LU Package 32-Lead Plastic TQFP (5mm × 5mm) (Reference LTC DWG # 05-08-1735 Rev Ø) 5.15 – 5.25 7.00 BSC 3.50 REF 5.00 BSC 32 0.50 BSC 1 2 3 32 SEE NOTE: 4 1 2 3 3.50 REF 7.00 BSC 5.00 BSC 5.15 – 5.25 A A 0.22 – 0.30 PACKAGE OUTLINE SEE NOTE: 5 1.30 MIN RECOMMENDED SOLDER PAD LAYOUT APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED 1.20 0.95 – 1.05 MAX 11° – 13° R0.08 – 0.20 GAUGE PLANE 0.25 0° – 7° 11° – 13° 0.09 – 0.22 1.00 REF 0.50 BSC 0.05 – 0.15 0.17 – 0.27 0.45 – 0.75 SECTION A – A NOTE: 1. DRAWING CONFORMS TO JEDEC #MS-026 PACKAGE OUTLINE 2. DIMENSIONS ARE IN MILLIMETERS 3. DIMENSIONS OF PACKAGE DO NOT INCLUDE MOLD FLASH. MOLD FLASH SHALL NOT EXCEED 0.25mm ON ANY SIDE, IF PRESENT 4. PIN-1 INDENTIFIER IS A MOLDED INDENTATION 5. EXACT SHAPE OF EACH CORNER IS OPTIONAL 6. DRAWING IS NOT TO SCALE LU32 TQFP 0906 REVØ