PIC12(L)F1571/2 8-Pin MCU with High-Precision 16-Bit PWMs Description: PIC12(L)F1571/2 microcontrollers combine the capabilities of 16-bit PWMs with Analog to suit a variety of applications. These devices deliver three 16-bit PWMs with independent timers for applications where high resolution is needed, such as LED lighting, stepper motors, power supplies and other general purpose applications. The core independent peripherals (16-bit PWMs, Complementary Waveform Generator), Enhanced Universal Synchronous Asynchronous Receiver Transceiver (EUSART) and Analog (ADCs, Comparator and DAC) enable closed-loop feedback and communication for use in multiple market segments. The EUSART peripheral enables the communication for applications such as LIN. Core Features: eXtreme Low-Power (XLP) Features: • C Compiler Optimized RISC Architecture • Only 49 Instructions • Operating Speed: - DC – 32 MHz clock input - 125 ns minimum instruction cycle • Interrupt Capability • 16-Level Deep Hardware Stack • Two 8-Bit Timers • One 16-Bit Timer • Three Additional 16-Bit Timers available using the 16-Bit PWMs • Power-on Reset (POR) • Power-up Timer (PWRT) • Low-Power Brown-out Reset (LPBOR) • Programmable Watchdog Timer (WDT) up to 256s • Programmable Code Protection • Sleep mode: 20 nA @ 1.8V, Typical • Watchdog Timer: 260 nA @ 1.8V, Typical • Operating Current: - 30 A/MHz @ 1.8V, typical Memory: • • • • Up to 3.5 Kbytes Flash Program Memory Up to 256 Bytes Data SRAM Memory Direct, Indirect and Relative Addressing modes High-Endurance Flash Data Memory (HEF) - 128 bytes if nonvolatile data storage - 100k erase/write cycles Operating Characteristics: • Operating Voltage Range: - 1.8V to 3.6V (PIC12LF1571/2) - 2.3V to 5.5V (PIC12F1571/2) • Temperature Range: - Industrial: -40°C to +85°C - Extended: -40°C to +125°C • Internal Voltage Reference module • In-Circuit Serial Programming™ (ICSP™) via Two Pins 2013-2015 Microchip Technology Inc. Digital Peripherals: • 16-Bit PWM: - Three 16-bit PWMs with independent timers - Multiple Output modes (Edge-Aligned, Center-Aligned, Set and Toggle on Register Match) - User settings for phase, duty cycle, period, offset and polarity - 16-bit timer capability - Interrupts generated based on timer matches with Offset, Duty Cycle, Period and Phase registers • Complementary Waveform Generator (CWG): - Rising and falling edge dead-band control - Multiple signal sources • Enhanced Universal Synchronous Asynchronous Receiver Transceiver (EUSART): - Supports LIN applications Device I/O Port Features: • Six I/Os • Individually Selectable Weak Pull-ups • Interrupt-On-Change Pins Option with Edge-Selectable Option DS40001723D-page 1 PIC12(L)F1571/2 Analog Peripherals: Clocking Structure: • 10-Bit Analog-to-Digital Converter (ADC): - Up to four external channels - Conversion available during Sleep • Comparator: - Low-Power/High-Speed modes - Fixed Voltage Reference at (non)inverting input(s) - Comparator outputs externally accessible - Synchronization with Timer1 clock source - Software hysteresis enable • 5-Bit Digital-to-Analog Converter (DAC): - 5-bit resolution, rail-to-rail - Positive reference selection - Unbuffered I/O pin output - Internal connections to ADCs and comparators • Voltage Reference: - Fixed voltage reference with 1.024V, 2.048V and 4.096V output levels • Precision Internal Oscillator: - Factory calibrated ±1%, typical - Software-selectable clock speeds from 31 kHz to 32 MHz • External Oscillator Block with: - Resonator modes up to 20 MHz - Two External Clock modes up to 32 MHz • Fail-Safe Clock Monitor • Digital Oscillator Input Available Data Sheet Index Program Memory Flash (K words) Data SRAM (bytes) High-Endurance Flash (bytes) I/O Pins 8-Bit/16-Bit Timers Comparators 16-Bit PWM 10-Bit ADC (ch) 5-Bit DAC CWG EUSART Debug(1) XLP PIC12(L)F1571/2 FAMILY TYPES PIC12(L)F1571 A 1 128 128 6 2/4(2) 1 3 4 1 1 0 I Y PIC12(L)F1572 A 2 256 128 6 2/4(2) 1 3 4 1 1 1 I Y Device Note 1: 2: I – Debugging integrated on chip. Three additional 16-bit timers available when not using the 16-bit PWM outputs. Data Sheet Index: (Unshaded devices are described in this document.) A DS40001723 DS40001723D-page 2 PIC12(L)F1571/2 Data Sheet, 8-Pin Flash, 8-Bit MCU with High-Precision 16-Bit PWM. 2013-2015 Microchip Technology Inc. PIC12(L)F1571/2 PIN DIAGRAMS 1 RA5 2 RA4 3 RA3/MCLR/VPP 4 PIC12(L)F1572 VDD PIC12(L)F1571 Pin Diagram – 8-Pin PDIP, SOIC, DFN, MSOP, UDFN 8 VSS 7 RA0/ICSPDAT 6 RA1/ICSPCLK 5 RA2 Note: See Table 1 for location of all peripheral functions. 8-Pin PDIP/SOIC/MSOP/DFN/UDFN ADC Reference Comparator Timers PWM EUSART(2) CWG Interrupt Pull-up Basic 8-PIN ALLOCATION TABLE (PIC12(L)F1571/2) I/O TABLE 1: RA0 7 AN0 DAC1OUT C1IN+ — PWM2 TX(2) CK(2) CWG1B IOC Y ICSPDAT ICDDAT RA1 6 AN1 VREF+ C1IN0- — PWM1 RX(2) DT(2) — IOC Y ICSPCLK ICDCLK RA2 5 AN2 — C1OUT T0CKI PWM3 — CWG1FLT CWG1A IOC INT Y — RA3 4 — — — T1G(1) — — — IOC Y MCLR VPP RA4 3 AN3 — C1IN1- T1G PWM2(1) TX(1,2) CK(1,2) CWG1B(1) IOC Y CLKOUT RA5 2 — — — T1CKI PWM1(1) RX(1,2) DT(1,2) CWG1A(1) IOC Y CLKIN VDD 1 — — — — — — — — — VDD Vss 8 — — — — — — — — — VSS Note 1: 2: Alternate pin function selected with the APFCON (Register 11-1) register. PIC12(L)F1572 only. 2013-2015 Microchip Technology Inc. DS40001723D-page 3 PIC12(L)F1571/2 Table of Contents 1.0 Device Overview .......................................................................................................................................................................... 7 2.0 Enhanced Mid-Range CPU ........................................................................................................................................................ 13 3.0 Memory Organization ................................................................................................................................................................. 15 4.0 Device Configuration .................................................................................................................................................................. 41 5.0 Oscillator Module........................................................................................................................................................................ 47 6.0 Resets ........................................................................................................................................................................................ 59 7.0 Interrupts .................................................................................................................................................................................... 69 8.0 Power-Down Mode (Sleep) ........................................................................................................................................................ 83 9.0 Watchdog Timer (WDT) ............................................................................................................................................................. 87 10.0 Flash Program Memory Control ................................................................................................................................................. 91 11.0 I/O Ports ................................................................................................................................................................................... 109 12.0 Interrupt-On-Change ................................................................................................................................................................ 119 13.0 Fixed Voltage Reference (FVR) ............................................................................................................................................... 123 14.0 Temperature Indicator Module ................................................................................................................................................. 127 15.0 Analog-to-Digital Converter (ADC) Module .............................................................................................................................. 129 16.0 5-Bit Digital-to-Analog Converter (DAC) Module ...................................................................................................................... 143 17.0 Comparator Module.................................................................................................................................................................. 147 18.0 Timer0 Module ......................................................................................................................................................................... 155 19.0 Timer1 Module with Gate Control............................................................................................................................................. 159 20.0 Timer2 Module ......................................................................................................................................................................... 171 21.0 Enhanced Universal Synchronous Asynchronous Receiver Transmitter (EUSART) ............................................................... 175 22.0 16-Bit Pulse-Width Modulation (PWM) Module ........................................................................................................................ 203 23.0 Complementary Waveform Generator (CWG) Module ............................................................................................................ 231 24.0 In-Circuit Serial Programming™ (ICSP™) ............................................................................................................................... 243 25.0 Instruction Set Summary .......................................................................................................................................................... 245 26.0 Electrical Specifications............................................................................................................................................................ 259 27.0 DC and AC Characteristics Graphs and Charts ....................................................................................................................... 283 28.0 Development Support............................................................................................................................................................... 305 29.0 Packaging Information.............................................................................................................................................................. 309 Appendix A: Data Sheet Revision History.......................................................................................................................................... 327 The Microchip Web Site ..................................................................................................................................................................... 329 Customer Change Notification Service .............................................................................................................................................. 329 Customer Support .............................................................................................................................................................................. 329 Product Identification System............................................................................................................................................................. 331 DS40001723D-page 4 2013-2015 Microchip Technology Inc. PIC12(L)F1571/2 TO OUR VALUED CUSTOMERS It is our intention to provide our valued customers with the best documentation possible to ensure successful use of your Microchip products. To this end, we will continue to improve our publications to better suit your needs. Our publications will be refined and enhanced as new volumes and updates are introduced. If you have any questions or comments regarding this publication, please contact the Marketing Communications Department via E-mail at [email protected]. We welcome your feedback. Most Current Data Sheet To obtain the most up-to-date version of this data sheet, please register at our Worldwide Web site at: http://www.microchip.com You can determine the version of a data sheet by examining its literature number found on the bottom outside corner of any page. The last character of the literature number is the version number, (e.g., DS30000000A is version A of document DS30000000). Errata An errata sheet, describing minor operational differences from the data sheet and recommended workarounds, may exist for current devices. As device/documentation issues become known to us, we will publish an errata sheet. The errata will specify the revision of silicon and revision of document to which it applies. To determine if an errata sheet exists for a particular device, please check with one of the following: • Microchip’s Worldwide Web site; http://www.microchip.com • Your local Microchip sales office (see last page) When contacting a sales office, please specify which device, revision of silicon and data sheet (include literature number) you are using. Customer Notification System Register on our web site at www.microchip.com to receive the most current information on all of our products. 2013-2015 Microchip Technology Inc. DS40001723D-page 5 PIC12(L)F1571/2 NOTES: DS40001723D-page 6 2013-2015 Microchip Technology Inc. PIC12(L)F1571/2 1.0 DEVICE OVERVIEW 1.1 The PIC12(L)F1571/2 devices are described within this data sheet. The block diagram of these devices is shown in Figure 1-1, the available peripherals are shown in Table 1-1 and the pinout descriptions are shown in Table 1-2. Peripheral PIC12(L)F1572 DEVICE PERIPHERAL SUMMARY PIC12(L)F1571 TABLE 1-1: Analog-to-Digital Converter (ADC) ● ● Complementary Wave Generator (CWG) ● ● Digital-to-Analog Converter (DAC) ● ● Enhanced Universal Synchronous/Asynchronous Receiver/Transmitter (EUSART) REGISTER NAMES When there are multiple instances of the same peripheral in a device, the peripheral control registers will be depicted as the concatenation of a peripheral identifier, peripheral instance and control identifier. The control registers section will show just one instance of all the register names with an ‘x’ in the place of the peripheral instance number. This naming convention may also be applied to peripherals when there is only one instance of that peripheral in the device to maintain compatibility with other devices in the family that contain more than one. 1.1.2 BIT NAMES There are two variants for bit names: • Short name: Bit function abbreviation • Long name: Peripheral abbreviation + short name ● 1.1.2.1 Short bit names are an abbreviation for the bit function. For example, some peripherals are enabled with the EN bit. The bit names shown in the registers are the short name variant. Fixed Voltage Reference (FVR) ● ● Temperature Indicator ● ● C1 ● ● PWM1 ● ● PWM2 ● ● PWM3 ● ● Timer0 ● ● Timer1 ● ● Timer2 ● ● Comparators PWM Modules Timers 2013-2015 Microchip Technology Inc. 1.1.1 Register and Bit Naming Conventions Short Bit Names Short bit names are useful when accessing bits in C programs. The general format for accessing bits by the short name is RegisterNamebits.ShortName. For example, the enable bit, EN, in the COG1CON0 register can be set in C programs with the instruction, COG1CON0bits.EN = 1. Short names are generally not useful in assembly programs because the same name may be used by different peripherals in different bit positions. When this occurs, during the include file generation, all instances of that short bit name are appended with an underscore, plus the name of the register in which the bit resides, to avoid naming contentions. DS40001723D-page 7 PIC12(L)F1571/2 1.1.2.2 Long Bit Names Long bit names are constructed by adding a peripheral abbreviation prefix to the short name. The prefix is unique to the peripheral, thereby making every long bit name unique. The long bit name for the COG1 enable bit is the COG1 prefix, G1, appended with the enable bit short name, EN, resulting in the unique bit name G1EN. Long bit names are useful in both C and assembly programs. For example, in C, the COG1CON0 enable bit can be set with the G1EN = 1 instruction. In assembly, this bit can be set with the BSF COG1CON0,G1EN instruction. 1.1.2.3 Bit Fields Bit fields are two or more adjacent bits in the same register. Bit fields adhere only to the short bit naming convention. For example, the three Least Significant bits of the COG1CON0 register contain the mode control bits. The short name for this field is MD. There is no long bit name variant. Bit field access is only possible in C programs. The following example demonstrates a C program instruction for setting the COG1 to the Push-Pull mode: 1.1.3 1.1.3.1 REGISTER AND BIT NAMING EXCEPTIONS Status, Interrupt and Mirror Bits Status, interrupt enables, interrupt flags and mirror bits are contained in registers that span more than one peripheral. In these cases, the bit name shown is unique so there is no prefix or short name variant. 1.1.3.2 Legacy Peripherals There are some peripherals that do not strictly adhere to these naming conventions. Peripherals that have existed for many years and are present in almost every device are the exceptions. These exceptions were necessary to limit the adverse impact of the new conventions on legacy code. Peripherals that do adhere to the new convention will include a table in the registers section indicating the long name prefix for each peripheral instance. Peripherals that fall into the exception category will not have this table. These peripherals include, but are not limited to, the following: • EUSART • MSSP COG1CON0bits.MD = 0x5; Individual bits in a bit field can also be accessed with long and short bit names. Each bit is the field name appended with the number of the bit position within the field. For example, the Most Significant mode bit has the short bit name, MD2, and the long bit name is G1MD2. The following two examples demonstrate assembly program sequences for setting the COG1 to Push-Pull mode: Example 1: MOVLW ANDWF MOVLW IORWF ~(1<<G1MD1) COG1CON0,F 1<<G1MD2 | 1<<G1MD0 COG1CON0,F Example 2: BSF BCF BSF COG1CON0,G1MD2 COG1CON0,G1MD1 COG1CON0,G1MD0 DS40001723D-page 8 2013-2015 Microchip Technology Inc. PIC12(L)F1571/2 FIGURE 1-1: PIC12(L)F1571/2 BLOCK DIAGRAM Rev. 10-000039E 9/12/2013 Program Flash Memory RAM PORTA CLKOUT Timing Generation CPU CLKIN INTRC Oscillator (Note 3) MCLR TMR2 TMR1 CWG1 Note 1: 2: 3: 4: TMR0 C1 Temp Indicator ADC 10-bit PWM3 DAC PWM2 FVR PWM1 EUSART(4) See applicable chapters for more information on peripherals. See Table 1-1 for peripherals available on specific devices. See Figure 2-1. PIC12(L)F1572 only. 2013-2015 Microchip Technology Inc. DS40001723D-page 9 PIC12(L)F1571/2 TABLE 1-2: PIC12(L)F1571/2 PINOUT DESCRIPTION Name RA0/AN0/C1IN+/DACOUT/ TX(2)/CK(2)/CWG1B/PWM2/ ICSPDAT/ICDDAT Function Input Type Output Type RA0 General purpose I/O. AN0 ADC channel input. C1IN+ Comparator positive input. DACOUT TX Digital-to-Analog Converter output. (3) (4) CK CWG complementary output. PWM2 PWM output. ICSPDAT ICSP™ data I/O. ICDDAT In-circuit debug data. RA1 General purpose I/O. AN1 ADC channel input. VREF+ ADC Voltage Reference input. C1IN0RX Comparator negative input. (3) (4) DT PWM output. ICSPCLK ICSP programming clock. ICDCLK In-circuit debug clock. RA2 General purpose I/O. AN2 ADC channel input. C1OUT Comparator output. T0CKI (3) (4) CWG1FLT CWG complementary output. PWM3 PWM output. INT External interrupt. RA3 General purpose input with IOC and WPU. VPP (3) (4) T1G Programming voltage. Timer1 gate input. Master Clear with internal pull-up. MCLR RA4/AN3/C1IN1-/T1G/TX(1,2)/ CK(1,2)/CWG1B(1)/PWM2(1)/ CLKOUT Timer0 clock input. Complementary Waveform Generator Fault input. CWG1A RA3/VPP/T1G(1)/MCLR USART asynchronous input. USART synchronous data. PWM1 RA2/AN2/C1OUT/T0CKI/ CWG1FLT/CWG1A/PWM3/INT USART asynchronous transmit. USART synchronous clock. CWG1B RA1/AN1/VREF+/C1IN0-/RX(2)/ DT(2)/PWM1/ICSPCLK/ICDCLK Description RA4 General purpose I/O. AN3 ADC channel input. C1IN1- Comparator negative input. T1G TX CK CWG1B PWM2 CLKOUT Timer1 gate input. (3) (4) USART asynchronous transmit. USART synchronous clock. CWG complementary output. PWM output. FOSC/4 output. Legend: AN = Analog input or output CMOS = CMOS compatible input or output TTL = TTL compatible input ST = Schmitt Trigger input with CMOS levels HV = High Voltage XTAL = Crystal Note 1: Alternate pin function selected with the APFCON (Register 11-1) register. 2: PIC12(L)F1572 only. 3: Input type is selected by the port. 4: Output type is selected by the port. DS40001723D-page 10 OD = Open-Drain I2C = Schmitt Trigger input with I2C levels 2013-2015 Microchip Technology Inc. PIC12(L)F1571/2 TABLE 1-2: PIC12(L)F1571/2 PINOUT DESCRIPTION (CONTINUED) Name RA5/T1CKI/RX(1,2)/DT(1,2)/ CWG1A(1)/PWM1(1)/CLKIN Function Input Type Output Type General purpose I/O. RA5 T1CKI Timer1 clock input. RX DT Description USART asynchronous input. (3) (4) CWG1A USART synchronous data. CWG complementary output. PWM1 PWM output. CLKIN External Clock input (EC mode). VDD VDD Power — Positive supply. VSS VSS Power — Ground reference. Legend: AN = Analog input or output CMOS = CMOS compatible input or output TTL = TTL compatible input ST = Schmitt Trigger input with CMOS levels HV = High Voltage XTAL = Crystal Note 1: Alternate pin function selected with the APFCON (Register 11-1) register. 2: PIC12(L)F1572 only. 3: Input type is selected by the port. 4: Output type is selected by the port. 2013-2015 Microchip Technology Inc. OD = Open-Drain I2C = Schmitt Trigger input with I2C levels DS40001723D-page 11 PIC12(L)F1571/2 NOTES: DS40001723D-page 12 2013-2015 Microchip Technology Inc. PIC12(L)F1571/2 2.0 ENHANCED MID-RANGE CPU • • • • This family of devices contains an enhanced mid-range 8-bit CPU core. The CPU has 49 instructions. Interrupt capability includes automatic context saving. The hardware stack is 16 levels deep and has Overflow and Underflow Reset capability. Direct, Indirect and Relative Addressing modes are available. Two File Select Registers (FSRs) provide the ability to read program and data memory. FIGURE 2-1: Automatic Interrupt Context Saving 16-Level Stack with Overflow and Underflow File Select Registers Instruction Set CORE BLOCK DIAGRAM Rev. 10-000055A 7/30/2013 15 Configuration 15 MUX Flash Program Memory Data Bus 16-Level Stack (15-bit) RAM 14 Program Bus 8 Program Counter 12 Program Memory Read (PMR) RAM Addr Addr MUX Instruction Reg Direct Addr 7 5 Indirect Addr 12 12 BSR Reg 15 FSR0 Reg 15 FSR1 Reg STATUS Reg 8 Instruction Decode and Control CLKIN CLKOUT Timing Generation Internal Oscillator Block 2013-2015 Microchip Technology Inc. Power-up Timer Power-on Reset Watchdog Timer Brown-out Reset VDD 3 8 MUX ALU W Reg VSS DS40001723D-page 13 PIC12(L)F1571/2 2.1 Automatic Interrupt Context Saving During interrupts, certain registers are automatically saved in shadow registers and restored when returning from the interrupt. This saves stack space and user code. See Section 7.5 “Automatic Context Saving”, for more information. 2.2 16-Level Stack with Overflow and Underflow These devices have a hardware stack memory, 15 bits wide and 16 words deep. A Stack Overflow or Underflow will set the appropriate bit (STKOVF or STKUNF) in the PCON register, and if enabled, will cause a Software Reset. See Section 3.5 “Stack” for more details. DS40001723D-page 14 2.3 File Select Registers There are two 16-bit File Select Registers (FSR). FSRs can access all file registers and program memory, which allows one Data Pointer for all memory. When an FSR points to program memory, there is one additional instruction cycle in instructions using INDF to allow the data to be fetched. General purpose memory can now also be addressed linearly, providing the ability to access contiguous data larger than 80 bytes. There are also new instructions to support the FSRs. See Section 3.6 “Indirect Addressing” for more details. 2.4 Instruction Set There are 49 instructions for the enhanced midrange CPU to support the features of the CPU. See Section 25.0 “Instruction Set Summary” for more details. 2013-2015 Microchip Technology Inc. PIC12(L)F1571/2 3.0 MEMORY ORGANIZATION These devices contain the following types of memory: • Program Memory: - Configuration Words - Device ID - User ID - Flash Program Memory • Data Memory: - Core Registers - Special Function Registers - General Purpose RAM - Common RAM • PCL and PCLATH • Stack • Indirect Addressing Program Memory Organization The enhanced mid-range core has a 15-bit Program Counter (PC) capable of addressing a 32K x 14 program memory space. Table 3-1 shows the memory sizes implemented. Accessing a location above these boundaries will cause a wraparound within the implemented memory space. The Reset vector is at 0000h and the interrupt vector is at 0004h (see Figure 3-1). 3.2 The following features are associated with access and control of program memory and data memory: TABLE 3-1: 3.1 High-Endurance Flash This device has a 128-byte section of high-endurance Program Flash Memory (PFM) in lieu of data EEPROM. This area is especially well-suited for nonvolatile data storage that is expected to be updated frequently over the life of the end product. See Section 10.2 “Flash Program Memory Overview” for more information on writing data to PFM. See Section 3.2.1.2 “Indirect Read with FSR” for more information about using the FSR registers to read byte data stored in PFM. DEVICE SIZES AND ADDRESSES Program Memory Space (Words) Last Program Memory Address High-Endurance Flash Memory Address Range(1) PIC12(L)F1571 1,024 03FFh 0380h-03FFh PIC12(L)F1572 2,048 07FFh 0780h-07FFh Device Note 1: High-endurance Flash applies to the low byte of each address in the range. 2013-2015 Microchip Technology Inc. DS40001723D-page 15 PIC12(L)F1571/2 FIGURE 3-1: PROGRAM MEMORY MAP AND STACK FOR PIC12(L)F1571 FIGURE 3-2: PROGRAM MEMORY MAP AND STACK FOR PIC12(L)F1572 Rev. 10-000040C 7/30/2013 Rev. 10-000040D 7/30/2013 PC<14:0> CALL, CALLW RETURN, RETLW Interrupt, RETFIE PC<14:0> 15 CALL, CALLW RETURN, RETLW Interrupt, RETFIE Stack Level 0 Stack Level 0 Stack Level 1 Stack Level 1 Stack Level 15 On-chip Program Memory Stack Level 15 Reset Vector 0000h Interrupt Vector 0004h 0005h Page 0 Rollover to Page 0 03FFh 0400h Rollover to Page 0 7FFFh DS40001723D-page 16 15 On-chip Program Memory Reset Vector 0000h Interrupt Vector 0004h 0005h Page 0 Rollover to Page 0 07FFh 0800h Rollover to Page 0 7FFFh 2013-2015 Microchip Technology Inc. PIC12(L)F1571/2 3.2.1 READING PROGRAM MEMORY AS DATA 3.2.1.2 Indirect Read with FSR The RETLW instruction can be used to provide access to tables of constants. The recommended way to create such a table is shown in Example 3-1. The program memory can be accessed as data by setting bit 7 of the FSRnH register and reading the matching INDFn register. The MOVIW instruction will place the lower eight bits of the addressed word in the W register. Writes to the program memory cannot be performed via the INDFn registers. Instructions that access the program memory via the FSR require one extra instruction cycle to complete. Example 3-2 demonstrates accessing the program memory via an FSR. EXAMPLE 3-1: The HIGH operator will set bit<7> if a label points to a location in program memory. There are two methods of accessing constants in program memory. The first method is to use tables of RETLW instructions. The second method is to set an FSR to point to the program memory. 3.2.1.1 RETLW Instruction constants BRW RETLW RETLW RETLW RETLW DATA0 DATA1 DATA2 DATA3 RETLW INSTRUCTION ;Add Index in W to ;program counter to ;select data ;Index0 data ;Index1 data my_function ;… LOTS OF CODE… MOVLW DATA_INDEX call constants ;… THE CONSTANT IS IN W The BRW instruction makes this type of table very simple to implement. If your code must remain portable with previous generations of microcontrollers, then the BRW instruction is not available, so the older table read method must be used. 2013-2015 Microchip Technology Inc. EXAMPLE 3-2: ACCESSING PROGRAM MEMORY VIA FSR constants DW DATA0 ;First constant DW DATA1 ;Second constant DW DATA2 DW DATA3 my_function ;… LOTS OF CODE… MOVLW DATA_INDEX ADDLW LOW constants MOVWF FSR1L MOVLW HIGH constants ;MSb is set automatically MOVWF FSR1H BTFSC STATUS,C ;carry from ADDLW? INCF FSR1H,f ;yes MOVIW 0[FSR1] ;THE PROGRAM MEMORY IS IN W DS40001723D-page 17 PIC12(L)F1571/2 3.3 Data Memory Organization The data memory is partitioned in 32 memory banks with 128 bytes in a bank. Each bank consists of (Figure 3-3): • • • • 12 Core Registers 20 Special Function Registers (SFR) Up to 80 bytes of General Purpose RAM (GPR) 16 bytes of Common RAM The active bank is selected by writing the bank number into the Bank Select Register (BSR). Unimplemented memory will read as ‘0’. All data memory can be accessed either directly (via instructions that use the file registers) or indirectly via the two File Select Registers (FSR). See Section 3.6 “Indirect Addressing” for more information. Data memory uses a 12-bit address. The upper five bits of the address define the bank address and the lower seven bits select the registers/RAM in that bank. DS40001723D-page 18 3.3.1 CORE REGISTERS The core registers contain the registers that directly affect the basic operation. The core registers occupy the first 12 addresses of every data memory bank (addresses: x00h/x08h through x0Bh/x8Bh). These registers are listed below in Table 3-2. For detailed information, see Table 3-9. TABLE 3-2: CORE REGISTERS Addresses BANKx x00h or x80h x01h or x81h x02h or x82h x03h or x83h x04h or x84h x05h or x85h x06h or x86h x07h or x87h x08h or x88h x09h or x89h x0Ah or x8Ah x0Bh or x8Bh INDF0 INDF1 PCL STATUS FSR0L FSR0H FSR1L FSR1H BSR WREG PCLATH INTCON 2013-2015 Microchip Technology Inc. PIC12(L)F1571/2 3.3.1.1 STATUS Register The STATUS register, shown in Register 3-1, contains: • The arithmetic status of the ALU • The Reset status The STATUS register can be the destination for any instruction, like any other register. If the STATUS register is the destination for an instruction that affects the Z, DC or C bits, then the write to these three bits is disabled. These bits are set or cleared according to the device logic. Furthermore, the TO and PD bits are not writable. Therefore, the result of an instruction with the STATUS register as destination may be different than intended. REGISTER 3-1: For example, CLRF STATUS will clear the upper three bits and set the Z bit. This leaves the STATUS register as ‘000u u1uu’ (where u = unchanged). It is recommended, therefore, that only BCF, BSF, SWAPF and MOVWF instructions are used to alter the STATUS register, because these instructions do not affect any Status bits. For other instructions not affecting any Status bits, refer to Section 25.0 “Instruction Set Summary”). Note 1: The C and DC bits operate as Borrow and Digit Borrow out bits, respectively, in subtraction. STATUS: STATUS REGISTER U-0 U-0 U-0 R-1/q R-1/q R/W-0/u R/W-0/u R/W-0/u — — — TO PD Z DC(1) C(1) bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared q = Value depends on condition bit 7-5 Unimplemented: Read as ‘0’ bit 4 TO: Time-out bit 1 = After power-up, CLRWDT instruction or SLEEP instruction 0 = A WDT time-out occurred bit 3 PD: Power-Down bit 1 = After power-down or by the CLRWDT instruction 0 = By execution of the SLEEP instruction bit 2 Z: Zero bit 1 = The result of an arithmetic or logic operation is zero 0 = The result of an arithmetic or logic operation is not zero bit 1 DC: Digit Carry/Digit Borrow bit (ADDWF, ADDLW, SUBLW, SUBWF instructions)(1) 1 = A carry-out from the 4th low-order bit of the result occurred 0 = No carry-out from the 4th low-order bit of the result bit 0 C: Carry/Borrow bit(1) (ADDWF, ADDLW, SUBLW, SUBWF instructions)(1) 1 = A carry-out from the Most Significant bit of the result occurred 0 = No carry-out from the Most Significant bit of the result occurred Note 1: For Borrow, the polarity is reversed. A subtraction is executed by adding the two’s complement of the second operand. For rotate (RRF, RLF) instructions, this bit is loaded with either the high-order or low-order bit of the source register. 2013-2015 Microchip Technology Inc. DS40001723D-page 19 PIC12(L)F1571/2 3.3.2 SPECIAL FUNCTION REGISTER The Special Function Registers are registers used by the application to control the desired operation of peripheral functions in the device. The Special Function Registers occupy the 20 bytes after the core registers of every data memory bank (addresses: x0Ch/x8Ch through x1Fh/x9Fh). The registers associated with the operation of the peripherals are described in the appropriate peripheral chapter of this data sheet. 3.3.3 GENERAL PURPOSE RAM There are up to 80 bytes of GPR in each data memory bank. The Special Function Registers occupy the 20 bytes after the core registers of every data memory bank (addresses: x0Ch/x8Ch through x1Fh/x9Fh). 3.3.3.1 FIGURE 3-3: BANKED MEMORY PARTITIONING Rev. 10-000041A 7/30/2013 7-bit Bank Offset 00h Core Registers (12 bytes) 0Bh 0Ch Special Function Registers (20 bytes maximum) 1Fh 20h Linear Access to GPR The general purpose RAM can be accessed in a non-banked method via the FSRs. This can simplify access to large memory structures. See Section 3.6.2 “Linear Data Memory” for more information. 3.3.4 Memory Region General Purpose RAM (80 bytes maximum) COMMON RAM There are 16 bytes of common RAM accessible from all banks. 3.3.5 DEVICE MEMORY MAPS The memory maps for PIC12(L)F1571/2 are as shown in Table 3-3 through Table 3-8. 6Fh 70h Common RAM (16 bytes) 7Fh DS40001723D-page 20 2013-2015 Microchip Technology Inc. 2013-2015 Microchip Technology Inc. TABLE 3-3: PIC12(L)F1571 MEMORY MAP, BANK 0-7 BANK 0 000h BANK 1 080h Core Registers (Table 3-2) 00Bh BANK 2 100h Core Registers (Table 3-2) 08Bh BANK 3 180h Core Registers (Table 3-2) 10Bh BANK 4 200h Core Registers (Table 3-2) 18Bh BANK 5 280h Core Registers (Table 3-2) 20Bh BANK 6 300h Core Registers (Table 3-2) 28Bh BANK 7 380h Core Registers (Table 3-2) 30Bh Core Registers (Table 3-2) 38Bh 00Ch PORTA 08Ch TRISA 10Ch LATA 18Ch ANSELA 20Ch WPUA 28Ch ODCONA 30Ch SLRCONA 38Ch INLVLA 00Dh — 08Dh — 10Dh — 18Dh — 20Dh — 28Dh — 30Dh — 38Dh — 00Eh — 08Eh — 10Eh — 18Eh — 20Eh — 28Eh — 30Eh — 38Eh — 00Fh — 08Fh — 10Fh — 18Fh — 20Fh — 28Fh — 30Fh — 38Fh — 010h — 090h — 110h — 190h — 210h — 290h — 310h — 390h — 011h PIR1 091h PIE1 111h CM1CON0 191h PMADRL 211h — 291h — 311h — 391h IOCAP 012h PIR2 092h PIE2 112h CM1CON1 192h PMADRH 212h — 292h — 312h — 392h IOCAN 013h PIR3 093h PIE3 113h — 193h PMDATL 213h — 293h — 313h — 393h IOCAF 014h — 094h — 114h — 194h PMDATH 214h — 294h — 314h — 394h — 015h TMR0 095h OPTION_REG 115h CMOUT 195h PMCON1 215h — 295h — 315h — 395h — 016h TMR1L 096h PCON 116h BORCON 196h PMCON2 216h — 296h — 316h — 396h — 017h TMR1H 097h WDTCON 117h FVRCON 197h VREGCON(1) 217h — 297h — 317h — 397h — 018h T1CON 098h OSCTUN E 118h DACxCON0 198h — 218h — 298h — 318h — 398h — 019h T1GCON 099h OSCCON 119h DACxCON1 199h — 219h — 299h — 319h — 399h — 01Ah TMR2 09Ah OSCSTAT 11Ah — 19Ah — 21Ah — 29Ah — 31Ah — 39Ah — 01Bh PR2 09Bh ADRESL 11Bh — 19Bh — 21Bh — 29Bh — 31Bh — 39Bh — 01Ch T2CON 09Ch ADRESH 11Ch — 19Ch — 21Ch — 29Ch — 31Ch — 39Ch — 01Dh — 09Dh ADCON0 11Dh APFCON 19Dh — 21Dh — 29Dh — 31Dh — 39Dh — 01Eh — 09Eh ADCON1 11Eh — 19Eh — 21Eh — 29Eh — 31Eh — 39Eh — 01Fh — 09Fh ADCON2 11Fh — 19Fh — 21Fh — 29Fh — 31Fh — 39Fh — 020h 0C0h 06Fh 0EFh 070h 0F0h Common RAM DS40001723D-page 21 07Fh 0FFh Unimplemented Read as ‘0’ Common RAM (Accesses 70h-7Fh) 120h 1A0h Unimplemented Read as ‘0’ 16Fh 170h 17Fh 220h Unimplemented Read as ‘0’ 1EFh 1F0h Common RAM (Accesses 70h-7Fh) Legend: = Unimplemented data memory locations, read as ‘0’. Note 1: PIC12F1571 only. 1FFh 2A0h Unimplemented Read as ‘0’ 26Fh 270h Common RAM (Accesses 70h-7Fh) 27Fh 320h Unimplemented Read as ‘0’ 2FFh Unimplemented Read as ‘0’ 36Fh 2EFh 2F0h Common RAM (Accesses 70h-7Fh) 3A0h 3EFh 370h Common RAM (Accesses 70h-7Fh) 37Fh Unimplemented Read as ‘0’ 3F0h Common RAM (Accesses 70h-7Fh) 3FFh Common RAM (Accesses 70h-7Fh) PIC12(L)F1571/2 General Purpose Register 80 Bytes 0A0h General Purpose Register 48 Bytes 0BFh PIC12(L)F1572 MEMORY MAP, BANK 0-7 BANK 0 000h BANK 1 080h Core Registers (Table 3-2) 00Bh BANK 2 100h Core Registers (Table 3-2) 08Bh BANK 3 180h Core Registers (Table 3-2) 10Bh BANK 4 200h Core Registers (Table 3-2) 18Bh BANK 5 280h Core Registers (Table 3-2) 20Bh BANK 6 300h Core Registers (Table 3-2) 28Bh BANK 7 380h Core Registers (Table 3-2) 30Bh Core Registers (Table 3-2) 38Bh 00Ch PORTA 08Ch TRISA 10Ch LATA 18Ch ANSELA 20Ch WPUA 28Ch ODCONA 30Ch SLRCONA 38Ch INLVLA 00Dh — 08Dh — 10Dh — 18Dh — 20Dh — 28Dh — 30Dh — 38Dh — 00Eh — 08Eh — 10Eh — 18Eh — 20Eh — 28Eh — 30Eh — 38Eh — 00Fh — 08Fh — 10Fh — 18Fh — 20Fh — 28Fh — 30Fh — 38Fh — 010h — 090h — 110h — 190h — 210h — 290h — 310h — 390h — 011h PIR1 091h PIE1 111h CM1CON0 191h PMADRL 211h — 291h — 311h — 391h IOCAP 012h PIR2 092h PIE2 112h CM1CON1 192h PMADRH 212h — 292h — 312h — 392h IOCAN 013h PIR3 093h PIE3 113h — 193h PMDATL 213h — 293h — 313h — 393h IOCAF 014h — 094h — 114h — 194h PMDATH 214h — 294h — 314h — 394h — 015h TMR0 095h OPTION_REG 115h CMOUT 195h PMCON1 215h — 295h — 315h — 395h — 016h TMR1L 096h PCON 116h BORCON 196h PMCON2 216h — 296h — 316h — 396h — 017h TMR1H 097h WDTCON 117h FVRCON 197h VREGCON(1) 217h — 297h — 317h — 397h — 018h T1CON 098h OSCTUNE 118h DAC1CON0 198h — 218h — 298h — 318h — 398h — 019h T1GCON 099h OSCCON 119h DAC1CON1 199h RCREG 219h — 299h — 319h — 399h — 01Ah TMR2 09Ah OSCSTAT 11Ah — 19Ah TXREG 21Ah — 29Ah — 31Ah — 39Ah — 01Bh PR2 09Bh ADRESL 11Bh — 19Bh SPBRG 21Bh — 29Bh — 31Bh — 39Bh — 01Ch T2CON 09Ch ADRESH 11Ch — 19Ch SPBRGH 21Ch — 29Ch — 31Ch — 39Ch — 01Dh — 09Dh ADCON0 11Dh APFCON 19Dh RCSTA 21Dh — 29Dh — 31Dh — 39Dh — 01Eh — 09Eh ADCON1 11Eh — 19Eh TXSTA 21Eh — 29Eh — 31Eh — 39Eh — 01Fh — 09Fh 0A0h ADCON2 11Fh — 19Fh BAUDCON 21Fh — 29Fh — 31Fh — 39Fh — 020h 2013-2015 Microchip Technology Inc. General Purpose Register 80 Bytes 06Fh General Purpose Register 80 Bytes 0EFh 0F0h 070h 0FFh 220h 1A0h General Purpose Register 80 Bytes 16Fh 170h Accesses 70h-7Fh Common RAM 07Fh 120h Unimplemented Read as ‘0’ 1EFh 1F0h Accesses 70h-7Fh 17Fh Legend: = Unimplemented data memory locations, read as ‘0’. Note 1: PIC12F1572 only. Unimplemented Read as ‘0’ 26Fh 270h Accesses 70h-7Fh 1FFh 2A0h Unimplemented Read as ‘0’ Unimplemented Read as ‘0’ Unimplemented Read as ‘0’ 3EFh 370h Accesses 70h-7Fh 2FFh 3A0h 36Fh 2EFh 2F0h Accesses 70h-7Fh 27Fh 320h 3F0h Accesses 70h-7Fh 37Fh Accesses 70h-7Fh 3FFh PIC12(L)F1571/2 DS40001723D-page 22 TABLE 3-4: 2013-2015 Microchip Technology Inc. TABLE 3-5: PIC12(L)F1571/2 MEMORY MAP, BANK 8-23 BANK 8 400h 40Bh 40Ch 40Dh 40Eh 40Fh 410h 411h 412h 413h 414h 415h 416h 417h 418h 419h 41Ah 41Bh 41Ch 41Dh 41Eh 41Fh 420h Core Registers (Table 3-2) — — — — — — — — — — — — — — — — — — — — BANK 9 480h 48Bh 48Ch 48Dh 48Eh 48Fh 490h 491h 492h 493h 494h 495h 496h 497h 498h 499h 49Ah 49Bh 49Ch 49Dh 49Eh 49Fh 4A0h Unimplemented Read as ‘0’ 46Fh 470h Core Registers (Table 3-2) — — — — — — — — — — — — — — — — — — — — 56Fh 570h 4FFh DS40001723D-page 23 80Bh 80Ch 88Bh 88Ch Unimplemented Read as ‘0’ 86Fh 870h Unimplemented Read as ‘0’ 8EFh 8F0h Accesses 70h-7Fh 87Fh Legend: 96Fh 970h Accesses 70h-7Fh 8FFh 9EFh 9F0h Accesses 70h-7Fh 97Fh = Unimplemented data memory locations, read as ‘0’. Accesses 70h-7Fh 9FFh A7Fh AFFh 7FFh BANK 23 B80h Core Registers (Table 3-2) B0Bh B0Ch Core Registers (Table 3-2) B8Bh B8Ch Unimplemented Read as ‘0’ B6Fh B70h Accesses 70h-7Fh Unimplemented Read as ‘0’ BEFh BF0h Accesses 70h-7Fh B7Fh — — — — — — — — — — — — — — — — — — — — Accesses 70h-7Fh BANK 22 Unimplemented Read as ‘0’ Core Registers (Table 3-2) Unimplemented Read as ‘0’ Accesses 70h-7Fh Core Registers (Table 3-2) Accesses 70h-7Fh 78Bh 78Ch 78Dh 78Eh 78Fh 790h 791h 792h 793h 794h 795h 796h 797h 798h 799h 79Ah 79Bh 79Ch 79Dh 79Eh 79Fh 7A0h 7EFh 7F0h B00h AEFh AF0h BANK 15 780h Unimplemented Read as ‘0’ BANK 21 A8Bh A8Ch A6Fh A70h — — — — — — — — — — — — — — — — — — — — 77Fh A80h Unimplemented Read as ‘0’ Core Registers (Table 3-2) 76Fh 770h 6FFh A0Bh A0Ch 70Bh 70Ch 70Dh 70Eh 70Fh 710h 711h 712h 713h 714h 715h 716h 717h 718h 719h 71Ah 71Bh 71Ch 71Dh 71Eh 71Fh 720h Accesses 70h-7Fh Core Registers (Table 3-2) Unimplemented Read as ‘0’ — — — — — CWG1DBR CWG1DBF CWG1CON0 CWG1CON1 CWG1CON2 — — — — — — — — — — BANK 14 700h Unimplemented Read as ‘0’ BANK 20 Core Registers (Table 3-2) Core Registers (Table 3-2) 6EFh 6F0h A00h 98Bh 98Ch 68Bh 68Ch 68Dh 68Eh 68Fh 690h 691h 692h 693h 694h 695h 696h 697h 698h 699h 69Ah 69Bh 69Ch 69Dh 69Eh 69Fh 6A0h Accesses 70h-7Fh BANK 19 Unimplemented Read as ‘0’ — — — — — — — — — — — — — — — — — — — — 67Fh 980h Core Registers (Table 3-2) Core Registers (Table 3-2) BANK 13 680h Unimplemented Read as ‘0’ Accesses 70h-7Fh BANK 18 90Bh 90Ch 60Bh 60Ch 60Dh 60Eh 60Fh 610h 611h 612h 613h 614h 615h 616h 617h 618h 619h 61Ah 61Bh 61Ch 61Dh 61Eh 61Fh 620h 66Fh 670h 5FFh 900h Core Registers (Table 3-2) — — — — — — — — — — — — — — — — — — — — BANK 12 600h Unimplemented Read as ‘0’ Accesses 70h-7Fh BANK 17 Core Registers (Table 3-2) 5EFh 5F0h 57Fh 880h Core Registers (Table 3-2 ) — — — — — — — — — — — — — — — — — — — — 58Bh 58Ch 58Dh 58Eh 58Fh 590h 591h 592h 593h 594h 595h 596h 597h 598h 599h 59Ah 59Bh 59Ch 59Dh 59Eh 59Fh 5A0h Unimplemented Read as ‘0’ Accesses 70h-7Fh BANK 16 Core Registers (Table 3-2) BANK 11 580h Accesses 70h-7Fh BFFh PIC12(L)F1571/2 Accesses 70h-7Fh 800h 50Bh 50Ch 50Dh 50Eh 50Fh 510h 511h 512h 513h 514h 515h 516h 517h 518h 519h 51Ah 51Bh 51Ch 51Dh 51Eh 51Fh 520h Unimplemented Read as ‘0’ 4EFh 4F0h 47Fh BANK 10 500h PIC12(L)F1571/2 MEMORY MAP, BANK 24-31 BANK 24 C00h BANK 25 Core Registers (Table 3-2) C0Bh C0Ch C0Dh C0Eh C0Fh C10h C11h C12h C13h C14h C15h C16h C17h C18h C19h C1Ah C1Bh C1Ch C1Dh C1Eh C1Fh C20h — — — — — — — — — — — — — — — — — — — — Core Registers (Table 3-2) C8Bh C8Ch C8Dh C8Eh C8Fh C90h C91h C92h C93h C94h C95h C96h C97h C98h C99h C9Ah C9Bh C9Ch C9Dh C9Eh C9Fh CA0h Unimplemented Read as ‘0’ 2013-2015 Microchip Technology Inc. C6Fh C70h Legend: — — — — — — — — — — — — — — — — — — — — CEFh CF0h D0Bh D0Ch D0Dh D0Eh D0Fh D10h D11h D12h D13h D14h D15h D16h D17h D18h D19h D1Ah D1Bh D1Ch D1Dh D1Eh D1Fh D20h — — — — — — — — — — — — — — — — — — — — BANK 28 E00h D8Bh D8Ch D6Fh D70h E0Bh E0Ch E0Dh E0Eh E0Fh E10h E11h E12h E13h E14h E15h E16h E17h See Table 3-7 for E18h Register Mapping E19h Details E1Ah E1Bh E1Ch E1Dh E1Eh E1Fh E20h Accesses 70h-7Fh = Unimplemented data memory locations, read as ‘0’. — — — — — — — — — — — — — — — — — — — — E6Fh E70h Accesses 70h-7Fh DFFh E8Bh E8Ch E8Dh E8Eh E8Fh E90h E91h E92h E93h E94h E95h E96h E97h E98h E99h E9Ah E9Bh E9Ch E9Dh E9Eh E9Fh EA0h — — — — — — — — — — — — — — — — — — — — EEFh EF0h F0Bh F0Ch F0Dh F0Eh F0Fh F10h F11h F12h F13h F14h F15h F16h F17h F18h F19h F1Ah F1Bh F1Ch F1Dh F1Eh F1Fh F20h — — — — — — — — — — — — — — — — — — — — Core Registers (Table 3-2) F8Bh F8Ch See Table 3-7 for Register Mapping Details Unimplemented Read as ‘0’ F6Fh F70h Accesses 70h-7Fh EFFh BANK 31 F80h Core Registers (Table 3-2) Unimplemented Read as ‘0’ Accesses 70h-7Fh E7Fh BANK 30 F00h Core Registers (Table 3-2) Unimplemented Read as ‘0’ DEFh DF0h D7Fh BANK 29 E80h Core Registers (Table 3-2) Core Registers (Table 3-2) Unimplemented Read as ‘0’ Accesses 70h-7Fh CFFh BANK 27 D80h Core Registers (Table 3-2) Unimplemented Read as ‘0’ Accesses 70h-7Fh CFFh BANK 26 D00h C80h FEFh FF0h Accesses 70h-7Fh F7Fh Accesses 70h-7Fh FFFh PIC12(L)F1571/2 DS40001723D-page 24 TABLE 3-6: PIC12(L)F1571/2 TABLE 3-7: PIC12(L)F1571/2 MEMORY MAP, BANK 27 TABLE 3-8: PIC12(L)F1571/2 MEMORY MAP, BANK 31 Bank 31 D8Ch D8Dh D8Eh D8Fh D90h D91h D92h D93h D94h D95h D96h D97h D98h D99h D9Ah D9Bh D9Ch D9Dh D9Eh D9Fh DA0h DA1h DA2h DA3h DA4h DA5h DA6h DA7h DA8h DA9h DAAh DABh DACh DADh DAEh DAFh DB0h DB1h DB2h DB3h DB4h DB5h DB6h DB7h DB8h DB9h DBAh DBBh DBCh DBDh DBEh DBFh DC0h — — PWMEN PWMLD PWMOUT PWM1PHL PWM1PHH PWM1DCL PWM1DCH PWM1PRL PWM1PRH PWM1OFL PWM1OFH PWM1TMRL PWM1TMRH PWM1CON PWM1INTE PWM1INTF PWM1CLKCON PWM1LDCON PWM1OFCON PWM2PHL PWM2PHH PWM2DCL PWM2DCH PWM2PRL PWM2PRH PWM2OFL PWM2OFH PWM2TMRL PWM2TMRH PWM2CON PWM2INTE PWM2INTF PWM2CLKCON PWM2LDCON PWM2OFCON PWM3PHL PWM3PHH PWM3DCL PWM3DCH PWM2PRL PWM3PRH PWM3OFL PWM3OFH PWM3TMRL PWM3TMRH PWM3CON PWM3INTE PWM3INTF PWM3CLKCON PWM3LDCON PWM3OFCON Bank 31 F8Ch Unimplemented Read as ‘0’ FE3h FE4h FE5h FE6h FE7h FE8h FE9h FEAh FEBh FECh FEDh FEEh FEFh Legend: STATUS_SHAD WREG_SHAD BSR_SHAD PCLATH_SHAD FSR0L_SHAD FSR0H_SHAD FSR1L_SHAD FSR1H_SHAD — STKPTR TOSL TOSH = Unimplemented data memory locations, read as ‘0’. DC1h — DEFh Legend: = Unimplemented data memory locations, read as ‘0’. 2013-2015 Microchip Technology Inc. DS40001723D-page 25 PIC12(L)F1571/2 3.3.6 CORE FUNCTION REGISTERS SUMMARY The Core Function registers listed in Table 3-9 can be addressed from any bank. TABLE 3-9: Addr Name CORE FUNCTION REGISTERS SUMMARY Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on POR, BOR Value on All Other Resets Bank 0-31 x00h or INDF0 x80h Addressing this location uses contents of FSR0H/FSR0L to address data memory (not a physical register) xxxx xxxx uuuu uuuu x01h or INDF1 x81h Addressing this location uses contents of FSR1H/FSR1L to address data memory (not a physical register) xxxx xxxx uuuu uuuu x02h or PCL x82h Program Counter (PC) Least Significant Byte 0000 0000 0000 0000 ---1 1000 ---q quuu x03h or STATUS x83h — — — TO PD Z DC C x04h or FSR0L x84h Indirect Data Memory Address 0 Low Pointer 0000 0000 uuuu uuuu x05h or FSR0H x85h Indirect Data Memory Address 0 High Pointer 0000 0000 0000 0000 x06h or FSR1L x86h Indirect Data Memory Address 1 Low Pointer 0000 0000 uuuu uuuu x07h or FSR1H x87h Indirect Data Memory Address 1 High Pointer 0000 0000 0000 0000 ---0 0000 ---0 0000 0000 0000 uuuu uuuu -000 0000 -000 0000 0000 0000 0000 0000 x08h or BSR x88h x09h or WREG x89h — — — BSR<4:0> Working Register x0Ah or PCLATH x8Ah — x0Bh or INTCON x8Bh GIE Write Buffer for the Upper 7 bits of the Program Counter PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF Legend: x = unknown; u = unchanged; q = value depends on condition; — = unimplemented, read as ‘0’; r = reserved. Shaded locations are unimplemented, read as ‘0’. DS40001723D-page 26 2013-2015 Microchip Technology Inc. PIC12(L)F1571/2 TABLE 3-10: Addr Name SPECIAL FUNCTION REGISTER SUMMARY Bit 7 Bit 6 — — Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on POR, BOR Value on All Other Resets Bank 0 00Ch PORTA RA<5:0> --xx xxxx --xx xxxx 00Dh — Unimplemented — — 00Eh — Unimplemented — — 00Fh — Unimplemented — — 010h — Unimplemented — — 011h PIR1 TMR1GIF 012h PIR2 — — 013h PIR3 — PWM3IF 014h — RCIF(2) ADIF TXIF(2) — — TMR2IF TMR1IF 0000 --00 0000 --00 C1IF — — — — — --0- ---- --0- ---- PWM2IF PWM1IF — — — — -000 ---- -000 ---- Unimplemented — — 015h TMR0 Holding Register for the 8-Bit Timer0 Count xxxx xxxx uuuu uuuu 016h TMR1L Holding Register for the Least Significant Byte of the 16-Bit TMR1 Count xxxx xxxx uuuu uuuu 017h TMR1H Holding Register for the Most Significant Byte of the 16-Bit TMR1 Count 018h T1CON 019h T1GCON TMR1CS<1:0> TMR1GE T1CKPS<1:0> T1GPOL 01Ah TMR2 Timer2 Module Register 01Bh PR2 Timer2 Period Register 01Ch T2CON T1GTM T1GSPM xxxx xxxx uuuu uuuu — T1SYNC T1GGO/ DONE T1GVAL — TMR1ON T1GSS<1:0> 0000 -0-0 uuuu -u-u 0000 0x00 uuuu uxuu 0000 0000 0000 0000 1111 1111 1111 1111 — T2OUTPS<3:0> TMR2ON T2CKPS<1:0> -000 0000 -000 0000 01Dh — Unimplemented — — 01Eh — Unimplemented — — 01Fh — Unimplemented — — Bank 1 08Ch TRISA — — TRISA<5:4> —(2) TRISA<2:0> --11 1111 --11 1111 08Dh — Unimplemented — — 08Eh — Unimplemented — — 08Fh — Unimplemented — — 090h — Unimplemented — — 091h PIE1 TMR1GIE 092h PIE2 — — 093h PIE3 — PWM3IE RCIE(2) ADIE TXIE(2) — — TMR2IE TMR1IE 0000 --00 0000 --00 C1IE — — — — — --0- ---- --0- ---- PWM2IE PWM1IE — — — — -000 ---- -000 ---- PSA 094h — 095h OPTION_REG WPUEN INTEDG TMR0CS TMR0SE 096h PCON STKOVF STKUNF — RWDT 097h WDTCON — — 098h OSCTUNE — — 099h OSCCON SPLLEN 09Ah OSCSTAT — 09Bh ADRESL ADC Result Register Low xxxx xxxx uuuu uuuu 09Ch ADRESH ADC Result Register High xxxx xxxx uuuu uuuu 09Dh ADCON0 — 09Eh ADCON1 ADFM 09Fh ADCON2 Legend: Note 1: 2: 3: Unimplemented — PS<2:0> RMCLR RI POR WDTPS<4:0> BOR 00-1 11qq qq-q qquu SWDTEN --01 0110 --01 0110 TUN<5:0> IRCF<3:0> PLLR OSTS HFIOFR MFIOFR CHS<4:0> ADCS<2:0> TRIGSEL<3:0> --00 0000 --00 0000 — HFIOFL SCS<1:0> LFIOFR GO/DONE — — — — — 1111 1111 1111 1111 0011 1-00 0011 1-00 HFIOFS ADON ADPREF<1:0> — — -0q0 0q00 -qqq qqqq -000 0000 -000 0000 0000 --00 0000 --00 0000 ---- 0000 ---- x = unknown; u = unchanged; q = value depends on condition; — = unimplemented; r = reserved. Shaded locations are unimplemented, read as ‘0’. PIC12F1571/2 only. PIC12(L)F1572 only. Unimplemented, read as ‘1’. 2013-2015 Microchip Technology Inc. DS40001723D-page 27 PIC12(L)F1571/2 TABLE 3-10: Addr SPECIAL FUNCTION REGISTER SUMMARY (CONTINUED) Name Bit 7 Bit 6 — — Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on POR, BOR Value on All Other Resets Bank 2 10Ch LATA LATA<5:4> — LATA<2:0> --xx -xxx --uu -uuu 10Dh — Unimplemented — — 10Eh — Unimplemented — — 10Fh — Unimplemented — — 110h — Unimplemented — — 111h CM1CON0 112h CM1CON1 C1ON C1OUT C1INTP C1INTN C1OE C1POL — C1PCH<1:0> C1SP — C1HYS C1SYNC C1NCH<2:0> 0000 -100 0000 -100 0000 -000 0000 -000 113h — Unimplemented — — 114h — Unimplemented — — 115h CMOUT — — — — — — — MC1OUT ---- ---0 ---- ---0 — — — BORRDY 10-- ---q uu-- ---u 116h BORCON SBOREN BORFS — — 117h FVRCON FVREN FVRRDY TSEN TSRNG CDAFVR<1:0> 118h DAC1CON0 DACEN — DACOE — DACPSS<1:0> 119h DAC1CON1 — — — 11Ah to 11Ch — ADFVR<1:0> — 0q00 0000 0q00 0000 — DACR<4:0> 0-0- 00-- 0-0- 00----0 0000 ---0 0000 Unimplemented — RXDTSEL CWGASEL CWGBSEL — 11Dh APFCON 11Eh — Unimplemented — — 11Fh — Unimplemented — — — T1GSEL TXCKSEL P2SEL P1SEL 000- 0000 000- 0000 Bank 3 18Ch ANSELA 18Dh — Unimplemented — — 18Eh — Unimplemented — — 18Fh — Unimplemented — — 190h — Unimplemented — — 191h PMADRL 192h PMADRH 193h PMDATL 194h PMDATH — — 195h PMCON1 —(3) CFGS 196h PMCON2 197h VREGCON(1) 198h — — — — ANSA4 — ANSA<2:0> ---1 -111 ---1 -111 Flash Program Memory Address Register Low Byte —(3) 0000 0000 0000 0000 Flash Program Memory Address Register High Byte 1000 0000 1000 0000 Flash Program Memory Read Data Register Low Byte xxxx xxxx uuuu uuuu Flash Program Memory Read Data Register High Byte LWLO FREE --xx xxxx --uu uuuu WRERR WREN WR RD — — VREGPM Reserved Flash Program Memory Control Register 2 — — — 1000 x000 1000 q000 0000 0000 0000 0000 — Unimplemented ---- --01 ---- --01 — — 199h RCREG USART Receive Data Register 0000 0000 0000 0000 19Ah TXREG USART Transmit Data Register 0000 0000 0000 0000 19Bh SPBRGL Baud Rate Generator Data Register Low 0000 0000 0000 0000 19Ch SPBRGH Baud Rate Generator Data Register High 19Dh RCSTA SPEN RX9 SREN CREN ADDEN FERR OERR RX9D 0000 000x 0000 000x 19Eh TXSTA CSRC TX9 TXEN SYNC SENDB BRGH TRMT TX9D 0000 0010 0000 0010 19Fh BAUDCON ABDOVF RCIDL — SCKP BRG16 — WUE ABDEN 01-0 0-00 01-0 0-00 Legend: Note 1: 2: 3: 0000 0000 0000 0000 x = unknown; u = unchanged; q = value depends on condition; — = unimplemented; r = reserved. Shaded locations are unimplemented, read as ‘0’. PIC12F1571/2 only. PIC12(L)F1572 only. Unimplemented, read as ‘1’. DS40001723D-page 28 2013-2015 Microchip Technology Inc. PIC12(L)F1571/2 TABLE 3-10: Addr Name SPECIAL FUNCTION REGISTER SUMMARY (CONTINUED) Bit 7 Bit 6 — — Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on POR, BOR Value on All Other Resets Bank 4 20Ch WPUA WPUA<5:0> --11 1111 --11 1111 20Dh — Unimplemented — — 20Eh to 21Fh — Unimplemented — — Bank 5 28Ch ODCONA 28Dh to 29Fh — — — ODA<5:4> — ODA<2:0> Unimplemented --11 -111 --11 -111 — — Bank 6 30Ch SLRCONA 30Dh to 31Fh — — — SLRA<5:4> — SLRA<2:0> Unimplemented --11 -111 --11 -111 — — Bank 7 38Ch INLVLA 38Dh to 390h — — — INLVLA<5:0> Unimplemented --11 1111 --11 1111 — — 391h IOCAP — — IOCAP<5:0> --00 0000 --00 0000 392h IOCAN — — IOCAN<5:0> --00 0000 --00 0000 393h IOCAF — — IOCAF<5:0> --00 0000 --00 0000 394h to 39Fh — Unimplemented — — — Unimplemented — — — Unimplemented — — Bank 8 40Ch to 41Fh Bank 9 48Ch to 49Fh Legend: Note 1: 2: 3: x = unknown; u = unchanged; q = value depends on condition; — = unimplemented; r = reserved. Shaded locations are unimplemented, read as ‘0’. PIC12F1571/2 only. PIC12(L)F1572 only. Unimplemented, read as ‘1’. 2013-2015 Microchip Technology Inc. DS40001723D-page 29 PIC12(L)F1571/2 TABLE 3-10: Addr SPECIAL FUNCTION REGISTER SUMMARY (CONTINUED) Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on POR, BOR Value on All Other Resets Bank 10 50Ch to 51Fh — Unimplemented — — — Unimplemented — — — Unimplemented — — — Unimplemented — — Bank 11 58Ch to 59Fh Bank 12 60Ch to 61Fh Bank 13 68Ch to 690h 691h CWG1DBR — — CWG1DBR<5:0> 692h CWG1DBF — — CWG1DBF<5:0> 693h CWG1CON0 G1EN G1OEB 694h CWG1CON1 695h CWG1CON2 696h to 69Fh G1ASDLB<1:0> G1ASE G1ARSEN G1OEA G1POLB G1POLA G1ASDLA<1:0> — — — — — --00 0000 --00 0000 --xx xxxx --xx xxxx — G1CS0 G1IS<2:0> G1ASDSC1 G1ASDSFLT 0000 0--0 0000 0--0 0000 -000 0000 -000 — 00-- -00- 00-- -00- — Unimplemented — — — Unimplemented — — Banks 14-26 x0Ch/ x8Ch — x1Fh/ x9Fh Legend: Note 1: 2: 3: x = unknown; u = unchanged; q = value depends on condition; — = unimplemented; r = reserved. Shaded locations are unimplemented, read as ‘0’. PIC12F1571/2 only. PIC12(L)F1572 only. Unimplemented, read as ‘1’. DS40001723D-page 30 2013-2015 Microchip Technology Inc. PIC12(L)F1571/2 TABLE 3-10: Addr SPECIAL FUNCTION REGISTER SUMMARY (CONTINUED) Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on POR, BOR Value on All Other Resets Bank 27 D8Ch — Unimplemented — — D8Dh — Unimplemented — — D8Eh PWMEN — — — — — D8Fh PWMLD — — — — — PWM3LDA_A PWM2LDA_A PWM1LDA_A ---- -000 ---- -000 D90h PWMOUT — — — — — PWM3OUT_A PWM2OUT_A PWM1OUT_A ---- -000 ---- -000 D91h PWM1PHL PH<7:0> xxxx xxxx uuuu uuuu D92h PWM1PHH PH<15:8> xxxx xxxx uuuu uuuu D93h PWM1DCL DC<7:0> xxxx xxxx uuuu uuuu D94h PWM1DCH DC<15:8> xxxx xxxx uuuu uuuu D95h PWM1PRL PR<7:0> xxxx xxxx uuuu uuuu D96h PWM1PRH PR<15:8> xxxx xxxx uuuu uuuu D97h PWM1OFL OF<7:0> xxxx xxxx uuuu uuuu D98h PWM1OFH OF<15:8> xxxx xxxx uuuu uuuu D99h PWM1TMRL TMR<7:0> xxxx xxxx uuuu uuuu D9Ah PWM1TMRH TMR<15:8> D9Bh PWM1CON PWM1EN D9Ch PWM1INTE — — — — PWM1OFIE D9Dh PWM1INTF — — — — D9Eh PWM1CLKCON — PWM1OE PWM1OUT PWM1POL PWM2EN_A PWM1EN_A ---- -000 ---- -000 xxxx xxxx uuuu uuuu PWM1MODE<1:0> — — PWM1PHIE PWM1DCIE PWM1PRIE ---- 000 ---- 000 PWM1OFIF PWM1PHIF PWM1DCIF PWM1PRIF ---- 000 ---- 000 — — — — PWM1OFO — PWM1PS<2:0> PWM1LDA PWM1LDT PWM3EN_A PWM1CS<1:0> -000 -000 -000 --00 — PWM1LDS<1:0> 00-- -000 00-- --00 — PWM1OFS<1:0> -000 -000 -000 --00 D9Fh PWM1LDCON DA0h PWM1OFCON DA1h PWM2PHL PH<7:0> xxxx xxxx uuuu uuuu DA2h PWM2PHH PH<15:8> xxxx xxxx uuuu uuuu DA3h PWM2DCL DC<7:0> xxxx xxxx uuuu uuuu DA4h PWM2DCH DC<15:8> xxxx xxxx uuuu uuuu DA5h PWM2PRL PR<7:0> xxxx xxxx uuuu uuuu DA6h PWM2PRH PR<15:8> xxxx xxxx uuuu uuuu DA7h PWM2OFL OF<7:0> xxxx xxxx uuuu uuuu DA8h PWM2OFH OF<15:8> xxxx xxxx uuuu uuuu DA9h PWM2TMRL TMR<7:0> xxxx xxxx uuuu uuuu DAAh PWM2TMRH TMR<15:8> — — 0000 00-- 0000 00-- PWM1OFM<1:0> DABh PWM2CON PWM2EN DACh PWM2INTE — — — — PWM2OFIE DADh PWM2INTF — — — — DAEh PWM2CLKCON — DAFh PWM2LDCON Legend: Note 1: 2: 3: PWM2OE PWM2OUT PWM2POL PWM2PS<2:0> PWM2LDA PWM2LDT — — xxxx xxxx uuuu uuuu PWM2MODE<1:0> — — PWM2PHIE PWM2DCIE PWM2PRIE ---- 000 ---- 000 PWM2OFIF PWM2PHIF PWM2DCIF PWM2PRIF ---- 000 ---- 000 — — PWM2CS<1:0> -000 -000 -000 --00 — — PWM2LDS<1:0> 00-- -000 00-- --00 0000 00-- 0000 00-- x = unknown; u = unchanged; q = value depends on condition; — = unimplemented; r = reserved. Shaded locations are unimplemented, read as ‘0’. PIC12F1571/2 only. PIC12(L)F1572 only. Unimplemented, read as ‘1’. 2013-2015 Microchip Technology Inc. DS40001723D-page 31 PIC12(L)F1571/2 TABLE 3-10: Addr SPECIAL FUNCTION REGISTER SUMMARY (CONTINUED) Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 — — Bit 1 Bit 0 Value on POR, BOR Value on All Other Resets Bank 27 (Continued) DB0h PWM2OFCON DB1h PWM3PHL — PWM2OFM<1:0> PWM2OFO PH<7:0> xxxx xxxx uuuu uuuu DB2h PWM3PHH PH<15:8> xxxx xxxx uuuu uuuu DB3h PWM3DCL DC<7:0> xxxx xxxx uuuu uuuu DB4h PWM3DCH DC<15:8> xxxx xxxx uuuu uuuu DB5h PWM3PRL PR<7:0> xxxx xxxx uuuu uuuu DB6h PWM3PRH PR<15:8> xxxx xxxx uuuu uuuu DB7h PWM3OFL OF<7:0> xxxx xxxx uuuu uuuu DA8h PWM3OFH OF<15:8> xxxx xxxx uuuu uuuu DA9h PWM3TMRL TMR<7:0> xxxx xxxx uuuu uuuu DBAh PWM3TMRH TMR<15:8> DBBh PWM3CON PWM3EN DBCh PWM3INTE — — — — PWM3OFIE DBDh PWM3INTF — — — — DBEh PWM3CLKCON — DBFh PWM3LDCON DC0h PWM3OFCON PWM3OE PWM3OUT PWM3POL — — PWM3OFM<1:0> -000 -000 -000 --00 xxxx xxxx uuuu uuuu — — PWM3PHIE PWM3DCIE PWM3PRIE ---- 000 ---- 000 PWM3OFIF PWM3PHIF PWM3DCIF PWM3PRIF ---- 000 ---- 000 — — — — PWM3OFO — PWM3PS<2:0> PWM3LDA PWM3LDT PWM2OFS<1:0> PWM3MODE<1:0> 0000 00-- 0000 00-- PWM3CS<1:0> -000 -000 -000 --00 — PWM3LDS<1:0> 00-- -000 00-- --00 — PWM3OFS<1:0> -000 -000 -000 --00 Bank 28-30 58Ch to 59Fh Legend: Note 1: 2: 3: — Unimplemented — — x = unknown; u = unchanged; q = value depends on condition; — = unimplemented; r = reserved. Shaded locations are unimplemented, read as ‘0’. PIC12F1571/2 only. PIC12(L)F1572 only. Unimplemented, read as ‘1’. DS40001723D-page 32 2013-2015 Microchip Technology Inc. PIC12(L)F1571/2 TABLE 3-10: Addr Name SPECIAL FUNCTION REGISTER SUMMARY (CONTINUED) Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on POR, BOR Value on All Other Resets — — Bank 31 F8Ch — FE3h — FE4h STATUS_ SHAD FE5h WREG_ SHAD FE6h BSR_ PCLATH_ SHAD FE8h FSR0L_ SHAD FE9h FSR0H_ SHAD FEAh FSR1L_ SHAD FEBh FSR1H_ SHAD FECh — FEDh STKPTR FEEh TOSL FEFh TOSH Legend: Note 1: 2: 3: — — — — — Z_SHAD Working Register Shadow — SHAD FE7h Unimplemented — — DC_SHAD C_SHAD ---- -xxx ---- -uuu xxxx xxxx uuuu uuuu — Bank Select Register Shadow Program Counter Latch High Register Shadow ---x xxxx ---u uuuu -xxx xxxx uuuu uuuu Indirect Data Memory Address 0 Low Pointer Shadow xxxx xxxx uuuu uuuu Indirect Data Memory Address 0 High Pointer Shadow xxxx xxxx uuuu uuuu Indirect Data Memory Address 1 Low Pointer Shadow xxxx xxxx uuuu uuuu Indirect Data Memory Address 1 High Pointer Shadow xxxx xxxx uuuu uuuu Unimplemented — — — — Top-of-Stack Low Byte — Top-of-Stack High Byte Current Stack Pointer — ---1 1111 ---1 1111 xxxx xxxx uuuu uuuu -xxx xxxx -uuu uuuu x = unknown; u = unchanged; q = value depends on condition; — = unimplemented; r = reserved. Shaded locations are unimplemented, read as ‘0’. PIC12F1571/2 only. PIC12(L)F1572 only. Unimplemented, read as ‘1’. 2013-2015 Microchip Technology Inc. DS40001723D-page 33 PIC12(L)F1571/2 3.4 PCL and PCLATH 3.4.2 The Program Counter (PC) is 15 bits wide. The low byte comes from the PCL register, which is a readable and writable register. The high byte (PC<14:8>) is not directly readable or writable and comes from PCLATH. On any Reset, the PC is cleared. Figure 3-4 shows the five situations for the loading of the PC. FIGURE 3-4: LOADING OF PC IN DIFFERENT SITUATIONS Rev. 10-000042A 7/30/2013 14 PCH PCL 0 PC 7 6 8 0 PCLATH Instruction with PCL as Destination ALU result 14 PCH PCL 0 PC 6 4 0 PCLATH GOTO, CALL 11 OPCODE <10:0> 14 PCH PCL 0 PC 6 7 0 PCLATH 14 PCH CALLW 8 W PCL 0 PCL 0 PC BRW 15 PC + W 14 PCH PC BRA 15 PC + OPCODE <8:0> 3.4.1 COMPUTED GOTO A computed GOTO is accomplished by adding an offset to the Program Counter (ADDWF PCL). When performing a table read using a computed GOTO method, care should be exercised if the table location crosses a PCL memory boundary (each 256-byte block). Refer to Application Note AN556, “Implementing a Table Read” (DS00556). 3.4.3 COMPUTED FUNCTION CALLs A computed function CALL allows programs to maintain tables of functions and provides another way to execute state machines or look-up tables. When performing a table read using a computed function CALL, care should be exercised if the table location crosses a PCL memory boundary (each 256-byte block). If using the CALL instruction, the PCH<2:0> and PCL registers are loaded with the operand of the CALL instruction. PCH<6:3> is loaded with PCLATH<6:3>. The CALLW instruction enables computed CALLs by combining PCLATH and W to form the destination address. A computed CALLW is accomplished by loading the W register with the desired address and executing CALLW. The PCL register is loaded with the value of W and PCH is loaded with PCLATH. 3.4.4 BRANCHING The branching instructions add an offset to the PC. This allows relocatable code and code that crosses page boundaries. There are two forms of branching, BRW and BRA. The PC will have incremented to fetch the next instruction in both cases. When using either branching instruction, a PCL memory boundary may be crossed. If using BRW, load the W register with the desired unsigned address and execute BRW. The entire PC will be loaded with the address, PC + 1 + W. If using BRA, the entire PC will be loaded with PC + 1 +, the signed value of the operand of the BRA instruction. MODIFYING PCL Executing any instruction with the PCL register as the destination simultaneously causes the Program Counter PC<14:8> bits (PCH) to be replaced by the contents of the PCLATH register. This allows the entire contents of the Program Counter to be changed by writing the desired upper seven bits to the PCLATH register. When the lower eight bits are written to the PCL register, all 15 bits of the Program Counter will change to the values contained in the PCLATH register and those being written to the PCL register. DS40001723D-page 34 2013-2015 Microchip Technology Inc. PIC12(L)F1571/2 3.5 Stack 3.5.1 All devices have a 16-level x 15-bit wide hardware stack (refer to Figures 3-5 through 3-8). The stack space is not part of either program or data space. The PC is PUSHed onto the stack when CALL or CALLW instructions are executed, or an interrupt causes a branch. The stack is POPed in the event of a RETURN, RETLW or RETFIE instruction execution. PCLATH is not affected by a PUSH or POP operation. The stack operates as a circular buffer if the STVREN bit is programmed to ‘0’ (Configuration Words). This means that after the stack has been PUSHed sixteen times, the seventeenth PUSH overwrites the value that was stored from the first PUSH. The eighteenth PUSH overwrites the second PUSH (and so on). The STKOVF and STKUNF flag bits will be set on an overflow/underflow, regardless of whether the Reset is enabled. Note 1: There are no instructions/mnemonics called PUSH or POP. These are actions that occur from the execution of the CALL, CALLW, RETURN, RETLW and RETFIE instructions or the vectoring to an interrupt address. FIGURE 3-5: ACCESSING THE STACK The stack is available through the TOSH, TOSL and STKPTR registers. STKPTR is the current value of the Stack Pointer. The TOSH:TOSL register pair points to the top of the stack. Both registers are read/writable. TOS is split into TOSH and TOSL due to the 15-bit size of the PC. To access the stack, adjust the value of STKPTR, which will position TOSH:TOSL, then read/write to TOSH:TOSL. The STKPTR is 5 bits to allow detection of overflow and underflow. Note: Care should be taken when modifying the STKPTR while interrupts are enabled. During normal program operation, CALL, CALLW and interrupts will increment STKPTR while RETLW, RETURN and RETFIE will decrement STKPTR. At any time, the STKPTR can be inspected to see how much stack is left. The STKPTR always points at the currently used place on the stack. Therefore, a CALL or CALLW will increment the STKPTR and then write the PC, and a return will unload the PC and then decrement the STKPTR. Reference Figure 3-5 through Figure 3-8 for examples of accessing the stack. ACCESSING THE STACK EXAMPLE 1 Rev. 10-000043A 7/30/2013 TOSH:TOSL 0x0F STKPTR = 0x1F Stack Reset Disabled (STVREN = 0) 0x0E 0x0D 0x0C 0x0B Initial Stack Configuration: 0x0A After Reset, the stack is empty. The empty stack is initialized so the Stack Pointer is pointing at 0x1F. If the Stack Overflow/Underflow Reset is enabled, the TOSH/TOSL register will return ‘0’. If the Stack Overflow/Underflow Reset is disabled, the TOSH/TOSL register will return the contents of stack address 0x0F. 0x09 0x08 0x07 0x06 0x05 0x04 0x03 0x02 0x01 0x00 TOSH:TOSL 2013-2015 Microchip Technology Inc. 0x1F 0x0000 STKPTR = 0x1F Stack Reset Enabled (STVREN = 1) DS40001723D-page 35 PIC12(L)F1571/2 FIGURE 3-6: ACCESSING THE STACK EXAMPLE 2 Rev. 10-000043B 7/30/2013 0x0F 0x0E 0x0D 0x0C 0x0B 0x0A This figure shows the stack configuration after the first CALL or a single interrupt. If a RETURN instruction is executed, the return address will be placed in the Program Counter and the Stack Pointer decremented to the empty state (0x1F). 0x09 0x08 0x07 0x06 0x05 0x04 0x03 0x02 0x01 0x00 TOSH:TOSL FIGURE 3-7: Return Address STKPTR = 0x00 ACCESSING THE STACK EXAMPLE 3 Rev. 10-000043C 7/30/2013 0x0F 0x0E 0x0D 0x0C After seven CALLs or six CALLs and an interrupt, the stack looks like the figure on the left. A series of RETURN instructions will repeatedly place the return addresses into the Program Counter and pop the stack. 0x0B 0x0A 0x09 0x08 0x07 TOSH:TOSL DS40001723D-page 36 0x06 Return Address 0x05 Return Address 0x04 Return Address 0x03 Return Address 0x02 Return Address 0x01 Return Address 0x00 Return Address STKPTR = 0x06 2013-2015 Microchip Technology Inc. PIC12(L)F1571/2 FIGURE 3-8: ACCESSING THE STACK EXAMPLE 4 Rev. 10-000043D 7/30/2013 TOSH:TOSL 3.5.2 0x0F Return Address 0x0E Return Address 0x0D Return Address 0x0C Return Address 0x0B Return Address 0x0A Return Address 0x09 Return Address 0x08 Return Address 0x07 Return Address 0x06 Return Address 0x05 Return Address 0x04 Return Address 0x03 Return Address 0x02 Return Address 0x01 Return Address 0x00 Return Address OVERFLOW/UNDERFLOW RESET If the STVREN bit in the Configuration Words is programmed to ‘1’, the device will be reset if the stack is PUSHed beyond the sixteenth level or POPed beyond the first level, setting the appropriate bits (STKOVF or STKUNF, respectively) in the PCON register. 3.6 When the stack is full, the next CALL or an interrupt will set the Stack Pointer to 0x10. This is identical to address 0x00 so the stack will wrap and overwrite the return address at 0x00. If the Stack Overflow/Underflow Reset is enabled, a Reset will occur and location 0x00 will not be overwritten. STKPTR = 0x10 Indirect Addressing The INDFn registers are not physical registers. Any instruction that accesses an INDFn register actually accesses the register at the address specified by the File Select Registers (FSR). If the FSRn address specifies one of the two INDFn registers, the read will return ‘0’ and the write will not occur (though Status bits may be affected). The FSRn register value is created by the pair, FSRnH and FSRnL. The FSR registers form a 16-bit address that allows an addressing space with 65536 locations. These locations are divided into three memory regions: • Traditional Data Memory • Linear Data Memory • Program Flash Memory 2013-2015 Microchip Technology Inc. DS40001723D-page 37 PIC12(L)F1571/2 FIGURE 3-9: INDIRECT ADDRESSING Rev. 10-000044A 7/30/2013 0x0000 0x0000 Traditional Data Memory 0x0FFF 0x1000 0x0FFF Reserved 0x1FFF 0x2000 Linear Data Memory 0x29AF 0x29B0 Reserved FSR Address Range 0x7FFF 0x8000 0x0000 Program Flash Memory 0xFFFF Note: 0x7FFF Not all memory regions are completely implemented. Consult device memory tables for memory limits. DS40001723D-page 38 2013-2015 Microchip Technology Inc. PIC12(L)F1571/2 3.6.1 TRADITIONAL DATA MEMORY The traditional data memory is a region from FSR address, 0x000, to FSR address, 0xFFF. The addresses correspond to the absolute addresses of all SFR, GPR and common registers. FIGURE 3-10: TRADITIONAL DATA MEMORY MAP Rev. 10-000056A 7/31/2013 Direct Addressing 4 BSR 0 Indirect Addressing From Opcode 6 0 Bank Select 7 FSRxH 0 0 0 0 Location Select 0x00 00000 Bank Select 00001 00010 11111 Bank 0 Bank 1 Bank 2 Bank 31 0 7 FSRxL 0 Location Select 0x7F 2013-2015 Microchip Technology Inc. DS40001723D-page 39 PIC12(L)F1571/2 3.6.2 LINEAR DATA MEMORY The linear data memory is the region from FSR address, 0x2000, to FSR address, 0x29AF. This region is a virtual region that points back to the 80-byte blocks of GPR memory in all the banks. Unimplemented memory reads as 0x00. Use of the linear data memory region allows buffers to be larger than 80 bytes because incrementing the FSR beyond one bank will go directly to the GPR memory of the next bank. The 16 bytes of common memory are not included in the linear data memory region. FIGURE 3-11: LINEAR DATA MEMORY MAP 3.6.3 PROGRAM FLASH MEMORY To make constant data access easier, the entire Program Flash Memory is mapped to the upper half of the FSR address space. When the MSb of FSRnH is set, the lower 15 bits are the address in program memory which will be accessed through INDF. Only the lower eight bits of each memory location are accessible via INDF. Writing to the Program Flash Memory cannot be accomplished via the FSR/INDF interface. All instructions that access Program Flash Memory via the FSR/INDF interface will require one additional instruction cycle to complete. FIGURE 3-12: PROGRAM FLASH MEMORY MAP Rev. 10-000057A 7/31/2013 7 FSRnH 0 0 1 0 Location Select 7 FSRnL Rev. 10-000058A 7/31/2013 7 1 0 FSRnH 0 Location Select 0x2000 7 FSRnL 0 0x8000 0x020 Bank 0 0x06F 0x0A0 Bank 1 0x0EF Program Flash Memory (low 8 bits) 0x120 Bank 2 0x16F 0x29AF DS40001723D-page 40 0xF20 Bank 30 0xF6F 0x0000 0xFFFF 0x7FFF 2013-2015 Microchip Technology Inc. PIC12(L)F1571/2 4.0 DEVICE CONFIGURATION Device configuration consists of Configuration Words, code protection and Device ID. 4.1 Configuration Words Note: The DEBUG bit in the Configuration Words is managed automatically by device development tools, including debuggers and programmers. For normal device operation, this bit should be maintained as a ‘1’. There are several Configuration Word bits that allow different oscillator and memory protection options. These are implemented as Configuration Word 1 at 8007h and Configuration Word 2 at 8008h. 2013-2015 Microchip Technology Inc. DS40001723D-page 41 PIC12(L)F1571/2 4.2 Register Definitions: Configuration Words REGISTER 4-1: CONFIG1: CONFIGURATION WORD 1 U-1 U-1 — — R/P-1 CLKOUTEN R/P-1 R/P-1 BOREN<1:0> U-1 (1) — bit 13 R/P-1 (2) CP R/P-1 MCLRE bit 8 R/P-1 PWRTE R/P-1 (1) R/P-1 WDTE<1:0> U-1 R/P-1 — R/P-1 FOSC<1:0> bit 7 bit 0 Legend: R = Readable bit P = Programmable bit U = Unimplemented bit, read as ‘1’ ‘0’ = Bit is cleared ‘1’ = Bit is set n = Value when blank or after bulk erase bit 13-12 Unimplemented: Read as ‘1’ bit 11 CLKOUTEN: Clock Out Enable bit 1 = Off – CLKOUT function is disabled; I/O or oscillator function on CLKOUT pin 0 = On – CLKOUT function is enabled on CLKOUT pin bit 10-9 BOREN<1:0>: Brown-out Reset Enable bits(1) 11 = On – Brown-out Reset is enabled; the SBOREN bit is ignored 10 = Sleep – Brown-out Reset is enabled while running and disabled in Sleep; the SBOREN bit is ignored 01 = SBODEN – Brown-out Reset is controlled by the SBOREN bit in the BORCON register 00 = Off – Brown-out Reset is disabled; the SBOREN bit is ignored bit 8 Unimplemented: Read as ‘1’ bit 7 CP: Flash Program Memory Code Protection bit(2) 1 = Off – Code protection is off; program memory can be read and written 0 = On – Code protection is on; program memory cannot be read or written externally bit 6 MCLRE: MCLR/VPP Pin Function Select bit If LVP bit = 1 (On): This bit is ignored. MCLR/VPP pin function is MCLR; weak pull-up is enabled. If LVP bit = 0 (Off): 1 = On – MCLR/VPP pin function is MCLR; weak pull-up is enabled 0 = Off – MCLR/VPP pin function is a digital input, MCLR is internally disabled; weak pull-up is under control of pin’s WPU control bit bit 5 PWRTE: Power-up Timer Enable bit(1) 1 = Off – PWRT is disabled 0 = On – PWRT is enabled bit 4-3 WDTE<1:0>: Watchdog Timer Enable bits 11 = On – WDT is enabled; SWDTEN is ignored 10 = Sleep – WDT is enabled while running and disabled in Sleep; SWDTEN is ignored 01 = SWDTEN – WDT is controlled by the SWDTEN bit in the WDTCON register 00 = Off – WDT is disabled; SWDTEN is ignored bit 2 Unimplemented: Read as ‘1’ bit 1-0 FOSC<1:0>: Oscillator Selection bits 11 = ECH – External Clock, High-Power mode: CLKI on CLKI 10 = ECM – External Clock, Medium Power mode: CLKI on CLKI – External Clock, Low-Power mode: CLKI on CLKI 01 = ECL 00 = INTOSC – I/O function on CLKI Note 1: 2: Enabling Brown-out Reset does not automatically enable the Power-up Timer. Once enabled, code-protect can only be disabled by bulk erasing the device. DS40001723D-page 42 2013-2015 Microchip Technology Inc. PIC12(L)F1571/2 REGISTER 4-2: CONFIG2: CONFIGURATION WORD 2 R/P-1 (1) LVP R/P-1 DEBUG R/P-1 (2) LPBOREN R/P-1 (3) BORV R/P-1 R/P-1 STVREN PLLEN bit 13 bit 8 U-1 U-1 U-1 U-1 U-1 U-1 — — — — — — R/P-1 R/P-1 WRT<1:0> bit 7 bit 0 Legend: R = Readable bit P = Programmable bit U = Unimplemented bit, read as ‘1’ ‘0’ = Bit is cleared ‘1’ = Bit is set n = Value when blank or after bulk erase bit 13 LVP: Low-Voltage Programming Enable bit(1) 1 = On – Low-voltage programming is enabled, MCLR/VPP pin function is MCLR; MCLRE Configuration bit is ignored 0 = Off – High voltage on MCLR/VPP must be used for programming bit 12 DEBUG: Debugger Mode bit(2) 1 = Off – In-Circuit Debugger is disabled; ICSPCLK and ICSPDAT are general purpose I/O pins 0 = On – In-Circuit Debugger is enabled; ICSPCLK and ICSPDAT are dedicated to the debugger bit 11 LPBOREN: Low-Power Brown-out Reset Enable bit 1 = Off – Low-power Brown-out Reset is disabled 0 = On – Low-power Brown-out Reset is enabled bit 10 BORV: Brown-out Reset Voltage Selection bit(3) 1 = Low – Brown-out Reset voltage (VBOR), low trip point selected 0 = High – Brown-out Reset voltage (VBOR), high trip point selected bit 9 STVREN: Stack Overflow/Underflow Reset Enable bit 1 = On – Stack overflow or underflow will cause a Reset 0 = Off – Stack overflow or underflow will not cause a Reset bit 8 PLLEN: PLL Enable bit 1 = On – 4xPLL is enabled 0 = Off – 4xPLL is disabled bit 7-2 Unimplemented: Read as ‘1’ bit 1-0 WRT<1:0>: Flash Memory Self-Write Protection bits 2 kW Flash Memory (PIC12F1572): 11 = Off – Write protection is off 10 = Boot – 000h to 1FFh is write-protected, 200h to 7FFh may be modified by PMCON control 01 = Half – 000h to 3FFh is write-protected, 400h to 7FFh may be modified by PMCON control 00 = All – 000h to 7FFh is write-protected, no addresses may be modified by PMCON control 1 kW Flash Memory (PIC12(L)F1571): 11 = Off – Write protection is off 10 = Boot – 000h to 0FFh is write-protected, 100h to 3FFh may be modified by PMCON control 01 = Half – 000h to 1FFh is write-protected, 200h to 3FFh may be modified by PMCON control 00 = All – 000h to 3FFh is write-protected, no addresses may be modified by PMCON control Note 1: 2: 3: This bit cannot be programmed to ‘0’ when programming mode is entered via LVP. The DEBUG bit in Configuration Words is managed automatically by device development tools, including debuggers and programmers. For normal device operation, this bit should be maintained as a ‘1’. See VBOR parameter for specific trip point voltages. 2013-2015 Microchip Technology Inc. DS40001723D-page 43 PIC12(L)F1571/2 4.3 Code Protection Code protection allows the device to be protected from unauthorized access. Internal access to the program memory is unaffected by any code protection setting. 4.3.1 PROGRAM MEMORY PROTECTION The entire program memory space is protected from external reads and writes by the CP bit in the Configuration Words. When CP = 0, external reads and writes of program memory are inhibited and a read will return all ‘0’s. The CPU can continue to read program memory, regardless of the protection bit settings. Writing the program memory is dependent upon the write protection setting. See Section 4.4 “Write Protection” for more information. 4.4 Write Protection Write protection allows the device to be protected from unintended self-writes. Applications, such as bootloader software, can be protected while allowing other regions of the program memory to be modified. 4.5 User ID Four memory locations (8000h-8003h) are designated as ID locations where the user can store checksum or other code identification numbers. These locations are readable and writable during normal execution. See Section 10.4 “User ID, Device ID and Configuration Word Access” for more information on accessing these memory locations. For more information on checksum calculation, see the “PIC12(L)F1571/2 Memory Programming Specification” (DS40001713). 4.6 Device ID and Revision ID The 14-bit Device ID word is located at 8006h and the 14-bit Revision ID is located at 8005h. These locations are read-only and cannot be erased or modified. See Section 10.4 “User ID, Device ID and Configuration Word Access” for more information on accessing these memory locations. Development tools, such as device programmers and debuggers, may be used to read the Device ID and Revision ID. The WRT<1:0> bits in the Configuration Words define the size of the program memory block that is protected. DS40001723D-page 44 2013-2015 Microchip Technology Inc. PIC12(L)F1571/2 4.7 Register Definitions: Device ID DEVICEID: DEVICE ID REGISTER(1) REGISTER 4-3: R R R R R R DEV<13:8> bit 13 R R bit 8 R R R R R R DEV<7:0> bit 7 bit 0 Legend: R = Readable bit ‘0’ = Bit is cleared bit 13-0 x = Bit is unknown ‘1’ = Bit is set DEV<13:0>: Device ID bits Refer to Table 4-1 to determine what these bits will read on which device. A value of 3FFFh is invalid. Note 1: This location cannot be written. REVISIONID: REVISION ID REGISTER(1) REGISTER 4-4: R R R R R R REV<13:8> bit 13 R R bit 8 R R R R R R REV<7:0> bit 7 bit 0 Legend: R = Readable bit ‘0’ = Bit is cleared bit 13-0 ‘1’ = Bit is set x = Bit is unknown REV<13:0>: Revision ID bits These bits are used to identify the device revision. Note 1: This location cannot be written. TABLE 4-1: DEVICE ID VALUES DEVICE Device ID Revision ID PIC12F1571 3051h 2xxxh PIC12LF1571 3053h 2xxxh PIC12F1572 3050h 2xxxh PIC12LF1572 3052h 2xxxh 2013-2015 Microchip Technology Inc. DS40001723D-page 45 PIC12(L)F1571/2 NOTES: DS40001723D-page 46 2013-2015 Microchip Technology Inc. PIC12(L)F1571/2 5.0 OSCILLATOR MODULE The oscillator module can be configured in one of the following clock modes: 5.1 Overview 1. The oscillator module has a wide variety of clock sources and selection features that allow it to be used in a wide range of applications, while maximizing performance and minimizing power consumption. Figure 5-1 illustrates a block diagram of the oscillator module. Clock sources can be supplied from external oscillators, quartz crystal resonators, ceramic resonators and Resistor-Capacitor (RC) circuits. In addition, the system clock source can be supplied from one of two internal oscillators and PLL circuits, with a choice of speeds selectable via software. Additional clock features include: • Selectable system clock source between external or internal sources via software • Oscillator Start-up Timer (OST) ensures stability of crystal oscillator sources 2013-2015 Microchip Technology Inc. 2. 3. 4. ECL – External Clock Low-Power mode (0 MHz to 0.5 MHz) ECM – External Clock Medium Power mode (0.5 MHz to 4 MHz) ECH – External Clock High-Power mode (4 MHz to 32 MHz) INTOSC – Internal Oscillator (31 kHz to 32 MHz) Clock Source modes are selected by the FOSC<1:0> bits in the Configuration Words. The FOSC bits determine the type of oscillator that will be used when the device is first powered. The ECH, ECM, and ECL Clock modes rely on an external logic level signal as the device clock source. The INTOSC internal oscillator block produces low, medium and high-frequency clock sources, designated as LFINTOSC, MFINTOSC and HFINTOSC (see Internal Oscillator Block, Figure 5-1). A wide selection of device clock frequencies may be derived from these three clock sources. DS40001723D-page 47 PIC12(L)F1571/2 SIMPLIFIED PIC® MCU CLOCK SOURCE BLOCK DIAGRAM FIGURE 5-1: Rev. 10-000155A 10/11/2013 FOSC<1:0> 01 Reserved 2 CLKIN 0 INTOSC PLLEN FOSC(1) 00 1 4x PLL(2) Sleep to CPU and Peripherals 1x SPLLEN 2 16 MHz SCS<1:0> 8 MHz 4 MHz 500 kHz Oscillator MFINTOSC(1) 2 MHz Prescaler HFPLL 16 MHz HFINTOSC(1) 1 MHz *500 kHz *250 kHz *125 kHz 62.5 kHz *31.25 kHz *31 kHz Internal Oscillator Block 4 IRCF<3:0> 31 kHz Oscillator 600 kHz Oscillator LFINTOSC(1) FRC(1) to WDT, PWRT, and other Peripherals to Peripherals to ADC and other Peripherals * Available with more than one IRCF selection Note 1: 2: 3: See Section 5.2 “Clock Source Types”. ST Buffer is high-speed type when using T1CKI. If FOSC<1:0> = 00, 4x PLL can only be used if IRCF<3:0> = 1110. DS40001723D-page 48 2013-2015 Microchip Technology Inc. PIC12(L)F1571/2 5.2 Clock Source Types Clock sources can be classified as external or internal. External clock sources rely on external circuitry for the clock source to function. Internal clock sources are contained within the oscillator module. The internal oscillator block has two internal oscillators and a dedicated Phase-Locked Loop (HFPLL) that are used to generate three internal system clock sources: the 16 MHz High-Frequency Internal Oscillator (HFINTOSC), 500 kHz Medium Frequency Internal Oscillator (MFINTOSC) and the 31 kHz Low-Frequency Internal Oscillator (LFINTOSC). The system clock can be selected between external or internal clock sources via the System Clock Select (SCS<1:0>) bits in the OSCCON register. See Section 5.3 “Clock Switching” for additional information. 5.2.1 EXTERNAL CLOCK SOURCES An external clock source can be used as the device system clock by performing one of the following actions: • Program the FOSC<1:0> bits in the Configuration Words to select an external clock source that will be used as the default system clock upon a device Reset. • Write the SCS<1:0> bits in the OSCCON register to switch the system clock source to: - Timer1 oscillator during run time, or - An external clock source determined by the value of the FOSCx bits. See Section 5.3 “Clock Switching” for more information. 2013-2015 Microchip Technology Inc. 5.2.1.1 EC Mode The External Clock (EC) mode allows an externally generated logic level signal to be the system clock source. When operating in this mode, an external clock source is connected to the CLKIN input. CLKOUT is available for general purpose I/Os or CLKOUT. Figure 5-2 shows the pin connections for EC mode. EC mode has three power modes to select from through the FOSCx bits in the Configuration Words: • ECH – High power, 4-20 MHz • ECM – Medium power, 0.5-4 MHz • ECL – Low power, 0-0.5 MHz The Oscillator Start-up Timer (OST) is disabled when EC mode is selected. Therefore, there is no delay in operation after a Power-on Reset (POR) or wake-up from Sleep. Because the PIC® MCU design is fully static, stopping the external clock input will have the effect of halting the device while leaving all data intact. Upon restarting the external clock, the device will resume operation as if no time had elapsed. FIGURE 5-2: Clock from Ext. System EXTERNAL CLOCK (EC) MODE OPERATION CLKIN PIC® MCU FOSC/4 or I/O(1) Note 1: CLKOUT Output depends upon CLKOUTEN bit of the Configuration Words. DS40001723D-page 49 PIC12(L)F1571/2 5.2.2 INTERNAL CLOCK SOURCES The device may be configured to use the internal oscillator block as the system clock by performing one of the following actions: • Program the FOSC<1:0> bits in the Configuration Words to select the INTOSC clock source, which will be used as the default system clock upon a device Reset. • Write the SCS<1:0> bits in the OSCCON register to switch the system clock source to the internal oscillator during run time. See Section 5.3 “Clock Switching”for more information. In INTOSC mode, CLKIN is available for general purpose I/O. CLKOUT is available for general purpose I/O or CLKOUT. The function of the OSC2/CLKOUT pin is determined by the CLKOUTEN bit in the Configuration Words. The internal oscillator block has two independent oscillators and a dedicated Phase-Locked Loop, HFPLL, that can produce one of three internal system clock sources. 1. 2. 3. The HFINTOSC (High-Frequency Internal Oscillator) is factory calibrated and operates at 16 MHz. The HFINTOSC source is generated from the 500 kHz MFINTOSC source and the dedicated Phase-Locked Loop, HFPLL. The frequency of the HFINTOSC can be user-adjusted via software using the OSCTUNE register (Register 5-3). The MFINTOSC (Medium Frequency Internal Oscillator) is factory calibrated and operates at 500 kHz. The frequency of the MFINTOSC can be user-adjusted via software using the OSCTUNE register (Register 5-3). The LFINTOSC (Low-Frequency Internal Oscillator) is uncalibrated and operates at 31 kHz. 5.2.2.1 HFINTOSC The High-Frequency Internal Oscillator (HFINTOSC) is a factory calibrated 16 MHz internal clock source. The frequency of the HFINTOSC can be altered via software using the OSCTUNE register (Register 5-3). The output of the HFINTOSC connects to a postscaler and multiplexer (see Figure 5-1). One of multiple frequencies derived from the HFINTOSC can be selected via software using the IRCF<3:0> bits of the OSCCON register. See Section 5.2.2.8 “Internal Oscillator Clock Switch Timing” for more information. The HFINTOSC is enabled by: • Configuring the IRCF<3:0> bits of the OSCCON register for the desired HF frequency, and • Setting FOSC<1:0> = 00, or • Setting the System Clock Source x (SCSx) bits of the OSCCON register to ‘1x’. A fast start-up oscillator allows internal circuits to power up and stabilize before switching to HFINTOSC. The High-Frequency Internal Oscillator Ready bit (HFIOFR) of the OSCSTAT register indicates when the HFINTOSC is running. The High-Frequency Internal Oscillator Status Locked bit (HFIOFL) of the OSCSTAT register indicates when the HFINTOSC is running within 2% of its final value. The High-Frequency Internal Oscillator Stable bit (HFIOFS) of the OSCSTAT register indicates when the HFINTOSC is running within 0.5% of its final value. 5.2.2.2 MFINTOSC The Medium Frequency Internal Oscillator (MFINTOSC) is a factory calibrated 500 kHz internal clock source. The frequency of the MFINTOSC can be altered via software using the OSCTUNE register (Register 5-3). The output of the MFINTOSC connects to a postscaler and multiplexer (see Figure 5-1). One of nine frequencies derived from the MFINTOSC can be selected via software using the IRCF<3:0> bits of the OSCCON register. See Section 5.2.2.8 “Internal Oscillator Clock Switch Timing” for more information. The MFINTOSC is enabled by: • Configuring the IRCF<3:0> bits of the OSCCON register for the desired HF frequency, and • Setting FOSC<1:0> = 00, or • Setting the System Clock Source x (SCSx) bits of the OSCCON register to ‘1x’ The Medium Frequency Internal Oscillator Ready bit (MFIOFR) of the OSCSTAT register indicates when the MFINTOSC is running. DS40001723D-page 50 2013-2015 Microchip Technology Inc. PIC12(L)F1571/2 5.2.2.3 Internal Oscillator Frequency Adjustment The 500 kHz internal oscillator is factory calibrated. This internal oscillator can be adjusted in software by writing to the OSCTUNE register (Register 5-3). Since the HFINTOSC and MFINTOSC clock sources are derived from the 500 kHz internal oscillator, a change in the OSCTUNE register value will apply to both. The default value of the OSCTUNE register is ‘0’. The value is a 6-bit two’s complement number. A value of 1Fh will provide an adjustment to the maximum frequency. A value of 20h will provide an adjustment to the minimum frequency. When the OSCTUNE register is modified, the oscillator frequency will begin shifting to the new frequency. Code execution continues during this shift. There is no indication that the shift has occurred. OSCTUNE does not affect the LFINTOSC frequency. Operation of features that depends on the LFINTOSC clock source frequency, such as the Power-up Timer (PWRT), Watchdog Timer (WDT) and peripherals, are not affected by the change in frequency. 5.2.2.4 LFINTOSC The Low-Frequency Internal Oscillator (LFINTOSC) is an uncalibrated 31 kHz internal clock source. The output of the LFINTOSC connects to a multiplexer (see Figure 5-1). Select 31 kHz, via software, using the IRCF<3:0> bits of the OSCCON register. See Section 5.2.2.8 “Internal Oscillator Clock Switch Timing” for more information. The LFINTOSC is also the frequency for the Power-up Timer (PWRT), Watchdog Timer (WDT) and Fail-Safe Clock Monitor (FSCM). The LFINTOSC is enabled by selecting 31 kHz (IRCF<3:0> (OSCCON<6:3>) = 0000) as the system clock source (SCS<1:0> (OSCCON<1:0>) = 1x) or when any of the following are enabled: • Configure the IRCF<3:0> bits of the OSCCON register for the desired LF frequency, and • Set FOSC<1:0> = 00, or • Set the System Clock Source x (SCSx) bits of the OSCCON register to ‘1x’ Peripherals that use the LFINTOSC are: • Power-up Timer (PWRT) • Watchdog Timer (WDT) 5.2.2.5 FRC The FRC clock is an uncalibrated, nominal 600 kHz peripheral clock source. The FRC is automatically turned on by the peripherals requesting the FRC clock. The FRC clock will continue to run during Sleep. 5.2.2.6 Internal Oscillator Frequency Selection The system clock speed can be selected via software using the Internal Oscillator Frequency Select bits IRCF<3:0> of the OSCCON register. The postscaler outputs of the 16 MHz HFINTOSC, 500 kHz MFINTOSC and 31 kHz LFINTOSC output connect to a multiplexer (see Figure 5-1). The Internal Oscillator Frequency Select bits, IRCF<3:0> of the OSCCON register, select the frequency output of the internal oscillators. One of the following frequencies can be selected via software: • • • • • • • • • • • • 32 MHz (requires 4x PLL) 16 MHz 8 MHz 4 MHz 2 MHz 1 MHz 500 kHz (default after Reset) 250 kHz 125 kHz 62.5 kHz 31.25 kHz 31 kHz (LFINTOSC) Note: Following any Reset, the IRCF<3:0> bits of the OSCCON register are set to ‘0111’ and the frequency selection is set to 500 kHz. The user can modify the IRCFx bits to select a different frequency. The IRCF<3:0> bits of the OSCCON register allow duplicate selections for some frequencies. These duplicate choices can offer system design trade-offs. Lower power consumption can be obtained when changing oscillator sources for a given frequency. Faster transition times can be obtained between frequency changes that use the same oscillator source. The Low-Frequency Internal Oscillator Ready bit (LFIOFR) of the OSCSTAT register indicates when the LFINTOSC is running. 2013-2015 Microchip Technology Inc. DS40001723D-page 51 PIC12(L)F1571/2 5.2.2.7 32 MHz Internal Oscillator Frequency Selection The internal oscillator block can be used with the 4x PLL associated with the external oscillator block to produce a 32 MHz internal system clock source. The following settings are required to use the 32 MHz internal clock source: • The FOSCx bits in the Configuration Words must be set to use the INTOSC source as the device system clock (FOSC<1:0> = 00). • The SCSx bits in the OSCCON register must be cleared to use the clock determined by FOSC<1:0> in the Configuration Words (SCS<1:0> = 00). • The IRCFx bits in the OSCCON register must be set to the 8 MHz HFINTOSC to use (IRCF<3:0> = 1110). • The SPLLEN bit in the OSCCON register must be set to enable the 4x PLL or the PLLEN bit of the Configuration Words must be programmed to a ‘1’. Note: When using the PLLEN bit of the Configuration Words, the 4x PLL cannot be disabled by software and the 8 MHz HFINTOSC option will no longer be available. The 4x PLL is not available for use with the internal oscillator when the SCSx bits of the OSCCON register are set to ‘1x’. The SCSx bits must be set to ‘00’ to use the 4x PLL with the internal oscillator. DS40001723D-page 52 5.2.2.8 Internal Oscillator Clock Switch Timing When switching between the HFINTOSC, MFINTOSC and the LFINTOSC, the new oscillator may already be shut down to save power (see Figure 5-3). If this is the case, there is a delay after the IRCF<3:0> bits of the OSCCON register are modified before the frequency selection takes place. The OSCSTAT register will reflect the current active status of the HFINTOSC, MFINTOSC and LFINTOSC oscillators. The sequence of a frequency selection is as follows: 1. 2. 3. 4. 5. 6. 7. IRCF<3:0> bits of the OSCCON register are modified. If the new clock is shut down, a clock start-up delay is started. Clock switch circuitry waits for a falling edge of the current clock. The current clock is held low and the clock switch circuitry waits for a rising edge in the new clock. The new clock is now active. The OSCSTAT register is updated as required. Clock switch is complete. See Figure 5-3 for more details. If the internal oscillator speed is switched between two clocks of the same source, there is no start-up delay before the new frequency is selected. Clock switching time delays are shown in Table 5-1. Start-up delay specifications are located in the oscillator tables of Section 26.0 “Electrical Specifications”. 2013-2015 Microchip Technology Inc. PIC12(L)F1571/2 FIGURE 5-3: INTERNAL OSCILLATOR SWITCH TIMING HFINTOSC/ MFINTOSC LFINTOSC (WDT disabled) HFINTOSC/ MFINTOSC Oscillator Delay(1) 2-Cycle Sync Running LFINTOSC 0 IRCF<3:0> =0 System Clock LFINTOSC (WDT enabled) HFINTOSC/ MFINTOSC HFINTOSC/ MFINTOSC 2-Cycle Sync Running LFINTOSC 0 IRCF <3:0> =0 System Clock LFINTOSC HFINTOSC/MFINTOSC LFINTOSC Turns Off unless WDT is Enabled LFINTOSC Oscillator Delay(1) HFINTOSC/ MFINTOSC IRCF <3:0> =0 2-Cycle Sync Running 0 System Clock Note 1: See Table 5-1 (Oscillator Switching Delays) for more information. 2013-2015 Microchip Technology Inc. DS40001723D-page 53 PIC12(L)F1571/2 5.3 Clock Switching 5.4 The system clock source can be switched between external and internal clock sources via software using the System Clock Select (SCSx) bits of the OSCCON register. The following clock sources can be selected using the SCSx bits: When clock switching from an old clock to a new clock is requested, just prior to entering Sleep mode, it is necessary to confirm that the switch is complete before the SLEEP instruction is executed. Failure to do so may result in an incomplete switch and consequential loss of the system clock altogether. Clock switching is confirmed by monitoring the clock status bits in the OSCSTAT register. Switch confirmation can be accomplished by sensing that the ready bit for the new clock is set or the ready bit for the old clock is cleared. For example, when switching between the internal oscillator with the PLL and the internal oscillator without the PLL, monitor the PLLR bit. When PLLR is set, the switch to 32 MHz operation is complete. Conversely, when PLLR is cleared, the switch from 32 MHz operation to the selected internal clock is complete. • Default system oscillator determined by FOSCx bits in the Configuration Words • Timer1 32 kHz crystal oscillator • Internal Oscillator Block (INTOSC) 5.3.1 Clock Switching Before Sleep SYSTEM CLOCK SELECT (SCSx) BITS The System Clock Select (SCSx) bits of the OSCCON register select the system clock source that is used for the CPU and peripherals. • When the SCSx bits of the OSCCON register = 00, the system clock source is determined by the value of the FOSC<1:0> bits in the Configuration Words. • When the SCSx bits of the OSCCON register = 01, the system clock source is the Timer1 oscillator. • When the SCSx bits of the OSCCON register = 1x, the system clock source is chosen by the internal oscillator frequency selected by the IRCF<3:0> bits of the OSCCON register. After a Reset, the SCSx bits of the OSCCON register are always cleared. Note: Any automatic clock switch does not update the SCSx bits of the OSCCON register. The user can monitor the OSTS bit of the OSCSTAT register to determine the current system clock source. When switching between clock sources, a delay is required to allow the new clock to stabilize. These oscillator delays are shown in Table 5-1. TABLE 5-1: OSCILLATOR SWITCHING DELAYS Switch From Switch To Frequency Oscillator Delay Sleep/POR LFINTOSC(1) MFINTOSC(1) HFINTOSC(1) 31 kHz 31.25 kHz-500 kHz 31.25 kHz-16 MHz Sleep/POR EC(1) DC – 32 MHz 2 cycles LFINTOSC EC(1) DC – 32 MHz 1 cycle of each Any Clock Source MFINTOSC(1) HFINTOSC(1) 31.25 kHz-500 kHz 31.25 kHz-16 MHz 2 s (approx.) Any Clock Source LFINTOSC(1) 31 kHz 1 cycle of each PLL Inactive PLL Active 16-32 MHz 2 ms (approx.) Note 1: 2: Oscillator Warm-up Delay (TWARM)(2) PLL inactive. See Section 26.0 “Electrical Specifications”. DS40001723D-page 54 2013-2015 Microchip Technology Inc. PIC12(L)F1571/2 5.5 Register Definitions: Oscillator Control REGISTER 5-1: R/W-0/0 OSCCON: OSCILLATOR CONTROL REGISTER R/W-0/0 R/W-1/1 SPLLEN R/W-1/1 R/W-1/1 U-0 IRCF<3:0> R/W-0/0 — R/W-0/0 SCS<1:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit u = Bit is unchanged x = Bit is unknown U = Unimplemented bit, read as ‘0’ ‘1’ = Bit is set ‘0’ = Bit is cleared -n/n = Value at POR and BOR/Value at all other Resets bit 7 SPLLEN: Software PLL Enable bit If PLLEN in Configuration Words = 1: SPLLEN bit is ignored. 4x PLL is always enabled (subject to oscillator requirements). If PLLEN in Configuration Words = 0: 1 = 4x PLL Is enabled 0 = 4x PLL is disabled bit 6-3 IRCF<3:0>: Internal Oscillator Frequency Select bits 1111 = 16 MHz HF 1110 = 8 MHz or 32 MHz HF (see Section 5.2.2.1 “HFINTOSC”) 1101 = 4 MHz HF 1100 = 2 MHz HF 1011 = 1 MHz HF 1010 = 500 kHz HF(1) 1001 = 250 kHz HF(1) 1000 = 125 kHz HF(1) 0111 = 500 kHz MF (default upon Reset) 0110 = 250 kHz MF 0101 = 125 kHz MF 0100 = 62.5 kHz MF 0011 = 31.25 kHz HF(1) 0010 = 31.25 kHz MF 000x = 31 kHz LF bit 2 Unimplemented: Read as ‘0’ bit 1-0 SCS<1:0>: System Clock Select bits 1x = Internal oscillator block 01 = Timer1 oscillator 00 = Clock determined by FOSC<1:0> in Configuration Words Note 1: Duplicate frequency derived from HFINTOSC. 2013-2015 Microchip Technology Inc. DS40001723D-page 55 PIC12(L)F1571/2 REGISTER 5-2: OSCSTAT: OSCILLATOR STATUS REGISTER U-0 R-0/q R-q/q R-0/q R-0/q R-q/q R-0/q R-0/q — PLLR OSTS HFIOFR HFIOFL MFIOFR LFIOFR HFIOFS bit 7 bit 0 Legend: R = Readable bit W = Writable bit q = Conditional bit u = Bit is unchanged x = Bit is unknown U = Unimplemented bit, read as ‘0’ ‘1’ = Bit is set ‘0’ = Bit is cleared -n/n = Value at POR and BOR/Value at all other Resets bit 7 Unimplemented: Read as ‘0’ bit 6 PLLR 4x PLL Ready bit 1 = 4x PLL is ready 0 = 4x PLL is not ready bit 5 OSTS: Oscillator Start-up Timer Status bit 1 = Running from the clock defined by the FOSC<1:0> bits of the Configuration Words 0 = Running from an internal oscillator (FOSC<1:0> = 00) bit 4 HFIOFR: High-Frequency Internal Oscillator Ready bit 1 = HFINTOSC is ready 0 = HFINTOSC is not ready bit 3 HFIOFL: High-Frequency Internal Oscillator Locked bit 1 = HFINTOSC is at least 2% accurate 0 = HFINTOSC is not 2% accurate bit 2 MFIOFR: Medium Frequency Internal Oscillator Ready bit 1 = MFINTOSC is ready 0 = MFINTOSC is not ready bit 1 LFIOFR: Low-Frequency Internal Oscillator Ready bit 1 = LFINTOSC is ready 0 = LFINTOSC is not ready bit 0 HFIOFS: High-Frequency Internal Oscillator Stable bit 1 = HFINTOSC is at least 0.5% accurate 0 = HFINTOSC is not 0.5% accurate DS40001723D-page 56 2013-2015 Microchip Technology Inc. PIC12(L)F1571/2 REGISTER 5-3: OSCTUNE: OSCILLATOR TUNING REGISTER U-0 U-0 — — R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 TUN<5:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit u = Bit is unchanged x = Bit is unknown U = Unimplemented bit, read as ‘0’ ‘1’ = Bit is set ‘0’ = Bit is cleared -n/n = Value at POR and BOR/Value at all other Resets bit 7-6 Unimplemented: Read as ‘0’ bit 5-0 TUN<5:0>: Frequency Tuning bits 100000 = Minimum frequency • • • 111111 = 000000 = Oscillator module is running at the factory-calibrated frequency 000001 = • • • 011110 = 011111 = Maximum frequency TABLE 5-2: SUMMARY OF REGISTERS ASSOCIATED WITH CLOCK SOURCES Name Bit 7 Bit 6 Bit 5 OSTS OSCCON SPLLEN OSCSTAT — PLLR OSCTUNE — — T1CON TMR1CS<1:0> Bit 4 Bit 3 Bit 2 HFIOFL MFIOFR — IRCF<3:0> HFIOFR Bit 1 Bit 0 SCS<1:0> 55 LFIOFR HFIOFS 56 — TMR1ON 167 TUN<5:0> T1CKPS<1:0> — Register on Page 57 T1SYNC Legend: — = unimplemented location, read as ‘0’. Shaded cells are not used by clock sources. TABLE 5-3: Name CONFIG1 SUMMARY OF CONFIGURATION WORD WITH CLOCK SOURCES Bits Bit -/7 Bit -/6 Bit 13/5 Bit 12/4 Bit 11/3 — CLKOUTEN 13:8 — — — 7:0 CP MCLRE PWRTE WDTE<1:0> Bit 10/2 Bit 9/1 Bit 8/0 BOREN<1:0> — — FOSC<1:0> Register on Page 42 Legend: — = unimplemented location, read as ‘0’. Shaded cells are not used by clock sources. 2013-2015 Microchip Technology Inc. DS40001723D-page 57 PIC12(L)F1571/2 NOTES: DS40001723D-page 58 2013-2015 Microchip Technology Inc. PIC12(L)F1571/2 6.0 RESETS There are multiple ways to reset this device: • • • • • • • • • Power-on Reset (POR) Brown-out Reset (BOR) Low-Power Brown-out Reset (LPBOR) MCLR Reset WDT Reset RESET instruction Stack Overflow Stack Underflow Programming mode exit FIGURE 6-1: To allow VDD to stabilize, an optional Power-up Timer can be enabled to extend the Reset time after a BOR or POR event. A simplified block diagram of the On-Chip Reset Circuit is shown in Figure 6-1. SIMPLIFIED BLOCK DIAGRAM OF ON-CHIP RESET CIRCUIT Rev. 10-000006A 8/14/2013 ICSP™ Programming Mode Exit RESET Instruction Stack Underflow Stack Overlfow MCLRE VPP/MCLR Sleep WDT Time-out Device Reset Power-on Reset VDD BOR Active(1) Brown-out Reset LPBOR Reset Note 1: R LFINTOSC Power-up Timer PWRTE See Table 6-1 for BOR active conditions. 2013-2015 Microchip Technology Inc. DS40001723D-page 59 PIC12(L)F1571/2 6.1 Power-on Reset (POR) 6.2 Brown-out Reset (BOR) The POR circuit holds the device in Reset until VDD has reached an acceptable level for minimum operation. Slow rising VDD, fast operating speeds or analog performance may require greater than minimum VDD. The PWRT, BOR or MCLR features can be used to extend the start-up period until all device operation conditions have been met. The BOR circuit holds the device in Reset when VDD reaches a selectable minimum level. Between the POR and BOR, complete voltage range coverage for execution protection can be implemented. 6.1.1 • • • • POWER-UP TIMER (PWRT) The Power-up Timer provides a nominal 64 ms time-out on a POR or Brown-out Reset. The device is held in Reset as long as PWRT is active. The PWRT delay allows additional time for the VDD to rise to an acceptable level. The Power-up Timer is enabled by clearing the PWRTE bit in the Configuration Words. The Power-up Timer starts after the release of the POR and BOR. For additional information, refer to Application Note AN607, “Power-up Trouble Shooting” (DS00000607). TABLE 6-1: The Brown-out Reset module has four operating modes controlled by the BOREN<1:0> bits in the Configuration Words. The four operating modes are: BOR is always on BOR is off when in Sleep BOR is controlled by software BOR is always off Refer to Table 6-1 for more information. The Brown-out Reset voltage level is selectable by configuring the BORV bit in the Configuration Words. A VDD noise rejection filter prevents the BOR from triggering on small events. If VDD falls below VBOR for a duration greater than parameter, TBORDC, the device will reset. See Figure 6-2 for more information. BOR OPERATING MODES BOREN<1:0> SBOREN Device Mode BOR Mode Instruction Execution upon: Release of POR or Wake-up from Sleep 11 X X Active Waits for BOR ready(1) (BORRDY = 1) 10 X Awake Active Sleep Disabled 1 X Active 0 X Disabled X X Disabled 01 00 Note 1: Waits for BOR ready (BORRDY = 1) Waits for BOR ready(1) (BORRDY = 1) Begins immediately (BORRDY = x) In these specific cases, “release of POR” and “wake-up from Sleep”, there is no delay in start-up. The BOR ready flag (BORRDY = 1) will be set before the CPU is ready to execute instructions because the BOR circuit is forced on by the BOREN<1:0> bits. DS40001723D-page 60 2013-2015 Microchip Technology Inc. PIC12(L)F1571/2 6.2.1 BOR IS ALWAYS ON BOR protection is not active during Sleep. The device wake-up will be delayed until the BOR is ready. When the BORENx bits of the Configuration Words are programmed to ‘11’, the BOR is always on. The device start-up will be delayed until the BOR is ready and VDD is higher than the BOR threshold. 6.2.3 When the BORENx bits of the Configuration Words are programmed to ‘01’, the BOR is controlled by the SBOREN bit of the BORCON register. The device start-up is not delayed by the BOR ready condition or the VDD level. BOR protection is active during Sleep. The BOR does not delay wake-up from Sleep. 6.2.2 BOR IS OFF IN SLEEP BOR protection begins as soon as the BOR circuit is ready. The status of the BOR circuit is reflected in the BORRDY bit of the BORCON register. When the BORENx bits of the Configuration Words are programmed to ‘10’, the BOR is on, except in Sleep. The device start-up will be delayed until the BOR is ready and VDD is higher than the BOR threshold. FIGURE 6-2: BOR protection is unchanged by Sleep. BROWN-OUT SITUATIONS VDD Internal Reset VBOR TPWRT(1) VDD Internal Reset VBOR < TPWRT TPWRT(1) VDD Internal Reset Note 1: BOR CONTROLLED BY SOFTWARE VBOR TPWRT(1) TPWRT delay only if PWRTE bit is programmed to ‘0’. 2013-2015 Microchip Technology Inc. DS40001723D-page 61 PIC12(L)F1571/2 6.3 Register Definitions: BOR Control REGISTER 6-1: BORCON: BROWN-OUT RESET CONTROL REGISTER R/W-1/u R/W-0/u U-0 U-0 U-0 U-0 U-0 R-q/u SBOREN BORFS(1) — — — — — BORRDY bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared q = Value depends on condition bit 7 SBOREN: Software Brown-out Reset Enable bit If BOREN<1:0> in Configuration Words = 01: 1 = BOR is enabled 0 = BOR is disabled If BOREN <1:0> in Configuration Words 01: SBOREN is read/write, but has no effect on the BOR. bit 6 BORFS: Brown-out Reset Fast Start bit(1) If BOREN <1:0> = 10 (Disabled in Sleep) or BOREN<1:0> = 01 (Under software control): 1 = Band gap is forced on always (covers Sleep/wake-up/operating cases) 0 = Band gap operates normally and may turn off If BOREN<1:0> = 11 (Always On) or BOREN<1:0> = 00 (Always Off): BORFS is read/write, but has no effect on the BOR. bit 5-1 Unimplemented: Read as ‘0’ bit 0 BORRDY: Brown-out Reset Circuit Ready Status bit 1 = The Brown-out Reset circuit is active 0 = The Brown-out Reset circuit is inactive Note 1: BOREN<1:0> bits are located in the Configuration Words. DS40001723D-page 62 2013-2015 Microchip Technology Inc. PIC12(L)F1571/2 6.4 Low-Power Brown-out Reset (LPBOR) The Low-Power Brown-out Reset (LPBOR) operates like the BOR to detect low-voltage conditions on the VDD pin. When too low of a voltage is detected, the device is held in Reset. When this occurs, a register bit (BOR) is changed to indicate that a BOR Reset has occurred. The BOR bit in PCON is used for both BOR and the LPBOR. Refer to Register 6-2. The LPBOR Voltage Threshold (VLPBOR) has a wider tolerance than the BOR (VBOR), but requires much less current (LPBOR current) to operate. The LPBOR is intended for use when the BOR is configured as disabled (BOREN<1:0> = 00) or disabled in Sleep mode (BOREN<1:0> = 10). Refer to Figure 6-1 to see how the LPBOR interacts with other modules. 6.4.1 ENABLING LPBOR The LPBOR is controlled by the LPBOR bit of the Configuration Words. When the device is erased, the LPBOR module defaults to disabled. The MCLR is an optional external input that can reset the device. The MCLR function is controlled by the MCLRE and LVP bits of the Configuration Words (Table 6-2). TABLE 6-2: MCLR CONFIGURATION MCLRE LVP MCLR 0 0 Disabled 1 0 Enabled x 1 Enabled 6.5.1 MCLR ENABLED When MCLR is enabled and the pin is held low, the device is held in Reset. The MCLR pin is connected to VDD through an internal weak pull-up. The device has a noise filter in the MCLR Reset path. The filter will detect and ignore small pulses. Note: 6.5.2 Watchdog Timer (WDT) Reset The Watchdog Timer generates a Reset if the firmware does not issue a CLRWDT instruction within the time-out period. The TO and PD bits in the STATUS register are changed to indicate the WDT Reset. See Section 9.0 “Watchdog Timer (WDT)” for more information. 6.7 RESET Instruction A RESET instruction will cause a device Reset. The RI bit in the PCON register will be set to ‘0’. See Table 6-4 for default conditions after a RESET instruction has occurred. 6.8 Stack Overflow/Underflow Reset The device can reset when the Stack overflows or underflows. The STKOVF or STKUNF bits of the PCON register indicate the Reset condition. These Resets are enabled by setting the STVREN bit in the Configuration Words. See Section 3.5.2 “Overflow/Underflow Reset” for more information. 6.9 MCLR 6.5 6.6 A Reset does not drive the MCLR pin low. MCLR DISABLED When MCLR is disabled, the pin functions as a general purpose input and the internal weak pull-up is under software control. See Section 11.3 “PORTA Registers” for more information. 2013-2015 Microchip Technology Inc. Programming Mode Exit Upon exit of Programming mode, the device will behave as if a POR had just occurred. 6.10 Power-up Timer The Power-up Timer optionally delays device execution after a BOR or POR event. This timer is typically used to allow VDD to stabilize before allowing the device to start running. The Power-up Timer is controlled by the PWRTE bit of the Configuration Words. 6.11 Start-up Sequence Upon the release of a POR or BOR, the following must occur before the device will begin executing: 1. 2. Power-up Timer runs to completion (if enabled). MCLR must be released (if enabled). The total time-out will vary based on oscillator configuration and Power-up Timer configuration. See Section 5.0 “Oscillator Module” for more information. The Power-up Timer runs independently of a MCLR Reset. If MCLR is kept low long enough, the Power-up Timer will expire. Upon bringing MCLR high, the device will begin execution after 10 FOSC cycles (see Figure 6-3). This is useful for testing purposes or to synchronize more than one device operating in parallel. DS40001723D-page 63 PIC12(L)F1571/2 FIGURE 6-3: RESET START-UP SEQUENCE Rev. 10-000032A 7/30/2013 VDD Internal POR TPWRT Power-up Timer MCLR Internal RESET Int. Oscillator FOSC Begin Execution code execution (1) Internal Oscillator, PWRTEN = 0 code execution (1) Internal Oscillator, PWRTEN = 1 VDD Internal POR TPWRT Power-up Timer MCLR Internal RESET Ext. Clock (EC) FOSC Begin Execution code execution (1) External Clock (EC modes), PWRTEN = 0 code execution (1) External Clock (EC modes), PWRTEN = 1 VDD Internal POR TPWRT Power-up Timer MCLR Internal RESET Osc Start-Up Timer TOST TOST Ext. Oscillator FOSC Begin Execution code execution (1) External Oscillators , PWRTEN = 0, IESO = 0 code execution (1) External Oscillators , PWRTEN = 1, IESO = 0 VDD Internal POR TPWRT Power-up Timer MCLR Internal RESET Osc Start-Up Timer TOST TOST Ext. Oscillator Int. Oscillator FOSC Begin Execution code execution (1) External Oscillators , PWRTEN = 0, IESO = 1 Note 1: code execution (1) External Oscillators , PWRTEN = 1, IESO = 1 Code execution begins 10 FOSC cycles after the FOSC clock is released. DS40001723D-page 64 2013-2015 Microchip Technology Inc. PIC12(L)F1571/2 6.12 Determining the Cause of a Reset Upon any Reset, multiple bits in the STATUS and PCON registers are updated to indicate the cause of the Reset. Table 6-3 and Table 6-4 show the Reset conditions of these registers. TABLE 6-3: RESET STATUS BITS AND THEIR SIGNIFICANCE STKOVF STKUNF RWDT RMCLR RI POR BOR TO PD Condition 0 0 1 1 1 0 x 1 1 Power-on Reset 0 0 1 1 1 0 x 0 x Illegal, TO is Set on POR 0 0 1 1 1 0 x x 0 Illegal, PD is Set on POR 0 0 u 1 1 u 0 1 1 Brown-out Reset u u 0 u u u u 0 u WDT Reset u u u u u u u 0 0 WDT Wake-up from Sleep u u u u u u u 1 0 Interrupt Wake-up from Sleep u u u 0 u u u u u MCLR Reset during Normal Operation u u u 0 u u u 1 0 MCLR Reset during Sleep u u u u 0 u u u u RESET Instruction Executed 1 u u u u u u u u Stack Overflow Reset (STVREN = 1) u 1 u u u u u u u Stack Underflow Reset (STVREN = 1) TABLE 6-4: RESET CONDITION FOR SPECIAL REGISTERS Program Counter STATUS Register PCON Register Power-on Reset 0000h ---1 1000 00-- 110x MCLR Reset during normal operation 0000h ---u uuuu uu-- 0uuu MCLR Reset during Sleep 0000h ---1 0uuu uu-- 0uuu WDT Reset 0000h ---0 uuuu uu-- uuuu WDT Wake-up from Sleep PC + 1 ---0 0uuu uu-- uuuu Condition Brown-out Reset 0000h ---1 1uuu 00-- 11u0 PC + 1(1) ---1 0uuu uu-- uuuu RESET Instruction Executed 0000h ---u uuuu uu-- u0uu Stack Overflow Reset (STVREN = 1) 0000h ---u uuuu 1u-- uuuu Stack Underflow Reset (STVREN = 1) 0000h ---u uuuu u1-- uuuu Interrupt Wake-up from Sleep Legend: u = unchanged; x = unknown; - = unimplemented bit, reads as ‘0’. Note 1: When the wake-up is due to an interrupt and the Global Interrupt Enable bit (GIE) is set, the return address is pushed on the stack and the PC is loaded with the interrupt vector (0004h) after execution of PC + 1. 2013-2015 Microchip Technology Inc. DS40001723D-page 65 PIC12(L)F1571/2 6.13 Power Control (PCON) Register The Power Control (PCON) register contains flag bits to differentiate between a: • • • • • • • Power-on Reset (POR) Brown-out Reset (BOR) RESET Instruction Reset (RI) MCLR Reset (RMCLR) Watchdog Timer Reset (RWDT) Stack Underflow Reset (STKUNF) Stack Overflow Reset (STKOVF) The PCON register bits are shown in Register 6-2. 6.14 Register Definitions: Power Control REGISTER 6-2: PCON: POWER CONTROL REGISTER R/W/HS-0/q R/W/HS-0/q STKOVF STKUNF U-0 R/W/HC-1/q R/W/HC-1/q R/W/HC-1/q R/W/HC-q/u R/W/HC-q/u — RWDT RMCLR RI POR BOR bit 7 bit 0 Legend: HC = Hardware Clearable bit HS = Hardware Settable bit R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared q = Value depends on condition bit 7 STKOVF: Stack Overflow Reset Flag bit 1 = A Stack Overflow Reset occurred 0 = A Stack Overflow Reset has not occurred or is cleared by firmware bit 6 STKUNF: Stack Underflow Reset Flag bit 1 = A Stack Underflow Reset occurred 0 = A Stack Underflow Reset has not occurred or is cleared by firmware bit 5 Unimplemented: Read as ‘0’ bit 4 RWDT: Watchdog Timer Reset Flag bit 1 = A Watchdog Timer Reset has not occurred or is set by firmware 0 = A Watchdog Timer Reset has occurred (cleared by hardware) bit 3 RMCLR: MCLR Reset Flag bit 1 = A MCLR Reset has not occurred or is set by firmware 0 = A MCLR Reset has occurred (cleared by hardware) bit 2 RI: RESET Instruction Flag bit 1 = A RESET instruction has not been executed or set by firmware 0 = A RESET instruction has been executed (cleared by hardware) bit 1 POR: Power-on Reset Status bit 1 = No Power-on Reset occurred 0 = A Power-on Reset occurred (must be set in software after a Power-on Reset occurs) bit 0 BOR: Brown-out Reset Status bit 1 = No Brown-out Reset occurred 0 = A Brown-out Reset occurred (must be set in software after a Power-on Reset or Brown-out Reset occurs) DS40001723D-page 66 2013-2015 Microchip Technology Inc. PIC12(L)F1571/2 TABLE 6-5: SUMMARY OF REGISTERS ASSOCIATED WITH RESETS Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register on Page BORCON SBOREN BORFS — — — — — BORRDY 62 PCON STKOVF STKUNF — RWDT RMCLR RI POR BOR 66 STATUS — — — TO PD Z DC WDTCON — — WDTPS<4:0> C 19 SWDTEN 89 Legend: — = unimplemented bit, reads as ‘0’. Shaded cells are not used by Resets. Note 1: Other (non Power-up) Resets include MCLR Reset and Watchdog Timer Reset during normal operation. TABLE 6-6: Name CONFIG1 CONFIG2 Bits SUMMARY OF CONFIGURATION WORD WITH RESETS Bit -/7 Bit -/6 Bit 13/5 Bit 12/4 Bit 11/3 — — — CLKOUTEN Bit 10/2 13:8 — 7:0 CP 13:8 — — LVP DEBUG LPBOR BORV 7:0 — — — — — — MCLRE PWRTE WDTE<1:0> Bit 9/1 BOREN<1:0> — Bit 8/0 — FOSC<1:0> STVREN PLLEN WRT<1:0> Register on Page 42 43 Legend: — = unimplemented location, read as ‘0’. Shaded cells are not used by Resets. 2013-2015 Microchip Technology Inc. DS40001723D-page 67 PIC12(L)F1571/2 NOTES: DS40001723D-page 68 2013-2015 Microchip Technology Inc. PIC12(L)F1571/2 7.0 INTERRUPTS Many peripherals produce interrupts. Refer to the corresponding chapters for details. The interrupt feature allows certain events to preempt normal program flow. Firmware is used to determine the source of the interrupt and act accordingly. Some interrupts can be configured to wake the MCU from Sleep mode. A block diagram of the interrupt logic is shown in Figure 7-1. This chapter contains the following information for interrupts: • • • • • Operation Interrupt Latency Interrupts during Sleep INT Pin Automatic Context Saving FIGURE 7-1: INTERRUPT LOGIC Rev. 10-000010A 1/13/2014 TMR0IF TMR0IE Peripheral Interrupts (TMR1IF) PIR1<0> (TMR1IE) PIE1<0> Wake-up (If in Sleep mode) INTF INTE IOCIF IOCIE Interrupt to CPU PEIE PIRn<7> PIEn<7> 2013-2015 Microchip Technology Inc. GIE DS40001723D-page 69 PIC12(L)F1571/2 7.1 Operation Interrupts are disabled upon any device Reset. They are enabled by setting the following bits: • GIE bit of the INTCON register • Interrupt enable bit(s) for the specific interrupt event(s) • PEIE bit of the INTCON register (if the interrupt enable bit of the interrupt event is contained in the PIE1, PIE2 and PIE3 registers) The RETFIE instruction exits the ISR by popping the previous address from the stack, restoring the saved context from the shadow registers and setting the GIE bit. For additional information on a specific interrupt’s operation, refer to its peripheral chapter. Note 1: Individual interrupt flag bits are set, regardless of the state of any other enable bits. 2: All interrupts will be ignored while the GIE bit is cleared. Any interrupt occurring while the GIE bit is clear will be serviced when the GIE bit is set again. The INTCON, PIR1, PIR2 and PIR3 registers record individual interrupts via interrupt flag bits. Interrupt flag bits will be set, regardless of the status of the GIE, PEIE and individual interrupt enable bits. The following events happen when an interrupt event occurs while the GIE bit is set: 7.2 • Current prefetched instruction is flushed • GIE bit is cleared • Current Program Counter (PC) is pushed onto the stack • Critical registers are automatically saved to the shadow registers (See “Section 7.5 “Automatic Context Saving”.”) • PC is loaded with the interrupt vector, 0004h Interrupt latency is defined as the time from when the interrupt event occurs to the time code execution at the interrupt vector begins. The latency for synchronous interrupts is three or four instruction cycles. For asynchronous interrupts, the latency is three to five instruction cycles, depending on when the interrupt occurs. See Figure 7-2 and Figure 7-3 for more details. Interrupt Latency The firmware within the Interrupt Service Routine (ISR) should determine the source of the interrupt by polling the interrupt flag bits. The interrupt flag bits must be cleared before exiting the ISR to avoid repeated interrupts. Because the GIE bit is cleared, any interrupt that occurs while executing the ISR will be recorded through its interrupt flag, but will not cause the processor to redirect to the interrupt vector. DS40001723D-page 70 2013-2015 Microchip Technology Inc. PIC12(L)F1571/2 FIGURE 7-2: INTERRUPT LATENCY Fosc Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 CLKR Interrupt Sampled during Q1 Interrupt GIE PC Execute PC-1 PC 1-Cycle Instruction at PC PC+1 0004h 0005h NOP NOP Inst(0004h) PC+1/FSR ADDR New PC/ PC+1 0004h 0005h Inst(PC) NOP NOP Inst(0004h) FSR ADDR PC+1 PC+2 0004h 0005h INST(PC) NOP NOP NOP Inst(0004h) Inst(0005h) FSR ADDR PC+1 0004h 0005h INST(PC) NOP NOP Inst(0004h) Inst(PC) Interrupt GIE PC Execute PC-1 PC 2-Cycle Instruction at PC Interrupt GIE PC Execute PC-1 PC 3-Cycle Instruction at PC Interrupt GIE PC Execute PC-1 PC 3-Cycle Instruction at PC 2013-2015 Microchip Technology Inc. PC+2 NOP NOP DS40001723D-page 71 PIC12(L)F1571/2 FIGURE 7-3: INT PIN INTERRUPT TIMING Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 FOSC CLKOUT (3) INT Pin (1) (1) INTF Interrupt Latency(2) (4) GIE INSTRUCTION FLOW PC PC PC + 1 PC + 1 0004h 0005h Instruction Fetched Inst (PC) Inst (PC + 1) — Inst (0004h) Inst (0005h) Instruction Executed Inst (PC – 1) Inst (PC) Forced NOP Forced NOP Inst (0004h) Note 1: 2: 3: 4: INTF flag is sampled here (every Q1). Asynchronous interrupt latency = 3-5 TCY. Synchronous latency = 3-4 TCY, where TCY = instruction cycle time. Latency is the same whether Inst (PC) is a single cycle or a 2-cycle instruction. For minimum width of INT pulse, refer to AC specifications in Section 26.0 “Electrical Specifications”. INTF is enabled to be set any time during the Q4-Q1 cycles. DS40001723D-page 72 2013-2015 Microchip Technology Inc. PIC12(L)F1571/2 7.3 Interrupts During Sleep Some interrupts can be used to wake from Sleep. To wake from Sleep, the peripheral must be able to operate without the system clock. The interrupt source must have the appropriate Interrupt Enable bit(s) set prior to entering Sleep. On waking from Sleep, if the GIE bit is also set, the processor will branch to the interrupt vector. Otherwise, the processor will continue executing instructions after the SLEEP instruction. The instruction directly after the SLEEP instruction will always be executed before branching to the ISR. Refer to Section 8.0 “Power-Down Mode (Sleep)” for more details. 7.4 INT Pin The INT pin can be used to generate an asynchronous edge-triggered interrupt. This interrupt is enabled by setting the INTE bit of the INTCON register. The INTEDG bit of the OPTION_REG register determines on which edge the interrupt will occur. When the INTEDG bit is set, the rising edge will cause the interrupt. When the INTEDG bit is clear, the falling edge will cause the interrupt. The INTF bit of the INTCON register will be set when a valid edge appears on the INT pin. If the GIE and INTE bits are also set, the processor will redirect program execution to the interrupt vector. 