MS8E Package 8-Lead Plastic MSOP, Exposed Die Pad (Reference LTC DWG # 05-08-1662 Rev K) BOTTOM VIEW OF EXPOSED PAD OPTION 1.88 (.074) 1 1.88 ±0.102 (.074 ±.004) 0.29 REF 1.68 (.066) 0.889 ±0.127 (.035 ±.005) 0.05 REF 5.10 (.201) MIN DETAIL “B” CORNER TAIL IS PART OF DETAIL “B” THE LEADFRAME FEATURE. FOR REFERENCE ONLY NO MEASUREMENT PURPOSE 1.68 ±0.102 3.20 – 3.45 (.066 ±.004) (.126 – .136) 8 3.00 ±0.102 (.118 ±.004) (NOTE 3) 0.65 (.0256) BSC 0.42 ±0.038 (.0165 ±.0015) TYP 8 7 6 5 0.52 (.0205) REF RECOMMENDED SOLDER PAD LAYOUT 0.254 (.010) 3.00 ±0.102 (.118 ±.004) (NOTE 4) 4.90 ±0.152 (.193 ±.006) DETAIL “A” 0° – 6° TYP GAUGE PLANE 0.53 ±0.152 (.021 ±.006) DETAIL “A” 1 2 3 4 1.10 (.043) MAX 0.86 (.034) REF 0.18 (.007) SEATING PLANE 0.22 – 0.38 (.009 – .015) TYP 0.65 (.0256) BSC NOTE: 1. DIMENSIONS IN MILLIMETER/(INCH) 2. DRAWING NOT TO SCALE 3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE 4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS. INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE 5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX 6. EXPOSED PAD DIMENSION DOES INCLUDE MOLD FLASH. MOLD FLASH ON E-PAD SHALL NOT EXCEED 0.254mm (.010") PER SIDE. 0.1016 ±0.0508 (.004 ±.002) MSOP (MS8E) 0213 REV K