MATERIAL DECLARATION SHEET Material Number CDSOT563-T05C Product Line Semiconductor Products 2008/7/29 Compliance Date RoHS Compliant YES Construction Material Homogeneous No. Element(subpa weight Material rt) [mg] 1 Die Chip Wafer 1 MSL 0.085 CASRN Materials Mass % Silicon 7440-21-3 99.00 0.084 other - 1.00 0.001 7439-96-5 0.30 Nickel 7440-02-0 9.50 0.104 Iron 7439-89-6 0.60 0.007 Tin 7440-31-5 2.30 0.025 Zinc 7440-66-6 0.50 0.005 Lead 7439-92-1 0.05 0.001 Copper 7440-50-8 86.74 0.952 Silver 7440-22-4 0.01 0 Silver 7440-22-4 74.50 0.238 TS ref# 10030 15.00 Manganese 2 3 Leadframe Epoxy Headquarters Riverside CA CAC92 Epoxy 1.098 0.32 Material Mass % Subpart mass of total wt. (%) of total unit wt. Homogeneous Material\ Epoxy resin www.bourns.com CASRN: CAS Registry Number® is a Registered Trademark of the American Chemical Society 2.23 0.003 0.048 28.84 8.41 page 1 of 2 MATERIAL DECLARATION SHEET 1,4Butanedioldiglycidyl ether Wire Au 0.076 Compound Outer 2.171 Aurum 7440-57-5 100.00 0.076 Silica 60676-86-0 80.00 1.737 Trade Secret 10.00 Trade Secret 9.70 1333-86-4 0.30 7440-31-5 100.00 Phenolic Resin Carbon Black 6 Plating Sn 0.057 Total weight 3.807 This Document was updated on: 0.024 3.00 Epoxy Resin 5 7.50 TS ref# 10039 Amine 4 2425-79-8 Tin 0.01 1.99 0.217 0.211 57.03 0.007 0.057 1.5 2015/12/14 Important remarks: 1. It is the responsibility of the user to verify they are accessing the latest version. 2. * 7(a)-Lead in high melting temperature type solders (i.e. lead- based alloys containing 85% by weight or more lead) Headquarters Riverside CA www.bourns.com CASRN: CAS Registry Number® is a Registered Trademark of the American Chemical Society page 2 of 2