XE162xM Data Sheet

16-Bit
Architecture
XE162FM, XE162HM
16-Bit Single-Chip
Real Time Signal Controller
XE166 Family / Base Line
Data Sheet
V2.1 2011-07
Microcontrollers
Edition 2011-07
Published by
Infineon Technologies AG
81726 Munich, Germany
© 2011 Infineon Technologies AG
All Rights Reserved.
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The information given in this document shall in no event be regarded as a guarantee of conditions or
characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any
information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties
and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights
of any third party.
Information
For further information on technology, delivery terms and conditions and prices, please contact the nearest
Infineon Technologies Office (www.infineon.com).
Warnings
Due to technical requirements, components may contain dangerous substances. For information on the types in
question, please contact the nearest Infineon Technologies Office.
Infineon Technologies components may be used in life-support devices or systems only with the express written
approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure
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be endangered.
16-Bit
Architecture
XE162FM, XE162HM
16-Bit Single-Chip
Real Time Signal Controller
XE166 Family / Base Line
Data Sheet
V2.1 2011-07
Microcontrollers
XE162FM, XE162HM
XE166 Family / Base Line
XE162xM
Revision History: V2.1, 2011-07
Previous Version(s):
V2.0, 2009-03
V1.3, 2008-09
V1.2, 2008-09
V1.1, 2008-06 Preliminary
V1.0, 2008-06 (Intermediate version)
Page
Subjects (major changes since last revisions)
27
ID registers added
73
ADC capacitances corrected (typ. vs. max.)
77
Conditions relaxed for ΔfINT
Range for fWU adapted according to PCN 2010-013-A
Added startup time from power-on tSPO
127
Quality declarations added
Trademarks
C166™, TriCore™, and DAVE™ are trademarks of Infineon Technologies AG.
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Is there any information in this document that you feel is wrong, unclear or missing?
Your feedback will help us to continuously improve the quality of this document.
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Data Sheet
V2.1, 2011-07
XE162FM, XE162HM
XE166 Family / Base Line
Table of Contents
Table of Contents
1
1.1
1.2
Summary of Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Basic Device Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Definition of Feature Variants . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
2
2.1
2.2
General Device Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Pin Configuration and Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Identification Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
3
3.1
3.2
3.3
3.4
3.5
3.6
3.7
3.8
3.9
3.10
3.11
3.12
3.13
3.14
3.15
3.16
3.17
3.18
Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Memory Subsystem and Organization . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Central Processing Unit (CPU) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Memory Protection Unit (MPU) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Memory Checker Module (MCHK) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Interrupt System . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
On-Chip Debug Support (OCDS) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Capture/Compare Unit (CAPCOM2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Capture/Compare Units CCU6x . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
General Purpose Timer (GPT12E) Unit . . . . . . . . . . . . . . . . . . . . . . . . . . .
Real Time Clock . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
A/D Converters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Universal Serial Interface Channel Modules (USIC) . . . . . . . . . . . . . . . . .
MultiCAN Module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
System Timer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Watchdog Timer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Clock Generation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Parallel Ports . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Instruction Set Summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
28
29
32
34
34
35
36
37
40
42
46
48
49
51
52
53
53
54
55
4
4.1
4.1.1
4.1.2
4.1.3
4.1.4
4.2
4.2.1
4.2.2
4.2.3
4.3
4.4
4.5
4.6
Electrical Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
General Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Absolut Maximum Rating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . .
Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Pad Timing Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Parameter Interpretation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
DC Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
DC Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
DC Parameters for Lower Voltage Area . . . . . . . . . . . . . . . . . . . . . . . .
Power Consumption . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Analog/Digital Converter Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . .
System Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Flash Memory Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
AC Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
58
58
58
59
61
61
62
64
66
68
73
77
80
82
Data Sheet
5
V2.1, 2011-07
XE162FM, XE162HM
XE166 Family / Base Line
Table of Contents
4.6.1
4.6.2
4.6.2.1
4.6.2.2
4.6.2.3
4.6.3
4.6.4
4.6.5
4.6.6
5
5.1
5.2
5.3
Data Sheet
Testing Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Definition of Internal Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Phase Locked Loop (PLL) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Wakeup Clock . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Selecting and Changing the Operating Frequency . . . . . . . . . . . . . .
External Clock Input Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Pad Properties . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Synchronous Serial Interface Timing . . . . . . . . . . . . . . . . . . . . . . . . . . .
Debug Interface Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Package and Reliability . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Packaging . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Thermal Considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Quality Declarations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
6
82
83
84
87
87
88
90
93
97
103
103
105
106
V2.1, 2011-07
XE162FM, XE162HM
XE166 Family / Base Line
Summary of Features
16-Bit Single-Chip
Real Time Signal Controller
XE162xM (XE166 Family)
1
Summary of Features
For a quick overview and easy reference, the features of the XE162xM are summarized
here.
•
•
•
•
•
•
•
High-performance CPU with five-stage pipeline and MPU
– 12.5 ns instruction cycle at 80 MHz CPU clock (single-cycle execution)
– One-cycle 32-bit addition and subtraction with 40-bit result
– One-cycle multiplication (16 × 16 bit)
– Background division (32 / 16 bit) in 21 cycles
– One-cycle multiply-and-accumulate (MAC) instructions
– Enhanced Boolean bit manipulation facilities
– Zero-cycle jump execution
– Additional instructions to support HLL and operating systems
– Register-based design with multiple variable register banks
– Fast context switching support with two additional local register banks
– 16 Mbytes total linear address space for code and data
– 1024 Bytes on-chip special function register area (C166 Family compatible)
– Integrated Memory Protection Unit (MPU)
Interrupt system with 16 priority levels for up to 96 sources
– Selectable external inputs for interrupt generation and wake-up
– Fastest sample-rate 12.5 ns
Eight-channel interrupt-driven single-cycle data transfer with
Peripheral Event Controller (PEC), 24-bit pointers cover total address space
Clock generation from internal or external clock sources,
using on-chip PLL or prescaler
Hardware CRC-Checker with Programmable Polynomial to Supervise On-Chip
Memory Areas
On-chip memory modules
– 8 Kbytes on-chip stand-by RAM (SBRAM)
– 2 Kbytes on-chip dual-port RAM (DPRAM)
– Up to 16 Kbytes on-chip data SRAM (DSRAM)
– Up to 32 Kbytes on-chip program/data SRAM (PSRAM)
– Up to 576 Kbytes on-chip program memory (Flash memory)
– Memory content protection through Error Correction Code (ECC)
On-Chip Peripheral Modules
– Multi-functional general purpose timer unit with 5 timers
– 16-channel general purpose capture/compare unit (CAPCOM2)
Data Sheet
7
V2.1, 2011-07
XE162FM, XE162HM
XE166 Family / Base Line
Summary of Features
•
•
•
•
•
•
•
– Capture/compare unit for flexible PWM signal generation (CCU60)
– Two Synchronizable A/D Converters with a total of up to 9 channels, 10-bit
resolution, conversion time below 1 μs, optional data preprocessing (data
reduction, range check), broken wire detection
– Up to 6 serial interface channels to be used as UART, LIN, high-speed
synchronous channel (SPI), IIC bus interface (10-bit addressing, 400 kbit/s), IIS
interface
– On-chip MultiCAN interface (Rev. 2.0B active) with up to 64 message objects
(Full CAN/Basic CAN) on up to 2 CAN nodes and gateway functionality
– On-chip system timer and on-chip real time clock
Single power supply from 3.0 V to 5.5 V
Programmable watchdog timer and oscillator watchdog
Up to 40 general purpose I/O lines
On-chip bootstrap loaders
Supported by a full range of development tools including C compilers, macroassembler packages, emulators, evaluation boards, HLL debuggers, simulators,
logic analyzer disassemblers, programming boards
On-chip debug support via Device Access Port (DAP) or JTAG interface
64-pin Green LQFP package, 0.5 mm (19.7 mil) pitch
Data Sheet
8
V2.1, 2011-07
XE162FM, XE162HM
XE166 Family / Base Line
Summary of Features
Ordering Information
The ordering code for an Infineon microcontroller provides an exact reference to a
specific product. This ordering code identifies:
•
•
•
the function set of the corresponding product type
the temperature range:
– SAF-…: -40°C to 85°C
the package and the type of delivery.
For ordering codes for the XE162xM please contact your sales representative or local
distributor.
This document describes several derivatives of the XE162xM group:
Table 1 lists these derivatives and summarizes the differences.
As this document refers to all of these derivatives, some descriptions may not apply to a
specific product, in particular to the special device types.
For simplicity the term XE162xM is used for all derivatives throughout this document.
XE162xM device types are available and can be ordered through Infineon’s direct and/or
distribution channels.
Data Sheet
9
V2.1, 2011-07
XE162FM, XE162HM
XE166 Family / Base Line
Summary of Features
1.1
Basic Device Types
Basic device types are available and can be ordered through Infineon’s direct and/or
distribution channels.
Table 1
Synopsis of XE162xM Basic Device Types
1)
PSRAM
DSRAM3)
Capt./Comp. ADC4) Interfaces4)
Modules
Chan.
Derivative
Flash
Memory2)
XE162FM72FxxL
576 Kbytes 32 Kbytes
16 Kbytes
CC2
CCU60
7+2
2 CAN Nodes,
6 Serial Chan.
XE162FM48FxxL
384 Kbytes 16 Kbytes
16 Kbytes
CC2
CCU60
7+2
2 CAN Nodes,
6 Serial Chan.
XE162FM24FxxL
192 Kbytes 10 Kbytes
16 Kbytes
CC2
CCU60
7+2
2 CAN Nodes,
6 Serial Chan.
XE162HM72FxxL
576 Kbytes 32 Kbytes
16 Kbytes
CC2
CCU60
7+2
No CAN Node,
6 Serial Chan.
XE162HM48FxxL
384 Kbytes 16 Kbytes
16 Kbytes
CC2
CCU60
7+2
No CAN Node,
6 Serial Chan.
XE162HM24FxxL
192 Kbytes 10 Kbytes
16 Kbytes
CC2
CCU60
7+2
No CAN Node,
6 Serial Chan.
1) xx is a placeholder for the available speed grade (in MHz).
2) Specific information about the on-chip Flash memory in Table 2.
3) All derivatives additionally provide 8 Kbytes SBRAM and 2 Kbytes DPRAM.
4) Specific information about the available channels in Table 4.
Analog input channels are listed for each Analog/Digital Converter module separately (ADC0 + ADC1).
Data Sheet
10
V2.1, 2011-07
XE162FM, XE162HM
XE166 Family / Base Line
Summary of Features
1.2
Definition of Feature Variants
The XE162xM types are offered with several Flash memory sizes. Table 2 describes the
location of the available memory areas for each Flash memory size.
Table 2
Flash Memory Allocation
Total Flash Size
Flash Area A1)
Flash Area B
Flash Area C
576 Kbytes
C0’0000H …
C0’EFFFH
C1’0000H …
C7’FFFFH
CC’0000H …
CC’FFFFH
384 Kbytes
C0’0000H …
C0’EFFFH
C1’0000H …
C4’FFFFH
CC’0000H …
CC’FFFFH
192 Kbytes
C0’0000H …
C0’EFFFH
C1’0000H …
C1’FFFFH
CC’0000H …
CC’FFFFH
1) The uppermost 4-Kbyte sector of the first Flash segment is reserved for internal use (C0’F000H to C0’FFFFH).
Table 3
Flash Memory Module Allocation (in Kbytes)
Total Flash Size
Flash 01)
Flash 1
Flash 2
Flash 3
576 Kbytes
256
256
---
64
384 Kbytes
256
64
---
64
192 Kbytes
128
---
---
64
1) The uppermost 4-Kbyte sector of the first Flash segment is reserved for internal use (C0’F000H to C0’FFFFH).
The XE162xM types are offered with different interface options. Table 4 lists the
available channels for each option.
Table 4
Interface Channel Association
Total Number
Available Channels
7 ADC0 channels
CH0, CH2, CH4, CH8, CH10, CH13, CH15
2 ADC1 channels
CH0, CH4
2 CAN nodes
CAN0, CAN1
64 message objects
6 serial channels
U0C0, U0C1, U1C0, U1C1, U2C0, U2C1
Data Sheet
11
V2.1, 2011-07
XE162FM, XE162HM
XE166 Family / Base Line
Summary of Features
The XE162xM types are offered with several SRAM memory sizes. Figure 1 shows the
allocation rules for PSRAM and DSRAM. Note that the rules differ:
•
•
PSRAM allocation starts from the lower address
DSRAM allocation starts from the higher address
For example 8 Kbytes of PSRAM will be allocated at E0’0000h-E0’1FFFh and 8 Kbytes
of DSRAM will be at 00’C000h-00’DFFFh.
E7'FFFFh
(EF'FFFFh)
00'DFFFh
Reserved for
PSRAM
Available
DSRAM
Available
PSRAM
Reserved for
DSRAM
E0'0000h
(E8'0000h)
00'8000h
MC_XC_SRAM_ALLOCATION
Figure 1
Data Sheet
SRAM Allocation
12
V2.1, 2011-07
XE162FM, XE162HM
XE166 Family / Base Line
General Device Information
2
General Device Information
The XE162xM series (16-Bit Single-Chip
Real Time Signal Controller) is a part of the Infineon XE166 Family of full-feature singlechip CMOS microcontrollers. These devices extend the functionality and performance of
the C166 Family in terms of instructions (MAC unit), peripherals, and speed. They
combine high CPU performance (up to 80 million instructions per second) with extended
peripheral functionality and enhanced IO capabilities. Optimized peripherals can be
adapted flexibly to meet the application requirements. These derivatives utilize clock
generation via PLL and internal or external clock sources. On-chip memory modules
include program Flash, program RAM, and data RAM.
VAREFVAGND VDDIM VDDI1 VDDP VSS
(1)
(1)
(1)
(3)
(9)
(4)
XTAL1
XTAL2
ESR0
Port 2
11 bit
Port 10
16 bit
Port 6
2 bit
Port 15
2 bit
Port 7
1 bit
Port 5
7 bit
PORST
TRST DAP/JTAG Debug
2 / 4 bit
2 bit
via Port Pins
TESTM
MC_XY _LOGSYMB 64
Figure 2
Data Sheet
XE162xM Logic Symbol
13
V2.1, 2011-07
XE162FM, XE162HM
XE166 Family / Base Line
General Device Information
2.1
Pin Configuration and Definition
64
63
62
61
60
59
58
57
56
55
54
53
52
51
50
49
VDDPB
ESR0
PORST
XTAL1
XTAL2
P10.15
P10.14
VDDI1
P10.13
P10.12
P10.11
P10.10
P10.9
P10.8
VDDPB
VS S
The pins of the XE162xM are described in detail in Table 5, which includes all alternate
functions. For further explanations please refer to the footnotes at the end of the table.
The following figure summarizes all pins, showing their locations on the four sides of the
package.
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
LQFP64
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
VDDPB
P10.7
P10.6
P10.5
P10.4
P10.3
P2.10
VDDI1
P10.2
P10.1
P10.0
P2.9
P2.8
P2.7
VDDPB
VSS
VSS
VDDPB
P5.4
P5.8
P5.10
P5.13
P5.15
VDDI 1
P2.0
P2.1
P2.2
P2.3
P2.4
P2.5
P2.6
V DDPB
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
VSS
VDDPB
TESTM
TRST
P7.0
V DDIM
P6.0
P6.1
VDDPA
P15.0
P15.4
VAREF
VAGND
P5.0
P5.2
VDDPB
MC_XY_PIN64
Figure 3
Data Sheet
XE162xM Pin Configuration (top view)
14
V2.1, 2011-07
XE162FM, XE162HM
XE166 Family / Base Line
General Device Information
Key to Pin Definitions
•
•
Ctrl.: The output signal for a port pin is selected by bit field PC in the associated
register Px_IOCRy. Output O0 is selected by setting the respective bit field PC to
1x00B, output O1 is selected by 1x01B, etc.
Output signal OH is controlled by hardware.
Type: Indicates the pad type and its power supply domain (A, B, M, 1).
– St: Standard pad
– Sp: Special pad e.g. XTALx
– DP: Double pad - can be used as standard or high speed pad
– In: Input only pad
– PS: Power supply pad
Table 5
Pin Definitions and Functions
Pin
Symbol
Ctrl.
Type Function
3
TESTM
I
In/B
Testmode Enable
Enables factory test modes, must be held HIGH for
normal operation (connect to VDDPB).
An internal pull-up device will hold this pin high
when nothing is driving it.
4
TRST
I
In/B
Test-System Reset Input
For normal system operation, pin TRST should be
held low. A high level at this pin at the rising edge
of PORST activates the XE162xM’s debug
system. In this case, pin TRST must be driven low
once to reset the debug system.
An internal pull-down device will hold this pin low
when nothing is driving it.
5
P7.0
O0 / I St/B
Bit 0 of Port 7, General Purpose Input/Output
T3OUT
O1
St/B
GPT12E Timer T3 Toggle Latch Output
T6OUT
O2
St/B
GPT12E Timer T6 Toggle Latch Output
TDO_A
OH /
IH
St/B
JTAG Test Data Output / DAP1 Input/Output
If DAP pos. 0 or 2 is selected during start-up, an
internal pull-down device will hold this pin low
when nothing is driving it.
ESR2_1
I
St/B
ESR2 Trigger Input 1
Data Sheet
15
V2.1, 2011-07
XE162FM, XE162HM
XE166 Family / Base Line
General Device Information
Table 5
Pin Definitions and Functions (cont’d)
Pin
Symbol
Ctrl.
7
P6.0
O0 / I DA/A Bit 0 of Port 6, General Purpose Input/Output
8
Type Function
EMUX0
O1
DA/A External Analog MUX Control Output 0 (ADC0)
BRKOUT
O3
DA/A OCDS Break Signal Output
ADCx_REQG I
TyG
DA/A External Request Gate Input for ADC0/1
U1C1_DX0E
I
DA/A USIC1 Channel 1 Shift Data Input
P6.1
O0 / I DA/A Bit 1 of Port 6, General Purpose Input/Output
EMUX1
O1
DA/A External Analog MUX Control Output 1 (ADC0)
T3OUT
O2
DA/A GPT12E Timer T3 Toggle Latch Output
U1C1_DOUT O3
DA/A USIC1 Channel 1 Shift Data Output
ADCx_REQT I
RyE
DA/A External Request Trigger Input for ADC0/1
ESR1_6
I
DA/A ESR1 Trigger Input 6
P15.0
I
In/A
Bit 0 of Port 15, General Purpose Input
ADC1_CH0
I
In/A
Analog Input Channel 0 for ADC1
P15.4
I
In/A
Bit 4 of Port 15, General Purpose Input
ADC1_CH4
I
In/A
Analog Input Channel 4 for ADC1
T6INA
I
In/A
GPT12E Timer T6 Count/Gate Input
VAREF
VAGND
-
PS/A Reference Voltage for A/D Converters ADC0/1
13
-
PS/A Reference Ground for A/D Converters ADC0/1
14
P5.0
I
In/A
Bit 0 of Port 5, General Purpose Input
ADC0_CH0
I
In/A
Analog Input Channel 0 for ADC0
P5.2
I
In/A
Bit 2 of Port 5, General Purpose Input
ADC0_CH2
I
In/A
Analog Input Channel 2 for ADC0
TDI_A
I
In/A
JTAG Test Data Input
P5.4
I
In/A
Bit 4 of Port 5, General Purpose Input
10
11
12
15
19
ADC0_CH4
I
In/A
Analog Input Channel 4 for ADC0
T3EUDA
I
In/A
GPT12E Timer T3 External Up/Down Control
Input
TMS_A
I
In/A
JTAG Test Mode Selection Input
Data Sheet
16
V2.1, 2011-07
XE162FM, XE162HM
XE166 Family / Base Line
General Device Information
Table 5
Pin Definitions and Functions (cont’d)
Pin
Symbol
Ctrl.