2013-2015 Microchip Technology Inc. 7.5 Automatic Context Saving Upon entering an interrupt, the return PC address is saved on the stack. Additionally, the following registers are automatically saved in the shadow registers: • • • • • W register STATUS register (except for TO and PD) BSR register FSR registers PCLATH register Upon exiting the Interrupt Service Routine, these registers are automatically restored. Any modifications to these registers during the ISR will be lost. If modifications to any of these registers are desired, the corresponding shadow register should be modified and the value will be restored when exiting the ISR. The shadow registers are available in Bank 31 and are readable and writable. Depending on the user’s application, other registers may also need to be saved. DS40001723D-page 73 PIC12(L)F1571/2 7.6 Register Definitions: Interrupt Control REGISTER 7-1: INTCON: INTERRUPT CONTROL REGISTER R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R-0/0 GIE(1) PEIE(2) TMR0IE INTE IOCIE TMR0IF INTF IOCIF(3) bit 7 bit 0 Legend: R = Readable bit W = Writable bit u = Bit is unchanged x = Bit is unknown U = Unimplemented bit, read as ‘0’ ‘1’ = Bit is set ‘0’ = Bit is cleared -n/n = Value at POR and BOR/Value at all other Resets bit 7 GIE: Global Interrupt Enable bit(1) 1 = Enables all active interrupts 0 = Disables all interrupts bit 6 PEIE: Peripheral Interrupt Enable bit(2) 1 = Enables all active peripheral interrupts 0 = Disables all peripheral interrupts bit 5 TMR0IE: Timer0 Overflow Interrupt Enable bit 1 = Enables the Timer0 interrupt 0 = Disables the Timer0 interrupt bit 4 INTE: INT External Interrupt Enable bit 1 = Enables the INT external interrupt 0 = Disables the INT external interrupt bit 3 IOCIE: Interrupt-On-Change Enable bit 1 = Enables the Interrupt-On-Change 0 = Disables the Interrupt-On-Change bit 2 TMR0IF: Timer0 Overflow Interrupt Flag bit 1 = TMR0 register has overflowed 0 = TMR0 register has not overflow bit 1 INTF: INT External Interrupt Flag bit 1 = The INT external interrupt occurred 0 = The INT external interrupt did not occur bit 0 IOCIF: Interrupt-On-Change Interrupt Flag bit(3) 1 = When at least one of the Interrupt-On-Change pins changed state 0 = None of the Interrupt-On-Change pins have changed state Note 1: 2: 3: Interrupt flag bits are set when an interrupt condition occurs, regardless of the state of its corresponding enable bit or the Global Interrupt Enable bit, GIE, of the INTCON register. User software should ensure the appropriate interrupt flag bits are clear prior to enabling an interrupt. Bit PEIE of the INTCON register must be set to enable any peripheral interrupt. The IOCIF Flag bit is read-only and cleared when all the Interrupt-On-Change flags in the IOCxF registers have been cleared by software. DS40001723D-page 74 2013-2015 Microchip Technology Inc. PIC12(L)F1571/2 REGISTER 7-2: PIE1: PERIPHERAL INTERRUPT ENABLE REGISTER 1 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 U-0 U-0 R/W-0/0 R/W-0/0 TMR1GIE ADIE RCIE(1) TXIE(1) — — TMR2IE TMR1IE bit 7 bit 0 Legend: R = Readable bit W = Writable bit u = Bit is unchanged x = Bit is unknown U = Unimplemented bit, read as ‘0’ ‘1’ = Bit is set ‘0’ = Bit is cleared -n/n = Value at POR and BOR/Value at all other Resets bit 7 TMR1GIE: Timer1 Gate Interrupt Enable bit 1 = Enables the Timer1 gate acquisition interrupt 0 = Disables the Timer1 gate acquisition interrupt bit 6 ADIE: Analog-to-Digital Converter (ADC) Interrupt Enable bit 1 = Enables the ADC interrupt 0 = Disables the ADC interrupt bit 5 RCIE: USART Receive Interrupt Enable bit(1) 1 = Enables the USART receive interrupt 0 = Disables the USART receive interrupt bit 4 TXIE: USART Transmit Interrupt Enable bit(1) 1 = Enables the USART transmit interrupt 0 = Disables the USART transmit interrupt bit 3-2 Unimplemented: Read as ‘0’ bit 1 TMR2IE: TMR2 to PR2 Match Interrupt Enable bit 1 = Enables the Timer2 to PR2 match interrupt 0 = Disables the Timer2 to PR2 match interrupt bit 0 TMR1IE: Timer1 Overflow Interrupt Enable bit 1 = Enables the Timer1 overflow interrupt 0 = Disables the Timer1 overflow interrupt Note 1: 2: Note: PIC12(L)F1572 only. Bit PEIE of the INTCON register must be set to enable any peripheral interrupt. Bit PEIE of the INTCON register must be set to enable any peripheral interrupt. 2013-2015 Microchip Technology Inc. DS40001723D-page 75 PIC12(L)F1571/2 REGISTER 7-3: PIE2: PERIPHERAL INTERRUPT ENABLE REGISTER 2 U-0 U-0 R/W-0/0 U-0 U-0 U-0 U-0 U-0 — — C1IE — — — — — bit 7 bit 0 Legend: R = Readable bit W = Writable bit u = Bit is unchanged x = Bit is unknown U = Unimplemented bit, read as ‘0’ ‘1’ = Bit is set ‘0’ = Bit is cleared -n/n = Value at POR and BOR/Value at all other Resets bit 7-6 Unimplemented: Read as ‘0’ bit 5 C1IE: Comparator C1 Interrupt Enable bit 1 = Enables the Comparator C1 interrupt 0 = Disables the Comparator C1 interrupt bit 4-0 Unimplemented: Read as ‘0’ Note: Bit PEIE of the INTCON register must be set to enable any peripheral interrupt. DS40001723D-page 76 2013-2015 Microchip Technology Inc. PIC12(L)F1571/2 REGISTER 7-4: PIE3: PERIPHERAL INTERRUPT ENABLE REGISTER 3 U-0 R/W-0/0 R/W-0/0 R/W-0/0 U-0 U-0 U-0 U-0 — PWM3IE PWM2IE PWM1IE — — — — bit 7 bit 0 Legend: R = Readable bit W = Writable bit u = Bit is unchanged x = Bit is unknown U = Unimplemented bit, read as ‘0’ ‘1’ = Bit is set ‘0’ = Bit is cleared -n/n = Value at POR and BOR/Value at all other Resets bit 7 Unimplemented: Read as ‘0’ bit 6 PWM3IE: PWM3 Interrupt Enable bit 1 = Enables the PWM3 interrupt 0 = Disables the PWM3 interrupt bit 5 PWM2IE: PWM2 Interrupt Enable bit 1 = Enables the PWM2 interrupt 0 = Disables the PWM2 interrupt bit 4 PWM1IE: PWM1 Interrupt Enable bit 1 = Enables the PWM1 interrupt 0 = Disables the PWM1 interrupt bit 3-0 Unimplemented: Read as ‘0’ Note: Bit PEIE of the INTCON register must be set to enable any peripheral interrupt. 2013-2015 Microchip Technology Inc. DS40001723D-page 77 PIC12(L)F1571/2 REGISTER 7-5: R/W-0/0 PIR1: PERIPHERAL INTERRUPT REQUEST REGISTER 1 R/W-0/0 TMR1GIF R-0/0 ADIF RCIF (1) R/W-0/0 TXIF (1) U-0 U-0 R/W-0/0 R/W-0/0 — — TMR2IF TMR1IF bit 7 bit 0 Legend: R = Readable bit W = Writable bit u = Bit is unchanged x = Bit is unknown U = Unimplemented bit, read as ‘0’ ‘1’ = Bit is set ‘0’ = Bit is cleared -n/n = Value at POR and BOR/Value at all other Resets bit 7 TMR1GIF: Timer1 Gate Interrupt Flag bit 1 = Interrupt is pending 0 = Interrupt is not pending bit 6 ADIF: ADC Interrupt Flag bit 1 = Interrupt is pending 0 = Interrupt is not pending bit 5 RCIF: USART Receive Interrupt Flag bit(1) 1 = Interrupt is pending 0 = Interrupt is not pending bit 4 TXIF: USART Transmit Interrupt Flag bit(1) 1 = Interrupt is pending 0 = Interrupt is not pending bit 3-2 Unimplemented: Read as ‘0’ bit 1 TMR2IF: Timer2 to PR2 Interrupt Flag bit 1 = Interrupt is pending 0 = Interrupt is not pending bit 0 TMR1IF: Timer1 Overflow Interrupt Flag bit 1 = Interrupt is pending 0 = Interrupt is not pending Note 1: Note: PIC12(L)F1572 only. Interrupt flag bits are set when an interrupt condition occurs, regardless of the state of its corresponding enable bit or the Global Interrupt Enable bit, GIE, of the INTCON register. User software should ensure the appropriate interrupt flag bits are clear prior to enabling an interrupt. DS40001723D-page 78 2013-2015 Microchip Technology Inc. PIC12(L)F1571/2 REGISTER 7-6: PIR2: PERIPHERAL INTERRUPT REQUEST REGISTER 2 U-0 U-0 R/W-0/0 U-0 U-0 U-0 U-0 U-0 — — C1IF — — — — — bit 7 bit 0 Legend: R = Readable bit W = Writable bit u = Bit is unchanged x = Bit is unknown U = Unimplemented bit, read as ‘0’ ‘1’ = Bit is set ‘0’ = Bit is cleared -n/n = Value at POR and BOR/Value at all other Resets bit 7-6 Unimplemented: Read as ‘0’ bit 5 C1IF: Numerically Controlled Oscillator Flag bit 1 = Interrupt is pending 0 = Interrupt is not pending bit 4-0 Unimplemented: Read as ‘0’ Note: Interrupt flag bits are set when an interrupt condition occurs, regardless of the state of its corresponding enable bit or the Global Interrupt Enable bit, GIE, of the INTCON register. User software should ensure the appropriate interrupt flag bits are clear prior to enabling an interrupt. 2013-2015 Microchip Technology Inc. DS40001723D-page 79 PIC12(L)F1571/2 REGISTER 7-7: PIR3: PERIPHERAL INTERRUPT REQUEST REGISTER 3 U-0 R-0/0 R-0/0 R-0/0 U-0 U-0 U-0 U-0 — PWM3IF(1) PWM2IF(1) PWM1IF(1) — — — — bit 7 bit 0 Legend: R = Readable bit W = Writable bit u = Bit is unchanged x = Bit is unknown U = Unimplemented bit, read as ‘0’ ‘1’ = Bit is set ‘0’ = Bit is cleared -n/n = Value at POR and BOR/Value at all other Resets bit 7 Unimplemented: Read as ‘0’ bit 6 PWM3IF: PWM3 Interrupt Flag bit(1) 1 = Interrupt is pending 0 = Interrupt is not pending bit 5 PWM2IF: PWM2 Interrupt Flag bit(1) 1 = Interrupt is pending 0 = Interrupt is not pending bit 4 PWM1IF: PWM1 Interrupt Flag bit(1) 1 = Interrupt is pending 0 = Interrupt is not pending bit 3-0 Unimplemented: Read as ‘0’ Note 1: 2: These bits are read-only. They must be cleared by addressing the Flag registers inside the module. Interrupt flag bits are set when an interrupt condition occurs, regardless of the state of its corresponding enable bit or the Global Enable bit, GIE, of the INTCON register. User software should ensure the appropriate interrupt flag bits are clear prior to enabling an interrupt. DS40001723D-page 80 2013-2015 Microchip Technology Inc. PIC12(L)F1571/2 TABLE 7-1: Name INTCON SUMMARY OF REGISTERS ASSOCIATED WITH INTERRUPTS Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register on Page GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF 74 OPTION_REG WPUEN INTEDG TMR0CS TMR0SE PSA ADIE RCIE(1) TXIE(1) — — TMR2IE TMR1IE 75 — C1IE — — — — — 76 — — — — 77 — — TMR2IF TMR1IF 78 — — — — 79 — — — — 80 PIE1 TMR1GIE PIE2 — PIE3 — PWM3IE PWM2IE PWM1IE PIR1 TMR1GIF ADIF RCIF(1) PIR2 — — C1IF — PIR3 — PWM3IF PWM2IF PWM1IF TXIF (1) PS<2:0> 157 Legend: — = unimplemented location, read as ‘0’. Shaded cells are not used by interrupts. Note 1: PIC12(L)F1572 only. 2013-2015 Microchip Technology Inc. DS40001723D-page 81 PIC12(L)F1571/2 NOTES: DS40001723D-page 82 2013-2015 Microchip Technology Inc. PIC12(L)F1571/2 8.0 POWER-DOWN MODE (SLEEP) The Power-Down mode is entered by executing a SLEEP instruction. Upon entering Sleep mode, the following conditions exist: 1. WDT will be cleared but keeps running if enabled for operation during Sleep. PD bit of the STATUS register is cleared. TO bit of the STATUS register is set. CPU clock is disabled. 31 kHz LFINTOSC is unaffected and peripherals that operate from it may continue operation in Sleep. Timer1 and peripherals that operate from Timer1 continue operation in Sleep when the Timer1 clock source selected is: • LFINTOSC • T1CKI • Timer1 oscillator ADC is unaffected if the dedicated FRC oscillator is selected. I/O ports maintain the status they had before SLEEP was executed (driving high, low or high-impedance). Resets other than WDT are not affected by Sleep mode. 2. 3. 4. 5. 6. 7. 8. 9. Refer to individual chapters for more details on peripheral operation during Sleep. To minimize current consumption, the following conditions should be considered: • • • • • • I/O pins should not be floating External circuitry sinking current from I/O pins Internal circuitry sourcing current from I/O pins Current draw from pins with internal weak pull-ups Modules using 31 kHz LFINTOSC CWG module using HFINTOSC I/O pins that are high-impedance inputs should be pulled to VDD or VSS externally to avoid switching currents caused by floating inputs. Examples of internal circuitry that might be sourcing current include the FVR module. See Section 13.0 “Fixed Voltage Reference (FVR)” for more information on this module. 8.1 Wake-up from Sleep The first three events will cause a device Reset. The last three events are considered a continuation of program execution. To determine whether a device Reset or wakeup event occurred, refer to Section 6.12 “Determining the Cause of a Reset”. When the SLEEP instruction is being executed, the next instruction (PC + 1) is prefetched. For the device to wake-up through an interrupt event, the corresponding interrupt enable bit must be enabled. Wake-up will occur regardless of the state of the GIE bit. If the GIE bit is disabled, the device continues execution at the instruction after the SLEEP instruction. If the GIE bit is enabled, the device executes the instruction after the SLEEP instruction, the device will then call the Interrupt Service Routine. In cases where the execution of the instruction following SLEEP is not desirable, the user should have a NOP after the SLEEP instruction. The WDT is cleared when the device wakes up from Sleep, regardless of the source of wake-up. 8.1.1 WAKE-UP USING INTERRUPTS When global interrupts are disabled (GIE cleared) and any interrupt source has both its interrupt enable bit and interrupt flag bit set, one of the following will occur: • If the interrupt occurs before the execution of a SLEEP instruction: - SLEEP instruction will execute as a NOP. - WDT and WDT prescaler will not be cleared - TO bit of the STATUS register will not be set - PD bit of the STATUS register will not be cleared. • If the interrupt occurs during or after the execution of a SLEEP instruction: - SLEEP instruction will be completely executed - Device will immediately wake-up from Sleep - WDT and WDT prescaler will be cleared - TO bit of the STATUS register will be set - PD bit of the STATUS register will be cleared Even if the flag bits were checked before executing a SLEEP instruction, it may be possible for flag bits to become set before the SLEEP instruction completes. To determine whether a SLEEP instruction executed, test the PD bit. If the PD bit is set, the SLEEP instruction was executed as a NOP. The device can wake-up from Sleep through one of the following events: 1. External Reset input on MCLR pin if enabled. 2. BOR Reset if enabled. 3. POR Reset. 4. Watchdog Timer if enabled. 5. Any external interrupt. 6. Interrupts by peripherals capable of running during Sleep (see individual peripheral for more information) 2013-2015 Microchip Technology Inc. DS40001723D-page 83 PIC12(L)F1571/2 FIGURE 8-1: WAKE-UP FROM SLEEP THROUGH INTERRUPT Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 CLKIN(1) TOST(3) CLKOUT(2) Interrupt Flag Interrupt Latency (4) GIE bit (INTCON reg.) Instruction Flow PC Instruction Fetched Instruction Executed Note 1: 2: 3: 4: 8.2 Processor in Sleep PC PC + 1 PC + 2 PC + 2 Inst(PC) = Sleep Inst(PC + 1) Inst(PC + 2) Inst(PC – 1) Sleep Inst(PC + 1) PC + 2 Forced NOP 0004h 0005h Inst(0004h) Inst(0005h) Forced NOP Inst(0004h) External Clock. High, Medium, Low mode assumed. CLKOUT is shown here for timing reference. TOST = 1024 TOSC. This delay does not apply to EC, RC and INTOSC Oscillator modes or Two-Speed Start-up (if available). GIE = 1 assumed. In this case, after wake-up, the processor calls the ISR at 0004h. If GIE = 0, execution will continue in-line. Low-Power Sleep Mode 8.2.2 PERIPHERAL USAGE IN SLEEP This device contains an internal Low Dropout (LDO) voltage regulator, which allows the device I/O pins to operate at voltages up to 5.5V while the internal device logic operates at a lower voltage. The LDO and its associated reference circuitry must remain active when the device is in Sleep mode. Some peripherals that can operate in Sleep mode will not operate properly with the Low-Power Sleep mode selected. The LDO will remain in the normal power mode when those peripherals are enabled. The LowPower Sleep mode is intended for use with these peripherals: Low-Power Sleep mode allows the user to optimize the operating current in Sleep. Low-Power Sleep mode can be selected by setting the VREGPM bit of the VREGCON register, which puts the LDO and reference circuitry in a low-power state whenever the device is in Sleep. • • • • 8.2.1 SLEEP CURRENT VS. WAKE-UP TIME In the default operating mode, the LDO and reference circuitry remain in the normal configuration while in Sleep. The device is able to exit Sleep mode quickly since all circuits remain active. In Low-Power Sleep mode, when waking up from Sleep, an extra delay time is required for these circuits to return to the normal configuration and stabilize. The Low-Power Sleep mode is beneficial for applications that stay in Sleep mode for long periods of time. The normal mode is beneficial for applications that need to wake from Sleep quickly and frequently. DS40001723D-page 84 Brown-out Reset (BOR) Watchdog Timer (WDT) External interrupt pin/Interrupt-On-Change pins Timer1 (with external clock source) The Complementary Waveform Generator (CWG) module can utilize the HFINTOSC oscillator as either a clock source or as an input source. Under certain conditions, when the HFINTOSC is selected for use with the CWG module, the HFINTOSC will remain active during Sleep. This will have a direct effect on the Sleep mode current. Please refer to section Section 23.10 “Operation During Sleep” for more information. Note: The PIC12LF1571/2 does not have a configurable Low-Power Sleep mode. PIC12LF1571/2 is an unregulated device and is always in the lowest power state when in Sleep with no wake-up time penalty. This device has a lower maximum VDD and I/O voltage than the PIC12F1571/2. See Section 26.0 “Electrical Specifications” for more information. 2013-2015 Microchip Technology Inc. PIC12(L)F1571/2 8.3 Register Definitions: Voltage Regulator Control VREGCON: VOLTAGE REGULATOR CONTROL REGISTER(1) REGISTER 8-1: U-0 U-0 U-0 U-0 U-0 U-0 R/W-0/0 R/W-1/1 — — — — — — VREGPM Reserved bit 7 bit 0 Legend: R = Readable bit W = Writable bit u = Bit is unchanged x = Bit is unknown U = Unimplemented bit, read as ‘0’ ‘1’ = Bit is set ‘0’ = Bit is cleared -n/n = Value at POR and BOR/Value at all other Resets bit 7-2 Unimplemented: Read as ‘0’ bit 1 VREGPM: Voltage Regulator Power Mode Selection bit 1 = Low-Power Sleep mode enabled in Sleep(2) Draws lowest current in Sleep, slower wake-up. 0 = Normal power mode enabled in Sleep(2) Draws higher current in Sleep, faster wake-up. bit 0 Reserved: Read as ‘1’, maintain this bit set Note 1: 2: PIC12F1571/2 only. See Section 26.0 “Electrical Specifications” TABLE 8-1: SUMMARY OF REGISTERS ASSOCIATED WITH POWER-DOWN MODE Name Bit 7 Bit 6 Bit 5 INTCON Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register on Page GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF 74 IOCAF — — IOCAF5 IOCAF4 IOCAF3 IOCAF2 IOCAF1 IOCAF0 122 IOCAN — — IOCAN5 IOCAN4 IOCAN3 IOCAN2 IOCAN1 IOCAN0 121 IOCAP — — IOCAP5 IOCAP4 IOCAP3 IOCAP2 IOCAP1 IOCAP0 121 TXIE(1) PIE1 TMR1GIE ADIE RCIE(1) — — TMR2IE TMR1IE 75 PIE2 — — C1IE — — — — — 76 PIE3 — PWM3IE PWM2IE PWM1IE — — — — 77 PIR1 TMR1GIF ADIF RCIF(1) TXIF(1) — — TMR2IF TMR1IF 78 PIR2 — — C1IF — — — — — 79 PIR3 — PWM3IF PWM2IF PWM1IF — — — — 80 STATUS — — — TO PD Z DC C 19 WDTCON — — SWDTEN 89 WDTPS<4:0> Legend: — = unimplemented, read as ‘0’. Shaded cells are not used in Power-Down mode. Note 1: PIC12(L)F1572 only. 2013-2015 Microchip Technology Inc. DS40001723D-page 85 PIC12(L)F1571/2 NOTES: DS40001723D-page 86 2013-2015 Microchip Technology Inc. PIC12(L)F1571/2 9.0 WATCHDOG TIMER (WDT) The Watchdog Timer is a system timer that generates a Reset if the firmware does not issue a CLRWDT instruction within the time-out period. The Watchdog Timer is typically used to recover the system from unexpected events. FIGURE 9-1: The WDT has the following features: • Independent clock source • Multiple operating modes: - WDT is always on - WDT is off when in Sleep - WDT is controlled by software - WDT is always off • Configurable time-out period is from 1 ms to 256 seconds (nominal) • Multiple Reset conditions • Operation during Sleep WATCHDOG TIMER BLOCK DIAGRAM Rev. 10-000141A 7/30/2013 WDTE<1:0> = 01 SWDTEN WDTE<1:0> = 11 LFINTOSC 23-%it Programmable Prescaler WDT WDT Time-out WDTE<1:0> = 10 Sleep 2013-2015 Microchip Technology Inc. WDTPS<4:0> DS40001723D-page 87 PIC12(L)F1571/2 9.1 Independent Clock Source 9.3 The WDT derives its time base from the 31 kHz LFINTOSC internal oscillator. Time intervals in this chapter are based on a nominal interval of 1 ms. See Section 26.0 “Electrical Specifications” for the LFINTOSC tolerances. 9.2 The Watchdog Timer module has four operating modes controlled by the WDTE<1:0> bits in the Configuration Words. See Table 9-1. 9.2.1 WDT IS ALWAYS ON When the WDTEx bits of the Configuration Words are set to ‘11’, the WDT is always on. WDT protection is active during Sleep. 9.2.2 WDT IS OFF IN SLEEP When the WDTEx bits of the Configuration Words are set to ‘10’, the WDT is on, except in Sleep. WDT protection is not active during Sleep. 9.2.3 WDT CONTROLLED BY SOFTWARE When the WDTEx bits of the Configuration Words are set to ‘01’, the WDT is controlled by the SWDTEN bit of the WDTCON register. WDT protection is unchanged by Sleep. See Table 9-1 for more details. TABLE 9-1: WDT OPERATING MODES WDTE<1:0> SWDTEN 11 X 10 X 01 00 TABLE 9-2: Device Mode The WDTPS<4:0> bits of the WDTCON register set the time-out period from 1 ms to 256 seconds (nominal). After a Reset, the default time-out period is two seconds. 9.4 WDT Operating Modes WDT Mode X Active Awake Active Sleep Disabled 1 X Active 0 X Disabled X X Disabled Time-out Period Clearing the WDT The WDT is cleared when any of the following conditions occur: • • • • • • • Any Reset CLRWDT instruction is executed Device enters Sleep Device wakes up from Sleep Oscillator fails WDT is disabled Oscillator Start-up Timer (OST) is running See Table 9-2 for more information. 9.5 Operation During Sleep When the device enters Sleep, the WDT is cleared. If the WDT is enabled during Sleep, the WDT resumes counting. When the device exits Sleep, the WDT is cleared again. The WDT remains clear until the OST, if enabled, completes. See Section 5.0 “Oscillator Module” for more information on the OST. When a WDT time-out occurs while the device is in Sleep, no Reset is generated. Instead, the device wakes up and resumes operation. The TO and PD bits in the STATUS register are changed to indicate the event. The RWDT bit in the PCON register can also be used. See Section 3.0 “Memory Organization” for more information. WDT CLEARING CONDITIONS Conditions WDT WDTE<1:0> = 00 WDTE<1:0> = 01 and SWDTEN = 0 WDTE<1:0> = 10 and enter Sleep CLRWDT Command Cleared Oscillator Fail Detected Exit Sleep + System Clock = T1OSC, EXTRC, INTOSC, EXTCLK Exit Sleep + System Clock = XT, HS, LP Change INTOSC divider (IRCF<3:0> bits) DS40001723D-page 88 Cleared until the end of OST Unaffected 2013-2015 Microchip Technology Inc. PIC12(L)F1571/2 9.6 Register Definitions: Watchdog Control REGISTER 9-1: WDTCON: WATCHDOG TIMER CONTROL REGISTER U-0 U-0 — — R/W-0/0 R/W-1/1 R/W-0/0 R/W-1/1 R/W-1/1 WDTPS<4:0> bit 7 R/W-0/0 SWDTEN bit 0 Legend: R = Readable bit W = Writable bit u = Bit is unchanged x = Bit is unknown U = Unimplemented bit, read as ‘0’ ‘1’ = Bit is set ‘0’ = Bit is cleared -n/n = Value at POR and BOR/Value at all other Resets bit 7-6 Unimplemented: Read as ‘0’ bit 5-1 WDTPS<4:0>: Watchdog Timer Period Select bits(1) Bit Value = Prescale Rate 11111 = Reserved; results in minimum interval (1:32) • • • 10011 = Reserved; results in minimum interval (1:32) 10010 = 1:8388608 (223) (Interval 256s nominal) 10001 = 1:4194304 (222) (Interval 128s nominal) 10000 = 1:2097152 (221) (Interval 64s nominal) 01111 = 1:1048576 (220) (Interval 32s nominal) 01110 = 1:524288 (219) (Interval 16s nominal) 01101 = 1:262144 (218) (Interval 8s nominal) 01100 = 1:131072 (217) (Interval 4s nominal) 01011 = 1:65536 (Interval 2s nominal) (Reset value) 01010 = 1:32768 (Interval 1s nominal) 01001 = 1:16384 (Interval 512 ms nominal) 01000 = 1:8192 (Interval 256 ms nominal) 00111 = 1:4096 (Interval 128 ms nominal) 00110 = 1:2048 (Interval 64 ms nominal) 00101 = 1:1024 (Interval 32 ms nominal) 00100 = 1:512 (Interval 16 ms nominal) 00011 = 1:256 (Interval 8 ms nominal) 00010 = 1:128 (Interval 4 ms nominal) 00001 = 1:64 (Interval 2 ms nominal) 00000 = 1:32 (Interval 1 ms nominal) bit 0 SWDTEN: Software Enable/Disable for Watchdog Timer bit If WDTE<1:0> = 1x: This bit is ignored. If WDTE<1:0> = 01: 1 = WDT is turned on 0 = WDT is turned off If WDTE<1:0> = 00: This bit is ignored. Note 1: Times are approximate. WDT time is based on 31 kHz LFINTOSC. 2013-2015 Microchip Technology Inc. DS40001723D-page 89 PIC12(L)F1571/2 TABLE 9-3: SUMMARY OF REGISTERS ASSOCIATED WITH WATCHDOG TIMER Name Bit 7 Bit 6 Bit 5 Bit 4 OSCCON SPLLEN PCON STKOVF STKUNF — RWDT STATUS — — — TO WDTCON — — Bit 3 IRCF<3:0> Bit 2 Bit 1 — Bit 0 SCS<1:0> RMCLR RI POR PD Z DC WDTPS<4:0> Register on Page 55 BOR 66 C 19 SWDTEN 89 Legend: — = unimplemented location, read as ‘0’. Shaded cells are not used by the Watchdog Timer. TABLE 9-4: Name Bits SUMMARY OF CONFIGURATION WORD WITH WATCHDOG TIMER Bit -/7 Bit -/6 Bit 13/5 Bit 12/4 Bit 11/3 CONFIG1 13:8 — — — — CLKOUTEN 7:0 CP MCLRE PWRTE WDTE<1:0> Bit 10/2 Bit 9/1 BOREN<1:0> — Bit 8/0 Register on Page — 42 FOSC<1:0> Legend: — = unimplemented location, read as ‘0’. Shaded cells are not used by the Watchdog Timer. DS40001723D-page 90 2013-2015 Microchip Technology Inc. PIC12(L)F1571/2 10.0 FLASH PROGRAM MEMORY CONTROL The Flash program memory is readable and writable during normal operation over the full VDD range. Program memory is indirectly addressed using Special Function Registers (SFRs). The SFRs used to access program memory are: • • • • • • PMCON1 PMCON2 PMDATL PMDATH PMADRL PMADRH When accessing the program memory, the PMDATH:PMDATL register pair forms a 2-byte word that holds the 14-bit data for read/write, and the PMADRH:PMADRL register pair forms a 2-byte word that holds the 15-bit address of the program memory location being read. The write time is controlled by an on-chip timer. The write/erase voltages are generated by an on-chip charge pump. The Flash program memory can be protected in two ways; by code protection (CP bit in the Configuration Words) and write protection (WRT<1:0> bits in the Configuration Words). Code protection (CP = 0) disables access, reading and writing, to the Flash program memory via external device programmers. Code protection does not affect the self-write and erase functionality. Code protection can only be reset by a device programmer performing a bulk erase to the device, clearing all Flash program memory, Configuration bits and User IDs.(1) Write protection prohibits self-write and erase to a portion or all of the Flash program memory as defined by the bits WRT<1:0>. Write protection does not affect a device programmers ability to read, write or erase the device. Note 1: Code protection of the entire Flash program memory array is enabled by clearing the CP bit of the Configuration Words. 10.1 The PMADRH:PMADRL register pair can address up to a maximum of 16K words of program memory. When selecting a program address value, the MSB of the address is written to the PMADRH register and the LSB is written to the PMADRL register. 10.1.1 PMCON1 AND PMCON2 REGISTERS PMCON1 is the control register for Flash program memory accesses. Control bits, RD and WR, initiate read and write, respectively. These bits cannot be cleared, only set, in software. They are cleared by hardware at completion of the read or write operation. The inability to clear the WR bit in software prevents the accidental, premature termination of a write operation. The WREN bit, when set, will allow a write operation to occur. On power-up, the WREN bit is clear. The WRERR bit is set when a write operation is interrupted by a Reset during normal operation. In these situations, following Reset, the user can check the WRERR bit and execute the appropriate error handling routine. The PMCON2 register is a write-only register. Attempting to read the PMCON2 register will return all ‘0’s. To enable writes to the program memory, a specific pattern (the unlock sequence), must be written to the PMCON2 register. The required unlock sequence prevents inadvertent writes to the program memory write latches and Flash program memory. 10.2 Flash Program Memory Overview It is important to understand the Flash program memory structure for erase and programming operations. Flash program memory is arranged in rows. A row consists of a fixed number of 14-bit program memory words. A row is the minimum size that can be erased by user software. After a row has been erased, the user can reprogram all or a portion of this row. Data to be written into the program memory row is written to 14-bit wide data write latches. These write latches are not directly accessible to the user, but may be loaded via sequential writes to the PMDATH:PMDATL register pair. Note: 2013-2015 Microchip Technology Inc. PMADRL and PMADRH Registers If the user wants to modify only a portion of a previously programmed row, then the contents of the entire row must be read and saved in RAM prior to the erase. Then, new data and retained data can be written into the write latches to reprogram the row of Flash program memory. However, any unprogrammed locations can be written without first erasing the row. In this case, it is not necessary to save and rewrite the other previously programmed locations. DS40001723D-page 91 PIC12(L)F1571/2 See Table 10-1 for erase row size and the number of write latches for Flash program memory. TABLE 10-1: FLASH MEMORY ORGANIZATION BY DEVICE Device PIC12(L)F1571 PIC12(L)F1572 10.2.1 Row Erase (words) Write Latches (words) 16 16 2. 3. Write the desired address to the PMADRH:PMADRL register pair. Clear the CFGS bit of the PMCON1 register. Then, set control bit, RD, of the PMCON1 register. Once the read control bit is set, the program memory Flash controller will use the second instruction cycle to read the data. This causes the second instruction immediately following the “BSF PMCON1,RD” instruction to be ignored. The data is available in the very next cycle in the PMDATH:PMDATL register pair; therefore, it can be read as two bytes in the following instructions. The PMDATH:PMDATL register pair will hold this value until another read or until it is written to by the user. Note: FLASH PROGRAM MEMORY READ FLOWCHART Rev. 10-000046A 7/30/2013 Start Read Operation Select Program or Configuration Memory (CFGS) READING THE FLASH PROGRAM MEMORY To read a program memory location, the user must: 1. FIGURE 10-1: The two instructions following a program memory read are required to be NOPs. This prevents the user from executing a 2-cycle instruction on the next instruction after the RD bit is set. Select Word Address (PMADRH:PMADRL) Initiate Read operation (RD = 1) Instruction fetched ignored NOP execution forced Instruction fetched ignored NOP execution forced Data read now in PMDATH:PMDATL End Read Operation DS40001723D-page 92 2013-2015 Microchip Technology Inc. PIC12(L)F1571/2 FIGURE 10-2: FLASH PROGRAM MEMORY READ CYCLE EXECUTION Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 PC Flash ADDR Flash Data PC + 1 INSTR (PC) INSTR(PC – 1) Executed Here PMADRH,PMADRL INSTR (PC + 1) BSF PMCON1,RD Executed Here PC +3 PC+3 PMDATH,PMDATL INSTR(PC + 1) Instruction Ignored, Forced NOP Executed Here PC + 5 PC + 4 INSTR (PC + 3) INSTR(PC + 2) Instruction Ignored, Forced NOP Executed Here INSTR (PC + 4) INSTR(PC + 3) Executed Here INSTR(PC + 4) Executed Here RD bit PMDATH PMDATL Register EXAMPLE 10-1: FLASH PROGRAM MEMORY READ * This code block will read 1 word of program * memory at the memory address: PROG_ADDR_HI : PROG_ADDR_LO * data will be returned in the variables; * PROG_DATA_HI, PROG_DATA_LO BANKSEL MOVLW MOVWF MOVLW MOVWF PMADRL PROG_ADDR_LO PMADRL PROG_ADDR_HI PMADRH ; Select Bank for PMCON registers ; ; Store LSB of address ; ; Store MSB of address BCF BSF NOP NOP PMCON1,CFGS PMCON1,RD ; ; ; ; Do not select Configuration Space Initiate read Ignored (Figure 10-2) Ignored (Figure 10-2) MOVF MOVWF MOVF MOVWF PMDATL,W PROG_DATA_LO PMDATH,W PROG_DATA_HI ; ; ; ; Get LSB of word Store in user location Get MSB of word Store in user location 2013-2015 Microchip Technology Inc. DS40001723D-page 93 PIC12(L)F1571/2 10.2.2 FLASH MEMORY UNLOCK SEQUENCE The unlock sequence is a mechanism that protects the Flash program memory from unintended self-write programming or erasing. The sequence must be executed and completed without interruption to successfully complete any of the following operations: • Row erase • Load program memory write latches • Write of program memory write latches to program memory • Write of program memory write latches to User IDs FIGURE 10-3: FLASH PROGRAM MEMORY UNLOCK SEQUENCE FLOWCHART Rev. 10-000047A 7/30/2013 Start Unlock Sequence Write 0x55 to PMCON2 The unlock sequence consists of the following steps: 1. Write 55h to PMCON2 2. Write AAh to PMCON2 Write 0xAA to PMCON2 3. Set the WR bit in PMCON1 4. NOP instruction 5. NOP instruction Once the WR bit is set, the processor will always force two NOP instructions. When an erase row or program row operation is being performed, the processor will stall internal operations (typical 2 ms), until the operation is complete and then resume with the next instruction. When the operation is loading the program memory write latches, the processor will always force the two NOP instructions and continue uninterrupted with the next instruction. Initiate Write or Erase operation (WR = 1) Instruction fetched ignored NOP execution forced Instruction fetched ignored NOP execution forced Since the unlock sequence must not be interrupted, global interrupts should be disabled prior to the unlock sequence and re-enabled after the unlock sequence is completed. End Unlock Sequence DS40001723D-page 94 2013-2015 Microchip Technology Inc. PIC12(L)F1571/2 10.2.3 ERASING FLASH PROGRAM MEMORY While executing code, program memory can only be erased by rows. To erase a row: 1. 2. 3. 4. 5. Load the PMADRH:PMADRL register pair with any address within the row to be erased. Clear the CFGS bit of the PMCON1 register. Set the FREE and WREN bits of the PMCON1 register. Write 55h, then AAh, to PMCON2 (Flash programming unlock sequence). Set control bit, WR, of the PMCON1 register to begin the erase operation. FIGURE 10-4: FLASH PROGRAM MEMORY ERASE FLOWCHART Rev. 10-000048A 7/30/2013 Start Erase Operation Disable Interrupts (GIE = 0) See Example 10-2. After the “BSF PMCON1,WR” instruction, the processor requires two cycles to set up the erase operation. The user must place two NOP instructions after the WR bit is set. The processor will halt internal operations for the typical 2 ms erase time. This is not Sleep mode as the clocks and peripherals will continue to run. After the erase cycle, the processor will resume operation with the third instruction after the PMCON1 write instruction. Select Program or Configuration Memory (CFGS) Select Row Address (PMADRH:PMADRL) Select Erase Operation (FREE = 1) Enable Write/Erase Operation (WREN = 1) Unlock Sequence (See Note 1) CPU stalls while Erase operation completes (2 ms typical) Disable Write/Erase Operation (WREN = 0) Re-enable Interrupts (GIE = 1) End Erase Operation Note 1: See Figure 10-3. 2013-2015 Microchip Technology Inc. DS40001723D-page 95 PIC12(L)F1571/2 EXAMPLE 10-2: ERASING ONE ROW OF PROGRAM MEMORY Required Sequence ; This row erase routine assumes the following: ; 1. A valid address within the erase row is loaded in ADDRH:ADDRL ; 2. ADDRH and ADDRL are located in shared data memory 0x70 - 0x7F (common RAM) BCF BANKSEL MOVF MOVWF MOVF MOVWF BCF BSF BSF INTCON,GIE PMADRL ADDRL,W PMADRL ADDRH,W PMADRH PMCON1,CFGS PMCON1,FREE PMCON1,WREN MOVLW MOVWF MOVLW MOVWF BSF NOP NOP 55h PMCON2 0AAh PMCON2 PMCON1,WR BCF BSF DS40001723D-page 96 PMCON1,WREN INTCON,GIE ; Disable ints so required sequences will execute properly ; Load lower 8 bits of erase address boundary ; Load upper 6 bits of erase address boundary ; Not configuration space ; Specify an erase operation ; Enable writes ; ; ; ; ; ; ; ; ; ; Start of required sequence to initiate erase Write 55h Write AAh Set WR bit to begin erase NOP instructions are forced as processor starts row erase of program memory. The processor stalls until the erase process is complete after erase processor continues with 3rd instruction ; Disable writes ; Enable interrupts 2013-2015 Microchip Technology Inc. PIC12(L)F1571/2 10.2.4 WRITING TO FLASH PROGRAM MEMORY Program memory is programmed using the following steps: 1. 2. 3. 4. Load the address in PMADRH:PMADRL of the row to be programmed. Load each write latch with data. Initiate a programming operation. Repeat Steps 1 through 3 until all data is written. Before writing to program memory, the word(s) to be written must be erased or previously unwritten. Program memory can only be erased one row at a time. No automatic erase occurs upon the initiation of the write. Program memory can be written one or more words at a time. The maximum number of words written at one time is equal to the number of write latches. See Figure 10-5 (row writes to program memory with 16 write latches) for more details. The write latches are aligned to the Flash row address boundary defined by the upper 11 bits of PMADRH:PMADRL (PMADRH<6:0>:PMADRL<7:4>), with the lower 4 bits of PMADRL (PMADRL<3:0>) determining the write latch being loaded. Write operations do not cross these boundaries. At the completion of a program memory write operation, the data in the write latches is reset to contain 0x3FFF. The following steps should be completed to load the write latches and program a row of program memory. These steps are divided into two parts. First, each write latch is loaded with data from the PMDATH:PMDATL using the unlock sequence with LWLO = 1. When the last word to be loaded into the write latch is ready, the LWLO bit is cleared and the unlock sequence executed. This initiates the programming operation, writing all the latches into Flash program memory. Note: The special unlock sequence is required to load a write latch with data or initiate a Flash programming operation. If the unlock sequence is interrupted, writing to the latches or program memory will not be initiated. 2013-2015 Microchip Technology Inc. 1. 2. 3. Set the WREN bit of the PMCON1 register. Clear the CFGS bit of the PMCON1 register. Set the LWLO bit of the PMCON1 register. When the LWLO bit of the PMCON1 register is ‘1’, the write sequence will only load the write latches and will not initiate the write to Flash program memory. 4. Load the PMADRH:PMADRL register pair with the address of the location to be written. 5. Load the PMDATH:PMDATL register pair with the program memory data to be written. 6. Execute the unlock sequence (Section 10.2.2 “Flash Memory Unlock Sequence”). The write latch is now loaded. 7. Increment the PMADRH:PMADRL register pair to point to the next location. 8. Repeat Steps 5 through 7 until all but the last write latch has been loaded. 9. Clear the LWLO bit of the PMCON1 register. When the LWLO bit of the PMCON1 register is ‘0’, the write sequence will initiate the write to Flash program memory. 10. Load the PMDATH:PMDATL register pair with the program memory data to be written. 11. Execute the unlock sequence (Section 10.2.2 “Flash Memory Unlock Sequence”). The entire program memory latch content is now written to Flash program memory. Note: The program memory write latches are reset to the blank state (0x3FFF) at the completion of every write or erase operation. As a result, it is not necessary to load all the program memory write latches. Unloaded latches will remain in the blank state. An example of the complete write sequence is shown in Example 10-3. The initial address is loaded into the PMADRH:PMADRL register pair; the data is loaded using Indirect Addressing. DS40001723D-page 97 7 BLOCK WRITES TO FLASH PROGRAM MEMORY WITH 16 WRITE LATCHES 6 0 7 4 PMADRH - rA r9 r8 r7 r6 3 0 7 PMADRL r5 r4 r3 r2 r1 r0 c3 c2 c1 - 5 - 0 7 PMDATH PMDATL 6 c0 Rev. 10-000004B 7/25/2013 0 8 14 11 Program Memory Write Latches 4 14 Write Latch #0 00h 14 14 14 Write Latch #14 0Eh Write Latch #1 01h Write Latch #15 0Fh PMADRL<3:0> 14 CFGS = 0 2013-2015 Microchip Technology Inc. PMADRH<6:0>: PMADRL<7:4> Row Address Decode 14 14 14 Row Addr Addr Addr Addr 000h 0000h 0001h 000Eh 000Fh 001h 0010h 0011h 001Eh 001Fh 002h 0020h 0021h 002Eh 002Fh 7FEh 7FE0h 7FE1h 7FEEh 7FEFh 7FFh 7FF0h 7FF1h 7FFEh 7FFFh Flash Program Memory 800h CFGS = 1 8000h - 8003h 8004h – 8005h 8006h 8007h – 8008h 8009h - 801Fh USER ID 0 - 3 reserved DEVICE ID Dev / Rev Configuration Words reserved Configuration Memory PIC12(L)F1571/2 DS40001723D-page 98 FIGURE 10-5: PIC12(L)F1571/2 FIGURE 10-6: FLASH PROGRAM MEMORY WRITE FLOWCHART Start Write Operation Determine number of words to be written into Program or Configuration Memory. The number of words cannot exceed the number of words per row. (word_cnt) Disable Interrupts (GIE = 0) Select Program or Config. Memory (CFGS) Select Row Address (PMADRH:PMADRL) Enable Write/Erase Operation (WREN = 1) Load the value to write (PMDATH:PMDATL) Update the word counter (word_cnt--) Last word to write ? Yes No Unlock Sequence (Figure10-3 x-x) Figure Select Write Operation (FREE = 0) No delay when writing to Program Memory Latches Load Write Latches Only (LWLO = 1) Increment Address (PMADRH:PMADRL++) Write Latches to Flash (LWLO = 0) Unlock Sequence (Figure10-3 x-x) Figure CPU stalls while Write operation completes (2ms typical) Disable Write/Erase Operation (WREN = 0) Re-enable Interrupts (GIE = 1) End Write Operation 2013-2015 Microchip Technology Inc. DS40001723D-page 99 PIC12(L)F1571/2 EXAMPLE 10-3: ; ; ; ; ; ; ; WRITING TO FLASH PROGRAM MEMORY This write routine assumes the following: 1. 32 bytes of data are loaded, starting at the address in DATA_ADDR 2. Each word of data to be written is made up of two adjacent bytes in DATA_ADDR, stored in little endian format 3. A valid starting address (the Least Significant bits = 00000) is loaded in ADDRH:ADDRL 4. ADDRH and ADDRL are located in shared data memory 0x70 - 0x7F (common RAM) BCF BANKSEL MOVF MOVWF MOVF MOVWF MOVLW MOVWF MOVLW MOVWF BCF BSF BSF INTCON,GIE PMADRH ADDRH,W PMADRH ADDRL,W PMADRL LOW DATA_ADDR FSR0L HIGH DATA_ADDR FSR0H PMCON1,CFGS PMCON1,WREN PMCON1,LWLO ; ; ; ; ; ; ; ; ; ; ; ; ; Disable ints so required sequences will execute properly Bank 3 Load initial address MOVIW MOVWF MOVIW MOVWF FSR0++ PMDATL FSR0++ PMDATH ; Load first data byte into lower ; ; Load second data byte into upper ; MOVF XORLW ANDLW BTFSC GOTO PMADRL,W 0x1F 0x1F STATUS,Z START_WRITE ; Check if lower bits of address are '00000' ; Check if we're on the last of 16 addresses ; ; Exit if last of 16 words, ; MOVLW MOVWF MOVLW MOVWF BSF NOP 55h PMCON2 0AAh PMCON2 PMCON1,WR ; ; ; ; ; ; ; ; PMADRL,F LOOP ; Still loading latches Increment address ; Write next latches PMCON1,LWLO ; No more loading latches - Actually start Flash program ; memory write 55h PMCON2 0AAh PMCON2 PMCON1,WR ; ; ; ; ; ; ; ; ; ; ; ; ; Load initial data address Load initial data address Not configuration space Enable writes Only Load Write Latches Required Sequence LOOP NOP INCF GOTO Required Sequence START_WRITE BCF MOVLW MOVWF MOVLW MOVWF BSF NOP NOP BCF BSF DS40001723D-page 100 PMCON1,WREN INTCON,GIE Start of required write sequence: Write 55h Write AAh Set WR bit to begin write NOP instructions are forced as processor loads program memory write latches Start of required write sequence: Write 55h Write AAh Set WR bit to begin write NOP instructions are forced as processor writes all the program memory write latches simultaneously to program memory. After NOPs, the processor stalls until the self-write process in complete after write processor continues with 3rd instruction Disable writes Enable interrupts 2013-2015 Microchip Technology Inc. PIC12(L)F1571/2 10.3 Modifying Flash Program Memory When modifying existing data in a program memory row, and data within that row must be preserved, it must first be read and saved in a RAM image. Program memory is modified using the following steps: 1. 2. 3. 4. 5. 6. 7. Load the starting address of the row to be modified. Read the existing data from the row into a RAM image. Modify the RAM image to contain the new data to be written into program memory. Load the starting address of the row to be rewritten. Erase the program memory row. Load the write latches with data from the RAM image. Initiate a programming operation. FIGURE 10-7: FLASH PROGRAM MEMORY MODIFY FLOWCHART Rev. 10-000050A 7/30/2013 Start Modify Operation Read Operation (See Note 1) An image of the entire row read must be stored in RAM Modify Image The words to be modified are changed in the RAM image Erase Operation (See Note 2) Write Operation Use RAM image (See Note 3) End Modify Operation Note 1: See Figure 10-2. 2: See Figure 10-4. 3: See Figure 10-6. 2013-2015 Microchip Technology Inc. DS40001723D-page 101 PIC12(L)F1571/2 10.4 User ID, Device ID and Configuration Word Access When read access is initiated on an address outside the parameters listed in Table 10-2, the PMDATH:PMDATL register pair is cleared, reading back ‘0’s. Instead of accessing program memory, the User IDs, Device ID/Revision ID and Configuration Words can be accessed when CFGS = 1 in the PMCON1 register. This is the region that would be pointed to by PC<15> = 1, but not all addresses are accessible. Different access may exist for reads and writes. Refer to Table 10-2. TABLE 10-2: USER ID, DEVICE ID AND CONFIGURATION WORD ACCESS (CFGS = 1) Address Function Read Access Write Access 8000h-8003h User IDs Yes Yes 8006h/8005h Device ID/Revision ID Yes No 8007h-8008h Configuration Words 1 and 2 Yes No EXAMPLE 10-4: CONFIGURATION WORD AND DEVICE ID ACCESS * This code block will read 1 word of program memory at the memory address: * PROG_ADDR_LO (must be 00h-08h) data will be returned in the variables; * PROG_DATA_HI, PROG_DATA_LO BANKSEL MOVLW MOVWF CLRF PMADRL PROG_ADDR_LO PMADRL PMADRH ; Select correct Bank ; ; Store LSB of address ; Clear MSB of address BSF BCF BSF NOP NOP BSF PMCON1,CFGS INTCON,GIE PMCON1,RD INTCON,GIE ; ; ; ; ; ; Select Configuration Space Disable interrupts Initiate read Executed (See Figure 10-2) Ignored (See Figure 10-2) Restore interrupts MOVF MOVWF MOVF MOVWF PMDATL,W PROG_DATA_LO PMDATH,W PROG_DATA_HI ; ; ; ; Get LSB of word Store in user location Get MSB of word Store in user location DS40001723D-page 102 2013-2015 Microchip Technology Inc. PIC12(L)F1571/2 10.5 Write Verify It is considered good programming practice to verify that program memory writes agree with the intended value. Since program memory is stored as a full page then the stored program memory contents are compared with the intended data stored in RAM after the last write is complete. FIGURE 10-8: FLASH PROGRAM MEMORY VERIFY FLOWCHART Rev. 10-000051A 7/30/2013 Start Verify Operation This routine assumes that the last row of data written was from an image saved on RAM. This image will be used to verify the data currently stored in Flash Program Memory Read Operation (See Note 1) PMDAT = RAM image ? No Yes Fail Verify Operation No Last word ? Yes End Verify Operation Note 1: See Figure 10-1. 2013-2015 Microchip Technology Inc. DS40001723D-page 103 PIC12(L)F1571/2 10.6 Register Definitions: Flash Program Memory Control REGISTER 10-1: R/W-x/u PMDATL: PROGRAM MEMORY DATA LOW BYTE REGISTER R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u PMDAT<7:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit u = Bit is unchanged x = Bit is unknown U = Unimplemented bit, read as ‘0’ ‘1’ = Bit is set ‘0’ = Bit is cleared -n/n = Value at POR and BOR/Value at all other Resets bit 7-0 PMDAT<7:0>: Read/Write Value for Least Significant bits of Program Memory bits REGISTER 10-2: PMDATH: PROGRAM MEMORY DATA HIGH BYTE REGISTER U-0 U-0 — — R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u PMDAT<13:8> bit 7 bit 0 Legend: R = Readable bit W = Writable bit u = Bit is unchanged x = Bit is unknown U = Unimplemented bit, read as ‘0’ ‘1’ = Bit is set ‘0’ = Bit is cleared -n/n = Value at POR and BOR/Value at all other Resets bit 7-6 Unimplemented: Read as ‘0’ bit 5-0 PMDAT<13:8>: Read/Write Value for Most Significant bits of Program Memory bits DS40001723D-page 104 2013-2015 Microchip Technology Inc. PIC12(L)F1571/2 REGISTER 10-3: R/W-0/0 PMADRL: PROGRAM MEMORY ADDRESS LOW BYTE REGISTER R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 PMADR<7:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit u = Bit is unchanged x = Bit is unknown U = Unimplemented bit, read as ‘0’ ‘1’ = Bit is set ‘0’ = Bit is cleared -n/n = Value at POR and BOR/Value at all other Resets bit 7-0 PMADR<7:0>: Specifies Least Significant bits for Program Memory Address bits REGISTER 10-4: U-1 PMADRH: PROGRAM MEMORY ADDRESS HIGH BYTE REGISTER R/W-0/0 R/W-0/0 R/W-0/0 —(1) R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 PMADR<14:8> bit 7 bit 0 Legend: R = Readable bit W = Writable bit u = Bit is unchanged x = Bit is unknown U = Unimplemented bit, read as ‘0’ ‘1’ = Bit is set ‘0’ = Bit is cleared -n/n = Value at POR and BOR/Value at all other Resets bit 7 Unimplemented: Read as ‘1’(1) bit 6-0 PMADR<14:8>: Specifies the Most Significant bits for Program Memory Address bits Note 1: Unimplemented, read as ‘1’. 2013-2015 Microchip Technology Inc. DS40001723D-page 105 PIC12(L)F1571/2 REGISTER 10-5: U-1 PMCON1: PROGRAM MEMORY CONTROL 1 REGISTER R/W-0/0 (1) — CFGS R/W-0/0 R/W/HC-0/0 R/W/HC-x/q(2) (3) LWLO FREE WRERR R/W-0/0 R/S/HC-0/0 R/S/HC-0/0 WREN WR RD bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ S = Bit can only be set x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared HC = Hardware Clearable bit bit 7 Unimplemented: Read as ‘1’(1) bit 6 CFGS: Configuration Select bit 1 = Accesses Configuration, User ID and Device ID registers 0 = Accesses Flash program memory bit 5 LWLO: Load Write Latches Only bit(3) 1 = Only the addressed program memory write latch is loaded/updated on the next WR command 0 = The addressed program memory write latch is loaded/updated and a write of all program memory write latches will be initiated on the next WR command bit 4 FREE: Program Flash Erase Enable bit 1 = Performs an erase operation on the next WR command (hardware cleared upon completion) 0 = Performs a write operation on the next WR command bit 3 WRERR: Program/Erase Error Flag bit(2) 1 = Condition indicates an improper program or erase sequence attempt or termination (bit is set automatically on any set attempt (writes ‘1’) of the WR bit) 0 = The program or erase operation completed normally bit 2 WREN: Program/Erase Enable bit 1 = Allows program/erase cycles 0 = Inhibits programming/erasing of program Flash bit 1 WR: Write Control bit 1 = Initiates a program Flash program/erase operation The operation is self-timed and the bit is cleared by hardware once operation is complete. The WR bit can only be set (not cleared) in software. 0 = Program/erase operation to the Flash is complete and inactive bit 0 RD: Read Control bit 1 = Initiates a program Flash read Read takes one cycle. RD is cleared in hardware. The RD bit can only be set (not cleared) in software. 0 = Does not initiate a program Flash read Note 1: 2: 3: Unimplemented bit, read as ‘1’. The WRERR bit is automatically set by hardware when a program memory write or erase operation is started (WR = 1). The LWLO bit is ignored during a program memory erase operation (FREE = 1). DS40001723D-page 106 2013-2015 Microchip Technology Inc. PIC12(L)F1571/2 REGISTER 10-6: W-0/0 PMCON2: PROGRAM MEMORY CONTROL 2 REGISTER W-0/0 W-0/0 W-0/0 W-0/0 W-0/0 W-0/0 W-0/0 Program Memory Control Register 2 bit 7 bit 0 Legend: R = Readable bit W = Writable bit S = Bit can only be set x = Bit is unknown U = Unimplemented bit, read as ‘0’ ‘1’ = Bit is set ‘0’ = Bit is cleared -n/n = Value at POR and BOR/Value at all other Resets bit 7-0 Flash Memory Unlock Pattern bits To unlock writes, a 55h must be written first, followed by an AAh, before setting the WR bit of the PMCON1 register. The value written to this register is used to unlock the writes. There are specific timing requirements on these writes. TABLE 10-3: Name SUMMARY OF REGISTERS ASSOCIATED WITH FLASH PROGRAM MEMORY Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register on Page INTCON GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF 74 PMCON1 —(1) CFGS LWLO FREE WRERR WREN WR RD 106 PMCON2 Program Memory Control Register 2 107 PMADRL PMADRL<7:0> 105 PMADRH —(1) PMADRH<6:0> PMDATL 105 PMDATL<7:0> — PMDATH — 104 PMDATH<5:0> 104 Legend: — = unimplemented location, read as ‘0’. Shaded cells are not used by Flash program memory. Note 1: Unimplemented, read as ‘1’. TABLE 10-4: Name CONFIG1 CONFIG2 SUMMARY OF CONFIGURATION WORD WITH FLASH PROGRAM MEMORY Bits Bit -/7 Bit -/6 Bit 13/5 Bit 12/4 Bit 11/3 13:8 — — — — CLKOUTEN 7:0 CP MCLRE PWRTE 13:8 — — LVP DEBUG LPBOR BORV 7:0 — — — — — — WDTE<1:0> Bit 10/2 Bit 9/1 Bit 8/0 BOREN<1:0> — — FOSC<1:0> STVREN PLLEN WRT<1:0> Register on Page 42 43 Legend: — = unimplemented location, read as ‘0’. Shaded cells are not used by Flash program memory. 2013-2015 Microchip Technology Inc. DS40001723D-page 107 PIC12(L)F1571/2 NOTES: DS40001723D-page 108 2013-2015 Microchip Technology Inc. PIC12(L)F1571/2 11.0 I/O PORTS Each port has three standard registers for its operation. These registers are: • TRISx registers (Data Direction) • PORTx registers (reads the levels on the pins of the device) • LATx registers (Output Latch) • INLVLx (Input Level Control) • ODCONx registers (Open-Drain Control) • SLRCONx registers (Slew Rate Control) Ports that support analog inputs have an associated ANSELx register. When an ANSELx bit is set, the digital input buffer associated with that bit is disabled. Disabling the input buffer prevents analog signal levels on the pin between a logic high and low from causing excessive current in the logic input circuitry. A simplified model of a generic I/O port, without the interfaces to other peripherals, is shown in Figure 11-1. FIGURE 11-1: GENERIC I/O PORT OPERATION Rev. 10-000052A 7/30/2013 Some ports may have one or more of the following additional registers. These registers are: Read LATx • ANSELx (Analog Select) • WPUx (Weak Pull-up) TRISx In general, when a peripheral is enabled on a port pin, that pin cannot be used as a general purpose output. However, the pin can still be read. D Q Write LATx Write PORTx VDD CK PORT AVAILABILITY PER DEVICE Device PORTA TABLE 11-1: Data Register Data bus I/O pin Read PORTx To digital peripherals PIC12(L)F1571 ● ANSELx PIC12(L)F1572 ● To analog peripherals The Data Latch (LATx registers) is useful for Read-Modify-Write operations on the value that the I/O pins are driving. VSS A write operation to the LATx register has the same effect as a write to the corresponding PORTx register. A read of the LATx register reads the values held in the I/O port latches, while a read of the PORTx register reads the actual I/O pin value. 2013-2015 Microchip Technology Inc. DS40001723D-page 109 PIC12(L)F1571/2 11.1 Alternate Pin Function The Alternate Pin Function Control (APFCON) register is used to steer specific peripheral input and output functions between different pins. The APFCON register is shown in Register 11-1. For this device family, the following functions can be moved between different pins. • • • • • • These bits have no effect on the values of any TRISx register. PORTx and TRISx overrides will be routed to the correct pin. The unselected pin will be unaffected. RX/DT TX/CK CWGOUTA CWGOUTB PWM2 PWM1 11.2 Register Definitions: Alternate Pin Function Control REGISTER 11-1: APFCON: ALTERNATE PIN FUNCTION CONTROL REGISTER R/W-0/0 R/W-0/0 R/W-0/0 U-0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 RXDTSEL CWGASEL CWGBSEL — T1GSEL TXCKSEL P2SEL P1SEL bit 7 bit 0 Legend: R = Readable bit W = Writable bit u = Bit is unchanged x = Bit is unknown U = Unimplemented bit, read as ‘0’ ‘1’ = Bit is set ‘0’ = Bit is cleared -n/n = Value at POR and BOR/Value at all other Resets bit 7 RXDTSEL: Pin Selection bit 1 = RX/DT function is on RA5 0 = RX/DT function is on RA1 bit 6 CWGASEL: Pin Selection bit 1 = CWGOUTA function is on RA5 0 = CWGOUTA function is on RA2 bit 5 CWGBSEL: Pin Selection bit 1 = CWGOUTB function is on RA4 0 = CWGOUTB function is on RA0 bit 4 Unimplemented: Read as ‘0’ bit 3 T1GSEL: Pin Selection bit 1 = T1G function is on RA3 0 = T1G function is on RA4 bit 2 TXCKSEL: Pin Selection bit 1 = TX/CK function is on RA4 0 = TX/CK function is on RA0 bit 1 P2SEL: Pin Selection bit 1 = PWM2 function is on RA4 0 = PWM2 function is on RA0 bit 0 P1SEL: Pin Selection bit 1 = PWM1 function is on RA5 0 = PWM1 function is on RA1 DS40001723D-page 110 2013-2015 Microchip Technology Inc. PIC12(L)F1571/2 11.3 11.3.1 PORTA Registers DATA REGISTER PORTA is a 6-bit wide, bidirectional port. The corresponding Data Direction register is TRISA (Register 11-3). Setting a TRISA bit (= 1) will make the corresponding PORTA pin an input (i.e., disable the output driver). Clearing a TRISA bit (= 0) will make the corresponding PORTA pin an output (i.e., enables output driver and puts the contents of the output latch on the selected pin). The exception is RA3, which is input-only and its TRISA bit will always read as ‘1’. Example 11-1 shows how to initialize an I/O port. Reading the PORTA register (Register 11-2) reads the status of the pins, whereas writing to it will write to the PORT latch. All write operations are Read-Modify-Write operations. Therefore, a write to a port implies that the port pins are read, this value is modified and then written to the Port Data Latch (LATA). 11.3.2 DIRECTION CONTROL The TRISA register (Register 11-3) controls the PORTA pin output drivers, even when they are being used as analog inputs. The user should ensure the bits in the TRISA register are maintained set when using them as analog inputs. I/O pins configured as analog input always read ‘0’. 11.3.3 OPEN-DRAIN CONTROL The ODCONA register (Register 11-7) controls the open-drain feature of the port. Open-drain operation is independently selected for each pin. When an ODCONA bit is set, the corresponding port output becomes an open-drain driver capable of sinking current only. When an ODCONA bit is cleared, the corresponding port output pin is the standard push-pull drive capable of sourcing and sinking current. 11.3.4 SLEW RATE CONTROL The SLRCONA register (Register 11-8) controls the slew rate option for each port pin. Slew rate control is independently selectable for each port pin. When an SLRCONA bit is set, the corresponding port pin drive is slew rate limited. When an SLRCONA bit is cleared, the corresponding port pin drive slews at the maximum rate possible. 2013-2015 Microchip Technology Inc. 11.3.5 INPUT THRESHOLD CONTROL The INLVLA register (Register 11-9) controls the input voltage threshold for each of the available PORTA input pins. A selection between the Schmitt Trigger CMOS or the TTL compatible thresholds is available. The input threshold is important in determining the value of a read of the PORTA register and also the level at which an Interrupt-On-Change occurs, if that feature is enabled. See Section 26.3 “DC Characteristics” for more information on threshold levels. Note: 11.3.6 Changing the input threshold selection should be performed while all peripheral modules are disabled. Changing the threshold level during the time a module is active may inadvertently generate a transition associated with an input pin, regardless of the actual voltage level on that pin. ANALOG CONTROL The ANSELA register (Register 11-5) is used to configure the Input mode of an I/O pin to analog. Setting the appropriate ANSELA bit high will cause all digital reads on the pin to be read as ‘0’ and allow analog functions on the pin to operate correctly. The state of the ANSELA bits has no effect on digital output functions. A pin with TRIS clear and ANSELA set will still operate as a digital output, but the Input mode will be analog. This can cause unexpected behavior when executing Read-Modify-Write instructions on the affected port. Note: The ANSELA bits default to the Analog mode after Reset. To use any pins as digital general purpose or peripheral inputs, the corresponding ANSELA bits must be initialized to ‘0’ by user software. EXAMPLE 11-1: BANKSEL CLRF BANKSEL CLRF BANKSEL CLRF BANKSEL MOVLW MOVWF INITIALIZING PORTA PORTA PORTA LATA LATA ANSELA ANSELA TRISA B'00111000' TRISA ; ;Init PORTA ;Data Latch ; ; ;digital I/O ; ;Set RA<5:3> as inputs ;and set RA<2:0> as ;outputs DS40001723D-page 111 PIC12(L)F1571/2 11.3.7 PORTA FUNCTIONS AND OUTPUT PRIORITIES Each PORTA pin is multiplexed with other functions. The pins, their combined functions and their output priorities are shown in Table 11-2. TABLE 11-2: RA0 ICSPDAT CWG1B(3) DAC1OUT TX(2,3) PWM2(3) RA0 RA1 PWM1(3) RA1 RA2 CWG1A CWG1FLT C1OUT PWM3 RA2 RA3 None RA4 CLKOUT CWG1B TX(2) PWM2 RA4 RA5 CWG1A PWM1 RA5 Note 1: 2: 3: DS40001723D-page 112 Function Priority(1) Pin Name When multiple outputs are enabled, the actual pin control goes to the peripheral with the highest priority. Analog input functions, such as ADC and comparator inputs, are not shown in the priority lists. These inputs are active when the I/O pin is set for Analog mode using the ANSELx registers. Digital output functions may control the pin when it is in Analog mode with the priority shown below in Table 11-2. PORTA OUTPUT PRIORITY Priority listed from highest to lowest. PIC12(L)F1572 only. Default pin (see APFCON register). 