
(e.g. one part may already have considered an overflow, while the other has
not). This is a general issue when reading multi-word results with consecutive
instructions, and not necessarily unique to the GPT module microarchitecture.
The following algorithm may be used to read concatenated GPT timers,
represented by Timer_high (for auxiliary timer, here: T2) and Timer_low (for
core timer, here: T3). In this example, the high part is read twice, and reading
of the low part is repeated if two different values were read for the high part.
•
•
•
•
read Timer_high_temp = T2
read Timer_low = T3
wait two basic clock cycles (to allow increment/decrement of auxiliary timer
in case of core timer overflow/underflow) - see Table 14 below
read Timer_high = T2
– if Timer_high is not equal to Timer_high_temp: read Timer_low = T3
After execution of this algorithm, Timer_high and Timer_low represent a
consistent time stamp of the concatenated timers.
The equivalent number of system clock cycles corresponding to two basic clock
cycles is shown in the following Table 14:
Table 14
Equivalent Number of System Clock Cycles Required to Wait
for Two Basic Clock Cycles
Setting of BPS1
BPS1 = 01 BPS1 = 00 BPS1 = 11 BPS1 = 10
Required Number of
System Clocks
8
Setting of BPS2
BPS2 = 01 BPS2 = 00 BPS2 = 11 BPS2 = 10
Required Number of
System Clocks
4
16
8
32
16
64
32
In case the required timer resolution can be achieved with different
combinations of the Block Prescaler BPS1/BPS2 and the Individual Prescalers
TxI, the variant with the smallest value for the Block Prescaler may be chosen
Errata Sheet
46
V1.2, 2013-07
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XC2000 Family / Premium Line
Detailed Errata Description
to minimize the waiting time. E.g. in order to run T6 at fSYS/512, select
BPS2 = 00B, T6I = 111B, and insert 8 NOPs (or other instructions) to ensure the
required waiting time before reading Timer_high the second time.
INT_X.H002 Increased Latency for Hardware Traps
When a condition for a HW trap occurs (i.e. one of the bits in register TFR is set
to 1B), the next valid instruction that reaches the Memory stage is replaced with
the corresponding TRAP instruction. In some special situations described in the
following, a valid instruction may not immediately be available at the Memory
stage, resulting in an increased delay in the reaction to the trap request:
1. When the CPU is in break mode, e.g. single-stepping over such instructions
as SBRK or BSET TFR.x (where x = one of the trap flags in register TFR)
will have no (immediate) effect until the next instruction enters the Memory
stage of the pipeline (i.e. until a further single-step is performed).
2. When the pipeline is running empty due to (mispredicted) branches and a
relatively slow program memory (with many wait states), servicing of the
trap is delayed by the time for the next access to this program memory, even
if vector table and trap handler are located in a faster memory. However, the
situation when the pipeline/prefetcher are completely empty is quite rare
due to the advanced prefetch mechanism of the C166S V2 core.
INT_X.H004 SCU Interrupts Enabled After Reset
Following a reset, the SCU interrupts are enabled by default (register
SCU_INTDIS = 0000H). This may lead to interrupt requests being triggered in
the SCU immediately, even before user software has begun to execute. In the
SCU, multiple interrupt sources are `ORed` to a common interrupt node of the
CPU interrupt controller. Due to the “ORing” of multiple interrupt sources, only
one interrupt request to the interrupt controller will be generated if multiple
sources at the input of this OR gate are active at the same time. If user software
enables an interrupt in the interrupt controller (SCU_xIC) which shares the
same node as the SCU interrupt request active after reset, it may lead to the
effect of suppressing the intended interrupt source. So, for all SCU interrupt
sources which will not be used, make sure to disable the interrupt source
Errata Sheet
47
V1.2, 2013-07
XC27x8X Derivatives
XC2000 Family / Premium Line
Detailed Errata Description
(SCU_INTDIS) and clear any pending request flags (SCU_xIC.IR) before
enabling interrupts in interrupt controller.
MultiCAN_AI.H005 TxD Pulse upon short disable request
If a CAN disable request is set and then canceled in a very short time (one bit
time or less) then a dominant transmit pulse may be generated by MultiCAN
module, even if the CAN bus is in the idle state.
Example for setup of the CAN disable request:
MCAN_KSCCFG.MODEN = 0 and then MCAN_KSCCFG.MODEN = 1
Workaround
Set all INIT bits to 1 before requesting module disable.