Type Function
20
P5.8
I
In/A
Bit 8 of Port 5, General Purpose Input
ADC0_CH8
I
In/A
Analog Input Channel 8 for ADC0
ADC1_CH8
I
In/A
Analog Input Channel 8 for ADC1
CCU6x_T12H I
RC
In/A
External Run Control Input for T12 of CCU60/1
CCU6x_T13H I
RC
In/A
External Run Control Input for T13 of CCU60/1
21
22
23
25
26
27
U2C0_DX0F
I
In/A
USIC2 Channel 0 Shift Data Input
P5.10
I
In/A
Bit 10 of Port 5, General Purpose Input
ADC0_CH10
I
In/A
Analog Input Channel 10 for ADC0
ADC1_CH10
I
In/A
Analog Input Channel 10 for ADC1
BRKIN_A
I
In/A
OCDS Break Signal Input
U2C1_DX0F
I
In/A
USIC2 Channel 1 Shift Data Input
P5.13
I
In/A
Bit 13 of Port 5, General Purpose Input
ADC0_CH13
I
In/A
Analog Input Channel 13 for ADC0
P5.15
I
In/A
Bit 15 of Port 5, General Purpose Input
ADC0_CH15
I
In/A
Analog Input Channel 15 for ADC0
P2.0
O0 / I St/B
Bit 0 of Port 2, General Purpose Input/Output
RxDC0C
I
St/B
CAN Node 0 Receive Data Input
T5INB
I
St/B
GPT12E Timer T5 Count/Gate Input
P2.1
O0 / I St/B
Bit 1 of Port 2, General Purpose Input/Output
TxDC0
O1
St/B
CAN Node 0 Transmit Data Output
T5EUDB
I
St/B
GPT12E Timer T5 External Up/Down Control
Input
ESR1_5
I
St/B
ESR1 Trigger Input 5
P2.2
O0 / I St/B
Bit 2 of Port 2, General Purpose Input/Output
TxDC1
O1
St/B
CAN Node 1 Transmit Data Output
ESR2_5
I
St/B
ESR2 Trigger Input 5
Data Sheet
17
V2.1, 2011-07
XE162FM, XE162HM
XE166 Family / Base Line
General Device Information
Table 5
Pin Definitions and Functions (cont’d)
Pin
Symbol
Ctrl.
28
P2.3
O0 / I St/B
U0C0_DOUT O1
29
30
31
Type Function
St/B
Bit 3 of Port 2, General Purpose Input/Output
USIC0 Channel 0 Shift Data Output
CC2_CC16
O3 / I St/B
CAPCOM2 CC16IO Capture Inp./ Compare Out.
ESR2_0
I
St/B
ESR2 Trigger Input 0
U0C0_DX0E
I
St/B
USIC0 Channel 0 Shift Data Input
U0C1_DX0D
I
St/B
USIC0 Channel 1 Shift Data Input
RxDC0A
I
St/B
CAN Node 0 Receive Data Input
P2.4
O0 / I St/B
Bit 4 of Port 2, General Purpose Input/Output
U0C1_DOUT O1
St/B
USIC0 Channel 1 Shift Data Output
TxDC0
O2
St/B
CAN Node 0 Transmit Data Output
CC2_CC17
O3 / I St/B
CAPCOM2 CC17IO Capture Inp./ Compare Out.
ESR1_0
I
St/B
ESR1 Trigger Input 0
U0C0_DX0F
I
St/B
USIC0 Channel 0 Shift Data Input
RxDC1A
I
St/B
CAN Node 1 Receive Data Input
P2.5
O0 / I St/B
Bit 5 of Port 2, General Purpose Input/Output
U0C0_SCLK
OUT
O1
St/B
USIC0 Channel 0 Shift Clock Output
TxDC0
O2
St/B
CAN Node 0 Transmit Data Output
CC2_CC18
O3 / I St/B
CAPCOM2 CC18IO Capture Inp./ Compare Out.
U0C0_DX1D
I
St/B
USIC0 Channel 0 Shift Clock Input
ESR1_10
I
St/B
ESR1 Trigger Input 10
P2.6
O0 / I St/B
Bit 6 of Port 2, General Purpose Input/Output
U0C0_SELO
0
O1
St/B
USIC0 Channel 0 Select/Control 0 Output
U0C1_SELO
1
O2
St/B
USIC0 Channel 1 Select/Control 1 Output
CC2_CC19
O3 / I St/B
CAPCOM2 CC19IO Capture Inp./ Compare Out.
U0C0_DX2D
I
St/B
USIC0 Channel 0 Shift Control Input
RxDC0D
I
St/B
CAN Node 0 Receive Data Input
ESR2_6
I
St/B
ESR2 Trigger Input 6
Data Sheet
18
V2.1, 2011-07
XE162FM, XE162HM
XE166 Family / Base Line
General Device Information
Table 5
Pin Definitions and Functions (cont’d)
Pin
Symbol
Ctrl.
35
P2.7
O0 / I St/B
Bit 7 of Port 2, General Purpose Input/Output
U0C1_SELO
0
O1
St/B
USIC0 Channel 1 Select/Control 0 Output
U0C0_SELO
1
O2
St/B
USIC0 Channel 0 Select/Control 1 Output
CC2_CC20
O3 / I St/B
CAPCOM2 CC20IO Capture Inp./ Compare Out.
U0C1_DX2C
I
St/B
USIC0 Channel 1 Shift Control Input
36
37
Type Function
RxDC1C
I
St/B
CAN Node 1 Receive Data Input
ESR2_7
I
St/B
ESR2 Trigger Input 7
P2.8
O0 / I DP/B Bit 8 of Port 2, General Purpose Input/Output
U0C1_SCLK
OUT
O1
DP/B USIC0 Channel 1 Shift Clock Output
EXTCLK
O2
DP/B Programmable Clock Signal Output
CC2_CC21
O3 / I DP/B CAPCOM2 CC21IO Capture Inp./ Compare Out.
U0C1_DX1D
I
P2.9
O0 / I St/B
DP/B USIC0 Channel 1 Shift Clock Input
Bit 9 of Port 2, General Purpose Input/Output
U0C1_DOUT O1
St/B
USIC0 Channel 1 Shift Data Output
TxDC1
O2
St/B
CAN Node 1 Transmit Data Output
CC2_CC22
O3 / I St/B
CAPCOM2 CC22IO Capture Inp./ Compare Out.
CLKIN1
I
St/B
Clock Signal Input 1
TCK_A
IH
St/B
DAP0/JTAG Clock Input
If JTAG pos. A is selected during start-up, an
internal pull-up device will hold this pin high when
nothing is driving it.
If DAP pos. 0 is selected during start-up, an
internal pull-down device will hold this pin low
when nothing is driving it.
Data Sheet
19
V2.1, 2011-07
XE162FM, XE162HM
XE166 Family / Base Line
General Device Information
Table 5
Pin Definitions and Functions (cont’d)
Pin
Symbol
Ctrl.
38
P10.0
O0 / I St/B
39
40
42
Type Function
Bit 0 of Port 10, General Purpose Input/Output
U0C1_DOUT O1
St/B
USIC0 Channel 1 Shift Data Output
CCU60_CC6
0
O2
St/B
CCU60 Channel 0 Output
CCU60_CC6
0INA
I
St/B
CCU60 Channel 0 Input
ESR1_2
I
St/B
ESR1 Trigger Input 2
U0C0_DX0A
I
St/B
USIC0 Channel 0 Shift Data Input
U0C1_DX0A
I
St/B
USIC0 Channel 1 Shift Data Input
P10.1
O0 / I St/B
Bit 1 of Port 10, General Purpose Input/Output
U0C0_DOUT O1
St/B
USIC0 Channel 0 Shift Data Output
CCU60_CC6
1
O2
St/B
CCU60 Channel 1 Output
CCU60_CC6
1INA
I
St/B
CCU60 Channel 1 Input
U0C0_DX1A
I
St/B
USIC0 Channel 0 Shift Clock Input
U0C0_DX0B
I
St/B
USIC0 Channel 0 Shift Data Input
P10.2
O0 / I St/B
Bit 2 of Port 10, General Purpose Input/Output
U0C0_SCLK
OUT
O1
St/B
USIC0 Channel 0 Shift Clock Output
CCU60_CC6
2
O2
St/B
CCU60 Channel 2 Output
CCU60_CC6
2INA
I
St/B
CCU60 Channel 2 Input
U0C0_DX1B
I
St/B
USIC0 Channel 0 Shift Clock Input
P2.10
O0 / I St/B
Bit 10 of Port 2, General Purpose Input/Output
U0C1_DOUT O1
St/B
USIC0 Channel 1 Shift Data Output
U0C0_SELO
3
O2
St/B
USIC0 Channel 0 Select/Control 3 Output
CC2_CC23
O3 / I St/B
CAPCOM2 CC23IO Capture Inp./ Compare Out.
U0C1_DX0E
I
St/B
USIC0 Channel 1 Shift Data Input
CAPINA
I
St/B
GPT12E Register CAPREL Capture Input
Data Sheet
20
V2.1, 2011-07
XE162FM, XE162HM
XE166 Family / Base Line
General Device Information
Table 5
Pin Definitions and Functions (cont’d)
Pin
Symbol
Ctrl.
43
P10.3
O0 / I St/B
44
45
46
Type Function
Bit 3 of Port 10, General Purpose Input/Output
CCU60_COU O2
T60
St/B
CCU60 Channel 0 Output
U0C0_DX2A
I
St/B
USIC0 Channel 0 Shift Control Input
U0C1_DX2A
I
St/B
USIC0 Channel 1 Shift Control Input
P10.4
O0 / I St/B
Bit 4 of Port 10, General Purpose Input/Output
U0C0_SELO
3
O1
St/B
USIC0 Channel 0 Select/Control 3 Output
CCU60_COU O2
T61
St/B
CCU60 Channel 1 Output
U0C0_DX2B
I
St/B
USIC0 Channel 0 Shift Control Input
U0C1_DX2B
I
St/B
USIC0 Channel 1 Shift Control Input
ESR1_9
I
St/B
ESR1 Trigger Input 9
P10.5
O0 / I St/B
Bit 5 of Port 10, General Purpose Input/Output
U0C1_SCLK
OUT
O1
St/B
USIC0 Channel 1 Shift Clock Output
CCU60_COU O2
T62
St/B
CCU60 Channel 2 Output
U2C0_DOUT O3
St/B
USIC2 Channel 0 Shift Data Output
U0C1_DX1B
I
St/B
USIC0 Channel 1 Shift Clock Input
P10.6
O0 / I St/B
Bit 6 of Port 10, General Purpose Input/Output
U0C0_DOUT O1
St/B
USIC0 Channel 0 Shift Data Output
U1C0_SELO
0
O3
St/B
USIC1 Channel 0 Select/Control 0 Output
U0C0_DX0C
I
St/B
USIC0 Channel 0 Shift Data Input
U1C0_DX2D
I
St/B
USIC1 Channel 0 Shift Control Input
CCU60_CTR
APA
I
St/B
CCU60 Emergency Trap Input
Data Sheet
21
V2.1, 2011-07
XE162FM, XE162HM
XE166 Family / Base Line
General Device Information
Table 5
Pin Definitions and Functions (cont’d)
Pin
Symbol
Ctrl.
47
P10.7
O0 / I St/B
Bit 7 of Port 10, General Purpose Input/Output
U0C1_DOUT O1
St/B
USIC0 Channel 1 Shift Data Output
CCU60_COU O2
T63
St/B
CCU60 Channel 3 Output
U0C1_DX0B
51
Type Function
I
St/B
USIC0 Channel 1 Shift Data Input
CCU60_CCP I
OS0A
St/B
CCU60 Position Input 0
T4INB
I
St/B
GPT12E Timer T4 Count/Gate Input
P10.8
O0 / I St/B
Bit 8 of Port 10, General Purpose Input/Output
U0C0_MCLK
OUT
O1
St/B
USIC0 Channel 0 Master Clock Output
U0C1_SELO
0
O2
St/B
USIC0 Channel 1 Select/Control 0 Output
U2C1_DOUT O3
St/B
USIC2 Channel 1 Shift Data Output
CCU60_CCP I
OS1A
St/B
CCU60 Position Input 1
U0C0_DX1C
I
St/B
USIC0 Channel 0 Shift Clock Input
BRKIN_B
I
St/B
OCDS Break Signal Input
T3EUDB
I
St/B
GPT12E Timer T3 External Up/Down Control
Input
Data Sheet
22
V2.1, 2011-07
XE162FM, XE162HM
XE166 Family / Base Line
General Device Information
Table 5
Pin Definitions and Functions (cont’d)
Pin
Symbol
Ctrl.
52
P10.9
O0 / I St/B
Bit 9 of Port 10, General Purpose Input/Output
U0C0_SELO
4
O1
St/B
USIC0 Channel 0 Select/Control 4 Output
U0C1_MCLK
OUT
O2
St/B
USIC0 Channel 1 Master Clock Output
CCU60_CCP I
OS2A
St/B
CCU60 Position Input 2
TCK_B
IH
St/B
DAP0/JTAG Clock Input
If JTAG pos. B is selected during start-up, an
internal pull-up device will hold this pin high when
nothing is driving it.
If DAP pos. 1 is selected during start-up, an
internal pull-down device will hold this pin low
when nothing is driving it.
T3INB
I
St/B
GPT12E Timer T3 Count/Gate Input
P10.10
O0 / I St/B
Bit 10 of Port 10, General Purpose Input/Output
U0C0_SELO
0
O1
St/B
USIC0 Channel 0 Select/Control 0 Output
CCU60_COU O2
T63
St/B
CCU60 Channel 3 Output
U0C0_DX2C
St/B
USIC0 Channel 0 Shift Control Input
53
54
I
Type Function
U0C1_DX1A
I
St/B
USIC0 Channel 1 Shift Clock Input
TDI_B
IH
St/B
JTAG Test Data Input
If JTAG pos. B is selected during start-up, an
internal pull-up device will hold this pin high when
nothing is driving it.
P10.11
O0 / I St/B
Bit 11 of Port 10, General Purpose Input/Output
U1C0_SCLK
OUT
O1
St/B
USIC1 Channel 0 Shift Clock Output
BRKOUT
O2
St/B
OCDS Break Signal Output
U1C0_DX1D
I
St/B
USIC1 Channel 0 Shift Clock Input
TMS_B
IH
St/B
JTAG Test Mode Selection Input
If JTAG pos. B is selected during start-up, an
internal pull-up device will hold this pin high when
nothing is driving it.
Data Sheet
23
V2.1, 2011-07
XE162FM, XE162HM
XE166 Family / Base Line
General Device Information
Table 5
Pin Definitions and Functions (cont’d)
Pin
Symbol
Ctrl.
55
P10.12
O0 / I St/B
56
Type Function
Bit 12 of Port 10, General Purpose Input/Output
U1C0_DOUT O1
St/B
USIC1 Channel 0 Shift Data Output
TDO_B
OH /
IH
St/B
JTAG Test Data Output / DAP1 Input/Output
If DAP pos. 1 is selected during start-up, an
internal pull-down device will hold this pin low
when nothing is driving it.
U1C0_DX0C
I
St/B
USIC1 Channel 0 Shift Data Input
U1C0_DX1E
I
St/B
USIC1 Channel 0 Shift Clock Input
P10.13
O0 / I St/B
Bit 13 of Port 10, General Purpose Input/Output
U1C0_DOUT O1
St/B
USIC1 Channel 0 Shift Data Output
U1C0_SELO
3
O3
St/B
USIC1 Channel 0 Select/Control 3 Output
U1C0_DX0D
I
St/B
USIC1 Channel 0 Shift Data Input
P10.14
O0 / I St/B
Bit 14 of Port 10, General Purpose Input/Output
U1C0_SELO
1
O1
St/B
USIC1 Channel 0 Select/Control 1 Output
U0C1_DOUT O2
St/B
USIC0 Channel 1 Shift Data Output
ESR2_2
I
St/B
ESR2 Trigger Input 2
U0C1_DX0C
I
St/B
USIC0 Channel 1 Shift Data Input
P10.15
O0 / I St/B
Bit 15 of Port 10, General Purpose Input/Output
U1C0_SELO
2
O1
St/B
USIC1 Channel 0 Select/Control 2 Output
U0C1_DOUT O2
St/B
USIC0 Channel 1 Shift Data Output
U1C0_DOUT O3
St/B
USIC1 Channel 0 Shift Data Output
U0C1_DX1C
I
St/B
USIC0 Channel 1 Shift Clock Input
60
XTAL2
O
Sp/M Crystal Oscillator Amplifier Output
61
XTAL1
I
Sp/M Crystal Oscillator Amplifier Input
To clock the device from an external source, drive
XTAL1, while leaving XTAL2 unconnected.
Voltages on XTAL1 must comply to the core
supply voltage VDDIM.
ESR2_9
I
St/B
58
59
Data Sheet
ESR2 Trigger Input 9
24
V2.1, 2011-07
XE162FM, XE162HM
XE166 Family / Base Line
General Device Information
Table 5
Pin Definitions and Functions (cont’d)
Pin
Symbol
Ctrl.
Type Function
62
PORST
I
In/B
63
ESR0
O0 / I St/B
External Service Request 0
After power-up, ESR0 operates as open-drain
bidirectional reset with a weak pull-up.
U1C0_DX0E
I
St/B
USIC1 Channel 0 Shift Data Input
USIC1 Channel 0 Shift Control Input
Power On Reset Input
A low level at this pin resets the XE162xM
completely. A spike filter suppresses input pulses
<10 ns. Input pulses >100 ns safely pass the filter.
The minimum duration for a safe recognition
should be 120 ns.
An internal pull-up device will hold this pin high
when nothing is driving it.
U1C0_DX2B
I
St/B
6
VDDIM
-
PS/M Digital Core Supply Voltage for Domain M
Decouple with a ceramic capacitor, see Data
Sheet for details.
24,
41,
57
VDDI1
-
PS/1 Digital Core Supply Voltage for Domain 1
Decouple with a ceramic capacitor, see Data
Sheet for details.
All VDDI1 pins must be connected to each other.
9
VDDPA
-
PS/A Digital Pad Supply Voltage for Domain A
Connect decoupling capacitors to adjacent
VDDP/VSS pin pairs as close as possible to the pins.
Note: The A/D_Converters and ports P5, P6 and
P15 are fed from supply voltage VDDPA.
Data Sheet
25
V2.1, 2011-07
XE162FM, XE162HM
XE166 Family / Base Line
General Device Information
Table 5
Pin Definitions and Functions (cont’d)
Pin
Symbol
Ctrl.
Type Function
2,
16,
18,
32,
34,
48,
50,
64
VDDPB
-
PS/B Digital Pad Supply Voltage for Domain B
Connect decoupling capacitors to adjacent
VDDP/VSS pin pairs as close as possible to the pins.
1,
17,
33,
49
VSS
Note: The on-chip voltage regulators and all ports
except P5, P6 and P15 are fed from supply
voltage VDDPB.
Data Sheet
-
PS/-- Digital Ground
All VSS pins must be connected to the ground-line
or ground-plane.
Note: Also the exposed pad is connected
internally to VSS. To improve the EMC
behavior, it is recommended to connect the
exposed pad to the board ground.
