PL IA NT CO M *R oH S Features Applications ■ Lead free as standard ■ Personal Digital Assistant (PDAs) ■ RoHS compliant* ■ Mobile phones and accessories ■ Low capacitance - 2 pF ■ Portable electronics ■ ESD protection >15 kV ■ ADSL / VDSL cards CDSOT563-0502 - Surface Mount TVS Diode Array General Information The CDSOT563-0502 device provides ESD and EFT protection for high speed data ports meeting IEC 61000-4-2 (ESD) and IEC 61000-4-4 (EFT) requirements. The Transient Voltage Suppressor array offers a Working Peak Reverse Voltage of 5 V and Minimum Breakdown Voltage of 6 V. I/O 1 VDD I/O 2 6 5 4 The SOT563 packaged device will mount directly onto the industry standard SOT563 footprint. Bourns® Chip Diodes are easy to handle with standard pick and place equipment and the flat configuration minimizes roll away. 1 2 3 I/O 1 GND 1/O 2 Electrical & Thermal Characteristics (@ TA = 25 °C Unless Otherwise Noted) Parameter Symbol Test Condition Min. Typ. Max. Peak Pulse Current IPPM 6 A Storage Temperature TSTG -55 +25 +150 °C Operating Temperature TOPR VWM -40 +25 +125 °C 5 V Working Peak Voltage Breakdown Voltage Leakage Current @ VWM Channel Leakage Current @ VWM Forward Voltage Clamping Voltage Channel Input Capacitance Channel Input Capacitance Channel to Channel Input Capacitance Channel to Channel Input Capacitance (tp = 8/20 µs) Unit VBR IL 9 V Vpin5 = 5 V, Vpin2 = 0 V, Pin 5 to Pin 2 5 µA ICH Vpin5 = 5 V, Vpin2 = 0 V, Any I/O to Pin 2 1 µA 1 V VF Vclamp_VDD CIN-1 CIN-2 CCROSS-1 CCROSS-2 @ 1 mA, Pin 5 to Pin 2 @ If =15 mA IPP = 5 A, tp = 8/20µs Vpin5 = 5 V, Vpin2 = 0 V, VIN = 2.5 V, f = 1 MHz 6 0.8 9 V 2 2.5 pF Vpin5 = floated, Vpin2 = 0 V, VIN = 2.5 V, f = 1 MHz 2.8 3.6 pF Vpin5 = 5 V, Vpin2 = 0 V, VIN = 2.5 V, f = 1 MHz 0.4 0.5 pF Vpin5 = floated, Vpin2 = 0 V, VIN = 2.5 V, f = 1 MHz 0.55 0.65 pF *RoHS Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 2011/65/EU June 8, 2011. Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications CDSOT563-0502 - Surface Mount TVS Diode Array Product Dimensions Recommended Footprint This is a molded SOT563 package with lead free 100 % Matte Sn on the lead frame. It weighs approximately 3 mg and has a flammability rating of UL 94V-0. 0.51 (0.020) TYP. 0.10 - 0.30 (0.004 - 0.012) 6 5 0.30 (0.012) TYP. 1.02 (0.040) TYP. 0.50 - 0.60 (0.020 - 0.024) 1.50 - 1.70 (0.059 - 0.067) 0.51 TYP. (0.020) 4 1.10 - 1.30 (0.043 - 0.051) 1.40 TYP. (0.055) 1.50 - 1.70 (0.059 - 0.067) Typical Part Marking 1 0.50 (0.020) BSC 2 3 0.17 - 0.27 (0.007 - 0.011) DIMENSIONS = MILLIMETERS (INCHES) CDSOT563-0502 ......................................................................52XY (“X” = Date Code; “Y” = Package House) 0.08 - 0.16 (0.003 - 0.007) How to Order CD SOT563 - 05 02 Common Diode Chip Diode Package SOT563 = SOT-563 Package Working Peak Reverse Voltage 05 = 5 V (Volts) Data Lines 02 = 2 Data Lines Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications CDSOT563-0502 - Surface Mount TVS Diode Array Rating & Characteristic Curves 12 11 10 9 8 7 6 5 4 3 2 1 0 Pulse Waveform I/O Pin to GND Pin VDD Pin to GND Pin Percent of IPP Clamping Voltage (V) Clamping Voltage vs. Peak Pulse Current Waveform Parameters: tr = 8 µs td = 20 µs 4.5 5.0 5.5 6.0 6.5 110 100 90 80 70 60 50 40 30 20 10 0 7.0 Waveform Parameters tt = 8 µs td = 20 µs et td = t|IPP/2 5 0 10 15 Peak Pulse Current (A) 3.00 2.75 2.50 2.25 2.00 1.75 1.50 1.25 1.00 0.75 0.50 0.25 0.00 25 30 Typical Variation of CIN vs. VIN 4.0 3.5 VDD Pin to GND Pin I/O Pin to GND Pin Waveform Parameters: tr = 8 µs td = 20 µs 4.6 4.8 5.0 5.2 5.4 5.6 5.8 6.0 6.2 6.4 6.6 6.8 7.0 Peak Pulse Current (A) Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications Input Capacitance (pF) Forward Clamping Voltage (V) Forward Clamping Voltage vs. Peak Pulse Current 20 Time (µs) VDD = floated 3.0 2.5 2.0 VDD = 5 V 1.5 1.0 f = 1 MHz, T = 25 °C 0.5 0.0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 Input Voltage (V) 3.5 4.0 4.5 5.0 CDSOT563-0502 - Surface Mount TVS Diode Array Packaging Information The product will be dispensed in tape and reel format (see diagram below) P 0 P 1 d T E Index Hole 120 ° F D2 W B D1 D P A Trailer ....... ....... End C Device ....... ....... ....... ....... Leader ....... ....... W1 Start DIMENSIONS: 10 pitches (min.) 10 pitches (min.) Direction of Feed Item Symbol SOT563 Carrier Width A 1.78 ± 0.05 (0.069 ± 0.002) Carrier Length B 1.78 ± 0.05 (0.069 ± 0.002) Carrier Depth C 0.69 ± 0.05 (0.027 ± 0.002) Sprocket Hole d 1.55 ± 0.05 (0.061 ± 0.002) Reel Outside Diameter D 178 (7.008) Reel Inner Diameter D1 50.0 MIN. (1.969) Feed Hole Diameter D2 13.0 ± 0.20 (0.512 ± 0.008) Sprocket Hole Position E 1.75 ± 0.10 (0.069 ± 0.004) Punch Hole Position F 3.50 ± 0.05 (0.138 ± 0.002) Punch Hole Pitch P 4.00 ± 0.10 (0.157 ± 0.004) Sprocket Hole Pitch P0 4.00 ± 0.10 (0.157 ± 0.004) Embossment Center P1 2.00 ± 0.05 (0.079 ± 0.002) Overall Tape Thickness T 0.20 ± 0.10 (0.008 ± 0.004) Tape Width W 8.00 ± 0.20 (0.315 ± 0.008) Reel Width W1 Quantity per Reel MM (INCHES) -- Devices are packed in accordance with EIA standard RS-481-A. Asia-Pacific: Tel: +886-2 2562-4117 Fax: +886-2 2562-4116 Europe: Tel: +41-41 768 5555 Fax: +41-41 768 5510 The Americas: Tel: +1-951 781-5500 Fax: +1-951 781-5700 www.bourns.com 14.4 MAX. (0.567) 3000 REV. 09/12 Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications