PIC12(L)F1612/16(L)F1613 8/14-Pin, 8-Bit Flash Microcontroller Description PIC12(L)F1612/16(L)F1613 microcontrollers deliver on-chip features that are unique to the design for embedded control of small motors and general purpose applications in 8/14-pin count packages. Features like 10-bit A/D, CCP, 24-bit SMT and Zero-Cross Detection offer an excellent solution to the variety of applications. The product family also has a CRC+ memory scan and Windowed WDT to support safety-critical systems in home appliances, white goods and other end equipment. Core Features Digital Peripherals • C Compiler Optimized RISC Architecture • Only 49 Instructions • Operating Speed: - DC – 32 MHz clock input - 125 ns minimum instruction cycle • Interrupt Capability • 16-Level Deep Hardware Stack • One 8-Bit Timer • One 16-bit Timers • Low Current Power-on Reset (POR) • Configurable Power-up Timer (PWRT) • Brown-out Reset (BOR) with Selectable Trip Point • Windowed Watchdog Timer (WWDT): - Variable prescaler selection - Variable window size selection - All sources configurable in hardware or software • Complementary Waveform Generator (CWG): - Rising and falling edge dead-band control - Full-bridge, half-bridge, 1-channel drive - Multiple signal sources • Two Capture/Compare/PWM (CCP) modules • Two Signal Measurement Timers (SMT): - 24-bit timer/counter with prescaler - Multiple gate and clock inputs • 8-Bit Timers (TMR2+HLT/4/6): - Up to 3 Timer2/4/6 with Hardware Limit Timer (HLT) - Monitors Fault Conditions: Stall, Stop, etc. - Multiple modes - 8-bit timer/counter with prescaler - 8-bit period register and postscaler - Asynchronous H/W Reset sources • Cyclic Redundancy Check with Memory Scan (CRC/SCAN): - Software configurable Memory • • • • 2 KW Flash Program Memory 256 Bytes Data SRAM Direct, Indirect and Relative Addressing modes High-Endurance Flash Data Memory (HEF): - 128 B of nonvolatile data storage - 100K erase/write cycles Operating Characteristics • Operating Voltage Range: - 1.8V to 3.6V (PIC12LF1612/16F1613) - 2.3V to 5.5V (PIC12F1612/16F1613) • Temperature Range: - Industrial: -40°C to 85°C - Extended: -40°C to 125°C eXtreme Low-Power (XLP) Features • • • • Sleep mode: 50 nA @ 1.8V, typical Watchdog Timer: 500 nA @ 1.8V, typical Secondary Oscillator: 500 nA @ 32 kHz Operating Current: - 8 uA @ 32 kHz, 1.8V, typical - 32 uA/MHz @ 1.8V, typical 2014-2016 Microchip Technology Inc. DS40001737B-page 1 PIC12(L)F1612/16(L)F1613 • Up to 11 I/O Pins and One Input-only Pin: - Individually programmable pull-ups - Slew rate control - Interrupt-on-change with edge-select Intelligent Analog Peripherals • 10-Bit Analog-to-Digital Converter (ADC): - Up to 8 external channels - Conversion available during Sleep • Up to Two Comparators (COMP): - Low-Power/High-Speed mode - Up to three external inverting inputs - Fixed Voltage Reference at non-inverting input(s) - Comparator outputs externally accessible • 8-Bit Digital-to-Analog Converter (DAC): - 8-bit resolution, rail-to-rail - Positive Reference Selection • Voltage Reference: - Fixed Voltage Reference (FVR): 1.024V, 2.048V and 4.096V output levels • Zero-Cross Detect (ZCD): - Detect when AC signal on pin crosses ground • Two High-Current Drive Pins: - 100mA @ 5V 2014-2016 Microchip Technology Inc. Clocking Structure • 16 MHz Internal Oscillator: - ±1% at calibration - Selectable frequency range from 32 MHz to 31 kHz • 31 kHz Low-Power Internal Oscillator • 4x Phase-Locked Loop (PLL): - For up to 32 MHz internal operation • External Oscillator Block with: - Three external clock modes up to 32 MHz DS40001737B-page 2 Program Memory Flash (W) Program Memory Flash (kB) Data SRAM (bytes) High Endurance Flash (bytes) I/O Pins 8-bit Timer with HLT 16-bit Timer Angular Timer Windowed Watchdog Timer 24-bit SMT Comparators 10-bit ADC (ch) Zero-Cross Detect CCP/10-bit PWM CWG CLC CRC with Memory Scan Math Accelerator with PID High-Current I/O 100mA PPS EUSART I2C/SPI PIC12/16(L)F161X FAMILY TYPES Data Sheet Index 2014-2016 Microchip Technology Inc. TABLE 1: PIC12(L)F1612 (A) 2048 3.5 256 128 6 4 1 0 Y 1 1 4 1 2/0 1 0 Y 0 0 N 0 0 PIC16(L)F1613 (A) 2048 3.5 256 128 12 4 1 0 Y 2 2 8 1 2/0 1 0 Y 0 0 N 0 0 PIC16(L)F1614 (B) 4096 7 512 128 12 4 3 1 Y 2 2 8 1 2/2 1 2 Y 1 2 Y 1 1 PIC16(L)F1615 (C) 8192 14 1024 128 12 4 3 1 Y 2 2 8 1 2/2 1 4 Y 1 2 Y 1 1 PIC16(L)F1618 (B) 4096 7 512 128 18 4 3 1 Y 2 2 12 1 2/2 1 2 Y 1 2 Y 1 1 PIC16(L)F1619 (C) 8192 14 1024 128 18 4 3 1 Y 2 2 12 1 2/2 1 4 Y 1 2 Y 1 1 Device Debugging Methods: (I) – Integrated on Chip; (H) – via ICD Header; E – using Emulation Product Data Sheet Index: A. DS40001737 PIC12(L)F1612/16(L)F1613 Data Sheet, 8/14-Pin, 8-bit Flash Microcontrollers B. DS40001769 PIC16(L)F1614/8 Data Sheet, 14/20-Pin, 8-bit Flash Microcontrollers C. DS40001770 PIC16(L)F1615/9 Data Sheet, 14/20-Pin, 8-bit Flash Microcontrollers Note: For other small form-factor package availability and marking information, please visit http://www.microchip.com/packaging or contact your local sales office. DS40001737B-page 3 PIC12(L)F1612/16(L)F1613 Note 1: PIC12(L)F1612/16(L)F1613 TABLE 2: PACKAGES Packages PDIP SOIC DFN UDFN PIC12(L)F1612 PIC16(L)F1613 Note: TSSOP QFN UQFN SSOP Pin details are subject to change. PIN DIAGRAMS 8-pin PDIP, SOIC, DFN, UDFN VDD 1 8 VSS RA5 2 7 RA0 3 4 6 RA1 5 RA2 RA4 RA3 14-pin PDIP, SOIC, TSSOP 1 14 RA5 VDD 2 13 VSS RA0/ICSPDAT RA4 12 RA1/ICSPCLK MCLR/VPP/RA3 3 4 11 RA2 RC5 5 10 RC0 RC4 6 9 RC1 7 8 RC2 RC3 VDD NC NC Vss 16-pin QFN, UQFN 16 15 14 13 RA5 RA4 RA3/MCLR/VPP RC5 1 12 2 11 3 10 4 9 6 7 8 RC4 RC3 RC2 RC1 5 RA0 RA1 RA2 RC0 2014-2016 Microchip Technology Inc. DS40001737B-page 4 PIC12(L)F1612/16(L)F1613 PIN ALLOCATION TABLES — CCP2 VREF+ — — RA2 5 AN2 — C1OUT T0CKI CCP1 RA3 4 — — — T1G(1) T6IN — — RA4 3 AN3 — C1IN1- T1G — RA5 2 — — — T1CKI T2IN VDD 1 — — — — — VSS 8 — — — — — Note Basic C1IN+ C1IN0- Pull-up CCP DAC1OUT1 AN1 SMT Timers AN0 6 Interrupt Comparator 7 RA1 ZCD Reference RA0 CWG I/O A/D 8-PIN ALLOCATION TABLE (PIC12(L)F1612) 8-Pin PDIP, SOIC, DFN, UDFN TABLE 3: CWG1B — IOC — Y ICSPDAT — ZCD1OUT IOC — Y ICSPCLK CWG1A CWG1IN ZCD1IN INT IOC SMTSIG2 Y — — IOC SMTWIN2 Y MCLR/VPP — IOC SMTSIG1 Y CLKOUT — IOC SMTWIN1 Y CLKIN — — — — — VDD — — — — — VSS CWG1B(1) CCP1 (1) CWG1A (1) Alternate pin function selected with the APFCON register. 1: A/D Reference Comparator Timers CCP CWG ZCD Interrupt SMT Pull-up RA0 13 12 AN0 DAC1OUT1 C1IN+ — — — — IOC — Y ICSPDAT RA1 12 11 AN1 VREF+ C1IN0C2IN0- — — — ZCD1OUT IOC — Y ICSPCLK RA2 11 10 AN2 — C1OUT T0CKI T4IN — CWG1IN ZCD1IN INT IOC — Y — RA3 4 3 — — — T1G(1) T6IN — — — IOC SMTWIN2 Y MCLR/VPP RA4 3 2 AN3 — — T1G — — — IOC SMTSIG1 Y CLKOUT RA5 2 1 — — — — IOC SMTWIN1 Y CLKIN RC0 10 9 AN4 — C2IN+ — — — — IOC — Y — RC1 9 8 AN5 — C1IN1C2IN1- T4IN — — — IOC SMTSIG2 Y — RC2 8 7 AN6 — C1IN2C2IN2- — — CWG1D — IOC — Y — RC3 7 6 AN7 — C1IN3C2IN3- — CCP2 CWG1C — IOC — Y — RC4 6 5 — — C2OUT — — CWG1B — IOC — Y — RC5 5 4 — — — — CCP1 CWG1A — IOC — Y — VDD 1 16 — — — — — — — — — — VDD VSS 14 13 — — — — — — — — — — VSS Note 1: — T1CKI T2IN CCP2 (1) Basic I/O 16-Pin QFN, UQFN 14/16-PIN ALLOCATION TABLE (PIC16(L)F1613) 14-Pin PDIP, SOIC, TSSOP TABLE 4: Alternate pin function selected with the APFCON register. 2014-2016 Microchip Technology Inc. DS40001737B-page 5 PIC12(L)F1612/16(L)F1613 TABLE OF CONTENTS 1.0 Device Overview .......................................................................................................................................................................... 8 2.0 Enhanced Mid-Range CPU ........................................................................................................................................................ 15 3.0 Memory Organization ................................................................................................................................................................. 17 4.0 Device Configuration .................................................................................................................................................................. 51 5.0 Oscillator Module........................................................................................................................................................................ 58 6.0 Resets ........................................................................................................................................................................................ 69 7.0 Interrupts .................................................................................................................................................................................... 77 8.0 Power-Down Mode (Sleep) ........................................................................................................................................................ 92 9.0 Windowed Watchdog Timer (WDT)............................................................................................................................................ 95 10.0 Flash Program Memory Control ............................................................................................................................................... 103 11.0 Cyclic Redundancy Check (CRC) Module ............................................................................................................................... 119 12.0 I/O Ports ................................................................................................................................................................................... 131 13.0 Interrupt-On-Change ................................................................................................................................................................ 146 14.0 Fixed Voltage Reference (FVR) ............................................................................................................................................... 151 15.0 Temperature Indicator Module ................................................................................................................................................. 154 16.0 Analog-to-Digital Converter (ADC) Module .............................................................................................................................. 156 17.0 8-bit Digital-to-Analog Converter (DAC1) Module .................................................................................................................... 170 18.0 Comparator Module.................................................................................................................................................................. 174 19.0 Zero-Cross Detection (ZCD) Module........................................................................................................................................ 182 20.0 Timer0 Module ......................................................................................................................................................................... 188 21.0 Timer1/3/5 Module with Gate Control....................................................................................................................................... 191 22.0 Timer2/4/6 Module ................................................................................................................................................................... 203 23.0 Capture/Compare/PWM Modules ............................................................................................................................................ 223 24.0 Complementary Waveform Generator (CWG) Module ............................................................................................................ 237 25.0 Signal Measurement Timer (SMT) ........................................................................................................................................... 262 26.0 In-Circuit Serial Programming™ (ICSP™) ............................................................................................................................... 305 27.0 Instruction Set Summary .......................................................................................................................................................... 307 28.0 Electrical Specifications............................................................................................................................................................ 321 29.0 DC and AC Characteristics Graphs and Charts ....................................................................................................................... 345 30.0 Development Support............................................................................................................................................................... 364 31.0 Packaging Information.............................................................................................................................................................. 368 Data Sheet Revision History ............................................................................................................................................................. 392 2014-2016 Microchip Technology Inc. DS40001737B-page 6 PIC12(L)F1612/16(L)F1613 TO OUR VALUED CUSTOMERS It is our intention to provide our valued customers with the best documentation possible to ensure successful use of your Microchip products. To this end, we will continue to improve our publications to better suit your needs. Our publications will be refined and enhanced as new volumes and updates are introduced. If you have any questions or comments regarding this publication, please contact the Marketing Communications Department via E-mail at [email protected] or fax the Reader Response Form in the back of this data sheet to (480) 792-4150. We welcome your feedback. Most Current Data Sheet To obtain the most up-to-date version of this data sheet, please register at our Worldwide Website at: http://www.microchip.com You can determine the version of a data sheet by examining its literature number found on the bottom outside corner of any page. The last character of the literature number is the version number, (e.g., DS30000A is version A of document DS30000). Errata An errata sheet, describing minor operational differences from the data sheet and recommended workarounds, may exist for current devices. As device/documentation issues become known to us, we will publish an errata sheet. The errata will specify the revision of silicon and revision of document to which it applies. To determine if an errata sheet exists for a particular device, please check with one of the following: • Microchip’s Worldwide Website; http://www.microchip.com • Your local Microchip sales office (see last page) When contacting a sales office, please specify which device, revision of silicon and data sheet (include literature number) you are using. Customer Notification System Register on our website at www.microchip.com to receive the most current information on all of our products. 2014-2016 Microchip Technology Inc. DS40001737B-page 7 PIC12(L)F1612/16(L)F1613 1.0 DEVICE OVERVIEW The PIC12(L)F1612/16(L)F1613 are described within this data sheet. The block diagram of these devices are shown in Figure 1-1, the available peripherals are shown in Table 1-1, and the pin out descriptions are shown in Tables 1-2 and 1-3. Peripheral PIC16(L)F1613 DEVICE PERIPHERAL SUMMARY PIC12(L)F1612 TABLE 1-1: Analog-to-Digital Converter (ADC) ● ● Complementary Wave Generator (CWG) ● ● Cyclic Redundancy Check (CRC) ● ● Digital-to-Analog Converter (DAC) ● ● Fixed Voltage Reference (FVR) ● ● Temperature Indicator ● ● Windowed Watchdog Timer (WDT) ● ● Zero Cross Detection (ZCD) ● ● CCP1 ● ● CCP2 ● ● C1 ● ● Capture/Compare/PWM (CCP) Modules Comparators C2 ● Signal Measurement Timer (SMT) SMT1 ● ● SMT2 ● ● Timer0 ● ● Timer1 ● ● Timer2 ● ● Timer4 ● ● Timer6 ● ● Timers 2014-2016 Microchip Technology Inc. DS40001737B-page 8 PIC12(L)F1612/16(L)F1613 1.1 1.1.1 Register and Bit Naming Conventions REGISTER NAMES When there are multiple instances of the same peripheral in a device, the peripheral control registers will be depicted as the concatenation of a peripheral identifier, peripheral instance, and control identifier. The control registers section will show just one instance of all the register names with an ‘x’ in the place of the peripheral instance number. This naming convention may also be applied to peripherals when there is only one instance of that peripheral in the device to maintain compatibility with other devices in the family that contain more than one. 1.1.2 BIT NAMES There are two variants for bit names: • Short name: Bit function abbreviation • Long name: Peripheral abbreviation + short name 1.1.2.1 Short Bit Names Short bit names are an abbreviation for the bit function. For example, some peripherals are enabled with the EN bit. The bit names shown in the registers are the short name variant. Short bit names are useful when accessing bits in C programs. The general format for accessing bits by the short name is RegisterNamebits.ShortName. For example, the enable bit, EN, in the COG1CON0 register can be set in C programs with the instruction COG1CON0bits.EN = 1. Short names are generally not useful in assembly programs because the same name may be used by different peripherals in different bit positions. When this occurs, during the include file generation, all instances of that short bit name are appended with an underscore plus the name of the register in which the bit resides to avoid naming contentions. 1.1.2.2 Long Bit Names Long bit names are constructed by adding a peripheral abbreviation prefix to the short name. The prefix is unique to the peripheral, thereby making every long bit name unique. The long bit name for the COG1 enable bit is the COG1 prefix, G1, appended with the enable bit short name, EN, resulting in the unique bit name G1EN. Long bit names are useful in both C and assembly programs. For example, in C the COG1CON0 enable bit can be set with the G1EN = 1 instruction. In assembly, this bit can be set with the BSF COG1CON0,G1EN instruction. 2014-2016 Microchip Technology Inc. 1.1.2.3 Bit Fields Bit fields are two or more adjacent bits in the same register. Bit fields adhere only to the short bit naming convention. For example, the three Least Significant bits of the COG1CON0 register contain the mode control bits. The short name for this field is MD. There is no long bit name variant. Bit field access is only possible in C programs. The following example demonstrates a C program instruction for setting the COG1 to the Push-Pull mode: COG1CON0bits.MD = 0x5; Individual bits in a bit field can also be accessed with long and short bit names. Each bit is the field name appended with the number of the bit position within the field. For example, the Most Significant mode bit has the short bit name MD2 and the long bit name is G1MD2. The following two examples demonstrate assembly program sequences for setting the COG1 to Push-Pull mode: Example 1: MOVLW ANDWF MOVLW IORWF ~(1<<G1MD1) COG1CON0,F 1<<G1MD2 | 1<<G1MD0 COG1CON0,F Example 2: BSF BCF BSF COG1CON0,G1MD2 COG1CON0,G1MD1 COG1CON0,G1MD0 1.1.3 1.1.3.1 REGISTER AND BIT NAMING EXCEPTIONS Status, Interrupt, and Mirror Bits Status, interrupt enables, interrupt flags, and mirror bits are contained in registers that span more than one peripheral. In these cases, the bit name shown is unique so there is no prefix or short name variant. 1.1.3.2 Legacy Peripherals There are some peripherals that do not strictly adhere to these naming conventions. Peripherals that have existed for many years and are present in almost every device are the exceptions. These exceptions were necessary to limit the adverse impact of the new conventions on legacy code. Peripherals that do adhere to the new convention will include a table in the registers section indicating the long name prefix for each peripheral instance. Peripherals that fall into the exception category will not have this table. These peripherals include, but are not limited to, the following: • EUSART • MSSP DS40001737B-page 9 PIC12(L)F1612/16(L)F1613 FIGURE 1-1: PIC12(L)F1612/16(L)F1613 BLOCK DIAGRAM Rev. 10-000039F 5/23/2014 Program Flash Memory RAM PORTA CLKOUT Timing Generation CPU CLKIN (4) PORTC INTRC Oscillator (Note 3) MCLR (4) TMR6 CWG1 Note 1: 2: 3: 4: TMR4 SMT2 TMR2 TMR1 SMT1 TMR0 C2 Scanner C1 CRC Temp Indicator ZCD1 ADC 10-bit CCP2 DAC FVR CCP1 See applicable chapters for more information on peripherals. See Table 1-1 for peripherals available on specific devices. See Figure 2-1. PIC16(L)F1613 only. 2014-2016 Microchip Technology Inc. DS40001737B-page 10 PIC12(L)F1612/16(L)F1613 TABLE 1-2: PIC12(L)F1612 PINOUT DESCRIPTION Name Function RA0/AN0/C1IN+/DAC1OUT1/ CCP2/CWG1B(1)/ ICSPDAT RA0 AN — ADC Channel input. Comparator positive input. C1IN+ AN — — AN Digital-to-Analog Converter output. CCP2 TTL/ST — Capture/Compare/PWM2. CWG1B TTL/ST — CWG complementary output B. ST CMOS RA1 ICSP™ Data I/O. TTL/ST CMOS/OD General purpose I/O. AN1 AN — ADC Channel input. VREF+ AN — Voltage Reference input. C1IN0- AN — Comparator negative input. ZCD1OUT — CMOS Zero-Cross Detect output. ST — ICSP Programming Clock. ICSPCLK RA2 TTL/ST CMOS/OD General purpose I/O. AN2 AN C1OUT — T0CKI TTL/ST — Timer0 clock input. T4IN TTL/ST — Timer4 input. CCP1 TTL/ST CMOS/OD Capture/Compare/PWM1. — ADC Channel input. CMOS/OD Comparator output. CWG1A — — CWG complementary output A. CWG1IN TTL/ST — CWG complementary input. ZCD1IN AN — Zero-Cross Detect input. INT TTL/ST — External interrupt. SMTSIG2 TTL/ST — SMT2 signal input. RA3 TTL/ST — General purpose input with IOC and WPU. VPP HV — Programming voltage. Timer1 Gate input. RA3/VPP/T1G(1)/T6IN/ SMTWIN2/MCLR T1G TTL/ST — T6IN TTL/ST — Timer6 input. SMTWIN2 TTL/ST — SMT2 window input. MCLR TTL/ST — Master Clear with internal pull-up. (1) RA4 TTL/ST CMOS/OD General purpose I/O. AN3 AN — ADC Channel input. C1IN1- AN — Comparator negative input. T1G TTL/ST — Timer1 Gate input. CWG1B — SMTSIG1 TTL/ST — CLKOUT — CMOS CMOS/OD CWG complementary output A. SMT1 signal input. FOSC/4 output. AN = Analog input or output CMOS = CMOS compatible input or output OD TTL = TTL compatible input ST = Schmitt Trigger input with CMOS levels I2C HV = High Voltage XTAL = Crystal 1: Alternate pin function selected with the APFCON register (Register 12-1). Legend: Note Description TTL/ST CMOS/OD General purpose I/O. AN0 ICSPDAT RA4/AN3/C1IN1-/T1G / CWG1B(1)/SMTSIG1/ CLKOUT Output Type DAC1OUT1 RA1/AN1/VREF+/C1IN0-/ ZCD1OUT/ICSPCLK RA2/AN2/C1OUT/T0CKI/T4IN/ CCP1(1)/CWG1A(1)/ CWG1IN/ZCD1IN/INT/SMTSIG2 Input Type 2014-2016 Microchip Technology Inc. = = Open-Drain Schmitt Trigger input with I2C levels DS40001737B-page 11 PIC12(L)F1612/16(L)F1613 TABLE 1-2: PIC12(L)F1612 PINOUT DESCRIPTION (CONTINUED) Name RA5/CLKIN/T1CKI/T2IN/ CCP1(1)/CWG1A(1)/ SMTWIN1 Function RA5 Input Type Output Type Description TTL/ST CMOS/OD General purpose I/O. CLKIN CMOS — External clock input (EC mode). T1CKI TTL/ST — Timer1 clock input. T2IN TTL/ST — Timer2 input. CCP1 TTL/ST CMOS/OD Capture/Compare/PWM1. CWG1A — SMTWIN1 TTL/ST — SMT1 window input. VDD VDD Power — Positive supply. VSS VSS Power — Ground reference. AN = Analog input or output CMOS = CMOS compatible input or output OD TTL = TTL compatible input ST = Schmitt Trigger input with CMOS levels I2C HV = High Voltage XTAL = Crystal 1: Alternate pin function selected with the APFCON register (Register 12-1). Legend: Note CMOS/OD CWG complementary output A. 2014-2016 Microchip Technology Inc. = = Open-Drain Schmitt Trigger input with I2C levels DS40001737B-page 12 PIC12(L)F1612/16(L)F1613 TABLE 1-3: PIC16(L)F1613 PINOUT DESCRIPTION Name Function Input Type RA0 TTL/ST AN0 AN RA0/AN0/C1IN+/DAC1OUT1/ ICSPDAT CMOS/OD General purpose I/O. — ADC Channel input. C1IN+ AN — Comparator positive input. — AN Digital-to-Analog Converter output. ICSPDAT ST CMOS RA1 TTL/ST ICSP™ Data I/O. CMOS/OD General purpose I/O. AN1 AN — VREF+ AN — Voltage Reference input. C1IN0- AN — Comparator negative input. C2IN0- AN ZCD1OUT — ICSPCLK ST RA2 TTL/ST AN2 AN RA2/AN2/C1OUT/T0CKI/ CWG1IN/ZCD1IN/INT ADC Channel input. CMOS/OD Comparator negative input. — Zero-Cross Detect output. ICSP Programming Clock. CMOS/OD General purpose I/O. — ADC Channel input. C1OUT — T0CKI TTL/ST — Timer0 clock input. CWG1IN TTL/ST — CWG complementary input. ZCD1IN AN — Zero-Cross Detect input. RA3/VPP/T1G(1)/T6IN/ SMTWIN2/MCLR CMOS/OD Comparator output. INT TTL/ST — External interrupt. RA3 TTL/ST — General purpose input with IOC and WPU. VPP HV — Programming voltage. T1G TTL/ST — Timer1 Gate input. Timer6 input. T6IN TTL/ST — SMTWIN2 TTL/ST — SMT2 window input. MCLR TTL/ST — Master Clear with internal pull-up. RA4 TTL/ST RA4/AN3/T1G(1)/SMTSIG1/ CLKOUT CMOS/OD General purpose I/O. AN3 AN — ADC Channel input. T1G TTL/ST — Timer1 Gate input. SMTSIG1 TTL/ST — CLKOUT — CMOS SMT1 signal input. FOSC/4 output. RA5 TTL/ST CLKIN CMOS — T1CKI TTL/ST — Timer1 clock input. T2IN TTL/ST — Timer2 input. CMOS/OD General purpose I/O. External clock input (EC mode). CCP2 TTL/ST SMTWIN1 TTL/ST RC0 TTL/ST AN4 AN — ADC Channel input. C2IN+ AN — Comparator positive input. RC0/AN4/C2IN+ CMOS/OD Capture/Compare/PWM2. — SMT1 window input. CMOS/OD General purpose I/O. AN = Analog input or output CMOS = CMOS compatible input or output OD TTL = TTL compatible input ST = Schmitt Trigger input with CMOS levels I2C HV = High Voltage XTAL = Crystal 1: Alternate pin function selected with the APFCON register (Register 12-1). Legend: Note Description DAC1OUT1 RA1/AN1/VREF+/C1IN0-/C2IN0-/ ZCD1OUT/ICSPCLK RA5/CLKIN/T1CKI/T2IN/ CCP2(1)/SMTWIN1 Output Type 2014-2016 Microchip Technology Inc. = = Open-Drain Schmitt Trigger input with I2C levels DS40001737B-page 13 PIC12(L)F1612/16(L)F1613 TABLE 1-3: PIC16(L)F1613 PINOUT DESCRIPTION (CONTINUED) Name Function Input Type RC1 TTL/ST RC1/AN5/C1IN1-/C2IN1-/T4IN/ SMTSIG2 Output Type Description CMOS/OD General purpose I/O. AN5 AN — ADC Channel input. C1IN1- AN — Comparator negative input. C2IN1- AN — Comparator negative input. T4IN TTL/ST — Timer4 input. — SMT2 signal input. SMTSIG2 TTL/ST RC2 TTL/ST RC2/AN6/C1IN2-/C2IN2-/ CWG1D CMOS/OD General purpose I/O. AN6 AN — ADC Channel input. C1IN2- AN — Comparator negative input. — Comparator negative input. C2IN2- AN CWG1D — RC3 TTL/ST — General purpose input with IOC and WPU. AN7 AN — ADC Channel input. C1IN3- AN — Comparator negative input. C2IN3- AN — Comparator negative input. CCP2 TTL/ST CWG1C — RC3/AN7/C1IN3-/C2IN3-/ CCP2(1)/CWG1C RC4/C2OUT/CWG1B RC4 TTL/ST C2OUT — CWG1B — RC5 TTL/ST RC5/CCP1/CWG1A CMOS/OD CWG complementary output D. CMOS/OD Capture/Compare/PWM2. CMOS/OD CWG complementary output C. CMOS/OD General purpose I/O. CMOS/OD Comparator output. CMOS/OD CWG complementary output B. CMOS/OD General purpose I/O. CCP1 TTL/ST CWG1A — VDD VDD Power — Positive supply. VSS VSS Power — Ground reference. AN = Analog input or output CMOS = CMOS compatible input or output OD TTL = TTL compatible input ST = Schmitt Trigger input with CMOS levels I2C HV = High Voltage XTAL = Crystal 1: Alternate pin function selected with the APFCON register (Register 12-1). Legend: Note CMOS/OD Capture/Compare/PWM1. CMOS/OD CWG complementary output A. 2014-2016 Microchip Technology Inc. = = Open-Drain Schmitt Trigger input with I2C levels DS40001737B-page 14 PIC12(L)F1612/16(L)F1613 2.0 ENHANCED MID-RANGE CPU This family of devices contain an enhanced mid-range 8-bit CPU core. The CPU has 49 instructions. Interrupt capability includes automatic context saving. The hardware stack is 16 levels deep and has Overflow and Underflow Reset capability. Direct, Indirect, and Relative Addressing modes are available. Two File Select Registers (FSRs) provide the ability to read program and data memory. • • • • Automatic Interrupt Context Saving 16-level Stack with Overflow and Underflow File Select Registers Instruction Set FIGURE 2-1: CORE BLOCK DIAGRAM Rev. 10-000055A 7/30/2013 15 Configuration 15 MUX Flash Program Memory Data Bus 16-Level Stack (15-bit) RAM 14 Program Bus 8 Program Counter 12 Program Memory Read (PMR) RAM Addr Addr MUX Instruction Reg Direct Addr 7 5 Indirect Addr 12 12 BSR Reg 15 FSR0 Reg 15 FSR1 Reg STATUS Reg 8 Instruction Decode and Control CLKIN CLKOUT Timing Generation Internal Oscillator Block 2014-2016 Microchip Technology Inc. Power-up Timer Power-on Reset Watchdog Timer Brown-out Reset VDD 3 8 MUX ALU W Reg VSS DS40001737B-page 15 PIC12(L)F1612/16(L)F1613 2.1 Automatic Interrupt Context Saving During interrupts, certain registers are automatically saved in shadow registers and restored when returning from the interrupt. This saves stack space and user code. See Section 7.5 “Automatic Context Saving”, for more information. 2.2 16-Level Stack with Overflow and Underflow These devices have a hardware stack memory 15 bits wide and 16 words deep. A Stack Overflow or Underflow will set the appropriate bit (STKOVF or STKUNF) in the PCON register, and if enabled, will cause a software Reset. See section Section 3.5 “Stack” for more details. 2.3 File Select Registers There are two 16-bit File Select Registers (FSR). FSRs can access all file registers and program memory, which allows one Data Pointer for all memory. When an FSR points to program memory, there is one additional instruction cycle in instructions using INDF to allow the data to be fetched. General purpose memory can now also be addressed linearly, providing the ability to access contiguous data larger than 80 bytes. There are also new instructions to support the FSRs. See Section 3.6 “Indirect Addressing” for more details. 2.4 Instruction Set There are 49 instructions for the enhanced mid-range CPU to support the features of the CPU. See Section 27.0 “Instruction Set Summary” for more details. 2014-2016 Microchip Technology Inc. DS40001737B-page 16 PIC12(L)F1612/16(L)F1613 3.0 MEMORY ORGANIZATION These devices contain the following types of memory: • Program Memory - Configuration Words - Device ID - User ID - Flash Program Memory • Data Memory - Core Registers - Special Function Registers - General Purpose RAM - Common RAM 3.2 High-Endurance Flash This device has a 128-byte section of high-endurance Program Flash Memory (PFM) in lieu of data EEPROM. This area is especially well suited for nonvolatile data storage that is expected to be updated frequently over the life of the end product. See Section 10.2 “Flash Program Memory Overview” for more information on writing data to PFM. See Section 3.2.1.2 “Indirect Read with FSR” for more information about using the FSR registers to read byte data stored in PFM. The following features are associated with access and control of program memory and data memory: • PCL and PCLATH • Stack • Indirect Addressing 3.1 Program Memory Organization The enhanced mid-range core has a 15-bit program counter capable of addressing a 32K x 14 program memory space. Table 3-1 shows the memory sizes implemented. Accessing a location above these boundaries will cause a wrap-around within the implemented memory space. The Reset vector is at 0000h and the interrupt vector is at 0004h (See Figure 3-1). Device Program Memory Space (Words) Last Program Memory Address High-Endurance Flash Memory Address Range(1) PIC12(L)F1612/16(L)F1613 2,048 07FFh 0780h-07FFh Note 1: High-endurance Flash applies to low byte of each address in the range. 2014-2016 Microchip Technology Inc. DS40001737B-page 17 PIC12(L)F1612/16(L)F1613 FIGURE 3-1: PROGRAM MEMORY MAP AND STACK FOR PIC12(L)F1612/16(L)F1613 Rev. 10-000040C 7/30/2013 PC<14:0> CALL, CALLW RETURN, RETLW Interrupt, RETFIE 3.2.1 There are two methods of accessing constants in program memory. The first method is to use tables of RETLW instructions. The second method is to set an FSR to point to the program memory. 3.2.1.1 15 READING PROGRAM MEMORY AS DATA RETLW Instruction The RETLW instruction can be used to provide access to tables of constants. The recommended way to create such a table is shown in Example 3-1. Stack Level 0 Stack Level 1 EXAMPLE 3-1: constants BRW Stack Level 15 On-chip Program Memory Reset Vector 0000h Interrupt Vector 0004h 0005h Page 0 Rollover to Page 0 07FFh 0800h RETLW RETLW RETLW RETLW DATA0 DATA1 DATA2 DATA3 RETLW INSTRUCTION ;Add Index in W to ;program counter to ;select data ;Index0 data ;Index1 data my_function ;… LOTS OF CODE… MOVLW DATA_INDEX call constants ;… THE CONSTANT IS IN W The BRW instruction makes this type of table very simple to implement. If your code must remain portable with previous generations of microcontrollers, then the BRW instruction is not available, so the older table read method must be used. Rollover to Page 0 2014-2016 Microchip Technology Inc. 7FFFh DS40001737B-page 18 PIC12(L)F1612/16(L)F1613 3.2.1.2 Indirect Read with FSR The program memory can be accessed as data by setting bit 7 of the FSRxH register and reading the matching INDFx register. The MOVIW instruction will place the lower eight bits of the addressed word in the W register. Writes to the program memory cannot be performed via the INDF registers. Instructions that access the program memory via the FSR require one extra instruction cycle to complete. Example 3-2 demonstrates accessing the program memory via an FSR. The HIGH operator will set bit<7> if a label points to a location in program memory. EXAMPLE 3-2: ACCESSING PROGRAM MEMORY VIA FSR constants DW DATA0 ;First constant DW DATA1 ;Second constant DW DATA2 DW DATA3 my_function ;… LOTS OF CODE… MOVLW DATA_INDEX ADDLW LOW constants MOVWF FSR1L MOVLW HIGH constants;MSb sets automatically MOVWF FSR1H BTFSC STATUS, C ;carry from ADDLW? INCF FSR1h, f ;yes MOVIW 0[FSR1] ;THE PROGRAM MEMORY IS IN W 2014-2016 Microchip Technology Inc. DS40001737B-page 19 PIC12(L)F1612/16(L)F1613 3.3 Data Memory Organization The data memory is partitioned in 32 memory banks with 128 bytes in a bank. Each bank consists of (Figure 3-2): • • • • 12 core registers 20 Special Function Registers (SFR) Up to 80 bytes of General Purpose RAM (GPR) 16 bytes of common RAM The active bank is selected by writing the bank number into the Bank Select Register (BSR). Unimplemented memory will read as ‘0’. All data memory can be accessed either directly (via instructions that use the TABLE 3-1: file registers) or indirectly via the two File Select Registers (FSR). See Section 3.6 “Indirect Addressing” for more information. Data memory uses a 12-bit address. The upper five bits of the address define the Bank address and the lower seven bits select the registers/RAM in that bank. 3.3.1 CORE REGISTERS The core registers contain the registers that directly affect the basic operation. The core registers occupy the first 12 addresses of every data memory bank (addresses x00h/x80h through x0Bh/x8Bh). These registers are listed below in Table 3-1. For detailed CORE REGISTERS Addresses BANKx x00h or x80h x01h or x81h x02h or x82h x03h or x83h x04h or x84h x05h or x85h x06h or x86h x07h or x87h x08h or x88h x09h or x89h x0Ah or x8Ah x0Bh or x8Bh INDF0 INDF1 PCL STATUS FSR0L FSR0H FSR1L FSR1H BSR WREG PCLATH INTCON 2014-2016 Microchip Technology Inc. DS40001737B-page 20 PIC12(L)F1612/16(L)F1613 3.3.1.1 STATUS Register The STATUS register, shown in Register 3-1, contains: • the arithmetic status of the ALU • the Reset status The STATUS register can be the destination for any instruction, like any other register. If the STATUS register is the destination for an instruction that affects the Z, DC or C bits, then the write to these three bits is disabled. These bits are set or cleared according to the device logic. Furthermore, the TO and PD bits are not writable. Therefore, the result of an instruction with the STATUS register as destination may be different than intended. REGISTER 3-1: U-0 It is recommended, therefore, that only BCF, BSF, SWAPF and MOVWF instructions are used to alter the STATUS register, because these instructions do not affect any Status bits. For other instructions not affecting any Status bits (Refer to Section 27.0 “Instruction Set Summary”). Note 1: The C and DC bits operate as Borrow and Digit Borrow out bits, respectively, in subtraction. STATUS: STATUS REGISTER U-0 — For example, CLRF STATUS will clear the upper three bits and set the Z bit. This leaves the STATUS register as ‘000u u1uu’ (where u = unchanged). U-0 — R-1/q — TO R-1/q PD R/W-0/u Z R/W-0/u (1) DC bit 7 R/W-0/u C(1) bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared q = Value depends on condition bit 7-5 Unimplemented: Read as ‘0’ bit 4 TO: Time-Out bit 1 = After power-up, CLRWDT instruction or SLEEP instruction 0 = A WDT time-out occurred bit 3 PD: Power-Down bit 1 = After power-up or by the CLRWDT instruction 0 = By execution of the SLEEP instruction bit 2 Z: Zero bit 1 = The result of an arithmetic or logic operation is zero 0 = The result of an arithmetic or logic operation is not zero bit 1 DC: Digit Carry/Digit Borrow bit (ADDWF, ADDLW, SUBLW, SUBWF instructions)(1) 1 = A carry-out from the 4th low-order bit of the result occurred 0 = No carry-out from the 4th low-order bit of the result bit 0 C: Carry/Borrow bit(1) (ADDWF, ADDLW, SUBLW, SUBWF instructions)(1) 1 = A carry-out from the Most Significant bit of the result occurred 0 = No carry-out from the Most Significant bit of the result occurred Note 1: For Borrow, the polarity is reversed. A subtraction is executed by adding the two’s complement of the second operand. For rotate (RRF, RLF) instructions, this bit is loaded with either the high-order or low-order bit of the source register. 2014-2016 Microchip Technology Inc. DS40001737B-page 21 PIC12(L)F1612/16(L)F1613 3.3.2 SPECIAL FUNCTION REGISTER The Special Function Registers are registers used by the application to control the desired operation of peripheral functions in the device. The Special Function Registers occupy the 20 bytes after the core registers of every data memory bank (addresses x0Ch/x8Ch through x1Fh/x9Fh). The registers associated with the operation of the peripherals are described in the appropriate peripheral chapter of this data sheet. 3.3.3 GENERAL PURPOSE RAM There are up to 80 bytes of GPR in each data memory bank. The Special Function Registers occupy the 20 bytes after the core registers of every data memory bank (addresses x0Ch/x8Ch through x1Fh/x9Fh). 3.3.3.1 FIGURE 3-2: BANKED MEMORY PARTITIONING Rev. 10-000041A 7/30/2013 7-bit Bank Offset Memory Region 00h Core Registers (12 bytes) 0Bh 0Ch Special Function Registers (20 bytes maximum) 1Fh 20h Linear Access to GPR The general purpose RAM can be accessed in a nonbanked method via the FSRs. This can simplify access to large memory structures. See Section 3.6.2 “Linear Data Memory” for more information. 3.3.4 General Purpose RAM (80 bytes maximum) COMMON RAM There are 16 bytes of common RAM accessible from all banks. 3.3.5 DEVICE MEMORY MAPS The memory maps are shown in Table 3-2 through Table 3-7. 6Fh 70h Common RAM (16 bytes) 7Fh 2014-2016 Microchip Technology Inc. DS40001737B-page 22 2014-2016 Microchip Technology Inc. TABLE 3-2: PIC12(L)F1612 MEMORY MAP, BANK 0-7 BANK 0 000h BANK 1 080h Core Registers (Table 3-1) PORTA — — — — PIR1 PIR2 PIR3 PIR4 TMR0 TMR1L TMR1H T1CON T1GCON TMR2 PR2 T2CON T2HLT T2CLKCON T2RST Core Registers (Table 3-1) 08Bh 08Ch 08Dh 08Eh 08Fh 090h 091h 092h 093h 094h 095h 096h 097h 098h 099h 09Ah 09Bh 09Ch 09Dh 09Eh 09Fh 0A0h General Purpose Register 80 Bytes Common RAM 07Fh Legend: ADCON0 ADCON1 ADCON2 Core Registers (Table 3-1) 10Bh 10Ch 10Dh 10Eh 10Fh 110h 111h 112h 113h 114h 115h 116h 117h 118h 119h 11Ah 11Bh 11Ch 11Dh 11Eh 11Fh 120h General Purpose Register 80 Bytes 0EFh 0F0h 06Fh 070h TRISA — — — — PIE1 PIE2 PIE3 PIE4 OPTION_REG PCON — OSCTUNE OSCCON OSCSTAT ADRESL ADRESH 0FFh Common RAM (Accesses 70h – 7Fh) BANK 3 180h LATA — — — — CM1CON0 CM1CON1 — — CMOUT BORCON FVRCON DAC1CON0 DAC1CON1 — — ZCD1CON APFCON — — Core Registers (Table 3-1) 18Bh 18Ch 18Dh 18Eh 18Fh 190h 191h 192h 193h 194h 195h 196h 197h 198h 199h 19Ah 19Bh 19Ch 19Dh 19Eh 19Fh 1A0h General Purpose Register 80 Bytes 16Fh 170h 17Fh Common RAM (Accesses 70h – 7Fh) = Unimplemented data memory locations, read as ‘0’. BANK 4 200h ANSELA — — — — PMADRL PMADRH PMDATL PMDATH PMCON1 PMCON2 VREGCON — — — — — — — — Core Registers (Table 3-1) 20Bh 20Ch 20Dh 20Eh 20Fh 210h 211h 212h 213h 214h 215h 216h 217h 218h 219h 21Ah 21Bh 21Ch 21Dh 21Eh 21Fh 220h Unimplemented Read as ‘0’ 1EFh 1F0h 1FFh Common RAM (Accesses 70h – 7Fh) BANK 5 280h WPUA — — — — — — — — — — — — — — — — — — — Core Registers (Table 3-1) 28Bh 28Ch 28Dh 28Eh 28Fh 290h 291h 292h 293h 294h 295h 296h 297h 298h 299h 29Ah 29Bh 29Ch CCP1RL CCP1RH CCP1CON CCP1CAP — — — 29Dh 29Eh 29Fh 2A0h CCPTMRS — Unimplemented Read as ‘0’ 26Fh 270h 27Fh Common RAM (Accesses 70h – 7Fh) BANK 6 300h ODCONA — — — — CCP2RL CCP2RH CCP2CON CCP2CAP — — Core Registers (Table 3-1) 30Bh 30Ch 30Dh 30Eh 30Fh 310h 311h 312h 313h 314h 315h 316h 317h 318h 319h 31Ah 31Bh 31Ch 31Dh 31Eh 31Fh 320h Unimplemented Read as ‘0’ 2EFh 2F0h 2FFh Common RAM (Accesses 70h – 7Fh) BANK 7 380h SLRCONA — — — — — — — — — — — — — — — — — — — Core Registers (Table 3-1) 38Bh 38Ch 38Dh 38Eh 38Fh 390h 391h 392h 393h 394h 395h 396h 397h 398h 399h 39Ah 39Bh 39Ch 39Dh 39Eh 39Fh 3A0h Unimplemented Read as ‘0’ 36Fh 370h 37Fh Common RAM (Accesses 70h – 7Fh) INLVLA — — — — IOCAP IOCAN IOCAF — — — — — — — — — — — — Unimplemented Read as ‘0’ 3EFh 3F0h 3FFh Common RAM (Accesses 70h – 7Fh) DS40001737B-page 23 PIC12(L)F1612/16(L)F1613 00Bh 00Ch 00Dh 00Eh 00Fh 010h 011h 012h 013h 014h 015h 016h 017h 018h 019h 01Ah 01Bh 01Ch 01Dh 01Eh 01Fh 020h BANK 2 100h 2014-2016 Microchip Technology Inc. TABLE 3-3: PIC16(L)F1613 MEMORY MAP, BANK 0-7 BANK 0 000h BANK 1 080h Core Registers (Table 3-1) PORTA — PORTC — — PIR1 PIR2 PIR3 PIR4 TMR0 TMR1L TMR1H T1CON T1GCON TMR2 PR2 T2CON T2HLT T2CLKCON T2RST Core Registers (Table 3-1) 08Bh 08Ch 08Dh 08Eh 08Fh 090h 091h 092h 093h 094h 095h 096h 097h 098h 099h 09Ah 09Bh 09Ch 09Dh 09Eh 09Fh 0A0h General Purpose Register 80 Bytes Common RAM 07Fh Legend: ADCON0 ADCON1 ADCON2 Core Registers (Table 3-1) 10Bh 10Ch 10Dh 10Eh 10Fh 110h 111h 112h 113h 114h 115h 116h 117h 118h 119h 11Ah 11Bh 11Ch 11Dh 11Eh 11Fh 120h General Purpose Register 80 Bytes 0EFh 0F0h 06Fh 070h TRISA — TRISC — — PIE1 PIE2 PIE3 PIE4 OPTION_REG PCON — OSCTUNE OSCCON OSCSTAT ADRESL ADRESH 0FFh Common RAM (Accesses 70h – 7Fh) BANK 3 180h LATA — LATC — — CM1CON0 CM1CON1 CM2CON0 CM2CON1 CMOUT BORCON FVRCON DAC1CON0 DAC1CON1 — — ZCD1CON APFCON — — Core Registers (Table 3-1) 18Bh 18Ch 18Dh 18Eh 18Fh 190h 191h 192h 193h 194h 195h 196h 197h 198h 199h 19Ah 19Bh 19Ch 19Dh 19Eh 19Fh 1A0h General Purpose Register 80 Bytes 16Fh 170h 17Fh Common RAM (Accesses 70h – 7Fh) = Unimplemented data memory locations, read as ‘0’. BANK 4 200h ANSELA — ANSELC — — PMADRL PMADRH PMDATL PMDATH PMCON1 PMCON2 VREGCON — — — — — — — — Core Registers (Table 3-1) 20Bh 20Ch 20Dh 20Eh 20Fh 210h 211h 212h 213h 214h 215h 216h 217h 218h 219h 21Ah 21Bh 21Ch 21Dh 21Eh 21Fh 220h Unimplemented Read as ‘0’ 1EFh 1F0h 1FFh Common RAM (Accesses 70h – 7Fh) BANK 5 280h WPUA — WPUC — — — — — — — — — — — — — — — — — Core Registers (Table 3-1) 28Bh 28Ch 28Dh 28Eh 28Fh 290h 291h 292h 293h 294h 295h 296h 297h 298h 299h 29Ah 29Bh 29Ch CCPR1L CCPR1H CCP1CON CCP1CAP — — — 29Dh 29Eh 29Fh 2A0h CCPTMRS — Unimplemented Read as ‘0’ 26Fh 270h 27Fh Common RAM (Accesses 70h – 7Fh) BANK 6 300h ODCONA — ODCONC — — CCPR2L CCPR2H CCP2CON CCP2CAP — — Core Registers (Table 3-1) 30Bh 30Ch 30Dh 30Eh 30Fh 310h 311h 312h 313h 314h 315h 316h 317h 318h 319h 31Ah 31Bh 31Ch 31Dh 31Eh 31Fh 320h Unimplemented Read as ‘0’ 2EFh 2F0h 2FFh Common RAM (Accesses 70h – 7Fh) BANK 7 380h SLRCONA — SLRCONC — — — — — — — — — — — — — — — — — Core Registers (Table 3-1) 38Bh 38Ch 38Dh 38Eh 38Fh 390h 391h 392h 393h 394h 395h 396h 397h 398h 399h 39Ah 39Bh 39Ch 39Dh 39Eh 39Fh 3A0h Unimplemented Read as ‘0’ 36Fh 370h 37Fh Common RAM (Accesses 70h – 7Fh) INLVLA — INLVLC — — IOCAP IOCAN IOCAF — — — IOCCP IOCCN IOCCF — — — — — — Unimplemented Read as ‘0’ 3EFh 3F0h 3FFh Common RAM (Accesses 70h – 7Fh) DS40001737B-page 24 PIC12(L)F1612/16(L)F1613 00Bh 00Ch 00Dh 00Eh 00Fh 010h 011h 012h 013h 014h 015h 016h 017h 018h 019h 01Ah 01Bh 01Ch 01Dh 01Eh 01Fh 020h BANK 2 100h 2014-2016 Microchip Technology Inc. TABLE 3-4: PIC12(L)F1612/16(L)F1613 MEMORY MAP, BANK 8-23 BANK 8 400h BANK 9 480h Core Registers (Table 3-1) — — — — — — — TMR4 PR4 T4CON T4HLT T4CLKCON T4RST — TMR6 PR6 T6CON T6HLT T6CLKCON T6RST Core Registers (Table 3-1) 48Bh 48Ch 48Dh 48Eh 48Fh 490h 491h 492h 493h 494h 495h 496h 497h 498h 499h 49Ah 49Bh 49Ch 49Dh 49Eh 49Fh 4A0h Unimplemented Read as ‘0’ 46Fh 470h Accesses 70h – 7Fh 47Fh 4EFh 4F0h 4FFh Accesses 70h – 7Fh Core Registers (Table 3-1 ) DS40001737B-page 25 87Fh Legend: Accesses 70h – 7Fh 56Fh 570h 57Fh 8FFh 5EFh 5F0h 5FFh = Unimplemented data memory locations, read as ‘0’. 66Fh 670h 67Fh 6EFh 6F0h 6FFh 76Fh 770h 77Fh 78Bh 78Ch 78Dh 78Eh 78Fh 790h 791h 792h 793h 794h 795h 796h 797h 798h 799h 79Ah 79Bh 79Ch 79Dh 79Eh 79Fh 7A0h 7EFh 7F0h 7FFh BANK 23 Core Registers (Table 3-1) B8Bh B8Ch Unimplemented Read as ‘0’ B7Fh Accesses 70h – 7Fh B80h Core Registers (Table 3-1) B6Fh B70h — — — — — CRCDATL CRCDATH CRCACCL CRCACCH CRCSHIFTL CRCSHIFTH CRCXORL CRCXORH CRCCON0 CRCCON1 — — — — — Unimplemented Read as ‘0’ BANK 22 Unimplemented Read as ‘0’ AFFh Accesses 70h – 7Fh B0Bh B0Ch Accesses 70h – 7Fh Core Registers (Table 3-1) Unimplemented Read as ‘0’ Core Registers (Table 3-1) AEFh AF0h — — — — — WDTCON0 WDTCON1 WDTPSL WDTPSH WDTTMR — — SCANLADRL SCANLADRH SCANHADRL SCANHADRH SCANCON0 SCANTRIG — — B00h A8Bh A8Ch Accesses 70h – 7Fh 70Bh 70Ch 70Dh 70Eh 70Fh 710h 711h 712h 713h 714h 715h 716h 717h 718h 719h 71Ah 71Bh 71Ch 71Dh 71Eh 71Fh 720h BANK 21 Unimplemented Read as ‘0’ A7Fh Accesses 70h – 7Fh BANK 15 780h Core Registers (Table 3-1) Unimplemented Read as ‘0’ Core Registers (Table 3-1) A6Fh A70h — — — — — CWG1DBR CWG1DBF CWG1AS0 CWG1AS1 CWG1OCON0 CWG1CON0 CWG1CON1 CWG1OCON1 CWG1CLKCON CWG1ISM — — — — — A80h A0Bh A0Ch Accesses 70h – 7Fh 68Bh 68Ch 68Dh 68Eh 68Fh 690h 691h 692h 693h 694h 695h 696h 697h 698h 699h 69Ah 69Bh 69Ch 69Dh 69Eh 69Fh 6A0h BANK 20 Unimplemented Read as ‘0’ 9FFh Accesses 70h – 7Fh BANK 14 700h Core Registers (Table 3-1) Unimplemented Read as ‘0’ Core Registers (Table 3-1) 9EFh 9F0h — — — — — — — — — — — — — — — — — — — — A00h 98Bh 98Ch Accesses 70h – 7Fh 60Bh 60Ch 60Dh 60Eh 60Fh 610h 611h 612h 613h 614h 615h 616h 617h 618h 619h 61Ah 61Bh 61Ch 61Dh 61Eh 61Fh 620h BANK 19 Unimplemented Read as ‘0’ 97Fh Accesses 70h – 7Fh BANK 13 680h Core Registers (Table 3-1) Unimplemented Read as ‘0’ Core Registers (Table 3-1) 96Fh 970h — — — — — — — — — — — — — — — — — — — — 980h 90Bh 90Ch Accesses 70h – 7Fh 58Bh 58Ch 58Dh 58Eh 58Fh 590h 591h 592h 593h 594h 595h 596h 597h 598h 599h 59Ah 59Bh 59Ch 59Dh 59Eh 59Fh 5A0h BANK 18 Unimplemented Read as ‘0’ 8EFh 8F0h Accesses 70h – 7Fh BANK 12 600h Core Registers (Table 3-1) Unimplemented Read as ‘0’ Core Registers (Table 3-1) Unimplemented Read as ‘0’ — — — — — — — — — — — — — — — — — — — — 900h 88Bh 88Ch 86Fh 870h 50Bh 50Ch 50Dh 50Eh 50Fh 510h 511h 512h 513h 514h 515h 516h 517h 518h 519h 51Ah 51Bh 51Ch 51Dh 51Eh 51Fh 520h BANK 17 880h 80Bh 80Ch Core Registers (Table 3-1) Unimplemented Read as ‘0’ BANK 16 800h — — — — — — — — — — — — — — — — — — — — BANK 11 580h Accesses 70h – 7Fh Unimplemented Read as ‘0’ BEFh BF0h BFFh Accesses 70h – 7Fh PIC12(L)F1612/16(L)F1613 40Bh 40Ch 40Dh 40Eh 40Fh 410h 411h 412h 413h 414h 415h 416h 417h 418h 419h 41Ah 41Bh 41Ch 41Dh 41Eh 41Fh 420h BANK 10 500h 2014-2016 Microchip Technology Inc. TABLE 3-5: PIC12(L)F1612/16(L)F1613 MEMORY MAP, BANK 24-31 BANK 24 C00h BANK 25 C80h Core Registers (Table 3-1) — — — — — — — — — — — — — — — — — — — — Core Registers (Table 3-1) C8Bh C8Ch C8Dh C8Eh C8Fh C90h C91h C92h C93h C94h C95h C96h C97h C98h C99h C9Ah C9Bh C9Ch C9Dh C9Eh C9Fh CA0h Unimplemented Read as ‘0’ C6Fh C70h CFFh Core Registers (Table 3-1) D0Bh D0Ch D0Dh D0Eh D0Fh D10h D11h D12h D13h D14h D15h D16h D17h D18h D19h D1Ah D1Bh D1Ch D1Dh D1Eh D1Fh D20h Unimplemented Read as ‘0’ CEFh CF0h Accesses 70h – 7Fh Legend: — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — BANK 28 E00h Core Registers (Table 3-1) D8Bh D8Ch D8Dh D8Eh D8Fh D90h D91h D92h D93h D94h D95h D96h D97h See Table 3-6 for D98h register mapping D99h details D9Ah D9Bh D9Ch D9Dh D9Eh D9Fh DA0h D6Fh D70h E0Bh E0Ch E0Dh E0Eh E0Fh E10h E11h E12h E13h E14h E15h E16h E17h E18h E19h E1Ah E1Bh E1Ch E1Dh E1Eh E1Fh E20h Accesses 70h – 7Fh D7Fh — — — — — — — — — — — — — — — — — — — — E6Fh E70h Accesses 70h – 7Fh DFFh E8Bh E8Ch E8Dh E8Eh E8Fh E90h E91h E92h E93h E94h E95h E96h E97h E98h E99h E9Ah E9Bh E9Ch E9Dh E9Eh E9Fh EA0h — — — — — — — — — — — — — — — — — — — — EEFh EF0h F0Bh F0Ch F0Dh F0Eh F0Fh F10h F11h F12h F13h F14h F15h F16h F17h F18h F19h F1Ah F1Bh F1Ch F1Dh F1Eh F1Fh F20h — — — — — — — — — — — — — — — — — — — — Core Registers (Table 3-1) F8Bh F8Ch F8Dh F8Eh F8Fh F90h F91h F92h F93h F94h F95h F96h F97h See Table 3-7 for F98h register mapping F99h details F9Ah F9Bh F9Ch F9Dh F9Eh F9Fh FA0h Unimplemented Read as ‘0’ F6Fh F70h Accesses 70h – 7Fh EFFh BANK 31 F80h Core Registers (Table 3-1) Unimplemented Read as ‘0’ Accesses 70h – 7Fh E7Fh BANK 30 F00h Core Registers (Table 3-1) Unimplemented Read as ‘0’ DEFh DF0h = Unimplemented data memory locations, read as ‘0’. BANK 29 E80h Core Registers (Table 3-1) Unimplemented Read as ‘0’ Accesses 70h – 7Fh CFFh BANK 27 D80h FEFh FF0h Accesses 70h – 7Fh F7Fh Accesses 70h – 7Fh FFFh DS40001737B-page 26 PIC12(L)F1612/16(L)F1613 C0Bh C0Ch C0Dh C0Eh C0Fh C10h C11h C12h C13h C14h C15h C16h C17h C18h C19h C1Ah C1Bh C1Ch C1Dh C1Eh C1Fh C20h BANK 26 D00h PIC12(L)F1612/16(L)F1613 TABLE 3-6: PIC12(L)F1612/16(L)F1613 MEMORY MAP, BANK 27 TABLE 3-7: PIC12(L)F1612/16(L)F1613 MEMORY MAP, BANK 31 Bank 27 D8Ch D8Dh D8Eh D8Fh D90h D91h D92h D93h D94h D95h D96h D97h D98h D99h D9Ah D9Bh D9Ch D9Dh D9Eh D9Fh DA0h DA1h DA2h DA3h DA4h DA5h DA6h DA7h DA8h DA9h DAAh DABh DACh DADh DAEh DAFh DB0h SMT1TMRL SMT1TMRH SMT1TMRU SMT1CPRL SMT1CPRH SMT1CPRU SMT1CPWL SMT1CPWH SMT1CPWU SMT1PRL SMT1PRH SMT1PRU SMT1CON0 SMT1CON1 SMT1STAT SMT1CLK SMT1SIG SMT1WIN SMT2TMRL SMT2TMRH SMT2TMRU SMT2CPRL SMT2CPRH SMT2CPRU SMT2CPWL SMT2CPWH SMT2CPWU SMT2PRL SMT2PRH SMT2PRU SMT2CON0 SMT2CON1 SMT2STAT SMT2CLK SMT2SIG SMT2WIN Bank 31 F8Ch Unimplemented Read as ‘0’ FE3h FE4h FE5h FE6h FE7h FE8h FE9h FEAh FEBh FECh FEDh FEEh FEFh Legend: STATUS_SHAD WREG_SHAD BSR_SHAD PCLATH_SHAD FSR0L_SHAD FSR0H_SHAD FSR1L_SHAD FSR1H_SHAD — STKPTR TOSL TOSH = Unimplemented data memory locations, read as ‘0’. — DEFh Legend: = Unimplemented data memory locations, read as ‘0’. 2014-2016 Microchip Technology Inc. DS40001737B-page 27 PIC12(L)F1612/16(L)F1613 3.3.6 CORE FUNCTION REGISTERS SUMMARY The Core Function registers listed in Table 3-8 can be addressed from any Bank. TABLE 3-8: Addr Name CORE FUNCTION REGISTERS SUMMARY Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on POR, BOR Value on all other Resets Bank 0-31 x00h or INDF0 x80h Addressing this location uses contents of FSR0H/FSR0L to address data memory (not a physical register) xxxx xxxx uuuu uuuu x01h or INDF1 x81h Addressing this location uses contents of FSR1H/FSR1L to address data memory (not a physical register) xxxx xxxx uuuu uuuu x02h or PCL x82h Program Counter (PC) Least Significant Byte 0000 0000 0000 0000 ---1 1000 ---q quuu x03h or STATUS x83h — — — TO PD Z DC C x04h or FSR0L x84h Indirect Data Memory Address 0 Low Pointer 0000 0000 uuuu uuuu x05h or FSR0H x85h Indirect Data Memory Address 0 High Pointer 0000 0000 0000 0000 x06h or FSR1L x86h Indirect Data Memory Address 1 Low Pointer 0000 0000 uuuu uuuu x07h or FSR1H x87h Indirect Data Memory Address 1 High Pointer 0000 0000 0000 0000 ---0 0000 ---0 0000 0000 0000 uuuu uuuu -000 0000 -000 0000 0000 0000 0000 0000 x08h or BSR x88h — x09h or WREG x89h — BSR<4:0> Working Register x0Ah or PCLATH x8Ah — x0Bh or INTCON x8Bh GIE Legend: — Write Buffer for the upper 7 bits of the Program Counter PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF x = unknown, u = unchanged, q = value depends on condition, - = unimplemented, read as ‘0’, r = reserved. Shaded locations are unimplemented, read as ‘0’. 2014-2016 Microchip Technology Inc. DS40001737B-page 28 2014-2016 Microchip Technology Inc. TABLE 3-9: Addr SPECIAL FUNCTION REGISTER SUMMARY Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on POR, BOR Value on all other Resets — — RA5 RA4 RA3 RA2 RA1 RA0 --xx xxxx --xx xxxx — — — RC5 RC4 RC3 RC2 RC1 RC0 --xx xxxx --xx xxxx Bank 0 00Ch PORTA 00Dh — 00Eh PORTC(4) Unimplemented 00Fh — Unimplemented — — 010h — Unimplemented — — 00-- -000 — PIR1 TMR1GIF ADIF — — — CCP1IF TMR2IF TMR1IF 00-- -000 012h PIR2 — C2IF(4) C1IF — — TMR6IF TMR4IF CCP2IF -00- -000 -00- -000 013h PIR3 — — CWGIF ZCDIF — — — — --00 ---- --00 ---- 014h PIR4 SCANIF CRCIF SMT2PWAIF SMT2PRAIF SMT2IF SMT1PWAIF SMT1PRAIF SMT1IF 0000 0000 0000 0000 015h TMR0 Holding Register for the 8-bit Timer0 Count xxxx xxxx uuuu uuuu 016h TMR1L Holding Register for the Least Significant Byte of the 16-bit TMR1 Count xxxx xxxx uuuu uuuu 017h TMR1H Holding Register for the Most Significant Byte of the 16-bit TMR1 Count xxxx xxxx uuuu uuuu 018h T1CON 0000 -0-0 uuuu -u-u 019h T1GCON 0000 0x00 uuuu uxuu 01Ah TMR2 Timer2 Module Register 0000 0000 0000 0000 01Bh PR2 Timer2 Period Register 1111 1111 1111 1111 01Ch T2CON ON 01Dh T2HLT PSYNC CKPOL CKSYNC — 01Eh T2CLKCON — — — — 01Fh T2RST — — — — TMR1CS<1:0> TMR1GE T1GPOL T1CKPS<1:0> T1GTM T1GSPM — T1SYNC T1GGO/ DONE T1GVAL CKPS<2:0> — — TMR1ON T1GSS<1:0> OUTPS<3:0> 0000 0000 0000 0000 MODE<3:0> 000- 0000 000- 0000 ---- -000 ---- -000 ---- 0000 ---- 0000 T2CS<2:0> RSEL<3:0> Legend: x = unknown, u = unchanged, q = value depends on condition, - = unimplemented, r = reserved. Shaded locations are unimplemented, read as ‘0’. Note 1: PIC12F1612/16F1613 only. 2: Unimplemented, read as ‘1’. 3: PIC12(L)F1612 only. 4: PIC16(L)F1613 only. DS40001737B-page 29 PIC12(L)F1612/16(L)F1613 011h 2014-2016 Microchip Technology Inc. TABLE 3-9: Addr SPECIAL FUNCTION REGISTER SUMMARY (CONTINUED) Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on POR, BOR Value on all other Resets — — TRISA5 TRISA4 —(2) TRISA2 TRISA1 TRISA0 --11 1111 --11 1111 Bank 1 08Ch TRISA 08Dh — 08Eh TRISC(4) 08Fh — Unimplemented 090h — Unimplemented 091h PIE1 TMR1GIE ADIE 092h PIE2 — C2IE(4) 093h PIE3 — — 094h PIE4 SCANIE CRCIE 095h OPTION_REG WPUEN INTEDG 096h PCON STKOVF STKUNF 097h — Unimplemented — — TRISC5 TRISC4 — TRISC3 TRISC2 TRISC1 TRISC0 — — --11 1111 --11 1111 — — — — 00-- -000 00-- -000 — — CCP1IE TMR2IE TMR1IE C1IE — — TMR6IE TMR4IE CCP2IE -00- -000 -00- -000 CWGIE ZCDIE — — — — --00 ---- --00 ---- SMT2PWAIE SMT2PRAIE SMT2IE SMT1PWAIE SMT1PRAIE SMT1IE TMR0CS TMR0SE PSA WDTWV RWDT RMCLR PS<2:0> RI POR BOR 0000 0000 0000 0000 1111 1111 1111 1111 00-1 11qq qq-q qquu — — Unimplemented — — OSCTUNE 099h OSCCON 09Ah OSCSTAT 09Bh ADRESL ADC Result Register Low 09Ch ADRESH ADC Result Register High 09Dh ADCON0 — 09Eh ADCON1 ADFM 09Fh ADCON2 SPLLEN — IRCF<3:0> PLLR — HFIOFR — HFIOFL MFIOFR CHS<4:0> ADCS<2:0> TRIGSEL<3:0> SCS<1:0> LFIOFR GO/DONE — — — — HFIOFS ADON ADPREF<1:0> — — --00 0000 --00 0000 0011 1-00 0011 1-00 -0-0 0000 -q-q qqqq xxxx xxxx uuuu uuuu xxxx xxxx uuuu uuuu -000 0000 -000 0000 0000 --00 0000 --00 0000 ---- 0000 ---- Legend: x = unknown, u = unchanged, q = value depends on condition, - = unimplemented, r = reserved. Shaded locations are unimplemented, read as ‘0’. Note 1: PIC12F1612/16F1613 only. 2: Unimplemented, read as ‘1’. 3: PIC12(L)F1612 only. 4: PIC16(L)F1613 only. DS40001737B-page 30 PIC12(L)F1612/16(L)F1613 098h TUN<5:0> 2014-2016 Microchip Technology Inc. TABLE 3-9: Addr SPECIAL FUNCTION REGISTER SUMMARY (CONTINUED) Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on POR, BOR Value on all other Resets — — LATA5 LATA4 — LATA2 LATA1 LATA0 --xx -xxx --uu -uuu Bank 2 10Ch LATA 10Dh — 10Eh LATC(4) 10Fh — Unimplemented 110h — Unimplemented 111h CM1CON0 C1ON C1OUT 112h CM1CON1 C1INTP C1INTN 113h CM2CON0(4) C2ON C2OUT 114h (4) CM2CON1 C2INTP C2INTN 115h CMOUT — — Unimplemented — — LATC5 C1OE LATC4 LATC3 — C1POL C2POL — C2PCH<1:0> — C1SP — C1PCH<1:0> C2OE LATC2 — DAC1EN — DAC1OE1 — DAC1PSS<1:0> — — 11Ch ZCD1CON 11Dh APFCON 11Eh — 11Fh — ADFVR<1:0> — — 10-- ---q uu-- ---u 0q00 0000 0q00 0000 0-0- 00-- 0-0- 00-- 0000 0000 0000 0000 Unimplemented — — Unimplemented — — DAC1R<7:0> ZCD1EN ZCD1OE ZCD1OUT ZCD1POL — — ZCD1INTP ZCD1INTN 0000 --00 0000 --00 — CWGASEL(3) CWGBSEL(3) — T1GSEL — CCP2SEL(4) CCP1SEL(3) -00- 0-00 -00- 0-00 Unimplemented — — Unimplemented — — Legend: x = unknown, u = unchanged, q = value depends on condition, - = unimplemented, r = reserved. Shaded locations are unimplemented, read as ‘0’. Note 1: PIC12F1612/16F1613 only. 2: Unimplemented, read as ‘1’. 3: PIC12(L)F1612 only. 4: PIC16(L)F1613 only. DS40001737B-page 31 PIC12(L)F1612/16(L)F1613 11Ah 0000 -000 ---- --00 BORRDY CDAFVR<1:0> 11Bh 0000 -000 — — TSRNG — 0000 -100 ---- --00 — — TSEN — 0000 -100 0000 -100 — BORFS — 0000 -000 MC1OUT FVRRDY — 0000 -100 MC2OUT(4) FVREN --uu uuuu 0000 -000 C2NCH<2:0> SBOREN — --xx xxxx C2SYNC — BORCON DAC1CON0 C2HYS — FVRCON DAC1CON1 C1SYNC — 117h 119h C1HYS LATC0 C1NCH<2:0> C2SP 116h 118h LATC1 — 2014-2016 Microchip Technology Inc. TABLE 3-9: Addr SPECIAL FUNCTION REGISTER SUMMARY (CONTINUED) Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on POR, BOR Value on all other Resets — — — ANSA4 — ANSA2 ANSA1 ANSA0 ---1 -111 ---1 -111 Bank 3 18Ch ANSELA 18Dh — 18Eh ANSELC(4) 18Fh — Unimplemented — — — — Unimplemented 191h PMADRL Flash Program Memory Address Register Low Byte 192h PMADRH 193h PMDATL —(2) ANSC2 ANSC1 ANSC0 Flash Program Memory Address Register High Byte Flash Program Memory Read Data Register Low Byte 194h PMDATH — — 195h PMCON1 —(2) CFGS 196h PMCON2 197h VREGCON(1) — ---- 1111 ---- 1111 — — Flash Program Memory Read Data Register High Byte LWLO FREE WRERR WREN WR RD Flash Program Memory Control Register 2 — — — — — — VREGPM Reserved — — 0000 0000 0000 0000 1000 0000 1000 0000 xxxx xxxx uuuu uuuu --xx xxxx --uu uuuu 1000 x000 1000 q000 0000 0000 0000 0000 ---- --01 ---- --01 — — --11 1111 --11 1111 — — --11 1111 --11 1111 — — Unimplemented Bank 4 20Ch WPUA 20Dh — 20Eh WPUC(4) 20Fh to 21Fh — — — WPUA5 WPUA4 WPUA3 WPUA2 WPUA1 WPUA0 Unimplemented — — WPUC5 WPUC4 WPUC3 WPUC2 WPUC1 WPUC0 Unimplemented Legend: x = unknown, u = unchanged, q = value depends on condition, - = unimplemented, r = reserved. Shaded locations are unimplemented, read as ‘0’. Note 1: PIC12F1612/16F1613 only. 2: Unimplemented, read as ‘1’. 3: PIC12(L)F1612 only. 4: PIC16(L)F1613 only. DS40001737B-page 32 PIC12(L)F1612/16(L)F1613 — ANSC3 Unimplemented 190h 198h to 19Fh — — 2014-2016 Microchip Technology Inc. TABLE 3-9: Addr SPECIAL FUNCTION REGISTER SUMMARY (CONTINUED) Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on POR, BOR Value on all other Resets — — ODA5 ODA4 — ODA2 ODA1 ODA0 --00 -000 --00 -000 Bank 5 28Ch ODCONA 28Dh — 28Eh ODCONC(4) 28Fh — Unimplemented — — ODC5 ODC4 — Unimplemented 291h CCP1RL Capture/Compare/PWM 1 Register (LSB) 292h CCP1RH Capture/Compare/PWM 1 Register (MSB) 293h CCP1CON EN OE OUT FMT 294h CCP1CAP — — — — — ODC2 ODC1 ODC0 — --00 0000 --00 0000 — — Unimplemented 290h 295h — 297h ODC3 — MODE<3:0> — — CTS<1:0> — — xxxx xxxx uuuu uuuu xxxx xxxx uuuu uuuu 0000 0000 0000 0000 ---- --00 ---- --00 — — Unimplemented CCP2RL Capture/Compare/PWM 2 Register (LSB) xxxx xxxx uuuu uuuu 299h CCP2RH Capture/Compare/PWM 2 Register (MSB) xxxx xxxx uuuu uuuu 0000 0000 0000 0000 ---- --00 ---- --00 29Ah CCP2CON EN OE OUT FMT 29Bh CCP2CAP — — — — 29Ch — Unimplemented — — 29Dh — Unimplemented — — 29Eh CCPTMRS ---- 0000 ---- 0000 29Fh — — — --00 -000 — — — — MODE<3:0> — — C2TSEL<1:0> CTS<1:0> C1TSEL<1:0> Unimplemented Bank 6 30Ch SLRCONA 30Dh — 30Eh SLRCONC(4) 30Fh — 31Fh — — — SLRA5 SLRA4 — SLRA2 SLRA1 SLRA0 --00 -000 — — — SLRC5 SLRC4 SLRC3 SLRC2 SLRC1 SLRC0 --00 0000 --00 0000 — — Unimplemented — Unimplemented DS40001737B-page 33 Legend: x = unknown, u = unchanged, q = value depends on condition, - = unimplemented, r = reserved. Shaded locations are unimplemented, read as ‘0’. Note 1: PIC12F1612/16F1613 only. 2: Unimplemented, read as ‘1’. 3: PIC12(L)F1612 only. 4: PIC16(L)F1613 only. PIC12(L)F1612/16(L)F1613 298h 2014-2016 Microchip Technology Inc. TABLE 3-9: Addr SPECIAL FUNCTION REGISTER SUMMARY (CONTINUED) Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on POR, BOR Value on all other Resets — — INLVLA5 INLVLA4 INLVLA3 INLVLA2 INLVLA1 INLVLA0 --11 1111 --11 1111 Bank 7 38Ch INLVLA 38Dh — 38Eh INLVLC(4) 30Fh — Unimplemented 390h — Unimplemented — — 391h IOCAP — — IOCAP5 IOCAP4 IOCAP3 IOCAP2 IOCAP1 IOCAP0 --00 0000 --00 0000 392h IOCAN — — IOCAN5 IOCAN4 IOCAN3 IOCAN2 IOCAN1 IOCAN0 --00 0000 --00 0000 393h IOCAF — — IOCAF5 IOCAF4 IOCAF3 IOCAF2 IOCAF1 IOCAF0 --00 0000 --00 0000 Unimplemented — — INLVLC5 INLVLC4 INLVLC3 INLVLC2 INLVLC1 INLVLC0 — — --11 1111 --11 1111 — — — Unimplemented — — — Unimplemented — — 396h — Unimplemented — — 397h IOCCP(4) — — IOCCP5 IOCCP4 IOCCP3 IOCCP2 IOCCP1 IOCCP0 --00 0000 --00 0000 398h IOCCN(4) — — IOCCN5 IOCCN4 IOCCN3 IOCCN2 IOCCN1 IOCCN0 --00 0000 --00 0000 399h IOCCF(4) — — IOCCF5 IOCCF4 IOCCF3 IOCCF2 IOCCF1 IOCCF0 --00 0000 --00 0000 — — 39Ah to 39Fh — Unimplemented Legend: x = unknown, u = unchanged, q = value depends on condition, - = unimplemented, r = reserved. Shaded locations are unimplemented, read as ‘0’. Note 1: PIC12F1612/16F1613 only. 2: Unimplemented, read as ‘1’. 3: PIC12(L)F1612 only. 4: PIC16(L)F1613 only. DS40001737B-page 34 PIC12(L)F1612/16(L)F1613 394h 395h 2014-2016 Microchip Technology Inc. TABLE 3-9: Addr SPECIAL FUNCTION REGISTER SUMMARY (CONTINUED) Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on POR, BOR Value on all other Resets — — Bank 8 40Ch to 412h Unimplemented 413h TMR4 Timer4 Module Register 0000 0000 0000 0000 414h PR4 Timer4 Period Register 1111 1111 1111 1111 415h T4CON ON OUTPS<3:0> 0000 0000 0000 0000 416h T4HLT PSYNC CKPOL CKSYNC — MODE<3:0> 000- 0000 000- 0000 417h T4CLKCON — — — — 418h T4RST — — — — 419h — Unimplemented 41Ah TMR6 41Bh PR6 41Ch T6CON ON 41Dh T6HLT PSYNC CKPOL CKSYNC — CKPS<2:0> — T4CS<2:0> ---- -000 ---- -000 ---- 0000 ---- 0000 — — Timer6 Module Register 0000 0000 0000 0000 Timer6 Period Register 1111 1111 1111 1111 OUTPS<3:0> 0000 0000 0000 0000 MODE<3:0> 000- 0000 000- 0000 RSEL<3:0> CKPS<2:0> 41Eh T6CLKCON — — — — 41Fh T6RST — — — — — T6CS<2:0> ---- -000 ---- -000 ---- 0000 ---- 0000 Unimplemented — — Unimplemented — — Unimplemented — — RSEL<3:0> Bank 9 48Ch to 49Fh — Bank 10 50Ch to 51Fh — Bank 11 DS40001737B-page 35 58Ch to 59Fh — Legend: x = unknown, u = unchanged, q = value depends on condition, - = unimplemented, r = reserved. Shaded locations are unimplemented, read as ‘0’. Note 1: PIC12F1612/16F1613 only. 2: Unimplemented, read as ‘1’. 3: PIC12(L)F1612 only. 4: PIC16(L)F1613 only. PIC12(L)F1612/16(L)F1613 — 2014-2016 Microchip Technology Inc. TABLE 3-9: Addr SPECIAL FUNCTION REGISTER SUMMARY (CONTINUED) Name Value on POR, BOR Value on all other Resets Unimplemented — — Unimplemented — — --00 0000 --00 0000 --xx xxxx --xx xxxx Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Bank 12 60Ch to 61Fh — Bank 13 68Ch to 690h 691h — CWG1DBR — — DBR<5:0> CWG1DBF — — 693h CWG1AS0 SHUTDOWN REN 694h CWG1AS1 — TMR6AS TMR4AS TMR2AS — 695h CWG1OCON0 OVRD OVRC OVRB OVRA STRD 696h CWG1CON0 EN LD — — — 697h CWG1CON1 — — IN — POLD POLC 698h CWG1OCON1 — — — — OED 699h CWG1CLKCON — — — — — 69Ah CWG1ISM — — — — — 69Bh to 6EFh — DBF<5:0> LSBD<1:0> — — 0000 00-- 0000 00-- C2AS(4) C1AS INAS -000 -000 -000 -000 STRC STRB STRA 0000 0000 0000 0000 00-- -000 00-- -000 POLB POLA --x- 0000 --x- 0000 OEC OEB OEA ---- 0000 ---- 0000 — — CS ---- ---0 ---- ---0 ---- -000 ---- -000 — — LSAC<1:0> MODE<2:0> IS<2:0> Unimplemented Legend: x = unknown, u = unchanged, q = value depends on condition, - = unimplemented, r = reserved. Shaded locations are unimplemented, read as ‘0’. Note 1: PIC12F1612/16F1613 only. 2: Unimplemented, read as ‘1’. 3: PIC12(L)F1612 only. 4: PIC16(L)F1613 only. DS40001737B-page 36 PIC12(L)F1612/16(L)F1613 692h 2014-2016 Microchip Technology Inc. TABLE 3-9: Addr SPECIAL FUNCTION REGISTER SUMMARY (CONTINUED) Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on POR, BOR Value on all other Resets — — --qq qqqq --qq qqqq -qqq -qqq -qqq -qqq 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 Bank 14 70Ch to 710h — Unimplemented WDTCON0 — WDTCON1 — 713h WDTPSL 714h WDTPSH 715h WDTTMR 716h — Unimplemented — — 717h — Unimplemented — — 718h SCANLADRL LADR<7:0> 0000 0000 0000 0000 719h SCANLADRH LADR<15:8> 0000 0000 0000 0000 71Ah SCANHADRL HADR<7:0> 1111 1111 1111 1111 71Bh SCANHADRH HADR<15:8> 1111 1111 1111 1111 71Ch SCANCON0 71Dh SCANTRIG 71Eh — 71Fh — — WDTPS<4:0> WDTCS<2:0> SEN — WINDOW<2:0> PSCNT<7:0> PSCNT<15:8> WDTTMR<4:0> STATE PSCNT<17:16> INTM — MODE<1:0> 0000 0-00 0000 0-00 — — TSEL<1:0> ---- --00 ---- --00 Unimplemented — — Unimplemented — — EN SCANGO BUSY INVALID Legend: x = unknown, u = unchanged, q = value depends on condition, - = unimplemented, r = reserved. Shaded locations are unimplemented, read as ‘0’. Note 1: PIC12F1612/16F1613 only. 2: Unimplemented, read as ‘1’. 3: PIC12(L)F1612 only. 4: PIC16(L)F1613 only. DS40001737B-page 37 PIC12(L)F1612/16(L)F1613 711h 712h 2014-2016 Microchip Technology Inc. TABLE 3-9: Addr SPECIAL FUNCTION REGISTER SUMMARY (CONTINUED) Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on POR, BOR Value on all other Resets — — Bank 15 78Ch to 790h — Unimplemented 791h CRCDATL DATA<7:0> xxxx xxxx xxxx xxxx 792h CRCDATH DATA<15:8> xxxx xxxx xxxx xxxx 793h CRCACCL ACC<7:0> 0000 0000 0000 0000 CRCACCH ACC<15:8> 0000 0000 0000 0000 795h CRCSHIFTL SHIFT<7:0> 0000 0000 0000 0000 796h CRCSHIFTH SHIFT<15:8> 0000 0000 0000 0000 797h CRCXORL — xxxx xxx- xxxx xxx- 798h CRCXORH xxxx xxxx xxxx xxxx 799h CRCCON0 FULL 0000 --00 0000 -00 79Ah CRCCON1 0000 0000 0000 0000 Unimplemented — — Unimplemented — — 79Bh to 79Fh — XOR<7:1> XOR<15:8> EN CRCGO BUSY DLEN<3:0> ACCM — — SHIFTM PLEN<3:0> Bank 16-26 x0Ch/ x8Ch — x1Fh/ x9Fh — Legend: x = unknown, u = unchanged, q = value depends on condition, - = unimplemented, r = reserved. Shaded locations are unimplemented, read as ‘0’. Note 1: PIC12F1612/16F1613 only. 2: Unimplemented, read as ‘1’. 3: PIC12(L)F1612 only. 4: PIC16(L)F1613 only. DS40001737B-page 38 PIC12(L)F1612/16(L)F1613 794h 2014-2016 Microchip Technology Inc. TABLE 3-9: Addr SPECIAL FUNCTION REGISTER SUMMARY (CONTINUED) Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on POR, BOR Value on all other Resets — — Bank 27 D80h to D8Bh — Unimplemented D8Ch SMT1TMRL SMT1TMR<7:0> 0000 0000 0000 0000 D8Dh SMT1TMRH SMT1TMR<15:8> 0000 0000 0000 0000 D8Eh SMT1TMRU SMT1TMR<23:16> 0000 0000 0000 0000 D8Fh SMT1CPRL SMT1CPR<7:0> xxxx xxxx xxxx xxxx D90h SMT1CPRH SMT1CPR<15:8> xxxx xxxx xxxx xxxx D91h SMT1CPRU SMT1CPR<23:16> xxxx xxxx xxxx xxxx D92h SMT1CPWL SMT1CPW<7:0> xxxx xxxx xxxx xxxx SMT1CPWH SMT1CPW<15:8> xxxx xxxx xxxx xxxx D94h SMT1CPWU SMT1CPW<23:16> xxxx xxxx xxxx xxxx D95h SMT1PRL SMT1PR<7:0> xxxx xxxx xxxx xxxx D96h SMT1PRH SMT1PR<15:8> xxxx xxxx xxxx xxxx D97h SMT1PRU D98h SMT1CON0 EN — D99h SMT1CON1 SMTxGO D9Ah SMT1STAT CPRUP D9Bh SMT1CLK D9Ch SMT1SIG D9Dh SMT1WIN D9Eh SMT2TMRL SMT1PR<23:16> STP WPOL SPOL CPOL REPEAT — — CPWUP RST — — TS — — — — — — — — — — — — — SMTxPS<1:0> MODE<3:0> WS CSEL<2:0> SSEL<3:0> — WSEL<2:0> AS xxxx xxxx xxxx xxxx 0-00 0000 0-00 0000 00-- 0000 00-- 0000 000- -000 000- -000 ---- -000 ---- -000 ---- 0000 ---- 0000 ---- -000 ---- -000 SMT2TMR<7:0> 0000 0000 0000 0000 DS40001737B-page 39 D9Fh SMT2TMRH SMT2TMR<15:8> 0000 0000 0000 0000 DA0h SMT2TMRU SMT2TMR<23:16> 0000 0000 0000 0000 DA1h SMT2CPRL SMT2CPR<7:0> xxxx xxxx xxxx xxxx DA2h SMT2CPRH SMT2CPR<15:8> xxxx xxxx xxxx xxxx DA3h SMT2CPRU SMT2CPR<23:16> xxxx xxxx xxxx xxxx DA4h SMT2CPWL SMT2CPW<7:0> xxxx xxxx xxxx xxxx Legend: x = unknown, u = unchanged, q = value depends on condition, - = unimplemented, r = reserved. Shaded locations are unimplemented, read as ‘0’. Note 1: PIC12F1612/16F1613 only. 2: Unimplemented, read as ‘1’. 3: PIC12(L)F1612 only. 4: PIC16(L)F1613 only. PIC12(L)F1612/16(L)F1613 D93h 2014-2016 Microchip Technology Inc. TABLE 3-9: Addr SPECIAL FUNCTION REGISTER SUMMARY (CONTINUED) Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on POR, BOR Value on all other Resets Bank 27 (Continued) DA5h SMT2CPWH SMTxCPW<15:8> xxxx xxxx xxxx xxxx DA6h SMT2CPWU SMTxCPW<23:16> xxxx xxxx xxxx xxxx DA7h SMT2PRL SMTxPR<7:0> xxxx xxxx xxxx xxxx DA8h SMT2PRH SMTxPR<15:8> xxxx xxxx xxxx xxxx DA9h SMT2PRU DAAh SMT2CON0 EN — DABh SMT2CON1 SMTxGO DACh SMT2STAT CPRUP DADh SMT2CLK DAEh SMT2SIG DAFh SMT2WIN SMTxPR<23:16> STP WPOL SPOL CPOL REPEAT — — CPWUP RST — — TS — — — — — — — — — — — — — SMTxPS<1:0> MODE<3:0> WS CSEL<2:0> SSEL<3:0> — WSEL<2:0> AS xxxx xxxx xxxx xxxx 0-00 0000 0-00 0000 00-- 0000 00-- 0000 000- -000 000- -000 ---- -000 ---- -000 ---- 0000 ---- 0000 ---- -000 ---- -000 DS40001737B-page 40 PIC12(L)F1612/16(L)F1613 Legend: x = unknown, u = unchanged, q = value depends on condition, - = unimplemented, r = reserved. Shaded locations are unimplemented, read as ‘0’. Note 1: PIC12F1612/16F1613 only. 2: Unimplemented, read as ‘1’. 