For thermal aspects, please refer to the
Data Sheet. Board layout examples are
given in an application note.
26
V2.1, 2011-07
XE162FM, XE162HM
XE166 Family / Base Line
General Device Information
2.2
Identification Registers
The identification registers describe the current version of the XE162xM and of its
modules.
Table 6
XE162xM Identification Registers
Short Name
Value
Address
SCU_IDMANUF
1820H
00’F07EH
SCU_IDCHIP
3801H
00’F07CH
SCU_IDMEM
30D0H
00’F07AH
SCU_IDPROG
1313H
00’F078H
JTAG_ID
0017’E083H
---
Data Sheet
Notes
marking EES-AA, ES-AA or AA
27
V2.1, 2011-07
XE162FM, XE162HM
XE166 Family / Base Line
Functional Description
3
Functional Description
The architecture of the XE162xM combines advantages of RISC, CISC, and DSP
processors with an advanced peripheral subsystem in a well-balanced design. On-chip
memory blocks allow the design of compact systems-on-silicon with maximum
performance suited for computing, control, and communication.
The on-chip memory blocks (program code memory and SRAM, dual-port RAM, data
SRAM) and the generic peripherals are connected to the CPU by separate high-speed
buses. Another bus, the LXBus, connects additional on-chip resources and external
resources (see Figure 4). This bus structure enhances overall system performance by
enabling the concurrent operation of several subsystems of the XE162xM.
The block diagram gives an overview of the on-chip components and the advanced
internal bus structure of the XE162xM.
DPRAM
OCDS
Debug Support
DSRAM
DMU
CPU
PMU
Flash
Memory
IMB
PSRAM
MAC Unit
EBC
LXBus Control
External Bus
Control
System Functions
Clock, Reset, Power
Control, StandBy RAM
WDT
MPU
Interrupt & PEC
RTC
LXB us
MCHK
ADC0 ADC1
Module Module
10 -Bit
8-Bit
GPT
CC2
Modules
CCU6 x
Modules
10 -Bit
8-Bit
5
Timers
16
Chan.
3+1
Chan.
each
Periph eral Data Bu s
Interrupt Bus
USICx
Modules
2
Chan.
each
Multi
CAN
Shared
MOs
for
Nodes
Analog and Digital General Purpose IO (GPIO) Ports
MC_BL_BLOCKDIAGRAM
Figure 4
Data Sheet
Block Diagram
28
V2.1, 2011-07
XE162FM, XE162HM
XE166 Family / Base Line
Functional Description
3.1
Memory Subsystem and Organization
The memory space of the XE162xM is configured in the von Neumann architecture. In
this architecture all internal and external resources, including code memory, data
memory, registers and I/O ports, are organized in the same linear address space.
Table 7
XE162xM Memory Map 1)
Address Area
Start Loc.
End Loc.
Area Size2)
Notes
IMB register space
FF’FF00H
FF’FFFFH
256 Bytes
–
Reserved (Access trap) F0’0000H
FF’FEFFH
<1 Mbyte
Minus IMB registers
Reserved for EPSRAM E8’8000H
EF’FFFFH
480 Kbytes
Mirrors EPSRAM
Emulated PSRAM
E8’0000H
E8’7FFFH
32 Kbytes
With Flash timing
Reserved for PSRAM
E0’8000H
E7’FFFFH
480 Kbytes
Mirrors PSRAM
Program SRAM
E0’0000H
E0’7FFFH
32 Kbytes
Maximum speed
Reserved for Flash
CD’0000H
DF’FFFFH
<1.25 Mbytes –
Program Flash 3
CC’0000H
CC’FFFFH
64 Kbytes
–
Program Flash 2
C8’0000H
CB’FFFFH
256 Kbytes
–
Program Flash 1
C4’0000H
C7’FFFFH
256 Kbytes
–
Program Flash 0
C0’0000H
C3’FFFFH
256 Kbytes
3)
40’0000H
BF’FFFFH
8 Mbytes
–
21’0000H
3F’FFFFH
< 2 Mbytes
Minus USIC/CAN
External memory area
4)
Available Ext. IO area
Reserved
20’BC00H
20’FFFFH
17 Kbytes
–
USIC alternate regs.
20’B000H
20’BFFFH
4 Kbytes
Accessed via EBC
MultiCAN alternate
regs.
20’8000H
20’AFFFH
12 Kbytes
Accessed via EBC
Reserved
20’6000H
20’7FFFH
8 Kbytes
–
USIC registers
20’4000H
20’5FFFH
8 Kbytes
Accessed via EBC
MultiCAN registers
20’0000H
20’3FFFH
16 Kbytes
Accessed via EBC
External memory area
01’0000H
1F’FFFFH
< 2 Mbytes
Minus segment 0
SFR area
00’FE00H
00’FFFFH
0.5 Kbyte
–
Dual-Port RAM
00’F600H
00’FDFFH
2 Kbytes
–
Reserved for DPRAM
00’F200H
00’F5FFH
1 Kbyte
–
ESFR area
00’F000H
00’F1FFH
0.5 Kbyte
–
XSFR area
00’E000H
00’EFFFH
4 Kbytes
–
Data Sheet
29
V2.1, 2011-07
XE162FM, XE162HM
XE166 Family / Base Line
Functional Description
Table 7
XE162xM Memory Map (cont’d)1)
Address Area
Start Loc.
End Loc.
Area Size2)
Notes
Data SRAM
00’A000H
00’DFFFH
16 Kbytes
–
Reserved for DSRAM
00’8000H
00’9FFFH
8 Kbytes
–
External memory area
00’0000H
00’7FFFH
32 Kbytes
–
1) Accesses to the shaded areas are reserved. In devices with external bus interface these accesses generate
external bus accesses.
2) The areas marked with “<” are slightly smaller than indicated. See column “Notes”.
3) The uppermost 4-Kbyte sector of the first Flash segment is reserved for internal use (C0’F000H to C0’FFFFH).
4) Several pipeline optimizations are not active within the external IO area. This is necessary to control external
peripherals properly.
This common memory space consists of 16 Mbytes organized as 256 segments of
64 Kbytes; each segment contains four data pages of 16 Kbytes. The entire memory
space can be accessed bytewise or wordwise. Portions of the on-chip DPRAM and the
register spaces (ESFR/SFR) additionally are directly bit addressable.
The internal data memory areas and the Special Function Register areas (SFR and
ESFR) are mapped into segment 0, the system segment.
The Program Management Unit (PMU) handles all code fetches and, therefore, controls
access to the program memories such as Flash memory and PSRAM.
The Data Management Unit (DMU) handles all data transfers and, therefore, controls
access to the DSRAM and the on-chip peripherals.
Both units (PMU and DMU) are connected to the high-speed system bus so that they can
exchange data. This is required if operands are read from program memory, code or
data is written to the PSRAM, code is fetched from external memory, or data is read from
or written to external resources. These include peripherals on the LXBus such as USIC
or MultiCAN. The system bus allows concurrent two-way communication for maximum
transfer performance.
Up to 32 Kbytes of on-chip Program SRAM (PSRAM) are provided to store user code
or data. The PSRAM is accessed via the PMU and is optimized for code fetches. A
section of the PSRAM with programmable size can be write-protected.
Up to 16 Kbytes of on-chip Data SRAM (DSRAM) are used for storage of general user
data. The DSRAM is accessed via a separate interface and is optimized for data access.
2 Kbytes of on-chip Dual-Port RAM (DPRAM) provide storage for user-defined
variables, for the system stack, and for general purpose register banks. A register bank
can consist of up to 16 word-wide (R0 to R15) and/or byte-wide (RL0, RH0, …, RL7,
RH7) General Purpose Registers (GPRs).
The upper 256 bytes of the DPRAM are directly bit addressable. When used by a GPR,
any location in the DPRAM is bit addressable.
Data Sheet
30
V2.1, 2011-07
XE162FM, XE162HM
XE166 Family / Base Line
Functional Description
8 Kbytes of on-chip Stand-By SRAM (SBRAM) provide storage for system-relevant
user data that must be preserved while the major part of the device is powered down.
The SBRAM is accessed via a specific interface and is powered in domain M.
1024 bytes (2 × 512 bytes) of the address space are reserved for the Special Function
Register areas (SFR space and ESFR space). SFRs are word-wide registers which are
used to control and monitor functions of the different on-chip units. Unused SFR
addresses are reserved for future members of the XE166 Family. In order to ensure
upward compatibility they should either not be accessed or written with zeros.
The on-chip Flash memory stores code, constant data, and control data. The on-chip
Flash memory consists of 1 module of 64 Kbytes (preferably for data storage) and
modules with a maximum capacity of 256 Kbytes each. Each module is organized in
sectors of 4 Kbytes.
The uppermost 4-Kbyte sector of segment 0 (located in Flash module 0) is used
internally to store operation control parameters and protection information.
Note: The actual size of the Flash memory depends on the chosen device type.
Each sector can be separately write protected1), erased and programmed (in blocks of
128 Bytes). The complete Flash area can be read-protected. A user-defined password
sequence temporarily unlocks protected areas. The Flash modules combine 128-bit
read access with protected and efficient writing algorithms for programming and erasing.
Dynamic error correction provides extremely high read data security for all read access
operations. Access to different Flash modules can be executed in parallel.
For Flash parameters, please see Section 4.5.
Memory Content Protection
The contents of on-chip memories can be protected against soft errors (induced e.g. by
radiation) by activating the parity mechanism or the Error Correction Code (ECC).
The parity mechanism can detect a single-bit error and prevent the software from using
incorrect data or executing incorrect instructions.
The ECC mechanism can detect and automatically correct single-bit errors. This
supports the stable operation of the system.
It is strongly recommended to activate the ECC mechanism wherever possible because
this dramatically increases the robustness of an application against such soft errors.
1) To save control bits, sectors are clustered for protection purposes, they remain separate for
programming/erasing.
Data Sheet
31
V2.1, 2011-07
XE162FM, XE162HM
XE166 Family / Base Line
Functional Description
3.2
Central Processing Unit (CPU)
The core of the CPU consists of a 5-stage execution pipeline with a 2-stage instructionfetch pipeline, a 16-bit arithmetic and logic unit (ALU), a 32-bit/40-bit multiply and
accumulate unit (MAC), a register-file providing three register banks, and dedicated
SFRs. The ALU features a multiply-and-divide unit, a bit-mask generator, and a barrel
shifter.
PSRAM
Flash/ROM
PMU
CPU
Prefetch
Unit
Branch
Unit
FIFO
CSP
IP
VECSEG
CPUCON1
CPUCON2
Return
Stack
IDX0
IDX1
QX0
QX1
QR0
QR1
+/-
+/-
Multiply
Unit
MRW
+/-
MCW
MSW
MAH
MAL
2-Stage
Prefetch
Pipeline
TFR
Injection/
Exception
Handler
5-Stage
Pipeline
IFU
DPP0
DPP1
DPP2
DPP3
DPRAM
IPIP
SPSEG
SP
STKOV
STKUN
ADU
Division Unit
Bit-Mask-Gen.
Multiply Unit
Barrel-Shifter
MDC
CP
R15
R15
R14
R15
R14
R14
R15
R14
GPRs
GPRs
GPRs
GPRs
R1
R1
R0
R0R1
R0
R1
R0
RF
+/-
PSW
MDH
MDL
ZEROS
ONES
MAC
Buffer
ALU
WB
DSRAM
EBC
Peripherals
DMU
mca04917_x.vsd
Figure 5
Data Sheet
CPU Block Diagram
32
V2.1, 2011-07
XE162FM, XE162HM
XE166 Family / Base Line
Functional Description
With this hardware most XE162xM instructions are executed in a single machine cycle
of 12.5 ns with an 80-MHz CPU clock. For example, shift and rotate instructions are
always processed during one machine cycle, no matter how many bits are shifted. Also,
multiplication and most MAC instructions execute in one cycle. All multiple-cycle
instructions have been optimized so that they can be executed very fast; for example, a
32-/16-bit division is started within 4 cycles while the remaining cycles are executed in
the background. Another pipeline optimization, the branch target prediction, eliminates
the execution time of branch instructions if the prediction was correct.
The CPU has a register context consisting of up to three register banks with 16 wordwide GPRs each at its disposal. One of these register banks is physically allocated within
the on-chip DPRAM area. A Context Pointer (CP) register determines the base address
of the active register bank accessed by the CPU at any time. The number of these
register bank copies is only restricted by the available internal RAM space. For easy
parameter passing, a register bank may overlap others.
A system stack of up to 32 Kwords is provided for storage of temporary data. The system
stack can be allocated to any location within the address space (preferably in the on-chip
RAM area); it is accessed by the CPU with the stack pointer (SP) register. Two separate
SFRs, STKOV and STKUN, are implicitly compared with the stack pointer value during
each stack access to detect stack overflow or underflow.
The high performance of the CPU hardware implementation can be best utilized by the
programmer with the highly efficient XE162xM instruction set. This includes the following
instruction classes:
•
•
•
•
•
•
•
•
•
•
•
•
•
Standard Arithmetic Instructions
DSP-Oriented Arithmetic Instructions
Logical Instructions
Boolean Bit Manipulation Instructions
Compare and Loop Control Instructions
Shift and Rotate Instructions
Prioritize Instruction
Data Movement Instructions
System Stack Instructions
Jump and Call Instructions
Return Instructions
System Control Instructions
Miscellaneous Instructions
The basic instruction length is either 2 or 4 bytes. Possible operand types are bits, bytes
and words. A variety of direct, indirect or immediate addressing modes are provided to
specify the required operands.
Data Sheet
33
V2.1, 2011-07
XE162FM, XE162HM
XE166 Family / Base Line
Functional Description
3.3
Memory Protection Unit (MPU)
The XE162xM’s Memory Protection Unit (MPU) protects user-specified memory areas
from unauthorized read, write, or instruction fetch accesses. The MPU can protect the
whole address space including the peripheral area. This completes establisched
mechanisms such as the register security mechanism or stack overrun/underrun
detection.
Four Protection Levels support flexible system programming where operating system,
low level drivers, and applications run on separate levels. Each protection level permits
different access restrictions for instructions and/or data.
Every access is checked (if the MPU is enabled) and an access violating the permission
rules will be marked as invalid and leads to a protection trap.
A set of protection registers for each protection level specifies the address ranges and
the access permissions. Applications requiring more than 4 protection levels can
dynamically re-program the protection registers.
3.4
Memory Checker Module (MCHK)
The XE162xM’s Memory Checker Module calculates a checksum (fractional polynomial
division) on a block of data, often called Cyclic Redundancy Code (CRC). It is based on
a 32-bit linear feedback shift register and may, therefore, also be used to generate
pseudo-random numbers.
The Memory Checker Module is a 16-bit parallel input signature compression circuitry
which enables error detection within a block of data stored in memory, registers, or
communicated e.g. via serial communication lines. It reduces the probability of error
masking due to repeated error patterns by calculating the signature of blocks of data.
The polynomial used for operation is configurable, so most of the commonly used
polynomials may be used. Also, the block size for generating a CRC result is
configurable via a local counter. An interrupt may be generated if testing the current data
block reveals an error.
An autonomous CRC compare circuitry is included to enable redundant error detection,
e.g. to enable higher safety integrity levels.
The Memory Checker Module provides enhanced fault detection (beyond parity or ECC)
for data and instructions in volatile and non volatile memories. This is especially
important for the safety and reliability of embedded systems.
Data Sheet
34
V2.1, 2011-07
XE162FM, XE162HM
XE166 Family / Base Line
Functional Description
3.5
Interrupt System
The architecture of the XE162xM supports several mechanisms for fast and flexible
response to service requests; these can be generated from various sources internal or
external to the microcontroller. Any of these interrupt requests can be programmed to be
serviced by the Interrupt Controller or by the Peripheral Event Controller (PEC).
Where in a standard interrupt service the current program execution is suspended and
a branch to the interrupt vector table is performed, just one cycle is ‘stolen’ from the
current CPU activity to perform a PEC service. A PEC service implies a single byte or
word data transfer between any two memory locations with an additional increment of
either the PEC source pointer, the destination pointer, or both. An individual PEC
transfer counter is implicitly decremented for each PEC service except when performing
in the continuous transfer mode. When this counter reaches zero, a standard interrupt is
performed to the corresponding source-related vector location. PEC services are
particularly well suited to supporting the transmission or reception of blocks of data. The
XE162xM has eight PEC channels, each whith fast interrupt-driven data transfer
capabilities.
With a minimum interrupt response time of 7/111) CPU clocks, the XE162xM can react
quickly to the occurrence of non-deterministic events.
Interrupt Nodes and Source Selection
The interrupt system provides 96 physical nodes with separate control register
containing an interrupt request flag, an interrupt enable flag and an interrupt priority bit
field. Most interrupt sources are assigned to a dedicated node. A particular subset of
interrupt sources shares a set of nodes. The source selection can be programmed using
the interrupt source selection (ISSR) registers.
External Request Unit (ERU)
A dedicated External Request Unit (ERU) is provided to route and preprocess selected
on-chip peripheral and external interrupt requests. The ERU features 4 programmable
input channels with event trigger logic (ETL) a routing matrix and 4 output gating units
(OGU). The ETL features rising edge, falling edge, or both edges event detection. The
OGU combines the detected interrupt events and provides filtering capabilities
depending on a programmable pattern match or miss.
Trap Processing
The XE162xM provides efficient mechanisms to identify and process exceptions or error
conditions that arise during run-time, the so-called ‘Hardware Traps’. A hardware trap
causes an immediate system reaction similar to a standard interrupt service (branching
1) Depending if the jump cache is used or not.
Data Sheet
35
V2.1, 2011-07
XE162FM, XE162HM
XE166 Family / Base Line
Functional Description
to a dedicated vector table location). The occurrence of a hardware trap is also indicated
by a single bit in the trap flag register (TFR). Unless another higher-priority trap service
is in progress, a hardware trap will interrupt any ongoing program execution. In turn,
hardware trap services can normally not be interrupted by standard or PEC interrupts.
Depending on the package option up to 3 External Service Request (ESR) pins are
provided. The ESR unit processes their input values and allows to implement user
controlled trap functions (System Requests SR0 and SR1). In this way reset, wakeup
and power control can be efficiently realized.
Software interrupts are supported by the ‘TRAP’ instruction in combination with an
individual trap (interrupt) number. Alternatively to emulate an interrupt by software a
program can trigger interrupt requests by writing the Interrupt Request (IR) bit of an
interrupt control register.
3.6
On-Chip Debug Support (OCDS)
The On-Chip Debug Support system built into the XE162xM provides a broad range of
debug and emulation features. User software running on the XE162xM can be debugged
within the target system environment.
The OCDS is controlled by an external debugging device via the debug interface. This
either consists of the 2-pin Device Access Port (DAP) or of the JTAG port conforming to
IEEE-1149. The debug interface can be completed with an optional break interface.
The debugger controls the OCDS with a set of dedicated registers accessible via the
debug interface (DAP or JTAG). In addition the OCDS system can be controlled by the
CPU, e.g. by a monitor program. An injection interface allows the execution of OCDSgenerated instructions by the CPU.
Multiple breakpoints can be triggered by on-chip hardware, by software, or by an
external trigger input. Single stepping is supported, as is the injection of arbitrary
instructions and read/write access to the complete internal address space. A breakpoint
trigger can be answered with a CPU halt, a monitor call, a data transfer, or/and the
activation of an external signal.
Tracing data can be obtained via the debug interface, or via the external bus interface
for increased performance.
Tracing of program execution is supported by the XE166 Family emulation device.
The DAP interface uses two interface signals, the JTAG interface uses four interface
signals, to communicate with external circuitry. The debug interface can be amended
with two optional break lines.
