Flexible Circuit Board Materials Resin Coated Copper Foil FRCC R-FR10 Material for thinner and multilayed It is possible to make board thickness thinner and to reduce a manufacture process Features ❶ ❷ ❸ ❹ Bendable due to the use of low modulus resin technology It is possible to make board thinner and multilayed Excellent Insulation resistance between layer to layer Halogen-free Applications Smartphone (Main board, Subboard, Module etc.), HDI board Concept Coplanarity of lamination Thickness of 4 layer Rigid-Flex board and Process cost Cover Lay with Copper foil Thick 0.30 Other company s PCB Thickness(mm) 0.25 FRCC 0.20 Thin Copper foil with resin High Coplanarity FRCC Low Process cost High General Properties Test item Unit Volume resistivity MΩ・m Surface resistance MΩ Dielectric constant（1MHz） - Dielectric constant（1GHz） - Dissipation factor（1MHz） - Dissipation factor（1GHz） Solder heat resistance（260℃） Peel strength Copper foil：0.012mm（12μm） Water absorption Flammability （UL method） Alkali resistance Tensile Modulus second N/mm ％ GPa Treatment conditions C-96/20/65 C-96/20/65+C-96/40/90 C-96/20/65 C-96/20/65+C-96/40/90 C-96/20/65 C-96/20/65+D-24/23 C-24/23/50 C-96/20/65 C-96/20/65+D-24/23 C-24/23/50 A A S4 E-24/50+D-24/23 A and E-168/70 Immersion（3 minutes） DMA R-FR10 Actual value 1×10 8 9×10 7 3×10 8 1×10 8 3.2 3.2 3.1 0.018 0.018 0.016 60 0.8 0.8 1.2 94VTM-0 no abnormality 2.0 Note：Test piece thickness is 0.04mm. However, test piece thickness of Flammability is 0.1mm of 4 layer board (core meterial is 0.025mm PI) The above data is actual values and not guaranteed values. 2015.5 industrial.panasonic.com/em Panasonic Corporation Flexible Circuit Board Materials Resin Coated Copper Foil FRCC R-FR10 Material for thinner and multilayed Line-up Standard Specification Copper foil PI layer Adhesive ● Copper foil 12μm （1/3oz） Electrolytic ○ ● PI layer 5μm ○ ● Product size ● Adhesive Type TD（mm） Roll Max.520 15μm 20μm 25μm 28μm Sheet Max.520 ○ ○ ○ ○ Characteristics Feature of layer construction Typical 4 layers flexible circuit board 4 layers flexible circuit board FRCC with Cover Lay Prepreg Multi-layer part Flexible part Multi-layer part FRCC FRCC Manufacture Process of 4 layers flexible circuit board Typical 4 layers flexible circuit board 4 layers flexible circuit board FRCC with Pattering（Inner Layer） Pattering （Inner Layer） Cover Lay Lamination Felios FRCC Lamination Cover-Lay Surface treatment Copper Foil Lamination Cover-Lay Surface treatment Process Simplification Material Reduction Copper Foil Lamination Drilling Cu Plating Drilling Cu Plating Pattering（Outer Layer） Pattering （Outer Layer） Solder Resist Coating Solder Resist Coating Punching, Routing Punching, Routing The above data is actual values and not guaranteed values. 2015.5 industrial.panasonic.com/em Panasonic Corporation