3: PIC12(L)F1612 only. 4: PIC16(L)F1613 only. 2014-2016 Microchip Technology Inc. TABLE 3-9: Addr SPECIAL FUNCTION REGISTER SUMMARY (CONTINUED) Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on POR, BOR Value on all other Resets Banks 28 SMT2CPWH SMTxCPW<15:8> xxxx xxxx xxxx xxxx DA6h SMT2CPWU SMTxCPW<23:16> xxxx xxxx xxxx xxxx DA7h SMT2PRL SMTxPR<7:0> xxxx xxxx xxxx xxxx DA8h SMT2PRH SMTxPR<15:8> xxxx xxxx xxxx xxxx DA9h SMT2PRU DAAh SMT2CON0 EN — DABh SMT2CON1 SMTxGO DACh SMT2STAT CPRUP DADh SMT2CLK DAEh SMT2SIG DAFh SMT2WIN DA5h SMT2CPWH SMTxCPW<15:8> DA6h SMT2CPWU DA7h SMT2PRL DA8h DA9h SMTxPR<23:16> STP WPOL SPOL CPOL REPEAT — — CPWUP RST — — TS — — — — — — — — — — — — — SMTxPS<1:0> MODE<3:0> WS AS CSEL<2:0> xxxx xxxx xxxx xxxx 0-00 0000 0-00 0000 00-- 0000 00-- 0000 000- -000 000- -000 ---- -000 ---- -000 ---- 0000 ---- 0000 ---- -000 ---- -000 xxxx xxxx xxxx xxxx SMTxCPW<23:16> xxxx xxxx xxxx xxxx SMTxPR<7:0> xxxx xxxx xxxx xxxx SMT2PRH SMTxPR<15:8> xxxx xxxx xxxx xxxx SMT2PRU SMTxPR<23:16> xxxx xxxx xxxx xxxx 0-00 0000 0-00 0000 00-- 0000 00-- 0000 000- -000 000- -000 ---- -000 ---- -000 ---- 0000 ---- 0000 ---- -000 ---- -000 SSEL<3:0> — DAAh SMT2CON0 EN — STP WPOL DABh SMT2CON1 SMTxGO REPEAT — — SPOL DACh SMT2STAT CPRUP CPWUP RST — — DADh SMT2CLK — — — — — WSEL<2:0> CPOL SMTxPS<1:0> MODE<3:0> TS WS CSEL<2:0> SSEL<3:0> AS DAEh SMT2SIG — — — — DAFh SMT2WIN — — — — DA5h SMT2CPWH SMTxCPW<15:8> xxxx xxxx xxxx xxxx DA6h SMT2CPWU SMTxCPW<23:16> xxxx xxxx xxxx xxxx DA7h SMT2PRL SMTxPR<7:0> xxxx xxxx xxxx xxxx — WSEL<2:0> DS40001737B-page 41 Legend: x = unknown, u = unchanged, q = value depends on condition, - = unimplemented, r = reserved. Shaded locations are unimplemented, read as ‘0’. Note 1: PIC12F1612/16F1613 only. 2: Unimplemented, read as ‘1’. 3: PIC12(L)F1612 only. 4: PIC16(L)F1613 only. PIC12(L)F1612/16(L)F1613 DA5h 2014-2016 Microchip Technology Inc. TABLE 3-9: Addr SPECIAL FUNCTION REGISTER SUMMARY (CONTINUED) Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on POR, BOR Value on all other Resets — — Bank 29-30 x0Ch/ x8Ch — x1Fh/ x9Fh — Unimplemented Legend: x = unknown, u = unchanged, q = value depends on condition, - = unimplemented, r = reserved. Shaded locations are unimplemented, read as ‘0’. Note 1: PIC12F1612/16F1613 only. 2: Unimplemented, read as ‘1’. 3: PIC12(L)F1612 only. 4: PIC16(L)F1613 only. PIC12(L)F1612/16(L)F1613 DS40001737B-page 42 2014-2016 Microchip Technology Inc. TABLE 3-9: Addr SPECIAL FUNCTION REGISTER SUMMARY (CONTINUED) Name Value on POR, BOR Value on all other Resets — — ---- -xxx ---- -uuu xxxx xxxx uuuu uuuu ---x xxxx ---u uuuu -xxx xxxx uuuu uuuu Indirect Data Memory Address 0 Low Pointer Shadow xxxx xxxx uuuu uuuu Indirect Data Memory Address 0 High Pointer Shadow xxxx xxxx uuuu uuuu Indirect Data Memory Address 1 Low Pointer Shadow xxxx xxxx uuuu uuuu Indirect Data Memory Address 1 High Pointer Shadow xxxx xxxx uuuu uuuu Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Bank 31 F8Ch — FE3h FE4h — STATUS_ Unimplemented — — — — — Z_SHAD DC_SHAD C_SHAD SHAD FE5h WREG_ Working Register Shadow SHAD FE6h BSR_ — — — Bank Select Register Shadow SHAD FE7h PCLATH_ — Program Counter Latch High Register Shadow SHAD FE8h FSR0L_ SHAD FSR0H_ SHAD FEAh FSR1L_ SHAD FEBh FSR1H_ FECh — SHAD FEDh STKPTR FEEh TOSL FEFh TOSH Unimplemented — — Top-of-Stack Low byte — Top-of-Stack High byte — Current Stack Pointer — — ---1 1111 ---1 1111 xxxx xxxx uuuu uuuu -xxx xxxx -uuu uuuu DS40001737B-page 43 Legend: x = unknown, u = unchanged, q = value depends on condition, - = unimplemented, r = reserved. Shaded locations are unimplemented, read as ‘0’. Note 1: PIC12F1612/16F1613 only. 2: Unimplemented, read as ‘1’. 3: PIC12(L)F1612 only. 4: PIC16(L)F1613 only. PIC12(L)F1612/16(L)F1613 FE9h PIC12(L)F1612/16(L)F1613 3.4 3.4.2 PCL and PCLATH The Program Counter (PC) is 15 bits wide. The low byte comes from the PCL register, which is a readable and writable register. The high byte (PC<14:8>) is not directly readable or writable and comes from PCLATH. On any Reset, the PC is cleared. Figure 3-3 shows the five situations for the loading of the PC. FIGURE 3-3: LOADING OF PC IN DIFFERENT SITUATIONS Rev. 10-000042A 7/30/2013 14 PCH PCL 0 PC 7 6 8 0 PCLATH Instruction with PCL as Destination ALU result 14 PCH PCL 0 PC 6 4 0 PCLATH GOTO, CALL 11 OPCODE <10:0> 14 PCH PCL 0 PC 6 7 0 PCLATH 14 PCH CALLW 8 W PCL 0 PCL 0 PC BRW 15 PC + W 14 PCH PC BRA 15 PC + OPCODE <8:0> 3.4.1 COMPUTED GOTO A computed GOTO is accomplished by adding an offset to the program counter (ADDWF PCL). When performing a table read using a computed GOTO method, care should be exercised if the table location crosses a PCL memory boundary (each 256-byte block). Refer to Application Note AN556, “Implementing a Table Read” (DS00556). 3.4.3 COMPUTED FUNCTION CALLS A computed function CALL allows programs to maintain tables of functions and provide another way to execute state machines or look-up tables. When performing a table read using a computed function CALL, care should be exercised if the table location crosses a PCL memory boundary (each 256-byte block). If using the CALL instruction, the PCH<2:0> and PCL registers are loaded with the operand of the CALL instruction. PCH<6:3> is loaded with PCLATH<6:3>. The CALLW instruction enables computed calls by combining PCLATH and W to form the destination address. A computed CALLW is accomplished by loading the W register with the desired address and executing CALLW. The PCL register is loaded with the value of W and PCH is loaded with PCLATH. 3.4.4 BRANCHING The branching instructions add an offset to the PC. This allows relocatable code and code that crosses page boundaries. There are two forms of branching, BRW and BRA. The PC will have incremented to fetch the next instruction in both cases. When using either branching instruction, a PCL memory boundary may be crossed. If using BRW, load the W register with the desired unsigned address and execute BRW. The entire PC will be loaded with the address PC + 1 + W. If using BRA, the entire PC will be loaded with PC + 1 +, the signed value of the operand of the BRA instruction. MODIFYING PCL Executing any instruction with the PCL register as the destination simultaneously causes the Program Counter PC<14:8> bits (PCH) to be replaced by the contents of the PCLATH register. This allows the entire contents of the program counter to be changed by writing the desired upper seven bits to the PCLATH register. When the lower eight bits are written to the PCL register, all 15 bits of the program counter will change to the values contained in the PCLATH register and those being written to the PCL register. 2014-2016 Microchip Technology Inc. DS40001737B-page 44 PIC12(L)F1612/16(L)F1613 3.5 3.5.1 Stack The stack is available through the TOSH, TOSL and STKPTR registers. STKPTR is the current value of the Stack Pointer. TOSH:TOSL register pair points to the TOP of the stack. Both registers are read/writable. TOS is split into TOSH and TOSL due to the 15-bit size of the PC. To access the stack, adjust the value of STKPTR, which will position TOSH:TOSL, then read/write to TOSH:TOSL. STKPTR is five bits to allow detection of overflow and underflow. All devices have a 16-level x 15-bit wide hardware stack (refer to Figures 3-4 through 3-7). The stack space is not part of either program or data space. The PC is PUSHed onto the stack when CALL or CALLW instructions are executed or an interrupt causes a branch. The stack is POPed in the event of a RETURN, RETLW or a RETFIE instruction execution. PCLATH is not affected by a PUSH or POP operation. The stack operates as a circular buffer if the STVREN bit is programmed to ‘0’ (Configuration Words). This means that after the stack has been PUSHed sixteen times, the seventeenth PUSH overwrites the value that was stored from the first PUSH. The eighteenth PUSH overwrites the second PUSH (and so on). The STKOVF and STKUNF flag bits will be set on an Overflow/Underflow, regardless of whether the Reset is enabled. Note: Care should be taken when modifying the STKPTR while interrupts are enabled. During normal program operation, CALL, CALLW and Interrupts will increment STKPTR while RETLW, RETURN, and RETFIE will decrement STKPTR. At any time STKPTR can be inspected to see how much stack is left. The STKPTR always points at the currently used place on the stack. Therefore, a CALL or CALLW will increment the STKPTR and then write the PC, and a return will unload the PC and then decrement the STKPTR. Note 1: There are no instructions/mnemonics called PUSH or POP. These are actions that occur from the execution of the CALL, CALLW, RETURN, RETLW and RETFIE instructions or the vectoring to an interrupt address. FIGURE 3-4: ACCESSING THE STACK Reference Figure 3-4 through Figure 3-7 for examples of accessing the stack. ACCESSING THE STACK EXAMPLE 1 Rev. 10-000043A 7/30/2013 TOSH:TOSL 0x0F STKPTR = 0x1F Stack Reset Disabled (STVREN = 0) 0x0E 0x0D 0x0C 0x0B Initial Stack Configuration: 0x0A After Reset, the stack is empty. The empty stack is initialized so the Stack Pointer is pointing at 0x1F. If the Stack Overflow/Underflow Reset is enabled, the TOSH/TOSL register will return ‘0’. If the Stack Overflow/Underflow Reset is disabled, the TOSH/TOSL register will return the contents of stack address 0x0F. 0x09 0x08 0x07 0x06 0x05 0x04 0x03 0x02 0x01 0x00 TOSH:TOSL 2014-2016 Microchip Technology Inc. 0x1F 0x0000 STKPTR = 0x1F Stack Reset Enabled (STVREN = 1) DS40001737B-page 45 PIC12(L)F1612/16(L)F1613 FIGURE 3-5: ACCESSING THE STACK EXAMPLE 2 Rev. 10-000043B 7/30/2013 0x0F 0x0E 0x0D 0x0C 0x0B 0x0A This figure shows the stack configuration after the first CALL or a single interrupt. If a RETURN instruction is executed, the return address will be placed in the Program Counter and the Stack Pointer decremented to the empty state (0x1F). 0x09 0x08 0x07 0x06 0x05 0x04 0x03 0x02 0x01 TOSH:TOSL FIGURE 3-6: 0x00 Return Address STKPTR = 0x00 ACCESSING THE STACK EXAMPLE 3 Rev. 10-000043C 7/30/2013 0x0F 0x0E 0x0D 0x0C After seven CALLs or six CALLs and an interrupt, the stack looks like the figure on the left. A series of RETURN instructions will repeatedly place the return addresses into the Program Counter and pop the stack. 0x0B 0x0A 0x09 0x08 0x07 TOSH:TOSL 2014-2016 Microchip Technology Inc. 0x06 Return Address 0x05 Return Address 0x04 Return Address 0x03 Return Address 0x02 Return Address 0x01 Return Address 0x00 Return Address STKPTR = 0x06 DS40001737B-page 46 PIC12(L)F1612/16(L)F1613 FIGURE 3-7: ACCESSING THE STACK EXAMPLE 4 Rev. 10-000043D 7/30/2013 TOSH:TOSL 3.5.2 0x0F Return Address 0x0E Return Address 0x0D Return Address 0x0C Return Address 0x0B Return Address 0x0A Return Address 0x09 Return Address 0x08 Return Address 0x07 Return Address 0x06 Return Address 0x05 Return Address 0x04 Return Address 0x03 Return Address 0x02 Return Address 0x01 Return Address 0x00 Return Address When the stack is full, the next CALL or an interrupt will set the Stack Pointer to 0x10. This is identical to address 0x00 so the stack will wrap and overwrite the return address at 0x00. If the Stack Overflow/Underflow Reset is enabled, a Reset will occur and location 0x00 will not be overwritten. STKPTR = 0x10 OVERFLOW/UNDERFLOW RESET If the STVREN bit in Configuration Words is programmed to ‘1’, the device will be reset if the stack is PUSHed beyond the sixteenth level or POPed beyond the first level, setting the appropriate bits (STKOVF or STKUNF, respectively) in the PCON register. 3.6 Indirect Addressing The INDFn registers are not physical registers. Any instruction that accesses an INDFn register actually accesses the register at the address specified by the File Select Registers (FSR). If the FSRn address specifies one of the two INDFn registers, the read will return ‘0’ and the write will not occur (though Status bits may be affected). The FSRn register value is created by the pair FSRnH and FSRnL. The FSR registers form a 16-bit address that allows an addressing space with 65536 locations. These locations are divided into three memory regions: • Traditional Data Memory • Linear Data Memory • Program Flash Memory 2014-2016 Microchip Technology Inc. DS40001737B-page 47 PIC12(L)F1612/16(L)F1613 FIGURE 3-8: INDIRECT ADDRESSING Rev. 10-000044A 7/30/2013 0x0000 0x0000 Traditional Data Memory 0x0FFF 0x1000 0x0FFF Reserved 0x1FFF 0x2000 Linear Data Memory 0x29AF 0x29B0 Reserved FSR Address Range 0x7FFF 0x8000 0x0000 Program Flash Memory 0xFFFF Note: 0x7FFF Not all memory regions are completely implemented. Consult device memory tables for memory limits. 2014-2016 Microchip Technology Inc. DS40001737B-page 48 PIC12(L)F1612/16(L)F1613 3.6.1 TRADITIONAL DATA MEMORY The traditional data memory is a region from FSR address 0x000 to FSR address 0xFFF. The addresses correspond to the absolute addresses of all SFR, GPR and common registers. FIGURE 3-9: TRADITIONAL DATA MEMORY MAP Rev. 10-000056A 7/31/2013 Direct Addressing 4 BSR 0 Indirect Addressing From Opcode 6 0 Bank Select 7 FSRxH 0 0 0 0 Location Select 0x00 00000 Bank Select 00001 00010 11111 Bank 0 Bank 1 Bank 2 Bank 31 0 7 FSRxL 0 Location Select 0x7F 2014-2016 Microchip Technology Inc. DS40001737B-page 49 PIC12(L)F1612/16(L)F1613 3.6.2 LINEAR DATA MEMORY The linear data memory is the region from FSR address 0x2000 to FSR address 0x29AF. This region is a virtual region that points back to the 80-byte blocks of GPR memory in all the banks. Unimplemented memory reads as 0x00. Use of the linear data memory region allows buffers to be larger than 80 bytes because incrementing the FSR beyond one bank will go directly to the GPR memory of the next bank. The 16 bytes of common memory are not included in the linear data memory region. FIGURE 3-10: LINEAR DATA MEMORY MAP 3.6.3 PROGRAM FLASH MEMORY To make constant data access easier, the entire program Flash memory is mapped to the upper half of the FSR address space. When the MSb of FSRnH is set, the lower 15 bits are the address in program memory which will be accessed through INDF. Only the lower eight bits of each memory location is accessible via INDF. Writing to the program Flash memory cannot be accomplished via the FSR/INDF interface. All instructions that access program Flash memory via the FSR/INDF interface will require one additional instruction cycle to complete. FIGURE 3-11: PROGRAM FLASH MEMORY MAP Rev. 10-000057A 7/31/2013 7 FSRnH 0 0 1 0 7 FSRnL Rev. 10-000058A 7/31/2013 7 1 0 FSRnH 0 Location Select Location Select 0x2000 7 FSRnL 0 0x8000 0x0A0 Bank 1 0x0EF Program Flash Memory (low 8 bits) 0x120 Bank 2 0x16F 0x29AF 2014-2016 Microchip Technology Inc. 0x0000 0x020 Bank 0 0x06F 0xF20 Bank 30 0xF6F 0xFFFF 0x7FFF DS40001737B-page 50 PIC12(L)F1612/16(L)F1613 4.0 DEVICE CONFIGURATION Device configuration consists of Configuration Words, Code Protection and Device ID. 4.1 Configuration Words There are several Configuration Word bits that allow different oscillator and memory protection options. These are implemented as Configuration Word 1 at 8007h, Configuration Word 2 at 8008h, and Configuration 3 at 8009h. Note: The DEBUG bit in Configuration Words is managed automatically by device development tools including debuggers and programmers. For normal device operation, this bit should be maintained as a ‘1’. 2014-2016 Microchip Technology Inc. DS40001737B-page 51 PIC12(L)F1612/16(L)F1613 4.2 Register Definitions: Configuration Words REGISTER 4-1: CONFIG1: CONFIGURATION WORD 1 U-1 U-1 R/P-1 — — CLKOUTEN R/P-1 R/P-1 U-1 BOREN<1:0>(1) — bit 13 R/P-1 R/P-1 R/P-1 CP(2) MCLRE PWRTE bit 8 U-1 U-1 — — U-1 R/P-1 — R/P-1 FOSC<1:0> bit 7 bit 0 Legend: R = Readable bit P = Programmable bit U = Unimplemented bit, read as ‘1’ ‘0’ = Bit is cleared ‘1’ = Bit is set -n = Value when blank or after Bulk Erase bit 13-12 Unimplemented: Read as ‘1’ bit 11 CLKOUTEN: Clock Out Enable bit 1 = CLKOUT function is disabled. I/O function on the CLKOUT pin 0 = CLKOUT function is enabled on the CLKOUT pin bit 10-9 BOREN<1:0>: Brown-Out Reset Enable bits(1) 11 = BOR enabled 10 = BOR enabled during operation and disabled in Sleep 01 = BOR controlled by SBOREN bit of the BORCON register 00 = BOR disabled bit 8 Unimplemented: Read as ‘1’ bit 7 CP: Code Protection bit(2) 1 = Program memory code protection is disabled 0 = Program memory code protection is enabled bit 6 MCLRE: MCLR/VPP Pin Function Select bit If LVP bit = 1: This bit is ignored. If LVP bit = 0: 1 =MCLR/VPP pin function is MCLR; Weak pull-up enabled. 0 =MCLR/VPP pin function is digital input; MCLR internally disabled; Weak pull-up under control of WPUA3 bit. bit 5 PWRTE: Power-Up Timer Enable bit 1 = PWRT disabled 0 = PWRT enabled bit 4-2 Unimplemented: Read as ‘1’ bit 1-0 FOSC<1:0>: Oscillator Selection bits 11 =ECH: External clock, High-Power mode: on CLKIN pin 10 =ECM: External clock, Medium-Power mode: on CLKIN pin 01 =ECL: External clock, Low-Power mode: on CLKIN pin 00 =INTOSC oscillator: I/O function on CLKIN pin Note 1: 2: Enabling Brown-out Reset does not automatically enable Power-up Timer. Once enabled, code-protect can only be disabled by bulk erasing the device. 2014-2016 Microchip Technology Inc. DS40001737B-page 52 PIC12(L)F1612/16(L)F1613 REGISTER 4-2: CONFIG2: CONFIGURATION WORD 2 R/P-1 R/P-1 DEBUG(3) (1) LVP R/P-1 R/P-1 R/P-1 R/P-1 LPBOR BORV(2) STVREN PLLEN bit 13 bit 8 R/P-1 U-1 U-1 U-1 U-1 U-1 ZCD — — — — — R/P-1 R/P-1 WRT<1:0> bit 7 bit 0 Legend: R = Readable bit P = Programmable bit U = Unimplemented bit, read as ‘1’ ‘0’ = Bit is cleared ‘1’ = Bit is set -n = Value when blank or after Bulk Erase bit 13 LVP: Low-Voltage Programming Enable bit(1) 1 = Low-voltage programming enabled 0 = High-voltage on MCLR must be used for programming bit 12 DEBUG: In-Circuit Debugger Mode bit(3) 1 = In-Circuit Debugger disabled, ICSPCLK and ICSPDAT are general purpose I/O pins 0 = In-Circuit Debugger enabled, ICSPCLK and ICSPDAT are dedicated to the debugger bit 11 LPBOR: Low-Power BOR Enable bit 1 = Low-Power Brown-out Reset is disabled 0 = Low-Power Brown-out Reset is enabled bit 10 BORV: Brown-Out Reset Voltage Selection bit(2) 1 = Brown-out Reset voltage (VBOR), low trip point selected 0 = Brown-out Reset voltage (VBOR), high trip point selected bit 9 STVREN: Stack Overflow/Underflow Reset Enable bit 1 = Stack Overflow or Underflow will cause a Reset 0 = Stack Overflow or Underflow will not cause a Reset bit 8 PLLEN: PLL Enable bit 1 = 4xPLL enabled 0 = 4xPLL disabled bit 7 ZCD: ZCD Disable bit 1 = ZCD disabled. ZCD can be enabled by setting the ZCD1EN bit of ZCD1CON 0 = ZCD always enabled bit 6-2 Unimplemented: Read as ‘1’ bit 1-0 WRT<1:0>: Flash Memory Self-Write Protection bits 2 kW Flash memory (PIC12(L)F1612/16(L)F1613): 11 = OFF - Write protection off 10 = BOOT - 000h to 1FFh write-protected, 200h to 7FFh may be modified by PMCON control 01 = HALF - 000h to 3FFh write-protected, 400h to 7FFh may be modified by PMCON control 00 = ALL - 000h to 7FFh write-protected, no addresses may be modified by PMCON control Note 1: 2: 3: The LVP bit cannot be programmed to ‘0’ when Programming mode is entered via LVP. See VBOR parameter for specific trip point voltages. The DEBUG bit in Configuration Words is managed automatically by device development tools including debuggers and programmers. For normal device operation, this bit should be maintained as a ‘1’. REGISTER 4-3: CONFIG3: CONFIGURATION WORD 3 R/P-0 R/P-0 WDTCCS<2:0> 2014-2016 Microchip Technology Inc. R/P-1 R/P-1 R/P-1 R/P-1 WDTCWS<2:0> DS40001737B-page 53 PIC12(L)F1612/16(L)F1613 REGISTER 4-3: CONFIG3: CONFIGURATION WORD 3 (CONTINUED) bit 13 U-1 R/P-1 — bit 8 R/P-1 R/P-1 R/P-1 R/P-1 WDTE<1:0> R/P-1 R/P-1 WDTCPS<4:0> bit 7 bit 0 Legend: R = Readable bit P = Programmable bit U = Unimplemented bit, read as ‘1’ ‘0’ = Bit is cleared ‘1’ = Bit is set -n = Value when blank or after Bulk Erase bit 13-11 WDTCCS<2:0>: WDT Configuration Clock Select bits 111 =Software Control; WDT clock selected by CS<2:0> 110 =Reserved • • • 010 =Reserved 001 =WDT reference clock is MFINTOSC, 31.25 kHz (default value) 000 =WDT reference clock is LFINTOSC, 31.00 kHz output bit 10-8 WDTCWS<2:0>: WDT Configuration Window Select bits. WINDOW at POR Value Window delay Percent of time Window opening Percent of time Software control of WINDOW? Keyed access required? 111 111 n/a 100 Yes No 110 111 n/a 100 101 101 25 75 100 100 37.5 62.5 011 011 50 50 No Yes 010 010 62.5 37.5 001 001 75 25 000 000 87.5 12.5(1) WDTCWS <2:0> Default fuse = 111 bit 7 Unimplemented: Read as ‘1’ bit 6-5 WDTE<1:0>: Watchdog Timer Enable bits 11 =WDT enabled in all modes, the SEN bit in the WDTCON0 register is ignored 10 =WDT enabled while running and disabled in Sleep 01 =WDT controlled by the SEN bit in the WDTCON0 register 00 = WDT disabled 2014-2016 Microchip Technology Inc. DS40001737B-page 54 PIC12(L)F1612/16(L)F1613 REGISTER 4-3: bit 4-0 CONFIG3: CONFIGURATION WORD 3 (CONTINUED) WDTCPS<4:0>: WDT Configuration Period Select bits WDTPS at POR Note 1: Software control of WDTPS WDTCPS <4:0> Value 11111 01011 1:65536 216 2s Yes 10011 ... 11110 10011 ... 11110 1:32 25 1 ms No Divider Ratio Typical time out (FIN = 31 kHz) 10010 10010 1:8388608 223 256 s 10001 10001 1:4194304 222 128 s 10000 10000 1:2097152 221 64 s 01111 01111 1:1048576 220 32 s 01110 01110 1:524299 219 16 s 01101 01101 1:262144 218 8s 01100 01100 1:131072 217 4s 01011 01011 1:65536 216 2s 01010 01010 1:32768 215 1s 01001 01001 1:16384 214 512 ms 01000 01000 1:8192 213 256 ms 00111 00111 1:4096 212 128 ms 00110 00110 1:2048 211 64 ms 00101 00101 1:1024 210 32 ms 00100 00100 1:512 29 16 ms 00011 00011 1:256 28 8 ms 00010 00010 1:128 27 4 ms 00001 00001 1:64 26 2 ms 00000 00000 1:32 25 1 ms Default fuse = 11111 No A window delay of 12.5% is only available in Software Control mode via the WDTCON1 register. 2014-2016 Microchip Technology Inc. DS40001737B-page 55 PIC12(L)F1612/16(L)F1613 4.3 Code Protection Code protection allows the device to be protected from unauthorized access. Internal access to the program memory is unaffected by any code protection setting. 4.3.1 PROGRAM MEMORY PROTECTION The entire program memory space is protected from external reads and writes by the CP bit in Configuration Words. When CP = 0, external reads and writes of program memory are inhibited and a read will return all ‘0’s. The CPU can continue to read program memory, regardless of the protection bit settings. Writing the program memory is dependent upon the write protection setting. See Section 4.4 “Write Protection” for more information. 4.4 Write Protection Write protection allows the device to be protected from unintended self-writes. Applications, such as boot loader software, can be protected while allowing other regions of the program memory to be modified. The WRT<1:0> bits in Configuration Words define the size of the program memory block that is protected. 4.5 User ID Four memory locations (8000h-8003h) are designated as ID locations where the user can store checksum or other code identification numbers. These locations are readable and writable during normal execution. See Section 10.4 “User ID, Device ID and Configuration Word Access” for more information on accessing these memory locations. For more information on checksum calculation, see the “PIC12(L)F1612/16(L)F161X Memory Programming Specification” (DS40001720). 2014-2016 Microchip Technology Inc. DS40001737B-page 56 PIC12(L)F1612/16(L)F1613 4.6 Device ID and Revision ID The 14-bit Device ID word is located at 8006h and the 14-bit Revision ID is located at 8005h. These locations are read-only and cannot be erased or modified. See Section 10.4 “User ID, Device ID and Configuration Word Access” for more information on accessing these memory locations. Development tools, such as device programmers and debuggers, may be used to read the Device ID and Revision ID. 4.7 Register Definitions: Device ID REGISTER 4-4: DEVID: DEVICE ID REGISTER R R R R R R DEV<13:8> bit 13 R R bit 8 R R R R R R DEV<7:0> bit 7 bit 0 Legend: R = Readable bit ‘1’ = Bit is set bit 13-0 ‘0’ = Bit is cleared DEV<13:0>: Device ID bits Device DEVID<13:0> Values PIC12F1612 11 0000 0101 1000 (3058h) PIC12LF1612 11 0000 0101 1001 (3059h) PIC16F1613 11 0000 0100 1100 (304Ch) PIC16LF1613 11 0000 0100 1101 (304Dh) REGISTER 4-5: REVID: REVISION ID REGISTER R R R R R R REV<13:8> bit 13 R R bit 8 R R R R R R REV<7:0> bit 7 bit 0 Legend: R = Readable bit ‘1’ = Bit is set bit 13-0 ‘0’ = Bit is cleared REV<13:0>: Revision ID bits 2014-2016 Microchip Technology Inc. DS40001737B-page 57 PIC12(L)F1612/16(L)F1613 5.0 OSCILLATOR MODULE The oscillator module can be configured in one of the following clock modes. 5.1 Overview 1. The oscillator module has a wide variety of clock sources and selection features that allow it to be used in a wide range of applications while maximizing performance and minimizing power consumption. Figure 5-1 illustrates a block diagram of the oscillator module. Clock sources can be supplied from external oscillators. In addition, the system clock source can be supplied from one of two internal oscillators and PLL circuits, with a choice of speeds selectable via software. Additional clock features include: • Selectable system clock source between external or internal sources via software. 2. 3. 4. ECL – External Clock Low-Power mode (0 MHz to 0.5 MHz) ECM – External Clock Medium-Power mode (0.5 MHz to 4 MHz) ECH – External Clock High-Power mode (4 MHz to 32 MHz) INTOSC – Internal oscillator (31 kHz to 32 MHz). Clock Source modes are selected by the FOSC<1:0> bits in the Configuration Words. The FOSC bits determine the type of oscillator that will be used when the device is first powered. The ECH, ECM, and ECL Clock modes rely on an external logic level signal as the device clock source. The INTOSC internal oscillator block produces low, medium, and high-frequency clock sources, designated LFINTOSC, MFINTOSC and HFINTOSC. (see Internal Oscillator Block, Figure 5-1). A wide selection of device clock frequencies may be derived from these three clock sources. 2014-2016 Microchip Technology Inc. DS40001737B-page 58 PIC12(L)F1612/16(L)F1613 SIMPLIFIED PIC® MCU CLOCK SOURCE BLOCK DIAGRAM FIGURE 5-1: Rev. 10-000155A 10/11/2013 FOSC<1:0> 01 Reserved 2 CLKIN 0 INTOSC PLLEN FOSC(1) 00 1 4x PLL(2) Sleep to CPU and Peripherals 1x SPLLEN 2 16 MHz SCS<1:0> 8 MHz 4 MHz (1) 2 MHz MFINTOSC(1) 500 kHz Oscillator Prescaler HFINTOSC HFPLL 16 MHz 1 MHz *500 kHz *250 kHz *125 kHz 62.5 kHz *31.25 kHz *31 kHz Internal Oscillator Block 4 IRCF<3:0> 31 kHz Oscillator 600 kHz Oscillator LFINTOSC(1) FRC(1) to WDT, PWRT, and other Peripherals to Peripherals to ADC and other Peripherals * Available with more than one IRCF selection Note 1: 2: See Section 5.2 “Clock Source Types”. If FOSC<1:0> = 00, 4x PLL can only be used if IRCF<3:0> = 1110. 2014-2016 Microchip Technology Inc. DS40001737B-page 59 PIC12(L)F1612/16(L)F1613 5.2 Clock Source Types Clock sources can be classified as external or internal. External clock sources rely on external circuitry for the clock source to function. Internal clock sources are contained within the oscillator module. The internal oscillator block has two internal oscillators and a dedicated Phase Lock Loop (HFPLL) that are used to generate three internal system clock sources: the 16 MHz High-Frequency Internal Oscillator (HFINTOSC), 500 kHz (MFINTOSC) and the 31 kHz Low-Frequency Internal Oscillator (LFINTOSC). The system clock can be selected between external or internal clock sources via the System Clock Select (SCS) bits in the OSCCON register. See Section5.3 “Clock Switching” for additional information. 5.2.1 EXTERNAL CLOCK SOURCES An external clock source can be used as the device system clock by performing one of the following actions: The Oscillator Start-up Timer (OST) is disabled when EC mode is selected. Therefore, there is no delay in operation after a Power-On Reset (POR) or wake-up from Sleep. Because the PIC® MCU design is fully static, stopping the external clock input will have the effect of limiting the device while leaving all data intact. Upon restarting the external clock, the device will resume operation as if no time had elapsed. FIGURE 5-2: Clock from Ext. System FOSC/4 or I/O(1) Note 1: EXTERNAL CLOCK (EC) MODE OPERATION CLKIN PIC® MCU CLKOUT Output depends upon CLKOUTEN bit of the Configuration Words. • Program the FOSC<1:0> bits in the Configuration Words to select an external clock source that will be used as the default system clock upon a device Reset. • Write the SCS<1:0> bits in the OSCCON register to switch the system clock source to: - An external clock source determined by the value of the FOSC bits. See Section5.3 “Clock Switching”for more information. 5.2.1.1 EC Mode The External Clock (EC) mode allows an externally generated logic level signal to be the system clock source. When operating in this mode, an external clock source is connected to the CLKIN input. CLKOUT is available for general purpose I/O or CLKOUT. Figure 5-2 shows the pin connections for EC mode. EC mode has three power modes to select from through the FOSC bits in the Configuration Words: • ECH – High power, 4-20 MHz • ECM – Medium power, 0.5-4 MHz • ECL – Low power, 0-0.5 MHz 2014-2016 Microchip Technology Inc. DS40001737B-page 60 PIC12(L)F1612/16(L)F1613 5.2.2 INTERNAL CLOCK SOURCES The device may be configured to use the internal oscillator block as the system clock by performing one of the following actions: • Program the FOSC<1:0> bits in Configuration Words to select the INTOSC clock source, which will be used as the default system clock upon a device Reset. • Write the SCS<1:0> bits in the OSCCON register to switch the system clock source to the internal oscillator during run-time. See Section5.3 “Clock Switching”for more information. In INTOSC mode, CLKIN is available for general purpose I/O. CLKOUT is available for general purpose I/O or CLKOUT. The function of the OSC2/CLKOUT pin is determined by the CLKOUTEN bit in Configuration Words. The internal oscillator block has two independent oscillators and a dedicated Phase Lock Loop, HFPLL that can produce one of three internal system clock sources. 1. 2. 3. The HFINTOSC (High-Frequency Internal Oscillator) is factory calibrated and operates at 16 MHz. The HFINTOSC source is generated from the 500 kHz MFINTOSC source and the dedicated Phase Lock Loop, HFPLL. The frequency of the HFINTOSC can be useradjusted via software using the OSCTUNE register (Register 5-3). The MFINTOSC (Medium-Frequency Internal Oscillator) is factory calibrated and operates at 500 kHz. The frequency of the MFINTOSC can be user-adjusted via software using the OSCTUNE register (Register 5-3). The LFINTOSC (Low-Frequency Internal Oscillator) is uncalibrated and operates at 31 kHz. 5.2.2.1 HFINTOSC The High-Frequency Internal Oscillator (HFINTOSC) is a factory calibrated 16 MHz internal clock source. The frequency of the HFINTOSC can be altered via software using the OSCTUNE register (Register 5-3). The output of the HFINTOSC connects to a postscaler and multiplexer (see Figure 5-1). One of multiple frequencies derived from the HFINTOSC can be selected via software using the IRCF<3:0> bits of the OSCCON register. See Section5.2.2.8 “Internal Oscillator Clock Switch Timing” for more information. The HFINTOSC is enabled by: • Configure the IRCF<3:0> bits of the OSCCON register for the desired HF frequency, and • FOSC<1:0> = 00, or • Set the System Clock Source (SCS) bits of the OSCCON register to ‘1x’. A fast start-up oscillator allows internal circuits to power up and stabilize before switching to HFINTOSC. The High-Frequency Internal Oscillator Ready bit (HFIOFR) of the OSCSTAT register indicates when the HFINTOSC is running. The High-Frequency Internal Oscillator Status Locked bit (HFIOFL) of the OSCSTAT register indicates when the HFINTOSC is running within 2% of its final value. The High-Frequency Internal Oscillator Stable bit (HFIOFS) of the OSCSTAT register indicates when the HFINTOSC is running within 0.5% of its final value. 5.2.2.2 MFINTOSC The Medium-Frequency Internal Oscillator (MFINTOSC) is a factory calibrated 500 kHz internal clock source. The frequency of the MFINTOSC can be altered via software using the OSCTUNE register (Register 5-3). The output of the MFINTOSC connects to a postscaler and multiplexer (see Figure 5-1). One of nine frequencies derived from the MFINTOSC can be selected via software using the IRCF<3:0> bits of the OSCCON register. See Section5.2.2.8 “Internal Oscillator Clock Switch Timing” for more information. The MFINTOSC is enabled by: • Configure the IRCF<3:0> bits of the OSCCON register for the desired HF frequency, and • FOSC<1:0> = 00, or • Set the System Clock Source (SCS) bits of the OSCCON register to ‘1x’ The Medium-Frequency Internal Oscillator Ready bit (MFIOFR) of the OSCSTAT register indicates when the MFINTOSC is running. 2014-2016 Microchip Technology Inc. DS40001737B-page 61 PIC12(L)F1612/16(L)F1613 5.2.2.3 Internal Oscillator Frequency Adjustment The 500 kHz internal oscillator is factory calibrated. This internal oscillator can be adjusted in software by writing to the OSCTUNE register (Register 5-3). Since the HFINTOSC and MFINTOSC clock sources are derived from the 500 kHz internal oscillator a change in the OSCTUNE register value will apply to both. The default value of the OSCTUNE register is ‘0’. The value is a 6-bit two’s complement number. A value of 1Fh will provide an adjustment to the maximum frequency. A value of 20h will provide an adjustment to the minimum frequency. When the OSCTUNE register is modified, the oscillator frequency will begin shifting to the new frequency. Code execution continues during this shift. There is no indication that the shift has occurred. OSCTUNE does not affect the LFINTOSC frequency. Operation of features that depend on the LFINTOSC clock source frequency, such as the Power-up Timer (PWRT), Watchdog Timer (WDT), and peripherals, are not affected by the change in frequency. 5.2.2.4 LFINTOSC The Low-Frequency Internal Oscillator (LFINTOSC) is an uncalibrated 31 kHz internal clock source. The output of the LFINTOSC connects to a multiplexer (see Figure 5-1). Select 31 kHz, via software, using the IRCF<3:0> bits of the OSCCON register. See Section5.2.2.8 “Internal Oscillator Clock Switch Timing” for more information. The LFINTOSC is also the frequency for the Power-up Timer (PWRT), Watchdog Timer (WDT) and Fail-Safe Clock Monitor (FSCM). The LFINTOSC is enabled by selecting 31 kHz (IRCF<3:0> bits of the OSCCON register = 000) as the system clock source (SCS bits of the OSCCON register = 1x), or when any of the following are enabled: • Configure the IRCF<3:0> bits of the OSCCON register for the desired LF frequency, and • FOSC<1:0> = 00, or • Set the System Clock Source (SCS) bits of the OSCCON register to ‘1x’ 5.2.2.5 FRC The FRC clock is an uncalibrated, nominal 600 kHz peripheral clock source. The FRC is automatically turned on by the peripherals requesting the FRC clock. The FRC clock will continue to run during Sleep. 5.2.2.6 Internal Oscillator Frequency Selection The system clock speed can be selected via software using the Internal Oscillator Frequency Select bits IRCF<3:0> of the OSCCON register. The postscaler outputs of the 16 MHz HFINTOSC, 500 kHz MFINTOSC, and 31 kHz LFINTOSC output connect to a multiplexer (see Figure 5-1). The Internal Oscillator Frequency Select bits IRCF<3:0> of the OSCCON register select the frequency output of the internal oscillators. One of the following frequencies can be selected via software: - 16 MHz 8 MHz 4 MHz 2 MHz 1 MHz 500 kHz (default after Reset) 250 kHz 125 kHz 62.5 kHz 31.25 kHz 31 kHz (LFINTOSC) Note: Following any Reset, the IRCF<3:0> bits of the OSCCON register are set to ‘0111’ and the frequency selection is set to 500 kHz. The user can modify the IRCF bits to select a different frequency. The IRCF<3:0> bits of the OSCCON register allow duplicate selections for some frequencies. These duplicate choices can offer system design trade-offs. Lower power consumption can be obtained when changing oscillator sources for a given frequency. Faster transition times can be obtained between frequency changes that use the same oscillator source. Peripherals that use the LFINTOSC are: • Power-up Timer (PWRT) • Watchdog Timer (WDT) The Low-Frequency Internal Oscillator Ready bit (LFIOFR) of the OSCSTAT register indicates when the LFINTOSC is running. 2014-2016 Microchip Technology Inc. DS40001737B-page 62 PIC12(L)F1612/16(L)F1613 5.2.2.7 32 MHz Internal Oscillator Frequency Selection The Internal Oscillator Block can be used with the 4x PLL associated with the External Oscillator Block to produce a 32 MHz internal system clock source. Either the 8 or 16 MHz internal oscillator settings can be used, with the 16 MHz being divided by two before being input into the PLL. The following settings are required to use the 32 MHz internal clock source: • The FOSC bits in Configuration Words must be set to use the INTOSC source as the device system clock (FOSC<1:0> = 00). • The SCS bits in the OSCCON register must be cleared to use the clock determined by FOSC<1:0> in Configuration Words (SCS<1:0> = 00). • The IRCF bits in the OSCCON register must be set to either the 16 MHz (IRCF<3:0> = 1111) or the 8 MHz HFINTOSC (IRCF<3:0> = 1110). • The SPLLEN bit in the OSCCON register must be set to enable the 4x PLL, or the PLLEN bit of the Configuration Words must be programmed to a ‘1’. Note: When using the PLLEN bit of the Configuration Words, the 4x PLL cannot be disabled by software and the 8/16 MHz HFINTOSC option will no longer be available. The 4x PLL is not available for use with the internal oscillator when the SCS bits of the OSCCON register are set to ‘1x’. The SCS bits must be set to ‘00’ to use the 4x PLL with the internal oscillator. 2014-2016 Microchip Technology Inc. 5.2.2.8 Internal Oscillator Clock Switch Timing When switching between the HFINTOSC, MFINTOSC and the LFINTOSC, the new oscillator may already be shut down to save power (see Figure 5-3). If this is the case, there is a delay after the IRCF<3:0> bits of the OSCCON register are modified before the frequency selection takes place. The OSCSTAT register will reflect the current active status of the HFINTOSC, MFINTOSC and LFINTOSC oscillators. The sequence of a frequency selection is as follows: 1. 2. 3. 4. 5. 6. 7. IRCF<3:0> bits of the OSCCON register are modified. If the new clock is shut down, a clock start-up delay is started. Clock switch circuitry waits for a falling edge of the current clock. The current clock is held low and the clock switch circuitry waits for a rising edge in the new clock. The new clock is now active. The OSCSTAT register is updated as required. Clock switch is complete. See Figure 5-3 for more details. If the internal oscillator speed is switched between two clocks of the same source, there is no start-up delay before the new frequency is selected. Clock switching time delays are shown in Table 5-1. Start-up delay specifications are located in the oscillator tables of Section28.0 “Electrical Specifications”. DS40001737B-page 63 PIC12(L)F1612/16(L)F1613 FIGURE 5-3: HFINTOSC/ MFINTOSC INTERNAL OSCILLATOR SWITCH TIMING LFINTOSC (WDT disabled) HFINTOSC/ MFINTOSC Start-up Time 2-cycle Sync Running 2-cycle Sync Running LFINTOSC IRCF <3:0> 0 0 System Clock HFINTOSC/ MFINTOSC LFINTOSC (WDT enabled) HFINTOSC/ MFINTOSC LFINTOSC 0 IRCF <3:0> 0 System Clock LFINTOSC HFINTOSC/MFINTOSC LFINTOSC turns off unless WDT is enabled LFINTOSC Start-up Time 2-cycle Sync Running HFINTOSC/ MFINTOSC IRCF <3:0> =0 0 System Clock 2014-2016 Microchip Technology Inc. DS40001737B-page 64 PIC12(L)F1612/16(L)F1613 5.3 Clock Switching The system clock source can be switched between external and internal clock sources via software using the System Clock Select (SCS) bits of the OSCCON register. The following clock sources can be selected using the SCS bits: When switching between clock sources, a delay is required to allow the new clock to stabilize. These oscillator delays are shown in Table 5-1. • Default system oscillator determined by FOSC bits in Configuration Words • Internal Oscillator Block (INTOSC) 5.3.1 SYSTEM CLOCK SELECT (SCS) BITS The System Clock Select (SCS) bits of the OSCCON register selects the system clock source that is used for the CPU and peripherals. • When the SCS bits of the OSCCON register = 00, the system clock source is determined by value of the FOSC<1:0> bits in the Configuration Words. • When the SCS bits of the OSCCON register = 1x, the system clock source is chosen by the internal oscillator frequency selected by the IRCF<3:0> bits of the OSCCON register. After a Reset, the SCS bits of the OSCCON register are always cleared. TABLE 5-1: OSCILLATOR SWITCHING DELAYS Switch From Switch To Frequency Oscillator Delay LFINTOSC(1) Sleep MFINTOSC(1) HFINTOSC(1) 31 kHz 31.25 kHz-500 kHz 31.25 kHz-16 MHz Oscillator Warm-up Delay (Tiosc st) Sleep/POR EC(1) DC – 32 MHz 2 cycles LFINTOSC EC(1) DC – 32 MHz 1 cycle of each Any clock source MFINTOSC(1) HFINTOSC(1) 31.25 kHz-500 kHz 31.25 kHz-16 MHz 2 s (approx.) Any clock source LFINTOSC(1) 31 kHz 1 cycle of each PLL inactive PLL active 16-32 MHz 2 ms (approx.) Note 1: PLL inactive. 2014-2016 Microchip Technology Inc. DS40001737B-page 65 PIC12(L)F1612/16(L)F1613 5.4 Register Definitions: Oscillator Control REGISTER 5-1: R/W-0/0 OSCCON: OSCILLATOR CONTROL REGISTER R/W-0/0 R/W-1/1 SPLLEN R/W-1/1 R/W-1/1 IRCF<3:0> U-0 R/W-0/0 — R/W-0/0 SCS<1:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7 SPLLEN: Software PLL Enable bit If PLLEN in Configuration Words = 1: SPLLEN bit is ignored. 4x PLL is always enabled (subject to oscillator requirements) If PLLEN in Configuration Words = 0: 1 = 4x PLL Is enabled 0 = 4x PLL is disabled bit 6-3 IRCF<3:0>: Internal Oscillator Frequency Select bits 1111 =16 MHz HF 1110 =8 MHz HF 1101 =4 MHz HF 1100 =2 MHz HF 1011 =1 MHz HF 1010 =500 kHz HF(1) 1001 =250 kHz HF(1) 1000 =125 kHz HF(1) 0111 =500 kHz MF (default upon Reset) 0110 =250 kHz MF 0101 =125 kHz MF 0100 =62.5 kHz MF 0011 =31.25 kHz HF(1) 0010 =31.25 kHz MF 000x =31 kHz LF bit 2 Unimplemented: Read as ‘0’ bit 1-0 SCS<1:0>: System Clock Select bits 1x = Internal oscillator block 01 = Reserved (defaults to internal oscillator block) 00 = Clock determined by FOSC<1:0> in Configuration Words. Note 1: Duplicate frequency derived from HFINTOSC. 2014-2016 Microchip Technology Inc. DS40001737B-page 66 PIC12(L)F1612/16(L)F1613 REGISTER 5-2: OSCSTAT: OSCILLATOR STATUS REGISTER U-0 R-0/q U-0 R-0/q R-0/q R-q/q R-0/q R-0/q — PLLR OSTS HFIOFR HFIOFL MFIOFR LFIOFR HFIOFS bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared q = Conditional bit 7 Unimplemented: Read as ‘0’ bit 6 PLLR: 4x PLL Ready bit 1 = 4x PLL is ready 0 = 4x PLL is not ready bit 5 OSTS: Oscillator Start-Up Timer Status bit 1 = Running from the clock defined by the FOSC<2:0> bits of the Configuration Words 0 = Running from an internal oscillator (FOSC<2:0> = 100) bit 4 HFIOFR: High-Frequency Internal Oscillator Ready bit 1 = HFINTOSC is ready 0 = HFINTOSC is not ready bit 3 HFIOFL: High-Frequency Internal Oscillator Locked bit 1 = HFINTOSC is at least 2% accurate 0 = HFINTOSC is not 2% accurate bit 2 MFIOFR: Medium-Frequency Internal Oscillator Ready bit 1 = MFINTOSC is ready 0 = MFINTOSC is not ready bit 1 LFIOFR: Low-Frequency Internal Oscillator Ready bit 1 = LFINTOSC is ready 0 = LFINTOSC is not ready bit 0 HFIOFS: High-Frequency Internal Oscillator Stable bit 1 = HFINTOSC is stable 0 = HFINTOSC is not stable 2014-2016 Microchip Technology Inc. DS40001737B-page 67 PIC12(L)F1612/16(L)F1613 REGISTER 5-3: OSCTUNE: OSCILLATOR TUNING REGISTER U-0 U-0 — — R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 TUN<5:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-6 Unimplemented: Read as ‘0’ bit 5-0 TUN<5:0>: Frequency Tuning bits 100000 = Minimum frequency • • • 111111 = 000000 = Oscillator module is running at the factory-calibrated frequency. 000001 = • • • 011110 = 011111 = Maximum frequency TABLE 5-2: SUMMARY OF REGISTERS ASSOCIATED WITH CLOCK SOURCES Name Bit 7 Bit 6 Bit 5 OSTS OSCCON SPLLEN OSCSTAT — PLLR OSCTUNE — — Bit 4 Bit 3 Bit 2 HFIOFL MFIOFR IRCF<3:0> — HFIOFR Bit 1 Bit 0 SCS<1:0> LFIOFR Register on Page 66 HFIOFS TUN<5:0> 67 68 Legend: — = unimplemented location, read as ‘0’. Shaded cells are not used by clock sources. TABLE 5-3: Name CONFIG1 SUMMARY OF CONFIGURATION WORD WITH CLOCK SOURCES Bits Bit -/7 Bit -/6 Bit 13/5 Bit 12/4 Bit 11/3 13:8 — — — — CLKOUTEN 7:0 CP MCLRE PWRTE — — Bit 10/2 Bit 9/1 Bit 8/0 BOREN<1:0> — — FOSC<1:0> Register on Page 52 Legend: — = unimplemented location, read as ‘0’. Shaded cells are not used by clock sources. 2014-2016 Microchip Technology Inc. DS40001737B-page 68 PIC12(L)F1612/16(L)F1613 6.0 RESETS There are multiple ways to reset this device: • • • • • • • • • Power-On Reset (POR) Brown-Out Reset (BOR) Low-Power Brown-Out Reset (LPBOR) MCLR Reset WDT Reset RESET instruction Stack Overflow Stack Underflow Programming mode exit To allow VDD to stabilize, an optional power-up timer can be enabled to extend the Reset time after a BOR or POR event. A simplified block diagram of the On-chip Reset Circuit is shown in Figure 6-1. FIGURE 6-1: SIMPLIFIED BLOCK DIAGRAM OF ON-CHIP RESET CIRCUIT Rev. 10-000 006D 1/22/201 4 ICSP™ Programming Mode Exit RESET Instruction Stack Underflow Stack Overflow VPP /MCLR MCLRE Sleep WDT Time-out Power-on Reset VDD BOR Active(1) R Brown-out Reset LFINTOSC LPBOR Reset Note 1: Device Reset WDT Window Violation Power-up Timer PWRTE See Table 6-1 for BOR active conditions. 2014-2016 Microchip Technology Inc. DS40001737B-page 69 PIC12(L)F1612/16(L)F1613 6.1 Power-On Reset (POR) 6.2 Brown-Out Reset (BOR) The POR circuit holds the device in Reset until VDD has reached an acceptable level for minimum operation. Slow rising VDD, fast operating speeds or analog performance may require greater than minimum VDD. The PWRT, BOR or MCLR features can be used to extend the start-up period until all device operation conditions have been met. The BOR circuit holds the device in Reset when VDD reaches a selectable minimum level. Between the POR and BOR, complete voltage range coverage for execution protection can be implemented. 6.1.1 • • • • POWER-UP TIMER (PWRT) The Power-up Timer provides a nominal 64 ms timeout on POR or Brown-out Reset. The device is held in Reset as long as PWRT is active. The PWRT delay allows additional time for the VDD to rise to an acceptable level. The Power-up Timer is enabled by clearing the PWRTE bit in Configuration Words. The Power-up Timer starts after the release of the POR and BOR. For additional information, refer to Application Note AN607, “Power-up Trouble Shooting” (DS00607). TABLE 6-1: The Brown-out Reset module has four operating modes controlled by the BOREN<1:0> bits in Configuration Words. The four operating modes are: BOR is always on BOR is off when in Sleep BOR is controlled by software BOR is always off Refer to Table 6-1 for more information. The Brown-out Reset voltage level is selectable by configuring the BORV bit in Configuration Words. A VDD noise rejection filter prevents the BOR from triggering on small events. If VDD falls below VBOR for a duration greater than parameter TBORDC, the device will reset. See Figure 6-2 for more information. BOR OPERATING MODES Instruction Execution upon: Release of POR or Wake-up from Sleep BOREN<1:0> SBOREN Device Mode BOR Mode 11 X X Active Waits for BOR ready(1) (BORRDY = 1) Awake Active 10 X Sleep Disabled Waits for BOR ready (BORRDY = 1) Active Waits for BOR ready(1) (BORRDY = 1) X Disabled X Disabled Begins immediately (BORRDY = x) 1 X 0 X 01 00 Note 1: In these specific cases, “release of POR” and “wake-up from Sleep,” there is no delay in start-up. The BOR ready flag, (BORRDY = 1), will be set before the CPU is ready to execute instructions because the BOR circuit is forced on by the BOREN<1:0> bits. 6.2.1 BOR IS ALWAYS ON When the BOREN bits of Configuration Words are programmed to ‘11’, the BOR is always on. The device start-up will be delayed until the BOR is ready and VDD is higher than the BOR threshold. BOR protection is active during Sleep. The BOR does not delay wake-up from Sleep. 6.2.2 BOR IS OFF IN SLEEP When the BOREN bits of Configuration Words are programmed to ‘10’, the BOR is on, except in Sleep. The device start-up will be delayed until the BOR is ready and VDD is higher than the BOR threshold. 2014-2016 Microchip Technology Inc. BOR protection is not active during Sleep. The device wake-up will be delayed until the BOR is ready. 6.2.3 BOR CONTROLLED BY SOFTWARE When the BOREN bits of Configuration Words are programmed to ‘01’, the BOR is controlled by the SBOREN bit of the BORCON register. The device start-up is not delayed by the BOR ready condition or the VDD level. BOR protection begins as soon as the BOR circuit is ready. The status of the BOR circuit is reflected in the BORRDY bit of the BORCON register. BOR protection is unchanged by Sleep. DS40001737B-page 70 PIC12(L)F1612/16(L)F1613 FIGURE 6-2: BROWN-OUT SITUATIONS VDD VBOR Internal TPWRT(1) Reset VDD VBOR Internal < TPWRT TPWRT(1) Reset VDD VBOR Internal TPWRT(1) Reset Note 1: 6.3 TPWRT delay only if PWRTE bit is programmed to ‘0’. Register Definitions: BOR Control REGISTER 6-1: BORCON: BROWN-OUT RESET CONTROL REGISTER R/W-1/u R/W-0/u U-0 U-0 U-0 U-0 U-0 R-q/u SBOREN BORFS — — — — — BORRDY bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared q = Value depends on condition bit 7 SBOREN: Software Brown-Out Reset Enable bit If BOREN <1:0> in Configuration Words = 01: 1 = BOR Enabled 0 = BOR Disabled If BOREN <1:0> in Configuration Words 01: SBOREN is read/write, but has no effect on the BOR bit 6 BORFS: Brown-Out Reset Fast Start bit(1) If BOREN <1:0> = 10 (Disabled in Sleep) or BOREN<1:0> = 01 (Under software control): 1 = Band gap is forced on always (covers sleep/wake-up/operating cases) 0 = Band gap operates normally, and may turn off If BOREN<1:0> = 11 (Always on) or BOREN<1:0> = 00 (Always off) BORFS is Read/Write, but has no effect. bit 5-1 Unimplemented: Read as ‘0’ bit 0 BORRDY: Brown-Out Reset Circuit Ready Status bit 1 = The Brown-out Reset circuit is active 0 = The Brown-out Reset circuit is inactive Note 1: BOREN<1:0> bits are located in Configuration Words. 2014-2016 Microchip Technology Inc. DS40001737B-page 71 PIC12(L)F1612/16(L)F1613 6.4 Low-Power Brown-Out Reset (LPBOR) The Low-Power Brown-Out Reset (LPBOR) operates like the BOR to detect low voltage conditions on the VDD pin. When too low of a voltage is detected, the device is held in Reset. When this occurs, a register bit (BOR) is changed to indicate that a BOR Reset has occurred. The BOR bit in PCON is used for both BOR and the LPBOR. Refer to Register 6-2. The LPBOR voltage threshold (VLPBOR) has a wider tolerance than the BOR (VBOR), but requires much less current (LPBOR current) to operate. The LPBOR is intended for use when the BOR is configured as disabled (BOREN = 00) or disabled in Sleep mode (BOREN = 10). Refer to Figure 6-1 to see how the LPBOR interacts with other modules. 6.4.1 MCLR The MCLR is an optional external input that can reset the device. The MCLR function is controlled by the MCLRE bit of Configuration Words and the LVP bit of Configuration Words (Table 6-2). TABLE 6-2: MCLR CONFIGURATION MCLRE LVP MCLR 0 0 Disabled 1 0 Enabled x 1 Enabled 6.5.1 MCLR ENABLED When MCLR is enabled and the pin is held low, the device is held in Reset. The MCLR pin is connected to VDD through an internal weak pull-up. The device has a noise filter in the MCLR Reset path. The filter will detect and ignore small pulses. Note: 6.5.2 A Reset does not drive the MCLR pin low. MCLR DISABLED When MCLR is disabled, the pin functions as a general purpose input and the internal weak pull-up is under software control. See Section12.3 “PORTA Registers” for more information. 2014-2016 Microchip Technology Inc. Watchdog Timer (WDT) Reset The Watchdog Timer generates a Reset if the firmware does not issue a CLRWDT instruction within the time-out period and the window is open. The TO and PD bits in the STATUS register are changed to indicate a WDT Reset caused by the timer overflowing, and WDTWV bit in the PCON register is changed to indicate a WDT Reset caused by a window violation. See Section9.0 “Windowed Watchdog Timer (WDT)” for more information. 6.7 RESET Instruction A RESET instruction will cause a device Reset. The RI bit in the PCON register will be set to ‘0’. See Table 6-4 for default conditions after a RESET instruction has occurred. 6.8 ENABLING LPBOR The LPBOR is controlled by the LPBOR bit of Configuration Words. When the device is erased, the LPBOR module defaults to disabled. 6.5 6.6 Stack Overflow/Underflow Reset The device can reset when the Stack Overflows or Underflows. The STKOVF or STKUNF bits of the PCON register indicate the Reset condition. These Resets are enabled by setting the STVREN bit in Configuration Words. See Section3.5.2 “Overflow/Underflow Reset” for more information. 6.9 Programming Mode Exit Upon exit of Programming mode, the device will behave as if a POR had just occurred. 6.10 Power-Up Timer The Power-up Timer optionally delays device execution after a BOR or POR event. This timer is typically used to allow VDD to stabilize before allowing the device to start running. The Power-up Timer is controlled by the PWRTE bit of Configuration Words. 6.11 Start-up Sequence Upon the release of a POR or BOR, the following must occur before the device will begin executing: 1. 2. Power-up Timer runs to completion (if enabled). MCLR must be released (if enabled). The total time-out will vary based on oscillator configuration and Power-up Timer configuration. See Section5.0 “Oscillator Module” for more information. The Power-up Timer runs independently of MCLR Reset. If MCLR is kept low long enough, the Power-up Timer will expire. Upon bringing MCLR high, the device will begin execution after 10 FOSC cycles (see Figure 6-3). This is useful for testing purposes or to synchronize more than one device operating in parallel. DS40001737B-page 72 PIC12(L)F1612/16(L)F1613 FIGURE 6-3: RESET START-UP SEQUENCE Rev. 10-000032A 7/30/2013 VDD Internal POR TPWRT Power-up Timer MCLR Internal RESET Int. Oscillator FOSC Begin Execution code execution (1) Internal Oscillator, PWRTEN = 0 code execution (1) Internal Oscillator, PWRTEN = 1 VDD Internal POR TPWRT Power-up Timer MCLR Internal RESET Ext. Clock (EC) FOSC Begin Execution code execution (1) External Clock (EC modes), PWRTEN = 0 code execution (1) External Clock (EC modes), PWRTEN = 1 VDD Internal POR TPWRT Power-up Timer MCLR Internal RESET TOST TOST Osc Start-Up Timer Ext. Oscillator FOSC Begin Execution code execution (1) External Oscillators , PWRTEN = 0, IESO = 0 code execution (1) External Oscillators , PWRTEN = 1, IESO = 0 VDD Internal POR TPWRT Power-up Timer MCLR Internal RESET TOST TOST Osc Start-Up Timer Ext. Oscillator Int. Oscillator FOSC Begin Execution code execution (1) External Oscillators , PWRTEN = 0, IESO = 1 Note 1: code execution (1) External Oscillators , PWRTEN = 1, IESO = 1 Code execution begins 10 FOSC cycles after the FOSC clock is released. 2014-2016 Microchip Technology Inc. DS40001737B-page 73 PIC12(L)F1612/16(L)F1613 6.12 Determining the Cause of a Reset Upon any Reset, multiple bits in the STATUS and PCON registers are updated to indicate the cause of the Reset. Table 6-3 and Table 6-4 show the Reset conditions of these registers. TABLE 6-3: RESET STATUS BITS AND THEIR SIGNIFICANCE STKOVF STKUNF RWDT 0 0 1 RMCLR RI POR BOR TO PD 1 1 0 x 1 1 Condition Power-on Reset 0 0 1 1 1 0 x 0 x Illegal, TO is set on POR 0 0 1 1 1 0 x x 0 Illegal, PD is set on POR 0 0 u 1 1 u 0 1 1 Brown-out Reset u u 0 u u u u 0 u WDT Reset u u u u u u u 0 0 WDT Wake-up from Sleep u u u u u u u 1 0 Interrupt Wake-up from Sleep u u u 0 u u u u u MCLR Reset during normal operation u u u 0 u u u 1 0 MCLR Reset during Sleep u u u u 0 u u u u RESET Instruction Executed 1 u u u u u u u u Stack Overflow Reset (STVREN = 1) u 1 u u u u u u u Stack Underflow Reset (STVREN = 1) TABLE 6-4: RESET CONDITION FOR SPECIAL REGISTERS Program Counter STATUS Register PCON Register Power-on Reset 0000h ---1 1000 0011 110x MCLR Reset during normal operation 0000h ---u uuuu uuuu 0uuu MCLR Reset during Sleep 0000h ---1 0uuu uuuu 0uuu WDT Reset 0000h ---0 uuuu uuu0 uuuu WDT Wake-up from Sleep PC + 1 ---0 0uuu uuuu uuuu Brown-out Reset 0000h ---1 1uuu 00uu 11u0 Condition Interrupt Wake-up from Sleep PC + 1 (1) ---1 0uuu uuuu uuuu RESET Instruction Executed 0000h ---u uuuu uuuu u0uu Stack Overflow Reset (STVREN = 1) 0000h ---u uuuu 1uuu uuuu Stack Underflow Reset (STVREN = 1) 0000h ---u uuuu u1uu uuuu WDT Window Violation 0000h ---1 uuuu uu0u uuuu Legend: u = unchanged, x = unknown, - = unimplemented bit, reads as ‘0’. Note 1:When the wake-up is due to an interrupt and the Global Interrupt Enable bit (GIE) is set, the return address is pushed on the stack and PC is loaded with the interrupt vector (0004h) after execution of PC + 1. 2014-2016 Microchip Technology Inc. DS40001737B-page 74 PIC12(L)F1612/16(L)F1613 6.13 Power Control (PCON) Register The Power Control (PCON) register contains flag bits to differentiate between a: • • • • • • • Power-On Reset (POR) Brown-Out Reset (BOR) Reset Instruction Reset (RI) MCLR Reset (RMCLR) Watchdog Timer Reset (RWDT) Stack Underflow Reset (STKUNF) Stack Overflow Reset (STKOVF) The PCON register bits are shown in Register 6-2. 6.14 Register Definitions: Power Control REGISTER 6-2: PCON: POWER CONTROL REGISTER R/W/HS-0/q R/W/HS-0/q R/W/HC-1/q R/W/HC-1/q R/W/HC-1/q R/W/HC-1/q R/W/HC-q/u R/W/HC-q/u STKOVF STKUNF WDTWV RWDT RMCLR RI POR BOR bit 7 bit 0 Legend: HC = Bit is cleared by hardware HS = Bit is set by hardware R = Readable bit W = Writable bit u = Bit is unchanged x = Bit is unknown U = Unimplemented bit, read as ‘0’ -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared q = Value depends on condition bit 7 STKOVF: Stack Overflow Flag bit 1 = A Stack Overflow occurred 0 = A Stack Overflow has not occurred or cleared by firmware bit 6 STKUNF: Stack Underflow Flag bit 1 = A Stack Underflow occurred 0 = A Stack Underflow has not occurred or cleared by firmware bit 5 WDTWV: WDT Window Violation Flag bit 1 = A WDT Window Violation Reset has not occurred or set by firmware 0 = A WDT Window Violation Reset has occurred (a CLRWDT instruction was executed either without arming the window or outside the window (cleared by hardware) bit 4 RWDT: Watchdog Timer Reset Flag bit 1 = A Watchdog Timer Reset has not occurred or set by firmware 0 = A Watchdog Timer Reset has occurred (cleared by hardware) bit 3 RMCLR: MCLR Reset Flag bit 1 = A MCLR Reset has not occurred or set by firmware 0 = A MCLR Reset has occurred (cleared by hardware) bit 2 RI: RESET Instruction Flag bit 1 = A RESET instruction has not been executed or set by firmware 0 = A RESET instruction has been executed (cleared by hardware) bit 1 POR: Power-On Reset Status bit 1 = No Power-on Reset occurred 0 = A Power-on Reset occurred (must be set in software after a Power-on Reset occurs) bit 0 BOR: Brown-Out Reset Status bit 1 = No Brown-out Reset occurred 0 = A Brown-out Reset occurred (must be set in software after a Power-on Reset or Brown-out Reset occurs) 2014-2016 Microchip Technology Inc. DS40001737B-page 75 PIC12(L)F1612/16(L)F1613 TABLE 6-5: SUMMARY OF REGISTERS ASSOCIATED WITH RESETS Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register on Page BORCON SBOREN BORFS — — — — — BORRDY 71 PCON STKOVF STKUNF WDTWV RWDT RMCLR RI POR BOR 75 — — — TO PD Z DC C 21 — — SEN 99 Name STATUS WDTCON0 Legend: Note 1: TABLE 6-6: Name CONFIG1 CONFIG2 CONFIG3 Legend: WDTPS<4:0> — = unimplemented bit, reads as ‘0’. Shaded cells are not used by Resets. Other (non Power-up) Resets include MCLR Reset and Watchdog Timer Reset during normal operation. SUMMARY OF CONFIGURATION WORD WITH RESETS Bits Bit -/7 Bit -/6 Bit 13/5 Bit 12/4 Bit 11/3 13:8 — — — — CLKOUTEN 7:0 CP MCLRE PWRTE — — — 13:8 — — LVP DEBUG LPBOR BORV 7:0 ZCD — — — — — 13:8 — — 7:0 — WDTE<1:0> Bit 10/2 Bit 9/1 Bit 8/0 BOREN<1:0> WDTCCS<2:0> — FOSC<1:0> STVREN PLLEN WRT<1:0> WDTCWS<2:0> WDTCPS<4:0> Register on Page 52 53 53 — = unimplemented location, read as ‘0’. Shaded cells are not used by Resets. 2014-2016 Microchip Technology Inc. DS40001737B-page 76 PIC12(L)F1612/16(L)F1613 7.0 INTERRUPTS The interrupt feature allows certain events to preempt normal program flow. Firmware is used to determine the source of the interrupt and act accordingly. Some interrupts can be configured to wake the MCU from Sleep mode. This chapter contains the following information for Interrupts: • • • • • Operation Interrupt Latency Interrupts During Sleep INT Pin Automatic Context Saving Many peripherals produce interrupts. Refer to the corresponding chapters for details. A block diagram of the interrupt logic is shown in Figure 7-1. FIGURE 7-1: Interrupt Logic Rev. 10-000010A 1/13/2014 TMR0IF TMR0IE Peripheral Interrupts (TMR1IF) PIR1<0> (TMR1IE) PIE1<0> Wake-up (If in Sleep mode) INTF INTE IOCIF IOCIE Interrupt to CPU PEIE PIRn<7> PIEn<7> 2014-2016 Microchip Technology Inc. GIE DS40001737B-page 77 PIC12(L)F1612/16(L)F1613 7.1 Operation Interrupts are disabled upon any device Reset. They are enabled by setting the following bits: • GIE bit of the INTCON register • Interrupt Enable bit(s) for the specific interrupt event(s) • PEIE bit of the INTCON register (if the Interrupt Enable bit of the interrupt event is contained in the PIE1, PIE2 and PIE3 registers) 7.2 Interrupt Latency Interrupt latency is defined as the time from when the interrupt event occurs to the time code execution at the interrupt vector begins. The latency for synchronous interrupts is three or four instruction cycles. For asynchronous interrupts, the latency is three to five instruction cycles, depending on when the interrupt occurs. See Figure 7-2 and Figure 7-3 for more details. The INTCON, PIR1, PIR2 and PIR3 registers record individual interrupts via interrupt flag bits. Interrupt flag bits will be set, regardless of the status of the GIE, PEIE and individual interrupt enable bits. The following events happen when an interrupt event occurs while the GIE bit is set: • Current prefetched instruction is flushed • GIE bit is cleared • Current Program Counter (PC) is pushed onto the stack • Critical registers are automatically saved to the shadow registers (See “Section7.5 “Automatic Context Saving”.”) • PC is loaded with the interrupt vector 0004h The firmware within the Interrupt Service Routine (ISR) should determine the source of the interrupt by polling the interrupt flag bits. The interrupt flag bits must be cleared before exiting the ISR to avoid repeated interrupts. Because the GIE bit is cleared, any interrupt that occurs while executing the ISR will be recorded through its interrupt flag, but will not cause the processor to redirect to the interrupt vector. The RETFIE instruction exits the ISR by popping the previous address from the stack, restoring the saved context from the shadow registers and setting the GIE bit. For additional information on a specific interrupt’s operation, refer to its peripheral chapter. Note 1: Individual interrupt flag bits are set, regardless of the state of any other enable bits. 2: All interrupts will be ignored while the GIE bit is cleared. Any interrupt occurring while the GIE bit is clear will be serviced when the GIE bit is set again. 2014-2016 Microchip Technology Inc. DS40001737B-page 78 PIC12(L)F1612/16(L)F1613 FIGURE 7-2: INTERRUPT LATENCY Fosc Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 CLKR Interrupt Sampled during Q1 Interrupt GIE PC Execute PC-1 PC 1-Cycle Instruction at PC PC+1 0004h 0005h NOP NOP Inst(0004h) PC+1/FSR ADDR New PC/ PC+1 0004h 0005h Inst(PC) NOP NOP Inst(0004h) FSR ADDR PC+1 PC+2 0004h 0005h INST(PC) NOP NOP NOP Inst(0004h) Inst(0005h) FSR ADDR PC+1 0004h 0005h INST(PC) NOP NOP Inst(0004h) Inst(PC) Interrupt GIE PC Execute PC-1 PC 2-Cycle Instruction at PC Interrupt GIE PC Execute PC-1 PC 3-Cycle Instruction at PC Interrupt GIE PC Execute PC-1 PC 3-Cycle Instruction at PC 2014-2016 Microchip Technology Inc. PC+2 NOP NOP DS40001737B-page 79 PIC12(L)F1612/16(L)F1613 FIGURE 7-3: INT PIN INTERRUPT TIMING Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 FOSC CLKOUT (3) INT pin (1) (1) INTF Interrupt Latency (2) (4) GIE INSTRUCTION FLOW PC Instruction Fetched Instruction Executed Note 1: 2: PC Inst (PC) Inst (PC – 1) PC + 1 Inst (PC + 1) Inst (PC) PC + 1 — Forced NOP 0004h 0005h Inst (0004h) Inst (0005h) Forced NOP Inst (0004h) INTF flag is sampled here (every Q1). Asynchronous interrupt latency = 3-5 TCY. Synchronous latency = 3-4 TCY, where TCY = instruction cycle time. Latency is the same whether Inst (PC) is a single cycle or a 2-cycle instruction. 3: For minimum width of INT pulse, refer to AC specifications in Section28.0 “Electrical Specifications”. 4: INTF is enabled to be set any time during the Q4-Q1 cycles. 2014-2016 Microchip Technology Inc. DS40001737B-page 80 PIC12(L)F1612/16(L)F1613 7.3 Interrupts During Sleep Some interrupts can be used to wake from Sleep. To wake from Sleep, the peripheral must be able to operate without the system clock. The interrupt source must have the appropriate Interrupt Enable bit(s) set prior to entering Sleep. On waking from Sleep, if the GIE bit is also set, the processor will branch to the interrupt vector. Otherwise, the processor will continue executing instructions after the SLEEP instruction. The instruction directly after the SLEEP instruction will always be executed before branching to the ISR. Refer to Section8.0 “PowerDown Mode (Sleep)” for more details. 7.4 INT Pin The INT pin can be used to generate an asynchronous edge-triggered interrupt. This interrupt is enabled by setting the INTE bit of the INTCON register. The INTEDG bit of the OPTION_REG register determines on which edge the interrupt will occur. When the INTEDG bit is set, the rising edge will cause the interrupt. When the INTEDG bit is clear, the falling edge will cause the interrupt. The INTF bit of the INTCON register will be set when a valid edge appears on the INT pin. If the GIE and INTE bits are also set, the processor will redirect program execution to the interrupt vector. 7.5 Automatic Context Saving Upon entering an interrupt, the return PC address is saved on the stack. Additionally, the following registers are automatically saved in the shadow registers: • • • • • W register STATUS register (except for TO and PD) BSR register FSR registers PCLATH register Upon exiting the Interrupt Service Routine, these registers are automatically restored. Any modifications to these registers during the ISR will be lost. If modifications to any of these registers are desired, the corresponding shadow register should be modified and the value will be restored when exiting the ISR. The shadow registers are available in Bank 31 and are readable and writable. Depending on the user’s application, other registers may also need to be saved. 2014-2016 Microchip Technology Inc. DS40001737B-page 81 PIC12(L)F1612/16(L)F1613 7.6 Register Definitions: Interrupt Control REGISTER 7-1: INTCON: INTERRUPT CONTROL REGISTER R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R-0/0 GIE(1) PEIE(2) TMR0IE INTE IOCIE TMR0IF INTF IOCIF(3) bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7 GIE: Global Interrupt Enable bit(1) 1 = Enables all active interrupts 0 = Disables all interrupts bit 6 PEIE: Peripheral Interrupt Enable bit(2) 1 = Enables all active peripheral interrupts 0 = Disables all peripheral interrupts bit 5 TMR0IE: Timer0 Overflow Interrupt Enable bit 1 = Enables the Timer0 interrupt 0 = Disables the Timer0 interrupt bit 4 INTE: INT External Interrupt Enable bit 1 = Enables the INT external interrupt 0 = Disables the INT external interrupt bit 3 IOCIE: Interrupt-on-Change Enable bit 1 = Enables the interrupt-on-change 0 = Disables the interrupt-on-change bit 2 TMR0IF: Timer0 Overflow Interrupt Flag bit 1 = TMR0 register has overflowed 0 = TMR0 register did not overflow bit 1 INTF: INT External Interrupt Flag bit 1 = The INT external interrupt occurred 0 = The INT external interrupt did not occur bit 0 IOCIF: Interrupt-on-Change Interrupt Flag bit(3) 1 = When at least one of the interrupt-on-change pins changed state 0 = None of the interrupt-on-change pins have changed state Note 1: Interrupt flag bits are set when an interrupt condition occurs, regardless of the state of its corresponding enable bit or the Global Interrupt Enable bit, GIE of the INTCON register. User software should ensure the appropriate interrupt flag bits are clear prior to enabling an interrupt. 2: Bit PEIE of the INTCON register must be set to enable any peripheral interrupt. 3: The IOCIF Flag bit is read-only and cleared when all the interrupt-on-change flags in the IOCxF registers have been cleared by software. 2014-2016 Microchip Technology Inc. DS40001737B-page 82 PIC12(L)F1612/16(L)F1613 REGISTER 7-2: PIE1: PERIPHERAL INTERRUPT ENABLE REGISTER 1 R/W-0/0 R/W-0/0 U-0 U-0 U-0 R/W-0/0 R/W-0/0 R/W-0/0 TMR1GIE ADIE — — — CCP1IE TMR2IE TMR1IE bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7 TMR1GIE: Timer1 Gate Interrupt Enable bit 1 = Enables the Timer1 gate acquisition interrupt 0 = Disables the Timer1 gate acquisition interrupt bit 6 ADIE: Analog-to-Digital Converter (ADC) Interrupt Enable bit 1 = Enables the ADC interrupt 0 = Disables the ADC interrupt bit 5-3 Unimplemented: Read as ‘0’ bit 2 CCP1IE: CCP1 Interrupt Enable bit 1 = Enables the CCP1 interrupt 0 = Disables the CCP1 interrupt bit 1 TMR2IE: TMR2 to PR2 Match Interrupt Enable bit 1 = Enables the Timer2 to PR2 match interrupt 0 = Disables the Timer2 to PR2 match interrupt bit 0 TMR1IE: Timer1 Overflow Interrupt Enable bit 1 = Enables the Timer1 overflow interrupt 0 = Disables the Timer1 overflow interrupt Note: Bit PEIE of the INTCON register must be set to enable any peripheral interrupt. 2014-2016 Microchip Technology Inc. DS40001737B-page 83 PIC12(L)F1612/16(L)F1613 REGISTER 7-3: PIE2: PERIPHERAL INTERRUPT ENABLE REGISTER 2 U-0 R/W-0/0 R/W-0/0 U-0 U-0 R/W-0/0 R/W-0/0 R/W-0/0 — C2IE(1) C1IE — — TMR6IE TMR4IE CCP2IE bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7 Unimplemented: Read as ‘0’ bit 6 C2IE: Comparator C2 Interrupt Enable bit(1) 1 = Enables the Comparator C2 interrupt 0 = Disables the Comparator C2 interrupt bit 5 C1IE: Comparator C1 Interrupt Enable bit 1 = Enables the Comparator C1 interrupt 0 = Disables the Comparator C1 interrupt bit 4-3 Unimplemented: Read as ‘0’ bit 2 TMR6IE: TMR6 to PR6 Match Interrupt Enable bit 1 = Enables the Timer6 to PR6 match interrupt 0 = Disables the Timer6 to PR6 match interrupt bit 1 TMR4IE: TMR4 to PR4 Match Interrupt Enable bit 1 = Enables the Timer4 to PR4 match interrupt 0 = Disables the Timer4 to PR4 match interrupt bit 0 CCP2IE: CCP2 Interrupt Enable bit 1 = The CCP2 interrupt is enabled 0 = The CCP2 interrupt is not enabled Note 1: 2: PIC16(L)F1613 only. Bit PEIE of the INTCON register must be set to enable any peripheral interrupt. 2014-2016 Microchip Technology Inc. DS40001737B-page 84 PIC12(L)F1612/16(L)F1613 REGISTER 7-4: PIE3: PERIPHERAL INTERRUPT ENABLE REGISTER 3 U-0 U-0 R/W-0/0 R/W-0/0 U-0 U-0 U-0 U-0 — — CWGIE ZCDIE — — — — bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-6 Unimplemented: Read as ‘0’ bit 5 CWGIE: Complementary Waveform Generator (CWG) Interrupt Enable bit 1 = Enables the CWG interrupt 0 = Disables the CWG interrupt bit 4 ZCDIE: Zero-Cross Detection (ZCD) Interrupt Enable bit 1 = Enables the ZCD interrupt 0 = Disables the ZCD interrupt bit 3-0 Unimplemented: Read as ‘0’ Note: Bit PEIE of the INTCON register must be set to enable any peripheral interrupt. 2014-2016 Microchip Technology Inc. DS40001737B-page 85 PIC12(L)F1612/16(L)F1613 REGISTER 7-5: PIE4: PERIPHERAL INTERRUPT ENABLE REGISTER 4 R/W-0/0 R/W-0/0 SCANIE CRCIE R/W-0/0 R/W-0/0 SMT2PWAIE SMT2PRAIE R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 SMT2IE SMT1PWAIE SMT1PRAIE SMT1IE bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7 SCANIE: Scanner Interrupt Enable bit 1 = Enables the scanner interrupt 0 = Disables the scanner interrupt bit 6 CRCIE: CRC Interrupt Enable bit 1 = Enables the CRC interrupt 0 = Disables the CRC interrupt bit 5 SMT2PWAIE: SMT2 Pulse Width Acquisition Interrupt Enable bit 1 = Enables the SMT2 acquisition interrupt 0 = Disables the SMT2 acquisition interrupt bit 4 SMT2PRAIE: SMT2 Period Acquisition Interrupt Enable bit 1 = Enables the SMT2 acquisition interrupt 0 = Disables the SMT2 acquisition interrupt bit 3 SMT2IE: SMT2 Match Interrupt Enable bit 1 = Enables the SMT2 period match interrupt 0 = Disables the SMT2 period match interrupt bit 2 SMT1PWAIE: SMT1 Pulse Width Acquisition Interrupt Enable bit 1 = Enables the SMT1 acquisition interrupt 0 = Disables the SMT1 acquisition interrupt bit 1 SMT1PRAIE: SMT1 Period Acquisition Interrupt Enable bit 1 = Enables the SMT1 acquisition interrupt 0 = Disables the SMT1 acquisition interrupt bit 0 SMT1IE: SMT1 Match Interrupt Enable bit 1 = Enables the SMT1 period match interrupt 0 = Disables the SMT1 period match interrupt Note: Bit PEIE of the INTCON register must be set to enable any peripheral interrupt. 2014-2016 Microchip Technology Inc. DS40001737B-page 86 PIC12(L)F1612/16(L)F1613 REGISTER 7-6: PIR1: PERIPHERAL INTERRUPT REQUEST REGISTER 1 R/W-0/0 R/W-0/0 U-0 U-0 U-0 R/W-0/0 R/W-0/0 R/W-0/0 TMR1GIF ADIF — — — CCP1IF TMR2IF TMR1IF bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7 TMR1GIF: Timer1 Gate Interrupt Flag bit 1 = Interrupt is pending 0 = Interrupt is not pending bit 6 ADIF: ADC Interrupt Flag bit 1 = Interrupt is pending 0 = Interrupt is not pending bit 5-3 Unimplemented: Read as ‘0’ bit 2 CCP1IF: CCP1 Interrupt Flag bit 1 = Interrupt is pending 0 = Interrupt is not pending bit 1 TMR2IF: Timer2 to PR2 Interrupt Flag bit 1 = Interrupt is pending 0 = Interrupt is not pending bit 0 TMR1IF: Timer1 Overflow Interrupt Flag bit 1 = Interrupt is pending 0 = Interrupt is not pending Note: Interrupt flag bits are set when an interrupt condition occurs, regardless of the state of its corresponding enable bit or the Global Interrupt Enable bit, GIE of the INTCON register. User software should ensure the appropriate interrupt flag bits are clear prior to enabling an interrupt. 2014-2016 Microchip Technology Inc. DS40001737B-page 87 PIC12(L)F1612/16(L)F1613 REGISTER 7-7: PIR2: PERIPHERAL INTERRUPT REQUEST REGISTER 2 U-0 R/W-0/0 R/W-0/0 U-0 U-0 R/W-0/0 R/W-0/0 R/W-0/0 — C2IF(1) C1IF — — TMR6IF TMR4IF CCP2IF bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7 Unimplemented: Read as ‘0’ bit 6 C2IF: Comparator C2 Interrupt Flag bit(1) 1 = Interrupt is pending 0 = Interrupt is not pending bit 5 C1IF: Comparator C1 Interrupt Flag bit 1 = Interrupt is pending 0 = Interrupt is not pending bit 4-3 Unimplemented: Read as ‘0’ bit 2 TMR6IF: Timer6 to PR6 Interrupt Flag bit 1 = Interrupt is pending 0 = Interrupt is not pending bit 1 TMR4IF: Timer4 to PR4 Interrupt Flag bit 1 = Interrupt is pending 0 = Interrupt is not pending bit 0 CCP2IF: CCP2 Interrupt Flag bit 1 = Interrupt is pending 0 = Interrupt is not pending Note 1: Note: PIC16(L)F1613 only. Interrupt flag bits are set when an interrupt condition occurs, regardless of the state of its corresponding enable bit or the Global Enable bit, GIE of the INTCON register. User software should ensure the appropriate interrupt flag bits are clear prior to enabling an interrupt. 2014-2016 Microchip Technology Inc. DS40001737B-page 88 PIC12(L)F1612/16(L)F1613 REGISTER 7-8: PIR3: PERIPHERAL INTERRUPT REQUEST REGISTER 3 U-0 U-0 R/W-0/0 R/W-0/0 U-0 U-0 U-0 U-0 — — CWGIF ZCDIF — — — — bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-6 Unimplemented: Read as ‘0’ bit 5 CWGIF: CWG Interrupt Flag bit 1 = Interrupt is pending 0 = Interrupt is not pending bit 4 ZCDIF: ZCD Interrupt Flag bit 1 = Interrupt is pending 0 = Interrupt is not pending bit 3-0 Unimplemented: Read as ‘0’ Note: Interrupt flag bits are set when an interrupt condition occurs, regardless of the state of its corresponding enable bit or the Global Enable bit, GIE of the INTCON register. User software should ensure the appropriate interrupt flag bits are clear prior to enabling an interrupt. 2014-2016 Microchip Technology Inc. DS40001737B-page 89 PIC12(L)F1612/16(L)F1613 REGISTER 7-9: PIR4: PERIPHERAL INTERRUPT REQUEST REGISTER 4 R/W-0/0 R/W-0/0 SCANIF CRCIF R/W-0/0 R/W-0/0 SMT2PWAIF SMT2PRAIF R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 SMT2IF SMT1PWAIF SMT1PRAIF SMT1IF bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7 SCANIF: Scanner Interrupt Flag bit 1 = Interrupt is pending 0 = Interrupt is not pending bit 6 CRCIF: CRC Interrupt Flag bit 1 = Interrupt is pending 0 = Interrupt is not pending bit 5 SMT2PWAIF: SMT2 Pulse Width Acquisition Interrupt Flag bit 1 = Interrupt is pending 0 = Interrupt is not pending bit 4 SMT2PRAIF: SMT2 Period Acquisition Interrupt Flag bit 1 = Interrupt is pending 0 = Interrupt is not pending bit 3 SMT2IF: SMT2 Match Interrupt Flag bit 1 = Interrupt is pending 0 = Interrupt is not pending bit 2 SMT1PWAIF: SMT1 Pulse Width Acquisition Interrupt Flag bit 1 = Interrupt is pending 0 = Interrupt is not pending bit 1 SMT1PRAIF: SMT1 Period Acquisition Interrupt Flag bit 1 = Interrupt is pending 0 = Interrupt is not pending bit 0 SMT1IF: SMT1 Match Interrupt Flag bit 1 = Interrupt is pending 0 = Interrupt is not pending Note: Interrupt flag bits are set when an interrupt condition occurs, regardless of the state of its corresponding enable bit or the Global Enable bit, GIE of the INTCON register. User software should ensure the appropriate interrupt flag bits are clear prior to enabling an interrupt. 2014-2016 Microchip Technology Inc. DS40001737B-page 90 PIC12(L)F1612/16(L)F1613 TABLE 7-1: Name INTCON SUMMARY OF REGISTERS ASSOCIATED WITH INTERRUPTS Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register on Page GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF 82 WPUEN INTEDG TMR0CS TMR0SE PSA PIE1 TMR1GIE ADIE — — — CCP1IE TMR2IE TMR1IE PIE2 — C2IE(1) C1IE — — TMR6IE TMR4IE CCP2IE 84 PIE3 — — CWGIE ZCDIE — — — — 85 PIE4 SCANIE CRCIE SMT2PWAIE SMT2PRAIE SMT2IE SMT1PWAIE SMT1PRAIE SMT1IF 86 PIR1 TMR1GIF ADIF — — — CCP1IF TMR2IF TMR1IF 87 PIR2 — C2IF(1) C1IF — — TMR6IF TMR4IF CCP2IF 88 PIR3 — — CWGIF ZCDIF — — — — 89 SCANIF CRCIF SMT2PWAIF SMT2PRAIF SMT2IF SMT1PWAIF SMT1PRAIF SMT1IF 90 OPTION_REG PIR4 Legend: Note 1: PS<2:0> 190 83 — = unimplemented location, read as ‘0’. Shaded cells are not used by interrupts. PIC16(L)F1613 only. 2014-2016 Microchip Technology Inc. DS40001737B-page 91 PIC12(L)F1612/16(L)F1613 8.0 POWER-DOWN MODE (SLEEP) The Power-Down mode is entered by executing a SLEEP instruction. Upon entering Sleep mode, the following conditions exist: 1. WDT will be cleared but keeps running, if enabled for operation during Sleep. PD bit of the STATUS register is cleared. TO bit of the STATUS register is set. CPU clock is disabled. 31 kHz LFINTOSC is unaffected and peripherals that operate from it may continue operation in Sleep. Timer1 and peripherals that operate from Timer1 continue operation in Sleep when the Timer1 clock source selected is: • LFINTOSC • T1CKI • Timer1 oscillator ADC is unaffected, if the dedicated FRC oscillator is selected. I/O ports maintain the status they had before SLEEP was executed (driving high, low or highimpedance). Resets other than WDT are not affected by Sleep mode. 2. 3. 4. 5. 6. 7. 8. 9. Refer to individual chapters for more details on peripheral operation during Sleep. To minimize current consumption, the following conditions should be considered: • • • • • • I/O pins should not be floating External circuitry sinking current from I/O pins Internal circuitry sourcing current from I/O pins Current draw from pins with internal weak pull-ups Modules using 31 kHz LFINTOSC CWG modules using HFINTOSC I/O pins that are high-impedance inputs should be pulled to VDD or VSS externally to avoid switching currents caused by floating inputs. Examples of internal circuitry that might be sourcing current include the FVR module. See Section 14.0 “Fixed Voltage Reference (FVR)” for more information on this module. 8.1 Wake-up from Sleep The first three events will cause a device Reset. The last three events are considered a continuation of program execution. To determine whether a device Reset or wake-up event occurred, refer to Section 6.12 “Determining the Cause of a Reset”. When the SLEEP instruction is being executed, the next instruction (PC + 1) is prefetched. For the device to wake-up through an interrupt event, the corresponding interrupt enable bit must be enabled. Wake-up will occur regardless of the state of the GIE bit. If the GIE bit is disabled, the device continues execution at the instruction after the SLEEP instruction. If the GIE bit is enabled, the device executes the instruction after the SLEEP instruction, the device will then call the Interrupt Service Routine. In cases where the execution of the instruction following SLEEP is not desirable, the user should have a NOP after the SLEEP instruction. The WDT is cleared when the device wakes up from Sleep, regardless of the source of wake-up. 8.1.1 WAKE-UP USING INTERRUPTS When global interrupts are disabled (GIE cleared) and any interrupt source has both its interrupt enable bit and interrupt flag bit set, one of the following will occur: • If the interrupt occurs before the execution of a SLEEP instruction - SLEEP instruction will execute as a NOP - WDT and WDT prescaler will not be cleared - TO bit of the STATUS register will not be set - PD bit of the STATUS register will not be cleared • If the interrupt occurs during or after the execution of a SLEEP instruction - SLEEP instruction will be completely executed - Device will immediately wake-up from Sleep - WDT and WDT prescaler will be cleared - TO bit of the STATUS register will be set - PD bit of the STATUS register will be cleared Even if the flag bits were checked before executing a SLEEP instruction, it may be possible for flag bits to become set before the SLEEP instruction completes. To determine whether a SLEEP instruction executed, test the PD bit. If the PD bit is set, the SLEEP instruction was executed as a NOP. The device can wake-up from Sleep through one of the following events: 1. External Reset input on MCLR pin, if enabled 2. BOR Reset, if enabled 3. POR Reset 4. Watchdog Timer, if enabled 5. Any external interrupt 6. Interrupts by peripherals capable of running during Sleep (see individual peripheral for more information) 2014-2016 Microchip Technology Inc. DS40001737B-page 92 PIC12(L)F1612/16(L)F1613 FIGURE 8-1: WAKE-UP FROM SLEEP THROUGH INTERRUPT Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 CLKIN(1) T1OSC(3) CLKOUT(2) Interrupt flag Interrupt Latency (4) GIE bit (INTCON reg.) Instruction Flow PC Instruction Fetched Instruction Executed Note 8.2 1: 2: 3: 4: Processor in Sleep PC Inst(PC) = Sleep Inst(PC - 1) PC + 1 PC + 2 PC + 2 Inst(PC + 1) Inst(PC + 2) Sleep Inst(PC + 1) PC + 2 Forced NOP 0004h 0005h Inst(0004h) Inst(0005h) Forced NOP Inst(0004h) External clock. High, Medium, Low mode assumed. CLKOUT is shown here for timing reference. T1OSC; See Section 28.0 “Electrical Specifications”. GIE = 1 assumed. In this case after wake-up, the processor calls the ISR at 0004h. If GIE = 0, execution will continue in-line. Low-Power Sleep Mode 8.2.2 PERIPHERAL USAGE IN SLEEP This device contains an internal Low Dropout (LDO) voltage regulator, which allows the device I/O pins to operate at voltages up to 5.5V while the internal device logic operates at a lower voltage. The LDO and its associated reference circuitry must remain active when the device is in Sleep mode. Some peripherals that can operate in Sleep mode will not operate properly with the Low-Power Sleep mode selected. The LDO will remain in the Normal-Power mode when those peripherals are enabled. The LowPower Sleep mode is intended for use with these peripherals: Low-Power Sleep mode allows the user to optimize the operating current in Sleep. Low-Power Sleep mode can be selected by setting the VREGPM bit of the VREGCON register, putting the LDO and reference circuitry in a low-power state whenever the device is in Sleep. • • • • 8.2.1 SLEEP CURRENT VS. WAKE-UP TIME In the Default Operating mode, the LDO and reference circuitry remain in the normal configuration while in Sleep. The device is able to exit Sleep mode quickly since all circuits remain active. In Low-Power Sleep mode, when waking up from Sleep, an extra delay time is required for these circuits to return to the normal configuration and stabilize. The Low-Power Sleep mode is beneficial for applications that stay in Sleep mode for long periods of time. The Normal mode is beneficial for applications that need to wake from Sleep quickly and frequently. 2014-2016 Microchip Technology Inc. Brown-Out Reset (BOR) Watchdog Timer (WDT) External interrupt pin/Interrupt-on-change pins Timer1 (with external clock source) The Complementary Waveform Generator (CWG) can utilize the HFINTOSC oscillator as either a clock source or as an input source. Under certain conditions, when the HFINTOSC is selected for use with the CWG modules, the HFINTOSC will remain active during Sleep. This will have a direct effect on the Sleep mode current. Please refer to sections Section 24.11 “Operation During Sleep” for more information. Note: The PIC12LF1612/16LF1613 does not have a configurable Low-Power Sleep mode. PIC12LF1612/16LF1613 is an unregulated device and is always in the lowest power state when in Sleep, with no wake-up time penalty. This device has a lower maximum VDD and I/O voltage than the PIC12F1612/16F1613. See Section 28.0 “Electrical Specifications” for more information. DS40001737B-page 93 PIC12(L)F1612/16(L)F1613 8.3 Register Definitions: Voltage Regulator Control VREGCON: VOLTAGE REGULATOR CONTROL REGISTER(1) REGISTER 8-1: U-0 U-0 U-0 U-0 U-0 U-0 R/W-0/0 R/W-1/1 — — — — — — VREGPM Reserved bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-2 Unimplemented: Read as ‘0’ bit 1 VREGPM: Voltage Regulator Power Mode Selection bit 1 = Low-Power Sleep mode enabled in Sleep(2) Draws lowest current in Sleep, slower wake-up 0 = Normal Power mode enabled in Sleep(2) Draws higher current in Sleep, faster wake-up bit 0 Reserved: Read as ‘1’. Maintain this bit set. Note 1: 2: PIC12F1612/16F1613 only. See Section 28.0 “Electrical Specifications”. TABLE 8-1: SUMMARY OF REGISTERS ASSOCIATED WITH POWER-DOWN MODE Name Bit 7 Bit 6 Bit 5 INTCON Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register on Page GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF 82 IOCAF — — IOCAF5 IOCAF4 IOCAF3 IOCAF2 IOCAF1 IOCAF0 148 IOCAN — — IOCAN5 IOCAN4 IOCAN3 IOCAN2 IOCAN1 IOCAN0 148 IOCAP — — IOCAP5 IOCAP4 IOCAP3 IOCAP2 IOCAP1 IOCAP0 148 IOCCP(1) — — IOCCP5 IOCCP4 IOCCP3 IOCCP2 IOCCP1 IOCCP0 148 IOCCN(1) — — IOCCN5 IOCCN4 IOCCN3 IOCCN2 IOCCN1 IOCCN0 148 IOCCF(1) — — IOCCF5 IOCCF4 IOCCF3 IOCCF2 IOCCF1 IOCCF0 148 83 PIE1 TMR1GIE ADIE — — — CCP1IE TMR2IE TMR1IE PIE2 — C2IE(1) C1IE — — TMR6IE TMR4IE CCP2IE 84 PIE3 — — CWGIE ZCDIE — — — — 85 PIE4 SCANIE CRCIE SMT2PWAIE SMT2PRAIE SMT2IE SMT1IF 86 PIR1 TMR1GIF ADIF — — — CCP1IF TMR2IF TMR1IF 87 PIR2 — C2IF(1) C1IF — — TMR6IF TMR4IF CCP2IF 88 PIR3 — — CWGIF ZCDIF — — — — 89 PIR4 SCANIF CRCIF SMT1IF 90 STATUS — — C 21 WDTCON0 — — SEN 99 Legend: Note 1: SMT2PWAIF SMT2PRAIF — TO SMT2IF SMT1PWAIE SMT1PRAIE SMT1PWAIF SMT1PRAIF PD WDTPS<4:0> Z DC — = unimplemented, read as ‘0’. Shaded cells are not used in Power-Down mode. PIC16(L)F1613 only. 2014-2016 Microchip Technology Inc. DS40001737B-page 94 PIC12(L)F1612/16(L)F1613 9.0 WINDOWED WATCHDOG TIMER (WDT) The Watchdog Timer (WDT) is a system timer that generates a Reset if the firmware does not issue a CLRWDT instruction within the time-out period. The Watchdog Timer is typically used to recover the system from unexpected events. The Windowed Watchdog Timer (WDT) differs in that CLRWDT instructions are only accepted when they are performed within a specific window during the time-out period. The WDT has the following features: • Selectable clock source • Multiple operating modes - WDT is always on - WDT is off when in Sleep - WDT is controlled by software - WDT is always off • Configurable time-out period is from 1 ms to 256 seconds (nominal) • Configurable window size from 12.5 to 100 percent of the time-out period • Multiple Reset conditions • Operation during Sleep 2014-2016 Microchip Technology Inc. DS40001737B-page 95 PIC12(L)F1612/16(L)F1613 FIGURE 9-1: WATCHDOG TIMER BLOCK DIAGRAM Rev. 10-000 162A 1/2/201 4 WWDT Armed WDT Window Violation Window Closed Window Sizes CLRWDT Comparator WINDOW RESET Reserved 111 Reserved 110 Reserved 101 Reserved 100 Reserved 011 Reserved 010 MFINTOSC/16 001 LFINTOSC 000 R 18-bit Prescale Counter E WDTCS WDTPS R 5-bit WDT Counter Overflow Latch WDT Time-out WDTE<1:0> = 01 SEN WDTE<1:0> = 11 WDTE<1:0> = 10 Sleep 2014-2016 Microchip Technology Inc. DS40001737B-page 96 PIC12(L)F1612/16(L)F1613 9.1 Independent Clock Source 9.4 Watchdog Window The WDT can derive its time base from either the 31 kHz LFINTOSC or 31.25 kHz MFINTOSC internal oscillators, depending on the value of either the WDTCCS<2:0> configuration bits or the WDTCS<2:0> bits of WDTCON1. Time intervals in this chapter are based on a minimum nominal interval of 1 ms. See Section28.0 “Electrical Specifications” for LFINTOSC and MFINTOSC tolerances. The Watchdog Timer has an optional Windowed mode that is controlled by the WDTCWS<2:0> Configuration bits and WINDOW<2:0> bits of the WDTCON1 register. In the Windowed mode, the CLRWDT instruction must occur within the allowed window of the WDT period. Any CLRWDT instruction that occurs outside of this window will trigger a window violation and will cause a WDT Reset, similar to a WDT time out. See Figure 9-2 for an example. 9.2 The window size is controlled by the WDTCWS<2:0> Configuration bits, or the WINDOW<2:0> bits of WDTCON1, if WDTCWS<2:0> = 111. WDT Operating Modes The Watchdog Timer module has four operating modes controlled by the WDTE<1:0> bits in Configuration Words. See Table 9-1. 9.2.1 WDT IS ALWAYS ON When the WDTE bits of Configuration Words are set to ‘11’, the WDT is always on. WDT protection is active during Sleep. 9.2.2 9.5 Clearing the WDT The WDT is cleared when any of the following conditions occur: WDT IS OFF IN SLEEP When the WDTE bits of Configuration Words are set to ‘10’, the WDT is on, except in Sleep. WDT protection is not active during Sleep. 9.2.3 In the event of a window violation, a Reset will be generated and the WDTWV bit of the PCON register will be cleared. This bit is set by a POR or can be set in firmware. WDT CONTROLLED BY SOFTWARE When the WDTE bits of Configuration Words are set to ‘01’, the WDT is controlled by the SEN bit of the WDTCON0 register. • • • • • • • Any Reset Valid CLRWDT instruction is executed Device enters Sleep Device wakes up from Sleep WDT is disabled Oscillator Start-up Timer (OST) is running Any write to the WDTCON0 or WDTCON1 registers WDT protection is unchanged by Sleep. See Table 9-1 for more details. 9.5.1 TABLE 9-1: When in Windowed mode, the WDT must be armed before a CLRWDT instruction will clear the timer. This is performed by reading the WDTCON0 register. Executing a CLRWDT instruction without performing such an arming action will trigger a window violation. WDT OPERATING MODES WDTE<1:0> SEN Device Mode WDT Mode 11 X X Active Awake Active Sleep Disabled 1 X Active 0 X Disabled X X Disabled 10 X 01 00 9.3 Time-Out Period The WDTPS bits of the WDTCON0 register set the time-out period from 1 ms to 256 seconds (nominal). After a Reset, the default time-out period is two seconds. 2014-2016 Microchip Technology Inc. CLRWDT CONSIDERATIONS (WINDOWED MODE) See Table 9-2 for more information. 9.6 Operation During Sleep When the device enters Sleep, the WDT is cleared. If the WDT is enabled during Sleep, the WDT resumes counting. When the device exits Sleep, the WDT is cleared again. The WDT remains clear until the OST, if enabled, completes. See Section5.0 “Oscillator Module” for more information on the OST. When a WDT time-out occurs while the device is in Sleep, no Reset is generated. Instead, the device wakes up and resumes operation. The TO and PD bits in the STATUS register are changed to indicate the event. The RWDT bit in the PCON register can also be used. See Section3.0 “Memory Organization” for more information. DS40001737B-page 97 PIC12(L)F1612/16(L)F1613 TABLE 9-2: WDT CLEARING CONDITIONS Conditions WDT WDTE<1:0> = 00 WDTE<1:0> = 01 and SEN = 0 WDTE<1:0> = 10 and enter Sleep Cleared CLRWDT Command Oscillator Fail Detected Exit Sleep + System Clock = T1OSC, EXTRC, INTOSC, EXTCLK Change INTOSC divider (IRCF bits) FIGURE 9-2: Unaffected WINDOW PERIOD AND DELAY Rev. 10-000163A 10/27/2015 CLRWDT Instruction (or other WDT Reset) Window Period Window Closed Window Delay (window violation can occur) 2014-2016 Microchip Technology Inc. Window Open Time-out Event DS40001737B-page 98 PIC12(L)F1612/16(L)F1613 9.7 Register Definitions: Windowed Watchdog Timer Control REGISTER 9-1: WDTCON0: WATCHDOG TIMER CONTROL REGISTER 0 U-0 U-0 R/W(3)-q/q(2) R/W(3)-q/q(2) R/W(3)-q/q(2) R/W(3)-q/q(2) R/W(3)-q/q(2) R/W-0/0 — — WDTPS<4:0>(1) SEN bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared q = Value depends on condition bit 7-6 Unimplemented: Read as ‘0’ bit 5-1 WDTPS<4:0>: Watchdog Timer Prescale Select bits(1) Bit Value = Prescale Rate 11111 = Reserved. Results in minimum interval (1:32) • • • 10011 = Reserved. Results in minimum interval (1:32) 10010 10001 10000 01111 01110 01101 01100 01011 01010 01001 01000 00111 00110 00101 00100 00011 00010 00001 00000 bit 0 = = = = = = = = = = = = = = = = = = = 1:8388608 (223) (Interval 256s nominal) 1:4194304 (222) (Interval 128s nominal) 1:2097152 (221) (Interval 64s nominal) 1:1048576 (220) (Interval 32s nominal) 1:524288 (219) (Interval 16s nominal) 1:262144 (218) (Interval 8s nominal) 1:131072 (217) (Interval 4s nominal) 1:65536 (Interval 2s nominal) (Reset value) 1:32768 (Interval 1s nominal) 1:16384 (Interval 512 ms nominal) 1:8192 (Interval 256 ms nominal) 1:4096 (Interval 128 ms nominal) 1:2048 (Interval 64 ms nominal) 1:1024 (Interval 32 ms nominal) 1:512 (Interval 16 ms nominal) 1:256 (Interval 8 ms nominal) 1:128 (Interval 4 ms nominal) 1:64 (Interval 2 ms nominal) 1:32 (Interval 1 ms nominal) SEN: Software Enable/Disable for Watchdog Timer bit If WDTE<1:0> = 1x: This bit is ignored. If WDTE<1:0> = 01: 1 = WDT is turned on 0 = WDT is turned off If WDTE<1:0> = 00: This bit is ignored. Note 1: 2: 3: Times are approximate. WDT time is based on 31 kHz LFINTOSC. When WDTCPS <4:0> in CONFIG3 = 11111, the Reset value of WDTPS<4:0> is 01011. Otherwise, the Reset value of WDTPS<4:0> is equal to WDTCPS<4:0> in CONFIG3. When WDTCPS <4:0> in CONFIG3 ≠ 11111, these bits are read-only. 2014-2016 Microchip Technology Inc. DS40001737B-page 99 PIC12(L)F1612/16(L)F1613 REGISTER 9-2: WDTCON1: WATCHDOG TIMER CONTROL REGISTER 1 U-0 R/W(3)-q/q(1) R/W(3)-q/q(1) R/W(3)-q/q(1) U-0 — WDTCS<2:0> — R/W(4)-q/q(2) R/W(4)-q/q(2) R/W(4)-q/q(2) WINDOW<2:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared q = Value depends on condition bit 7 Unimplemented: Read as ‘0’ bit 6-4 WDTCS<2:0>: Watchdog Timer Clock Select bits 111 = Reserved • • • 010 = Reserved 001 = MFINTOSC 31.25 kHz 000 = LFINTOSC 31 kHz bit 3 Unimplemented: Read as ‘0’ bit 2-0 WINDOW<2:0>: Watchdog Timer Window Select bits WINDOW<2:0> Note 1: 2: 3: 4: Window delay Percent of time Window opening Percent of time 111 N/A 100 110 12.5 87.5 101 25 75 100 37.5 62.5 011 50 50 010 62.5 37.5 001 75 25 000 87.5 12.5 If WDTCCS <2:0> in CONFIG3 = 111, the Reset value of WDTCS<2:0> is 000. The Reset value of WINDOW<2:0> is determined by the value of WDTCWS<2:0> in the CONFIG3 register. If WDTCCS<2:0> in CONFIG3 ≠ 111, these bits are read-only. If WDTCWS<2:0> in CONFIG3 ≠ 111, these bits are read-only. 2014-2016 Microchip Technology Inc. DS40001737B-page 100 PIC12(L)F1612/16(L)F1613 REGISTER 9-3: R-0/0 WDTPSL: WDT PRESCALE SELECT LOW BYTE REGISTER (READ ONLY) R-0/0 R-0/0 R-0/0 R-0/0 PSCNT<7:0> R-0/0 R-0/0 R-0/0 (1) bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared PSCNT<7:0>: Prescale Select Low Byte bits(1) bit 7-0 Note 1: The 18-bit WDT prescale value, PSCNT<17:0> includes the WDTPSL, WDTPSH and the lower bits of the WDTTMR registers. PSCNT<17:0> is intended for debug operations and should be read during normal operation. REGISTER 9-4: R-0/0 WDTPSH: WDT PRESCALE SELECT HIGH BYTE REGISTER (READ ONLY) R-0/0 R-0/0 R-0/0 R-0/0 R-0/0 R-0/0 R-0/0 PSCNT<15:8>(1) bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared PSCNT<15:8>: Prescale Select High Byte bits(1) bit 7-0 Note 1: The 18-bit WDT prescale value, PSCNT<17:0> includes the WDTPSL, WDTPSH and the lower bits of the WDTTMR registers. PSCNT<17:0> is intended for debug operations and should be read during normal operation. REGISTER 9-5: R-0/0 WDTTMR: WDT TIMER REGISTER (READ ONLY) R-0/0 R-0/0 R-0/0 R-0/0 WDTTMR<3:0> R-0/0 STATE R-0/0 R-0/0 PSCNT<17:16>(1) bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-3 WDTTMR<4:0>: Watchdog Timer Value bit 2 STATE: WDT Armed Status bit 1 = WDT is armed 0 = WDT is not armed bit 1-0 PSCNT<17:16>: Prescale Select Upper Byte bits(1) Note 1: The 18-bit WDT prescale value, PSCNT<17:0> includes the WDTPSL, WDTPSH and the lower bits of the WDTTMR registers. PSCNT<17:0> is intended for debug operations and should be read during normal operation. 2014-2016 Microchip Technology Inc. DS40001737B-page 101 PIC12(L)F1612/16(L)F1613 TABLE 9-3: Name SUMMARY OF REGISTERS ASSOCIATED WITH WATCHDOG TIMER Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 IRCF<3:0> Bit 1 Bit 0 Register on Page OSCCON SPLLEN PCON STKOVF STKUNF WDTWV RWDT RMCLR RI POR BOR STATUS — — — TO PD Z DC C 21 WDTCON0 — — SEN 99 WDTCON1 — Legend: 75 99 WINDOW<2:0> 99 PSCNT<15:8> 99 WDTTMR<4:0> — STATE PSCNT<17:16> 99 x = unknown, u = unchanged, – = unimplemented locations read as ‘0’. Shaded cells are not used by Watchdog Timer. TABLE 9-4: CONFIG3 66 PSCNT<7:0> WDTTMR CONFIG1 — WDTCS<2:0> WDTPSH Name SCS<1:0> WDTPS<4:0> WDTPSL Legend: — SUMMARY OF CONFIGURATION WORD WITH WATCHDOG TIMER Bits Bit -/7 Bit -/6 Bit 13/5 Bit 12/4 Bit 11/3 13:8 — — — — CLKOUTEN 7:0 CP MCLRE PWRTE — — 13:8 — — 7:0 — WDTE<1:0> WDTCCS<2:0> Bit 10/2 Bit 9/1 Bit 8/0 BOREN<1:0> — — FOSC<1:0> WDTCWS<2:0> WDTCPS<4:0> Register on Page 52 53 — = unimplemented location, read as ‘0’. Shaded cells are not used by Watchdog Timer. 2014-2016 Microchip Technology Inc. DS40001737B-page 102 PIC12(L)F1612/16(L)F1613 10.0 FLASH PROGRAM MEMORY CONTROL The Flash program memory is readable and writable during normal operation over the full VDD range. Program memory is indirectly addressed using Special Function Registers (SFRs). The SFRs used to access program memory are: • • • • • • PMCON1 PMCON2 PMDATL PMDATH PMADRL PMADRH When accessing the program memory, the PMDATH:PMDATL register pair forms a 2-byte word that holds the 14-bit data for read/write, and the PMADRH:PMADRL register pair forms a 2-byte word that holds the 15-bit address of the program memory location being read. The write time is controlled by an on-chip timer. The write/ erase voltages are generated by an on-chip charge pump rated to operate over the operating voltage range of the device. The Flash program memory can be protected in two ways; by code protection (CP bit in Configuration Words) and write protection (WRT<1:0> bits in Configuration Words). Code protection (CP = 0)(1), disables access, reading and writing, to the Flash program memory via external device programmers. Code protection does not affect the self-write and erase functionality. Code protection can only be reset by a device programmer performing a Bulk Erase to the device, clearing all Flash program memory, Configuration bits and User IDs. Write protection prohibits self-write and erase to a portion or all of the Flash program memory, as defined by the bits WRT<1:0>. Write protection does not affect a device programmers ability to read, write or erase the device. Note 1: Code protection of the entire Flash program memory array is enabled by clearing the CP bit of Configuration Words. 10.1 PMADRL and PMADRH Registers The PMADRH:PMADRL register pair can address up to a maximum of 16K words of program memory. When selecting a program address value, the MSB of the address is written to the PMADRH register and the LSB is written to the PMADRL register. 10.1.1 PMCON1 AND PMCON2 REGISTERS PMCON1 is the control register for Flash program memory accesses. 2014-2016 Microchip Technology Inc. Control bits RD and WR initiate read and write, respectively. These bits cannot be cleared, only set, in software. They are cleared by hardware at completion of the read or write operation. The inability to clear the WR bit in software prevents the accidental, premature termination of a write operation. The WREN bit, when set, will allow a write operation to occur. On power-up, the WREN bit is clear. The WRERR bit is set when a write operation is interrupted by a Reset during normal operation. In these situations, following Reset, the user can check the WRERR bit and execute the appropriate error handling routine. The PMCON2 register is a write-only register. Attempting to read the PMCON2 register will return all ‘0’s. To enable writes to the program memory, a specific pattern (the unlock sequence), must be written to the PMCON2 register. The required unlock sequence prevents inadvertent writes to the program memory write latches and Flash program memory. 10.2 Flash Program Memory Overview It is important to understand the Flash program memory structure for erase and programming operations. Flash program memory is arranged in rows. A row consists of a fixed number of 14-bit program memory words. A row is the minimum size that can be erased by user software. After a row has been erased, the user can reprogram all or a portion of this row. Data to be written into the program memory row is written to 14-bit wide data write latches. These write latches are not directly accessible to the user, but may be loaded via sequential writes to the PMDATH:PMDATL register pair. Note: If the user wants to modify only a portion of a previously programmed row, then the contents of the entire row must be read and saved in RAM prior to the erase. Then, new data and retained data can be written into the write latches to reprogram the row of Flash program memory. However, any unprogrammed locations can be written without first erasing the row. In this case, it is not necessary to save and rewrite the other previously programmed locations. See Table 10-1 for Erase Row size and the number of write latches for Flash program memory. TABLE 10-1: Device PIC12(L)F1612 PIC16(L)F1613 FLASH MEMORY ORGANIZATION BY DEVICE Row Erase (words) Write Latches (words) 16 16 DS40001737B-page 103 PIC12(L)F1612/16(L)F1613 10.2.1 READING THE FLASH PROGRAM MEMORY To read a program memory location, the user must: 1. 2. 3. Write the desired address to the PMADRH:PMADRL register pair. Clear the CFGS bit of the PMCON1 register. Then, set control bit RD of the PMCON1 register. Once the read control bit is set, the program memory Flash controller will use the second instruction cycle to read the data. This causes the second instruction immediately following the “BSF PMCON1,RD” instruction to be ignored. The data is available in the very next cycle, in the PMDATH:PMDATL register pair; therefore, it can be read as two bytes in the following instructions. PMDATH:PMDATL register pair will hold this value until another read or until it is written to by the user. Note: The two instructions following a program memory read are required to be NOPs. This prevents the user from executing a 2cycle instruction on the next instruction after the RD bit is set. FIGURE 10-1: FLASH PROGRAM MEMORY READ FLOWCHART Rev. 10-000046A 7/30/2013 Start Read Operation Select Program or Configuration Memory (CFGS) Select Word Address (PMADRH:PMADRL) Initiate Read operation (RD = 1) Instruction fetched ignored NOP execution forced Instruction fetched ignored NOP execution forced Data read now in PMDATH:PMDATL End Read Operation 2014-2016 Microchip Technology Inc. DS40001737B-page 104 PIC12(L)F1612/16(L)F1613 FIGURE 10-2: FLASH PROGRAM MEMORY READ CYCLE EXECUTION Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 PC Flash ADDR Flash Data PC + 1 INSTR (PC) INSTR(PC - 1) executed here PMADRH,PMADRL INSTR (PC + 1) BSF PMCON1,RD executed here PC +3 PC+3 PMDATH,PMDATL INSTR(PC + 1) instruction ignored Forced NOP executed here PC + 5 PC + 4 INSTR (PC + 3) INSTR(PC + 2) instruction ignored Forced NOP executed here INSTR (PC + 4) INSTR(PC + 3) executed here INSTR(PC + 4) executed here RD bit PMDATH PMDATL Register EXAMPLE 10-1: FLASH PROGRAM MEMORY READ * This code block will read 1 word of program * memory at the memory address: PROG_ADDR_HI: PROG_ADDR_LO * data will be returned in the variables; * PROG_DATA_HI, PROG_DATA_LO BANKSEL MOVLW MOVWF MOVLW MOVWF PMADRL PROG_ADDR_LO PMADRL PROG_ADDR_HI PMADRH ; Select Bank for PMCON registers ; ; Store LSB of address ; ; Store MSB of address BCF BSF NOP NOP PMCON1,CFGS PMCON1,RD ; ; ; ; Do not select Configuration Space Initiate read Ignored (Figure 10-2) Ignored (Figure 10-2) MOVF MOVWF MOVF MOVWF PMDATL,W PROG_DATA_LO PMDATH,W PROG_DATA_HI ; ; ; ; Get LSB of word Store in user location Get MSB of word Store in user location 2014-2016 Microchip Technology Inc. DS40001737B-page 105 PIC12(L)F1612/16(L)F1613 10.2.2 FLASH MEMORY UNLOCK SEQUENCE The unlock sequence is a mechanism that protects the Flash program memory from unintended self-write programming or erasing. The sequence must be executed and completed without interruption to successfully complete any of the following operations: • Row Erase • Load program memory write latches • Write of program memory write latches to program memory • Write of program memory write latches to User IDs FIGURE 10-3: FLASH PROGRAM MEMORY UNLOCK SEQUENCE FLOWCHART Rev. 10-000047A 7/30/2013 Start Unlock Sequence Write 0x55 to PMCON2 The unlock sequence consists of the following steps: 1. Write 55h to PMCON2 2. Write AAh to PMCON2 Write 0xAA to PMCON2 3. Set the WR bit in PMCON1 4. NOP instruction 5. NOP instruction Once the WR bit is set, the processor will always force two NOP instructions. When an Erase Row or Program Row operation is being performed, the processor will stall internal operations (typical 2 ms), until the operation is complete and then resume with the next instruction. When the operation is loading the program memory write latches, the processor will always force the two NOP instructions and continue uninterrupted with the next instruction. Since the unlock sequence must not be interrupted, global interrupts should be disabled prior to the unlock sequence and re-enabled after the unlock sequence is completed. 2014-2016 Microchip Technology Inc. Initiate Write or Erase operation (WR = 1) Instruction fetched ignored NOP execution forced Instruction fetched ignored NOP execution forced End Unlock Sequence DS40001737B-page 106 PIC12(L)F1612/16(L)F1613 10.2.3 ERASING FLASH PROGRAM MEMORY While executing code, program memory can only be erased by rows. To erase a row: 1. 2. 3. 4. 5. Load the PMADRH:PMADRL register pair with any address within the row to be erased. Clear the CFGS bit of the PMCON1 register. Set the FREE and WREN bits of the PMCON1 register. Write 55h, then AAh, to PMCON2 (Flash programming unlock sequence). Set control bit WR of the PMCON1 register to begin the erase operation. See Example 10-2. After the “BSF PMCON1,WR” instruction, the processor requires two cycles to set up the erase operation. The user must place two NOP instructions immediately following the WR bit set instruction. The processor will halt internal operations for the typical 2 ms erase time. This is not Sleep mode as the clocks and peripherals will continue to run. After the erase cycle, the processor will resume operation with the third instruction after the PMCON1 write instruction. FIGURE 10-4: FLASH PROGRAM MEMORY ERASE FLOWCHART Rev. 10-000048A 7/30/2013 Start Erase Operation Disable Interrupts (GIE = 0) Select Program or Configuration Memory (CFGS) Select Row Address (PMADRH:PMADRL) Select Erase Operation (FREE = 1) Enable Write/Erase Operation (WREN = 1) Unlock Sequence (See Note 1) CPU stalls while Erase operation completes (2 ms typical) Disable Write/Erase Operation (WREN = 0) Re-enable Interrupts (GIE = 1) End Erase Operation Note 1: See Figure 10-3. 2014-2016 Microchip Technology Inc. DS40001737B-page 107 PIC12(L)F1612/16(L)F1613 EXAMPLE 10-2: ERASING ONE ROW OF PROGRAM MEMORY Required Sequence ; This row erase routine assumes the following: ; 1. A valid address within the erase row is loaded in ADDRH:ADDRL ; 2. ADDRH and ADDRL are located in shared data memory 0x70 - 0x7F (common RAM) BCF BANKSEL MOVF MOVWF MOVF MOVWF BCF BSF BSF INTCON,GIE PMADRL ADDRL,W PMADRL ADDRH,W PMADRH PMCON1,CFGS PMCON1,FREE PMCON1,WREN MOVLW MOVWF MOVLW MOVWF BSF NOP NOP 55h PMCON2 AAh PMCON2 PMCON1,WR BCF BSF PMCON1,WREN INTCON,GIE 2014-2016 Microchip Technology Inc. ; Disable ints so required sequences will execute properly ; Load lower 8 bits of erase address boundary ; Load upper 6 bits of erase address boundary ; Not configuration space ; Specify an erase operation ; Enable writes ; ; ; ; ; ; ; ; ; ; Start of required sequence to initiate erase Write 55h Write AAh Set WR bit to begin erase NOP instructions are forced as processor starts row erase of program memory. The processor stalls until the erase process is complete after erase processor continues with 3rd instruction ; Disable writes ; Enable interrupts DS40001737B-page 108 PIC12(L)F1612/16(L)F1613 10.2.4 WRITING TO FLASH PROGRAM MEMORY Program memory is programmed using the following steps: 1. 2. 3. 4. Load the address in PMADRH:PMADRL of the row to be programmed. Load each write latch with data. Initiate a programming operation. Repeat steps 1 through 3 until all data is written. The following steps should be completed to load the write latches and program a row of program memory. These steps are divided into two parts. First, each write latch is loaded with data from the PMDATH:PMDATL using the unlock sequence with LWLO = 1. When the last word to be loaded into the write latch is ready, the LWLO bit is cleared and the unlock sequence executed. This initiates the programming operation, writing all the latches into Flash program memory. Note: Before writing to program memory, the word(s) to be written must be erased or previously unwritten. Program memory can only be erased one row at a time. No automatic erase occurs upon the initiation of the write. Program memory can be written one or more words at a time. The maximum number of words written at one time is equal to the number of write latches. See Figure 10-5 (row writes to program memory with 16 write latches) for more details. The write latches are aligned to the Flash row address boundary defined by the upper 11 bits of PMADRH:PMADRL, (PMADRH<6:0>:PMADRL<7:4>) with the lower four bits of PMADRL, (PMADRL<3:0>) determining the write latch being loaded. Write operations do not cross these boundaries. At the completion of a program memory write operation, the data in the write latches is reset to contain 0x3FFF. The special unlock sequence is required to load a write latch with data or initiate a Flash programming operation. If the unlock sequence is interrupted, writing to the latches or program memory will not be initiated. 1. 2. 3. Set the WREN bit of the PMCON1 register. Clear the CFGS bit of the PMCON1 register. Set the LWLO bit of the PMCON1 register. When the LWLO bit of the PMCON1 register is ‘1’, the write sequence will only load the write latches and will not initiate the write to Flash program memory. 4. Load the PMADRH:PMADRL register pair with the address of the location to be written. 5. Load the PMDATH:PMDATL register pair with the program memory data to be written. 6. Execute the unlock sequence (Section 10.2.2 “Flash Memory Unlock Sequence”). The write latch is now loaded. 7. Increment the PMADRH:PMADRL register pair to point to the next location. 8. Repeat steps 5 through 7 until all but the last write latch has been loaded. 9. Clear the LWLO bit of the PMCON1 register. When the LWLO bit of the PMCON1 register is ‘0’, the write sequence will initiate the write to Flash program memory. 10. Load the PMDATH:PMDATL register pair with the program memory data to be written. 11. Execute the unlock sequence (Section 10.2.2 “Flash Memory Unlock Sequence”). The entire program memory latch content is now written to Flash program memory. Note: The program memory write latches are reset to the Blank state (0x3FFF) at the completion of every write or erase operation. As a result, it is not necessary to load all the program memory write latches. Unloaded latches will remain in the blank state. An example of the complete write sequence is shown in Example 10-3. The initial address is loaded into the PMADRH:PMADRL register pair; the data is loaded using indirect addressing. 2014-2016 Microchip Technology Inc. DS40001737B-page 109 2014-2016 Microchip Technology Inc. FIGURE 10-5: 7 6 - rA BLOCK WRITES TO FLASH PROGRAM MEMORY WITH 16 WRITE LATCHES 0 7 4 PMADRH r9 r8 r7 r6 3 0 7 PMADRL r5 r4 r3 r2 r1 r0 c3 c2 c1 - 5 0 7 PMDATH - PMDATL 6 c0 Rev. 10-000 004C 11/13/201 3 0 8 14 11 Program Memory Write Latches 4 14 Write Latch #0 00h 14 14 14 Write Latch #14 0Eh Write Latch #1 01h Write Latch #15 0Fh PMADRL<3:0> 14 DS40001737B-page 110 PMADRH<6:0>: PMADRL<7:4> Row Address Decode 14 14 Row Addr Addr Addr Addr 000h 0000h 0001h 000Eh 000Fh 001h 0010h 0011h 001Eh 001Fh 002h 0020h 0021h 002Eh 002Fh 7FEh 7FE0h 7FE1h 7FEEh 7FEFh 7FFh 7FF0h 7FF1h 7FFEh 7FFFh Flash Program Memory 800h CFGS = 1 8000h - 8003h USER ID 0 - 3 8004h reserved 8005h 8006h 8007h – 8009h 800Ah - 801Fh MASK/ REV ID DEVICE ID Configuration Words reserved Configuration Memory PIC12(L)F1612/16(L)F1613 CFGS = 0 14 PIC12(L)F1612/16(L)F1613 FIGURE 10-6: FLASH PROGRAM MEMORY WRITE FLOWCHART Rev. 10-000049A 7/30/2013 Start Write Operation Determine number of words to be written into Program or Configuration Memory. The number of words cannot exceed the number of words per row (word_cnt) Enable Write/Erase Operation (WREN = 1) Load the value to write (PMDATH:PMDATL) Disable Interrupts (GIE = 0) Update the word counter (word_cnt--) Write Latches to Flash (LWLO = 0) Select Program or Config. Memory (CFGS) Last word to write ? Yes Unlock Sequence (See Note 1) Select Row Address (PMADRH:PMADRL) No Select Write Operation (FREE = 0) Load Write Latches Only (LWLO = 1) Unlock Sequence (See Note 1) No delay when writing to Program Memory Latches CPU stalls while Write operation completes (2 ms typical) Disable Write/Erase Operation (WREN = 0) Re-enable Interrupts (GIE = 1) Increment Address (PMADRH:PMADRL++) End Write Operation Note 1: See Figure 10-3. 2014-2016 Microchip Technology Inc. DS40001737B-page 111 PIC12(L)F1612/16(L)F1613 EXAMPLE 10-3: ; ; ; ; ; ; ; WRITING TO FLASH PROGRAM MEMORY (16 WRITE LATCHES) This write routine assumes the following: 1. 32 bytes of data are loaded, starting at the address in DATA_ADDR 2. Each word of data to be written is made up of two adjacent bytes in DATA_ADDR, stored in little endian format 3. A valid starting address (the Least Significant bits = 00000) is loaded in ADDRH:ADDRL 4. ADDRH and ADDRL are located in shared data memory 0x70 - 0x7F (common RAM) BCF BANKSEL MOVF MOVWF MOVF MOVWF MOVLW MOVWF MOVLW MOVWF BCF BSF BSF INTCON,GIE PMADRH ADDRH,W PMADRH ADDRL,W PMADRL LOW DATA_ADDR FSR0L HIGH DATA_ADDR FSR0H PMCON1,CFGS PMCON1,WREN PMCON1,LWLO ; ; ; ; ; ; ; ; ; ; ; ; ; Disable ints so required sequences will execute properly Bank 3 Load initial address MOVIW MOVWF MOVIW MOVWF FSR0++ PMDATL FSR0++ PMDATH ; Load first data byte into lower ; ; Load second data byte into upper ; MOVF XORLW ANDLW BTFSC GOTO PMADRL,W 0x0F 0x0F STATUS,Z START_WRITE ; Check if lower bits of address are '00000' ; Check if we're on the last of 16 addresses ; ; Exit if last of 16 words, ; MOVLW MOVWF MOVLW MOVWF BSF NOP 55h PMCON2 AAh PMCON2 PMCON1,WR ; ; ; ; ; ; ; ; PMADRL,F LOOP ; Still loading latches Increment address ; Write next latches PMCON1,LWLO ; No more loading latches - Actually start Flash program ; memory write 55h PMCON2 AAh PMCON2 PMCON1,WR ; ; ; ; ; ; ; ; ; ; ; ; ; Load initial data address Load initial data address Not configuration space Enable writes Only Load Write Latches Required Sequence LOOP NOP INCF GOTO Required Sequence START_WRITE BCF MOVLW MOVWF MOVLW MOVWF BSF NOP NOP BCF BSF PMCON1,WREN INTCON,GIE 2014-2016 Microchip Technology Inc. Start of required write sequence: Write 55h Write AAh Set WR bit to begin write NOP instructions are forced as processor loads program memory write latches Start of required write sequence: Write 55h Write AAh Set WR bit to begin write NOP instructions are forced as processor writes all the program memory write latches simultaneously to program memory. After NOPs, the processor stalls until the self-write process in complete after write processor continues with 3rd instruction Disable writes Enable interrupts DS40001737B-page 112 PIC12(L)F1612/16(L)F1613 10.3 Modifying Flash Program Memory When modifying existing data in a program memory row, and data within that row must be preserved, it must first be read and saved in a RAM image. Program memory is modified using the following steps: 1. 2. 3. 4. 5. 6. 7. Load the starting address of the row to be modified. Read the existing data from the row into a RAM image. Modify the RAM image to contain the new data to be written into program memory. Load the starting address of the row to be rewritten. Erase the program memory row. Load the write latches with data from the RAM image. Initiate a programming operation. FIGURE 10-7: FLASH PROGRAM MEMORY MODIFY FLOWCHART Rev. 10-000050A 7/30/2013 Start Modify Operation Read Operation (See Note 1) An image of the entire row read must be stored in RAM Modify Image The words to be modified are changed in the RAM image Erase Operation (See Note 2) Write Operation Use RAM image (See Note 3) End Modify Operation Note 1: See Figure 10-2. 2: See Figure 10-4. 3: See Figure 10-5. 2014-2016 Microchip Technology Inc. DS40001737B-page 113 PIC12(L)F1612/16(L)F1613 10.4 User ID, Device ID and Configuration Word Access Instead of accessing program memory, the User ID’s, Device ID/Revision ID and Configuration Words can be accessed when CFGS = 1 in the PMCON1 register. This is the region that would be pointed to by PC<15> = 1, but not all addresses are accessible. Different access may exist for reads and writes. Refer to Table 10-2. When read access is initiated on an address outside the parameters listed in Table 10-2, the PMDATH:PMDATL register pair is cleared, reading back ‘0’s. TABLE 10-2: USER ID, DEVICE ID AND CONFIGURATION WORD ACCESS (CFGS = 1) Address Function 8000h-8003h 8006h/8005h 8007h-8009h EXAMPLE 10-4: User IDs Device ID/Revision ID Configuration Words 1, 2, and 3 Read Access Write Access Yes Yes Yes Yes No No CONFIGURATION WORD AND DEVICE ID ACCESS * This code block will read 1 word of program memory at the memory address: * PROG_ADDR_LO (must be 00h-08h) data will be returned in the variables; * PROG_DATA_HI, PROG_DATA_LO BANKSEL MOVLW MOVWF CLRF PMADRL PROG_ADDR_LO PMADRL PMADRH ; Select correct Bank ; ; Store LSB of address ; Clear MSB of address BSF BCF BSF NOP NOP BSF PMCON1,CFGS INTCON,GIE PMCON1,RD INTCON,GIE ; ; ; ; ; ; Select Configuration Space Disable interrupts Initiate read Executed (See Figure 10-2) Ignored (See Figure 10-2) Restore interrupts MOVF MOVWF MOVF MOVWF PMDATL,W PROG_DATA_LO PMDATH,W PROG_DATA_HI ; ; ; ; Get LSB of word Store in user location Get MSB of word Store in user location 2014-2016 Microchip Technology Inc. DS40001737B-page 114 PIC12(L)F1612/16(L)F1613 10.5 Write Verify It is considered good programming practice to verify that program memory writes agree with the intended value. Since program memory is stored as a full page then the stored program memory contents are compared with the intended data stored in RAM after the last write is complete. FIGURE 10-8: FLASH PROGRAM MEMORY VERIFY FLOWCHART Rev. 10-000051A 7/30/2013 Start Verify Operation This routine assumes that the last row of data written was from an image saved on RAM. This image will be used to verify the data currently stored in Flash Program Memory Read Operation (See Note 1) PMDAT = RAM image ? No Yes Fail Verify Operation No Last word ? Yes End Verify Operation Note 1: See Figure 10-2. 2014-2016 Microchip Technology Inc. DS40001737B-page 115 PIC12(L)F1612/16(L)F1613 10.6 Register Definitions: Flash Program Memory Control REGISTER 10-1: R/W-x/u PMDATL: PROGRAM MEMORY DATA LOW BYTE REGISTER R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u PMDAT<7:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-0 PMDAT<7:0>: Read/write value for Least Significant bits of program memory REGISTER 10-2: PMDATH: PROGRAM MEMORY DATA HIGH BYTE REGISTER U-0 U-0 — — R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u PMDAT<13:8> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-6 Unimplemented: Read as ‘0’ bit 5-0 PMDAT<13:8>: Read/write value for Most Significant bits of program memory REGISTER 10-3: R/W-0/0 PMADRL: PROGRAM MEMORY ADDRESS LOW BYTE REGISTER R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 PMADR<7:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-0 PMADR<7:0>: Specifies the Least Significant bits for program memory address REGISTER 10-4: U-1 PMADRH: PROGRAM MEMORY ADDRESS HIGH BYTE REGISTER R/W-0/0 R/W-0/0 —(1) R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 PMADR<14:8> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7 Unimplemented: Read as ‘1’ bit 6-0 PMADR<14:8>: Specifies the Most Significant bits for program memory address Note 1: Unimplemented, read as ‘1’. 2014-2016 Microchip Technology Inc. DS40001737B-page 116 PIC12(L)F1612/16(L)F1613 REGISTER 10-5: U-1 (1) — PMCON1: PROGRAM MEMORY CONTROL 1 REGISTER R/W-0/0 R/W-0/0 R/W/HC-0/0 R/W/HC-x/q(2) R/W-0/0 R/S/HC-0/0 R/S/HC-0/0 CFGS LWLO FREE WRERR WREN WR RD bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ S = Bit can only be set x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared HC = Bit is cleared by hardware bit 7 Unimplemented: Read as ‘1’ bit 6 CFGS: Configuration Select bit 1 = Access Configuration, User ID and Device ID Registers 0 = Access Flash program memory bit 5 LWLO: Load Write Latches Only bit(3) 1 = Only the addressed program memory write latch is loaded/updated on the next WR command 0 = The addressed program memory write latch is loaded/updated and a write of all program memory write latches will be initiated on the next WR command bit 4 FREE: Program Flash Erase Enable bit 1 = Performs an erase operation on the next WR command (hardware cleared upon completion) 0 = Performs a write operation on the next WR command bit 3 WRERR: Program/Erase Error Flag bit 1 = Condition indicates an improper program or erase sequence attempt or termination (bit is set automatically on any set attempt (write ‘1’) of the WR bit) 0 = The program or erase operation completed normally bit 2 WREN: Program/Erase Enable bit 1 = Allows program/erase cycles 0 = Inhibits programming/erasing of program Flash bit 1 WR: Write Control bit 1 = Initiates a program Flash program/erase operation. The operation is self-timed and the bit is cleared by hardware once operation is complete. The WR bit can only be set (not cleared) in software. 0 = Program/erase operation to the Flash is complete and inactive bit 0 RD: Read Control bit 1 = Initiates a program Flash read. Read takes one cycle. RD is cleared in hardware. The RD bit can only be set (not cleared) in software. 0 = Does not initiate a program Flash read Note 1: 2: 3: Unimplemented bit, read as ‘1’. The WRERR bit is automatically set by hardware when a program memory write or erase operation is started (WR = 1). The LWLO bit is ignored during a program memory erase operation (FREE = 1). 2014-2016 Microchip Technology Inc. DS40001737B-page 117 PIC12(L)F1612/16(L)F1613 REGISTER 10-6: W-0/0 PMCON2: PROGRAM MEMORY CONTROL 2 REGISTER W-0/0 W-0/0 W-0/0 W-0/0 W-0/0 W-0/0 W-0/0 Program Memory Control Register 2 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ S = Bit can only be set x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-0 Flash Memory Unlock Pattern bits To unlock writes, a 55h must be written first, followed by an AAh, before setting the WR bit of the PMCON1 register. The value written to this register is used to unlock the writes. There are specific timing requirements on these writes. TABLE 10-3: Name SUMMARY OF REGISTERS ASSOCIATED WITH FLASH PROGRAM MEMORY Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register on Page INTCON GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF 82 PMCON1 —(1) CFGS LWLO FREE WRERR WREN WR RD 117 PMCON2 Program Memory Control Register 2 118 PMADRL PMADRL<7:0> 116 — PMADRH (1) PMADRH<6:0> PMDATL PMDATH Legend: Note 1: — CONFIG1 CONFIG2 CONFIG3 Legend: — 116 PMDATH<5:0> 116 — = unimplemented location, read as ‘0’. Shaded cells are not used by Flash program memory. Unimplemented, read as ‘1’. TABLE 10-4: Name 116 PMDATL<7:0> SUMMARY OF CONFIGURATION WORD WITH FLASH PROGRAM MEMORY Bits Bit -/7 Bit -/6 Bit 13/5 Bit 12/4 Bit 11/3 13:8 — — — — CLKOUTEN 7:0 CP MCLRE PWRTE — — — 13:8 — — LVP DEBUG LPBOR BORV 7:0 ZCD — — — — — 13:8 — — 7:0 — WDTE<1:0> WDTCCS<2:0> Bit 10/2 Bit 9/1 Bit 8/0 BOREN<1:0> — FOSC<1:0> STVREN PLLEN WRT<1:0> WDTCWS<2:0> WDTCPS<4:0> Register on Page 52 53 53 — = unimplemented location, read as ‘0’. Shaded cells are not used by Flash program memory. 2014-2016 Microchip Technology Inc. DS40001737B-page 118 PIC12(L)F1612/16(L)F1613 11.0 EXAMPLE 11-1: CYCLIC REDUNDANCY CHECK (CRC) MODULE Rev. 10-000206A 1/8/2014 CRC-16-ANSI The Cyclic Redundancy Check (CRC) module provides a software-configurable hardware-implemented CRC checksum generator. This module includes the following features: x16 + x15 + x2 + 1 (17 bits) Standard 16-bit representation = 0x8005 CRCXORH = 0b10000000 CRCXORL = 0b0000010- • • • • • Any standard CRC up to 16 bits can be used Configurable Polynomial Any seed value up to 16 bits can be used Standard and reversed bit order available Augmented zeros can be added automatically or by the user • Memory scanner for fast CRC calculations on program memory user data • Software loadable data registers for calculating CRC values not from the memory scanner 11.1 Data Sequence: 0x55, 0x66, 0x77, 0x88 DLEN = 0b0111 PLEN = 0b1111 Data entered into the CRC: SHIFTM = 0: 01010101 01100110 01110111 10001000 SHIFTM = 1: 10101010 01100110 11101110 00010001 Check Value (ACCM = 1): SHIFTM = 0: 0x32D6 CRCACCH = 0b00110010 CRCACCL = 0b11010110 CRC Module Overview The CRC module provides a means for calculating a check value of program memory. The CRC module is coupled with a memory scanner for faster CRC calculations. The memory scanner can automatically provide data to the CRC module. The CRC module can also be operated by directly writing data to SFRs, without using the scanner. 11.2 SHIFTM = 1: 0x6BA2 CRCACCH = 0b01101011 CRCACCL = 0b10100010 Note 1: Bit 0 is unimplemented. The LSb of any CRC polynomial is always ‘1’ and will always be treated as a ‘1’ by the CRC for calculating the CRC check value. This bit will be read in software as a ‘0’. CRC Functional Overview The CRC module can be used to detect bit errors in the Flash memory using the built-in memory scanner or through user input RAM. The CRC module can accept up to a 16-bit polynomial with up to a 16-bit seed value. A CRC calculated check value (or checksum) will then be generated into the CRCACC<15:0> registers for user storage. The CRC module uses an XOR shift register implementation to perform the polynomial division required for the CRC calculation. EXAMPLE 11-2: (1) 11.3 CRC Polynomial Implementation Any standard polynomial up to 17 bits can be used. The PLEN<3:0> bits are used to specify how long the polynomial used will be. For an xn polynomial, PLEN = n-2. In an n-bit polynomial the xn bit and the LSb will be used as a ‘1’ in the CRC calculation because the MSb and LSb must always be a ‘1’ for a CRC polynomial. For example, if using CRC-16-ANSI, the polynomial will look like 0x8005. This will be implemented into the CRCXOR<15:1> registers, as shown in Example 11-1. CRC LFSR EXAMPLE Rev. 10-000207A 5/27/2014 Linear Feedback Shift Register for CRC-16-ANSI x16 + x15 + x2 + 1 Data in Augmentation Mode ON b15 b14 b13 b12 b11 b10 b9 b8 b7 b6 b5 b4 b3 b2 b1 Data in Augmentation Mode OFF b15 b14 b13 b12 b11 2014-2016 Microchip Technology Inc. b10 b9 b8 b7 b6 b0 b5 b4 b3 b2 b1 b0 DS40001737B-page 119 PIC12(L)F1612/16(L)F1613 11.4 CRC Data Sources Data can be input to the CRC module in two ways: - User data using the CRCDAT registers - Flash using the Program Memory Scanner To set the number of bits of data, up to 16 bits, the DLEN bits of CRCCON1 must be set accordingly. Only data bits in CRCDATA registers up to DLEN will be used, other data bits in CRCDATA registers will be ignored. 11.6 CRC Interrupt The CRC will generate an interrupt when the BUSY bit transitions from 1 to 0. The CRCIF interrupt flag bit of the PIR4 register is set every time the BUSY bit transitions, regardless of whether or not the CRC interrupt is enabled. The CRCIF bit can only be cleared in software. The CRC interrupt enable is the CRCIE bit of the PIE4 register. Data is moved into the CRCSHIFT as an intermediate to calculate the check value located in the CRCACC registers. The SHIFTM bit is used to determine the bit order of the data being shifted into the accumulator. If SHIFTM is not set, the data will be shifted in MSb first. The value of DLEN will determine the MSb. If SHIFTM bit is set, the data will be shifted into the accumulator in reversed order, LSb first. The CRC module can be seeded with an initial value by setting the CRCACC<15:0> registers to the appropriate value before beginning the CRC. 11.4.1 CRC FROM USER DATA To use the CRC module on data input from the user, the user must write the data to the CRCDAT registers. The data from the CRCDAT registers will be latched into the shift registers on any write to the CRCDATL register. 11.4.2 CRC FROM FLASH To use the CRC module on data located in Flash memory, the user can initialize the Program Memory Scanner as defined in Section 11.8, Program Memory Scan Configuration. 11.5 CRC Check Value The CRC check value will be located in the CRCACC registers after the CRC calculation has finished. The check value will depend on two mode settings of the CRCCON: ACCM and SHIFTM. If the ACCM bit is set, the CRC module will augment the data with a number of zeros equal to the length of the polynomial to find the final check value. If the ACCM bit is not set, the CRC will stop at the end of the data. A number of zeros equal to the length of the polynomial can then be entered to find the same check value as augmented mode, alternatively the expected check value can be entered at this point to make the final result equal 0. A final XOR value may be needed with the check value to find the desired CRC result 2014-2016 Microchip Technology Inc. DS40001737B-page 120 PIC12(L)F1612/16(L)F1613 11.7 Configuring the CRC The following steps illustrate how to properly configure the CRC. 1. Determine if the automatic Program Memory scan will be used with the Scanner or manual calculation through the SFR interface and perform the actions specified in Section11.4 “CRC Data Sources”, depending on which decision was made. 2. If desired, seed a starting CRC value into the CRCACCH/L registers. 3. Program the CRCXORH/L registers with the desired generator polynomial. 4. Program the DLEN<3:0> bits of the CRCCON1 register with the length of the data word - 1 (refer to Example 11-1). This determines how many times the shifter will shift into the accumulator for each data word. 5. Program the PLEN<3:0> bits of the CRCCON1 register with the length of the polynomial - 2 (refer to Example 11-1). 6. Determine whether shifting in trailing zeros is desired and set the ACCM bit of CRCCON0 register appropriately. 7. Likewise, determine whether the MSb or LSb should be shifted first and write the SHIFTM bit of CRCCON0 register appropriately. 8. Write the CRCGO bit of the CRCCON0 register to begin the shifting process. 9a. If manual SFR entry is used, monitor the FULL bit of CRCCON0 register. When FULL = 0, another word of data can be written to the CRCDATH/L registers, keeping in mind that CRCDATH should be written first if the data has >8 bits, as the shifter will begin upon the CRCDATL register being written. 9b. If the scanner is used, the scanner will automatically stuff words into the CRCDATH/L registers as needed, as long as the SCANGO bit is set. 10a.If using the Flash memory scanner, monitor the SCANIF (or the SCANGO bit) for the scanner to finish pushing information into the CRCDATA registers. After the scanner is completed, monitor the CRCIF (or the BUSY bit) to determine that the CRC has been completed and the check value can be read from the CRCACC registers. If both the interrupt flags are set (or both BUSY and SCANGO bits are cleared), the completed CRC calculation can be read from the CRCACCH/L registers. 10b.If manual entry is used, monitor the CRCIF (or BUSY bit) to determine when the CRCACC registers will hold the check value. 2014-2016 Microchip Technology Inc. 11.8 Program Memory Scan Configuration If desired, the Program Memory Scan module may be used in conjunction with the CRC module to perform a CRC calculation over a range of program memory addresses. In order to set up the Scanner to work with the CRC you need to perform the following steps: 1. 2. 3. 4. 5. Set the EN bit to enable the module. This can be performed at any point preceding the setting of the SCANGO bit, but if it gets disabled, all internal states of the Scanner are reset (registers are unaffected). Choose which memory access mode is to be used (see Section11.10 “Scanning Modes”) and set the MODE bits of the SCANCON0 register appropriately. Based on the memory access mode, set the INTM bits of the SCANCON0 register to the appropriate interrupt mode (see Section11.10.5 “Interrupt Interaction”) Set the SCANLADRL/H and SCANHADRL/H registers with the beginning and ending locations in memory that are to be scanned. Begin the scan by setting the SCANGO bit in the SCANCON0 register. The scanner will wait (CRCGO must be set) for the signal from the CRC that it is ready for the first Flash memory location, then begin loading data into the CRC. It will continue to do so until it either hits the configured end address or an address that is unimplemented on the device, at which point the SCANGO bit will clear, Scanner functions will cease, and the SCANIF interrupt will be triggered. Alternately, the SCANGO bit can be cleared in software if desired. 11.9 Scanner Interrupt The scanner will trigger an interrupt when the SCANGO bit transitions from 1 to 0. The SCANIF interrupt flag of PIR4 is set when the last memory location is reached and the data is entered into the CRCDATA registers. The SCANIF bit can only be cleared in software. The SCAN interrupt enable is the SCANIE bit of the PIE4 register. 11.10 Scanning Modes The memory scanner can scan in four modes: Burst, Peek, Concurrent, and Triggered. These modes are controlled by the MODE bits of the SCANCON0 register. The four modes are summarized in Table 11-1. 11.10.1 BURST MODE When MODE = 01, the scanner is in Burst mode. In Burst mode, CPU operation is stalled beginning with the operation after the one that sets the SCANGO bit, and the scan begins, using the instruction clock to execute. DS40001737B-page 121 PIC12(L)F1612/16(L)F1613 The CPU is held until the scan stops. Note that because the CPU is not executing instructions, the SCANGO bit cannot be cleared in software, so the CPU will remain stalled until one of the hardware end-conditions occurs. Burst mode has the highest throughput for the scanner, but has the cost of stalling other execution while it occurs. 11.10.2 CONCURRENT MODE When MODE = 00, the scanner is in Concurrent mode. Concurrent mode, like Burst mode, stalls the CPU while performing accesses of memory. However, while Burst mode stalls until all accesses are complete, Concurrent mode allows the CPU to execute in between access cycles. 11.10.3 ately upon the SCANGO bit being set, it waits for a rising edge from a separate trigger clock, the source of which is determined by the SCANTRIG register. 11.10.4 PEEK MODE When MODE = 10, the scanner is in Peek mode. Peek mode waits for an instruction cycle in which the CPU does not need to access the NVM (such as a branch instruction) and uses that cycle to do its own NVM access. This results in the lowest throughput for the NVM access (and can take a much longer time to complete a scan than the other modes), but does so without any impact on execution times, unlike the other modes. TRIGGERED MODE When MODE = 11, the scanner is in Triggered mode. Triggered mode behaves identically to Concurrent mode, except instead of beginning the scan immedi- TABLE 11-1: SUMMARY OF SCANNER MODES Description MODE<1:0> First Scan Access CPU Operation 11 Triggered As soon as possible following a trigger Stalled during NVM access CPU resumes execution following each access 10 Peek At the first dead cycle Timing is unaffected CPU continues execution following each access 01 Burst 00 Concurrent As soon as possible 11.10.5 Stalled during NVM access CPU suspended until scan completes CPU resumes execution following each access INTERRUPT INTERACTION The INTM bit of the SCANCON0 register controls the scanner’s response to interrupts depending on which mode the NVM scanner is in, as described in Table 112. TABLE 11-2: SCAN INTERRUPT MODES MODE<1:0> INTM MODE == Burst MODE != Burst 1 Interrupt overrides SCANGO to pause the burst Scanner suspended during interrupt response; and the interrupt handler executes at full speed; interrupt executes at full speed and scan Scanner Burst resumes when interrupt resumes when the interrupt is complete. completes. 0 Interrupts do not override SCANGO, and the scan (burst) operation will continue; interrupt response will be delayed until scan completes (latency will be increased). In general, if INTM = 0, the scanner will take precedence over the interrupt, resulting in decreased interrupt processing speed and/or increased interrupt 2014-2016 Microchip Technology Inc. Scanner accesses NVM during interrupt response. If MODE != Peak the interrupt handler execution speed will be affected. response latency. If INTM = 1, the interrupt will take precedence and have a better speed, delaying the memory scan. DS40001737B-page 122 PIC12(L)F1612/16(L)F1613 11.10.6 WDT INTERACTION 11.10.7 Operation of the WDT is not affected by scanner activity. Hence, it is possible that long scans, particularly in Burst mode, may exceed the WDT time-out period and result in an undesired device Reset. This should be considered when performing memory scans with an application that also utilizes WDT. IN-CIRCUIT DEBUG (ICD) INTERACTION The scanner freezes when an ICD halt occurs, and remains frozen until user-mode operation resumes. The debugger may inspect the SCANCON0 and SCANLADR registers to determine the state of the scan. The ICD interaction with each operating mode is summarized in Table 11-3. TABLE 11-3: ICD AND SCANNER INTERACTIONS Scanner Operating Mode ICD Halt Peek Concurrent Triggered If external halt is asserted during a scan cycle, the instruction (delayed by scan) may or may not execute before ICD entry, depending on external halt timing. External Halt Burst If external halt is asserted during the BSF(SCANCON.GO), ICD entry occurs, and the burst is delayed until ICD exit. Otherwise, the current NVM-access cycle will complete, and then the scanner will be interrupted for ICD entry. If external halt is asserted during the If external halt is asserted during the cycle immediately prior to the scan burst, the burst is suspended and will cycle, both scan and instruction resume with ICD exit. execution happen after the ICD exits. PC Breakpoint If Scanner would peek an instruction that is not executed (because of ICD entry), the peek will occur after ICD exit, when the instruction executes. Scan cycle occurs before ICD entry and instruction execution happens after the ICD exits. Data Breakpoint The instruction with the dataBP executes and ICD entry occurs immediately after. If scan is requested during that cycle, the scan cycle is postponed until the ICD exits. Single Step If a scan cycle is ready after the debug instruction is executed, the scan will read PFM and then the ICD is re-entered. SWBP and ICDINST 2014-2016 Microchip Technology Inc. If scan would stall a SWBP, the scan cycle occurs and the ICD is entered. If PCPB (or single step) is on BSF(SCANCON.GO), the ICD is entered before execution; execution of the burst will occur at ICD exit, and the burst will run to completion. Note that the burst can be interrupted by an external halt. If SWBP replaces BSF(SCANCON.GO), the ICD will be entered; instruction execution will occur at ICD exit (from ICDINSTR register), and the burst will run to completion. DS40001737B-page 123 PIC12(L)F1612/16(L)F1613 11.11 Register Definitions: CRC and Scanner Control REGISTER 11-1: CRCCON0: CRC CONTROL REGISTER 0 R/W-0/0 R/W-0/0 R-0 R/W-0/0 U-0 U-0 R/W-0/0 R-0 EN CRCGO BUSY ACCM — — SHIFTM FULL bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7 EN: CRC Enable bit 1 = CRC module is released from Reset 0 = CRC is disabled and consumes no operating current bit 6 CRCGO: CRC Start bit 1 = Start CRC serial shifter 0 = CRC serial shifter turned off bit 5 BUSY: CRC Busy bit 1 = Shifting in progress or pending 0 = All valid bits in shifter have been shifted into accumulator and EMPTY = 1 bit 4 ACCM: Accumulator Mode bit 1 = Data is augmented with zeros 0 = Data is not augmented with zeros bit 3-2 Unimplemented: Read as ‘0’ bit 1 SHIFTM: Shift Mode bit 1 = Shift right (LSb) 0 = Shift left (MSb) bit 0 FULL: Data Path Full Indicator bit 1 = CRCDATH/L registers are full 0 = CRCDATH/L registers have shifted their data into the shifter REGISTER 11-2: R/W-0/0 CRCCON1: CRC CONTROL REGISTER 1 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 DLEN<3:0> R/W-0/0 R/W-0/0 R/W-0/0 PLEN<3:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-4 DLEN<3:0>: Data Length bits Denotes the length of the data word -1 (See Example 11-1) bit 3-0 PLEN<3:0>: Polynomial Length bits Denotes the length of the polynomial -1 (See Example 11-1) 2014-2016 Microchip Technology Inc. DS40001737B-page 124 PIC12(L)F1612/16(L)F1613 REGISTER 11-3: R/W-x/x CRCDATH: CRC DATA HIGH BYTE REGISTER R/W-x/x R/W-x/x R/W-x/x R/W-x/x R/W-x/x R/W-x/x R/W-x/x DAT<15:8> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-0 DAT<15:8>: CRC Input/Output Data bits REGISTER 11-4: R/W-x/x CRCDATL: CRC DATA LOW BYTE REGISTER R/W-x/x R/W-x/x R/W-x/x R/W-x/x R/W-x/x R/W-x/x R/W-x/x DAT<7:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-0 DAT<7:0>: CRC Input/Output Data bits Writing to this register fills the shifter. REGISTER 11-5: R/W-0/0 CRCACCH: CRC ACCUMULATOR HIGH BYTE REGISTER R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 ACC<15:8> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-0 ACC<15:8>: CRC Accumulator Register bits Writing to this register writes to the CRC accumulator register. Reading from this register reads the CRC accumulator. REGISTER 11-6: R/W-0/0 CRCACCL: CRC ACCUMULATOR LOW BYTE REGISTER R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 ACC<7:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-0 ACC<7:0>: CRC Accumulator Register bits Writing to this register writes to the CRC accumulator register through the CRC write bus. Reading from this register reads the CRC accumulator. 2014-2016 Microchip Technology Inc. DS40001737B-page 125 PIC12(L)F1612/16(L)F1613 REGISTER 11-7: R-0 CRCSHIFTH: CRC SHIFT HIGH BYTE REGISTER R-0 R-0 R-0 R-0 R-0 R-0 R-0 SHIFT<15:8> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-0 SHIFT<15:8>: CRC Shifter Register bits Reading from this register reads the CRC Shifter. REGISTER 11-8: R-0 CRCSHIFTL: CRC SHIFT LOW BYTE REGISTER R-0 R-0 R-0 R-0 R-0 R-0 R-0 SHIFT<7:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-0 SHIFT<7:0>: CRC Shifter Register bits Reading from this register reads the CRC Shifter. REGISTER 11-9: R/W CRCXORH: CRC XOR HIGH BYTE REGISTER R/W R/W R/W R/W R/W R/W R/W XOR<15:8> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-0 XOR<15:8>: XOR of Polynomial Term XN Enable bits REGISTER 11-10: CRCXORL: CRC XOR LOW BYTE REGISTER R/W-x/x R/W-x/x R/W-x/x R/W-x/x R/W-x/x R/W-x/x R/W-x/x U-0 — XOR<7:1> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-1 XOR<7:1>: XOR of Polynomial Term XN Enable bits bit 0 Unimplemented: Read as ‘0’ 2014-2016 Microchip Technology Inc. DS40001737B-page 126 PIC12(L)F1612/16(L)F1613 REGISTER 11-11: SCANCON0: SCANNER ACCESS CONTROL REGISTER 0 R/W-0/0 R/W/HC-0/0 R-0 R-0 R/W-0/0 U-0 EN(1) SCANGO(2, 3) BUSY(4) INVALID INTM — R/W-0/0 bit 7 R/W-0/0 MODE<1:0>(5) bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared HC = Bit is cleared by hardware bit 7 EN: Scanner Enable bit(1) 1 = Scanner is enabled 0 = Scanner is disabled, internal states are reset bit 6 SCANGO: Scanner GO bit(2, 3) 1 = When the CRC sends a ready signal, NVM will be accessed according to MDx and data passed to the client peripheral. 0 = Scanner operations will not occur bit 5 BUSY: Scanner Busy Indicator bit(4) 1 = Scanner cycle is in process 0 = Scanner cycle is complete (or never started) bit 4 INVALID: Scanner Abort signal bit 1 = SCANLADRL/H has incremented or contains an invalid address(6) 0 = SCANLADRL/H points to a valid address bit 3 INTM: NVM Scanner Interrupt Management Mode Select bit If MODE = 10: This bit is ignored If MODE = 01 (CPU is stalled until all data is transferred): 1 = SCANGO is overridden (to zero) during interrupt operation; scanner resumes after returning from interrupt 0 = SCANGO is not affected by interrupts, the interrupt response will be affected If MODE = 00 or 11: 1 = SCANGO is overridden (to zero) during interrupt operation; scan operations resume after returning from interrupt 0 = Interrupts do not prevent NVM access bit 2 Unimplemented: Read as ‘0’ bit 1-0 MODE<1:0>: Memory Access Mode bits(5) 11 = Triggered mode 10 = Peek mode 01 = Burst mode 00 = Concurrent mode Note 1: 2: 3: 4: 5: 6: Setting EN = 0 (SCANCON0 register) does not affect any other register content. This bit is cleared when LADR > HADR (and a data cycle is not occurring). If INTM = 1, this bit is overridden (to zero, but not cleared) during an interrupt response. BUSY = 1 when the NVM is being accessed, or when the CRC sends a ready signal. See Table 11-1 for more detailed information. An invalid address happens when the entire range of the PFM is scanned and completed, i.e., device memory is 0x4000 and SCANHADR = 0x3FFF, after the last scan SCANLADR increments to 0x4000, the address is invalid. 2014-2016 Microchip Technology Inc. DS40001737B-page 127 PIC12(L)F1612/16(L)F1613 REGISTER 11-12: SCANLADRH: SCAN LOW ADDRESS HIGH BYTE REGISTER R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 LADR<15:8>(1, 2) bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared LADR<15:8>: Scan Start/Current Address bits(1, 2) Most Significant bits of the current address to be fetched from, value increments on each fetch of memory. bit 7-0 Note 1: 2: Registers SCANLADRH/L form a 16-bit value, but are not guarded for atomic or asynchronous access; registers should only be read or written while SCANGO = 0 (SCANCON0 register). While SCANGO = 1 (SCANCON0 register), writing to this register is ignored. REGISTER 11-13: SCANLADRL: SCAN LOW ADDRESS LOW BYTE REGISTER R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 LADR<7:0>(1, 2) bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared LADR<7:0>: Scan Start/Current Address bits(1, 2) Least Significant bits of the current address to be fetched from, value increments on each fetch of memory bit 7-0 Note 1: 2: Registers SCANLADRH/L form a 16-bit value, but are not guarded for atomic or asynchronous access; registers should only be read or written while SCANGO = 0 (SCANCON0 register). While SCANGO = 1 (SCANCON0 register), writing to this register is ignored. 2014-2016 Microchip Technology Inc. DS40001737B-page 128 PIC12(L)F1612/16(L)F1613 REGISTER 11-14: SCANHADRH: SCAN HIGH ADDRESS HIGH BYTE REGISTER R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 HADR<15:8>(1, 2) bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared HADR<15:8>: Scan End Address bits(1, 2) Most Significant bits of the address at the end of the designated scan bit 7-0 Note 1: 2: Registers SCANHADRH/L form a 16-bit value, but are not guarded for atomic or asynchronous access; registers should only be read or written while SCANGO = 0 (SCANCON0 register). While SCANGO = 1 (SCANCON0 register), writing to this register is ignored. REGISTER 11-15: SCANHADRL: SCAN HIGH ADDRESS LOW BYTE REGISTER R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 HADR<7:0> R/W-0/0 R/W-0/0 R/W-0/0 (1, 2) bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared HADR<7:0>: Scan End Address bits(1, 2) Least Significant bits of the address at the end of the designated scan bit 7-0 Note 1: 2: Registers SCANHADRH/L form a 16-bit value, but are not guarded for atomic or asynchronous access; registers should only be read or written while SCANGO = 0 (SCANCON0 register). While SCANGO = 1 (SCANCON0 register), writing to this register is ignored. 2014-2016 Microchip Technology Inc. DS40001737B-page 129 PIC12(L)F1612/16(L)F1613 REGISTER 11-16: SCANTRIG: SCAN TRIGGER SELECTION REGISTER U-0 U-0 U-0 U-0 — — — — U-0 U-0 R/W-0/0 R/W-0/0 TSEL<3:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-4 Unimplemented: Read as ‘0’ bit 3-0 TSEL<3:0>: Scanner Data Trigger Input Selection bits 1111-1010 = Reserved 1001 = SMT2_Match 1000 = SMT1_Match 0111 = TMR0_Overflow 0110 = TMR5_Overflow 0101 = TMR3_Overflow 0100 = TMR1_Overflow 0011 = TMR6_postscaled 0010 = TMR4_postscaled 0001 = TMR2_postscaled 0000 = LFINTOSC TABLE 11-4: Name SUMMARY OF REGISTERS ASSOCIATED WITH CRC Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register on Page CRCACCH ACC<15:8> 125 CRCACCL ACC<7:0> 125 CRCCON0 EN CRCGO CRCCON1 BUSY ACCM — — DLEN<3:0> SHIFTM FULL PLEN<3:0> 124 124 CRCDATH DAT<15:8> 125 CRCDATL DAT<7:0> 125 CRCSHIFTH SHIFT<15:8> 126 CRCSHIFTL SHIFT<7:0> 126 CRCXORH XOR<15:8> CRCXORL 126 XOR<7:1> INTCON GIE PEIE TMR0IE INTE IOCIE IOCIF 82 SCANIF CRCIF SMT2PWAIF SMT2PRAIF SMT2IF SMT1PWAIF SMT1PRAIF SMT1IF 90 PIE4 SCANIE CRCIE SMT2PWAIE SMT2PRAIE SMT2IE SMT1PWAIE SMT1PRAIE SMT1IE EN SCANGO BUSY INVALID INTM INTF 126 PIR4 SCANCON0 TMR0IF — — MODE<1:0> 86 127 SCANHADRH HADR<15:8> 129 SCANHADRL HADR<7:0> 129 SCANLADRH LADR<15:8> 128 SCANLADRL LADR<7:0> 128 TSEL<3:0> SCANTRIG Legend: * 130 — = unimplemented location, read as ‘0’. Shaded cells are not used for the CRC module. Page provides register information. 2014-2016 Microchip Technology Inc. DS40001737B-page 130 PIC12(L)F1612/16(L)F1613 12.0 I/O PORTS FIGURE 12-1: GENERIC I/O PORT OPERATION Each port has six standard registers for its operation. These registers are: • TRISx registers (data direction) • PORTx registers (reads the levels on the pins of the device) • LATx registers (output latch) • INLVLx (input level control) • ODCONx registers (open-drain) • SLRCONx registers (slew rate) Rev. 10-000052A 7/30/2013 Read LATx TRISx D Q Write LATx Write PORTx VDD CK Some ports may have one or more of the following additional registers. These registers are: Data Register Data bus • ANSELx (analog select) • WPUx (weak pull-up) I/O pin Read PORTx In general, when a peripheral is enabled on a port pin, that pin cannot be used as a general purpose output. However, the pin can still be read. To digital peripherals ANSELx To analog peripherals Device PORTC PORT AVAILABILITY PER DEVICE PORTA TABLE 12-1: PIC16(L)F1613 ● ● PIC12(L)F1612 ● VSS The Data Latch (LATx registers) is useful for readmodify-write operations on the value that the I/O pins are driving. A write operation to the LATx register has the same effect as a write to the corresponding PORTx register. A read of the LATx register reads of the values held in the I/O PORT latches, while a read of the PORTx register reads the actual I/O pin value. Ports that support analog inputs have an associated ANSELx register. When an ANSEL bit is set, the digital input buffer associated with that bit is disabled. Disabling the input buffer prevents analog signal levels on the pin between a logic high and low from causing excessive current in the logic input circuitry. A simplified model of a generic I/O port, without the interfaces to other peripherals, is shown in Figure 12-1. 2014-2016 Microchip Technology Inc. DS40001737B-page 131 PIC12(L)F1612/16(L)F1613 12.1 Alternate Pin Function The Alternate Pin Function Control (APFCON) register is used to steer specific peripheral input and output functions between different pins. The APFCON register is shown in Register 12-1. For this device family, the following functions can be moved between different pins. • • • • • These bits have no effect on the values of any TRIS register. PORT and TRIS overrides will be routed to the correct pin. The unselected pin will be unaffected. CWGA CWGB T1G CCP1 CCP2 12.2 Register Definitions: Alternate Pin Function Control REGISTER 12-1: APFCON: ALTERNATE PIN FUNCTION CONTROL REGISTER U-0 R/W-0/0 R/W-0/0 — CWGASEL(1) CWGBSEL(1) U-0 — R/W-0/0 T1GSEL U-0 R/W-0/0 R/W-0/0 — CCP2SEL(2) CCP1SEL(1) bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7 Unimplemented: Read as ‘0’ bit 6 CWGASEL: Pin Selection bit(1) 1 = CWGA function is on RA5 0 = CWGA function is on RA2 bit 5 CWGBSEL: Pin Selection bit(1) 1 = CWGB function is on RA4 0 = CWGB function is on RA0 bit 4 Unimplemented: Read as ‘0’ bit 3 T1GSEL: Pin Selection bit 1 = T1G function is on RA3 0 = T1G function is on RA4 bit 2 Unimplemented: Read as ‘0’ bit 1 CCP2SEL: Pin Selection bit(2) 1 = CCP2 function is on RA5 0 = CCP2 function is on RC3 bit 0 CCP1SEL: Pin Selection bit(1) 1 = CCP1 function is on RA5 0 = CCP1 function is on RA2 Note 1: 2: PIC12(L)F1612 only. PIC16(L)F1613 only. 2014-2016 Microchip Technology Inc. DS40001737B-page 132 PIC12(L)F1612/16(L)F1613 12.3 12.3.1 PORTA Registers DATA REGISTER PORTA is a 6-bit wide, bidirectional port. The corresponding data direction register is TRISA (Register 12-3). Setting a TRISA bit (= 1) will make the corresponding PORTA pin an input (i.e., disable the output driver). Clearing a TRISA bit (= 0) will make the corresponding PORTA pin an output (i.e., enables output driver and puts the contents of the output latch on the selected pin). The exception is RA3, which is input-only and its TRIS bit will always read as ‘1’. Example 12-1 shows how to initialize an I/O port. Reading the PORTA register (Register 12-2) reads the status of the pins, whereas writing to it will write to the PORT latch. All write operations are read-modify-write operations. Therefore, a write to a port implies that the port pins are read, this value is modified and then written to the PORT data latch (LATA). 12.3.2 DIRECTION CONTROL The TRISA register (Register 12-3) controls the PORTA pin output drivers, even when they are being used as analog inputs. The user should ensure the bits in the TRISA register are maintained set when using them as analog inputs. I/O pins configured as analog input always read ‘0’. 12.3.3 OPEN-DRAIN CONTROL The ODCONA register (Register 12-7) controls the open-drain feature of the port. Open-drain operation is independently selected for each pin. When an ODCONA bit is set, the corresponding port output becomes an open-drain driver capable of sinking current only. When an ODCONA bit is cleared, the corresponding port output pin is the standard push-pull drive capable of sourcing and sinking current. 12.3.4 SLEW RATE CONTROL The SLRCONA register (Register 12-8) controls the slew rate option for each port pin. Slew rate control is independently selectable for each port pin. When an SLRCONA bit is set, the corresponding port pin drive is slew rate limited. When an SLRCONA bit is cleared, The corresponding port pin drive slews at the maximum rate possible. 2014-2016 Microchip Technology Inc. 12.3.5 INPUT THRESHOLD CONTROL The INLVLA register (Register 12-9) controls the input voltage threshold for each of the available PORTA input pins. A selection between the Schmitt Trigger CMOS or the TTL Compatible thresholds is available. The input threshold is important in determining the value of a read of the PORTA register and also the level at which an interrupt-on-change occurs, if that feature is enabled. See 28.3 “DC Characteristics” for more information on threshold levels. Note: 12.3.6 Changing the input threshold selection should be performed while all peripheral modules are disabled. Changing the threshold level during the time a module is active may inadvertently generate a transition associated with an input pin, regardless of the actual voltage level on that pin. ANALOG CONTROL The ANSELA register (Register 12-5) is used to configure the Input mode of an I/O pin to analog. Setting the appropriate ANSELA bit high will cause all digital reads on the pin to be read as ‘0’ and allow analog functions on the pin to operate correctly. The state of the ANSELA bits has no effect on digital output functions. A pin with TRIS clear and ANSEL set will still operate as a digital output, but the Input mode will be analog. This can cause unexpected behavior when executing read-modify-write instructions on the affected port. Note: The ANSELA bits default to the Analog mode after Reset. To use any pins as digital general purpose or peripheral inputs, the corresponding ANSEL bits must be initialized to ‘0’ by user software. EXAMPLE 12-1: BANKSEL CLRF BANKSEL CLRF BANKSEL CLRF BANKSEL MOVLW MOVWF INITIALIZING PORTA PORTA ; PORTA ;Init PORTA LATA ;Data Latch LATA ; ANSELA ; ANSELA ;digital I/O TRISA ; B'00111000' ;Set RA<5:3> as inputs TRISA ;and set RA<2:0> as ;outputs DS40001737B-page 133 PIC12(L)F1612/16(L)F1613 12.3.7 PORTA FUNCTIONS AND OUTPUT PRIORITIES Each PORTA pin is multiplexed with other functions. The pins, their combined functions and their output priorities are shown in Table 12-2. When multiple outputs are enabled, the actual pin control goes to the peripheral with the highest priority. Analog input functions, such as ADC and comparator inputs, are not shown in the priority lists. These inputs are active when the I/O pin is set for Analog mode using the ANSELx registers. Digital output functions may control the pin when it is in Analog mode with the priority shown below in Table 12-2. TABLE 12-2: PORTA OUTPUT PRIORITY (PIC12(L)F1612 ONLY) Function Priority(1) Pin Name RA0 DAC1OUT1 CWG1B(2) CCP2 RA0 RA1 ZCD1OUT RA1 RA2 CWG1A(2) C1OUT CCP1 RA2(2) RA3 RA3 RA4 CLKOUT CWG1B(3) RA4 RA5 CWG1A(3) CCP1(3) RA5 Note 1: 2: 3: Priority listed from highest to lowest. Default pin (see APFCON register). Alternate pin (see APFCON register). TABLE 12-3: PORTA OUTPUT PRIORITY (PIC16(L)F1613 ONLY) Function Priority(1) Pin Name RA0 DAC1OUT1 RA0 RA1 ZCD1OUT RA1 RA2 C1OUT RA2(2) RA3 RA3 RA4 CLKOUT RA4 RA5 CCP2(3) RA5 Note 1: 2: 3: 2014-2016 Microchip Technology Inc. Priority listed from highest to lowest. Default pin (see APFCON register). Alternate pin (see APFCON register). DS40001737B-page 134 PIC12(L)F1612/16(L)F1613 12.4 Register Definitions: PORTA REGISTER 12-2: PORTA: PORTA REGISTER U-0 U-0 R/W-x/x R/W-x/x R-x/x R/W-x/x R/W-x/x R/W-x/x — — RA5 RA4 RA3 RA2 RA1 RA0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-6 Unimplemented: Read as ‘0’ bit 5-0 RA<5:0>: PORTA I/O Value bits(1) 1 = Port pin is > VIH 0 = Port pin is < VIL Note 1: Writes to PORTA are actually written to corresponding LATA register. Reads from PORTA register is return of actual I/O pin values. REGISTER 12-3: U-0 TRISA: PORTA TRI-STATE REGISTER U-0 — — R/W-1/1 TRISA5 R/W-1/1 U-1 R/W-1/1 R/W-1/1 R/W-1/1 TRISA4 —(1) TRISA2 TRISA1 TRISA0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-6 Unimplemented: Read as ‘0’ bit 5-4 TRISA<5:4>: PORTA Tri-State Control bit 1 = PORTA pin configured as an input (tri-stated) 0 = PORTA pin configured as an output bit 3 Unimplemented: Read as ‘1’ bit 2-0 TRISA<2:0>: PORTA Tri-State Control bit 1 = PORTA pin configured as an input (tri-stated) 0 = PORTA pin configured as an output Note 1: Unimplemented, read as ‘1’. 2014-2016 Microchip Technology Inc. DS40001737B-page 135 PIC12(L)F1612/16(L)F1613 REGISTER 12-4: LATA: PORTA DATA LATCH REGISTER U-0 U-0 R/W-x/u R/W-x/u U-0 R/W-x/u R/W-x/u R/W-x/u — — LATA5 LATA4 — LATA2 LATA1 LATA0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-6 Unimplemented: Read as ‘0’ bit 5-4 LATA<5:4>: RA<5:4> Output Latch Value bits(1) bit 3 Unimplemented: Read as ‘0’ bit 2-0 LATA<2:0>: RA<2:0> Output Latch Value bits(1) Note 1: Writes to PORTA are actually written to corresponding LATA register. Reads from PORTA register is return of actual I/O pin values. REGISTER 12-5: ANSELA: PORTA ANALOG SELECT REGISTER U-0 U-0 U-0 R/W-1/1 U-0 R/W-1/1 R/W-1/1 R/W-1/1 — — — ANSA4 — ANSA2 ANSA1 ANSA0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-5 Unimplemented: Read as ‘0’ bit 4 ANSA4: Analog Select between Analog or Digital Function on Pins RA4, respectively 1 = Analog input. Pin is assigned as analog input(1). Digital input buffer disabled. 0 = Digital I/O. Pin is assigned to port or digital special function. bit 3 Unimplemented: Read as ‘0’ bit 2-0 ANSA<2:0>: Analog Select between Analog or Digital Function on Pins RA<2:0>, respectively 1 = Analog input. Pin is assigned as analog input(1). Digital input buffer disabled. 0 = Digital I/O. Pin is assigned to port or digital special function. Note 1: When setting a pin to an analog input, the corresponding TRIS bit must be set to Input mode in order to allow external control of the voltage on the pin. 2014-2016 Microchip Technology Inc. DS40001737B-page 136 PIC12(L)F1612/16(L)F1613 REGISTER 12-6: WPUA: WEAK PULL-UP PORTA REGISTER U-0 U-0 R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 — — WPUA5 WPUA4 WPUA3 WPUA2 WPUA1 WPUA0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-6 Unimplemented: Read as ‘0’ bit 5-0 WPUA<5:0>: Weak Pull-up Register bits(3) 1 = Pull-up enabled 0 = Pull-up disabled Note 1: 2: 3: Global WPUEN bit of the OPTION_REG register must be cleared for individual pull-ups to be enabled. The weak pull-up device is automatically disabled if the pin is configured as an output. For the WPUA3 bit, when MCLRE = 1, weak pull-up is internally enabled, but not reported here. REGISTER 12-7: ODCONA: PORTA OPEN-DRAIN CONTROL REGISTER U-0 U-0 R/W-0/0 R/W-0/0 U-0 R/W-0/0 R/W-0/0 R/W-0/0 — — ODA5 ODA4 — ODA2 ODA1 ODA0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-6 Unimplemented: Read as ‘0’ bit 5-4 ODA<5:4>: PORTA Open-Drain Enable bits For RA<5:4> pins, respectively 1 = Port pin operates as open-drain drive (sink current only) 0 = Port pin operates as standard push-pull drive (source and sink current) bit 3 Unimplemented: Read as ‘0’ bit 2-0 ODA<2:0>: PORTA Open-Drain Enable bits For RA<2:0> pins, respectively 1 = Port pin operates as open-drain drive (sink current only) 0 = Port pin operates as standard push-pull drive (source and sink current) 2014-2016 Microchip Technology Inc. DS40001737B-page 137 PIC12(L)F1612/16(L)F1613 REGISTER 12-8: SLRCONA: PORTA SLEW RATE CONTROL REGISTER U-0 U-0 R/W-1/1 R/W-1/1 U-0 R/W-1/1 R/W-1/1 R/W-1/1 — — SLRA5 SLRA4 — SLRA2 SLRA1 SLRA0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-6 Unimplemented: Read as ‘0’ bit 5-4 SLRA<5:4>: PORTA Slew Rate Enable bits For RA<5:4> pins, respectively 1 = Port pin slew rate is limited 0 = Port pin slews at maximum rate bit 3 Unimplemented: Read as ‘0’ bit 2-0 SLRA<2:0>: PORTA Slew Rate Enable bits For RA<2:0> pins, respectively 1 = Port pin slew rate is limited 0 = Port pin slews at maximum rate REGISTER 12-9: INLVLA: PORTA INPUT LEVEL CONTROL REGISTER U-0 U-0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 — — INLVLA5 INLVLA4 INLVLA3 INLVLA2 INLVLA1 INLVLA0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-6 Unimplemented: Read as ‘0’ bit 5-0 INLVLA<5:0>: PORTA Input Level Select bits For RA<5:0> pins, respectively 1 = ST input used for PORT reads and interrupt-on-change 0 = TTL input used for PORT reads and interrupt-on-change 2014-2016 Microchip Technology Inc. DS40001737B-page 138 PIC12(L)F1612/16(L)F1613 TABLE 12-4: SUMMARY OF REGISTERS ASSOCIATED WITH PORTA Name ANSELA Bit 7 Bit 6 — — Bit 5 — (2) (2) Bit 4 Bit 3 Bit 2 Bit 1 ANSA4 — ANSA2 ANSA1 Register on Page Bit 0 ANSA0 (3) 136 (2) APFCON — — T1GSEL — INLVLA — — INLVLA5 INLVLA4 INLVLA3 INLVLA2 INLVLA1 INLVLA0 138 LATA — — LATA5 LATA4 — LATA2 LATA1 LATA0 136 ODCONA — — ODA5 ODA4 — ODA2 ODA1 ODA0 WPUEN INTEDG TMR0CS TMR0SE PSA PORTA — — RA5 RA4 RA3 RA2 RA1 RA0 135 SLRCONA — — SLRA5 SLRA4 — SLRA2 SLRA1 SLRA0 138 TRISA2 TRISA1 TRISA0 135 WPUA2 WPUA1 WPUA0 137 OPTION_REG CWGASEL CWGBSEL TRISA — — TRISA5 TRISA4 —(1) WPUA — — WPUA5 WPUA4 WPUA3 Legend: Note 1: 2: 3: CONFIG1 Legend: CCP1SEL 132 137 PS<2:0> 190 x = unknown, u = unchanged, – = unimplemented locations read as ‘0’. Shaded cells are not used by PORTA. Unimplemented, read as ‘1’. PIC12(L)F1612 only. PIC16(L)F1613 only. TABLE 12-5: Name CCP2SEL SUMMARY OF CONFIGURATION WORD WITH PORTA Bits Bit -/7 Bit -/6 Bit 13/5 Bit 12/4 Bit 11/3 13:8 — — — — CLKOUTEN 7:0 CP MCLRE PWRTE — — Bit 10/2 Bit 9/1 BOREN<1:0> — Bit 8/0 — FOSC<1:0> Register on Page 52 — = unimplemented location, read as ‘0’. Shaded cells are not used by PORTA. 2014-2016 Microchip Technology Inc. DS40001737B-page 139 PIC12(L)F1612/16(L)F1613 12.5 12.5.1 PORTC Registers (PIC16(L)F1613 only) DATA REGISTER PORTC is a 6-bit wide, bidirectional port. The corresponding data direction register is TRISC (Register 12-11). Setting a TRISC bit (= 1) will make the corresponding PORTC pin an input (i.e., disable the output driver). Clearing a TRISC bit (= 0) will make the corresponding PORTC pin an output (i.e., enable the output driver and put the contents of the output latch on the selected pin). Example 12-1 shows how to initialize an I/O port. Reading the PORTC register (Register 12-10) reads the status of the pins, whereas writing to it will write to the PORT latch. All write operations are read-modify-write operations. Therefore, a write to a port implies that the port pins are read, this value is modified and then written to the PORT data latch (LATC). 12.5.2 DIRECTION CONTROL The TRISC register (Register 12-11) controls the PORTC pin output drivers, even when they are being used as analog inputs. The user should ensure the bits in the TRISC register are maintained set when using them as analog inputs. I/O pins configured as analog input always read ‘0’. 12.5.3 OPEN-DRAIN CONTROL The ODCONC register (Register 12-15) controls the open-drain feature of the port. Open-drain operation is independently selected for each pin. When an ODCONC bit is set, the corresponding port output becomes an open-drain driver capable of sinking current only. When an ODCONC bit is cleared, the corresponding port output pin is the standard push-pull drive capable of sourcing and sinking current. 12.5.4 12.5.5 INPUT THRESHOLD CONTROL The INLVLC register (Register 12-17) controls the input voltage threshold for each of the available PORTC input pins. A selection between the Schmitt Trigger CMOS or the TTL Compatible thresholds is available. The input threshold is important in determining the value of a read of the PORTC register and also the level at which an interrupt-on-change occurs, if that feature is enabled. See 28.3 “DC Characteristics” for more information on threshold levels. Note: 12.5.6 Changing the input threshold selection should be performed while all peripheral modules are disabled. Changing the threshold level during the time a module is active may inadvertently generate a transition associated with an input pin, regardless of the actual voltage level on that pin. ANALOG CONTROL The ANSELC register (Register 12-13) is used to configure the Input mode of an I/O pin to analog. Setting the appropriate ANSELC bit high will cause all digital reads on the pin to be read as ‘0’ and allow analog functions on the pin to operate correctly. The state of the ANSELC bits has no effect on digital output functions. A pin with TRIS clear and ANSELC set will still operate as a digital output, but the Input mode will be analog. This can cause unexpected behavior when executing read-modify-write instructions on the affected port. Note: The ANSELC bits default to the Analog mode after Reset. To use any pins as digital general purpose or peripheral inputs, the corresponding ANSEL bits must be initialized to ‘0’ by user software. SLEW RATE CONTROL The SLRCONC register (Register 12-16) controls the slew rate option for each port pin. Slew rate control is independently selectable for each port pin. When an SLRCONC bit is set, the corresponding port pin drive is slew rate limited. When an SLRCONC bit is cleared, The corresponding port pin drive slews at the maximum rate possible. 2014-2016 Microchip Technology Inc. DS40001737B-page 140 PIC12(L)F1612/16(L)F1613 12.5.7 PORTC FUNCTIONS AND OUTPUT PRIORITIES Each PORTC pin is multiplexed with other functions. The pins, their combined functions and their output priorities are shown in Table 12-6. When multiple outputs are enabled, the actual pin control goes to the peripheral with the highest priority. Analog input and some digital input functions are not included in the output priority list. These input functions can remain active when the pin is configured as an output. Certain digital input functions override other port functions and are included in the output priority list. TABLE 12-6: PORTC OUTPUT PRIORITY Function Priority(1) Pin Name RC0 RC0 RC1 RC1 RC2 CWG1D RC2 RC3 CWG1C CCP2(2) RC3 RC4 CWG1B C2OUT RC4 RC5 CWG1A CCP1 RC5 Note 1: 2: Priority listed from highest to lowest. Default pin (see APFCON register). 2014-2016 Microchip Technology Inc. DS40001737B-page 141 PIC12(L)F1612/16(L)F1613 12.6 Register Definitions: PORTC (PIC16(L)F1613 ONLY) REGISTER 12-10: PORTC: PORTC REGISTER U-0 U-0 R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u — — RC5 RC4 RC3 RC2 RC1 RC0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-6 Unimplemented: Read as ‘0’ bit 5-0 RC<5:0>: PORTC General Purpose I/O Pin bits 1 = Port pin is > VIH 0 = Port pin is < VIL Note 1: Writes to PORTC are actually written to corresponding LATC register. Reads from PORTC register is return of actual I/O pin values. REGISTER 12-11: TRISC: PORTC TRI-STATE REGISTER U-0 U-0 R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 — — TRISC5 TRISC4 TRISC3 TRISC2 TRISC1 TRISC0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-6 Unimplemented: Read as ‘0’ bit 5-0 TRISC<5:0>: PORTC Tri-State Control bits 1 = PORTC pin configured as an input (tri-stated) 0 = PORTC pin configured as an output 2014-2016 Microchip Technology Inc. DS40001737B-page 142 PIC12(L)F1612/16(L)F1613 REGISTER 12-12: LATC: PORTC DATA LATCH REGISTER U-0 U-0 R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u — — LATC5 LATC4 LATC3 LATC2 LATC1 LATC0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-6 Unimplemented: Read as ‘0’ bit 5-0 LATC<5:0>: PORTC Tri-State Control bits 1 = PORTC pin configured as an input (tri-stated) 0 = PORTC pin configured as an output Note 1: Writes to PORTC are actually written to corresponding LATC register. Reads from PORTC register is return of actual I/O pin values. REGISTER 12-13: ANSELC: PORTC ANALOG SELECT REGISTER U-0 U-0 U-0 U-0 R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 — — — — ANSC3 ANSC2 ANSC1 ANSC0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-4 Unimplemented: Read as ‘0’ bit 3-0 ANSC<3:0>: Analog Select between Analog or Digital Function on pins RC<3:0>, respectively 1 = Analog input. Pin is assigned as analog input(1). Digital input buffer disabled. 0 = Digital I/O. Pin is assigned to port or digital special function. Note 1: When setting a pin to an analog input, the corresponding TRIS bit must be set to Input mode in order to allow external control of the voltage on the pin. 2014-2016 Microchip Technology Inc. DS40001737B-page 143 PIC12(L)F1612/16(L)F1613 REGISTER 12-14: WPUC: WEAK PULL-UP PORTC REGISTER(1),(2) U-0 U-0 R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 — — WPUC5 WPUC4 WPUC3 WPUC2 WPUC1 WPUC0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-6 Unimplemented: Read as ‘0’ bit 5-0 WPUC<5:0>: Weak Pull-up Register bits 1 = Pull-up enabled 0 = Pull-up disabled Note 1: 2: Global WPUEN bit of the OPTION_REG register must be cleared for individual pull-ups to be enabled. The weak pull-up device is automatically disabled if the pin is configured as an output. REGISTER 12-15: ODCONC: PORTC OPEN-DRAIN CONTROL REGISTER U-0 U-0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 — — ODC5 ODC4 ODC3 ODC2 ODC1 ODC0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-6 Unimplemented: Read as ‘0’ bit 5-0 ODC<5:0>: PORTC Open Drain Enable bits For RC<5:0> pins, respectively 1 = Port pin operates as open-drain drive (sink current only) 0 = Port pin operates as standard push-pull drive (source and sink current) 2014-2016 Microchip Technology Inc. DS40001737B-page 144 PIC12(L)F1612/16(L)F1613 REGISTER 12-16: SLRCONC: PORTC SLEW RATE CONTROL REGISTER U-0 U-0 R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 — — SLRC5 SLRC4 SLRC3 SLRC2 SLRC1 SLRC0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-6 Unimplemented: Read as ‘0’ bit 5-0 SLRC<5:0>: PORTC Slew Rate Enable bits For RC<5:0> pins, respectively 1 = Port pin slew rate is limited 0 = Port pin slews at maximum rate REGISTER 12-17: INLVLC: PORTC INPUT LEVEL CONTROL REGISTER U-0 U-0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 — — INLVLC5 INLVLC4 INLVLC3 INLVLC2 INLVLC1 INLVLC0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-6 Unimplemented: Read as ‘0’ bit 5-0 INLVLC<5:0>: PORTC Input Level Select bits For RC<5:0> pins, respectively 1 = ST input used for PORT reads and interrupt-on-change 0 = TTL input used for PORT reads and interrupt-on-change TABLE 12-7: Name SUMMARY OF REGISTERS ASSOCIATED WITH PORTC Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 ANSELC — — — — ANSC3 ANSC2 APFCON — CWGASEL(1) CWGBSEL(1) — T1GSEL — Bit 1 Bit 0 ANSC1 ANSC0 CCP2SEL(2) CCP1SEL(1) Register on Page 143 132 INLVLC — — INLVLC5 INLVLC4 INLVLC3 INLVLC2 INLVLC1 INLVLC0 LATC — — LATC5 LATC4 LATC3 LATC2 LATC1 LATC0 143 ODCONC — — ODC5 ODC4 ODC3 ODC2 ODC1 ODC0 144 WPUEN INTEDG TMR0CS TMR0SE PSA PORTC — — RC5 RC4 RC3 RC2 RC1 RC0 142 SLRCONC — — SLRC5 SLRC4 SLRC3 SLRC2 SLRC1 SLRC0 145 TRISC(2) — — TRISC5 TRISC4 TRISC3 TRISC2 TRISC1 TRISC0 142 WPUC — — WPUC5 WPUC4 WPUC3 WPUC2 WPUC1 WPUC0 144 OPTION_REG Legend: Note 1: 2: PS<2:0> 145 190 x = unknown, u = unchanged, - = unimplemented locations read as ‘0’. Shaded cells are not used by PORTC. PIC12(L)F1612 only. PIC16(L)F1613 only. 2014-2016 Microchip Technology Inc. DS40001737B-page 145 PIC12(L)F1612/16(L)F1613 13.0 INTERRUPT-ON-CHANGE The PORTA and PORTC pins can be configured to operate as Interrupt-On-Change (IOC) pins. An interrupt can be generated by detecting a signal that has either a rising edge or a falling edge. Any individual port pin, or combination of port pins, can be configured to generate an interrupt. The interrupt-on-change module has the following features: • • • • Interrupt-on-Change enable (Master Switch) Individual pin configuration Rising and falling edge detection Individual pin interrupt flags Figure 13-1 is a block diagram of the IOC module. 13.1 Enabling the Module 13.3 Interrupt Flags The IOCAFx and IOCCFx bits located in the IOCAF and IOCCF registers, respectively, are status flags that correspond to the interrupt-on-change pins of the associated port. If an expected edge is detected on an appropriately enabled pin, then the status flag for that pin will be set, and an interrupt will be generated if the IOCIE bit is set. The IOCIF bit of the INTCON register reflects the status of all IOCAFx and IOCCFx bits. 13.4 Clearing Interrupt Flags The individual status flags, (IOCAFx and IOCCFx bits), can be cleared by resetting them to zero. If another edge is detected during this clearing operation, the associated status flag will be set at the end of the sequence, regardless of the value actually being written. To allow individual port pins to generate an interrupt, the IOCIE bit of the INTCON register must be set. If the IOCIE bit is disabled, the edge detection on the pin will still occur, but an interrupt will not be generated. In order to ensure that no detected edge is lost while clearing flags, only AND operations masking out known changed bits should be performed. The following sequence is an example of what should be performed. 13.2 EXAMPLE 13-1: Individual Pin Configuration For each port pin, a rising edge detector and a falling edge detector are present. To enable a pin to detect a rising edge, the associated bit of the IOCxP register is set. To enable a pin to detect a falling edge, the associated bit of the IOCxN register is set. A pin can be configured to detect rising and falling edges simultaneously by setting both associated bits of the IOCxP and IOCxN registers, respectively. MOVLW XORWF ANDWF 13.5 CLEARING INTERRUPT FLAGS (PORTA EXAMPLE) 0xff IOCAF, W IOCAF, F Operation in Sleep The interrupt-on-change interrupt sequence will wake the device from Sleep mode, if the IOCIE bit is set. If an edge is detected while in Sleep mode, the IOCxF register will be updated prior to the first instruction executed out of Sleep. 2014-2016 Microchip Technology Inc. DS40001737B-page 146 PIC12(L)F1612/16(L)F1613 FIGURE 13-1: INTERRUPT-ON-CHANGE BLOCK DIAGRAM (PORTA EXAMPLE) Rev. 10-000 037A 6/2/201 4 IOCANx D Q R Q4Q1 edge detect RAx IOCAPx D data bus = 0 or 1 Q D S to data bus IOCAFx Q write IOCAFx R IOCIE Q2 IOC interrupt to CPU core from all other IOCnFx individual pin detectors FOSC Q1 Q1 Q1 Q3 Q3 Q4 Q4Q1 Q2 Q2 Q2 Q3 Q4 Q4Q1 2014-2016 Microchip Technology Inc. Q4 Q4Q1 Q4Q1 DS40001737B-page 147 PIC12(L)F1612/16(L)F1613 13.6 Register Definitions: Interrupt-on-Change Control REGISTER 13-1: IOCAP: INTERRUPT-ON-CHANGE PORTA POSITIVE EDGE REGISTER U-0 U-0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 — — IOCAP5 IOCAP4 IOCAP3 IOCAP2 IOCAP1 IOCAP0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-6 Unimplemented: Read as ‘0’ bit 5-0 IOCAP<5:0>: Interrupt-on-Change PORTA Positive Edge Enable bits 1 = Interrupt-on-Change enabled on the pin for a positive going edge. IOCAFx bit and IOCIF flag will be set upon detecting an edge. 0 = Interrupt-on-Change disabled for the associated pin. REGISTER 13-2: IOCAN: INTERRUPT-ON-CHANGE PORTA NEGATIVE EDGE REGISTER U-0 U-0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 — — IOCAN5 IOCAN4 IOCAN3 IOCAN2 IOCAN1 IOCAN0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-6 Unimplemented: Read as ‘0’ bit 5-0 IOCAN<5:0>: Interrupt-on-Change PORTA Negative Edge Enable bits 1 = Interrupt-on-Change enabled on the pin for a negative going edge. IOCAFx bit and IOCIF flag will be set upon detecting an edge. 0 = Interrupt-on-Change disabled for the associated pin. REGISTER 13-3: IOCAF: INTERRUPT-ON-CHANGE PORTA FLAG REGISTER U-0 U-0 R/W/HS-0/0 R/W/HS-0/0 R/W/HS-0/0 R/W/HS-0/0 R/W/HS-0/0 R/W/HS-0/0 — — IOCAF5 IOCAF4 IOCAF3 IOCAF2 IOCAF1 IOCAF0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit u = Bit is unchanged x = Bit is unknown U = Unimplemented bit, read as ‘0’ -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared HS - Bit is set in hardware bit 7-6 Unimplemented: Read as ‘0’ bit 5-0 IOCAF<5:0>: Interrupt-on-Change PORTA Flag bits 1 = An enabled change was detected on the associated pin. Set when IOCAPx = 1 and a rising edge was detected on RAx, or when IOCANx = 1 and a falling edge was detected on RAx. 0 = No change was detected, or the user cleared the detected change. 2014-2016 Microchip Technology Inc. DS40001737B-page 148 PIC12(L)F1612/16(L)F1613 REGISTER 13-4: IOCCP: INTERRUPT-ON-CHANGE PORTC POSITIVE EDGE REGISTER(1) U-0 U-0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 — — IOCCP5 IOCCP4 IOCCP3 IOCCP2 IOCCP1 IOCCP0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-6 Unimplemented: Read as ‘0’ bit 5-0 IOC P<5:0>: Interrupt-on-Change PORTC Positive Edge Enable bits Note C 1 = Interrupt-on-Change enabled on the pin for a positive going edge. IOCCFx bit and IOCIF flag will be set upon detecting an edge. 0 = Interrupt-on-Change disabled for the associated pin. 1: PIC16(L)F1613 only. REGISTER 13-5: IOCCN: INTERRUPT-ON-CHANGE PORTC NEGATIVE EDGE REGISTER(1) U-0 U-0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 — — IOCCN5 IOCCN4 IOCCN3 IOCCN2 IOCCN1 IOCCN0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-6 Unimplemented: Read as ‘0’ bit 5-0 IOC N<5:0>: Interrupt-on-Change PORTC Negative Edge Enable bits Note C 1 = Interrupt-on-Change enabled on the pin for a negative going edge. IOCCFx bit and IOCIF flag will be set upon detecting an edge. 0 = Interrupt-on-Change disabled for the associated pin. 1: PIC16(L)F1613 only. REGISTER 13-6: IOCCF: INTERRUPT-ON-CHANGE PORTC FLAG REGISTER(1) U-0 U-0 R/W/HS-0/0 R/W/HS-0/0 R/W/HS-0/0 R/W/HS-0/0 R/W/HS-0/0 R/W/HS-0/0 — — IOCCF5 IOCCF4 IOCCF3 IOCCF2 IOCCF1 IOCCF0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared HS - Bit is set in hardware bit 7-6 Unimplemented: Read as ‘0’ bit 5-0 IOCCF<5:0>: Interrupt-on-Change PORTC Flag bits 1 = An enabled change was detected on the associated pin. Set when IOCCPx = 1 and a rising edge was detected on RCx, or when IOCCNx = 1 and a falling edge was detected on RCx. 0 = No change was detected, or the user cleared the detected change. Note 1: PIC16(L)F1613 only. 2014-2016 Microchip Technology Inc. DS40001737B-page 149 PIC12(L)F1612/16(L)F1613 TABLE 13-1: Name SUMMARY OF REGISTERS ASSOCIATED WITH INTERRUPT-ON-CHANGE Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register on Page ANSELA — — — ANSA4 — ANSA2 ANSA1 ANSA0 136 INTCON GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF 82 IOCAF — — IOCAF5 IOCAF4 IOCAF3 IOCAF2 IOCAF1 IOCAF0 148 IOCAN — — IOCAN5 IOCAN4 IOCAN3 IOCAN2 IOCAN1 IOCAN0 148 IOCAP — — IOCAP5 IOCAP4 IOCAP3 IOCAP2 IOCAP1 IOCAP0 148 IOCCF(2) — — IOCCF5 IOCCF4 IOCCF3 IOCCF2 IOCCF1 IOCCF0 149 (2) — — IOCCN5 IOCCN4 IOCCN3 IOCCN2 IOCCN1 IOCCN0 149 IOCCP(2) — — IOCCP5 IOCCP4 IOCCP3 IOCCP2 IOCCP1 IOCCP0 149 TRISA — — TRISA5 TRISA4 —(1) TRISA2 TRISA1 TRISA0 135 TRISC(2) — — TRISC5 TRISC4 TRISC3 TRISC2 TRISC1 TRISC0 142 IOCCN Legend: Note 1: 2: — = unimplemented location, read as ‘0’. Shaded cells are not used by interrupt-on-change. Unimplemented, read as ‘1’. only. 2014-2016 Microchip Technology Inc. DS40001737B-page 150 PIC12(L)F1612/16(L)F1613 14.0 The ADFVR<1:0> bits of the FVRCON register are used to enable and configure the gain amplifier settings for the reference supplied to the ADC module. Reference Section16.0 “Analog-to-Digital Converter (ADC) Module” for additional information. FIXED VOLTAGE REFERENCE (FVR) The Fixed Voltage Reference (FVR) is a stable voltage reference, independent of VDD, with a nominal output level (VFVR) of 1.024V. The output of the FVR can be configured to supply a reference voltage to the following: The CDAFVR<1:0> bits of the FVRCON register are used to enable and configure the gain amplifier settings for the reference supplied to the comparator modules. Reference Section18.0 “Comparator Module” for additional information. • ADC input channel • Comparator positive input • Comparator negative input To minimize current consumption when the FVR is disabled, the FVR buffers should be turned off by clearing the Buffer Gain Selection bits. The FVR can be enabled by setting the FVREN bit of the FVRCON register. 14.1 14.2 Independent Gain Amplifier When the Fixed Voltage Reference module is enabled, it requires time for the reference and amplifier circuits to stabilize. Once the circuits stabilize and are ready for use, the FVRRDY bit of the FVRCON register will be set. See Figure 36-64: FVR Stabilization Period, Only. The output of the FVR supplied to the peripherals, (listed above), is routed through a programmable gain amplifier. Each amplifier can be programmed for a gain of 1x, 2x or 4x, to produce the three possible voltage levels. FIGURE 14-1: FVR Stabilization Period VOLTAGE REFERENCE BLOCK DIAGRAM Rev. 10-000 053C 12/9/201 3 ADFVR<1:0> CDAFVR<1:0> FVREN Note 1 2 1x 2x 4x FVR_buffer1 (To ADC Module) 1x 2x 4x FVR_buffer2 (To Comparators and DAC) 2 + _ FVRRDY Note 1: Any peripheral requiring the Fixed Reference (See Table 14-1) 2014-2016 Microchip Technology Inc. DS40001737B-page 151 PIC12(L)F1612/16(L)F1613 TABLE 14-1: Peripheral PERIPHERALS REQUIRING THE FIXED VOLTAGE REFERENCE (FVR) Conditions Description HFINTOSC FOSC<2:0> = 010 and IRCF<3:0> = 000x BOREN<1:0> = 11 BOR always enabled. BOR BOREN<1:0> = 10 and BORFS = 1 BOR disabled in Sleep mode, BOR Fast Start enabled. BOREN<1:0> = 01 and BORFS = 1 BOR under software control, BOR Fast Start enabled. All PIC12F1612/16F1613 devices, when VREGPM = 1 and not in Sleep The device runs off of the Low-Power Regulator when in Sleep mode. LDO 2014-2016 Microchip Technology Inc. INTOSC is active and device is not in Sleep. DS40001737B-page 152 PIC12(L)F1612/16(L)F1613 14.3 Register Definitions: FVR Control REGISTER 14-1: FVRCON: FIXED VOLTAGE REFERENCE CONTROL REGISTER R/W-0/0 R-q/q R/W-0/0 R/W-0/0 FVREN(1) FVRRDY(2) TSEN(3) TSRNG(3) R/W-0/0 R/W-0/0 R/W-0/0 CDAFVR<1:0>(1) R/W-0/0 ADFVR<1:0>(1) bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared q = Value depends on condition bit 7 FVREN: Fixed Voltage Reference Enable bit(1) 1 = Fixed Voltage Reference is enabled 0 = Fixed Voltage Reference is disabled bit 6 FVRRDY: Fixed Voltage Reference Ready Flag bit(2) 1 = Fixed Voltage Reference output is ready for use 0 = Fixed Voltage Reference output is not ready or not enabled bit 5 TSEN: Temperature Indicator Enable bit(3) 1 = Temperature Indicator is enabled 0 = Temperature Indicator is disabled bit 4 TSRNG: Temperature Indicator Range Selection bit(3) 1 = VOUT = VDD - 4VT (High Range) 0 = VOUT = VDD - 2VT (Low Range) bit 3-2 CDAFVR<1:0>: Comparator FVR Buffer Gain Selection bits(1) 11 = Comparator FVR Buffer Gain is 4x, with output VCDAFVR = 4x VFVR(4) 10 = Comparator FVR Buffer Gain is 2x, with output VCDAFVR = 2x VFVR(4) 01 = Comparator FVR Buffer Gain is 1x, with output VCDAFVR = 1x VFVR 00 = Comparator FVR Buffer is off bit 1-0 ADFVR<1:0>: ADC FVR Buffer Gain Selection bit(1) 11 = ADC FVR Buffer Gain is 4x, with output VADFVR = 4x VFVR(4) 10 = ADC FVR Buffer Gain is 2x, with output VADFVR = 2x VFVR(4) 01 = ADC FVR Buffer Gain is 1x, with output VADFVR = 1x VFVR 00 = ADC FVR Buffer is off Note 1: 2: 3: 4: To minimize current consumption when the FVR is disabled, the FVR buffers should be turned off by clearing the Buffer Gain Selection bits. FVRRDY is always ‘1’ for the PIC12F1612/16F1613 devices. See Section15.0 “Temperature Indicator Module” for additional information. Fixed Voltage Reference output cannot exceed VDD. TABLE 14-2: Name FVRCON Legend: SUMMARY OF REGISTERS ASSOCIATED WITH THE FIXED VOLTAGE REFERENCE Bit 7 Bit 6 Bit 5 Bit 4 FVREN FVRRDY TSEN TSRNG Bit 3 Bit 2 CDAFVR<1:0> Bit 1 Bit 0 ADFVR<1:0> Register on page 153 Shaded cells are unused by the Fixed Voltage Reference module. 2014-2016 Microchip Technology Inc. DS40001737B-page 153 PIC12(L)F1612/16(L)F1613 15.0 TEMPERATURE INDICATOR MODULE FIGURE 15-1: This family of devices is equipped with a temperature circuit designed to measure the operating temperature of the silicon die. The circuit’s range of operating temperature falls between -40°C and +85°C. The output is a voltage that is proportional to the device temperature. The output of the temperature indicator is internally connected to the device ADC. Rev. 10-000069A 7/31/2013 VDD TSEN The circuit may be used as a temperature threshold detector or a more accurate temperature indicator, depending on the level of calibration performed. A onepoint calibration allows the circuit to indicate a temperature closely surrounding that point. A two-point calibration allows the circuit to sense the entire range of temperature more accurately. Reference Application Note AN1333, “Use and Calibration of the Internal Temperature Indicator” (DS01333) for more details regarding the calibration process. 15.1 TEMPERATURE CIRCUIT DIAGRAM TSRNG VOUT Temp. Indicator To ADC Circuit Operation Figure 15-1 shows a simplified block diagram of the temperature circuit. The proportional voltage output is achieved by measuring the forward voltage drop across multiple silicon junctions. Equation 15-1 describes the output characteristics of the temperature indicator. EQUATION 15-1: VOUT RANGES High Range: VOUT = VDD - 4VT Low Range: VOUT = VDD - 2VT 15.2 Minimum Operating VDD When the temperature circuit is operated in low range, the device may be operated at any operating voltage that is within specifications. When the temperature circuit is operated in high range, the device operating voltage, VDD, must be high enough to ensure that the temperature circuit is correctly biased. Table 15-1 shows the recommended minimum VDD vs. range setting. TABLE 15-1: The temperature sense circuit is integrated with the Fixed Voltage Reference (FVR) module. See Section14.0 “Fixed Voltage Reference (FVR)” for more information. The circuit is enabled by setting the TSEN bit of the FVRCON register. When disabled, the circuit draws no current. The circuit operates in either high or low range. The high range, selected by setting the TSRNG bit of the FVRCON register, provides a wider output voltage. This provides more resolution over the temperature range, but may be less consistent from part to part. This range requires a higher bias voltage to operate and thus, a higher VDD is needed. The low range is selected by clearing the TSRNG bit of the FVRCON register. The low range generates a lower voltage drop and thus, a lower bias voltage is needed to operate the circuit. The low range is provided for low voltage operation. 2014-2016 Microchip Technology Inc. RECOMMENDED VDD VS. RANGE Min. VDD, TSRNG = 1 Min. VDD, TSRNG = 0 3.6V 1.8V 15.3 Temperature Output The output of the circuit is measured using the internal Analog-to-Digital Converter. A channel is reserved for the temperature circuit output. Refer to Section16.0 “Analog-to-Digital Converter (ADC) Module” for detailed information. 15.4 ADC Acquisition Time To ensure accurate temperature measurements, the user must wait at least 200 s after the ADC input multiplexer is connected to the temperature indicator output before the conversion is performed. In addition, the user must wait 200 s between sequential conversions of the temperature indicator output. DS40001737B-page 154 PIC12(L)F1612/16(L)F1613 TABLE 15-2: Name FVRCON Legend: SUMMARY OF REGISTERS ASSOCIATED WITH THE TEMPERATURE INDICATOR Bit 7 Bit 6 Bit 5 Bit 4 FVREN FVRRDY TSEN TSRNG Bit 3 Bit 2 CDAFVR<1:0> Bit 1 Bit 0 ADFVR<1:0> Register on page 118 Shaded cells are unused by the temperature indicator module. 2014-2016 Microchip Technology Inc. DS40001737B-page 155 PIC12(L)F1612/16(L)F1613 16.0 The ADC voltage reference is software selectable to be either internally generated or externally supplied. ANALOG-TO-DIGITAL CONVERTER (ADC) MODULE The ADC can generate an interrupt upon completion of a conversion. This interrupt can be used to wake-up the device from Sleep. The Analog-to-Digital Converter (ADC) allows conversion of an analog input signal to a 10-bit binary representation of that signal. This device uses analog inputs, which are multiplexed into a single sample and hold circuit. The output of the sample and hold is connected to the input of the converter. The converter generates a 10-bit binary result via successive approximation and stores the conversion result into the ADC result registers (ADRESH:ADRESL register pair). Figure 16-1 shows the block diagram of the ADC. FIGURE 16-1: ADC BLOCK DIAGRAM Rev. 10-000033D 9/16/2014 VDD ADPREF Positive Reference Select VDD VREF+ pin External Channel Inputs ANa VRNEG VRPOS . . . ADC_clk sampled input ANz Internal Channel Inputs ADCS<2:0> VSS AN0 ADC Clock Select FOSC/n Fosc Divider FRC FOSC FRC Temp Indicator Reserved ADC CLOCK SOURCE FVR_buffer1 ADC Sample Circuit CHS<4:0> 10 set bit ADIF Write to bit GO/DONE ADFM GO/DONE Q1 Q4 16 start ADRESH Q2 TRIGSEL<4:0> 0=Left Justify 1=Right Justify complete ADRESL Enable Trigger Select ADON . . . Trigger Sources VDD AUTO CONVERSION TRIGGER 2014-2016 Microchip Technology Inc. DS40001737B-page 156 PIC12(L)F1612/16(L)F1613 16.1 ADC Configuration When configuring and using the ADC the following functions must be considered: • • • • • • Port configuration Channel selection ADC voltage reference selection ADC conversion clock source Interrupt control Result formatting 16.1.1 PORT CONFIGURATION The ADC can be used to convert both analog and digital signals. When converting analog signals, the I/O pin should be configured for analog by setting the associated TRIS and ANSEL bits. Refer to Section12.0 “I/O Ports” for more information. Note: 16.1.2 Analog voltages on any pin that is defined as a digital input may cause the input buffer to conduct excess current. CHANNEL SELECTION There are up to 11 channel selections available: • • • • • AN<7:0> pins (PIC16(L)F1613 only) AN<3:0> pins (PIC12(L)F1612 only) Temperature Indicator DAC1_output FVR_buffer1 16.1.4 CONVERSION CLOCK The source of the conversion clock is software selectable via the ADCS bits of the ADCON1 register. There are seven possible clock options: • • • • • • • FOSC/2 FOSC/4 FOSC/8 FOSC/16 FOSC/32 FOSC/64 FRC (internal RC oscillator) The time to complete one bit conversion is defined as TAD. One full 10-bit conversion requires 11.5 TAD periods as shown in Figure 16-2. For correct conversion, the appropriate TAD specification must be met. Refer to the ADC conversion requirements in Section28.0 “Electrical Specifications” for more information. Table 16-1 gives examples of appropriate ADC clock selections. Note: Unless using the FRC, any changes in the system clock frequency will change the ADC clock frequency, which may adversely affect the ADC result. The CHS bits of the ADCON0 register determine which channel is connected to the sample and hold circuit. When changing channels, a delay (TACQ) is required before starting the next conversion. Refer to Section16.2.6 “ADC Conversion Procedure” for more information. 16.1.3 ADC VOLTAGE REFERENCE The ADC module uses a positive and a negative voltage reference. The positive reference is labeled ref+ and the negative reference is labeled ref-. The positive voltage reference (ref+) is selected by the ADPREF bits in the ADCON1 register. The positive voltage reference source can be: • VREF+ pin • VDD • FVR_buffer1 The negative voltage reference (ref-) source is: • VSS 2014-2016 Microchip Technology Inc. DS40001737B-page 157 PIC12(L)F1612/16(L)F1613 TABLE 16-1: ADC CLOCK PERIOD (TAD) VS. DEVICE OPERATING FREQUENCIES ADC Clock Period (TAD) ADC Clock Source Device Frequency (FOSC) ADCS<2:0 > 20 MHz 16 MHz 8 MHz 4 MHz 1 MHz Fosc/2 000 100 ns 125 ns 250 ns 500 ns 2.0 s Fosc/4 100 200 ns 250 ns 500 ns 1.0 s 4.0 s Fosc/8 001 400 ns 500 ns 1.0 s 2.0 s 8.0 s Fosc/16 101 800 ns 1.0 s 2.0 s 4.0 s 16.0 s Fosc/32 010 1.6 s 2.0 s 4.0 s 8.0 s 32.0 s Fosc/64 110 3.2 s 4.0 s 8.0 s 16.0 s 64.0 s FRC x11 1.0-6.0 s 1.0-6.0 s 1.0-6.0 s 1.0-6.0 s 1.0-6.0 s Legend: Shaded cells are outside of recommended range. Note 1: The FRC source has a typical TAD time of 1.7 ms. 2: When the device frequency is greater than 1 MHz, the FRC clock source is only recommended if the conversion will be performed during Sleep. 3: The TAD period when using the FRC clock source can fall within a specified range, (see TAD parameter). The TAD period when using the FOSC-based clock source can be configured for a more precise TAD period. However, the FRC clock source must be used when conversions are to be performed with the device in Sleep mode. FIGURE 16-2: ANALOG-TO-DIGITAL CONVERSION TAD CYCLES Rev. 10-000035A 7/30/2013 TAD1 TAD2 TAD3 TAD4 TAD5 TAD6 TAD7 TAD8 TAD9 TAD10 TAD11 b9 b8 b7 b6 b5 b4 b3 b2 b1 b0 THCD Conversion Starts TACQ Holding capacitor disconnected from analog input (THCD). Set GO bit On the following cycle: ADRESH:ADRESL is loaded, GO bit is cleared, ADIF bit is set, holding capacitor is reconnected to analog input. Enable ADC (ADON bit) and Select channel (ACS bits) 2014-2016 Microchip Technology Inc. DS40001737B-page 158 PIC12(L)F1612/16(L)F1613 16.1.5 INTERRUPTS 16.1.6 The ADC module allows for the ability to generate an interrupt upon completion of an Analog-to-Digital conversion. The ADC Interrupt Flag is the ADIF bit in the PIR1 register. The ADC Interrupt Enable is the ADIE bit in the PIE1 register. The ADIF bit must be cleared in software. RESULT FORMATTING The 10-bit ADC conversion result can be supplied in two formats, left justified or right justified. The ADFM bit of the ADCON1 register controls the output format. Figure 16-3 shows the two output formats. Note 1: The ADIF bit is set at the completion of every conversion, regardless of whether or not the ADC interrupt is enabled. 2: The ADC operates during Sleep only when the FRC oscillator is selected. This interrupt can be generated while the device is operating or while in Sleep. If the device is in Sleep, the interrupt will wake-up the device. Upon waking from Sleep, the next instruction following the SLEEP instruction is always executed. If the user is attempting to wake-up from Sleep and resume in-line code execution, the GIE and PEIE bits of the INTCON register must be disabled. If the GIE and PEIE bits of the INTCON register are enabled, execution will switch to the Interrupt Service Routine. FIGURE 16-3: 10-BIT ADC CONVERSION RESULT FORMAT Rev. 10-000054A 7/30/2013 ADRESH ADRESL (ADFM = 0) MSB LSB bit 7 bit 0 bit 7 10-bit ADC Result (ADFM = 1) bit 0 Unimplemented: Read as ‘0’ MSB bit 7 Unimplemented: Read as ‘0’ 2014-2016 Microchip Technology Inc. LSB bit 0 bit 7 bit 0 10-bit ADC Result DS40001737B-page 159 PIC12(L)F1612/16(L)F1613 16.2 16.2.1 ADC Operation STARTING A CONVERSION To enable the ADC module, the ADON bit of the ADCON0 register must be set to a ‘1’. Setting the GO/ DONE bit of the ADCON0 register to a ‘1’ will start the Analog-to-Digital conversion. Note: 16.2.2 The GO/DONE bit should not be set in the same instruction that turns on the ADC. Refer to Section16.2.6 “ADC Conversion Procedure”. COMPLETION OF A CONVERSION 16.2.4 ADC OPERATION DURING SLEEP The ADC module can operate during Sleep. This requires the ADC clock source to be set to the FRC option. Performing the ADC conversion during Sleep can reduce system noise. If the ADC interrupt is enabled, the device will wake-up from Sleep when the conversion completes. If the ADC interrupt is disabled, the ADC module is turned off after the conversion completes, although the ADON bit remains set. When the ADC clock source is something other than FRC, a SLEEP instruction causes the present conversion to be aborted and the ADC module is turned off, although the ADON bit remains set. When the conversion is complete, the ADC module will: 16.2.5 • Clear the GO/DONE bit • Set the ADIF Interrupt Flag bit • Update the ADRESH and ADRESL registers with new conversion result The auto-conversion trigger allows periodic ADC measurements without software intervention. When a rising edge of the selected source occurs, the GO/DONE bit is set by hardware. 16.2.3 The auto-conversion trigger source is selected with the TRIGSEL<4:0> bits of the ADCON2 register. TERMINATING A CONVERSION If a conversion must be terminated before completion, the GO/DONE bit can be cleared in software. The ADRESH and ADRESL registers will be updated with the partially complete Analog-to-Digital conversion sample. Incomplete bits will match the last bit converted. Note: A device Reset forces all registers to their Reset state. Thus, the ADC module is turned off and any pending conversion is terminated. AUTO-CONVERSION TRIGGER Using the auto-conversion trigger does not assure proper ADC timing. It is the user’s responsibility to ensure that the ADC timing requirements are met. See Table 16-2 for auto-conversion sources. TABLE 16-2: AUTO-CONVERSION SOURCES Source Peripheral Timer0 T0_overflow Timer1 T1_overflow Timer2 TMR2_postscaled Timer4 TMR4_postscaled Timer6 TMR6_postscaled Comparator C1 Comparator C2 C1_OUT_sync (1) C2_OUT_sync SMT1 SMT1_CPW SMT1 SMT1_CPR SMT1 SMT1_PR SMT2 SMT2_CPW SMT2 SMT2_CPR SMT2 SMT2_PR CCP1 CCP1_out CCP2 CCP2_out Note 1: 2014-2016 Microchip Technology Inc. Signal Name PIC16(L)F1613 only. DS40001737B-page 160 PIC12(L)F1612/16(L)F1613 16.2.6 ADC CONVERSION PROCEDURE This is an example procedure for using the ADC to perform an Analog-to-Digital conversion: 1. 2. 3. 4. 5. 6. 7. 8. Configure Port: • Disable pin output driver (Refer to the TRIS register) • Configure pin as analog (Refer to the ANSEL register) Configure the ADC module: • Select ADC conversion clock • Configure voltage reference • Select ADC input channel • Turn on ADC module Configure ADC interrupt (optional): • Clear ADC interrupt flag • Enable ADC interrupt • Enable peripheral interrupt • Enable global interrupt(1) Wait the required acquisition time(2). Start conversion by setting the GO/DONE bit. Wait for ADC conversion to complete by one of the following: • Polling the GO/DONE bit • Waiting for the ADC interrupt (interrupts enabled) Read ADC Result. Clear the ADC interrupt flag (required if interrupt is enabled). EXAMPLE 16-1: ADC CONVERSION ;This code block configures the ADC ;for polling, Vdd and Vss references, FRC ;oscillator and AN0 input. ; ;Conversion start & polling for completion ; are included. ; BANKSEL ADCON1 ; MOVLW B’11110000’ ;Right justify, FRC ;oscillator MOVWF ADCON1 ;Vdd and Vss Vref+ BANKSEL TRISA ; BSF TRISA,0 ;Set RA0 to input BANKSEL ANSEL ; BSF ANSEL,0 ;Set RA0 to analog BANKSEL ADCON0 ; MOVLW B’00000001’ ;Select channel AN0 MOVWF ADCON0 ;Turn ADC On CALL SampleTime ;Acquisiton delay BSF ADCON0,ADGO ;Start conversion BTFSC ADCON0,ADGO ;Is conversion done? GOTO $-1 ;No, test again BANKSEL ADRESH ; MOVF ADRESH,W ;Read upper 2 bits MOVWF RESULTHI ;store in GPR space BANKSEL ADRESL ; MOVF ADRESL,W ;Read lower 8 bits MOVWF RESULTLO ;Store in GPR space Note 1: The global interrupt can be disabled if the user is attempting to wake-up from Sleep and resume in-line code execution. 2: Refer to Section16.4 “ADC Acquisition Requirements”. 2014-2016 Microchip Technology Inc. DS40001737B-page 161 PIC12(L)F1612/16(L)F1613 16.3 Register Definitions: ADC Control REGISTER 16-1: U-0 ADCON0: ADC CONTROL REGISTER 0 R/W-0/0 R/W-0/0 — R/W-0/0 R/W-0/0 CHS<4:0> R/W-0/0 R/W-0/0 R/W-0/0 GO/DONE ADON bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7 Unimplemented: Read as ‘0’ bit 6-2 CHS<4:0>: Analog Channel Select bits 11111 = FVR (Fixed Voltage Reference) Buffer 1 Output(3) 11110 = DAC (Digital-to-Analog Converter)(2) 11101 = Temperature Indicator(1) 11100 = Reserved. No channel connected. • • • 01000 = Reserved. No channel connected. 00111 = AN7(4) 00110 = AN6(4) 00101 = AN5(4) 00100 = AN4(4) 00011 = AN3 00010 = AN2 00001 = AN1 00000 = AN0 bit 1 GO/DONE: ADC Conversion Status bit 1 = ADC conversion cycle in progress. Setting this bit starts an ADC conversion cycle. This bit is automatically cleared by hardware when the ADC conversion has completed. 0 = ADC conversion completed/not in progress bit 0 ADON: ADC Enable bit 1 = ADC is enabled 0 = ADC is disabled and consumes no operating current Note 1: 2: 3: 4: See Section15.0 “Temperature Indicator Module”. See Section17.0 “8-bit Digital-to-Analog Converter (DAC1) Module” for more information. See Section14.0 “Fixed Voltage Reference (FVR)” for more information. AN<7:4> available on PIC16(L)F1613 only. 2014-2016 Microchip Technology Inc. DS40001737B-page 162 PIC12(L)F1612/16(L)F1613 REGISTER 16-2: R/W-0/0 ADCON1: ADC CONTROL REGISTER 1 R/W-0/0 ADFM R/W-0/0 R/W-0/0 ADCS<2:0> U-0 U-0 — — R/W-0/0 bit 7 R/W-0/0 ADPREF<1:0> bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7 ADFM: ADC Result Format Select bit 1 = Right justified. Six Most Significant bits of ADRESH are set to ‘0’ when the conversion result is loaded. 0 = Left justified. Six Least Significant bits of ADRESL are set to ‘0’ when the conversion result is loaded. bit 6-4 ADCS<2:0>: ADC Conversion Clock Select bits 111 = FRC (clock supplied from an internal RC oscillator) 110 = FOSC/64 101 = FOSC/16 100 = FOSC/4 011 = FRC (clock supplied from an internal RC oscillator) 010 = FOSC/32 001 = FOSC/8 000 = FOSC/2 bit 3-2 Unimplemented: Read as ‘0’ bit 1-0 ADPREF<1:0>: ADC Positive Voltage Reference Configuration bits 11 = VRPOS is connected to internal Fixed Voltage Reference (FVR) 10 = VRPOS is connected to external VREF+ pin(1) 01 = Reserved 00 = VRPOS is connected to VDD Note 1: When selecting the VREF+ pin as the source of the positive reference, be aware that a minimum voltage specification exists. See SectionTABLE 28-13: “Analog-to-Digital Converter (ADC) Characteristics(1,2,3)” for details. 2014-2016 Microchip Technology Inc. DS40001737B-page 163 PIC12(L)F1612/16(L)F1613 REGISTER 16-3: R/W-0/0 ADCON2: ADC CONTROL REGISTER 2 R/W-0/0 R/W-0/0 R/W-0/0 TRIGSEL<3:0>(1) U-0 U-0 U-0 U-0 — — — — bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-4 TRIGSEL<3:0>: Auto-Conversion Trigger Selection bits(1) 1111 = SMT2_PR 1110 = SMT1_PR 1101 = TMR6_postscaled 1100 = TMR4_postscaled 1011 = SMT2_CPR 1010 = SMT2_CPW 1001 = SMT1_CPR 1000 = SMT1_CPW 0111 = C2_OUT_sync(3) 0110 = C1_OUT_sync 0101 = TMR2_postscaled 0100 = T1_overflow(2) 0011 = T0_overflow(2) 0010 = CCP2_out 0001 = CCP1_out 0000 = No auto-conversion trigger selected bit 3-0 Unimplemented: Read as ‘0’ Note 1: 2: 3: This is a rising edge sensitive input for all sources. Signal also sets its corresponding interrupt flag. PIC16(L)F1613 only. Reserved on PIC12(L)F1612. 2014-2016 Microchip Technology Inc. DS40001737B-page 164 PIC12(L)F1612/16(L)F1613 REGISTER 16-4: R/W-x/u ADRESH: ADC RESULT REGISTER HIGH (ADRESH) ADFM = 0 R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u ADRES<9:2> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-0 ADRES<9:2>: ADC Result Register bits Upper eight bits of 10-bit conversion result REGISTER 16-5: R/W-x/u ADRESL: ADC RESULT REGISTER LOW (ADRESL) ADFM = 0 R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u — — — — — — ADRES<1:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-6 ADRES<1:0>: ADC Result Register bits Lower two bits of 10-bit conversion result bit 5-0 Reserved: Do not use. 2014-2016 Microchip Technology Inc. DS40001737B-page 165 PIC12(L)F1612/16(L)F1613 REGISTER 16-6: ADRESH: ADC RESULT REGISTER HIGH (ADRESH) ADFM = 1 R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u — — — — — — R/W-x/u R/W-x/u ADRES<9:8> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-2 Reserved: Do not use. bit 1-0 ADRES<9:8>: ADC Result Register bits Upper two bits of 10-bit conversion result REGISTER 16-7: R/W-x/u ADRESL: ADC RESULT REGISTER LOW (ADRESL) ADFM = 1 R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u ADRES<7:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-0 ADRES<7:0>: ADC Result Register bits Lower eight bits of 10-bit conversion result 2014-2016 Microchip Technology Inc. DS40001737B-page 166 PIC12(L)F1612/16(L)F1613 16.4 ADC Acquisition Requirements For the ADC to meet its specified accuracy, the charge holding capacitor (CHOLD) must be allowed to fully charge to the input channel voltage level. The Analog Input model is shown in Figure 16-4. The source impedance (RS) and the internal sampling switch (RSS) impedance directly affect the time required to charge the capacitor CHOLD. The sampling switch (RSS) impedance varies over the device voltage (VDD), refer to Figure 16-4. The maximum recommended impedance for analog sources is 10 k. As the EQUATION 16-1: Assumptions: source impedance is decreased, the acquisition time may be decreased. After the analog input channel is selected (or changed), an ADC acquisition must be done before the conversion can be started. To calculate the minimum acquisition time, Equation 16-1 may be used. This equation assumes that 1/2 LSb error is used (1,024 steps for the ADC). The 1/2 LSb error is the maximum error allowed for the ADC to meet its specified resolution. ACQUISITION TIME EXAMPLE Temperature = 50°C and external impedance of 10k 5.0V V DD T ACQ = Amplifier Settling Time + Hold Capacitor Charging Time + Temperature Coefficient = T AMP + T C + T COFF = 2µs + T C + Temperature - 25°C 0.05µs/°C The value for TC can be approximated with the following equations: 1 = V CHOLD V AP P LI ED 1 – -------------------------n+1 2 –1 ;[1] VCHOLD charged to within 1/2 lsb –TC ---------- RC V AP P LI ED 1 – e = V CHOLD ;[2] VCHOLD charge response to VAPPLIED – Tc --------- 1 RC ;combining [1] and [2] V AP P LI ED 1 – e = V A PP LIE D 1 – -------------------------n+1 2 –1 Note: Where n = number of bits of the ADC. Solving for TC: T C = – C HOLD R IC + R SS + R S ln(1/2047) = – 12.5pF 1k + 7k + 10k ln(0.0004885) = 1.12 µs Therefore: T A CQ = 2µs + 1.12 µs + 50°C- 25°C 0.05 µs/°C = 4.37µs Note 1: The reference voltage (VRPOS) has no effect on the equation, since it cancels itself out. 2: The charge holding capacitor (CHOLD) is not discharged after each conversion. 3: The maximum recommended impedance for analog sources is 10 k. This is required to meet the pin leakage specification. 2014-2016 Microchip Technology Inc. DS40001737B-page 167 PIC12(L)F1612/16(L)F1613 FIGURE 16-4: ANALOG INPUT MODEL Rev. 10-000070A 8/2/2013 VDD RS Analog Input pin VT § 0.6V RIC 1K Sampling switch SS RSS ILEAKAGE(1) VA Legend: CHOLD CPIN ILEAKAGE RIC RSS SS VT Note 1: FIGURE 16-5: CPIN 5pF CHOLD = 10 pF VT § 0.6V Ref- = Sample/Hold Capacitance = Input Capacitance = Leakage Current at the pin due to varies injunctions = Interconnect Resistance = Resistance of Sampling switch = Sampling Switch = Threshold Voltage VDD 6V 5V 4V 3V 2V RSS 5 6 7 8 9 10 11 Sampling Switch (k ) Refer to Section28.0 “Electrical Specifications”. ADC TRANSFER FUNCTION Full-Scale Range 3FFh 3FEh ADC Output Code 3FDh 3FCh 3FBh 03h 02h 01h 00h Analog Input Voltage 0.5 LSB Ref- 2014-2016 Microchip Technology Inc. Zero-Scale Transition 1.5 LSB Full-Scale Transition Ref+ DS40001737B-page 168 PIC12(L)F1612/16(L)F1613 TABLE 16-3: Name SUMMARY OF REGISTERS ASSOCIATED WITH ADC Bit 7 ADCON0 — ADCON1 ADFM Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 CHS<4:0> ADCS<2:0> ADCON2 — TRIGSEL<4:0> Bit 1 Bit 0 Register on Page GO/DONE ADON 162 — ADPREF<1:0> 163 — — 164 — ADRESH ADC Result Register High 165, 166 ADRESL ADC Result Register Low 165, 166 ANSELA — — — ANSA4 — ANSA2 ANSA1 ANSA0 136 ANSELC(2) — — — — ANSC3 ANSC2 ANSC1 ANSC0 143 INTCON GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF 82 PIE1 TMR1GIE ADIE RCIE TXIE SSP1IE CCP1IE TMR2IE TMR1IE 83 PIR1 TMR1GIF ADIF RCIF TXIF SSP1IF CCP1IF TMR2IF TMR1IF 87 — — TRISA5 TRISA4 —(1) TRISA2 TRISA1 TRISA0 135 TRISC3 TRISC2 TRISC1 TRISC0 142 TRISA TRISC(2) — — TRISC5 TRISC4 FVRCON FVREN FVRRDY TSEN TSRNG Legend: Note 1: 2: CDAFVR<1:0> ADFVR<1:0> 153 x = unknown, u = unchanged, — = unimplemented read as ‘0’, q = value depends on condition. Shaded cells are not used for ADC module. Unimplemented, read as ‘1’. PIC16(L)F1613 only. 2014-2016 Microchip Technology Inc. DS40001737B-page 169 PIC12(L)F1612/16(L)F1613 17.0 8-BIT DIGITAL-TO-ANALOG CONVERTER (DAC1) MODULE The Digital-to-Analog Converter supplies a variable voltage reference, ratiometric with the input source, with 256 selectable output levels. 17.1 Output Voltage Selection The DAC has 256 voltage level ranges. The 256 levels are set with the DAC1R<7:0> bits of the DAC1CON1 register. The DAC output voltage is determined by Equation 17-1: The input of the DAC can be connected to: • External VREF pins • VDD supply voltage • FVR (Fixed Voltage Reference) The output of the DAC can be configured to supply a reference voltage to the following: • Comparator positive input • ADC input channel • DACXOUT1 pin The Digital-to-Analog Converter (DAC) is enabled by setting the DAC1EN bit of the DAC1CON0 register. EQUATION 17-1: DAC OUTPUT VOLTAGE IF DAC1EN = 1 DAC1R 7:0 VOUT = VSOURCE+ – VSOURCE- -------------------------------- + VSOURCE8 2 VSOURCE+ = VDD, VREF, or FVR BUFFER 2 VSOURCE- = VSS 17.2 Ratiometric Output Level The DAC output value is derived using a resistor ladder with each end of the ladder tied to a positive and negative voltage reference input source. If the voltage of either input source fluctuates, a similar fluctuation will result in the DAC output value. The value of the individual resistors within the ladder can be found in Section28.0 “Electrical Specifications”. 17.3 DAC Voltage Reference Output The DAC voltage can be output to the DACxOUT1 pin by setting the DAC1OE1 bit of the DAC1CON0 register. Selecting the DAC reference voltage for output on the DACXOUT1 pin automatically overrides the digital output buffer and digital input threshold detector functions of that pin. Reading the DACXOUT1 pin when it has been configured for DAC reference voltage output will always return a ‘0’. Due to the limited current drive capability, a buffer must be used on the DAC voltage reference output for external connections to either DACXOUT1 pin. Figure 17-2 shows an example buffering technique. 2014-2016 Microchip Technology Inc. DS40001737B-page 170 PIC12(L)F1612/16(L)F1613 FIGURE 17-1: DIGITAL-TO-ANALOG CONVERTER BLOCK DIAGRAM Rev. 10-000 026C 12/11/201 3 VDD 00 01 VREF+ FVR_buffer2 10 Reserved 11 VSOURCE+ DACR<7:0> 8 R DACPSS R DACEN R 32-to-1 MUX R 32 Steps DACx_output To Peripherals R DACxOUT1 (1) R DACOE1 R VSOURCE- VSS Note 1: The unbuffered DACx_output is provided on the DACxOUT pin(s). FIGURE 17-2: VOLTAGE REFERENCE OUTPUT BUFFER EXAMPLE PIC® MCU DAC Module R Voltage Reference Output Impedance 2014-2016 Microchip Technology Inc. DACXOUT1 + – Buffered DAC Output DS40001737B-page 171 PIC12(L)F1612/16(L)F1613 17.4 Operation During Sleep When the device wakes up from Sleep through an interrupt or a Watchdog Timer time-out, the contents of the DAC1CON0 register are not affected. To minimize current consumption in Sleep mode, the voltage reference should be disabled. 17.5 Effects of a Reset A device Reset affects the following: • DAC is disabled. • DAC output voltage is removed from the DACXOUT1 pin. • The DAC1R<7:0> range select bits are cleared. 2014-2016 Microchip Technology Inc. DS40001737B-page 172 PIC12(L)F1612/16(L)F1613 17.6 Register Definitions: DAC Control REGISTER 17-1: DAC1CON0: DAC1 CONTROL REGISTER 0 R/W-0/0 U-0 R/W-0/0 U-0 DAC1EN — DAC1OE1 — R/W-0/0 R/W-0/0 DAC1PSS<1:0> U-0 U-0 — — bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7 DAC1EN: DAC1 Enable bit 1 = DAC is enabled 0 = DAC is disabled bit 6 Unimplemented: Read as ‘0’ bit 5 DAC1OE1: DAC1 Voltage Output 1 Enable bit 1 = DAC voltage level is also an output on the DACxOUT1 pin 0 = DAC voltage level is disconnected from the DACxOUT1 pin bit 4 Unimplemented: Read as ‘0’ bit 3-2 DAC1PSS<1:0>: DAC1 Positive Source Select bits 11 = Reserved, do not use 10 = FVR Buffer2 output 01 = VREF+ pin 00 = VDD bit 1-0 Unimplemented: Read as ‘0’ REGISTER 17-2: R/W-0/0 DAC1CON1: DAC1 CONTROL REGISTER 1 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 DAC1R<7:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-0 DAC1R<7:0>: DAC1 Voltage Output Select bits TABLE 17-1: Name FVRCON DAC1CON0 SUMMARY OF REGISTERS ASSOCIATED WITH THE DAC1 MODULE Bit 7 Bit 6 Bit 5 Bit 4 FVREN DAC1EN FVRRDY TSEN TSRNG CDAFVR<1:0> — DAC1OE1 — DAC1PSS<1:0> DAC1CON1 Legend: Bit 3 Bit 2 Bit 1 Bit 0 ADFVR<1:0> — DAC1R<7:0> — Register on page 153 173 173 — = Unimplemented location, read as ‘0’. Shaded cells are not used with the DAC module. 2014-2016 Microchip Technology Inc. DS40001737B-page 173 PIC12(L)F1612/16(L)F1613 18.0 COMPARATOR MODULE FIGURE 18-1: Comparators are used to interface analog circuits to a digital circuit by comparing two analog voltages and providing a digital indication of their relative magnitudes. Comparators are very useful mixed signal building blocks because they provide analog functionality independent of program execution. The analog comparator module includes the following features: • • • • • • • • • Independent comparator control Programmable input selection Comparator output is available internally/externally Programmable output polarity Interrupt-on-change Wake-up from Sleep Programmable Speed/Power optimization PWM shutdown Programmable and Fixed Voltage Reference 18.1 Comparator Overview SINGLE COMPARATOR VIN+ + VIN- – Output VINVIN+ Output Note: The black areas of the output of the comparator represents the uncertainty due to input offsets and response time. A single comparator is shown in Figure 18-1 along with the relationship between the analog input levels and the digital output. When the analog voltage at VIN+ is less than the analog voltage at VIN-, the output of the comparator is a digital low level. When the analog voltage at VIN+ is greater than the analog voltage at VIN-, the output of the comparator is a digital high level. The comparators available for this device are located in Table 18-1. TABLE 18-1: COMPARATOR AVAILABILITY PER DEVICE Device C1 C2 PIC16(L)F1613 ● ● PIC12(L)F1612 ● 2014-2016 Microchip Technology Inc. DS40001737B-page 174 PIC12(L)F1612/16(L)F1613 FIGURE 18-2: COMPARATOR MODULE SIMPLIFIED BLOCK DIAGRAM Rev. 10-000027E 6/18/2014 CxNCH<2:0> 3 CxON(1) CxIN0- 000 CxIN1- 001 CxIN2- 010 CxIN3- 011 Reserved 100 Reserved 101 FVR_buffer2 110 CxON(1) CxVN Interrupt Rising Edge CxINTP Interrupt Falling Edge CxINTN set bit CxIF - D CxOUT Q MCxOUT Cx CxVP 111 + Q1 CxSP CxHYS CxPOL CxOUT_sync CxIN+ 00 DAC_output 01 FVR_buffer2 10 CxSYNC CxOE 0 Note 1: 2 TRIS bit CxOUT D 11 CxPCH<1:0> to peripherals CxON(1) Q 1 (From Timer1 Module) T1CLK When CxON = 0, all multiplexer inputs are disconnected and the Comparator will produce a ‘0’ at the output. 2014-2016 Microchip Technology Inc. DS40001737B-page 175 PIC12(L)F1612/16(L)F1613 18.2 Comparator Control Each comparator has two control registers: CMxCON0 and CMxCON1. The CMxCON0 registers (see Register 18-1) contain Control and Status bits for the following: • • • • • • Enable Output selection Output polarity Speed/Power selection Hysteresis enable Output synchronization The CMxCON1 registers (see Register 18-2) contain Control bits for the following: • • • • Interrupt enable Interrupt edge polarity Positive input channel selection Negative input channel selection 18.2.1 COMPARATOR ENABLE Setting the CxON bit of the CMxCON0 register enables the comparator for operation. Clearing the CxON bit disables the comparator resulting in minimum current consumption. 18.2.2 COMPARATOR OUTPUT SELECTION 18.2.3 COMPARATOR OUTPUT POLARITY Inverting the output of the comparator is functionally equivalent to swapping the comparator inputs. The polarity of the comparator output can be inverted by setting the CxPOL bit of the CMxCON0 register. Clearing the CxPOL bit results in a non-inverted output. Table 18-2 shows the output state versus input conditions, including polarity control. TABLE 18-2: COMPARATOR OUTPUT STATE VS. INPUT CONDITIONS Input Condition CxPOL CxOUT CxVN > CxVP 0 0 CxVN < CxVP 0 1 CxVN > CxVP 1 1 CxVN < CxVP 1 0 18.2.4 COMPARATOR SPEED/POWER SELECTION The trade-off between speed or power can be optimized during program execution with the CxSP control bit. The default state for this bit is ‘1’ which selects the Normal Speed mode. Device power consumption can be optimized at the cost of slower comparator propagation delay by clearing the CxSP bit to ‘0’. The output of the comparator can be monitored by reading either the CxOUT bit of the CMxCON0 register or the MCxOUT bit of the CMOUT register. In order to make the output available for an external connection, the following conditions must be true: • CxOE bit of the CMxCON0 register must be set • Corresponding TRIS bit must be cleared • CxON bit of the CMxCON0 register must be set Note 1: The CxOE bit of the CMxCON0 register overrides the PORT data latch. Setting the CxON bit of the CMxCON0 register has no impact on the port override. 2: The internal output of the comparator is latched with each instruction cycle. Unless otherwise specified, external outputs are not latched. 2014-2016 Microchip Technology Inc. DS40001737B-page 176 PIC12(L)F1612/16(L)F1613 18.3 Comparator Hysteresis A selectable amount of separation voltage can be added to the input pins of each comparator to provide a hysteresis function to the overall operation. Hysteresis is enabled by setting the CxHYS bit of the CMxCON0 register. See Section28.0 “Electrical more information. 18.4 Specifications” Timer1 Gate Operation It is recommended that the comparator output be synchronized to Timer1. This ensures that Timer1 does not increment while a change in the comparator is occurring. COMPARATOR OUTPUT SYNCHRONIZATION The output from a comparator can be synchronized with Timer1 by setting the CxSYNC bit of the CMxCON0 register. Once enabled, the comparator output is latched on the falling edge of the Timer1 source clock. If a prescaler is used with Timer1, the comparator output is latched after the prescaling function. To prevent a race condition, the comparator output is latched on the falling edge of the Timer1 clock source and Timer1 increments on the rising edge of its clock source. See the Comparator Block Diagram (Figure 18-2) and the Timer1 Block Diagram (Figure 21-1) for more information. 18.5 Note: for The output resulting from a comparator operation can be used as a source for gate control of Timer1. See Section21.5 “Timer1 Gate” for more information. This feature is useful for timing the duration or interval of an analog event. 18.4.1 The associated interrupt flag bit, CxIF bit of the PIR2 register, must be cleared in software. If another edge is detected while this flag is being cleared, the flag will still be set at the end of the sequence. Comparator Interrupt An interrupt can be generated upon a change in the output value of the comparator for each comparator, a rising edge detector and a falling edge detector are present. When either edge detector is triggered and its associated enable bit is set (CxINTP and/or CxINTN bits of the CMxCON1 register), the Corresponding Interrupt Flag bit (CxIF bit of the PIR2 register) will be set. To enable the interrupt, you must set the following bits: • CxON, CxPOL and CxSP bits of the CMxCON0 register • CxIE bit of the PIE2 register • CxINTP bit of the CMxCON1 register (for a rising edge detection) • CxINTN bit of the CMxCON1 register (for a falling edge detection) • PEIE and GIE bits of the INTCON register 2014-2016 Microchip Technology Inc. 18.6 Although a comparator is disabled, an interrupt can be generated by changing the output polarity with the CxPOL bit of the CMxCON0 register, or by switching the comparator on or off with the CxON bit of the CMxCON0 register. Comparator Positive Input Selection Configuring the CxPCH<1:0> bits of the CMxCON1 register directs an internal voltage reference or an analog pin to the non-inverting input of the comparator: • • • • CxIN+ analog pin DAC output FVR (Fixed Voltage Reference) VSS (Ground) See Section14.0 “Fixed Voltage Reference (FVR)” for more information on the Fixed Voltage Reference module. See Section17.0 “8-bit Digital-to-Analog Converter (DAC1) Module” for more information on the DAC input signal. Any time the comparator is disabled (CxON = 0), all comparator inputs are disabled. 18.7 Comparator Negative Input Selection The CxNCH<2:0> bits of the CMxCON1 register direct an analog input pin or analog ground to the inverting input of the comparator: • • • • • • CxIN0- pin CxIN1- pin CxIN2- pin CxIN3- pin Analog Ground FVR_buffer2 Some inverting input selections share a pin with the operational amplifier output function. Enabling both functions at the same time will direct the operational amplifier output to the comparator inverting input. Note: To use CxINy+ and CxINy- pins as analog input, the appropriate bits must be set in the ANSEL register and the corresponding TRIS bits must also be set to disable the output drivers. DS40001737B-page 177 PIC12(L)F1612/16(L)F1613 18.8 Comparator Response Time The comparator output is indeterminate for a period of time after the change of an input source or the selection of a new reference voltage. This period is referred to as the response time. The response time of the comparator differs from the settling time of the voltage reference. Therefore, both of these times must be considered when determining the total response time to a comparator input change. See the Comparator and Voltage Reference Specifications in Section28.0 “Electrical Specifications” for more details. 18.9 A maximum source impedance of 10 k is recommended for the analog sources. Also, any external component connected to an analog input pin, such as a capacitor or a Zener diode, should have very little leakage current to minimize inaccuracies introduced. Note 1: When reading a PORT register, all pins configured as analog inputs will read as a ‘0’. Pins configured as digital inputs will convert as an analog input, according to the input specification. 2: Analog levels on any pin defined as a digital input, may cause the input buffer to consume more current than is specified. Analog Input Connection Considerations A simplified circuit for an analog input is shown in Figure 18-3. Since the analog input pins share their connection with a digital input, they have reverse biased ESD protection diodes to VDD and VSS. The analog input, therefore, must be between VSS and VDD. If the input voltage deviates from this range by more than 0.6V in either direction, one of the diodes is forward biased and a latch-up may occur. FIGURE 18-3: ANALOG INPUT MODEL Rev. 10-000071A 8/2/2013 VDD RS < 10K Analog Input pin VT § 0.6V RIC To Comparator ILEAKAGE(1) CPIN 5pF VA VT § 0.6V VSS Legend: CPIN ILEAKAGE RIC RS VA VT Note 1: = Input Capacitance = Leakage Current at the pin due to various junctions = Interconnect Resistance = Source Impedance = Analog Voltage = Threshold Voltage See Section28.0 “Electrical Specifications”. 2014-2016 Microchip Technology Inc. DS40001737B-page 178 PIC12(L)F1612/16(L)F1613 18.10 Register Definitions: Comparator Control REGISTER 18-1: CMxCON0: COMPARATOR Cx CONTROL REGISTER 0 R/W-0/0 R-0/0 U/U-0/0 R/W-0/0 U-0 R/W-1/1 R/W-0/0 R/W-0/0 CxON CxOUT — CxPOL — CxSP CxHYS CxSYNC bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7 CxON: Comparator Enable bit 1 = Comparator is enabled 0 = Comparator is disabled and consumes no active power bit 6 CxOUT: Comparator Output bit If CxPOL = 1 (inverted polarity): 1 = CxVP < CxVN 0 = CxVP > CxVN If CxPOL = 0 (non-inverted polarity): 1 = CxVP > CxVN 0 = CxVP < CxVN bit 5 Unimplemented: Read as ‘0’ bit 4 CxPOL: Comparator Output Polarity Select bit 1 = Comparator output is inverted 0 = Comparator output is not inverted bit 3 Unimplemented: Read as ‘0’ bit 2 CxSP: Comparator Speed/Power Select bit 1 = Comparator operates in normal power, higher speed mode 0 = Comparator operates in Low-power, Low-speed mode bit 1 CxHYS: Comparator Hysteresis Enable bit 1 = Comparator hysteresis enabled 0 = Comparator hysteresis disabled bit 0 CxSYNC: Comparator Output Synchronous Mode bit 1 = Comparator output to Timer1 and I/O pin is synchronous to changes on Timer1 clock source. Output updated on the falling edge of Timer1 clock source. 0 = Comparator output to Timer1 and I/O pin is asynchronous 2014-2016 Microchip Technology Inc. DS40001737B-page 179 PIC12(L)F1612/16(L)F1613 REGISTER 18-2: CMxCON1: COMPARATOR Cx CONTROL REGISTER 1 R/W-0/0 R/W-0/0 CxINTP CxINTN R/W-0/0 R/W-0/0 CxPCH<1:0> R/W-0/0 R/W-0/0 — R/W-0/0 R/W-0/0 CxNCH<2:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7 CxINTP: Comparator Interrupt on Positive Going Edge Enable bits 1 = The CxIF interrupt flag will be set upon a positive going edge of the CxOUT bit 0 = No interrupt flag will be set on a positive going edge of the CxOUT bit bit 6 CxINTN: Comparator Interrupt on Negative Going Edge Enable bits 1 = The CxIF interrupt flag will be set upon a negative going edge of the CxOUT bit 0 = No interrupt flag will be set on a negative going edge of the CxOUT bit bit 5-4 CxPCH<1:0>: Comparator Positive Input Channel Select bits 11 = CxVP connects to AGND 10 = CxVP connects to FVR Buffer 2 01 = CxVP connects to VDAC 00 = CxVP connects to CxIN+ pin bit 3 Unimplemented: Read as ‘0’ bit 2-0 CxNCH<2:0>: Comparator Negative Input Channel Select bits 111 = CxVN connects to AGND 110 = CxVN connects to FVR Buffer 2 101 = Reserved 100 = Reserved 011 = CxVN connects to CxIN3- pin(1) 010 = CxVN connects to CxIN2- pin(1) 001 = CxVN connects to CxIN1- pin 000 = CxVN connects to CxIN0- pin Note 1: PIC16(L)F1613 only. REGISTER 18-3: U-0 CMOUT: COMPARATOR OUTPUT REGISTER U-0 — U-0 — — U-0 — U-0 — U-0 R-0/0 R-0/0 — MC2OUT(1) MC1OUT bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-2 Unimplemented: Read as ‘0’ bit 1 MC2OUT: Mirror Copy of C2OUT bit(1) bit 0 MC1OUT: Mirror Copy of C1OUT bit Note 1: PIC16(L)F1613 only. 2014-2016 Microchip Technology Inc. DS40001737B-page 180 PIC12(L)F1612/16(L)F1613 TABLE 18-3: Name ANSELA SUMMARY OF REGISTERS ASSOCIATED WITH COMPARATOR MODULE Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register on Page — — — ANSA4 — ANSA2 ANSA1 ANSA0 136 — C1POL — C1SP C1HYS C1SYNC 179 CM1CON0 C1ON C1OUT CM1CON1 C1INTP C1INTN CM2CON0(2) C2ON C2OUT CM2CON1(2) C2INTP C2INTN C1PCH<1:0> C2OE C2POL C2PCH<1:0> — — C1NCH<2:0> C2SP — CMOUT — — — — FVREN FVRRDY TSEN TSRNG CDAFVR<1:0> DAC1EN — DAC1OE1 — DAC1PSS<1:0> DAC1CON0 DAC1CON1 180 C2SYNC C2NCH<2:0> FVRCON — C2HYS — (2) MC2OUT 180 MC1OUT ADFVR<1:0> — 179 — DAC1R<7:0> 180 153 173 173 GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF PIE2 OSFIE C2IE C1IE — BCL1IE TMR6IE TMR4IE CCP2IE 84 PIR2 OSFIF C2IF C1IF — BCL1IF TMR6IF TMR4IF CCP2IF 88 — — TRISA5 TRISA4 —(1) TRISA2 TRISA1 TRISA0 135 TRISC7(2) TRISC6(2) TRISC5 TRISC4 TRISC3 TRISC2 TRISC1 TRISC0 142 INTCON TRISA TRISC(2) Legend: Note 1: 2: 82 — = unimplemented location, read as ‘0’. Shaded cells are unused by the comparator module. Unimplemented, read as ‘1’. PIC16(L)F1613 only. 2014-2016 Microchip Technology Inc. DS40001737B-page 181 PIC12(L)F1612/16(L)F1613 19.0 ZERO-CROSS DETECTION (ZCD) MODULE The ZCD module detects when an A/C signal crosses through the ground potential. The actual zero crossing threshold is the zero crossing reference voltage, VCPINV, which is typically 0.75V above ground. The connection to the signal to be detected is through a series current limiting resistor. The module applies a current source or sink to the ZCD pin to maintain a constant voltage on the pin, thereby preventing the pin voltage from forward biasing the ESD protection diodes. When the applied voltage is greater than the reference voltage, the module sinks current. When the applied voltage is less than the reference voltage, the module sources current. The current source and sink action keeps the pin voltage constant over the full range of the applied voltage. The ZCD module is shown in the simplified block diagram Figure 19-2. 19.1 External Resistor Selection The ZCD module requires a current limiting resistor in series with the external voltage source. The impedance and rating of this resistor depends on the external source peak voltage. Select a resistor value that will drop all of the peak voltage when the current through the resistor is nominally 300 A. Refer to Equation 19-1 and Figure 19-1. Make sure that the ZCD I/O pin internal weak pull-up is disabled so it does not interfere with the current source and sink. EQUATION 19-1: EXTERNAL RESISTOR V PEAK R SERIES = ---------------–4 3 10 The ZCD module is useful when monitoring an A/C waveform for, but not limited to, the following purposes: • • • • A/C period measurement Accurate long term time measurement Dimmer phase delayed drive Low EMI cycle switching FIGURE 19-1: VPEAK EXTERNAL VOLTAGE VMAXPEAK VMINPEAK VCPINV 2014-2016 Microchip Technology Inc. DS40001737B-page 182 PIC12(L)F1612/16(L)F1613 FIGURE 19-2: SIMPLIFIED ZCD BLOCK DIAGRAM VPULLUP Rev. 10-000194B 5/14/2014 optional VDD RPULLUP - Zcpinv ZCDxIN RSERIES RPULLDOWN + External voltage source optional ZCDx_output D Q ZCDxPOL ZCDxOUT bit Q1 Interrupt det ZCDxINTP ZCDxINTN Set ZCDIF flag Interrupt det 2014-2016 Microchip Technology Inc. DS40001737B-page 183 PIC12(L)F1612/16(L)F1613 19.2 ZCD Logic Output The ZCD module includes a Status bit, which can be read to determine whether the current source or sink is active. The ZCDxOUT bit of the ZCDxCON register is set when the current sink is active, and cleared when the current source is active. The ZCDxOUT bit is affected by the polarity bit. 19.3 ZCD Logic Polarity The ZCDxPOL bit of the ZCDxCON register inverts the ZCDxOUT bit relative to the current source and sink output. When the ZCDxPOL bit is set, a ZCDxOUT high indicates that the current source is active, and a low output indicates that the current sink is active. The ZCDxPOL bit affects the ZCD interrupts. See Section19.4 “ZCD Interrupts”. 19.5 Correcting for VCPINV offset The actual voltage at which the ZCD switches is the reference voltage at the non-inverting input of the ZCD op amp. For external voltage source waveforms other than square waves, this voltage offset from zero causes the zero-cross event to occur either too early or too late. When the waveform is varying relative to VSS, then the zero cross is detected too early as the waveform falls and too late as the waveform rises. When the waveform is varying relative to VDD, then the zero cross is detected too late as the waveform rises and too early as the waveform falls. The actual offset time can be determined for sinusoidal waveforms with the corresponding equations shown in Equation 19-2. EQUATION 19-2: ZCD EVENT OFFSET When External Voltage Source is relative to Vss: 19.4 ZCD Interrupts An interrupt will be generated upon a change in the ZCD logic output when the appropriate interrupt enables are set. A rising edge detector and a falling edge detector are present in the ZCD for this purpose. The ZCDIF bit of the PIR3 register will be set when either edge detector is triggered and its associated enable bit is set. The ZCDxINTP enables rising edge interrupts and the ZCDxINTN bit enables falling edge interrupts. Both are located in the ZCDxCON register. To fully enable the interrupt, the following bits must be set: • ZCDIE bit of the PIE3 register • ZCDxINTP bit of the ZCDxCON register (for a rising edge detection) • ZCDxINTN bit of the ZCDxCON register (for a falling edge detection) • PEIE and GIE bits of the INTCON register Changing the ZCDxPOL bit will cause an interrupt, regardless of the level of the ZCDxEN bit. The ZCDIF bit of the PIR3 register must be cleared in software as part of the interrupt service. If another edge is detected while this flag is being cleared, the flag will still be set at the end of the sequence. T OFFSET Vcpinv asin ------------------ V PEAK = ---------------------------------2 Freq When External Voltage Source is relative to VDD: T OFFSET V DD – Vcpinv asin -------------------------------- V PEAK = ------------------------------------------------2 Freq This offset time can be compensated for by adding a pull-up or pull-down biasing resistor to the ZCD pin. A pull-up resistor is used when the external voltage source is varying relative to VSS. A pull-down resistor is used when the voltage is varying relative to VDD. The resistor adds a bias to the ZCD pin so that the target external voltage source must go to zero to pull the pin voltage to the VCPINV switching voltage. The pull-up or pull-down value can be determined with the equations shown in Equation 19-3 or Equation 19-4. EQUATION 19-3: ZCD PULL-UP/DOWN When External Signal is relative to Vss: R SERIE S V PULLUP – V cpinv R PULLUP = -----------------------------------------------------------------------V cpinv When External Signal is relative to VDD: R SERIES V cpinv R PULLDOWN = ------------------------------------------- V DD – V cpinv 2014-2016 Microchip Technology Inc. DS40001737B-page 184 PIC12(L)F1612/16(L)F1613 The pull-up and pull-down resistor values are significantly affected by small variations of VCPINV. Measuring VCPINV can be difficult, especially when the waveform is relative to VDD. However, by combining Equations 19-2 and 19-3, the resistor value can be determined from the time difference between the ZCDx_output high and low periods. Note that the time difference, ∆T, is 4*TOFFSET. The equation for determining the pull-up and pull-down resistor values from the high and low ZCDx_output periods is shown in Equation 19-4. The ZCDx_output signal can be directly observed on the ZCDxOUT pin by setting the ZCDxOE bit. EQUATION 19-4: V BI A S R = R SERIES ---------------------------------------------------------------- – 1 T V PE AK sin Freq ---------- 2 R is pull-up or pull-down resistor. VBIAS is VPULLUP when R is pull-up or VDD when R is pull-down. ∆T is the ZCDxOUT high and low period difference. 19.6 Handling VPEAK variations If the peak amplitude of the external voltage is expected to vary, the series resistor must be selected to keep the ZCD current source and sink below the design maximum range of ± 600 A and above a reasonable minimum range. A general rule of thumb is that the maximum peak voltage can be no more than six times the minimum peak voltage. To ensure that the maximum current does not exceed ± 600 A and the minimum is at least ± 100 A, compute the series resistance as shown in Equation 19-5. The compensating pull-up for this series resistance can be determined with Equation 19-3 because the pull-up value is independent from the peak voltage. EQUATION 19-5: SERIES R FOR V RANGE V MAXPEAK + V MINPEAK R SERIES = --------------------------------------------------------–4 7 10 19.7 Operation During Sleep The ZCD current sources and interrupts are unaffected by Sleep. 19.8 Effects of a Reset The ZCD circuit can be configured to default to the active or inactive state on Power-On-Reset (POR). When the ZCD Configuration bit is cleared, the ZCD circuit will be active at POR. When the ZCD Configuration bit is set, the ZCDxEN bit of the ZCDxCON register must be set to enable the ZCD module. 2014-2016 Microchip Technology Inc. DS40001737B-page 185 PIC12(L)F1612/16(L)F1613 19.9 Register Definitions: ZCD Control REGISTER 19-1: ZCDxCON: ZERO CROSS DETECTION CONTROL REGISTER R/W-q/q R/W-0/0 R-x/x R/W-0/0 U-0 U-0 R/W-0/0 R/W-0/0 ZCDxEN ZCDxOE ZCDxOUT ZCDxPOL — — ZCDxINTP ZCDxINTN bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared q = value depends on configuration bits bit 7 ZCDxEN: Zero-Cross Detection Enable bit 1 = Zero-cross detect is enabled. ZCD pin is forced to output to source and sink current. 0 = Zero-cross detect is disabled. ZCD pin operates according to TRIS controls. bit 6 ZCDxOE: Zero-Cross Detection Output Enable bit 1 = ZCD pin output is enabled 0 = ZCD pin output is disabled bit 5 ZCDxOUT: Zero-Cross Detection Logic Level bit ZCDxPOL bit = 0: 1 = ZCD pin is sinking current 0 = ZCD pin is sourcing current ZCDxPOL bit = 1: 1 = ZCD pin is sourcing current 0 = ZCD pin is sinking current bit 4 ZCDxPOL: Zero-Cross Detection Logic Output Polarity bit 1 = ZCD logic output is inverted 0 = ZCD logic output is not inverted bit 3-2 Unimplemented: Read as ‘0’ bit 1 ZCDxINTP: Zero-Cross Positive Edge Interrupt Enable bit 1 = ZCDIF bit is set on low-to-high ZCDx_output transition 0 = ZCDIF bit is unaffected by low-to-high ZCDx_output transition bit 0 ZCDxINTN: Zero-Cross Negative Edge Interrupt Enable bit 1 = ZCDIF bit is set on high-to-low ZCDx_output transition 0 = ZCDIF bit is unaffected by high-to-low ZCDx_output transition TABLE 19-1: Name PIE3 PIR3 ZCD1CON Legend: SUMMARY OF REGISTERS ASSOCIATED WITH THE ZCD MODULE Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register on page — — CWGIE ZCDIE — — — — 85 — — — — CWGIF ZCDIF — — ZCD1EN ZCD1OE ZCD1OUT ZCD1POL — — ZCD1INTP ZCD1INTN 89 186 — = unimplemented, read as ‘0’. Shaded cells are unused by the ZCD module. 2014-2016 Microchip Technology Inc. DS40001737B-page 186 PIC12(L)F1612/16(L)F1613 TABLE 19-2: Name CONFIG2 Legend: SUMMARY OF CONFIGURATION WORD WITH THE ZCD MODULE Bits Bit -/7 Bit -/6 Bit 13/5 Bit 12/4 Bit 11/3 Bit 10/2 Bit 9/1 Bit 8/0 Register on Page 13:8 — — LVP DEBUG LPBOR BORV STVREN PLLEN 53 7:0 ZCD — — — — — WRT<1:0> — = unimplemented location, read as ‘0’. Shaded cells are not used by the ZCD module. 2014-2016 Microchip Technology Inc. DS40001737B-page 187 PIC12(L)F1612/16(L)F1613 20.0 20.1.2 TIMER0 MODULE 8-BIT COUNTER MODE The Timer0 module is an 8-bit timer/counter with the following features: In 8-Bit Counter mode, the Timer0 module will increment on every rising or falling edge of the T0CKI pin. • • • • • • 8-Bit Counter mode using the T0CKI pin is selected by setting the TMR0CS bit in the OPTION_REG register to ‘1’. 8-bit timer/counter register (TMR0) 3-bit prescaler (independent of Watchdog Timer) Programmable internal or external clock source Programmable external clock edge selection Interrupt on overflow TMR0 can be used to gate Timer1 The rising or falling transition of the incrementing edge for either input source is determined by the TMR0SE bit in the OPTION_REG register. Figure 20-1 is a block diagram of the Timer0 module. 20.1 Timer0 Operation The Timer0 module can be used as either an 8-bit timer or an 8-bit counter. 20.1.1 8-BIT TIMER MODE The Timer0 module will increment every instruction cycle, if used without a prescaler. 8-bit Timer mode is selected by clearing the TMR0CS bit of the OPTION_REG register. When TMR0 is written, the increment is inhibited for two instruction cycles immediately following the write. Note: The value written to the TMR0 register can be adjusted, in order to account for the two instruction cycle delay when TMR0 is written. FIGURE 20-1: TIMER0 BLOCK DIAGRAM Rev. 10-000017A 8/5/2013 TMR0CS Fosc/4 T0CKI(1) PSA 0 1 TMR0SE 1 write to TMR0 Prescaler R 0 FOSC/2 T0CKI Sync Circuit PS<2:0> T0_overflow TMR0 Q1 set bit TMR0IF Note 1: The T0CKI prescale output frequency should not exceed FOSC/8. 2014-2016 Microchip Technology Inc. DS40001737B-page 188 PIC12(L)F1612/16(L)F1613 20.1.3 SOFTWARE PROGRAMMABLE PRESCALER A software programmable prescaler is available for exclusive use with Timer0. The prescaler is enabled by clearing the PSA bit of the OPTION_REG register. Note: The Watchdog Timer (WDT) uses its own independent prescaler. There are eight prescaler options for the Timer0 module ranging from 1:2 to 1:256. The prescale values are selectable via the PS<2:0> bits of the OPTION_REG register. In order to have a 1:1 prescaler value for the Timer0 module, the prescaler must be disabled by setting the PSA bit of the OPTION_REG register. The prescaler is not readable or writable. All instructions writing to the TMR0 register will clear the prescaler. 20.1.4 TIMER0 INTERRUPT Timer0 will generate an interrupt when the TMR0 register overflows from FFh to 00h. The TMR0IF interrupt flag bit of the INTCON register is set every time the TMR0 register overflows, regardless of whether or not the Timer0 interrupt is enabled. The TMR0IF bit can only be cleared in software. The Timer0 interrupt enable is the TMR0IE bit of the INTCON register. Note: 20.1.5 The Timer0 interrupt cannot wake the processor from Sleep since the timer is frozen during Sleep. 8-BIT COUNTER MODE SYNCHRONIZATION When in 8-Bit Counter mode, the incrementing edge on the T0CKI pin must be synchronized to the instruction clock. Synchronization can be accomplished by sampling the prescaler output on the Q2 and Q4 cycles of the instruction clock. The high and low periods of the external clocking source must meet the timing requirements as shown in Section28.0 “Electrical Specifications”. 20.1.6 OPERATION DURING SLEEP Timer0 cannot operate while the processor is in Sleep mode. The contents of the TMR0 register will remain unchanged while the processor is in Sleep mode. 2014-2016 Microchip Technology Inc. DS40001737B-page 189 PIC12(L)F1612/16(L)F1613 20.2 Register Definitions: Option Register REGISTER 20-1: OPTION_REG: OPTION REGISTER R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 WPUEN INTEDG TMR0CS TMR0SE PSA R/W-1/1 R/W-1/1 R/W-1/1 PS<2:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7 WPUEN: Weak Pull-Up Enable bit 1 = All weak pull-ups are disabled (except MCLR, if it is enabled) 0 = Weak pull-ups are enabled by individual WPUx latch values bit 6 INTEDG: Interrupt Edge Select bit 1 = Interrupt on rising edge of INT pin 0 = Interrupt on falling edge of INT pin bit 5 TMR0CS: Timer0 Clock Source Select bit 1 = Transition on T0CKI pin 0 = Internal instruction cycle clock (FOSC/4) bit 4 TMR0SE: Timer0 Source Edge Select bit 1 = Increment on high-to-low transition on T0CKI pin 0 = Increment on low-to-high transition on T0CKI pin bit 3 PSA: Prescaler Assignment bit 1 = Prescaler is not assigned to the Timer0 module 0 = Prescaler is assigned to the Timer0 module bit 2-0 PS<2:0>: Prescaler Rate Select bits Bit Value 001 1:2 1:4 010 1:8 011 1 : 16 100 1 : 32 101 110 1 : 64 111 1 : 256 000 TABLE 20-1: Name Bit 7 OPTION_REG Legend: * Note 1: Bit 6 Bit 5 Bit 4 TRIGSEL<3:0> INTCON TRISA 1 : 128 SUMMARY OF REGISTERS ASSOCIATED WITH TIMER0 ADCON2 TMR0 Timer0 Rate Bit 3 Bit 2 Bit 1 Bit 0 Register on Page — — — — 164 TMR0IF INTF IOCIF GIE PEIE TMR0IE INTE IOCIE WPUEN INTEDG TMR0CS TMR0SE PSA PS<2:0> Holding Register for the 8-bit Timer0 Count — — TRISA5 TRISA4 82 190 188* —(1) TRISA2 TRISA1 TRISA0 135 — = Unimplemented location, read as ‘0’. Shaded cells are not used by the Timer0 module. Page provides register information. Unimplemented, read as ‘1’. 2014-2016 Microchip Technology Inc. DS40001737B-page 190 PIC12(L)F1612/16(L)F1613 21.0 TIMER1/3/5 MODULE WITH GATE CONTROL The Timer1/3/5 modules are a 16-bit timers/counters with the following features: • • • • • • • • • • • • • 16-bit timer/counter register pair (TMR1H:TMR1L) Programmable internal or external clock source 2-bit prescaler Optionally synchronized comparator out Multiple Timer1 gate (count enable) sources Interrupt on overflow Wake-up on overflow (external clock, Asynchronous mode only) ADC Auto-Conversion Trigger(s) Selectable Gate Source Polarity Gate Toggle mode Gate Single-Pulse mode Gate Value Status Gate Event Interrupt Figure 21-1 is a block diagram of the Timer1 module. Note: Three identical Timer1 modules are implemented on this device. The timers are named Timer1, Timer3, and Timer5. All references to Timer1 apply as well to Timer3 and Timer5, as well as references to their associated registers. 2014-2016 Microchip Technology Inc. DS40001737B-page 191 PIC12(L)F1612/16(L)F1613 FIGURE 21-1: TIMER1 BLOCK DIAGRAM T1GSS<1:0> Rev. 10-000 018E 12/19/201 3 T1GSPM T1G 00 T0_overflow 01 C1OUT_sync 10 0 C2OUT_sync(4) 11 1 D 1 Single Pulse Acq. Control D 0 Q T1GVAL Q1 Q T1GGO/DONE T1GPOL CK Q Interrupt TMR1ON R set bit TMR1GIF det T1GTM TMR1GE set flag bit TMR1IF TMR1ON EN (2) T1_overflow TMR1 TMR1H TMR1L Q Synchronized Clock Input 0 D 1 T1CLK T1SYNC TMR1CS<1:0> LFINTOSC (1) Fosc Internal Clock Fosc/4 Internal Clock Note 1: 2: 3: 4: 11 10 T1CKI 01 00 Prescaler 1,2,4,8 Synchronize(3) det 2 T1CKPS<1:0> Fosc/2 Internal Clock Sleep Input ST Buffer is high speed type when using T1CKI. Timer1 register increments on rising edge. Synchronize does not operate while in Sleep. PIC16(L)F1613 only 2014-2016 Microchip Technology Inc. DS40001737B-page 192 PIC12(L)F1612/16(L)F1613 21.1 Timer1 Operation 21.2 The Timer1 module is a 16-bit incrementing counter which is accessed through the TMR1H:TMR1L register pair. Writes to TMR1H or TMR1L directly update the counter. When used with an internal clock source, the module is a timer and increments on every instruction cycle. When used with an external clock source, the module can be used as either a timer or counter and increments on every selected edge of the external source. Timer1 is enabled by configuring the TMR1ON and TMR1GE bits in the T1CON and T1GCON registers, respectively. Table 21-1 displays the Timer1 enable selections. TABLE 21-1: TIMER1 ENABLE SELECTIONS Clock Source Selection The TMR1CS<1:0> bits of the T1CON register are used to select the clock source for Timer1. Table 21-2 displays the clock source selections. 21.2.1 INTERNAL CLOCK SOURCE When the internal clock source is selected, the TMR1H:TMR1L register pair will increment on multiples of FOSC as determined by the Timer1 prescaler. When the FOSC internal clock source is selected, the Timer1 register value will increment by four counts every instruction clock cycle. Due to this condition, a 2 LSB error in resolution will occur when reading the Timer1 value. To utilize the full resolution of Timer1, an asynchronous input signal must be used to gate the Timer1 clock input. The following asynchronous sources may be used: Timer1 Operation TMR1ON TMR1GE 0 0 Off 0 1 Off 1 0 Always On 1 1 Count Enabled • Asynchronous event on the T1G pin to Timer1 gate • C1 or C2 (PIC16(L)F1613 only) comparator input to Timer1 gate 21.2.2 EXTERNAL CLOCK SOURCE When the external clock source is selected, the Timer1 module may work as a timer or a counter. When enabled to count, Timer1 is incremented on the rising edge of the external clock input T1CKI. The external clock source can be synchronized to the microcontroller system clock or it can run asynchronously. Note: In Counter mode, a falling edge must be registered by the counter prior to the first incrementing rising edge after any one or more of the following conditions: •Timer1 enabled after POR •Write to TMR1H or TMR1L •Timer1 is disabled •Timer1 is disabled (TMR1ON = 0) when T1CKI is high then Timer1 is enabled (TMR1ON=1) when T1CKI is low. TABLE 21-2: CLOCK SOURCE SELECTIONS TMR1CS<1:0> Clock Source 11 LFINTOSC 10 External Clocking on T1CKI Pin 01 System Clock (FOSC) 00 Instruction Clock (FOSC/4) 2014-2016 Microchip Technology Inc. DS40001737B-page 193 PIC12(L)F1612/16(L)F1613 21.3 Timer1 Prescaler Timer1 has four prescaler options allowing 1, 2, 4 or 8 divisions of the clock input. The T1CKPS bits of the T1CON register control the prescale counter. The prescale counter is not directly readable or writable; however, the prescaler counter is cleared upon a write to TMR1H or TMR1L. 21.4 Timer1 Operation in Asynchronous Counter Mode If control bit T1SYNC of the T1CON register is set, the external clock input is not synchronized. The timer increments asynchronously to the internal phase clocks. If the external clock source is selected then the timer will continue to run during Sleep and can generate an interrupt on overflow, which will wake-up the processor. However, special precautions in software are needed to read/write the timer (see Section21.4.1 “Reading and Writing Timer1 in Asynchronous Counter Mode”). Note: 21.4.1 When switching from synchronous to asynchronous operation, it is possible to skip an increment. When switching from asynchronous to synchronous operation, it is possible to produce an additional increment. READING AND WRITING TIMER1 IN ASYNCHRONOUS COUNTER MODE Reading TMR1H or TMR1L while the timer is running from an external asynchronous clock will ensure a valid read (taken care of in hardware). However, the user should keep in mind that reading the 16-bit timer in two 8-bit values itself, poses certain problems, since the timer may overflow between the reads. TABLE 21-4: T1GSS 21.5 Timer1 Gate Timer1 can be configured to count freely or the count can be enabled and disabled using Timer1 gate circuitry. This is also referred to as Timer1 Gate Enable. Timer1 gate can also be driven by multiple selectable sources. 21.5.1 TIMER1 GATE ENABLE The Timer1 Gate Enable mode is enabled by setting the TMR1GE bit of the T1GCON register. The polarity of the Timer1 Gate Enable mode is configured using the T1GPOL bit of the T1GCON register. When Timer1 Gate Enable mode is enabled, Timer1 will increment on the rising edge of the Timer1 clock source. When Timer1 Gate Enable mode is disabled, no incrementing will occur and Timer1 will hold the current count. See Figure 21-3 for timing details. TABLE 21-3: TIMER1 GATE ENABLE SELECTIONS T1CLK T1GPOL T1G 0 0 Counts 0 1 Holds Count 1 0 Holds Count 1 1 Counts 21.5.2 Timer1 Operation TIMER1 GATE SOURCE SELECTION Timer1 gate source selections are shown in Table 21-4. Source selection is controlled by the T1GSS<1:0> bits of the T1GCON register. The polarity for each available source is also selectable. Polarity selection is controlled by the T1GPOL bit of the T1GCON register. TIMER1 GATE SOURCES Timer1 Gate Source 00 Timer1 Gate pin (T1G) 01 Overflow of Timer0 (T0_overflow) (TMR0 increments from FFh to 00h) 10 Comparator 1 Output (C1_OUT_sync)(1) 11 Comparator 2 Output (C2_OUT_sync)(1,2) Note 1: 2: For writes, it is recommended that the user simply stop the timer and write the desired values. A write contention may occur by writing to the timer registers, while the register is incrementing. This may produce an unpredictable value in the TMR1H:TMR1L register pair. Optionally synchronized comparator output. PIC16(L)F1613 only. 2014-2016 Microchip Technology Inc. DS40001737B-page 194 PIC12(L)F1612/16(L)F1613 21.5.2.1 T1G Pin Gate Operation The T1G pin is one source for Timer1 gate control. It can be used to supply an external source to the Timer1 gate circuitry. 21.5.2.2 Timer0 Overflow Gate Operation When Timer0 increments from FFh to 00h, a low-tohigh pulse will automatically be generated and internally supplied to the Timer1 gate circuitry. 21.5.3 TIMER1 GATE TOGGLE MODE When Timer1 Gate Toggle mode is enabled, it is possible to measure the full-cycle length of a Timer1 gate signal, as opposed to the duration of a single level pulse. The Timer1 gate source is routed through a flip-flop that changes state on every incrementing edge of the signal. See Figure 21-4 for timing details. 21.5.5 TIMER1 GATE VALUE STATUS When Timer1 Gate Value Status is utilized, it is possible to read the most current level of the gate control value. The value is stored in the T1GVAL bit in the T1GCON register. The T1GVAL bit is valid even when the Timer1 gate is not enabled (TMR1GE bit is cleared). 21.5.6 TIMER1 GATE EVENT INTERRUPT When Timer1 Gate Event Interrupt is enabled, it is possible to generate an interrupt upon the completion of a gate event. When the falling edge of T1GVAL occurs, the TMR1GIF flag bit in the PIR1 register will be set. If the TMR1GIE bit in the PIE1 register is set, then an interrupt will be recognized. The TMR1GIF flag bit operates even when the Timer1 gate is not enabled (TMR1GE bit is cleared). Timer1 Gate Toggle mode is enabled by setting the T1GTM bit of the T1GCON register. When the T1GTM bit is cleared, the flip-flop is cleared and held clear. This is necessary in order to control which edge is measured. Note: 21.5.4 Enabling Toggle mode at the same time as changing the gate polarity may result in indeterminate operation. TIMER1 GATE SINGLE-PULSE MODE When Timer1 Gate Single-Pulse mode is enabled, it is possible to capture a single pulse gate event. Timer1 Gate Single-Pulse mode is first enabled by setting the T1GSPM bit in the T1GCON register. Next, the T1GGO/ DONE bit in the T1GCON register must be set. The Timer1 will be fully enabled on the next incrementing edge. On the next trailing edge of the pulse, the T1GGO/ DONE bit will automatically be cleared. No other gate events will be allowed to increment Timer1 until the T1GGO/DONE bit is once again set in software. See Figure 21-5 for timing details. If the Single Pulse Gate mode is disabled by clearing the T1GSPM bit in the T1GCON register, the T1GGO/DONE bit should also be cleared. Enabling the Toggle mode and the Single-Pulse mode simultaneously will permit both sections to work together. This allows the cycle times on the Timer1 gate source to be measured. See Figure 21-6 for timing details. 2014-2016 Microchip Technology Inc. DS40001737B-page 195 PIC12(L)F1612/16(L)F1613 21.6 Timer1 Interrupt The Timer1 register pair (TMR1H:TMR1L) increments to FFFFh and rolls over to 0000h. When Timer1 rolls over, the Timer1 interrupt flag bit of the PIR1 register is set. To enable the interrupt on rollover, you must set these bits: • • • • TMR1ON bit of the T1CON register TMR1IE bit of the PIE1 register PEIE bit of the INTCON register GIE bit of the INTCON register 21.7.1 ALTERNATE PIN LOCATIONS This module incorporates I/O pins that can be moved to other locations with the use of the alternate pin function register, APFCON. To determine which pins can be moved and what their default locations are upon a Reset, see Section12.1 “Alternate Pin Function” for more information. The interrupt is cleared by clearing the TMR1IF bit in the Interrupt Service Routine. The TMR1H:TMR1L register pair and the TMR1IF bit should be cleared before enabling interrupts. Note: 21.7 Timer1 Operation During Sleep Timer1 can only operate during Sleep when setup in Asynchronous Counter mode. In this mode, an external crystal or clock source can be used to increment the counter. To set up the timer to wake the device: • • • • • TMR1ON bit of the T1CON register must be set TMR1IE bit of the PIE1 register must be set PEIE bit of the INTCON register must be set T1SYNC bit of the T1CON register must be set TMR1CS bits of the T1CON register must be configured The device will wake-up on an overflow and execute the next instructions. If the GIE bit of the INTCON register is set, the device will call the Interrupt Service Routine. Timer1 oscillator will continue to operate in Sleep regardless of the T1SYNC bit setting. FIGURE 21-2: TIMER1 INCREMENTING EDGE T1CKI = 1 when TMR1 Enabled T1CKI = 0 when TMR1 Enabled Note 1: 2: Arrows indicate counter increments. In Counter mode, a falling edge must be registered by the counter prior to the first incrementing rising edge of the clock. 2014-2016 Microchip Technology Inc. DS40001737B-page 196 PIC12(L)F1612/16(L)F1613 FIGURE 21-3: TIMER1 GATE ENABLE MODE TMR1GE T1GPOL T1G_in T1CKI T1GVAL Timer1 N FIGURE 21-4: N+1 N+2 N+3 N+4 TIMER1 GATE TOGGLE MODE TMR1GE T1GPOL T1GTM T1G_in T1CKI T1GVAL Timer1 N 2014-2016 Microchip Technology Inc. N+1 N+2 N+3 N+4 N+5 N+6 N+7 N+8 DS40001737B-page 197 PIC12(L)F1612/16(L)F1613 FIGURE 21-5: TIMER1 GATE SINGLE-PULSE MODE TMR1GE T1GPOL T1GSPM T1GGO/ Cleared by hardware on falling edge of T1GVAL Set by software DONE Counting enabled on rising edge of T1G T1G_in T1CKI T1GVAL Timer1 TMR1GIF N Cleared by software 2014-2016 Microchip Technology Inc. N+1 N+2 Set by hardware on falling edge of T1GVAL Cleared by software DS40001737B-page 198 PIC12(L)F1612/16(L)F1613 FIGURE 21-6: TIMER1 GATE SINGLE-PULSE AND TOGGLE COMBINED MODE TMR1GE T1GPOL T1GSPM T1GTM T1GGO/ Cleared by hardware on falling edge of T1GVAL Set by software DONE Counting enabled on rising edge of T1G T1G_in T1CKI T1GVAL Timer1 TMR1GIF N Cleared by software 2014-2016 Microchip Technology Inc. N+1 N+2 N+3 Set by hardware on falling edge of T1GVAL N+4 Cleared by software DS40001737B-page 199 PIC12(L)F1612/16(L)F1613 21.8 Register Definitions: Timer1 Control REGISTER 21-1: R/W-0/u T1CON: TIMER1 CONTROL REGISTER R/W-0/u R/W-0/u TMR1CS<1:0> R/W-0/u U-0 R/W-0/u U-0 R/W-0/u — T1SYNC — TMR1ON T1CKPS<1:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-6 TMR1CS<1:0>: Timer1 Clock Source Select bits 11 =LFINTOSC 10 =T1CKI 01 =FOSC 00 =FOSC/4 bit 5-4 T1CKPS<1:0>: Timer1 Input Clock Prescale Select bits 11 =1:8 Prescale value 10 =1:4 Prescale value 01 =1:2 Prescale value 00 =1:1 Prescale value bit 3 Unimplemented: Read as ‘0’ bit 2 T1SYNC: Timer1 Synchronization Control bit 1 = Do not synchronize asynchronous clock input 0 = Synchronize asynchronous clock input with system clock (FOSC) bit 1 Unimplemented: Read as ‘0’ bit 0 TMR1ON: Timer1 On bit 1 = Enables Timer1 0 = Stops Timer1 and clears Timer1 gate flip-flop 2014-2016 Microchip Technology Inc. DS40001737B-page 200 PIC12(L)F1612/16(L)F1613 REGISTER 21-2: T1GCON: TIMER1 GATE CONTROL REGISTER R/W-0/u R/W-0/u R/W-0/u R/W-0/u R/W/HC-0/u R-x/x TMR1GE T1GPOL T1GTM T1GSPM T1GGO/ DONE T1GVAL R/W-0/u R/W-0/u T1GSS<1:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared HC = Bit is cleared by hardware bit 7 TMR1GE: Timer1 Gate Enable bit If TMR1ON = 0: This bit is ignored If TMR1ON = 1: 1 = Timer1 counting is controlled by the Timer1 gate function 0 = Timer1 counts regardless of Timer1 gate function bit 6 T1GPOL: Timer1 Gate Polarity bit 1 = Timer1 gate is active-high (Timer1 counts when gate is high) 0 = Timer1 gate is active-low (Timer1 counts when gate is low) bit 5 T1GTM: Timer1 Gate Toggle Mode bit 1 = Timer1 Gate Toggle mode is enabled 0 = Timer1 Gate Toggle mode is disabled and toggle flip-flop is cleared Timer1 gate flip-flop toggles on every rising edge. bit 4 T1GSPM: Timer1 Gate Single-Pulse Mode bit 1 = Timer1 gate Single-Pulse mode is enabled and is controlling Timer1 gate 0 = Timer1 gate Single-Pulse mode is disabled bit 3 T1GGO/DONE: Timer1 Gate Single-Pulse Acquisition Status bit 1 = Timer1 gate single-pulse acquisition is ready, waiting for an edge 0 = Timer1 gate single-pulse acquisition has completed or has not been started bit 2 T1GVAL: Timer1 Gate Value Status bit Indicates the current state of the Timer1 gate that could be provided to TMR1H:TMR1L. Unaffected by Timer1 Gate Enable (TMR1GE). bit 0 T1GSS<1:0>: Timer1 Gate Source Select bits 11 =Comparator 2 optionally synchronized output (C2_OUT_sync) 10 =Comparator 1 optionally synchronized output (C1_OUT_sync) 01 =Timer0 overflow output (T0_overflow) 00 =Timer1 gate pin (T1G) 2014-2016 Microchip Technology Inc. DS40001737B-page 201 PIC12(L)F1612/16(L)F1613 TABLE 21-5: Name SUMMARY OF REGISTERS ASSOCIATED WITH TIMER1 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register on Page ANSELA — — — ANSA4 — ANSA2 ANSA1 ANSA0 136 APFCON — CWGASEL(2) CWGBSEL(2) — T1GSEL — CCP2SEL(3) CCP1SEL(2) 132 INTCON GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF 82 PIE1 TMR1GIE ADIE — — — CCP1IE TMR2IE TMR1IE 83 PIR1 TMR1GIF ADIF — — — CCP1IF TMR2IF TMR1IF 87 TMR1H Holding Register for the Most Significant Byte of the 16-bit TMR1 Count 196* TMR1L Holding Register for the Least Significant Byte of the 16-bit TMR1 Count 196* TMR3H Holding Register for the Most Significant Byte of the 16-bit TMR3 Count 196* TMR3L Holding Register for the Least Significant Byte of the 16-bit TMR3 Count 196* TMR5H Holding Register for the Most Significant Byte of the 16-bit TMR5 Count 196* TMR5L Holding Register for the Least Significant Byte of the 16-bit TMR5 Count 196* TRISA — T1CON TMR1CS<1:0> T1GCON T3CON T3GCON T5CON T5GCON Legend: Note * 1: 2: 3: TMR1GE — T1GPOL TMR3CS<1:0> TMR3GE T3GPOL TMR5CS<1:0> TMR5GE T5GPOL TRISA5 TRISA4 T1CKPS<1:0> T1GTM T1GSPM T3CKPS<1:0> T3GTM T3GSPM T5CKPS<1:0> T5GTM T5GSPM (1) TRISA2 TRISA1 TRISA0 135 — T1SYNC — TMR1ON 200 T1GGO/ DONE T1GVAL — — T3SYNC T3GGO/ DONE T3GVAL — T5SYNC T5GGO/ DONE T5GVAL T1GSS<1:0> — TMR3ON T3GSS<1:0> — TMR5ON T5GSS<1:0> 201 200 201 200 201 — = unimplemented location, read as ‘0’. Shaded cells are not used by the Timer1 module. Page provides register information. Unimplemented, read as ‘1’. PIC12(L)F1612 only. PIC16(L)F1613 only. 2014-2016 Microchip Technology Inc. DS40001737B-page 202 PIC12(L)F1612/16(L)F1613 22.0 TIMER2/4/6 MODULE The Timer2/4/6 modules are 8-bit timers that can operate as free-running period counters or in conjunction with external signals that control start, run, freeze, and reset operations in a One-Shot mode of operation. Sophisticated waveform control such as pulse density modulation are possible by combining the operation of these timers with other internal peripherals such as the comparators and CCP modules. Features of the timer include: • • • • • • • • • Selectable synchronous/asynchronous operation Alternate clock sources Interrupt-on-period Two modes of operation - Free Running Period - One-Shot See Figure 22-2 for Timer2 clock sources. See Figure 22-1 for a block diagram of Timer2 with HLT. Note: 8-bit Timer register 8-bit Period register Selectable external hardware timer Resets Programmable prescaler (1:1 to 1:128) Programmable postscaler (1:1 to 1:16) FIGURE 22-1: Three identical Timer2 modules are implemented on this device. The timers are named Timer2, Timer4, and Timer6. All references to Timer2 apply as well to Timer4 and Timer6. All references to PR2 apply as well to PR4 and PR6. TIMER2 WITH HARDWARE LIMIT TIMER (HLT) BLOCK DIAGRAM Rev. 10-000 168A 1/22/201 4 RSEL MODE<3:0> See TxRST Register TMRx_ers Edg e Detecto r Level Dete ctor Mode Control (2 clock Sync) MODE<3> reset CCP_pset enable D Q Clear ON CKPOL 0 Pre scaler TMRx_clk TMRx 3 CKPS<2:0> Sync 1 Fosc/4 PSYNC R Set flag bi t TMRxIF Comparator Postscaler TMRx_postscaled 4 ON Sync (2 Clocks) 1 PRx OUTPS<3:0> 0 CKSYNC Note 1: 2: Signal to the CCP to trigger the PWM pulse See Section 22.5 for description of CCP interaction in the different TMR modes 2014-2016 Microchip Technology Inc. DS40001737B-page 203 PIC12(L)F1612/16(L)F1613 FIGURE 22-2: TIMER2 CLOCK SOURCE BLOCK DIAGRAM TxCLKCON Rev. 10-000 169A 12/19/201 3 Reserved 111 TXIN 110 MFINTOSC 101 ZCD1_output 100 LFINTOSC 011 HFINTOSC 010 FOSC 001 FOSC/4 000 2014-2016 Microchip Technology Inc. TMR2_clk DS40001737B-page 204 PIC12(L)F1612/16(L)F1613 22.1 22.1.1 Timer2 Operation Timer2 operates in two major modes: • Free Running Period mode • One-Shot mode Within each mode there are several options for starting, stopping, and reset. Table 22-1 lists the options. The TMR2 and PR2 registers are both directly readable and writable. The TMR2 register is cleared on any device Reset, whereas the PR2 register initializes to FFh. Both the prescaler and postscaler counters are cleared on the following events: • • • • a write to the TMR2 register a write to the T2CON register Any device Reset External Reset Source events, which resets the timer. Note: TMR2 is not cleared when T2CON is written. FREE RUNNING PERIOD MODE The value of TMR2 is compared to that of the Period register, T2PR, on each clock cycle. When the two values match, the comparator resets the value of TMR2 to 00h on the next cycle and increments the output postscaler counter. When the postscaler count equals the value in the OUTPS<3:0> bits of the TMRxCON1 register, a one clock period wide pulse occurs on the TMR2_postscaled output and the postscaler count is cleared. 22.1.2 ONE-SHOT MODE The One-Shot mode is identical to the Free Running Period mode except that the ON bit is cleared and the timer is stopped when TMR2 matches T2PR and will not restart until the T2ON bit is cycled off and on. Postscaler OUTPS<3:0> values other than 0 are meaningless in this mode because the timer is stopped at the first period event and the postscaler is reset when the timer is restarted. 22.2 Timer2 Interrupt Timer2 can also generate a device interrupt. The interrupt is generated when the postscaler counter matches one of 16 postscale options (from 1:1 through 1:16), which is selected with the postscaler control bits, OUTPS<3:0> of the T2CON register. The interrupt is enabled by setting the TMR2 Interrupt Enable bit, TMR2IE, of the PIE1 register. The interrupt timing is illustrated in Figure 22-3. FIGURE 22-3: TIMER2 PRESCALER, POSTSCALER, AND INTERRUPT TIMING DIAGRAM Rev. 10-000205A 4/7/2016 CKPS 0b010 PRx 1 OUTPS 0b0001 TMRx_clk TMRx 0 1 0 1 0 1 0 TMRx_postscaled TMRxIF (1) (2) (1) Note 1: Setting the interrupt flag is synchronized with the instruction clock. Synchronization may take as many as 2 instruction cycles 2: Cleared by software. 2014-2016 Microchip Technology Inc. DS40001737B-page 205 PIC12(L)F1612/16(L)F1613 22.3 Timer2 Output The Timer2 module’s primary output is TMR2_postscaled, which pulses for a single TMR2_clk period upon each match of the postscaler counter and the OUTPS TMR2xCON. The PR2 postscaler is incremented each time the TMR2 value matches the PR2 value. this signal can be selected as an input to several other input modules: • The CRC memory scanner, as a trigger for Triggered mode • The ADC module, as an auto-conversion trigger • Both SMT modules, as both a window and/or a signal input • CWG, as an auto-shutdown source In addition, the Timer2 is also used by the CCP module for pulse generation in PWM mode. Both the actual TMR2 value as well as other internal signals are sent to the CCP module to properly clock both the period and pulse width of the PWM signal. See Section23.4 “CCP/PWM Clock Selection” for more details on setting up Timer2 for use with the CCP, as well as the timing diagrams in Section22.5 “Operation Examples” for examples of how the varying Timer2 modes affect CCP PWM output. 22.4 External Reset Sources In addition to the clock source, the Timer2 also takes in an external Reset source. This external Reset source is selected for Timer2, Timer4, and Timer6 with the T2RST, T4RST, and T6RST registers, respectively. This source can control starting and stopping of the timer, as well as resetting the timer, depending on which mode the timer is in. The mode of the timer is controlled by the MODE<3:0> bits of the TxHLT register. 22.5 Operation Examples Unless otherwise specified, the following notes apply to the following timing diagrams: - Both the prescaler and postscaler are set to 1:1 (both the CKPS and OUTPS bits in the TxCON register are cleared). - The diagrams illustrate any clock except FOSC/4 and show clock-sync delays of at least two full cycles for both ON and TMRx_ers. When using FOSC/4, the clocksync delay is at least one instruction period for TMRx_ers; ON applies in the next instruction period. - ON and TMRx_ers are somewhat generalized, and clock-sync delays may produce results that are slightly different than illustrated. - The PWM Duty Cycle and PWM output are illustrated assuming that the timer is used for the PWM function of the CCP module as described in Section23.4 “CCP/PWM Clock Selection”. The signals are not a part of the Timer2 module. Note: The CKSYNC bit should be set while running Timer2/4/6 in order to ensure proper operation of the timer and its interactions with other modules. Clearing the CKSYNC bit should be done only in specific cases where a very specific number of clock cycles is desired, and should only be done with extreme caution. Note 1: Because of Synchronization, there needs to be at least six clock pulses between each external Reset signal pulse while in edge-triggered modes. A second pulse fewer than six clock pulses after a first will not be detected by the module. Similarly, in level-triggered modes, the input signal active time must be at least three clock pulses wide to be detected. 2: While the part is in a debug freeze state, external Reset sources will continue to trigger. 2014-2016 Microchip Technology Inc. DS40001737B-page 206 PIC12(L)F1612/16(L)F1613 TABLE 22-1: TIMER2 OPERATING MODES MODE<3:0> Mode <3> <2:0> Output Operation Stop ON = 1 — ON = 0 001 Hardware gate, active-high (Figure 22-5) ON = 1 and TMRx_ers = 1 — ON = 0 or TMRx_ers = 0 Hardware gate, active-low ON = 1 and TMRx_ers = 0 — ON = 0 or TMRx_ers = 1 Period Pulse 011 Rising or falling edge Reset 100 Rising edge Reset (Figure 22-6) TMRx_ers ↑ Falling edge Reset TMRx_ers ↓ 0 110 Period Pulse with Hardware Reset 111 000 001 010 One-Shot Edge triggered start (Note 1) 011 1 100 101 110 111 Note 1: 2: 3: Reset Software gate (Figure 22-4) 101 One-Shot Start 000 010 Free Running Period Timer Control Operation Edge triggered start and hardware Reset (Note 1) Low level Reset TMRx_ers ↕ ON = 1 High level Reset (Figure 22-7) ON = 0 TMRx_ers = 0 ON = 0 or TMRx_ers = 0 TMRx_ers = 1 ON = 0 or TMRx_ers = 1 Software start (Figure 22-8) ON = 1 — Rising edge start (Figure 22-9) ON = 1 and TMRx_ers ↑ — Falling edge start ON = 1 and TMRx_ers ↓ — Any edge start ON = 1 and TMRx_ers ↕ — Rising edge start and Rising edge Reset (Figure 22-10) ON = 1 and TMRx_ers ↑ TMRx_ers ↑ Falling edge start and Falling edge Reset ON = 1 and TMRx_ers ↓ TMRx_ers ↓ Rising edge start and Low level Reset (Figure 22-11) ON = 1 and TMRx_ers ↑ TMRx_ers = 0 Falling edge start and High level Reset ON = 1 and TMRx_ers ↓ TMRx_ers = 1 ON = 0 or Next clock after TMRx = PRx (Note 2) If ON = 0 then an edge is required to restart the timer after ON = 1. When TMRx = PRx then the next clock clears ON and stops TMRx at 00h. When TMRx = PRx then the next clock stops TMRx at 00h but does not clear ON. 2014-2016 Microchip Technology Inc. DS40001737B-page 207 PIC12(L)F1612/16(L)F1613 22.5.1 SOFTWARE GATE MODE This mode corresponds to legacy Timer2 operation. The timer increments with each clock input when ON = 1 and does not increment when ON = 0. When the TMRx count equals the PRx period count the timer resets on the next clock and continues counting from 0. Operation with the ON bit software controlled is illustrated in Figure 22-4. With PRx = 5, the counter advances until TMRx = 5, and goes to zero with the next clock. FIGURE 22-4: SOFTWARE GATE MODE TIMING DIAGRAM Rev. 10-000 195A 12/20/201 3 0b0000 MODE TMRx_clk Instruction(1) BSF BCF BSF ON PRx TMRx 5 0 1 2 3 4 5 0 1 2 3 4 5 0 1 2 3 4 5 0 1 TMRx_postscaled PWM Duty Cycle 3 PWM Output Note 1: BSF and BCF represent Bit-Set File and Bit-Clear File instructions executed by the CPU to set or clear the ON bit of TxCON. CPU execution is asynchronous to the timer clock input. 2014-2016 Microchip Technology Inc. DS40001737B-page 208 PIC12(L)F1612/16(L)F1613 22.5.2 HARDWARE GATE MODE The Hardware Gate modes operate the same as the software gate mode except the TMRx_ers external signal can also gate the timer. When used with the CCP the gating extends the PWM period. If the timer is stopped when the PWM output is high then the duty cycle is also extended. When MODE<3:0> = 0001 then the timer is stopped when the external signal is high. When MODE<3:0> = 0010, the timer is stopped when the external signal is low. Figure 22-5 illustrates the hardware gating mode for MODE<3:0> = 0001 in which a high input level starts the counter. FIGURE 22-5: HARDWARE GATE MODE TIMING DIAGRAM Rev. 10-000 196A 12/20/201 3 0b0001 MODE TMRx_clk TMRx_ers PRx TMRx 5 0 1 2 3 4 5 0 1 2 3 4 5 0 1 TMRx_postscaled PWM Duty Cycle 3 PWM Output 2014-2016 Microchip Technology Inc. DS40001737B-page 209 PIC12(L)F1612/16(L)F1613 22.5.3 EDGE-TRIGGERED HARDWARE LIMIT MODE In Edge-Triggered Hardware Limit mode, the timer can be reset by the TMRx_ers external signal before the timer reaches the period count. Three types of Resets are possible: • Reset on rising or falling edge (MODE<3:0> = 0011) • Reset on rising edge (MODE<3:0> = 0100) • Reset on falling edge (MODE<3:0> = 0101) When the timer is used in conjunction with the CCP in PWM mode then an early Reset shortens the period and restarts the PWM pulse after a two clock delay. Refer to Figure 22-6. FIGURE 22-6: EDGE-TRIGGERED HARDWARE LIMIT MODE TIMING DIAGRAM Rev. 10-000 197A 12/20/201 3 0b0100 MODE TMRx_clk PRx 5 Instruction(1) BSF BCF BSF ON TMRx_ers TMRx 0 1 2 0 1 2 3 4 5 0 1 2 3 4 5 0 1 TMRx_postscaled PWM Duty Cycle 3 PWM Output Note 1: BSF and BCF represent Bit-Set File and Bit-Clear File instructions executed by the CPU to set or clear the ON bit of TxCON. CPU execution is asynchronous to the timer clock input. 2014-2016 Microchip Technology Inc. DS40001737B-page 210 PIC12(L)F1612/16(L)F1613 22.5.4 LEVEL-TRIGGERED HARDWARE LIMIT MODE Reset. The PWM output will remain high until the timer counts up to match the CCPRx pulse width value. If the external Reset signal goes true while the PWM output is high then the PWM output will remain high until the Reset signal is released allowing the timer to count up to match the CCPRx value. In the Level-Triggered Hardware Limit Timer modes, the counter is reset by high or low levels of the external signal TMRx_ers, as shown in Figure 22-7. Selecting MODE<3:0> = 0110 will cause the timer to reset on a low level external signal. Selecting MODE<3:0> = 0111 will cause the timer to reset on a high level external signal. In the example, the counter is reset while TMRx_ers = 1. ON is controlled by BSF and BCF instructions. When ON = 0 the external signal is ignored. When the CCP uses the timer as the PWM time base then the PWM output will be set high when the timer starts counting and then set low only when the timer count matches the CCPRx value. The timer is reset when either the timer count matches the PRx value or two clock periods after the external Reset signal goes true and stays true. The timer starts counting and the PWM output is set high, on either the clock following the PRx match or two clocks after the external Reset signal relinquishes the FIGURE 22-7: LEVEL-TRIGGERED HARDWARE LIMIT TIMING DIAGRAM Rev. 10-000 198A 12/20/201 3 0b0111 MODE TMRx_clk PRx 5 Instruction(1) BSF BCF BSF ON TMRx_ers TMRx 0 1 2 0 1 2 3 4 5 0 0 1 2 3 4 5 0 TMRx_postscaled PWM Duty Cycle 3 PWM Output Note 1: BSF and BCF represent Bit-Set File and Bit-Clear File instructions executed by the CPU to set or clear the ON bit of TxCON. CPU execution is asynchronous to the timer clock input. 2014-2016 Microchip Technology Inc. DS40001737B-page 211 PIC12(L)F1612/16(L)F1613 22.5.5 SOFTWARE START ONE-SHOT MODE In One-Shot mode, the timer resets and the ON bit is cleared when the timer value matches the PRx period value. The ON bit must be set by software to start another timer cycle. Setting MODE<3:0> = 1000 selects One-Shot mode which is illustrated in Figure 22-8. In the example, ON is controlled by BSF and BCF instructions. In the first case, a BSF instruction sets ON and the counter runs to completion and clears ON. In the second case, a BSF instruction starts the cycle, BCF/BSF instructions turn the counter off and on during the cycle, and then it runs to completion. FIGURE 22-8: When One-Shot mode is used in conjunction with the CCP PWM operation the PWM pulse drive starts concurrent with setting the ON bit. Clearing the ON bit while the PWM drive is active will extend the PWM drive. The PWM drive will terminate when the timer value matches the CCPRx pulse width value. The PWM drive will remain off until software sets the ON bit to start another cycle. If software clears the ON bit after the CCPRx match but before the PRx match then the PWM drive will be extended by the length of time the ON bit remains cleared. Another timing cycle can only be initiated by setting the ON bit after it has been cleared by a PRx period count match. SOFTWARE START ONE-SHOT MODE TIMING DIAGRAM Rev. 10-000199A 4/7/2016 0b1000 MODE TMRx_clk 5 PRx Instruction(1) BSF BSF BCF BSF ON TMRx 0 1 2 3 4 5 0 1 2 3 4 5 0 TMRx_postscaled PWM Duty Cycle 3 PWM Output Note 1: BSF and BCF represent Bit-Set File and Bit-Clear File instructions executed by the CPU to set or clear the ON bit of TxCON. CPU execution is asynchronous to the timer clock input. 2014-2016 Microchip Technology Inc. DS40001737B-page 212 PIC12(L)F1612/16(L)F1613 22.5.6 EDGE-TRIGGERED ONE-SHOT MODE The Edge-Triggered One-Shot modes start the timer on an edge from the external signal input, after the ON bit is set, and clear the ON bit when the timer matches the PRx period value. The following edges will start the timer: • Rising edge (MODE<3:0> = 1001) • Falling edge (MODE<3:0>= 1010) • Rising or Falling edge (MODE<3:0> = 1011) FIGURE 22-9: If the timer is halted by clearing the ON bit then another TMRx_ers edge is required after the ON bit is set to resume counting. Figure 22-9 illustrates operation in the rising edge One-Shot mode. When the Edge-Triggered One-Shot mode is used in conjunction with the CCP then the edge-trigger will activate the PWM drive and the PWM drive will deactivate when the timer matches the CCPRx pulse width value and stay deactivated when the timer halts at the PRx period count match. EDGE-TRIGGERED ONE-SHOT MODE TIMING DIAGRAM Rev. 10-000200A 4/7/2016 0b1001 MODE TMRx_clk 5 PRx Instruction(1) BSF BSF BCF ON TMRx_ers TMRx 0 1 2 3 4 5 0 1 2 TMRx_out TMRx_postscaled PWM Duty Cycle 3 PWM Output Note 1: BSF and BCF represent Bit-Set File and Bit-Clear File instructions executed by the CPU to set or clear the ON bit of TxCON. CPU execution is asynchronous to the timer clock input. 