Data Sheet
36
V2.1, 2011-07
XE162FM, XE162HM
XE166 Family / Base Line
Functional Description
3.7
Capture/Compare Unit (CAPCOM2)
The CAPCOM2 unit supports generation and control of timing sequences on up to
16 channels with a maximum resolution of one system clock cycle (eight cycles in
staggered mode). The CAPCOM2 unit is typically used to handle high-speed I/O tasks
such as pulse and waveform generation, pulse width modulation (PWM), digital to
analog (D/A) conversion, software timing, or time recording with respect to external
events.
Two 16-bit timers (T7/T8) with reload registers provide two independent time bases for
the capture/compare register array.
The input clock for the timers is programmable to several prescaled values of the internal
system clock, or may be derived from an overflow/underflow of timer T6 in module GPT2.
This provides a wide range or variation for the timer period and resolution and allows
precise adjustments to the application-specific requirements. In addition, an external
count input allows event scheduling for the capture/compare registers relative to external
events.
The capture/compare register array contains 16 dual purpose capture/compare
registers, each of which may be individually allocated to either CAPCOM timer and
programmed for capture or compare function.
All registers have each one port pin associated with it which serves as an input pin for
triggering the capture function, or as an output pin to indicate the occurrence of a
compare event.
When a capture/compare register has been selected for capture mode, the current
contents of the allocated timer will be latched (‘captured’) into the capture/compare
register in response to an external event at the port pin which is associated with this
register. In addition, a specific interrupt request for this capture/compare register is
generated. Either a positive, a negative, or both a positive and a negative external signal
transition at the pin can be selected as the triggering event.
The contents of all registers which have been selected for one of the five compare modes
are continuously compared with the contents of the allocated timers.
When a match occurs between the timer value and the value in a capture/compare
register, specific actions will be taken based on the selected compare mode.
Table 8
Compare Modes
Compare Modes
Function
Mode 0
Interrupt-only compare mode;
Several compare interrupts per timer period are possible
Mode 1
Pin toggles on each compare match;
Several compare events per timer period are possible
Data Sheet
37
V2.1, 2011-07
XE162FM, XE162HM
XE166 Family / Base Line
Functional Description
Table 8
Compare Modes (cont’d)
Compare Modes
Function
Mode 2
Interrupt-only compare mode;
Only one compare interrupt per timer period is generated
Mode 3
Pin set ‘1’ on match; pin reset ‘0’ on compare timer overflow;
Only one compare event per timer period is generated
Double Register
Mode
Two registers operate on one pin;
Pin toggles on each compare match;
Several compare events per timer period are possible
Single Event Mode
Generates single edges or pulses;
Can be used with any compare mode
Data Sheet
38
V2.1, 2011-07
XE162FM, XE162HM
XE166 Family / Base Line
Functional Description
Reload Reg.
T7REL
fCC
T7IN
T6OUF
T7
Input
Control
Timer T7
CC16IO
CC17IO
CC16IRQ
CC17IRQ
Mode
Control
(Capture
or
Compare)
Sixteen
16-bit
Capture/
Compare
Registers
CC31IO
fCC
T6OUF
T7IRQ
CC31IRQ
T8
Input
Control
Timer T8
T8IRQ
Reload Reg.
T8REL
MC_CAPCOM2_BLOCKDIAG
Figure 6
Data Sheet
CAPCOM2 Unit Block Diagram
39
V2.1, 2011-07
XE162FM, XE162HM
XE166 Family / Base Line
Functional Description
3.8
Capture/Compare Units CCU6x
The XE162xM types feature the CCU60 unit(s).
The CCU6 is a high-resolution capture and compare unit with application-specific
modes. It provides inputs to start the timers synchronously, an important feature in
devices with several CCU6 modules.
The module provides two independent timers (T12, T13), that can be used for PWM
generation, especially for AC motor control. Additionally, special control modes for block
commutation and multi-phase machines are supported.
Timer 12 Features
•
•
•
•
•
•
•
•
•
•
Three capture/compare channels, where each channel can be used either as a
capture or as a compare channel.
Supports generation of a three-phase PWM (six outputs, individual signals for highside and low-side switches)
16-bit resolution, maximum count frequency = peripheral clock
Dead-time control for each channel to avoid short circuits in the power stage
Concurrent update of the required T12/13 registers
Center-aligned and edge-aligned PWM can be generated
Single-shot mode supported
Many interrupt request sources
Hysteresis-like control mode
Automatic start on a HW event (T12HR, for synchronization purposes)
Timer 13 Features
•
•
•
•
•
•
One independent compare channel with one output
16-bit resolution, maximum count frequency = peripheral clock
Can be synchronized to T12
Interrupt generation at period match and compare match
Single-shot mode supported
Automatic start on a HW event (T13HR, for synchronization purposes)
Additional Features
•
•
•
•
•
•
•
Block commutation for brushless DC drives implemented
Position detection via Hall sensor pattern
Automatic rotational speed measurement for block commutation
Integrated error handling
Fast emergency stop without CPU load via external signal (CTRAP)
Control modes for multi-channel AC drives
Output levels can be selected and adapted to the power stage
Data Sheet
40
V2.1, 2011-07
XE162FM, XE162HM
XE166 Family / Base Line
Functional Description
CCU6 Module Kernel
fSYS
T13
Channel 3
com pare
1
3
2
2
2
trap i nput
st art
Trap
Control
output select
1
Multichannel
Control
Hal l i nput
Channel 2
Deadtime
Control
compa re
1
compa re
Interrupts
Channel 1
compa re
T12
1
capture
TxHR
Channel 0
output select
com pare
3
1
CTRAP
CCPOS0
CCPOS1
CCPOS2
COUT60
CC60
COUT61
CC61
COUT62
CC62
COUT63
Input / Output Control
m c_ccu6_blockdiagram . vsd
Figure 7
CCU6 Block Diagram
Timer T12 can work in capture and/or compare mode for its three channels. The modes
can also be combined. Timer T13 can work in compare mode only. The multi-channel
control unit generates output patterns that can be modulated by timer T12 and/or timer
T13. The modulation sources can be selected and combined for signal modulation.
Data Sheet
41
V2.1, 2011-07
XE162FM, XE162HM
XE166 Family / Base Line
Functional Description
3.9
General Purpose Timer (GPT12E) Unit
The GPT12E unit is a very flexible multifunctional timer/counter structure which can be
used for many different timing tasks such as event timing and counting, pulse width and
duty cycle measurements, pulse generation, or pulse multiplication.
The GPT12E unit incorporates five 16-bit timers organized in two separate modules,
GPT1 and GPT2. Each timer in each module may either operate independently in a
number of different modes or be concatenated with another timer of the same module.
Each of the three timers T2, T3, T4 of module GPT1 can be configured individually for
one of four basic modes of operation: Timer, Gated Timer, Counter, and Incremental
Interface Mode. In Timer Mode, the input clock for a timer is derived from the system
clock and divided by a programmable prescaler. Counter Mode allows timer clocking in
reference to external events.
Pulse width or duty cycle measurement is supported in Gated Timer Mode, where the
operation of a timer is controlled by the ‘gate’ level on an external input pin. For these
purposes each timer has one associated port pin (TxIN) which serves as a gate or clock
input. The maximum resolution of the timers in module GPT1 is 4 system clock cycles.
The counting direction (up/down) for each timer can be programmed by software or
altered dynamically by an external signal on a port pin (TxEUD), e.g. to facilitate position
tracking.
In Incremental Interface Mode the GPT1 timers can be directly connected to the
incremental position sensor signals A and B through their respective inputs TxIN and
TxEUD. Direction and counting signals are internally derived from these two input
signals, so that the contents of the respective timer Tx corresponds to the sensor
position. The third position sensor signal TOP0 can be connected to an interrupt input.
Timer T3 has an output toggle latch (T3OTL) which changes its state on each timer
overflow/underflow. The state of this latch may be output on pin T3OUT e.g. for time out
monitoring of external hardware components. It may also be used internally to clock
timers T2 and T4 for measuring long time periods with high resolution.
In addition to the basic operating modes, T2 and T4 may be configured as reload or
capture register for timer T3. A timer used as capture or reload register is stopped. The
contents of timer T3 is captured into T2 or T4 in response to a signal at the associated
input pin (TxIN). Timer T3 is reloaded with the contents of T2 or T4, triggered either by
an external signal or a selectable state transition of its toggle latch T3OTL. When both
T2 and T4 are configured to alternately reload T3 on opposite state transitions of T3OTL
with the low and high times of a PWM signal, this signal can be continuously generated
without software intervention.
Note: Signals T2IN, T2EUD, T4EUD, and T6EUD are not connected to pins.
Data Sheet
42
V2.1, 2011-07
XE162FM, XE162HM
XE166 Family / Base Line
Functional Description
T3CON.BPS1
fGPT
2n:1
Basic Clock
Interrupt
Request
(T2IRQ)
Aux. Timer T2
T2IN
T2EUD
U/D
T2
Mode
Reload
Control
Capture
Interrupt
Request
(T3IRQ)
T3IN
T3
Mode
Control
T3EUD
Core Timer T3
U/D
T3OTL
T3OUT
Toggle
Latch
Capture
T4IN
T4EUD
T4
Mode
Control
Reload
Aux. Timer T4
U/D
Interrupt
Request
(T4IRQ)
MC_GPT_BLOCK1
Figure 8
Data Sheet
Block Diagram of GPT1
43
V2.1, 2011-07
XE162FM, XE162HM
XE166 Family / Base Line
Functional Description
With its maximum resolution of 2 system clock cycles, the GPT2 module provides
precise event control and time measurement. It includes two timers (T5, T6) and a
capture/reload register (CAPREL). Both timers can be clocked with an input clock which
is derived from the CPU clock via a programmable prescaler or with external signals. The
counting direction (up/down) for each timer can be programmed by software or altered
dynamically with an external signal on a port pin (TxEUD). Concatenation of the timers
is supported with the output toggle latch (T6OTL) of timer T6, which changes its state on
each timer overflow/underflow.
The state of this latch may be used to clock timer T5, and/or it may be output on pin
T6OUT. The overflows/underflows of timer T6 can also be used to clock the CAPCOM2
timers and to initiate a reload from the CAPREL register.
The CAPREL register can capture the contents of timer T5 based on an external signal
transition on the corresponding port pin (CAPIN); timer T5 may optionally be cleared
after the capture procedure. This allows the XE162xM to measure absolute time
differences or to perform pulse multiplication without software overhead.
The capture trigger (timer T5 to CAPREL) can also be generated upon transitions of
GPT1 timer T3 inputs T3IN and/or T3EUD. This is especially advantageous when T3
operates in Incremental Interface Mode.
Data Sheet
44
V2.1, 2011-07
XE162FM, XE162HM
XE166 Family / Base Line
Functional Description
T6CON.BPS2
fGPT
2n:1
Basic Clock
Interrupt
Request
(T5IRQ)
GPT2 Timer T5
T5IN
T5EUD
T5
Mode
Control
U/D
Clear
Capture
CAPIN
T3IN/
T3EUD
CAPREL
Mode
Control
GPT2 CAPREL
Interrupt
Request
(CRIRQ)
Reload
Clear
Interrupt
Request
(T6IRQ)
Toggle
FF
T6IN
T6
Mode
Control
GPT2 Timer T6
T6OTL
T6OUT
T6OUF
U/D
T6EUD
MC_GPT_BLOCK2
Figure 9
Data Sheet
Block Diagram of GPT2
45
V2.1, 2011-07
XE162FM, XE162HM
XE166 Family / Base Line
Functional Description
3.10
Real Time Clock
The Real Time Clock (RTC) module of the XE162xM can be clocked with a clock signal
selected from internal sources or external sources (pins).
The RTC basically consists of a chain of divider blocks:
•
•
•
Selectable 32:1 and 8:1 dividers (on - off)
The reloadable 16-bit timer T14
The 32-bit RTC timer block (accessible via registers RTCH and RTCL) consisting of:
– a reloadable 10-bit timer
– a reloadable 6-bit timer
– a reloadable 6-bit timer
– a reloadable 10-bit timer
All timers count up. Each timer can generate an interrupt request. All requests are
combined to a common node request.
fRTC
:32
M UX
RUN
M UX
Interrupt Sub Node
:8
PRE
REFCLK
CNT
INT0
CNT
INT1
CNT
INT2
RTCINT
CNT
INT3
REL-Register
f CNT
T14REL
10 Bits
6 Bits
6 Bits
10 Bits
T14
10 Bits
6 Bits
6 Bits
10 Bits
T14-Register
CNT-Register
M CB05568B
Figure 10
RTC Block Diagram
Note: The registers associated with the RTC are only affected by a power reset.
Data Sheet
46
V2.1, 2011-07
XE162FM, XE162HM
XE166 Family / Base Line
Functional Description
The RTC module can be used for different purposes:
•
•
•
•
System clock to determine the current time and date
Cyclic time-based interrupt, to provide a system time tick independent of CPU
frequency and other resources
48-bit timer for long-term measurements
Alarm interrupt at a defined time
Data Sheet
47
V2.1, 2011-07
XE162FM, XE162HM
XE166 Family / Base Line
Functional Description
3.11
A/D Converters
For analog signal measurement, up to two 10-bit A/D converters (ADC0, ADC1) with
7 + 2 multiplexed input channels and a sample and hold circuit have been integrated onchip. 2 inputs can be converted by both A/D converters. Conversions use the successive
approximation method. The sample time (to charge the capacitors) and the conversion
time are programmable so that they can be adjusted to the external circuit. The A/D
converters can also operate in 8-bit conversion mode, further reducing the conversion
time.
Several independent conversion result registers, selectable interrupt requests, and
highly flexible conversion sequences provide a high degree of programmability to meet
the application requirements. Both modules can be synchronized to allow parallel
sampling of two input channels.
For applications that require more analog input channels, external analog multiplexers
can be controlled automatically. For applications that require fewer analog input
channels, the remaining channel inputs can be used as digital input port pins.
The A/D converters of the XE162xM support two types of request sources which can be
triggered by several internal and external events.
•
•
Parallel requests are activated at the same time and then executed in a predefined
sequence.
Queued requests are executed in a user-defined sequence.
In addition, the conversion of a specific channel can be inserted into a running sequence
without disturbing that sequence. All requests are arbitrated according to the priority
level assigned to them.
Data reduction features reduce the number of required CPU access operations allowing
the precise evaluation of analog inputs (high conversion rate) even at a low CPU speed.
Result data can be reduced by limit checking or accumulation of results.
The Peripheral Event Controller (PEC) can be used to control the A/D converters or to
automatically store conversion results to a table in memory for later evaluation, without
requiring the overhead of entering and exiting interrupt routines for each data transfer.
Each A/D converter contains eight result registers which can be concatenated to build a
result FIFO. Wait-for-read mode can be enabled for each result register to prevent the
loss of conversion data.
In order to decouple analog inputs from digital noise and to avoid input trigger noise,
those pins used for analog input can be disconnected from the digital input stages. This
can be selected for each pin separately with the Port x Digital Input Disable registers.
The Auto-Power-Down feature of the A/D converters minimizes the power consumption
when no conversion is in progress.
Broken wire detection for each channel and a multiplexer test mode provide information
to verify the proper operation of the analog signal sources (e.g. a sensor system).
Data Sheet
48
V2.1, 2011-07
XE162FM, XE162HM
XE166 Family / Base Line
Functional Description
3.12
Universal Serial Interface Channel Modules (USIC)
The XE162xM features the USIC modules USIC0, USIC1, USIC2. Each module
provides two serial communication channels.
The Universal Serial Interface Channel (USIC) module is based on a generic data shift
and data storage structure which is identical for all supported serial communication
protocols. Each channel supports complete full-duplex operation with a basic data buffer
structure (one transmit buffer and two receive buffer stages). In addition, the data
handling software can use FIFOs.
The protocol part (generation of shift clock/data/control signals) is independent of the
general part and is handled by protocol-specific preprocessors (PPPs).
The USIC’s input/output lines are connected to pins by a pin routing unit. The inputs and
outputs of each USIC channel can be assigned to different interface pins, providing great
flexibility to the application software. All assignments can be made during runtime.
Bus
Buffer & Shift Structure Protocol Preprocessors
Pins
Control 0
DBU
0
PPP_B
DSU
0
PPP_C
PPP_D
Control 1
PPP_A
DBU
1
Pin Routing Shell
Bus Interface
PPP_A
PPP_B
DSU
1
PPP_C
PPP_D
fsys
Fractional
Dividers
Baud rate
Generators
USIC_basic.vsd
Figure 11
General Structure of a USIC Module
The regular structure of the USIC module brings the following advantages:
•
•
•
Higher flexibility through configuration with same look-and-feel for data management
Reduced complexity for low-level drivers serving different protocols
Wide range of protocols with improved performances (baud rate, buffer handling)
Data Sheet
49
V2.1, 2011-07
XE162FM, XE162HM
XE166 Family / Base Line
Functional Description
Target Protocols
Each USIC channel can receive and transmit data frames with a selectable data word
width from 1 to 16 bits in each of the following protocols:
•
•
•
•
•
UART (asynchronous serial channel)
– module capability: maximum baud rate = fSYS / 4
– data frame length programmable from 1 to 63 bits
– MSB or LSB first
LIN Support (Local Interconnect Network)
– module capability: maximum baud rate = fSYS / 16
– checksum generation under software control
– baud rate detection possible by built-in capture event of baud rate generator
SSC/SPI (synchronous serial channel with or without data buffer)
– module capability: maximum baud rate = fSYS / 2, limited by loop delay
– number of data bits programmable from 1 to 63, more with explicit stop condition
– MSB or LSB first
– optional control of slave select signals
IIC (Inter-IC Bus)
– supports baud rates of 100 kbit/s and 400 kbit/s
IIS (Inter-IC Sound Bus)
– module capability: maximum baud rate = fSYS / 2
Note: Depending on the selected functions (such as digital filters, input synchronization
stages, sample point adjustment, etc.), the maximum achievable baud rate can be
limited. Please note that there may be additional delays, such as internal or
external propagation delays and driver delays (e.g. for collision detection in UART
mode, for IIC, etc.).
Data Sheet
50
V2.1, 2011-07
XE162FM, XE162HM
XE166 Family / Base Line
Functional Description
3.13
MultiCAN Module
The MultiCAN module contains independently operating CAN nodes with Full-CAN
functionality which are able to exchange Data and Remote Frames using a gateway
function. Transmission and reception of CAN frames is handled in accordance with CAN
specification V2.0 B (active). Each CAN node can receive and transmit standard frames
with 11-bit identifiers as well as extended frames with 29-bit identifiers.
All CAN nodes share a common set of message objects. Each message object can be
individually allocated to one of the CAN nodes. Besides serving as a storage container
for incoming and outgoing frames, message objects can be combined to build gateways
between the CAN nodes or to set up a FIFO buffer.
Note: The number of CAN nodes and message objects depends on the selected device
type.
The message objects are organized in double-chained linked lists, where each CAN
node has its own list of message objects. A CAN node stores frames only into message
objects that are allocated to its own message object list and it transmits only messages
belonging to this message object list. A powerful, command-driven list controller
performs all message object list operations.
MultiCAN Module Kernel
Clock
Control
CAN
Node 0
Interrupt
Control
Port
Control
...
Linked
List
Control
TXDCn
RXDCn
...
Message
Object
Buffer
...
