No.13070161 Process Guidelines Laminate R-5775 Prepreg R-5670 High Speed, Low Loss Multi-layer Materials No.13070161-1 General Material Storage Laminate should be stored flat in a cool dry environment. Avoid bending or scratching the laminate surface. When possible store the laminate in the original container. Prepreg should be stored flat in a cool dry controlled environment, 73 F(23 C) or less and 50% RH or less. Extended storage of prepreg should be at a reduced temperature of 41 F(5 C). Open bags of prepreg must be resealed. Prepreg should not be exposed to open environments for more than 8 hours total cumulatively under the above conditions or as agreed upon between user and supplier. Laminate Surface Preparation Regular Shiny Copper can be cleaned using industry standard chemical clean or mechanical clean. Reverse Treat Copper should be cleaned using industry standard chemical clean. Inner Layer Bond Treatment Black or Brown Oxide can be used. In the case of using Black Oxide, please check whether peel strength is acceptable for the usage. Alternative Oxide Treatment with organic coating using a Peroxide/Sulfuric etch technology is preferred. Drying Dry finished inner layers completely to remove any absorbed moisture or surface moisture. A racked bake at 225 F(105 C) for 20-30 minutes is preferred. For conveyorized alternative oxide processing, some equipment may have sufficient drying capability. However, a racked bake is suggested. The following guidelines are provided as general recommendations. Process optimization may be necessary. No.13070161-2 Drilling (1) Drilling parameters in general condition Drilling parameters should be adjusted depending on hole size, layer count, panel thickness, stack count and stack height etc. min Diameter mm 0.20 0.25 0.30 0.35 0.40 0.45 0.50 0.55 0.60 0.65 0.70 0.75 0.80 0.85 0.90 Spindle speed k rpm 160 160 160 137 120 107 96 87 80 74 68 64 60 56 53 max velocity infeed chipload infeed chipload bit life m/min 100 126 151 151 151 151 151 150 151 151 149 151 151 149 150 m/min 1.6 1.8 1.9 1.8 1.8 1.8 1.8 1.8 1.7 1.7 1.7 1.6 1.6 1.6 1.6 μ/rev 10 11 12 13 15 17 19 21 21 23 25 25 27 29 30 m/min 2.4 2.8 3.2 3.0 2.9 2.7 2.7 2.6 2.6 2.6 2.6 2.6 2.5 2.4 2.4 μ/rev 15 18 20 22 24 25 28 30 33 35 38 41 42 43 45 hits 700-1,000 700-1,000 700-1,000 700-1,000 700-1,000 700-1,000 1,400-2,000 1,400-2,000 1,400-2,000 1,400-2,000 1,400-2,000 1,400-2,000 1,400-2,000 1,400-2,000 1,400-2,000 Note: 1) Spindle speed should be adjusted to make velocity 100 – 150 m/min. 2) To use lubricant sheets like LE sheets as entry sheets is recommendable. 3) To use drilling bits with high helix angle is recommendable. 4) Peck drilling is recommendable for thin drilling bits. 5) Please adjust drilling parameters after checking qualities of through holes. The following guidelines are provided as general recommendations. Process optimization may be necessary. No.13070161-3 Drilling (2) Positioning accuracy Drill size mm Velocity m/min 151 Spindle Speed krpm 160 Chip load micron/rev 20 φ0.30 Hit count 3000 0.15 Aluminum Entry board (lubricated is preferred) Panel thickness mm 0.8 ( #7628 X 4 ) Copper thickness micron Stack count 35 / 35 4 * No peck drilling Positioning accuracy map of R-5775 and R-1766 as our conventional FR-4 R-5775 R-1766 0.1 0.1 0.05 0.05 0 0 -0.1 -0.05 0 0.05 0.1 -0.1 -0.05 0 0.05 0.1 -0.05 -0.05 -0.1 -0.1 positioning accuracy : 46.8 micron positioning accuracy : 47.2 micron The following guidelines are provided as general recommendations. Process optimization may be necessary. No.13070161-4 Laminate Curing temperature time will be determined by the thickness of multilayer package being laminated. Laminate parameters should be adjusted depending on board thickness, stack count and stack thickness etc. Please Note : below is NOT a press control program. The graph represents the recommended pressure/temperature profile of actual panels subjected to during the lamination program cycle. Points 1. Product temperature -Product temperature should be kept at higher 185C for more than 75 minutes. 195C for 120 minutes is prefered 2. Press pressure -It’s a guide line that Ramping up of pressure is started after 90C of material temp. at the platen side and finished before 110C of material temp. at the platen side. -3.0MPa in the case that ROR of material is 4.0C/min, 3.5MPa in the case of 3.0C/min and 4.0MPa in the case of 2.0C/min are guide lines. * Pressure is optimized according to Circuit Pattern by our customers. 3. Vacuum -Stop at 30minute from start (at 90-130C of material temp. at the platen side). 4. Cushion -Cushion for Pressure evenness is needed. (Sheets of ｋraft paper etc.) * It’s recommendable that Tg of PCBs by DSC is above 180C. Product temp ： over 185C 75min ↑ Product Heat up rate 2.0 - 4.0C/min 110 100 90 Pressure (MPa) Temperature ( C ) 200 Pressure 3.0 – 4.0MPa 20 ↑0.5MPa 20min 30 60 Time （min） ） max. 100torr (13.3kPa) Vacuum : STOP at 30min from start (at 90 – 130C ) The following guidelines are provided as general recommendations. Process optimization may be necessary. No.13070161-5 Desmear 1) Permanganate Desmear The weight loss of R-5775 laminate and R-5670 prepreg is less than that of R-1766 as our conventional FR-4 material. Twice of FR-4 condition is recommendable. Desmear parameters should be adjusted depending on board thickness, stack count and stack thickness etc. process reagent type temp. (C) time (min) Swelling alkaline 65-85 5-10 Etching permanganate 70-85 10-15 process reagent type temp. (C) time (min) Swelling organic solvent 35-40 6-10 Etching permanganate 70-85 10-15 Part number Weight loss ratio R-5775 0.2 - 0.4 R-1766 1.0 2) Plasma Desmear Half time of FR-4 conditions is recommendable. 3) Combined Desmear for Hybrid construction with FR-4 materials First, Plasma Desmear for the half time of FR-4 condition is done and Permanganate Desmear without swelling process for the half time of FR-4 condition is done continuously. The following guidelines are provided as general recommendations. Process optimization may be necessary. No.13070161-6 Finishing •- Ag plating, Sn plating, Direct gold plating and OSP are good for R-5775. -- If you use Ni plating like ENIG, baking or long time holding at room temperature - (E.g. 5H at 150℃, 1week at room temperature) is needed before Ni plating. - It depends on circuit pattern and conditions (circulation, bubbling etc.) of equipment, though. ++Before purchase++ * If delivery specifications have been agreed upon, descriptions in the delivery specifications take precedence. * Specifications and appearances are subject to change without prior notice for product improvement. * For details of the products contained in this catalog, contact your dealer or our sales representative. * ALL data are our actual values and not assured values. 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