2014-2016 Microchip Technology Inc. DS40001737B-page 213 PIC12(L)F1612/16(L)F1613 22.5.7 EDGE-TRIGGERED HARDWARE LIMIT ONE-SHOT MODE In Edge-Triggered Hardware Limit One-Shot modes the timer starts on the first external signal edge after the ON bit is set and resets on all subsequent edges. Only the first edge after the ON bit is set is needed to start the timer. The counter will resume counting automatically two clocks after all subsequent external Reset edges. Edge triggers are as follows: • Rising edge start and reset (MODE<3:0> = 1100) • Falling edge start and reset (MODE<3:0> = 1101) The timer resets and clears the ON bit when the timer value matches the PRx period value. External signal edges will have no effect until after software sets the ON bit. Figure 22-10 illustrates the rising edge hardware limit one-shot operation. When this mode is used in conjunction with the CCP then the first starting edge trigger, and all subsequent Reset edges, will activate the PWM drive. The PWM drive will deactivate when the timer matches the CCPRx pulse width value and stay deactivated until the timer halts at the PRx period match unless an external signal edge resets the timer before the match occurs. 2014-2016 Microchip Technology Inc. DS40001737B-page 214 2014-2016 Microchip Technology Inc. FIGURE 22-10: EDGE-TRIGGERED HARDWARE LIMIT ONE-SHOT TIMING DIAGRAM Rev. 10-000201A 4/7/2016 0b1100 MODE TMRx_clk PRx Instruction(1) 5 BSF BSF ON TMRx_ers TMRx 0 1 2 3 4 5 0 1 2 0 1 2 3 4 5 0 TMRx_postscaled 3 PWM Output Note 1: BSF and BCF represent Bit-Set File and Bit-Clear File instructions executed by the CPU to set or clear the ON bit of TxCON. CPU execution is asynchronous to the timer clock input. DS40001737B-page 215 PIC12(L)F1612/16(L)F1613 PWM Duty Cycle PIC12(L)F1612/16(L)F1613 22.5.8 LEVEL RESET, EDGE-TRIGGERED HARDWARE LIMIT ONE-SHOT MODES In Level Reset, Edge-Triggered One-Shot mode the timer count is reset on the external signal level and starts counting on the rising/falling edge of the transition from Reset level to the active level when the ON bit is set. Reset levels are selected as follows: • High Reset level (MODE<3:0> = 1110) • Low Reset level (MODE<3:0> = 1111) When the timer count matches the PRx period count then the timer is reset and the ON bit is cleared. When the ON bit is cleared by either a PRx match or by software control a new external signal edge is required after the ON bit is set to start the counter. When Level Triggered Reset One-Shot mode is used in conjunction with the CCP PWM operation the PWM drive goes active with the external signal edge that starts the timer. The PWM drive goes inactive when the timer count equals the CCPRx pulse width count. The PWM drive does not go active when the timer count clears at the PRx period count match. 22.6 Timer2 Operation During Sleep When PSYNC = 1, Timer2 cannot be operated while the processor is in Sleep mode. The contents of the TMR2 and PR2 registers will remain unchanged while processor is in Sleep mode. When PSYNC = 0, Timer2 will operate in Sleep as long as the clock source selected is also still running. Selecting the LFINTOSC, MFINTOSC, or HFINTOSC oscillator as the timer clock source will keep the selected oscillator running during Sleep. 2014-2016 Microchip Technology Inc. DS40001737B-page 216 2014-2016 Microchip Technology Inc. FIGURE 22-11: LEVEL-TRIGGERED HARDWARE LIMIT ONE-SHOT MODE TIMING DIAGRAM Rev. 10-000202A 4/7/2016 0b1110 MODE TMRx_clk PRx Instruction(1) 5 BSF BSF ON TMRx_ers TMRx 0 1 2 3 4 5 0 1 0 1 2 3 4 5 0 TMRx_postscaled 3 PWM Output Note 1: BSF and BCF represent Bit-Set File and Bit-Clear File instructions executed by the CPU to set or clear the ON bit of TxCON. CPU execution is asynchronous to the timer clock input. DS40001737B-page 217 PIC12(L)F1612/16(L)F1613 PWM Duty Cycle PIC12(L)F1612/16(L)F1613 22.7 Register Definitions: Timer2/4/6 Control Long bit name prefixes for the Timer2/4/6 peripherals are shown in Table 22-2. Refer to Section 1.1 “Register and Bit Naming Conventions” for more information. TABLE 22-2: Peripheral Bit Name Prefix TMR2 TMR2 TMR4 TMR4 TMR6 TMR6 REGISTER 22-1: TxCLKCON: TIMERx CLOCK SELECTION REGISTER U-0 U-0 U-0 U-0 U-0 — — — — — R/W-0/0 R/W-0/0 R/W-0/0 TxCS<2:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-3 Unimplemented: Read as ‘0’ bit 2-0 TxCS: Timerx Clock Selection bits 111 = Reserved 110 = TxIN 101 = MFINTOSC 31.25 kHz 100 = ZCD_output 011 = LFINTOSC 010 = HFINTOSC 16 MHz 001 = FOSC 000 = FOSC/4 2014-2016 Microchip Technology Inc. DS40001737B-page 218 PIC12(L)F1612/16(L)F1613 REGISTER 22-2: R/W/HC-0/0 TxCON: TIMERx CONTROL REGISTER R/W-0/0 ON(1) R/W-0/0 R/W-0/0 R/W-0/0 CKPS<2:0> R/W-0/0 R/W-0/0 R/W-0/0 OUTPS<3:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared HC = Bit is cleared by hardware bit 7 ON: Timerx On bit 1 = Timerx is on 0 = Timerx is off: all counters and state machines are reset bit 6-4 CKPS<2:0>: Timer2-type Clock Prescale Select bits 111 =1:128 Prescaler 110 =1:64 Prescaler 101 =1:32 Prescaler 100 =1:16 Prescaler 011 =1:8 Prescaler 010 =1:4 Prescaler 001 =1:2 Prescaler 000 =1:1 Prescaler bit 3-0 OUTPS<3:0>: Timerx Output Postscaler Select bits 1111 =1:16 Postscaler 1110 =1:15 Postscaler 1101 =1:14 Postscaler 1100 =1:13 Postscaler 1011 =1:12 Postscaler 1010 =1:11 Postscaler 1001 =1:10 Postscaler 1000 =1:9 Postscaler 0111 =1:8 Postscaler 0110 =1:7 Postscaler 0101 =1:6 Postscaler 0100 =1:5 Postscaler 0011 =1:4 Postscaler 0010 =1:3 Postscaler 0001 =1:2 Postscaler 0000 =1:1 Postscaler Note 1: In certain modes, the ON bit will be auto-cleared by hardware. See Section22.5.5 “Software Start OneShot Mode”. 2014-2016 Microchip Technology Inc. DS40001737B-page 219 PIC12(L)F1612/16(L)F1613 REGISTER 22-3: TxHLT: TIMERx CLOCK SELECTION REGISTER R/W-0/0 R/W-0/0 R/W-0/0 U-0 PSYNC(1, 2) CKPOL(3) CKSYNC(4, — R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 MODE<3:0>(6, 7, 8) 5) bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7 PSYNC: Timerx Prescaler Synchronization Enable bit(1, 2) 1 = TMRx Prescaler Output is synchronized to Fosc/4 0 = TMRx Prescaler Output is not synchronized to Fosc/4 bit 6 CKPOL: Timerx Clock Polarity Selection bit(3) 1 = Falling edge of input clock clocks timer/prescaler 0 = Rising edge of input clock clocks timer/prescaler bit 5 CKSYNC: Timerx Clock Synchronization Enable bit(4, 5) 1 = ON register bit is synchronized to TMR2_clk input 0 = ON register bit is not synchronized to TMR2_clk input bit 4 Unimplemented: Read as ‘0’ bit 3-0 MODE<3:0>: Timerx Control Mode Selection bits(6, 7, 8) See Table 22-1. Note 1: Setting this bit ensures that reading TMRx will return a valid data value. 2: When this bit is ‘1’, Timer2 cannot operate in Sleep mode. 3: CKPOL should not be changed while ON = 1. 4: Setting this bit ensures glitch-free operation when the ON is enabled or disabled. 5: When this bit is set, the timer operation will be delayed by two TMRx input clocks after the ON bit is set. 6: Unless otherwise indicated, all modes start upon ON = 1 and stop upon ON = 0 (stops occur without affecting the value of TMRx). 7: When TMRx = PRx, the next clock clears TMRx, regardless of the operating mode. 8: In edge-triggered “One-Shot” modes, the triggered-start mechanism is reset and rearmed when ON = 0; the counter will not restart until an input edge occurs. 2014-2016 Microchip Technology Inc. DS40001737B-page 220 PIC12(L)F1612/16(L)F1613 REGISTER 22-4: TxRST: TIMER2 EXTERNAL RESET SIGNAL SELECTION REGISTER U-0 U-0 U-0 U-0 — — — — R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 RSEL<3:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-4 Unimplemented: Read as ‘0’ bit 3-0 RSEL<3:0>: Timer2 External Reset Signal Source Selection bits See Table 22-3. TABLE 22-3: EXTERNAL RESET SOURCES RSEL<4:0> Timer2 Timer4 Timer6 1111 Reserved Reserved Reserved 1110 PWM4_out PWM4_out PWM4_out 1101 PWM3_out PWM3_out PWM3_out 1100 LC4_out LC4_out LC4_out 1011 LC3_out LC3_out LC3_out 1010 LC2_out LC2_out LC2_out 1001 LC1_out LC1_out LC1_out 1000 ZCD1_out ZCD1_out ZCD1_out 0111 TMR6_postscaled TMR6_postscaled Reserved 0110 TMR4_postscaled Reserved TMR4_postscaled 0101 Reserved TMR2_postscaled TMR2_postscaled 0100 CCP2_out CCP2_out CCP2_out 0011 CCP1_out CCP1_out CCP1_out 0010 C2OUT_sync C2OUT_sync C2OUT_sync 0001 C1OUT_sync C1OUT_sync C1OUT_sync 0000 Pin selected by T2INPPS Pin selected by T2INPPS Pin selected by T2INPPS 2014-2016 Microchip Technology Inc. DS40001737B-page 221 PIC12(L)F1612/16(L)F1613 TABLE 22-4: Name CCP1CON SUMMARY OF REGISTERS ASSOCIATED WITH TIMER2 Bit 7 Bit 6 Bit 5 Bit 4 EN — OUT FMT Bit 3 Bit 2 Bit 1 Bit 0 MODE<3:0> Register on Page 232 CCP2CON EN — OUT FMT INTCON GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF 82 TMR1GIE ADIE — — — CCP1IE TMR2IE TMR1IE 83 ADIF RCIF TXIF SSP1IF CCP1IF TMR2IF TMR1IF PIE1 PIR1 TMR1GIF PR2 Timer2 Module Period Register TMR2 Holding Register for the 8-bit TMR2 Register T2CON ON T2CLKCON — MODE<3:0> 87 205* 205* CKPS<2:0> — 232 — — — T2RST — — — T2HLT PSYNC CKPOL CKSYNC PR4 Timer4 Module Period Register TMR4 Holding Register for the 8-bit TMR4 Register OUTPS<3:0> 219 CS<3:0> 218 RSEL<3:0> 221 MODE<4:0> 220 205* T4CON ON T4CLKCON — — — T4RST — — — T4HLT PSYNC CKPOL CKSYNC 205* CKPS<2:0> OUTPS<3:0> 219 — CS<3:0> 218 — RSEL<3:0> 221 MODE<4:0> 220 PR6 Timer6 Module Period Register 205* TMR6 Holding Register for the 8-bit TMR6 Register 205* T6CON ON T6CLKCON — — — — T6RST — — — — T6HLT PSYNC CKPOL CKSYNC Legend: * CKPS<2:0> OUTPS<3:0> — T6CS<2:0> RSEL<3:0> MODE<4:0> 219 218 221 220 — = unimplemented location, read as ‘0’. Shaded cells are not used for Timer2 module. Page provides register information. 2014-2016 Microchip Technology Inc. DS40001737B-page 222 PIC12(L)F1612/16(L)F1613 23.0 CAPTURE/COMPARE/PWM MODULES The Capture/Compare/PWM module is a peripheral which allows the user to time and control different events, and to generate Pulse-Width Modulation (PWM) signals. In Capture mode, the peripheral allows the timing of the duration of an event. The Compare mode allows the user to trigger an external event when a predetermined amount of time has expired. The PWM mode can generate Pulse-Width Modulated signals of varying frequency and duty cycle. This family of devices contains two standard Capture/ Compare/PWM modules (CCP1 and CCP2). Note 1: In devices with more than one CCP module, it is very important to pay close attention to the register names used. A number placed after the module acronym is used to distinguish between separate modules. For example, the CCP1CON and CCP2CON control the same operational aspects of two completely different CCP modules. 2: Throughout this section, generic references to a CCP module in any of its operating modes may be interpreted as being equally applicable to CCPx module. Register names, module signals, I/O pins, and bit names may use the generic designator ‘x’ to indicate the use of a numeral to distinguish a particular module, when required. 23.1 Capture Mode The Capture mode function described in this section is available and identical for all CCP modules. Capture mode makes use of the 16-bit Timer1 resource. When an event occurs on the CCPx input, the 16-bit CCPRxH:CCPRxL register pair captures and stores the 16-bit value of the TMR1H:TMR1L register pair, respectively. An event is defined as one of the following and is configured by the MODE<3:0> bits of the CCPxCON register: • • • • • Every edge (rising or falling) Every falling edge Every rising edge Every 4th rising edge Every 16th rising edge The CCPx capture input signal is configured by the CTS bits of the CCPxCAP register with the following options: • CCPx pin • Comparator 1 output (C1_OUT_sync) • Comparator 2 output (C2_OUT_sync) (PIC16(L)F1613 only) • Interrupt-on-change interrupt trigger (IOC_interrupt) When a capture is made, the Interrupt Request Flag bit CCPxIF of the PIRx register is set. The interrupt flag must be cleared in software. If another capture occurs before the value in the CCPRxH, CCPRxL register pair is read, the old captured value is overwritten by the new captured value. Figure shows a simplified diagram of the capture operation. 23.1.1 CCP PIN CONFIGURATION In Capture mode, select the interrupt source using the CTS bits of the CCPxCAP register. If the CCPx pin is chosen, it should be configured as an input by setting the associated TRIS control bit. Also, the CCP2 pin function can be moved to alternative pins using the APFCON register. Refer to Section12.1 “Alternate Pin Function” for more details. Note: 2014-2016 Microchip Technology Inc. If the CCPx pin is configured as an output, a write to the port can cause a capture condition. DS40001737B-page 223 PIC12(L)F1612/16(L)F1613 FIGURE 23-1: CAPTURE MODE OPERATION BLOCK DIAGRAM Rev. 10-000 158A 12/19/201 3 OE CCPx TRIS Control CCPxCAP<1:0> CCPRxH IOC_interrup t 11 C2OUT_syn c(1) 10 C1OUT_syn c 01 CCP x 16 Prescaler 1,4,16 set CCPxIF and Edge Detect 16 00 MODE <3:0> Note 1: 23.1.2 CCPRxL TMR1H TMR1L PIC16(L)F1613 Only TIMER1 MODE RESOURCE 23.1.5 CAPTURE DURING SLEEP Timer1 must be running in Timer mode or Synchronized Counter mode for the CCP module to use the capture feature. In Asynchronous Counter mode, the capture operation may not work. Capture mode depends upon the Timer1 module for proper operation. There are two options for driving the Timer1 module in Capture mode. It can be driven by the instruction clock (FOSC/4), or by an external clock source. See Section21.0 “Timer1/3/5 Module with Gate Control” for more information on configuring Timer1. When Timer1 is clocked by FOSC/4, Timer1 will not increment during Sleep. When the device wakes from Sleep, Timer1 will continue from its previous state. 23.1.3 SOFTWARE INTERRUPT MODE When the Capture mode is changed, a false capture interrupt may be generated. The user should keep the CCPxIE interrupt enable bit of the PIEx register clear to avoid false interrupts. Additionally, the user should clear the CCPxIF interrupt flag bit of the PIRx register following any change in Operating mode. Note: 23.1.4 Clocking Timer1 from the system clock (FOSC) should not be used in Capture mode. In order for Capture mode to recognize the trigger event on the CCPx pin, Timer1 must be clocked from the instruction clock (FOSC/4) or from an external clock source. CCP PRESCALER There are four prescaler settings specified by the MODE<3:0> bits of the CCPxCON register. Whenever the CCP module is turned off, or the CCP module is not in Capture mode, the prescaler counter is cleared. Any Reset will clear the prescaler counter. Capture mode will operate during Sleep when Timer1 is clocked by an external clock source. 23.1.6 ALTERNATE PIN LOCATIONS This module incorporates I/O pins that can be moved to other locations with the use of the alternate pin function register APFCON. To determine which pins can be moved and what their default locations are upon a Reset, see Section12.1 “Alternate Pin Function” for more information. 23.1.7 CAPTURE OUTPUT Whenever a capture occurs, the output of the CCP will go high for a period equal to one system clock period (1/FOSC). This output is available as an input signal to the CWG, as an auto-conversion trigger for the ADC, as an External Reset Signal for the TMR2 modules, as a window input to the SMT, and as an input to the CLC module. Switching from one capture prescaler to another does not clear the prescaler and may generate a false interrupt. To avoid this unexpected operation, turn the module off by clearing the EN bit of the CCPxCON register before changing the prescaler. 2014-2016 Microchip Technology Inc. DS40001737B-page 224 PIC12(L)F1612/16(L)F1613 23.2 All Compare modes can generate an interrupt. Compare Mode The Compare mode function described in this section is available and identical for all CCP modules. Figure 23-2 shows a simplified diagram of the compare operation. Compare mode makes use of the 16-bit Timer1 resource. The 16-bit value of the CCPRxH:CCPRxL register pair is constantly compared against the 16-bit value of the TMR1H:TMR1L register pair. When a match occurs, one of the following events can occur: 23.2.1 • • • • • • Toggle the CCPx output Set the CCPx output Clear the CCPx output Pulse the CCPx output Generate a Software Interrupt Optionally Reset TMR1 CCPx PIN CONFIGURATION The user must configure the CCPx pin as an output by clearing the associated TRIS bit. The CCPx pin function can be moved to alternate pins using the APFCON register (Register 12-1). Refer to Section12.1 “Alternate Pin Function” for more details. Clearing the CCPxCON register will force the CCPx compare output latch to the default low level. This is not the PORT I/O data latch. Note: The action on the pin is based on the value of the MODE<3:0> control bits of the CCPxCON register. At the same time, the interrupt flag CCPxIF bit is set. FIGURE 23-2: COMPARE MODE OPERATION BLOCK DIAGRAM Rev. 10-000 159A 12/10/201 3 To Peripherals CCPRxH CCPRxL OE set CCPxIF Comparator Output Logic 4 TMR1H TMR1L 2014-2016 Microchip Technology Inc. S R Q CCP x TRIS Control MODE<3:0> DS40001737B-page 225 PIC12(L)F1612/16(L)F1613 23.2.2 TIMER1 MODE RESOURCE In Compare mode, Timer1 must be running in either Timer mode or Synchronized Counter mode. The compare operation may not work in Asynchronous Counter mode. See Section21.0 “Timer1/3/5 Module with Gate Control” for more information on configuring Timer1. Note: 23.2.3 Clocking Timer1 from the system clock (FOSC) should not be used in Compare mode. In order for Compare mode to recognize the trigger event on the CCPx pin, TImer1 must be clocked from the instruction clock (FOSC/4) or from an external clock source. SOFTWARE INTERRUPT MODE When Generate Software Interrupt mode is chosen (MODE<3:0> = 1010), the CCPx module does not assert control of the CCPx pin (see the CCPxCON register). 23.2.4 COMPARE DURING SLEEP The Compare mode is dependent upon the system clock (FOSC) for proper operation. Since FOSC is shut down during Sleep mode, the Compare mode will not function properly during Sleep. 23.2.5 ALTERNATE PIN LOCATIONS This module incorporates I/O pins that can be moved to other locations with the use of the alternate pin function register, APFCON. To determine which pins can be moved and what their default locations are upon a Reset, see Section12.1 “Alternate Pin Function” for more information. 23.2.6 CAPTURE OUTPUT When in Compare mode, the CCP will provide an output upon the 16-bit value of the CCPRxH:CCPRxL register pair matching the TMR1H:TMR1L register pair. The compare output depends on which Compare mode the CCP is configured as. If the MODE bits of CCPxCON register are equal to ‘1011’ or ‘1010’, the CCP module will output high, while TMR1 is equal to CCPRxH:CCPRxL register pair. This means that the pulse width is determined by the TMR1 prescaler. If the MODE bits of CCPxCON are equal to ‘0001’ or ‘0010’, the output will toggle upon a match, going from ‘0’ to ‘1’ or vice-versa. If the MODE bits of CCPxCON are equal to ‘1001’, the output is cleared on a match, and if the MODE bits are equal to ‘1000’, the output is set on a match. This output is available as an input signal to the CWG, as an auto-conversion trigger for the ADC, as an external Reset signal for the TMR2 modules, as a window input to the SMT, and as an input to the CLC module. 2014-2016 Microchip Technology Inc. DS40001737B-page 226 PIC12(L)F1612/16(L)F1613 23.3 The term duty cycle describes the proportion of the on time to the off time and is expressed in percentages, where 0% is fully off and 100% is fully on. A lower duty cycle corresponds to less power applied and a higher duty cycle corresponds to more power applied. PWM Overview Pulse-Width Modulation (PWM) is a scheme that provides power to a load by switching quickly between fully on and fully off states. The PWM signal resembles a square wave where the high portion of the signal is considered the on state and the low portion of the signal is considered the off state. The high portion, also known as the pulse width, can vary in time and is defined in steps. A larger number of steps applied, which lengthens the pulse width, also supplies more power to the load. Lowering the number of steps applied, which shortens the pulse width, supplies less power. The PWM period is defined as the duration of one complete cycle or the total amount of on and off time combined. PWM resolution defines the maximum number of steps that can be present in a single PWM period. A higher resolution allows for more precise control of the pulse width time and in turn the power that is applied to the load. FIGURE 23-3: SIMPLIFIED PWM BLOCK DIAGRAM Rev. 10-000157A 10/14/2015 Duty cycle registers CCPRxH CCPRxL CCPx_out To Peripherals set CCPIF 10-bit Latch(2) (Not visible to user) OE Comparator R Q CCPx S TRIS Control TMR2 Module R TMR2 (1) ERS logic Comparator CCPx_pset PR2 Note 1: 2: 8-bit timer is concatenated with two bits generated by Fosc or two bits of the internal prescaler to create 10-bit time-base. The alignment of the 10 bits from the CCPR register is determined by the FMT bit. Refer to Figure 23-4 for more information. 2014-2016 Microchip Technology Inc. DS40001737B-page 227 PIC12(L)F1612/16(L)F1613 23.3.1 STANDARD PWM OPERATION 23.3.2 SETUP FOR PWM OPERATION The standard PWM function described in this section is available and identical for all CCP modules. The following steps should be taken when configuring the CCP module for standard PWM operation: The standard PWM mode generates a Pulse-Width Modulation (PWM) signal on the CCPx pin with up to 10 bits of resolution. The period, duty cycle, and resolution are controlled by the following registers: 1. • PR2/4/6 registers • T2CON/T4CON/T6CON registers • CCPRxH:CCPRxL register pair 3. Figure shows a simplified block diagram of PWM operation. Note 1: The corresponding TRIS bit must be cleared to enable the PWM output on the CCPx pin. 2. 4. 5. 6. 2: Clearing the CCPxCON register will relinquish control of the CCPx pin. 7. Disable the CCPx pin output driver by setting the associated TRIS bit. Determine which timer will be used to clock the CCP; Timer2/4/6. Load the associated PR2/4/6 register with the PWM period value. Configure the CCP module for the PWM mode by loading the CCPxCON register with the appropriate values. Load the CCPRxH:CCPRxL register pair with the PWM duty cycle value. Configure and start Timer2/4/6: • Clear the TMR2IF/TMR4IF/TMR6IF interrupt flag bit of the PIRx register. See Note below. • Configure the CKPS bits of the TxCON register with the Timer prescale value. • Enable the Timer by setting the ON bit of the TxCON register. Enable PWM output pin: • Wait until the Timer overflows and the TMR2IF/TMR4IF/TMR6IF bit of the PIRx register is set. See Note below. • Enable the CCPx pin output driver by clearing the associated TRIS bit. Note: 2014-2016 Microchip Technology Inc. In order to send a complete duty cycle and period on the first PWM output, the above steps must be included in the setup sequence. If it is not critical to start with a complete PWM signal on the first output, then step 6 may be ignored. DS40001737B-page 228 PIC12(L)F1612/16(L)F1613 23.4 CCP/PWM Clock Selection The PIC12(L)F1612/16(L)F1613 allows each individual CCP and PWM module to select the timer source that controls the module. Each module has an independent selection. As there are up to three 8-bit timers with auto-reload (Timer2/4/6), PWM mode on the CCP and PWM modules can use any of these timers. The CCPTMRS register is used to select which timer is used. 23.4.1 USING THE TMR2/4/6 WITH THE CCP MODULE This device has a new version of the TMR2 module that has many new modes, which allow for greater customization and control of the PWM signals than older parts. Refer to Section23.5 “Operation Examples” for examples of PWM signal generation using the different modes of Timer2. The CCP operation requires that the timer used as the PWM time base has the FOSC/4 clock source selected. 23.4.2 PWM PERIOD The PWM period is specified by the PR2/4/6 register of Timer2/4/6. The PWM period can be calculated using the formula of Equation 23-1. EQUATION 23-1: PWM PERIOD PWM Period = PR2 + 1 4 T OSC (TMR2 Prescale Value) Note 1: TOSC = 1/FOSC Significant two bits of the duty cycle should be written to bits <7:6> of the CCPRxL register and the Most Significant eight bits to the CCPRxH register. This is illustrated in Figure 23-4. These bits can be written at any time. The duty cycle value is not latched into the internal latch until after the period completes (i.e., a match between PR2/4/6 and TMR2/4/6 registers occurs). Equation 23-2 is used to calculate the PWM pulse width. Equation 23-3 is used to calculate the PWM duty cycle ratio. EQUATION 23-2: PULSE WIDTH Pulse Width = CCPRxH:CCPRxL T OSC (TMR2 Prescale Value) EQUATION 23-3: DUTY CYCLE RATIO CCPRxH:CCPRxL Duty Cycle Ratio = -------------------------------------------------4 PRx + 1 The PWM duty cycle registers are double buffered for glitchless PWM operation. The 8-bit timer TMR2/4/6 register is concatenated with either the 2-bit internal system clock (FOSC), or two bits of the prescaler, to create the 10-bit time base. The system clock is used if the Timer2/4/6 prescaler is set to 1:1. When the 10-bit time base matches the internal buffer register, then the CCPx pin is cleared (see Figure ). FIGURE 23-4: CCPx DUTY-CYCLE ALIGNMENT When TMR2/4/6 is equal to its respective PR2/4/6 register, the following three events occur on the next increment cycle: • TMR2/4/6 is cleared • The CCPx pin is set. (Exception: If the PWM duty cycle = 0%, the pin will not be set.) • The PWM duty cycle is latched from the CCPRxH:CCPRxL pair into the internal 10-bit latch. Note: 23.4.3 Rev. 10-000 160A 12/9/201 3 CCPRxH CCPRxL 7 6 5 4 3 2 1 0 7 6 5 4 3 2 1 0 FMT = 1 FMT = 0 CCPRxH CCPRxL 7 6 5 4 3 2 1 0 7 6 5 4 3 2 1 0 10-bit Duty Cycle The Timer postscaler (see Figure ) is not used in the determination of the PWM frequency. 9 8 7 6 5 4 3 2 1 0 PWM DUTY CYCLE The PWM duty cycle is specified by writing a 10-bit value to two registers: the CCPRxH:CCPRxL register pair. Where the particular bits go is determined by the FMT bit of the CCPxCON register. If FMT = 0, the two Most Significant bits of the duty cycle value should be written to bits <1:0> of CCPRxH register and the remaining eight bits to the CCPRxL register. If FMT = 1, the Least 2014-2016 Microchip Technology Inc. 23.4.4 PWM RESOLUTION The resolution determines the number of available duty cycles for a given period. For example, a 10-bit resolution will result in 1024 discrete duty cycles, whereas an 8-bit resolution will result in 256 discrete duty cycles. DS40001737B-page 229 PIC12(L)F1612/16(L)F1613 The maximum PWM resolution is ten bits when PR2/4/6 is 255. The resolution is a function of the PR2/4/6 register value as shown by Equation 23-4. EQUATION 23-4: PWM RESOLUTION log 4 PR2 + 1 Resolution = ------------------------------------------ bits log 2 Note: If the pulse width value is greater than the period, the assigned PWM pin(s) will remain unchanged. 2014-2016 Microchip Technology Inc. DS40001737B-page 230 PIC12(L)F1612/16(L)F1613 TABLE 23-1: EXAMPLE PWM FREQUENCIES AND RESOLUTIONS (FOSC = 20 MHz) PWM Frequency 1.22 kHz 4.88 kHz 19.53 kHz 78.12 kHz 156.3 kHz 208.3 kHz 16 4 1 1 1 1 0xFF 0xFF 0xFF 0x3F 0x1F 0x17 10 10 10 8 7 6 Timer Prescale PR2 Value Maximum Resolution (bits) TABLE 23-2: EXAMPLE PWM FREQUENCIES AND RESOLUTIONS (FOSC = 8 MHz) PWM Frequency 1.22 kHz Timer Prescale PR2 Value 19.61 kHz 76.92 kHz 153.85 kHz 200.0 kHz 16 4 1 1 1 1 0x65 0x65 0x65 0x19 0x0C 0x09 8 8 8 6 5 5 Maximum Resolution (bits) 23.4.5 4.90 kHz CHANGES IN SYSTEM CLOCK FREQUENCY The PWM frequency is derived from the system clock frequency. Any changes in the system clock frequency will result in changes to the PWM frequency. See Section5.0 “Oscillator Module” for additional details. 23.4.6 EFFECTS OF RESET Any Reset will force all ports to Input mode and the CCP registers to their Reset states. 23.4.7 PWM OUTPUT The output of the CCP in PWM mode is the PWM signal generated by the module and described above. This output is available as an input signal to the CWG, as an auto-conversion trigger for the ADC, as an external Reset signal for the TMR2 modules, as a window input to the SMT, and as an input to the CLC module. 2014-2016 Microchip Technology Inc. DS40001737B-page 231 PIC12(L)F1612/16(L)F1613 23.5 Register Definitions: CCP Control REGISTER 23-1: CCPxCON: CCPx CONTROL REGISTER R/W-0/0 U/U-0/0 R-x R/W-0/0 EN — OUT FMT R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 MODE<3:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Reset ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7 EN: CCPx Module Enable bit 1 = CCPx is enabled 0 = CCPx is disabled bit 6 Unimplemented: Read as ‘0’ bit 5 OUT: CCPx Output Data bit (read-only) bit 4 FMT: CCPW (Pulse-Width) Alignment bit If MODE = PWM Mode 1 = Left-aligned format, CCPRxH <7> is the MSb of the PWM duty cycle 0 = Right-aligned format, CCPRxL<0> is the LSb of the PWM duty cycle bit 3-0 MODE<3:0>: CCPx Mode Selection bit 11xx = PWM mode 1011 = 1010 = 1001 = 1000 = Compare mode: Pulse output, clear TMR1 Compare mode: Pulse output (0 - 1 - 0) Compare mode: clear output on compare match Compare mode: set output on compare match 0111 = 0110 = 0101 = 0100 = Capture mode: every 16th rising edge Capture mode: every 4th rising edge Capture mode: every rising edge Capture mode: every falling edge 0011 = 0010 = 0001 = 0000 = Capture mode: every rising or falling edge Compare mode: toggle output on match Compare mode: Toggle output and clear TMR1 on match Capture/Compare/PWM off (resets CCPx module) (reserved for backwards compatibility) 2014-2016 Microchip Technology Inc. DS40001737B-page 232 PIC12(L)F1612/16(L)F1613 REGISTER 23-2: CCPTMRS: PWM TIMER SELECTION CONTROL REGISTER 0 U-0 U-0 U-0 U-0 — — — — R/W-0/0 R/W-0/0 R/W-0/0 C2TSEL<1:0> bit 7 R/W-0/0 C1TSEL<1:0> bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-4 Unimplemented: Read as ‘0’ bit 3-2 C2TSEL<1:0>: CCP2 (PWM2) Timer Selection bits 11 = Reserved 10 = CCP2 is based off Timer6 in PWM mode 01 = CCP2 is based off Timer4 in PWM mode 00 = CCP2 is based off Timer2 in PWM mode bit 1-0 C1TSEL<1:0>: CCP1 (PWM1) Timer Selection bits 11 = Reserved 10 = CCP1 is based off Timer6 in PWM mode 01 = CCP1 is based off Timer4 in PWM mode 00 = CCP1 is based off Timer2 in PWM mode 2014-2016 Microchip Technology Inc. DS40001737B-page 233 PIC12(L)F1612/16(L)F1613 REGISTER 23-3: R/W-0/0 CCPRxL: CCPx LOW BYTE REGISTER R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 CCPR<7:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Reset ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-0 MODE = Capture Mode CCPRxL<7:0>: LSB of captured TMR1 value MODE = Compare Mode CCPRxL<7:0>: LSB compared to TMR1 value MODE = PWM Mode && FMT = 0 CCPRxL<7:0>: CCPW<7:0> — Pulse width Least Significant eight bits MODE = PWM Mode && FMT = 1 CCPRxL<7:6>: CCPW<1:0> — Pulse width Least Significant two bits CCPRxL<5:0>: Not used 2014-2016 Microchip Technology Inc. DS40001737B-page 234 PIC12(L)F1612/16(L)F1613 REGISTER 23-4: R/W-0/0 CCPRxH: CCPx HIGH BYTE REGISTER R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 CCPR<15:8> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Reset ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-0 MODE = Capture Mode CCPRxH<7:0>: MSB of captured TMR1 value MODE = Compare Mode CCPRxH<7:0>: MSB compared to TMR1 value MODE = PWM Mode && FMT = 0 CCPRxH<7:2>: Not used CCPRxH<1:0>: CCPW<9:8> — Pulse width Most Significant two bits MODE = PWM Mode && FMT = 1 CCPRxH<7:0>: CCPW<9:2> — Pulse width Most Significant eight bits REGISTER 23-5: CCPxCAP: CCPx CAPTURE INPUT SELECTION REGISTER U-0 U-0 U-0 U-0 U-0 U-0 — — — — — — R/W-0/0 bit 7 R/W-0/0 CTS<1:0> bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Reset ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-2 Unimplemented: Read as ‘0’ bit 1-0 CTS<1:0>: Capture Trigger Input Selection bits 11 = IOC_interrupt 10 = C2_OUT_sync(1) 01 = C1_OUT_sync 00 = CCPx pin Note 1: PIC16(L)F1613 only. Reserved on PIC12(L)F1612. 2014-2016 Microchip Technology Inc. DS40001737B-page 235 PIC12(L)F1612/16(L)F1613 TABLE 23-3: Name APFCON CCPxCON SUMMARY OF REGISTERS ASSOCIATED WITH STANDARD PWM Bit 7 — EN Bit 6 Bit 5 CWGASEL(2) CWGBSEL(2) — OUT CCPRxL Capture/Compare/PWM Register x (LSB) CCPRxH Capture/Compare/PWM Register x (MSB) CCPTMRS INTCON P4TSEL<1:0> Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register on Page — T1GSEL — CCP2SEL(3) CCP1SEL(2) 132 FMT MODE<3:0> 232 234 235 P3TSEL<1:0> C2TSEL<1:0> C1TSEL<1:0> 233 GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF 82 PIE1 TMR1GIE ADIE — — — CCP1IE TMR2IE TMR1IE 83 PIE2 — C2IE(1) C1IE — — TMR6IE TMR4IE CCP2IE PR2 T2CON Timer2 Period Register ON CKPS<2:0> TMR2 Timer2 Module Register PR4 Timer4 Period Register T4CON ON 84 243* OUTPS<3:0> 262 243* 243* CKPS<2:0> OUTPS<3:0> 262 TMR4 Timer4 Module Register 243* PR6 Timer6 Period Register 243* T6CON TMR6 TRISA ON CKPS<2:0> OUTPS<3:0> 262 Timer6 Module Register — — 243* TRISA5 TRISA4 —(1) TRISA2 TRISA1 TRISA0 135 Legend: — = Unimplemented location, read as ‘0’. Shaded cells are not used by the PWM. * Page provides register information. Note 1: Unimplemented, read as ‘1’. 2014-2016 Microchip Technology Inc. DS40001737B-page 236 PIC12(L)F1612/16(L)F1613 24.0 COMPLEMENTARY WAVEFORM GENERATOR (CWG) MODULE The Complementary Waveform Generator (CWG) produces half-bridge, full-bridge, and steering of PWM waveforms. It is backwards compatible with previous ECCP functions. The CWG has the following features: • Six operating modes: - Synchronous Steering mode - Asynchronous Steering mode - Full-Bridge mode, Forward (PIC16(L)F1613 only) - Full-Bridge mode, Reverse (PIC16(L)F1613 only) - Half-Bridge mode - Push-Pull mode • Output polarity control • Output steering - Synchronized to rising event - Immediate effect • Independent 6-bit rising and falling event deadband timers - Clocked dead band - Independent rising and falling dead-band enables • Auto-shutdown control with: - Selectable shutdown sources - Auto-restart enable - Auto-shutdown pin override control 2014-2016 Microchip Technology Inc. 24.1 Fundamental Operation The CWG module can operate in six different modes, as specified by MODE of the CWGxCON0 register: • Half-Bridge mode (Figure 24-9) • Push-Pull mode (Figure 28-2) - Full-Bridge mode, Forward (Figure 28-3) (PIC16(L)F1613 only) - Full-Bridge mode, Reverse (Figure 28-3) (PIC16(L)F1613 only) • Steering mode (Figure 24-10) • Synchronous Steering mode (Figure 24-11) It may be necessary to guard against the possibility of circuit faults or a feedback event arriving too late or not at all. In this case, the active drive must be terminated before the Fault condition causes damage. Thus, all output modes support auto-shutdown, which is covered in 24.10 “Auto-Shutdown”. 24.1.1 HALF-BRIDGE MODE In Half-Bridge mode, two output signals are generated as true and inverted versions of the input as illustrated in Figure 24-9. A non-overlap (dead-band) time is inserted between the two outputs to prevent shoot through current in various power supply applications. Dead-band control is described in Section 24.5 “Dead-Band Control”. The unused outputs CWGxC and CWGxD drive similar signals, with polarity independently controlled by the POLC and POLD bits of the CWGxCON1 register, respectively. DS40001737B-page 237 2014-2016 Microchip Technology Inc. FIGURE 24-1: SIMPLIFIED CWG BLOCK DIAGRAM (HALF BRIDGE MODE) Rev. 10-000 166A 12/19/201 3 Reserved 111 Reserved 110 Reserved 101 CCP2_out 100 CCP1_out 011 C2OUT_sync(1) 010 C1OUT_sync 001 CWGxIN 000 CWG_data Rising Deadband Block CWG_dataA clock signal_out CWG_dataC signal_in D Q CWGxISM<2:0> E R Q Falling Deadband Block signal_out signal_in EN SHUTDOWN HFINTOSC 1 FOSC 0 CWGxCLK<0> Note 1: PIC16(L)F1613 Only CWG_dataD DS40001737B-page 238 PIC12(L)F1612/16(L)F1613 CWG_dataB clock PIC12(L)F1612/16(L)F1613 24.1.2 PUSH-PULL MODE In Push-Pull mode, two output signals are generated, alternating copies of the input as illustrated in Figure 28-2. This alternation creates the push-pull effect required for driving some transformer-based power supply designs. The push-pull sequencer is reset whenever EN = 0 or if an auto-shutdown event occurs. The sequencer is clocked by the first input pulse, and the first output appears on CWGxA. The unused outputs CWGxC and CWGxD drive copies of CWGxA and CWGxB, respectively, but with polarity controlled by the POLC and POLD bits of the CWGxCON1 register, respectively. 24.1.3 FULL-BRIDGE MODES In Forward and Reverse Full-Bridge modes, three outputs drive static values while the fourth is modulated by the input data signal. In Forward Full-Bridge mode, CWGxA is driven to its active state, CWGxB and CWGxC are driven to their inactive state, and CWGxD is modulated by the input signal. In Reverse Full-Bridge mode, CWGxC is driven to its active state, CWGxA and CWGxD are driven to their inactive states, and CWGxB is modulated by the input signal. In Full-Bridge mode, the dead-band period is used when there is a switch from forward to reverse or vice-versa. This dead-band control is described in Section 24.5 “Dead-Band Control”, with additional details in Section 24.6 “Rising Edge and Reverse Dead Band” and Section 24.7 “Falling Edge and Forward Dead Band”. The mode selection may be toggled between forward and reverse by toggling the MODE<0> bit of the CWGxCON0 while keeping MODE<2:1> static, without disabling the CWG module. 2014-2016 Microchip Technology Inc. DS40001737B-page 239 2014-2016 Microchip Technology Inc. FIGURE 24-2: SIMPLIFIED CWG BLOCK DIAGRAM (PUSH-PULL MODE) Rev. 10-000 167A 12/19/201 3 Reserved 111 Reserved 110 Reserved 101 CCP2_out 100 CCP1_out 011 (1) 010 C1OUT_sync 001 CWGxIN 000 C2OUT_sync CWG_data D Q CWG_dataA Q CWG_dataC R CWG_dataB D Q E Q CWG_dataD CWGxISM<2:0> SHUTDOWN Note 1: PIC16(L)F1613 Only DS40001737B-page 240 PIC12(L)F1612/16(L)F1613 EN R 2014-2016 Microchip Technology Inc. FIGURE 24-3: SIMPLIFIED CWG BLOCK DIAGRAM (FORWARD AND REVERSE FULL-BRIDGE MODES) Rev. 10-000 165A 12/19/201 3 Reserved 111 Reserved 110 Reserved 101 CCP2_out 100 CCP1_out 011 (1) 010 C1OUT_sync 001 CWGxIN 000 C2OUT_sync Reverse Deadband Block MODE0 clock signal_out signal_in CWG_dataA D D Q Q CWG_dataB Q CWG_dataC CWGxISM<2:0> E R CWG_dataD Q clock signal_out Forward Deadband Block EN CWG_data SHUTDOWN HFINTOSC FOSC 1 0 CWGxCLK<0> Note 1: PIC16(L)F1613 Only DS40001737B-page 241 PIC12(L)F1612/16(L)F1613 signal_in PIC12(L)F1612/16(L)F1613 24.1.4 STEERING MODES In Steering modes, the data input can be steered to any or all of the four CWG output pins. In Synchronous Steering mode, changes to steering selection registers take effect on the next rising input. In Non-Synchronous mode, steering takes effect on the next instruction cycle. Additional details are provided in Section 24.9 “CWG Steering Mode”. 2014-2016 Microchip Technology Inc. DS40001737B-page 242 2014-2016 Microchip Technology Inc. FIGURE 24-4: SIMPLIFIED CWG BLOCK DIAGRAM (OUTPUT STEERING MODES) Rev. 10-000 164A 12/19/201 3 Reserved 111 Reserved 110 Reserved 101 CCP2_out 100 CCP1_out 011 C2OUT_sync(1) 010 C1OUT_sync 001 CWGxIN 000 CWG_dataA CWG_data CWG_dataC Q CWGxISM <2:0> E EN SHUTDOWN PIC16(L)F1613 Only R Q DS40001737B-page 243 PIC12(L)F1612/16(L)F1613 CWG_dataD D Note 1: CWG_dataB PIC12(L)F1612/16(L)F1613 24.2 Clock Source The CWG module allows the following clock sources to be selected: • Fosc (system clock) • HFINTOSC (16 MHz only) The clock sources are selected using the CS bit of the CWGxCLKCON register. 24.3 Selectable Input Sources The CWG generates the output waveforms from the input sources in Table 24-1. TABLE 24-1: SELECTABLE INPUT SOURCES Source Peripheral CWG pin Signal Name CWGxIN pin Comparator C1 Comparator C2 C1_OUT_sync (1) C2_OUT_sync CCP1 CCP1_out CCP2 CCP2_out Note 1: PIC16(L)F1613 only. The input sources are selected using the CWGxISM register. 24.4 24.4.1 Output Control OUTPUT ENABLES Each CWG output pin has individual output enable control. Output enables are selected with the Gx1OEx <3:0> bits. When an output enable control is cleared, the module asserts no control over the pin. When an output enable is set, the override value or active PWM waveform is applied to the pin per the port priority selection. The output pin enables are dependent on the module enable bit, EN of the CWGxCON0 register. When EN is cleared, CWG output enables and CWG drive levels have no effect. 24.4.2 POLARITY CONTROL The polarity of each CWG output can be selected independently. When the output polarity bit is set, the corresponding output is active-high. Clearing the output polarity bit configures the corresponding output as active-low. However, polarity does not affect the override levels. Output polarity is selected with the POLx bits of the CWGxCON1. Auto-shutdown and steering options are unaffected by polarity. 2014-2016 Microchip Technology Inc. DS40001737B-page 244 PIC12(L)F1612/16(L)F1613 FIGURE 24-5: CWG OUTPUT BLOCK DIAGRAM Rev. 10-000 171A 12/19/201 3 LSAC<1:0> CWG_dataA 1 POLA OVRA ‘1’ 11 ‘0’ 10 High Z 01 00 0 OEA TRIS Control 1 CWGxA 0 STRA(1) LSBD<1:0> CWG_dataB 1 POLB OVRB ‘1’ 11 ‘0’ 10 High Z 01 00 0 OEB TRIS Control 1 CWGxB 0 STRB(1) LSAC<1:0> CWG_dataC 1 POLC OVRC ‘1’ 11 ‘0’ 10 High Z 01 00 0 OEC TRIS Control 1 CWGxC(2) 0 STRC(1) LSBD<1:0> CWG_dataD 1 POLD OVRD ‘1’ 11 ‘0’ 10 High Z 01 0 00 OED TRIS Control 1 0 CWGxD(2) STRD(1) CWG_shutdown Note 1: 2: STRx is held to 1 in all modes other than Output Steering Mode. PIC16(L)F1613 ONLY 2014-2016 Microchip Technology Inc. DS40001737B-page 245 PIC12(L)F1612/16(L)F1613 24.5 Dead-Band Control The dead-band control provides non-overlapping PWM signals to prevent shoot-through current in PWM switches. Dead-band operation is employed for HalfBridge and Full-Bridge modes. The CWG contains two 6-bit dead-band counters. One is used for the rising edge of the input source control in Half-Bridge mode or for reverse dead-band Full-Bridge mode. The other is used for the falling edge of the input source control in Half-Bridge mode or for forward dead band in FullBridge mode. Dead band is timed by counting CWG clock periods from zero up to the value in the rising or falling deadband counter registers. See CWGxDBR and CWGxDBF registers, respectively. 24.5.1 24.7 Falling Edge and Forward Dead Band CWGxDBF controls the dead-band time at the leading edge of CWGxB (Half-Bridge mode) or the leading edge of CWGxD (Full-Bridge mode). The CWGxDBF value is double-buffered. When EN = 0, the CWGxDBF register is loaded immediately when CWGxDBF is written. When EN = 1 then software must set the LD bit of the CWGxCON0 register, and the buffer will be loaded at the next falling edge of the CWG input signal. If the input source signal is not present for enough time for the count to be completed, no output will be seen on the respective output. Refer to Figure 24.6 and Figure 24-7 for examples. DEAD-BAND FUNCTIONALITY IN HALF-BRIDGE MODE In Half-Bridge mode, the dead-band counters dictate the delay between the falling edge of the normal output and the rising edge of the inverted output. This can be seen in Figure 24-9. 24.5.2 DEAD-BAND FUNCTIONALITY IN FULL-BRIDGE MODE In Full-Bridge mode, the dead-band counters are used when undergoing a direction change. The MODE<0> bit of the CWGxCON0 register can be set or cleared while the CWG is running, allowing for changes from Forward to Reverse mode. The CWGxA and CWGxC signals will change immediately upon the first rising input edge following a direction change, but the modulated signals (CWGxB or CWGxD, depending on the direction of the change) will experience a delay dictated by the dead-band counters. This is demonstrated in Figure 28-3. 24.6 Rising Edge and Reverse Dead Band CWGxDBR controls the rising edge dead-band time at the leading edge of CWGxA (Half-Bridge mode) or the leading edge of CWGxB (Full-Bridge mode). The CWGxDBR value is double-buffered. When EN = 0, the CWGxDBR register is loaded immediately when CWGxDBR is written. When EN = 1, then software must set the LD bit of the CWGxCON0 register, and the buffer will be loaded at the next falling edge of the CWG input signal. If the input source signal is not present for enough time for the count to be completed, no output will be seen on the respective output. 2014-2016 Microchip Technology Inc. DS40001737B-page 246 2014-2016 Microchip Technology Inc. FIGURE 24-6: DEAD-BAND OPERATION CWGXDBR = 0X01, CWGXDBF = 0X02 cwg_clock Input Source CWGxA CWGxB DEAD-BAND OPERATION, CWGXDBR = 0X03, CWGXDBF = 0X04, SOURCE SHORTER THAN DEAD BAND cwg_clock Input Source CWGxA CWGxB DS40001737B-page 247 source shorter than dead band PIC12(L)F1612/16(L)F1613 FIGURE 24-7: PIC12(L)F1612/16(L)F1613 24.8 Dead-Band Uncertainty EQUATION 24-1: When the rising and falling edges of the input source are asynchronous to the CWG clock, it creates uncertainty in the dead-band time delay. The maximum uncertainty is equal to one CWG clock period. Refer to Equation 24-1 for more details. DEAD-BAND UNCERTAINTY 1 TDEADBAND_UNCERTAINTY = ----------------------------Fcwg_clock Example: FCWG_CLOCK = 16 MHz Therefore: 1 TDEADBAND_UNCERTAINTY = ----------------------------Fcwg_clock 1 = -----------------16MHz = 62.5ns FIGURE 24-8: EXAMPLE OF PWM DIRECTION CHANGE MODE0 CWGxA CWGxB CWGxC CWGxD No delay CWGxDBR No delay CWGxDBF CWGx_data Note 1:WGPOL{ABCD} = 0 2: The direction bit MODE<0> (Register 24-1) can be written any time during the PWM cycle, and takes effect at the next rising CWGx_data. 3: When changing directions, CWGxA and CWGxC switch at rising CWGx_data; modulated CWGxB and CWGxD are held inactive for the dead band duration shown; dead band affects only the first pulse after the direction change. FIGURE 24-9: CWG HALF-BRIDGE MODE OPERATION CWGx_clock CWGxA CWGxC Falling Event Dead Band Rising Event Dead Band Rising Event D Falling Event Dead Band CWGxB CWGxD CWGx_data Note: CWGx_rising_src = CCP1_out, CWGx_falling_src = ~CCP1_out 2014-2016 Microchip Technology Inc. DS40001737B-page 248 PIC12(L)F1612/16(L)F1613 24.9 24.9.1 CWG Steering Mode In Steering mode (MODE = 00x), the CWG allows any combination of the CWGxx pins to be the modulated signal. The same signal can be simultaneously available on multiple pins, or a fixed-value output can be presented. When the respective STRx bit of CWGxOCON0 is ‘0’, the corresponding pin is held at the level defined. When the respective STRx bit of CWGxOCON0 is ‘1’, the pin is driven by the input data signal. The user can assign the input data signal to one, two, three, or all four output pins. The POLx bits of the CWGxCON1 register control the signal polarity only when STRx = 1. The CWG auto-shutdown operation also applies in Steering modes as described in Section 24.10 “AutoShutdown”. An auto-shutdown event will only affect pins that have STRx = 1. FIGURE 24-10: STEERING SYNCHRONIZATION Changing the MODE bits allows for two modes of steering, synchronous and asynchronous. When MODE = 000, the steering event is asynchronous and will happen at the end of the instruction that writes to STRx (that is, immediately). In this case, the output signal at the output pin may be an incomplete waveform. This can be useful for immediately removing a signal from the pin. When MODE = 001, the steering update is synchronous and occurs at the beginning of the next rising edge of the input data signal. In this case, steering the output on/off will always produce a complete waveform. Figure 24-10 and Figure 24-11 illustrate the timing of asynchronous and synchronous steering, respectively. EXAMPLE OF STEERING EVENT AT END OF INSTRUCTION (MODE<2:0> = 000) Rising Event CWGx_data (Rising and Falling Source) STR<D:A> CWGx<D:A> OVR<D:A> Data OVR<D:A> follows CWGx_data FIGURE 24-11: EXAMPLE OF STEERING EVENT AT BEGINNING OF INSTRUCTION (MODE<2:0> = 001) CWGx_data (Rising and Falling Source) STR<D:A> CWGx<D:A> OVR<D:A> Data OVR<D:A> Data follows CWGx_data 2014-2016 Microchip Technology Inc. DS40001737B-page 249 PIC12(L)F1612/16(L)F1613 24.10 Auto-Shutdown 24.11 Operation During Sleep Auto-shutdown is a method to immediately override the CWG output levels with specific overrides that allow for safe shutdown of the circuit. The shutdown state can be either cleared automatically or held until cleared by software. The auto-shutdown circuit is illustrated in Figure 28-12. The CWG module operates independently from the system clock and will continue to run during Sleep, provided that the clock and input sources selected remain active. 24.10.1 • CWG module is enabled • Input source is active • HFINTOSC is selected as the clock source, regardless of the system clock source selected. SHUTDOWN The shutdown state can be entered by either of the following two methods: • Software generated • External Input 24.10.1.1 Software Generated Shutdown Setting the SHUTDOWN bit of the CWGxAS0 register will force the CWG into the shutdown state. When the auto-restart is disabled, the shutdown state will persist as long as the SHUTDOWN bit is set. The HFINTOSC remains active during Sleep when all the following conditions are met: In other words, if the HFINTOSC is simultaneously selected as the system clock and the CWG clock source, when the CWG is enabled and the input source is active, then the CPU will go idle during Sleep, but the HFINTOSC will remain active and the CWG will continue to operate. This will have a direct effect on the Sleep mode current. When auto-restart is enabled, the SHUTDOWN bit will clear automatically and resume operation on the next rising edge event. 24.10.2 EXTERNAL INPUT SOURCE External shutdown inputs provide the fastest way to safely suspend CWG operation in the event of a Fault condition. When any of the selected shutdown inputs goes active, the CWG outputs will immediately go to the selected override levels without software delay. Several input sources can be selected to cause a shutdown condition. All input sources are active-low. The sources are: • Comparator C1_OUT_sync • Comparator C2_OUT_sync (PIC16(L)F1613 only) • Timer2 – TMR2_postscaled • Timer4 – TMR4_postscaled • Timer6 – TMR6_postscaled • CWGxIN input pin Shutdown inputs are selected using the CWGxAS1 register (Register 24-6). Note: Shutdown inputs are level sensitive, not edge sensitive. The shutdown state cannot be cleared, except by disabling autoshutdown, as long as the shutdown input level persists. 2014-2016 Microchip Technology Inc. DS40001737B-page 250 2014-2016 Microchip Technology Inc. FIGURE 24-12: CWG SHUTDOWN BLOCK DIAGRAM Write ‘1’ to SHUTDOWN bit Rev. 10-000 172A 1/9/201 4 CWGxIN INAS C1OUT_sync C1AS C2OUT_sync (1) C2AS TMR2_postscaled TMR2AS S SHUTDOWN S D FREEZE REN TMR4_postscaled TMR4AS Write ‘0’ to SHUTDOWN bit TMR6_postscaled TMR6AS Note 1: Q Q CWG_shutdown R CWG_data CK PIC16(L)F1613 only PIC12(L)F1612/16(L)F1613 DS40001737B-page 251 PIC12(L)F1612/16(L)F1613 24.12 Configuring the CWG 24.12.2 The following steps illustrate how to properly configure the CWG. After an auto-shutdown event has occurred, there are two ways to resume operation: 1. • Software controlled • Auto-restart 2. 3. 4. 5. Ensure that the TRIS control bits corresponding to the desired CWG pins for your application are set so that the pins are configured as inputs. Clear the EN bit, if not already cleared. Set desired mode of operation with the MODE bits. Set desired dead-band times, if applicable to mode, with the CWGxDBR and CWGxDBF registers. Setup the following controls in the CWGxAS0 and CWGxAS1 registers. a. Select the desired shutdown source. b. Select both output overrides to the desired levels (this is necessary even if not using autoshutdown because start-up will be from a shutdown state). c. Set which pins will be affected by auto-shutdown with the CWGxAS1 register. d. Set the SHUTDOWN bit and clear the REN bit. 6. 7. Select the desired input source using the CWGxISM register. Configure the following controls. a. Select desired clock source CWGxCLKCON register. using the b. Select the desired output polarities using the CWGxCON1 register. c. Set the output enables for the desired outputs. 8. 9. Set the EN bit. Clear TRIS control bits corresponding to the desired output pins to configure these pins as outputs. 10. If auto-restart is to be used, set the REN bit and the SHUTDOWN bit will be cleared automatically. Otherwise, clear the SHUTDOWN bit to start the CWG. 24.12.1 AUTO-SHUTDOWN RESTART The restart method is selected with the REN bit of the CWGxAS0 register. Waveforms of software controlled and automatic restarts are shown in Figure 24-13 and Figure 24-14. 24.12.2.1 Software Controlled Restart When the REN bit of the CWGxAS0 register is cleared, the CWG must be restarted after an auto-shutdown event by software. Clearing the shutdown state requires all selected shutdown inputs to be low, otherwise the SHUTDOWN bit will remain set. The overrides will remain in effect until the first rising edge event after the SHUTDOWN bit is cleared. The CWG will then resume operation. 24.12.2.2 Auto-Restart When the REN bit of the CWGxAS0 register is set, the CWG will restart from the auto-shutdown state automatically. The SHUTDOWN bit will clear automatically when all shutdown sources go low. The overrides will remain in effect until the first rising edge event after the SHUTDOWN bit is cleared. The CWG will then resume operation. 24.12.3 ALTERNATE OUTPUT PINS This module incorporates outputs that can be moved to alternate pins with the use of the alternate pin function register APFCON. To determine which outputs can be moved and what their default pins are upon a Reset, see Section 12.1 “Alternate Pin Function” for more information. PIN OVERRIDE LEVELS The levels driven to the output pins, while the shutdown input is true, are controlled by the LSBD and LSAC bits of the CWGxAS0 register. LSBD<1:0> controls the CWGxB and D override levels and LSAC<1:0> controls the CWGxA and C override levels. The control bit logic level corresponds to the output logic drive level while in the shutdown state. The polarity control does not affect the override level. 2014-2016 Microchip Technology Inc. DS40001737B-page 252 2014-2016 Microchip Technology Inc. FIGURE 24-13: SHUTDOWN FUNCTIONALITY, AUTO-RESTART DISABLED (REN = 0, LSAC = 01, LSBD = 01) Shutdown Event Ceases REN Cleared by Software CWG Input Source Shutdown Source SHUTDOWN CWGxA CWGxC Tri-State (No Pulse) CWGxB CWGxD Tri-State (No Pulse) No Shutdown Output Resumes Shutdown SHUTDOWN FUNCTIONALITY, AUTO-RESTART ENABLED (REN = 1, LSAC = 01, LSBD = 01) Shutdown Event Ceases REN auto-cleared by hardware CWG Input Source Shutdown Source SHUTDOWN DS40001737B-page 253 CWGxA CWGxC Tri-State (No Pulse) CWGxB CWGxD Tri-State (No Pulse) No Shutdown Shutdown Output Resumes PIC12(L)F1612/16(L)F1613 FIGURE 24-14: PIC12(L)F1612/16(L)F1613 24.13 Register Definitions: CWG Control REGISTER 24-1: CWGxCON0: CWGx CONTROL REGISTER 0 R/W-0/0 R/W/HC-0/0 U-0 U-0 U-0 EN LD(1) — — — R/W-0/0 R/W-0/0 R/W-0/0 MODE<2:0> bit 7 bit 0 Legend: HC = Bit is cleared by hardware HS = Bit is set by hardware R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared q = Value depends on condition bit 7 EN: CWGx Enable bit 1 = Module is enabled 0 = Module is disabled bit 6 LD: CWGx Load Buffer bits(1) 1 = Buffers to be loaded on the next rising/falling event 0 = Buffers not loaded bit 5-3 Unimplemented: Read as ‘0’ bit 2-0 MODE<2:0>: CWGx Mode bits 111 = Reserved 110 = Reserved 101 = CWG outputs operate in Push-Pull mode 100 = CWG outputs operate in Half-Bridge mode 011 = CWG outputs operate in Reverse Full-Bridge mode 010 = CWG outputs operate in Forward Full-Bridge mode 001 = CWG outputs operate in Synchronous Steering mode 000 = CWG outputs operate in Steering mode Note 1: This bit can only be set after EN = 1 and cannot be set in the same instruction that EN is set. 2014-2016 Microchip Technology Inc. DS40001737B-page 254 PIC12(L)F1612/16(L)F1613 REGISTER 24-2: CWGxCON1: CWGx CONTROL REGISTER 1 U-0 U-0 R-x U-0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 — — IN — POLD POLC POLB POLA bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared q = Value depends on condition bit 7-6 Unimplemented: Read as ‘0’ bit 5 IN: CWG Input Value bit 4 Unimplemented: Read as ‘0’ bit 3 POLD: CWGxD Output Polarity bit 1 = Signal output is inverted polarity 0 = Signal output is normal polarity bit 2 POLC: CWGxC Output Polarity bit 1 = Signal output is inverted polarity 0 = Signal output is normal polarity bit 1 POLB: CWGxB Output Polarity bit 1 = Signal output is inverted polarity 0 = Signal output is normal polarity bit 0 POLA: CWGxA Output Polarity bit 1 = Signal output is inverted polarity 0 = Signal output is normal polarity 2014-2016 Microchip Technology Inc. DS40001737B-page 255 PIC12(L)F1612/16(L)F1613 REGISTER 24-3: CWGxDBR: CWGx RISING DEAD-BAND COUNTER REGISTER U-0 U-0 — — R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u DBR<5:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared q = Value depends on condition bit 7-6 Unimplemented: Read as ‘0’ bit 5-0 DBR<5:0>: Rising Event Dead-Band Value for Counter bits REGISTER 24-4: CWGxDBF: CWGx FALLING DEAD-BAND COUNTER REGISTER U-0 U-0 — — R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u DBF<5:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared q = Value depends on condition bit 7-6 Unimplemented: Read as ‘0’ bit 5-0 DBF<5:0>: Falling Event Dead-Band Value for Counter bits 2014-2016 Microchip Technology Inc. DS40001737B-page 256 PIC12(L)F1612/16(L)F1613 REGISTER 24-5: CWGxAS0: CWGx AUTO-SHUTDOWN CONTROL REGISTER 0 R/W/HS-0/0 R/W-0/0 SHUTDOWN(1, 2) REN R/W-0/0 R/W-1/1 LSBD<1:0> R/W-0/0 R/W-1/1 LSAC<1:0> U-0 U-0 — — bit 7 bit 0 Legend: HC = Bit is cleared by hardware HS = Bit is set by hardware R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared q = Value depends on condition bit 7 SHUTDOWN: Auto-Shutdown Event Status bit(1, 2) 1 = An Auto-Shutdown state is in effect 0 = No Auto-shutdown event has occurred bit 6 REN: Auto-Restart Enable bit 1 = Auto-restart enabled 0 = Auto-restart disabled bit 5-4 LSBD<1:0>: CWGxB and CWGxD Auto-Shutdown State Control bits 11 = A logic ‘1’ is placed on CWGxB/D when an auto-shutdown event is present 10 = A logic ‘0’ is placed on CWGxB/D when an auto-shutdown event is present 01 = Pin is tri-stated on CWGxB/D when an auto-shutdown event is present 00 = The inactive state of the pin, including polarity, is placed on CWGxB/D after the required dead-band interval bit 3-2 LSAC<1:0>: CWGxA and CWGxC Auto-Shutdown State Control bits 11 = A logic ‘1’ is placed on CWGxA/C when an auto-shutdown event is present 10 = A logic ‘0’ is placed on CWGxA/C when an auto-shutdown event is present 01 = Pin is tri-stated on CWGxA/C when an auto-shutdown event is present 00 = The inactive state of the pin, including polarity, is placed on CWGxA/C after the required dead-band interval bit 1-0 Unimplemented: Read as ‘0’ Note 1: This bit may be written while EN = 0 (CWGxCON0 register) to place the outputs into the shutdown configuration. 2: The outputs will remain in auto-shutdown state until the next rising edge of the input signal after this bit is cleared. 2014-2016 Microchip Technology Inc. DS40001737B-page 257 PIC12(L)F1612/16(L)F1613 REGISTER 24-6: U-1 CWGxAS1: CWGx AUTO-SHUTDOWN CONTROL REGISTER 1 R/W-0/0 — R/W-0/0 TMR6AS TMR4AS R/W-0/0 TMR2AS U-1 R/W-0/0 R/W-0/0 R/W-0/0 — C2AS(1) C1AS INAS bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared q = Value depends on condition bit 7 Unimplemented: Read as ‘1’ bit 6 TMR6AS: TMR6 Postscale Output bit 1 = TMR6 postscale shut-down is enabled 0 = TMR6 postscale shut-down is disabled bit 5 TMR4AS: TMR4 Postscale Output bit 1 = TMR4 postscale shut-down is enabled 0 = TMR4 postscale shut-down is disabled bit 4 TMR2AS: TMR2 Postscale Output bit 1 = TMR2 postscale shut-down is enabled 0 = TMR2 postscale shut-down is disabled bit 3 Unimplemented: Read as ‘1’ bit 2 C2AS: Comparator C2 Output bit(1) 1 = C2 output shut-down is enabled 0 = C2 output shut-down is disabled bit 1 C1AS: Comparator C1 Output bit 1 = C1 output shut-down is enabled 0 = C1 output shut-down is disabled bit 0 INAS: CWGx Input Pin bit 1 = CWGxIN input pin shut-down is enabled 0 = CWGxIN input pin shut-down is disabled Note 1: PIC16(L)F1613 only. 2014-2016 Microchip Technology Inc. DS40001737B-page 258 PIC12(L)F1612/16(L)F1613 CWGxOCON0: CWGx STEERING CONTROL REGISTER(1) REGISTER 24-7: R/W-0/0 R/W-0/0 OVRD OVRC R/W-0/0 OVRB R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 OVRA STRD(2) STRC(2) STRB(2) STRA(2) bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared q = Value depends on condition bit 7 OVRD: Steering Data D bit bit 6 OVRC: Steering Data C bit bit 5 OVRB: Steering Data B bit bit 4 OVRA: Steering Data A bit bit 3 STRD: Steering Enable D bit(2) 1 = CWGxD output has the CWGx_data waveform with polarity control from POLD bit 0 = CWGxD output is assigned the value of OVRD bit bit 2 STRC: Steering Enable C bit(2) 1 = CWGxC output has the CWGx_data waveform with polarity control from POLC bit 0 = CWGxC output is assigned the value of OVRC bit bit 1 STRB: Steering Enable B bit(2) 1 = CWGxB output has the CWGx_data waveform with polarity control from POLB bit 0 = CWGxB output is assigned the value of OVRB bit bit 0 STRA: Steering Enable A bit(2) 1 = CWGxA output has the CWGx_data waveform with polarity control from POLA bit 0 = CWGxA output is assigned the value of OVRA bit Note 1: The bits in this register apply only when MODE<2:0> = 00x. 2: This bit is effectively double-buffered when MODE<2:0> = 001. 2014-2016 Microchip Technology Inc. DS40001737B-page 259 PIC12(L)F1612/16(L)F1613 REGISTER 24-8: CWGxCLKCON: CWGx CLOCK SELECTION CONTROL REGISTER U-0 U-0 U-0 U-0 U-0 U-0 U-0 R/W-0/0 — — — — — — — CS bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared q = Value depends on condition bit 7-1 Unimplemented: Read as ‘0’ bit 0 CS: CWGx Clock Selection bit 1 = HFINTOSC 16 MHz is selected 0 = FOSC is selected REGISTER 24-9: CWGxISM: CWGx INPUT SELECTION REGISTER U-0 U-0 U-0 U-0 U-0 — — — — — R/W-0/0 R/W-0/0 R/W-0/0 IS<2:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared q = Value depends on condition bit 7-3 Unimplemented: Read as ‘0’ bit 2-0 GxIS<2:0>: CWGx Input Selection bits 111 = Reserved, do not use 110 = Reserved, do not use 101 = Reserved, do not use 100 = CCP2_out 011 = CCP1_out 010 = C2_OUT_sync(1) 001 = C1_OUT_sync 000 = CWGxIN pin Note 1: PIC16(L)F1613 only. 2014-2016 Microchip Technology Inc. DS40001737B-page 260 PIC12(L)F1612/16(L)F1613 TABLE 24-2: Name SUMMARY OF REGISTERS ASSOCIATED WITH CWG Bit 7 APFCON — Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register on Page — T1GSEL — CCP2SEL(2) CCP1SEL(1) 132 — — 257 C1AS INAS 258 — CS CWGASEL(2) CWGBSEL(2) CWG1AS0 SHUTDOWN REN LSBD<1:0> LSAC<1:0> CWG1AS1 — TMR6AS TMR4AS TMR2AS — C2AS — CWG1CLKCON — — — — — CWG1CON0 EN LD — — — CWG1CON1 — — IN — POLD CWG1DBF — — DBF<5:0> CWG1DBR — — DBR<5:0> CWG1ISM — — — — — OVRD OVRC OVRB OVRA STRD CWG1OCON0 Legend: Note 1: 2: MODE<2:0> POLC POLB POLA 255 256 256 IS<2:0> STRC 260 259 STRB 260 STRA 259 x = unknown, u = unchanged, – = unimplemented locations read as ‘0’. Shaded cells are not used by CWG. PIC12(L)F1612 only. PIC16(L)F1613 only. 2014-2016 Microchip Technology Inc. DS40001737B-page 261 PIC12(L)F1612/16(L)F1613 25.0 SIGNAL MEASUREMENT TIMER (SMT) The SMT is a 24-bit counter with advanced clock and gating logic, which can be configured for measuring a variety of digital signal parameters such as pulse width, frequency and duty cycle, and the time difference between edges on two signals. Features of the SMT include: • 24-bit timer/counter - Four 8-bit registers (SMTxTMRL/H/U) - Readable and writable - Optional 16-bit operating mode • Two 24-bit measurement capture registers • One 24-bit period match register • Multi-mode operation, including relative timing measurement • Interrupt on period match • Multiple clock, gate and signal sources • Interrupt on acquisition complete • Ability to read current input values Note: These devices implement two SMT modules. All references to SMTx apply to SMT1 and SMT2. 2014-2016 Microchip Technology Inc. DS40001737B-page 262 PIC12(L)F1612/16(L)F1613 FIGURE 25-1: SMTx BLOCK DIAGRAM Rev. 10-000 161A 1/2/201 4 Period Latch Set SMTxPRAIF SMT Clock Sync Circuit SMT_window SMTxPR Control Logic SMT Clock Sync Circuit SMT_signal Set SMTxIF Comparator Reset SMTxTMR Enable Reserved 111 Reserved 110 Reserved 101 MFINTOSC/16 100 LFINTOSC 011 HFINTOSC 010 FOSC/4 001 FOSC 000 Window Latch 24-bit Buffer SMTxCPR 24-bit Buffer SMTxCPW Set SMTxPWAIF Prescaler SMTxCLK<2:0> FIGURE 25-2: SMTx SIGNAL AND WINDOW BLOCK DIAGRAM Rev. 10-000 173A 12/19/201 3 Reserved 111 TMR6_postscaled 110 TMR4_postscaled 101 TMR2_postscaled 100 ZCD1_output 011 C2OUT_sync(1) 010 C1OUT_sync 001 SMTSIGx SMTxSIG<2:0> 2014-2016 Microchip Technology Inc. SMT_signal See SMTxWIN Register SMT_window 000 SMTxWIN<3:0> DS40001737B-page 263 PIC12(L)F1612/16(L)F1613 25.1 SMT Operation 25.2.3 PERIOD LATCH REGISTERS The core of the module is the 24-bit counter, SMTxTMR combined with a complex data acquisition front-end. Depending on the mode of operation selected, the SMT can perform a variety of measurements summarized in Table 25-1. The SMTxCPR registers are the 24-bit SMT period latch. They are used to latch in other values of the SMTxTMR when triggered by various other signals, which are determined by the mode the SMT is currently in. 25.1.1 The SMTxCPR registers can also be updated with the current value of the SMTxTMR value by setting the CPRUP bit in the SMTxSTAT register. CLOCK SOURCES Clock sources available to the SMT include: • • • • • FOSC FOSC/4 HFINTOSC 16 MHz LFINTOSC MFINTOSC 31.25 kHz The SMT clock source is selected by configuring the CSEL<2:0> bits in the SMTxCLK register. The clock source can also be prescaled using the PS<1:0> bits of the SMTxCON0 register. The prescaled clock source is used to clock both the counter and any synchronization logic used by the module. 25.1.2 PERIOD MATCH INTERRUPT Similar to other timers, the SMT triggers an interrupt when SMTxTMR rolls over to ‘0’. This happens when SMTxTMR = SMTxPR, regardless of mode. Hence, in any mode that relies on an external signal or a window to reset the timer, proper operation requires that SMTxPR be set to a period larger than that of the expected signal or window. 25.2 Basic Timer Function Registers The SMTxTMR time base and the SMTxCPW/SMTxPR/SMTxCPR buffer registers serve several functions and can be manually updated using software. 25.2.1 TIME BASE The SMTxTMR is the 24-bit counter that is the center of the SMT. It is used as the basic counter/timer for measurement in each of the modes of the SMT. It can be reset to a value of 24'h00_0000 by setting the RST bit of the SMTxSTAT register. It can be written to and read from software, but it is not guarded for atomic access, therefore reads and writes to the SMTxTMR should only be made when the GO = 0, or the software should have other measures to ensure integrity of SMTxTMR reads/writes. 25.2.2 PULSE WIDTH LATCH REGISTERS The SMTxCPW registers are the 24-bit SMT pulse width latch. They are used to latch in the value of the SMTxTMR when triggered by various signals, which are determined by the mode the SMT is currently in. The SMTxCPW registers can also be updated with the current value of the SMTxTMR value by setting the CPWUP bit of the SMTxSTAT register. 2014-2016 Microchip Technology Inc. 25.3 Halt Operation The counter can be prevented from rolling-over using the STP bit in the SMTxCON0 register. When halting is enabled, the period match interrupt persists until the SMTxTMR is reset (either by a manual reset, Section25.2.1 “Time Base”) or by clearing the SMTxGO bit of the SMTxCON1 register and writing the SMTxTMR values in software. 25.4 Polarity Control The three input signals for the SMT have polarity control to determine whether or not they are active high/positive edge or active low/negative edge signals. The following bits apply to Polarity Control: • WSEL bit (Window Polarity) • SSEL bit (Signal Polarity) • CSEL bit (Clock Polarity) These bits are located in the SMTxCON0 register. 25.5 Status Information The SMT provides input status information for the user without requiring the need to deal with the polarity of the incoming signals. 25.5.1 WINDOW STATUS Window status is determined by the WS bit of the SMTxSTAT register. This bit is only used in Windowed Measure, Gated Counter and Gated Window Measure modes, and is only valid when TS = 1, and will be delayed in time by synchronizer delays in non-Counter modes. 25.5.2 SIGNAL STATUS Signal status is determined by the AS bit of the SMTxSTAT register. This bit is used in all modes except Window Measure, Time of Flight and Capture modes, and is only valid when TS = 1, and will be delayed in time by synchronizer delays in non-Counter modes. 25.5.3 GO STATUS Timer run status is determined by the TS bit of the SMTxSTAT register, and will be delayed in time by synchronizer delays in non-Counter modes. DS40001737B-page 264 PIC12(L)F1612/16(L)F1613 25.6 25.6.1 Modes of Operation Timer mode is the simplest mode of operation where the SMTxTMR is used as a 16/24-bit timer. No data acquisition takes place in this mode. The timer increments as long as the SMTxGO bit has been set by software. No SMT window or SMT signal events affect the SMTxGO bit. Everything is synchronized to the SMT clock source. When the timer experiences a period match (SMTxTMR = SMTxPR), SMTxTMR is reset and the period match interrupt trips. See Figure 25-3. The modes of operation are summarized in Table 25-1. The following sections provide detailed descriptions, examples of how the modes can be used. Note that all waveforms assume WPOL/SPOL/CPOL = 0. When WPOL/SPOL/CPOL = 1, all SMTSIGx, SMTWINx and SMT clock signals will have a polarity opposite to that indicated. For all modes, the REPEAT bit controls whether the acquisition is repeated or single. When REPEAT = 0 (Single Acquisition mode), the timer will stop incrementing and the SMTxGO bit will be reset upon the completion of an acquisition. Otherwise, the timer will continue and allow for continued acquisitions to overwrite the previous ones until the timer is stopped in software. TABLE 25-1: TIMER MODE MODES OF OPERATION MODE Mode of Operation Synchronous Operation Reference 0000 Timer Yes Section25.6.1 “Timer Mode” 0001 Gated Timer Yes Section25.6.2 “Gated Timer Mode” 0010 Period and Duty Cycle Acquisition Yes Section25.6.3 “Period and Duty-Cycle Mode” 0011 High and Low Time Measurement Yes Section25.6.4 “High and Low Measure Mode” 0100 Windowed Measurement Yes Section25.6.5 “Windowed Measure Mode” 0101 Gated Windowed Measurement Yes Section25.6.6 “Gated Window Measure Mode” 0110 Time of Flight Yes Section25.6.7 “Time of Flight Measure Mode” 0111 Capture Yes Section25.6.8 “Capture Mode” 1000 Counter No Section25.6.9 “Counter Mode” 1001 Gated Counter No Section25.6.10 “Gated Counter Mode” Windowed Counter No Section25.6.11 “Windowed Counter Mode” Reserved — — 1010 1011 - 1111 2014-2016 Microchip Technology Inc. DS40001737B-page 265 2014-2016 Microchip Technology Inc. FIGURE 25-3: TIMER MODE TIMING DIAGRAM Rev. 10-000 174A 12/19/201 3 SMTx Clock SMTxEN SMTxGO SMTxGO_sync SMTxPR SMTxTMR 11 0 1 2 3 4 5 6 7 8 9 10 11 0 1 2 3 4 5 6 7 8 9 SMTxIF PIC12(L)F1612/16(L)F1613 DS40001737B-page 266 PIC12(L)F1612/16(L)F1613 25.6.2 GATED TIMER MODE Gated Timer mode uses the SMTSIGx input to control whether or not the SMTxTMR will increment. Upon a falling edge of the external signal, the SMTxCPW register will update to the current value of the SMTxTMR. Example waveforms for both repeated and single acquisitions are provided in Figure 25-4 and Figure 25-5. 