isl3159e

DATASHEET
±15kV ESD Protected, +125°C, 40Mbps, 5V,
PROFIBUS™, Full Fail-safe, RS-485/RS-422 Transceiver
ISL3159E
Features
Intersil’s ISL3159E is a ±15kV IEC61000 ESD protected, 5V
powered, single transceiver that meets both the RS-485 and
RS-422 standards for balanced communication. It also
features the larger output voltage and higher data rate - up to
40Mbps - required by high speed PROFIBUS applications, and
is offered in industrial and extended Industrial (-40°C to
+125°C) temperature ranges. The low bus currents
(+220µA/-150µA) present a “1/5 unit load” to the RS-485 bus.
This allows up to 160 transceivers on the network without
violating the RS-485 specification’s load limit and without
using repeaters.
• IEC61000 ESD protection on RS-485 I/O Pins . . . . . . ±15kV
- Class 3 HBM ESD level on all other pins . . . . . . . . . . . >9kV
This transceiver requires a 5V ±10% tolerance supply, and
delivers at least a 2.1V differential output voltage over this
supply range. This translates into better noise immunity (data
integrity), longer reach, or the ability to drive up to six 120Ω
terminations in “star” or other nonstandard bus topologies, at
the exceptional 40Mbps data rate.
SCSI applications benefit from the ISL3159’s low receiver and
transmitter part-to-part skews, which make it perfect for high
speed parallel applications where large numbers of bits must
be simultaneously captured. The low bit-to-bit skew eases the
timing constraints on the data latching signal.
Receiver (Rx) inputs feature a “full fail-safe” design, which
ensures a logic high Rx output if Rx inputs are floating,
shorted, or terminated but undriven. Rx outputs feature high
drive levels (typically >30mA at VOL = 1V) to ease the design of
optically isolated interfaces.
• Large differential VOUT . . . . . . . . . . . . . . . . . . . 2.8V into 54Ω
Better noise immunity, or drive up to 6 terminations
• High data rates. . . . . . . . . . . . . . . . . . . . . . . . . . up to 40Mbps
• Specified for +125°C operation
• 11/13ns (max) Tx/Rx propagation delays; 1.5ns (max) skew
• 1/5 unit load allows up to 160 devices on the bus
• Full fail-safe (open, shorted, terminated/undriven) receiver
• High Rx IOL to drive optocouplers for isolated applications
• Hot plug - Tx and Rx outputs remain three-state during
power-up
• Low quiescent supply current. . . . . . . . . . . . . . . . . . . . . . 4mA
• Low current shutdown mode . . . . . . . . . . . . . . . . . . . . . . . 1µA
• -7V to +12V common-mode input voltage range
• Three-state Rx and Tx outputs
• Operates from a single +5V supply (10% tolerance)
• Current limiting and thermal shutdown for driver overload
protection
• Pb-free (RoHS compliant)
Applications
• PROFIBUS DP and FMS networks
• SCSI “fast 40” drivers and receivers
Hot plug circuitry ensures that the Tx and Rx outputs remain in
a high impedance state while the power supply stabilizes.
• Motor controller/position encoder systems
Driver (Tx) outputs are short-circuit protected, even for voltages
exceeding the power supply voltage. Additionally, on-chip
thermal shutdown circuitry disables the Tx outputs to prevent
damage if power dissipation becomes excessive.
• Field bus networks
+5V
• Factory automation
• Security networks
• Building environmental control systems
• Industrial/process control networks
+5V
SOIC AND MSOP PIN NUMBERS SHOWN
+
8
0.1µF
0.1µF
+
8
VCC
1 RO
VCC
R
D
2 RE
B/Z
7
3 DE
A/Y
6
4 DI
RT
RT
7
B/Z
DE 3
6
A/Y
RE 2
R
D
GND
5
DI 4
RO 1
GND
5
FIGURE 1. TYPICAL OPERATING CIRCUIT
August 25, 2015
FN6364.2
1
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 1-888-468-3774 | Copyright Intersil Americas LLC 2007, 2015. All Rights Reserved
Intersil (and design) is a trademark owned by Intersil Corporation or one of its subsidiaries.
All other trademarks mentioned are the property of their respective owners.
ISL3159E
Ordering Information
PART NUMBER
(Notes 1, 2, 3)
TEMP. RANGE
(°C)
PART MARKING
PACKAGE
(RoHS Compliant)
PKG. DWG. #
ISL3159EIBZ
3159 EIBZ
-40 to +85
8 Ld SOIC
M8.15
ISL3159EIUZ
3159Z
-40 to +85
8 Ld MSOP
M8.118
ISL3159EIRZ
159Z
-40 to +85
10 Ld DFN
L10.3x3C
ISL3159EFBZ
3159 EFBZ
-40 to +125
8 Ld SOIC
M8.15
ISL3159EFUZ
159FZ
-40 to +125
8 Ld MSOP
M8.118
ISL3159EFRZ
59FZ
-40 to +125
10 Ld DFN
L10.3x3C
NOTES:
1. Add “-T*” suffix for tape and reel. Please refer to TB347 for details on reel specifications.
2. Intersil Pb-free plus anneal products employ special Pb-free material sets; molding compounds/die attach materials and 100% matte tin plate
termination finish, which are RoHS compliant and compatible with both SnPb and Pb-free soldering operations. Intersil Pb-free products are MSL
classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.
3. For Moisture Sensitivity Level (MSL), please see product information page for ISL3159E. For more information on MSL, please see tech brief TB363.
