T PL IA N M CO *R oH S Features Applications ■ RoHS compliant* ■ Ethernet - 10/100/1000 Base T ■ Protects up to four I/O ports ■ Personal digital assistants ■ Bidirectional configuration ■ Handheld electronics ■ ESD protection ■ Cellular phones ■ Low capacitance: 6 pF ■ Video cards CDNBS08-SLVU2.8-8 - Low Capacitance TVS Array General Information The markets of portable communications, computing and video equipment are challenging the semiconductor industry to develop increasingly smaller electronic components. 8 7 6 5 1 2 3 4 Bourns offers Transient Voltage Suppressor Array combination diodes for surge and ESD protection applications in an eight lead narrow body SOIC package size format. Bourns® Chip Diodes conform to JEDEC standards, are easy to handle on standard pick and place equipment and their flat configuration minimizes roll away. The Bourns® device will meet IEC 61000-4-2 (ESD), IEC 61000-4-4 (EFT) and IEC 61000-4-5 (Surge) requirements. Electrical Characteristics (@ TA = 25 °C Unless Otherwise Noted) Parameter Symbol Max. Unit IPP 30 A Peak Pulse Power (tp= 8/20 µs) 1 PPP 600 W Working Voltage VWM 2.8 V Breakdown Voltage @ 1 mA VBR 1.0 µA Peak Pulse Current (tp= 8/20 µs) Leakage Current @ VWM ID Capacitance @ 0 V, 1 MHz C Min. 3.0 EFT Protection per IEC 61000-4-4 @ 5/50 ns Surge Protection per IEC 61000-4-5 Clamping Voltage @ 8/20 µs V 6 Snapback Voltage @ 50 mA ESD Protection per IEC 61000-4-2 Contact Discharge Air Discharge Nom. ESD pF 2.8 V ±8 ±15 kV EFT 60 A @ IP = 5 A 2 VC 8.5 V @ IP = 24 A 2 VC 15 V @ IPP = 30 A 2 VC 17 V Notes: 1. See Peak Pulse Power vs. Pulse Time. 2. Each differential line pair. Thermal Characteristics (@ TA = 25 °C Unless Otherwise Noted) Parameter Symbol Min. Nom. Max. Unit Junction Temperature Range TJ -55 +25 +125 °C Storage Temperature Range TSTG -55 +25 +150 °C *RoHS Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 2011/65/EU June 8, 2011. Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. CDNBS08-SLVU2.8-8 - Low Capacitance TVS Array Product Dimensions Recommended Footprint This is an RoHS compliant molded JEDEC narrow body SO-8 package with 100 % Sn plating on the lead frame. It weighs approximately 15 mg and has a flammability rating of UL 94V-0. A B A J G 45 ° NOM. D C B C 4°±4° E H I 7 ° NOM. 4 PLCS. D Dimensions DIMENSIONS = MILLIMETERS (INCHES) 7 ° NOM. 3 PLCS. E A 1.143 - 1.397 (0.045 - 0.065) B 0.635 - 0.889 (0.025 - 0.035) C 6.223 Min. (0.245) Min. D 3.937 - 4.191 (0.155 - 0.165) E 1.016 - 1.27 (0.040 - 0.050) F K L Dimensions A 4.80 - 5.00 (0.189 - 0.197) B 3.81 - 4.00 (0.150 - 0.157) C 5.80 - 6.20 (0.228 ± 0.244) D 0.36 - 0.51 (0.014 - 0.020) E 1.35 - 1.75 (0.053 - 0.069) F 0.102 - 0.203 (0.004 - 0.008) G 0.25 - 0.50 (0.010 - 0.020) H 0.51 - 1.12 (0.020 - 0.044) I 0.190 - 0.229 (0.0075 - 0.0090) J 4.60 - 5.21 (0.181 - 0.205) K 0.28 - 0.79 (0.011 - 0.031) L 1.27 (0.050) Typical Part Marking CDNBS08-SLVU2.8-8 ..................................................... SL8 How to Order CD NBS08 - SLVU 2.8 - 8 Common Code Chip Diode Package NBS08 = Narrow Body SOIC8 Package Model SLVU = Low Capacitance TVS Array Working Peak Reverse Voltage 2.8 = 2.8 VRWM (Volts) Number of Diodes Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. CDNBS08-SLVU2.8-8 - Low Capacitance TVS Array Block Diagram Device Pinout 8 7 1 6 2 Pin Bidirectional Common Mode Bidirectional Differential Mode 1 Line 1 Line Pair 1 2 GND Line Pair 1 3 GND Line Pair 2 4 Line 4 Line Pair 2 5 Line 3 Line Pair 4 6 GND Line Pair 4 7 GND Line Pair 3 8 Line 2 Line Pair 3 5 3 4 Performance Graphs Peak Pulse Power vs Pulse Time Pulse Waveform 120 IPP – Peak Pulse Current (% of IPP) PPP – Peak Pulse Current (W) 10,000 600 W, 8/20 µs Waveform 1,000 100 1 10 100 1,000 10,000 et 60 40 td = t|IPP/2 20 Power Derating Curve 100 Peak Pulse Power 8/20 µs 80 60 40 20 Average Power 0 25 50 75 0 5 10 15 t – Time (µs) td – Pulse Duration (µs) % of Rated Power 80 0 10 0.01 0 Test Waveform Parameters tt = 8 µs td = 20 µs tt 100 100 125 TL – Lead Temperature (°C) Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. 150 20 25 30 CDNBS08-SLVU2.8-8 - Low Capacitance TVS Array Packaging Information The product is packaged in tape and reel format per EIA-481 standard. P 0 P 1 d PART ORIENTATION T E Index Hole 120 ° F D2 W B PIN 1 D1 D P A Trailer ....... ....... End C Device ....... ....... ....... ....... Leader ....... ....... W1 Start DIMENSIONS: 10 pitches (min.) MM (INCHES) 10 pitches (min.) Direction of Feed Item Symbol NSOIC 8L Carrier Width A 6.7 ± 0.10 (0.264 ± 0.004) Carrier Length B 5.5 ± 0.10 (0.217 ± 0.004) Carrier Depth C 2.10 ± 0.10 (0.083 ± 0.004) Sprocket Hole d 1.55 ± 0.05 (0.061 ± 0.002) Reel Outside Diameter D 330 (12.992) Reel Inner Diameter D1 Feed Hole Diameter D2 13.0 ± 0.20 (0.512 ± 0.008) Sprocket Hole Position E 1.75 ± 0.10 (0.069 ± 0.004) Punch Hole Position F 3.50 ± 0.05 (0.138 ± 0.002) Punch Hole Pitch P 8.00 ± 0.10 (0.315 ± 0.004) Sprocket Hole Pitch P0 4.00 ± 0.10 (0.157 ± 0.004) Embossment Center P1 2.00 ± 0.05 (0.079 ± 0.002) Overall Tape Thickness T 0.20 ± 0.10 (0.008 ± 0.004) Tape Width W 12.00 ± 0.20 (0.472 ± 0.008) Reel Width W1 Quantity per Reel -- 80.0 MIN. (3.1500) Asia-Pacific: Tel: +886-2 2562-4117 Fax: +886-2 2562-4116 Europe: Tel: +41-41 768 5555 Fax: +41-41 768 5510 The Americas: Tel: +1-951 781-5500 Fax: +1-951 781-5700 www.bourns.com 18.4 MAX. (0.724) 2500 REV. 12/12 Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications.