NCP708 1 A, 1% Precision Very Low Dropout Voltage Regulator with Enable The NCP708 is a Very Low Dropout Regulator which provides up to 1 A of load current and maintains excellent output voltage accuracy of 1.5% including line, load and temperature variations. The operating input voltage range from 2.4 V up to 5.5 V makes this device suitable for Li−ion battery powered products as well as post−regulation applications. The product is available in 3.3 V fixed output voltage option. Other voltage options are possible on request. NCP708 is fully protected against overheating and output short circuit. Small 6−pin UDFN6 3x3 package makes the device especially suitable for space constrained applications. Features Other Output Voltage Options Available on Request. Low Quiescent Current of Typ. 200 mA Very Low Dropout: 250 mV Max. at IOUT = 1 A ±1.5% Accuracy Over Load/Line/Temperature High PSRR: 70 dB at 1 kHz Internal Soft−Start to Limit the Inrush Current Thermal Shutdown and Current Limit Protections Stable with a 4.7 mF Ceramic Output Capacitor Available in UDFN6 3x3 mm Package These are Pb−Free Devices 708 330 ALYWG G = Assembly Location = Wafer Lot = Year = Work Week = Pb−Free Package EN 1 6 IN GND 2 5 OUT_s N/C 3 4 OUT (Top View) ORDERING INFORMATION See detailed ordering, marking and shipping information on page 8 of this data sheet. VOUT = 3.3 V @ 1 A IN OUT NCP708 CIN 1 UDFN6 CASE 517DD PIN CONNECTION Hard−Drives, SSDs Servers, Networking Equipment Telecom Equipment Battery Powered Applications VIN = 3.6 − 5.5 V 1 (Note: Microdot may be in either location) Typical Applications • • • • MARKING DIAGRAM A L Y W G • Operating Input Voltage Range: 2.4 V to 5.5 V • Fixed Output Voltage Option: 3.3 V • • • • • • • • • www.onsemi.com SNS EN ON GND OFF COUT 4.7 mF Ceramic Figure 1. Typical Application Schematic © Semiconductor Components Industries, LLC, 2015 December, 2015 − Rev. 2 1 Publication Order Number: NCP708/D NCP708 Figure 2. Simplified Internal Schematic Block Diagram PIN FUNCTION DESCRIPTION Pin No. Pin Name 1 EN 2 GND Power supply ground. 3 N/C Not connected. This pin can be tied to ground to improve thermal dissipation. 4 OUT Regulated output voltage. A minimum 4.7 mF ceramic capacitor is needed from this pin to ground to assure stability. 5 OUT_S 6 IN − Exposed Pad Description Enable pin. Driving EN over 0.9 V turns on the regulator. Driving EN below 0.4 V puts the regulator into shutdown mode. Output voltage sense connection. This pin should be connected to the output voltage rail. Input pin. A small capacitor is needed from this pin to ground to assure stability. This pad enhances thermal performance and is electrically connected to GND. It is recommended that the exposed pad is connected to the ground plane on the board or otherwise left open. www.onsemi.com 2 NCP708 ABSOLUTE MAXIMUM RATINGS Rating Symbol Value Unit VIN −0.3 V to 6 V V Output Voltage VOUT −0.3 V to VIN + 0.3 V V Enable Input VEN −0.3 V to VIN + 0.3 V V Output Short Circuit Duration tSC Indefinite s TJ(MAX) 150 °C Input Voltage (Note 1) Maximum Junction Temperature TSTG −55 to 150 °C ESD Capability, Human Body Model (Note 2) ESDHBM 2000 V ESD Capability, Machine Model (Note 2) ESDMM 200 V Storage Temperature Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. Refer to ELECTRICAL CHARACTERISTIS and APPLICATION INFORMATION for Safe Operating Area. 2. This device