MultiCAN_AI.H006 Time stamp influenced by resynchronization
The time stamp measurement feature is not based on an absolute time
measurement, but on actual CAN bit times which are subject to the CAN
resynchronization during CAN bus operation.The time stamp value merely
indicates the number of elapsed actual bit times. Those actual bit times can be
shorter or longer than nominal bit time length due to the CAN resynchronization
events.
Workaround
None.
MultiCAN_AI.H007 Alert Interrupt Behavior in case of Bus-Off
The MultiCAN module shows the following behavior in case of a bus-off status:
Errata Sheet
48
V1.2, 2013-07
XC27x8X Derivatives
XC2000 Family / Premium Line
Detailed Errata Description
TEC=0x60 or
REC=0x60
EWRN
Figure 6
REC=0x1,
TEC=0x1
BOFF
INIT
REC=0x60,
TEC=0x1
EWRN+BOFF
INIT
REC=0x0,
TEC=0x0
ALERT
INIT
Alert Interrupt Behavior in case of Bus-Off
When the threshold for error warning (EWRN) is reached (default value of Error
Warning Level EWRN = 0x60), then the EWRN interrupt is issued. The bus-off
(BOFF) status is reached if TEC > 255 according to CAN specification,
changing the MultiCAN module with REC and TEC to the same value 0x1,
setting the INIT bit to 1B, and issuing the BOFF interrupt. The bus-off recovery
phase starts automatically. Every time an idle time is seen, REC is incremented.
If REC = 0x60, a combined status EWRN+BOFF is reached. The corresponding
interrupt can also be seen as a pre-warning interrupt, that the bus-off recovery
phase will be finished soon. When the bus-off recovery phase has finished (128
times idle time have been seen on the bus), EWRN and BOFF are cleared, the
ALERT interrupt bit is set and the INIT bit is still set.
MultiCAN_AI.H008 Effect of CANDIS on SUSACK
When a CAN node is disabled by setting bit NCR.CANDIS = 1B, the node waits
for the bus idle state and then sets bit NSR.SUSACK = 1B.
According to specification CANDIS shall have no influence on SUSACK.
However, SUSACK has no effect on applications, as its original intention is to
have an indication that the suspend mode of the node is reached during
debugging.
MultiCAN_TC.H002 Double Synchronization of receive input
The MultiCAN module has a double synchronization stage on the CAN receive
inputs. This double synchronization delays the receive data by 2 module clock
cycles. If the MultiCAN is operating at a low module clock frequency and high
CAN baudrate, this delay may become significant and has to be taken into
Errata Sheet
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V1.2, 2013-07
XC27x8X Derivatives
XC2000 Family / Premium Line
Detailed Errata Description
account when calculating the overall physical delay on the CAN bus
(transceiver delay etc.).
MultiCAN_TC.H003 Message may be discarded before transmission in
STT mode
If MOFCRn.STT=1 (Single Transmit Trial enabled), bit TXRQ is cleared
(TXRQ=0) as soon as the message object has been selected for transmission
and, in case of error, no retransmission takes places.
Therefore, if the error occurs between the selection for transmission and the
real start of frame transmission, the message is actually never sent.
Workaround
In case the transmission shall be guaranteed, it is not suitable to use the STT
mode. In this case, MOFCRn.STT shall be 0.
MultiCAN_TC.H004 Double remote request
Assume the following scenario: A first remote frame (dedicated to a message
object) has been received. It performs a transmit setup (TXRQ is set) with
clearing NEWDAT. MultiCAN starts to send the receiver message object (data
frame), but loses arbitration against a second remote request received by the
same message object as the first one (NEWDAT will be set).
When the appropriate message object (data frame) triggered by the first remote
frame wins the arbitration, it will be sent out and NEWDAT is not reset. This leads
to an additional data frame, that will be sent by this message object (clearing
NEWDAT).
There will, however, not be more data frames than there are corresponding
remote requests.
Errata Sheet
50
V1.2, 2013-07
XC27x8X Derivatives
XC2000 Family / Premium Line
Detailed Errata Description
C AN Bus
r e m o te
re q u e s t
r e m o te
re q u e s t
d a ta
d a ta
lo s s o f
a rb itra tio n
M u ltiC A N
s e tu p
d a ta
o b je c t
c le a r s e t
NEW DAT
by H W
c le a r
NEW DAT
by H W
Figure 7
s e tu p
d a ta
s e tu p
o b je c t
d a ta
o b je c t
c le a r
NEW DAT
by H W
Loss of Arbitration
OCDS_X.H003 Debug Interface Configuration by User Software
If the debug interface must be (re)configured, the sequence of actions to follow
is:
1.
