Nomenclature Guide HS/IS Radiation Hardened Types H S PREFIX H: Harris I: Intersil 1 - 6664 PART NUMBER FAMILY Rad Hard/High-Rel Products PACKAGE DESIGNATOR 1: Ceramic Dual-In-Line Frit-Seal (CERDIP) or Ceramic Dual-In-Line Metal-Seal (SBDIP) 2: Can 4: Ceramic Leadless Chip Carriers (CLCC) 7B: 8 Lead Ceramic Dual-In-Line Side-Brazed (SBDIP) 8: Ceramic Pin Grid Array (CPGA) 9: Ceramic Flatpack 0: Die YE: SMD 0.5 9S: TO-257 Hermetic Surface Mount RH -8 CLASS -8: -55°C to +125°C QML SMD Class Q (Note 1) -Q: -55°C to +125°C QML SMD Class V (Note 1) -T: -55°C to +125°C QML SMD Class T (Note 1) /PROTO: -55°C to +125°C Temperature Tested (Note 2) HARDNESS RH: Radiation Hardened (Note 3) EH: Radiation Hardened (Note 3) NOTES: 1. FLIGHT UNITS MUST BE ORDERED BY SMD#. A cross reference table is available on the Intersil website at http://www.intersil.com/ 2. /PROTO available for design-in/breadboarding - NOT FOR FLIGHT. 3. Refer to specific device type SMD for radiation hardness level. www.intersil.com 1-888-INTERSIL or 1-888-468-3774 | Copyright Intersil Americas Inc. 2013. All Rights Reserved Intersil (and design) is a trademark owned by Intersil Corporation or one of its subsidiaries. All other trademarks mentioned are the property of their respective owners