TABLE 1. KEY DIFFERENCES BETWEEN HIGH-SPEED INTERFACE FAMILY OF PARTS
FULL/HALF DUPLEX
VCC
(V)
ISL3179E
Half
3.3
1.5
40
ISL3180E
Full
3.3
1.5
40
ISL3159E
Half
5
2.1
40
ISL3259E
Half
5
2.1
100
PART NUMBER
VOD
(V)
DATA RATE
(Mbps)
Pin Configurations
ISL3159E
(10 LD DFN)
TOP VIEW
ISL3159E
(8 LD SOIC, MSOP)
TOP VIEW
RO 1
R
RE 2
DE 3
DI 4
D
8
VCC
RO
1
10 VCC
7
B/Z
RE
2
9 NC
6
A/Y
DE
3
5
GND
DI
4
7 A/Y
NC
5
6 GND
Truth Table
8 B/Z
EP
Truth Table
TRANSMITTING
RECEIVING
INPUTS
OUTPUTS
INPUTS
OUTPUT
RE
DE
DI
B/Z
A/Y
RE
DE
A-B
RO
X
1
1
0
1
0
0
≥ -0.05V
1
X
1
0
1
0
0
0
≤ -0.2V
0
0
0
X
High-Z
High-Z
0
0
Inputs Open/Shorted
1
1
0
X
High-Z *
High-Z *
1
1
X
High-Z
1
0
X
High-Z *
NOTE: *Shutdown mode
NOTE: *Shutdown mode
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ISL3159E
Pin Descriptions
PIN
FUNCTION
RO
Receiver output: If A-B ≥ -50mV, RO is high; If A-B ≤ -200mV, RO is low; RO = High if A and B are unconnected (floating) or shorted, or
connected to a terminated bus that is undriven.
RE
Receiver output enable. RO is enabled when RE is low; RO is high impedance when RE is high. If the Rx enable function isn’t required,
connect RE directly to GND.
DE
Driver output enable. The driver outputs, Y and Z, are enabled by bringing DE high. They are high impedance when DE is low. If the Tx
enable function isn’t required, connect DE to VCC through a 1kΩ or greater resistor.
DI
Driver input. A low on DI forces output Y low and output Z high. Similarly, a high on DI forces output Y high and output Z low.
GND
Ground connection. This is also the potential of the DFN’s exposed metal pad.
A/Y
±15kV IEC61000 ESD protected RS-485/422 level, noninverting receiver input and noninverting driver output. Pin is an input (A) if DE = 0;
pin is an output (Y) if DE = 1.
B/Z
±15kV IEC61000 ESD protected RS-485/422 level, inverting receiver input and inverting driver output. Pin is an input (B) if DE = 0; pin is
an output (Z) if DE = 1.
VCC
System power supply input (4.5V to 5.5V).
NC
No internal connection.
EP
The exposed metal pad on the bottom of the DFN; connect to GND.
Typical Operating Circuit
+5V
+5V
SOIC AND MSOP PIN NUMBERS SHOWN
+
8
0.1µF
0.1µF
+
8
VCC
1 RO
R
D
2 RE
B/Z
A/Y
3 DE
4 DI
VCC
7
RT
RT
6
DI 4
7
B/Z
DE 3
6
A/Y
RE 2
R
D
GND
GND
5
5
RO 1
FIGURE 2. TYPICAL OPERATING CIRCUIT
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ISL3159E
Absolute Maximum Ratings
Thermal Information
VCC to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7V
Input Voltages
DI, DE, RE. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 7V
Input/Output Voltages
A/Y, B/Z . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -9V to +13V
RO. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to (VCC +0.3V)
Short-circuit Duration
Y, Z . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Continuous
ESD Rating . . . . . . . . . . . . See “Electrical Specifications” table on page 5
Thermal Resistance (Typical)
JA (°C/W) JC (°C/W)
8 Ld SOIC Package (Notes 4, 6) . . . . . . . . .
105
60
8 Ld MSOP Package (Notes 4, 6) . . . . . . . .
140
55
10 Ld DFN Package (Notes 5, 7) . . . . . . . .
46
3.5
Maximum Junction Temperature (Plastic Package) . . . . . . . . . . . +150°C
Maximum Storage Temperature Range . . . . . . . . . . . . . .-65°C to +150°C
Pb-free Reflow Profile . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . see TB493
Operating Conditions
Temperature Range
ISL3159EF . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-40°C to +125°C
ISL3159EI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40°C to +85°C
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product
reliability and result in failures not covered by warranty.
NOTES:
4. JA is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details.
5. JA is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. See Tech
Brief TB379.
6. For JC, the “case temp” location is taken at the package top center.
7. For JC, the “case temp” location is the center of the exposed metal pad on the package underside.
Electrical Specifications
Test Conditions: VCC = 4.5V to 5.5V; unless otherwise specified. Typicals are at VCC = 5V, TA = +25°C,
(Note 8)
PARAMETER
TEMP
(°C)
MIN
(Note 18)
TYP
MAX
(Note 18)
No Load
Full
-
-
VCC
RL = 100Ω (RS-422) (Figure 3A)
Full
2.6
3.4
-
V
RL = 54Ω (RS-485)
(Figure 3A)
I Suffix
Full
2.1
2.8
VCC
V
F Suffix, (Note 17)
Full
2.1
2.8
VCC
V
RL = 60Ω, -7V ≤ VCM ≤ 12V (Figure 3B, Note 17)
Full
1.9
2.7
-
V
RL = 54Ω or 100Ω (Figure 3A)
Full
-
0.01
0.2
V
SYMBOL
TEST CONDITIONS
UNIT
DC CHARACTERISTICS
Driver Differential VOUT
VOD
VOD
Change in Magnitude of Driver
Differential VOUT for
Complementary Output States
Driver Common-mode VOUT
VOC
RL = 54Ω or 100Ω (Figure 3A, Note 17)
Full
-
2
3
V
Change in Magnitude of Driver
Common-mode VOUT for
Complementary Output States
VOC
RL = 54Ω or 100Ω (Figure 3A)
Full
-
0.01
0.2
V
Logic Input High Voltage
VIH
DI, DE, RE
Full
2
-
-
V
Logic Input Low Voltage
VIL
DI, DE, RE
Full
-
-
0.8
V
Logic Input Current
IIN1
DI = DE = RE = 0V or VCC
Full
-2
-
2
µA
Input Current (A/Y, B/Z)
IIN2
DE = 0V, VCC = 0V or 5.5V VIN = 12V
Full
-
-
220
µA
Full
-160
-
-
µA
DE = VCC, -7V ≤ VY or VZ ≤ 12V (Note 10)
Full
-
-
±250
mA
VIN = -7V
Driver Short-circuit Current,
VO = High or Low
IOSD1
Differential Capacitance
CD
A/Y to B/Z
25
-
9
-
pF
Receiver Differential Threshold
Voltage
V TH
-7V ≤ VCM ≤ 12V
Full
-200
-
-50
mV
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ISL3159E
Electrical Specifications
Test Conditions: VCC = 4.5V to 5.5V; unless otherwise specified. Typicals are at VCC = 5V, TA = +25°C,
(Note 8) (Continued)
PARAMETER
SYMBOL
TEST CONDITIONS
TEMP
(°C)
MIN
(Note 18)
TYP
MAX
(Note 18)
UNIT
Receiver Input Hysteresis
V TH
VCM = 0V
25
-
28
-
mV
Receiver Output High Voltage
VOH
IO = -8mA, VID = -50mV
Full
VCC - 0.5
-
-
V
Receiver Output Low Voltage
VOL
IO = +10mA, VID = -200mV
Full
-
-
0.4
V
Receiver Output Low Current
IOL
VOL = 1V, VID = -200mV
Full
25
40
-
mA
Three-state (high impedance)
Receiver Output Current
IOZR
0.4V ≤ VO ≤ 2.4V
Full
-1
0.015
1
µA
Receiver Input Resistance
RIN
-7V ≤ VCM ≤ 12V
Full
54
80
-
kΩ
Receiver Short-circuit Current
IOSR
0V ≤ VO ≤ VCC
Full
±20
-
±110
mA
DI = DE = 0V or VCC
Full
-
2.6
4
mA
DE = 0V, RE = VCC, DI = 0V or VCC
Full
-
0.05
1
µA
IEC61000-4-2, Air-Gap Discharge Method
25
-
±15
-
kV
SUPPLY CURRENT
No-load Supply Current (Note 9)
ICC
Shutdown Supply Current
ISHDN
ESD PERFORMANCE
RS-485 Pins (A/Y, B/Z)
All Pins
IEC61000-4-2, Contact Discharge Method
25
-
±8
-
kV
Human Body Model, From Bus Pins to GND
25
-
±16.5
-
kV
HBM, per MIL-STD-883 Method 3015
25
-
> ±9
-
kV
Machine Model
25
-
> ±400
-
V
VOD ≥ ±1.5V, RD = 54Ω, CL = 100pF (Figure 6)
Full
40
-
-
Mbps
DRIVER SWITCHING CHARACTERISTICS
Maximum Data Rate
fMAX
Driver Differential Output Delay
tDD
RD = 54Ω, CD = 50pF (Figure 4)
Full
-
8
12
ns
Driver Differential Output Skew
tSKEW
RD = 54Ω, CD = 50pF (Figure 4)
Full
-
0.5
1.5
ns
Prop Delay Part-to-part Skew
tSKP-P
RD = 54Ω, CD = 50pF (Figure 4, Note 16)
Full
-
-
4
ns
Driver Differential Rise or Fall
Time
tR, tF
RD = 54Ω, CD = 50pF (Figure 4)
Full
2
5
8
ns
Driver Enable to Output High
tZH
RL = 110Ω, CL = 50pF, SW = GND
(Figure 5, Note 11)
Full
-
13
20
ns
Driver Enable to Output Low
tZL
RL = 110Ω, CL = 50pF, SW = VCC
(Figure 5, Note 11)
Full
-
11
20
ns
|tZH (Y or Z) - tZL (Z or Y)|
Full
-
2.5
-
ns
Driver Disable from Output High
tHZ
RL = 110Ω, CL = 50pF, SW = GND (Figure 5)
Full
-
14
20
ns
Driver Disable from Output Low
tLZ
RL = 110Ω, CL = 50pF, SW = VCC (Figure 5)
Full
-
12
20
ns
|tHZ (Y or Z) - tLZ (Z or Y)|
Full
-
3
-
ns
(Note 13)
Full
60
-
600
ns
Full
-
-
1000
ns
Full
-
-
1000
ns
Driver Enable Time Skew
tENSKEW
Driver Disable Time Skew
tDISSKEW
Time to Shutdown
tSHDN
Driver Enable from Shutdown to
Output High
tZH(SHDN) RL = 110Ω, CL = 50pF, SW = GND
(Figure 5, Notes 13, 14)
Driver Enable from Shutdown to
Output Low
tZL(SHDN)
RL = 110Ω, CL = 50pF, SW = VCC
(Figure 5, Notes 13, 14)
RECEIVER SWITCHING CHARACTERISTICS
Maximum Data Rate
fMAX
Receiver Skew | tPLH - tPHL |
tSKD
Prop Delay Part-to-part Skew
tSKP-P
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VID = ±1.5V
Full
40
-
-
Mbps
Full
-
9
13
ns
(Figure 7)
Full
-
0
1.5
ns
(Figure 7, Note 16)
Full
-
-
4
ns
tPLH, tPHL (Figure 7)
Receiver Input to Output Delay
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FN6364.2
August 25, 2015
ISL3159E
Electrical Specifications
Test Conditions: VCC = 4.5V to 5.5V; unless otherwise specified. Typicals are at VCC = 5V, TA = +25°C,
(Note 8) (Continued)
PARAMETER
SYMBOL
TEST CONDITIONS
TEMP
(°C)
MIN
(Note 18)
TYP
MAX
(Note 18)
UNIT
Receiver Enable to Output High
tZH
RL = 1kΩ, CL = 15pF, SW = GND
(Figure 8, Note 12)
Full
-
-
12
ns
Receiver Enable to Output Low
tZL
RL = 1kΩ, CL = 15pF, SW = VCC
(Figure 8, Note 12)
Full
-
-
12
ns
Receiver Disable from Output High
tHZ
RL = 1kΩ, CL = 15pF, SW = GND (Figure 8)
Full
-
-
12
ns
Receiver Disable from Output Low
tLZ
RL = 1kΩ, CL = 15pF, SW = VCC (Figure 8)
Full
-
-
12
ns
(Note 13)
Full
60
-
600
ns
Full
-
-
1000
ns
Full
-
-
1000
ns
Time to Shutdown
tSHDN
Receiver Enable from Shutdown to
Output High
tZH(SHDN) RL = 1kΩ, CL = 15pF, SW = GND
(Figure 8, Notes 13, 15)
Receiver Enable from Shutdown to
Output Low
tZL(SHDN)
RL = 1kΩ, CL = 15pF, SW = VCC
(Figure 8, Notes 13, 15)
NOTES:
8. All currents into device pins are positive; all currents out of device pins are negative. All voltages are referenced to device ground unless otherwise
specified.
9. Supply current specification is valid for loaded drivers when DE = 0V.
10. Applies to peak current. See “Typical Performance Curves” on page 8 for more information.
11. Because of the shutdown feature, keep RE = 0 to prevent the device from entering SHDN.
12. Because of the shutdown feature, the RE signal high time must be short enough (typically <100ns) to prevent the device from entering SHDN.
13. These IC’s are put into shutdown by bringing RE high and DE low. If the inputs are in this state for less than 60ns, the parts are guaranteed not to
enter shutdown. If the inputs are in this state for at least 700ns, the parts are guaranteed to have entered shutdown. See “Low Power Shutdown
Mode” on page 12.
14. Keep RE = VCC, and set the DE signal low time >700ns to ensure that the device enters SHDN.
15. Set the RE signal high time >700ns to ensure that the device enters SHDN.
16. This is the part-to-part skew between any two units tested with identical test conditions (temperature, VCC, etc.).
17. VCC = 5V ±5%
18. Parts are 100% tested at +25°C. Over-temperature limits established by characterization and are not production tested.
Test Circuits and Waveforms
VCC
RL/2
DE
DI
VCC
Z
Z
DI
VOD
D
375Ω
DE
VOD
D
Y
Y
RL/2
FIGURE 3A. VOD AND VOC
VOC
RL = 60Ω
VCM
-7V TO +12V
375Ω
FIGURE 3B. VOD WITH COMMON-MODE LOAD
FIGURE 3. DC DRIVER TEST CIRCUITS
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ISL3159E
Test Circuits and Waveforms (Continued)
3V
DI
1.5V
1.5V
0V
VCC
tPHL
tPLH
DE
Z
DI
RD
D
OUT (Z)
VOH
OUT (Y)
VOL
CD
Y
SIGNAL
GENERATOR
90%
DIFF OUT (Y - Z)
+VOD
90%
10%
10%
tR
-VOD
tF
SKEW = |tPLH - tPHL|
FIGURE 4A. TEST CIRCUIT
FIGURE 4B. MEASUREMENT POINTS
FIGURE 4. DRIVER PROPAGATION DELAY AND DIFFERENTIAL TRANSITION TIMES
DE
Z
DI
110Ω
VCC
D
SIGNAL
GENERATOR
SW
Y
GND
3V
50pF
PARAMETER
OUTPUT
RE
DE
DI
SW
(Note 13)
tZH, tZH(SHDN)
(Note 13)
1.5V
1.5V
0V
OUTPUT HIGH
tHZ
VOH - 0.5V
50%
OUT (Y, Z)
tHZ
Y/Z
X
1/0
GND
tLZ
Y/Z
X
0/1
VCC
tZH
Y/Z
0 (Note 11)
1/0
GND
tZL, tZL(SHDN)
(Note 13)
tZL
Y/Z
0 (Note 11)
0/1
VCC
OUT (Y, Z)
tHZ(SHDN)
Y/Z
1 (Note 14)
1/0
GND
tLZ(SHDN)
Y/Z
1 (Note 14)
0/1
VCC
VOH
0V
tLZ
VCC
50%
OUTPUT LOW
VOL + 0.5V V
OL
FIGURE 5B. MEASUREMENT POINTS
FIGURE 5A. TEST CIRCUIT
FIGURE 5. DRIVER ENABLE AND DISABLE TIMES
VCC
DE
+
Z
DI
54Ω
D
Y
VOD
CL
3V
DI
0V
-
SIGNAL
GENERATOR
CL
+VOD
DIFF OUT (Y - Z)
-VOD
FIGURE 6A. TEST CIRCUIT
0V
FIGURE 6B. MEASUREMENT POINTS
FIGURE 6. DRIVER DATA RATE
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ISL3159E
Test Circuits and Waveforms (Continued)
+3V
RE
+1.5V
A
15pF
B
R
A
1.5V
1.5V
RO
0V
tPLH
tPHL
VCC
SIGNAL
GENERATOR
1.7V
RO
1.7V
0V
FIGURE 7B. MEASUREMENT POINTS
FIGURE 7A. TEST CIRCUIT
FIGURE 7. RECEIVER PROPAGATION DELAY
RE
GND
B
A
1kΩ
RO
R
VCC
GND
SW
SIGNAL
GENERATOR
(Note 13)
15pF
3V
RE
1.5V
1.5V
0V
PARAMETER
DE
A
tZH, tZH(SHDN)
SW
tHZ
0
tLZ
0
-1.5V
VCC
tZH (Note 12)
0
+1.5V
GND
tZL (Note 12)
0
-1.5V
VCC
tHZ(SHDN) (Note 15)
0
+1.5V
GND
tLZ(SHDN) (Note 15)
0
-1.5V
VCC
+1.5V
OUTPUT HIGH
(Note 13)
GND
tHZ
VOH - 0.5V
1.5V
RO
VOH
0V
tZL, tZL(SHDN)
tLZ
(Note 13)
VCC
RO
1.5V
OUTPUT LOW
FIGURE 8A. TEST CIRCUIT
VOL + 0.5V V
OL
FIGURE 8B. MEASUREMENT POINTS
FIGURE 8. RECEIVER ENABLE AND DISABLE TIMES
Typical Performance Curves
DRIVER OUTPUT CURRENT (mA)
+85°C
90
RD = 30Ω
80
70
3.5
RD = 20Ω
+25°C
DIFFERENTIAL OUTPUT VOLTAGE (V)
110
100
VCC = 5V, TA = +25°C; unless otherwise specified
+125°C
RD = 54Ω
60
50
40
RD = 100Ω
30
20
10
0
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
DIFFERENTIAL OUTPUT VOLTAGE (V)
4.5
5.0
FIGURE 9. DRIVER OUTPUT CURRENT vs DIFFERENTIAL OUTPUT
VOLTAGE
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8
3.4
RD = 100Ω
3.3
3.2
3.1
3.0
2.9
2.8
2.7
RD = 54Ω
2.6
2.5
-40
-15
10
35
60
85
110
125
TEMPERATURE (°C)
FIGURE 10. DRIVER DIFFERENTIAL OUTPUT VOLTAGE vs
TEMPERATURE
FN6364.2
August 25, 2015
ISL3159E
Typical Performance Curves
VCC = 5V, TA = +25°C; unless otherwise specified (Continued)
2.55
200
150
2.50
Y OR Z = LOW
ICC (mA)
OUTPUT CURRENT (mA)
100
50
0
2.45
2.40
-50
Y OR Z = HIGH
2.35
-100
-150
-7 -6
-4
-2
0
2
4
6
OUTPUT VOLTAGE (V)
8
10
2.30
-40
12
10
35
60
85
110 125
TEMPERATURE (°C)
FIGURE 11. DRIVER OUTPUT CURRENT vs SHORT-CIRCUIT
VOLTAGE
FIGURE 12. SUPPLY CURRENT vs TEMPERATURE
9.0
0.9
|tPLH - tPHL|
8.8
0.8
8.6
8.4
0.7
tPHL
SKEW (ns)
PROPAGATION DELAY (ns)
DE = VCC, RE = X OR DE = GND, RE = GND
-15
8.2
8.0
7.8
0.6
0.5
7.6
tPLH
7.4
0.4
7.2
-15
10
35
60
85
0.3
-40
110 125
-15
10
0
5
RO
0
3
2
1
0
-1
Y-Z
-2
-3
TIME (5ns/DIV)
FIGURE 15. DRIVER AND RECEIVER WAVEFORMS
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RECEIVER OUTPUT (V)
5
DRIVER INPUT (V)
RDIFF = 54Ω, CD = 50pF
9
60
85
110
125
FIGURE 14. DRIVER DIFFERENTIAL SKEW vs TEMPERATURE
DRIVER OUTPUT (V)
DRIVER OUTPUT (V)
RECEIVER OUTPUT (V)
FIGURE 13. DRIVER DIFFERENTIAL PROPAGATION DELAY vs
TEMPERATURE
DI
35
TEMPERATURE (°C)
TEMPERATURE (°C)
RDIFF = 54Ω, CD = 50pF
DI
5
0
5
RO
0
DRIVER INPUT (V)
7.0
-40
3
2
1
0
-1
Y-Z
-2
-3
TIME (5ns/DIV)
FIGURE 16. DRIVER AND RECEIVER WAVEFORMS
FN6364.2
August 25, 2015
ISL3159E
0
5.0
RO
0
DRIVER+CABLE DELAY
3.0
(~156ns)
1.5
A-B
0
-1.5
-3.0
DI = 40Mbps
0
5.0
RO
0
3.0
DRIVER+CABLE DELAY
1.5
RECEIVER OUTPUT CURRENT (mA)
70
-1.5
-3.0
FIGURE 18. DRIVER AND RECEIVER WAVEFORMS DRIVING 350
FEET (107 METERS) OF CAT5 CABLE (DOUBLE
TERMINATED WITH 120Ω)
Die Characteristics
VOL, +25°C
SUBSTRATE AND DFN THERMAL PAD POTENTIAL
(POWERED UP):
VOL, +85°C
50
A-B
TIME (10ns/DIV)
FIGURE 17. DRIVER AND RECEIVER WAVEFORMS DRIVING 100
FEET (31 METERS) OF CAT5 CABLE (DOUBLE
TERMINATED WITH 120Ω)
VOH, +25°C
(~480ns)
0
TIME (10ns/DIV)
60
5
DRIVER INPUT (V)
5
RECEIVER OUTPUT (V)
DI = 40Mbps
DRIVER INPUT (V)
VCC = 5V, TA = +25°C; unless otherwise specified (Continued)
RECEIVER INPUT (V)
RECEIVER INPUT (V)
RECEIVER OUTPUT (V)
Typical Performance Curves
VOL, +125°C
GND
40
PROCESS:
30
VOH, +85°C
Si Gate BiCMOS
VOH, +125°C
20
10
0
0
1
2
3
4
5
RECEIVER OUTPUT VOLTAGE (V)
FIGURE 19. RECEIVER OUTPUT CURRENT vs RECEIVER OUTPUT
VOLTAGE
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FN6364.2
August 25, 2015
ISL3159E
Application Information
RS-485 and RS-422 are differential (balanced) data
transmission standards for use in long haul or noisy
environments. RS-422 is a subset of RS-485, so RS-485
transceivers are also RS-422 compliant. RS-422 is a
point-to-multipoint (multidrop) standard, which allows only one
driver and up to 10 (assuming one unit load devices) receivers
on each bus. RS-485 is a true multipoint standard, which
allows up to 32 one unit load devices (any mix of drivers and
receivers) on each bus. To allow for multipoint operation, the
RS-485 spec requires that drivers must handle bus contention
without sustaining any damage.
