NT IA PL M CO S oH *R Features Applications ■ Lead free device (RoHS compliant*) ■ Ethernet ports ■ ESD protection >40 kV ■ Portable electronics ■ Protects 6 lines ■ Wireless LANs ■ Low capacitance ~5 pF ■ USB interface CDNBS08-SR112 - Steering Diode Array General Information The CDNBS08-SR112 device provides ESD, EFT and Surge protection for external ports meeting IEC 61000-4-2 (ESD), IEC 61000-4-4 (EFT) and IEC 61000-4-5 (Surge) requirements. REF 1 I/O 6 REF 2 I/O 5 8 7 6 5 The steering diode array provides up to 6 lines of protection using the “rail to rail” clamping technique with low leakage current and low capacitance per line. The device is available in a JEDEC SO-8 package and is intended to be mounted directly onto an FR4 printed circuit board. 1 2 3 4 I/O 1 I/O 2 I/O 3 I/O 4 E T E L O S B O Absolute Maximum Ratings (@ TA = 25 °C Unless Otherwise Noted) Parameter Power Dissipation - Continuous Storage Temperature Operating Temperature Symbol Value Unit PPD 145 mW TSTG -55 to 150 ºC TOPR -55 to 150 ºC Symbol Value Unit VF 1.3 V VRRM 20 V IFM 12 A Electrical Characteristics (@ TA = 25 °C Unless Otherwise Noted) Parameter Typical Forward Voltage @ 50 mA Repetitive Peak Reverse Voltage (NOTE 1) Maximum Peak Pulse Current @ 8/20 µS Maximum Leakage Current @ 18 V IR 20 nA Maximum Quiescent Supply Current @ 20 V VM 200 nA Typical Junction Capacitance @ 0 V 1 MHz (NOTE 2) IQ 5 pF ESD Protection per IEC 61000-4-2 Minimum Contact Discharge Minimum Air Discharge CJ ±8 ±15 kV kV EFT Protection per IEC 61000-4-4 @ 5/50 ns 40 A Surge Protection per IEC 61000-4-5 @ 8/20 µs L1 (Line – Ground) L2 (Line – Line) 12 12 A A Notes: 1. VRRM is +VCC for Pin 8 and –VEE for Pin 4. 2. Measure capacitance CJ between any I/O pins to ground and divide by 2. Asia-Pacific: Tel: +886-2 2562-4117 • Fax: +886-2 2562-4116 Europe: Tel: +41-41 768 5555 • Fax: +41-41 768 5510 The Americas: Tel: +1-951 781-5500 • Fax: +1-951 781-5700 www.bourns.com *RoHS Directive 2002/95/EC Jan 27 2003 including Annex. Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications CDNBS08-SR112 - Steering Diode Array Product Dimensions Recommended Footprint This is a molded JEDEC SO-8 package with lead free 100 % Sn plating on the terminations. It weighs approximately 70 mg and has a flammability rating of UL 94V-0. A B A D F B C H C E T E L O S B O G E Dimensions DIMENSIONS = MILLIMETERS (INCHES) D E A 1.143 - 1.397 (0.045 - 0.055) B 0.635 - 0.889 (0.025 - 0.035) C 6.223 ........ MIN. (0.245) Dimensions A 4.80 - 5.00 (0.189 - 0.196) D 3.937 - 4.191 (0.155 - 0.165) B 3.80 - 4.00 (0.150 - 0.157) E 1.016 - 1.27 (0.040 - 0.050) C 5.80 - 6.20 (0.229 - 0.244) D 1.35 - 1.75 (0.054 - 0.068) E 0.10 - 0.25 (0.004 - 0.008) F 0.25 - 0.50 (0.010 - 0.019) G 0.40 - 1.250 (0.016 - 0.049) H 0.18 - 0.25 (0.007 - 0.009) How to Order CD NBS08 - SR 112 Common Code Chip Diode Package • NBS08 = SO-8 Package Model SR = Steering Diode Code 112 = Special Code Typical Part Marking CDNBS08-SR112 ........................................................................ 112 Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications CDNBS08-SR112 - Steering Diode Array Performance Graphs Typical Low Current Forward Voltage Drop Pulse Waveform 120 TA = 25 °C SINGLE PULSE See Figure 2 160 Forward Current - mA IPP – Peak Pulse Current (% of IPP) 200 120 80 40 0 600 800 80 et 60 40 td = t|IPP/2 20 E T E L O S B O 1,100 0 0 1,200 5 Typical High Current Forward Voltage Drop 15 20 25 30 Non-Repetitive Peak Pulse Current TA = 25 °C SINGLE PULSE See Figure 2 3 2 1 0 0 1 Peak Pulse Current - Amps 8 4 Forward Current - A 10 t – Time (µs) Forward Voltage Drop - mV 5 Test Waveform Parameters tt = 8 µs td = 20 µs tt 100 2 Forward Voltage Drop - V Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications 3 6 4 2 0 0.001 0.01 0.1 1 Square Wave Pulse - ms 10 100 CDNBS08-SR112 - Steering Diode Array Packaging Specifications The product will be dispensed in Tape and Reel format (see diagram below). P 0 P 1 d T E Index Hole 120 ° F D2 W B D1 D P A Trailer C E T E L O S B O Device Leader ....... ....... ....... ....... ....... ....... ....... ....... End 10 pitches (min.) Symbol Carrier Width A Carrier Length B Carrier Depth C Sprocket Hole d Reel Outside Diameter D Reel Inner Diameter D1 Feed Hole Diameter D2 Sprocket Hole Position E Punch Hole Position F Punch Hole Pitch P Sprocket Hole Pitch P0 Embossment Center P1 Overall Tape Thickness T Tape Width W Reel Width W1 Quantity per Reel DIMENSIONS: W1 MM (INCHES) 10 pitches (min.) Direction of Feed Item Start -- Devices are packed in accordance with EIA standard RS-481-A. NSOIC 8L 6.7 ± 0.10 (0.264 ± 0.004) 5.5 ± 0.10 (0.217 ± 0.004) 2.10 ± 0.10 (0.083 ± 0.004) 1.55 ± 0.05 (0.061 ± 0.002) 330 (12.992) 80.0 MIN. (3.1500) 13.0 ± 0.20 (0.512 ± 0.008) 1.75 ± 0.10 (0.069 ± 0.004) 3.50 ± 0.05 (0.138 ± 0.002) 8.00 ± 0.10 (0.315 ± 0.004) 4.00 ± 0.10 (0.157 ± 0.004) 2.00 ± 0.05 (0.079 ± 0.002) 0.20 ± 0.10 (0.008 ± 0.004) 12.00 ± 0.20 (0.472 ± 0.008) 18.4 MAX. (0.724) 2500 REV. 09/09 Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications