20 LD SSOP

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
SSOP
CASE 940C–03
ISSUE B
DATE 01/23/1995
SCALE 2:1
20X
K REF
0.12 (0.005)
M
T U
S
V
S
0.25 (0.010)
N
L/2
20
11
M
B
L
PIN 1
IDENT
1
N
F
10
DETAIL E
–U–
A
–V–
0.20 (0.008)
M
T U
ÉÉÉÉ
ÇÇÇÇ
ÇÇÇÇ
ÉÉÉÉ
ÇÇÇÇ
K
J
S
J1
K1
SECTION N–N
0.076 (0.003)
–T–
SEATING
PLANE
–W–
C
D
G
H
DETAIL E
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH,
PROTRUSIONS OR GATE BURRS. MOLD FLASH
OR GATE BURRS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED 0.15 (0.006)
PER SIDE.
5. DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION/INTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.13 (0.005) TOTAL IN
EXCESS OF K DIMENSION AT MAXIMUM
MATERIAL CONDITION. DAMBAR INTRUSION
SHALL NOT REDUCE DIMENSION K BY MORE
THAN 0.07 (0.002) AT LEAST MATERIAL
CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE DETERMINED
AT DATUM PLANE –W–.
DIM
A
B
C
D
F
G
H
J
J1
K
K1
L
M
MILLIMETERS
MIN
MAX
7.07
7.33
5.20
5.38
1.73
1.99
0.05
0.21
0.63
0.95
0.65 BSC
0.59
0.75
0.09
0.20
0.09
0.16
0.25
0.38
0.25
0.33
7.65
7.90
0_
8_
INCHES
MIN
MAX
0.278
0.288
0.205
0.212
0.068
0.078
0.002
0.008
0.024
0.037
0.026 BSC
0.023
0.030
0.003
0.008
0.003
0.006
0.010
0.015
0.010
0.013
0.301
0.311
0_
8_
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 Semiconductor Components Industries, LLC, 2000
February, 2000 – Rev. 03B
1
Case Outline Number:
940C