series incorporates ESD protection and is tested by the following methods: ESD Human Body Model tested per EIA/JESD22−A114 ESD Machine Model tested per EIA/JESD22−A115 Latch−up Current Maximum Rating tested per JEDEC standard: JESD78 THERMAL CHARACTERISTICS Rating Thermal Characteristics, WDFN6 3 x 3, Thermal Resistance, Junction−to−Air www.onsemi.com 3 Symbol Value Unit RqJA 55 °C/W NCP708 ELECTRICAL CHARACTERISTICS − VOLTAGE VERSION 3.3 V −40°C ≤ TJ ≤ 125°C; VIN = VOUT(NOM) + 0.3 V or 2.4 V, whichever is greater; IOUT = 10 mA, CIN = COUT = 4.7 mF, VEN = 0.9 V, unless otherwise noted. Typical values are at TJ = +25°C. (Note 3) Test Conditions Parameter Symbol Min VIN 2.4 UVLO 1.2 3.25 Operating Input Voltage Typ Max Unit 5.5 V 1.6 1.9 V 3.3 3.35 Undervoltage lock−out VIN rising Output Voltage Accuracy VOUT + 0.3 V ≤ VIN ≤ 5.25 V, IOUT = 0 – 1 A VOUT Line Regulation VOUT + 0.3 V ≤ VIN ≤ 5.25 V, IOUT = 10 mA RegLINE Load Regulation IOUT = 0 mA to 1 A Load Transient Any 200 mA load step from IOUT = 10 mA to 1A or 10 mA to 1 A in 10 ms, COUT = 10 mF Dropout voltage (Note 4) IOUT = 1 A, VOUT(nom) = 3.3 V VDO 220 Output Current Limit VOUT = 90% VOUT(nom) ICL Quiescent current IOUT = 0 mA Ground current IOUT = 1 A Shutdown current VEN ≤ 0 V, VIN = 2.0 to 5.5 V Reverse Leakage Current in Shutdown VIN = 5.5 V, VOUT = VOUT(NOM), VEN < 0.4 V EN Pin High Threshold EN Pin Low Threshold VEN Voltage increasing VEN Voltage decreasing EN Pin Input Current VEN = 5.5 V IEN Turn−on Time COUT = 4.7 mF, from assertion EN pin to 98% Vout(nom) tON mV RegLOAD 2 mV TranLOAD ±60 mV Output Noise Voltage VOUT = 3.3 V, VIN = 3.6 V, IOUT = 0.1 A f = 200 Hz to 100 kHz Thermal Shutdown Temperature Thermal Shutdown Hysteresis mV A IQ 180 IGND 200 VEN_HI VEN_LO VIN = 3.8 V, VOUT = 3.3 V IOUT = 0.1 A 330 1.1 IREV Power Supply Rejection Ratio V 2 mA 230 mA 0.1 1 mA 1.5 5 mA 0.4 V V 500 nA 0.9 100 ms 200 f = 1 kHz PSRR 70 dB VNOISE 100 mVrms Temperature increasing from TJ = +25°C TSD 160 °C Temperature falling from TSD TSDH − 20 °C − Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 3. Performance guaranteed over the indicated operating temperature range by design and/or characterization production tested at TJ = TA = 25°C. Low duty cycle pulse techniques are used during testing to maintain the junction temperature as close to ambient as possible. 4. Characterized when VOUT falls 100 mV below the regulated voltage at VIN = VOUT(NOM) + 0.3 V. TYPICAL CHARACTERISTICS VIN = VOUT−NOM + 0.3 V or VIN = 2.4 V whatever is greater, VEN = 0.9 V, IOUT = 10 mA, CIN = COUT = 4.7 mF, TJ = 25°C. 2.0 3.35 VOUT−NOM = 3.3 V 3.33 3.32 3.31 3.30 3.29 3.28 3.27 3.26 3.25 −40 VIN = VOUT−NOM + 0.3 V to 4.5 V VOUT−NOM = 3.3 V 1.5 LINE REGULATION (mV) OUTPUT VOLTAGE (V) 3.34 1.0 0.5 0 −0.5 −1.0 −1.5 −20 0 20 40 60 80 100 −2.0 −40 120 −20 0 20 40 60 80 100 TEMPERATURE (°C) TEMPERATURE (°C) Figure 3. Output Voltage vs. Temperature Figure 4. Line Regulation vs. Temperature www.onsemi.com 4 120 NCP708 TYPICAL CHARACTERISTICS VIN = VOUT−NOM + 0.3 V or VIN = 2.4 V whatever is greater, VEN = 0.9 V, IOUT = 10 mA, CIN = COUT = 4.7 mF, TJ = 25°C. 5 275 VOUT−NOM = 3.3 V VOUT = VOUT−NOM − 100 mV 250 DROPOUT VOLTAGE (mV) LOAD REGULATION (mV) 4 3 2 1 0 −1 −2 −3 −4 −5 −40 −20 VOUT−NOM = 3.3 V IOUT = 0 mA to 1000 mA 0 20 40 60 80 100 225 200 175 150 125 100 75 50 25 0 0 120 200 400 600 800 1000 TEMPERATURE (°C) OUTPUT CURRENT (mA) Figure 5. Load Regulation vs. Temperature Figure 6. Dropout Voltage vs. Output Current 220 190 QUIESCENT CURRENT (mA) GROUND CURRENT (mA) 200 180 170 160 150 140 VOUT−NOM = 3.3 V 200 400 600 800 180 160 VOUT−NOM = 3.3 V IOUT = 0 mA 140 120 −40 130 0 200 1000 0 20 40 60 80 100 120 OUTPUT CURRENT (mA) TEMPERATURE (°C) Figure 7. Ground Current vs. Output Current Figure 8. Quiescent Current vs. Temperature 200 1.0 VIN = 5.5 V VOUT−NOM = 3.3 V VEN = 0 V SHUTDOWN CURRENT (mA) 0.9 QUIESCENT CURRENT (mA) −20 190 180 170 160 VOUT−NOM = 3.3 V IOUT = 0 mA 150 4.0 4.5 5.0 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 −40 140 3.5 0.8 5.5 −20 0 20 40 60 80 100 120 INPUT VOLTAGE (V) TEMPERATURE (°C) Figure 9. Quiescent Current vs. Input Voltage Figure 10. Shutdown Current vs. Temperature www.onsemi.com 5 NCP708 TYPICAL CHARACTERISTICS VIN = VOUT−NOM + 0.3 V or VIN = 2.4 V whatever is greater, VEN = 0.9 V, IOUT = 10 mA, CIN = COUT = 4.7 mF, TJ = 25°C. 2.1 1.9 1.7 1.5 VOUT−FORCED = 0 V VOUT−NOM = 3.3 V 1.3 1.1 −40 ENABLE THRESHOLD VOLTAGE (V) OUTPUT CURRENT LIMIT (A) 2.3 −20 0 20 40 60 80 100 2.1 1.9 1.7 1.5 VOUT−FORCED = VOUT−NOM − 0.1 V VOUT−NOM = 3.3 V 1.3 1.1 −40 120 −20 0 20 40 60 80 100 TEMPERATURE (°C) TEMPERATURE (°C) Figure 11. Short Circuit Current vs. Temperature Figure 12. Output Current Limit vs. Temperature 0.9 120 0.5 VOUT−NOM = 3.3 V ENABLE INPUT CURRENT (mA) SHORT CIRCUIT CURRENT (A) 2.3 0.8 OFF −> ON 0.7 ON −> OFF 0.6 0.5 0.4 −40 −20 0 20 40 60 80 100 VOUT−NOM = 3.3 V 0.4 0.3 0.2 0.1 0 −40 120 −20 0 20 40 60 80 100 TEMPERATURE (°C) TEMPERATURE (°C) Figure 13. Enable Threshold Voltage vs. Temperature Figure 14. Enable Input Current vs. Temperature 120 90 VOUT−NOM = 3.3 V 80 50 40 30 20 10 0 4.6 V 500 mV/div 60 20 mV/div PSRR (dB) 70 COUT = 4.7 mF X7R 0805 IOUT = 30 mA VIN = 3.8 V VOUT−NOM = 3.3 V 10 100 1K 10K 100K tR = tF = 1 ms VOUT 3.3 V 20 ms/div 1M FREQUENCY (Hz) Figure 15. Power Supply Rejection Ratio Figure 16. Line Transient Response www.onsemi.com 6 VIN 3.6 V NCP708 TYPICAL CHARACTERISTICS VIN = VOUT−NOM + 0.3 V or VIN = 2.4 V whatever is greater, VEN = 0.9 V, IOUT = 10 mA, CIN = COUT = 4.7 mF, TJ = 25°C. IOUT IIN VIN VOUT VOUT 3.3 V 1 V/div 50 mV/div 500 mA/div tR = tF = 1 ms 1 mA VOUT−NOM = 3.3 V 50 mA/div 1000 mA 40 ms/div 2 ms/div Figure 17. Load Transient Response Figure 18. Turn−ON/OFF − VIN Driven (slow) IIN COUT is discharged just by load resistance 250 Ohm 1 V/div VOUT 100 mA/div 0V VOUT−NOM = 3.3 V IIN Figure 19. Turn−ON/OFF − VIN Driven (fast) Figure 20. Turn−ON/OFF − EN Driven 220 1.6 200 PD(MAX), 2 oz Cu 1.4 180 1.2 160 PD(MAX), 1 oz Cu 1.0 140 0.8 120 0.6 qJA, 1 oz Cu 100 80 qJA, 2 oz Cu 60 100 200 300 400 500 PCB COPPER AREA (mm2) Figure 21. qJA and PD(MAX) vs. Copper Area www.onsemi.com 7 600 0.4 0.2 0 PD(MAX), MAXIMUM POWER DISSIPATION (W) 1 ms/div qJA, JUNCTION TO AMBIENT THERMAL RESISTANCE (°C/W) 40 ms/div 0 VEN VOUT 0V 1 V/div 3.3 V 0V 3.3 V VIN 5.5 V VOUT−NOM = 3.3 V 0.9 V 1 V/div 100 mA/div VOUT−NOM = 3.3 V NCP708 APPLICATIONS INFORMATION Input Decoupling (Cin) Thermal A 4.7 mF capacitor either ceramic or tantalum is recommended and should be connected as close as possible to the pins of NCP708 device. Higher values and lower ESR will improve the overall line transient response. As power across the NCP708 increases, it might become necessary to provide some thermal relief. The