Another important advantage of RS-485 is the extended
Common-mode Range (CMR), which specifies that the driver
outputs and receiver inputs withstand signals that range from
+12V to -7V. RS-422 and RS-485 are intended for runs as long
as 4000’ (~1200m), so the wide CMR is necessary to handle
ground potential differences, as well as voltages induced in the
cable by external fields.
Receiver (Rx) Features
This transceiver utilizes a differential input receiver for
maximum noise immunity and common-mode rejection. Input
sensitivity is ±200mV, as required by the RS422 and RS-485
specifications. Receiver inputs function with common-mode
voltages as great as 7V outside the power supplies (i.e., +12V
and -7V), making them ideal for long networks, or industrial
environments, where induced voltages are a realistic concern.
The receiver input resistance of 50kΩ surpasses the RS-422
spec of 4kΩ, and is five times the RS-485 “Unit Load” (UL)
requirement of 12kΩ minimum. Thus, the ISL3159E is known
as a “one-fifth UL” transceiver, and there can be up to 160
devices on the RS-485 bus while still complying with the
RS-485 loading specification.
The receiver is a “full fail-safe” version that guarantees a high
level receiver output if the receiver inputs are unconnected
(floating), shorted together, or connected to a terminated bus
with all the transmitters disabled (terminated/undriven).
Rx outputs deliver large low state currents (typically >30mA) at
VOL = 1V (to ease the design of optically coupled isolated
networks).
Receivers easily meet the 40Mbps data rate supported by the
driver, and the receiver output is tri-statable via the active low
RE input.
Driver (Tx) Features
The RS-485/RS-422 driver is a differential output device that
delivers at least 2.1V across a 54Ω load (RS-485/
PROFIBUS), and at least 2.6V across a 100Ω load (RS-422)
even with VCC = 4.5V. The drivers feature low propagation
delay skew to maximize bit width and to minimize EMI.
Outputs of the drivers are not slew rate limited, so faster
output transition times allow data rates of at least 40Mbps.
Driver outputs are tri-statable via the active high DE input.
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11
For parallel applications, bit-to-bit skews between any two
ISL3159E transmitter and receiver pairs are guaranteed to be no
worse than 8ns (4ns max for any two Tx, 4ns max for any two Rx).
High VOD Improves Noise Immunity and Flexibility
The ISL3159E driver design delivers larger differential output
voltages (VOD) than the RS-485 standard requires, or than
most RS-485 transmitters can deliver. The minimum ±2.1V
VOD guarantees at least ±600mV more noise immunity than
networks built using standard 1.5V VOD transmitters.
Another advantage of the large VOD is the ability to drive more
than two bus terminations, which allows for utilizing the
ISL3159E in “star” and other multiterminated, “nonstandard”
network topologies. Figure 9 on page 8, details the
transmitter’s VOD vs IOUT characteristic, and includes load
lines for four (30Ω) and six (20Ω) 120Ω terminations. Figure 9
shows that the driver typically delivers 1.9/1.5V into 4/6
terminations, even at +85°C. The RS-485 standard requires a
minimum 1.5V VOD into two terminations, but the ISL3159E
typically delivers RS-485 voltage levels with 2x to 3x the
number of terminations.
ESD Protection
All pins on the ISL3159E include class 3 (>9kV) Human Body
Model (HBM) ESD protection structures, but the RS-485 pins
(driver outputs and receiver inputs) incorporate advanced
structures allowing them to survive ESD events in excess of
±16.5kV HBM and ±15kV IEC61000-4-2. The RS-485 pins are
particularly vulnerable to ESD strikes because they typically
connect to an exposed port on the exterior of the finished
product. Simply touching the port pins, or connecting a cable,
can cause an ESD event that might destroy unprotected ICs.
These new ESD structures protect the device whether or not it
is powered up and without degrading the RS-485
common-mode range of -7V to +12V. This built-in ESD
protection eliminates the need for board level protection
structures (e.g., transient suppression diodes) and the
associated, undesirable capacitive load they present.
IEC61000-4-2 Testing
The IEC61000 test method applies to finished equipment,
rather than to an individual IC. Therefore, the pins most likely
to suffer an ESD event are those that are exposed to the
outside world (the RS-485 pins in this case), and the IC is
tested in its typical application configuration (power applied)
rather than testing each pin-to-pin combination. The IEC61000
standard’s lower current limiting resistor coupled with the
larger charge storage capacitor yields a test that is much more
severe than the HBM test. The extra ESD protection built into
this device’s RS-485 pins allows the design of equipment
meeting level 4 criteria without the need for additional board
level protection on the RS-485 port.
AIR-GAP DISCHARGE TEST METHOD
For this test method, a charged probe tip moves toward the IC
pin until the voltage arcs to it. The current waveform delivered to
the IC pin depends on approach speed, humidity, temperature,
etc., so it is more difficult to obtain repeatable results. The
ISL3159E RS-485 pins withstand ±15kV air-gap discharges.
FN6364.2
August 25, 2015
ISL3159E
CONTACT DISCHARGE TEST METHOD
During the contact discharge test, the probe contacts the
tested pin before the probe tip is energized, thereby
eliminating the variables associated with the air-gap
discharge. The result is a more repeatable and predictable
test, but equipment limits prevent testing devices at voltages
higher than ±9kV. The RS-485 pins of the ISL3159E survive
±8kV contact discharges.
Hot Plug Function
When a piece of equipment powers up, there is a period of
time where the processor or ASIC driving the RS-485 control
lines (DE, RE) is unable to ensure that the RS-485 Tx and Rx
outputs are kept disabled. If the equipment is connected to the
bus, a driver activating prematurely during power-up may
crash the bus. To avoid this scenario, the ISL3159E
incorporates a “hot plug” function. Circuitry monitoring VCC
ensures that, during power-up and power-down, the Tx and Rx
outputs remain disabled, regardless of the state of DE and RE, if
VCC is less than ~3.2V. This gives the processor/ASIC a chance to
stabilize and drive the RS-485 control lines to the proper states.
RE = GND
3.3V
3.1V
2.5
VCC
0
RL = 1kΩ
2.5
0
A/Y
ISL3159E
RL = 1kΩ
ISL3159E
RO
5.0
2.5
0
TIME (40µs/DIV)
FIGURE 20. HOT PLUG PERFORMANCE (ISL3159E) vs ISL83088E
WITHOUT HOT PLUG CIRCUITRY
Data Rate, Cables and Terminations
Twisted pair is the cable of choice for RS-485, RS-422 and
PROFIBUS networks. Twisted pair cables tend to pick up noise
and other electromagnetically induced voltages as
common-mode signals, which are effectively rejected by the
differential receivers in these ICs.
According to guidelines in the RS-422 and PROFIBUS
specifications, networks operating at data rates in excess of
3Mbps should be limited to cable lengths of 100m (328 ft) or
less, and the PROFIBUS specification recommends that the
more expensive “Type A” (22AWG) cable be used. The
ISL3159E’s large differential output swing, fast transition
times and high drive-current output stages allow operation
even at 40Mbps over standard “CAT5” cables in excess of
100m (328 ft). Figure 18 on page 10 details the ISL3159E
performance at this condition, with a 120Ω termination
resistor at both the driver and the receiver ends. Note that the
differential signal delivered to the receiver at the end of the
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12
The ISL3159E may also be used at slower data rates over
longer cables, but there are some limitations. The Rx is
optimized for high speed operation, so its output may glitch if
the Rx input differential transition times are too slow. Keeping
the transition times below 500ns, (which equates to the Tx
driving a 1000’ (305m) CAT 5 cable) yields excellent
performance across the full operating temperature range.
To minimize reflections, proper termination is imperative when
using this high data rate transceiver. In point-to-point, or
point-to-multipoint (single driver on bus) networks, the main
cable should be terminated in its characteristic impedance
(typically 120Ω for “CAT5” and 220Ω for “Type A”) at the end
farthest from the driver. In multireceiver applications, stubs
connecting receivers to the main cable should be kept as short
as possible. Multipoint (multidriver) systems require that the
main cable be terminated in its characteristic impedance at
both ends. Stubs connecting a transceiver to the main cable
should be kept as short as possible.
Built-in Driver Overload Protection
5.0
RECEIVER OUTPUT (V)
DRIVER Y OUTPUT (V)
5.0
VCC (V)
DE, DI = VCC
cable (A-B) still exceeds 1V, so even longer cables could be
driven if lower noise margins are acceptable. Of course, jitter
or some other criteria may limit the network to shorter cable
lengths than those discussed here. If more noise margin is
desired, shorter cables produce a larger receiver input signal
as illustrated in Figure 17 on page 10. Performance should be
even better if the “Type A” cable is utilized.
As stated previously, the RS-485 specification requires that
drivers survive worst case bus contentions undamaged. These
transmitters meet this requirement via driver output short-circuit
current limits, and on-chip thermal shutdown circuitry.
The driver output stages incorporate short-circuit current
limiting circuitry, which ensures that the output current never
exceeds the RS-485 specification, even at the common-mode
voltage range extremes. In the event of a major short-circuit
condition, the device also includes a thermal shutdown feature
that disables the drivers whenever the die temperature
becomes excessive. This eliminates the power dissipation,
allowing the die to cool. The drivers automatically reenable
after the die temperature drops about 15 degrees. If the
contention persists, the thermal shutdown/reenable cycle
repeats until the fault is cleared. Receivers stay operational
during thermal shutdown.
Low Power Shutdown Mode
This BiCMOS transceiver uses a fraction of the power required
by their bipolar counterparts, but it also includes a shutdown
feature that reduces the already low quiescent ICC to a 50nA
trickle. It enters shutdown whenever the receiver and driver are
simultaneously disabled (RE = VCC and DE = GND) for a period
of at least 600ns. Disabling both the driver and the receiver for
less than 60ns guarantees that the transceiver will not enter
shutdown.
Note that receiver and driver enable times increase when the
transceiver enables from shutdown. Refer to Notes 11, 12, 13,
14 and 15, at the end of the Electrical Specification table on
page 6, for more information.
FN6364.2
August 25, 2015
ISL3159E
Revision History
The revision history provided is for informational purposes only and is believed to be accurate, but not warranted. Please go to the web to make sure that
you have the latest revision.
DATE
REVISION
CHANGE
August 25, 2015
FN6364.2
Added Key Differences table to page 2.
July 29, 2015
FN6364.1
Reformatted datasheet to newest template and standards.
Ordering Information table - added MSL note 3.
Added in “Thermal Information” on page 4 Tjc for packages plus corresponding notes and changed Tja from 75
to 46 for DFN package.
Pin Description on page 3 - Added row for EP and added to description of GND.
Updated note references on Figures 5B and 8B.
Die Characteristics section on page 10: removed Transistor Count
Added Revision History table and About Intersil section.
Updated POD M8.118 from rev 2 to rev 4. Changes since rev 2:
- Updated to new intersil format by adding land pattern and moving dimensions from table onto drawing
- Corrected lead width dimension in side view 1 from "0.25 - 0.036" to "0.25 - 0.36"
Updated POD L10.3x3C from rev 1 to rev 4. Changes since rev 1:
- Updated Format to new standard
- Removed package outline and included center to center distance between lands on recommended land
pattern.
- Removed Note 4 "Dimension b applies to the metallized terminal and is measured between 0.18mm and
0.30mm from the terminal tip." since it is not applicable to this package. Renumbered notes accordingly.
- Tiebar Note 4 updated
From: Tiebar shown (if present) is a non-functional feature.