2.
3.
4.
activate internal test-logic reset by installing SCU_DBGPRR.TRSTGT=0
disable debug interface by installing SCU_DBGPRR.DBGEN=0
install desired debug interface configuration in SCU_DBGPRR[11:0]
activate pull-devices (if internal will be used) by installing Px_IOCRy
accordingly
5. enable debug interface by installing SCU_DBGPRR.DBGEN=1
6. release internal test-logic reset by installing SCU_DBGPRR.TRSTGT=1
These steps must be performed as separate, sequential write operations.
PVC_X.H001 PVC Threshold Level 2
The Power Validation Circuits (PVCM, PVC1) compare the supply voltage of
the respective domain (DMP_M, DMP_1) with programmable levels (LEV1V
and LEV2V in register SCU_PVCMCON0 or SCU_PVC1CON0).
The default value of LEV1V is used to generate a reset request in the case of
low core voltage.
Errata Sheet
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V1.2, 2013-07
XC27x8X Derivatives
XC2000 Family / Premium Line
Detailed Errata Description
LEV2V can generate an interrupt request at a higher voltage, to be used as a
warning. Due to variations of the tolerance of both the Embedded Voltage
Regulators (EVR) and the PVC levels, this interrupt can be triggered
inadvertently, even though the core voltage is within the normal range. It is,
therefore, recommended not to use this warning level.
LEV2V can be disabled by executing the following sequence:
1. Disable the PVC level threshold 2 interrupt request
SCU_PVCMCON0.L2INTEN and SCU_ PVC1CON0.L2INTEN.
2. Disable the PVC interrupt request flag source SCU_INTDIS.PVCMI2 and
SCU_INTDIS.PVC1I2.
3. Clear the PVC interrupt request flag source SCU_DMPMITCLR.PVCMI2 and
SCU_ DMPMITCLR.PVC1I2.
4. Clear the PVC interrupt request flag by writing to SCU_INTCLR.PVCMI2
and SCU_INTCLR.PVC1I2.
5. Clear the selected SCU request flag (default is SCU_1IC.IR).
RESET_X.H003 How to Trigger a PORST after an Internal Failure
There is no internal User Reset that restores the complete device including the
power system like a Power-On Reset. In some applications it is possible to
connect ESR1 or ESR2 with the PORST pin and set the used ESR pin as Reset
output. With this a WDT or Software Reset can trigger a Power-On Reset.
A detailed description is in the Application Note AP16103.
RTC_X.H003 Changing the RTC Configuration
The count input clock fRTC for the Real Time Clock module (RTC) can be
selected via bit field RTCCLKSEL in register RTCCLKCON. Whenever the
system clock is less than 4 times faster than the RTC count input clock (fSYS <
fRTC × 4), Asynchronous Mode must be selected (bit RTCCM = 1B in register
RTCCLKCON).
To assure data consistency in the count registers T14, RTCL, RTCH, the RTC
module must be temporarily switched off by setting bit MODEN = 0B in register
RTC_KSCCFG before register RTCCLKCON is modified, i.e. whenever
Errata Sheet
52
V1.2, 2013-07
XC27x8X Derivatives
XC2000 Family / Premium Line
Detailed Errata Description
•
•
changing the operating mode (Synchronous/Asynchronous) Mode in bit
RTCCM, or
changing the RTC count source in bit field RTCCLKSEL.
SCU_X.H009 WUCR.TTSTAT can be set after a Power-Up
After power-up the wake-up clock fWU is selected for the Wake-Up Timer (WUT).
In this case, the trim interrupt trigger cannot be used, because the WUT trim
trigger status bit (WUCR.TTSTAT) might become set erroneously. This happens
sporadically and is, therefore, difficult to find in the development phase of an
application. If the trim interrupt trigger is enabled this may lead to unintended
SCU interrupts that may also block other interrupt sources (see INT_X.H004).
This can be avoided by executing the following sequence:
1. Disable the trim interrupt source SCU_INTDIS.WUTI
2. Clear the trim interrupt request flag by writing to INTCLR.WUTI
3. Clear the selected SCU request flag (default is SCU_1IC.IR)
SWD_X.H001 Application Influence on the SWD
The internal Supply Watchdog (SWD) monitors the external supply voltage of
the pad I/O domain VDDPB which is connected to the device. Therefore,
adjustable threshold levels are defined over the complete supply voltage range.
