No.15111373 Process Guidelines Laminate R-5735 Prepreg R-5630 High Speed, Low Loss Multi-layer Materials No.15111373 -1 General Material Storage R-5735 laminate and R-5630 prepreg is the same as our conventional FR-4 material. Laminate should be stored flat in a cool dry environment. Avoid bending or scratching the laminate surface. When possible store the laminate in the original container. Prepreg should be stored flat in a cool dry controlled environment, 73 F(23 C) or less and 50% RH or less. Laminate Surface Preparation Regular Shiny Copper can be cleaned using industry standard chemical clean or mechanical clean. Reverse Treat Copper should be cleaned using industry standard chemical clean. Inner Layer Bond Treatment Black or Brown Oxide can be used. Alternative Oxide Treatment using a Peroxide/Sulfuric etch technology can be also used. Drying Dry finished inner layers completely to remove any absorbed moisture or surface moisture. A racked bake at 300 F(150 C) for 1-2 hours is preferred. For conveyorized alternative oxide processing, some equipment may have sufficient drying capability. However, a racked bake is suggested. The following guidelines are provided as general recommendations. Process optimization may be necessary. No.15111373 -2 Drilling (1) Drilling parameters in general condition Drilling parameters should be adjusted depending on hole size, layer count, panel thickness, stack count and stack height etc. (1) Drilling parameters in general condition min max diameter ｓpindle velocity infeed chipload infeed chipload mm 0.20 0.25 0.30 0.35 0.40 0.45 0.50 0.55 0.60 0.65 0.70 0.75 0.80 0.85 0.90 rpm 160,000 160,000 160,000 137,000 120,000 107,000 96,000 87,000 80,000 74,000 68,000 64,000 60,000 56,000 53,000 m/min 100 126 151 151 151 151 151 150 151 151 149 151 151 149 150 m/min 1.6 1.8 1.9 1.8 1.8 1.8 1.8 1.8 1.7 1.7 1.7 1.6 1.6 1.6 1.6 μ/rev 10 11 12 13 15 17 19 21 21 23 25 25 27 29 30 m/min 2.4 2.8 3.2 3.0 2.9 2.7 2.7 2.6 2.6 2.6 2.6 2.6 2.5 2.4 2.4 μ/rev 15 18 20 22 24 25 28 30 33 35 38 41 42 43 45 The following guidelines are provided as general recommendations. Process optimization may be necessary. bit life hits 750-2,000 750-2,000 1,500-3,000 1,500-3,000 1,500-3,000 1,500-3,000 1,500-3,000 1,500-3,000 1,500-3,000 1,500-3,000 1,500-3,000 1,500-3,000 1,500-3,000 1,500-3,000 1,500-3,000 No.15111373 -3 Drilling (2) Positioning accuracy (2) Positioning accuracy Drill size mm 0.3 Surface speed m/min 151 Revolution rpm 160000 Chip load micron/rev 20 Hit count 3000 0.15 Aluminum (lubricated is preferred) Entry board Panel thickness mm 0.76 ( #2116x2 + #2116x2 1oz/1oz + #2116x2 ) Copper thickness oz 1/1 Stack count 4 Positioning accuracy map of R-5735 and R-5725. R-5735 R-5725 positioning accuracy : 50.2 micron positioning accuracy : 45.1 micron The following guidelines are provided as general recommendations. Process optimization may be necessary. No.15111373 -4 Laminate Curing temperature time will be determined by the thickness of multilayer package being laminated. Laminate parameters should be adjusted depending on board thickness, stack count and stack thickness etc. Please Note : below is NOT a press control program. The graph represents the recommended pressure/temperature profile that the actual panels are subjected to during the lamination program cycle. above 200 C for over 80 min Platen temperature ↑ Product temperature Heat up rate 3 ~ 4 C/min (100 C ~ 140 C) ◆ Heat up rate (100 C ~ 140 C) <Recommended> 3 ~ 4 C/min <Proper range> 2 ~ 4 C/min 110 80 Pressure 2.0 ~ 3.5 MPa (Ramp up pressure during 80 C ~ 110 C) 20 0.5 MPa 30 60 90 Time (min） ） Vacuum : 100 Torr (13.3 kPa) or less, from start to over 60 min ( ~ around 160 C) The following guidelines are provided as general recommendations. Process optimization may be necessary. Pressure (MPa) Temperature ( C ) 200 No.15111373 -5 Desmear The weight loss of R-5735 laminate and R-5630 prepreg is less than that of R-1766 as our conventional FR-4 material and nearly same as R-5725. Desmear parameters should be adjusted depending on board thickness, stack count and stack thickness etc. process reagent type temp. (C) time (min) Swelling alkaline 65-85 5-10 Etching permanganate 70-85 10-15 process reagent type temp. (C) time (min) Swelling organic solvent 35-40 6-10 Etching permanganate 70-85 10-15 Part number Weight loss ratio R-5735 0.3 - 0.7 R-5725 0.3 - 0.7 R-1766 1.0 The following guidelines are provided as general recommendations. Process optimization may be necessary. No.15111373 -6 ++Before purchase++ * If delivery specifications have been agreed upon, descriptions in the delivery specifications take precedence. * Specifications and appearances are subject to change without prior notice for product improvement. * For details of the products contained in this catalog, contact your dealer or our sales representative. * ALL data are our actual values and not assured values. 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