Address
Decoder
CAN
Node n
fCAN
TXDC0
RXDC0
CAN Control
mc_multican_block.vsd
Figure 12
Data Sheet
Block Diagram of MultiCAN Module
51
V2.1, 2011-07
XE162FM, XE162HM
XE166 Family / Base Line
Functional Description
MultiCAN Features
•
•
•
•
•
•
•
•
•
•
CAN functionality conforming to CAN specification V2.0 B active for each CAN node
(compliant to ISO 11898)
Independent CAN nodes
Set of independent message objects (shared by the CAN nodes)
Dedicated control registers for each CAN node
Data transfer rate up to 1 Mbit/s, individually programmable for each node
Flexible and powerful message transfer control and error handling capabilities
Full-CAN functionality for message objects:
– Can be assigned to one of the CAN nodes
– Configurable as transmit or receive objects, or as message buffer FIFO
– Handle 11-bit or 29-bit identifiers with programmable acceptance mask for filtering
– Remote Monitoring Mode, and frame counter for monitoring
Automatic Gateway Mode support
16 individually programmable interrupt nodes
Analyzer mode for CAN bus monitoring
3.14
System Timer
The System Timer consists of a programmable prescaler and two concatenated timers
(10 bits and 6 bits). Both timers can generate interrupt requests. The clock source can
be selected and the timers can also run during power reduction modes.
Therefore, the System Timer enables the software to maintain the current time for
scheduling functions or for the implementation of a clock.
Data Sheet
52
V2.1, 2011-07
XE162FM, XE162HM
XE166 Family / Base Line
Functional Description
3.15
Watchdog Timer
The Watchdog Timer is one of the fail-safe mechanisms which have been implemented
to prevent the controller from malfunctioning for longer periods of time.
The Watchdog Timer is always enabled after an application reset of the chip. It can be
disabled and enabled at any time by executing the instructions DISWDT and ENWDT
respectively. The software has to service the Watchdog Timer before it overflows. If this
is not the case because of a hardware or software failure, the Watchdog Timer
overflows, generating a prewarning interrupt and then a reset request.
The Watchdog Timer is a 16-bit timer clocked with the system clock divided by 16,384
or 256. The Watchdog Timer register is set to a prespecified reload value (stored in
WDTREL) in order to allow further variation of the monitored time interval. Each time it
is serviced by the application software, the Watchdog Timer is reloaded and the
prescaler is cleared.
Time intervals between 3.2 μs and 13.42 s can be monitored (@ 80 MHz).
The default Watchdog Timer interval after power-up is 6.5 ms (@ 10 MHz).
3.16
Clock Generation
The Clock Generation Unit can generate the system clock signal fSYS for the XE162xM
from a number of external or internal clock sources:
•
•
•
•
External clock signals with pad voltage or core voltage levels
External crystal or resonator using the on-chip oscillator
On-chip clock source for operation without crystal/resonator
Wake-up clock (ultra-low-power) to further reduce power consumption
The programmable on-chip PLL with multiple prescalers generates a clock signal for
maximum system performance from standard crystals, a clock input signal, or from the
on-chip clock source. See also Section 4.6.2.
The Oscillator Watchdog (OWD) generates an interrupt if the crystal oscillator frequency
falls below a certain limit or stops completely. In this case, the system can be supplied
with an emergency clock to enable operation even after an external clock failure.
All available clock signals can be output on one of two selectable pins.
Data Sheet
53
V2.1, 2011-07
XE162FM, XE162HM
XE166 Family / Base Line
Functional Description
3.17
Parallel Ports
The XE162xM provides up to 40 I/O lines which are organized into 4 input/output ports
and 2 input ports. All port lines are bit-addressable, and all input/output lines can be
individually (bit-wise) configured via port control registers. This configuration selects the
direction (input/output), push/pull or open-drain operation, activation of pull devices, and
edge characteristics (shape) and driver characteristics (output current) of the port
drivers. The I/O ports are true bidirectional ports which are switched to high impedance
state when configured as inputs. During the internal reset, all port pins are configured as
inputs without pull devices active.
All port lines have alternate input or output functions associated with them. These
alternate functions can be programmed to be assigned to various port pins to support the
best utilization for a given application. For this reason, certain functions appear several
times in Table 9.
All port lines that are not used for alternate functions may be used as general purpose
I/O lines.
Table 9
Summary of the XE162xM’s Ports
Port
Width
I/O
Connected Modules
P2
11
I/O
CAN, CC2, GPT12E, USIC, DAP/JTAG
P5
7
I
Analog Inputs, CCU6, DAP/JTAG, GPT12E, CAN
P6
2
I/O
ADC, CAN, GPT12E
P7
1
I/O
CAN, GPT12E, SCU, DAP/JTAG, USIC
P10
16
I/O
CCU6, USIC, DAP/JTAG, CAN
P15
2
I
Analog Inputs, GPT12E
Data Sheet
54
V2.1, 2011-07
XE162FM, XE162HM
XE166 Family / Base Line
Functional Description
3.18
Instruction Set Summary
Table 10 lists the instructions of the XE162xM.
The addressing modes that can be used with a specific instruction, the function of the
instructions, parameters for conditional execution of instructions, and the opcodes for
each instruction can be found in the “Instruction Set Manual”.
This document also provides a detailed description of each instruction.
Table 10
Instruction Set Summary
Mnemonic
Description
Bytes
ADD(B)
Add word (byte) operands
2/4
ADDC(B)
Add word (byte) operands with Carry
2/4
SUB(B)
Subtract word (byte) operands
2/4
SUBC(B)
Subtract word (byte) operands with Carry
2/4
MUL(U)
(Un)Signed multiply direct GPR by direct GPR
(16- × 16-bit)
2
DIV(U)
(Un)Signed divide register MDL by direct GPR (16-/16-bit) 2
DIVL(U)
(Un)Signed long divide reg. MD by direct GPR (32-/16-bit) 2
CPL(B)
Complement direct word (byte) GPR
2
NEG(B)
Negate direct word (byte) GPR
2
AND(B)
Bitwise AND, (word/byte operands)
2/4
OR(B)
Bitwise OR, (word/byte operands)
2/4
XOR(B)
Bitwise exclusive OR, (word/byte operands)
2/4
BCLR/BSET
Clear/Set direct bit
2
BMOV(N)
Move (negated) direct bit to direct bit
4
BAND/BOR/BXOR AND/OR/XOR direct bit with direct bit
4
BCMP
Compare direct bit to direct bit
4
BFLDH/BFLDL
Bitwise modify masked high/low byte of bit-addressable
direct word memory with immediate data
4
CMP(B)
Compare word (byte) operands
2/4
CMPD1/2
Compare word data to GPR and decrement GPR by 1/2
2/4
CMPI1/2
Compare word data to GPR and increment GPR by 1/2
2/4
PRIOR
Determine number of shift cycles to normalize direct
word GPR and store result in direct word GPR
2
SHL/SHR
Shift left/right direct word GPR
2
Data Sheet
55
V2.1, 2011-07
XE162FM, XE162HM
XE166 Family / Base Line
Functional Description
Table 10
Instruction Set Summary (cont’d)
Mnemonic
Description
Bytes
ROL/ROR
Rotate left/right direct word GPR
2
ASHR
Arithmetic (sign bit) shift right direct word GPR
2
MOV(B)
Move word (byte) data
2/4
MOVBS/Z
Move byte operand to word op. with sign/zero extension
2/4
JMPA/I/R
Jump absolute/indirect/relative if condition is met
4
JMPS
Jump absolute to a code segment
4
JB(C)
Jump relative if direct bit is set (and clear bit)
4
JNB(S)
Jump relative if direct bit is not set (and set bit)
4
CALLA/I/R
Call absolute/indirect/relative subroutine if condition is met 4
CALLS
Call absolute subroutine in any code segment
4
PCALL
Push direct word register onto system stack and call
absolute subroutine
4
TRAP
Call interrupt service routine via immediate trap number
2
PUSH/POP
Push/pop direct word register onto/from system stack
2
SCXT
Push direct word register onto system stack and update
register with word operand
4
RET(P)
Return from intra-segment subroutine
(and pop direct word register from system stack)
2
RETS
Return from inter-segment subroutine
2
RETI
Return from interrupt service subroutine
2
SBRK
Software Break
2
SRST
Software Reset
4
IDLE
Enter Idle Mode
PWRDN
Unused instruction
4
1)
4
SRVWDT
Service Watchdog Timer
4
DISWDT/ENWDT
Disable/Enable Watchdog Timer
4
EINIT
End-of-Initialization Register Lock
4
ATOMIC
Begin ATOMIC sequence
2
EXTR
Begin EXTended Register sequence
2
EXTP(R)
Begin EXTended Page (and Register) sequence
2/4
EXTS(R)
Begin EXTended Segment (and Register) sequence
2/4
Data Sheet
56
V2.1, 2011-07
XE162FM, XE162HM
XE166 Family / Base Line
Functional Description
Table 10
Instruction Set Summary (cont’d)
Mnemonic
Description
Bytes
NOP
Null operation
2
CoMUL/CoMAC
Multiply (and accumulate)
4
CoADD/CoSUB
Add/Subtract
4
Co(A)SHR
(Arithmetic) Shift right
4
CoSHL
Shift left
4
CoLOAD/STORE
Load accumulator/Store MAC register
4
CoCMP
Compare
4
CoMAX/MIN
Maximum/Minimum
4
CoABS/CoRND
Absolute value/Round accumulator
4
CoMOV
Data move
4
CoNEG/NOP
Negate accumulator/Null operation
4
1) The Enter Power Down Mode instruction is not used in the XE162xM, due to the enhanced power control
scheme. PWRDN will be correctly decoded, but will trigger no action.
Data Sheet
57
V2.1, 2011-07
XE162FM, XE162HM
XE166 Family / Base Line
Electrical Parameters
4
Electrical Parameters
The operating range for the XE162xM is defined by its electrical parameters. For proper
operation the specified limits must be respected when integrating the device in its target
environment.
4.1
General Parameters
These parameters are valid for all subsequent descriptions, unless otherwise noted.
4.1.1
Absolut Maximum Rating Conditions
Stresses above the values listed under “Absolute Maximum Ratings” may cause
permanent damage to the device. This is a stress rating only. Functional operation of the
device at these or any other conditions above those indicated in the operational sections
of this specification is not implied. Exposure to absolute maximum rating conditions for
an extended time may affect device reliability.
During absolute maximum rating overload conditions (VIN > VDDP or VIN < VSS) the
voltage on VDDP pins with respect to ground (VSS) must not exceed the values defined by
the absolute maximum ratings.
Table 11
Absolute Maximum Rating Parameters
Parameter
Symbol
Values
Unit
Min.
Typ.
Max.
Note /
Test Condition
Output current on a pin
when high value is driven
IOH SR
-30
−
−
mA
Output current on a pin
when low value is driven
IOL SR
−
−
30
mA
-10
−
10
mA
1)
−
−
100
mA
1)
-40
−
150
°C
-65
−
150
°C
-0.5
−
6.0
V
-0.5
−
VDDP
V
IOV SR
Absolute sum of overload Σ|IOV|
Overload current
currents
SR
Junction Temperature
TJ SR
TST SR
VDDPA,
VDDPB
Storage Temperature
Digital supply voltage for
IO pads and voltage
regulators
Voltage on any pin with
respect to ground (Vss)
SR
VIN SR
VIN ≤ VDDP(max)
+ 0.5
1) Overload condition occurs if the input voltage VIN is out of the absolute maximum rating range. In this case the
current must be limited to the listed values by design measures.
Data Sheet
58
V2.1, 2011-07
XE162FM, XE162HM
XE166 Family / Base Line
Electrical Parameters
4.1.2
Operating Conditions
The following operating conditions must not be exceeded to ensure correct operation of
the XE162xM. All parameters specified in the following sections refer to these operating
conditions, unless otherwise noticed.
Note: Typical parameter values refer to room temperature and nominal supply voltage,
minimum/maximum
parameter
values
also
include
conditions
of
minimum/maximum temperature and minimum/maximum supply voltage.
Additional details are described where applicable.
Table 12
Operating Conditions
Parameter
Symbol
Voltage Regulator Buffer
Capacitance for DMP_M
CEVRM
Voltage Regulator Buffer
Capacitance for DMP_1
CEVR1
External Load
Capacitance
CL SR
Values
Unit
Note /
Test Condition
4.7
μF
1)
−
2.2
μF
1)2)
203)
−
pF
pin out
driver= default
Min.
Typ.
Max.
1.0
−
0.47
−
SR
SR
4)
fSYS SR −
IOVA SR -2
−
100
MHz
5)
−
5
mA
not subject to
production test
Overload current for digital IOVD SR -5
inputs6)
−
5
mA
not subject to
production test
2.5 x
10-4
1.5 x
10-3
-
IOV < 0 mA;
1.0 x
10-6
1.0 x
10-4
-
1.0 x
10-2
3.0 x
10-2
IOV < 0 mA;
1.0 x
10-4
5.0 x
10-3
IOV > 0 mA;
System frequency
Overload current for
analog inputs6)
Overload current coupling KOVA
factor for analog inputs7)
CC
−
−
Overload current coupling KOVD
CC
factor for digital I/O pins
−
−
Data Sheet
59
not subject to
production test
IOV > 0 mA;
not subject to
production test
not subject to
production test
not subject to
production test
V2.1, 2011-07
XE162FM, XE162HM
XE166 Family / Base Line
Electrical Parameters
Table 12
Operating Conditions (cont’d)
Parameter
Symbol
Values
Unit
Note /
Test Condition
mA
not subject to
production test
Min.
Typ.
Max.
Σ|IOV|
SR
−
−
50
Digital core supply voltage VDDIM
for domain M8)
CC
−
1.5
−
Digital core supply voltage VDDI1
for domain 18)
CC
−
1.5
−
−
5.5
V
0
−
V
Absolute sum of overload
currents
Digital supply voltage for
IO pads and voltage
regulators
VDDP SR 4.5
Digital ground voltage
VSS SR
−
1) To ensure the stability of the voltage regulators the EVRs must be buffered with ceramic capacitors. Separate
buffer capacitors with the recomended values shall be connected as close as possible to each VDDIM and VDDI1
pin to keep the resistance of the board tracks below 2 Ohm. Connect all VDDI1 pins together. The minimum
capacitance value is required for proper operation under all conditions (e.g. temperature). Higher values
slightly increase the startup time.
2) Use one Capacitor for each pin.
3) This is the reference load. For bigger capacitive loads, use the derating factors listed in the PAD properties
section.
4) The timing is valid for pin drivers operating in default current mode (selected after reset). Reducing the output
current may lead to increased delays or reduced driving capability (CL).
5) The operating frequency range may be reduced for specific device types. This is indicated in the device
designation (...FxxL). 80 MHz devices are marked ...F80L.
6) Overload conditions occur if the standard operating conditions are exceeded, i.e. the voltage on any pin
exceeds the specified range: VOV > VIHmax (IOV > 0) or VOV < VILmin ((IOV < 0). The absolute sum of input
overload currents on all pins may not exceed 50 mA. The supply voltages must remain within the specified
limits. Proper operation under overload conditions depends on the application. Overload conditions must not
occur on pin XTAL1 (powered by VDDIM).
7) An overload current (IOV) through a pin injects a certain error current (IINJ) into the adjacent pins. This error
current adds to the respective pins leakage current (IOZ). The amount of error current depends on the overload
current and is defined by the overload coupling factor KOV. The polarity of the injected error current is inverse
compared to the polarity of the overload current that produces it.The total current through a pin is |ITOT| = |IOZ|
+ (|IOV| KOV). The additional error current may distort the input voltage on analog inputs.
8) Value is controlled by on-chip regulator
Data Sheet
60
V2.1, 2011-07
XE162FM, XE162HM
XE166 Family / Base Line
Electrical Parameters
4.1.3
Pad Timing Definition
If not otherwise noted, all timing parameters are tested and are valid for the
corresponding output pins operating in strong driver, fast edge mode.
See also “Pad Properties” on Page 90.
4.1.4
Parameter Interpretation
The parameters listed in the following include both the characteristics of the XE162xM
and its demands on the system. To aid in correctly interpreting the parameters when
evaluating them for a design, they are marked accordingly in the column “Symbol”:
CC (Controller Characteristics):
The logic of the XE162xM provides signals with the specified characteristics.
SR (System Requirement):
The external system must provide signals with the specified characteristics to the
XE162xM.
Data Sheet
61
V2.1, 2011-07
XE162FM, XE162HM
XE166 Family / Base Line
Electrical Parameters
4.2
DC Parameters
These parameters are static or average values that may be exceeded during switching
transitions (e.g. output current).
Leakage current is strongly dependent on the operating temperature and the voltage
level at the respective pin. The maximum values in the following tables apply under worst
case conditions, i.e. maximum temperature and an input level equal to the supply
voltage.
The value for the leakage current in an application can be determined by using the
respective leakage derating formula (see tables) with values from that application.
The pads of the XE162xM are designed to operate in various driver modes. The DC
parameter specifications refer to the pad current limits specified in Section 4.6.4.
Supply Voltage Restrictions
The XE162xM can operate within a wide supply voltage range from 3.0 V to 5.5 V.
However, during operation this supply voltage must remain within 10 percent of the
selected nominal supply voltage. It cannot vary across the full operating voltage range.
Because of the supply voltage restriction and because electrical behavior depends on
the supply voltage, the parameters are specified separately for the upper and the lower
voltage range.
During operation, the supply voltages may only change with a maximum speed of
dV/dt < 1 V/ms.
During power-on sequences, the supply voltages may only change with a maximum
speed of dV/dt < 5 V/μs, i.e. the target supply voltage may be reached earliest after
approx. 1 μs.
Note: To limit the speed of supply voltage changes, the employment of external buffer
capacitors at pins VDDPA/VDDPB is recommended.
Data Sheet
62
V2.1, 2011-07
XE162FM, XE162HM
XE166 Family / Base Line
Electrical Parameters
Pullup/Pulldown Device Behavior
Most pins of the XE162xM feature pullup or pulldown devices. For some special pins
these are fixed; for the port pins they can be selected by the application.
The specified current values indicate how to load the respective pin depending on the
intended signal level. Figure 13 shows the current paths.
The shaded resistors shown in the figure may be required to compensate system pull
currents that do not match the given limit values.
VDDP
Pullup
Pulldown
VSS
MC_XC2X_PULL
Figure 13
Data Sheet
Pullup/Pulldown Current Definition
63
V2.1, 2011-07
XE162FM, XE162HM
XE166 Family / Base Line
Electrical Parameters
4.2.1
DC Parameters
Keeping signal levels within the limits specified in this table ensures operation without
overload conditions. For signal levels outside these specifications, also refer to the
specification of the overload current IOV.
Note: Operating Conditions apply.
Table 13 is valid under the following conditions:
VDDP ≥ 4.5 V; VDDPtyp = 5 V; VDDP ≤ 5.5 V
Table 13
DC Characteristics for Upper Voltage Range
Parameter
Symbol
Values
Pin capacitance (digital
inputs/outputs). To be
doubled for double bond
pins.1)
CIO CC
Input Hysteresis2)
HYS CC 0.11 x
Unit
Note /
Test Condition
Min.
Typ.
Max.
−
−
10
pF
not subject to
production test
−
−
V
RS = 0 Ohm
VDDP
Absolute input leakage
current on pins of analog
ports3)
|IOZ1|
CC
−
10
200
nA
VIN > 0 V;
VIN < VDDP
Absolute input leakage
current for all other pins.
