SPI/Digital or I2C µModule Isolators + Power Complete Isolated Digital Interface with Three Isolated Power Rails— No External Components Required The LTM®2883 is a complete digital µModule® galvanic isolator. The LTM2883’s internal inductive isolation barrier breaks ground loops by isolating the logic level interface for SPI, I2C or general purpose I/O. An onboard DC/DC converter provides power to the internal communications interface and to three adjustable isolated power supply outputs, nominally 5V, 12.5V and –12.5V. Each supply can be adjusted from its nominal value using a single external resistor. The LTM2883’s 2500VRMS isolation, onboard secondary power, digital communications interface and guaranteed uninterrupted communication through common mode transients greater than 30kV/µs, provides a simple, highly integrated µModule solution for isolated serial data communications. Features Isolated Supplies vs Equal Load Current 6-Channel Logic Isolator: 2500VRMS n UL Recognized File #E151738 Isolated Adjustable DC Power: 3V to 5V at Up to 30mA ±12.5V at Up to 25mA No External Components Required High Speed Logic Isolation: 10MHz Digital (LTM2883-S) 4MHz Full Duplex SPI (LTM2883-S) 400kHz I2C (LTM2883-I) High Common Mode Transient Immunity: 30kV/μs 3.3V (LTM2883-3) or 5V (LTM2883-5) Operation 1.62V to 5.5V Logic Supply ±10kV ESD HBM Across the Isolation Barrier Common Mode Working Voltage: 560VPEAK Low Current Shutdown Mode (<10µA) 15mm × 11.25mm BGA Package n 14 ® LTM2883-5 VCC = 5V n n n VCC2, V+, |V–| VOLTAGE (V) n 12 10 8 6 4 VCC2 V+ V– 2 n n n 0 0 n n n L, LT, LTC, LTM, Linear Technology, the Linear logo and µModule are registered trademarks and the Isolator logo is a trademark of Linear Technology Corporation. All other trademarks are the property of their respective owners. 5 10 15 20 LOAD CURRENT (mA) 25 30 Isolated µModule Technology TOP VIEW 1 To achieve greater than 2500VRMS isolation, the LTM2883 utilizes Isolator μModule technology, which uses coupled signal inductors embedded in the μModule substrate. This technique ensures consistent ruggedness and reliability, and will be certified by UL, CSA and IEC. The μModule package integrates several technologies to deliver a cost-effective, advanced solution that minimizes board space and improves electrical and thermal performance. 2 3 4 5 6 7 8 SDO DO2 SCK SDI CS SDOE ON A VL B C DO1 GND VCC D E F G H J I1 GND2 – + AVCC2 AV AV K L SDO2 I2 SCK2 SDI2 CS2 VCC2 V– V+ BGA PACKAGE 32-PIN (15mm × 11.25mm × 3.42mm) 2V/DIV 2V/DIV SCK Common Mode Transient Immunity SDO REPETITIVE 35kV/µs COMMON MODE TRANSIENTS FROM GND TO GND2 200V/DIV 20ns/DIV Unlike other isolated solutions, the LTM2883 allows communication through common mode transient events greater than 30kV/µs, unaffected by the transient and avoiding any priority data jitter or data corruption. The system also includes data refresh, error checking and safe shutdown for truly robust digital communications. *LTM2883-S “ROUNDTRIP” CONFIGURATION SCK2 OUTPUT CONNECTED TO SDO2 INPUT EMI Performance: LTM2883 vs Competitor A 60 Devices measured on LTM2883 Demo Circuit 1748A CISPR 22 Class B Limit LTM2883 50 Competitor A 40 6 dB Safety Margin 30 dBμV/m 20 10 0 GTEM Radiated Emission Scan Corrected per IEC 61000-4-20 Detector=Peak RBW=120kHz VBW=300kHz Sweep Time=680ms # of Points=8084 -10 -20 -30 0 100 200 300 400 500 600 700 800 900 1,000 Frequency (MHz) www.linear.com/2883 n 1-800-4-LINEAR 0211A