To: Tiebar shown (if present) is a non-functional feature and may be located on any of the 4 sides (or ends).
Updated POD M8.15 from rev 1 to rev 4. Changes since rev 1:
- Updated to new POD format by removing table and moving dimensions onto drawing and adding land pattern
- Changed in Typical Recommended Land Pattern the following:
2.41(0.095) to 2.20(0.087)
0.76 (0.030) to 0.60(0.023)
0.200 to 5.20(0.205)
- Changed Note 1 "1982" to "1994"
About Intersil
Intersil Corporation is a leading provider of innovative power management and precision analog solutions. The company's products
address some of the largest markets within the industrial and infrastructure, mobile computing and high-end consumer markets.
For the most updated datasheet, application notes, related documentation and related parts, please see the respective product
information page found at www.intersil.com.
You may report errors or suggestions for improving this datasheet by visiting www.intersil.com/ask.
Reliability reports are also available from our website at www.intersil.com/support
For additional products, see www.intersil.com/en/products.html
Intersil products are manufactured, assembled and tested utilizing ISO9001 quality systems as noted
in the quality certifications found at www.intersil.com/en/support/qualandreliability.html
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time
without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be
accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third
parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
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13
FN6364.2
August 25, 2015
ISL3159E
Package Outline Drawing
M8.118
8 LEAD MINI SMALL OUTLINE PLASTIC PACKAGE
Rev 4, 7/11
5
3.0±0.05
A
DETAIL "X"
D
8
1.10 MAX
SIDE VIEW 2
0.09 - 0.20
4.9±0.15
3.0±0.05
5
0.95 REF
PIN# 1 ID
1
2
B
0.65 BSC
GAUGE
PLANE
TOP VIEW
0.55 ± 0.15
0.25
3°±3°
0.85±010
H
DETAIL "X"
C
SEATING PLANE
0.25 - 0.36
0.08 M C A-B D
0.10 ± 0.05
0.10 C
SIDE VIEW 1
(5.80)
NOTES:
(4.40)
(3.00)
1. Dimensions are in millimeters.
(0.65)
(0.40)
(1.40)
TYPICAL RECOMMENDED LAND PATTERN
Submit Document Feedback
14
2. Dimensioning and tolerancing conform to JEDEC MO-187-AA
and AMSEY14.5m-1994.
3. Plastic or metal protrusions of 0.15mm max per side are not
included.
4. Plastic interlead protrusions of 0.15mm max per side are not
included.
5. Dimensions are measured at Datum Plane "H".
6. Dimensions in ( ) are for reference only.
FN6364.2
August 25, 2015
ISL3159E
Package Outline Drawing
L10.3x3C
10 LEAD DUAL FLAT PACKAGE (DFN)
Rev 4, 3/15
3.00
5
PIN #1 INDEX AREA
A
B
10
5
PIN 1
INDEX AREA
1
2.38
3.00
0.50
2
10 x 0.25
6
(4X)
0.10 C B
1.64
TOP VIEW
10x 0.40
BOTTOM VIEW
(4X)
0.10 M C B
SEE DETAIL "X"
(10 x 0.60)
(10x 0.25)
0.90
MAX
0.10 C
BASE PLANE
2.38
0.20
C
SEATING PLANE
0.08 C
SIDE VIEW
(8x 0.50)
1.64
2.80 TYP
C
TYPICAL RECOMMENDED LAND PATTERN
0.20 REF
4
0.05
DETAIL "X"
NOTES:
Submit Document Feedback
15
1.
Dimensions are in millimeters.
Dimensions in ( ) for Reference Only.
2.
Dimensioning and tolerancing conform to AMSE Y14.5m-1994.
3.
Unless otherwise specified, tolerance : Decimal ± 0.05
4.
Tiebar shown (if present) is a non-functional feature and may be
located on any of the 4 sides (or ends).
5.
The configuration of the pin #1 identifier is optional, but must be
located within the zone indicated. The pin #1 identifier may be
either a mold or mark feature.
6.
Compliant to JEDEC MO-229-WEED-3 except for E-PAD
dimensions.
FN6364.2
August 25, 2015
ISL3159E
Package Outline Drawing
M8.15
8 LEAD NARROW BODY SMALL OUTLINE PLASTIC PACKAGE
Rev 4, 1/12
DETAIL "A"
1.27 (0.050)
0.40 (0.016)
INDEX
6.20 (0.244)
5.80 (0.228)
AREA
0.50 (0.20)
x 45°
0.25 (0.01)
4.00 (0.157)
3.80 (0.150)
1
2
8°
0°
3
0.25 (0.010)
0.19 (0.008)
SIDE VIEW “B”
TOP VIEW
2.20 (0.087)
SEATING PLANE
5.00 (0.197)
4.80 (0.189)
1.75 (0.069)
1.35 (0.053)
1
8
2
7
0.60 (0.023)
1.27 (0.050)
3
6
4
5
-C-
1.27 (0.050)
0.51(0.020)
0.33(0.013)
SIDE VIEW “A
0.25(0.010)
0.10(0.004)
5.20(0.205)
TYPICAL RECOMMENDED LAND PATTERN
NOTES:
1. Dimensioning and tolerancing per ANSI Y14.5M-1994.
2. Package length does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006
inch) per side.
3. Package width does not include interlead flash or protrusions. Interlead
flash and protrusions shall not exceed 0.25mm (0.010 inch) per side.
4. The chamfer on the body is optional. If it is not present, a visual index
feature must be located within the crosshatched area.
5. Terminal numbers are shown for reference only.
6. The lead width as measured 0.36mm (0.014 inch) or greater above the
seating plane, shall not exceed a maximum value of 0.61mm (0.024 inch).
7. Controlling dimension: MILLIMETER. Converted inch dimensions are not
necessarily exact.
8. This outline conforms to JEDEC publication MS-012-AA ISSUE C.
Submit Document Feedback
16
FN6364.2
August 25, 2015