To be doubled for double
bond pins.3)1)4)
|IOZ2|
CC
−
0.2
5
μA
−
0.2
15
μA
TJ ≤ 110 °C;
VIN < VDDP;
VIN > VSS
TJ≤ 150 °C;
VIN < VDDP;
VIN > VSS
−
−
μA
6)
−
−
30
μA
6)
0.7 x
−
VDDP
V
Pull Level Force Current5) |IPLF| SR 250
Pull Level Keep Current7)
|IPLK|
SR
Input high voltage
(all except XTAL1)
VIH SR
Input low voltage
(all except XTAL1)
VIL SR
Output High voltage8)
VOH CC VDDP
VDDP
+ 0.3
−
-0.3
0.3 x
V
VDDP
−
−
V
IOH ≥ IOHmax
−
−
V
IOH ≥ IOHnom9)
- 1.0
VDDP
- 0.4
Data Sheet
64
V2.1, 2011-07
XE162FM, XE162HM
XE166 Family / Base Line
Electrical Parameters
Table 13
DC Characteristics for Upper Voltage Range (cont’d)
Parameter
Symbol
Values
Min.
Output Low Voltage8)
VOL CC
Typ.
Unit
Note /
Test Condition
IOL ≤ IOLmax
IOL ≤ IOLnom9)
Max.
−
−
1.0
V
−
−
0.4
V
1) Because each double bond pin is connected to two pads (standard pad and high-speed pad), it has twice the
normal value. For a list of affected pins refer to the pin definitions table in chapter 2.
2) Not subject to production test - verified by design/characterization. Hysteresis is implemented to avoid
metastable states and switching due to internal ground bounce. It cannot suppress switching due to external
system noise under all conditions.
3) If the input voltage exceeds the respective supply voltage due to ground bouncing (VIN < VSS) or supply ripple
(VIN > VDDP), a certain amount of current may flow through the protection diodes. This current adds to the
leakage current. An additional error current (IINJ) will flow if an overload current flows through an adjacent pin.
Please refer to the definition of the overload coupling factor KOV.
4) The given values are worst-case values. In production test, this leakage current is only tested at 125 °C; other
values are ensured by correlation. For derating, please refer to the following descriptions: Leakage derating
depending on temperature (TJ = junction temperature [°C]): IOZ = 0.05 x e(1.5 + 0.028 x TJ>) [μA]. For example, at
a temperature of 95 °C the resulting leakage current is 3.2 μA. Leakage derating depending on voltage level
(DV = VDDP - VPIN [V]): IOZ = IOZtempmax - (1.6 x DV) (μA]. This voltage derating formula is an approximation
which applies for maximum temperature.
5) Drive the indicated minimum current through this pin to change the default pin level driven by the enabled pull
device: VPIN ≤ VILmax for a pullup; VPIN ≥ VIHmin for a pulldown.
6) These values apply to the fixed pull-devices in dedicated pins and to the user-selectable pull-devices in
general purpose IO pins.
7) Limit the current through this pin to the indicated value so that the enabled pull device can keep the default
pin level: VPIN ≥ VIHmin for a pullup; VPIN ≤ VILmax for a pulldown.
8) The maximum deliverable output current of a port driver depends on the selected output driver mode. This
specification is not valid for outputs which are switched to open drain mode. In this case the respective output
will float and the voltage is determined by the external circuit.
9) As a rule, with decreasing output current the output levels approach the respective supply level (VOL->VSS,
VOH->VDDP). However, only the levels for nominal output currents are verified.
Data Sheet
65
V2.1, 2011-07
XE162FM, XE162HM
XE166 Family / Base Line
Electrical Parameters
4.2.2
DC Parameters for Lower Voltage Area
Keeping signal levels within the limits specified in this table ensures operation without
overload conditions. For signal levels outside these specifications, also refer to the
specification of the overload current IOV.
Note: Operating Conditions apply.
Table 14 is valid under the following conditions:
VDDP ≥ 3.0 V; VDDPtyp = 3.3 V; VDDP ≤ 4.5 V
Table 14
DC Characteristics for Lower Voltage Range
Parameter
Symbol
Values
Pin capacitance (digital
inputs/outputs). To be
doubled for double bond
pins.1)
CIO CC
Input Hysteresis2)
HYS CC 0.07 x
Unit
Note /
Test Condition
Min.
Typ.
Max.
−
−
10
pF
not subject to
production test
−
−
V
RS = 0 Ohm
VDDP
Absolute input leakage
current on pins of analog
ports3)
|IOZ1|
CC
−
10
200
nA
VIN > VSS;
VIN < VDDP
Absolute input leakage
current for all other pins.
To be doubled for double
bond pins.3)1)4)
|IOZ2|
CC
−
0.2
2.5
μA
−
0.2
8
μA
TJ ≤ 110 °C;
VIN < VDDP;
VIN > VSS
TJ ≤ 150 °C;
VIN < VDDP;
VIN > VSS
−
−
−
−
10
μA
0.7 x
−
VDDP
V
Pull Level Force Current5) |IPLF| SR 150
Pull Level Keep Current7)
|IPLK|
SR
Input high voltage
(all except XTAL1)
VIH SR
Input low voltage
(all except XTAL1)
VIL SR
Output High voltage8)
VOH CC VDDP
VDDP
6)
+ 0.3
−
-0.3
6)
0.3 x
V
VDDP
−
−
V
IOH ≥ IOHmax
−
−
V
IOH ≥ IOHnom9)
- 1.0
VDDP
- 0.4
Data Sheet
66
V2.1, 2011-07
XE162FM, XE162HM
XE166 Family / Base Line
Electrical Parameters
Table 14
DC Characteristics for Lower Voltage Range (cont’d)
Parameter
Symbol
Values
Min.
Output Low Voltage8)
VOL CC
Typ.
Unit
Note /
Test Condition
IOL ≤ IOLmax
IOL ≤ IOLnom10)
Max.
−
−
1.0
V
−
−
0.4
V
1) Because each double bond pin is connected to two pads (standard pad and high-speed pad), it has twice the
normal value. For a list of affected pins refer to the pin definitions table in chapter 2.
2) Not subject to production test - verified by design/characterization. Hysteresis is implemented to avoid
metastable states and switching due to internal ground bounce. It cannot suppress switching due to external
system noise under all conditions.
3) If the input voltage exceeds the respective supply voltage due to ground bouncing (VIN < VSS) or supply ripple
(VIN > VDDP), a certain amount of current may flow through the protection diodes. This current adds to the
leakage current. An additional error current (IINJ) will flow if an overload current flows through an adjacent pin.
Please refer to the definition of the overload coupling factor KOV.
4) The given values are worst-case values. In production test, this leakage current is only tested at 125 °C; other
values are ensured by correlation. For derating, please refer to the following descriptions: Leakage derating
depending on temperature (TJ = junction temperature [°C]): IOZ = 0.05 x e(1.5 + 0.028 x TJ>) [μA]. For example, at
a temperature of 95 °C the resulting leakage current is 3.2 μA. Leakage derating depending on voltage level
(DV = VDDP - VPIN [V]): IOZ = IOZtempmax - (1.6 x DV) (μA]. This voltage derating formula is an approximation
which applies for maximum temperature.
5) Drive the indicated minimum current through this pin to change the default pin level driven by the enabled pull
device: VPIN <= VIL for a pullup; VPIN >= VIH for a pulldown.
6) These values apply to the fixed pull-devices in dedicated pins and to the user-selectable pull-devices in
general purpose IO pins.
7) Limit the current through this pin to the indicated value so that the enabled pull device can keep the default
pin level: VPIN >= VIH for a pullup; VPIN <= VIL for a pulldown.
8) The maximum deliverable output current of a port driver depends on the selected output driver mode. This
specification is not valid for outputs which are switched to open drain mode. In this case the respective output
will float and the voltage is determined by the external circuit.
9) As a rule, with decreasing output current the output levels approach the respective supply level (VOL->VSS,
VOH->VDDP). However, only the levels for nominal output currents are verified.
10) As a rule, with decreasing output current the output levels approach the respective supply level (VOL->VSS,
VOH->VDDP). However, only the levels for nominal output currents are verified.
Data Sheet
67
V2.1, 2011-07
XE162FM, XE162HM
XE166 Family / Base Line
Electrical Parameters
4.2.3
Power Consumption
The power consumed by the XE162xM depends on several factors such as supply
voltage, operating frequency, active circuits, and operating temperature. The power
consumption specified here consists of two components:
•
•
The switching current IS depends on the device activity
The leakage current ILK depends on the device temperature
To determine the actual power consumption, always both components, switching current
IS and leakage current ILK must be added:
IDDP = IS + ILK.
Note: The power consumption values are not subject to production test. They are
verified by design/characterization.
To determine the total power consumption for dimensioning the external power
supply, also the pad driver currents must be considered.
The given power consumption parameters and their values refer to specific operating
conditions:
•
•
Active mode:
Regular operation, i.e. peripherals are active, code execution out of Flash.
Stopover mode:
Crystal oscillator and PLL stopped, Flash switched off, clock in domain DMP_1
stopped.
Note: The maximum values cover the complete specified operating range of all
manufactured devices.
The typical values refer to average devices under typical conditions, such as
nominal supply voltage, room temperature, application-oriented activity.
After a power reset, the decoupling capacitors for VDDIM and VDDI1 are charged with
the maximum possible current.
For additional information, please refer to Section 5.2, Thermal Considerations.
Note: Operating Conditions apply.
Table 15
Parameter
Switching Power Consumption
Symbol
ISACT
Power supply current
(active) with all peripherals CC
active and EVVRs on
Values
Min.
Typ.
Max.
−
10 +
0.6 x
10 +
1.0 x
fSYS1)
fSYS1)
0.7
2.0
Power supply current in
ISSO CC −
stopover mode, EVVRs on
Unit
Note /
Test Condition
mA
2)3)
mA
1) fSYS in MHz.
Data Sheet
68
V2.1, 2011-07
XE162FM, XE162HM
XE166 Family / Base Line
Electrical Parameters
2) The pad supply voltage pins (VDDPB) provide the input current for the on-chip EVVRs and the current
consumed by the pin output drivers. A small current is consumed because the drivers input stages are
switched.
In Fast Startup Mode (with the Flash modules deactivated), the typical current is reduced to 3 + 0.6 x fSYS.
3) Please consider the additional conditions described in section "Active Mode Power Supply Current".
Active Mode Power Supply Current
The actual power supply current in active mode not only depends on the system
frequency but also on the configuration of the XE162xM’s subsystem.
Besides the power consumed by the device logic the power supply pins also provide the
current that flows through the pin output drivers.
A small current is consumed because the drivers’ input stages are switched.
The IO power domains can be supplied separately. Power domain A (VDDPA) supplies the
A/D converters and Port 6. Power domain B (VDDPB) supplies the on-chip EVVRs and all
other ports.
During operation domain A draws a maximum current of 1.5 mA for each active A/D
converter module from VDDPA.
In Fast Startup Mode (with the Flash modules deactivated), the typical current is reduced
to (3 + 0.6×fSYS) mA.
Data Sheet
69
V2.1, 2011-07
XE162FM, XE162HM
XE166 Family / Base Line
Electrical Parameters
IS [mA]
100
ISACTmax
90
80
70
ISACTtyp
60
50
40
30
20
10
20
40
60
80
fSYS [MHz]
MC_XC2XM_IS
Figure 14
Supply Current in Active Mode as a Function of Frequency
Note: Operating Conditions apply.
Data Sheet
70
V2.1, 2011-07
XE162FM, XE162HM
XE166 Family / Base Line
Electrical Parameters
Table 16
Leakage Power Consumption
Parameter
Leakage supply current
(DMP_1 powered)1)
Symbol
ILK1 CC
Values
Unit
Note /
Test Condition
0.05
mA
0.5
1.3
mA
−
2.1
6.2
mA
−
4.4
13.7
mA
TJ= 25 °C1)
TJ= 85 °C1)
TJ= 125 °C1)
TJ= 150 °C1)
Min.
Typ.
Max.
−
0.03
−
1) All inputs (including pins configured as inputs) are set at 0 V to 0.1 V or at VDDP - 0.1 V to VDDP and all outputs
(including pins configured as outputs) are disconnected.
Note: A fraction of the leakage current flows through domain DMP_A (pin VDDPA). This
current can be calculated as 7 000 × e-α, with α = 5 000 / (273 + 1.3×TJ).
For TJ = 150°C, this results in a current of 160 μA.
The leakage power consumption can be calculated according to the following formulas:
ILK0 = 500 000 × e-α, with α = 3 000 / (273 + B×TJ)
Parameter B must be replaced by
•
•
1.0 for typical values
1.6 for maximum values
ILK1 = 600 000 × e-α, with α = 5 000 / (273 + B×TJ)
Parameter B must be replaced by
•
•
1.0 for typical values
1.3 for maximum values
Data Sheet
71
V2.1, 2011-07
XE162FM, XE162HM
XE166 Family / Base Line
Electrical Parameters
ILK [mA]
14
ILK1max
12
10
8
6
ILK1typ
4
2
-50
0
100
50
125
150
TJ [°C]
MC_XY_ILKN
Figure 15
Leakage Supply Current as a Function of Temperature
Data Sheet
72
V2.1, 2011-07
XE162FM, XE162HM
XE166 Family / Base Line
Electrical Parameters
4.3
Analog/Digital Converter Parameters
These parameters describe the conditions for optimum ADC performance.
Note: Operating Conditions apply.
Table 17
ADC Parameters
Parameter
Symbol
Switched capacitance at
an analog input
CAINSW
Values
Unit
Note /
Test Condition
Min.
Typ.
Max.
−
4
5
pF
not subject to
production
test1)
−
10
12
pF
not subject to
production
test1)
7
9
pF
not subject to
production
test1)
−
13
15
pF
not subject to
production
test1)
CC
CAINT
Total capacitance at an
analog input
CC
Switched capacitance at
the reference input
CC
CAREFSW −
Total capacitance at the
reference input
CAREFT
Differential Non-Linearity
Error
|EADNL|
CC
−
0.8
1.0
LSB
not subject to
production test
Gain Error
|EAGAIN| −
CC
0.4
0.8
LSB
not subject to
production test
Integral Non-Linearity
|EAINL|
CC
−
0.8
1.2
LSB
not subject to
production test
Offset Error
|EAOFF|
CC
−
0.5
0.8
LSB
not subject to
production test
Analog clock frequency
fADCI SR 0.5
−
20
MHz Upper voltage
range
0.5
−
16.5
MHz Lower voltage
range
CC
Input resistance of the
selected analog channel
RAIN CC −
−
2
kOh
m
not subject to
production
test1)
Input resistance of the
reference input
RAREF
−
−
2
kOh
m
not subject to
production
test1)
Data Sheet
CC
73
V2.1, 2011-07
XE162FM, XE162HM
XE166 Family / Base Line
Electrical Parameters
Table 17
ADC Parameters (cont’d)
Parameter
Symbol
Values
Min.
Unit
Typ.
Max.
Broken wire detection
delay against VAGND2)
tBWG CC −
−
50
3)
Broken wire detection
delay against VAREF2)
tBWR CC −
−
50
4)
Conversion time for 8-bit
result2)
tc8 CC
(11 + STC) x tADCI
+ 2 x tSYS
Conversion time for 10-bit tc10 CC
result2)
(13 + STC) x tADCI
+ 2 x tSYS
Total Unadjusted Error
−
1
2
LSB
Wakeup time from analog tWAF CC −
powerdown, fast mode2)
−
4
μs
Wakeup time from analog tWAS CC −
powerdown, slow mode2)
−
15
μs
−
1.5
V
Analog reference ground
|TUE|
CC
Note /
Test Condition
VAGND
VSS
SR
- 0.05
5)
Analog input voltage
range
VAIN SR VAGND
−
VAREF
V
6)
Analog reference voltage
VAREF
VAGND
−
VDDPA
V
5)
SR
+ 1.0
+ 0.05
1) These parameter values cover the complete operating range. Under relaxed operating conditions (room
temperature, nominal supply voltage) the typical values can be used for calculation.
2) This parameter includes the sample time (also the additional sample time specified by STC), the time to
determine the digital result and the time to load the result register with the conversion result. Values for the
basic clock tADCI depend on programming.
3) The broken wire detection delay against VAGND is measured in numbers of consecutive precharge cycles at a
conversion rate of not more than 500 µs. Result below 10% (66H).
4) The broken wire detection delay against VAREF is measured in numbers of consecutive precharge cycles at a
conversion rate of not more than 10 µs. This function is influenced by leakage current, in particular at high
temperature. Result above 80% (332H).
5) TUE is tested at VAREF = VDDPA = 5.0 V, VAGND = 0 V. It is verified by design for all other voltages within the
defined voltage range. The specified TUE is valid only if the absolute sum of input overload currents on analog
port pins (see IOV specification) does not exceed 10 mA, and if VAREF and VAGND remain stable during the
measurement time.
6) VAIN may exceed VAGND or VAREF up to the absolute maximum ratings. However, the conversion result in these
cases will be X000H or X3FFH, respectively.
Data Sheet
74
V2.1, 2011-07
XE162FM, XE162HM
XE166 Family / Base Line
Electrical Parameters
RSource
V AIN
R AIN, On
C AINT - C AINS
C Ext
A/D Converter
CAINS
MCS05570
Figure 16
Data Sheet
Equivalent Circuitry for Analog Inputs
75
V2.1, 2011-07
XE162FM, XE162HM
XE166 Family / Base Line
Electrical Parameters
Sample time and conversion time of the XE162xM’s A/D converters are programmable.
The timing above can be calculated using Table 18.
The limit values for fADCI must not be exceeded when selecting the prescaler value.
Table 18
A/D Converter Computation Table
GLOBCTR.5-0
(DIVA)
A/D Converter
Analog Clock fADCI
INPCRx.7-0
(STC)
000000B
fSYS
fSYS / 2
fSYS / 3
fSYS / (DIVA+1)
fSYS / 63
fSYS / 64
00H
000001B
000010B
:
111110B
111111B
01H
02H
:
FEH
FFH
Sample Time1)
tS
tADCI × 2
tADCI × 3
tADCI × 4
tADCI × (STC+2)
tADCI × 256
tADCI × 257
1) The selected sample time is doubled if broken wire detection is active (due to the presampling phase).
Converter Timing Example A:
Assumptions:
Analog clock
Sample time
fSYS
fADCI
tS
= 80 MHz (i.e. tSYS = 12.5 ns), DIVA = 03H, STC = 00H
= fSYS / 4 = 20 MHz, i.e. tADCI = 50 ns
= tADCI × 2 = 100 ns
Conversion 10-bit:
tC10
= 13 × tADCI + 2 × tSYS = 13 × 50 ns + 2 × 12.5 ns = 0.675 μs
Conversion 8-bit:
tC8
= 11 × tADCI + 2 × tSYS = 11 × 50 ns + 2 × 12.5 ns = 0.575 μs
Converter Timing Example B:
Assumptions:
Analog clock
Sample time
fSYS
fADCI
tS
= 40 MHz (i.e. tSYS = 25 ns), DIVA = 02H, STC = 03H
= fSYS / 3 = 13.3 MHz, i.e. tADCI = 75 ns
= tADCI × 5 = 375 ns
Conversion 10-bit:
tC10
= 16 × tADCI + 2 × tSYS = 16 × 75 ns + 2 × 25 ns = 1.25 μs
Conversion 8-bit:
tC8
Data Sheet
= 14 × tADCI + 2 × tSYS = 14 × 75 ns + 2 × 25 ns = 1.10 μs
76
V2.1, 2011-07
XE162FM, XE162HM
XE166 Family / Base Line
Electrical Parameters
4.4
System Parameters
The following parameters specify several aspects which are important when integrating
the XE162xM into an application system.
Note: These parameters are not subject to production test but verified by design and/or
characterization.