maximum power dissipation supported by the device is dependent upon board design and layout. Mounting pad configuration on the PCB, the board material, and also the ambient temperature affect the rate of temperature rise for the part. This is stating that when the NCP708 has good thermal conductivity through the PCB, the junction temperature will be relatively low with high power dissipation. The power dissipation across the device can be roughly represented by the equation: Output Decoupling (Cout) The minimum decoupling value is 4.7 mF and can be augmented to fulfill stringent load transient requirements. The regulator accepts ceramic chip capacitors MLCC. If a tantalum capacitor is used, and its ESR is large, the loop oscillation may result. Larger values improve noise rejection and PSRR. P D + ǒV IN * V OUTǓ * I OUT [W] Enable Operation (eq. 1) The maximum power dissipation depends on the thermal resistance of the case and circuit board, the temperature differential between the junction and ambient, PCB orientation and the rate of air flow. The maximum allowable power dissipation can be calculated using the following equation: The enable pin EN will turn on or off the regulator. These limits of threshold are covered in the electrical specification section of this data sheet. If the enable is not used then the pin should be connected to VIN. Hints P MAX + ǒT J * T AǓńq JA [W] Please be sure the Vin and GND lines are sufficiently wide. If their impedance is high, noise pickup or unstable operation may result. Set external components, especially the output capacitor, as close as possible to the circuit. The sense pin SNS trace is recommended to be kept as far from noisy power traces as possible and as close to load as possible. (eq. 2) Where (TJ − TA) is the temperature differential between the junction and the surrounding environment and qJA is the thermal resistance from the junction to the ambient. Connecting the exposed pad and non connected pin 3 to a large ground pad or plane helps to conduct away heat and improves thermal relief. ORDERING INFORMATION Device NCP708MU330TAG Nominal Ooutput Voltage Package Shipping† 3.3 V UDFN6 3 x 3 (Pb−Free) 3000 / Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. www.onsemi.com 8 NCP708 PACKAGE DIMENSIONS UDFN6 3x3, 0.95P CASE 517DD ISSUE O A D L L B L1 PIN 1 REFERENCE 2X 0.15 C 2X DETAIL A ÇÇÇ ÇÇÇ ÇÇÇ 0.15 C ALTERNATE TERMINAL CONSTRUCTIONS E NOTES: 5. DIMENSIONS AND TOLERANCING PER ASME Y14.5M, 1994. 6. CONTROLLING DIMENSION: MILLIMETERS. 7. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.30 MM FROM THE TERMINAL TIP. 8. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. DIM A A1 A3 b D D2 E E2 e K L L1 ÇÇ ÇÇ ÉÉ EXPOSED Cu TOP VIEW MOLD CMPD DETAIL B ALTERNATE CONSTRUCTIONS DETAIL B 0.10 C A 7X 0.08 C (A3) NOTE 4 SIDE VIEW C A1 SEATING PLANE RECOMMENDED SOLDERING FOOTPRINT* 6X D2 DETAIL A 1 6X L PKG OUTLINE 3 E2 K 6 MILLIMETERS MIN MAX 0.45 0.55 0.00 0.05 0.20 REF 0.25 0.35 3.00 BSC 2.30 2.50 3.00 BSC 1.55 1.75 0.95 BSC 0.28 REF 0.30 0.50 −−− 0.15 4 6X b e 0.10 C A B BOTTOM VIEW 0.05 C 2.60 0.60 1.80 3.30 1 0.95 PITCH 0.45 NOTE 3 6X DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and the are registered trademarks of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries. SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. 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