2013-2015 Microchip Technology Inc. PIC12(L)F1571/2 11.4 Register Definitions: PORTA REGISTER 11-2: PORTA: PORTA REGISTER U-0 U-0 — — R/W-x/x R/W-x/x R-x/x R/W-x/x R/W-x/x R/W-x/x RA<5:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit u = Bit is unchanged x = Bit is unknown U = Unimplemented bit, read as ‘0’ ‘1’ = Bit is set ‘0’ = Bit is cleared -n/n = Value at POR and BOR/Value at all other Resets bit 7-6 Unimplemented: Read as ‘0’ bit 5-0 RA<5:0>: PORTA I/O Value bits(1) 1 = Port pin is > VIH 0 = Port pin is < VIL Note 1: Writes to PORTA are actually written to corresponding LATA register. Reads from the PORTA register are the return of actual I/O pin values. REGISTER 11-3: TRISA: PORTA TRI-STATE REGISTER U-0 U-0 — — R/W-1/1 R/W-1/1 TRISA<5:4> U-1 —(1) R/W-1/1 R/W-1/1 R/W-1/1 TRISA<2:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit u = Bit is unchanged x = Bit is unknown U = Unimplemented bit, read as ‘0’ ‘1’ = Bit is set ‘0’ = Bit is cleared -n/n = Value at POR and BOR/Value at all other Resets bit 7-6 Unimplemented: Read as ‘0’ bit 5-4 TRISA<5:4>: PORTA Tri-State Control bits 1 = PORTA pin configured as an input (tri-stated) 0 = PORTA pin configured as an output bit 3 Unimplemented: Read as ‘1’(1) bit 2-0 TRISA<2:0>: PORTA Tri-State Control bits 1 = PORTA pin configured as an input (tri-stated) 0 = PORTA pin configured as an output Note 1: Unimplemented, read as ‘1’. 2013-2015 Microchip Technology Inc. DS40001723D-page 113 PIC12(L)F1571/2 REGISTER 11-4: LATA: PORTA DATA LATCH REGISTER U-0 U-0 — — R/W-x/u R/W-x/u U-0 LATA<5:4>(1) R/W-x/u R/W-x/u R/W-x/u LATA<2:0>(1) — bit 7 bit 0 Legend: R = Readable bit W = Writable bit u = Bit is unchanged x = Bit is unknown U = Unimplemented bit, read as ‘0’ ‘1’ = Bit is set ‘0’ = Bit is cleared -n/n = Value at POR and BOR/Value at all other Resets bit 7-6 Unimplemented: Read as ‘0’ bit 5-4 LATA<5:4>: RA<5:4> Output Latch Value bits(1) bit 3 Unimplemented: Read as ‘0’ bit 2-0 LATA<2:0>: RA<2:0> Output Latch Value bits(1) Note 1: Writes to PORTA are actually written to corresponding LATA register. Reads from the PORTA register are the return of actual I/O pin values. REGISTER 11-5: ANSELA: PORTA ANALOG SELECT REGISTER U-0 U-0 U-0 R/W-1/1 U-0 — — — ANSA4 — R/W-1/1 R/W-1/1 R/W-1/1 ANSA<2:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit u = Bit is unchanged x = Bit is unknown U = Unimplemented bit, read as ‘0’ ‘1’ = Bit is set ‘0’ = Bit is cleared -n/n = Value at POR and BOR/Value at all other Resets bit 7-5 Unimplemented: Read as ‘0’ bit 4 ANSA4: Analog Select Between Analog or Digital Function on RA4 Pins (respectively) bit 1 = Analog input; pin is assigned as analog input, digital input buffer is disabled(1) 0 = Digital I/O; pin is assigned to port or digital special function bit 3 Unimplemented: Read as ‘0’ bit 2-0 ANSA<2:0>: Analog Select Between Analog or Digital Function on RA<2:0> pins (respectively) bits 1 = Analog input; pin is assigned as analog input, digital input buffer is disabled(1) 0 = Digital I/O; pin is assigned to port or digital special function Note 1: When setting a pin to an analog input, the corresponding TRISx bit must be set to Input mode in order to allow external control of the voltage on the pin. DS40001723D-page 114 2013-2015 Microchip Technology Inc. PIC12(L)F1571/2 REGISTER 11-6: U-0 WPUA: WEAK PULL-UP PORTA REGISTER U-0 — R/W-1/1 R/W-1/1 R/W-1/1 — R/W-1/1 WPUA<5:0> R/W-1/1 R/W-1/1 (1,2,3) bit 7 bit 0 Legend: R = Readable bit W = Writable bit u = Bit is unchanged x = Bit is unknown U = Unimplemented bit, read as ‘0’ ‘1’ = Bit is set ‘0’ = Bit is cleared -n/n = Value at POR and BOR/Value at all other Resets bit 7-6 Unimplemented: Read as ‘0’ bit 5-0 WPUA<5:0>: Weak Pull-up Register bits(1,2,3) 1 = Pull-up is enabled 0 = Pull-up is disabled Note 1: 2: 3: Global WPUEN bit of the OPTION_REG register must be cleared for individual pull-ups to be enabled. The weak pull-up device is automatically disabled if the pin is configured as an output. For the WPUA3 bit, when MCLRE = 1, the weak pull-up is internally enabled, but not reported here. REGISTER 11-7: ODCONA: PORTA OPEN-DRAIN CONTROL REGISTER U-0 U-0 — — R/W-0/0 R/W-0/0 ODA<5:4> U-0 — R/W-0/0 R/W-0/0 R/W-0/0 ODA<2:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit u = Bit is unchanged x = Bit is unknown U = Unimplemented bit, read as ‘0’ ‘1’ = Bit is set ‘0’ = Bit is cleared -n/n = Value at POR and BOR/Value at all other Resets bit 7-6 Unimplemented: Read as ‘0’ bit 5-4 ODA<5:4>: PORTA Open-Drain Enable bits For RA<5:4> Pins, Respectively: 1 = Port pin operates as open-drain drive (sink current only) 0 = Port pin operates as standard push-pull drive (source and sink current) bit 3 Unimplemented: Read as ‘0’ bit 2-0 ODA<2:0>: PORTA Open-Drain Enable bits For RA<2:0> Pins, Respectively: 1 = Port pin operates as open-drain drive (sink current only) 0 = Port pin operates as standard push-pull drive (source and sink current) 2013-2015 Microchip Technology Inc. DS40001723D-page 115 PIC12(L)F1571/2 REGISTER 11-8: SLRCONA: PORTA SLEW RATE CONTROL REGISTER U-0 U-0 — — R/W-1/1 R/W-1/1 U-0 SLRA<5:4> R/W-1/1 — R/W-1/1 R/W-1/1 SLRA<2:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit u = Bit is unchanged x = Bit is unknown U = Unimplemented bit, read as ‘0’ ‘1’ = Bit is set ‘0’ = Bit is cleared -n/n = Value at POR and BOR/Value at all other Resets bit 7-6 Unimplemented: Read as ‘0’ bit 5-4 SLRA<5:4>: PORTA Slew Rate Enable bits For RA<5:4> Pins, Respectively: 1 = Port pin slew rate is limited 0 = Port pin slews at maximum rate bit 3 Unimplemented: Read as ‘0’ bit 2-0 SLRA<2:0>: PORTA Slew Rate Enable bits For RA<2:0> Pins, Respectively: 1 = Port pin slew rate is limited 0 = Port pin slews at maximum rate REGISTER 11-9: INLVLA: PORTA INPUT LEVEL CONTROL REGISTER U-0 U-0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 — — INLVLA5 INLVLA4 INLVLA3 INLVLA2 INLVLA1 INLVLA0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit u = Bit is unchanged x = Bit is unknown U = Unimplemented bit, read as ‘0’ ‘1’ = Bit is set ‘0’ = Bit is cleared -n/n = Value at POR and BOR/Value at all other Resets bit 7-6 Unimplemented: Read as ‘0’ bit 5-0 INLVLA<5:0>: PORTA Input Level Select bits For RA<5:0> Pins, Respectively: 1 = ST input is used for PORT reads and Interrupt-On-Change 0 = TTL input is used for PORT reads and Interrupt-On-Change DS40001723D-page 116 2013-2015 Microchip Technology Inc. PIC12(L)F1571/2 TABLE 11-3: SUMMARY OF REGISTERS ASSOCIATED WITH PORTA Name ANSELA APFCON Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 — — — ANSA4 — RXDTSEL CWGASEL CWGBSEL — Bit 2 Bit 1 Bit 0 ANSA<2:0> T1GSEL TXCKSEL P2SEL Register on Page 114 P1SEL INLVLA<5:0> 110 INLVLA — — LATA — — LATA<5:4> — LATA<2:0> 114 ODCONA — — ODA<5:4> — ODA<2:0> 115 PS<2:0> 157 WPUEN INTEDG PORTA — — SLRCONA — — SLRA<5:4> — SLRA<2:0> 116 TRISA — — TRISA<5:4> —(1) TRISA<2:0> 113 WPUA — — OPTION_REG TMR0CS TMR0SE 116 PSA RA<5:0> 113 WPUA<5:0> 115 Legend: — = unimplemented location, read as ‘0’. Shaded cells are not used by PORTA. Note 1: Unimplemented, read as ‘1’. TABLE 11-4: Name CONFIG1 Bits SUMMARY OF CONFIGURATION WORD WITH PORTA Bit -/7 Bit -/6 Bit 13/5 Bit 12/4 Bit 11/3 IESO CLKOUTEN 13:8 — — FCMEN 7:0 CP MCLRE PWRTE WDTE<1:0> Bit 10/2 Bit 9/1 BOREN<1:0> Bit 8/0 — FOSC<2:0> Register on Page 42 Legend: — = unimplemented location, read as ‘0’. Shaded cells are not used by PORTA. 2013-2015 Microchip Technology Inc. DS40001723D-page 117 PIC12(L)F1571/2 NOTES: DS40001723D-page 118 2013-2015 Microchip Technology Inc. PIC12(L)F1571/2 12.0 INTERRUPT-ON-CHANGE The PORTA and PORTB pins can be configured to operate as Interrupt-On-Change (IOC) pins. An interrupt can be generated by detecting a signal that has either a rising edge or a falling edge. Any individual port pin, or combination of port pins, can be configured to generate an interrupt. The Interrupt-On-Change module has the following features: • • • • Interrupt-On-Change enable (Master Switch) Individual pin configuration Rising and falling edge detection Individual pin interrupt flags Figure 12-1 is a block diagram of the IOC module. 12.1 Enabling the Module 12.3 Interrupt Flags The IOCAFx and IOCBFx bits located in the IOCAF and IOCBF registers, respectively, are status flags that correspond to the Interrupt-On-Change pins of the associated port. If an expected edge is detected on an appropriately enabled pin, then the status flag for that pin will be set, and an interrupt will be generated if the IOCIE bit is set. The IOCIF bit of the INTCON register reflects the status of all IOCAFx and IOCBFx bits. 12.4 Clearing Interrupt Flags The individual status flags, (IOCAFx and IOCBFx bits), can be cleared by resetting them to zero. If another edge is detected during this clearing operation, the associated status flag will be set at the end of the sequence, regardless of the value actually being written. To allow individual port pins to generate an interrupt, the IOCIE bit of the INTCON register must be set. If the IOCIE bit is disabled, the edge detection on the pin will still occur, but an interrupt will not be generated. In order to ensure that no detected edge is lost while clearing flags, only AND operations masking out known changed bits should be performed. The following sequence is an example of what should be performed. 12.2 Individual Pin Configuration EXAMPLE 12-1: For each port pin, a rising edge detector and a falling edge detector are present. To enable a pin to detect a rising edge, the associated bit of the IOCxP register is set. To enable a pin to detect a falling edge, the associated bit of the IOCxN register is set. MOVLW XORWF ANDWF A pin can be configured to detect rising and falling edges simultaneously by setting both associated bits of the IOCxP and IOCxN registers, respectively. 12.5 CLEARING INTERRUPT FLAGS (PORTA EXAMPLE) 0xff IOCAF, W IOCAF, F Operation in Sleep The Interrupt-On-Change interrupt sequence will wake the device from Sleep mode, if the IOCIE bit is set. If an edge is detected while in Sleep mode, the IOCxF register will be updated prior to the first instruction executed out of Sleep. 2013-2015 Microchip Technology Inc. DS40001723D-page 119 PIC12(L)F1571/2 FIGURE 12-1: INTERRUPT-ON-CHANGE BLOCK DIAGRAM (PORTA EXAMPLE) Rev. 10-000 037A 6/2/201 4 IOCANx D Q R Q4Q1 edge detect RAx IOCAPx D data bus = 0 or 1 Q D S to data bus IOCAFx Q write IOCAFx R IOCIE Q2 IOC interrupt to CPU core from all other IOCnFx individual pin detectors FOSC Q1 Q1 Q2 Q2 Q2 Q3 Q3 Q4 Q4Q1 Q1 Q3 Q4 Q4Q1 DS40001723D-page 120 Q4 Q4Q1 Q4Q1 2013-2015 Microchip Technology Inc. PIC12(L)F1571/2 12.6 Register Definitions: Interrupt-On-Change Control REGISTER 12-1: IOCAP: INTERRUPT-ON-CHANGE PORTA POSITIVE EDGE REGISTER U-0 U-0 — — R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 IOCAP<5:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit u = Bit is unchanged x = Bit is unknown U = Unimplemented bit, read as ‘0’ ‘1’ = Bit is set ‘0’ = Bit is cleared -n/n = Value at POR and BOR/Value at all other Resets bit 7-6 Unimplemented: Read as ‘0’ bit 5-0 IOCAP<5:0>: Interrupt-On-Change PORTA Positive Edge Enable bits 1 = Interrupt-On-Change is enabled on the pin for a positive going edge; IOCAFx bit and IOCIF flag will be set upon detecting an edge 0 = Interrupt-On-Change is disabled for the associated pin REGISTER 12-2: IOCAN: INTERRUPT-ON-CHANGE PORTA NEGATIVE EDGE REGISTER U-0 U-0 — — R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 IOCAN<5:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit u = Bit is unchanged x = Bit is unknown U = Unimplemented bit, read as ‘0’ ‘1’ = Bit is set ‘0’ = Bit is cleared -n/n = Value at POR and BOR/Value at all other Resets bit 7-6 Unimplemented: Read as ‘0’ bit 5-0 IOCAN<5:0>: Interrupt-On-Change PORTA Negative Edge Enable bits 1 = Interrupt-On-Change is enabled on the pin for a negative going edge; IOCAFx bit and IOCIF flag will be set upon detecting an edge. 0 = Interrupt-On-Change is disabled for the associated pin 2013-2015 Microchip Technology Inc. DS40001723D-page 121 PIC12(L)F1571/2 REGISTER 12-3: IOCAF: INTERRUPT-ON-CHANGE PORTA FLAG REGISTER U-0 U-0 — — R/W/HS-0/0 R/W/HS-0/0 R/W/HS-0/0 R/W/HS-0/0 R/W/HS-0/0 R/W/HS-0/0 IOCAF<5:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared HS - Bit is set in hardware bit 7-6 Unimplemented: Read as ‘0’ bit 5-0 IOCAF<5:0>: Interrupt-On-Change PORTA Flag bits 1 = An enabled change was detected on the associated pin Set when IOCAPx = 1 and a rising edge was detected on RAx, or when IOCANx = 1 and a falling edge was detected on RAx. 0 = No change was detected or the user cleared the detected change TABLE 12-1: Name SUMMARY OF REGISTERS ASSOCIATED WITH INTERRUPT-ON-CHANGE Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 ANSELA — — — ANSA4 — INTCON TMR0IE INTE IOCIE Bit 2 Bit 1 Bit 0 ANSA<2:0> GIE PEIE — — IOCAF<5:0> 122 IOCAN — — IOCAN<5:0> 121 IOCAP — — IOCAP<5:0> 121 TRISA — — TRISA<5:4> INTF 114 IOCAF —(1) TMR0IF Register on Page IOCIF TRISA<2:0> 74 113 Legend: — = unimplemented location, read as ‘0’. Shaded cells are not used by Interrupt-On-Change. Note 1: Unimplemented, read as ‘1’. DS40001723D-page 122 2013-2015 Microchip Technology Inc. PIC12(L)F1571/2 13.0 FIXED VOLTAGE REFERENCE (FVR) The Fixed Voltage Reference (FVR) is a stable voltage reference, independent of VDD, with a nominal output level (VFVR) of 1.024V. The output of the FVR can be configured to supply a reference voltage to the following: • ADC input channel • Comparator positive input • Comparator negative input The FVR can be enabled by setting the FVREN bit of the FVRCON register. 13.1 The CDAFVR<1:0> bits of the FVRCON register are used to enable and configure the gain amplifier settings for the reference supplied to the comparator modules. Reference Section 17.0 “Comparator Module” for additional information. To minimize current consumption when the FVR is disabled, the FVR buffers should be turned off by clearing the Buffer Gain Selection bits. 13.2 Independent Gain Amplifier The output of the FVR supplied to the peripherals, (listed above), is routed through a programmable gain amplifier. Each amplifier can be programmed for a gain of 1x, 2x or 4x, to produce the three possible voltage levels. FIGURE 13-1: The ADFVR<1:0> bits of the FVRCON register are used to enable and configure the gain amplifier settings for the reference supplied to the ADC module. Reference Section 15.0 “Analog-to-Digital Converter (ADC) Module” for additional information. FVR Stabilization Period The FVR can be enabled by setting the FVREN bit of the FVRCON register. When the Fixed Voltage Reference module is enabled, it requires time for the reference and amplifier circuits to stabilize. Once the circuits stabilize and are ready for use, the FVRRDY bit of the FVRCON register will be set. See the FVR Stabilization Period characterization graph, Figure 27-21. VOLTAGE REFERENCE BLOCK DIAGRAM Rev. 10-000053A 8/6/2013 ADFVR<1:0> CDAFVR<1:0> FVREN Note 1 2 1x 2x 4x FVR_buffer1 (To ADC Module) 1x 2x 4x FVR_buffer2 (To Comparators) 2 + _ FVRRDY Note 1: Any peripheral requiring the Fixed Voltage Reference (see Table 13-1). 2013-2015 Microchip Technology Inc. DS40001723D-page 123 PIC12(L)F1571/2 TABLE 13-1: PERIPHERALS REQUIRING THE FIXED VOLTAGE REFERENCE (FVR) Peripheral HFINTOSC BOR LDO Conditions Description FOSC<2:0> = 010 and IRCF<3:0> = 000x INTOSC is active and device is not in Sleep. BOREN<1:0> = 11 BOR is always enabled. BOREN<1:0> = 10 and BORFS = 1 BOR is disabled in Sleep mode, BOR Fast Start is enabled. BOREN<1:0> = 01 and BORFS = 1 BOR under software control, BOR Fast Start is enabled. All PIC12F1571/2 devices, when VREGPM = 1 and not in Sleep The device runs off of the Low-Power Regulator when in Sleep mode. DS40001723D-page 124 2013-2015 Microchip Technology Inc. PIC12(L)F1571/2 13.3 Register Definitions: FVR Control REGISTER 13-1: FVRCON: FIXED VOLTAGE REFERENCE CONTROL REGISTER R/W-0/0 R-q/q R/W-0/0 R/W-0/0 FVREN(1) FVRRDY(2) TSEN(3) TSRNG(3) R/W-0/0 R/W-0/0 R/W-0/0 CDAFVR<1:0>(1) R/W-0/0 ADFVR<1:0>(1) bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared q = Value depends on condition bit 7 FVREN: Fixed Voltage Reference Enable bit(1) 1 = Fixed Voltage Reference is enabled 0 = Fixed Voltage Reference is disabled bit 6 FVRRDY: Fixed Voltage Reference Ready Flag bit(2) 1 = Fixed Voltage Reference output is ready for use 0 = Fixed Voltage Reference output is not ready or not enabled bit 5 TSEN: Temperature Indicator Enable bit(3) 1 = Temperature indicator is enabled 0 = Temperature indicator is disabled bit 4 TSRNG: Temperature Indicator Range Selection bit(3) 1 = VOUT = VDD – 4VT (High Range) 0 = VOUT = VDD – 2VT (Low Range) bit 3-2 CDAFVR<1:0>: Comparator FVR Buffer Gain Selection bits(1) 11 = Comparator FVR Buffer Gain is 4x, with output VCDAFVR = 4x VFVR(4) 10 = Comparator FVR Buffer Gain is 2x, with output VCDAFVR = 2x VFVR(4) 01 = Comparator FVR Buffer Gain is 1x, with output VCDAFVR = 1x VFVR 00 = Comparator FVR Buffer is off bit 1-0 ADFVR<1:0>: ADC FVR Buffer Gain Selection bit(1) 11 = ADC FVR Buffer Gain is 4x, with output VADFVR = 4x VFVR(4) 10 = ADC FVR Buffer Gain is 2x, with output VADFVR = 2x VFVR(4) 01 = ADC FVR Buffer Gain is 1x, with output VADFVR = 1x VFVR 00 = ADC FVR Buffer is off Note 1: 2: 3: 4: To minimize current consumption when the FVR is disabled, the FVR buffers should be turned off by clearing the Buffer Gain Selection bits. FVRRDY is always ‘1’ for the PIC12F1571/2 devices. See Section 14.0 “Temperature Indicator Module” for additional information. Fixed Voltage Reference output cannot exceed VDD. TABLE 13-2: Name FVRCON SUMMARY OF REGISTERS ASSOCIATED WITH THE FIXED VOLTAGE REFERENCE Bit 7 Bit 6 Bit 5 Bit 4 FVREN FVRRDY TSEN TSRNG 2013-2015 Microchip Technology Inc. Bit 3 Bit 2 CDAFVR>1:0> Bit 1 Bit 0 ADFVR<1:0> Register on Page 125 DS40001723D-page 125 PIC12(L)F1571/2 NOTES: DS40001723D-page 126 2013-2015 Microchip Technology Inc. PIC12(L)F1571/2 14.0 TEMPERATURE INDICATOR MODULE FIGURE 14-1: This family of devices is equipped with a temperature circuit designed to measure the operating temperature of the silicon die. The circuit’s range of operating temperature falls between -40°C and +85°C. The output is a voltage that is proportional to the device temperature. The output of the temperature indicator is internally connected to the device ADC. Rev. 10-000069A 7/31/2013 VDD TSEN The circuit may be used as a temperature threshold detector or a more accurate temperature indicator, depending on the level of calibration performed. A onepoint calibration allows the circuit to indicate a temperature closely surrounding that point. A two-point calibration allows the circuit to sense the entire range of temperature more accurately. Reference Application Note AN1333, “Use and Calibration of the Internal Temperature Indicator” (DS00001333) for more details regarding the calibration process. 14.1 TEMPERATURE CIRCUIT DIAGRAM TSRNG VOUT Temp. Indicator To ADC Circuit Operation Figure 14-1 shows a simplified block diagram of the temperature circuit. The proportional voltage output is achieved by measuring the forward voltage drop across multiple silicon junctions. Equation 14-1 describes the output characteristics of the temperature indicator. EQUATION 14-1: VOUT RANGES High Range: VOUT = VDD – 4 VT Low Range: VOUT = VDD – 2 VT The temperature sense circuit is integrated with the Fixed Voltage Reference (FVR) module. See Section 13.0 “Fixed Voltage Reference (FVR)” for more information. The circuit is enabled by setting the TSEN bit of the FVRCON register. When disabled, the circuit draws no current. 14.2 Minimum Operating VDD When the temperature circuit is operated in low range, the device may be operated at any operating voltage that is within specifications. When the temperature circuit is operated in high range, the device operating voltage, VDD, must be high enough to ensure that the temperature circuit is correctly biased. Table 14-1 shows the recommended minimum VDD vs. range setting. TABLE 14-1: RECOMMENDED VDD VS. RANGE Min. VDD, TSRNG = 1 Min. VDD, TSRNG = 0 3.6V 1.8V 14.3 Temperature Output The circuit operates in either high or low range. The high range, selected by setting the TSRNG bit of the FVRCON register, provides a wider output voltage. This provides more resolution over the temperature range, but may be less consistent from part to part. This range requires a higher bias voltage to operate and thus, a higher VDD is needed. The output of the circuit is measured using the internal Analog-to-Digital Converter. A channel is reserved for the temperature circuit output. Refer to Section 15.0 “Analog-to-Digital Converter (ADC) Module” for detailed information. The low range is selected by clearing the TSRNG bit of the FVRCON register. The low range generates a lower voltage drop and thus, a lower bias voltage is needed to operate the circuit. The low range is provided for low-voltage operation. To ensure accurate temperature measurements, the user must wait at least 200 s after the ADC input multiplexer is connected to the temperature indicator output before the conversion is performed. In addition, the user must wait 200 s between sequential conversions of the temperature indicator output. 2013-2015 Microchip Technology Inc. 14.4 ADC Acquisition Time DS40001723D-page 127 PIC12(L)F1571/2 TABLE 14-2: Name FVRCON SUMMARY OF REGISTERS ASSOCIATED WITH THE TEMPERATURE INDICATOR Bit 7 Bit 6 Bit 5 Bit 4 FVREN FVRRDY TSEN TSRNG Bit 3 Bit 2 CDAFVR<1:0> Bit 1 Bit 0 ADFVR<1:0> Register on Page 118 Legend: Shaded cells are unused by the temperature indicator module. DS40001723D-page 128 2013-2015 Microchip Technology Inc. PIC12(L)F1571/2 15.0 ANALOG-TO-DIGITAL CONVERTER (ADC) MODULE The ADC voltage reference is software selectable to be either internally generated or externally supplied. The Analog-to-Digital Converter (ADC) allows conversion of an analog input signal to a 10-bit binary representation of that signal. This device uses analog inputs, which are multiplexed into a single sample and hold circuit. The output of the sample and hold is connected to the input of the converter. The converter generates a 10-bit binary result via successive approximation and stores the conversion result into the ADC result registers (ADRESH:ADRESL register pair). Figure 15-1 shows the block diagram of the ADC. FIGURE 15-1: The ADC can generate an interrupt upon completion of a conversion. This interrupt can be used to wake-up the device from Sleep. ADC BLOCK DIAGRAM VDD ADPREF Rev. 10-000033A 7/30/2013 Positive Reference Select VDD VREF+ pin External Channel Inputs ANa VRNEG VRPOS . . . ADC_clk sampled input ANz Internal Channel Inputs ADCS<2:0> VSS AN0 ADC Clock Select FOSC/n Fosc Divider FRC FOSC FRC Temp Indicator DACx_output ADC CLOCK SOURCE FVR_buffer1 ADC Sample Circuit CHS<4:0> ADFM set bit ADIF Write to bit GO/DONE 10-bit Result GO/DONE Q1 Q4 16 start ADRESH Q2 TRIGSEL<3:0> 10 complete ADRESL Enable Trigger Select ADON . . . VSS Trigger Sources AUTO CONVERSION TRIGGER 2013-2015 Microchip Technology Inc. DS40001723D-page 129 PIC12(L)F1571/2 15.1 ADC Configuration When configuring and using the ADC the following functions must be considered: • • • • • • Port configuration Channel selection ADC voltage reference selection ADC conversion clock source Interrupt control Result formatting 15.1.1 PORT CONFIGURATION The ADC can be used to convert both analog and digital signals. When converting analog signals, the I/O pin should be configured for analog by setting the associated TRISx and ANSELx bits. Refer to Section 11.0 “I/O Ports” for more information. Note: 15.1.2 Analog voltages on any pin that is defined as a digital input may cause the input buffer to conduct excess current. CHANNEL SELECTION There are 7 channel selections available: • • • • AN<3:0> pins Temperature Indicator DAC1_output FVR_buffer1 15.1.4 CONVERSION CLOCK The source of the conversion clock is software-selectable via the ADCSx bits of the ADCON1 register. There are seven possible clock options: • • • • • • • FOSC/2 FOSC/4 FOSC/8 FOSC/16 FOSC/32 FOSC/64 FRC (internal Fast RC oscillator) The time to complete one bit conversion is defined as TAD. One full 10-bit conversion requires 11.5 TAD periods, as shown in Figure 15-2. For correct conversion, the appropriate TAD specification must be met. Refer to the ADC conversion requirements in Section 26.0 “Electrical Specifications” for more information. Table 15-1 gives examples of appropriate ADC clock selections. Note: Unless using the FRC, any changes in the system clock frequency will change the ADC clock frequency, which may adversely affect the ADC result. The CHS bits of the ADCON0 register determine which channel is connected to the sample and hold circuit. When changing channels, a delay (TACQ) is required before starting the next conversion. Refer to Section 15.2.6 “ADC Conversion Procedure” for more information. 15.1.3 ADC VOLTAGE REFERENCE The ADC module uses a positive and a negative voltage reference. The positive reference is labeled ref+ and the negative reference is labeled ref-. The positive voltage reference (ref+) is selected by the ADPREFx bits in the ADCON1 register. The positive voltage reference source can be: • VREF+ pin • VDD The negative voltage reference (ref-) source is: • VSS DS40001723D-page 130 2013-2015 Microchip Technology Inc. PIC12(L)F1571/2 TABLE 15-1: ADC CLOCK PERIOD (TAD) VS. DEVICE OPERATING FREQUENCIES ADC Clock Period (TAD) ADC Clock Source Device Frequency (FOSC) ADCS<2:0> 20 MHz 16 MHz 8 MHz 4 MHz 1 MHz Fosc/2 000 100 ns 125 ns 250 ns 500 ns 2.0 s Fosc/4 100 200 ns 250 ns 500 ns 1.0 s 4.0 s Fosc/8 001 400 ns 500 ns 1.0 s 2.0 s 8.0 s Fosc/16 101 800 ns 1.0 s 2.0 s 4.0 s 16.0 s Fosc/32 010 1.6 s 2.0 s 4.0 s 8.0 s 32.0 s Fosc/64 110 3.2 s 4.0 s 8.0 s 16.0 s 64.0 s FRC x11 1.0-6.0 s 1.0-6.0 s 1.0-6.0 s 1.0-6.0 s 1.0-6.0 s Legend: Shaded cells are outside of recommended range. Note: The TAD period when using the FRC clock source can fall within a specified range (see TAD parameter). The TAD period when using the FOSC-based clock source can be configured for a more precise TAD period. However, the FRC clock source must be used when conversions are to be performed with the device in Sleep mode. FIGURE 15-2: ANALOG-TO-DIGITAL CONVERSION TAD CYCLES Rev. 10-000035A 7/30/2013 TAD1 TAD2 TAD3 TAD4 TAD5 TAD6 TAD7 TAD8 TAD9 TAD10 TAD11 b9 b8 b7 b6 b5 b4 b3 b2 b1 b0 THCD Conversion Starts TACQ Holding capacitor disconnected from analog input (THCD). Set GO bit On the following cycle: ADRESH:ADRESL is loaded, GO bit is cleared, ADIF bit is set, holding capacitor is reconnected to analog input. Enable ADC (ADON bit) and Select channel (ACS bits) 2013-2015 Microchip Technology Inc. DS40001723D-page 131 PIC12(L)F1571/2 15.1.5 INTERRUPTS 15.1.6 The ADC module allows for the ability to generate an interrupt upon completion of an Analog-to-Digital conversion. The ADC Interrupt Flag is the ADIF bit in the PIR1 register. The ADC Interrupt Enable is the ADIE bit in the PIE1 register. The ADIF bit must be cleared in software. RESULT FORMATTING The 10-bit ADC conversion result can be supplied in two formats, left justified or right justified. The ADFM bit of the ADCON1 register controls the output format. Figure 15-3 shows the two output formats. Note 1: The ADIF bit is set at the completion of every conversion, regardless of whether or not the ADC interrupt is enabled. 2: The ADC operates during Sleep only when the FRC oscillator is selected. This interrupt can be generated while the device is operating or while in Sleep. If the device is in Sleep, the interrupt will wake-up the device. Upon waking from Sleep, the next instruction following the SLEEP instruction is always executed. If the user is attempting to wake-up from Sleep and resume in-line code execution, the ADIE bit of the PIE1 register and the PEIE bit of the INTCON register must both be set, and the GIE bit of the INTCON register must be cleared. If all three of these bits are set, the execution will switch to the Interrupt Service Routine. FIGURE 15-3: 10-BIT ADC CONVERSION RESULT FORMAT Rev. 10-000054A 7/30/2013 ADRESH ADRESL (ADFM = 0) MSB LSB bit 7 bit 0 bit 7 10-bit ADC Result (ADFM = 1) bit 0 Unimplemented: Read as ‘0’ MSB bit 7 Unimplemented: Read as ‘0’ DS40001723D-page 132 LSB bit 0 bit 7 bit 0 10-bit ADC Result 2013-2015 Microchip Technology Inc. PIC12(L)F1571/2 15.2 15.2.1 ADC Operation STARTING A CONVERSION To enable the ADC module, the ADON bit of the ADCON0 register must be set to a ‘1’. Setting the GO/DONE bit of the ADCON0 register to a ‘1’ will start the Analog-to-Digital conversion. Note: 15.2.2 The GO/DONE bit should not be set in the same instruction that turns on the ADC. Refer to Section 15.2.6 “ADC Conversion Procedure”. COMPLETION OF A CONVERSION When the conversion is complete, the ADC module will: • Clear the GO/DONE bit • Set the ADIF Interrupt Flag bit • Update the ADRESH and ADRESL registers with new conversion result 15.2.3 TERMINATING A CONVERSION 15.2.5 The auto-conversion trigger allows periodic ADC measurements without software intervention. When a rising edge of the selected source occurs, the GO/DONE bit is set by hardware. The auto-conversion trigger source is selected with the TRIGSEL<3:0> bits of the ADCON2 register. Using the auto-conversion trigger does not assure proper ADC timing. It is the user’s responsibility to ensure that the ADC timing requirements are met. The PWM module can trigger the ADC in two ways, directly through the PWMx_OFx_match or through the interrupts generated by all four match signals. See Section 22.0 “16-Bit Pulse-Width Modulation (PWM) Module”. If the interrupts are chosen, each enabled interrupt in PWMxINTE will trigger a conversion. Refer to Figure 15-4 for more information. See Table 15-2 for auto-conversion sources. FIGURE 15-4: If a conversion must be terminated before completion, the GO/DONE bit can be cleared in software. The ADRESH and ADRESL registers will be updated with the partially complete Analog-to-Digital conversion sample. Incomplete bits will match the last bit converted. Note: 15.2.4 The ADC module can operate during Sleep. This requires the ADC clock source to be set to the FRC option. Performing the ADC conversion during Sleep can reduce system noise. If the ADC interrupt is enabled, the device will wake-up from Sleep when the conversion completes. If the ADC interrupt is disabled, the ADC module is turned off after the conversion completes, although the ADON bit remains set. When the ADC clock source is something other than FRC, a SLEEP instruction causes the present conversion to be aborted and the ADC module is turned off, although the ADON bit remains set. 2013-2015 Microchip Technology Inc. 16-BIT PWM INTERRUPT BLOCK DIAGRAM Rev. 10-000154A 10/24/2013 OFx_match PWMxOFIE PHx_match PWMxPHIE A device Reset forces all registers to their Reset state. Thus, the ADC module is turned off and any pending conversion is terminated. ADC OPERATION DURING SLEEP AUTO-CONVERSION TRIGGER PWMx_interrupt DCx_match PWMxDCIE PRx_match PWMxPRIE TABLE 15-2: AUTO-CONVERSION SOURCES Source Peripheral Signal Name Timer0 T0_overflow Timer1 T1_overflow Timer2 T2_match Comparator C1 C1OUT_sync PWM1 PWM1_OF_match PWM1 PWM1_interrupt PWM2 PWM2_OF_match PWM2 PWM2_interrupt PWM3 PWM3_OF_match PWM3 PWM3_interrupt DS40001723D-page 133 PIC12(L)F1571/2 15.2.6 ADC CONVERSION PROCEDURE This is an example procedure for using the ADC to perform an Analog-to-Digital conversion: 1. 2. 3. 4. 5. 6. 7. 8. Configure port: • Disable pin output driver (refer to the TRISx register) • Configure pin as analog (refer to the ANSELx register) • Disable weak pull-ups either globally (refer to the OPTION_REG register) or individually (refer to the appropriate WPUx register) Configure the ADC module: • Select ADC conversion clock • Configure voltage reference • Select ADC input channel • Turn on ADC module Configure ADC interrupt (optional): • Clear ADC interrupt flag • Enable ADC interrupt • Enable peripheral interrupt • Enable global interrupt(1) Wait the required acquisition time.(2) Start conversion by setting the GO/DONE bit. Wait for ADC conversion to complete by one of the following: • Polling the GO/DONE bit • Waiting for the ADC interrupt (interrupts enabled) Read ADC result. Clear the ADC interrupt flag (required if interrupt is enabled). EXAMPLE 15-1: ADC CONVERSION ;This code block configures the ADC ;for polling, Vdd and Vss references, FRC ;oscillator and AN0 input. ; ;Conversion start & polling for completion ; are included. ; BANKSEL ADCON1 ; MOVLW B’11110000’ ;Right justify, FRC ;oscillator MOVWF ADCON1 ;Vdd and Vss Vref+ BANKSEL TRISA ; BSF TRISA,0 ;Set RA0 to input BANKSEL ANSEL ; BSF ANSEL,0 ;Set RA0 to analog BANKSEL WPUA BCF WPUA,0 ;Disable weak ;pull-up on RA0 BANKSEL ADCON0 ; MOVLW B’00000001’ ;Select channel AN0 MOVWF ADCON0 ;Turn ADC On CALL SampleTime ;Acquisiton delay BSF ADCON0,ADGO ;Start conversion BTFSC ADCON0,ADGO ;Is conversion done? GOTO $-1 ;No, test again BANKSEL ADRESH ; MOVF ADRESH,W ;Read upper 2 bits MOVWF RESULTHI ;store in GPR space BANKSEL ADRESL ; MOVF ADRESL,W ;Read lower 8 bits MOVWF RESULTLO ;Store in GPR space Note 1: The global interrupt can be disabled if the user is attempting to wake-up from Sleep and resume in-line code execution. 2: Refer to Section 15.4 “ADC Acquisition Requirements”. DS40001723D-page 134 2013-2015 Microchip Technology Inc. PIC12(L)F1571/2 15.3 Register Definitions: ADC Control REGISTER 15-1: U-0 ADCON0: ADC CONTROL REGISTER 0 R/W-0/0 R/W-0/0 — R/W-0/0 R/W-0/0 CHS<4:0> R/W-0/0 R/W-0/0 R/W-0/0 GO/DONE ADON bit 7 bit 0 Legend: R = Readable bit W = Writable bit u = Bit is unchanged x = Bit is unknown U = Unimplemented bit, read as ‘0’ ‘1’ = Bit is set ‘0’ = Bit is cleared -n/n = Value at POR and BOR/Value at all other Resets bit 7 Unimplemented: Read as ‘0’ bit 6-2 CHS<4:0>: Analog Channel Select bits 00000 = AN0 00001 = AN1 00010 = AN2 00011 = AN3 00100 = Reserved; no channel connected • • • 11100 = Reserved; no channel connected 11101 = Temperature indicator(1) 11110 = DAC (Digital-to-Analog Converter)(2) 11111 = FVR (Fixed Voltage Reference) Buffer 1 output(3) bit 1 GO/DONE: ADC Conversion Status bit 1 = ADC conversion cycle is in progress Setting this bit starts an ADC conversion cycle. This bit is automatically cleared by hardware when the ADC conversion has completed. 0 = ADC conversion completed/not in progress bit 0 ADON: ADC Enable bit 1 = ADC is enabled 0 = ADC is disabled and consumes no operating current Note 1: 2: 3: See Section 14.0 “Temperature Indicator Module” for more information. See Section 16.0 “5-Bit Digital-to-Analog Converter (DAC) Module” for more information. See Section 13.0 “Fixed Voltage Reference (FVR)” for more information. 2013-2015 Microchip Technology Inc. DS40001723D-page 135 PIC12(L)F1571/2 REGISTER 15-2: R/W-0/0 ADCON1: ADC CONTROL REGISTER 1 R/W-0/0 ADFM R/W-0/0 R/W-0/0 ADCS<2:0> U-0 U-0 — — R/W-0/0 bit 7 R/W-0/0 ADPREF<1:0> bit 0 Legend: R = Readable bit W = Writable bit u = Bit is unchanged x = Bit is unknown U = Unimplemented bit, read as ‘0’ ‘1’ = Bit is set ‘0’ = Bit is cleared -n/n = Value at POR and BOR/Value at all other Resets bit 7 ADFM: ADC Result Format Select bit 1 = Right justified; six Most Significant bits of ADRESH are set to ‘0’ when the conversion result is loaded 0 = Left justified; six Least Significant bits of ADRESL are set to ‘0’ when the conversion result is loaded bit 6-4 ADCS<2:0>: ADC Conversion Clock Select bits 000 = FOSC/2 001 = FOSC/8 010 = FOSC/32 011 = FRC (clock supplied from an internal RC oscillator) 100 = FOSC/4 101 = FOSC/16 110 = FOSC/64 111 = FRC (clock supplied from an internal RC oscillator) bit 3-2 Unimplemented: Read as ‘0’ bit 1-0 ADPREF<1:0>: ADC Positive Voltage Reference Configuration bits 00 = VRPOS is connected to VDD 01 = Reserved 10 = VRPOS is connected to external VREF+ pin(1) 11 = VRPOS is connected to internal Fixed Voltage Reference (FVR) Note 1: When selecting the VREF+ pin as the source of the positive reference, be aware that a minimum voltage specification exists. See Section 26.0 “Electrical Specifications” for details. DS40001723D-page 136 2013-2015 Microchip Technology Inc. PIC12(L)F1571/2 REGISTER 15-3: R/W-0/0 ADCON2: ADC CONTROL REGISTER 2 R/W-0/0 R/W-0/0 TRIGSEL<3:0> R/W-0/0 (1) U-0 U-0 U-0 U-0 — — — — bit 7 bit 0 Legend: R = Readable bit W = Writable bit u = Bit is unchanged x = Bit is unknown U = Unimplemented bit, read as ‘0’ ‘1’ = Bit is set ‘0’ = Bit is cleared -n/n = Value at POR and BOR/Value at all other Resets bit 7-4 TRIGSEL<3:0>: Auto-Conversion Trigger Selection bits(1) 0000 = No auto-conversion trigger selected 0001 = PWM1 – PWM1_interrupt 0010 = PWM2 – PWM2_interrupt 0011 = Timer0 – T0_overflow(2) 0100 = Timer1 – T1_overflow(2) 0101 = Timer2 – T2_match 0110 = Comparator C1 – C1OUT_sync 0111 = PWM3 – PWM3_interrupt 1000 = PWM1 – PWM1_OF1_match 1001 = PWM2 – PWM2_OF2_match 1010 = PWM3 – PWM3_OF3_match 1011 = Reserved 1100 = Reserved 1101 = Reserved 1110 = Reserved 1111 = Reserved bit 3-0 Unimplemented: Read as ‘0’ Note 1: 2: This is a rising edge sensitive input for all sources. Signal also sets its corresponding interrupt flag. 2013-2015 Microchip Technology Inc. DS40001723D-page 137 PIC12(L)F1571/2 REGISTER 15-4: R/W-x/u ADRESH: ADC RESULT REGISTER HIGH (ADRESH) ADFM = 0 R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u ADRES<9:2> bit 7 bit 0 Legend: R = Readable bit W = Writable bit u = Bit is unchanged x = Bit is unknown U = Unimplemented bit, read as ‘0’ ‘1’ = Bit is set ‘0’ = Bit is cleared -n/n = Value at POR and BOR/Value at all other Resets bit 7-0 ADRES<9:2>: ADC Result Register bits Upper eight bits of 10-bit conversion result. REGISTER 15-5: R/W-x/u ADRESL: ADC RESULT REGISTER LOW (ADRESL) ADFM = 0 R/W-x/u ADRES<1:0> R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u — — — — — — bit 7 bit 0 Legend: R = Readable bit W = Writable bit u = Bit is unchanged x = Bit is unknown U = Unimplemented bit, read as ‘0’ ‘1’ = Bit is set ‘0’ = Bit is cleared -n/n = Value at POR and BOR/Value at all other Resets bit 7-6 ADRES<1:0>: ADC Result Register bits Lower two bits of 10-bit conversion result. bit 5-0 Reserved: Do not use DS40001723D-page 138 2013-2015 Microchip Technology Inc. PIC12(L)F1571/2 REGISTER 15-6: ADRESH: ADC RESULT REGISTER HIGH (ADRESH) ADFM = 1 R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u — — — — — — R/W-x/u R/W-x/u ADRES<9:8> bit 7 bit 0 Legend: R = Readable bit W = Writable bit u = Bit is unchanged x = Bit is unknown U = Unimplemented bit, read as ‘0’ ‘1’ = Bit is set ‘0’ = Bit is cleared -n/n = Value at POR and BOR/Value at all other Resets bit 7-2 Reserved: Do not use bit 1-0 ADRES<9:8>: ADC Result Register bits Upper two bits of 10-bit conversion result. REGISTER 15-7: R/W-x/u ADRESL: ADC RESULT REGISTER LOW (ADRESL) ADFM = 1 R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u ADRES<7:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit u = Bit is unchanged x = Bit is unknown U = Unimplemented bit, read as ‘0’ ‘1’ = Bit is set ‘0’ = Bit is cleared -n/n = Value at POR and BOR/Value at all other Resets bit 7-0 ADRES<7:0>: ADC Result Register bits Lower eight bits of 10-bit conversion result. 2013-2015 Microchip Technology Inc. DS40001723D-page 139 PIC12(L)F1571/2 15.4 ADC Acquisition Requirements For the ADC to meet its specified accuracy, the Charge Holding Capacitor (CHOLD) must be allowed to fully charge to the input channel voltage level. The Analog Input model is shown in Figure 15-5. The Source Impedance (RS) and the internal Sampling Switch Impedance (RSS) directly affect the time required to charge the capacitor, CHOLD. The Sampling Switch Impedance (RSS) varies over the device voltage (VDD); refer to Figure 15-5. The maximum recommended impedance for analog sources is 10 k. As the EQUATION 15-1: Assumptions: Source Impedance is decreased, the acquisition time may be decreased. After the analog input channel is selected (or changed), an ADC acquisition must be done before the conversion can be started. To calculate the minimum acquisition time, Equation 15-1 may be used. This equation assumes that 1/2 LSb error is used (1,024 steps for the ADC). The 1/2 LSb error is the maximum error allowed for the ADC to meet its specified resolution. ACQUISITION TIME EXAMPLE Temperature = 50°C and external impedance of 10k 5.0V V DD T ACQ = Amplifier Settling Time + Hold Capacitor Charging Time + Temperature Coefficient = T AMP + T C + T COFF = 2µs + T C + Temperature - 25°C 0.05µs/°C The value for TC can be approximated with the following equations: 1 = V CHOLD V AP P LI ED 1 – -------------------------n+1 2 –1 ;[1] VCHOLD charged to within 1/2 lsb –TC ---------- RC V AP P LI ED 1 – e = V CHOLD ;[2] VCHOLD charge response to VAPPLIED – Tc --------- 1 RC ;combining [1] and [2] V AP P LI ED 1 – e = V A PP LIE D 1 – -------------------------n + 1 2 –1 Note: Where n = number of bits of the ADC. Solving for TC: T C = – C HOLD R IC + R SS + R S ln(1/2047) = – 12.5pF 1k + 7k + 10k ln(0.0004885) = 1.715 µs Therefore: T AC Q = 2µs + 1.715 µs + 50°C- 25°C 0.05 µs/°C = 4.96µs Note 1: The Reference Voltage (VRPOS) has no effect on the equation, since it cancels itself out. 2: The Charge Holding Capacitor (CHOLD) is not discharged after each conversion. 3: The maximum recommended impedance for analog sources is 10 k. This is required to meet the pin leakage specification. DS40001723D-page 140 2013-2015 Microchip Technology Inc. PIC12(L)F1571/2 FIGURE 15-5: ANALOG INPUT MODEL Rev. 10-000070B 8/5/2014 VDD RS Analog Input pin VT § 0.6V RIC 1K Sampling switch SS RSS ILEAKAGE(1) VA Legend: CHOLD CPIN ILEAKAGE RIC RSS SS VT Note 1: FIGURE 15-6: CPIN 5pF CHOLD = 12.5 pF VT § 0.6V Ref- = Sample/Hold Capacitance = Input Capacitance = Leakage Current at the pin due to varies injunctions = Interconnect Resistance = Resistance of Sampling switch = Sampling Switch = Threshold Voltage VDD 6V 5V 4V 3V 2V RSS 5 6 7 8 9 10 11 Sampling Switch (k ) Refer to Section 26.0 “Electrical Specifications”. ADC TRANSFER FUNCTION Full-Scale Range 3FFh 3FEh ADC Output Code 3FDh 3FCh 3FBh 03h 02h 01h 00h Analog Input Voltage 0.5 LSB Ref- 2013-2015 Microchip Technology Inc. Zero-Scale Transition 1.5 LSB Full-Scale Transition Ref+ DS40001723D-page 141 PIC12(L)F1571/2 TABLE 15-3: Name SUMMARY OF REGISTERS ASSOCIATED WITH ADC Bit 7 ADCON0 — ADCON1 ADFM ADCON2 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 CHS<4:0> ADCS<2:0> TRIGSEL<3:0> Bit 1 Bit 0 Register on Page GO/DONE ADON 135 — — ADPREF<1:0> 136 — — — 137 — ADRESH ADC Result Register High 138, 139 ADRESL ADC Result Register Low 138, 139 ANSELA — — — ANSA4 — INTCON GIE PEIE TMR0IE INTE IOCIE TMR0IF ANSA<2:0> INTF IOCIF 114 (2) (2) 74 PIE1 TMR1GIE ADIE RCIE TXIE — — TMR2IE TMR1IE 75 PIR1 TMR1GIF ADIF RCIF(2) TXIF(2) — — TMR2IF TMR1IF 78 — — TRISA5 TRISA4 —(1) FVREN FVRRDY TSEN TSRNG CDAFVR<1:0> TRISA FVRCON TRISA<2:0> ADFVR<1:0> 113 125 Legend: — = unimplemented, read as ‘0’. Shaded cells are not used for the ADC module. Note 1: Unimplemented, read as ‘1’. 2: PIC12(L)F1572 only. DS40001723D-page 142 2013-2015 Microchip Technology Inc. PIC12(L)F1571/2 16.0 5-BIT DIGITAL-TO-ANALOG CONVERTER (DAC) MODULE The output of the DAC (DACx_output) can be selected as a reference voltage to the following: The Digital-to-Analog Converter supplies a variable voltage reference, ratiometric with the input source, with 32 selectable output levels. • Comparator positive input • ADC input channel • DACxOUT1 pin The positive input source (VSOURCE+) of the DAC can be connected to the: The Digital-to-Analog Converter (DAC) can be enabled by setting the DACEN bit of the DACxCON0 register. • External VREF+ pin • VDD supply voltage • FVR buffered output The negative input source (VSOURCE-) of the DAC can be connected to the: • Vss FIGURE 16-1: DIGITAL-TO-ANALOG CONVERTER BLOCK DIAGRAM Rev. 10-000026B 9/6/2013 VDD 00 01 VREF+ FVR_buffer2 10 Reserved 11 VSOURCE+ 5 DACR<4:0> R DACPSS R DACEN R 32-to-1 MUX R 32 Steps DACx_output To Peripherals R R DACxOUT1 (1) DACOE1 R VSS VSOURCE- Note 1: The unbuffered DACx_output is provided on the DACxOUT pin(s). 2013-2015 Microchip Technology Inc. DS40001723D-page 143 PIC12(L)F1571/2 16.1 Output Voltage Selection The DAC has 32 voltage level ranges. The 32 levels are set with the DACR<4:0> bits of the DACxCON1 register. The DAC output voltage can be determined by using Equation 16-1. 16.2 Ratiometric Output Level The DAC output value is derived using a resistor ladder with each end of the ladder tied to a positive and negative voltage reference input source. If the voltage of either input source fluctuates, a similar fluctuation will result in the DAC output value. The value of the individual resistors within the ladder can be found in Table 26-16. 16.3 DAC Voltage Reference Output The unbuffered DAC voltage can be output to the DACxOUTn pin(s) by setting the respective DACOEn bit(s) of the DACxCON0 register. Selecting the DAC reference voltage for output on either DACxOUTn pin automatically overrides the digital output buffer, the weak pull-up and digital input threshold detector functions of that pin. EQUATION 16-1: Reading the DACxOUTn pin when it has been configured for DAC reference voltage output will always return a ‘0’. Note: 16.4 The unbuffered DAC output (DACxOUTn) is not intended to drive an external load. Operation During Sleep When the device wakes up from Sleep through an interrupt or a Watchdog Timer time-out, the contents of the DACxCON0 register are not affected. To minimize current consumption in Sleep mode, the voltage reference should be disabled. 16.5 Effects of a Reset A device Reset affects the following: • DACx is disabled. • DACX output voltage is removed from the DACxOUTn pin(s). • The DACR<4:0> range select bits are cleared. DAC OUTPUT VOLTAGE IF DACEN = 1 DACR 4:0 DACx_output = VSOURCE+ – VSOURCE- ----------------------------+ VSOURCE5 2 Note: See the DACxCON0 register for the available VSOURCE+ and VSOURCE- selections. DS40001723D-page 144 2013-2015 Microchip Technology Inc. PIC12(L)F1571/2 16.6 Register Definitions: DAC Control REGISTER 16-1: DACxCON0: DACx VOLTAGE REFERENCE CONTROL REGISTER 0 R/W-0/0 U-0 R/W-0/0 U-0 DACEN — DACOE — R/W-0/0 R/W-0/0 U-0 U-0 — — DACPSS<1:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit u = Bit is unchanged x = Bit is unknown U = Unimplemented bit, read as ‘0’ ‘1’ = Bit is set ‘0’ = Bit is cleared -n/n = Value at POR and BOR/Value at all other Resets bit 7 DACEN: DAC Enable bit 1 = DACx is enabled 0 = DACx is disabled bit 6 Unimplemented: Read as ‘0’ bit 5 DACOE: DAC Voltage Output Enable bit 1 = DACx voltage level is output on the DACxOUT1 pin 0 = DACx voltage level is disconnected from the DACxOUT1 pin bit 4 Unimplemented: Read as ‘0’ bit 3-2 DACPSS<1:0>: DAC Positive Source Select bits 11 = Reserved 10 = FVR_buffer2 01 = VREF+ pin 00 = VDD bit 1-0 Unimplemented: Read as ‘0’ REGISTER 16-2: DACxCON1: DACx VOLTAGE REFERENCE CONTROL REGISTER 1 U-0 U-0 U-0 — — — R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 DACR<4:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit u = Bit is unchanged x = Bit is unknown U = Unimplemented bit, read as ‘0’ ‘1’ = Bit is set ‘0’ = Bit is cleared -n/n = Value at POR and BOR/Value at all other Resets bit 7-5 Unimplemented: Read as ‘0’ bit 4-0 DACR<4:0>: DAC Voltage Output Select bits TABLE 16-1: SUMMARY OF REGISTERS ASSOCIATED WITH THE DAC MODULE Name Bit 7 Bit 6 Bit 5 Bit 4 DACxCON0 DACEN — DACOE — DACxCON1 — — — Bit 3 Bit 2 DACPSS<1:0> DACR<4:0> Bit 1 Bit 0 Register on Page — — 145 145 Legend: — = Unimplemented location, read as ‘0’. 2013-2015 Microchip Technology Inc. DS40001723D-page 145 PIC12(L)F1571/2 NOTES: DS40001723D-page 146 2013-2015 Microchip Technology Inc. PIC12(L)F1571/2 17.0 COMPARATOR MODULE 17.1 Comparator Overview Comparators are used to interface analog circuits to a digital circuit by comparing two analog voltages and providing a digital indication of their relative magnitudes. Comparators are very useful mixed signal building blocks because they provide analog functionality independent of program execution. The analog comparator module includes the following features: A single comparator is shown in Figure 17-2 along with the relationship between the analog input levels and the digital output. When the analog voltage at VIN+ is less than the analog voltage at VIN-, the output of the comparator is a digital low level. When the analog voltage at VIN+ is greater than the analog voltage at VIN-, the output of the comparator is a digital high level. • • • • • • • • • The comparators available for this device are listed in Table 17-1. Independent comparator control Programmable input selection Comparator output is available internally/externally Programmable output polarity Interrupt-On-Change Wake-up from Sleep Programmable speed/power optimization PWM shutdown Programmable and Fixed Voltage Reference FIGURE 17-1: TABLE 17-1: AVAILABLE COMPARATORS Device C1 PIC12(L)F1571 ● PIC12(L)F1572 ● COMPARATOR MODULE SIMPLIFIED BLOCK DIAGRAM Rev. 10-000027C 9/6/2013 CxNCH<2:0> 3 CxON(1) 000 CxIN0CxIN1- 001 Reserved 010 Reserved 011 Reserved 100 Reserved 101 FVR_buffer2 110 CxON(1) CxVN 00 DAC_out 01 FVR_buffer2 10 Note 1: 2 Interrupt Falling Edge CxINTN set bit CxIF - D CxOUT Q MCxOUT + Q1 CxSP CxHYS CxPOL CxOUT_async to peripherals CxOUT_sync to peripherals CxSYNC CxOE 0 TRIS bit CxOUT D 11 CxPCH<1:0> CxINTP Cx CxVP 111 CxIN+ Interrupt Rising Edge CxON(1) Q 1 (From Timer1 Module) T1CLK When CxON = 0, all multiplexer inputs are disconnected and the Comparator will produce a ‘0’ at the output. 2013-2015 Microchip Technology Inc. DS40001723D-page 147 PIC12(L)F1571/2 FIGURE 17-2: SINGLE COMPARATOR 17.2.2 VIN+ + VIN- – Configuring the CxPCH<1:0> bits of the CMxCON1 register directs an internal voltage reference or an analog pin to the non-inverting input of the comparator: Output VINVIN+ 17.2 CxIN+ analog pin DAC1_output FVR_buffer2 VSS See Section 13.0 “Fixed Voltage Reference (FVR)” for more information on the Fixed Voltage Reference module. See Section 16.0 “5-Bit Digital-to-Analog Converter (DAC) Module” for more information on the DAC input signal. Output Note: • • • • The black areas of the output of the comparator represents the uncertainty due to input offsets and response time. Comparator Control The comparator has two control registers: CMxCON0 and CMxCON1. Any time the comparator is disabled (CxON = 0), all comparator inputs are disabled. 17.2.3 Enable Output selection Output polarity Speed/power selection Hysteresis enable Output synchronization The CMxCON1 register (see Register 17-2) contains control bits for the following: • • • • Interrupt enable Interrupt edge polarity Positive input channel selection Negative input channel selection 17.2.1 COMPARATOR ENABLE Setting the CxON bit of the CMxCON0 register enables the comparator for operation. Clearing the CxON bit disables the comparator resulting in minimum current consumption. COMPARATOR NEGATIVE INPUT SELECTION The CxNCH<2:0> bits of the CMxCON0 register direct one of the input sources to the comparator inverting input. Note: The CMxCON0 register (see Register 17-1) contains control and status bits for the following: • • • • • • COMPARATOR POSITIVE INPUT SELECTION 17.2.4 To use CxIN+ and CxIN- pins as analog input, the appropriate bits must be set in the ANSELx register and the corresponding TRISx bits must also be set to disable the output drivers. COMPARATOR OUTPUT SELECTION The output of the comparator can be monitored by reading either the CxOUT bit of the CMxCON0 register or the MCxOUT bit of the CMOUT register. In order to make the output available for an external connection, the following conditions must be true: • CxOE bit of the CMxCON0 register must be set • Corresponding TRISx bit must be cleared • CxON bit of the CMxCON0 register must be set The synchronous comparator output signal (CxOUT_sync) is available to the following peripheral(s): • Analog-to-Digital Converter (ADC) • Timer1 The asynchronous comparator output signal (CxOUT_async) is available to the following peripheral(s): • Complementary Waveform Generator (CWG) Note 1: The CxOE bit of the CMxCON0 register overrides the port data latch. Setting the CxON bit of the CMxCON0 register has no impact on the port override. 2: The internal output of the comparator is latched with each instruction cycle. Unless otherwise specified, external outputs are not latched. DS40001723D-page 148 2013-2015 Microchip Technology Inc. PIC12(L)F1571/2 17.2.5 COMPARATOR OUTPUT POLARITY Inverting the output of the comparator is functionally equivalent to swapping the comparator inputs. The polarity of the comparator output can be inverted by setting the CxPOL bit of the CMxCON0 register. Clearing the CxPOL bit results in a non-inverted output. Table 17-2 shows the output state versus input conditions, including polarity control. TABLE 17-2: COMPARATOR OUTPUT STATE VS. INPUT CONDITIONS Input Condition CxVN > CxVP CxVN < CxVP CxVN > CxVP CxVN < CxVP 17.2.6 CxPOL CxOUT 0 0 1 1 0 1 1 0 17.3 A simplified circuit for an analog input is shown in Figure 17-3. Since the analog input pins share their connection with a digital input, they have reverse biased ESD protection diodes to VDD and VSS. The analog input, therefore, must be between VSS and VDD. If the input voltage deviates from this range by more than 0.6V in either direction, one of the diodes is forward-biased and a latch-up may occur. A maximum source impedance of 10 k is recommended for the analog sources. Also, any external component connected to an analog input pin, such as a capacitor or a Zener diode, should have very little leakage current to minimize inaccuracies introduced. Note 1: When reading a PORT register, all pins configured as analog inputs will read as a ‘0’. Pins configured as digital inputs will convert as an analog input, according to the input specification. COMPARATOR SPEED/POWER SELECTION The trade-off between speed or power can be optimized during program execution with the CxSP control bit. The default state for this bit is ‘1’, which selects the Normal Speed mode. Device power consumption can be optimized at the cost of slower comparator propagation delay by clearing the CxSP bit to ‘0’. FIGURE 17-3: Analog Input Connection Considerations 2: Analog levels on any pin defined as a digital input, may cause the input buffer to consume more current than is specified. ANALOG INPUT MODEL Rev. 10-000071A 8/2/2013 VDD RS < 10K Analog Input pin VT § 0.6V RIC To Comparator ILEAKAGE(1) CPIN 5pF VA VT § 0.6V VSS Legend: CPIN ILEAKAGE RIC RS VA VT Note 1: = Input Capacitance = Leakage Current at the pin due to various junctions = Interconnect Resistance = Source Impedance = Analog Voltage = Threshold Voltage See Section 26.0 “Electrical Specifications”. 2013-2015 Microchip Technology Inc. DS40001723D-page 149 PIC12(L)F1571/2 17.4 Comparator Hysteresis A selectable amount of separation voltage can be added to the input pins of each comparator to provide a hysteresis function to the overall operation. Hysteresis is enabled by setting the CxHYS bit of the CMxCON0 register. See Section 26.0 “Electrical Specifications” for more information. 17.5 Timer1 Gate Operation The output resulting from a comparator operation can be used as a source for gate control of Timer1. See Section 19.5 “Timer1 Gate” for more information. This feature is useful for timing the duration or interval of an analog event. It is recommended that the comparator output be synchronized to Timer1. This ensures that Timer1 does not increment while a change in the comparator is occurring. 17.5.1 COMPARATOR OUTPUT SYNCHRONIZATION 17.6 An interrupt can be generated upon a change in the output value of the comparator for each comparator, a rising edge detector and a falling edge detector are present. When either edge detector is triggered and its associated enable bit is set (CxINTP and/or CxINTN bits of the CMxCON1 register), the corresponding interrupt flag bit (CxIF bit of the PIR2 register) will be set. To enable the interrupt, you must set the following bits: • CxON and CxPOL bits of the CMxCON0 register • CxIE bit of the PIE2 register • CxINTP bit of the CMxCON1 register (for a rising edge detection) • CxINTN bit of the CMxCON1 register (for a falling edge detection) • PEIE and GIE bits of the INTCON register The associated interrupt flag bit, CxIF bit of the PIR2 register, must be cleared in software. If another edge is detected while this flag is being cleared, the flag will still be set at the end of the sequence. Note: The output from the Cx comparator can be synchronized with Timer1 by setting the CxSYNC bit of the CMxCON0 register. Once enabled, the comparator output is latched on the falling edge of the Timer1 source clock. If a prescaler is used with Timer1, the comparator output is latched after the prescaling function. To prevent a race condition, the comparator output is latched on the falling edge of the Timer1 clock source and Timer1 increments on the rising edge of its clock source. See the Comparator Block Diagram (Figure 17-2) and the Timer1 Block Diagram (Figure 19-1) for more information. DS40001723D-page 150 Comparator Interrupt 17.7 Although a comparator is disabled, an interrupt can be generated by changing the output polarity with the CxPOL bit of the CMxCON0 register, or by switching the comparator on or off with the CxON bit of the CMxCON0 register. Comparator Response Time The comparator output is indeterminate for a period of time after the change of an input source or the selection of a new reference voltage. This period is referred to as the response time. The response time of the comparator differs from the settling time of the voltage reference. Therefore, both of these times must be considered when determining the total response time to a comparator input change. See the Comparator and Voltage Reference Specifications in Section 26.0 “Electrical Specifications” for more details. 2013-2015 Microchip Technology Inc. PIC12(L)F1571/2 17.8 Register Definitions: Comparator Control REGISTER 17-1: CMxCON0: COMPARATOR Cx CONTROL REGISTER 0 R/W-0/0 R-0/0 R/W-0/0 R/W-0/0 U-0 R/W-0/0 R/W-0/0 R/W-0/0 CxON CxOUT CxOE CxPOL — CxSP CxHYS CxSYNC bit 7 bit 0 Legend: R = Readable bit W = Writable bit u = Bit is unchanged x = Bit is unknown U = Unimplemented bit, read as ‘0’ ‘1’ = Bit is set ‘0’ = Bit is cleared -n/n = Value at POR and BOR/Value at all other Resets bit 7 CxON: Comparator Enable bit 1 = Comparator is enabled 0 = Comparator is disabled and consumes no active power bit 6 CxOUT: Comparator Output bit If CxPOL = 1 (inverted polarity): 1 = CxVP < CxVN 0 = CxVP > CxVN If CxPOL = 0 (non-inverted polarity): 1 = CxVP > CxVN 0 = CxVP < CxVN bit 5 CxOE: Comparator Output Enable bit 1 = CxOUT is present on the CxOUT pin; requires that the associated TRISx bit be cleared to actually drive the pin, not affected by CxON 0 = CxOUT is internal only bit 4 CxPOL: Comparator Output Polarity Select bit 1 = Comparator output is inverted 0 = Comparator output is not inverted bit 3 Unimplemented: Read as ‘0’ bit 2 CxSP: Comparator Speed/Power Select bit 1 = Comparator mode is in Normal Power, Higher Speed mode 0 = Comparator mode is in Low-Power, Low-Speed mode bit 1 CxHYS: Comparator Hysteresis Enable bit 1 = Comparator hysteresis is enabled 0 = Comparator hysteresis is disabled bit 0 CxSYNC: Comparator Output Synchronous Mode bit 1 = Comparator output to Timer1 and I/O pin is synchronous to changes on Timer1 clock source; output updated on the falling edge of Timer1 clock source 0 = Comparator output to Timer1 and I/O pin is asynchronous 2013-2015 Microchip Technology Inc. DS40001723D-page 151 PIC12(L)F1571/2 REGISTER 17-2: CMxCON1: COMPARATOR Cx CONTROL REGISTER 1 R/W-0/0 R/W-0/0 CxINTP CxINTN R/W-0/0 R/W-0/0 CxPCH<1:0> U-0 R/W-0/0 R/W-0/0 R/W-0/0 CxNCH<2:0> — bit 7 bit 0 Legend: R = Readable bit W = Writable bit u = Bit is unchanged x = Bit is unknown U = Unimplemented bit, read as ‘0’ ‘1’ = Bit is set ‘0’ = Bit is cleared -n/n = Value at POR and BOR/Value at all other Resets bit 7 CxINTP: Comparator Interrupt on Positive Going Edge Enable bit 1 = The CxIF interrupt flag will be set upon a positive going edge of the CxOUT bit 0 = No interrupt flag will be set on a positive going edge of the CxOUT bit bit 6 CxINTN: Comparator Interrupt on Negative Going Edge Enable bit 1 = The CxIF interrupt flag will be set upon a negative going edge of the CxOUT bit 0 = No interrupt flag will be set on a negative going edge of the CxOUT bit bit 5-4 CxPCH<1:0>: Comparator Positive Input Channel Select bits 11 = CxVP connects to VSS 10 = CxVP connects to FVR Voltage Reference 01 = CxVP connects to DAC Voltage Reference 00 = CxVP connects to CxIN+ pin bit 3 Unimplemented: Read as ‘0’ bit 2-0 CxNCH<1:0>: Comparator Negative Input Channel Select bits 111 = CxVN connects to GND 110 = CxVN connects to FVR Voltage Reference 101 = Reserved 100 = Reserved 011 = Reserved 010 = Reserved 001 = CxVN connects to CxIN1- pin 000 = CxVN connects to CxIN0- pin REGISTER 17-3: U-0 CMOUT: COMPARATOR OUTPUT REGISTER U-0 — — U-0 — U-0 — U-0 — U-0 — U-0 R-0/0 — MC1OUT bit 7 bit 0 Legend: R = Readable bit W = Writable bit u = Bit is unchanged x = Bit is unknown U = Unimplemented bit, read as ‘0’ ‘1’ = Bit is set ‘0’ = Bit is cleared -n/n = Value at POR and BOR/Value at all other Resets bit 7-1 Unimplemented: Read as ‘0’ bit 0 MC1OUT: Mirror Copy of C1OUT bit DS40001723D-page 152 2013-2015 Microchip Technology Inc. PIC12(L)F1571/2 TABLE 17-3: Name ANSELA SUMMARY OF REGISTERS ASSOCIATED WITH COMPARATOR MODULE Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 — — — ANSA4 — C1OE C1POL — Bit 2 C1ON C1OUT CM1CON1 C1NTP C1INTN — — — — DACEN — DACOE — DACPSS<1:0> CDAFVR<1:0> CMOUT DAC1CON0 — — — FVRCON FVREN FVRRDY TSEN TSRNG INTCON DAC1CON1 C1SP — — Bit 0 ANSA<2:0> CM1CON0 C1PCH<1:0> Bit 1 114 C1HYS C1SYNC C1NCH<2:0> — Register on Page 151 152 — MC1OUT 152 — — 145 DACR<4:0> 145 ADFVR<1:0> 125 GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF 74 PIE2 — — C1IE — — — — — 76 PIR2 — — C1IF — — — — — PORTA — — RA5 RA4 RA3 LATA — — LATA5 LATA4 TRISA — — TRISA5 TRISA4 79 RA<2:0> 113 — LATA<2:0> 114 —(1) TRISA<2:0> 113 Legend: — = unimplemented location, read as ‘0’. Shaded cells are unused by the comparator module. Note 1: Unimplemented, read as ‘1’. 