2014-2016 Microchip Technology Inc. DS40001737B-page 267 2014-2016 Microchip Technology Inc. FIGURE 25-4: GATED TIMER MODE REPEAT ACQUISITION TIMING DIAGRAM Rev. 10-000 176A 12/19/201 3 SMTx_signal SMTx_signalsync SMTx Clock SMTxEN SMTxGO SMTxGO_sync SMTxPR SMTxCPW SMTxPWAIF 0 1 2 3 4 5 6 5 7 7 DS40001737B-page 268 PIC12(L)F1612/16(L)F1613 SMTxTMR 0xFFFFFF 2014-2016 Microchip Technology Inc. FIGURE 25-5: GATED TIMER MODE SINGLE ACQUISITION TIMING DIAGRAM Rev. 10-000 175A 12/19/201 3 SMTx_signal SMTx_signalsync SMTx Clock SMTxEN SMTxGO SMTxGO_sync SMTxPR SMTxTMR SMTxPWAIF 0 1 2 3 4 5 5 DS40001737B-page 269 PIC12(L)F1612/16(L)F1613 SMTxCPW 0xFFFFFF PIC12(L)F1612/16(L)F1613 25.6.3 PERIOD AND DUTY-CYCLE MODE In Duty-Cycle mode, either the duty cycle or period (depending on polarity) of the SMTx_signal can be acquired relative to the SMT clock. The CPW register is updated on a falling edge of the signal, and the CPR register is updated on a rising edge of the signal, along with the SMTxTMR resetting to 0x0001. In addition, the SMTxGO bit is reset on a rising edge when the SMT is in Single Acquisition mode. See Figure 25-6 and Figure 25-7. 2014-2016 Microchip Technology Inc. DS40001737B-page 270 2014-2016 Microchip Technology Inc. FIGURE 25-6: PERIOD AND DUTY-CYCLE REPEAT ACQUISITION MODE TIMING DIAGRAM Rev. 10-000 177A 12/19/201 3 SMTx_signal SMTx_signalsync SMTx Clock SMTxEN SMTxGO SMTxGO_sync SMTxTMR SMTxCPR SMTxPWAIF SMTxPRAIF 1 2 3 4 5 6 7 8 9 10 11 1 2 3 4 5 5 2 11 DS40001737B-page 271 PIC12(L)F1612/16(L)F1613 SMTxCPW 0 2014-2016 Microchip Technology Inc. FIGURE 25-7: PERIOD AND DUTY-CYCLE SINGLE ACQUISITION TIMING DIAGRAM Rev. 10-000 178A 12/19/201 3 SMTx_signal SMTx_signalsync SMTx Clock SMTxEN SMTxGO SMTxGO_sync SMTxTMR SMTxCPR SMTxPWAIF SMTxPRAIF 1 2 3 4 5 6 7 8 9 10 11 5 11 DS40001737B-page 272 PIC12(L)F1612/16(L)F1613 SMTxCPW 0 PIC12(L)F1612/16(L)F1613 25.6.4 HIGH AND LOW MEASURE MODE This mode measures the high and low pulse time of the SMTSIGx relative to the SMT clock. It begins incrementing the SMTxTMR on a rising edge on the SMTSIGx input, then updates the SMTxCPW register with the value and resets the SMTxTMR on a falling edge, starting to increment again. Upon observing another rising edge, it updates the SMTxCPR register with its current value and once again resets the SMTxTMR value and begins incrementing again. See Figure 25-8 and Figure 25-9. 2014-2016 Microchip Technology Inc. DS40001737B-page 273 2014-2016 Microchip Technology Inc. FIGURE 25-8: HIGH AND LOW MEASURE MODE REPEAT ACQUISITION TIMING DIAGRAM Rev. 10-000 180A 12/19/201 3 SMTx_signal SMTx_signalsync SMTx Clock SMTxEN SMTxGO SMTxGO_sync SMTxTMR SMTxCPR SMTxPWAIF SMTxPRAIF 1 2 3 4 5 1 2 3 4 5 6 1 2 1 2 3 5 2 6 DS40001737B-page 274 PIC12(L)F1612/16(L)F1613 SMTxCPW 0 2014-2016 Microchip Technology Inc. FIGURE 25-9: HIGH AND LOW MEASURE MODE SINGLE ACQUISITION TIMING DIAGRAM Rev. 10-000 179A 12/19/201 3 SMTx_signal SMTx_signalsync SMTx Clock SMTxEN SMTxGO SMTxGO_sync SMTxTMR SMTxCPW SMTxPWAIF SMTxPRAIF 1 2 3 4 5 1 2 3 4 5 6 5 6 DS40001737B-page 275 PIC12(L)F1612/16(L)F1613 SMTxCPR 0 PIC12(L)F1612/16(L)F1613 25.6.5 WINDOWED MEASURE MODE This mode measures the window duration of the SMTWINx input of the SMT. It begins incrementing the timer on a rising edge of the SMTWINx input and updates the SMTxCPR register with the value of the timer and resets the timer on a second rising edge. See Figure 25-10 and Figure 25-11. 2014-2016 Microchip Technology Inc. DS40001737B-page 276 2014-2016 Microchip Technology Inc. FIGURE 25-10: WINDOWED MEASURE MODE REPEAT ACQUISITION TIMING DIAGRAM Rev. 10-000 182A 12/19/201 3 SMTxWIN SMTxWIN_sync SMTx Clock SMTxEN SMTxGO SMTxGO_sync SMTxTMR SMTxPRAIF 1 2 3 4 5 6 7 8 9 10 11 12 1 2 3 4 12 5 6 7 8 1 2 3 4 8 DS40001737B-page 277 PIC12(L)F1612/16(L)F1613 SMTxCPR 0 2014-2016 Microchip Technology Inc. FIGURE 25-11: WINDOWED MEASURE MODE SINGLE ACQUISITION TIMING DIAGRAM Rev. 10-000 181A 12/19/201 3 SMTxWIN SMTxWIN_sync SMTx Clock SMTxEN SMTxGO SMTxGO_sync SMTxTMR SMTxPRAIF 1 2 3 4 5 6 7 8 9 10 11 12 12 DS40001737B-page 278 PIC12(L)F1612/16(L)F1613 SMTxCPR 0 PIC12(L)F1612/16(L)F1613 25.6.6 GATED WINDOW MEASURE MODE This mode measures the duty cycle of the SMTx_signal input over a known input window. It does so by incrementing the timer on each pulse of the clock signal while the SMTx_signal input is high, updating the SMTxCPR register and resetting the timer on every rising edge of the SMTWINx input after the first. See Figure 25-12 and Figure 25-13. 2014-2016 Microchip Technology Inc. DS40001737B-page 279 2014-2016 Microchip Technology Inc. FIGURE 25-12: GATED WINDOWED MEASURE MODE REPEAT ACQUISITION TIMING DIAGRAM Rev. 10-000 184A 12/19/201 3 SMTxWIN SMTxWIN_sync SMTx_signal SMTx_signalsync SMTx Clock SMTxEN SMTxGO SMTxTMR SMTxCPR SMTxPRAIF 0 1 2 3 4 5 6 0 1 6 2 3 0 3 DS40001737B-page 280 PIC12(L)F1612/16(L)F1613 SMTxGO_sync 2014-2016 Microchip Technology Inc. FIGURE 25-13: GATED WINDOWED MEASURE MODE SINGLE ACQUISITION TIMING DIAGRAMS Rev. 10-000 183A 12/19/201 3 SMTxWIN SMTxWIN_sync SMTx_signal SMTx_signalsync SMTx Clock SMTxEN SMTxGO SMTxTMR SMTxCPR SMTxPRAIF 0 1 2 3 4 5 6 6 DS40001737B-page 281 PIC12(L)F1612/16(L)F1613 SMTxGO_sync PIC12(L)F1612/16(L)F1613 25.6.7 TIME OF FLIGHT MEASURE MODE This mode measures the time interval between a rising edge on the SMTWINx input and a rising edge on the SMTx_signal input, beginning to increment the timer upon observing a rising edge on the SMTWINx input, while updating the SMTxCPR register and resetting the timer upon observing a rising edge on the SMTx_signal input. In the event of two SMTWINx rising edges without an SMTx_signal rising edge, it will update the SMTxCPW register with the current value of the timer and reset the timer value. See Figure 25-14 and Figure 25-15. 2014-2016 Microchip Technology Inc. DS40001737B-page 282 2014-2016 Microchip Technology Inc. FIGURE 25-14: TIME OF FLIGHT MODE REPEAT ACQUISITION TIMING DIAGRAM Rev. 10-000186A 4/22/2016 SMTxWIN SMTxWIN_sync SMTx_signal SMTx_signalsync SMTx Clock SMTxEN SMTxGO SMTxGO_sync 0 1 2 3 4 5 1 SMTxPWAIF SMTxPRAIF 3 4 5 6 7 8 2 9 10 11 12 13 1 13 SMTxCPW SMTxCPR 2 4 DS40001737B-page 283 PIC12(L)F1612/16(L)F1613 SMTxTMR 2014-2016 Microchip Technology Inc. FIGURE 25-15: TIME OF FLIGHT MODE SINGLE ACQUISITION TIMING DIAGRAM Rev. 10-000185A 4/26/2016 SMTxWIN SMTxWIN_sync SMTx_signal SMTx_signalsync SMTx Clock SMTxEN SMTxGO SMTxGO_sync 0 1 2 3 4 5 SMTxCPW SMTxCPR SMTxPWAIF SMTxPRAIF 4 DS40001737B-page 284 PIC12(L)F1612/16(L)F1613 SMTxTMR PIC12(L)F1612/16(L)F1613 25.6.8 CAPTURE MODE This mode captures the Timer value based on a rising or falling edge on the SMTWINx input and triggers an interrupt. This mimics the capture feature of a CCP module. The timer begins incrementing upon the SMTxGO bit being set, and updates the value of the SMTxCPR register on each rising edge of SMTWINx, and updates the value of the CPW register on each falling edge of the SMTWINx. The timer is not reset by any hardware conditions in this mode and must be reset by software, if desired. See Figure 25-16 and Figure 25-17. 2014-2016 Microchip Technology Inc. DS40001737B-page 285 2014-2016 Microchip Technology Inc. FIGURE 25-16: CAPTURE MODE REPEAT ACQUISITION TIMING DIAGRAM Rev. 10-000 188A 12/19/201 3 SMTxWIN SMTxWIN_sync SMTx Clock SMTxEN SMTxGO SMTxGO_sync SMTxTMR 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 SMTxCPR SMTxPWAIF SMTxPRAIF 3 2 19 18 32 31 DS40001737B-page 286 PIC12(L)F1612/16(L)F1613 SMTxCPW 2014-2016 Microchip Technology Inc. FIGURE 25-17: CAPTURE MODE SINGLE ACQUISITION TIMING DIAGRAM Rev. 10-000 187A 12/19/201 3 SMTxWIN SMTxWIN_sync SMTx Clock SMTxEN SMTxGO SMTxGO_sync SMTxTMR 0 1 2 3 SMTxCPR SMTxPWAIF SMTxPRAIF 3 2 DS40001737B-page 287 PIC12(L)F1612/16(L)F1613 SMTxCPW PIC12(L)F1612/16(L)F1613 25.6.9 COUNTER MODE This mode increments the timer on each pulse of the SMTx_signal input. This mode is asynchronous to the SMT clock and uses the SMTx_signal as a time source. The SMTxCPW register will be updated with the current SMTxTMR value on the falling edge of the SMTxWIN input. See Figure 25-18. 2014-2016 Microchip Technology Inc. DS40001737B-page 288 2014-2016 Microchip Technology Inc. FIGURE 25-18: COUNTER MODE TIMING DIAGRAM Rev. 10-000189A 4/12/2016 SMTxWIN SMTx_signal SMTxEN SMTxGO SMTxTMR SMTxCPW 0 1 2 3 4 5 6 7 8 27 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 12 25 PIC12(L)F1612/16(L)F1613 DS40001737B-page 289 PIC12(L)F1612/16(L)F1613 25.6.10 GATED COUNTER MODE This mode counts pulses on the SMTx_signal input, gated by the SMTxWIN input. It begins incrementing the timer upon seeing a rising edge of the SMTxWIN input and updates the SMTxCPW register upon a falling edge on the SMTxWIN input. See Figure 25-19 and Figure 25-20. 2014-2016 Microchip Technology Inc. DS40001737B-page 290 2014-2016 Microchip Technology Inc. FIGURE 25-19: GATED COUNTER MODE REPEAT ACQUISITION TIMING DIAGRAM Rev. 10-000190A 12/18/2013 SMTxWIN SMTx_signal SMTxEN SMTxGO SMTxTMR 0 1 2 3 4 5 6 7 8 SMTxCPW 9 10 11 12 8 13 13 SMTxPWAIF GATED COUNTER MODE SINGLE ACQUISITION TIMING DIAGRAM Rev. 10-000191A 12/18/2013 SMTxWIN SMTx_signal SMTxEN SMTxGO SMTxTMR DS40001737B-page 291 SMTxCPW SMTxPWAIF 0 1 2 3 4 5 6 7 8 8 PIC12(L)F1612/16(L)F1613 FIGURE 25-20: PIC12(L)F1612/16(L)F1613 25.6.11 WINDOWED COUNTER MODE This mode counts pulses on the SMTx_signal input, within a window dictated by the SMTxWIN input. It begins counting upon seeing a rising edge of the SMTxWIN input, updates the SMTxCPW register on a falling edge of the SMTxWIN input, and updates the SMTxCPR register on each rising edge of the SMTxWIN input beyond the first. See Figure 25-21 and Figure 25-22. 2014-2016 Microchip Technology Inc. DS40001737B-page 292 2014-2016 Microchip Technology Inc. FIGURE 25-21: WINDOWED COUNTER MODE REPEAT ACQUISITION TIMING DIAGRAM SMTxWIN SMTx_signal SMTxEN SMTxGO SMTxTMR 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 1 SMTxCPW 2 3 5 4 9 5 SMTxCPR 16 SMTxPWAIF SMTxPRAIF WINDOWED COUNTER MODE SINGLE ACQUISITION TIMING DIAGRAM SMTxWIN SMTx_signal SMTxEN SMTxGO SMTxTMR SMTxCPW DS40001737B-page 293 SMTxCPR SMTxPWAIF SMTxPRAIF 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 9 16 PIC12(L)F1612/16(L)F1613 FIGURE 25-22: PIC12(L)F1612/16(L)F1613 25.7 Interrupts The SMT can trigger an interrupt under three different conditions: • PW Acquisition Complete • PR Acquisition Complete • Counter Period Match The interrupts are controlled by the PIR and PIE registers of the device. 25.7.1 PW AND PR ACQUISITION INTERRUPTS The SMT can trigger interrupts whenever it updates the SMTxCPW and SMTxCPR registers, the circumstances for which are dependent on the SMT mode, and are discussed in each mode’s specific section. The SMTxCPW interrupt is controlled by SMTxPWAIF and SMTxPWAIE bits in registers PIR4 and PIE4, respectively. The SMTxCPR interrupt is controlled by the SMTxPRAIF and SMTxPRAIE bits, also located in registers PIR4 and PIE4, respectively. In synchronous SMT modes, the interrupt trigger is synchronized to the SMTxCLK. In Asynchronous modes, the interrupt trigger is asynchronous. In either mode, once triggered, the interrupt will be synchronized to the CPU clock. 25.7.2 COUNTER PERIOD MATCH INTERRUPT As described in Section 25.1.2 “Period Match interrupt”, the SMT will also interrupt upon SMTxTMR, matching SMTxPR with its period match limit functionality described in Section25.3 “Halt Operation”. The period match interrupt is controlled by SMTxIF and SMTxIE, located in registers PIR4 and PIE4, respectively. 2014-2016 Microchip Technology Inc. DS40001737B-page 294 PIC12(L)F1612/16(L)F1613 25.8 Register Definitions: SMT Control Long bit name prefixes for the Signal Measurement Timer peripherals are shown in Table 25-2. Refer to Section 1.1 “Register and Bit Naming Conventions” for more information. TABLE 25-2: Peripheral Bit Name Prefix SMT1 SMT1 SMT2 SMT2 REGISTER 25-1: R/W-0/0 SMTxCON0: SMT CONTROL REGISTER 0 U-0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 — STP WPOL SPOL CPOL (1) EN R/W-0/0 bit 7 R/W-0/0 SMTxPS<1:0> bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7 EN: SMT Enable bit(1) 1 = SMT is enabled 0 = SMT is disabled; internal states are reset, clock requests are disabled bit 6 Unimplemented: Read as ‘0’ bit 5 STP: SMT Counter Halt Enable bit When SMTxTMR = SMTxPR: 1 = Counter remains SMTxPR; period match interrupt occurs when clocked 0 = Counter resets to 24'h000000; period match interrupt occurs when clocked bit 4 WPOL: SMTxWIN Input Polarity Control bit 1 = SMTxWIN signal is active-low/falling edge enabled 0 = SMTxWIN signal is active-high/rising edge enabled bit 3 SPOL: SMTxSIG Input Polarity Control bit 1 = SMTx_signal is active-low/falling edge enabled 0 = SMTx_signal is active-high/rising edge enabled bit 2 CPOL: SMT Clock Input Polarity Control bit 1 = SMTxTMR increments on the falling edge of the selected clock signal 0 = SMTxTMR increments on the rising edge of the selected clock signal bit 1-0 SMTxPS<1:0>: SMT Prescale Select bits 11 = Prescaler = 1:8 10 = Prescaler = 1:4 01 = Prescaler = 1:2 00 = Prescaler = 1:1 Note 1: Setting EN to ‘0‘ does not affect the register contents. 2014-2016 Microchip Technology Inc. DS40001737B-page 295 PIC12(L)F1612/16(L)F1613 REGISTER 25-2: SMTxCON1: SMT CONTROL REGISTER 1 R/W/HC-0/0 R/W-0/0 U-0 U-0 SMTxGO REPEAT — — R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 MODE<3:0> bit 7 bit 0 Legend: HC = Bit is cleared by hardware HS = Bit is set by hardware R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared q = Value depends on condition bit 7 SMTxGO: SMT GO Data Acquisition bit 1 = Incrementing, acquiring data is enabled 0 = Incrementing, acquiring data is disabled bit 6 REPEAT: SMT Repeat Acquisition Enable bit 1 = Repeat Data Acquisition mode is enabled 0 = Single Acquisition mode is enabled bit 5-4 Unimplemented: Read as ‘0’ bit 3-0 MODE<3:0> SMT Operation Mode Select bits 1111 = Reserved • • • 1011 = Reserved 1010 = Windowed counter 1001 = Gated counter 1000 = Counter 0111 = Capture 0110 = Time of flight 0101 = Gated windowed measure 0100 = Windowed measure 0011 = High and low time measurement 0010 = Period and Duty-Cycle Acquisition 0001 = Gated Timer 0000 = Timer 2014-2016 Microchip Technology Inc. DS40001737B-page 296 PIC12(L)F1612/16(L)F1613 REGISTER 25-3: SMTxSTAT: SMT STATUS REGISTER R/W/HC-0/0 R/W/HC-0/0 R/W/HC-0/0 U-0 U-0 R-0/0 R-0/0 R-0/0 CPRUP CPWUP RST — — TS WS AS bit 7 bit 0 Legend: HC = Bit is cleared by hardware HS = Bit is set by hardware R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared q = Value depends on condition bit 7 CPRUP: SMT Manual Period Buffer Update bit 1 = Request update to SMTxCPRx registers 0 = SMTxCPRx registers update is complete bit 6 CPWUP: SMT Manual Pulse Width Buffer Update bit 1 = Request update to SMTxCPW registers 0 = SMTxCPW registers update is complete bit 5 RST: SMT Manual Timer Reset bit 1 = Request Reset to SMTxTMR registers 0 = SMTxTMR registers update is complete bit 4-3 Unimplemented: Read as ‘0’ bit 2 TS: SMT GO Value Status bit 1 = SMT timer is incrementing 0 = SMT timer is not incrementing bit 1 WS: SMTxWIN Value Status bit 1 = SMT window is open 0 = SMT window is closed bit 0 AS: SMT_signal Value Status bit 1 = SMT acquisition is in progress 0 = SMT acquisition is not in progress 2014-2016 Microchip Technology Inc. DS40001737B-page 297 PIC12(L)F1612/16(L)F1613 REGISTER 25-4: SMTxCLK: SMT CLOCK SELECTION REGISTER U-0 U-0 U-0 U-0 U-0 — — — — — R/W-0/0 R/W-0/0 R/W-0/0 CSEL<2:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared q = Value depends on condition bit 7-3 Unimplemented: Read as ‘0’ bit 2-0 CSEL<2:0>: SMT Clock Selection bits 111 = Reserved 110 = Reserved 101 = Reserved 100 = MFINTOSC/16 011 = LFINTOSC 010 = HFINTOSC 16 MHz 001 = FOSC/4 000 = FOSC REGISTER 25-5: SMTxWIN: SMTx WINDOW INPUT SELECT REGISTER U-0 U-0 U-0 U-0 — — — — R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 WSEL<3:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared q = Value depends on condition bit 7-4 Unimplemented: Read as ‘0’ bit 3-0 WSEL<3:0>: SMTx Window Selection bits 1111 = Reserved • • • 1001 = Reserved 1000 = TMR6_postscaled 0111 = TMR4_postscaled 0110 = TMR2_postscaled 0101 = ZCD1_out 0100 = CCP2_out 0011 = CCP1_out 0010 = C2OUT_sync(1) 0001 = C1OUT_sync 0000 = SMTWINx pin Note 1: PIC16(L)F1613 only. Reserved on PIC12(L)F1612. 2014-2016 Microchip Technology Inc. DS40001737B-page 298 PIC12(L)F1612/16(L)F1613 REGISTER 25-6: SMT1SIG: SMT1 SIGNAL INPUT SELECT REGISTER U-0 U-0 U-0 U-0 U-0 — — — — — R/W-0/0 R/W-0/0 R/W-0/0 SSEL<2:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared q = Value depends on condition bit 7-3 Unimplemented: Read as ‘0’ bit 2-0 SSEL<2:0>: SMT1 Signal Selection bits 111 = Reserved 110 = TMR6_postscaled 101 = TMR4_postscaled 100 = TMR2_postscaled 011 = ZCD1_out 010 = C2OUT_sync(1) 001 = C1OUT_sync 000 = SMTxSIG pin Note 1: PIC16(L)F1613 only. Reserved on PIC12(L)F1612. 2014-2016 Microchip Technology Inc. DS40001737B-page 299 PIC12(L)F1612/16(L)F1613 REGISTER 25-7: R/W-0/0 SMTxTMRL: SMT TIMER REGISTER – LOW BYTE R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 SMTxTMR<7:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-0 SMTxTMR<7:0>: Significant bits of the SMT Counter – Low Byte REGISTER 25-8: R/W-0/0 SMTxTMRH: SMT TIMER REGISTER – HIGH BYTE R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 SMTxTMR<15:8> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-0 SMTxTMR<15:8>: Significant bits of the SMT Counter – High Byte REGISTER 25-9: R/W-0/0 SMTxTMRU: SMT TIMER REGISTER – UPPER BYTE R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 SMTxTMR<23:16> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-0 SMTxTMR<23:16>: Significant bits of the SMT Counter – Upper Byte 2014-2016 Microchip Technology Inc. DS40001737B-page 300 PIC12(L)F1612/16(L)F1613 REGISTER 25-10: SMTxCPRL: SMT CAPTURED PERIOD REGISTER – LOW BYTE R-x/x R-x/x R-x/x R-x/x R-x/x R-x/x R-x/x R-x/x SMTxCPR<7:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-0 SMTxCPR<7:0>: Significant bits of the SMT Period Latch – Low Byte REGISTER 25-11: SMTxCPRH: SMT CAPTURED PERIOD REGISTER – HIGH BYTE R-x/x R-x/x R-x/x R-x/x R-x/x R-x/x R-x/x R-x/x SMTxCPR<15:8> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-0 SMTxCPR<15:8>: Significant bits of the SMT Period Latch – High Byte REGISTER 25-12: SMTxCPRU: SMT CAPTURED PERIOD REGISTER – UPPER BYTE R-x/x R-x/x R-x/x R-x/x R-x/x R-x/x R-x/x R-x/x SMTxCPR<23:16> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-0 SMTxCPR<23:16>: Significant bits of the SMT Period Latch – Upper Byte 2014-2016 Microchip Technology Inc. DS40001737B-page 301 PIC12(L)F1612/16(L)F1613 REGISTER 25-13: SMTxCPWL: SMT CAPTURED PULSE WIDTH REGISTER – LOW BYTE R-x/x R-x/x R-x/x R-x/x R-x/x R-x/x R-x/x R-x/x SMTxCPW<7:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-0 SMTxCPW<7:0>: Significant bits of the SMT PW Latch – Low Byte REGISTER 25-14: SMTxCPWH: SMT CAPTURED PULSE WIDTH REGISTER – HIGH BYTE R-x/x R-x/x R-x/x R-x/x R-x/x R-x/x R-x/x R-x/x SMTxCPW<15:8> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-0 SMTxCPW<15:8>: Significant bits of the SMT PW Latch – High Byte REGISTER 25-15: SMTxCPWU: SMT CAPTURED PULSE WIDTH REGISTER – UPPER BYTE R-x/x R-x/x R-x/x R-x/x R-x/x R-x/x R-x/x R-x/x SMTxCPW<23:16> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-0 SMTxCPW<23:16>: Significant bits of the SMT PW Latch – Upper Byte 2014-2016 Microchip Technology Inc. DS40001737B-page 302 PIC12(L)F1612/16(L)F1613 REGISTER 25-16: SMTxPRL: SMT PERIOD REGISTER – LOW BYTE R/W-x/1 R/W-x/1 R/W-x/1 R/W-x/1 R/W-x/1 R/W-x/1 R/W-x/1 R/W-x/1 SMTxPR<7:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-0 SMTxPR<7:0>: Significant bits of the SMT Timer Value for Period Match – Low Byte REGISTER 25-17: SMTxPRH: SMT PERIOD REGISTER – HIGH BYTE R/W-x/1 R/W-x/1 R/W-x/1 R/W-x/1 R/W-x/1 R/W-x/1 R/W-x/1 R/W-x/1 SMTxPR<15:8> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-0 SMTxPR<15:8>: Significant bits of the SMT Timer Value for Period Match – High Byte REGISTER 25-18: SMTxPRU: SMT PERIOD REGISTER – UPPER BYTE R/W-x/1 R/W-x/1 R/W-x/1 R/W-x/1 R/W-x/1 R/W-x/1 R/W-x/1 R/W-x/1 SMTxPR<23:16> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-0 SMTxPR<23:16>: Significant bits of the SMT Timer Value for Period Match – Upper Byte 2014-2016 Microchip Technology Inc. DS40001737B-page 303 PIC12(L)F1612/16(L)F1613 TABLE 25-3: Name SUMMARY OF REGISTERS ASSOCIATED WITH SMTx Bit 7 Bit 6 PIE4 SCANIE CRCIE SMT2PWAIE SMT2PRAIE SMT2IE PIR4 SCANIF CRCIF SMT2PWAIF SMT2PRAIF SMT2IF — — — — — SPOL SMT1CLK Bit 5 Bit 4 SMT1CON0 EN — STP WPOL SMT1CON1 SMT1GO REPEAT — — Bit 3 Bit 0 Register on Page SMT1PWAIE SMT1PRAIE SMT1IE 86 SMT1PWAIF SMT1IF Bit 2 Bit 1 SMT1PRAIF CSEL<2:0> CPOL 90 298 SMT1PS<1:0> MODE<3:0> 295 296 SMT1CPRH SMT1CPR<15:8> 301 SMT1CPRL SMT1CPR<7:0> 301 SMT1CPRU SMT1CPR<23:16> 301 SMT1CPWH SMT1CPW<15:8> 302 SMT1CPWL SMT1CPW<7:0> 302 SMT1CPWU SMT1CPW<23:16> 302 SMT1PRH SMT1PR<15:8> 303 SMT1PRL SMT1PR<7:0> 303 SMT1PRU SMT1PR<23:16> SMT1SIG SMT1STAT — — — — — CPRUP CPWUP RST — — 303 SSEL<2:0> TS WS 299 AS 297 SMT1TMRH SMT1TMR<15:8> 300 SMT1TMRL SMT1TMR<7:0> 300 SMT1TMRU SMT1TMR<23:16> — — SMT2CLK — — — — — SMT2CON0 EN — STP WPOL SPOL SMT2CON1 SMT2GO REPEAT — — SMT1WIN — — 300 WSEL<3:0> 298 CSEL<2:0> CPOL 298 SMT2PS<1:0> MODE<3:0> 295 296 SMT2CPRH SMT2CPR<15:8> 301 SMT2CPRL SMT2CPR<7:0> 301 SMT2CPRU SMT2CPR<23:16> 301 SMT2CPWH SMT2CPW<15:8> 302 SMT2CPWL SMT2CPW<7:0> 302 SMT2CPWU SMT2CPW<23:16> 302 SMT2PRH SMT2PR<15:8> 303 SMT2PRL SMT2PR<7:0> 303 SMT2PRU SMT2PR<23:16> SMT2SIG SMT2STAT — — — — — CPRUP CPWUP RST — — 303 SSEL<2:0> TS WS 299 AS 297 SMT2TMRH SMT2TMR<15:8> 300 SMT2TMRL SMT2TMR<7:0> 300 SMT2TMRU SMT2TMR<23:16> SMT2WIN Legend: — — — 300 WSEL<4:0> 298 x = unknown, u = unchanged, — = unimplemented read as ‘0’, q = value depends on condition. Shaded cells are not used for SMTx module. 2014-2016 Microchip Technology Inc. DS40001737B-page 304 PIC12(L)F1612/16(L)F1613 26.0 IN-CIRCUIT SERIAL PROGRAMMING™ (ICSP™) ICSP™ programming allows customers to manufacture circuit boards with unprogrammed devices. Programming can be done after the assembly process allowing the device to be programmed with the most recent firmware or a custom firmware. Five pins are needed for ICSP™ programming: • ICSPCLK • ICSPDAT • MCLR/VPP • VDD • VSS In Program/Verify mode the program memory, user IDs and the Configuration Words are programmed through serial communications. The ICSPDAT pin is a bidirectional I/O used for transferring the serial data and the ICSPCLK pin is the clock input. For more information on ICSP™ refer to the “PIC12(L)F1612/PIC16(L)F161X Memory Programming Specification” (DS40001720). 26.3 Common Programming Interfaces Connection to a target device is typically done through an ICSP™ header. A commonly found connector on development tools is the RJ-11 in the 6P6C (6-pin, 6-connector) configuration. See Figure 26-1. FIGURE 26-1: VDD ICD RJ-11 STYLE CONNECTOR INTERFACE ICSPDAT NC 2 4 6 ICSPCLK 1 3 5 Target VPP/MCLR VSS PC Board Bottom Side Pin Description* 26.1 High-Voltage Programming Entry Mode The device is placed into High-Voltage Programming Entry mode by holding the ICSPCLK and ICSPDAT pins low then raising the voltage on MCLR/VPP to VIHH. 1 = VPP/MCLR 2 = VDD Target 3 = VSS (ground) 4 = ICSPDAT 5 = ICSPCLK 6 = No Connect 26.2 Low-Voltage Programming Entry Mode The Low-Voltage Programming Entry mode allows the PIC® Flash MCUs to be programmed using VDD only, without high voltage. When the LVP bit of Configuration Words is set to ‘1’, the ICSP Low-Voltage Programming Entry mode is enabled. To disable the Low-Voltage ICSP mode, the LVP bit must be programmed to ‘0’. Another connector often found in use with the PICkit™ programmers is a standard 6-pin header with 0.1 inch spacing. Refer to Figure 26-2. Entry into the Low-Voltage Programming Entry mode requires the following steps: 1. 2. MCLR is brought to VIL. A 32-bit key sequence is presented on ICSPDAT, while clocking ICSPCLK. Once the key sequence is complete, MCLR must be held at VIL for as long as Program/Verify mode is to be maintained. If low-voltage programming is enabled (LVP = 1), the MCLR Reset function is automatically enabled and cannot be disabled. See Section6.5 “MCLR” for more information. The LVP bit can only be reprogrammed to ‘0’ by using the High-Voltage Programming mode. 2014-2016 Microchip Technology Inc. DS40001737B-page 305 PIC12(L)F1612/16(L)F1613 FIGURE 26-2: PICkit™ PROGRAMMER STYLE CONNECTOR INTERFACE Rev. 10-000128A 7/30/2013 Pin 1 Indicator Pin Description* 1 = VPP/MCLR 1 2 3 4 5 6 2 = VDD Target 3 = VSS (ground) 4 = ICSPDAT 5 = ICSPCLK 6 = No connect * The 6-pin header (0.100" spacing) accepts 0.025" square pins For additional interface recommendations, refer to your specific device programmer manual prior to PCB design. FIGURE 26-3: It is recommended that isolation devices be used to separate the programming pins from other circuitry. The type of isolation is highly dependent on the specific application and may include devices such as resistors, diodes, or even jumpers. See Figure 26-3 for more information. TYPICAL CONNECTION FOR ICSP™ PROGRAMMING Rev. 10-000129A 7/30/2013 External Programming Signals Device to be Programmed VDD VDD VDD VPP MCLR/VPP VSS VSS Data ICSPDAT Clock ICSPCLK * * * To Normal Connections * Isolation devices (as required). 2014-2016 Microchip Technology Inc. DS40001737B-page 306 PIC12(L)F1612/16(L)F1613 27.0 INSTRUCTION SET SUMMARY Each instruction is a 14-bit word containing the operation code (opcode) and all required operands. The opcodes are broken into three broad categories. • Byte Oriented • Bit Oriented • Literal and Control • One additional instruction cycle will be used when any instruction references an indirect file register and the file select register is pointing to program memory. One instruction cycle consists of 4 oscillator cycles; for an oscillator frequency of 4 MHz, this gives a nominal instruction execution rate of 1 MHz. The literal and control category contains the most varied instruction word format. All instruction examples use the format ‘0xhh’ to represent a hexadecimal number, where ‘h’ signifies a hexadecimal digit. Table 27-3 lists the instructions recognized by the MPASMTM assembler. 27.1 All instructions are executed within a single instruction cycle, with the following exceptions, which may take two or three cycles: • Subroutine takes two cycles (CALL, CALLW) • Returns from interrupts or subroutines take two cycles (RETURN, RETLW, RETFIE) • Program branching takes two cycles (GOTO, BRA, BRW, BTFSS, BTFSC, DECFSZ, INCSFZ) TABLE 27-1: Description Register file address (0x00 to 0x7F) W Working register (accumulator) b Bit address within an 8-bit file register k Literal field, constant data or label x Don’t care location (= 0 or 1). The assembler will generate code with x = 0. It is the recommended form of use for compatibility with all Microchip software tools. d Destination select; d = 0: store result in W, d = 1: store result in file register f. Default is d = 1. n FSR or INDF number. (0-1) mm Pre-post increment-decrement mode selection TABLE 27-2: ABBREVIATION DESCRIPTIONS Field Description PC Program Counter TO Time-Out bit C DC Z PD Any instruction that specifies a file register as part of the instruction performs a Read-Modify-Write (R-M-W) operation. The register is read, the data is modified, and the result is stored according to either the instruction, or the destination designator ‘d’. A read operation is performed on a register even if the instruction writes to that register. OPCODE FIELD DESCRIPTIONS Field f Read-Modify-Write Operations Carry bit Digit Carry bit Zero bit Power-Down bit 2014-2016 Microchip Technology Inc. DS40001737B-page 307 PIC12(L)F1612/16(L)F1613 FIGURE 27-1: GENERAL FORMAT FOR INSTRUCTIONS Byte-oriented file register operations 13 8 7 6 OPCODE d f (FILE #) 0 d = 0 for destination W d = 1 for destination f f = 7-bit file register address Bit-oriented file register operations 13 10 9 7 6 OPCODE b (BIT #) f (FILE #) 0 b = 3-bit bit address f = 7-bit file register address Literal and control operations General 13 OPCODE 8 7 0 k (literal) k = 8-bit immediate value CALL and GOTO instructions only 13 11 10 OPCODE 0 k (literal) k = 11-bit immediate value MOVLP instruction only 13 OPCODE 7 6 0 k (literal) k = 7-bit immediate value MOVLB instruction only 13 5 4 OPCODE 0 k (literal) k = 5-bit immediate value BRA instruction only 13 9 8 0 OPCODE k (literal) k = 9-bit immediate value FSR Offset instructions 13 OPCODE 7 6 n 5 0 k (literal) n = appropriate FSR k = 6-bit immediate value FSR Increment instructions 13 OPCODE 3 2 1 0 n m (mode) n = appropriate FSR m = 2-bit mode value OPCODE only 13 0 OPCODE 2014-2016 Microchip Technology Inc. DS40001737B-page 308 PIC12(L)F1612/16(L)F1613 TABLE 27-3: ENHANCED MID-RANGE INSTRUCTION SET 14-Bit Opcode Mnemonic, Operands Description Cycles MSb LSb Status Affected Notes BYTE-ORIENTED FILE REGISTER OPERATIONS ADDWF ADDWFC ANDWF ASRF LSLF LSRF CLRF CLRW COMF DECF INCF IORWF MOVF MOVWF RLF RRF SUBWF SUBWFB SWAPF XORWF f, d f, d f, d f, d f, d f, d f – f, d f, d f, d f, d f, d f f, d f, d f, d f, d f, d f, d Add W and f Add with Carry W and f AND W with f Arithmetic Right Shift Logical Left Shift Logical Right Shift Clear f Clear W Complement f Decrement f Increment f Inclusive OR W with f Move f Move W to f Rotate Left f through Carry Rotate Right f through Carry Subtract W from f Subtract with Borrow W from f Swap nibbles in f Exclusive OR W with f 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 00 11 00 11 11 11 00 00 00 00 00 00 00 00 00 00 00 11 00 00 0111 1101 0101 0111 0101 0110 0001 0001 1001 0011 1010 0100 1000 0000 1101 1100 0010 1011 1110 0110 dfff dfff dfff dfff dfff dfff lfff 0000 dfff dfff dfff dfff dfff 1fff dfff dfff dfff dfff dfff dfff ffff ffff ffff ffff ffff ffff ffff 00xx ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff C, DC, Z C, DC, Z Z C, Z C, Z C, Z Z Z Z Z Z Z Z C C C, DC, Z C, DC, Z Z 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 BYTE ORIENTED SKIP OPERATIONS DECFSZ INCFSZ f, d f, d Decrement f, Skip if 0 Increment f, Skip if 0 BCF BSF f, b f, b Bit Clear f Bit Set f 1(2) 1(2) 00 00 1, 2 1, 2 1011 dfff ffff 1111 dfff ffff BIT-ORIENTED FILE REGISTER OPERATIONS 1 1 00bb bfff ffff 01bb bfff ffff 2 2 01 01 10bb bfff ffff 11bb bfff ffff 1, 2 1, 2 11 11 11 00 11 11 11 11 1110 1001 1000 0000 0001 0000 1100 1010 01 01 BIT-ORIENTED SKIP OPERATIONS BTFSC BTFSS f, b f, b Bit Test f, Skip if Clear Bit Test f, Skip if Set ADDLW ANDLW IORLW MOVLB MOVLP MOVLW SUBLW XORLW k k k k k k k k Add literal and W AND literal with W Inclusive OR literal with W Move literal to BSR Move literal to PCLATH Move literal to W Subtract W from literal Exclusive OR literal with W 1 (2) 1 (2) LITERAL OPERATIONS 1 1 1 1 1 1 1 1 kkkk kkkk kkkk 001k 1kkk kkkk kkkk kkkk kkkk kkkk kkkk kkkk kkkk kkkk kkkk kkkk C, DC, Z Z Z C, DC, Z Z Note 1: If the Program Counter (PC) is modified, or a conditional test is true, the instruction requires two cycles. The second cycle is executed as a NOP. 2: If this instruction addresses an INDF register and the MSb of the corresponding FSR is set, this instruction will require one additional instruction cycle. 2014-2016 Microchip Technology Inc. DS40001737B-page 309 PIC12(L)F1612/16(L)F1613 TABLE 27-3: ENHANCED MID-RANGE INSTRUCTION SET (CONTINUED) 14-Bit Opcode Mnemonic, Operands Description Cycles MSb LSb Status Affected Notes CONTROL OPERATIONS BRA BRW CALL CALLW GOTO RETFIE RETLW RETURN k – k – k k k – Relative Branch Relative Branch with W Call Subroutine Call Subroutine with W Go to address Return from interrupt Return with literal in W Return from Subroutine CLRWDT NOP OPTION RESET SLEEP TRIS – – – – – f Clear Watchdog Timer No Operation Load OPTION_REG register with W Software device Reset Go into Standby mode Load TRIS register with W ADDFSR MOVIW n, k n mm MOVWI k[n] n mm Add Literal k to FSRn Move Indirect FSRn to W with pre/post inc/dec modifier, mm Move INDFn to W, Indexed Indirect. Move W to Indirect FSRn with pre/post inc/dec modifier, mm Move W to INDFn, Indexed Indirect. 2 2 2 2 2 2 2 2 11 00 10 00 10 00 11 00 001k 0000 0kkk 0000 1kkk 0000 0100 0000 kkkk 0000 kkkk 0000 kkkk 0000 kkkk 0000 kkkk 1011 kkkk 1010 kkkk 1001 kkkk 1000 00 00 00 00 00 00 0000 0000 0000 0000 0000 0000 0110 0000 0110 0000 0110 0110 0100 TO, PD 0000 0010 0001 0011 TO, PD 0fff INHERENT OPERATIONS 1 1 1 1 1 1 C-COMPILER OPTIMIZED k[n] 1 1 11 00 1 1 11 00 0001 0nkk kkkk 0000 0001 0nmm Z kkkk 1111 0nkk 1nmm Z 0000 0001 kkkk 1 11 1111 1nkk 2, 3 2 2, 3 2 Note 1: If the Program Counter (PC) is modified, or a conditional test is true, the instruction requires two cycles. The second cycle is executed as a NOP. 2: If this instruction addresses an INDF register and the MSb of the corresponding FSR is set, this instruction will require one additional instruction cycle. 3: See Table in the MOVIW and MOVWI instruction descriptions. 2014-2016 Microchip Technology Inc. DS40001737B-page 310 PIC12(L)F1612/16(L)F1613 27.2 Instruction Descriptions ADDFSR Add Literal to FSRn ANDLW AND literal with W Syntax: [ label ] ADDFSR FSRn, k Syntax: [ label ] ANDLW Operands: -32 k 31 n [ 0, 1] Operands: 0 k 255 Operation: (W) .AND. (k) (W) Operation: FSR(n) + k FSR(n) Status Affected: Z Status Affected: None Description: Description: The signed 6-bit literal ‘k’ is added to the contents of the FSRnH:FSRnL register pair. The contents of W register are AND’ed with the 8-bit literal ‘k’. The result is placed in the W register. Add literal and W ANDWF AND W with f Syntax: [ label ] ADDLW Syntax: [ label ] ANDWF Operands: 0 k 255 Operands: Operation: (W) + k (W) 0 f 127 d 0,1 Status Affected: C, DC, Z Operation: (W) .AND. (f) (destination) Description: The contents of the W register are added to the 8-bit literal ‘k’ and the result is placed in the W register. k FSRn is limited to the range 0000h FFFFh. Moving beyond these bounds will cause the FSR to wrap-around. ADDLW k f,d Status Affected: Z Description: AND the W register with register ‘f’. If ‘d’ is ‘0’, the result is stored in the W register. If ‘d’ is ‘1’, the result is stored back in register ‘f’. ASRF Arithmetic Right Shift Syntax: [ label ] ASRF ADDWF Add W and f Syntax: [ label ] ADDWF Operands: 0 f 127 d 0,1 Operands: 0 f 127 d [0,1] Operation: (W) + (f) (destination) Operation: (f<7>) dest<7> (f<7:1>) dest<6:0>, (f<0>) C, Status Affected: C, Z Description: The contents of register ‘f’ are shifted one bit to the right through the Carry flag. The MSb remains unchanged. If ‘d’ is ‘0’, the result is placed in W. If ‘d’ is ‘1’, the result is stored back in register ‘f’. f,d Status Affected: C, DC, Z Description: Add the contents of the W register with register ‘f’. If ‘d’ is ‘0’, the result is stored in the W register. If ‘d’ is ‘1’, the result is stored back in register ‘f’. ADDWFC ADD W and CARRY bit to f Syntax: [ label ] ADDWFC Operands: 0 f 127 d [0,1] Operation: (W) + (f) + (C) dest register f C f {,d} Status Affected: C, DC, Z Description: Add W, the Carry flag and data memory location ‘f’. If ‘d’ is ‘0’, the result is placed in W. If ‘d’ is ‘1’, the result is placed in data memory location ‘f’. 2014-2016 Microchip Technology Inc. f {,d} DS40001737B-page 311 PIC12(L)F1612/16(L)F1613 BCF Bit Clear f Syntax: [ label ] BCF BTFSC f,b Bit Test f, Skip if Clear Syntax: [ label ] BTFSC f,b 0 f 127 0b7 Operands: 0 f 127 0b7 Operands: Operation: 0 (f<b>) Operation: skip if (f<b>) = 0 Status Affected: None Status Affected: None Description: Bit ‘b’ in register ‘f’ is cleared. Description: If bit ‘b’ in register ‘f’ is ‘1’, the next instruction is executed. If bit ‘b’, in register ‘f’, is ‘0’, the next instruction is discarded, and a NOP is executed instead, making this a 2cycle instruction. BRA Relative Branch BTFSS Bit Test f, Skip if Set Syntax: [ label ] BRA label [ label ] BRA $+k Syntax: [ label ] BTFSS f,b Operands: 0 f 127 0b<7 Operands: -256 label - PC + 1 255 -256 k 255 Operation: skip if (f<b>) = 1 Operation: (PC) + 1 + k PC Status Affected: None Status Affected: None Description: Description: Add the signed 9-bit literal ‘k’ to the PC. Since the PC will have incremented to fetch the next instruction, the new address will be PC + 1 + k. This instruction is a 2-cycle instruction. This branch has a limited range. If bit ‘b’ in register ‘f’ is ‘0’, the next instruction is executed. If bit ‘b’ is ‘1’, then the next instruction is discarded and a NOP is executed instead, making this a 2-cycle instruction. BRW Relative Branch with W CALL Call Subroutine Syntax: [ label ] BRW Operands: None Operation: (PC) + (W) PC Status Affected: None Description: Add the contents of W (unsigned) to the PC. Since the PC will have incremented to fetch the next instruction, the new address will be PC + 1 + (W). This instruction is a 2-cycle instruction. BSF Bit Set f Syntax: [ label ] BSF Operands: 0 f 127 0b7 Operation: 1 (f<b>) Status Affected: None Description: Bit ‘b’ in register ‘f’ is set. Syntax: [ label ] CALL k Operands: 0 k 2047 Operation: (PC)+ 1 TOS, k PC<10:0>, (PCLATH<6:3>) PC<14:11> Status Affected: None Description: Call Subroutine. First, return address (PC + 1) is pushed onto the stack. The 11-bit immediate address is loaded into PC bits <10:0>. The upper bits of the PC are loaded from PCLATH. CALL is a 2-cycle instruction. f,b 2014-2016 Microchip Technology Inc. DS40001737B-page 312 PIC12(L)F1612/16(L)F1613 COMF CALLW Subroutine Call With W Syntax: [ label ] CALLW Operands: None Operation: (PC) +1 TOS, (W) PC<7:0>, (PCLATH<6:0>) PC<14:8> Complement f Syntax: [ label ] COMF Operands: 0 f 127 d [0,1] Operation: (f) (destination) f,d Status Affected: Z Description: The contents of register ‘f’ are complemented. If ‘d’ is ‘0’, the result is stored in W. If ‘d’ is ‘1’, the result is stored back in register ‘f’. DECF Decrement f Status Affected: None Description: Subroutine call with W. First, the return address (PC + 1) is pushed onto the return stack. Then, the contents of W is loaded into PC<7:0>, and the contents of PCLATH into PC<14:8>. CALLW is a 2-cycle instruction. CLRF Clear f Syntax: [ label ] CLRF Operands: 0 f 127 Operation: 00h (f) 1Z Status Affected: Z Description: The contents of register ‘f’ are cleared and the Z bit is set. CLRW Clear W Syntax: [ label ] CLRW Operands: None Syntax: [ label ] DECFSZ f,d Operation: 00h (W) 1Z Operands: 0 f 127 d [0,1] Status Affected: Z Operation: Description: W register is cleared. Zero bit (Z) is set. (f) - 1 (destination); skip if result = 0 Status Affected: None Description: The contents of register ‘f’ are decremented. If ‘d’ is ‘0’, the result is placed in the W register. If ‘d’ is ‘1’, the result is placed back in register ‘f’. If the result is ‘1’, the next instruction is executed. If the result is ‘0’, then a NOP is executed instead, making it a 2-cycle instruction. f CLRWDT Clear Watchdog Timer Syntax: [ label ] CLRWDT Operands: None Operation: 00h WDT 0 WDT prescaler, 1 TO 1 PD Status Affected: TO, PD Description: CLRWDT instruction resets the Watchdog Timer. It also resets the prescaler of the WDT. Status bits TO and PD are set. 2014-2016 Microchip Technology Inc. Syntax: [ label ] DECF f,d Operands: 0 f 127 d [0,1] Operation: (f) - 1 (destination) Status Affected: Z Description: Decrement register ‘f’. If ‘d’ is ‘0’, the result is stored in the W register. If ‘d’ is ‘1’, the result is stored back in register ‘f’. DECFSZ Decrement f, Skip if 0 DS40001737B-page 313 PIC12(L)F1612/16(L)F1613 Unconditional Branch IORWF Syntax: [ label ] Syntax: [ label ] Operands: 0 k 2047 Operands: Operation: k PC<10:0> PCLATH<6:3> PC<14:11> 0 f 127 d [0,1] Operation: (W) .OR. (f) (destination) Status Affected: None Status Affected: Z Description: GOTO is an unconditional branch. The 11-bit immediate value is loaded into PC bits <10:0>. The upper bits of PC are loaded from PCLATH<4:3>. GOTO is a 2-cycle instruction. Description: Inclusive OR the W register with register ‘f’. If ‘d’ is ‘0’, the result is placed in the W register. If ‘d’ is ‘1’, the result is placed back in register ‘f’. INCF Increment f Syntax: [ label ] Operands: 0 f 127 d [0,1] Operation: (f) + 1 (destination) Status Affected: Z Description: The contents of register ‘f’ are incremented. If ‘d’ is ‘0’, the result is placed in the W register. If ‘d’ is ‘1’, the result is placed back in register ‘f’. GOTO GOTO k LSLF INCF f,d INCFSZ Increment f, Skip if 0 Syntax: [ label ] Operands: 0 f 127 d [0,1] Operation: (f) + 1 (destination), skip if result = 0 Status Affected: None Description: The contents of register ‘f’ are incremented. If ‘d’ is ‘0’, the result is placed in the W register. If ‘d’ is ‘1’, the result is placed back in register ‘f’. If the result is ‘1’, the next instruction is executed. If the result is ‘0’, a NOP is executed instead, making it a 2-cycle instruction. Inclusive OR W with f IORWF f,d Logical Left Shift Syntax: [ label ] LSLF Operands: 0 f 127 d [0,1] f {,d} Operation: (f<7>) C (f<6:0>) dest<7:1> 0 dest<0> Status Affected: C, Z Description: The contents of register ‘f’ are shifted one bit to the left through the Carry flag. A ‘0’ is shifted into the LSb. If ‘d’ is ‘0’, the result is placed in W. If ‘d’ is ‘1’, the result is stored back in register ‘f’. C register f 0 INCFSZ f,d IORLW Inclusive OR literal with W Syntax: [ label ] Operands: 0 k 255 Operation: (W) .OR. k (W) Status Affected: Z Description: The contents of the W register are OR’ed with the 8-bit literal ‘k’. The result is placed in the W register. LSRF Logical Right Shift Syntax: [ label ] LSRF Operands: 0 f 127 d [0,1] Operation: 0 dest<7> (f<7:1>) dest<6:0>, (f<0>) C, Status Affected: C, Z Description: The contents of register ‘f’ are shifted one bit to the right through the Carry flag. A ‘0’ is shifted into the MSb. If ‘d’ is ‘0’, the result is placed in W. If ‘d’ is ‘1’, the result is stored back in register ‘f’. 0 f {,d} register f C IORLW k 2014-2016 Microchip Technology Inc. DS40001737B-page 314 PIC12(L)F1612/16(L)F1613 MOVF Move f Syntax: [ label ] Operands: 0 f 127 d [0,1] MOVF f,d Operation: (f) (dest) Status Affected: Z Description: The contents of register f is moved to a destination dependent upon the status of d. If d = 0, destination is W register. If d = 1, the destination is file register f itself. d = 1 is useful to test a file register since status flag Z is affected. Words: 1 Cycles: 1 Example: MOVF MOVIW Move INDFn to W Syntax: [ label ] MOVIW ++FSRn [ label ] MOVIW --FSRn [ label ] MOVIW FSRn++ [ label ] MOVIW FSRn-[ label ] MOVIW k[FSRn] Operands: n [0,1] mm [00,01, 10, 11] -32 k 31 Operation: INDFn W Effective address is determined by • FSR + 1 (preincrement) • FSR - 1 (predecrement) • FSR + k (relative offset) After the Move, the FSR value will be either: • FSR + 1 (all increments) • FSR - 1 (all decrements) • Unchanged Status Affected: Z Mode Syntax mm Preincrement ++FSRn 00 Predecrement --FSRn 01 Postincrement FSRn++ 10 Postdecrement FSRn-- 11 Description: This instruction is used to move data between W and one of the indirect registers (INDFn). Before/after this move, the pointer (FSRn) is updated by pre/post incrementing/decrementing it. FSR, 0 After Instruction W = value in FSR register Z = 1 Note: The INDFn registers are not physical registers. Any instruction that accesses an INDFn register actually accesses the register at the address specified by the FSRn. FSRn is limited to the range 0000h FFFFh. Incrementing/decrementing it beyond these bounds will cause it to wrap-around. MOVLB 2014-2016 Microchip Technology Inc. Move literal to BSR Syntax: [ label ] MOVLB k Operands: 0 k 31 Operation: k BSR Status Affected: None Description: The 5-bit literal ‘k’ is loaded into the Bank Select Register (BSR). DS40001737B-page 315 PIC12(L)F1612/16(L)F1613 MOVLP Move literal to PCLATH MOVWI Move W to INDFn Syntax: [ label ] MOVLP k Syntax: Operands: 0 k 127 [ label ] MOVWI ++FSRn [ label ] MOVWI --FSRn [ label ] MOVWI FSRn++ [ label ] MOVWI FSRn-[ label ] MOVWI k[FSRn] Operands: n [0,1] mm [00,01, 10, 11] -32 k 31 Operation: W INDFn Effective address is determined by • FSR + 1 (preincrement) • FSR - 1 (predecrement) • FSR + k (relative offset) After the Move, the FSR value will be either: • FSR + 1 (all increments) • FSR - 1 (all decrements) Unchanged Status Affected: None Mode Syntax Preincrement ++FSRn 00 Predecrement --FSRn 01 Postincrement FSRn++ 10 Postdecrement FSRn-- 11 Description: This instruction is used to move data between W and one of the indirect registers (INDFn). Before/after this move, the pointer (FSRn) is updated by pre/post incrementing/decrementing it. Operation: k PCLATH Status Affected: None Description: The 7-bit literal ‘k’ is loaded into the PCLATH register. MOVLW Move literal to W Syntax: [ label ] MOVLW k Operands: 0 k 255 Operation: k (W) Status Affected: None Description: The 8-bit literal ‘k’ is loaded into W register. The “don’t cares” will assemble as ‘0’s. Words: 1 Cycles: 1 Example: MOVLW 0x5A After Instruction W = MOVWF Move W to f Syntax: [ label ] Operands: 0 f 127 Operation: (W) (f) MOVWF 0x5A f Status Affected: None Description: Move data from W register to register ‘f’. Words: 1 Cycles: 1 Example: MOVWF OPTION_REG Before Instruction OPTION_REG = W = After Instruction OPTION_REG = W = 2014-2016 Microchip Technology Inc. 0xFF 0x4F 0x4F 0x4F mm Note: The INDFn registers are not physical registers. Any instruction that accesses an INDFn register actually accesses the register at the address specified by the FSRn. FSRn is limited to the range 0000h FFFFh. Incrementing/decrementing it beyond these bounds will cause it to wrap-around. The increment/decrement operation on FSRn WILL NOT affect any Status bits. DS40001737B-page 316 PIC12(L)F1612/16(L)F1613 NOP No Operation RETFIE Return from Interrupt Syntax: [ label ] Syntax: [ label ] Operands: None Operands: None Operation: No operation Operation: Status Affected: None TOS PC, 1 GIE Description: No operation. Status Affected: None Words: 1 Description: Cycles: 1 Return from Interrupt. Stack is POPed and Top-of-Stack (TOS) is loaded in the PC. Interrupts are enabled by setting Global Interrupt Enable bit, GIE (INTCON<7>). This is a 2-cycle instruction. Words: 1 Cycles: 2 Example: NOP NOP OPTION Load OPTION_REG Register with W Syntax: [ label ] OPTION Operands: None Operation: (W) OPTION_REG Status Affected: None Description: Move data from W register to OPTION_REG register. RESET Software Reset Syntax: [ label ] RESET Operands: None Operation: Execute a device Reset. Resets the RI flag of the PCON register. Status Affected: None Description: This instruction provides a way to execute a hardware Reset by software. Example: RETFIE RETFIE After Interrupt PC = GIE = RETLW Return with literal in W Syntax: [ label ] RETLW k Operands: 0 k 255 Operation: k (W); TOS PC Status Affected: None Description: The W register is loaded with the 8-bit literal ‘k’. The program counter is loaded from the top of the stack (the return address). This is a 2-cycle instruction. Words: 1 Cycles: 2 Example: TABLE CALL TABLE;W contains table ;offset value • ;W now has table value • • ADDWF PC ;W = offset RETLW k1 ;Begin table RETLW k2 ; • • • RETLW kn ; End of table Before Instruction W = After Instruction W = 2014-2016 Microchip Technology Inc. TOS 1 0x07 value of k8 DS40001737B-page 317 PIC12(L)F1612/16(L)F1613 RETURN Return from Subroutine RRF Syntax: [ label ] Operands: 0 f 127 d [0,1] Operation: See description below Syntax: [ label ] Operands: None RETURN Operation: TOS PC Status Affected: None Description: Return from subroutine. The stack is POPed and the top of the stack (TOS) is loaded into the program counter. This is a 2-cycle instruction. Rotate Right f through Carry RRF f,d Status Affected: C Description: The contents of register ‘f’ are rotated one bit to the right through the Carry flag. If ‘d’ is ‘0’, the result is placed in the W register. If ‘d’ is ‘1’, the result is placed back in register ‘f’. C Register f SLEEP Enter Sleep mode RLF Rotate Left f through Carry Syntax: [ label ] Syntax: [ label ] Operands: None Operands: 0 f 127 d [0,1] Operation: Operation: See description below 00h WDT, 0 WDT prescaler, 1 TO, 0 PD Status Affected: TO, PD Description: The power-down Status bit, PD is cleared. Time-out Status bit, TO is set. Watchdog Timer and its prescaler are cleared. The processor is put into Sleep mode with the oscillator stopped. RLF f,d Status Affected: C Description: The contents of register ‘f’ are rotated one bit to the left through the Carry flag. If ‘d’ is ‘0’, the result is placed in the W register. If ‘d’ is ‘1’, the result is stored back in register ‘f’. C Words: 1 Cycles: 1 Example: RLF Register f SLEEP REG1,0 Before Instruction REG1 C After Instruction REG1 W C 2014-2016 Microchip Technology Inc. = = 1110 0110 0 = = = 1110 0110 1100 1100 1 DS40001737B-page 318 PIC12(L)F1612/16(L)F1613 SUBLW Subtract W from literal Syntax: [ label ] Operands: 0 k 255 Syntax: [ label ] Operation: k - (W) W) Operands: Status Affected: C, DC, Z 0 f 127 d [0,1] Description: The W register is subtracted (2’s complement method) from the 8-bit literal ‘k’. The result is placed in the W register. Operation: (f<3:0>) (destination<7:4>), (f<7:4>) (destination<3:0>) Status Affected: None Description: The upper and lower nibbles of register ‘f’ are exchanged. If ‘d’ is ‘0’, the result is placed in the W register. If ‘d’ is ‘1’, the result is placed in register ‘f’. TRIS Load TRIS Register with W Syntax: [ label ] TRIS f SUBWF SUBLW k C=0 Wk C=1 Wk DC = 0 W<3:0> k<3:0> DC = 1 W<3:0> k<3:0> Subtract W from f Syntax: [ label ] Operands: 0 f 127 d [0,1] SUBWF f,d Operation: (f) - (W) destination) Status Affected: C, DC, Z Description: Subtract (2’s complement method) W register from register ‘f’. If ‘d’ is ‘0’, the result is stored in the W register. If ‘d’ is ‘1’, the result is stored back in register ‘f. C=0 Wf C=1 Wf DC = 0 W<3:0> f<3:0> DC = 1 W<3:0> f<3:0> SUBWFB Subtract W from f with Borrow Syntax: SUBWFB Operands: 0 f 127 d [0,1] SWAPF Swap Nibbles in f SWAPF f,d Operands: 5f7 Operation: (W) TRIS register ‘f’ Status Affected: None Description: Move data from W register to TRIS register. When ‘f’ = 5, TRISA is loaded. When ‘f’ = 6, TRISB is loaded. When ‘f’ = 7, TRISC is loaded. f {,d} Operation: (f) – (W) – (B) dest Status Affected: C, DC, Z Description: Subtract W and the BORROW flag (CARRY) from register ‘f’ (2’s complement method). If ‘d’ is ‘0’, the result is stored in W. If ‘d’ is ‘1’, the result is stored back in register ‘f’. 2014-2016 Microchip Technology Inc. DS40001737B-page 319 PIC12(L)F1612/16(L)F1613 XORLW Exclusive OR literal with W Syntax: [ label ] Operands: 0 k 255 XORLW k Operation: (W) .XOR. k W) Status Affected: Z Description: The contents of the W register are XOR’ed with the 8-bit literal ‘k’. The result is placed in the W register. XORWF Exclusive OR W with f Syntax: [ label ] Operands: 0 f 127 d [0,1] Operation: (W) .XOR. (f) destination) Status Affected: Z Description: Exclusive OR the contents of the W register with register ‘f’. If ‘d’ is ‘0’, the result is stored in the W register. If ‘d’ is ‘1’, the result is stored back in register ‘f’. XORWF 2014-2016 Microchip Technology Inc. f,d DS40001737B-page 320 PIC12(L)F1612/16(L)F1613 28.0 ELECTRICAL SPECIFICATIONS 28.1 Absolute Maximum Ratings(†) Ambient temperature under bias...................................................................................................... -40°C to +125°C Storage temperature ........................................................................................................................ -65°C to +150°C Voltage on pins with respect to VSS on VDD pin PIC12F1612/16F1613 .............................................................................................. -0.3V to +6.5V PIC12LF1612/16F1613 ............................................................................................ -0.3V to +4.0V on MCLR pin ........................................................................................................................... -0.3V to +9.0V on all other pins ............................................................................................................ -0.3V to (VDD + 0.3V) Maximum current on VSS pin(1) -40°C TA +85°C .............................................................................................................. 250 mA +85°C TA +125°C ............................................................................................................. 85 mA on VDD pin(1) -40°C TA +85°C .............................................................................................................. 250 mA +85°C TA +125°C ............................................................................................................. 85 mA Sunk by any standard I/O pin ............................................................................................................... 50 mA Sourced by any standard I/O pin .......................................................................................................... 50 mA Sunk by any High Current I/O pin ....................................................................................................... 100 mA Sourced by any High Current I/O pin ................................................................................................. 100 mA Clamp current, IK (VPIN < 0 or VPIN > VDD) ................................................................................................... 20 mA Total power dissipation(2) ............................................................................................................................... 800 mW Note 1: 2: Maximum current rating requires even load distribution across I/O pins. Maximum current rating may be limited by the device package power dissipation characterizations, see Table 28-6: “Thermal Characteristics” to calculate device specifications. Power dissipation is calculated as follows: PDIS = VDD x {IDD – IOH} + {(VDD – VOH) x IOH} + (VOl x IOL). . † NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operation listings of this specification is not implied. Exposure above maximum rating conditions for extended periods may affect device reliability. 2014-2016 Microchip Technology Inc. DS40001737B-page 321 PIC12(L)F1612/16(L)F1613 28.2 Standard Operating Conditions The standard operating conditions for any device are defined as: Operating Voltage: Operating Temperature: VDDMIN VDD VDDMAX TA_MIN TA TA_MAX VDD — Operating Supply Voltage(1) PIC12LF1612/16F1613 VDDMIN (Fosc 16 MHz) ......................................................................................................... +1.8V VDDMIN (Fosc 32 MHz) ......................................................................................................... +2.5V VDDMAX .................................................................................................................................... +3.6V PIC12F1612/16F1613 VDDMIN (Fosc 16 MHz) ......................................................................................................... +2.3V VDDMIN (Fosc 32 MHz) ......................................................................................................... +2.5V VDDMAX .................................................................................................................................... +5.5V TA — Operating Ambient Temperature Range Industrial Temperature TA_MIN ...................................................................................................................................... -40°C TA_MAX .................................................................................................................................... +85°C Extended Temperature TA_MIN ...................................................................................................................................... -40°C TA_MAX .................................................................................................................................. +125°C Note 1: See Parameter D001, DS Characteristics: Supply Voltage. 2014-2016 Microchip Technology Inc. DS40001737B-page 322 PIC12(L)F1612/16(L)F1613 VOLTAGE FREQUENCY GRAPH, -40°C TA +125°C, PIC12F1612/16F1613 ONLY FIGURE 28-1: Rev. 10-000130B 9/19/2013 VDD (V) 5.5 2.5 2.3 0 16 32 Frequency (MHz) Note 1: The shaded region indicates the permissible combinations of voltage and frequency. 2: Refer to Table 28-7 for each Oscillator mode’s supported frequencies. VOLTAGE FREQUENCY GRAPH, -40°C TA +125°C, PIC12LF1612/16F1613 ONLY FIGURE 28-2: Rev. 10-000131B 9/19/2013 VDD (V) 3.6 2.5 1.8 0 16 32 Frequency (MHz) Note 1: The shaded region indicates the permissible combinations of voltage and frequency. 2: Refer to Table 28-7 for each Oscillator mode’s supported frequencies. 2014-2016 Microchip Technology Inc. DS40001737B-page 323 PIC12(L)F1612/16(L)F1613 28.3 DC Characteristics TABLE 28-1: SUPPLY VOLTAGE Standard Operating Conditions (unless otherwise stated) PIC12F1612/16F1613 PIC12F1612/16F1613 Param. No. D001 Sym. VDD Characteristic Min. Typ† Max. Units VDDMIN 1.8 2.5 — — VDDMAX 3.6 3.6 V V FOSC 16 MHz FOSC 32 MHz 2.3 2.5 — — 5.5 5.5 V V FOSC 16 MHz FOSC 32 MHz 1.5 — — V Device in Sleep mode 1.7 — — V Device in Sleep mode — 1.6 — V — 1.6 — V — 0.8 — V — 1.5 — V — 1.024 — V -40°C TA +85°C — 1.024 — V -40°C TA +85°C -4 — +4 % 1x VFVR, VDD 2.5V 2x VFVR, VDD 2.5V -5 — +5 % 1x VFVR, VDD 2.5V 2x VFVR, VDD 2.5V 4x VFVR, VDD 4.75V Supply Voltage D001 D002* VDR RAM Data Retention Voltage(1) D002* D002A* VPOR Power-on Reset Release Voltage(2) D002A* D002B* VPORR* (2) Power-on Reset Rearm Voltage D002B* D003 VFVR Fixed Voltage Reference Voltage D003 D003A VADFVR FVR Gain Voltage Accuracy for ADC D003A D003B VCDAFVR FVR Gain Voltage Accuracy for Comparator/ADC D003B D004* Conditions SVDD -4 — +4 % 1x VFVR, VDD 2.5V 2x VFVR, VDD 2.5V -7 — +7 % 1x VFVR, VDD 2.5V 2x VFVR, VDD 2.5V 4x VFVR, VDD 4.75V 0.05 — — V/ms Ensures that the Power-on Reset signal is released properly. 0.05 — — V/ms Ensures that the Power-on Reset signal is released properly. VDD Rise Rate(2) D004* * † These parameters are characterized but not tested. Data in “Typ” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: This is the limit to which VDD can be lowered in Sleep mode without losing RAM data. 2: See Figure 28-3, POR and POR REARM with Slow Rising VDD. 2014-2016 Microchip Technology Inc. DS40001737B-page 324 PIC12(L)F1612/16(L)F1613 FIGURE 28-3: POR AND POR REARM WITH SLOW RISING VDD VDD VPOR VPORR SVDD VSS NPOR(1) POR REARM VSS TPOR(3) TVLOW(2) Note 1: 2: 3: TABLE 28-2: When NPOR is low, the device is held in Reset. TPOR 1 s typical. TVLOW 2.7 s typical. SUPPLY CURRENT (IDD)(1,2) PIC12LF1612/16F1613 Standard Operating Conditions (unless otherwise stated) PIC12F1612/16F1613 Param. No. D013 D013 D014 D014 Device Characteristics Conditions Min. Typ† Max. Units VDD Note FOSC = 1 MHz, External Clock (ECM), Medium-Power mode — 30 90 A 1.8 — 55 110 A 3.0 — 65 120 A 2.3 — 85 150 A 3.0 — 115 200 A 5.0 — 115 260 A 1.8 — 210 380 A 3.0 — 180 310 A 2.3 — 240 410 A 3.0 — 295 520 A 5.0 FOSC = 1 MHz, External Clock (ECM), Medium-Power mode FOSC = 4 MHz, External Clock (ECM), Medium-Power mode FOSC = 4 MHz, External Clock (ECM), Medium-Power mode * † These parameters are characterized but not tested. Data in “Typ” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: The test conditions for all IDD measurements in active operation mode are: OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VSS; MCLR = VDD; WDT disabled. 2: The supply current is mainly a function of the operating voltage and frequency. Other factors, such as I/O pin loading and switching rate, oscillator type, internal code execution pattern and temperature, also have an impact on the current consumption. 2014-2016 Microchip Technology Inc. DS40001737B-page 325 PIC12(L)F1612/16(L)F1613 TABLE 28-2: SUPPLY CURRENT (IDD)(1,2) (CONTINUED) PIC12LF1612/16F1613 Standard Operating Conditions (unless otherwise stated) PIC12F1612/16F1613 Param. No. D015 D015 D016 D016 Device Characteristics Conditions Min. Typ† Max. Units — 9.6 36 A 1.8 — 16.2 60 A 3.0 — 39 84 A 2.3 — 45 90 A 3.0 — 51 108 A 5.0 — 215 360 A 1.8 — 275 480 A 3.0 — 270 450 A 2.3 — 300 500 A 3.0 — 350 620 A 5.0 D017* — 410 800 A 1.8 — 630 1200 A 3.0 D017* — 530 950 A 2.3 — 660 1300 A 3.0 — 730 1400 A 5.0 — 600 1200 A 1.8 — 970 1850 A 3.0 — 780 1500 A 2.3 — 1000 1900 A 3.0 — 1090 2100 A 5.0 D018 D018 Note VDD FOSC = 31 kHz, LFINTOSC, -40°C TA +85°C FOSC = 31 kHz, LFINTOSC, -40°C TA +85°C FOSC = 500 kHz, HFINTOSC FOSC = 500 kHz, HFINTOSC FOSC = 8 MHz, HFINTOSC FOSC = 8 MHz, HFINTOSC FOSC = 16 MHz, HFINTOSC FOSC = 16 MHz, HFINTOSC * † These parameters are characterized but not tested. Data in “Typ” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: The test conditions for all IDD measurements in active operation mode are: OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VSS; MCLR = VDD; WDT disabled. 2: The supply current is mainly a function of the operating voltage and frequency. Other factors, such as I/O pin loading and switching rate, oscillator type, internal code execution pattern and temperature, also have an impact on the current consumption. 2014-2016 Microchip Technology Inc. DS40001737B-page 326 PIC12(L)F1612/16(L)F1613 TABLE 28-2: SUPPLY CURRENT (IDD)(1,2) (CONTINUED) PIC12LF1612/16F1613 Standard Operating Conditions (unless otherwise stated) PIC12F1612/16F1613 Param. No. D019 Device Characteristics Conditions Min. Typ† Max. Units VDD — 1.6 5.0 mA 3.0 — 1.9 6.0 mA 3.6 D019 — 1.6 5.0 mA 3.0 — 1.9 6.0 mA 5.0 D020A — 1.6 5.0 mA 3.0 — 1.9 6.0 mA 3.6 — 1.6 5.0 mA 3.0 — 1.9 6.0 mA 5.0 — 6 16 A 1.8 — 8 22 A 3.0 — 13 43 A 2.3 — 15 55 A 3.0 — 16 57 A 5.0 — 19 40 A 1.8 — 32 60 A 3.0 — 31 60 A 2.3 — 38 90 A 3.0 — 44 100 A 5.0 D020A D020B D020B D020C D020C Note FOSC = 32 MHz, HFINTOSC FOSC = 32 MHz, HFINTOSC FOSC = 32 MHz, External Clock (ECH), High-Power mode FOSC = 32 MHz, External Clock (ECH), High-Power mode FOSC = 32 kHz, External Clock (ECL), Low-Power mode FOSC = 32 kHz, External Clock (ECL), Low-Power mode FOSC = 500 kHz, External Clock (ECL), Low-Power mode FOSC = 500 kHz, External Clock (ECL), Low-Power mode * † These parameters are characterized but not tested. Data in “Typ” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: The test conditions for all IDD measurements in active operation mode are: OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VSS; MCLR = VDD; WDT disabled. 2: The supply current is mainly a function of the operating voltage and frequency. Other factors, such as I/O pin loading and switching rate, oscillator type, internal code execution pattern and temperature, also have an impact on the current consumption. 2014-2016 Microchip Technology Inc. DS40001737B-page 327 PIC12(L)F1612/16(L)F1613 TABLE 28-3: POWER-DOWN CURRENTS (IPD)(1,2) PIC12LF1612/16F1613 Operating Conditions: (unless otherwise stated) Low-Power Sleep Mode PIC12F1612/16F1613 Low-Power Sleep Mode, VREGPM = 1 Param. No. Device Characteristics Conditions Min. Typ† Max. +85°C Max. +125°C Units A VDD D022 Base IPD — 0.020 1.0 8.0 — 0.025 2.0 9.0 A 3.0 D022 Base IPD — 0.25 3.0 10 A 2.3 — 0.30 4.0 12 A 3.0 — 0.40 6.0 15 A 5.0 — 9.8 16 18 A 2.3 — 10.3 18 20 A 3.0 — 11.5 21 26 A 5.0 D023 — 0.26 2.0 9.0 A 1.8 — 0.44 3.0 10 A 3.0 D023 — 0.43 6.0 15 A 2.3 — 0.53 7.0 20 A 3.0 — 0.64 8.0 22 A 5.0 — 15 28 30 A 1.8 — 18 30 33 A 3.0 — 18 33 35 A 2.3 — 19 35 37 A 3.0 5.0 D022A Base IPD D023A D023A 1.8 Note WDT, BOR, FVR disabled, all Peripherals inactive WDT, BOR, FVR disabled, all Peripherals inactive, Low-Power Sleep mode WDT, BOR, FVR disabled, all Peripherals inactive, Normal-Power Sleep mode, VREGPM = 0 WDT Current WDT Current FVR Current FVR Current — 20 37 39 A D024 — 6.0 17 20 A 3.0 BOR Current D024 — 7.0 17 30 A 3.0 BOR Current — 8.0 20 40 A 5.0 D24A — 0.1 4.0 10 A 3.0 LPBOR Current D24A — 0.35 5.0 14 A 3.0 LPBOR Current — 0.45 8.0 17 A 5.0 D026 — 0.11 1.5 9.0 A 1.8 — 0.12 2.7 10 A 3.0 D026 — 0.30 4.0 11 A 2.3 — 0.35 5.0 13 A 3.0 — 0.45 8.0 16 A 5.0 — 250 — — A 1.8 — 250 — — A 3.0 — 280 — — A 2.3 — 280 — — A 3.0 — 280 — — A 5.0 D026A* D026A* * † Legend: Note 1: 2: 3: ADC Current (Note 3), No conversion in progress ADC Current (Note 3), No conversion in progress ADC Current (Note 3), Conversion in progress ADC Current (Note 3), Conversion in progress These parameters are characterized but not tested. Data in “Typ” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested. TBD = To Be Determined The peripheral current can be determined by subtracting the base IPD current from this limit. Max. values should be used when calculating total current consumption. The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured with the part in Sleep mode, with all I/O pins in high-impedance state and tied to VSS. ADC clock source is FRC. 2014-2016 Microchip Technology Inc. DS40001737B-page 328 PIC12(L)F1612/16(L)F1613 TABLE 28-3: POWER-DOWN CURRENTS (IPD)(1,2) (CONTINUED) PIC12LF1612/16F1613 Operating Conditions: (unless otherwise stated) Low-Power Sleep Mode PIC12F1612/16F1613 Low-Power Sleep Mode, VREGPM = 1 Param. No. Device Characteristics D027 D027 * † Legend: Note 1: 2: 3: Min. Typ† Conditions Max. +85°C Max. +125°C Units VDD — 7 22 25 A 1.8 — 8 23 27 A 3.0 — 17 35 37 A 2.3 — 18 37 38 A 3.0 — 19 38 40 A 5.0 Note Comparator, CxSP = 0 Comparator, CxSP = 0 These parameters are characterized but not tested. Data in “Typ” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested. TBD = To Be Determined The peripheral current can be determined by subtracting the base IPD current from this limit. Max. values should be used when calculating total current consumption. The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured with the part in Sleep mode, with all I/O pins in high-impedance state and tied to VSS. ADC clock source is FRC. 2014-2016 Microchip Technology Inc. DS40001737B-page 329 PIC12(L)F1612/16(L)F1613 TABLE 28-4: I/O PORTS Standard Operating Conditions (unless otherwise stated) Param. No. Sym. VIL Characteristic Min. Typ† Max. Units Conditions Input Low Voltage I/O PORT: D030 with TTL buffer D030A D031 with Schmitt Trigger buffer D032 MCLR VIH — — 0.8 V 4.5V VDD 5.5V — — 0.15 VDD V 1.8V VDD 4.5V — — 0.2 VDD V 2.0V VDD 5.5V — — 0.2 VDD V Input High Voltage I/O PORT: D040 with TTL buffer D040A D041 with Schmitt Trigger buffer D042 MCLR IIL D060 MCLR(3) IPUR D080 — V 4.5V VDD 5.5V — — V 1.8V VDD 4.5V 2.0V VDD 5.5V 0.8 VDD — — V 0.8 VDD — — V — ±5 ± 125 nA VSS VPIN VDD, Pin at high-impedance, 85°C — ±5 ± 1000 nA VSS VPIN VDD, Pin at high-impedance, 125°C — ± 50 ± 200 nA VSS VPIN VDD, Pin at high-impedance, 85°C 25 100 200 A VDD = 3.3V, VPIN = VSS 25 140 300 A VDD = 5.0V, VPIN = VSS — — 0.6 V IOL = 8.0 mA, VDD = 5.0V IOL = 6.0 mA, VDD = 3.3V IOL = 1.8 mA, VDD = 1.8V VDD - 0.7 — — V IOH = 3.5 mA, VDD = 5.0V IOH = 3.0 mA, VDD = 3.3V IOH = 1.0 mA, VDD = 1.8V — — 50 pF Weak Pull-up Current D070* VOL — Input Leakage Current(1) I/O Ports D061 2.0 0.25 VDD + 0.8 Output Low Voltage(3) I/O Ports VOH D090 Output High Voltage(3) I/O Ports D101A* CIO All I/O pins * † These parameters are characterized but not tested. Data in “Typ” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: Negative current is defined as current sourced by the pin. 2: The leakage current on the MCLR pin is strongly dependent on the applied voltage level. The specified levels represent normal operating conditions. Higher leakage current may be measured at different input voltages. 3: Excluding OSC2 in CLKOUT mode. 2014-2016 Microchip Technology Inc. DS40001737B-page 330 PIC12(L)F1612/16(L)F1613 TABLE 28-5: MEMORY PROGRAMMING SPECIFICATIONS Standard Operating Conditions (unless otherwise stated) Param. No. Sym. Characteristic Min. Typ† Max. Units Conditions Program Memory Programming Specifications D110 VIHH Voltage on MCLR/VPP pin 8.0 — 9.0 V D111 IDDP Supply Current during Programming — — 10 mA D112 VBE VDD for Bulk Erase 2.7 — VDDMAX V D113 VPEW VDD for Write or Row Erase VDDMIN — VDDMAX V D114 IPPPGM Current on MCLR/VPP during Erase/Write — 1.0 — mA D115 IDDPGM Current on VDD during Erase/ Write — 5.0 — mA 10K — — E/W VDDMIN — VDDMAX V (Note 2) Program Flash Memory -40C TA +85C (Note 1) D121 EP Cell Endurance D122 VPRW VDD for Read/Write D123 TIW Self-timed Write Cycle Time — 2 2.5 ms D124 TRETD Characteristic Retention — 40 — Year Provided no other specifications are violated D125 EHEFC High-Endurance Flash Cell 100K — — E/W 0C TA +60°C, lower byte last 128 addresses † Data in “Typ” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: Self-write and Block Erase. 2: Required only if single-supply programming is disabled. 