Nomenclature Guide 80C, 82CXXX Types M D TEMPERATURE RANGE C: 0°C to +70°C I: -40°C to +85°C M: -55°C to +125°C PACKAGE DESIGNATOR P: Dual-In-Line Plastic (PDIP) D: Ceramic Dual-In-Line Frit-Seal (CERDIP) or Ceramic Dual-In-Line Metal Seal (SBDIP) G: Ceramic Pin Grid Array (CPGA) R: Ceramic Leadless Chip Carrier (CLCC) S: Plastic Leaded Chip Carrier (PLCC) M: Small Outline Plastic (SOIC) MS: OKI Pin for Pin Cross (PLCC) MQ: OKI Pin for Pin Cross (MQFP) PART NUMBER 80CXXX: CMOS Microprocessors 82CXXX: CMOS Peripherals 1 80C86 - 2 /B Z PB-FREE OPTION Z: Pb-Free Product ZA: Pb-Free with Anneal SUFFIX /B: -55°C to +125°C with Burn-In /883: Current Rev Compliant /7: Thin EPI, Current Rev 883 Compliant SPEED DESIGNATION Peripherals -5: 5MHz Blank: 8MHz -10: 10MHz -12: 12MHz µProcessors Blank: 5MHz -2: 8MHz -10: 10MHz -12: 12MHz -20: 20MHz -25: 25MHz www.intersil.com 1-888-INTERSIL or 1-888-468-3774 | Copyright Intersil Americas Inc. 2011. All Rights Reserved Intersil (and design) is a trademark owned by Intersil Corporation or one of its subsidiaries. All other trademarks mentioned are the property of their respective owners