LTM2883 SPI/Digital or I2C uModule Isolator + Power

SPI/Digital or I2C µModule Isolators + Power
Complete Isolated Digital Interface with Three Isolated Power Rails—
No External Components Required
The LTM®2883 is a complete digital µModule® galvanic isolator. The LTM2883’s internal inductive isolation barrier breaks ground
loops by isolating the logic level interface for SPI, I2C or general purpose I/O. An onboard DC/DC converter provides power to
the internal communications interface and to three adjustable isolated power supply outputs, nominally 5V, 12.5V and –12.5V.
Each supply can be adjusted from its nominal value using a single external resistor. The LTM2883’s 2500VRMS isolation, onboard
secondary power, digital communications interface and guaranteed uninterrupted communication through common mode
transients greater than 30kV/µs, provides a simple, highly integrated µModule solution for isolated serial data communications.
Features
Isolated Supplies vs
Equal Load Current
6-Channel Logic Isolator: 2500VRMS
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UL Recognized
File #E151738
Isolated Adjustable DC Power:
3V to 5V at Up to 30mA
±12.5V at Up to 25mA
No External Components Required
High Speed Logic Isolation:
10MHz Digital (LTM2883-S)
4MHz Full Duplex SPI (LTM2883-S)
400kHz I2C (LTM2883-I)
High Common Mode Transient Immunity: 30kV/μs
3.3V (LTM2883-3) or 5V (LTM2883-5) Operation
1.62V to 5.5V Logic Supply
±10kV ESD HBM Across the Isolation Barrier
Common Mode Working Voltage: 560VPEAK
Low Current Shutdown Mode (<10µA)
15mm × 11.25mm BGA Package
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14
®
LTM2883-5
VCC = 5V
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VCC2, V+, |V–| VOLTAGE (V)
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12
10
8
6
4
VCC2
V+
V–
2
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0
0
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L, LT, LTC, LTM, Linear Technology, the Linear logo and µModule are
registered trademarks and the Isolator logo is a trademark of Linear
Technology Corporation. All other trademarks are the property of their
respective owners.
5
10
15
20
LOAD CURRENT (mA)
25
30
Isolated µModule Technology
TOP VIEW
1
To achieve greater than 2500VRMS isolation,
the LTM2883 utilizes Isolator μModule
technology, which uses coupled signal
inductors embedded in the μModule
substrate. This technique ensures consistent
ruggedness and reliability, and will be
certified by UL, CSA and IEC. The μModule
package integrates several technologies to
deliver a cost-effective, advanced solution
that minimizes board space and improves
electrical and thermal performance.
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SDO DO2 SCK SDI CS SDOE ON
A
VL
B
C
DO1
GND
VCC
D
E
F
G
H
J
I1
GND2
–
+
AVCC2 AV AV
K
L
SDO2 I2 SCK2 SDI2 CS2 VCC2 V–
V+
BGA PACKAGE
32-PIN (15mm × 11.25mm × 3.42mm)
2V/DIV
2V/DIV
SCK
Common Mode Transient Immunity
SDO
REPETITIVE
35kV/µs
COMMON
MODE
TRANSIENTS
FROM GND
TO GND2
200V/DIV
20ns/DIV
Unlike other isolated solutions, the LTM2883 allows
communication through common mode transient events greater
than 30kV/µs, unaffected by the transient and avoiding any
priority data jitter or data corruption. The system also includes
data refresh, error checking and safe shutdown for truly robust
digital communications.
*LTM2883-S “ROUNDTRIP” CONFIGURATION
SCK2 OUTPUT CONNECTED TO SDO2 INPUT
EMI Performance: LTM2883 vs Competitor A
60
Devices measured on LTM2883 Demo Circuit 1748A
CISPR 22 Class B Limit
LTM2883
50
Competitor A
40
6 dB Safety Margin
30
dBμV/m
20
10
0
GTEM Radiated Emission Scan
Corrected per IEC 61000-4-20
Detector=Peak
RBW=120kHz
VBW=300kHz
Sweep Time=680ms
# of Points=8084
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-20
-30
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100
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800
900
1,000
Frequency (MHz)
www.linear.com/2883 n 1-800-4-LINEAR
0211A