Flexible Circuit Board Materials FCCL R-F775 R-F786W Standard type High curvature CCL Excellent dimensional stability and Spring back performance Features ❶ ❷ ❸ ❹ ❺ Thin Flexible Circuit Board Materials with a Low modulus polyimide Excellent Spring back performance and High flexibility (R-F786W) Excellent dimensional stability (R-F775) Halogen-free (Adhesiveless) Offer thick copper foil and Polyimide film (R-F775) Applications Smartphone, Casing edge, Slide keyboard, DSCs, Camera module, LCD module, etc. Spring back performance 12 ED12-25-12 30mm 䕦50%Down 10 10mm Weight load 3DQDVRQLF 5 R-F786W ED12-25-12 Gap quantity Test coupon Number of times 㻳㼍㼜㻌㼝㼡㼍㼚㼠㼕㼠㼥䠄㼙㼙䠅 14 CCL with Copper Company A 15 Weight load flexibility Condition 10 8 6 4 2 0 0 5 3DQDVRQLF 10 Company B R-F786W ED12-25-12 㼃㼑㼕㼓㼔㼠㼘㼛㼍㼐䠄䡃䡂䠅 ED12-25-12 General Properties Condition Property Test condition Unit R-F775 R-F786W Standard Value A GPa 7.1 5.1 ‒ Weight roll ：2.0Kgf Tensile Modulus Radius Repetiton Insulation resistance of the surface layer A Ω 1×1015 1×1015 1.0E+11 or more Dk A 1MHz − 3.2 3.2 4.0(max.) Df A 1MHz − 0.002 0.008 0.07 or less A and E-169/70 − 94V-0 94VTM-0 94V‒0 After having gent, put it back Flame resistance(UL) Chemical resistance No abnormality No abnormality No abnormality 1.3 1.1 0.525 or more 1.3 1.2 0.525 or more − No abnormality No abnormality No abnormality − No abnormality No abnormality No abnormality After etching MD direction 0.030 0.021 0.10∼‒0.10 After etching TD direction 0.037 0.015 0.10∼‒0.10 0.022 0.018 0.10∼‒0.10 0.027 0.015 0.10∼‒0.10 RA 18-25-18 RA 18-25-18 NaOH2mol/l 23℃5 min − IPA 23℃5 min Company B 㻡䃛㼙 A Peel strength L/S=1/1mm Crystalstructure after lamination 3DQDVRQLF HCL2mol/l 23℃5 min ：0 ⇔ 180° Judgement ：disconnected 㻡䃛㼙 ※ special ED copper N/mm 260℃ solder float for 5sec Solder heat Resistance A 288℃ solder float for 1min Moisture Absorption Solder Heat Resistance C-96/40/90 260℃ solder float for 1min Solder heat resistance Solder Temp（℃） Normal state After abssorption 40℃90％96Hr Dimensional stability ％ After E-0.5/150 MD direction After E-0.5/150 TD direction R - F7 75 330 270 R - F78 6W 360 30 0 The above data is actual values and not guaranteed values. LQGXVWULDOSDQDVRQLFFRPHP 3DQDVRQLF&RUSRUDWLRQ Flexible Circuit Board Materials FCCL Standard type R-F775 R-F786W High curvature CCL Line-up Film Film thickness Type Grade 12.5 1/2mil 15 3/5mil 20 4/5mil 25 1mil 38 50 2mil 75 3mil 100 4mil 125 5mil 150 6mil Standard PI R-F775 Double side ○＊ ○ ○ ○ ○ ○ ○ ○ ○ ○ High Heat resistance PI R-F786W Double side ○ − − ○ − ○ − − − − ＊ ：Under development Copper Foil R-F775 Copper Foil thickness SPEC. 2 with Carrier 6 1/6OZ 9 1/4OZ 12 1/3OZ 18 1/2OZ 35 1OZ 70 2OZ 105 3OZ 150 4OZ Standard ○ ○＊ ○ ○ ○ − − − − Special − ○＊ ○ ○ ○ ○ − − − Standard − − ○ ○ ○ ○ ○ ○＊ ○＊ Special − ○＊ ○ ○ ○ − − − − ED RA ＊ ：Under development R-F7８６W Copper Foil thickness SPEC. 12 1/3OZ 18 1/2OZ ED Special ○ ○ RA Special ○ ○ Size Type TD（Width） 250mm Roll 500mm 510mm Sheet Max.510mm LQGXVWULDOSDQDVRQLFFRPHP 3DQDVRQLF&RUSRUDWLRQ