UHE Package 28-Lead Plastic QFN (5mm × 6mm) (Reference LTC DWG # 05-08-1932 Rev Ø) 0.70 ±0.05 5.50 ±0.05 4.10 ±0.05 2.50 REF PACKAGE OUTLINE 3.65 ±0.05 4.65 ±0.05 0.25 ±0.05 0.50 BSC 3.50 REF 5.10 ±0.05 6.50 ±0.05 PIN 1 NOTCH R = 0.30 TYP OR 0.35 × 45° CHAMFER RECOMMENDED SOLDER PAD LAYOUT APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED 5.00 ±0.10 0.00 – 0.05 0.200 REF R = 0.10 TYP 2.50 REF 23 28 0.40 ±0.10 PIN 1 TOP MARK (SEE NOTE 6) 22 6.00 ±0.10 1 3.50 REF 4.65 ±0.10 3.65 ±0.10 15 8 (UHE28) QFN 1012 REV Ø 14 0.75 ±0.05 0.25 ±0.05 9 R = 0.125 TYP 0.50 BSC BOTTOM VIEW—EXPOSED PAD NOTE: 1. DRAWING IS NOT A JEDEC PACKAGE OUTLINE 2. DRAWING NOT TO SCALE 3. ALL DIMENSIONS ARE IN MILLIMETERS 4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.20mm ON ANY SIDE 5. EXPOSED PAD SHALL BE SOLDER PLATED 6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE