PACKAGE THERMAL RESISTANCE TABLE PIN COMMON TO SUBSTRATE — BOARD TYPE θ JC θ JA (°C/W) (°C/W) 3 3 35 35 Case Case TYPE PACKAGE CODE Metal Can K TO-3 2L TO-3 4L Metal Can H TO-5 TO-39 TO-46 TO-52 40 15 80 N/A 150 150 440 360 — Pin 3* Pin 3* Pin 3* J8 J14 J16 J18 J20 J24 J28 30 25 25 20 15 10 7 110 95 85 75 70 65 55 — — — — — — D8 D14 D16 D18 D20 30 25 25 20 15 100 85 80 75 70 — — — — — LCC 20L 40 100 — CERDIP Side Brazed LCC J D L STYLE LEAD COUNT Flat Pack Glass Sealed W W10 W14 40 40 170 160 — — Flat Pack Bottom Brazed WB WB10 WB14 40 40 160 150 — — Plastic TO P TO-3P 3L (TO-247) 1.5 45 Pin 2 Plastic TO Z TO-226 3L (TO-92) — 160 Pin 1 or 2 (By Device) Plastic TO T T T7 TO-220 3L TO-220 5L TO-220 7L 3 3 3 34 34 34 Pin 2 Pin 3 Pin 4 Plastic DD M Q R DD Pak 3L DD Pak 5L DD Pak 7L 3 3 3 34 34 34 Pin 2 Pin 3 Pin 4 Plastic PDIP 300mil N8 N8 N8 45 50 100 150 Cu, 4 Layer A42, 4 Layer Plastic PDIP 300mil N N14, Cu N16, Cu N18, Cu N20, Cu N24, Cu N28, Cu 33 34 29 28 27 30 70 70 65 62 60 59 4 Layer 4 Layer 4 Layer 4 Layer 4 Layer 4 Layer Plastic SC70 SC6 SC8 SC6, 2 pin fused SC8, 3 pin fused — — 270 270 Cu, Multilayer Cu, Multilayer Plastic SOT/TSOT S3 S5 S6 TS8 S3 S5 S6 TS8 100 50 51 47 202 215 192 195 A42, 4 Layer Pin 2 Cu, 4 Layer, Pin 2 Cu, 4 Layer, Pin 2 Cu, 4 Layer, Pin 2 Plastic SOT-223 ST SOT-223 15 60 (est.) Pin 2 TYPE PACKAGE CODE (°C/W) (°C/W) PIN COMMON TO SUBSTRATE — BOARD TYPE Plastic SO 150mil S8 S8 S8 S8, 2 pin fused S8, 3 pin fused 39 — 37 35 120 190 90 85 Cu, 4 Layer A42, 4 Layer Cu, 4 Layer Cu, 4 Layer S S14 S14 S16, 4 pin fused S16 S16 37 — 22 30 — 88 160 65 80 150 Cu, 4 Layer A42, 4 Layer Cu, 4 Layer Cu, 4 Layer A42, 4 Layer S8E S8E 5 33 Cu, 4 Layer Plastic SO 300mil SW SW16 SW18 SW20 SW24 SW28 30 27 25 23 20 80 70 60 60 55 4 Layer 4 Layer 4 Layer 4 Layer 4 Layer Plastic MSOP & Exposed MSOP MS8 MS8 MS8 40 45 163 273 Cu, 4 Layer A42, 4 Layer MS8E MS8E 5–10 35–40 Cu, 4 Layer MS MS10 MS12 MS16 MS16(12) 45 21 21 21 160 135 120 135 Cu, 4 Layer Cu, 4 Layer Cu, 4 Layer Cu, 4 Layer MSE MSE10 MSE12 MSE16 MSE16(12) 5–10 5–10 5–10 5–10 35–40 35–40 35–40 35–40 Cu, 4 Layer Cu, 4 Layer Cu, 4 Layer Cu, 4 Layer Plastic SSOP 5.3mm G G16 G20 G24 G28 G36 G44 40 30 25 25 25 25 110 90 88 80 70 70 Cu, 4 Layer Cu, 4 Layer Cu, 4 Layer Cu, 4 Layer Cu, 4 Layer Cu, 4 Layer SSOP Narrow 150mil GN GN16 GN16/ 4 pin fused GN20 GN24 GN28 40 37 30 30 25 110 90 90 85 80 Cu, 4 Layer Cu, 4 Layer Cu, 4 Layer Cu, 4 Layer Cu, 4 Layer SSOP Wide 300mil GW GW36 GW44 20 17 65 60 Cu, 4 Layer Cu, 4 Layer Plastic TSSOP 4.4mm F F14 F20 F20, fused 17 20 18 100 90 80 Cu, 4 Layer Cu, 4 Layer Cu, 4 Layer FE FE16 FE20 FE24 FE28 FE38 FE38(31) 10 10 10 5–10 5–10 5–10 38 38 33 30 28 28 Cu, 4 Layer Cu, 4 Layer Cu, 4 Layer Cu, 4 Layer Cu, 4 Layer Cu, 4 Layer FW FW48 — 82 Cu, 4 Layer Plastic TSSOP 6.1mm STYLE LEAD COUNT θ JC θ JA 1 PACKAGE THERMAL RESISTANCE TABLE TYPE PACKAGE CODE STYLE LEAD COUNT θ JC θ JA (°C/W) (°C/W) PIN COMMON TO SUBSTRATE — BOARD TYPE Plastic DFN (Exposed Pad) 2×2 2×3 PIN COMMON TO SUBSTRATE — BOARD TYPE θ JC θ JA (°C/W) (°C/W) UD16,UD20 PD16,PD20 7.5 68 4 Layer UDB UDB10 5.0 137 4 Layer 3×4 UDC PDC UDC20,UDC20MA,UDC24 PDC20 6.8 52 4 Layer 3×5 UDD UDD24 5.0 46 4 Layer 4×4 UF PF UF16,UF20,UF24,UF28 PF24,PF28 4.5 47 4 Layer 4×5 UFD UFD20,UFD24,UFD28 3.4 43 4 Layer 4×6 UFE UFE26,UFE38 4.0 38 4 Layer PACKAGE CODE STYLE LEAD COUNT 3×3 UD PD 3×2 TYPE Plastic QFN (Exposed Pad) DC DC3,DC4,DC6,DC8 16.7 80.6 4 Layer KC KC8 17.2 88.5 4 Layer DCB DCB6,DCB8 9.6 64 4 Layer 3×2 DDB DDB8,DDB10,DDB12 16.8 55 4 Layer 3×3 DD KD DD8,DD10,DD12,DD12MA KD10 5.5 43 4 Layer DE UE DE12 UE12 5.5 43 4 Layer DE KE DE14,DE16 KE14 5.5 43 4 Layer 4×4 DF DF12 3.7 42.6 4 Layer 4×7 UFF UFF34,UFF36,UFF44 2.6 36.4 4 Layer 5×3 DHC DHC16 3.2 41.7 4 Layer 4×9 UFH UFH44 3.0 34 4 Layer 5×4 DHD DHD16 4.3 41.7 4 Layer 5×5 UH UH20,UH24,UH32,UH40 7.3 44 4 Layer 5×5 DH DH16 3.0 34 4 Layer 5×6 UHE UHE28,UHE36,UHE42 5.0 43 4 Layer 6×3 DJC DJC22 4.3 31.8 4 Layer 5×7 UHF UHF38 2.0 34 4 Layer 6x4 DJD DJD24 4.3 37 4 Layer 5×8 UHG UHG39/UHG52 3.8 36 4 Layer 7×4 DKD DKD32,DKD24 7.5 34 4 Layer 5×9 UHH UHH48,UHH56 2.0 31 4 Layer 6×6 UJ UJ40 2.0 33 4 Layer 7×7 UK UK44,UK48 3.0 34 4 Layer 7×8 UKG WKG UKG52 WKG52 2.0 31 4 Layer 7×9 UKH WKH UKH64 WKH56 2.0 29 4 Layer 9×9 UP WP UP64 WP64 1.0 29 4 Layer 4×3 CONSULT INDIVIDUAL DATA SHEETS FOR PRODUCT-SPECIFIC VALUES OR REQUIREMENTS. NOTES: 1. These values are offered for general reference use. 2. High effective thermal conductivity board (JEDEC 4 Layer) was used for the thermal resistance calculations. 3. DFN and QFN package type dimensions are mm × mm. 4. All DFN/QFN are Cu leadframe. 5. The values for Plastic Packages are for copper material and non-fused type unless otherwise shown in the Style Lead Count column. 6. Construction variations, such as die size, material, leads fused internally to Die Attach Pad, and PCB layout, significantly influence thermal performance. 7. For θJC calculation, heat sink apply to pkg bottom (exposed pad package only) 8. Cu = Copper, A42 = Alloy 42. *3-Lead Versions, Metal Can 2