2013-2015 Microchip Technology Inc. DS40001723D-page 153 PIC12(L)F1571/2 NOTES: DS40001723D-page 154 2013-2015 Microchip Technology Inc. PIC12(L)F1571/2 18.0 TIMER0 MODULE 18.1.2 8-BIT COUNTER MODE The Timer0 module is an 8-bit timer/counter with the following features: In 8-Bit Counter mode, the Timer0 module will increment on every rising or falling edge of the T0CKI pin. • • • • • • In 8-Bit Counter mode, the T0CKI pin is selected by setting the TMR0CS bit in the OPTION_REG register to ‘1’. 8-Bit Timer/Counter register (TMR0) 3-bit prescaler (independent of Watchdog Timer) Programmable internal or external clock source Programmable external clock edge selection Interrupt on overflow TMR0 can be used to gate Timer1 The rising or falling transition of the incrementing edge for either input source is determined by the TMR0SE bit in the OPTION_REG register. Figure 18-1 is a block diagram of the Timer0 module. 18.1 Timer0 Operation The Timer0 module can be used as either an 8-bit timer or an 8-bit counter. 18.1.1 8-BIT TIMER MODE The Timer0 module will increment every instruction cycle if used without a prescaler. The 8-Bit Timer mode is selected by clearing the TMR0CS bit of the OPTION_REG register. When TMR0 is written, the increment is inhibited for two instruction cycles immediately following the write. Note: The value written to the TMR0 register can be adjusted in order to account for the two instruction cycle delay when TMR0 is written. FIGURE 18-1: TIMER0 BLOCK DIAGRAM Rev. 10-000017A 8/5/2013 TMR0CS Fosc/4 T0CKI(1) PSA 0 1 TMR0SE 1 write to TMR0 Prescaler R 0 FOSC/2 T0CKI Sync Circuit PS<2:0> T0_overflow TMR0 Q1 set bit TMR0IF Note 1: The T0CKI prescale output frequency should not exceed FOSC/8. 2013-2015 Microchip Technology Inc. DS40001723D-page 155 PIC12(L)F1571/2 18.1.3 SOFTWARE PROGRAMMABLE PRESCALER A software programmable prescaler is available for exclusive use with Timer0. The prescaler is enabled by clearing the PSA bit of the OPTION_REG register. Note: The Watchdog Timer (WDT) uses its own independent prescaler. There are eight prescaler options for the Timer0 module, ranging from 1:2 to 1:256. The prescale values are selectable via the PS<2:0> bits of the OPTION_REG register. In order to have a 1:1 prescaler value for the Timer0 module, the prescaler must be disabled by setting the PSA bit of the OPTION_REG register. The prescaler is not readable or writable. All instructions writing to the TMR0 register will clear the prescaler. 18.1.4 18.1.5 8-BIT COUNTER MODE SYNCHRONIZATION When in 8-Bit Counter mode, the incrementing edge on the T0CKI pin must be synchronized to the instruction clock. Synchronization can be accomplished by sampling the prescaler output on the Q2 and Q4 cycles of the instruction clock. The high and low periods of the external clocking source must meet the timing requirements as shown in Section 26.0 “Electrical Specifications”. 18.1.6 OPERATION DURING SLEEP Timer0 cannot operate while the processor is in Sleep mode. The contents of the TMR0 register will remain unchanged while the processor is in Sleep mode. TIMER0 INTERRUPT Timer0 will generate an interrupt when the TMR0 register overflows from FFh to 00h. The TMR0IF interrupt flag bit of the INTCON register is set every time the TMR0 register overflows, regardless of whether or not the Timer0 interrupt is enabled. The TMR0IF bit can only be cleared in software. The Timer0 interrupt enable is the TMR0IE bit of the INTCON register. Note: The Timer0 interrupt cannot wake the processor from Sleep since the timer is frozen during Sleep. DS40001723D-page 156 2013-2015 Microchip Technology Inc. PIC12(L)F1571/2 18.2 Register Definitions: Option Register REGISTER 18-1: OPTION_REG: OPTION REGISTER R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 WPUEN INTEDG TMR0CS TMR0SE PSA R/W-1/1 R/W-1/1 R/W-1/1 PS<2:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit u = Bit is unchanged x = Bit is unknown U = Unimplemented bit, read as ‘0’ ‘1’ = Bit is set ‘0’ = Bit is cleared -n/n = Value at POR and BOR/Value at all other Resets bit 7 WPUEN: Weak Pull-Up Enable bit 1 = All weak pull-ups are disabled (except MCLR if it is enabled) 0 = Weak pull-ups are enabled by individual WPUx latch values bit 6 INTEDG: Interrupt Edge Select bit 1 = Interrupt on rising edge of INT pin 0 = Interrupt on falling edge of INT pin bit 5 TMR0CS: Timer0 Clock Source Select bit 1 = Transition on T0CKI pin 0 = Internal instruction cycle clock (FOSC/4) bit 4 TMR0SE: Timer0 Source Edge Select bit 1 = Increment on high-to-low transition on T0CKI pin 0 = Increment on low-to-high transition on T0CKI pin bit 3 PSA: Prescaler Assignment bit 1 = Prescaler is not assigned to the Timer0 module 0 = Prescaler is assigned to the Timer0 module bit 2-0 PS<2:0>: Prescaler Rate Select bits TABLE 18-1: Name Bit 7 TRISA 000 001 010 011 100 101 110 111 1:2 1:4 1:8 1 : 16 1 : 32 1 : 64 1 : 128 1 : 256 Bit 6 Bit 5 Bit 4 TRIGSEL<3:0> GIE OPTION_REG WPUEN TMR0 Timer0 Rate SUMMARY OF REGISTERS ASSOCIATED WITH TIMER0 ADCON2 INTCON Bit Value PEIE TMR0IE INTE INTEDG TMR0CS TMR0SE Bit 3 Bit 2 Bit 1 Bit 0 Register on Page — — — — 137 IOCIE TMR0IF INTF IOCIF 74 PSA PS<2:0> 157 Holding Register for the 8-bit Timer0 Count — — TRISA5 TRISA4 155* —(1) TRISA2 TRISA1 TRISA0 113 Legend: — = unimplemented location, read as ‘0’. Shaded cells are not used by the Timer0 module. * Page provides register information. Note 1: Unimplemented, read as ‘1’. 2013-2015 Microchip Technology Inc. DS40001723D-page 157 PIC12(L)F1571/2 NOTES: DS40001723D-page 158 2013-2015 Microchip Technology Inc. PIC12(L)F1571/2 19.0 TIMER1 MODULE WITH GATE CONTROL • Wake-up on overflow (external clock, Asynchronous mode only) • ADC auto-conversion trigger(s) • Selectable gate source polarity • Gate Toggle mode • Gate Single-Pulse mode • Gate value status • Gate event interrupt The Timer1 module is a 16-bit timer/counter with the following features: • • • • • • 16-bit Timer/Counter register pair (TMR1H:TMR1L) Programmable internal or external clock source 2-bit prescaler Optionally synchronized comparator out Multiple Timer1 gate (count enable) sources Interrupt on overflow FIGURE 19-1: Figure 19-1 is a block diagram of the Timer1 module. TIMER1 BLOCK DIAGRAM T1GSS<1:0> Rev. 10-000018D 8/5/2013 T1G 00 T0_overflow 01 C1OUT_sync 10 Reserved 11 T1GSPM 0 1 D 1 Single Pulse Acq. Control D 0 T1GVAL Q Q1 Q T1GGO/DONE T1GPOL CK Q Interrupt TMR1ON R set bit TMR1GIF det T1GTM TMR1GE set flag bit TMR1IF TMR1ON EN T1_overflow TMR1(2) TMR1H TMR1L Q Synchronized Clock Input 0 D 1 T1CLK T1SYNC TMR1CS<1:0> LFINTOSC (1) 11 10 T1CKI Fosc Internal Clock 01 00 Fosc/4 Internal Clock Prescaler 1,2,4,8 Synchronize(3) det 2 T1CKPS<1:0> Fosc/2 Internal Clock Sleep Input Note 1: ST Buffer is high speed type when using T1CKI. 2: Timer1 register increments on rising edge. 3: Synchronize does not operate while in Sleep. 2013-2015 Microchip Technology Inc. DS40001723D-page 159 PIC12(L)F1571/2 19.1 Timer1 Operation 19.2 The Timer1 module is a 16-bit incrementing counter which is accessed through the TMR1H:TMR1L register pair. Writes to TMR1H or TMR1L directly update the counter. When used with an internal clock source, the module is a timer and increments on every instruction cycle. When used with an external clock source, the module can be used as either a timer or counter and increments on every selected edge of the external source. Timer1 is enabled by configuring the TMR1ON and TMR1GE bits in the T1CON and T1GCON registers, respectively. Table 19-1 displays the Timer1 enable selections. TABLE 19-1: TIMER1 ENABLE SELECTIONS Clock Source Selection The TMR1CS<1:0> bits of the T1CON register are used to select the clock source for Timer1. Table 19-2 displays the clock source selections. 19.2.1 INTERNAL CLOCK SOURCE When the internal clock source is selected, the TMR1H:TMR1L register pair will increment on multiples of FOSC, as determined by the Timer1 prescaler. When the FOSC internal clock source is selected, the Timer1 register value will increment by four counts every instruction clock cycle. Due to this condition, a 2 LSB error in resolution will occur when reading the Timer1 value. To utilize the full resolution of Timer1, an asynchronous input signal must be used to gate the Timer1 clock input. The following asynchronous sources may be used: Timer1 Operation TMR1ON TMR1GE 0 0 Off 0 1 Off 1 0 Always On 1 1 Count Enabled • Asynchronous event on the T1G pin to Timer1 gate • C1 or C2 comparator input to Timer1 gate 19.2.2 EXTERNAL CLOCK SOURCE When the external clock source is selected, the Timer1 module may work as a timer or a counter. When enabled to count, Timer1 is incremented on the rising edge of the external clock input T1CKI. The external clock source can be synchronized to the microcontroller system clock or it can run asynchronously. Note: In Counter mode, a falling edge must be registered by the counter prior to the first incrementing rising edge after any one or more of the following conditions: • • • • TABLE 19-2: CLOCK SOURCE SELECTIONS TMR1CS<1:0> T1OSCEN(1) 11 x LFINTOSC 10 x External Clocking on T1CKI Pin 01 x System Clock (FOSC) x Instruction Clock (FOSC/4) 00 Note 1: Timer1 enabled after POR Write to TMR1H or TMR1L Timer1 is disabled Timer1 is disabled (TMR1ON = 0) when T1CKI is high, then Timer1 is enabled (TMR1ON = 1) when T1CKI is low Clock Source T1OSCEN is not available for these devices. DS40001723D-page 160 2013-2015 Microchip Technology Inc. PIC12(L)F1571/2 19.3 Timer1 Prescaler Timer1 has four prescaler options, allowing 1, 2, 4 or 8 divisions of the clock input. The T1CKPSx bits of the T1CON register control the prescale counter. The prescale counter is not directly readable or writable; however, the prescaler counter is cleared upon a write to TMR1H or TMR1L. 19.4 Timer1 Operation in Asynchronous Counter Mode If control bit, T1SYNC, of the T1CON register is set, the external clock input is not synchronized. The timer increments asynchronously to the internal phase clocks. If the external clock source is selected then the timer will continue to run during Sleep and can generate an interrupt on overflow, which will wake-up the processor. However, special precautions in software are needed to read/write the timer (see Section 19.4.1 “Reading and Writing Timer1 in Asynchronous Counter Mode”). Note: 19.4.1 When switching from synchronous to asynchronous operation, it is possible to skip an increment. When switching from asynchronous to synchronous operation, it is possible to produce an additional increment. READING AND WRITING TIMER1 IN ASYNCHRONOUS COUNTER MODE Reading TMR1H or TMR1L while the timer is running from an external asynchronous clock will ensure a valid read (taken care of in hardware). However, the user should keep in mind that reading the 16-bit timer in two 8-bit values itself, poses certain problems, since the timer may overflow between the reads. For writes, it is recommended that the user simply stop the timer and write the desired values. A write contention may occur by writing to the timer registers, while the register is incrementing. This may produce an unpredictable value in the TMR1H:TMR1L register pair. 19.5 Timer1 Gate Timer1 can be configured to count freely or the count can be enabled and disabled using Timer1 gate circuitry. This is also referred to as Timer1 Gate Enable. Timer1 gate can also be driven by multiple selectable sources. 19.5.1 The Timer1 Gate Enable mode is enabled by setting the TMR1GE bit of the T1GCON register. The polarity of the Timer1 Gate Enable mode is configured using the T1GPOL bit of the T1GCON register. When Timer1 Gate Enable mode is enabled, Timer1 will increment on the rising edge of the Timer1 clock source. When Timer1 Gate Enable mode is disabled, no incrementing will occur and Timer1 will hold the current count. See Figure 19-3 for timing details. TABLE 19-3: TIMER1 GATE ENABLE SELECTIONS T1CLK T1GPOL T1G 0 0 Counts 0 1 Holds Count 1 0 Holds Count 1 1 Counts 19.5.2 Timer1 Operation TIMER1 GATE SOURCE SELECTION Timer1 gate source selections are shown in Table 19-4. Source selection is controlled by the T1GSS<1:0> bits of the T1GCON register. The polarity for each available source is also selectable. Polarity selection is controlled by the T1GPOL bit of the T1GCON register. TABLE 19-4: T1GSS<1:0> TIMER1 GATE SOURCES Timer1 Gate Source 00 Timer1 Gate Pin (T1G) 01 Overflow of Timer0 (T0_overflow) (TMR0 increments from FFh to 00h) 10 Comparator 1 Output (C1OUT_sync)(1) 11 Reserved Note 1: 2013-2015 Microchip Technology Inc. TIMER1 GATE ENABLE Optionally synchronized comparator output. DS40001723D-page 161 PIC12(L)F1571/2 19.5.2.1 T1G Pin Gate Operation The T1G pin is one source for Timer1 gate control. It can be used to supply an external source to the Timer1 gate circuitry. 19.5.2.2 Timer0 Overflow Gate Operation When Timer0 increments from FFh to 00h, a low-tohigh pulse will automatically be generated and internally supplied to the Timer1 gate circuitry. 19.5.3 TIMER1 GATE TOGGLE MODE When Timer1 Gate Toggle mode is enabled, it is possible to measure the full cycle length of a Timer1 gate signal, as opposed to the duration of a single level pulse. The Timer1 gate source is routed through a flip-flop that changes state on every incrementing edge of the signal. See Figure 19-4 for timing details. Timer1 Gate Toggle mode is enabled by setting the T1GTM bit of the T1GCON register. When the T1GTM bit is cleared, the flip-flop is cleared and held clear. This is necessary in order to control which edge is measured. Note: 19.5.4 Enabling Toggle mode at the same time as changing the gate polarity may result in indeterminate operation. If the Single-Pulse Gate mode is disabled by clearing the T1GSPM bit in the T1GCON register, the T1GGO/DONE bit should also be cleared. Enabling the Toggle mode and the Single-Pulse mode simultaneously will permit both sections to work together. This allows the cycle times on the Timer1 gate source to be measured. See Figure 19-6 for timing details. 19.5.5 TIMER1 GATE VALUE STATUS When Timer1 gate value status is utilized, it is possible to read the most current level of the gate control value. The value is stored in the T1GVAL bit in the T1GCON register. The T1GVAL bit is valid even when the Timer1 gate is not enabled (TMR1GE bit is cleared). 19.5.6 TIMER1 GATE EVENT INTERRUPT When Timer1 gate event interrupt is enabled, it is possible to generate an interrupt upon the completion of a gate event. When the falling edge of T1GVAL occurs, the TMR1GIF flag bit in the PIR1 register will be set. If the TMR1GIE bit in the PIE1 register is set, then an interrupt will be recognized. The TMR1GIF flag bit operates even when the Timer1 gate is not enabled (TMR1GE bit is cleared). TIMER1 GATE SINGLE-PULSE MODE When Timer1 Gate Single-Pulse mode is enabled, it is possible to capture a single-pulse gate event. Timer1 Gate Single-Pulse mode is first enabled by setting the T1GSPM bit in the T1GCON register. Next, the T1GGO/ DONE bit in the T1GCON register must be set. The Timer1 will be fully enabled on the next incrementing edge. On the next trailing edge of the pulse, the T1GGO/ DONE bit will automatically be cleared. No other gate events will be allowed to increment Timer1 until the T1GGO/DONE bit is once again set in software. See Figure 19-5 for timing details. DS40001723D-page 162 2013-2015 Microchip Technology Inc. PIC12(L)F1571/2 19.6 Timer1 Interrupt The Timer1 register pair (TMR1H:TMR1L) increments to FFFFh and rolls over to 0000h. When Timer1 rolls over, the Timer1 interrupt flag bit of the PIR1 register is set. To enable the interrupt on rollover, you must set these bits: • • • • TMR1ON bit of the T1CON register TMR1IE bit of the PIE1 register PEIE bit of the INTCON register GIE bit of the INTCON register The interrupt is cleared by clearing the TMR1IF bit in the Interrupt Service Routine. Note: 19.7 The TMR1H:TMR1L register pair and the TMR1IF bit should be cleared before enabling interrupts. The device will wake-up on an overflow and execute the next instructions. If the GIE bit of the INTCON register is set, the device will call the Interrupt Service Routine. Timer1 oscillator will continue to operate in Sleep regardless of the T1SYNC bit setting. 19.7.1 ALTERNATE PIN LOCATIONS This module incorporates I/O pins that can be moved to other locations with the use of the Alternate Pin Function register, APFCON. To determine which pins can be moved and what their default locations are upon a Reset, see Section 11.1 “Alternate Pin Function” for more information. Timer1 Operation During Sleep Timer1 can only operate during Sleep when set up in Asynchronous Counter mode. In this mode, an external crystal or clock source can be used to increment the counter. To set up the timer to wake the device: • • • • • TMR1ON bit of the T1CON register must be set TMR1IE bit of the PIE1 register must be set PEIE bit of the INTCON register must be set T1SYNC bit of the T1CON register must be set TMR1CS bits of the T1CON register must be configured FIGURE 19-2: TIMER1 INCREMENTING EDGE T1CKI = 1 when TMR1 is Enabled T1CKI = 0 when TMR1 is Enabled Note 1: 2: Arrows indicate counter increments. In Counter mode, a falling edge must be registered by the counter prior to the first incrementing rising edge of the clock. 2013-2015 Microchip Technology Inc. DS40001723D-page 163 PIC12(L)F1571/2 FIGURE 19-3: TIMER1 GATE ENABLE MODE TMR1GE T1GPOL t1g_in T1CKI T1GVAL N Timer1 FIGURE 19-4: N+1 N+2 N+3 N+4 TIMER1 GATE TOGGLE MODE TMR1GE T1GPOL T1GTM t1g_in T1CKI T1GVAL Timer1 DS40001723D-page 164 N N+1 N+2 N+3 N+4 N+5 N+6 N+7 N+8 2013-2015 Microchip Technology Inc. PIC12(L)F1571/2 FIGURE 19-5: TIMER1 GATE SINGLE-PULSE MODE TMR1GE T1GPOL T1GSPM T1GGO/ DONE Cleared by Hardware on Falling Edge of T1GVAL Set by Software Counting Enabled on Rising Edge of T1G t1g_in T1CKI T1GVAL Timer1 TMR1GIF N Cleared by Software 2013-2015 Microchip Technology Inc. N+1 N+2 Set by Hardware on Falling Edge of T1GVAL Cleared by Software DS40001723D-page 165 PIC12(L)F1571/2 FIGURE 19-6: TIMER1 GATE SINGLE-PULSE AND TOGGLE COMBINED MODE TMR1GE T1GPOL T1GSPM T1GTM T1GGO/ DONE Cleared by Hardware on Falling Edge of T1GVAL Set by Software Counting Enabled on Rising Edge of T1G t1g_in T1CKI T1GVAL Timer1 TMR1GIF DS40001723D-page 166 N Cleared by Software N+1 N+2 N+3 N+4 Set by Hardware on Falling Edge of T1GVAL Cleared by Software 2013-2015 Microchip Technology Inc. PIC12(L)F1571/2 19.8 Register Definitions: Timer1 Control REGISTER 19-1: R/W-0/u T1CON: TIMER1 CONTROL REGISTER R/W-0/u R/W-0/u TMR1CS<1:0> R/W-0/u T1CKPS<1:0> U-0 R/W-0/u U-0 R/W-0/u — T1SYNC — TMR1ON bit 7 bit 0 Legend: R = Readable bit W = Writable bit u = Bit is unchanged x = Bit is unknown U = Unimplemented bit, read as ‘0’ ‘1’ = Bit is set ‘0’ = Bit is cleared -n/n = Value at POR and BOR/Value at all other Resets bit 7-6 TMR1CS<1:0>: Timer1 Clock Source Select bits 11 = Timer1 clock source is the LFINTOSC 10 = Timer1 clock source is the T1CKI pin (on the rising edge) 01 = Timer1 clock source is the system clock (FOSC) 00 = Timer1 clock source is the instruction clock (FOSC/4) bit 5-4 T1CKPS<1:0>: Timer1 Input Clock Prescale Select bits 11 = 1:8 Prescale value 10 = 1:4 Prescale value 01 = 1:2 Prescale value 00 = 1:1 Prescale value bit 3 Unimplemented: Read as ‘0’ bit 2 T1SYNC: Timer1 Synchronization Control bit 1 = Does not synchronize the asynchronous clock input 0 = Synchronizes the asynchronous clock input with the system clock (FOSC) bit 1 Unimplemented: Read as ‘0’ bit 0 TMR1ON: Timer1 On bit 1 = Enables Timer1 0 = Stops Timer1 and clears Timer1 gate flip-flop 2013-2015 Microchip Technology Inc. DS40001723D-page 167 PIC12(L)F1571/2 REGISTER 19-2: T1GCON: TIMER1 GATE CONTROL REGISTER R/W-0/u R/W-0/u R/W-0/u R/W-0/u R/W/HC-0/u R-x/x TMR1GE T1GPOL T1GTM T1GSPM T1GGO/ DONE T1GVAL R/W-0/u bit 7 R/W-0/u T1GSS<1:0> bit 0 Legend: R = Readable bit W = Writable bit HC = Hardware Clearable bit u = Bit is unchanged x = Bit is unknown U = Unimplemented bit, read as ‘0’ ‘1’ = Bit is set ‘0’ = Bit is cleared -n/n = Value at POR and BOR/Value at all other Resets bit 7 TMR1GE: Timer1 Gate Enable bit If TMR1ON = 0: This bit is ignored. If TMR1ON = 1: 1 = Timer1 counting is controlled by the Timer1 gate function 0 = Timer1 counts regardless of Timer1 gate function bit 6 T1GPOL: Timer1 Gate Polarity bit 1 = Timer1 gate is active-high (Timer1 counts when gate is high) 0 = Timer1 gate is active-low (Timer1 counts when gate is low) bit 5 T1GTM: Timer1 Gate Toggle Mode bit 1 = Timer1 Gate Toggle mode is enabled 0 = Timer1 Gate Toggle mode is disabled and toggle flip-flop is cleared Timer1 gate flip-flop toggles on every rising edge. bit 4 T1GSPM: Timer1 Gate Single-Pulse Mode bit 1 = Timer1 Gate Single-Pulse mode is enabled and is controlling Timer1 gate 0 = Timer1 Gate Single-Pulse mode is disabled bit 3 T1GGO/DONE: Timer1 Gate Single-Pulse Acquisition Status bit 1 = Timer1 gate single-pulse acquisition is ready, waiting for an edge 0 = Timer1 gate single-pulse acquisition has completed or has not been started bit 2 T1GVAL: Timer1 Gate Value Status bit Indicates the current state of the Timer1 gate that could be provided to TMR1H:TMR1L. Unaffected by Timer1 Gate Enable bit (TMR1GE). bit 1-0 T1GSS<1:0>: Timer1 Gate Source Select bits 11 = Reserved 10 = Comparator 1 optionally synchronized output (C1OUT_sync) 01 = Timer0 overflow output (T0_overflow) 00 = Timer1 gate pin (T1G) DS40001723D-page 168 2013-2015 Microchip Technology Inc. PIC12(L)F1571/2 TABLE 19-5: Name ANSELA APFCON INTCON OSCSTAT SUMMARY OF REGISTERS ASSOCIATED WITH TIMER1 Bit 7 Bit 6 Bit 5 Bit 4 — — — ANSA4 — — T1GSEL RXDTSEL CWGASEL CWGBSEL Bit 3 Bit 2 Bit 1 Bit 0 ANSA<2:0> TXCKSEL P2SEL Register on Page 114 P1SEL 110 GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF 74 — PLLR OSTS HFIOFR HFIOFL MFIOFR LFIOFR HFIOFS 56 (2) (2) PIE1 TMR1GIE ADIE RCIE TXIE — — TMR2IE TMR1IE 75 PIR1 TMR1GIF ADIF RCIF(2) TXIF(2) — — TMR2IF TMR1IF 79 TMR1H Holding Register for the Most Significant Byte of the 16-bit TMR1 Count 163* TMR1L Holding Register for the Least Significant Byte of the 16-bit TMR1 Count 163* TRISA — T1CON TMR1CS<1:0> T1GCON Legend: * Note 1: 2: TMR1GE — T1GPOL TRISA<5:4> T1CKPS<1:0> T1GTM T1GSPM (1) — TRISA<2:0> 113 — T1SYNC — TMR1ON T1GGO/ DONE T1GVAL T1GSS<1:0> 167 168 — = unimplemented location, read as ‘0’. Shaded cells are not used by the Timer1 module. Page provides register information. Unimplemented, read as ‘1’. PIC12(L)F1572 only. 2013-2015 Microchip Technology Inc. DS40001723D-page 169 PIC12(L)F1571/2 NOTES: DS40001723D-page 170 2013-2015 Microchip Technology Inc. PIC12(L)F1571/2 20.0 TIMER2 MODULE The Timer2 module incorporates the following features: • 8-Bit Timer and Period registers (TMR2 and PR2, respectively) • Readable and writable (both registers) • Software programmable prescaler (1:1, 1:4, 1:16 and 1:64) • Software programmable postscaler (1:1 to 1:16) • Interrupt on TMR2 match with PR2 See Figure 20-1 for a block diagram of Timer2. FIGURE 20-1: TIMER2 BLOCK DIAGRAM Rev. 10-000019A 7/30/2013 T2_match Prescaler 1:1, 1:4, 1:16, 1:64 Fosc/4 R TMR2 To Peripherals 2 T2CKPS<1:0> Postscaler 1:1 to 1:16 Comparator set bit TMR2IF 4 T2OUTPS<3:0> PR2 FIGURE 20-2: TIMER2 TIMING DIAGRAM Rev. 10-000020A 7/30/2013 FOSC/4 1:4 Prescale 0x03 PR2 TMR2 0x00 0x01 0x02 0x03 0x00 0x01 0x02 Pulse Width(1) T2_match Note 1: The Pulse Width of T2_match is equal to the scaled input of TMR2. 2013-2015 Microchip Technology Inc. DS40001723D-page 171 PIC12(L)F1571/2 20.1 Timer2 Operation The clock input to the Timer2 module is the system instruction clock (FOSC/4). TMR2 increments from 00h on each clock edge. A 4-bit counter/prescaler on the clock input allows direct input, divide-by-4 and divide-by-16 prescale options. These options are selected by the prescaler control bits, T2CKPS<1:0> of the T2CON register. The value of TMR2 is compared to that of the Period register, PR2, on each clock cycle. When the two values match, the comparator generates a match signal as the timer output. This signal also resets the value of TMR2 to 00h on the next cycle and drives the output counter/ postscaler (see Section 20.2 “Timer2 Interrupt”). The TMR2 and PR2 registers are both directly readable and writable. The TMR2 register is cleared on any device Reset, whereas the PR2 register initializes to FFh. Both the prescaler and postscaler counters are cleared on the following events: • • • • • • • • • A write to the TMR2 register A write to the T2CON register Power-on Reset (POR) Brown-out Reset (BOR) MCLR Reset Watchdog Timer (WDT) Reset Stack Overflow Reset Stack Underflow Reset RESET Instruction Note: 20.2 20.3 The output of TMR2 is T2_match. The T2_match signal is synchronous with the system clock. Figure 20-3 shows two examples of the timing of the T2_match signal relative to FOSC and prescale value, T2CKPS<1:0>. The upper diagram illustrates 1:1 prescale timing and the lower diagram, 1:X prescale timing. FIGURE 20-3: Timer2 can also generate an optional device interrupt. The Timer2 output signal (T2_match) provides the input for the 4-bit counter/postscaler. This counter generates the TMR2 match interrupt flag which is latched in TMR2IF of the PIR1 register. The interrupt is enabled by setting the TMR2 Match Interrupt Enable bit, TMR2IE of the PIE1 register. T2_MATCH TIMING DIAGRAM Rev. 10-000021A 7/30/2013 Q1 Q2 Q3 Q4 Q1 FOSC TCY1 FOSC/4 T2_match TMR2 = 0 TMR2 = PR2 match PRESCALE = 1:1 (T2CKPS<1:0> = 00) TCY1 TCY2 ... ... T2_match TCYX ... FOSC/4 TMR2 is not cleared when T2CON is written. Timer2 Interrupt Timer2 Output TMR2 = PR2 match TMR2 = 0 PRESCALE = 1:X (T2CKPS<1:0> = 01,10,11) 20.4 Timer2 Operation During Sleep Timer2 cannot be operated while the processor is in Sleep mode. The contents of the TMR2 and PR2 registers will remain unchanged while the processor is in Sleep mode. A range of 16 postscale options (from 1:1 through 1:16 inclusive) can be selected with the postscaler control bits, T2OUTPS<3:0>, of the T2CON register. DS40001723D-page 172 2013-2015 Microchip Technology Inc. PIC12(L)F1571/2 20.5 Register Definitions: Timer2 Control REGISTER 20-1: U-0 T2CON: TIMER2 CONTROL REGISTER R/W-0/0 R/W-0/0 — R/W-0/0 R/W-0/0 T2OUTPS<3:0> R/W-0/0 R/W-0/0 TMR2ON R/W-0/0 T2CKPS<1:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit u = Bit is unchanged x = Bit is unknown U = Unimplemented bit, read as ‘0’ ‘1’ = Bit is set ‘0’ = Bit is cleared -n/n = Value at POR and BOR/Value at all other Resets bit 7 Unimplemented: Read as ‘0’ bit 6-3 T2OUTPS<3:0>: Timer2 Output Postscaler Select bits 0000 = 1:1 Postscaler 0001 = 1:2 Postscaler 0010 = 1:3 Postscaler 0011 = 1:4 Postscaler 0100 = 1:5 Postscaler 0101 = 1:6 Postscaler 0110 = 1:7 Postscaler 0111 = 1:8 Postscaler 1000 = 1:9 Postscaler 1001 = 1:10 Postscaler 1010 = 1:11 Postscaler 1011 = 1:12 Postscaler 1100 = 1:13 Postscaler 1101 = 1:14 Postscaler 1110 = 1:15 Postscaler 1111 = 1:16 Postscaler bit 2 TMR2ON: Timer2 On bit 1 = Timer2 is on 0 = Timer2 is off bit 1-0 T2CKPS<1:0>: Timer2 Clock Prescale Select bits 00 = Prescaler is 1 01 = Prescaler is 4 10 = Prescaler is 16 11 = Prescaler is 64 TABLE 20-1: SUMMARY OF REGISTERS ASSOCIATED WITH TIMER2 Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register on Page INTCON GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF 74 TXIE(1) — — TMR2IE TMR1IE 75 TXIF(1) — — TMR2IF TMR1IF 78 PIE1 TMR1GIE ADIE RCIE(1) PIR1 TMR1GIF ADIF RCIF(1) PR2 Timer2 Module Period Register T2CON TMR2 — T2OUTPS<3:0> 171* TMR2ON T2CKPS<1:0> Holding Register for the 8-bit TMR2 Count 173 171* Legend: — = unimplemented location, read as ‘0’. Shaded cells are not used for Timer2 module. * Page provides register information. Note 1: PIC12(L)F1572 only. 2013-2015 Microchip Technology Inc. DS40001723D-page 173 PIC12(L)F1571/2 NOTES: DS40001723D-page 174 2013-2015 Microchip Technology Inc. PIC12(L)F1571/2 21.0 ENHANCED UNIVERSAL SYNCHRONOUS ASYNCHRONOUS RECEIVER TRANSMITTER (EUSART) The EUSART module includes the following capabilities: • • • • • • • • • • Full-duplex asynchronous transmit and receive Two-character input buffer One-character output buffer Programmable 8-bit or 9-bit character length Address detection in 9-bit mode Input buffer overrun error detection Received character framing error detection Half-duplex synchronous master Half-duplex synchronous slave Programmable clock polarity in synchronous modes • Sleep operation The Enhanced Universal Synchronous Asynchronous Receiver Transmitter (EUSART) module is a serial I/O communications peripheral. It contains all the clock generators, shift registers and data buffers necessary to perform an input or output serial data transfer, independent of device program execution. The EUSART, also known as a Serial Communications Interface (SCI), can be configured as a full-duplex asynchronous system or half-duplex synchronous system. Full-Duplex mode is useful for communications with peripheral systems, such as CRT terminals and personal computers. Half-Duplex Synchronous mode is intended for communications with peripheral devices, such as A/D or D/A integrated circuits, serial EEPROMs or other microcontrollers. These devices typically do not have internal clocks for baud rate generation and require the external clock signal provided by a master synchronous device. FIGURE 21-1: The EUSART module implements the following additional features, making it ideally suited for use in Local Interconnect Network (LIN) bus systems: • Automatic detection and calibration of the baud rate • Wake-up on Break reception • 13-bit Break character transmit Block diagrams of the EUSART transmitter and receiver are shown in Figure 21-1 and Figure 21-2. EUSART TRANSMIT BLOCK DIAGRAM Rev. 10-000113B 7/14/2015 Data bus TXIE 8 Interrupt TXREG register TXIF 8 MSb LSb (8) 0 TX/CK Pin Buffer and Control Transmit Shift Register (TSR) TXEN Baud Rate Generator TRMT FOSC ÷n TX9 n BRG16 TX9D +1 Multiplier x4 x16 x64 SYNC 1 x 0 0 0 BRGH x 1 1 0 0 BRG16 x 1 0 1 0 SPBRGH SPBRGL 2013-2015 Microchip Technology Inc. DS40001723D-page 175 PIC12(L)F1571/2 FIGURE 21-2: EUSART RECEIVE BLOCK DIAGRAM Rev. 10-000114A 7/30/2013 CREN OERR RCIDL SPEN RSR Register MSb RX/DT pin Pin Buffer and Control Baud Rate Generator Data Recovery FOSC Stop (8) 7 LSb 1 0 Start ÷n RX9 BRG16 +1 Multiplier x4 x16 x64 SYNC 1 x 0 0 0 BRGH x 1 1 0 0 BRG16 x 1 0 1 0 SPBRGH SPBRGL n FIFO FERR RX9D RCREG Register 8 Data Bus RCIF RCIE Interrupt The operation of the EUSART module is controlled through three registers: These registers are detailed in Register 21-1, Register 21-2 and Register 21-3, respectively. • Transmit Status and Control (TXSTA) • Receive Status and Control (RCSTA) • Baud Rate Control (BAUDCON) When the receiver or transmitter section is not enabled, then the corresponding RX or TX pin may be used for general purpose input and output. DS40001723D-page 176 2013-2015 Microchip Technology Inc. PIC12(L)F1571/2 21.1 EUSART Asynchronous Mode The EUSART transmits and receives data using the standard Non-Return-to-Zero (NRZ) format. NRZ is implemented with two levels: a VOH mark state which represents a ‘1’ data bit, and a VOL space state which represents a ‘0’ data bit. NRZ refers to the fact that consecutively transmitted data bits of the same value stay at the output level of that bit without returning to a neutral level between each bit transmission. An NRZ transmission port Idles in the mark state. Each character transmission consists of one Start bit, followed by eight or nine data bits and is always terminated by one or more Stop bits. The Start bit is always a space and the Stop bits are always marks. The most common data format is eight bits. Each transmitted bit persists for a period of 1/(Baud Rate). An on-chip dedicated 8-bit/16-bit Baud Rate Generator is used to derive standard baud rate frequencies from the system oscillator. See Table 21-5 for examples of baud rate configurations. 21.1.1.2 Transmitting Data A transmission is initiated by writing a character to the TXREG register. If this is the first character, or the previous character has been completely flushed from the TSR, the data in the TXREG is immediately transferred to the TSR register. If the TSR still contains all or part of a previous character, the new character data is held in the TXREG until the Stop bit of the previous character has been transmitted. The pending character in the TXREG is then transferred to the TSR in one TCY immediately following the Stop bit transmission. The transmission of the Start bit, data bits and Stop bit sequence commences immediately following the transfer of the data to the TSR from the TXREG. 21.1.1.3 Transmit Data Polarity The EUSART transmits and receives the LSb first. The EUSART’s transmitter and receiver are functionally independent, but share the same data format and baud rate. Parity is not supported by the hardware, but can be implemented in software and stored as the ninth data bit. The polarity of the transmit data can be controlled with the SCKP bit of the BAUDCON register. The default state of this bit is ‘0’ which selects high true transmit Idle and data bits. Setting the SCKP bit to ‘1’ will invert the transmit data resulting in low true Idle and data bits. The SCKP bit controls transmit data polarity in Asynchronous mode only. In Synchronous mode, the SCKP bit has a different function. See Section 21.5.1.2 “Clock Polarity”. 21.1.1 21.1.1.4 EUSART ASYNCHRONOUS TRANSMITTER The EUSART transmitter block diagram is shown in Figure 21-1. The heart of the transmitter is the serial Transmit Shift Register (TSR), which is not directly accessible by software. The TSR obtains its data from the transmit buffer, which is the TXREG register. 21.1.1.1 Enabling the Transmitter The EUSART transmitter is enabled for asynchronous operations by configuring the following three control bits: • TXEN = 1 • SYNC = 0 • SPEN = 1 All other EUSART control bits are assumed to be in their default state. Setting the TXEN bit of the TXSTA register enables the transmitter circuitry of the EUSART. Clearing the SYNC bit of the TXSTA register configures the EUSART for asynchronous operation. Setting the SPEN bit of the RCSTA register enables the EUSART and automatically configures the TX/CK I/O pin as an output. If the TX/CK pin is shared with an analog peripheral, the analog I/O function must be disabled by clearing the corresponding ANSELx bit. Note: Transmit Interrupt Flag The TXIF interrupt flag bit of the PIR1 register is set whenever the EUSART transmitter is enabled and no character is being held for transmission in the TXREG. In other words, the TXIF bit is only clear when the TSR is busy with a character and a new character has been queued for transmission in the TXREG. The TXIF flag bit is not cleared immediately upon writing TXREG. TXIF becomes valid in the second instruction cycle following the write execution. Polling TXIF immediately following the TXREG write will return invalid results. The TXIF bit is read-only, it cannot be set or cleared by software. The TXIF interrupt can be enabled by setting the TXIE interrupt enable bit of the PIE1 register. However, the TXIF flag bit will be set whenever the TXREG is empty, regardless of the state of the TXIE enable bit. To use interrupts when transmitting data, set the TXIE bit only when there is more data to send. Clear the TXIE interrupt enable bit upon writing the last character of the transmission to the TXREG. The TXIF transmitter interrupt flag is set when the TXEN enable bit is set. 2013-2015 Microchip Technology Inc. DS40001723D-page 177 PIC12(L)F1571/2 21.1.1.5 TSR Status 21.1.1.7 The TRMT bit of the TXSTA register indicates the status of the TSR register. This is a read-only bit. The TRMT bit is set when the TSR register is empty and is cleared when a character is transferred to the TSR register from the TXREG. The TRMT bit remains clear until all bits have been shifted out of the TSR register. No interrupt logic is tied to this bit, so the user has to poll this bit to determine the TSR status. Note: 1. 2. 3. The TSR register is not mapped in data memory, so it is not available to the user. 21.1.1.6 4. 5. Transmitting 9-Bit Characters The EUSART supports 9-bit character transmissions. When the TX9 bit of the TXSTA register is set, the EUSART will shift nine bits out for each character transmitted. The TX9D bit of the TXSTA register is the ninth and Most Significant data bit. When transmitting 9-bit data, the TX9D data bit must be written before writing the eight Least Significant bits into the TXREG. All nine bits of data will be transferred to the TSR register immediately after the TXREG is written. 6. 7. 8. A special 9-Bit Address mode is available for use with multiple receivers. See Section 21.1.2.7 “Address Detection” for more information on this mode. FIGURE 21-3: Asynchronous Transmission Setup Initialize the SPBRGH/SPBRGL register pair, and the BRGH and BRG16 bits to achieve the desired baud rate (see Section 21.4 “EUSART Baud Rate Generator (BRG)”). Enable the asynchronous serial port by clearing the SYNC bit and setting the SPEN bit. If 9-bit transmission is desired, set the TX9 control bit. A set ninth data bit will indicate that the eight Least Significant data bits are an address when the receiver is set for address detection. Set the SCKP bit if inverted transmit is desired. Enable the transmission by setting the TXEN control bit. This will cause the TXIF interrupt bit to be set. If interrupts are desired, set the TXIE interrupt enable bit of the PIE1 register. An interrupt will occur immediately provided that the GIE and PEIE bits of the INTCON register are also set. If 9-bit transmission is selected, the ninth bit should be loaded into the TX9D data bit. Load 8-bit data into the TXREG register. This will start the transmission. ASYNCHRONOUS TRANSMISSION Write to TXREG Word 1 BRG Output (Shift Clock) Start bit TX/CK Pin bit 0 bit 1 bit 7/8 Stop bit Word 1 1 TCY TXIF bit (Transmit Buffer Reg. Empty Flag) Word 1 Transmit Shift Reg. TRMT bit (Transmit Shift Reg. Empty Flag) FIGURE 21-4: ASYNCHRONOUS TRANSMISSION (BACK-TO-BACK) Write to TXREG BRG Output (Shift Clock) Word 1 Word 2 Start bit TX/CK Pin bit 0 1 TCY TXIF bit (Transmit Buffer Reg. Empty Flag) bit 1 Word 1 bit 7/8 Stop bit Start bit Word 2 bit 0 1 TCY Word 1 Transmit Shift Reg. Word 2 Transmit Shift Reg. TRMT bit (Transmit Shift Reg. Empty Flag) Note: This timing diagram shows two consecutive transmissions. DS40001723D-page 178 2013-2015 Microchip Technology Inc. PIC12(L)F1571/2 TABLE 21-1: Name BAUDCON INTCON PIE1 PIR1 RCSTA SUMMARY OF REGISTERS ASSOCIATED WITH ASYNCHRONOUS TRANSMISSION Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register on Page ABDOVF RCIDL — SCKP BRG16 — WUE ABDEN 186 GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF 74 TMR1GIE ADIE RCIE(1) TXIE(1) — — TMR2IE TMR1IE 75 TMR1GIF ADIF (1) RCIF TXIF (1) — — TMR2IF TMR1IF 78 SPEN RX9 SREN CREN ADDEN FERR OERR RX9D 185* SPBRGL BRG<7:0> 187* SPBRGH BRG<15:8> 187* TXREG TXSTA EUSART Transmit Data Register CSRC TX9 TXEN 177 SYNC SENDB BRGH TRMT TX9D 184 Legend: — = unimplemented location, read as ‘0’. Shaded cells are not used for asynchronous transmission. * Page provides register information. Note 1: PIC12(L)F1572 only. 2013-2015 Microchip Technology Inc. DS40001723D-page 179 PIC12(L)F1571/2 21.1.2 EUSART ASYNCHRONOUS RECEIVER The Asynchronous mode is typically used in RS-232 systems. The receiver block diagram is shown in Figure 21-2. The data is received on the RX/DT pin and drives the data recovery block. The data recovery block is actually a high-speed shifter operating at 16 times the baud rate, whereas the serial Receive Shift Register (RSR) operates at the bit rate. When all eight or nine bits of the character have been shifted in, they are immediately transferred to a two character First-In-First-Out (FIFO) memory. The FIFO buffering allows reception of two complete characters and the start of a third character before software must start servicing the EUSART receiver. The FIFO and RSR registers are not directly accessible by software. Access to the received data is via the RCREG register. 21.1.2.1 Enabling the Receiver The EUSART receiver is enabled for asynchronous operation by configuring the following three control bits: • CREN = 1 • SYNC = 0 • SPEN = 1 All other EUSART control bits are assumed to be in their default state. Setting the CREN bit of the RCSTA register enables the receiver circuitry of the EUSART. Clearing the SYNC bit of the TXSTA register configures the EUSART for asynchronous operation. Setting the SPEN bit of the RCSTA register enables the EUSART. The programmer must set the corresponding TRIS bit to configure the RX/DT I/O pin as an input. Note: If the RX/DT function is on an analog pin, the corresponding ANSELx bit must be cleared for the receiver to function. 21.1.2.2 Receiving Data The receiver data recovery circuit initiates character reception on the falling edge of the first bit. The first bit, also known as the Start bit, is always a zero. The data recovery circuit counts one-half bit time to the center of the Start bit and verifies that the bit is still a zero. If it is not a zero then the data recovery circuit aborts character reception, without generating an error, and resumes looking for the falling edge of the Start bit. If the Start bit zero verification succeeds, then the data recovery circuit counts a full bit time to the center of the next bit. The bit is then sampled by a majority detect circuit and the resulting ‘0’ or ‘1’ is shifted into the RSR. This repeats until all data bits have been sampled and shifted into the RSR. One final bit time is measured and the level sampled. This is the Stop bit, which is always a ‘1’. If the data recovery circuit samples a ‘0’ in the Stop bit position then a framing error is set for this character; otherwise, the framing error is cleared for this character. See Section 21.1.2.4 “Receive Framing Error” for more information on framing errors. Immediately after all data bits and the Stop bit have been received, the character in the RSR is transferred to the EUSART receive FIFO and the RCIF interrupt flag bit of the PIR1 register is set. The top character in the FIFO is transferred out of the FIFO by reading the RCREG register. Note: 21.1.2.3 If the receive FIFO is overrun, no additional characters will be received until the overrun condition is cleared. See Section 21.1.2.5 “Receive Overrun Error” for more information on overrun errors. Receive Interrupts The RCIF interrupt flag bit of the PIR1 register is set whenever the EUSART receiver is enabled and there is an unread character in the receive FIFO. The RCIF interrupt flag bit is read-only, it cannot be set or cleared by software. RCIF interrupts are enabled by setting all of the following bits: • RCIE, Interrupt Enable bit of the PIE1 register • PEIE, Peripheral Interrupt Enable bit of the INTCON register • GIE, Global Interrupt Enable bit of the INTCON register The RCIF interrupt flag bit will be set when there is an unread character in the FIFO, regardless of the state of interrupt enable bits. DS40001723D-page 180 2013-2015 Microchip Technology Inc. PIC12(L)F1571/2 21.1.2.4 Receive Framing Error Each character in the receive FIFO buffer has a corresponding framing error status bit. A framing error indicates that a Stop bit was not seen at the expected time. The framing error status is accessed via the FERR bit of the RCSTA register. The FERR bit represents the status of the top unread character in the receive FIFO. Therefore, the FERR bit must be read before reading the RCREG. The FERR bit is read-only and only applies to the top unread character in the receive FIFO. A framing error (FERR = 1) does not preclude reception of additional characters. It is not necessary to clear the FERR bit. Reading the next character from the FIFO buffer will advance the FIFO to the next character and the next corresponding framing error. The FERR bit can be forced clear by clearing the SPEN bit of the RCSTA register which resets the EUSART. Clearing the CREN bit of the RCSTA register does not affect the FERR bit. A framing error by itself does not generate an interrupt. Note: 21.1.2.5 If all receive characters in the receive FIFO have framing errors, repeated reads of the RCREG will not clear the FERR bit. Receive Overrun Error The receive FIFO buffer can hold two characters. An overrun error will be generated if a third character, in its entirety, is received before the FIFO is accessed. When this happens the OERR bit of the RCSTA register is set. The characters already in the FIFO buffer can be read, but no additional characters will be received until the error is cleared. The error must be cleared by either clearing the CREN bit of the RCSTA register or by resetting the EUSART by clearing the SPEN bit of the RCSTA register. 2013-2015 Microchip Technology Inc. 21.1.2.6 Receiving 9-Bit Characters The EUSART supports 9-bit character reception. When the RX9 bit of the RCSTA register is set, the EUSART will shift nine bits into the RSR for each character received. The RX9D bit of the RCSTA register is the ninth and Most Significant data bit of the top unread character in the receive FIFO. When reading 9-bit data from the receive FIFO buffer, the RX9D data bit must be read before reading the eight Least Significant bits from the RCREG. 21.1.2.7 Address Detection A special Address Detection mode is available for use when multiple receivers share the same transmission line, such as in RS-485 systems. Address detection is enabled by setting the ADDEN bit of the RCSTA register. Address detection requires 9-bit character reception. When address detection is enabled, only characters with the ninth data bit set will be transferred to the receive FIFO buffer, thereby setting the RCIF interrupt bit. All other characters will be ignored. Upon receiving an address character, user software determines if the address matches its own. Upon address match, user software must disable address detection by clearing the ADDEN bit before the next Stop bit occurs. When user software detects the end of the message, determined by the message protocol used, software places the receiver back into the Address Detection mode by setting the ADDEN bit. DS40001723D-page 181 PIC12(L)F1571/2 21.1.2.8 Asynchronous Reception Setup 21.1.2.9 1. Initialize the SPBRGH, SPBRGL register pair and the BRGH and BRG16 bits to achieve the desired baud rate (see Section 21.4 “EUSART Baud Rate Generator (BRG)”). 2. Clear the ANSELx bit for the RX pin (if applicable). 3. Enable the serial port by setting the SPEN bit. The SYNC bit must be clear for asynchronous operation. 4. If interrupts are desired, set the RCIE bit of the PIE1 register, and the GIE and PEIE bits of the INTCON register. 5. If 9-bit reception is desired, set the RX9 bit. 6. Enable reception by setting the CREN bit. 7. The RCIF interrupt flag bit will be set when a character is transferred from the RSR to the receive buffer. An interrupt will be generated if the RCIE interrupt enable bit was also set. 8. Read the RCSTA register to get the error flags and, if 9-bit data reception is enabled, the ninth data bit. 9. Get the received eight Least Significant data bits from the receive buffer by reading the RCREG register. 10. If an overrun occurred, clear the OERR flag by clearing the CREN receiver enable bit. FIGURE 21-5: This mode would typically be used in RS-485 systems. To set up an Asynchronous Reception with Address Detect Enable: 1. Initialize the SPBRGH/SPBRGL register pair, and the BRGH and BRG16 bits to achieve the desired baud rate (see Section 21.4 “EUSART Baud Rate Generator (BRG)”). 2. Clear the ANSELx bit for the RX pin (if applicable). 3. Enable the serial port by setting the SPEN bit. The SYNC bit must be clear for asynchronous operation. 4. If interrupts are desired, set the RCIE bit of the PIE1 register, and the GIE and PEIE bits of the INTCON register. 5. Enable 9-bit reception by setting the RX9 bit. 6. Enable address detection by setting the ADDEN bit. 7. Enable reception by setting the CREN bit. 8. The RCIF interrupt flag bit will be set when a character with the ninth bit set is transferred from the RSR to the receive buffer. An interrupt will be generated if the RCIE interrupt enable bit was also set. 9. Read the RCSTA register to get the error flags. The ninth data bit will always be set. 10. Get the received eight Least Significant data bits from the receive buffer by reading the RCREG register. Software determines if this is the device’s address. 11. If an overrun occurred, clear the OERR flag by clearing the CREN receiver enable bit. 12. If the device has been addressed, clear the ADDEN bit to allow all received data into the receive buffer and generate interrupts. ASYNCHRONOUS RECEPTION Start bit RX/DT Pin 9-Bit Address Detection Mode Setup Rcv Shift Reg. Rcv Buffer Reg. bit 0 bit 1 bit 7/8 Stop bit Start bit Word 1 RCREG bit 0 bit 7/8 Stop bit Start bit bit 7/8 Stop bit Word 2 RCREG RCIDL Read Rcv Buffer Reg. (RCREG) RCIF (Interrupt Flag) OERR bit CREN Note: This timing diagram shows three words appearing on the RX input. The RCREG (receive buffer) is read after the third word, causing the OERR (overrun) bit to be set. DS40001723D-page 182 2013-2015 Microchip Technology Inc. PIC12(L)F1571/2 TABLE 21-2: Name BAUDCON INTCON PIE1 PIR1 SUMMARY OF REGISTERS ASSOCIATED WITH ASYNCHRONOUS RECEPTION Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register on Page ABDOVF RCIDL — SCKP BRG16 — WUE ABDEN 186 GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF 74 TMR1GIE ADIE RCIE(1) TXIE(1) — — TMR2IE TMR1IE 75 ADIF (1) (1) — — TMR2IF TMR1IF TMR1GIF RCIF RCREG TXIF EUSART Receive Data Register RCSTA SPEN RX9 SREN CREN SPBRGL FERR OERR RX9D BRG<7:0> SPBRGH TXSTA ADDEN TX9 TXEN SYNC SENDB 185* 187* BRG<15:8> CSRC 78 180* 187* BRGH TRMT TX9D 184 Legend: — = unimplemented location, read as ‘0’. Shaded cells are not used for asynchronous reception. * Page provides register information. Note 1: PIC12(L)F1572 only. 21.2 Clock Accuracy with Asynchronous Operation The factory calibrates the Internal Oscillator Block (INTOSC) output. However, the INTOSC frequency may drift as VDD or temperature changes, and this directly affects the asynchronous baud rate. 2013-2015 Microchip Technology Inc. The Auto-Baud Detect feature (see Section 21.4.1 “Auto-Baud Detect”) can be used to compensate for changes in the INTOSC frequency. There may not be fine enough resolution when adjusting the Baud Rate Generator to compensate for a gradual change in the peripheral clock frequency. DS40001723D-page 183 PIC12(L)F1571/2 21.3 Register Definitions: EUSART Control REGISTER 21-1: TXSTA: TRANSMIT STATUS AND CONTROL REGISTER R/W-/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R-1/1 R/W-0/0 CSRC TX9 TXEN(1) SYNC SENDB BRGH TRMT TX9D bit 7 bit 0 Legend: R = Readable bit W = Writable bit u = Bit is unchanged x = Bit is unknown U = Unimplemented bit, read as ‘0’ ‘1’ = Bit is set ‘0’ = Bit is cleared -n/n = Value at POR and BOR/Value at all other Resets bit 7 CSRC: Clock Source Select bit Asynchronous mode: Don’t care. Synchronous mode: 1 = Master mode (clock generated internally from BRG) 0 = Slave mode (clock from external source) bit 6 TX9: 9-Bit Transmit Enable bit 1 = Selects 9-bit transmission 0 = Selects 8-bit transmission bit 5 TXEN: Transmit Enable bit(1) 1 = Transmit is enabled 0 = Transmit is disabled bit 4 SYNC: EUSART Mode Select bit 1 = Synchronous mode 0 = Asynchronous mode bit 3 SENDB: Send Break Character bit Asynchronous mode: 1 = Sends Sync Break on next transmission (cleared by hardware upon completion) 0 = Sync Break transmission completed Synchronous mode: Don’t care. bit 2 BRGH: High Baud Rate Select bit Asynchronous mode: 1 = High speed 0 = Low speed Synchronous mode: Unused in this mode. bit 1 TRMT: Transmit Shift Register Status bit 1 = TSR is empty 0 = TSR is full bit 0 TX9D: Ninth bit of Transmit Data Can be address/data bit or a parity bit. Note 1: SREN/CREN overrides TXEN in Sync mode. DS40001723D-page 184 2013-2015 Microchip Technology Inc. PIC12(L)F1571/2 REGISTER 21-2: RCSTA: RECEIVE STATUS AND CONTROL REGISTER R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R-0/0 R-0/0 R-0/0 SPEN RX9 SREN CREN ADDEN FERR OERR RX9D bit 7 bit 0 Legend: R = Readable bit W = Writable bit u = Bit is unchanged x = Bit is unknown U = Unimplemented bit, read as ‘0’ ‘1’ = Bit is set ‘0’ = Bit is cleared -n/n = Value at POR and BOR/Value at all other Resets bit 7 SPEN: Serial Port Enable bit 1 = Serial port is enabled (configures RX/DT and TX/CK pins as serial port pins) 0 = Serial port is disabled (held in Reset) bit 6 RX9: 9-Bit Receive Enable bit 1 = Selects 9-bit reception 0 = Selects 8-bit reception bit 5 SREN: Single Receive Enable bit Asynchronous mode: Don’t care. Synchronous mode – Master: 1 = Enables single receive 0 = Disables single receive This bit is cleared after reception is complete. Synchronous mode – Slave: Don’t care. bit 4 CREN: Continuous Receive Enable bit Asynchronous mode: 1 = Enables receiver 0 = Disables receiver Synchronous mode: 1 = Enables continuous receive until enable bit CREN is cleared (CREN overrides SREN) 0 = Disables continuous receive bit 3 ADDEN: Address Detect Enable bit Asynchronous mode 9-bit (RX9 = 1): 1 = Enables address detection, enables interrupt and loads the receive buffer when RSR<8> is set 0 = Disables address detection, all bytes are received and ninth bit can be used as parity bit Asynchronous mode 8-bit (RX9 = 0): Don’t care. bit 2 FERR: Framing Error bit 1 = Framing error (can be updated by reading RCREG register and receiving next valid byte) 0 = No framing error bit 1 OERR: Overrun Error bit 1 = Overrun error (can be cleared by clearing bit, CREN) 0 = No overrun error bit 0 RX9D: Ninth Bit of Received Data bit This can be address/data bit or a parity bit and must be calculated by user firmware. 2013-2015 Microchip Technology Inc. DS40001723D-page 185 PIC12(L)F1571/2 REGISTER 21-3: BAUDCON: BAUD RATE CONTROL REGISTER R-0/0 R-1/1 U-0 R/W-0/0 R/W-0/0 U-0 R/W-0/0 R/W-0/0 ABDOVF RCIDL — SCKP BRG16 — WUE ABDEN bit 7 bit 0 Legend: R = Readable bit W = Writable bit u = Bit is unchanged x = Bit is unknown U = Unimplemented bit, read as ‘0’ ‘1’ = Bit is set ‘0’ = Bit is cleared -n/n = Value at POR and BOR/Value at all other Resets bit 7 ABDOVF: Auto-Baud Detect Overflow bit Asynchronous mode: 1 = Auto-baud timer overflowed 0 = Auto-baud timer did not overflow Synchronous mode: Don’t care. bit 6 RCIDL: Receive Idle Flag bit Asynchronous mode: 1 = Receiver is Idle 0 = Start bit has been received and the receiver is receiving Synchronous mode: Don’t care. bit 5 Unimplemented: Read as ‘0’ bit 4 SCKP: Synchronous Clock Polarity Select bit Asynchronous mode: 1 = Transmits inverted data to the TX/CK pin 0 = Transmits non-inverted data to the TX/CK pin Synchronous mode: 1 = Data is clocked on rising edge of the clock 0 = Data is clocked on falling edge of the clock bit 3 BRG16: 16-Bit Baud Rate Generator bit 1 = 16-bit Baud Rate Generator is used 0 = 8-bit Baud Rate Generator is used bit 2 Unimplemented: Read as ‘0’ bit 1 WUE: Wake-up Enable bit Asynchronous mode: 1 = Receiver is waiting for a falling edge; no character will be received, RCIF bit will be set, WUE will automatically clear after RCIF is set 0 = Receiver is operating normally Synchronous mode: Don’t care bit 0 ABDEN: A.uto-Baud Detect Enable bit Asynchronous mode: 1 = Auto-Baud Detect mode is enabled (clears when auto-baud is complete) 0 = Auto-Baud Detect mode is disabled Synchronous mode: Don’t care. DS40001723D-page 186 2013-2015 Microchip Technology Inc. PIC12(L)F1571/2 21.4 EUSART Baud Rate Generator (BRG) The Baud Rate Generator (BRG) is an 8-bit or 16-bit timer that is dedicated to the support of both the asynchronous and synchronous EUSART operation. By default, the BRG operates in 8-bit mode. Setting the BRG16 bit of the BAUDCON register selects 16-bit mode. The SPBRGH/SPBRGL register pair determines the period of the free-running baud rate timer. In Asynchronous mode, the multiplier of the baud rate period is determined by both the BRGH bit of the TXSTA register and the BRG16 bit of the BAUDCON register. In Synchronous mode, the BRGH bit is ignored. Table 21-3 contains the formulas for determining the baud rate. Example 21-1 provides a sample calculation for determining the baud rate and baud rate error. Typical baud rates and error values for various Asynchronous modes have been computed for your convenience and are shown in Table 21-3. It may be advantageous to use the high baud rate (BRGH = 1) or the 16-bit BRG (BRG16 = 1) to reduce the baud rate error. The 16-bit BRG mode is used to achieve slow baud rates for fast oscillator frequencies. EXAMPLE 21-1: CALCULATING BAUD RATE ERROR For a device with FOSC of 16 MHz, desired baud rate of 9600, Asynchronous mode, 8-bit BRG: F OS C Desired Baud Rate = -----------------------------------------------------------------------64 [SPBRGH:SPBRGL] + 1 Solving for SPBRGH:SPBRGL: FOSC --------------------------------------------Desired Baud Rate X = --------------------------------------------- – 1 64 16000000 -----------------------9600 = ------------------------ – 1 64 = 25.042 = 25 16000000 Calculated Baud Rate = --------------------------64 25 + 1 = 9615 Calc. Baud Rate – Desired Baud Rate Error = -------------------------------------------------------------------------------------------Desired Baud Rate 9615 – 9600 = ---------------------------------- = 0.16% 9600 Writing a new value to the SPBRGH/SPBRGL register pair causes the BRG timer to be reset (or cleared). This ensures that the BRG does not wait for a timer overflow before outputting the new baud rate. If the system clock is changed during an active receive operation, a receive error or data loss may result. To avoid this problem, check the status of the RCIDL bit to make sure that the receive operation is Idle before changing the system clock. 