Note: Operating Conditions apply.
Table 19
Various System Parameters
Parameter
Symbol
Values
Min.
Typ.
Max.
Unit
Note /
Test Condition
ΔTJ ≤ 10 °C
Short-term deviation of
internal clock source
frequency1)
ΔfINT CC -1
−
1
%
Internal clock source
frequency
fINT CC
4.8
5.0
5.2
MHz
Wakeup clock source
frequency2)
fWU CC
400
−
700
kHz
FREQSEL= 00
210
−
390
kHz
FREQSEL= 01
140
−
260
kHz
FREQSEL= 10
110
−
200
kHz
FREQSEL= 11
2.2
2.7
ms
fWU = 500 kHz
−
12 /
μs
Startup time from poweron with code execution
from Flash
tSPO CC 1.8
Startup time from stopover tSSO CC 11 /
fWU3)
mode with code execution
from PSRAM
Core voltage (PVC)
supervision level
VPVC CC VLV
fWU3)
VLV
- 0.03
VLV
V
5)
V
Lower voltage
range5)
V
Upper voltage
range5)
+ 0.07
4)
Supply watchdog (SWD)
supervision level
VSWD
CC
VLV
- 0.106)
VLV
VLV
+ 0.15
VLV
- 0.15
VLV
VLV
+ 0.15
1) The short-term frequency deviation refers to a timeframe of a few hours and is measured relative to the current
frequency at the beginning of the respective timeframe. This parameter is useful to determine a time span for
re-triggering a LIN synchronization.
2) This parameter is tested for the fastest and the slowest selection. The medium selections are not subject to
production test - verified by design/characterization
Data Sheet
77
V2.1, 2011-07
XE162FM, XE162HM
XE166 Family / Base Line
Electrical Parameters
3) fWU in MHz
4) This value includes a hysteresis of approximately 50 mV for rising voltage.
5) VLV = selected SWD voltage level
6) The limit VLV - 0.10 V is valid for the OK1 level. The limit for the OK2 level is VLV - 0.15 V.
Conditions for tSPO Timing Measurement
The time required for the transition from Power-On to Base mode is called tSPO. It is
measured under the following conditions:
Precondition: The pad supply is valid, i.e. VDDPB is above 3.0 V and remains above 3.0 V
even though the XE162xM is starting up. No debugger is attached.
Start condition: Power-on reset is removed (PORST = 1).
End condition: External pin toggle caused by first user instruction executed from FLASH
after startup.
Conditions for tSSO Timing Measurement
The time required for the transition from Stopover to Stopover Waked-Up mode is
called tSSO. It is measured under the following conditions:
Precondition: The Stopover mode has been entered using the procedure defined in the
Programmer’s Guide.
Start condition: Pin toggle on ESR pin triggering the startup sequence.
End condition: External pin toggle caused by first user instruction executed from PSRAM
after startup.
Coding of bit fields LEVxV in SWD and PVC Configuration Registers
Table 20
Coding of bit fields LEVxV in Register SWDCON0
Code
Default Voltage Level
0000B
2.9 V
0001B
3.0 V
0010B
3.1 V
0011B
3.2 V
0100B
3.3 V
0101B
3.4 V
0110B
3.6 V
0111B
4.0 V
1000B
4.2 V
Data Sheet
Notes1)
LEV1V: reset request
78
V2.1, 2011-07
XE162FM, XE162HM
XE166 Family / Base Line
Electrical Parameters
Table 20
Coding of bit fields LEVxV in Register SWDCON0 (cont’d)
Code
Default Voltage Level
Notes1)
1001B
4.5 V
LEV2V: no request
1010B
4.6 V
1011B
4.7 V
1100B
4.8 V
1101B
4.9 V
1110B
5.0 V
1111B
5.5 V
1) The indicated default levels are selected automatically after a power reset.
Table 21
Coding of Bitfields LEVxV in Registers PVCyCONz
Notes1)
Code
Default Voltage Level
000B
0.95 V
001B
1.05 V
010B
1.15 V
011B
1.25 V
100B
1.35 V
LEV1V: reset request
101B
1.45 V
LEV2V: interrupt request2)
110B
1.55 V
111B
1.65 V
1) The indicated default levels are selected automatically after a power reset.
2) Due to variations of the tolerance of both the Embedded Voltage Regulators (EVR) and the PVC levels, this
interrupt can be triggered inadvertently, even though the core voltage is within the normal range. It is,
therefore, recommended not to use the this warning level.
Data Sheet
79
V2.1, 2011-07
XE162FM, XE162HM
XE166 Family / Base Line
Electrical Parameters
4.5
Flash Memory Parameters
The XE162xM is delivered with all Flash sectors erased and with no protection installed.
The data retention time of the XE162xM’s Flash memory (i.e. the time after which stored
data can still be retrieved) depends on the number of times the Flash memory has been
erased and programmed.
Note: These parameters are not subject to production test but verified by design and/or
characterization.
Note: Operating Conditions apply.
Table 22
Flash Parameters
Parameter
Symbol
Values
Min.
Unit
Typ.
Max.
NPP SR −
−
41)
−
−
12)
Flash erase endurance for NSEC SR 10
security pages
−
−
Flash wait states3)
NWSFLAS 1
−
−
H SR
2
−
−
3
−
−
4
−
Parallel Flash module
program/erase limit
depending on Flash read
activity
NFL_RD ≤ 1,
fSYS ≤ 80 MHz
NFL_RD > 1
cycle tRET ≥ 20 years
s
fSYS ≤ 8 MHz
fSYS ≤ 13 MHz
fSYS ≤ 17 MHz
fSYS > 17 MHz
−
Erase time per
sector/page
tER CC
−
7
8.0
ms
Programming time per
page
tPR CC
−
34)
3.5
ms
Data retention time
tRET CC 20
−
−
year
s
Drain disturb limit
NDD SR 32
−
−
cycle
s
Data Sheet
80
4)
Note /
Test Condition
NEr ≤ 1 000
cycles
V2.1, 2011-07
XE162FM, XE162HM
XE166 Family / Base Line
Electrical Parameters
Table 22
Flash Parameters (cont’d)
Parameter
Number of erase cycles
Symbol
NEr SR
Values
Unit
Note /
Test Condition
Min.
Typ.
Max.
−
−
15 000 cycle tRET ≥ 5 years;
s
Valid for up to
64 userselected
sectors (data
storage)
−
−
1 000
cycle tRET ≥ 20 years
s
1) All Flash module(s) can be erased/programmed while code is executed and/or data is read from only one
Flash module or from PSRAM. The Flash module that delivers code/data can, of course, not be
erased/programmed.
2) Flash module 3 can be erased/programmed while code is executed and/or data is read from any other Flash
module.
3) Value of IMB_IMBCTRL.WSFLASH.
4) Programming and erase times depend on the internal Flash clock source. The control state machine needs a
few system clock cycles. This increases the stated durations noticably only at extremely low system clock
frequencies.
Access to the XE162xM Flash modules is controlled by the IMB. Built-in prefetch
mechanisms optimize the performance for sequential access.
Flash access waitstates only affect non-sequential access. Due to prefetch
mechanisms, the performance for sequential access (depending on the software
structure) is only partially influenced by waitstates.
Data Sheet
81
V2.1, 2011-07
XE162FM, XE162HM
XE166 Family / Base Line
Electrical Parameters
4.6
AC Parameters
These parameters describe the dynamic behavior of the XE162xM.
4.6.1
Testing Waveforms
These values are used for characterization and production testing (except pin XTAL1).
Output delay
Output delay
Hold time
Hold time
0.8 V DDP
0.7 V DDP
Input Signal
(driven by tester)
0.3 V DDP
0.2 V DDP
Output Signal
(measured)
Output timings refer to the rising edge of CLKOUT.
Input timings are calculated from the time, when the input signal reaches
V IH or V IL, respectively.
MCD05556C
Figure 17
Input Output Waveforms
VLoad + 0.1 V
V OH - 0.1 V
Timing
Reference
Points
V Load - 0.1 V
V OL + 0.1 V
For timing purposes a port pin is no longer floating when a 100 mV
change from load voltage occurs, but begins to float when a 100 mV
change from the loaded V OH /V OL level occurs (IOH / IOL = 20 mA).
MCA05565
Figure 18
Data Sheet
Floating Waveforms
82
V2.1, 2011-07
XE162FM, XE162HM
XE166 Family / Base Line
Electrical Parameters
4.6.2
Definition of Internal Timing
The internal operation of the XE162xM is controlled by the internal system clock fSYS.
Because the system clock signal fSYS can be generated from a number of internal and
external sources using different mechanisms, the duration of the system clock periods
(TCSs) and their variation (as well as the derived external timing) depend on the
mechanism used to generate fSYS. This must be considered when calculating the timing
for the XE162xM.
Phase Locked Loop Operation (1:N)
fI N
f SYS
TCS
Direct Clock Drive (1:1)
fI N
f SYS
TCS
Prescaler Operation (N:1)
fI N
f SYS
TCS
M C_XC2X_CLOCKGEN
Figure 19
Generation Mechanisms for the System Clock
Note: The example of PLL operation shown in Figure 19 uses a PLL factor of 1:4; the
example of prescaler operation uses a divider factor of 2:1.
The specification of the external timing (AC Characteristics) depends on the period of the
system clock (TCS).
Data Sheet
83
V2.1, 2011-07
XE162FM, XE162HM
XE166 Family / Base Line
Electrical Parameters
Direct Drive
When direct drive operation is selected (SYSCON0.CLKSEL = 11B), the system clock is
derived directly from the input clock signal CLKIN1:
fSYS = fIN.
The frequency of fSYS is the same as the frequency of fIN. In this case the high and low
times of fSYS are determined by the duty cycle of the input clock fIN.
Selecting Bypass Operation from the XTAL11) input and using a divider factor of 1 results
in a similar configuration.
Prescaler Operation
When prescaler operation is selected (SYSCON0.CLKSEL = 10B, PLLCON0.VCOBY =
1B), the system clock is derived either from the crystal oscillator (input clock signal
XTAL1) or from the internal clock source through the output prescaler K1 (= K1DIV+1):
fSYS = fOSC / K1.
If a divider factor of 1 is selected, the frequency of fSYS equals the frequency of fOSC. In
this case the high and low times of fSYS are determined by the duty cycle of the input
clock fOSC (external or internal).
The lowest system clock frequency results from selecting the maximum value for the
divider factor K1:
fSYS = fOSC / 1024.
4.6.2.1
Phase Locked Loop (PLL)
When PLL operation is selected (SYSCON0.CLKSEL = 10B, PLLCON0.VCOBY = 0B),
the on-chip phase locked loop is enabled and provides the system clock. The PLL
multiplies the input frequency by the factor F (fSYS = fIN × F).
F is calculated from the input divider P (= PDIV+1), the multiplication factor N (=
NDIV+1), and the output divider K2 (= K2DIV+1):
(F = N / (P × K2)).
The input clock can be derived either from an external source at XTAL1 or from the onchip clock source.
The PLL circuit synchronizes the system clock to the input clock. This synchronization is
performed smoothly so that the system clock frequency does not change abruptly.
Adjustment to the input clock continuously changes the frequency of fSYS so that it is
locked to fIN. The slight variation causes a jitter of fSYS which in turn affects the duration
of individual TCSs.
1) Voltages on XTAL1 must comply to the core supply voltage VDDIM.
Data Sheet
84
V2.1, 2011-07
XE162FM, XE162HM
XE166 Family / Base Line
Electrical Parameters
The timing in the AC Characteristics refers to TCSs. Timing must be calculated using the
minimum TCS possible under the given circumstances.
The actual minimum value for TCS depends on the jitter of the PLL. Because the PLL is
constantly adjusting its output frequency to correspond to the input frequency (from
crystal or oscillator), the accumulated jitter is limited. This means that the relative
deviation for periods of more than one TCS is lower than for a single TCS (see formulas
and Figure 20).
This is especially important for bus cycles using waitstates and for the operation of
timers, serial interfaces, etc. For all slower operations and longer periods (e.g. pulse train
generation or measurement, lower baudrates, etc.) the deviation caused by the PLL jitter
is negligible.
The value of the accumulated PLL jitter depends on the number of consecutive VCO
output cycles within the respective timeframe. The VCO output clock is divided by the
output prescaler K2 to generate the system clock signal fSYS. The number of VCO cycles
is K2 × T, where T is the number of consecutive fSYS cycles (TCS).
The maximum accumulated jitter (long-term jitter) DTmax is defined by:
DTmax [ns] = ±(220 / (K2 × fSYS) + 4.3)
This maximum value is applicable, if either the number of clock cycles T > (fSYS / 1.2) or
the prescaler value K2 > 17.
In all other cases for a timeframe of T × TCS the accumulated jitter DT is determined by:
DT [ns] = DTmax × [(1 - 0.058 × K2) × (T - 1) / (0.83 × fSYS - 1) + 0.058 × K2]
fSYS in [MHz] in all formulas.
Example, for a period of 3 TCSs @ 33 MHz and K2 = 4:
Dmax = ±(220 / (4 × 33) + 4.3) = 5.97 ns (Not applicable directly in this case!)
D3 = 5.97 × [(1 - 0.058 × 4) × (3 - 1) / (0.83 × 33 - 1) + 0.058 × 4]
= 5.97 × [0.768 × 2 / 26.39 + 0.232]
= 1.7 ns
Example, for a period of 3 TCSs @ 33 MHz and K2 = 2:
Dmax = ±(220 / (2 × 33) + 4.3) = 7.63 ns (Not applicable directly in this case!)
D3 = 7.63 × [(1 - 0.058 × 2) × (3 - 1) / (0.83 × 33 - 1) + 0.058 × 2]
= 7.63 × [0.884 × 2 / 26.39 + 0.116]
= 1.4 ns
Data Sheet
85
V2.1, 2011-07
XE162FM, XE162HM
XE166 Family / Base Line
Electrical Parameters
Acc. jitter DT
ns
±9
fSYS = 33 MHz fSYS = 66 MHz
fVCO = 66 MHz
±8
±7
f VCO = 132 MHz
±6
±5
±4
±3
±2
±1
Cycles T
0
1
20
40
60
80
100
MC_XC2X_JITTER
Figure 20
Approximated Accumulated PLL Jitter
Note: The specified PLL jitter values are valid if the capacitive load per pin does not
exceed CL = 20 pF.
The maximum peak-to-peak noise on the pad supply voltage (measured between
VDDPB pin 100 and VSS pin 1) is limited to a peak-to-peak voltage of VPP = 50 mV.
This can be achieved by appropriate blocking of the supply voltage as close as
possible to the supply pins and using PCB supply and ground planes.
Data Sheet
86
V2.1, 2011-07
XE162FM, XE162HM
XE166 Family / Base Line
Electrical Parameters
PLL frequency band selection
Different frequency bands can be selected for the VCO so that the operation of the PLL
can be adjusted to a wide range of input and output frequencies:
Table 23
System PLL Parameters
Parameter
Symbol
Values
Min.
Unit
Typ.
Max.
−
110
Note /
Test Condition
VCO output frequency
(VCO controlled)
fVCO CC 50
−
160
MHz VCOSEL = 01B
VCO output frequency
(VCO free-running)
fVCO CC 10
−
40
MHz VCOSEL = 00B
20
−
80
MHz VCOSEL = 01B
4.6.2.2
100
MHz VCOSEL = 00B
Wakeup Clock
When wakeup operation is selected (SYSCON0.CLKSEL = 00B), the system clock is
derived from the low-frequency wakeup clock source:
fSYS = fWU.
In this mode, a basic functionality can be maintained without requiring an external clock
source and while minimizing the power consumption.
4.6.2.3
Selecting and Changing the Operating Frequency
When selecting a clock source and the clock generation method, the required
parameters must be carefully written to the respective bit fields, to avoid unintended
intermediate states.
Many applications change the frequency of the system clock (fSYS) during operation in
order to optimize system performance and power consumption. Changing the operating
frequency also changes the switching currents, which influences the power supply.
To ensure proper operation of the on-chip EVRs while they generate the core voltage,
the operating frequency shall only be changed in certain steps. This prevents overshoots
and undershoots of the supply voltage.
To avoid the indicated problems, recommended sequences are provided which ensure
the intended operation of the clock system interacting with the power system.
Please refer to the Programmer’s Guide.
Data Sheet
87
V2.1, 2011-07
XE162FM, XE162HM
XE166 Family / Base Line
Electrical Parameters
4.6.3
External Clock Input Parameters
These parameters specify the external clock generation for the XE162xM. The clock can
be generated in two ways:
•
•
By connecting a crystal or ceramic resonator to pins XTAL1/XTAL2
By supplying an external clock signal
– This clock signal can be supplied either to pin XTAL1 (core voltage domain) or to
pin CLKIN1 (IO voltage domain)
If connected to CLKIN1, the input signal must reach the defined input levels VIL and VIH.
If connected to XTAL1, a minimum amplitude VAX1 (peak-to-peak voltage) is sufficient for
the operation of the on-chip oscillator.
Note: The given clock timing parameters (t1 … t4) are only valid for an external clock
input signal.
Note: Operating Conditions apply.
Table 24
External Clock Input Characteristics
Parameter
Symbol
Values
Min.
Oscillator frequency
XTAL1 input current
absolute value
XTAL11)
Note /
Test Condition
Typ.
Max.
fOSC SR 4
−
40
MHz Input = clock
signal
4
−
16
MHz Input = crystal
or ceramic
resonator
−
−
20
μA
6
−
−
ns
6
−
−
ns
−
−
8
ns
−
−
8
ns
0.3 x
−
−
V
4 to 16 MHz
−
−
V
16 to 25 MHz
−
−
V
25 to 40 MHz
−
1.7
V
2)
|IIL| CC
t1 SR
Input clock low time
t2 SR
t3 SR
Input clock rise time
Input clock fall time
t4 SR
Input voltage amplitude on VAX1 SR
Input clock high time
Unit
VDDIM
0.4 x
VDDIM
0.5 x
VDDIM
Input voltage range limits
for signal on XTAL1
Data Sheet
VIX1 SR -1.7 +
VDDIM
88
V2.1, 2011-07
XE162FM, XE162HM
XE166 Family / Base Line
Electrical Parameters
1) The amplitude voltage VAX1 refers to the offset voltage VOFF. This offset voltage must be stable during the
operation and the resulting voltage peaks must remain within the limits defined by VIX1.
2) Overload conditions must not occur on pin XTAL1.
Note: For crystal or ceramic resonator operation, it is strongly recommended to measure
the oscillation allowance (negative resistance) in the final target system (layout) to
determine the optimum parameters for oscillator operation.
The manufacturers of crystals and ceramic resonators offer an oscillator
evaluation service. This evaluation checks the crystal/resonator specification
limits to ensure a reliable oscillator operation.
t1
VOFF
t3
0.9 V AX1
0.1 V AX1
VAX1
t2
t4
tOSC = 1/fOSC
MC_ EXTCLOCK
Figure 21
External Clock Drive XTAL1
Data Sheet
89
V2.1, 2011-07
XE162FM, XE162HM
XE166 Family / Base Line
Electrical Parameters
4.6.4
Pad Properties
The output pad drivers of the XE162xM can operate in several user-selectable modes.
Strong driver mode allows controlling external components requiring higher currents
such as power bridges or LEDs. Reducing the driving power of an output pad reduces
electromagnetic emissions (EME). In strong driver mode, selecting a slower edge
reduces EME.
The dynamic behavior, i.e. the rise time and fall time, depends on the applied external
capacitance that must be charged and discharged. Timing values are given for a
capacitance of 20 pF, unless otherwise noted.