2014-2016 Microchip Technology Inc. DS40001737B-page 331 PIC12(L)F1612/16(L)F1613 TABLE 28-6: THERMAL CHARACTERISTICS Standard Operating Conditions (unless otherwise stated) Param. No. TH01 TH02 Sym. Characteristic JA Thermal Resistance Junction to Ambient JC TH03 TJMAX TH04 PD TH05 Thermal Resistance Junction to Case Maximum Junction Temperature Power Dissipation PINTERNAL Internal Power Dissipation Typ. Units Conditions 62.2 C/W 20-pin DIP package 77.7 C/W 20-pin SOIC package 87.3 C/W 20-pin SSOP package 43 C/W 20-pin QFN 4X4mm package 27.5 C/W 20-pin DIP package 23.1 C/W 20-pin SOIC package 31.1 C/W 20-pin SSOP package 5.3 C/W 20-pin QFN 4X4mm package 150 C — W PD = PINTERNAL + PI/O — W PINTERNAL = IDD x VDD(1) TH06 PI/O I/O Power Dissipation — W PI/O = (IOL * VOL) + (IOH * (VDD - VOH)) TH07 PDER Derated Power — W PDER = PDMAX (TJ - TA)/JA(2) Note 1: IDD is current to run the chip alone without driving any load on the output pins. 2: TA = Ambient Temperature; TJ = Junction Temperature 2014-2016 Microchip Technology Inc. DS40001737B-page 332 PIC12(L)F1612/16(L)F1613 28.4 AC Characteristics Timing Parameter Symbology has been created with one of the following formats: 1. TppS2ppS 2. TppS T F Frequency Lowercase letters (pp) and their meanings: pp cc CCP1 ck CLKOUT cs CS di SDIx do SDO dt Data in io I/O PORT mc MCLR Uppercase letters and their meanings: S F Fall H High I Invalid (High-impedance) L Low FIGURE 28-4: T Time osc rd rw sc ss t0 t1 wr CLKIN RD RD or WR SCKx SS T0CKI T1CKI WR P R V Z Period Rise Valid High-impedance LOAD CONDITIONS Rev. 10-000133A 8/1/2013 Load Condition Pin CL VSS Legend: CL=50 pF for all pins 2014-2016 Microchip Technology Inc. DS40001737B-page 333 PIC12(L)F1612/16(L)F1613 FIGURE 28-5: CLOCK TIMING Q4 Q1 Q2 Q3 Q4 Q1 CLKIN OS12 OS02 OS11 OS03 CLKOUT (CLKOUT mode) Note 1: See Table 28-10. TABLE 28-7: CLOCK OSCILLATOR TIMING REQUIREMENTS Standard Operating Conditions (unless otherwise stated) Param. No. OS01 Sym. FOSC Characteristic External CLKIN Frequency(1) Min. Typ† Max. Units Conditions DC — 0.5 MHz External Clock (ECL) DC — 4 MHz External Clock (ECM) DC — 32 MHz External Clock (ECH) OS02 TOSC External CLKIN Period(1) 31.25 — ns External Clock (EC) OS03 TCY Instruction Cycle Time(1) 200 TCY DC ns TCY = 4/FOSC * † These parameters are characterized but not tested. Data in “Typ” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: Instruction cycle period (TCY) equals four times the input oscillator time base period. All specified values are based on characterization data for that particular oscillator type under standard operating conditions with the device executing code. Exceeding these specified limits may result in an unstable oscillator operation and/or higher than expected current consumption. All devices are tested to operate at “min” values with an external clock applied to CLKIN pin. When an external clock input is used, the “max” cycle time limit is “DC” (no clock) for all devices. 2014-2016 Microchip Technology Inc. DS40001737B-page 334 PIC12(L)F1612/16(L)F1613 TABLE 28-8: OSCILLATOR PARAMETERS Standard Operating Conditions (unless otherwise stated) Param. No. Sym. Characteristic Freq. Tolerance Min. Typ† Max. Units — MHz (Note 2) (Note 3) HFOSC Internal Calibrated HFINTOSC Frequency(1) — — 16.0 OS09 LFOSC Internal LFINTOSC Frequency — — 31 — kHz OS10* TIOSC ST HFINTOSC Wake-up from Sleep Start-up Time — — 5 15 s OS10A* TLFOSC ST LFINTOSC Wake-up from Sleep Start-up Time — — 0.5 — ms OS08 Conditions -40°C TA +125°C * † These parameters are characterized but not tested. Data in “Typ” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1:To ensure these oscillator frequency tolerances, VDD and VSS must be capacitively decoupled as close to the device as possible. 0.1 F and 0.01 F values in parallel are recommended. 2: See Figure 28-6: “HFINTOSC Frequency Accuracy over Device VDD and Temperature”, 3: See Figure 36-45: “LFINTOSC Frequency over VDD and Temperature, PIC12LF1612/16F1613 Only”, and Figure 36-46: “LFINTOSC Frequency over VDD and Temperature, PIC12F1612/16F1613 Only”. FIGURE 28-6: HFINTOSC FREQUENCY ACCURACY OVER VDD AND TEMPERATURE Rev. 10-000 135B 12/4/201 3 125 ±5% 85 Temperature (°C) ±3% 60 25 ±2% 0 ±5% -40 1.8 2.3 5.5 VDD (V) 2014-2016 Microchip Technology Inc. DS40001737B-page 335 PIC12(L)F1612/16(L)F1613 TABLE 28-9: PLL CLOCK TIMING SPECIFICATIONS Standard Operating Conditions (unless otherwise stated) Param No. Sym. F10 Min. Typ† Max. Units FOSC Oscillator Frequency Range 4 — 8 MHz F11 FSYS On-Chip VCO System Frequency 16 — 32 MHz F12 TRC PLL Start-up Time (Lock Time) — — 2 ms CLK CLKOUT Stability (Jitter) -0.25% — +0.25% % F13* Characteristic Conditions * These parameters are characterized but not tested. † Data in “Typ” column is at 5V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested. 2014-2016 Microchip Technology Inc. DS40001737B-page 336 PIC12(L)F1612/16(L)F1613 FIGURE 28-7: Cycle F CLKOUT AND I/O TIMING Write Fetch Read Execute Q4 Q1 Q2 Q3 OSC OS12 OS11 OS20 CLKOUT OS21 OS19 OS18 OS16 OS13 OS17 I/O pin (Input) OS14 OS15 I/O pin (Output) New Value Old Value OS18, OS19 TABLE 28-10: CLKOUT AND I/O TIMING PARAMETERS Standard Operating Conditions (unless otherwise stated) Param. No. Sym. Characteristic Min. Typ† Max. Units Conditions TosH2ckL FOSC to CLKOUT(1) — — 70 ns 3.3V VDD 5.0V OS12 TosH2ckH FOSC to — — 72 ns 3.3V VDD 5.0V OS13 TckL2ioV CLKOUT to Port out valid(1) — — 20 ns OS14 TioV2ckH Port input valid before CLKOUT(1) TOSC + 200 ns — — ns OS15 TosH2ioV Fosc (Q1 cycle) to Port out valid — 50 70* ns 3.3V VDD 5.0V OS16 TosH2ioI Fosc (Q2 cycle) to Port input invalid (I/O in setup time) 50 — — ns 3.3V VDD 5.0V OS17 TioV2osH Port input valid to Fosc(Q2 cycle) (I/O in setup time) 20 — — ns OS18* TioR Port output rise time — — 40 15 72 32 ns VDD = 1.8V 3.3V VDD 5.0V OS19* TioF Port output fall time — — 28 15 55 30 ns VDD = 1.8V 3.3V VDD 5.0V OS11 CLKOUT(1) OS20* Tinp INT pin input high or low time 25 — — ns OS21* Tioc Interrupt-on-change new input level time 25 — — ns * These parameters are characterized but not tested. † Data in “Typ” column is at 3.0V, 25C unless otherwise stated. Note 1: Measurements are taken in EXTRC mode where CLKOUT output is 4 x TOSC. 2014-2016 Microchip Technology Inc. DS40001737B-page 337 PIC12(L)F1612/16(L)F1613 FIGURE 28-8: RESET, WATCHDOG TIMER, OSCILLATOR START-UP TIMER AND POWER-UP TIMER TIMING Vdd MCLR 30 Internal POR 33 PWRT Time-out 32 OSC Start-up Time Internal Reset(1) Watchdog Timer Reset(1) 34 31 34 I/O pins Note 1:Asserted low. 2014-2016 Microchip Technology Inc. DS40001737B-page 338 PIC12(L)F1612/16(L)F1613 TABLE 28-11: RESET, WATCHDOG TIMER, OSCILLATOR START-UP TIMER, POWER-UP TIMER AND BROWN-OUT RESET PARAMETERS Standard Operating Conditions (unless otherwise stated) Param. No. Sym. Characteristic Min. Typ† Max. Units Conditions 30 TMCL 2 — — s 31 TWDTLP Low-Power Watchdog Timer Time-out Period 10 16 27 ms 32 TOST Oscillator Start-up Timer Period(1) — 1024 — TOSC 33* TPWRT Power-up Timer Period 40 65 140 ms 34* TIOZ I/O high-impedance from MCLR Low or Watchdog Timer Reset — — 2.0 s 35 VBOR Brown-out Reset Voltage(2) 2.55 2.70 2.85 V BORV = 0 2.35 1.80 2.45 1.90 2.58 2.05 V V BORV = 1 (PIC12F1612/ 16F1613) BORV = 1 (PIC12LF1612/ 16F1613) MCLR Pulse Width (low) VDD = 3.3V-5V, 1:16 Prescaler used PWRTE = 0 36* VHYST Brown-out Reset Hysteresis 0 25 60 mV -40°C TA +85°C 37* TBORDC Brown-out Reset DC Response Time 1 16 35 s VDD VBOR VLPBOR Low-Power Brown-Out Reset Voltage 1.8 2.1 2.5 V LPBOR = 1 38 * † These parameters are characterized but not tested. Data in “Typ” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: By design, the Oscillator Start-up Timer (OST) counts the first 1024 cycles, independent of frequency. 2: To ensure these voltage tolerances, VDD and VSS must be capacitively decoupled as close to the device as possible. 0.1 F and 0.01 F values in parallel are recommended. FIGURE 28-9: BROWN-OUT RESET TIMING AND CHARACTERISTICS V DD VBOR and VHYST VBOR (Device in Brown-out Reset) (Device not in Brown-out Reset) 37 Reset 33 (due to BOR) 2014-2016 Microchip Technology Inc. DS40001737B-page 339 PIC12(L)F1612/16(L)F1613 FIGURE 28-10: TIMER0 AND TIMER1 EXTERNAL CLOCK TIMINGS T0CKI 40 41 42 T1CKI 45 46 49 47 TMR0 or TMR1 TABLE 28-12: TIMER0 AND TIMER1 EXTERNAL CLOCK REQUIREMENTS Standard Operating Conditions (unless otherwise stated) Param. No. 40* Sym. TT0H Characteristic T0CKI High Pulse Width Min. No Prescaler With Prescaler TT0L 41* T0CKI Low Pulse Width No Prescaler With Prescaler Typ† Max. Units 0.5 TCY + 20 — — ns 10 — — ns 0.5 TCY + 20 — — ns 10 — — ns Greater of: 20 or TCY + 40 N — — ns 42* TT0P T0CKI Period 45* TT1H T1CKI High Synchronous, No Prescaler Time Synchronous, with Prescaler 0.5 TCY + 20 — — ns 15 — — ns Asynchronous 30 — — ns Synchronous, No Prescaler 0.5 TCY + 20 — — ns Synchronous, with Prescaler 15 — — ns Asynchronous 30 — — ns Greater of: 30 or TCY + 40 N — — ns TT1L 46* T1CKI Low Time 47* TT1P T1CKI Input Synchronous Period 49* TCKEZTMR1 Delay from External Clock Edge to Timer Increment Asynchronous * † 60 — — ns 2 TOSC — 7 TOSC — Conditions N = prescale value N = prescale value Timers in Sync mode These parameters are characterized but not tested. Data in “Typ” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested. 2014-2016 Microchip Technology Inc. DS40001737B-page 340 PIC12(L)F1612/16(L)F1613 TABLE 28-13: ANALOG-TO-DIGITAL CONVERTER (ADC) CHARACTERISTICS(1,2,3) Operating Conditions (unless otherwise stated) VDD = 3.0V, TA = 25°C Param. Sym. No. Characteristic Min. Typ† Max. Units Conditions AD01 NR Resolution — — 10 AD02 EIL Integral Error — ±1 ±1.7 AD03 EDL Differential Error — ±1 ±1 AD04 EOFF Offset Error — ±1 ±2.5 LSb VREF = 3.0V AD05 EGN — ±1 ±2.0 LSb VREF = 3.0V AD06 VREF Reference Voltage 1.8 — VDD V AD07 VAIN Full-Scale Range VSS — VREF V AD08 ZAIN Recommended Impedance of Analog Voltage Source — — 10 k Gain Error bit LSb VREF = 3.0V LSb No missing codes VREF = 3.0V VREF = (VRPOS - VRNEG) (Note 4) Can go higher if external 0.01F capacitor is present on input pin. * † These parameters are characterized but not tested. Data in “Typ” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1:Total Absolute Error includes integral, differential, offset and gain errors. 2: The ADC conversion result never decreases with an increase in the input voltage and has no missing codes. 3: See Section 29.0 “DC and AC Characteristics Graphs and Charts” for operating characterization. 4: ADC VREF is selected by ADPREF<0> bit. 2014-2016 Microchip Technology Inc. DS40001737B-page 341 PIC12(L)F1612/16(L)F1613 FIGURE 28-11: ADC CONVERSION TIMING (ADC CLOCK FOSC-BASED) BSF ADCON0, GO 1 Tcy AD133 AD131 Q4 AD130 ADC_clk 9 ADC Data 8 6 7 3 2 1 0 NEW_DATA OLD_DATA ADRES 1 Tcy ADIF GO DONE Sampling Stopped AD132 Sample FIGURE 28-12: ADC CONVERSION TIMING (ADC CLOCK FROM FRC) BSF ADCON0, GO AD133 1 Tcy AD131 Q4 AD130 ADC_clk 9 ADC Data 8 7 6 OLD_DATA ADRES 2 1 0 NEW_DATA 1 Tcy ADIF GO Sample 3 DONE AD132 Sampling Stopped Note 1: If the ADC clock source is selected as FRC, a time of TCY is added before the ADC clock starts. This allows the SLEEP instruction to be executed. 2014-2016 Microchip Technology Inc. DS40001737B-page 342 PIC12(L)F1612/16(L)F1613 TABLE 28-14: ADC CONVERSION REQUIREMENTS Standard Operating Conditions (unless otherwise stated) Param. Sym. No. AD130* TAD AD131 TCNV Characteristic Min. Typ† Max. Units ADC Clock Period (TADC) 1.0 — 6.0 ADC Internal FRC Oscillator Period (TFRC) 1.0 2.0 Conversion Time (not including Acquisition Time)(1) — 11 Conditions s FOSC-based 6.0 s ADCS<2:0> = x11 (ADC FRC mode) — TAD Set GO/DONE bit to conversion complete s AD132* TACQ Acquisition Time — 5.0 — AD133* THCD Holding Capacitor Disconnect Time — — 1/2 TAD 1/2 TAD + 1TCY — — FOSC-based ADCS<2:0> = x11 (ADC FRC mode) * † These parameters are characterized but not tested. Data in “Typ” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: The ADRES register may be read on the following TCY cycle. TABLE 28-15: COMPARATOR SPECIFICATIONS(1) Operating Conditions (unless otherwise stated) VDD = 3.0V, TA = 25°C Param. No. Sym. Characteristics Min. Typ. Max. Units — ±7.5 ±60 mV CM01 Vioff Input Offset Voltage CM02 Vicm Input Common Mode Voltage 0 — VDD V CM03 CMRR Common Mode Rejection Ratio — 50 — dB Comments CxSP = 1, Vicm = VDD/2 CM04A Response Time Rising Edge — 400 800 ns CxSP = 1 CM04B Response Time Falling Edge — 200 400 ns CxSP = 1 Response Time Rising Edge — 1200 — ns CxSP = 0 Response Time Falling Edge — 550 — ns CxSP = 0 Comparator Mode Change to Output Valid — — 10 s — 25 — mV CM04C Tresp(2) CM04D CM05* Tmc2ov CM06 CHYSTER Comparator Hysteresis * Note 1: 2: CxHYS = 1, CxSP = 1 These parameters are characterized but not tested. See Section 29.0 “DC and AC Characteristics Graphs and Charts” for operating characterization. Response time measured with one comparator input at VDD/2, while the other input transitions from Vss to VDD. 2014-2016 Microchip Technology Inc. DS40001737B-page 343 PIC12(L)F1612/16(L)F1613 TABLE 28-16: DIGITAL-TO-ANALOG CONVERTER (DAC) SPECIFICATIONS(1) Operating Conditions (unless otherwise stated) VDD = 3.0V, TA = 25°C Param. No. Sym. Characteristics Min. Typ. Max. Units DAC01* CLSB Step Size — VDD/256 — V DAC02* CACC Absolute Accuracy — — 1.5 LSb DAC03* CR Unit Resistor Value (R) — — — CST Time(2) — — 10 s DAC04* * Note 1: 2: Settling Comments These parameters are characterized but not tested. See Section 29.0 “DC and AC Characteristics Graphs and Charts” for operating characterization. Settling time measured while DACR<4:0> transitions from ‘0000’ to ‘1111’. TABLE 28-17: ZERO CROSS PIN SPECIFICATIONS Operating Conditions (unless otherwise stated) VDD = 3.0V, TA = 25°C Param. No. Sym. Characteristics Min. Typ. Max. Units ZC01 ZCPINV Voltage on Zero Cross Pin — 0.75 — V ZC02 ZCSRC Source current — -300 -600 A ZC03 ZCSNK Sink current — 300 600 A ZC04 ZCISW Response Time Rising Edge — 1 — s Response Time Falling Edge — 1 — s ZC05 ZCOUT Response Time Rising Edge — 1 — s Response Time Falling Edge — 1 — s * Comments These parameters are characterized but not tested. 2014-2016 Microchip Technology Inc. DS40001737B-page 344 PIC12(L)F1612/16(L)F1613 29.0 DC AND AC CHARACTERISTICS GRAPHS AND CHARTS The graphs and tables provided in this section are for design guidance and are not tested. In some graphs or tables, the data presented are outside specified operating range (i.e., outside specified VDD range). This is for information only and devices are ensured to operate properly only within the specified range. Unless otherwise noted, all graphs apply to both the L and LF devices. Note: The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore, outside the warranted range. “Typical” represents the mean of the distribution at 25C. “Maximum”, “Max.”, “Minimum” or “Min.” represents (mean + 3) or (mean - 3) respectively, where is a standard deviation, over each temperature range. DS40001737B-page 345 2014-2015 Microchip Technology Inc. PIC12(L)F1612/16(L)F1613 Note: Unless otherwise noted, VIN = 5V, FOSC = 500 kHz, CIN = 0.1 µF, TA = 25°C. Max. 12 60 Max: 85°C + 3ı Typical: 25°C 10 Max. Max: 85°C + 3ı Typical: 25°C 50 Typical 40 IDD (µA) IDD (µA) 8 Typical 6 30 4 20 2 10 0 0 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6 2.0 3.8 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 VDD (V) VDD (V) FIGURE 29-1: IDD, EC Oscillator LP Mode, Fosc = 32 kHz, PIC12LF1612/16F1613 Only. FIGURE 29-4: IDD, EC Oscillator LP Mode, Fosc = 500 kHz, PIC12F1612/16F1613 Only. 350 25 Max. 300 Max: 85°C + 3ı Typical: 25°C 20 Typical: 25°C 4 MHz Typical 15 IDD (µA) IDD (µA) 250 200 150 10 100 1 MHz 5 50 0 0 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 1.6 6.0 1.8 2.0 2.2 2.4 FIGURE 29-2: IDD, EC Oscillator LP Mode, Fosc = 32 kHz, PIC12F1612/16F1613 Only. 2.8 3.0 3.2 3.4 3.6 3.8 FIGURE 29-5: IDD Typical, EC Oscillator MP Mode, PIC12LF1612/16F1613 Only. 350 50 Max. 45 4 MHz Max: 85°C + 3ı 300 Max: 85°C + 3ı Typical: 25°C 40 250 30 IDD (µA) 35 IDD (µA) 2.6 VDD (V) VDD (V) Typical 25 200 150 20 15 1 MHz 100 10 50 5 0 0 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6 3.8 VDD (V) FIGURE 29-3: IDD, EC Oscillator LP Mode, Fosc = 500 kHz, PIC12LF1612/16F1613 Only. DS40001737B-page 346 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6 3.8 VDD (V) FIGURE 29-6: IDD Maximum, EC Oscillator MP Mode, PIC12LF1612/16F1613 Only. 2014-2015 Microchip Technology Inc. PIC12(L)F1612/16(L)F1613 Note: Unless otherwise noted, VIN = 5V, FOSC = 500 kHz, CIN = 0.1 µF, TA = 25°C. 400 3.0 350 Max: 85°C + 3ı Typical: 25°C 4 MHz 2.5 32 MHz 2.0 250 IDD (mA) IDD (µA) 300 200 1 MHz 1.5 16 MHz 150 1.0 100 8 MHz 0.5 50 0 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 0.0 6.0 1.6 1.8 2.0 2.2 2.4 VDD (V) 2.6 2.8 3.0 3.2 3.4 3.6 3.8 VDD (V) FIGURE 29-10: IDD Maximum, EC Oscillator HP Mode, PIC12LF1612/16F1613 Only. FIGURE 29-7: IDD Typical, EC Oscillator MP Mode, PIC12F1612/16F1613 Only. 2.5 450 32 MHz 400 Typical: 25°C Max: 85°C + 3ı 2.0 350 4 MHz 1.5 IDD (mA) IDD (µA) 300 250 200 1 MHz 16 MHz 1.0 8 MHz 150 100 0.5 50 0.0 0 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 2.0 6.0 2.5 3.0 3.5 FIGURE 29-8: IDD Maximum, EC Oscillator MP Mode, PIC12F1612/16F1613 Only. 4.5 5.0 5.5 6.0 FIGURE 29-11: IDD Typical, EC Oscillator HP Mode, PIC12F1612/16F1613 Only. 2.5 2.5 32 MHz Max: 85°C + 3ı 32 MHz Typical: 25°C 2.0 2.0 1.5 1.5 IDD (mA) IDD (mA) 4.0 VDD (V) VDD (V) 16 MHz 16 MHz 1.0 1.0 8 MHz 8 MHz 0.5 0.5 0.0 0.0 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6 VDD (V) FIGURE 29-9: IDD Typical, EC Oscillator HP Mode, PIC12LF1612/16F1613 Only. DS40001737B-page 347 3.8 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 VDD (V) FIGURE 29-12: IDD Maximum, EC Oscillator HP Mode, PIC12F1612/16F1613 Only. 2014-2015 Microchip Technology Inc. PIC12(L)F1612/16(L)F1613 Note: Unless otherwise noted, VIN = 5V, FOSC = 500 kHz, CIN = 0.1 µF, TA = 25°C. 7 260 Max. Max: 85°C + 3ı Typical: 25°C 6 Max. Max: 85°C + 3ı Typical: 25°C 240 Typical Typical 220 5 IDD (µA) IDD (µA) 200 4 180 3 160 2 140 1 120 100 0 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6 2.0 3.8 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 VDD (V) VDD (V) FIGURE 29-16: IDD, MFINTOSC Mode, Fosc = 500 kHz, PIC12F1612/16F1613 Only. FIGURE 29-13: IDD, LFINTOSC Mode, Fosc = 31 kHz, PIC12LF1612/16F1613 Only. 25 1.6 Max. 16 MHz 1.4 Typical: 25°C Typical 20 15 IDD (mA) IDD (µA) 1.2 10 1.0 8 MHz 0.8 4 MHz 0.6 2 MHz 0.4 5 1 MHz Max: 85°C + 3ı Typical: 25°C 0.2 0.0 0 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 1.6 6.0 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6 3.8 VDD (V) VDD (V) FIGURE 29-14: IDD, LFINTOSC Mode, Fosc = 31 kHz, PIC12F1612/16F1613 Only. FIGURE 29-17: IDD Typical, HFINTOSC Mode, PIC12LF1612/16F1613 Only. 180 1.8 1.6 170 Max: 85°C + 3ı Typical: 25°C 160 16 MHz Max: 85°C + 3ı 1.4 Max. 1.2 IDD (mA) IDD (µA) 150 140 8 MHz 1.0 0.8 4 MHz 130 2 MHz 0.6 Typical 120 0.4 110 1 MHz 0.2 0.0 100 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6 3.8 VDD (V) FIGURE 29-15: IDD, MFINTOSC Mode, Fosc = 500 kHz, PIC12LF1612/16F1613 Only. DS40001737B-page 348 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6 3.8 VDD (V) FIGURE 29-18: IDD Maximum, HFINTOSC Mode, PIC12LF1612/16F1613 Only. 2014-2015 Microchip Technology Inc. PIC12(L)F1612/16(L)F1613 Note: Unless otherwise noted, VIN = 5V, FOSC = 500 kHz, CIN = 0.1 µF, TA = 25°C. 1.6 1.2 16 MHz 1.4 Typical: 25°C Max. 1 1.2 0.8 IPD (µA) IDD (mA) 0.8 8 MHz 1.0 4 MHz Max: 85°C + 3ı Typical: 25°C 0.6 2 MHz 0.6 0.4 0.4 Typical 1 MHz 0.2 0.2 0.0 0 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 2.0 2.5 3.0 3.5 4.0 VDD (V) 5.0 5.5 6.0 FIGURE 29-22: IPD Base, LP Sleep Mode (VREGPM = 1), PIC12F1612/16F1613 Only. FIGURE 29-19: IDD Typical, HFINTOSC Mode, PIC12F1612/16F1613 Only. 1.6 3 16 MHz 1.4 4.5 VDD (V) Max: 85°C + 3ı Typical: 25°C Max: 85°C + 3ı 2.5 1.2 IPD (µA) IDD (mA) 4 MHz 0.8 Max. 2 8 MHz 1.0 2 MHz 0.6 1.5 1 1 MHz 0.4 Typical 0.5 0.2 0 0.0 1.6 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6 3.8 6.0 VDD (V) VDD (V) FIGURE 29-20: IDD Maximum, HFINTOSC Mode, PIC12F1612/16F1613 Only. FIGURE 29-23: IPD, Watchdog Timer (WDT), PIC12LF1612/16F1613 Only. 2.5 450 Max: 85°C + 3ı Typical: 25°C 400 Max. 2 Max. 350 IPD (µA) IPD (nA) 300 250 Max: 85°C + 3ı Typical: 25°C 200 1.5 1 Typical 150 100 0.5 Typical 50 0 0 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6 3.8 VDD (V) FIGURE 29-21: IPD Base, LP Sleep Mode, PIC12LF1612/16F1613 Only. DS40001737B-page 349 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 VDD (V) FIGURE 29-24: IPD, Watchdog Timer (WDT), PIC12F1612/16F1613 Only. 2014-2015 Microchip Technology Inc. PIC12(L)F1612/16(L)F1613 Note: Unless otherwise noted, VIN = 5V, FOSC = 500 kHz, CIN = 0.1 µF, TA = 25°C. 13 35 Max: 85°C + 3ı Typical: 25°C Max: 85°C + 3ı Typical: 25°C 12 30 Max. 11 Max. 10 IPD (nA) IPD (nA) 25 20 Typical 9 Typical 8 7 15 6 10 5 4 5 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6 2.8 3.8 3.0 3.2 3.4 3.6 3.8 4.0 4.2 4.4 4.6 4.8 5.0 5.2 5.4 5.6 VDD (V) VDD (V) FIGURE 29-25: IPD, Fixed Voltage Reference (FVR), PIC12LF1612/16F1613 Only. FIGURE 29-28: IPD, Brown-Out Reset (BOR), BORV = 1, PIC12F1612/16F1613 Only. 1.8 35 Max. Max. 1.6 30 1.4 25 1.2 IPD (nA) IPD (nA) Typical 20 15 Max: 85°C + 3ı Typical: 25°C 1 0.8 0.6 10 Typical 0.4 Max: 85°C + 3ı Typical: 25°C 5 0.2 0 0 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 2.9 6.0 3.0 3.1 3.2 3.3 VDD (V) 3.4 3.5 3.6 3.7 VDD (V) FIGURE 29-26: IPD, Fixed Voltage Reference (FVR), PIC12F1612/16F1613 Only. FIGURE 29-29: IPD, LP Brown-Out Reset (LPBOR = 0), PIC12LF1612/16F1613 Only. 1.8 11 Max: 85°C + 3ı Typical: 25°C 10 Max: 85°C + 3ı Typical: 25°C 1.6 Max. Max. 1.4 9 IPD (µA) IPD (nA) 1.2 Typical 8 7 1.0 0.8 0.6 6 Typical 0.4 5 0.2 0.0 4 2.9 3.0 3.1 3.2 3.3 3.4 3.5 3.6 3.7 VDD (V) FIGURE 29-27: IPD, Brown-Out Reset (BOR), BORV = 1, PIC12LF1612/16F1613 Only. DS40001737B-page 350 2.8 3.0 3.2 3.4 3.6 3.8 4.0 4.2 4.4 4.6 4.8 5.0 5.2 5.4 5.6 VDD (V) FIGURE 29-30: IPD, LP Brown-Out Reset (LPBOR = 0), PIC12F1612/16F1613 Only. 2014-2015 Microchip Technology Inc. PIC12(L)F1612/16(L)F1613 Note: Unless otherwise noted, VIN = 5V, FOSC = 500 kHz, CIN = 0.1 µF, TA = 25°C. 7 1.4 Max: 85°C + 3ı Typical: 25°C 6 Max. Max: 85°C + 3ı Typical: 25°C 1.2 Max. 5 IPD (µA) 1 IPD (µA) 4 3 0.8 0.6 Typical 2 0.4 1 0.2 Typical 0 0 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6 3.8 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 VDD (V) VDD (V) FIGURE 29-34: IPD, ADC Non-Converting, PIC12F1612/16F1613 Only. FIGURE 29-31: IPD, Timer1 Oscillator, FOSC = 32 kHz, PIC12LF1612/16F1613 Only. 12 Max: 85°C + 3ı Typical: 25°C 10 Max. IPD (µA) 8 6 Typical 4 2 0 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 VDD (V) FIGURE 29-32: IPD, Timer1 Oscillator, FOSC = 32 kHz, PIC12F1612/16F1613 Only. 500 Max: 85°C + 3ı Typical: 25°C 450 Max. 400 350 IPD (nA) 300 250 200 150 100 Typical 50 0 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6 3.8 VDD (V) FIGURE 29-33: IPD, ADC Non-Converting, PIC12LF1612/16F1613 Only. DS40001737B-page 351 2014-2015 Microchip Technology Inc. PIC12(L)F1612/16(L)F1613 Note: Unless otherwise noted, VIN = 5V, FOSC = 500 kHz, CIN = 0.1 µF, TA = 25°C. 800 5 Max: -40°C + 3ı Typical: 25°C 700 Graph represents 3ı Limits Max. 4 Typical 3 VOL (V) IPD (µA) 600 500 -40°C 2 Typical 400 125°C 1 300 200 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6 0 3.8 0 10 20 30 VDD (V) FIGURE 29-35: IPD, Comparator, NP Mode (CxSP = 1), PIC12LF1612/16F1613 Only. 40 IOL (mA) 50 60 70 80 FIGURE 29-38: VOL vs. IOL Over Temperature, VDD = 5.0V, PIC12F1612/16F1613 Only. 800 Max: -40°C + 3ı Typical: 25°C Max. 3.5 700 Graph represents 3ı Limits 3.0 2.5 Typical 500 VOH (V) IPD (µA) 600 400 2.0 1.5 125°C Typical 300 1.0 -40°C 0.5 200 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 0.0 VDD (V) -14 FIGURE 29-36: IPD, Comparator, NP Mode (CxSP = 1), PIC12F1612/16F1613 Only. -12 -10 -8 -6 -4 -2 0 IOH (mA) FIGURE 29-39: VOH vs. IOH Over Temperature, VDD = 3.0V. 6 Graph represents 3ı Limits 3.0 5 Graph represents 3ı Limits 2.5 2.0 -40°C 3 VOL (V) VOH (V) 4 125°C 2 -40°C Typical 1.5 Typical 125°C 1.0 1 0.5 0 -30 -25 -20 -15 -10 -5 0 0.0 IOH (mA) FIGURE 29-37: VOH vs. IOH Over Temperature, VDD = 5.0V, PIC12F1612/16F1613 Only. DS40001737B-page 352 0 5 10 15 20 25 30 IOL (mA) FIGURE 29-40: VOL vs. IOL Over Temperature, VDD = 3.0V. 2014-2015 Microchip Technology Inc. PIC12(L)F1612/16(L)F1613 Note: Unless otherwise noted, VIN = 5V, FOSC = 500 kHz, CIN = 0.1 µF, TA = 25°C. 2.0 40,000 Graph represents 3ı Limits 38,000 1.6 36,000 1.4 34,000 1.2 Frequency (Hz) VOH (V) 1.8 125°C 1.0 0.8 Typical -40°C 0.6 Max. Typical 32,000 30,000 Min. 28,000 26,000 0.4 24,000 0.2 22,000 Max: Typical + 3ı (-40°C to +125°C) Typical; statistical mean @ 25°C Min: Typical - 3ı (-40°C to +125°C) 20,000 0.0 -4.0 -3.5 -3.0 -2.5 -2.0 -1.5 -1.0 -0.5 2.0 0.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 VDD (V) IOH (mA) FIGURE 29-41: VOH vs. IOH Over Temperature, VDD = 1.8V, PIC12LF1612/16F1613 Only. FIGURE 29-44: LFINTOSC Frequency, PIC12F1612/16F1613 Only. 24 1.8 22 Graph represents 3ı Limits Max. 1.6 20 Time (ms) 1.4 Vol (V) 1.2 1.0 125°C 18 Typical 16 Typical Min. 0.8 14 -40°C 0.6 Max: Typical + 3ı (-40°C to +125°C) Typical; statistical mean @ 25°C Min: Typical - 3ı (-40°C to +125°C) 12 0.4 10 0.2 2.0 2.5 3.0 3.5 0.0 0 1 2 3 4 5 6 7 8 9 4.0 4.5 5.0 5.5 6.0 VDD (V) 10 FIGURE 29-45: WDT Time-Out Period, PIC12F1612/16F1613 Only. IOL (mA) FIGURE 29-42: VOL vs. IOL Over Temperature, VDD = 1.8V, PIC12LF1612/16F1613 Only. Title WDT TIME-OUT PERIOD 24 22 40,000 Max. 38,000 20 Max. Time (ms) 36,000 34,000 Frequency (Hz) Typical 32,000 18 Typical 16 Min. 30,000 14 Min. 28,000 Max: Typical + 3ı (-40°C to +125°C) Typical; statistical mean @ 25°C Min: Typical - 3ı (-40°C to +125°C) 12 26,000 24,000 10 Max: Typical + 3ı (-40°C to +125°C) Typical; statistical mean @ 25°C Min: Typical - 3ı (-40°C to +125°C) 22,000 1.6 20,000 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6 VDD (V) 3.8 1.8 2.0 2.2 2.4 2.6 VDD (V) 2.8 3.0 3.2 3.4 3.6 3.8 FIGURE 29-46: WDT Time-Out Period, PIC12LF1612/16F1613 Only. FIGURE 29-43: LFINTOSC Frequency, PIC12LF1612/16F1613 Only. DS40001737B-page 353 2014-2015 Microchip Technology Inc. PIC12(L)F1612/16(L)F1613 Note: Unless otherwise noted, VIN = 5V, FOSC = 500 kHz, CIN = 0.1 µF, TA = 25°C. 70.0 2.00 Max: Typical + 3ı Typical: statistical mean Min: Typical - 3ı 60.0 Max. Max. 1.95 50.0 Voltage (mV) Voltage (V) Typical 1.90 Min. 40.0 Typical 30.0 20.0 1.85 Min. Max: Typical + 3ı Typical: statistical mean Min: Typical - 3ı 10.0 0.0 1.80 -60 -40 -20 0 20 40 60 80 100 120 -60 140 -40 -20 0 Temperature (°C) ( C) 40 60 80 100 120 140 Temperature (°C) FIGURE 29-47: Brown-Out Reset Voltage, Low Trip Point (BORV = 1), PIC12LF1612/16F1613 Only. FIGURE 29-50: Brown-Out Reset Hysteresis, Low Trip Point (BORV = 1), PIC12F1612/16F1613 Only. 2.85 70 Max: Typical + 3ı Typical: statistical mean Min: Typical - 3ı 60 Max: Typical + 3ı Typical: statistical mean Min: Typical - 3ı 2.80 Max. Max. Voltage (V) 50 Voltage (mV) 20 40 30 Typical 2.75 Typical Min. 2.70 20 2.65 Min. 10 2.60 0 -60 -40 -20 0 20 40 60 80 100 120 -60 140 -40 -20 0 20 40 60 80 100 120 140 Temperature (°C) Temperature (°C) FIGURE 29-48: Brown-Out Reset Hysteresis, Low Trip Point (BORV = 1), PIC12LF1612/16F1613 Only. FIGURE 29-51: Brown-Out Reset Voltage, High Trip Point (BORV = 0). 80 2.60 Max: Typical + 3ı Typical: statistical mean Min: Typical - 3ı 70 Max. 60 2.55 Max. Voltage (mV) Typical Voltage (V) 2.50 Min. 2.45 50 Typical 40 30 20 2.40 Min. Max: Typical + 3ı Typical: statistical mean Min: Typical - 3ı 2.35 10 0 -60 -40 -20 0 20 40 60 80 100 120 140 2.30 -60 -40 -20 0 20 40 60 80 100 120 140 Temperature (°C) FIGURE 29-49: Brown-Out Reset Voltage, Low Trip Point (BORV = 1), PIC12F1612/16F1613 Only. DS40001737B-page 354 Temperature (°C) ( C) FIGURE 29-52: Brown-Out Reset Hysteresis, High Trip Point (BORV = 0). 2014-2015 Microchip Technology Inc. PIC12(L)F1612/16(L)F1613 Note: Unless otherwise noted, VIN = 5V, FOSC = 500 kHz, CIN = 0.1 µF, TA = 25°C. 100 2.7 Max: Typical + 3ı Typical: statistical mean Min: Typical - 3ı 2.6 2.5 Max: Typical + 3ı (-40°C to +125°C) Typical; statistical mean @ 25°C Min: Typical - 3ı (-40°C to +125°C) 90 Max. Max. 80 Time (ms) Voltage (V) 2.4 2.3 2.2 Typical Typical 70 2.1 60 Min. 2.0 1.9 Min. 50 1.8 40 1.7 -60 -40 -20 0 20 40 60 80 100 120 1.6 140 1.8 2 2.2 2.4 Temperature (°C) FIGURE 29-53: LPBOR Reset Voltage. 3 3.2 3.4 3.6 3.8 1.70 1.68 Max: Typical + 3ı Typical: statistical mean 45 Max. 40 1.66 35 1.64 Max. Typical Voltage (V) Voltage (mV) 2.8 FIGURE 29-56: PWRT Period, PIC12LF1612/16F1613 Only. 50 30 25 20 Typical 1.62 1.60 Min. 1.58 15 1.56 10 1.54 5 1.52 Max: Typical + 3ı Typical: statistical mean Min: Typical - 3ı 1.50 0 -60 -40 -20 0 20 40 60 80 100 120 -50 140 -25 0 25 FIGURE 29-54: 50 75 100 125 150 Temperature (°C) Temperature (°C) LPBOR Reset Hysteresis. FIGURE 29-57: POR Release Voltage. 1.58 1.58 100 Max: Typical + 3ı (-40°C to +125°C) Typical; statistical mean @ 25°C Min: Typical - 3ı (-40°C to +125°C) 90 Max: Typical + 3ı Typical: 25°C Min: Typical - 3ı 1.56 1.56 Max. Voltage Voltage (V) (V) Max. 80 Time (ms) 2.6 VDD (V) Typical 70 Min. 1.54 1.54 Typical 1.52 1.52 1.5 1.50 Min. 1.48 1.48 60 1.46 Max: Typical + 3ı 0 1.46 -40 Typical:-20 statistical mean 50 20 40 40 60 80 100 120 75 100 125 150 Temperature (°C) Min: Typical - 3ı 1.44 2 2.5 3 3.5 4 4.5 VDD (V) FIGURE 29-55: PWRT Period, PIC12F1612/16F1613 Only. DS40001737B-page 355 5 5.5 6 -50 -25 0 25 50 Temperature (°C) FIGURE 29-58: POR Rearm Voltage, NP Mode (VREGPM1 = 0), PIC12F1612/16F1613 Only. 2014-2015 Microchip Technology Inc. PIC12(L)F1612/16(L)F1613 Note: Unless otherwise noted, VIN = 5V, FOSC = 500 kHz, CIN = 0.1 µF, TA = 25°C. 1.4 40 Max: Typical + 3ı Typical: statistical mean @ 25°C 1.3 35 Max. 1.2 Time (µs) Voltage (V) Max. 30 1.1 Typical 1.0 Typical 25 0.9 Min. 20 0.8 Max: Typical + 3ı Typical: statistical mean Min: Typical - 3ı 0.7 Note: The FVR Stabiliztion Period applies when coming out of RESET or exiting sleep mode. 15 0.6 10 -50 -25 0 25 50 75 100 125 150 1.6 1.8 2.0 2.2 2.4 Temperature (°C) 2.6 2.8 3.0 3.2 3.4 3.6 3.8 VDD (mV) FIGURE 29-62: FVR Stabilization Period, PIC12LF1612/16F1613 Only. FIGURE 29-59: POR Rearm Voltage, NP Mode, PIC12LF1612/16F1613 Only. 12 Max: Typical + 3ı (-40°C to +125°C) Typical; statistical mean @ 25°C Min: Typical - 3ı (-40°C to +125°C) 10 1.0 0.5 Max. DNL (LSb) Time (µs) 8 6 Typical 4 2 0.0 -0.5 0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 -1.0 VDD (V) FIGURE 29-60: VREGPM = 0. 0 128 256 384 Wake From Sleep, 512 640 768 896 1024 Output Code FIGURE 29-63: ADC 10-bit Mode, Single-Ended DNL, VDD = 3.0V, TAD = 1 S, 25°C. 50 45 1.0 40 Max. 0.5 30 Typical DNL (LSb) Time (µs) 35 25 20 0.0 15 10 Max: Typical + 3ı (-40°C to +125°C) Typical; statistical mean @ 25°C Min: Typical - 3ı (-40°C to +125°C) 5 -0.5 0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 VDD (V) FIGURE 29-61: VREGPM = 1. Wake From Sleep, DS40001737B-page 356 5.5 6.0 -1.0 0 128 256 384 512 640 768 896 1024 Output Code FIGURE 29-64: ADC 10-bit Mode, Single-Ended DNL, VDD = 3.0V, TAD = 4 S, 25°C. 2014-2015 Microchip Technology Inc. PIC12(L)F1612/16(L)F1613 Note: Unless otherwise noted, VIN = 5V, FOSC = 500 kHz, CIN = 0.1 µF, TA = 25°C. 1.0 2 1.5 Max -40C 1 Max 125C Max 25C 0.5 INL (LSB) INL (LSb) 0.5 0.0 0 Min 25C -0.5 Min -40C -1 Min 125C -0.5 -1.5 -1.0 0 128 256 384 512 640 768 896 -2 1024 5.00E-07 1.00E-06 Output Code FIGURE 29-65: ADC 10-bit Mode, Single-Ended INL, VDD = 3.0V, TAD = 1 S, 25°C. 2.00E-06 TADs 4.00E-06 8.00E-06 FIGURE 29-68: ADC 10-bit Mode, Single-Ended INL, VDD = 3.0V, VREF = 3.0V. 2 2.0 1.0 1.5 Max 125C 1.5 0.5 0.5 1 0.0 0.5 Max -40C Max 25C DNL (LSB) INL DNL (LSb)(LSb) 1.0 -0.5 0.0 -1.0 0 Min -40C -0.5 -1.5 Min 25C -0.5 -2.0 0 512 1024 1536 2048 2560 3072 3584 -1 4096 Output Code -1.5 -1.0 0 128 256 384 512 Min 125C 640 768 896 -2 1024 1.8 Output Code FIGURE 29-66: ADC 10-bit Mode, Single-Ended INL, VDD = 3.0V, TAD = 4 S, 25°C. 3 FIGURE 29-69: ADC 10-bit Mode, Single-Ended DNL, VDD = 3.0V, TAD = 1 S. 2.5 2 2 1.5 Max -40C Max 125C 1 1.5 Min 125C 1 0.5 Min 25C 0 Min 25C -0.5 Max 25C 0.5 Min -40C INL (LSB) DNL (LSB) 2.3 VREF 0 Min -40C -0.5 Min 25C -1 Min 125C -1 Min 125C -1.5 Min -40C -1.5 -2 -2 -2.5 DC 10-BIT MODE, SINGLE-ENDED INL, Vdd = 3.0V, VREF = 3.0V, -2.5 5.00E-07 1.00E-06 2.00E-06 TADs 4.00E-06 8.00E-06 FIGURE 29-67: ADC 10-bit Mode, Single-Ended DNL, VDD = 3.0V, VREF = 3.0V. DS40001737B-page 357 -3 1.8 2.3 VREF 3 FIGURE 29-70: ADC 10-bit Mode, Single-Ended INL, VDD = 3.0V, TAD = 1 S. 2014-2015 Microchip Technology Inc. PIC12(L)F1612/16(L)F1613 Note: Unless otherwise noted, VIN = 5V, FOSC = 500 kHz, CIN = 0.1 µF, TA = 25°C. 150 800 ADC VREF+ SET TO VDD ADC VREF- SET TO GND 700 Max. Typical ADC VREF+ SET TO VDD ADC VREF- SET TO GND 125 Max. 100 600 Min. 75 500 ADC Output Codes ADC Output Codes Typical Min. 400 300 200 25 0 -25 Max: Typical + 3ı Typical; statistical mean Min: Typical - 3ı 100 50 Max: Typical + 3ı Typical; statistical mean Min: Typical - 3ı -50 0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 -75 6.0 -50 -25 0 25 50 75 100 125 150 Temperature (°C) ( C) VDD (V) FIGURE 29-71: Temp. Indicator Initial Offset, High Range, Temp. = 20°C, PIC12F1612/16F1613 Only. FIGURE 29-74: Temp. Indicator Slope Normalized to 20°C, High Range, VDD = 5.5V, PIC12F1612/16F1613 Only. 900 250 ADC VREF+ SET TO VDD ADC VREF- SET TO GND Max. 800 ADC VREF+ SET TO VDD ADC VREF- SET TO GND 200 Typical Min. Max. Typical 150 Min. ADC Output Codes ADC Output Codes 700 600 500 Max: Typical + 3ı Typical; statistical mean Min: Typical - 3ı 400 2.5 3.0 3.5 4.0 4.5 5.0 5.5 50 0 -50 Max: Typical + 3ı Typical; statistical mean Min: Typical - 3ı -100 300 2.0 100 -150 6.0 -50 -25 0 25 VDD (V) 50 75 100 125 150 Temperature (°C) ( C) FIGURE 29-72: Temp. Indicator Initial Offset, Low Range, Temp. = 20°C, PIC12F1612/16F1613 Only. FIGURE 29-75: Temp. Indicator Slope Normalized to 20°C, High Range, VDD = 3.0V, PIC12F1612/16F1613 Only. 800 150 ADC VREF+ SET TO VDD ADC VREF- SET TO GND Max. ADC VREF+ SET TO VDD ADC VREF- SET TO GND 125 Max. 700 Typical Typical 600 100 Min. Min. ADC Output Codes ADC Output Codes 75 500 400 300 50 25 0 -25 Max: Typical + 3ı Typical; statistical mean Min: Typical - 3ı 200 1.5 1.8 2.1 2.4 2.7 3.0 3.3 3.6 3.9 VDD (V) FIGURE 29-73: Temp. Indicator Initial Offset, Low Range, Temp. = 20°C, PIC12LF1612/16F1613 Only. DS40001737B-page 358 Max: Typical + 3ı Typical; statistical mean Min: Typical - 3ı -50 100 -75 -50 -25 0 25 50 75 100 125 150 Temperature (°C) ( C) FIGURE 29-76: Temp. Indicator Slope Normalized to 20°C, Low Range, VDD = 3.0V, PIC12F1612/16F1613 Only. 2014-2015 Microchip Technology Inc. PIC12(L)F1612/16(L)F1613 Note: Unless otherwise noted, VIN = 5V, FOSC = 500 kHz, CIN = 0.1 µF, TA = 25°C. 250 43 Typical -40°C 41 150 Min. Hysteresis (mV) ADC Output Codes 45 Max. ADC VREF+ SET TO VDD ADC VREF- SET TO GND 200 100 50 0 39 25°C 37 85°C 35 125°C 33 31 -50 29 Max: Typical + 3ı Typical; statistical mean Min: Typical - 3ı -100 27 25 -150 -50 -25 0 25 50 75 100 125 0.0 150 0.5 1.0 1.5 2.0 2.5 3.0 3.5 Common Mode Voltage (V) Temperature (°C) ( C) FIGURE 29-77: Temp. Indicator Slope Normalized to 20°C, Low Range, VDD = 1.8V, PIC12LF1612/16F1613 Only. FIGURE 29-80: Comparator Hysteresis, NP Mode (CxSP = 1), VDD = 3.0V, Typical Measured Values. 150 ADC VREF+ SET TO VDD ADC VREF- SET TO GND 30 Max. 100 Typical 25 Min. 20 15 Offset Voltage (mV) ADC Output Codes Max. 50 0 -50 0 25 50 75 100 0 Min. -5 -15 -100 -25 5 -10 Max: Typical + 3ı Typical; statistical mean Min: Typical - 3ı -50 10 125 150 -20 0.0 0.5 1.0 Temperature (°C) ( C) 1.5 2.0 2.5 3.0 3.5 Common Mode Voltage (V) FIGURE 29-78: Temp. Indicator Slope Normalized to 20°C, Low Range, VDD = 3.0V, PIC12LF1612/16F1613 Only. FIGURE 29-81: Comparator Offset, NP Mode (CxSP = 1), VDD = 3.0V, Typical Measured Values at 25°C. 250 ADC VREF+ SET TO VDD ADC VREF- SET TO GND 200 30 Max. 25 Typical Max. 20 Min. Offset Voltage (mV) ADC Output Codes 150 100 50 0 -50 -25 0 25 50 75 100 125 Temperature (°C) FIGURE 29-79: Temp. Indicator Slope Normalized to 20°C, High Range, VDD = 3.6V, PIC12LF1612/16F1613 Only. DS40001737B-page 359 5 0 Min. -5 -15 -150 -50 10 -10 Max: Typical + 3ı Typical; statistical mean Min: Typical - 3ı -100 15 150 -20 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 Common Mode Voltage (V) FIGURE 29-82: Comparator Offset, NP Mode (CxSP = 1), VDD = 3.0V, Typical Measured Values From -40°C to 125°C. 2014-2015 Microchip Technology Inc. PIC12(L)F1612/16(L)F1613 Note: Unless otherwise noted, VIN = 5V, FOSC = 500 kHz, CIN = 0.1 µF, TA = 25°C. 140 50 Max: Typical + 3ı (-40°C to +125°C) Typical; statistical mean @ 25°C Min: Typical - 3ı (-40°C to +125°C) 120 45 -40°C 25°C 85°C 35 125°C Time (ns) Hysteresis (mV) 100 40 80 60 Max. 30 Typical 40 Min. 25 20 20 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 0 6.0 1.5 2.0 2.5 Common Mode Voltage (V) FIGURE 29-83: Comparator Hysteresis, NP Mode (CxSP = 1), VDD = 5.5V, Typical Measured Values, PIC12F1612/16F1613 Only. 3.5 4.0 FIGURE 29-86: Comparator Response Time Over Voltage, NP Mode (CxSP = 1), Typical Measured Values, PIC12LF1612/16F1613 Only. 90 30 Max: Typical + 3ı (-40°C to +125°C) Typical; statistical mean @ 25°C Min: Typical - 3ı (-40°C to +125°C) 80 25 70 Max. 20 15 60 Time (ns) Hysteresis (mV) 3.0 VDD (V) 10 5 0 50 Max. 40 Typical Min. 30 Min. -5 20 -10 10 -15 -20 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 2.0 2.5 3.0 3.5 Common Mode Voltage (V) 4.0 4.5 5.0 5.5 6.0 VDD (V) FIGURE 29-84: Comparator Offset, NP Mode (CxSP = 1), VDD = 5.0V, Typical Measured Values at 25°C, PIC12F1612/16F1613 Only. FIGURE 29-87: Comparator Response Time Over Voltage, NP Mode (CxSP = 1), Typical Measured Values, PIC12F1612/16F1613 Only. 1,400 40 Max: Typical + 3ı (-40°C to +125°C) Typical; statistical mean @ 25°C Min: Typical - 3ı (-40°C to +125°C) 1,200 30 Max. Time (ns) Offset Voltage (mV) 1,000 20 10 800 600 0 400 Min. Max. -10 Typical 200 Min. -20 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 Common Mode Voltage (V) FIGURE 29-85: Comparator Offset, NP Mode (CxSP = 1), VDD = 5.5V, Typical Measured Values From -40°C to 125°C, PIC12F1612/16F1613 Only. DS40001737B-page 360 1.5 2.0 2.5 3.0 3.5 4.0 VDD (V) FIGURE 29-88: Comparator Output Filter Delay Time Over Temp., NP Mode (CxSP = 1), Typical Measured Values, PIC12LF1612/16F1613 Only. 2014-2015 Microchip Technology Inc. PIC12(L)F1612/16(L)F1613 Note: Unless otherwise noted, VIN = 5V, FOSC = 500 kHz, CIN = 0.1 µF, TA = 25°C. 0.020 800 Max: Typical + 3ı (-40°C to +125°C) Typical; statistical mean @ 25°C Min: Typical - 3ı (-40°C to +125°C) 700 0.015 0.010 500 DNL (LSb) Time (ns) 600 400 0.005 -40°C 25°C 0.000 85°C 300 125°C -0.005 Max. 200 Typical 100 -0.010 Min. 0 2.0 2.5 3.0 3.5 4.0 9'' 4.5 5.0 5.5 -0.015 6.0 FIGURE 29-89: Comparator Output Filter Delay Time Over Temp., NP Mode (CxSP = 1), Typical Measured Values, PIC12F1612/16F1613 Only. 0 14 28 42 56 70 84 98 112126140154168182196210224238252 Output Code FIGURE 29-92: Typical DAC INL Error, VDD = 5.0V, VREF = External 5V, PIC12F1612/16F1613 Only. 0.00 -0.05 0.02 -0.10 0.015 -0.15 INL (LSb) 0.025 DNL (LSb) 0.01 0.005 -40°C -40°C 25°C -0.25 85°C 25°C 0 -0.20 125°C -0.30 85°C 125°C -0.005 -0.35 -0.01 -0.40 -0.015 -0.45 0 14 28 42 56 70 84 98 112126140154168182196210224238252 Output Code -0.02 0 16 32 48 64 80 96 112 128 144 160 176 192 208 224 240 Output Code FIGURE 29-93: Typical DAC INL Error, VDD = 5.0V, VREF = External 5V, PIC12F1612/16F1613 Only. FIGURE 29-90: Typical DAC DNL Error, VDD = 3.0V, VREF = External 3V. , -0.05 24 -0.10 22 -0.15 20 -0.20 -40°C 25°C -0.25 85°C 125°C -0.30 DNL (LSb) INL (LSb) 0.00 Max. 18 Typical 16 14 Max: Typical + 3ı (-40°C to +125°C) Typical; statistical mean @ 25°C Min: Typical - 3ı (-40°C to +125°C) Min. -0.35 12 -0.40 10 1.6 1.8 2 2.2 2.4 2.6 2.8 3 3.2 3.4 3.6 3.8 VREF (V) -0.45 0 14 28 42 56 70 84 98 112126140154168182196210224238252 Output Code FIGURE 29-91: Typical DAC INL Error, VDD = 3.0V, VREF = External 3V. DS40001737B-page 361 FIGURE 29-94: DAC INL Error, VDD = 3.0V. 2014-2015 Microchip Technology Inc. PIC12(L)F1612/16(L)F1613 Note: Unless otherwise noted, VIN = 5V, FOSC = 500 kHz, CIN = 0.1 µF, TA = 25°C. 0.45 0.4 0.9 -2.1 0.35 Vref = Int. Vdd 0.3 0.3 Vref = Ext. 1.8V 0.25 Vref = Ext. 2.0V Vref = Int. Vdd 0.2 Vref = Ext. 3.0V Vref = Ext. 1.8V Vref = Ext. 2.0V 0.15 0.2 Vref = Ext. 3.0V 0.1 0.05 0.10 Absolute Absolute INL (LSb) INL (LSb) Absolute Absolute DNL (LSb) DNL (LSb) 0.4 -2.3 0.88 Vref = Int. Vdd -2.5 Vref = Ext. 1.8V Vref = Ext. 2.0V 0.86 -2.7 -40 Vref = Ext. 3.0V 25 Vref = Ext. 5.0V -2.9 85 0.84 -3.1 125 -3.3 0.82 -3.5 -50 0 50 0 100 150 0.0 0.8 0.0 -60 -40 -20 0 20 40 60 Temperature (°C) 80 100 120 0.78 -60.0 140 FIGURE 29-95: Absolute Value of DAC DNL Error, VDD = 3.0V, VREF = VDD. 1.0 -40.0 2.0 -20.0 3.0 0 0.0 4.0 5.0 20.0 40.0 60.0 Temperature (°C) 80.0 6.0 100.0 120.0 140.0 FIGURE 29-98: Absolute Value of DAC INL Error, VDD = 5.0V, VREF = VDD, PIC12F1612/16F1613 Only. 0.85 -2.3 0.88 Vref = Int. Vdd -2.5 Vref = Ext. 1.8V 0.86 -2.7 Vref = Ext. 2.0V -40 Vref = Ext. 3.0V 25 -2.9 0.84 -3.1 85 125 -3.3 0.82 -3.5 0.0 0.80 1.0 2.0 3.0 4.0 0.80 ZCD Pin Voltage (V) Absolute Absolute INL (LSb) INL (LSb) 0.90 -2.1 -40°C 0.75 25°C 0.70 5.0 85°C 0 0.65 125° 0.78 -60.0 -40.0 -20.0 0.0 20.0 40.0 60.0 Temperature (°C) 80.0 100.0 120.0 0.60 140.0 2.3 FIGURE 29-96: Absolute Value of DAC INL Error, VDD = 3.0V, VREF = VDD. 2.8 3.3 3.8 VDD (V) 4.3 4.8 5.3 FIGURE 29-99: ZCD Pin Voltage, Typical Measured Values. 0.30 0.3 1.4 Vref = Int. Vdd 0.26 0.2 Fall-2.3V Vref = Ext. 1.8V 0.15 0.22 0.1 1.2 Fall-3.0V Vref = Ext. 2.0V -40 Vref = Ext. 3.0V 25 Vref = Ext. 5.0V 85 125 0.18 0.05 Fall-5.5V 1.0 Time (us) Absolute Absolute DNL (LSb) DNL (LSb) 0.25 0.8 0.6 0 0.14 0.0 1.0 2.0 3.0 0 4.0 5.0 6.0 0.4 Rise-2.3V Rise-3.0V 0.2 0.10 -60.0 -40.0 -20.0 0.0 20.0 40.0 60.0 Temperature (°C) 80.0 100.0 120.0 140.0 FIGURE 29-97: Absolute Value of DAC DNL Error, VDD = 5.0V, VREF = VDD, PIC12F1612/16F1613 Only. DS40001737B-page 362 Rise-5.5V 0.0 -40 -20 0 20 40 60 80 100 120 140 Temperature (°C) FIGURE 29-100: ZCD Response time Over Voltage, Typical Measured Values. 2014-2015 Microchip Technology Inc. PIC12(L)F1612/16(L)F1613 Note: Unless otherwise noted, VIN = 5V, FOSC = 500 kHz, CIN = 0.1 µF, TA = 25°C. ZCD Source/Sink Current (mA) 8.00 5.5V 6.00 3.0V 4.00 2.3V 2.00 1.8V 0.00 0.00 0.50 1.00 1.50 2.00 -2.00 -4.00 ZCD Pin Voltage (V) FIGURE 29-101: ZCD Pin Current Over ZCD Pin Voltage, Typical Measured Values from -40°C to 125°C. 1.00 0.90 0.80 Time (us) 0.70 0.60 0.50 0.40 1.8V 0.30 2.3V 0.20 0.10 30.00 3.0V 5.5V 80.00 130.00 180.00 230.00 280.00 330.00 380.00 430.00 ZCD Source/Sink Current (uA) FIGURE 29-102: ZCD Pin Response Time Over Current, Typical Measured Values from -40°C to 125°C. DS40001737B-page 363 2014-2015 Microchip Technology Inc. PIC12(L)F1612/16(L)F1613 30.0 DEVELOPMENT SUPPORT The PIC® microcontrollers (MCU) and dsPIC® digital signal controllers (DSC) are supported with a full range of software and hardware development tools: • Integrated Development Environment - MPLAB® X IDE Software • Compilers/Assemblers/Linkers - MPLAB XC Compiler - MPASMTM Assembler - MPLINKTM Object Linker/ MPLIBTM Object Librarian - MPLAB Assembler/Linker/Librarian for Various Device Families • Simulators - MPLAB X SIM Software Simulator • Emulators - MPLAB REAL ICE™ In-Circuit Emulator • In-Circuit Debuggers/Programmers - MPLAB ICD 3 - PICkit™ 3 • Device Programmers - MPLAB PM3 Device Programmer • Low-Cost Demonstration/Development Boards, Evaluation Kits and Starter Kits • Third-party development tools 30.1 MPLAB X Integrated Development Environment Software The MPLAB X IDE is a single, unified graphical user interface for Microchip and third-party software, and hardware development tool that runs on Windows®, Linux and Mac OS® X. Based on the NetBeans IDE, MPLAB X IDE is an entirely new IDE with a host of free software components and plug-ins for highperformance application development and debugging. Moving between tools and upgrading from software simulators to hardware debugging and programming tools is simple with the seamless user interface. With complete project management, visual call graphs, a configurable watch window and a feature-rich editor that includes code completion and context menus, MPLAB X IDE is flexible and friendly enough for new users. With the ability to support multiple tools on multiple projects with simultaneous debugging, MPLAB X IDE is also suitable for the needs of experienced users. Feature-Rich Editor: • Color syntax highlighting • Smart code completion makes suggestions and provides hints as you type • Automatic code formatting based on user-defined rules • Live parsing User-Friendly, Customizable Interface: • Fully customizable interface: toolbars, toolbar buttons, windows, window placement, etc. • Call graph window Project-Based Workspaces: • • • • Multiple projects Multiple tools Multiple configurations Simultaneous debugging sessions File History and Bug Tracking: • Local file history feature • Built-in support for Bugzilla issue tracker 2014-2016 Microchip Technology Inc. DS40001737B-page 364 PIC12(L)F1612/16(L)F1613 30.2 MPLAB XC Compilers The MPLAB XC Compilers are complete ANSI C compilers for all of Microchip’s 8, 16, and 32-bit MCU and DSC devices. These compilers provide powerful integration capabilities, superior code optimization and ease of use. MPLAB XC Compilers run on Windows, Linux or MAC OS X. For easy source level debugging, the compilers provide debug information that is optimized to the MPLAB X IDE. The free MPLAB XC Compiler editions support all devices and commands, with no time or memory restrictions, and offer sufficient code optimization for most applications. MPLAB XC Compilers include an assembler, linker and utilities. The assembler generates relocatable object files that can then be archived or linked with other relocatable object files and archives to create an executable file. MPLAB XC Compiler uses the assembler to produce its object file. Notable features of the assembler include: • • • • • • Support for the entire device instruction set Support for fixed-point and floating-point data Command-line interface Rich directive set Flexible macro language MPLAB X IDE compatibility 30.3 MPASM Assembler The MPASM Assembler is a full-featured, universal macro assembler for PIC10/12/16/18 MCUs. The MPASM Assembler generates relocatable object files for the MPLINK Object Linker, Intel® standard HEX files, MAP files to detail memory usage and symbol reference, absolute LST files that contain source lines and generated machine code, and COFF files for debugging. The MPASM Assembler features include: 30.4 MPLINK Object Linker/ MPLIB Object Librarian The MPLINK Object Linker combines relocatable objects created by the MPASM Assembler. It can link relocatable objects from precompiled libraries, using directives from a linker script. The MPLIB Object Librarian manages the creation and modification of library files of precompiled code. When a routine from a library is called from a source file, only the modules that contain that routine will be linked in with the application. This allows large libraries to be used efficiently in many different applications. The object linker/library features include: • Efficient linking of single libraries instead of many smaller files • Enhanced code maintainability by grouping related modules together • Flexible creation of libraries with easy module listing, replacement, deletion and extraction 30.5 MPLAB Assembler, Linker and Librarian for Various Device Families MPLAB Assembler produces relocatable machine code from symbolic assembly language for PIC24, PIC32 and dsPIC DSC devices. MPLAB XC Compiler uses the assembler to produce its object file. The assembler generates relocatable object files that can then be archived or linked with other relocatable object files and archives to create an executable file. Notable features of the assembler include: • • • • • • Support for the entire device instruction set Support for fixed-point and floating-point data Command-line interface Rich directive set Flexible macro language MPLAB X IDE compatibility • Integration into MPLAB X IDE projects • User-defined macros to streamline assembly code • Conditional assembly for multipurpose source files • Directives that allow complete control over the assembly process 2014-2016 Microchip Technology Inc. DS40001737B-page 365 PIC12(L)F1612/16(L)F1613 30.6 MPLAB X SIM Software Simulator The MPLAB X SIM Software Simulator allows code development in a PC-hosted environment by simulating the PIC MCUs and dsPIC DSCs on an instruction level. On any given instruction, the data areas can be examined or modified and stimuli can be applied from a comprehensive stimulus controller. Registers can be logged to files for further run-time analysis. The trace buffer and logic analyzer display extend the power of the simulator to record and track program execution, actions on I/O, most peripherals and internal registers. The MPLAB X SIM Software Simulator fully supports symbolic debugging using the MPLAB XC Compilers, and the MPASM and MPLAB Assemblers. The software simulator offers the flexibility to develop and debug code outside of the hardware laboratory environment, making it an excellent, economical software development tool. 30.7 MPLAB REAL ICE In-Circuit Emulator System The MPLAB REAL ICE In-Circuit Emulator System is Microchip’s next generation high-speed emulator for Microchip Flash DSC and MCU devices. It debugs and programs all 8, 16 and 32-bit MCU, and DSC devices with the easy-to-use, powerful graphical user interface of the MPLAB X IDE. The emulator is connected to the design engineer’s PC using a high-speed USB 2.0 interface and is connected to the target with either a connector compatible with in-circuit debugger systems (RJ-11) or with the new high-speed, noise tolerant, LowVoltage Differential Signal (LVDS) interconnection (CAT5). The emulator is field upgradeable through future firmware downloads in MPLAB X IDE. MPLAB REAL ICE offers significant advantages over competitive emulators including full-speed emulation, run-time variable watches, trace analysis, complex breakpoints, logic probes, a ruggedized probe interface and long (up to three meters) interconnection cables. 2014-2016 Microchip Technology Inc. 30.8 MPLAB ICD 3 In-Circuit Debugger System The MPLAB ICD 3 In-Circuit Debugger System is Microchip’s most cost-effective, high-speed hardware debugger/programmer for Microchip Flash DSC and MCU devices. It debugs and programs PIC Flash microcontrollers and dsPIC DSCs with the powerful, yet easy-to-use graphical user interface of the MPLAB IDE. The MPLAB ICD 3 In-Circuit Debugger probe is connected to the design engineer’s PC using a highspeed USB 2.0 interface and is connected to the target with a connector compatible with the MPLAB ICD 2 or MPLAB REAL ICE systems (RJ-11). MPLAB ICD 3 supports all MPLAB ICD 2 headers. 30.9 PICkit 3 In-Circuit Debugger/ Programmer The MPLAB PICkit 3 allows debugging and programming of PIC and dsPIC Flash microcontrollers at a most affordable price point using the powerful graphical user interface of the MPLAB IDE. The MPLAB PICkit 3 is connected to the design engineer’s PC using a fullspeed USB interface and can be connected to the target via a Microchip debug (RJ-11) connector (compatible with MPLAB ICD 3 and MPLAB REAL ICE). The connector uses two device I/O pins and the Reset line to implement in-circuit debugging and In-Circuit Serial Programming™ (ICSP™). 30.10 MPLAB PM3 Device Programmer The MPLAB PM3 Device Programmer is a universal, CE compliant device programmer with programmable voltage verification at VDDMIN and VDDMAX for maximum reliability. It features a large LCD display (128 x 64) for menus and error messages, and a modular, detachable socket assembly to support various package types. The ICSP cable assembly is included as a standard item. In Stand-Alone mode, the MPLAB PM3 Device Programmer can read, verify and program PIC devices without a PC connection. It can also set code protection in this mode. The MPLAB PM3 connects to the host PC via an RS-232 or USB cable. The MPLAB PM3 has high-speed communications and optimized algorithms for quick programming of large memory devices, and incorporates an MMC card for file storage and data applications. DS40001737B-page 366 PIC12(L)F1612/16(L)F1613 30.11 Demonstration/Development Boards, Evaluation Kits, and Starter Kits A wide variety of demonstration, development and evaluation boards for various PIC MCUs and dsPIC DSCs allows quick application development on fully functional systems. Most boards include prototyping areas for adding custom circuitry and provide application firmware and source code for examination and modification. The boards support a variety of features, including LEDs, temperature sensors, switches, speakers, RS-232 interfaces, LCD displays, potentiometers and additional EEPROM memory. 30.12 Third-Party Development Tools Microchip also offers a great collection of tools from third-party vendors. These tools are carefully selected to offer good value and unique functionality. • Device Programmers and Gang Programmers from companies, such as SoftLog and CCS • Software Tools from companies, such as Gimpel and Trace Systems • Protocol Analyzers from companies, such as Saleae and Total Phase • Demonstration Boards from companies, such as MikroElektronika, Digilent® and Olimex • Embedded Ethernet Solutions from companies, such as EZ Web Lynx, WIZnet and IPLogika® The demonstration and development boards can be used in teaching environments, for prototyping custom circuits and for learning about various microcontroller applications. In addition to the PICDEM™ and dsPICDEM™ demonstration/development board series of circuits, Microchip has a line of evaluation kits and demonstration software for analog filter design, KEELOQ® security ICs, CAN, IrDA®, PowerSmart battery management, SEEVAL® evaluation system, Sigma-Delta ADC, flow rate sensing, plus many more. Also available are starter kits that contain everything needed to experience the specified device. This usually includes a single application and debug capability, all on one board. Check the Microchip web page (www.microchip.com) for the complete list of demonstration, development and evaluation kits. 2014-2016 Microchip Technology Inc. DS40001737B-page 367 PIC12(L)F1612/16(L)F1613 31.0 PACKAGING INFORMATION 31.1 Package Marking Information 8-Lead PDIP (300 mil) XXXXXXXX XXXXXNNN YYWW 8-Lead SOIC (3.90 mm) e3 * Note: * 12F1612 I/P e3 017 1410 Example 12F1612 I/SN1410 017 NNN Legend: XX...X Y YY WW NNN Example Customer-specific information Year code (last digit of calendar year) Year code (last 2 digits of calendar year) Week code (week of January 1 is week ‘01’) Alphanumeric traceability code Pb-free JEDEC® designator for Matte Tin (Sn) This package is Pb-free. The Pb-free JEDEC designator ( e3 ) can be found on the outer packaging for this package. In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. Standard PICmicro® device marking consists of Microchip part number, year code, week code and traceability code. For PICmicro device marking beyond this, certain price adders apply. Please check with your Microchip Sales Office. For QTP devices, any special marking adders are included in QTP price. 2014-2016 Microchip Technology Inc. DS40001737B-page 368 PIC12(L)F1612/16(L)F1613 31.1 Package Marking Information (Continued) 8-Lead DFN (3x3x0.9 mm) 8-Lead UDFN (3x3x0.5 mm) Example MGW0 1410 017 XXXX YYWW NNN PIN 1 14-Lead PDIP PIN 1 Example PIC16F1613 -I/P e3 1410017 XXXXXXXXXXXXXX XXXXXXXXXXXXXX YYWWNNN 14-Lead SOIC (.150”) Example XXXXXXXXXXX XXXXXXXXXXX YYWWNNN 14-Lead TSSOP PIC16F1613 -I/SL e3 1410017 Example XXXXXXXX YYWW NNN F1613IST 1410 017 16-Lead QFN (4x4x0.9 mm) PIN 1 2014-2016 Microchip Technology Inc. Example PIN 1 PIC16 F1613 E/ML e3 410017 DS40001737B-page 369 PIC12(L)F1612/16(L)F1613 TABLE 31-1: 8-LEAD 3x3 DFN (MF) TOP MARKING Part Number Marking PIC12F1612-E/MF MGU0 PIC12LF1612-E/MF MGW0 PIC12F1612-I/MF MGV0 PIC12LF1612-I/MF MGX0 PIC12F1612T-I/MF MGV0 PIC12LF1612T-I/MF MGX0 2014-2016 Microchip Technology Inc. DS40001737B-page 370 PIC12(L)F1612/16(L)F1613 31.2 Package Details The following sections give the technical details of the packages. 8-Lead Plastic Dual In-Line (P) - 300 mil Body [PDIP] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging D A N B E1 NOTE 1 1 2 TOP VIEW E C A2 A PLANE L c A1 e eB 8X b1 8X b .010 C SIDE VIEW END VIEW Microchip Technology Drawing No. C04-018D Sheet 1 of 2 2014-2016 Microchip Technology Inc. DS40001737B-page 371 PIC12(L)F1612/16(L)F1613 8-Lead Plastic Dual In-Line (P) - 300 mil Body [PDIP] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging ALTERNATE LEAD DESIGN (VENDOR DEPENDENT) DATUM A DATUM A b b e 2 e 2 e Units Dimension Limits Number of Pins N e Pitch Top to Seating Plane A Molded Package Thickness A2 Base to Seating Plane A1 Shoulder to Shoulder Width E Molded Package Width E1 Overall Length D Tip to Seating Plane L c Lead Thickness Upper Lead Width b1 b Lower Lead Width Overall Row Spacing eB § e MIN .115 .015 .290 .240 .348 .115 .008 .040 .014 - INCHES NOM 8 .100 BSC .130 .310 .250 .365 .130 .010 .060 .018 - MAX .210 .195 .325 .280 .400 .150 .015 .070 .022 .430 Notes: 1. Pin 1 visual index feature may vary, but must be located within the hatched area. 2. § Significant Characteristic 3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side. 4. Dimensioning and tolerancing per ASME Y14.5M BSC: Basic Dimension. Theoretically exact value shown without tolerances. Microchip Technology Drawing No. C04-018D Sheet 2 of 2 2014-2016 Microchip Technology Inc. DS40001737B-page 372 PIC12(L)F1612/16(L)F1613 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 2014-2016 Microchip Technology Inc. DS40001737B-page 373 PIC12(L)F1612/16(L)F1613 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 2014-2016 Microchip Technology Inc. DS40001737B-page 374 PIC12(L)F1612/16(L)F1613 !"#$% & !"#!$ !%& '#(##! )%*!!&! !!+11'''" "1% 2014-2016 Microchip Technology Inc. DS40001737B-page 375 PIC12(L)F1612/16(L)F1613 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 2014-2016 Microchip Technology Inc. DS40001737B-page 376 PIC12(L)F1612/16(L)F1613 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 2014-2016 Microchip Technology Inc. DS40001737B-page 377 PIC12(L)F1612/16(L)F1613 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 2014-2016 Microchip Technology Inc. DS40001737B-page 378 PIC12(L)F1612/16(L)F1613 8-Lead Ultra Thin Plastic Dual Flat, No Lead Package (RF) - 3x3x0.50 mm Body [UDFN] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging D A B N (DATUM A) (DATUM B) E NOTE 1 2X 0.10 C 1 2X 2 TOP VIEW 0.10 C 0.05 C C SEATING PLANE A1 A 8X (A3) 0.05 C SIDE VIEW 0.10 C A B D2 1 2 L 0.10 C A B E2 NOTE 1 K N e 8X b 0.10 e 2 C A B BOTTOM VIEW Microchip Technology Drawing C04-254A Sheet 1 of 2 2014-2016 Microchip Technology Inc. DS40001737B-page 379 PIC12(L)F1612/16(L)F1613 8-Lead Ultra Thin Plastic Dual Flat, No Lead Package (RF) - 3x3x0.50 mm Body [UDFN] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Units Dimension Limits Number of Terminals N e Pitch A Overall Height Standoff A1 A3 Terminal Thickness Overall Width E E2 Exposed Pad Width D Overall Length D2 Exposed Pad Length b Terminal Width Terminal Length L K Terminal-to-Exposed-Pad MIN 0.45 0.00 1.40 2.20 0.25 0.35 0.20 MILLIMETERS NOM 8 0.65 BSC 0.50 0.02 0.065 REF 3.00 BSC 1.50 3.00 BSC 2.30 0.30 0.45 - MAX 0.55 0.05 1.60 2.40 0.35 0.55 - Notes: 1. Pin 1 visual index feature may vary, but must be located within the hatched area. 2. Package is saw singulated 3. Dimensioning and tolerancing per ASME Y14.5M BSC: Basic Dimension. Theoretically exact value shown without tolerances. REF: Reference Dimension, usually without tolerance, for information purposes only. Microchip Technology Drawing C04-254A Sheet 2 of 2 2014-2016 Microchip Technology Inc. DS40001737B-page 380 PIC12(L)F1612/16(L)F1613 8-Lead Ultra Thin Plastic Dual Flat, No Lead Package (RF) - 3x3x0.50 mm Body [UDFN] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging C X2 E Y2 X1 G1 G2 SILK SCREEN Y1 RECOMMENDED LAND PATTERN Units Dimension Limits E Contact Pitch Optional Center Pad Width X2 Optional Center Pad Length Y2 Contact Pad Spacing C Contact Pad Width (X8) X1 Contact Pad Length (X8) Y1 Contact Pad to Contact Pad (X6) G1 Contact Pad to Center Pad (X8) G2 MIN MILLIMETERS NOM 0.65 BSC MAX 1.60 2.40 2.90 0.35 0.85 0.20 0.30 Notes: 1. Dimensioning and tolerancing per ASME Y14.5M BSC: Basic Dimension. Theoretically exact value shown without tolerances. Microchip Technology Drawing C04-2254A 2014-2016 Microchip Technology Inc. DS40001737B-page 381 PIC12(L)F1612/16(L)F1613 '( ) # !")#% & !"#!$ !%& '#(##! )%*!!&! !!+11'''" "1% N NOTE 1 E1 1 3 2 D E A2 A L A1 c b1 b e eB K!# "#X"!# Q$"8 *)# Q<U> Q Q QY Z 3 )! !!) [ [ 3 &&)%%## 33G 3= 3G J#!!) 3 3G [ [ $& !$& \&! > =3 =G &&)%\&! >3 G Y6 X! =G G G !!) X 33G 3= 3G X&%## 3 3G 83 G ] 8 3 3 J [ [ K X&\&! X' X&\&! Y6 '; 3J< = & 3 )36#$&7*!$ "6 (8$!"$#!8!&'!!!& ;*!< ! #! = "##&>3&!$&"&*# ! $##&*# ! $###!7&3? #& "#&! >@3G J<+J#"# !7!6$#''!$!! # ' <GJ 2014-2016 Microchip Technology Inc. DS40001737B-page 382 PIC12(L)F1612/16(L)F1613 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 2014-2016 Microchip Technology Inc. DS40001737B-page 383 PIC12(L)F1612/16(L)F1613 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 2014-2016 Microchip Technology Inc. DS40001737B-page 384 PIC12(L)F1612/16(L)F1613 & !"#!$ !%& '#(##! )%*!!&! !!+11'''" "1% 2014-2016 Microchip Technology Inc. DS40001737B-page 385 PIC12(L)F1612/16(L)F1613 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 2014-2016 Microchip Technology Inc. DS40001737B-page 386 PIC12(L)F1612/16(L)F1613 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 2014-2016 Microchip Technology Inc. DS40001737B-page 387 PIC12(L)F1612/16(L)F1613 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 2014-2016 Microchip Technology Inc. DS40001737B-page 388 PIC12(L)F1612/16(L)F1613 16-Lead Plastic Quad Flat, No Lead Package (ML) - 4x4x0.9mm Body [QFN] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging D A B N NOTE 1 1 2 E (DATUM B) (DATUM A) 2X 0.15 C 2X TOP VIEW 0.15 C 0.10 C C A1 A SEATING PLANE 16X (A3) 0.08 C SIDE VIEW 0.10 C A B D2 0.10 C A B E2 2 e 2 1 NOTE 1 K N 0.40 16X b 0.10 e C A B BOTTOM VIEW Microchip Technology Drawing C04-127D Sheet 1 of 2 2014-2016 Microchip Technology Inc. DS40001737B-page 389 PIC12(L)F1612/16(L)F1613 16-Lead Plastic Quad Flat, No Lead Package (ML) - 4x4x0.9mm Body [QFN] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Units Dimension Limits N Number of Pins e Pitch A Overall Height A1 Standoff A3 Contact Thickness E Overall Width E2 Exposed Pad Width D Overall Length D2 Exposed Pad Length b Contact Width Contact Length L Contact-to-Exposed Pad K MIN 0.80 0.00 2.50 2.50 0.25 0.30 0.20 MILLIMETERS NOM 16 0.65 BSC 0.90 0.02 0.20 REF 4.00 BSC 2.65 4.00 BSC 2.65 0.30 0.40 - MAX 1.00 0.05 2.80 2.80 0.35 0.50 - Notes: 1. Pin 1 visual index feature may vary, but must be located within the hatched area. 2. Package is saw singulated 3. Dimensioning and tolerancing per ASME Y14.5M BSC: Basic Dimension. Theoretically exact value shown without tolerances. REF: Reference Dimension, usually without tolerance, for information purposes only. Microchip Technology Drawing C04-127D Sheet 2 of 2 2014-2016 Microchip Technology Inc. DS40001737B-page 390 PIC12(L)F1612/16(L)F1613 16-Lead Plastic Quad Flat, No Lead Package (ML) - 4x4x0.9mm Body [QFN] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 2014-2016 Microchip Technology Inc. DS40001737B-page 391 PIC12(L)F1612/16(L)F1613 APPENDIX A: DATA SHEET REVISION HISTORY Revision A (01/2014) Original release. Revision B (05/2016) Added Section 1.1 Register and Bit Naming Conventions. Added Register 12-14 WPUC register. Updated SMT Chapter. Minor typos corrected. Added High endurance column to Table 1: PIC12/16(L)F161x Family Types. Added Sections 22.1.1 and 22.1.2. Added Tables 22-1 and 22-3. Updated the High-Endurance Flash data memory information on the cover page. Updated Figures 18-2, 21-1, 22-8, 23-2, and 23-3; Registers 19-1, 21-1, 22-3, 22-4, and 25-6; Sections 18,6, 18.7, 22.0, 22.1, 22.4, 22.5, 22.5.1, 22.5.2, 22.5.4, 22.5.5, 22.5.8, 23.1.7, 23.2.6, and 25.0; Tables 5-1, 7-1, 8-1, 22-1 and 25-3. Updated Package Drawings C04-018, C04-127. Deleted Section 24.1.1 and Registers 22-5 and 22-6. 2014-2016 Microchip Technology Inc. DS40001737B-page 392 PIC12(L)F1612/16(L)F1613 THE MICROCHIP WEBSITE CUSTOMER SUPPORT Microchip provides online support via our website at www.microchip.com. This website is used as a means to make files and information easily available to customers. Accessible by using your favorite Internet browser, the website contains the following information: Users of Microchip products can receive assistance through several channels: • Product Support – Data sheets and errata, application notes and sample programs, design resources, user’s guides and hardware support documents, latest software releases and archived software • General Technical Support – Frequently Asked Questions (FAQ), technical support requests, online discussion groups, Microchip consultant program member listing • Business of Microchip – Product selector and ordering guides, latest Microchip press releases, listing of seminars and events, listings of Microchip sales offices, distributors and factory representatives • • • • Distributor or Representative Local Sales Office Field Application Engineer (FAE) Technical Support Customers should contact their distributor, representative or Field Application Engineer (FAE) for support. Local sales offices are also available to help customers. A listing of sales offices and locations is included in the back of this document. Technical support is available through the website at: http://www.microchip.com/support CUSTOMER CHANGE NOTIFICATION SERVICE Microchip’s customer notification service helps keep customers current on Microchip products. Subscribers will receive e-mail notification whenever there are changes, updates, revisions or errata related to a specified product family or development tool of interest. To register, access the Microchip website at www.microchip.com. Under “Support”, click on “Customer Change Notification” and follow the registration instructions. 2014-2016 Microchip Technology Inc. DS40001737B-page 393 PIC12(L)F1612/16(L)F1613 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. [X](1) PART NO. Device - X Tape and Reel Temperature Option Range /XX XXX Package Pattern Examples: a) b) Device: PIC12LF1612, PIC12F1612, PIC16LF1613, PIC16F1613 c) Tape and Reel Option: Blank T = Standard packaging (tube or tray) = Tape and Reel(1) Temperature Range: I E = -40C to +85C = -40C to +125C Package:(2) MF ML P RF SL SN ST = = = = = = = PIC12LF1612T - I/SN Tape and Reel, Industrial temperature, SOIC package PIC16F1613 - I/P Industrial temperature PDIP package PIC16F1613 - E/ML 298 Extended temperature, QFN package QTP pattern #298 (Industrial) (Extended) DFN (8-Lead) QFN (16-Lead) Plastic DIP Micro Lead Frame (UDFN) 3x3x0.5mm SOIC (14-Lead SOIC (8-Lead) TSSOP Note 1: 2: Pattern: QTP, SQTP, Code or Special Requirements (blank otherwise) 2014-2016 Microchip Technology Inc. Tape and Reel identifier only appears in the catalog part number description. This identifier is used for ordering purposes and is not printed on the device package. Check with your Microchip Sales Office for package availability with the Tape and Reel option. For other small form-factor package availability and marking information, please visit www.microchip.com/packaging or contact your local sales office. DS40001737B-page 394 Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. • Microchip is willing to work with the customer who is concerned about the integrity of their code. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights unless otherwise stated. Microchip received ISO/TS-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company’s quality system processes and procedures are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified. QUALITY MANAGEMENT SYSTEM CERTIFIED BY DNV == ISO/TS 16949 == Trademarks The Microchip name and logo, the Microchip logo, AnyRate, dsPIC, FlashFlex, flexPWR, Heldo, JukeBlox, KeeLoq, KeeLoq logo, Kleer, LANCheck, LINK MD, MediaLB, MOST, MOST logo, MPLAB, OptoLyzer, PIC, PICSTART, PIC32 logo, RightTouch, SpyNIC, SST, SST Logo, SuperFlash and UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. ClockWorks, The Embedded Control Solutions Company, ETHERSYNCH, Hyper Speed Control, HyperLight Load, IntelliMOS, mTouch, Precision Edge, and QUIET-WIRE are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, Any Capacitor, AnyIn, AnyOut, BodyCom, chipKIT, chipKIT logo, CodeGuard, dsPICDEM, dsPICDEM.net, Dynamic Average Matching, DAM, ECAN, EtherGREEN, In-Circuit Serial Programming, ICSP, Inter-Chip Connectivity, JitterBlocker, KleerNet, KleerNet logo, MiWi, motorBench, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach, Omniscient Code Generation, PICDEM, PICDEM.net, PICkit, PICtail, PureSilicon, RightTouch logo, REAL ICE, Ripple Blocker, Serial Quad I/O, SQI, SuperSwitcher, SuperSwitcher II, Total Endurance, TSHARC, USBCheck, VariSense, ViewSpan, WiperLock, Wireless DNA, and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. Silicon Storage Technology is a registered trademark of Microchip Technology Inc. in other countries. GestIC is a registered trademarks of Microchip Technology Germany II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in other countries. All other trademarks mentioned herein are property of their respective companies. © 2014-2016, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. ISBN: 978-1-5224-0554-2 2014-2016 Microchip Technology Inc. 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