2013-2015 Microchip Technology Inc. DS40001723D-page 187 PIC12(L)F1571/2 TABLE 21-3: BAUD RATE FORMULAS Configuration Bits SYNC BRG16 BRGH BRG/EUSART Mode Baud Rate Formula FOSC/[64 (n+1)] 0 0 0 8-bit/Asynchronous 0 0 1 8-bit/Asynchronous 0 1 0 16-bit/Asynchronous 0 1 1 16-bit/Asynchronous 1 0 x 8-bit/Synchronous 1 1 x 16-bit/Synchronous FOSC/[16 (n+1)] FOSC/[4 (n+1)] Legend: x = Don’t care; n = value of SPBRGH/SPBRGL register pair. TABLE 21-4: Name BAUDCON RCSTA SUMMARY OF REGISTERS ASSOCIATED WITH THE BAUD RATE GENERATOR Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register on Page ABDOVF RCIDL — SCKP BRG16 — WUE ABDEN 186 SPEN RX9 SREN CREN ADDEN FERR OERR RX9D SPBRGL BRG<7:0> SPBRGH TXSTA BRG<15:8> CSRC TX9 TXEN SYNC SENDB 185 187* 187* BRGH TRMT TX9D 184 Legend: — = unimplemented location, read as ‘0’. Shaded cells are not used for the Baud Rate Generator. * Page provides register information. DS40001723D-page 188 2013-2015 Microchip Technology Inc. PIC12(L)F1571/2 TABLE 21-5: BAUD RATES FOR ASYNCHRONOUS MODES SYNC = 0, BRGH = 0, BRG16 = 0 BAUD RATE FOSC = 20.000 MHz FOSC = 18.432 MHz FOSC = 16.000 MHz FOSC = 11.0592 MHz Actual Rate % Error SPBRG Value (decimal) Actual Rate % Error SPBRG Value (decimal) Actual Rate % Error SPBRG Value (decimal) Actual Rate % Error SPBRG Value (decimal) 300 — — — — — — — — — — — — 1200 1221 1.73 255 1200 0.00 239 1202 0.16 207 1200 0.00 143 2400 2404 0.16 129 2400 0.00 119 2404 0.16 103 2400 0.00 71 9600 9470 -1.36 32 9600 0.00 29 9615 0.16 25 9600 0.00 17 10417 10417 0.00 29 10286 -1.26 27 10417 0.00 23 10165 -2.42 16 19.2k 19.53k 1.73 15 19.20k 0.00 14 19.23k 0.16 12 19.20k 0.00 8 57.6k — — — 57.60k 0.00 7 — — — 57.60k 0.00 2 115.2k — — — — — — — — — — — — SYNC = 0, BRGH = 0, BRG16 = 0 BAUD RATE FOSC = 8.000 MHz Actual Rate % Error SPBRG Value (decimal) FOSC = 4.000 MHz Actual Rate % Error SPBRG Value (decimal) FOSC = 3.6864 MHz Actual Rate % Error SPBRG Value (decimal) FOSC = 1.000 MHz Actual Rate % Error SPBRG Value (decimal) 300 — — — 300 0.16 207 300 0.00 191 300 0.16 51 1200 1202 0.16 103 1202 0.16 51 1200 0.00 47 1202 0.16 12 2400 2404 0.16 51 2404 0.16 25 2400 0.00 23 — — — 9600 9615 0.16 12 — — — 9600 0.00 5 — — — 10417 10417 0.00 11 10417 0.00 5 — — — — — — 19.2k — — — — — — 19.20k 0.00 2 — — — 57.6k — — — — — — 57.60k 0.00 0 — — — 115.2k — — — — — — — — — — — — SYNC = 0, BRGH = 1, BRG16 = 0 BAUD RATE FOSC = 20.000 MHz Actual Rate % Error SPBRG Value (decimal) FOSC = 18.432 MHz Actual Rate % Error SPBRG Value (decimal) FOSC = 16.000 MHz Actual Rate % Error SPBRG Value (decimal) FOSC = 11.0592 MHz Actual Rate % Error SPBRG Value (decimal) 300 — — — — — — — — — — — — 1200 — — — — — — — — — — — — 2400 — — — — — — — — — — — — 9600 9615 0.16 129 9600 0.00 119 9615 0.16 103 9600 0.00 71 10417 10417 0.00 119 10378 -0.37 110 10417 0.00 95 10473 0.53 65 19.2k 19.23k 0.16 64 19.20k 0.00 59 19.23k 0.16 51 19.20k 0.00 35 57.6k 56.82k -1.36 21 57.60k 0.00 19 58.82k 2.12 16 57.60k 0.00 11 115.2k 113.64k -1.36 10 115.2k 0.00 9 111.1k -3.55 8 115.2k 0.00 5 2013-2015 Microchip Technology Inc. DS40001723D-page 189 PIC12(L)F1571/2 TABLE 21-5: BAUD RATES FOR ASYNCHRONOUS MODES (CONTINUED) SYNC = 0, BRGH = 1, BRG16 = 0 BAUD RATE FOSC = 8.000 MHz Actual Rate % Error SPBRG Value (decimal) FOSC = 4.000 MHz Actual Rate % Error SPBRG Value (decimal) FOSC = 3.6864 MHz Actual Rate % Error SPBRG Value (decimal) FOSC = 1.000 MHz Actual Rate % Error SPBRG Value (decimal) 207 300 — — — — — — — — — 300 0.16 1200 — — — 1202 0.16 207 1200 0.00 191 1202 0.16 51 2400 2404 0.16 207 2404 0.16 103 2400 0.00 95 2404 0.16 25 9600 9615 0.16 51 9615 0.16 25 9600 0.00 23 — — — 10417 10417 0.00 47 10417 0.00 23 10473 0.53 21 10417 0.00 5 19.2k 19231 0.16 25 19.23k 0.16 12 19.2k 0.00 11 — — — 57.6k 55556 -3.55 8 — — — 57.60k 0.00 3 — — — 115.2k — — — — — — 115.2k 0.00 1 — — — SYNC = 0, BRGH = 0, BRG16 = 1 BAUD RATE FOSC = 20.000 MHz Actual Rate FOSC = 18.432 MHz FOSC = 16.000 MHz FOSC = 11.0592 MHz % Error SPBRG Value (decimal) Actual Rate % Error SPBRG Value (decimal) Actual Rate % Error SPBRG Value (decimal) Actual Rate % Error SPBRG Value (decimal) 300 300.0 -0.01 4166 300.0 0.00 3839 300.03 0.01 3332 300.0 0.00 2303 1200 1200 -0.03 1041 1200 0.00 959 1200.5 0.04 832 1200 0.00 575 2400 2399 -0.03 520 2400 0.00 479 2398 -0.08 416 2400 0.00 287 9600 9615 0.16 129 9600 0.00 119 9615 0.16 103 9600 0.00 71 10417 10417 0.00 119 10378 -0.37 110 10417 0.00 95 10473 0.53 65 19.2k 19.23k 0.16 64 19.20k 0.00 59 19.23k 0.16 51 19.20k 0.00 35 57.6k 56.818 -1.36 21 57.60k 0.00 19 58.82k 2.12 16 57.60k 0.00 11 115.2k 113.636 -1.36 10 115.2k 0.00 9 111.11k -3.55 8 115.2k 0.00 5 SYNC = 0, BRGH = 0, BRG16 = 1 BAUD RATE FOSC = 8.000 MHz Actual Rate FOSC = 4.000 MHz FOSC = 3.6864 MHz % Error SPBRG Value (decimal) Actual Rate % Error SPBRG Value (decimal) Actual Rate % Error FOSC = 1.000 MHz SPBRG Value (decimal) Actual Rate % Error SPBRG Value (decimal) 300 299.9 -0.02 1666 300.1 0.04 832 300.0 0.00 767 300.5 0.16 207 1200 1199 -0.08 416 1202 0.16 207 1200 0.00 191 1202 0.16 51 2400 2404 0.16 207 2404 0.16 103 2400 0.00 95 2404 0.16 25 9600 9615 0.16 51 9615 0.16 25 9600 0.00 23 — — — 10417 10417 0.00 47 10417 0.00 23 10473 0.53 21 10417 0.00 5 19.2k 19.23k 0.16 25 19.23k 0.16 12 19.20k 0.00 11 — — — 57.6k 55556 -3.55 8 — — — 57.60k 0.00 3 — — — 115.2k — — — — — — 115.2k 0.00 1 — — — DS40001723D-page 190 2013-2015 Microchip Technology Inc. PIC12(L)F1571/2 TABLE 21-5: BAUD RATES FOR ASYNCHRONOUS MODES (CONTINUED) SYNC = 0, BRGH = 1, BRG16 = 1 or SYNC = 1, BRG16 = 1 BAUD RATE FOSC = 20.000 MHz Actual Rate FOSC = 18.432 MHz % Error SPBRG Value (decimal) Actual Rate % Error SPBRG Value (decimal) FOSC = 16.000 MHz Actual Rate FOSC = 11.0592 MHz % Error SPBRG Value (decimal) Actual Rate % Error SPBRG Value (decimal) 300 300.0 0.00 16665 300.0 0.00 15359 300.0 0.00 13332 300.0 0.00 9215 1200 1200 -0.01 4166 1200 0.00 3839 1200.1 0.01 3332 1200 0.00 2303 2400 2400 0.02 2082 2400 0.00 1919 2399.5 -0.02 1666 2400 0.00 1151 9600 9597 -0.03 520 9600 0.00 479 9592 -0.08 416 9600 0.00 287 10417 10417 0.00 479 10425 0.08 441 10417 0.00 383 10433 0.16 264 19.2k 19.23k 0.16 259 19.20k 0.00 239 19.23k 0.16 207 19.20k 0.00 143 57.6k 57.47k -0.22 86 57.60k 0.00 79 57.97k 0.64 68 57.60k 0.00 47 115.2k 116.3k 0.94 42 115.2k 0.00 39 114.29k -0.79 34 115.2k 0.00 23 SYNC = 0, BRGH = 1, BRG16 = 1 or SYNC = 1, BRG16 = 1 BAUD RATE FOSC = 8.000 MHz Actual Rate FOSC = 4.000 MHz FOSC = 3.6864 MHz FOSC = 1.000 MHz % Error SPBRG Value (decimal) Actual Rate % Error SPBRG Value (decimal) Actual Rate % Error SPBRG Value (decimal) Actual Rate % Error SPBRG Value (decimal) 300 300.0 0.00 6666 300.0 0.01 3332 300.0 0.00 3071 300.1 0.04 832 1200 1200 -0.02 1666 1200 0.04 832 1200 0.00 767 1202 0.16 207 2400 2401 0.04 832 2398 0.08 416 2400 0.00 383 2404 0.16 103 9600 9615 0.16 207 9615 0.16 103 9600 0.00 95 9615 0.16 25 10417 10417 0 191 10417 0.00 95 10473 0.53 87 10417 0.00 23 19.2k 19.23k 0.16 103 19.23k 0.16 51 19.20k 0.00 47 19.23k 0.16 12 57.6k 57.14k -0.79 34 58.82k 2.12 16 57.60k 0.00 15 — — — 115.2k 117.6k 2.12 16 111.1k -3.55 8 115.2k 0.00 7 — — — 2013-2015 Microchip Technology Inc. DS40001723D-page 191 PIC12(L)F1571/2 21.4.1 AUTO-BAUD DETECT The EUSART module supports automatic detection and calibration of the baud rate. In the Auto-Baud Detect (ABD) mode, the clock to the BRG is reversed. Rather than the BRG clocking the incoming RX signal, the RX signal is timing the BRG. The Baud Rate Generator is used to time the period of a received 55h (ASCII “U”), which is the Sync character for the LIN bus. The unique feature of this character is that it has five rising edges, including the Stop bit edge. Setting the ABDEN bit of the BAUDCON register starts the auto-baud calibration sequence (Figure 21-6). While the ABD sequence takes place, the EUSART state machine is held in Idle. On the first rising edge of the receive line, after the Start bit, the SPBRG begins counting up using the BRG counter clock as shown in Table 21-6. The fifth rising edge will occur on the RX pin at the end of the eighth bit period. At that time, an accumulated value totaling the proper BRG period is left in the SPBRGH/SPBRGL register pair, the ABDEN bit is automatically cleared and the RCIF interrupt flag is set. The value in the RCREG needs to be read to clear the RCIF interrupt. RCREG content should be discarded. When calibrating for modes that do not use the SPBRGH register, the user can verify that the SPBRGL register did not overflow by checking for 00h in the SPBRGH register. The BRG auto-baud clock is determined by the BRG16 and BRGH bits, as shown in Table 21-6. During ABD, both the SPBRGH and SPBRGL registers are used as a 16-bit counter, independent of the BRG16 bit setting. While calibrating the baud rate period, the SPBRGH FIGURE 21-6: BRG Value and SPBRGL registers are clocked at 1/8th the BRG base clock rate. The resulting byte measurement is the average bit time when clocked at full speed. Note 1: If the WUE bit is set with the ABDEN bit, Auto-Baud Detection will occur on the byte following the Break character (see Section 21.4.3 “Auto-Wake-up on Break”). 2: It is up to the user to determine that the incoming character baud rate is within the range of the selected BRG clock source. Some combinations of oscillator frequency and EUSART baud rates are not possible. 3: During the auto-baud process, the auto-baud counter starts counting at 1. Upon completion of the auto-baud sequence, to achieve maximum accuracy, subtract 1 from the SPBRGH:SPBRGL register pair. TABLE 21-6: BRG COUNTER CLOCK RATES BRG16 BRGH BRG Base Clock BRG ABD Clock 0 0 FOSC/64 FOSC/512 0 1 FOSC/16 FOSC/128 1 0 FOSC/16 FOSC/128 1 FOSC/4 FOSC/32 1 Note: During the ABD sequence, the SPBRGL and SPBRGH registers are both used as a 16-bit counter, independent of the BRG16 setting. AUTOMATIC BAUD RATE CALIBRATION XXXXh 0000h 001Ch Start RX Pin Edge #1 bit 1 bit 0 Edge #2 bit 3 bit 2 Edge #3 bit 5 bit 4 Edge #4 bit 7 bit 6 Edge #5 Stop bit BRG Clock Auto Cleared Set by User ABDEN bit RCIDL RCIF bit (Interrupt) Read RCREG SPBRGL XXh 1Ch SPBRGH XXh 00h Note 1: The ABD sequence requires the EUSART module to be configured in Asynchronous mode. DS40001723D-page 192 2013-2015 Microchip Technology Inc. PIC12(L)F1571/2 21.4.2 AUTO-BAUD OVERFLOW 21.4.3.1 Special Considerations During the course of Automatic Baud Detection, the ABDOVF bit of the BAUDCON register will be set if the baud rate counter overflows before the fifth rising edge is detected on the RX pin. The ABDOVF bit indicates that the counter has exceeded the maximum count that can fit in the 16 bits of the SPBRGH:SPBRGL register pair. The overflow condition will set the RCIF flag. The counter continues to count until the fifth rising edge is detected on the RX pin. The RCIDL bit will remain false (‘0’) until the fifth rising edge, at which time, the RDICL bit will set. If the RCREG is read after the overflow occurs, but before the fifth rising edge, the fifth rising edge will set the RCIF again. Break Character Terminating the auto-baud process early to clear an overflow condition will prevent proper detection of the Sync character fifth rising edge. If any falling edges of the Sync character have not yet occurred when the ABDEN bit is cleared, then those will be falsely detected as Start bits. The following steps are recommended to clear the overflow condition: Therefore, the initial character in the transmission must be all ‘0’s. This must be ten or more bit times; 13-bit times are recommended for LIN bus or any number of bit times for standard RS-232 devices. 1. 2. 3. Read RCREG to clear RCIF. If RCIDL is zero, then wait for RCIF and repeat Step 1. Clear the ABDOVF bit. 21.4.3 AUTO-WAKE-UP ON BREAK During Sleep mode, all clocks to the EUSART are suspended. Because of this, the Baud Rate Generator is inactive and a proper character reception cannot be performed. The auto-wake-up feature allows the controller to wake-up due to activity on the RX/DT line. This feature is available only in Asynchronous mode. The auto-wake-up feature is enabled by setting the WUE bit of the BAUDCON register. Once set, the normal receive sequence on RX/DT is disabled, and the EUSART remains in an Idle state, monitoring for a wake-up event independent of the CPU mode. A wake-up event consists of a high-to-low transition on the RX/DT line. (This coincides with the start of a Sync Break or a wake-up signal character for the LIN protocol.) To avoid character errors or character fragments during a wake-up event, the wake-up character must be all zeros. When the wake-up is enabled, the function works independent of the low time on the data stream. If the WUE bit is set and a valid non-zero character is received, the low time from the Start bit to the first rising edge will be interpreted as the wake-up event. The remaining bits in the character will be received as a fragmented character and subsequent characters can result in framing or overrun errors. Oscillator Start-up Time Oscillator start-up time must be considered, especially in applications using oscillators with longer start-up intervals (i.e., LP, XT or HS/PLL mode). The Sync Break (or wake-up signal) character must be of sufficient length, and be followed by a sufficient interval, to allow enough time for the selected oscillator to start and provide proper initialization of the EUSART. WUE Bit The wake-up event causes a receive interrupt by setting the RCIF bit. The WUE bit is cleared in hardware by a rising edge on RX/DT. The interrupt condition is then cleared in software by reading the RCREG register and discarding its contents. To ensure that no actual data is lost, check the RCIDL bit to verify that a receive operation is not in process before setting the WUE bit. If a receive operation is not occurring, the WUE bit may then be set just prior to entering the Sleep mode. The EUSART module generates an RCIF interrupt coincident with the wake-up event. The interrupt is generated synchronously to the Q clocks in normal CPU operating modes (Figure 21-7), and asynchronously if the device is in Sleep mode (Figure 21-8). The interrupt condition is cleared by reading the RCREG register. The WUE bit is automatically cleared by the low-to-high transition on the RX line at the end of the Break. This signals to the user that the Break event is over. At this point, the EUSART module is in Idle mode waiting to receive the next character. 2013-2015 Microchip Technology Inc. DS40001723D-page 193 PIC12(L)F1571/2 FIGURE 21-7: AUTO-WAKE-UP BIT (WUE) TIMING DURING NORMAL OPERATION Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1Q2 Q3 Q4 OSC1 WUE bit Auto-Cleared Bit Set by User RX/DT Line RCIF Note 1: Cleared due to User Read of RCREG The EUSART remains in Idle while the WUE bit is set. FIGURE 21-8: AUTO-WAKE-UP BIT (WUE) TIMINGS DURING SLEEP Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 OSC1 WUE bit Auto Cleared Bit Set by User RX/DT Line Note 1 RCIF Sleep Command Executed Note 1: 2: Sleep Ends Cleared due to User Read of RCREG If the wake-up event requires long oscillator warm-up time, the automatic clearing of the WUE bit can occur while the stposc signal is still active. This sequence should not depend on the presence of Q clocks. The EUSART remains in Idle while the WUE bit is set. DS40001723D-page 194 2013-2015 Microchip Technology Inc. PIC12(L)F1571/2 21.4.4 BREAK CHARACTER SEQUENCE The EUSART module has the capability of sending the special Break character sequences that are required by the LIN bus standard. A Break character consists of a Start bit, followed by twelve ‘0’ bits and a Stop bit. To send a Break character, set the SENDB and TXEN bits of the TXSTA register. The Break character transmission is then initiated by a write to the TXREG. The value of data written to TXREG will be ignored and all ‘0’s will be transmitted. The SENDB bit is automatically reset by hardware after the corresponding Stop bit is sent. This allows the user to preload the transmit FIFO with the next transmit byte following the Break character (typically, the Sync character in the LIN specification). The TRMT bit of the TXSTA register indicates when the transmit operation is active or idle, just as it does during normal transmission. See Figure 21-9 for the timing of the Break character sequence. 21.4.4.1 Break and Sync Transmit Sequence The following sequence will start a message frame header made up of a Break, followed by an auto-baud Sync byte. This sequence is typical of a LIN bus master. 1. 2. 3. 4. 5. 21.4.5 RECEIVING A BREAK CHARACTER The Enhanced USART module can receive a Break character in two ways. The first method to detect a Break character uses the FERR bit of the RCSTA register and the received data as indicated by RCREG. The Baud Rate Generator is assumed to have been initialized to the expected baud rate. A Break character has been received when: • RCIF bit is set • FERR bit is set • RCREG = 00h The second method uses the auto-wake-up feature described in Section 21.4.3 “Auto-Wake-up on Break”. By enabling this feature, the EUSART will sample the next two transitions on RX/DT, cause an RCIF interrupt and receive the next data byte followed by another interrupt. Note that following a Break character, the user will typically want to enable the Auto-Baud Detect feature. For both methods, the user can set the ABDEN bit of the BAUDCON register before placing the EUSART in Sleep mode. Configure the EUSART for the desired mode. Set the TXEN and SENDB bits to enable the Break sequence. Load the TXREG with a dummy character to initiate transmission (the value is ignored). Write ‘55h’ to TXREG to load the Sync character into the transmit FIFO buffer. After the Break has been sent, the SENDB bit is reset by hardware and the Sync character is then transmitted. When the TXREG becomes empty, as indicated by the TXIF, the next data byte can be written to TXREG. FIGURE 21-9: Write to TXREG SEND BREAK CHARACTER SEQUENCE Dummy Write BRG Output (Shift Clock) TX (pin) Start bit bit 0 bit 1 bit 11 Stop bit Break TXIF bit (Transmit Interrupt Flag) TRMT bit (Transmit Shift Empty Flag) SENDB (send Break control bit) 2013-2015 Microchip Technology Inc. SENDB Sampled Here Auto Cleared DS40001723D-page 195 PIC12(L)F1571/2 21.5 EUSART Synchronous Mode Synchronous serial communications are typically used in systems with a single master and one or more slaves. The master device contains the necessary circuitry for baud rate generation and supplies the clock for all devices in the system. Slave devices can take advantage of the master clock by eliminating the internal clock generation circuitry. There are two signal lines in Synchronous mode: a bidirectional data line and a clock line. Slaves use the external clock supplied by the master to shift the serial data into and out of their respective Receive and Transmit Shift registers. Since the data line is bidirectional, synchronous operation is half-duplex only. Half-duplex refers to the fact that master and slave devices can receive and transmit data but not both simultaneously. The EUSART can operate as either a master or slave device. Start and Stop bits are not used in synchronous transmissions. 21.5.1 SYNCHRONOUS MASTER MODE The following bits are used to configure the EUSART for synchronous master operation: • • • • • SYNC = 1 CSRC = 1 SREN = 0 (for transmit); SREN = 1 (for receive) CREN = 0 (for transmit); CREN = 1 (for receive) SPEN = 1 Setting the SYNC bit of the TXSTA register configures the device for synchronous operation. Setting the CSRC bit of the TXSTA register configures the device as a master. Clearing the SREN and CREN bits of the RCSTA register ensures that the device is in the Transmit mode, otherwise the device will be configured to receive. Setting the SPEN bit of the RCSTA register enables the EUSART. 21.5.1.1 Master Clock Synchronous data transfers use a separate clock line, which is synchronous with the data. A device configured as a master transmits the clock on the TX/CK line. The TX/CK pin output driver is automatically enabled when the EUSART is configured for synchronous transmit or receive operation. Serial data bits change on the leading edge to ensure they are valid at the trailing edge of each clock. One clock cycle is generated for each data bit. Only as many clock cycles are generated as there are data bits. DS40001723D-page 196 21.5.1.2 Clock Polarity A clock polarity option is provided for Microwire compatibility. Clock polarity is selected with the SCKP bit of the BAUDCON register. Setting the SCKP bit sets the clock Idle state as high. When the SCKP bit is set, the data changes on the falling edge of each clock. Clearing the SCKP bit sets the Idle state as low. When the SCKP bit is cleared, the data changes on the rising edge of each clock. 21.5.1.3 Synchronous Master Transmission Data is transferred out of the device on the RX/DT pin. The RX/DT and TX/CK pin output drivers are automatically enabled when the EUSART is configured for synchronous master transmit operation. A transmission is initiated by writing a character to the TXREG register. If the TSR still contains all or part of a previous character the new character data is held in the TXREG until the last bit of the previous character has been transmitted. If this is the first character, or the previous character has been completely flushed from the TSR, the data in the TXREG is immediately transferred to the TSR. The transmission of the character commences immediately following the transfer of the data to the TSR from the TXREG. Each data bit changes on the leading edge of the master clock and remains valid until the subsequent leading clock edge. Note: The TSR register is not mapped in data memory, so it is not available to the user. 21.5.1.4 Synchronous Master Transmission Setup 1. 2. 3. 4. 5. 6. 7. 8. Initialize the SPBRGH, SPBRGL register pair and the BRGH and BRG16 bits to achieve the desired baud rate (see Section 21.4 “EUSART Baud Rate Generator (BRG)”). Enable the synchronous master serial port by setting bits, SYNC, SPEN and CSRC. Disable Receive mode by clearing bits, SREN and CREN. Enable Transmit mode by setting the TXEN bit. If 9-bit transmission is desired, set the TX9 bit. If interrupts are desired, set the TXIE bit of the PIE1 register, and the GIE and PEIE bits of the INTCON register. If 9-bit transmission is selected, the ninth bit should be loaded in the TX9D bit. Start transmission by loading data to the TXREG register. 2013-2015 Microchip Technology Inc. PIC12(L)F1571/2 FIGURE 21-10: SYNCHRONOUS TRANSMISSION RX/DT Pin bit 0 bit 1 bit 2 bit 7 bit 0 TX/CK Pin (SCKP = 0) bit 7 bit 1 Word 1 Word 2 TX/CK Pin (SCKP = 1) Write to TXREG Reg Write Word 1 Write Word 2 TXIF bit (Interrupt Flag) TRMT bit TXEN bit Note: ‘1’ ‘1’ Sync Master mode, SPBRGL = 0, continuous transmission of two 8-bit words. FIGURE 21-11: SYNCHRONOUS TRANSMISSION (THROUGH TXEN) RX/DT Pin bit 0 bit 1 bit 2 bit 6 bit 7 TX/CK Pin Write to TXREG Reg. TXIF bit TRMT bit TXEN bit TABLE 21-7: Name BAUDCON INTCON PIE1 PIR1 RCSTA SUMMARY OF REGISTERS ASSOCIATED WITH SYNCHRONOUS MASTER TRANSMISSION Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register on Page ABDOVF RCIDL — SCKP BRG16 — WUE ABDEN 186 GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF 74 TMR1GIE ADIE RCIE(1) TXIE(1) — — TMR2IE TMR1IE 75 TMR1GIF ADIF (1) RCIF TXIF (1) — — TMR2IF TMR1IF 78 SPEN RX9 SREN CREN ADDEN FERR OERR RX9D 185 SPBRGL BRG<7:0> 187* SPBRGH BRG<15:8> 187* EUSART Transmit Data Register TXREG TXSTA CSRC TX9 TXEN SYNC SENDB BRGH 177* TRMT TX9D 184 Legend: — = unimplemented location, read as ‘0’. Shaded cells are not used for synchronous master transmission. * Page provides register information. Note 1: PIC12(L)F1572 only. 2013-2015 Microchip Technology Inc. DS40001723D-page 197 PIC12(L)F1571/2 21.5.1.5 Synchronous Master Reception Data is received at the RX/DT pin. The RX/DT pin output driver is automatically disabled when the EUSART is configured for synchronous master receive operation. In Synchronous mode, reception is enabled by setting either the Single Receive Enable bit (SREN of the RCSTA register) or the Continuous Receive Enable bit (CREN of the RCSTA register). When SREN is set and CREN is clear, only as many clock cycles are generated as there are data bits in a single character. The SREN bit is automatically cleared at the completion of one character. When CREN is set, clocks are continuously generated until CREN is cleared. If CREN is cleared in the middle of a character, the CK clock stops immediately and the partial character is discarded. If SREN and CREN are both set, then SREN is cleared at the completion of the first character and CREN takes precedence. To initiate reception, set either SREN or CREN. Data is sampled at the RX/DT pin on the trailing edge of the TX/CK clock pin and is shifted into the Receive Shift Register (RSR). When a complete character is received into the RSR, the RCIF bit is set and the character is automatically transferred to the two-character receive FIFO. The Least Significant eight bits of the top character in the receive FIFO are available in RCREG. The RCIF bit remains set as long as there are unread characters in the receive FIFO. Note: 21.5.1.6 If the RX/DT function is on an analog pin, the corresponding ANSELx bit must be cleared for the receiver to function. Slave Clock Synchronous data transfers use a separate clock line, which is synchronous with the data. A device configured as a slave receives the clock on the TX/CK line. The TX/CK pin output driver is automatically disabled when the device is configured for synchronous slave transmit or receive operation. Serial data bits change on the leading edge to ensure they are valid at the trailing edge of each clock. One data bit is transferred for each clock cycle. Only as many clock cycles should be received as there are data bits. Note: If the device is configured as a slave and the TX/CK function is on an analog pin, the corresponding ANSELx bit must be cleared. DS40001723D-page 198 21.5.1.7 Receive Overrun Error The receive FIFO buffer can hold two characters. An overrun error will be generated if a third character, in its entirety, is received before RCREG is read to access the FIFO. When this happens, the OERR bit of the RCSTA register is set. Previous data in the FIFO will not be overwritten. The two characters in the FIFO buffer can be read, however, no additional characters will be received until the error is cleared. The OERR bit can only be cleared by clearing the overrun condition. If the overrun error occurred when the SREN bit is set and CREN is clear, then the error is cleared by reading RCREG. If the overrun occurred when the CREN bit is set, then the error condition is cleared by either clearing the CREN bit of the RCSTA register or by clearing the SPEN bit which resets the EUSART. 21.5.1.8 Receiving 9-Bit Characters The EUSART supports 9-bit character reception. When the RX9 bit of the RCSTA register is set the EUSART will shift 9 bits into the RSR for each character received. The RX9D bit of the RCSTA register is the ninth, and Most Significant, data bit of the top unread character in the receive FIFO. When reading 9-bit data from the receive FIFO buffer, the RX9D data bit must be read before reading the eight Least Significant bits from the RCREG. 21.5.1.9 Synchronous Master Reception Setup 1. Initialize the SPBRGH/SPBRGL register pair for the appropriate baud rate. Set or clear the BRGH and BRG16 bits, as required, to achieve the desired baud rate. 2. Clear the ANSELx bit for the RX pin (if applicable). 3. Enable the synchronous master serial port by setting bits, SYNC, SPEN and CSRC. 4. Ensure bits, CREN and SREN, are clear. 5. If interrupts are desired, set the RCIE bit of the PIE1 register, and the GIE and PEIE bits of the INTCON register. 6. If 9-bit reception is desired, set bit, RX9. 7. Start reception by setting the SREN bit or for continuous reception, set the CREN bit. 8. Interrupt flag bit, RCIF, will be set when reception of a character is complete. An interrupt will be generated if the enable bit, RCIE, was set. 9. Read the RCSTA register to get the ninth bit (if enabled) and determine if any error occurred during reception. 10. Read the 8-bit received data by reading the RCREG register. 11. If an overrun error occurs, clear the error by either clearing the CREN bit of the RCSTA register or by clearing the SPEN bit which resets the EUSART. 2013-2015 Microchip Technology Inc. PIC12(L)F1571/2 FIGURE 21-12: SYNCHRONOUS RECEPTION (MASTER MODE, SREN) RX/DT Pin bit 0 bit 1 bit 2 bit 3 bit 4 bit 5 bit 6 bit 7 TX/CK Pin (SCKP = 0) TX/CK Pin (SCKP = 1) Write to SREN bit SREN bit CREN bit ‘0’ ‘0’ RCIF bit (Interrupt) Read RCREG Note: Timing diagram demonstrates Sync Master mode with bit SREN = 1 and bit BRGH = 0. TABLE 21-8: Name BAUDCON INTCON PIE1 PIR1 SUMMARY OF REGISTERS ASSOCIATED WITH SYNCHRONOUS MASTER RECEPTION Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register on Page ABDOVF RCIDL — SCKP BRG16 — WUE ABDEN 186 GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF 74 TMR1GIE ADIE RCIE(1) TXIE(1) — — TMR2IE TMR1IE 75 ADIF RCIF(1) TXIF(1) — — TMR2IF TMR1IF TMR1GIF RCREG RCSTA EUSART Receive Data Register SPEN RX9 SREN SPBRGL ADDEN FERR OERR RX9D BRG<7:0> SPBRGH TXSTA CREN TX9 TXEN SYNC SENDB 185 187* BRG<15:8> CSRC 78 180* 187* BRGH TRMT TX9D 184 Legend: — = unimplemented location, read as ‘0’. Shaded cells are not used for synchronous master reception. * Page provides register information. Note 1: PIC12(L)F1572 only. 2013-2015 Microchip Technology Inc. DS40001723D-page 199 PIC12(L)F1571/2 21.5.2 SYNCHRONOUS SLAVE MODE If two words are written to the TXREG and then the SLEEP instruction is executed, the following will occur: The following bits are used to configure the EUSART for synchronous slave operation: • • • • • 1. SYNC = 1 CSRC = 0 SREN = 0 (for transmit); SREN = 1 (for receive) CREN = 0 (for transmit); CREN = 1 (for receive) SPEN = 1 2. 3. 4. Setting the SYNC bit of the TXSTA register configures the device for synchronous operation. Clearing the CSRC bit of the TXSTA register configures the device as a slave. Clearing the SREN and CREN bits of the RCSTA register ensures that the device is in Transmit mode; otherwise, the device will be configured to receive. Setting the SPEN bit of the RCSTA register enables the EUSART. 21.5.2.1 5. 21.5.2.2 EUSART Synchronous Slave Transmit 1. The operation of the Synchronous Master and Slave modes is identical (see Section 21.5.1.3 “Synchronous Master Transmission”), except in the case of Sleep mode. 2. 3. 4. 5. 6. 7. 8. TABLE 21-9: Name BAUDCON INTCON PIE1 PIR1 RCSTA Synchronous Slave Transmission Setup Set the SYNC and SPEN bits, and clear the CSRC bit. Clear the ANSELx bit for the CK pin (if applicable). Clear the CREN and SREN bits. If interrupts are desired, set the TXIE bit of the PIE1 register and the GIE and PEIE bits of the INTCON register. If 9-bit transmission is desired, set the TX9 bit. Enable transmission by setting the TXEN bit. If 9-bit transmission is selected, insert the Most Significant bit into the TX9D bit. Start transmission by writing the Least Significant eight bits to the TXREG register. SUMMARY OF REGISTERS ASSOCIATED WITH SYNCHRONOUS SLAVE TRANSMISSION Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register on Page ABDOVF RCIDL — SCKP BRG16 — WUE ABDEN 186 GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF 74 TMR1GIE ADIE RCIE(1) TXIE(1) — — TMR2IE TMR1IE 75 TMR1GIF ADIF (1) RCIF TXIF (1) — — TMR2IF TMR1IF 78 SPEN RX9 SREN CREN ADDEN FERR OERR RX9D 185 CSRC TX9 TXEN TRMT TX9D TXREG TXSTA The first character will immediately transfer to the TSR register and transmit. The second word will remain in the TXREG register. The TXIF bit will not be set. After the first character has been shifted out of TSR, the TXREG register will transfer the second character to the TSR and the TXIF bit will now be set. If the PEIE and TXIE bits are set, the interrupt will wake the device from Sleep and execute the next instruction. If the GIE bit is also set, the program will call the Interrupt Service Routine. EUSART Transmit Data Register SYNC SENDB BRGH 177* 184 Legend: — = unimplemented location, read as ‘0’. Shaded cells are not used for synchronous slave transmission. * Page provides register information. Note 1: PIC12(L)F1572 only. DS40001723D-page 200 2013-2015 Microchip Technology Inc. PIC12(L)F1571/2 21.5.2.3 EUSART Synchronous Slave Reception 21.5.2.4 1. The operation of the Synchronous Master and Slave modes is identical (Section 21.5.1.5 “Synchronous Master Reception”), with the following exceptions: 2. 3. • Sleep • CREN bit is always set, therefore, the receiver is never Idle • SREN bit, which is a “don’t care” in Slave mode A character may be received while in Sleep mode by setting the CREN bit prior to entering Sleep. Once the word is received, the RSR register will transfer the data to the RCREG register. If the RCIE enable bit is set, the interrupt generated will wake the device from Sleep and execute the next instruction. If the GIE bit is also set, the program will branch to the interrupt vector. 4. 5. 6. 7. 8. 9. Synchronous Slave Reception Setup Set the SYNC and SPEN bits, and clear the CSRC bit. Clear the ANSELx bit for both the CK and DT pins (if applicable). If interrupts are desired, set the RCIE bit of the PIE1 register, and the GIE and PEIE bits of the INTCON register. If 9-bit reception is desired, set the RX9 bit. Set the CREN bit to enable reception. The RCIF bit will be set when reception is complete. An interrupt will be generated if the RCIE bit was set. If 9-bit mode is enabled, retrieve the Most Significant bit from the RX9D bit of the RCSTA register. Retrieve the eight Least Significant bits from the receive FIFO by reading the RCREG register. If an overrun error occurs, clear the error by either clearing the CREN bit of the RCSTA register or by clearing the SPEN bit which resets the EUSART. TABLE 21-10: SUMMARY OF REGISTERS ASSOCIATED WITH SYNCHRONOUS SLAVE RECEPTION Name BAUDCON INTCON Bit 7 Bit 6 ABDOVF GIE Bit 2 Bit 1 Bit 0 Register on Page BRG16 — WUE ABDEN 186 IOCIE TMR0IF INTF IOCIF 74 TXIE(1) — — TMR2IE TMR1IE 75 TXIF(1) — — TMR2IF TMR1IF 78 Bit 5 Bit 4 Bit 3 RCIDL — SCKP PEIE TMR0IE INTE PIE1 TMR1GIE ADIE RCIE(1) PIR1 TMR1GIF ADIF RCIF(1) RCSTA SPEN RX9 SREN CREN ADDEN FERR OERR RX9D 185 TXSTA CSRC TX9 TXEN SYNC SENDB BRGH TRMT TX9D 184 RCREG EUSART Receive Data Register 180* Legend: — = unimplemented location, read as ‘0’. Shaded cells are not used for synchronous slave reception. * Page provides register information. Note 1: PIC12(L)F1572 only. 2013-2015 Microchip Technology Inc. DS40001723D-page 201 PIC12(L)F1571/2 NOTES: DS40001723D-page 202 2013-2015 Microchip Technology Inc. PIC12(L)F1571/2 22.0 16-BIT PULSE-WIDTH MODULATION (PWM) MODULE Each PWM module has four Offset modes: • • • • The Pulse-Width Modulation (PWM) module generates a pulse-width modulated signal determined by the phase, duty cycle, period and offset event counts that are contained in the following registers: • • • • Using the Offset modes, each PWM module can offset its waveform relative to any other PWM module in the same device. For a more detailed description of the Offset modes, refer to Section 22.3 “Offset Modes”. PWMxPH register PWMxDC register PWMxPR register PWMxOF register Every PWM module has a configurable reload operation to ensure all event count buffers change at the end of a period, thereby avoiding signal glitches. Figure 22-2 shows a simplified block diagram of the reload operation. For a more detailed description of the reload operation, refer to Section 22.4 “Reload Operation”. Figure 22-1 shows a simplified block diagram of the PWM operation. Each PWM module has four modes of operation: • • • • Independent Run Slave Run with Synchronous Start One-Shot Slave with Synchronous Start Continuous Run Slave with Synchronous Start and Timer Reset Standard Set On Match Toggle On Match Center-Aligned For a more detailed description of each PWM mode, refer to Section 22.2 “PWM Modes”. FIGURE 22-1: 16-BIT PWM BLOCK DIAGRAM MODE<1:0> EN PHx_match PWM Control Unit DCx_match OF3_match(1) 11 OF2_match(1) 10 (1) OF1_match Reserved Rev. 10-000152A 4/21/2014 D Q4 PWMxOUT Q CK PWMxPOL PWMx_output OF_match 01 Offset Control PRx_match To Peripherals PWMxOE 00 PWMx OFM<1:0> E OFS Comparator PWM_clock PRx_match set PRIF 16-bt Latch LDx_trigger PWMxPR Comparator Note 1: PHx_match set PHIF 16-bt Latch LDx_trigger PWMxPH R U/D PWMxTMR TRIS Control Comparator OFx_match set OFIF 16-bt Latch LDx_trigger PWMxOF Comparator DCx_match set DCIF 16-bt Latch LDx_trigger PWMxDC A PWM module cannot trigger from its own offset match event. The input corresponding to a PWM module’s own offset match is reserved. 2013-2015 Microchip Technology Inc. DS40001723D-page 203 PIC12(L)F1571/2 FIGURE 22-2: LOAD TRIGGER BLOCK DIAGRAM Rev. 10-000153A 4/21/2014 LD3_trigger(1) 11 (1) 10 LD1_trigger(1) 01 Reserved 00 LD2_trigger 1 0 PWMxLDS LDx_trigger 22.1 PWM_clock 1. The input corresponding to a PWM module’s own load trigger is reserved. 2. PWMxLDA is cleared by hardware upon LDx_trigger. Fundamental Operation FIGURE 22-3: The PWM module produces a 16-bit resolution pulse-width modulated output. Each PWM module has an independent timer driven by a selection of clock sources determined by the PWMxCLKCON register (Register 22-4). The timer value is compared to event count registers to generate the various events of a the PWM waveform, such as the period and duty cycle. For a block diagram describing the clock sources, refer to Figure 22-3. The current state of the PWM output can be read using the OUT bit of the PWMxCON register. In some modes, this bit can be set and cleared by software, giving additional software control over the PWM waveform. This bit is synchronized to FOSC/4 and therefore, does not change in real time with respect to the PWM_clock. If PWM_clock > FOSC/4, the OUT bit may not accurately represent the output state of the PWM. PWM CLOCK SOURCE BLOCK DIAGRAM Rev. 10-000156A 1/7/2015 PWMxCS<1:0> Each PWM module can be enabled individually using the EN bit of the PWMxCON register, or several PWM modules can be enabled simultaneously using the mirror bits of the PWMEN register. Note: Q PRx_match PWMxLDT Note D PWMxLDA(2) 22.1.1 FOSC 00 HFINTOSC 01 LFINTOSC 10 Reserved 11 PWMxPS<2:0> Prescaler PWMx_clock PWMx PIN CONFIGURATION All PWM outputs are multiplexed with the PORT data latch, so the pins must also be configured as outputs by clearing the associated PORT TRISx bits. The slew rate feature may be configured to optimize the rate to be used in conjunction with the PWM outputs. High-speed output switching is attained by clearing the associated PORT SLRCONx bits. The PWM outputs can be configured to be open-drain outputs by setting the associated PORT ODCONx bits. 22.1.2 PWMx Output Polarity The output polarity is inverted by setting the POL bit of the PWMxCON register. The polarity control affects the PWM output even when the module is not enabled. DS40001723D-page 204 2013-2015 Microchip Technology Inc. PIC12(L)F1571/2 22.2 PWM Modes PWM modes are selected with the MODE<1:0> bits of the PWMxCON register (Register 22-1). In all PWM modes, an offset match event can also be used to synchronize the PWMxTMR in three Offset modes. See Section 22.3 “Offset Modes” for more information. 22.2.1 STANDARD MODE The Standard mode (MODE<1:0> = 00) selects a single-phase PWM output. The PWM output in this mode is determined by when the period, duty cycle and phase counts match the PWMxTMR value. The start of the duty cycle occurs on the phase match and the end of the duty cycle occurs on the duty cycle match. The period match resets the timer. The offset match can also be used to synchronize the PWMxTMR in the Offset modes. See Section 22.3 “Offset Modes” for more information. Equation 22-1 is used to calculate the PWM period in Standard mode. Equation 22-2 is used to calculate the PWM duty cycle ratio in Standard mode. EQUATION 22-1: PWM PERIOD IN STANDARD MODE PWMxPR + 1 Prescale Period = -------------------------------------------------------------------PWMxCLK EQUATION 22-2: PWM DUTY CYCLE IN STANDARD MODE PWMxDC – PWMx PH Duty Cycle = ----------------------------------------------------------------- PWMxPR + 1 A detailed timing diagram for Standard mode is shown in Figure 22-4. 22.2.2 SET ON MATCH MODE The Set On Match mode (MODE<1:0> = 01) generates an active output when the phase count matches the PWMxTMR value. The output stays active until the OUT bit of the PWMxCON register is cleared or the PWM module is disabled. The duty cycle count has no effect in this mode. The period count only determines the maximum PWMxTMR value above which no phase matches can occur. The OUT bit can be used to set or clear the output of the PWM in this mode. Writes to this bit will take place on the next rising edge of the PWM_clock after the bit is written. A detailed timing diagram for Set On Match mode is shown in Figure 22-5. 22.2.3 TOGGLE ON MATCH MODE The Toggle On Match mode (MODE<1:0> = 10) generates a 50% duty cycle PWM with a period twice as long as that computed for the Standard PWM mode. Duty cycle count has no effect in this mode. The phase count determines how many PWMxTMR periods, after a period event, the output will toggle. Writes to the OUT bit of the PWMxCON register will have no effect in this mode. A detailed timing diagram for Toggle On Match mode is shown in Figure 22-6. 22.2.4 CENTER-ALIGNED MODE The Center-Aligned mode (MODE = 11) generates a PWM waveform that is centered in the period. In this mode, the period is two times the PWMxPR count. The PWMxTMR counts up to the period value, then counts back down to 0. The duty cycle count determines both the start and end of the active PWM output. The start of the duty cycle occurs at the match event when PWMxTMR is incrementing and the duty cycle ends at the match event when PWMxTMR is decrementing. The incrementing match value is the period count minus the duty cycle count. The decrementing match value is the incrementing match value plus 1. Equation 22-3 is used to calculate the PWM period in Center-Aligned mode. EQUATION 22-3: PWM PERIOD IN CENTER-ALIGNED MODE PWMxPR + 1 Prescale 2 Period = --------------------------------------------------------------------------PWMxCLK Equation 22-4 is used to calculate the PWM duty cycle ratio in Center-Aligned mode. EQUATION 22-4: PWM DUTY CYCLE IN CENTER-ALIGNED MODE PWMxDC 2 Duty Cycle = ------------------------------------------------ PWMx PR + 1 2 Writes to the OUT bit will have no effect in this mode. A detailed timing diagram for Center-Aligned mode is shown in Figure 22-7. 2013-2015 Microchip Technology Inc. DS40001723D-page 205 STANDARD PWM MODE TIMING DIAGRAM Rev. 10-000142A 9/5/2013 Period Duty Cycle Phase PWMxCLK PWMxPR 10 PWMxPH 4 PWMxDC 9 PWMxTMR 0 1 2 3 4 5 6 7 8 9 10 0 1 2 3 4 5 6 PWMxOUT FIGURE 22-5: SET ON MATCH PWM MODE TIMING DIAGRAM Rev. 10-000143A 9/5/2013 Period Phase 2013-2015 Microchip Technology Inc. PWMxCLK PWMxPR 10 PWMxPH 4 PWMxTMR PWMxOUT 0 1 2 3 4 5 6 7 8 9 10 0 1 2 3 4 5 6 PIC12(L)F1571/2 DS40001723D-page 206 FIGURE 22-4: 2013-2015 Microchip Technology Inc. FIGURE 22-6: TOGGLE ON MATCH PWM MODE TIMING DIAGRAM Rev. 10-000144A 9/5/2013 Period Phase PWMxCLK PWMxPR 10 PWMxPH 4 PWMxTMR 0 1 2 3 4 5 6 7 8 9 10 0 1 2 3 4 5 6 PWMxOUT FIGURE 22-7: CENTER-ALIGNED PWM MODE TIMING DIAGRAM Rev. 10-000 145A Rev. 4/22/201 10-000 145A 4 4/22/201 4 Period Period PWMxPR PWMxPR 66 PWMxDC PWMxDC 44 DS40001723D-page 207 PWMxTMR PWMxTMR PWMxOUT PWMxOUT 00 11 22 33 44 55 66 66 55 44 33 22 11 00 00 11 22 33 PIC12(L)F1571/2 Duty DutyCycle Cycle PWMxCLK PWMxCLK PIC12(L)F1571/2 22.3 Offset Modes The Offset modes provide the means to adjust the waveform of a slave PWM module relative to the waveform of a master PWM module in the same device. 22.3.1 INDEPENDENT RUN MODE In Independent Run mode (OFM<1:0> = 00), the PWM module is unaffected by the other PWM modules in the device. The PWMxTMR associated with the PWM module in this mode starts counting as soon as the EN bit associated with this PWM module is set and continues counting until the EN bit is cleared. Period events reset the PWMxTMR to zero, after which, the timer continues to count. A detailed timing diagram of this mode used with Standard PWM mode is shown in Figure 22-8. 22.3.2 SLAVE RUN MODE WITH SYNC START In Slave Run mode with Sync Start (OFM<1:0> = 01), the slave PWMxTMR waits for the master’s OFx_match event. When this event occurs, if the EN bit is set, the PWMxTMR begins counting and continues to count until software clears the EN bit. Slave period events reset the PWMxTMR to zero, after which, the timer continues to count. A detailed timing diagram of this mode used with Standard PWM mode is shown in Figure 22-9. 22.3.3 ONE-SHOT SLAVE MODE WITH SYNC START In One-Shot Slave mode with Synchronous Start (OFM<1:0> = 10), the slave PWMxTMR waits until the master's OFx_match event. The timer then begins counting, starting from the value that is already in the timer, and continues to count until the period match event. When the period event occurs, the timer resets to zero and stops counting. The timer then waits until the next master OFx_match event, after which, it begins counting again to repeat the cycle. An OFx_match event that occurs before the slave PWM has completed the previously triggered period will be ignored. A slave period that is greater than the master period, but less than twice the master period, will result in a slave output every other master period. Note: During the time the slave timers are resetting to zero, if another offset match event is received, it is possible that the slave PWM would not recognize this match event and the slave timers would fail to begin counting again. This would result in missing duty cycles from the output of the slave PWM. To prevent this from happening, avoid using the same period for both the master and slave PWMs. 22.3.4 CONTINUOUS RUN SLAVE MODE WITH SYNC START AND TIMER RESET In Continuous Run Slave mode with Synchronous Start and Timer Reset (OFM<1:0> = 11), the slave PWMxTMR is inhibited from counting after the slave PWM enable is set. The first master OFx_match event starts the slave PWMxTMR. Subsequent master OFx_match events reset the slave PWMxTMR timer value back to 1, after which, the slave PWMxTMR continues to count. The next master OFx_match event resets the slave PWMxTMR back to 1 to repeat the cycle. Slave period events that occur before the master’s OFx_match event will reset the slave PWMxTMR to zero, after which, the timer will continue to count. Slaves operating in this mode must have a PWMxPH register pair value equal to or greater than 1; otherwise, the phase match event will not occur precluding the start of the PWM output duty cycle. The offset timing will persist If both the master and slave PWMxPR values are the same, and the Slave Offset mode is changed to Independent Run mode while the PWM module is operating. A detailed timing diagram of this mode used in Standard PWM mode is shown in Figure 22-11. Note: 22.3.5 Unexpected results will occur if the slave PWM_clock is a higher frequency than the master PWM_clock. OFFSET MATCH IN CENTER-ALIGNED MODE When a master is operating in Center-Aligned mode, the offset match event depends on which direction the PWMxTMR is counting. Clearing the OFO bit of the PWMxOFCON register will cause the OFx_match event to occur when the timer is counting up. Setting the OFO bit of the PWMxOFCON register will cause the OFx_match event to occur when the timer is counting down. The OFO bit is ignored in non-Center-Aligned modes. The OFO bit is double-buffered and requires setting the LDA bit to take effect when the PWM module is operating. Detailed timing diagrams of Center-Aligned mode using offset match control in Independent Slave with Sync Start mode can be seen in Figure 22-12 and Figure 22-13. A detailed timing diagram of this mode used with Standard PWM mode is shown in Figure 22-10. DS40001723D-page 208 2013-2015 Microchip Technology Inc. 2013-2015 Microchip Technology Inc. FIGURE 22-8: INDEPENDENT RUN MODE TIMING DIAGRAM Rev. 10-000 146B 7/8/201 5 Period Duty Cycle Phase Offset PWMxCLK PWMxPR 10 PWMxPH 3 PWMxDC 5 PWMxOF 2 PWMxTMR 0 1 2 3 4 5 6 7 8 9 10 0 1 2 3 4 5 6 0 1 2 3 4 0 1 2 3 4 0 1 2 3 4 0 1 2 PWMxOUT OFx_match PHx_match DCx_match PRx_match DS40001723D-page 209 PWMyPR 4 PWMyPH 0 PWMyDC 1 PWMyOUT Note: PWMx = Master, PWMy = Slave PIC12(L)F1571/2 PWMyTMR SLAVE RUN MODE WITH SYNC START TIMING DIAGRAM Rev. 10-000 147B 7/8/201 5 Period Duty Cycle Phase Offset PWMxCLK PWMxPR 10 PWMxPH 3 PWMxDC 5 PWMxOF 2 PWMxTMR 0 1 2 3 4 5 6 7 8 9 10 0 1 2 3 4 5 6 1 2 3 4 0 1 2 3 4 0 1 2 3 4 0 PWMxOUT OFx_match PWMyTMR 0 PWMyPR 4 PWMyPH 0 PWMyDC 1 2013-2015 Microchip Technology Inc. PWMyOUT Note: Master = PWMx, Slave = PWMy PIC12(L)F1571/2 DS40001723D-page 210 FIGURE 22-9: 2013-2015 Microchip Technology Inc. FIGURE 22-10: ONE-SHOT SLAVE RUN MODE WITH SYNC START TIMING DIAGRAM Rev. 10-000 148B 7/8/201 5 Period Duty Cycle Phase Offset PWMxCLK PWMxPR 10 PWMxPH 3 PWMxDC 5 PWMxOF 2 PWMxTMR 0 1 2 3 4 5 6 1 2 3 4 7 8 9 10 0 1 2 3 4 5 6 1 2 3 4 PWMxOUT OFx_match PWMyTMR 0 0 4 PWMyPH 0 PWMyDC 1 PWMyOUT Note: Master = PWMx, Slave = PWMy DS40001723D-page 211 PIC12(L)F1571/2 PWMyPR CONTINUOUS SLAVE RUN MODE WITH IMMEDIATE RESET AND SYNC START TIMING DIAGRAM Rev. 10-000 149B 7/8/201 5 Period Duty Cycle Phase Offset PWMxCLK PWMxPR 10 PWMxPH 3 PWMxDC 5 PWMxOF 2 PWMxTMR 0 1 2 3 4 5 6 7 8 9 10 0 1 2 3 4 5 6 1 2 3 4 0 1 2 3 4 0 1 1 2 3 4 PWMxOUT OFx_match PWMyTMR 0 PWMyPR 4 PWMyPH 1 PWMyDC 2 2013-2015 Microchip Technology Inc. PWMyOUT Note: Master= PWMx, Slave=PWMy PIC12(L)F1571/2 DS40001723D-page 212 FIGURE 22-11: 2013-2015 Microchip Technology Inc. FIGURE 22-12: OFFSET MATCH ON INCREMENTING TIMER TIMING DIAGRAM Rev. 10-000 150B 7/9/201 5 Period Duty Cycle Offset PWMxCLK PWMxPR 6 PWMxDC 2 PWMxOF 2 PWMxTMR 0 1 2 3 4 5 6 6 5 4 3 2 0 1 2 3 4 4 3 2 1 0 1 0 0 1 2 3 0 1 PWMxOUT OFx_match PHx_match DCx_match PRx_match PWMyTMR 0 4 PWMyDC 1 PWMyOUT Note: Master = PWMx, Slave = PWMy DS40001723D-page 213 PIC12(L)F1571/2 PWMyPR 0 OFFSET MATCH ON DECREMENTING TIMER TIMING DIAGRAM Rev. 10-000 151B 7/9/201 5 Period Duty Cycle Offset PWMxCLK PWMxPR 6 PWMxDC 2 PWMxOF 2 PWMxTMR 0 1 2 3 4 5 6 6 5 4 3 2 1 0 0 1 2 3 0 1 2 3 4 4 3 PWMxOUT OF5_match PH5_match DC5_match PR5_match PWMyTMR 0 2013-2015 Microchip Technology Inc. PWMyPR 4 PWMyDC 1 PWMyOUT Note: Master = PWMx, Slave = PWMy PIC12(L)F1571/2 DS40001723D-page 214 FIGURE 22-13: PIC12(L)F1571/2 22.4 Reload Operation Four of the PWM module control register pairs and one control bit are double-buffered so that all can be updated simultaneously. These include: • • • • • PWMxPHH:PWMxPHL register pair PWMxDCH:PWMxDCL register pair PWMxPRH:PWMxPRL register pair PWMxOFH:PWMxOFL register pair OFO control bit When written to, these registers do not immediately affect the operation of the PWM. By default, writes to these registers will not be loaded into the PWM Operating Buffer registers until after the arming conditions are met. The arming control has two methods of operation: 22.4.2 When the LDT bit is set, then the Triggered mode is selected and a trigger event is required for the LDA bit to take effect. The trigger source is the buffer load event of one of the other PWM modules in the device. The triggering source is selected by the LDS<1:0> bits of the PWMxLDCON register. The buffers will be loaded at the first period event following the trigger event. Triggered reloading is used when a PWM module is operating as a slave to another PWM and it is necessary to synchronize the buffer reloads in both modules. Note 1: The buffer load operation clears the LDA bit. 2: If the LDA bit is set at the same time as PWMxTMR = PWMxPR, the LDA bit is ignored until the next period event. Such is the case when triggered reload is selected and the triggering event occurs simultaneously with the target’s period event. • Immediate • Triggered The LDT bit of the PWMxLDCON register controls the arming method. Both methods require the LDA bit to be set. All four buffer pairs will load simultaneously at the loading event. 22.4.1 IMMEDIATE RELOAD When the LDT bit is clear, then the immediate mode is selected and the buffers will be loaded at the first period event after the LDA bit is set. Immediate reloading is used when a PWM module is operating stand-alone or when the PWM module is operating as a master to other slave PWM modules. 2013-2015 Microchip Technology Inc. TRIGGERED RELOAD 22.5 Operation in Sleep Mode Each PWM module will continue to operate in Sleep mode when either the HFINTOSC or LFINTOSC is selected as the clock source by PWMxCLKCON<1:0>. 22.6 Interrupts Each PWM module has four independent interrupts based on the phase, duty cycle, period and offset match events. The interrupt flag is set on the rising edge of each of these signals. Refer to Figures 22-12 and 22-13 for detailed timing diagrams of the match signals. DS40001723D-page 215 PIC12(L)F1571/2 22.7 Register Definitions: PWM Control TABLE 22-1: Long bit name prefixes for the 16-bit PWM peripherals are shown in Table 22-1. Refer to Section 1.1 “Register and Bit Naming Conventions” for more information REGISTER 22-1: BIT NAME PREFIXES Peripheral Bit Name Prefix PWM1 PWM1 PWM2 PWM2 PWM3 PWM3 PWMxCON: PWMx CONTROL REGISTER R/W-0/0 R/W-0/0 R/HS/HC-0/0 R/W-0/0 EN OE OUT POL R/W-0/0 R/W-0/0 MODE<1:0> U-0 U-0 — — bit 7 bit 0 Legend: HC = Hardware Clearable bit HS = Hardware Settable bit R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ ‘1’ = Bit is set ‘0’ = Bit is cleared -n/n = Value at POR and BOR/Value at all other Resets bit 7 EN: PWMx Module Enable bit 1 = Module is enabled 0 = Module is disabled bit 6 OE: PWMx Output Enable bit 1 = PWM output pin is enabled 0 = PWM output pin is disabled bit 5 OUT: Output State of the PWMx Module bit bit 4 POL: PWMx Output Polarity Control bit 1 = PWM output active state is low 0 = PWM output active state is high bit 3-2 MODE<1:0>: PWMx Mode Control bits 11 = Center-Aligned mode 10 = Toggle On Match mode 01 = Set On Match mode 00 = Standard PWM mode bit 1-0 Unimplemented: Read as ‘0’ DS40001723D-page 216 2013-2015 Microchip Technology Inc. PIC12(L)F1571/2 REGISTER 22-2: PWMxINTE: PWMx INTERRUPT ENABLE REGISTER U-0 U-0 U-0 U-0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 — — — — OFIE PHIE DCIE PRIE bit 7 bit 0 Legend: R = Readable bit W = Writable bit u = Bit is unchanged x = Bit is unknown U = Unimplemented bit, read as ‘0’ ‘1’ = Bit is set ‘0’ = Bit is cleared -n/n = Value at POR and BOR/Value at all other Resets bit 7-4 Unimplemented: Read as ‘0’ bit 3 OFIE: Offset Interrupt Enable bit 1 = Interrupts CPU on offset match 0 = Does not interrupt CPU on offset match bit 2 PHIE: Phase Interrupt Enable bit 1 = Interrupts CPU on phase match 0 = Does not Interrupt CPU on phase match bit 1 DCIE: Duty Cycle Interrupt Enable bit 1 = Interrupts CPU on duty cycle match 0 = Does not interrupt CPU on duty cycle match bit 0 PRIE: Period Interrupt Enable bit 1 = Interrupts CPU on period match 0 = Does not interrupt CPU on period match 2013-2015 Microchip Technology Inc. DS40001723D-page 217 PIC12(L)F1571/2 REGISTER 22-3: PWMxINTF: PWMx INTERRUPT REQUEST REGISTER U-0 U-0 U-0 U-0 R/W/HS-0/0 R/W/HS-0/0 — — — — OFIF PHIF R/W/HS-0/0 R/W/HS-0/0 DCIF bit 7 PRIF bit 0 Legend: HC = Hardware Clearable bit HS = Hardware Settable bit R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ ‘1’ = Bit is set ‘0’ = Bit is cleared -n/n = Value at POR and BOR/Value at all other Resets bit 7-4 Unimplemented: Read as ‘0’ bit 3 OFIF: Offset Interrupt Flag bit(1) 1 = Offset match event occurred 0 = Offset match event did not occur bit 2 PHIF: Phase Interrupt Flag bit(1) 1 = Phase match event occurred 0 = Phase match event did not occur bit 1 DCIF: Duty Cycle Interrupt Flag bit(1) 1 = Duty cycle match event occurred 0 = Duty cycle match event did not occur bit 0 PRIF: Period Interrupt Flag bit(1) 1 = Period match event occurred 0 = Period match event did not occur Note 1: Bit is forced clear by hardware while module is disabled (EN = 0). DS40001723D-page 218 2013-2015 Microchip Technology Inc. PIC12(L)F1571/2 REGISTER 22-4: U-0 PWMxCLKCON: PWMx CLOCK CONTROL REGISTER R/W-0/0 — R/W-0/0 R/W-0/0 PS<2:0> U-0 U-0 — — R/W-0/0 bit 7 R/W-0/0 CS<1:0> bit 0 Legend: R = Readable bit W = Writable bit u = Bit is unchanged x = Bit is unknown U = Unimplemented bit, read as ‘0’ ‘1’ = Bit is set ‘0’ = Bit is cleared -n/n = Value at POR and BOR/Value at all other Resets bit 7 Unimplemented: Read as ‘0’ bit 6-4 PS<2:0>: Clock Source Prescaler Select bits 111 = Divides clock source by 128 110 = Divides clock source by 64 101 = Divides clock source by 32 100 = Divides clock source by 16 011 = Divides clock source by 8 010 = Divides clock source by 4 001 = Divides clock source by 2 000 = No prescaler bit 3-2 Unimplemented: Read as ‘0’ bit 1-0 CS<1:0>: Clock Source Select bits 11 = Reserved 10 = LFINTOSC (continues to operate during Sleep) 01 = HFINTOSC (continues to operate during Sleep) 00 = FOSC 2013-2015 Microchip Technology Inc. DS40001723D-page 219 PIC12(L)F1571/2 REGISTER 22-5: PWMxLDCON: PWMx RELOAD TRIGGER SOURCE SELECT REGISTER R/W-0/0 R/W-0/0 U-0 U-0 U-0 U-0 LDA(1) LDT — — — — R/W-0/0 bit 7 R/W-0/0 LDS<1:0> bit 0 Legend: R = Readable bit W = Writable bit u = Bit is unchanged x = Bit is unknown U = Unimplemented bit, read as ‘0’ ‘1’ = Bit is set ‘0’ = Bit is cleared -n/n = Value at POR and BOR/Value at all other Resets bit 7 LDA: Load Buffer Armed bit(1) If LDT = 1: 1 = Loads the OFx, PHx, DCx and PRx buffers at the end of the period when the selected trigger occurs 0 = Does not load buffers or load has completed If LDT = 0: 1 = Loads the OFx, PHx, DCx and PRx buffers at the end of the current period 0 = Does not load buffers or load has completed bit 6 LDT: Load Buffer on Trigger bit 1 = Loads buffers on trigger enabled 0 = Loads buffers on trigger disabled Loads the OFx, PHx, DCx and PRx buffers at the end of every period after the selected trigger occurs. Reloads internal double buffers at the end of current period. The LDS<1:0> bits are ignored. bit 5-2 Unimplemented: Read as ‘0’ bit 1-0 LDS<1:0>: Load Trigger Source Select bits 11 = LD3_trigger(2) 10 = LD2_trigger(2) 01 = LD1_trigger(2) 00 = Reserved Note 1: 2: This bit is cleared by the module after a reload operation. It can be cleared in software to clear an existing arming event. The LD_trigger corresponding to the PWM used becomes reserved. DS40001723D-page 220 2013-2015 Microchip Technology Inc. PIC12(L)F1571/2 REGISTER 22-6: U-0 PWMxOFCON: PWMx OFFSET TRIGGER SOURCE SELECT REGISTER R/W-0/0 — R/W-0/0 R/W-0/0 U-0 U-0 OFO(1) — — OFM<1:0> R/W-0/0 R/W-0/0 OFS<1:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit u = Bit is unchanged x = Bit is unknown U = Unimplemented bit, read as ‘0’ ‘1’ = Bit is set ‘0’ = Bit is cleared -n/n = Value at POR and BOR/Value at all other Resets bit 7 Unimplemented: Read as ‘0’ bit 6-5 OFM<1:0>: Offset Mode Select bits 11 = Continuous Slave Run mode with immediate Reset and synchronized start when the selected offset trigger occurs 10 = One-Shot Slave Run mode with synchronized start when the selected offset trigger occurs 01 = Independent Slave Run mode with synchronized start when the selected offset trigger occurs 00 = Independent Run mode bit 4 OFO: Offset Match Output Control bit(1) If MODE<1:0> = 11 (PWM Center-Aligned mode): 1 = OFx_match occurs on counter match when counter decrementing, (second match) 0 = OFx_match occurs on counter match when counter incrementing, (first match) If MODE<1:0> = 00, 01 or 10 (all other modes): Bit is ignored. bit 3-2 Unimplemented: Read as ‘0’ bit 1-0 OFS<1:0>: Offset Trigger Source Select bits 11 = OF3_match(1) 10 = OF2_match(1) 01 = OF1_match(1) 00 = Reserved Note 1: The OFx_match corresponding to the PWM used becomes reserved. 2013-2015 Microchip Technology Inc. DS40001723D-page 221 PIC12(L)F1571/2 REGISTER 22-7: R/W-x/u PWMxPHH: PWMx PHASE COUNT HIGH REGISTER R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u PH<15:8> bit 7 bit 0 Legend: R = Readable bit W = Writable bit u = Bit is unchanged x = Bit is unknown U = Unimplemented bit, read as ‘0’ ‘1’ = Bit is set ‘0’ = Bit is cleared -n/n = Value at POR and BOR/Value at all other Resets bit 7-0 PH<15:8>: PWMx Phase High bits Upper eight bits of PWM phase count. REGISTER 22-8: R/W-x/u PWMxPHL: PWMx PHASE COUNT LOW REGISTER R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u PH<7:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit u = Bit is unchanged x = Bit is unknown U = Unimplemented bit, read as ‘0’ ‘1’ = Bit is set ‘0’ = Bit is cleared -n/n = Value at POR and BOR/Value at all other Resets bit 7-0 PH<7:0>: PWMx Phase Low bits Lower eight bits of PWM phase count. DS40001723D-page 222 2013-2015 Microchip Technology Inc. PIC12(L)F1571/2 REGISTER 22-9: R/W-x/u PWMxDCH: PWMx DUTY CYCLE COUNT HIGH REGISTER R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u DC<15:8> bit 7 bit 0 Legend: R = Readable bit W = Writable bit u = Bit is unchanged x = Bit is unknown U = Unimplemented bit, read as ‘0’ ‘1’ = Bit is set ‘0’ = Bit is cleared -n/n = Value at POR and BOR/Value at all other Resets bit 7-0 DC<15:8>: PWMx Duty Cycle High bits Upper eight bits of PWM duty cycle count. REGISTER 22-10: PWMxDCL: PWMx DUTY CYCLE COUNT LOW REGISTER R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u DC<7:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit u = Bit is unchanged x = Bit is unknown U = Unimplemented bit, read as ‘0’ ‘1’ = Bit is set ‘0’ = Bit is cleared -n/n = Value at POR and BOR/Value at all other Resets bit 7-0 DC<7:0>: PWMx Duty Cycle Low bits Lower eight bits of PWM duty cycle count. 