In general, the performance of a pad driver depends on the available supply voltage
VDDP. The following table lists the pad parameters.
Note: These parameters are not subject to production test but verified by design and/or
characterization.
Note: Operating Conditions apply.
Data Sheet
90
V2.1, 2011-07
XE162FM, XE162HM
XE166 Family / Base Line
Electrical Parameters
Table 25 is valid under the following conditions:
VDDP ≥ 4.5 V; VDDPtyp = 5 V; VDDP ≤ 5.5 V; CL ≥ 20 pF; CL ≤ 100 pF;
Table 25
Standard Pad Parameters for Upper Voltage Range
Parameter
Symbol
Min.
Typ.
Max.
Maximum output driver
current (absolute value)1)
IOmax
−
−
CC
−
Nominal output driver
current (absolute value)
IOnom
CC
Rise and Fall times (10% - tRF CC
90%)
Values
Unit
Note /
Test Condition
10
mA
Strong driver
−
4.0
mA
Medium driver
−
−
0.5
mA
Weak driver
−
−
2.5
mA
Strong driver
−
−
1.0
mA
Medium driver
−
−
0.1
mA
Weak driver
−
−
4.2 +
0.14 x
ns
Strong driver;
Sharp edge
−
−
11.6 + ns
0.22 x
Strong driver;
Medium edge
−
−
−
−
CL
CL
20.6 + ns
0.22 x
Strong driver;
Slow edge
CL
23 +
0.6 x
ns
Medium driver
ns
Weak driver
CL
−
−
212 +
1.9 x
CL
1) The total output current that may be drawn at a given time must be limited to protect the supply rails from
damage. For any group of 16 neighboring output pins, the total output current in each direction (ΣIOL and ΣIOH) must remain below 50 mA.
Data Sheet
91
V2.1, 2011-07
XE162FM, XE162HM
XE166 Family / Base Line
Electrical Parameters
Table 26 is valid under the following conditions:
VDDP ≥ 3.0 V; VDDPtyp = 3.3 V; VDDP ≤ 4.5 V; CL ≥ 20 pF; CL ≤ 100 pF;
Table 26
Standard Pad Parameters for Lower Voltage Range
Parameter
Symbol
Min.
Typ.
Max.
Maximum output driver
current (absolute value)1)
IOmax
−
−
CC
−
Nominal output driver
current (absolute value)
IOnom
CC
Rise and Fall times (10% - tRF CC
90%)
Values
Unit
Note /
Test Condition
10
mA
Strong driver
−
2.5
mA
Medium driver
−
−
0.5
mA
Weak driver
−
−
2.5
mA
Strong driver
−
−
1.0
mA
Medium driver
−
−
0.1
mA
Weak driver
−
−
6.2 +
0.24 x
ns
Strong driver;
Sharp edge
−
−
ns
Strong driver;
Medium edge
−
−
ns
Strong driver;
Slow edge
−
−
ns
Medium driver
ns
Weak driver
CL
24 +
0.3 x
CL
34 +
0.3 x
CL
37 +
0.65 x
CL
−
−
500 +
2.5 x
CL
1) The total output current that may be drawn at a given time must be limited to protect the supply rails from
damage. For any group of 16 neighboring output pins, the total output current in each direction (ΣIOL and ΣIOH) must remain below 50 mA.
Data Sheet
92
V2.1, 2011-07
XE162FM, XE162HM
XE166 Family / Base Line
Electrical Parameters
4.6.5
Synchronous Serial Interface Timing
The following parameters are applicable for a USIC channel operated in SSC mode.
Note: These parameters are not subject to production test but verified by design and/or
characterization.
Note: Operating Conditions apply; CL = 20 pF.
Table 27
USIC SSC Master Mode Timing for Upper Voltage Range
Parameter
Symbol
Values
Unit
Min.
Typ.
Max.
Slave select output SELO t1 CC
active to first SCLKOUT
transmit edge
tSYS
−
−
ns
Slave select output SELO t2 CC
inactive after last
SCLKOUT receive edge
tSYS
−
−
ns
t3 CC
-6
−
9
ns
Receive data input setup t4 SR
time to SCLKOUT receive
edge
31
−
−
ns
t5 SR
-4
−
−
ns
Data output DOUT valid
time
Data input DX0 hold time
from SCLKOUT receive
edge
Note /
Test Condition
- 8 1)
- 6 1)
1) tSYS = 1 / fSYS
Table 28
USIC SSC Master Mode Timing for Lower Voltage Range
Parameter
Symbol
Values
Unit
Min.
Typ.
Max.
Slave select output SELO t1 CC
active to first SCLKOUT
transmit edge
tSYS
−
−
ns
Slave select output SELO t2 CC
inactive after last
SCLKOUT receive edge
tSYS
−
−
ns
-7
−
11
ns
Data output DOUT valid
time
Data Sheet
t3 CC
Note /
Test Condition
- 10 1)
- 9 1)
93
V2.1, 2011-07
XE162FM, XE162HM
XE166 Family / Base Line
Electrical Parameters
Table 28
USIC SSC Master Mode Timing for Lower Voltage Range (cont’d)
Parameter
Symbol
Values
Unit
Min.
Typ.
Max.
Receive data input setup t4 SR
time to SCLKOUT receive
edge
40
−
−
ns
t5 SR
-5
−
−
ns
Data input DX0 hold time
from SCLKOUT receive
edge
Note /
Test Condition
1) tSYS = 1 / fSYS
Table 29
USIC SSC Slave Mode Timing for Upper Voltage Range
Parameter
Symbol
Values
Unit
Min.
Typ.
Max.
t10 SR
7
−
−
ns
Select input DX2 hold after t11 SR
last clock input DX1
receive edge1)
7
−
−
ns
Receive data input setup
time to shift clock receive
edge1)
t12 SR
7
−
−
ns
Data input DX0 hold time
from clock input DX1
receive edge1)
t13 SR
5
−
−
ns
Data output DOUT valid
time
t14 CC
7
−
33
ns
Select input DX2 setup to
first clock input DX1
transmit edge1)
Note /
Test Condition
1) These input timings are valid for asynchronous input signal handling of slave select input, shift clock input, and
receive data input (bits DXnCR.DSEN = 0).
Data Sheet
94
V2.1, 2011-07
XE162FM, XE162HM
XE166 Family / Base Line
Electrical Parameters
Table 30
USIC SSC Slave Mode Timing for Lower Voltage Range
Parameter
Symbol
Values
Unit
Min.
Typ.
Max.
t10 SR
7
−
−
ns
Select input DX2 hold after t11 SR
last clock input DX1
receive edge1)
7
−
−
ns
Receive data input setup
time to shift clock receive
edge1)
t12 SR
7
−
−
ns
Data input DX0 hold time
from clock input DX1
receive edge1)
t13 SR
5
−
−
ns
Data output DOUT valid
time
t14 CC
8
−
41
ns
Select input DX2 setup to
first clock input DX1
transmit edge1)
Note /
Test Condition
1) These input timings are valid for asynchronous input signal handling of slave select input, shift clock input, and
receive data input (bits DXnCR.DSEN = 0).
Data Sheet
95
V2.1, 2011-07
XE162FM, XE162HM
XE166 Family / Base Line
Electrical Parameters
Master Mode Timing
t1
Select Output
SELOx
t2
Inactive
Inactive
Active
Clock Output
SCLKOUT
Receive
Edge
First Transmit
Edge
Last Receive
Edge
Transmit
Edge
t3
t3
Data Output
DOUT
t4
Data Input
DX0
t4
t5
Data
valid
t5
Data
valid
Slave Mode Timing
t10
Select Input
DX2
Clock Input
DX1
t11
Inactive
Inactive
Active
Receive
Edge
First Transmit
Edge
t12
Data Input
DX0
t12
t13
Data
valid
t 14
Last Receive
Edge
Transmit
Edge
t 13
Data
valid
t14
Data Output
DOUT
Transmit Edge: with this clock edge, transmit data is shifted to transmit data output.
Receive Edge: with this clock edge, receive data at receive data input is latched
.
Drawn for BRGH.SCLKCFG = 00B. Also valid for for SCLKCFG = 01B with inverted SCLKOUT signal.
USIC_SSC_TMGX.VSD
Figure 22
USIC - SSC Master/Slave Mode Timing
Note: This timing diagram shows a standard configuration where the slave select signal
is low-active and the serial clock signal is not shifted and not inverted.
Data Sheet
96
V2.1, 2011-07
XE162FM, XE162HM
XE166 Family / Base Line
Electrical Parameters
4.6.6
Debug Interface Timing
The debugger can communicate with the XE162xM either via the 2-pin DAP interface or
via the standard JTAG interface.
Debug via DAP
The following parameters are applicable for communication through the DAP debug
interface.
Note: These parameters are not subject to production test but verified by design and/or
characterization.
Note: Operating Conditions apply; CL= 20 pF.
Table 31
DAP Interface Timing for Upper Voltage Range
Parameter
DAP0 clock period
DAP0 high time
DAP0 low time
DAP0 clock rise time
DAP0 clock fall time
DAP1 setup to DAP0
rising edge
Symbol
t11 SR
t12 SR
t13 SR
t14 SR
t15 SR
t16 SR
Values
Unit
Note /
Test Condition
Min.
Typ.
Max.
251)
−
−
ns
8
−
−
ns
8
−
−
ns
−
−
4
ns
−
−
4
ns
6
−
−
ns
pad_type= stan
dard
DAP1 hold after DAP0
rising edge
t17 SR
6
−
−
ns
pad_type= stan
dard
DAP1 valid per DAP0
clock period2)
t19 CC
17
20
−
ns
pad_type= stan
dard
1) The debug interface cannot operate faster than the overall system, therefore t11 ≥ tSYS.
2) The Host has to find a suitable sampling point by analyzing the sync telegram response.
Data Sheet
97
V2.1, 2011-07
XE162FM, XE162HM
XE166 Family / Base Line
Electrical Parameters
Table 32
DAP Interface Timing for Lower Voltage Range
Parameter
Symbol
t11 SR
t12 SR
t13 SR
t14 SR
t15 SR
t16 SR
DAP0 clock period
DAP0 high time
DAP0 low time
DAP0 clock rise time
DAP0 clock fall time
DAP1 setup to DAP0
rising edge
Values
Unit
Note /
Test Condition
Min.
Typ.
Max.
251)
−
−
ns
8
−
−
ns
8
−
−
ns
−
−
4
ns
−
−
4
ns
6
−
−
ns
pad_type= stan
dard
DAP1 hold after DAP0
rising edge
t17 SR
6
−
−
ns
pad_type= stan
dard
DAP1 valid per DAP0
clock period2)
t19 CC
12
17
−
ns
pad_type= stan
dard
1) The debug interface cannot operate faster than the overall system, therefore t11 ≥ tSYS.
2) The Host has to find a suitable sampling point by analyzing the sync telegram response.
t 11
0.9 VDDP
0.5 VDDP
t15
t12
t 14
0.1 VDDP
t13
MC_DAP0
Figure 23
Data Sheet
Test Clock Timing (DAP0)
98
V2.1, 2011-07
XE162FM, XE162HM
XE166 Family / Base Line
Electrical Parameters
DAP0
t1 6
t1 7
DAP1
MC_ DAP1_RX
Figure 24
DAP Timing Host to Device
t1 1
DAP1
t1 9
MC_ DAP1_TX
Figure 25
DAP Timing Device to Host
Note: The transmission timing is determined by the receiving debugger by evaluating the
sync-request synchronization pattern telegram.
Data Sheet
99
V2.1, 2011-07
XE162FM, XE162HM
XE166 Family / Base Line
Electrical Parameters
Debug via JTAG
The following parameters are applicable for communication through the JTAG debug
interface. The JTAG module is fully compliant with IEEE1149.1-2000.
Note: These parameters are not subject to production test but verified by design and/or
characterization.
Note: Operating Conditions apply; CL= 20 pF.
Table 33
JTAG Interface Timing for Upper Voltage Range
Parameter
Symbol
Values
Min.
TCK clock period
TCK high time
t1 SR
t2 SR
t3 SR
t4 SR
t5 SR
t6 SR
Unit
Typ.
Max.
50
−
−
ns
16
−
−
ns
1)
16
−
−
ns
−
−
8
ns
−
−
8
ns
6
−
−
ns
t7 SR
6
−
−
ns
TDO valid from TCK falling t8 CC
edge (propagation delay)3)
−
25
29
ns
TDO high impedance to
valid output from TCK
falling edge4)3)
t9 CC
−
25
29
ns
TDO valid output to high
impedance from TCK
falling edge3)
t10 CC
−
25
29
ns
TDO hold after TCK falling t18 CC
edge3)
5
−
−
ns
TCK low time
TCK clock rise time
TCK clock fall time
TDI/TMS setup to TCK
rising edge
TDI/TMS hold after TCK
rising edge
Note /
Test Condition
2)
1) The debug interface cannot operate faster than the overall system, therefore t1 ≥ tSYS.
2) Under typical conditions, the interface can operate at transfer rates up to 20 MHz.
3) The falling edge on TCK is used to generate the TDO timing.
4) The setup time for TDO is given implicitly by the TCK cycle time.
Data Sheet
100
V2.1, 2011-07
XE162FM, XE162HM
XE166 Family / Base Line
Electrical Parameters
Table 34
JTAG Interface Timing for Lower Voltage Range
Parameter
Symbol
Values
Unit
Min.
Typ.
Max.
501)
−
−
ns
16
−
−
ns
16
−
−
ns
−
t1 SR
t2 SR
t3 SR
t4 SR
t5 SR
t6 SR
−
8
ns
−
−
8
ns
6
−
−
ns
t7 SR
6
−
−
ns
TDO valid from TCK falling t8 CC
edge (propagation delay)3)
−
32
36
ns
TDO high impedance to
valid output from TCK
falling edge4)3)
t9 CC
−
32
36
ns
TDO valid output to high
impedance from TCK
falling edge3)
t10 CC
−
32
36
ns
TDO hold after TCK falling t18 CC
edge3)
5
−
−
ns
TCK clock period
TCK high time
TCK low time
TCK clock rise time
TCK clock fall time
TDI/TMS setup to TCK
rising edge
TDI/TMS hold after TCK
rising edge
Note /
Test Condition
2)
1) The debug interface cannot operate faster than the overall system, therefore t1 ≥ tSYS.
2) Under typical conditions, the interface can operate at transfer rates up to 20 MHz.
3) The falling edge on TCK is used to generate the TDO timing.
4) The setup time for TDO is given implicitly by the TCK cycle time.
Data Sheet
101
V2.1, 2011-07
XE162FM, XE162HM
XE166 Family / Base Line
Electrical Parameters
t1
0.9 VDDP
0.5 VDDP
t5
t2
0.1 VDDP
t4
t3
MC_JTAG_TCK
Figure 26
Test Clock Timing (TCK)
TCK
t6
t7
t6
t7
TMS
TDI
t9
t8
t10
TDO
MC_JTAG
Figure 27
Data Sheet
JTAG Timing
102
V2.1, 2011-07
XE162FM, XE162HM
XE166 Family / Base Line
Package and Reliability
5
Package and Reliability
The XE166 Family devices use the package type PG-LQFP (Plastic Green - Low Profile
Quad Flat Package). The following specifications must be regarded to ensure proper
integration of the XE162xM in its target environment.
5.1
Packaging
These parameters specify the packaging rather than the silicon.
Table 35
Package Parameters (PG-LQFP-64-13)
Parameter
Power Dissipation
Thermal resistance
Junction-Ambient
Symbol
PDISS
RΘJA
Limit Values
Unit Notes
Min.
Max.
–
1.0
W
–
58
K/W No thermal via1)
46
K/W 4-layer, no pad2)
–
1) Device mounted on a 2-layer JEDEC board (according to JESD 51-3) or a 4-layer board without thermal vias;
exposed pad not soldered.
2) Device mounted on a 4-layer JEDEC board (according to JESD 51-7) with thermal vias.
Package Compatibility Considerations
The XE162xM is a member of the XE166 Family of microcontrollers. It is also compatible
to a certain extent with members of similar families or subfamilies.
Each package is optimized for the device it houses. Therefore, there may be slight
differences between packages of the same pin-count but for different device types. In
particular, the size of the Exposed Pad (if present) may vary.
If different device types are considered or planned for an application, it must be ensured
that the board layout fits all packages under consideration.
Data Sheet
103
V2.1, 2011-07
XE162FM, XE162HM
XE166 Family / Base Line
Package and Reliability
0.5
H
7˚ MAX.
0.15 -0.06
+0.05
1.6 MAX.
0.1 ±0.05
1.4 ±0.05
Package Outlines
0.6 ±0.15
0.08 C 64x
C
7.5
+0.07
0.2 -0.03
0.08 M A-B D C 64x
12
10
0.2 A-B D 64x
1)
0.2 A-B D H 4x
10
B
12
A
1)
D
64
1
Index Marking
1) Does not include plastic or metal protrusion of 0.25 max. per side
PG-LQFP-64-13-PO V07
Figure 28
PG-LQFP-64-13 (Plastic Green Thin Quad Flat Package)
All dimensions in mm.
You can find complete information about Infineon packages, packing and marking in our
Infineon Internet Page “Packages”: http://www.infineon.com/packages
Data Sheet
104
V2.1, 2011-07
XE162FM, XE162HM
XE166 Family / Base Line
Package and Reliability
5.2
Thermal Considerations
When operating the XE162xM in a system, the total heat generated in the chip must be
dissipated to the ambient environment to prevent overheating and the resulting thermal
damage.
The maximum heat that can be dissipated depends on the package and its integration
into the target board. The “Thermal resistance RΘJA” quantifies these parameters. The
power dissipation must be limited so that the average junction temperature does not
exceed 125 °C.
The difference between junction temperature and ambient temperature is determined by
ΔT = (PINT + PIOSTAT + PIODYN) × RΘJA
The internal power consumption is defined as
PINT = VDDP × IDDP (switching current and leakage current).
The static external power consumption caused by the output drivers is defined as
PIOSTAT = Σ((VDDP-VOH) × IOH) + Σ(VOL × IOL)
The dynamic external power consumption caused by the output drivers (PIODYN) depends
on the capacitive load connected to the respective pins and their switching frequencies.
If the total power dissipation for a given system configuration exceeds the defined limit,
countermeasures must be taken to ensure proper system operation:
•
•
•
•
Reduce VDDP, if possible in the system
Reduce the system frequency
Reduce the number of output pins
Reduce the load on active output drivers
Data Sheet
105
V2.1, 2011-07
XE162FM, XE162HM
XE166 Family / Base Line
Package and Reliability
5.3
Quality Declarations
The operation lifetime of the XE162xM depends on the operating temperature. The life
time decreases with increasing temperature as shown in Table 37.
Table 36
Quality Parameters
Parameter
Symbol
Operation lifetime
tOP CC
VHBM
Table 37
Unit
Note /
Test Condition
Min.
Typ.
Max.
−
−
20
a
See Table 37
−
−
2 000
V
EIA/JESD22A114-B
MSL CC −
−
3
−
JEDEC
J-STD-020C
ESD susceptibility
according to Human Body SR
Model (HBM)
Moisture sensitivity level
Values
Lifetime dependency from Temperature
Operating Time
Operating Temperature
20 a
TJ ≤ 110°C
TJ = 120°C
TJ = 125°C
TJ = 130°C
TJ = 140°C
TJ = 150°C
95 500 h
68 500 h
49 500 h
26 400 h
14 500 h
Data Sheet
106
V2.1, 2011-07
w w w . i n f i n e o n . c o m
Published by Infineon Technologies AG