These limits are also influenced by system environment and may deviate due
to external influences slightly from the values given in the Datasheet.
Independent of the SWD is the internal start up and operation protected by the
PVC, which monitor the core voltage.
USIC_AI.H001 FIFO RAM Parity Error Handling
A false RAM parity error may be signalled by the USIC module, which may
optionally lead to a trap request (if enabled) for the USIC RAM, under the
following conditions:
•
a receive FIFO buffer is configured for the USIC module, and
Errata Sheet
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XC2000 Family / Premium Line
Detailed Errata Description
•
•
after the last power-up, less data elements than configured in bit field SIZE
have been received in the FIFO buffer, and
the last data element is read from the receiver buffer output register OUTRL
(i.e. the buffer is empty after this read access).
Once the number of received data elements is greater than or equal to the
receive buffer size configured in bit field SIZE, the effect described above can
no longer occur.
To avoid false parity errors, it is recommended to initialize the USIC RAM before
using the receive buffer FIFO. This can be achieved by configuring a 64-entry
transmit FIFO and writing 64 times the value 0x0 to the FIFO input register
IN00 to fill the whole FIFO RAM with 0x0.
USIC_AI.H002 Configuration of USIC Port Pins
Setting up alternate output functions of USIC port pins through Pn.IOCRy
registers before enabling the USIC protocol (CCR.MODE = 0001B, 0010B,
0011B or 0100B) might lead to unintended spikes on these port pins. To avoid
the unintended spikes, either of the following two sequences can be used to
enable the protocol:
•
•
Sequence 1:
– Write the initial output value to the port pin through Pn_OMR
– Enable the output driver for the general purpose output through
Pn_IOCRx
– Enable USIC protocol through CCR.MODE
– Select the USIC alternate output function through Pn_IOCRx
Sequence 2:
– Enable USIC protocol through CCR.MODE
– Enable the output driver for the USIC alternate output function through
Pn_IOCRx
Similarly, after the protocol is established, switching off the USIC channel by
reseting CCR.MODE directly might cause undesired transitions on the output
pin. The following sequence is recommended:
•
•
Write the passive output value to the port pin through Pn_OMR
Enable the output driver for the general purpose output through Pn_IOCRx
Errata Sheet
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V1.2, 2013-07
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XC2000 Family / Premium Line
Detailed Errata Description
•
Disable USIC protocol through CCR.MODE
USIC_AI.H003 PSR.RXIDLE Cleared by Software
If PSR.RXIDLE is cleared by software, the USIC is not able to receive until the
receive line is detected IDLE again (see User’s Manual chapter Idle Time).
For UART based busses with higher traffic e.g. LIN it is possible that sometimes
the next frame starts sending before PSR.RXIDLE is set 1B by hardware again.
This generates an error.
A solution is, that the PSR.RXIDLE bit is not cleared in software.
Errata Sheet
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XC2000 Family / Premium Line
Detailed Errata Description
6.4
Documentation Updates
EBC_X.D001 Visibility of Internal LXBus Cycles on External Address Bus
EBC chapter “Access Control to LXBus Modules” receives the following
correction:
In the first paragraph the term “read mode” is replaced by “tri-state mode”.
The following is added:
Despite the above mentioned measures, accesses to internal LXBus modules
are to some extent reflected on the non-multiplexed address pins A[23:0] of the
external bus.
1. During an internal LXBus access, the external address bus is tri-stated. The
switch to tri-state mode occurs in the same cycle as the internal LXBus
access. This may induce residual voltage which can lead to undefined logic
levels on the address bus pins. Those in turn can cause unwanted switching
activity on attached device input stages. Therefore attached devices should
be equipped with an input hysteresis filter to avoid unwanted switching
activity.
2. After an internal LXBus access is completed the address of the location
accessed last on the LXBus becomes visible on the external address bus,
unless an external bus cycle immediately follows the LXBus cycle. Due to
this behavior, switching activity on the address bus can be observed even if
no external access is active.
Note: A functional impact due to this behavior is not expected because the
external bus chip select signals
(CSx)
are held inactive and
control signals (ALE/BHE/RD/WR) are switched off (tri-state)
during the internal LXBus access.
Errata Sheet
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V1.2, 2013-07
w w w . i n f i n e o n . c o m
02664AERRA
Published by Infineon Technologies AG