2013-2015 Microchip Technology Inc. DS40001723D-page 223 PIC12(L)F1571/2 REGISTER 22-11: PWMxPRH: PWMx PERIOD COUNT HIGH REGISTER R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u PR<15:8> bit 7 bit 0 Legend: R = Readable bit W = Writable bit u = Bit is unchanged x = Bit is unknown U = Unimplemented bit, read as ‘0’ ‘1’ = Bit is set ‘0’ = Bit is cleared -n/n = Value at POR and BOR/Value at all other Resets bit 7-0 PR<15:8>: PWMx Period High bits Upper eight bits of PWM period count. REGISTER 22-12: PWMxPRL: PWMx PERIOD COUNT LOW REGISTER R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u PR<7:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit u = Bit is unchanged x = Bit is unknown U = Unimplemented bit, read as ‘0’ ‘1’ = Bit is set ‘0’ = Bit is cleared -n/n = Value at POR and BOR/Value at all other Resets bit 7-0 PR<7:0>: PWMx Period Low bits Lower eight bits of PWM period count. DS40001723D-page 224 2013-2015 Microchip Technology Inc. PIC12(L)F1571/2 REGISTER 22-13: PWMxOFH: PWMx OFFSET COUNT HIGH REGISTER R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u OF<15:8> bit 7 bit 0 Legend: R = Readable bit W = Writable bit u = Bit is unchanged x = Bit is unknown U = Unimplemented bit, read as ‘0’ ‘1’ = Bit is set ‘0’ = Bit is cleared -n/n = Value at POR and BOR/Value at all other Resets bit 7-0 OF<15:8>: PWMx Offset High bits Upper eight bits of PWM offset count. REGISTER 22-14: PWMxOFL: PWMx OFFSET COUNT LOW REGISTER R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u OF<7:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit u = Bit is unchanged x = Bit is unknown U = Unimplemented bit, read as ‘0’ ‘1’ = Bit is set ‘0’ = Bit is cleared -n/n = Value at POR and BOR/Value at all other Resets bit 7-0 OF<7:0>: PWMx Offset Low bits Lower eight bits of PWM offset count. 2013-2015 Microchip Technology Inc. DS40001723D-page 225 PIC12(L)F1571/2 REGISTER 22-15: PWMxTMRH: PWMx TIMER HIGH REGISTER R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u TMR<15:8> bit 7 bit 0 Legend: R = Readable bit W = Writable bit u = Bit is unchanged x = Bit is unknown U = Unimplemented bit, read as ‘0’ ‘1’ = Bit is set ‘0’ = Bit is cleared -n/n = Value at POR and BOR/Value at all other Resets bit 7-0 TMR<15:8>: PWMx Timer High bits Upper eight bits of PWM timer counter. REGISTER 22-16: PWMxTMRL: PWMx TIMER LOW REGISTER R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u TMR<7:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit u = Bit is unchanged x = Bit is unknown U = Unimplemented bit, read as ‘0’ ‘1’ = Bit is set ‘0’ = Bit is cleared -n/n = Value at POR and BOR/Value at all other Resets bit 7-0 TMR<7:0>: PWMx Timer Low bits Lower eight bits of PWM timer counter. DS40001723D-page 226 2013-2015 Microchip Technology Inc. PIC12(L)F1571/2 Note: There are no long and short bit name variants for the following three mirror registers REGISTER 22-17: PWMEN: PWMEN BIT ACCESS REGISTER U-0 U-0 U-0 U-0 U-0 R/W-0/0 R/W-0/0 R/W-0/0 — — — — — PWM3EN_A PWM2EN_A PWM1EN_A bit 7 bit 0 Legend: R = Readable bit W = Writable bit u = Bit is unchanged x = Bit is unknown U = Unimplemented bit, read as ‘0’ ‘1’ = Bit is set ‘0’ = Bit is cleared -n/n = Value at POR and BOR/Value at all other Resets bit 7-3 Unimplemented: Read as ‘0’ bit 2-0 PWMxEN_A: PWM3/PWM2/PWM1 Enable bits Mirror copy of EN bit (PWMxCON<7>). REGISTER 22-18: PWMLD: LD BIT ACCESS REGISTER U-0 U-0 U-0 U-0 U-0 R/W-0/0 — — — — — PWM3LDA_A R/W-0/0 R/W-0/0 PWM2LDA_A PWM1LDA_A bit 7 bit 0 Legend: R = Readable bit W = Writable bit u = Bit is unchanged x = Bit is unknown U = Unimplemented bit, read as ‘0’ ‘1’ = Bit is set ‘0’ = Bit is cleared -n/n = Value at POR and BOR/Value at all other Resets bit 7-3 Unimplemented: Read as ‘0’ bit 2-0 PWMxLDA_A: PWM3/PWM2/PWM1 LD bits Mirror copy of LD bit (PWMxLDCON<7>). REGISTER 22-19: PWMOUT: PWMOUT BIT ACCESS REGISTER U-0 U-0 U-0 U-0 U-0 — — — — — R/W-0/0 R/W-0/0 R/W-0/0 PWM3OUT_A PWM2OUT_A PWM1OUT_A bit 7 bit 0 Legend: R = Readable bit W = Writable bit u = Bit is unchanged x = Bit is unknown U = Unimplemented bit, read as ‘0’ ‘1’ = Bit is set ‘0’ = Bit is cleared -n/n = Value at POR and BOR/Value at all other Resets bit 7-3 Unimplemented: Read as ‘0’ bit 2-0 PWMxOUT_A: PWM3/PWM2/PWM1 Output bits Mirror copy of OUT bit (PWMxCON<5>). 2013-2015 Microchip Technology Inc. DS40001723D-page 227 PIC12(L)F1571/2 TABLE 22-2: Name OSCCON SUMMARY OF REGISTERS ASSOCIATED WITH PWM Bit 7 Bit 6 Bit 5 SPLLEN Bit 4 Bit 3 Bit 2 IRCF<3:0> Bit 1 — Bit 0 SCS<1:0> Register on Page 55 PIE3 — PWM3IE PWM2IE PWM1IE — — — — PIR3 — PWM3IF PWM2IF PWM1IF — — — — 80 PWMEN — — — — — PWM3EN_A PWM2EN_A PWM1EN_A 227 PWMLD — — — — — PWM3LDA_A PWM2LDA_A PWM1LDA_A 227 PWMOUT — — — — — PWM3OUT_A PWM2OUT_A PWM1OUT_A 227 77 PWM1PHL PH<7:0> 222 PWM1PHH PH<15:8> 222 PWM1DCL DC<7:0> 223 PWM1DCH DC<15:8> 223 PWM1PRH PR<7:0> 224 PWM1PRL PR<15:8> 224 PWM1OFH OF<7:0> 225 PWM1OFL OF<15:8> 225 PWM1TMRH TMR<7:0> 226 PWM1TMRL TMR<15:8> 226 PWM1CON EN OE OUT POL PWM1INTE — — — — OFIE PWM1INTF — — — — PWM1CLKCON — PWM1LDCON LDA PWM1OFCON — — — 216 PHIE DCIE PRIE 217 OFIF PHIF DCIF — — — — OFO — PS<2:0> LDT — OFM<1:0> MODE<1:0> PRIF 218 CS<1:0> 219 — LDS<1:0> 220 — OFS<1:0> 221 PWM2PHL PH<7:0> 222 PWM2PHH PH<15:8> 222 PWM2DCL DC<7:0> 223 PWM2DCH DC<15:8> 223 PWM2PRL PR<7:0> 224 PWM2PRH PR<15:8> 224 PWM2OFL OF<7:0> 225 PWM2OFH OF<15:8> 225 PWM2TMRL TMR<7:0> 226 PWM2TMRH TMR<15:8> 226 PWM2CON EN OE OUT POL PWM2INTE — — — — OFIE PWM2INTF — — — — PWM2CLKCON — PWM2LDCON LDA PWM2OFCON — — — 216 PHIE DCIE PRIE 217 OFIF PHIF DCIF — — — — OFO — PS<2:0> LDT — OFM<1:0> MODE<1:0> PRIF 218 CS<1:0> 219 — LDS<1:0> 220 — OFS<1:0> 221 PWM3PHL PH<7:0> 222 PWM3PHH PH<15:8> 222 PWM3DCL DC<7:0> 223 PWM3DCH DC<15:8> 223 PWM3PRL PR<7:0> 224 PWM3PRH PR<15:8> 224 PWM3OFL OF<7:0> 225 PWM3OFH OF<15:8> 225 PWM3TMRL TMR<7:0> 226 PWM3TMRH TMR<15:8> PWM3CON EN OE OUT POL 226 MODE<1:0> — — 216 Legend: — = unimplemented location, read as ‘0’. Shaded cells are not used by the PWM. DS40001723D-page 228 2013-2015 Microchip Technology Inc. PIC12(L)F1571/2 TABLE 22-2: SUMMARY OF REGISTERS ASSOCIATED WITH PWM (CONTINUED) Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register on Page PWM3INTE — — — — OFIE PHIE DCIE PRIE 217 PWM3INTF — — — — OFIF PHIF DCIF PRIF PWM3CLKCON — — — — — OFO — Name PS<2:0> PWM3LDCON LDA PWM3OFCON — LDT — OFM<1:0> 218 CS<1:0> 219 — LDS<1:0> 220 — OFS<1:0> 221 Legend: — = unimplemented location, read as ‘0’. Shaded cells are not used by the PWM. TABLE 22-3: Name CONFIG1 SUMMARY OF CONFIGURATION WORD WITH CLOCK SOURCES Bits Bit -/7 Bit -/6 Bit 13/5 Bit 12/4 Bit 11/3 — CLKOUTEN 13:8 — — — 7:0 CP MCLRE PWRTE WDTE<1:0> Bit 10/2 Bit 9/1 Bit 8/0 BOREN<1:0> — — FOSC<1:0> Register on Page 42 Legend: — = unimplemented location, read as ‘0’. Shaded cells are not used by clock sources. 2013-2015 Microchip Technology Inc. DS40001723D-page 229 PIC12(L)F1571/2 NOTES: DS40001723D-page 230 2013-2015 Microchip Technology Inc. PIC12(L)F1571/2 23.0 COMPLEMENTARY WAVEFORM GENERATOR (CWG) MODULE The Complementary Waveform Generator (CWG) produces a complementary waveform with dead-band delay from a selection of input sources. 23.3 Selectable Input Sources The CWG generates the output waveforms from the input sources in Table 23-1. TABLE 23-1: The CWG module has the following features: • • • • • Selectable dead-band clock source control Selectable input sources Output enable control Output polarity control Dead-band control with independent 6-bit rising and falling edge dead-band counters • Auto-shutdown control with: - Selectable shutdown sources - Auto-restart enable - Auto-shutdown pin override control 23.1 Fundamental Operation The CWG generates two output waveforms from the selected input source. The off-to-on transition of each output can be delayed from the on-to-off transition of the other output, thereby, creating a time delay immediately where neither output is driven. This is referred to as dead time and is covered in Section 23.5 “Dead-Band Control”. A typical operating waveform with dead band, generated from a single input signal, is shown in Figure 23-2. It may be necessary to guard against the possibility of circuit Faults or a feedback event arriving too late, or not at all. In this case, the active drive must be terminated before the Fault condition causes damage. This is referred to as auto-shutdown and is covered in Section 23.9 “Auto-Shutdown Control”. 23.2 Clock Source The CWG module allows the following clock sources to be selected: • FOSC (system clock) • HFINTOSC (16 MHz only) SELECTABLE INPUT SOURCES Source Peripheral Signal Name Comparator C1 C1OUT_sync PWM1 PWM1_output PWM2 PWM2_output PWM3 PWM3_output The input sources are selected using the GxIS<2:0> bits in the CWGxCON1 register (Register 23-2). 23.4 Output Control Immediately after the CWG module is enabled, the complementary drive is configured with both CWGxA and CWGxB drives cleared. 23.4.1 OUTPUT ENABLES Each CWG output pin has individual output enable control. Output enables are selected with the GxOEA and GxOEB bits of the CWGxCON0 register. When an output enable control is cleared, the module asserts no control over the pin. When an output enable is set, the override value or active PWM waveform is applied to the pin per the port priority selection. The output pin enables are dependent on the module enable bit, GxEN. When GxEN is cleared, CWG output enables and CWG drive levels have no effect. 23.4.2 POLARITY CONTROL The polarity of each CWG output can be selected independently. When the output polarity bit is set, the corresponding output is active-high. Clearing the output polarity bit configures the corresponding output as active-low. However, polarity does not affect the override levels. Output polarity is selected with the GxPOLA and GxPOLB bits of the CWGxCON0 register. The clock sources are selected using the G1CS0 bit of the CWGxCON0 register (Register 23-1). 2013-2015 Microchip Technology Inc. DS40001723D-page 231 SIMPLIFIED CWG BLOCK DIAGRAM Rev. 10-000123D 7/10/2015 GxASDLA 2 00 GxCS 1 FOSC 10 ‘1' 11 CWGxDBR cwg_clock GxASDLA = 01 6 HFINTOSC GxIS ‘0' C1OUT_async Reserved PWM1_out PWM2_out PWM3_out Reserved Reserved Reserved = 0 R S TRISx Q GxOEA GxPOLA Input Source CWGxDBF R 6 Q GxOEB EN = 0 R 1 GxPOLB 00 2013-2015 Microchip Technology Inc. CWG1FLT (INT pin) GxASDSFLT S Q D S R GxARSEN 10 ‘1' 11 shutdown Q GxASDLB GxASE Data Bit WRITE ‘0' GxASE Auto-Shutdown Source C1OUT_async GxASDSC1 x = CWG module number CWGxA 1 EN 3 Q set dominate 2 GxASDLB = 01 TRISx CWGxB PIC12(L)F1571/2 DS40001723D-page 232 FIGURE 23-1: PIC12(L)F1571/2 FIGURE 23-2: TYPICAL CWG OPERATION WITH PWM1 (NO AUTO-SHUTDOWN) cwg_clock PWM1 CWGxA Rising Edge Dead Band Falling Edge Dead Band Rising Edge Rising Edge Dead Band Falling Edge Dead Band Dead Band CWGxB 23.5 Dead-Band Control Dead-band control provides for non-overlapping output signals to prevent shoot-through current in power switches. The CWG contains two 6-bit dead-band counters. One dead-band counter is used for the rising edge of the input source control. The other is used for the falling edge of the input source control. Dead band is timed by counting CWG clock periods from zero, up to the value in the rising or falling DeadBand Counter registers. See the CWGxDBR and CWGxDBF registers (Register 23-4 and Register 23-5, respectively). 23.6 Rising Edge Dead Band The rising edge dead band delays the turn-on of the CWGxA output from when the CWGxB output is turned off. The rising edge dead-band time starts when the rising edge of the input source signal goes true. When this happens, the CWGxB output is immediately turned off and the rising edge dead-band delay time starts. When the rising edge dead-band delay time is reached, the CWGxA output is turned on. 23.7 Falling Edge Dead Band The falling edge dead band delays the turn-on of the CWGxB output from when the CWGxA output is turned off. The falling edge dead-band time starts when the falling edge of the input source goes true. When this happens, the CWGxA output is immediately turned off and the falling edge dead-band delay time starts. When the falling edge dead-band delay time is reached, the CWGxB output is turned on. The CWGxDBF register sets the duration of the deadband interval on the falling edge of the input source signal. This duration is from 0 to 64 counts of dead band. Dead band is always counted off the edge on the input source signal. A count of 0 (zero), indicates that no dead band is present. If the input source signal is not present for enough time for the count to be completed, no output will be seen on the respective output. Refer to Figure 23-3 and Figure 23-4 for examples. The CWGxDBR register sets the duration of the deadband interval on the rising edge of the input source signal. This duration is from 0 to 64 counts of dead band. Dead band is always counted off the edge on the input source signal. A count of 0 (zero), indicates that no dead band is present. If the input source signal is not present for enough time for the count to be completed, no output will be seen on the respective output. 2013-2015 Microchip Technology Inc. DS40001723D-page 233 DEAD-BAND OPERATION, CWGxDBR = 01h, CWGxDBF = 02h cwg_clock Input Source CWGxA CWGxB FIGURE 23-4: DEAD-BAND OPERATION, CWGxDBR = 03h, CWGxDBF = 04h, SOURCE SHORTER THAN DEAD BAND cwg_clock Input Source CWGxA 2013-2015 Microchip Technology Inc. CWGxB Source Shorter than Dead Band PIC12(L)F1571/2 DS40001723D-page 234 FIGURE 23-3: PIC12(L)F1571/2 23.8 Dead-Band Uncertainty 23.9 Auto-Shutdown Control When the rising and falling edges of the input source triggers the dead-band counters, the input may be asynchronous. This will create some uncertainty in the dead-band time delay. The maximum uncertainty is equal to one CWG clock period. Refer to Equation 23-1 for more detail. Auto-shutdown is a method to immediately override the CWG output levels with specific overrides that allow for safe shutdown of the circuit. The shutdown state can be either cleared automatically or held until cleared by software. EQUATION 23-1: The shutdown state can be entered by either of the following two methods: DEAD-BAND UNCERTAINTY 1 TDEADBAND_UNCERTAINTY = ----------------------------Fcwg_clock 23.9.1 SHUTDOWN • Software generated • External Input 23.9.1.1 Software Generated Shutdown Setting the GxASE bit of the CWGxCON2 register will force the CWG into the shutdown state. When auto-restart is disabled, the shutdown state will persist as long as the GxASE bit is set. Example: Fcwg_clock = 16 MHz When auto-restart is enabled, the GxASE bit will clear automatically and resume operation on the next rising edge event. See Figure 23-6. 23.9.1.2 Therefore: 1 TDEADBAND_UNCERTAINTY = ----------------------------Fcwg_clock 1 = ------------------16 MHz = 62.5ns External shutdown inputs provide the fastest way to safely suspend CWG operation in the event of a Fault condition. When any of the selected shutdown inputs goes active, the CWG outputs will immediately go to the selected override levels without software delay. Any combination of two input sources can be selected to cause a shutdown condition. The sources are: • Comparator C1 – C1OUT_async • CWG1FLT Shutdown inputs are selected in the CWGxCON2 register (Register 23-3). Note: 2013-2015 Microchip Technology Inc. External Input Source Shutdown inputs are level sensitive, not edge sensitive. The shutdown state cannot be cleared, except by disabling auto-shutdown, as long as the shutdown input level persists. DS40001723D-page 235 PIC12(L)F1571/2 23.10 Operation During Sleep 23.11.1 The CWG module operates independently from the system clock, and will continue to run during Sleep provided that the clock and input sources selected remain active. The levels driven to the output pins, while the shutdown input is true, are controlled by the GxASDLA and GxASDLB bits of the CWGxCON1 register (Register 23-3). GxASDLA controls the CWG1A override level and GxASDLB controls the CWG1B override level. The control bit logic level corresponds to the output logic drive level while in the shutdown state. The polarity control does not apply to the override level. The HFINTOSC remains active during Sleep, provided that the CWG module is enabled, the input source is active and the HFINTOSC is selected as the clock source, regardless of the system clock source selected. In other words, if the HFINTOSC is simultaneously selected as the system clock and the CWG clock source, when the CWG is enabled and the input source is active, the CPU will go idle during Sleep, but the CWG will continue to operate and the HFINTOSC will remain active. This will have a direct effect on the Sleep mode current. 23.11 Configuring the CWG The following steps illustrate how to properly configure the CWG to ensure a synchronous start: 1. 2. 3. 4. 5. 6. 7. 8. 9. Ensure that the TRISx control bits corresponding to CWGxA and CWGxB are set so that both are configured as inputs. Clear the GxEN bit if not already cleared. Set desired dead-band times with the CWGxDBR and CWGxDBF registers. Set up the following controls in the CWGxCON2 auto-shutdown register: • Select desired shutdown source. • Select both output overrides to the desired levels (this is necessary even if not using auto-shutdown because start-up will be from a shutdown state). • Set the GxASE bit and clear the GxARSEN bit. Select the desired input source using the CWGxCON1 register. Configure the following controls in the CWGxCON0 register: • Select desired clock source. • Select the desired output polarities. • Set the output enables for the outputs to be used. Set the GxEN bit. Clear the TRISx control bits corresponding to CWGxA and CWGxB to be used to configure those pins as outputs. If auto-restart is to be used, set the GxARSEN bit and the GxASE bit will be cleared automatically. Otherwise, clear the GxASE bit to start the CWG. DS40001723D-page 236 23.11.2 PIN OVERRIDE LEVELS AUTO-SHUTDOWN RESTART After an auto-shutdown event has occurred, there are two ways to resume operation: • Software controlled • Auto-restart The restart method is selected with the GxARSEN bit of the CWGxCON2 register. Waveforms of software controlled and automatic restarts are shown in Figure 23-5 and Figure 23-6. 23.11.2.1 Software Controlled Restart When the GxARSEN bit of the CWGxCON2 register is cleared, the CWG must be restarted after an auto-shutdown event by software. Clearing the shutdown state requires all selected shutdown inputs to be low, otherwise, the GxASE bit will remain set. The overrides will remain in effect until the first rising edge event after the GxASE bit is cleared. The CWG will then resume operation. 23.11.2.2 Auto-Restart When the GxARSEN bit of the CWGxCON2 register is set, the CWG will restart from the auto-shutdown state automatically. The GxASE bit will clear automatically when all shutdown sources go low. The overrides will remain in effect until the first rising edge event after the GxASE bit is cleared. The CWG will then resume operation. 2013-2015 Microchip Technology Inc. 2013-2015 Microchip Technology Inc. FIGURE 23-5: SHUTDOWN FUNCTIONALITY, AUTO-RESTART DISABLED (GxARSEN = 0, GxASDLA = 01, GxASDLB = 01) Shutdown Event Ceases GxASE Cleared by Software CWG Input Source Shutdown Source GxASE CWG1A Tri-State (No Pulse) CWG1B Tri-State (No Pulse) No Shutdown Output Resumes Shutdown FIGURE 23-6: SHUTDOWN FUNCTIONALITY, AUTO-RESTART ENABLED (GxARSEN = 1, GxASDLA = 01, GxASDLB = 01) Shutdown Event Ceases GxASE Auto-Cleared by Hardware CWG Input Source GxASE DS40001723D-page 237 CWG1A Tri-State (No Pulse) CWG1B Tri-State (No Pulse) No Shutdown Shutdown Output Resumes PIC12(L)F1571/2 Shutdown Source PIC12(L)F1571/2 23.12 Register Definitions: CWG Control REGISTER 23-1: CWGxCON0: CWGx CONTROL REGISTER 0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 U-0 U-0 R/W-0/0 GxEN GxOEB GxOEA GxPOLB GxPOLA — — GxCS0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit u = Bit is unchanged x = Bit is unknown U = Unimplemented bit, read as ‘0’ ‘1’ = Bit is set ‘0’ = Bit is cleared -n/n = Value at POR and BOR/Value at all other Resets bit 7 GxEN: CWGx Enable bit 1 = Module is enabled 0 = Module is disabled bit 6 GxOEB: CWGxB Output Enable bit 1 = CWGxB is available on appropriate I/O pin 0 = CWGxB is not available on appropriate I/O pin bit 5 GxOEA: CWGxA Output Enable bit 1 = CWGxA is available on appropriate I/O pin 0 = CWGxA is not available on appropriate I/O pin bit 4 GxPOLB: CWGxB Output Polarity bit 1 = Output is inverted polarity 0 = Output is normal polarity bit 3 GxPOLA: CWGxA Output Polarity bit 1 = Output is inverted polarity 0 = Output is normal polarity bit 2-1 Unimplemented: Read as ‘0’ bit 0 GxCS0: CWGx Clock Source Select bit 1 = HFINTOSC 0 = FOSC DS40001723D-page 238 2013-2015 Microchip Technology Inc. PIC12(L)F1571/2 REGISTER 23-2: R/W-x/u CWGxCON1: CWGx CONTROL REGISTER 1 R/W-x/u R/W-x/u GxASDLB<1:0> R/W-x/u U-0 GxASDLA<1:0> — R/W-0/0 R/W-0/0 R/W-0/0 GxIS<2:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit u = Bit is unchanged x = Bit is unknown U = Unimplemented bit, read as ‘0’ ‘1’ = Bit is set ‘0’ = Bit is cleared -n/n = Value at POR and BOR/Value at all other Resets bit 7-6 GxASDLB<1:0>: CWGx Shutdown State for CWGxB bits When an Auto-Shutdown Event is Present (GxASE = 1): 11 = CWGxB pin is driven to ‘1’, regardless of the setting of the GxPOLB bit 10 = CWGxB pin is driven to ‘0’, regardless of the setting of the GxPOLB bit 01 = CWGxB pin is tri-stated 00 = CWGxB pin is driven to its inactive state after the selected dead-band interval; GxPOLB will still control the polarity of the output bit 5-4 GxASDLA<1:0>: CWGx Shutdown State for CWGxA bits When an Auto-Shutdown Event is Present (GxASE = 1): 11 = CWGxA pin is driven to ‘1’, regardless of the setting of the GxPOLA bit 10 = CWGxA pin is driven to ‘0’, regardless of the setting of the GxPOLA bit 01 = CWGxA pin is tri-stated 00 = CWGxA pin is driven to its inactive state after the selected dead-band interval; GxPOLA will still control the polarity of the output bit 3 Unimplemented: Read as ‘0’ bit 2-0 GxIS<2:0>: CWGx Input Source Select bits 111 = Reserved 110 = Reserved 101 = Reserved 100 = PWM3 – PWM3_out 011 = PWM2 – PWM2_out 010 = PWM1 – PWM1_out 001 = Reserved 000 = Comparator C1 – C1OUT_async 2013-2015 Microchip Technology Inc. DS40001723D-page 239 PIC12(L)F1571/2 REGISTER 23-3: CWGxCON2: CWGx CONTROL REGISTER 2 R/W-0/0 R/W-0/0 U-0 U-0 U-0 R/W-0/0 R/W-0/0 U-0 GxASE GxARSEN — — — GxASDSC1 GxASDSFLT — bit 7 bit 0 Legend: R = Readable bit W = Writable bit u = Bit is unchanged x = Bit is unknown U = Unimplemented bit, read as ‘0’ ‘1’ = Bit is set ‘0’ = Bit is cleared -n/n = Value at POR and BOR/Value at all other Resets bit 7 GxASE: Auto-Shutdown Event Status bit 1 = An auto-shutdown event has occurred 0 = No auto-shutdown event has occurred bit 6 GxARSEN: Auto-Restart Enable bit 1 = Auto-restart is enabled 0 = Auto-restart is disabled bit 5-3 Unimplemented: Read as ‘0’ bit 2 GxASDSC1: CWGx Auto-Shutdown on Comparator C1 Enable bit 1 = Shutdown when Comparator C1 output (C1OUT_async) is high 0 = Comparator C1 output has no effect on shutdown bit 1 GxASDSFLT: CWGx Auto-Shutdown on FLT Enable bit 1 = Shutdown when CWG1FLT input is low 0 = CWG1FLT input has no effect on shutdown bit 0 Unimplemented: Read as ‘0’ DS40001723D-page 240 2013-2015 Microchip Technology Inc. PIC12(L)F1571/2 REGISTER 23-4: CWGxDBR: CWGx COMPLEMENTARY WAVEFORM GENERATOR RISING DEAD-BAND COUNT REGISTER U-0 U-0 — — R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u CWGxDBR<5:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared q = Value depends on condition bit 7-6 Unimplemented: Read as ‘0’ bit 5-0 CWGxDBR<5:0>: Complementary Waveform Generator (CWGx) Rising Counts bits 11 1111 = 63-64 counts of dead band 11 1110 = 62-63 counts of dead band • • • 00 0010 = 2-3 counts of dead band 00 0001 = 1-2 counts of dead band 00 0000 = 0 counts of dead band REGISTER 23-5: CWGxDBF: CWGx COMPLEMENTARY WAVEFORM GENERATOR FALLING DEAD-BAND COUNT REGISTER U-0 U-0 — — R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u CWGxDBF<5:0> bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared q = Value depends on condition bit 7-6 Unimplemented: Read as ‘0’ bit 5-0 CWGxDBF<5:0>: Complementary Waveform Generator (CWGx) Falling Counts bits 11 1111 = 63-64 counts of dead band 11 1110 = 62-63 counts of dead band • • • 00 0010 = 2-3 counts of dead band 00 0001 = 1-2 counts of dead band 00 0000 = 0 counts of dead band; dead-band generation is bypassed 2013-2015 Microchip Technology Inc. DS40001723D-page 241 PIC12(L)F1571/2 TABLE 23-2: Name ANSELA CWG1CON0 CWG1CON1 SUMMARY OF REGISTERS ASSOCIATED WITH CWG Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register on Page — — — ANSA4 — ANSA2 ANSA1 ANSA0 114 G1EN G1OEB — — G1CS0 238 G1ASDLB<1:0> CWG1CON2 G1ASE G1ARSEN CWG1DBF — — CWG1DBR — — TRISA — — G1OEA G1POLB G1POLA G1ASDLA<1:0> — — — — — G1IS<1:0> G1ASDSC1 G1ASDSFLT 239 — CWG1DBF<5:0> 241 CWG1DBR<5:0> TRISA<5:4> —(1) TRISA2 240 241 TRISA<1:0> 113 Legend: — = unimplemented location, read as ‘0’. Shaded cells are not used by the CWG. Note 1: Unimplemented, read as ‘1’. DS40001723D-page 242 2013-2015 Microchip Technology Inc. PIC12(L)F1571/2 24.0 IN-CIRCUIT SERIAL PROGRAMMING™ (ICSP™) ICSP™ programming allows customers to manufacture circuit boards with unprogrammed devices. Programming can be done after the assembly process, allowing the device to be programmed with the most recent firmware or a custom firmware. Five pins are needed for ICSP™ programming: • ICSPCLK • ICSPDAT • MCLR/VPP • VDD • VSS In Program/Verify mode, the program memory, User IDs and the Configuration Words are programmed through serial communications. The ICSPDAT pin is a bidirectional I/O used for transferring the serial data and the ICSPCLK pin is the clock input. For more information on ICSP™, refer to the “PIC12(L)F1501/PIC16(L)F150X Memory Programming Specification” (DS41573). 24.1 High-Voltage Programming Entry Mode The device is placed into High-Voltage Programming Entry mode by holding the ICSPCLK and ICSPDAT pins low, then raising the voltage on MCLR/VPP to VIHH. 24.2 Low-Voltage Programming Entry Mode The Low-Voltage Programming Entry mode allows the PIC® MCUs (Flash) to be programmed using VDD only, without high voltage. When the LVP bit of the Configuration Words is set to ‘1’, the ICSP Low-Voltage Programming Entry mode is enabled. To disable the Low-Voltage ICSP mode, the LVP bit must be programmed to ‘0’. 24.3 Common Programming Interfaces Connection to a target device is typically done through an ICSP™ header. A commonly found connector on development tools is the RJ-11 in the 6P6C (6-pin, 6-connector) configuration. See Figure 24-1. FIGURE 24-1: VDD ICD RJ-11 STYLE CONNECTOR INTERFACE ICSPDAT NC 2 4 6 ICSPCLK 1 3 5 Target VPP/MCLR VSS PC Board Bottom Side Pin Description* 1 = VPP/MCLR 2 = VDD Target 3 = VSS (ground) 4 = ICSPDAT 5 = ICSPCLK 6 = No Connect Another connector often found in use with the PICkit™ programmers is a standard 6-pin header with 0.1 inch spacing. Refer to Figure 24-2. Entry into the Low-Voltage Programming Entry mode requires the following steps: 1. 2. MCLR is brought to VIL. A 32-bit key sequence is presented on ICSPDAT while clocking ICSPCLK. Once the key sequence is complete, MCLR must be held at VIL for as long as Program/Verify mode is to be maintained. If Low-Voltage Programming is enabled (LVP = 1), the MCLR Reset function is automatically enabled and cannot be disabled. See Section 6.5 “MCLR” for more information. The LVP bit can only be reprogrammed to ‘0’ by using the High-Voltage Programming mode. 2013-2015 Microchip Technology Inc. DS40001723D-page 243 PIC12(L)F1571/2 FIGURE 24-2: PICkit™ PROGRAMMER STYLE CONNECTOR INTERFACE Rev. 10-000128A 7/30/2013 Pin 1 Indicator Pin Description* 1 = VPP/MCLR 1 2 3 4 5 6 2 = VDD Target 3 = VSS (ground) 4 = ICSPDAT 5 = ICSPCLK 6 = No connect * The 6-pin header (0.100" spacing) accepts 0.025" square pins For additional interface recommendations, refer to your specific device programmer manual prior to PCB design. FIGURE 24-3: It is recommended that isolation devices be used to separate the programming pins from other circuitry. The type of isolation is highly dependent on the specific application and may include devices, such as resistors, diodes or even jumpers. See Figure 24-3 for more information. TYPICAL CONNECTION FOR ICSP™ PROGRAMMING Rev. 10-000129A 7/30/2013 External Programming Signals Device to be Programmed VDD VDD VDD VPP MCLR/VPP VSS VSS Data ICSPDAT Clock ICSPCLK * * * To Normal Connections * Isolation devices (as required). DS40001723D-page 244 2013-2015 Microchip Technology Inc. PIC12(L)F1571/2 25.0 INSTRUCTION SET SUMMARY 25.1 Read-Modify-Write Operations • Byte-Oriented • Bit-Oriented • Literal and Control Any instruction that specifies a file register as part of the instruction performs a Read-Modify-Write (R-M-W) operation. The register is read, the data is modified and the result is stored according to either the instruction or the destination designator, ‘d’. A read operation is performed on a register even if the instruction writes to that register. The literal and control category contains the most varied instruction word format. TABLE 25-1: Each instruction is a 14-bit word containing the operation code (opcode) and all required operands. The opcodes are broken into three broad categories. OPCODE FIELD DESCRIPTIONS Table 25-3 lists the instructions recognized by the MPASM™ assembler. Field All instructions are executed within a single instruction cycle, with the following exceptions, which may take two or three cycles: W Working register (accumulator). b Bit address within an 8-bit file register. k Literal field, constant data or label. x Don’t care location (= 0 or 1). The assembler will generate code with x = 0. It is the recommended form of use for compatibility with all Microchip software tools. d Destination select; d = 0: store result in W, d = 1: store result in file register f. Default is d = 1. n FSR or INDF number (0-1). • Subroutine takes two cycles (CALL, CALLW) • Returns from interrupts or subroutines take two cycles (RETURN, RETLW, RETFIE) • Program branching takes two cycles (GOTO, BRA, BRW, BTFSS, BTFSC, DECFSZ, INCSFZ) • One additional instruction cycle will be used when any instruction references an indirect file register and the file select register is pointing to program memory One instruction cycle consists of 4 oscillator cycles; for an oscillator frequency of 4 MHz, this gives a nominal instruction execution rate of 1 MHz. All instruction examples use the format ‘0xhh’ to represent a hexadecimal number, where ‘h’ signifies a hexadecimal digit. f mm Description Register file address (0x00 to 0x7F). Pre-Post Increment-Decrement mode selection. TABLE 25-2: ABBREVIATION DESCRIPTIONS Field PC TO C DC Z PD 2013-2015 Microchip Technology Inc. Description Program Counter Time-out bit Carry bit Digit Carry bit Zero bit Power-Down bit DS40001723D-page 245 PIC12(L)F1571/2 FIGURE 25-1: GENERAL FORMAT FOR INSTRUCTIONS Byte-oriented file register operations 13 8 7 6 OPCODE d f (FILE #) 0 d = 0 for destination W d = 1 for destination f f = 7-bit file register address Bit-oriented file register operations 13 10 9 7 6 OPCODE b (BIT #) f (FILE #) 0 b = 3-bit bit address f = 7-bit file register address Literal and control operations General 13 OPCODE 8 7 0 k (literal) k = 8-bit immediate value CALL and GOTO instructions only 13 11 10 OPCODE 0 k (literal) k = 11-bit immediate value MOVLP instruction only 13 OPCODE 7 6 0 k (literal) k = 7-bit immediate value MOVLB instruction only 13 OPCODE 5 4 0 k (literal) k = 5-bit immediate value BRA instruction only 13 OPCODE 9 8 0 k (literal) k = 9-bit immediate value FSR Offset instructions 13 OPCODE 7 6 n 5 0 k (literal) n = appropriate FSR k = 6-bit immediate value FSR Increment instructions 13 OPCODE 3 2 1 0 n m (mode) n = appropriate FSR m = 2-bit mode value OPCODE only 13 0 OPCODE DS40001723D-page 246 2013-2015 Microchip Technology Inc. PIC12(L)F1571/2 TABLE 25-3: ENHANCED MID-RANGE INSTRUCTION SET Mnemonic, Operands Description Cycles 14-Bit Opcode MSb LSb Status Affected Notes BYTE-ORIENTED FILE REGISTER OPERATIONS ADDWF ADDWFC ANDWF ASRF LSLF LSRF CLRF CLRW COMF DECF INCF IORWF MOVF MOVWF RLF RRF SUBWF SUBWFB SWAPF XORWF f, d f, d f, d f, d f, d f, d f – f, d f, d f, d f, d f, d f f, d f, d f, d f, d f, d f, d Add W and f Add with Carry W and f AND W with f Arithmetic Right Shift Logical Left Shift Logical Right Shift Clear f Clear W Complement f Decrement f Increment f Inclusive OR W with f Move f Move W to f Rotate Left f through Carry Rotate Right f through Carry Subtract W from f Subtract with Borrow W from f Swap nibbles in f Exclusive OR W with f DECFSZ INCFSZ f, d f, d Decrement f, Skip if 0 Increment f, Skip if 0 BCF BSF f, b f, b Bit Clear f Bit Set f BTFSC BTFSS f, b f, b Bit Test f, Skip if Clear Bit Test f, Skip if Set ADDLW ANDLW IORLW MOVLB MOVLP MOVLW SUBLW XORLW k k k k k k k k Add literal and W AND literal with W Inclusive OR literal with W Move literal to BSR Move literal to PCLATH Move literal to W Subtract W from literal Exclusive OR literal with W 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 00 11 00 11 11 11 00 00 00 00 00 00 00 00 00 00 00 11 00 00 0111 1101 0101 0111 0101 0110 0001 0001 1001 0011 1010 0100 1000 0000 1101 1100 0010 1011 1110 0110 dfff dfff dfff dfff dfff dfff lfff 0000 dfff dfff dfff dfff dfff 1fff dfff dfff dfff dfff dfff dfff ffff ffff ffff ffff ffff ffff ffff 00xx ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff C, DC, Z C, DC, Z Z C, Z C, Z C, Z Z Z Z Z Z Z Z C C C, DC, Z C, DC, Z Z 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 BYTE-ORIENTED SKIP OPERATIONS 1(2) 1(2) 00 00 1, 2 1, 2 1011 dfff ffff 1111 dfff ffff BIT-ORIENTED FILE REGISTER OPERATIONS 1 1 00bb bfff ffff 01bb bfff ffff 2 2 01 01 10bb bfff ffff 11bb bfff ffff 1, 2 1, 2 11 11 11 00 11 11 11 11 1110 1001 1000 0000 0001 0000 1100 1010 01 01 BIT-ORIENTED SKIP OPERATIONS 1 (2) 1 (2) LITERAL OPERATIONS 1 1 1 1 1 1 1 1 kkkk kkkk kkkk 001k 1kkk kkkk kkkk kkkk kkkk kkkk kkkk kkkk kkkk kkkk kkkk kkkk C, DC, Z Z Z C, DC, Z Z Note 1: If the Program Counter (PC) is modified, or a conditional test is true, the instruction requires two cycles. The second cycle is executed as a NOP. 2: If this instruction addresses an INDF register and the MSb of the corresponding FSR is set, this instruction will require one additional instruction cycle. 3: See the table in the MOVIW and MOVWI instruction descriptions. 2013-2015 Microchip Technology Inc. DS40001723D-page 247 PIC12(L)F1571/2 TABLE 25-3: ENHANCED MID-RANGE INSTRUCTION SET (CONTINUED) Mnemonic, Operands Description Cycles 14-Bit Opcode MSb LSb Status Affected Notes CONTROL OPERATIONS BRA BRW CALL CALLW GOTO RETFIE RETLW RETURN k – k – k k k – Relative Branch Relative Branch with W Call Subroutine Call Subroutine with W Go to address Return from interrupt Return with literal in W Return from Subroutine 2 2 2 2 2 2 2 2 11 00 10 00 10 00 11 00 001k 0000 0kkk 0000 1kkk 0000 0100 0000 kkkk 0000 kkkk 0000 kkkk 0000 kkkk 0000 kkkk 1011 kkkk 1010 kkkk 1001 kkkk 1000 00 00 00 00 00 00 0000 0000 0000 0000 0000 0000 0110 0000 0110 0000 0110 0110 0100 TO, PD 0000 0010 0001 0011 TO, PD 0fff INHERENT OPERATIONS CLRWDT NOP OPTION RESET SLEEP TRIS – – – – – f Clear Watchdog Timer No Operation Load OPTION_REG register with W Software device Reset Go into Standby mode Load TRIS register with W ADDFSR MOVIW n, k n mm MOVWI k[n] n mm Add Literal k to FSRn Move Indirect FSRn to W with pre/post inc/dec modifier, mm Move INDFn to W, Indexed Indirect. Move W to Indirect FSRn with pre/post inc/dec modifier, mm Move W to INDFn, Indexed Indirect. 1 1 1 1 1 1 C COMPILER OPTIMIZED k[n] 1 1 11 00 1 1 11 00 0001 0nkk kkkk 0000 0001 0nmm Z kkkk 1111 0nkk 1nmm Z 0000 0001 kkkk 1 11 1111 1nkk 2, 3 2 2, 3 2 Note 1: If the Program Counter (PC) is modified, or a conditional test is true, the instruction requires two cycles. The second cycle is executed as a NOP. 2: If this instruction addresses an INDF register and the MSb of the corresponding FSR is set, this instruction will require one additional instruction cycle. 3: See the table in the MOVIW and MOVWI instruction descriptions. DS40001723D-page 248 2013-2015 Microchip Technology Inc. PIC12(L)F1571/2 25.2 Instruction Descriptions ADDFSR Add Literal to FSRn ANDLW AND literal with W Syntax: [ label ] ADDFSR FSRn, k Syntax: [ label ] ANDLW Operands: -32 k 31 n [ 0, 1] Operation: FSR(n) + k FSR(n) Status Affected: None Description: The signed 6-bit literal ‘k’ is added to the contents of the FSRnH:FSRnL register pair. k Operands: 0 k 255 Operation: (W) .AND. (k) (W) Status Affected: Z Description: The contents of W register are AND’ed with the 8-bit literal ‘k’. The result is placed in the W register. FSRn is limited to the range 0000h FFFFh. Moving beyond these bounds will cause the FSR to wraparound. ADDLW Add literal and W ANDWF AND W with f Syntax: [ label ] ADDLW Syntax: [ label ] ANDWF Operands: 0 f 127 d 0,1 Operation: (W) .AND. (f) (destination) The contents of the W register are added to the 8-bit literal ‘k’ and the result is placed in the W register. Status Affected: Z Description: AND the W register with register ‘f’. If ‘d’ is ‘0’, the result is stored in the W register. If ‘d’ is ‘1’, the result is stored back in register ‘f’. ADDWF Add W and f ASRF Arithmetic Right Shift Syntax: [ label ] ADDWF Syntax: [ label ] ASRF Operands: 0 f 127 d 0,1 Operands: 0 f 127 d [0,1] Operation: (W) + (f) (destination) Operation: Status Affected: C, DC, Z Description: Add the contents of the W register with register ‘f’. If ‘d’ is ‘0’, the result is stored in the W register. If ‘d’ is ‘1’, the result is stored back in register ‘f’. (f<7>) dest<7> (f<7:1>) dest<6:0>, (f<0>) C, Status Affected: C, Z Description: The contents of register ‘f’ are shifted one bit to the right through the Carry flag. The MSb remains unchanged. If ‘d’ is ‘0’, the result is placed in W. If ‘d’ is ‘1’, the result is stored back in register ‘f’. Operands: 0 k 255 Operation: (W) + k (W) Status Affected: C, DC, Z Description: k f,d ADDWFC ADD W and CARRY bit to f Syntax: [ label ] ADDWFC Operands: 0 f 127 d [0,1] f {,d} register f C f {,d} Operation: (W) + (f) + (C) dest Status Affected: C, DC, Z Description: Add W, the Carry flag and data memory location ‘f’. If ‘d’ is ‘0’, the result is placed in W. If ‘d’ is ‘1’, the result is placed in data memory location ‘f’. 2013-2015 Microchip Technology Inc. f,d DS40001723D-page 249 PIC12(L)F1571/2 BCF Bit Clear f Syntax: [ label ] BCF BTFSC f,b Bit Test f, Skip if Clear Syntax: [ label ] BTFSC f,b 0 f 127 0b7 Operands: 0 f 127 0b7 Operands: Operation: 0 (f<b>) Operation: skip if (f<b>) = 0 Status Affected: None Status Affected: None Description: Bit ‘b’ in register ‘f’ is cleared. Description: If bit ‘b’ in register ‘f’ is ‘1’, the next instruction is executed. If bit ‘b’, in register ‘f’, is ‘0’, the next instruction is discarded, and a NOP is executed instead, making this a 2-cycle instruction. BRA Relative Branch BTFSS Bit Test f, Skip if Set Syntax: [ label ] BRA label [ label ] BRA $+k Syntax: [ label ] BTFSS f,b Operands: 0 f 127 0b<7 Operands: -256 label - PC + 1 255 -256 k 255 Operation: skip if (f<b>) = 1 Operation: (PC) + 1 + k PC Status Affected: None Status Affected: None Description: Description: Add the signed 9-bit literal ‘k’ to the PC. Since the PC will have incremented to fetch the next instruction, the new address will be PC + 1 + k. This instruction is a 2-cycle instruction. This branch has a limited range. If bit ‘b’ in register ‘f’ is ‘0’, the next instruction is executed. If bit ‘b’ is ‘1’, then the next instruction is discarded and a NOP is executed instead, making this a 2-cycle instruction. BRW Relative Branch with W Syntax: [ label ] BRW Operands: None Operation: (PC) + (W) PC Status Affected: None Description: Add the contents of W (unsigned) to the PC. Since the PC will have incremented to fetch the next instruction, the new address will be PC + 1 + (W). This instruction is a 2-cycle instruction. BSF Bit Set f Syntax: [ label ] BSF Operands: 0 f 127 0b7 Operation: 1 (f<b>) Status Affected: None Description: Bit ‘b’ in register ‘f’ is set. DS40001723D-page 250 f,b 2013-2015 Microchip Technology Inc. PIC12(L)F1571/2 CALL Call Subroutine CLRWDT Clear Watchdog Timer Syntax: [ label ] CALL k Syntax: [ label ] CLRWDT Operands: 0 k 2047 Operands: None Operation: (PC)+ 1 TOS, k PC<10:0>, (PCLATH<6:3>) PC<14:11> Operation: Status Affected: None 00h WDT 0 WDT prescaler, 1 TO 1 PD Description: Call Subroutine. First, return address (PC + 1) is pushed onto the stack. The 11-bit immediate address is loaded into PC bits <10:0>. The upper bits of the PC are loaded from PCLATH. CALL is a 2-cycle instruction. Status Affected: TO, PD Description: CLRWDT instruction resets the Watchdog Timer. It also resets the prescaler of the WDT. Status bits TO and PD are set. CALLW Subroutine Call With W COMF Complement f Syntax: [ label ] CALLW Syntax: [ label ] COMF Operands: None Operands: Operation: (PC) +1 TOS, (W) PC<7:0>, (PCLATH<6:0>) PC<14:8> 0 f 127 d [0,1] Operation: (f) (destination) Status Affected: Z Description: The contents of register ‘f’ are complemented. If ‘d’ is ‘0’, the result is stored in W. If ‘d’ is ‘1’, the result is stored back in register ‘f’. DECF Decrement f Status Affected: None Description: Subroutine call with W. First, the return address (PC + 1) is pushed onto the return stack. Then, the contents of W is loaded into PC<7:0>, and the contents of PCLATH into PC<14:8>. CALLW is a 2-cycle instruction. CLRF Clear f Syntax: [ label ] CLRF f f,d Syntax: [ label ] DECF f,d 0 f 127 d [0,1] Operands: 0 f 127 Operands: Operation: 00h (f) 1Z Operation: (f) - 1 (destination) Z Status Affected: Z Description: The contents of register ‘f’ are cleared and the Z bit is set. Description: Decrement register ‘f’. If ‘d’ is ‘0’, the result is stored in the W register. If ‘d’ is ‘1’, the result is stored back in register ‘f’. CLRW Clear W Syntax: [ label ] CLRW Operands: None Operation: 00h (W) 1Z Status Affected: Status Affected: Z Description: W register is cleared. Zero bit (Z) is set. 2013-2015 Microchip Technology Inc. DS40001723D-page 251 PIC12(L)F1571/2 DECFSZ Decrement f, Skip if 0 INCFSZ Syntax: [ label ] DECFSZ f,d Syntax: [ label ] Operands: 0 f 127 d [0,1] Operands: 0 f 127 d [0,1] Operation: (f) - 1 (destination); skip if result = 0 Operation: (f) + 1 (destination), skip if result = 0 Status Affected: None Status Affected: None Description: The contents of register ‘f’ are decremented. If ‘d’ is ‘0’, the result is placed in the W register. If ‘d’ is ‘1’, the result is placed back in register ‘f’. If the result is ‘1’, the next instruction is executed. If the result is ‘0’, then a NOP is executed instead, making it a 2-cycle instruction. Description: The contents of register ‘f’ are incremented. If ‘d’ is ‘0’, the result is placed in the W register. If ‘d’ is ‘1’, the result is placed back in register ‘f’. If the result is ‘1’, the next instruction is executed. If the result is ‘0’, a NOP is executed instead, making it a 2-cycle instruction. GOTO Unconditional Branch IORLW Inclusive OR literal with W Syntax: [ label ] Syntax: [ label ] GOTO k Increment f, Skip if 0 INCFSZ f,d IORLW k Operands: 0 k 2047 Operands: 0 k 255 Operation: k PC<10:0> PCLATH<6:3> PC<14:11> Operation: (W) .OR. k (W) Status Affected: None Description: GOTO is an unconditional branch. The 11-bit immediate value is loaded into PC bits <10:0>. The upper bits of PC are loaded from PCLATH<4:3>. GOTO is a 2-cycle instruction. INCF Status Affected: Z Description: The contents of the W register are OR’ed with the 8-bit literal ‘k’. The result is placed in the W register. Increment f IORWF Inclusive OR W with f Syntax: [ label ] Syntax: [ label ] Operands: 0 f 127 d [0,1] Operands: 0 f 127 d [0,1] Operation: (f) + 1 (destination) Operation: (W) .OR. (f) (destination) Status Affected: Z Status Affected: Z Description: The contents of register ‘f’ are incremented. If ‘d’ is ‘0’, the result is placed in the W register. If ‘d’ is ‘1’, the result is placed back in register ‘f’. Description: Inclusive OR the W register with register ‘f’. If ‘d’ is ‘0’, the result is placed in the W register. If ‘d’ is ‘1’, the result is placed back in register ‘f’. DS40001723D-page 252 INCF f,d IORWF f,d 2013-2015 Microchip Technology Inc. PIC12(L)F1571/2 LSLF Logical Left Shift MOVF Syntax: [ label ] LSLF Syntax: [ label ] Operands: 0 f 127 d [0,1] Operands: 0 f 127 d [0,1] Operation: (f<7>) C (f<6:0>) dest<7:1> 0 dest<0> Operation: (f) (dest) f {,d} Status Affected: C, Z Description: The contents of register ‘f’ are shifted one bit to the left through the Carry flag. A ‘0’ is shifted into the LSb. If ‘d’ is ‘0’, the result is placed in W. If ‘d’ is ‘1’, the result is stored back in register ‘f’. C register f 0 Z Description: The contents of register f is moved to a destination dependent upon the status of d. If d = 0, destination is W register. If d = 1, the destination is file register f itself. d = 1 is useful to test a file register since status flag Z is affected. Words: 1 Cycles: 1 Logical Right Shift Syntax: [ label ] LSRF Operands: 0 f 127 d [0,1] Operation: 0 dest<7> (f<7:1>) dest<6:0>, (f<0>) C, Status Affected: C, Z Description: The contents of register ‘f’ are shifted one bit to the right through the Carry flag. A ‘0’ is shifted into the MSb. If ‘d’ is ‘0’, the result is placed in W. If ‘d’ is ‘1’, the result is stored back in register ‘f’. f {,d} 2013-2015 Microchip Technology Inc. MOVF FSR, 0 After Instruction W = value in FSR register Z = 1 LSRF register f MOVF f,d Status Affected: Example: 0 Move f C DS40001723D-page 253 PIC12(L)F1571/2 MOVIW Move INDFn to W MOVLP Syntax: [ label ] MOVIW ++FSRn [ label ] MOVIW --FSRn [ label ] MOVIW FSRn++ [ label ] MOVIW FSRn-[ label ] MOVIW k[FSRn] Syntax: [ label ] MOVLP k Operands: 0 k 127 Operation: k PCLATH Status Affected: None Operands: n [0,1] mm [00,01, 10, 11] -32 k 31 Description: The 7-bit literal ‘k’ is loaded into the PCLATH register. Operation: INDFn W Effective address is determined by • FSR + 1 (preincrement) • FSR - 1 (predecrement) • FSR + k (relative offset) After the Move, the FSR value will be either: • FSR + 1 (all increments) • FSR - 1 (all decrements) • Unchanged Status Affected: MOVLW Move literal to W Syntax: [ label ] 0 k 255 Operation: k (W) Status Affected: None Description: The 8-bit literal ‘k’ is loaded into W register. The “don’t cares” will assemble as ‘0’s. Words: 1 1 Mode Syntax mm Cycles: Preincrement ++FSRn 00 Example: --FSRn 01 Postincrement FSRn++ 10 Postdecrement FSRn-- 11 Description: This instruction is used to move data between W and one of the indirect registers (INDFn). Before/after this move, the pointer (FSRn) is updated by pre/post incrementing/decrementing it. Note: The INDFn registers are not physical registers. Any instruction that accesses an INDFn register actually accesses the register at the address specified by the FSRn. FSRn is limited to the range 0000h FFFFh. Incrementing/decrementing it beyond these bounds will cause it to wraparound. MOVLB MOVLW k Operands: Z Predecrement Move literal to PCLATH MOVLW 0x5A After Instruction W = MOVWF Move W to f Syntax: [ label ] MOVWF Operands: 0 f 127 Operation: (W) (f) 0x5A f Status Affected: None Description: Move data from W register to register ‘f’. Words: 1 Cycles: 1 Example: MOVWF OPTION_REG Before Instruction OPTION_REG = W = After Instruction OPTION_REG = W = 0xFF 0x4F 0x4F 0x4F Move literal to BSR Syntax: [ label ] MOVLB k Operands: 0 k 31 Operation: k BSR Status Affected: None Description: The 5-bit literal ‘k’ is loaded into the Bank Select Register (BSR). DS40001723D-page 254 2013-2015 Microchip Technology Inc. PIC12(L)F1571/2 MOVWI Move W to INDFn Syntax: [ label ] MOVWI ++FSRn [ label ] MOVWI --FSRn [ label ] MOVWI FSRn++ [ label ] MOVWI FSRn-[ label ] MOVWI k[FSRn] Operands: Operation: n [0,1] mm [00,01, 10, 11] -32 k 31 W INDFn Effective address is determined by • FSR + 1 (preincrement) • FSR - 1 (predecrement) • FSR + k (relative offset) After the Move, the FSR value will be either: • FSR + 1 (all increments) • FSR - 1 (all decrements) Unchanged Status Affected: None Mode Syntax Preincrement ++FSRn 00 Predecrement --FSRn 01 Postincrement FSRn++ 10 Postdecrement FSRn-- 11 Description: This instruction is used to move data between W and one of the indirect registers (INDFn). Before/after this move, the pointer (FSRn) is updated by pre/post incrementing/decrementing it. mm Note: The INDFn registers are not physical registers. Any instruction that accesses an INDFn register actually accesses the register at the address specified by the FSRn. NOP No Operation Syntax: [ label ] Operands: None Operation: No operation Status Affected: None NOP Description: No operation. Words: 1 Cycles: 1 Example: NOP OPTION Load OPTION_REG Register with W Syntax: [ label ] OPTION Operands: None Operation: (W) OPTION_REG Status Affected: None Description: Move data from W register to OPTION_REG register. RESET Software Reset Syntax: [ label ] RESET Operands: None Operation: Execute a device Reset. Resets the nRI flag of the PCON register. Status Affected: None Description: This instruction provides a way to execute a hardware Reset by software. FSRn is limited to the range 0000h FFFFh. Incrementing/decrementing it beyond these bounds will cause it to wraparound. The increment/decrement operation on FSRn WILL NOT affect any Status bits. 2013-2015 Microchip Technology Inc. DS40001723D-page 255 PIC12(L)F1571/2 RETFIE Return from Interrupt RETURN Return from Subroutine Syntax: [ label ] Syntax: [ label ] Operands: None Operands: None Operation: TOS PC, 1 GIE Operation: TOS PC Status Affected: None Status Affected: None Description: Description: Return from Interrupt. Stack is POPed and Top-of-Stack (TOS) is loaded in the PC. Interrupts are enabled by setting Global Interrupt Enable bit, GIE (INTCON<7>). This is a 2-cycle instruction. Return from subroutine. The stack is POPed and the top of the stack (TOS) is loaded into the Program Counter. This is a 2-cycle instruction. Words: 1 Cycles: 2 Example: RETFIE RETURN RETFIE After Interrupt PC = GIE = TOS 1 RETLW Return with literal in W RLF Syntax: [ label ] Syntax: [ label ] 0 f 127 d [0,1] See description below RETLW k Rotate Left f through Carry RLF f,d Operands: 0 k 255 Operands: Operation: k (W); TOS PC Operation: None Status Affected: C Description: The W register is loaded with the 8-bit literal ‘k’. The Program Counter is loaded from the top of the stack (the return address). This is a 2-cycle instruction. Description: The contents of register ‘f’ are rotated one bit to the left through the Carry flag. If ‘d’ is ‘0’, the result is placed in the W register. If ‘d’ is ‘1’, the result is stored back in register ‘f’. Words: 1 Cycles: 2 Status Affected: Example: TABLE C CALL TABLE;W contains table ;offset value • ;W now has table value • • ADDWF PC ;W = offset RETLW k1 ;Begin table RETLW k2 ; • • • RETLW kn ; End of table Before Instruction W = After Instruction W = DS40001723D-page 256 Words: 1 Cycles: 1 Example: RLF Register f REG1,0 Before Instruction REG1 C After Instruction REG1 W C = = 1110 0110 0 = = = 1110 0110 1100 1100 1 0x07 value of k8 2013-2015 Microchip Technology Inc. PIC12(L)F1571/2 RRF Rotate Right f through Carry SUBLW Syntax: [ label ] Syntax: [ label ] Operands: 0 f 127 d [0,1] Operands: 0 k 255 Operation: k - (W) W) Operation: See description below Status Affected: C, DC, Z Status Affected: C Description: Description: The contents of register ‘f’ are rotated one bit to the right through the Carry flag. If ‘d’ is ‘0’, the result is placed in the W register. If ‘d’ is ‘1’, the result is placed back in register ‘f’. The W register is subtracted (2’s complement method) from the 8-bit literal ‘k’. The result is placed in the W register. RRF f,d C Register f Subtract W from literal SUBLW k C=0 Wk C=1 Wk DC = 0 W<3:0> k<3:0> DC = 1 W<3:0> k<3:0> SLEEP Enter Sleep mode SUBWF Syntax: [ label ] Syntax: [ label ] Operands: 0 f 127 d [0,1] Operation: (f) - (W) destination) SLEEP Operands: None Operation: 00h WDT, 0 WDT prescaler, 1 TO, 0 PD Status Affected: TO, PD Description: The power-down Status bit, PD is cleared. Time-out Status bit, TO is set. Watchdog Timer and its prescaler are cleared. The processor is put into Sleep mode with the oscillator stopped. SUBWF f,d Status Affected: C, DC, Z Description: Subtract (2’s complement method) W register from register ‘f’. If ‘d’ is ‘0’, the result is stored in the W register. If ‘d’ is ‘1’, the result is stored back in register ‘f. SUBWFB 2013-2015 Microchip Technology Inc. Subtract W from f C=0 Wf C=1 Wf DC = 0 W<3:0> f<3:0> DC = 1 W<3:0> f<3:0> Subtract W from f with Borrow Syntax: SUBWFB Operands: 0 f 127 d [0,1] f {,d} Operation: (f) – (W) – (B) dest Status Affected: C, DC, Z Description: Subtract W and the BORROW flag (CARRY) from register ‘f’ (2’s complement method). If ‘d’ is ‘0’, the result is stored in W. If ‘d’ is ‘1’, the result is stored back in register ‘f’. DS40001723D-page 257 PIC12(L)F1571/2 SWAPF Swap Nibbles in f XORLW Syntax: [ label ] Syntax: [ label ] Operands: 0 f 127 d [0,1] Operands: 0 k 255 (f<3:0>) (destination<7:4>), (f<7:4>) (destination<3:0>) Operation: (W) .XOR. k W) Operation: Status Affected: Z Status Affected: None Description: Description: The upper and lower nibbles of register ‘f’ are exchanged. If ‘d’ is ‘0’, the result is placed in the W register. If ‘d’ is ‘1’, the result is placed in register ‘f’. The contents of the W register are XOR’ed with the 8-bit literal ‘k’. The result is placed in the W register. TRIS Load TRIS Register with W XORWF Syntax: [ label ] TRIS f Syntax: [ label ] Operands: 0 f 127 d [0,1] Operation: (W) .XOR. (f) destination) SWAPF f,d Operands: 5f7 Operation: (W) TRIS register ‘f’ Status Affected: None Description: Move data from W register to TRIS register. When ‘f’ = 5, TRISA is loaded. When ‘f’ = 6, TRISB is loaded. When ‘f’ = 7, TRISC is loaded. DS40001723D-page 258 Exclusive OR literal with W XORLW k Exclusive OR W with f XORWF f,d Status Affected: Z Description: Exclusive OR the contents of the W register with register ‘f’. If ‘d’ is ‘0’, the result is stored in the W register. If ‘d’ is ‘1’, the result is stored back in register ‘f’. 2013-2015 Microchip Technology Inc. PIC12(L)F1571/2 26.0 ELECTRICAL SPECIFICATIONS 26.1 Absolute Maximum Ratings(†) Ambient temperature under bias............................................................................................................ -40°C to +125°C Storage temperature .............................................................................................................................. -65°C to +150°C Voltage on pins with respect to VSS: on VDD pin PIC12F1571/2 ................................................................................................................. -0.3V to +6.5V PIC12LF1571/2 ............................................................................................................... -0.3V to +4.0V on MCLR pin ................................................................................................................................. -0.3V to +9.0V on all other pins .................................................................................................................. -0.3V to (VDD + 0.3V) Maximum current: on VSS pin(1) -40°C TA +85°C .................................................................................................................... 250 mA +85°C TA +125°C ................................................................................................................... 85 mA on VDD pin(1) -40°C TA +85°C .................................................................................................................... 250 mA +85°C TA +125°C ................................................................................................................... 85 mA Sunk by any standard I/O pin ..................................................................................................................... 50 mA Sourced by any standard I/O pin ................................................................................................................ 50 mA Clamp current, IK (VPIN < 0 or VPIN > VDD) ......................................................................................................... 20 mA Total power dissipation(2) .....................................................................................................................................800 mW Note 1: 2: Maximum current rating requires even load distribution across I/O pins. Maximum current rating may be limited by the device package power dissipation characterizations, see Table 26-6: “Thermal Characteristics” to calculate device specifications. Power dissipation is calculated as follows: PDIS = VDD x {IDD – IOH} + {(VDD – VOH) x IOH} + (VOl x IOL). † NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operation listings of this specification is not implied. Exposure above maximum rating conditions for extended periods may affect device reliability. 2013-2015 Microchip Technology Inc. DS40001723D-page 259 PIC12(L)F1571/2 26.2 Standard Operating Conditions The standard operating conditions for any device are defined as: Operating Voltage: Operating Temperature: VDDMIN VDD VDDMAX TA_MIN TA TA_MAX VDD — Operating Supply Voltage(1) PIC12LF1571/2 VDDMIN (FOSC 16 MHz) ............................................................................................................... +1.8V VDDMIN (FOSC 32 MHz) ............................................................................................................... +2.5V VDDMAX .......................................................................................................................................... +3.6V PIC12F1571/2 VDDMIN (FOSC 16 MHz) ............................................................................................................... +2.3V VDDMIN (FOSC 32 MHz) ............................................................................................................... +2.5V VDDMAX .......................................................................................................................................... +5.5V TA — Operating Ambient Temperature Range Industrial Temperature TA_MIN ............................................................................................................................................ -40°C TA_MAX .......................................................................................................................................... +85°C Extended Temperature TA_MIN ............................................................................................................................................ -40°C TA_MAX ........................................................................................................................................ +125°C Note 1: See Parameter D001, DS Characteristics: Supply Voltage. DS40001723D-page 260 2013-2015 Microchip Technology Inc. PIC12(L)F1571/2 FIGURE 26-1: VOLTAGE FREQUENCY GRAPH, -40°C TA +125°C, PIC12F1571/2 ONLY Rev. 10-000130B 9/19/2013 VDD (V) 5.5 2.5 2.3 0 16 32 Frequency (MHz) Note 1: The shaded region indicates the permissible combinations of voltage and frequency. 2: Refer to Table 26-7 for each Oscillator mode’s supported frequencies. FIGURE 26-2: VOLTAGE FREQUENCY GRAPH, -40°C TA +125°C, PIC12LF1571/2 ONLY Rev. 10-000131B 9/19/2013 VDD (V) 3.6 2.5 1.8 0 16 32 Frequency (MHz) Note 1: The shaded region indicates the permissible combinations of voltage and frequency. 2: Refer to Table 26-7 for each Oscillator mode’s supported frequencies. 2013-2015 Microchip Technology Inc. DS40001723D-page 261 PIC12(L)F1571/2 26.3 DC Characteristics TABLE 26-1: SUPPLY VOLTAGE PIC12LF1571/2 Standard Operating Conditions (unless otherwise stated) PIC12F1571/2 Param. No. D001 Sym. VDD Characteristic Min. Typ† Max. Units VDDMIN 1.8 2.5 — — VDDMAX 3.6 3.6 V V FOSC 16 MHz FOSC 32 MHz (Note 3) 2.3 2.5 — — 5.5 5.5 V V FOSC 16 MHz FOSC 32 MHz (Note 3) 1.5 — — V Device in Sleep mode 1.7 — — V Device in Sleep mode — 1.6 — V — 1.6 — V — 0.8 — V Supply Voltage D001 D002* VDR RAM Data Retention Voltage(1) D002* D002A* VPOR Power-on Reset Release Voltage(2) D002A* D002B* VPORR* Conditions Power-on Reset Rearm Voltage(2) D002B* — 1.5 — V D003 VFVR Fixed Voltage Reference Voltage — 1.024 — V -40°C TA +85°C D003A VADFVR FVR Gain Voltage Accuracy for ADC -4 — +4 % 1x VFVR, ADFVR = 01, VDD 2.5V 2x VFVR, ADFVR = 10, VDD 2.5V 4x VFVR, ADFVR = 11, VDD 4.75V D003B VCDAFVR FVR Gain Voltage Accuracy for Comparator -4 — +4 % 1x VFVR, CDAFVR = 01, VDD 2.5V 2x VFVR, CDAFVR = 10, VDD 2.5V 4x VFVR, CDAFVR = 11, VDD 4.75V D004* SVDD 0.05 — — V/ms VDD Rise Rate(2) Ensures that the Power-on Reset signal is released properly * † These parameters are characterized but not tested. Data in “Typ” column is at 3.0V, +25°C unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: This is the limit to which VDD can be lowered in Sleep mode without losing RAM data. 2: See Figure 26-3, POR and POR Rearm with Slow Rising VDD. 3: PLL required for 32 MHz operation. DS40001723D-page 262 2013-2015 Microchip Technology Inc. PIC12(L)F1571/2 FIGURE 26-3: POR AND POR REARM WITH SLOW RISING VDD VDD VPOR VPORR SVDD VSS NPOR(1) POR Rearm VSS TVLOW(3) Note 1: 2: 3: TPOR(2) When NPOR is low, the device is held in Reset. TPOR: 1 s typical. TVLOW: 2.7 s typical. 2013-2015 Microchip Technology Inc. DS40001723D-page 263 PIC12(L)F1571/2 TABLE 26-2: SUPPLY CURRENT (IDD)(1,2) PIC12LF1571/2 Standard Operating Conditions (unless otherwise stated) PIC12F1571/2 Param. No. Device Characteristics D013 D013 D014 D014 D015 D015 D016 D016 Min. Typ† Max. Units — 35 44 — 60 — Conditions VDD Note A 1.8 69 A 3.0 FOSC = 1 MHz, External Clock (ECM), Medium Power mode 68 93 A 2.3 — 91 120 A 3.0 — 131 160 A 5.0 — 116 132 A 1.8 — 203 233 A 3.0 — 174 221 A 2.3 — 234 286 A 3.0 — 299 374 A 5.0 — 5.5 11 A 1.8 — 7.3 12 A 3.0 — 13 21 A 2.3 — 15 24 A 3.0 — 17 25 A 5.0 — 111 151 A 1.8 — 133 176 A 3.0 — 144 209 A 2.3 — 162 237 A 3.0 — 216 288 A 5.0 D017* — 0.5 0.6 mA 1.8 — 0.7 0.9 mA 3.0 D017* — 0.6 0.8 mA 2.3 — 0.8 0.9 mA 3.0 — 0.9 1.0 mA 5.0 D018 D018 * † Note 1: 2: 3: — 0.7 0.8 mA 1.8 — 1.1 1.2 mA 3.0 — 0.9 1.1 mA 2.3 — 1.1 1.3 mA 3.0 — 1.3 1.5 mA 5.0 FOSC = 1 MHz, External Clock (ECM), Medium Power mode FOSC = 4 MHz, External Clock (ECM), Medium Power mode FOSC = 4 MHz, External Clock (ECM), Medium Power mode FOSC = 31 kHz, LFINTOSC, -40°C TA +85°C FOSC = 31 kHz, LFINTOSC, -40°C TA +85°C FOSC = 500 kHz, MFINTOSC FOSC = 500 kHz, MFINTOSC FOSC = 8 MHz, HFINTOSC FOSC = 8 MHz, HFINTOSC FOSC = 16 MHz, HFINTOSC FOSC = 16 MHz, HFINTOSC These parameters are characterized but not tested. Data in “Typ” column is at 3.0V, +25°C unless otherwise stated. These parameters are for design guidance only and are not tested. The test conditions for all IDD measurements in active operation mode are: CLKIN = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VSS; MCLR = VDD; WDT disabled. The supply current is mainly a function of the operating voltage and frequency. Other factors, such as I/O pin loading and switching rate, oscillator type, internal code execution pattern and temperature, also have an impact on the current consumption. PLL required for 32 MHz operation. DS40001723D-page 264 2013-2015 Microchip Technology Inc. PIC12(L)F1571/2 TABLE 26-2: SUPPLY CURRENT (IDD)(1,2) (CONTINUED) PIC12LF1571/2 Standard Operating Conditions (unless otherwise stated) PIC12F1571/2 Param. No. Device Characteristics Conditions Min. Typ† Max. Units D018A* — 2 2.4 mA 3.0 FOSC = 32 MHz, HFINTOSC (Note 3) D018A* — 2.1 2.5 mA 3.0 — 2.2 2.6 mA 5.0 FOSC = 32 MHz, HFINTOSC (Note 3) D019A — 1.7 1.9 mA 3.0 FOSC = 32 MHz, External Clock (ECH), High-Power mode (Note 3) D019A — 1.8 2 mA 3.0 — 1.9 2.3 mA 5.0 FOSC = 32 MHz, External Clock (ECH), High-Power mode (Note 3) — 2.2 5.9 A 1.8 — 4.3 8.3 A 3.0 — 12 20 A 2.3 — 15 25 A 3.0 — 17 26 A 5.0 — 18 25 A 1.8 — 30 38 A 3.0 — 29 40 A 2.3 — 37 51 A 3.0 — 42 53 A 5.0 D019B D019B D019C D019C * † Note 1: 2: 3: VDD Note FOSC = 32 kHz, External Clock (ECL), Low-Power mode FOSC = 32 kHz, External Clock (ECL), Low-Power mode FOSC = 500 kHz, External Clock (ECL), Low-Power mode FOSC = 500 kHz, External Clock (ECL), Low-Power mode These parameters are characterized but not tested. Data in “Typ” column is at 3.0V, +25°C unless otherwise stated. These parameters are for design guidance only and are not tested. The test conditions for all IDD measurements in active operation mode are: CLKIN = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VSS; MCLR = VDD; WDT disabled. The supply current is mainly a function of the operating voltage and frequency. Other factors, such as I/O pin loading and switching rate, oscillator type, internal code execution pattern and temperature, also have an impact on the current consumption. PLL required for 32 MHz operation. 2013-2015 Microchip Technology Inc. DS40001723D-page 265 PIC12(L)F1571/2 TABLE 26-3: POWER-DOWN CURRENTS (IPD)(1,2) PIC12LF1571/2 Operating Conditions (unless otherwise stated) Low-Power Sleep Mode PIC12F1571/2 Low-Power Sleep Mode, VREGPM = 1 Param. No. D022 Device Characteristics Base IPD D022 Base IPD D022A Base IPD D023 D023 Conditions Min. Typ† Max. +85°C Max. +125°C Units — 0.020 0.6 2.6 A 1.8 — 0.025 0.8 2.9 A 3.0 — 0.2 0.9 2.8 A 2.3 — 0.3 3.0 3.8 A 3.0 — 0.4 3.6 4.5 A 5.0 — 9 14 15 A 2.3 — 11 19 21 A 3.0 — 12 21 22 A 5.0 WDT, BOR and FVR disabled, all peripherals inactive, Normal Power Sleep mode, VREGPM = 0 — 0.3 0.8 2.9 A 1.8 WDT Current — 0.5 1.1 3.5 A 3.0 — 0.5 1.7 4.1 A 2.3 — 0.6 1.9 4.4 A 3.0 VDD Note WDT, BOR and FVR disabled, all peripherals inactive, VREGPM = 1 WDT, BOR and FVR disabled, all peripherals inactive, Low-Power Sleep mode, VREGPM = 1 WDT Current — 0.7 2.1 4.7 A 5.0 D023A — 13 18 20 A 1.8 — 22 28 29 A 3.0 D023A — 16 24 25 A 2.3 — 19 30 31 A 3.0 — 20 33 35 A 5.0 D024 — 6.5 9 11 A 3.0 BOR Current D024 — 7.0 10 11 A 3.0 BOR Current — 8.0 12 13 A 5.0 D24A — 0.2 2 4 A 3.0 LPBOR Current D24A — 0.4 2 4 A 3.0 LPBOR Current — 0.5 3 5 A 5.0 — 0.03 0.7 2.7 A 1.8 — 0.04 0.8 3 A 3.0 — 0.2 1.3 3.8 A 2.3 — 0.3 1.4 3.9 A 3.0 D026 D026 — 0.4 1.5 4 A 5.0 D026A* — 250 — — A 1.8 — 250 — — A 3.0 D026A* — 280 — — A 2.3 — 280 — — A 3.0 — 280 — — A 5.0 * † Note 1: 2: 3: FVR Current FVR Current ADC Current (Note 3), No conversion in progress ADC Current (Note 3), No conversion in progress ADC Current (Note 3), Conversion in progress ADC Current (Note 3), Conversion in progress These parameters are characterized but not tested. Data in “Typ” column is at 3.0V, +25°C unless otherwise stated. These parameters are for design guidance only and are not tested. The peripheral current can be determined by subtracting the base IPD current from this limit. Max. values should be used when calculating total current consumption. The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured with the part in Sleep mode, with all I/O pins in high-impedance state and tied to VSS. ADC clock source is FRC. DS40001723D-page 266 2013-2015 Microchip Technology Inc. PIC12(L)F1571/2 TABLE 26-3: POWER-DOWN CURRENTS (IPD)(1,2) (CONTINUED) PIC12LF1571/2 Operating Conditions (unless otherwise stated) Low-Power Sleep Mode PIC12F1571/2 Low-Power Sleep Mode, VREGPM = 1 Param. No. Conditions Min. Typ† Max. +85°C Max. +125°C Units D027 — 4 7 9 A — 4.2 8 10 A 3.0 D027 — 13 20 21 A 2.3 — 14 23 25 A 3.0 — 16 24 26 A 5.0 — 20 35 36 A 1.8 — 21 36 38 A 3.0 — 28 47 48 A 2.3 — 29 51 52 A 3.0 — 31 52 53 A 5.0 Device Characteristics D028A D028A * † Note 1: 2: 3: Note VDD 1.8 Comparator, CxSP = 0 Comparator, CxSP = 0 Comparator, Normal Power, CxSP = 1 (Note 1) Comparator, Normal Power, CxSP = 1, VREGPM = 1 (Note 1) These parameters are characterized but not tested. Data in “Typ” column is at 3.0V, +25°C unless otherwise stated. These parameters are for design guidance only and are not tested. The peripheral current can be determined by subtracting the base IPD current from this limit. Max. values should be used when calculating total current consumption. The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured with the part in Sleep mode, with all I/O pins in high-impedance state and tied to VSS. ADC clock source is FRC. 2013-2015 Microchip Technology Inc. DS40001723D-page 267 PIC12(L)F1571/2 TABLE 26-4: I/O PORTS Standard Operating Conditions (unless otherwise stated) Param. No. Sym. VIL Characteristic Min. Typ† Max. Units — — Conditions — 0.8 V 4.5V VDD 5.5V — 0.15 VDD V 1.8V VDD 4.5V 2.0V VDD 5.5V Input Low Voltage I/O Ports: D030 with TTL Buffer D030A D031 D032 with Schmitt Trigger Buffer — — 0.2 VDD V with I2C Levels — — 0.3 VDD V with SMbus Levels — — 0.8 V — — 0.2 VDD V MCLR VIH 2.7V VDD 5.5V Input High Voltage I/O Ports: D040 2.0 — — V 4.5V VDD 5.5V 0.25 VDD + 0.8 — — V 1.8V VDD 4.5V with Schmitt Trigger Buffer 0.8 VDD — — V 2.0V VDD 5.5V with I2C Levels 0.7 VDD — — V with TTL Buffer D040A D041 with SMbus Levels D042 MCLR IIL D060 MCLR(2) IPUR D080 D090 V — V — ±5 ± 125 nA VSS VPIN VDD, Pin at high-impedance, +85°C — ±5 ± 1000 nA VSS VPIN VDD, Pin at high-impedance, +125°C — ± 50 ± 200 nA VSS VPIN VDD, Pin at high-impedance, +85°C 25 100 200 A VDD = 3.3V, VPIN = VSS 25 140 300 A VDD = 5.0V, VPIN = VSS — — 0.6 V IOL = 8 mA, VDD = 5V IOL = 6 mA, VDD = 3.3V IOL = 1.8 mA, VDD = 1.8V VDD – 0.7 — — V IOH = 3.5 mA, VDD = 5V IOH = 3 mA, VDD = 3.3V IOH = 1 mA, VDD = 1.8V 50 pF Output Low Voltage I/O Ports VOH — — Weak Pull-up Current D070* VOL — Input Leakage Current(1) I/O Ports D061 2.7V VDD 5.5V 2.1 0.8 VDD Output High Voltage I/O Ports Capacitive Loading Specifications on Output Pins D101A* CIO All I/O Pins — — * † These parameters are characterized but not tested. Data in “Typ” column is at 3.0V, +25°C unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: Negative current is defined as current sourced by the pin. 2: The leakage current on the MCLR pin is strongly dependent on the applied voltage level. The specified levels represent normal operating conditions. Higher leakage current may be measured at different input voltages. DS40001723D-page 268 2013-2015 Microchip Technology Inc. PIC12(L)F1571/2 TABLE 26-5: MEMORY PROGRAMMING SPECIFICATIONS Standard Operating Conditions (unless otherwise stated) Param. No. Sym. Characteristic Min. Typ† Max. Units Conditions Program Memory Programming Specifications D110 VIHH Voltage on MCLR/VPP Pin 8.0 — 9.0 V D111 IDDP Supply Current during Programming — — 10 mA D112 VBE VDD for Bulk Erase 2.7 — VDDMAX V D113 VPEW VDD for Write or Row Erase VDDMIN — VDDMAX V D114 IPPPGM Current on MCLR/VPP during Erase/Write — 1.0 — mA D115 IDDPGM Current on VDD during Erase/Write — 5.0 — mA D121 EP Cell Endurance 10K — — E/W (Note 2) Program Flash Memory -40C TA +85C (Note 1) D122 VPRW VDD for Read/Write VDDMIN — VDDMAX V D123 TIW Self-Timed Write Cycle Time — 2 2.5 ms D124 TRETD Characteristic Retention — 40 — Year Provided no other specifications are violated D125 EHEFC High-Endurance Flash Cell 100K — — E/W 0C TA +60°C, lower byte last 128 addresses † Data in “Typ” column is at 3.0V, +25°C unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: Self-write and block erase. 2: Required only if single-supply programming is disabled. 2013-2015 Microchip Technology Inc. DS40001723D-page 269 PIC12(L)F1571/2 TABLE 26-6: THERMAL CHARACTERISTICS Standard Operating Conditions (unless otherwise stated) Param. No. TH01 TH02 Sym. Characteristic JA Thermal Resistance Junction to Ambient JC TH03 TJMAX TH04 PD TH05 Thermal Resistance Junction to Case Maximum Junction Temperature Power Dissipation PINTERNAL Internal Power Dissipation Typ. Units Conditions 56.7 C/W 8-pin DFN 3x3 mm package 89.3 C/W 8-pin PDIP package 149.5 C/W 8-pin SOIC package 39.4 C/W 8-pin UDFN 3x3 mm package 9.0 C/W 8-pin DFN 3x3 mm package 43.1 C/W 8-pin PDIP package 39.9 C/W 8-pin SOIC package 40.3 C/W 8-pin UDFN 3x3 mm package 150 C — W PD = PINTERNAL + PI/O — W PINTERNAL = IDD x VDD(1) TH06 PI/O I/O Power Dissipation — W PI/O = (IOL * VOL) + (IOH * (VDD – VOH)) TH07 PDER Derated Power — W PDER = PDMAX (TJ – TA)/JA(2) Note 1: IDD is current to run the chip alone without driving any load on the output pins. 2: TA = Ambient Temperature; TJ = Junction Temperature. DS40001723D-page 270 2013-2015 Microchip Technology Inc. PIC12(L)F1571/2 26.4 AC Characteristics Timing Parameter Symbology has been created with one of the following formats: 1. TppS2ppS 2. TppS T F Frequency Lowercase letters (pp) and their meanings: pp cc CCP1 ck CLKOUT cs CS di SDIx do SDO dt Data in io I/O PORT mc MCLR Uppercase letters and their meanings: S F Fall H High I Invalid (High-impedance) L Low FIGURE 26-4: T Time osc rd rw sc ss t0 t1 wr CLKIN RD RD or WR SCKx SS T0CKI T1CKI WR P R V Z Period Rise Valid High-impedance LOAD CONDITIONS Rev. 10-000133A 8/1/2013 Load Condition Pin CL VSS Legend: CL=50 pF for all pins 2013-2015 Microchip Technology Inc. DS40001723D-page 271 PIC12(L)F1571/2 FIGURE 26-5: CLOCK TIMING Q4 Q1 Q2 Q3 Q4 Q1 CLKIN OS02 OS04 OS04 OS03 CLKOUT (CLKOUT Mode) Note 1: See Table 26-10. TABLE 26-7: CLOCK OSCILLATOR TIMING REQUIREMENTS Standard Operating Conditions (unless otherwise stated) Param. No. OS01 Sym. FOSC Characteristic External CLKIN Frequency(1) Min. Typ† Max. Units Conditions DC — 0.5 MHz External Clock (ECL) DC — 4 MHz External Clock (ECM) External Clock (ECH) DC — 20 MHz OS02 TOSC External CLKIN Period(1) 50 — ns External Clock (EC) OS03 TCY Instruction Cycle Time(1) 200 TCY DC ns TCY = 4/FOSC * † These parameters are characterized but not tested. Data in “Typ” column is at 3.0V, +25°C unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: Instruction cycle period (TCY) equals four times the input oscillator time base period. All specified values are based on characterization data for that particular oscillator type under standard operating conditions with the device executing code. Exceeding these specified limits may result in an unstable oscillator operation and/or higher than expected current consumption. All devices are tested to operate at “min” values with an external clock applied to the CLKIN pin. When an external clock input is used, the “max” cycle time limit is “DC” (no clock) for all devices. DS40001723D-page 272 2013-2015 Microchip Technology Inc. PIC12(L)F1571/2 TABLE 26-8: OSCILLATOR PARAMETERS Standard Operating Conditions (unless otherwise stated) Param. No. Sym. Characteristic Freq. Tolerance Min. Typ† Max. Units OS08 HFOSC Internal Calibrated HFINTOSC Frequency(1) ±2% — 16.0 — MHz OS09 LFOSC Internal LFINTOSC Frequency — — 31 — kHz OS10* TWARM HFINTOSC Wake-up from Sleep Start-up Time — — 5 15 s LFINTOSC Wake-up from Sleep Start-up Time — — 0.5 — ms Conditions VDD = 3.0V, TA = 25°C (Note 2) * † These parameters are characterized but not tested. Data in “Typ” column is at 3.0V, +25°C unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: To ensure these oscillator frequency tolerances, VDD and VSS must be capacitively decoupled as close to the device as possible. 0.1 F and 0.01 F values in parallel are recommended. 2: See Figure 26-6: “HFINTOSC Frequency Accuracy Over Device VDD and Temperature. HFINTOSC FREQUENCY ACCURACY OVER DEVICE VDD AND TEMPERATURE FIGURE 26-6: +125 ± 5% Temperature (°C) +85 ± 3% +60 ± 2% +25 0 ± 5% -40 1.8 2.5 2.0 3.0 3.5 4.0 4.5 5.0 5.5 VDD (V) TABLE 26-9: Param No. Sym. PLL CLOCK TIMING SPECIFICATIONS (VDD = 2.7V TO 5.5V) Characteristic Min. Typ† Max. Units F10 F11 FOSC Oscillator Frequency Range FSYS On-Chip VCO System Frequency 4 16 — — 8 32 MHz MHz F12 TRC PLL Start-up Time (Lock Time) — — 2 ms CLK CLKOUT Stability (Jitter) -0.25% — +0.25% % F13* Conditions * These parameters are characterized but not tested. † Data in “Typ” column is at 3V, +25C unless otherwise stated. These parameters are for design guidance only and are not tested. 2013-2015 Microchip Technology Inc. DS40001723D-page 273 PIC12(L)F1571/2 FIGURE 26-7: CLKOUT AND I/O TIMING Cycle Write Fetch Read Execute Q4 Q1 Q2 Q3 FOSC OS12 OS11 OS20 OS21 CLKOUT OS19 OS18 OS16 OS13 OS17 I/O pin (Input) OS14 OS15 I/O pin (Output) New Value Old Value OS18, OS19 TABLE 26-10: CLKOUT AND I/O TIMING PARAMETERS Standard Operating Conditions (unless otherwise stated) Param. No. Sym. Characteristic Min. Typ† Max. Units Conditions OS11 TosH2ckL FOSC to CLKOUT(1) — — 70 ns 3.3V VDD 5.0V OS12 TosH2ckH FOSC to CLKOUT(1) — — 72 ns 3.3V VDD 5.0V OS13 TckL2ioV CLKOUT to Port Out Valid(1) — — 20 ns OS14 TioV2ckH Port Input Valid Before CLKOUT(1) TOSC + 200 ns — — ns OS15 TosH2ioV Fosc (Q1 cycle) to Port Out Valid — 50 70* ns 3.3V VDD 5.0V OS16 TosH2ioI Fosc (Q2 cycle) to Port Input Invalid (I/O in setup time) 50 — — ns 3.3V VDD 5.0V OS17 TioV2osH Port Input Valid to Fosc(Q2 cycle) (I/O in setup time) 20 — — ns OS18* TioR Port Output Rise Time — — 40 15 72 32 ns VDD = 1.8V, 3.3V VDD 5.0V OS19* TioF Port Output Fall Time — — 28 15 55 30 ns VDD = 1.8V, 3.3V VDD 5.0V OS20* Tinp INT Pin Input High or Low Time 25 — — ns OS21* Tioc Interrupt-On-Change New Input Level Time 25 — — ns * These parameters are characterized but not tested. † Data in “Typ” column is at 3.0V, +25C unless otherwise stated. Note 1: Measurements are taken in EXTRC mode where CLKOUT output is 4 x TOSC. DS40001723D-page 274 2013-2015 Microchip Technology Inc. PIC12(L)F1571/2 FIGURE 26-8: RESET, WATCHDOG TIMER, OSCILLATOR START-UP TIMER AND POWER-UP TIMER TIMING VDD MCLR 30 Internal POR PWRT Time-out 33 32 OSC Start-up Time Internal Reset(1) Watchdog Timer Reset(1) 34 31 34 I/O Pins Note 1: Asserted low. 2013-2015 Microchip Technology Inc. DS40001723D-page 275 PIC12(L)F1571/2 TABLE 26-11: RESET, WATCHDOG TIMER, OSCILLATOR START-UP TIMER, POWER-UP TIMER AND BROWN-OUT RESET PARAMETERS Standard Operating Conditions (unless otherwise stated) Param. No. Sym. Characteristic Min. Typ† Max. Units Conditions 2 — — s 10 16 27 ms Oscillator Start-up Timer Period(1) — 1024 — TOSC TPWRT Power-up Timer Period 40 65 140 ms 34* TIOZ I/O High-Impedance from MCLR Low or Watchdog Timer Reset — — 2.0 s 35 VBOR Brown-out Reset Voltage(2) 2.55 2.35 1.80 2.70 2.45 1.90 2.85 2.58 2.05 V V V 36* VHYST Brown-out Reset Hysteresis 0 25 60 mV 37* TBORDC Brown-out Reset DC Response Time 1 16 35 s VDD VBOR 38 VLPBOR Low-Power Brown-out Reset Voltage 1.8 2.1 2.5 V LPBOR = 1 30 TMCL 31 TWDTLP Low-Power Watchdog Timer Time-out Period 32 TOST 33* * † Note 1: 2: MCLR Pulse Width (low) VDD = 3.3V-5V, 1:512 prescaler used PWRTE = 0 BORV = 0 BORV = 1 (PIC12F1571/2) BORV = 1 (PIC12LF1571/2) -40°C TA +85°C These parameters are characterized but not tested. Data in “Typ” column is at 3.0V, +25°C unless otherwise stated. These parameters are for design guidance only and are not tested. By design, the Oscillator Start-up Timer (OST) counts the first 1024 cycles, independent of frequency. To ensure these voltage tolerances, VDD and VSS must be capacitively decoupled as close to the device as possible. 0.1 F and 0.01 F values in parallel are recommended. FIGURE 26-9: BROWN-OUT RESET TIMING AND CHARACTERISTICS VDD VBOR and VHYST VBOR (Device in Brown-out Reset) (Device not in Brown-out Reset) 37 Reset (due to BOR) DS40001723D-page 276 33 2013-2015 Microchip Technology Inc. PIC12(L)F1571/2 FIGURE 26-10: TIMER0 AND TIMER1 EXTERNAL CLOCK TIMINGS T0CKI 40 41 42 T1CKI 45 46 49 47 TMR0 or TMR1 TABLE 26-12: TIMER0 AND TIMER1 EXTERNAL CLOCK REQUIREMENTS Standard Operating Conditions (unless otherwise stated) Param. No. 40* Sym. TT0H Characteristic T0CKI High Pulse Width Min. No Prescaler With Prescaler 41* TT0L T0CKI Low Pulse Width No Prescaler With Prescaler Typ† Max. Units 0.5 TCY + 20 — — ns 10 — — ns 0.5 TCY + 20 — — ns 10 — — ns Greater of: 20 or TCY + 40 N — — ns 42* TT0P T0CKI Period 45* TT1H T1CKI High Synchronous, No Prescaler Time Synchronous, with Prescaler 0.5 TCY + 20 — — ns 15 — — ns Asynchronous 30 — — ns Synchronous, No Prescaler 0.5 TCY + 20 — — ns Synchronous, with Prescaler 15 — — ns Asynchronous 30 — — ns Greater of: 30 or TCY + 40 N — — ns TT1L 46* T1CKI Low Time 47* TT1P T1CKI Input Synchronous Period 49* TCKEZTMR1 Delay from External Clock Edge to Timer Increment Asynchronous * † 60 — — ns 2 TOSC — 7 TOSC — Conditions N = Prescale value N = Prescale value Timers in Sync mode These parameters are characterized but not tested. Data in “Typ” column is at 3.0V, +25°C unless otherwise stated. These parameters are for design guidance only and are not tested. 2013-2015 Microchip Technology Inc. DS40001723D-page 277 PIC12(L)F1571/2 TABLE 26-13: ANALOG-TO-DIGITAL CONVERTER (ADC) CHARACTERISTICS(1,2,3) Operating Conditions (unless otherwise stated) VDD = 3.0V, TA = +25°C Param. Sym. No. Characteristic Min. Typ† Max. AD01 NR Resolution — — 10 AD02 EIL Integral Error — ±1 ±1.7 AD03 EDL Differential Error AD04 EOFF Offset Error AD05 EGN AD06 AD07 VAIN Full-Scale Range AD08 ZAIN Recommended Impedance of Analog Voltage Source * † Note 1: 2: 3: 4: Units Conditions bit LSb VREF = 3.0V — ±1 ±1 — ±1 ±2.5 LSb VREF = 3.0V LSb No missing codes, VREF = 3.0V Gain Error — ±1 ±2.0 LSb VREF = 3.0V VREF Reference Voltage 1.8 — VDD V VSS — VREF V — — 10 k VREF = (VRPOS – VRNEG) (Note 4) Can go higher if external 0.01 F capacitor is present on input pin. These parameters are characterized but not tested. Data in “Typ” column is at 3.0V, +25°C unless otherwise stated. These parameters are for design guidance only and are not tested. Total absolute error includes integral, differential, offset and gain errors. The ADC conversion result never decreases with an increase in the input voltage and has no missing codes. See Section 27.0 “DC and AC Characteristics Graphs and Charts” for operating characterization. ADC VREF is selected by the ADPREF<0> bit. DS40001723D-page 278 2013-2015 Microchip Technology Inc. PIC12(L)F1571/2 FIGURE 26-11: ADC CONVERSION TIMING (ADC CLOCK FOSC-BASED) BSF ADCON0, GO AD133 1 TCY AD131 Q4 AD130 ADC_clk 9 ADC Data 8 7 6 3 2 1 0 NEW_DATA OLD_DATA ADRES 1 TCY ADIF GO Sample DONE Sampling Stopped AD132 FIGURE 26-12: ADC CONVERSION TIMING (ADC CLOCK FROM FRC) BSF ADCON0, GO AD133 1 TCY AD131 Q4 AD130 ADC_clk 9 ADC Data 8 7 6 OLD_DATA ADRES 2 1 0 NEW_DATA 1 TCY ADIF GO Sample 3 DONE AD132 Sampling Stopped Note 1: If the ADC clock source is selected as FRC, a time of TCY is added before the ADC clock starts; this allows the SLEEP instruction to be executed. 2013-2015 Microchip Technology Inc. DS40001723D-page 279 PIC12(L)F1571/2 TABLE 26-14: ADC CONVERSION REQUIREMENTS Standard Operating Conditions (unless otherwise stated) Param. Sym. No. AD130* TAD AD131 TCNV Characteristic Min. Typ† Max. Units Conditions ADC Clock Period (TADC) 1.0 — 6.0 s FOSC-based ADC Internal FRC Oscillator Period (TFRC) 1.0 2.0 6.0 s ADCS<2:0> = x11 (ADC FRC mode) Conversion Time (not including Acquisition Time)(1) — 11 — TAD Set GO/DONE bit to conversion complete s AD132* TACQ Acquisition Time — 5.0 — AD133* THCD Holding Capacitor Disconnect Time — — 1/2 TAD 1/2 TAD + 1TCY — — FOSC-based, ADCS<2:0> = x11 (ADC FRC mode) * † These parameters are characterized but not tested. Data in “Typ” column is at 3.0V, +25°C unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: The ADRES register may be read on the following TCY cycle. DS40001723D-page 280 2013-2015 Microchip Technology Inc. PIC12(L)F1571/2 TABLE 26-15: COMPARATOR SPECIFICATIONS(1) Operating Conditions (unless otherwise stated) VDD = 3.0V, TA = +25°C Param. No. CM01 Sym. Characteristics VIOFF Input Offset Voltage Min. Typ. Max. Units — ±7.5 ±60 mV Comments CxSP = 1, VICM = VDD/2 CM02 VICM Input Common-Mode Voltage 0 — VDD V CM03 CMRR Common-Mode Rejection Ration — 50 — dB CM04A TRESP(2) Response Time Rising Edge — 400 800 ns CxSP = 1 Response Time Falling Edge — 200 400 ns CxSP = 1 CM04B CM04C Response Time Rising Edge — 1200 — ns CxSP = 0 CM04D Response Time Falling Edge — 550 — ns CxSP = 0 Comparator Mode Change to Output Valid — — 10 s — 25 — mV CM05* TMC2OV CM06 CHYSTER Comparator Hysteresis * Note 1: 2: CxHYS = 1, CxSP = 1 These parameters are characterized but not tested. See Section 27.0 “DC and AC Characteristics Graphs and Charts” for operating characterization. Response time measured with one comparator input at VDD/2, while the other input transitions from VSS to VDD. TABLE 26-16: DIGITAL-TO-ANALOG CONVERTER (DAC) SPECIFICATIONS(1) Operating Conditions (unless otherwise stated) VDD = 3.0V, TA = +25°C Param. No. Sym. Characteristics Min. Typ. Max. Units — VDD/32 — V DAC01* CLSB Step Size DAC02* CACC Absolute Accuracy — — 1/2 LSb DAC03* CR Unit Resistor Value (R) — 5K — CST Time(2) — — 10 s DAC04* * Note 1: 2: Settling Comments These parameters are characterized but not tested. See Section 27.0 “DC and AC Characteristics Graphs and Charts” for operating characterization. Settling time measured while DACR<4:0> transitions from ‘0000’ to ‘1111’. 2013-2015 Microchip Technology Inc. DS40001723D-page 281 PIC12(L)F1571/2 FIGURE 26-13: USART SYNCHRONOUS TRANSMISSION (MASTER/SLAVE) TIMING CK US121 US121 DT US122 US120 Note: Refer to Figure 26-4 for load conditions. TABLE 26-17: USART SYNCHRONOUS TRANSMISSION REQUIREMENTS Standard Operating Conditions (unless otherwise stated) Param. No. US120 US121 US122 Symbol TCKH2DTV TCKRF TDTRF FIGURE 26-14: Characteristic Min. Max. Units Conditions SYNC XMIT (Master and Slave) Clock High to Data-Out Valid — 80 ns 3.0V VDD 5.5V — 100 ns 1.8V VDD 5.5V Clock Out Rise Time and Fall Time (Master mode) — 45 ns 3.0V VDD 5.5V — 50 ns 1.8V VDD 5.5V Data-Out Rise Time and Fall Time — 45 ns 3.0V VDD 5.5V — 50 ns 1.8V VDD 5.5V USART SYNCHRONOUS RECEIVE (MASTER/SLAVE) TIMING CK US125 DT US126 Note: Refer to Figure 26-4 for load conditions. TABLE 26-18: USART SYNCHRONOUS RECEIVE REQUIREMENTS Standard Operating Conditions (unless otherwise stated) Param. No. Symbol Characteristic US125 TDTV2CKL SYNC RCV (Master and Slave) Data-Hold before CK (DT hold time) US126 TCKL2DTL Data-Hold after CK (DT hold time) DS40001723D-page 282 Min. Max. Units 10 — ns 15 — ns Conditions 2013-2015 Microchip Technology Inc. PIC12(L)F1571/2 27.0 DC AND AC CHARACTERISTICS GRAPHS AND CHARTS The graphs and tables provided in this section are for design guidance and are not tested. In some graphs or tables, the data presented is outside specified operating range (i.e., outside specified VDD range). This is for information only and devices are ensured to operate properly only within the specified range. Note: The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore, outside the warranted range. “Typical” represents the mean of the distribution at +25C. “MAXIMUM”, “Max.”, “MINIMUM” or “Min.” represents (mean + 3) or (mean – 3) respectively, where is a standard deviation over each temperature range. 2013-2015 Microchip Technology Inc. DS40001723D-page 283 PIC12(L)F1571/2 FIGURE 27-1: IDD, EC OSCILLATOR, LOW-POWER MODE, FOSC = 32 kHz, PIC12LF1571/2 ONLY 6.0 5.5 Max. Max: 85°C + 3ı Typical: 25°C 5.0 4.5 Typical IDD (µA) 4.0 3.5 3.0 2.5 2.0 1.5 1.0 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6 3.8 VDD (V) IDD, EC OSCILLATOR, LOW-POWER MODE, FOSC = 32 kHz, PIC12F1571/2 ONLY FIGURE 27-2: 25 Max: 85°C + 3ı Typical: 25°C 20 Max. IDD (µA) Typical 15 10 5 0 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 VDD (V) DS40001723D-page 284 2013-2015 Microchip Technology Inc. PIC12(L)F1571/2 FIGURE 27-3: IDD, EC OSCILLATOR, LOW-POWER MODE, FOSC = 500 kHz, PIC12LF1571/2 ONLY 40 Max: 85°C + 3ı Typical: 25°C 35 Max. Typical IDD (µA) 30 25 20 15 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6 3.8 VDD (V) FIGURE 27-4: IDD, EC OSCILLATOR, LOW-POWER MODE, FOSC = 500 kHz, PIC12F1571/2 ONLY 50 Max. Max: 85°C + 3ı Typical: 25°C 45 IDD (µA) 40 Typical 35 30 25 20 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 VDD (V) 2013-2015 Microchip Technology Inc. DS40001723D-page 285 PIC12(L)F1571/2 FIGURE 27-5: IDD TYPICAL, EC OSCILLATOR, MEDIUM POWER MODE, PIC12LF1571/2 ONLY 300 Typical: 25°C 250 4 MHz IDD (µA) 200 150 100 1 MHz 50 0 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6 3.8 VDD (V) IDD MAXIMUM, EC OSCILLATOR, MEDIUM POWER MODE, PIC12LF1571/2 ONLY FIGURE 27-6: 300 4 MHz Max: 85°C + 3ı 250 IDD (µA) 200 150 100 1 MHz 50 0 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6 3.8 VDD (V) DS40001723D-page 286 2013-2015 Microchip Technology Inc. PIC12(L)F1571/2 FIGURE 27-7: IDD TYPICAL, EC OSCILLATOR, MEDIUM POWER MODE, PIC12F1571/2 ONLY 350 4 MHz Typical: 25°C 300 IDD (µA) 250 200 150 1 MHz 100 50 0 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 VDD (V) FIGURE 27-8: IDD MAXIMUM, EC OSCILLATOR, MEDIUM POWER MODE, PIC12F1571/2 ONLY 400 350 4 MHz Max: 85°C + 3ı 300 IDD (µA) 250 200 1 MHz 150 100 50 0 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 VDD (V) 2013-2015 Microchip Technology Inc. DS40001723D-page 287 PIC12(L)F1571/2 FIGURE 27-9: IDD TYPICAL, EC OSCILLATOR, HIGH-POWER MODE, PIC12LF1571/2 ONLY 2.5 Typical: 25°C IDD (mA) 2.0 32 MHz 1.5 16 MHz 1.0 8 MHz 0.5 0.0 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6 3.8 VDD (V) IDD MAXIMUM, EC OSCILLATOR, HIGH-POWER MODE, PIC12LF1571/2 ONLY FIGURE 27-10: 2.5 Max: 85°C + 3ı 32 MHz IDD (mA) 2.0 1.5 16 MHz 1.0 8 MHz 0.5 0.0 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6 3.8 VDD (V) DS40001723D-page 288 2013-2015 Microchip Technology Inc. PIC12(L)F1571/2 FIGURE 27-11: IDD TYPICAL, EC OSCILLATOR, HIGH-POWER MODE, PIC12F1571/2 ONLY 2.5 Typical: 25°C 2.0 32 MHz IDD (mA) 1.5 16 MHz 1.0 8 MHz 0.5 0.0 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 VDD (V) FIGURE 27-12: IDD MAXIMUM, EC OSCILLATOR, HIGH-POWER MODE, PIC12F1571/2 ONLY 2.5 Max: 85°C + 3ı 32 MHz IDD (mA) 2.0 1.5 16 MHz 1.0 8 MHz 0.5 0.0 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 VDD (V) 2013-2015 Microchip Technology Inc. DS40001723D-page 289 PIC12(L)F1571/2 FIGURE 27-13: IDD, LFINTOSC, FOSC = 31 kHz, PIC12LF1571/2 ONLY 10 Max. 9 Max: 85°C + 3ı Typical: 25°C Typical IDD (µA) 8 7 6 5 4 3 2 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6 3.8 VDD (V) FIGURE 27-14: IDD, LFINTOSC, FOSC = 31 kHz, PIC12F1571/2 ONLY 25 Max: 85°C + 3ı Typical: 25°C 20 Max. IDD (µA) Typical 15 10 5 0 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 VDD (V) DS40001723D-page 290 2013-2015 Microchip Technology Inc. PIC12(L)F1571/2 FIGURE 27-15: IDD, MFINTOSC, FOSC = 500 kHz, PIC12LF1571/2 ONLY 170 160 Max: 85°C + 3ı Typical: 25°C Max. IDD (µA) 150 140 Typical 130 120 110 100 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6 3.8 VDD (V) FIGURE 27-16: IDD, MFINTOSC, FOSC = 500 kHz, PIC12F1571/2 ONLY 260 Max. Max: 85°C + 3ı Typical: 25°C 240 Typical 220 IDD (µA) 200 180 160 140 120 100 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 VDD (V) 2013-2015 Microchip Technology Inc. DS40001723D-page 291 PIC12(L)F1571/2 FIGURE 27-17: IDD TYPICAL, HFINTOSC, PIC12LF1571/2 ONLY 1.4 16 MHz Typical: 25°C 1.2 IDD (mA) 1.0 8 MHz 0.8 4 MHz 0.6 2 MHz 0.4 1 MHz 0.2 0.0 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6 3.8 VDD (V) IDD MAXIMUM, HFINTOSC, PIC12LF1571/2 ONLY FIGURE 27-18: 1.4 16 MHz Max: 85°C + 3ı 1.2 1.0 IDD (mA) 8 MHz 0.8 4 MHz 2 MHz 0.6 1 MHz 0.4 0.2 0.0 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6 3.8 VDD (V) DS40001723D-page 292 2013-2015 Microchip Technology Inc. PIC12(L)F1571/2 FIGURE 27-19: IDD TYPICAL, HFINTOSC, PIC12F1571/2 ONLY 1.4 16 MHz Typical: 25°C 1.2 1.0 IDD (mA) 8 MHz 0.8 4 MHz 2 MHz 0.6 1 MHz 0.4 0.2 0.0 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 VDD (V) FIGURE 27-20: IDD MAXIMUM, HFINTOSC, PIC12F1571/2 ONLY 1.6 1.4 16 MHz Max: 85°C + 3ı 1.2 IDD (mA) 1.0 8 MHz 0.8 4 MHz 2 MHz 0.6 1 MHz 0.4 0.2 0.0 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 VDD (V) 2013-2015 Microchip Technology Inc. DS40001723D-page 293 PIC12(L)F1571/2 FIGURE 27-21: IPD BASE, LOW-POWER SLEEP MODE, PIC12LF1571/2 ONLY 350 300 Max: 85°C + 3ı Typical: 25°C Max. IPD (nA (nA) 250 200 150 100 Typical 50 0 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6 3.8 VDD (V) IPD BASE, LOW-POWER SLEEP MODE, PIC12F1571/2 ONLY FIGURE 27-22: 0.8 0.7 Max: 85°C + 3ı Typical: 25°C IPD (µA (µA) 0.6 Max 0.5 0.4 0.3 Typical 0.2 0.1 0.0 20 2.0 2 2.5 5 3 3.0 0 3 3.5 5 4 4.0 0 4 4.5 5 5 5.0 0 5 5.5 5 6 6.0 0 VDD (V) DS40001723D-page 294 2013-2015 Microchip Technology Inc. PIC12(L)F1571/2 FIGURE 27-23: IPD, WATCHDOG TIMER (WDT), PIC12LF1571/2 ONLY 1.0 0.9 Max: 85°C + 3ı Typical: 25°C 0.8 Max. IPD (µA) 0.7 0.6 Typical 0.5 04 0.4 0.3 0.2 0.1 0.0 16 1.6 1 1.8 8 2 2.0 0 2 2.2 2 2 2.4 4 2 2.6 6 2 2.8 8 3 3.0 0 3 3.2 2 3 3.4 4 3 3.6 6 3 3.8 8 VDD (V) FIGURE 27-24: IPD, WATCHDOG TIMER (WDT), PIC12F1571/2 ONLY 1.6 1.4 Max: 85°C + 3ı Typical: 25°C 1.2 Max. IPD (µA (µA) 1.0 0.8 Typical 0.6 0.4 0.2 0.0 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 VDD (V) 2013-2015 Microchip Technology Inc. DS40001723D-page 295 PIC12(L)F1571/2 FIGURE 27-25: IPD, FIXED VOLTAGE REFERENCE (FVR), PIC12LF1571/2 ONLY 28 Max: 85°C + 3ı Typical: 25°C 26 24 Max. IPD (uA) 22 20 18 T i l Typical 16 14 12 10 16 1.6 1 1.8 8 2 2.0 0 2 2.2 2 2 2.4 4 2 2.6 6 2 2.8 8 3 3.0 0 3 3.2 2 3 3.4 4 3 3.6 6 3 3.8 8 VDD (V) FIGURE 27-26: IPD, FIXED VOLTAGE REFERENCE (FVR), PIC12F1571/2 ONLY 24 22 Max. 20 IPD (uA (uA) Typical 18 16 14 Max: 85°C + 3ı Typical: 25 C 25°C 12 10 20 2.0 2 5 2.5 3 0 3.0 3 5 3.5 4 0 4.0 4 5 4.5 5 0 5.0 5 5 5.5 6 0 6.0 VDD (V) DS40001723D-page 296 2013-2015 Microchip Technology Inc. PIC12(L)F1571/2 FIGURE 27-27: IPD, BROWN-OUT RESET (BOR), BORV = 1, PIC12LF1571/2 ONLY 9 8.5 Max: 85°C + 3ı Typical: 25°C 8 Max. IPD ((uA) 7.5 7 Typical 6.5 6 5.5 5 4.5 24 2.4 2 2.5 5 2 2.6 6 2 2.7 7 2 2.8 8 2 2.9 9 3 3.0 0 3 3.1 1 3 3.2 2 3 3.3 3 3 3.4 4 3 3.5 5 3 3.6 6 3 3.7 7 5 4 5.4 5 6 5.6 VDD (V) IPD, BROWN-OUT RESET (BOR), BORV = 1, PIC12F1571/2 ONLY FIGURE 27-28: 12 11 Max: 85°C + 3ı Typical: 25°C 10 Max. IPD (uA) 9 8 Typical 7 6 5 4 2 8 2.8 3 0 3.0 3 2 3.2 3 4 3.4 3 6 3.6 3 8 3.8 4 0 4.0 4 2 4.2 4 4 4.4 4 6 4.6 4 8 4.8 5 0 5.0 5 2 5.2 VDD (V) 2013-2015 Microchip Technology Inc. DS40001723D-page 297 PIC12(L)F1571/2 FIGURE 27-29: IPD, LOW-POWER BROWN-OUT RESET (LPBOR = 0), PIC12LF1571/2 ONLY 1.8 16 1.6 Max: 85°C + 3ı Typical: 25°C 1.4 Max. IPD (uA (uA) 1.2 1 0.8 0.6 0.4 Typical 0.2 0 2.4 2.5 2.6 2.7 2.8 2.9 3.0 3.1 3.2 3.3 3.4 3.5 3.6 3.7 VDD (V) IPD, LOW-POWER BROWN-OUT RESET (LPBOR = 0), PIC12F1571/2 ONLY FIGURE 27-30: 1.8 Max: 85°C + 3ı Typical: 25°C 1.6 Max. 1.4 IDD (µA (µA) 1.2 1.0 0.8 0.6 Typical 0.4 0.2 0.0 28 2.8 3 3.0 0 3 3.2 2 3 3.4 4 3 3.6 6 3 3.8 8 4 4.0 0 4 4.2 2 4 4.4 4 4 4.6 6 4 4.8 8 5 5.0 0 5 5.2 2 5 5.4 4 5 5.6 6 VDD (V) DS40001723D-page 298 2013-2015 Microchip Technology Inc. PIC12(L)F1571/2 FIGURE 27-31: IPD, ADC NON-CONVERTING, PIC12LF1571/2 ONLY 500 450 Max: 85°C + 3ı Typical: 25°C 400 Max. 350 IPD (µA) 300 250 200 150 100 Typical 50 0 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6 3.8 VDD (V) FIGURE 27-32: IPD, ADC NON-CONVERTING, PIC12F1571/2 ONLY 1.4 Max: 85°C + 3ı Typical: 25°C 1.2 Max. IDD (µA) 1.0 0.8 0.6 0.4 Typical 0.2 0.0 15 1.5 2 0 2.0 2 5 2.5 3 0 3.0 3 5 3.5 4 0 4.0 4 5 4.5 5 0 5.0 5 5 5.5 6 0 6.0 VDD (V) 2013-2015 Microchip Technology Inc. DS40001723D-page 299 PIC12(L)F1571/2 FIGURE 27-33: IPD, COMPARATOR, LOW-POWER MODE (CxSP = 0), PIC12F1571/2 ONLY 22 Max: 85°C + 3ı Typical: 25°C 20 Max. 18 Typical IPD (µ (µA) 16 14 12 10 8 6 4 2 0 2.0 2 5 2.5 3 0 3.0 3 5 3.5 4 0 4.0 4 5 4.5 5 0 5.0 5 5 5.5 6 0 6.0 VDD (V) IPD, COMPARATOR, NORMAL POWER MODE (CxSP = 1), PIC12LF1571/2 ONLY FIGURE 27-34: 32 Max: -40°C + 3ı Typical: 25°C 30 28 Max. IPD (µA (µA) 26 24 22 Typical 20 18 16 14 12 16 1.6 1 1.8 8 2 2.0 0 2 2.2 2 2 2.4 4 2 2.6 6 2 2.8 8 3 3.0 0 3 3.2 2 3 3.4 4 3 3.6 6 3 3.8 8 VDD (V) DS40001723D-page 300 2013-2015 Microchip Technology Inc. PIC12(L)F1571/2 FIGURE 27-35: IPD, COMPARATOR, NORMAL POWER MODE (CxSP = 1), PIC12F1571/2 ONLY 45 Max: -40°C 40°C + 3ı Typical: 25°C 40 Max. 35 IPD (µA (µA) Typical 30 25 20 15 10 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 VDD (V) 2013-2015 Microchip Technology Inc. DS40001723D-page 301 PIC12(L)F1571/2 FIGURE 27-36: IPD, PWM, HFINTOSC MODE (16 MHz), PIC12LF1571/2 ONLY 1100 Max: 85°C + 3ı Typical: 25°C 1000 900 Max. IPD (µA (µA) 800 700 Typical 600 500 400 300 200 16 1.6 1 8 1.8 2 0 2.0 2 2 2.2 2 4 2.4 2 6 2.6 2 8 2.8 3 0 3.0 3 2 3.2 3 4 3.4 3 6 3.6 3 8 3.8 VDD (V) FIGURE 27-37: IPD, PWM, HFINTOSC MODE (16 MHz), PIC12F1571/2 ONLY 1,200 Max: 85°C + 3ı Typical: 25°C 1,100 Max. 1,000 Typical IPD (µA (µA) 900 800 700 600 500 400 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 VDD (V) DS40001723D-page 302 2013-2015 Microchip Technology Inc. PIC12(L)F1571/2 FIGURE 27-38: FVR STABILIZATION PERIOD 60 Max: Typical + 3ı Typical: statistical mean @ 25°C 50 Max. Time (us) 40 Typical 30 20 Note: The FVR Stabilization Period applies when: 1) coming out of RESET or exiting Sleep mode for PIC12/16LFxxxx devices. 2) when exiting sleep mode with VREGPM = 1 for PIC12/16Fxxxx devices In all other cases, the FVR is stable when released from RESET. 10 0 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6 3.8 VDD (V) 2013-2015 Microchip Technology Inc. DS40001723D-page 303 PIC12(L)F1571/2 NOTES: DS40001723D-page 304 2013-2015 Microchip Technology Inc. PIC12(L)F1571/2 28.0 DEVELOPMENT SUPPORT The PIC® microcontrollers (MCU) and dsPIC® digital signal controllers (DSC) are supported with a full range of software and hardware development tools: • Integrated Development Environment - MPLAB® X IDE Software • Compilers/Assemblers/Linkers - MPLAB XC Compiler - MPASMTM Assembler - MPLINKTM Object Linker/ MPLIBTM Object Librarian - MPLAB Assembler/Linker/Librarian for Various Device Families • Simulators - MPLAB X SIM Software Simulator • Emulators - MPLAB REAL ICE™ In-Circuit Emulator • In-Circuit Debuggers/Programmers - MPLAB ICD 3 - PICkit™ 3 • Device Programmers - MPLAB PM3 Device Programmer • Low-Cost Demonstration/Development Boards, Evaluation Kits and Starter Kits • Third-party development tools 28.1 MPLAB X Integrated Development Environment Software The MPLAB X IDE is a single, unified graphical user interface for Microchip and third-party software, and hardware development tool that runs on Windows®, Linux and Mac OS® X. Based on the NetBeans IDE, MPLAB X IDE is an entirely new IDE with a host of free software components and plug-ins for highperformance application development and debugging. Moving between tools and upgrading from software simulators to hardware debugging and programming tools is simple with the seamless user interface. With complete project management, visual call graphs, a configurable watch window and a feature-rich editor that includes code completion and context menus, MPLAB X IDE is flexible and friendly enough for new users. With the ability to support multiple tools on multiple projects with simultaneous debugging, MPLAB X IDE is also suitable for the needs of experienced users. Feature-Rich Editor: • Color syntax highlighting • Smart code completion makes suggestions and provides hints as you type • Automatic code formatting based on user-defined rules • Live parsing User-Friendly, Customizable Interface: • Fully customizable interface: toolbars, toolbar buttons, windows, window placement, etc. • Call graph window Project-Based Workspaces: • • • • Multiple projects Multiple tools Multiple configurations Simultaneous debugging sessions File History and Bug Tracking: • Local file history feature • Built-in support for Bugzilla issue tracker 2013-2015 Microchip Technology Inc. DS40001723D-page 305 PIC12(L)F1571/2 28.2 MPLAB XC Compilers The MPLAB XC Compilers are complete ANSI C compilers for all of Microchip’s 8, 16, and 32-bit MCU and DSC devices. These compilers provide powerful integration capabilities, superior code optimization and ease of use. MPLAB XC Compilers run on Windows, Linux or MAC OS X. For easy source level debugging, the compilers provide debug information that is optimized to the MPLAB X IDE. The free MPLAB XC Compiler editions support all devices and commands, with no time or memory restrictions, and offer sufficient code optimization for most applications. MPLAB XC Compilers include an assembler, linker and utilities. The assembler generates relocatable object files that can then be archived or linked with other relocatable object files and archives to create an executable file. MPLAB XC Compiler uses the assembler to produce its object file. Notable features of the assembler include: • • • • • • Support for the entire device instruction set Support for fixed-point and floating-point data Command-line interface Rich directive set Flexible macro language MPLAB X IDE compatibility 28.3 MPASM Assembler The MPASM Assembler is a full-featured, universal macro assembler for PIC10/12/16/18 MCUs. The MPASM Assembler generates relocatable object files for the MPLINK Object Linker, Intel® standard HEX files, MAP files to detail memory usage and symbol reference, absolute LST files that contain source lines and generated machine code, and COFF files for debugging. The MPASM Assembler features include: 28.4 MPLINK Object Linker/ MPLIB Object Librarian The MPLINK Object Linker combines relocatable objects created by the MPASM Assembler. It can link relocatable objects from precompiled libraries, using directives from a linker script. The MPLIB Object Librarian manages the creation and modification of library files of precompiled code. When a routine from a library is called from a source file, only the modules that contain that routine will be linked in with the application. This allows large libraries to be used efficiently in many different applications. The object linker/library features include: • Efficient linking of single libraries instead of many smaller files • Enhanced code maintainability by grouping related modules together • Flexible creation of libraries with easy module listing, replacement, deletion and extraction 28.5 MPLAB Assembler, Linker and Librarian for Various Device Families MPLAB Assembler produces relocatable machine code from symbolic assembly language for PIC24, PIC32 and dsPIC DSC devices. MPLAB XC Compiler uses the assembler to produce its object file. The assembler generates relocatable object files that can then be archived or linked with other relocatable object files and archives to create an executable file. Notable features of the assembler include: • • • • • • Support for the entire device instruction set Support for fixed-point and floating-point data Command-line interface Rich directive set Flexible macro language MPLAB X IDE compatibility • Integration into MPLAB X IDE projects • User-defined macros to streamline assembly code • Conditional assembly for multipurpose source files • Directives that allow complete control over the assembly process DS40001723D-page 306 2013-2015 Microchip Technology Inc. PIC12(L)F1571/2 28.6 MPLAB X SIM Software Simulator The MPLAB X SIM Software Simulator allows code development in a PC-hosted environment by simulating the PIC MCUs and dsPIC DSCs on an instruction level. On any given instruction, the data areas can be examined or modified and stimuli can be applied from a comprehensive stimulus controller. Registers can be logged to files for further run-time analysis. The trace buffer and logic analyzer display extend the power of the simulator to record and track program execution, actions on I/O, most peripherals and internal registers. The MPLAB X SIM Software Simulator fully supports symbolic debugging using the MPLAB XC Compilers, and the MPASM and MPLAB Assemblers. The software simulator offers the flexibility to develop and debug code outside of the hardware laboratory environment, making it an excellent, economical software development tool. 28.7 MPLAB REAL ICE In-Circuit Emulator System The MPLAB REAL ICE In-Circuit Emulator System is Microchip’s next generation high-speed emulator for Microchip Flash DSC and MCU devices. It debugs and programs all 8, 16 and 32-bit MCU, and DSC devices with the easy-to-use, powerful graphical user interface of the MPLAB X IDE. The emulator is connected to the design engineer’s PC using a high-speed USB 2.0 interface and is connected to the target with either a connector compatible with in-circuit debugger systems (RJ-11) or with the new high-speed, noise tolerant, LowVoltage Differential Signal (LVDS) interconnection (CAT5). The emulator is field upgradable through future firmware downloads in MPLAB X IDE. MPLAB REAL ICE offers significant advantages over competitive emulators including full-speed emulation, run-time variable watches, trace analysis, complex breakpoints, logic probes, a ruggedized probe interface and long (up to three meters) interconnection cables. 2013-2015 Microchip Technology Inc. 28.8 MPLAB ICD 3 In-Circuit Debugger System The MPLAB ICD 3 In-Circuit Debugger System is Microchip’s most cost-effective, high-speed hardware debugger/programmer for Microchip Flash DSC and MCU devices. It debugs and programs PIC Flash microcontrollers and dsPIC DSCs with the powerful, yet easy-to-use graphical user interface of the MPLAB IDE. The MPLAB ICD 3 In-Circuit Debugger probe is connected to the design engineer’s PC using a highspeed USB 2.0 interface and is connected to the target with a connector compatible with the MPLAB ICD 2 or MPLAB REAL ICE systems (RJ-11). MPLAB ICD 3 supports all MPLAB ICD 2 headers. 28.9 PICkit 3 In-Circuit Debugger/ Programmer The MPLAB PICkit 3 allows debugging and programming of PIC and dsPIC Flash microcontrollers at a most affordable price point using the powerful graphical user interface of the MPLAB IDE. The MPLAB PICkit 3 is connected to the design engineer’s PC using a fullspeed USB interface and can be connected to the target via a Microchip debug (RJ-11) connector (compatible with MPLAB ICD 3 and MPLAB REAL ICE). The connector uses two device I/O pins and the Reset line to implement in-circuit debugging and In-Circuit Serial Programming™ (ICSP™). 28.10 MPLAB PM3 Device Programmer The MPLAB PM3 Device Programmer is a universal, CE compliant device programmer with programmable voltage verification at VDDMIN and VDDMAX for maximum reliability. It features a large LCD display (128 x 64) for menus and error messages, and a modular, detachable socket assembly to support various package types. The ICSP cable assembly is included as a standard item. In Stand-Alone mode, the MPLAB PM3 Device Programmer can read, verify and program PIC devices without a PC connection. It can also set code protection in this mode. The MPLAB PM3 connects to the host PC via an RS-232 or USB cable. The MPLAB PM3 has high-speed communications and optimized algorithms for quick programming of large memory devices, and incorporates an MMC card for file storage and data applications. DS40001723D-page 307 PIC12(L)F1571/2 28.11 Demonstration/Development Boards, Evaluation Kits, and Starter Kits A wide variety of demonstration, development and evaluation boards for various PIC MCUs and dsPIC DSCs allows quick application development on fully functional systems. Most boards include prototyping areas for adding custom circuitry and provide application firmware and source code for examination and modification. The boards support a variety of features, including LEDs, temperature sensors, switches, speakers, RS-232 interfaces, LCD displays, potentiometers and additional EEPROM memory. 28.12 Third-Party Development Tools Microchip also offers a great collection of tools from third-party vendors. These tools are carefully selected to offer good value and unique functionality. • Device Programmers and Gang Programmers from companies, such as SoftLog and CCS • Software Tools from companies, such as Gimpel and Trace Systems • Protocol Analyzers from companies, such as Saleae and Total Phase • Demonstration Boards from companies, such as MikroElektronika, Digilent® and Olimex • Embedded Ethernet Solutions from companies, such as EZ Web Lynx, WIZnet and IPLogika® The demonstration and development boards can be used in teaching environments, for prototyping custom circuits and for learning about various microcontroller applications. In addition to the PICDEM™ and dsPICDEM™ demonstration/development board series of circuits, Microchip has a line of evaluation kits and demonstration software for analog filter design, KEELOQ® security ICs, CAN, IrDA®, PowerSmart battery management, SEEVAL® evaluation system, Sigma-Delta ADC, flow rate sensing, plus many more. Also available are starter kits that contain everything needed to experience the specified device. This usually includes a single application and debug capability, all on one board. Check the Microchip web page (www.microchip.com) for the complete list of demonstration, development and evaluation kits. DS40001723D-page 308 2013-2015 Microchip Technology Inc. PIC12(L)F1571/2 29.0 PACKAGING INFORMATION 29.1 Package Marking Information 8-Lead PDIP (300 mil) XXXXXXXX XXXXXNNN YYWW 8-Lead SOIC (3.90 mm) NNN Legend: XX...X Y YY WW NNN e3 * Note: Example 12F1571 E/Pe3 017 1310 Example 12F1571 E/SN1310 017 Customer-specific information Year code (last digit of calendar year) Year code (last 2 digits of calendar year) Week code (week of January 1 is week ‘01’) Alphanumeric traceability code Pb-free JEDEC® designator for Matte Tin (Sn) This package is Pb-free. The Pb-free JEDEC designator ( e3 ) can be found on the outer packaging for this package. In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. 2013-2015 Microchip Technology Inc. DS40001723D-page 309 PIC12(L)F1571/2 Package Marking Information (Continued) 8-Lead MSOP (3x3 mm) Example L1571I 310017 8-Lead DFN (3x3x0.9 mm) 8-Lead UDFN (3x3x0.5 mm) XXXX YYWW NNN PIN 1 DS40001723D-page 310 Example MFQ0 1312 017 PIN 1 2013-2015 Microchip Technology Inc. PIC12(L)F1571/2 TABLE 29-1: 8-LEAD 3x3x0.9 DFN (MF) TOP MARKING Part Number Marking TABLE 29-2: 8-LEAD 3x3x0.5 UDFN (RF) TOP MARKING Part Number Marking PIC12F1571-E/MF MFY0/YYWW/NNN PIC12F1571-E/MF MFY0/YYWW/NNN PIC12F1572-E/MF MGA0/YYWW/NNN PIC12F1572-E/MF MGA0/YYWW/NNN PIC12F1571-I/MF MFZ0 PIC12F1571-I/MF MFZ0 PIC12F1572-I/MF MGB0 PIC12F1572-I/MF MGB0 PIC12LF1571-E/MF MGC0 PIC12LF1571-E/MF MGC0 PIC12LF1572-E/MF MGE0 PIC12LF1572-E/MF MGE0 PIC12LF1571-I/MF MGD0 PIC12LF1571-I/MF MGD0 PIC12LF1572-I/MF MGF0 PIC12LF1572-I/MF MGF0 2013-2015 Microchip Technology Inc. DS40001723D-page 311 PIC12(L)F1571/2 29.2 Package Details The following sections give the technical details of the packages. 8-Lead Plastic Dual In-Line (P) - 300 mil Body [PDIP] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging D A N B E1 NOTE 1 1 2 TOP VIEW E C A2 A PLANE L c A1 e eB 8X b1 8X b .010 C SIDE VIEW END VIEW Microchip Technology Drawing No. C04-018D Sheet 1 of 2 DS40001723D-page 312 2013-2015 Microchip Technology Inc. PIC12(L)F1571/2 8-Lead Plastic Dual In-Line (P) - 300 mil Body [PDIP] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging ALTERNATE LEAD DESIGN (VENDOR DEPENDENT) DATUM A DATUM A b b e 2 e 2 e Units Dimension Limits Number of Pins N e Pitch Top to Seating Plane A Molded Package Thickness A2 Base to Seating Plane A1 Shoulder to Shoulder Width E Molded Package Width E1 Overall Length D Tip to Seating Plane L c Lead Thickness Upper Lead Width b1 b Lower Lead Width Overall Row Spacing eB § e MIN .115 .015 .290 .240 .348 .115 .008 .040 .014 - INCHES NOM 8 .100 BSC .130 .310 .250 .365 .130 .010 .060 .018 - MAX .210 .195 .325 .280 .400 .150 .015 .070 .022 .430 Notes: 1. Pin 1 visual index feature may vary, but must be located within the hatched area. 2. § Significant Characteristic 3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side. 4. Dimensioning and tolerancing per ASME Y14.5M BSC: Basic Dimension. Theoretically exact value shown without tolerances. Microchip Technology Drawing No. C04-018D Sheet 2 of 2 2013-2015 Microchip Technology Inc. DS40001723D-page 313 PIC12(L)F1571/2 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging DS40001723D-page 314 2013-2015 Microchip Technology Inc. PIC12(L)F1571/2 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 2013-2015 Microchip Technology Inc. DS40001723D-page 315 PIC12(L)F1571/2 !"#$% & ! "#$%&"'"" ($) % *++&&&! !+$ DS40001723D-page 316 2013-2015 Microchip Technology Inc. PIC12(L)F1571/2 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 2013-2015 Microchip Technology Inc. DS40001723D-page 317 PIC12(L)F1571/2 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging DS40001723D-page 318 2013-2015 Microchip Technology Inc. PIC12(L)F1571/2 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 2013-2015 Microchip Technology Inc. DS40001723D-page 319 PIC12(L)F1571/2 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging DS40001723D-page 320 2013-2015 Microchip Technology Inc. PIC12(L)F1571/2 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 2013-2015 Microchip Technology Inc. DS40001723D-page 321 PIC12(L)F1571/2 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging DS40001723D-page 322 2013-2015 Microchip Technology Inc. PIC12(L)F1571/2 8-Lead Ultra Thin Plastic Dual Flat, No Lead Package (RF) - 3x3x0.50 mm Body [UDFN] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging D A B N (DATUM A) (DATUM B) E NOTE 1 2X 0.10 C 1 2X 2 TOP VIEW 0.10 C 0.05 C C SEATING PLANE A1 A 8X (A3) 0.05 C SIDE VIEW 0.10 C A B D2 1 2 L 0.10 C A B E2 NOTE 1 K N e 8X b 0.10 e 2 C A B BOTTOM VIEW Microchip Technology Drawing C04-254A Sheet 1 of 2 2013-2015 Microchip Technology Inc. DS40001723D-page 323 PIC12(L)F1571/2 8-Lead Ultra Thin Plastic Dual Flat, No Lead Package (RF) - 3x3x0.50 mm Body [UDFN] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Units Dimension Limits Number of Terminals N e Pitch Overall Height A Standoff A1 A3 Terminal Thickness Overall Width E E2 Exposed Pad Width Overall Length D D2 Exposed Pad Length Terminal Width b Terminal Length L K Terminal-to-Exposed-Pad MIN 0.45 0.00 1.40 2.20 0.25 0.35 0.20 MILLIMETERS NOM 8 0.65 BSC 0.50 0.02 0.065 REF 3.00 BSC 1.50 3.00 BSC 2.30 0.30 0.45 - MAX 0.55 0.05 1.60 2.40 0.35 0.55 - Notes: 1. Pin 1 visual index feature may vary, but must be located within the hatched area. 2. Package is saw singulated 3. Dimensioning and tolerancing per ASME Y14.5M BSC: Basic Dimension. Theoretically exact value shown without tolerances. REF: Reference Dimension, usually without tolerance, for information purposes only. Microchip Technology Drawing C04-254A Sheet 2 of 2 DS40001723D-page 324 2013-2015 Microchip Technology Inc. PIC12(L)F1571/2 8-Lead Ultra Thin Plastic Dual Flat, No Lead Package (RF) - 3x3x0.50 mm Body [UDFN] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging C X2 E Y2 X1 G1 G2 SILK SCREEN Y1 RECOMMENDED LAND PATTERN Units Dimension Limits E Contact Pitch Optional Center Pad Width X2 Optional Center Pad Length Y2 Contact Pad Spacing C Contact Pad Width (X8) X1 Contact Pad Length (X8) Y1 Contact Pad to Contact Pad (X6) G1 Contact Pad to Center Pad (X8) G2 MIN MILLIMETERS NOM 0.65 BSC MAX 1.60 2.40 2.90 0.35 0.85 0.20 0.30 Notes: 1. Dimensioning and tolerancing per ASME Y14.5M BSC: Basic Dimension. Theoretically exact value shown without tolerances. Microchip Technology Drawing C04-2254A 2013-2015 Microchip Technology Inc. DS40001723D-page 325 PIC12(L)F1571/2 NOTES: DS40001723D-page 326 2013-2015 Microchip Technology Inc. PIC12(L)F1571/2 APPENDIX A: DATA SHEET REVISION HISTORY Revision A (10/2013) Original release of this document. Revision B (2/2014) Updated PIC12(L)F1571/2 Family Types table Program Memory Flash heading (words to K words). Revision C (8/2014) Updated PWM chapter. Changed to Final data sheet. Updated IDD and IPD parameters in the Electrical Specification chapter. Added Characterization Graphs. Added Section Conventions. 1.1: Register and Bit Naming Updated Figures 5-3 and 15-5. Updated Tables 3-1, 3-7, and 3-10. Updated Section 15.2.5. Updated Equation 15-1. Revision D (8/2015) Updated Clocking Structure, Memory, Low-Power Features, Family Types table and Pin Diagram Table on cover pages. Added Sections 3.2: High-Endurance Flash and 5.4: Clock Switching Before Sleep. Added Table 29-2 and 8-pin UDFN packaging. Updated Examples 3-2 and 15-1. Updated Figures 8-1, 21-1, 22-8 through 22-13 and 23-1. Updated Registers 7-5, 8-1, 22-6 and 23-3. Updated Sections 8.2.2, 15.2.6, 16.0, 21.0, 21.4.2, 22.3.3, 23.9.1.2, 23.11.1, 26.1 and 29.1. Updated Tables 1, 3-3, 3-4, 3-10, 5-1, 16-1, 17-3, 22-2, 23-2, 26-6, 26-8 and 29-1. 2013-2015 Microchip Technology Inc. DS40001723D-page 327 PIC12(L)F1571/2 NOTES: DS40001723D-page 328 2013-2015 Microchip Technology Inc. PIC12(L)F1571/2 THE MICROCHIP WEB SITE CUSTOMER SUPPORT Microchip provides online support via our WWW site at www.microchip.com. This web site is used as a means to make files and information easily available to customers. Accessible by using your favorite Internet browser, the web site contains the following information: Users of Microchip products can receive assistance through several channels: • Product Support – Data sheets and errata, application notes and sample programs, design resources, user’s guides and hardware support documents, latest software releases and archived software • General Technical Support – Frequently Asked Questions (FAQ), technical support requests, online discussion groups, Microchip consultant program member listing • Business of Microchip – Product selector and ordering guides, latest Microchip press releases, listing of seminars and events, listings of Microchip sales offices, distributors and factory representatives • • • • Distributor or Representative Local Sales Office Field Application Engineer (FAE) Technical Support Customers should contact their distributor, representative or Field Application Engineer (FAE) for support. Local sales offices are also available to help customers. A listing of sales offices and locations is included in the back of this document. Technical support is available through the web site at: http://microchip.com/support CUSTOMER CHANGE NOTIFICATION SERVICE Microchip’s customer notification service helps keep customers current on Microchip products. Subscribers will receive e-mail notification whenever there are changes, updates, revisions or errata related to a specified product family or development tool of interest. To register, access the Microchip web site at www.microchip.com. Under “Support”, click on “Customer Change Notification” and follow the registration instructions. 2013-2015 Microchip Technology Inc. DS40001723D-page 329 PIC12(L)F1571/2 NOTES: DS40001723D-page 330 2013-2015 Microchip Technology Inc. PIC12(L)F1571/2 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. [X](1) PART NO. Device - X Tape and Reel Temperature Option Range /XX XXX Package Pattern Examples: a) b) Device: PIC12LF1571, PIC12F1571 PIC12LF1572, PIC12F1572 Tape and Reel Option: Blank T = Standard packaging (tube or tray) = Tape and Reel(1) Temperature Range: I E = -40C to +85C = -40C to +125C Package:(2) MF MS P SN RF Pattern: QTP, SQTP, Code or Special Requirements (blank otherwise) c) = = = = = (Industrial) (Extended) Micro Lead Frame (DFN) 3x3x0.9 mm MSOP Plastic DIP SOIC Micro Lead Frame (UDFN) 3x3x0.5 mm 2013-2015 Microchip Technology Inc. PIC12LF1571T - I/SO Tape and Reel, Industrial temperature, SOIC package PIC12F1572 - I/P Industrial temperature, PDIP package PIC12F1571-E/MF Extended Temperature, DFN package Note 1: Tape and Reel identifier only appears in the catalog part number description. This identifier is used for ordering purposes and is not printed on the device package. Check with your Microchip Sales Office for package availability with the Tape and Reel option. 2: For other small form-factor package availability and marking information, please visit www.microchip.com/packaging or contact your local sales office. DS40001723D-page 331 PIC12(L)F1571/2 NOTES: DS40001723D-page 332 2013-2015 Microchip Technology Inc. Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. • Microchip is willing to work with the customer who is concerned about the integrity of their code. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights unless otherwise stated. Trademarks The Microchip name and logo, the Microchip logo, dsPIC, FlashFlex, flexPWR, JukeBlox, KEELOQ, KEELOQ logo, Kleer, LANCheck, MediaLB, MOST, MOST logo, MPLAB, OptoLyzer, PIC, PICSTART, PIC32 logo, RightTouch, SpyNIC, SST, SST Logo, SuperFlash and UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. The Embedded Control Solutions Company and mTouch are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, BodyCom, chipKIT, chipKIT logo, CodeGuard, dsPICDEM, dsPICDEM.net, ECAN, In-Circuit Serial Programming, ICSP, Inter-Chip Connectivity, KleerNet, KleerNet logo, MiWi, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach, Omniscient Code Generation, PICDEM, PICDEM.net, PICkit, PICtail, RightTouch logo, REAL ICE, SQI, Serial Quad I/O, Total Endurance, TSHARC, USBCheck, VariSense, ViewSpan, WiperLock, Wireless DNA, and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. Silicon Storage Technology is a registered trademark of Microchip Technology Inc. in other countries. GestIC is a registered trademark of Microchip Technology Germany II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in other countries. All other trademarks mentioned herein are property of their respective companies. © 2013-2015, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. ISBN: 978-1-63277-715-7 QUALITY MANAGEMENT SYSTEM CERTIFIED BY DNV == ISO/TS 16949 == 2013-2015 Microchip Technology Inc. Microchip received ISO/TS-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company’s quality system processes and procedures are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified. 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