mflsmf

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& oHS
AE C
C OM
AP P
PR LI
OV AN
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Features
■ High power ratings
■ Surface mount packaging for automated
assembly
■ Compliant with AEC-Q200 Rev-C- Stress
Test Qualification for Passive Components
in Automotive Applications
■ Low profile
■ Compatible with Pb and Pb-free solder
reflow profiles
■ RoHS compliant* and halogen free**
■ Agency recognition:
■ Standard 7555 mm (2920 mils) footprint
MF-LSMF Series - PTC Resettable Fuses
Electrical Characteristics
Ihold
Itrip
Resistance
Max. Time
To Trip
Tripped
Power
Dissipation
Watts
at 23 °C
Typ.
1.5
V max.
Volts
I max.
Amps
MF-LSMF185/33X
33.0
40
MF-LSMF260X
24.0
20
2.60
5.20
0.020
0.075
8.0
5.00
1.5
MF-LSMF300X
6.0
40
3.00
5.00
0.015
0.048
8.0
20.00
1.5
20
3.00
5.20
0.020
0.075
8.0
5.00
1.5
Model***
MF-LSMF300/24X
24.0
®
Amperes
at 23 °C
Hold
Trip
1.85
3.70
Ohms
at 23 °C
RMin.
R1Max.
0.045
0.150
Amperes
at 23 °C
Seconds
at 23 °C
8.0
2.50
™
*** Features Multifuse Free Xpansion Design for MF-LSMF Series.
Environmental Characteristics
Operating Temperature......................................... -40 °C to +85 °C
Maximum Device Surface Temperature
in Tripped State .................................................... 125 °C
Passive Aging ....................................................... +85 °C, 1000 hours ............................................... ±5 % typical resistance change
Humidity Aging...................................................... +85 °C, 85 % R.H. 1000 hours ............................. ±5 % typical resistance change
Thermal Shock ..................................................... +85 °C to -40 °C, 20 times .................................... ±10 % typical resistance change
Solvent Resistance ............................................... MIL-STD-202, Method 215 ................................... No change
Vibration ............................................................... MIL-STD-883C, Method 2007.1,........................... No change
Condition A
Test Procedures And Requirements For Model MF-LSMF Series
Test
Test Conditions
Accept/Reject Criteria
Visual/Mech. ......................................................... Verify dimensions and materials ........................... Per MF physical description
Resistance ............................................................ In still air @ 23 °C ................................................. Rmin ≤ R ≤ R1max
Time to Trip ........................................................... At specified current, Vmax, 23 °C ......................... T ≤ max. time to trip (seconds)
Hold Current ......................................................... 30 min. at Ihold ..................................................... No trip
Trip Cycle Life ....................................................... Vmax, Imax, 100 cycles ........................................ No arcing or burning
Trip Endurance ..................................................... Vmax, 48 hours..................................................... No arcing or burning
Solderability .......................................................... ANSI/J-STD-002 ................................................... 95 % min. coverage
UL File Number ..................................................... E174545
http://www.ul.com/ Follow link to Certifications, then UL File No., enter E174545
TÜV Certificate Number ....................................... R 50256634
http://www.tuvdotcom.com/ Follow link to “Certificate Search”, enter 50256634
*RoHS Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 2011/65/EU June 8, 2011.
**Bourns is using the definition that appears to be the prevalent definition used as the industry standard at this time. The Bourns definition of “halogen-free” is:
Bromine (Br) content: ≤ 900 ppm; Chlorine (Cl) content: ≤ 900 ppm; Total Br + Cl content: ≤1500 ppm.
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
Applications
■ Automotive electronics
■ Industrial controls
■ IEEE ports
■ Portable electronics
MF-LSMF Series - PTC Resettable Fuses
Product Dimensions
A
Model
Min.
6.73
(0.265)
6.73
(0.265)
6.73
(0.265)
6.73
(0.265)
MF-LSMF185/33X
MF-LSMF260X
MF-LSMF300X
MF-LSMF300/24X
B
Max.
7.98
(0.312)
7.98
(0.312)
7.98
(0.312)
7.98
(0.312)
Min.
4.80
(0.189)
4.80
(0.189)
4.80
(0.189)
4.80
(0.189)
C
Max.
5.44
(0.214)
5.44
(0.214)
5.44
(0.214)
5.44
(0.214)
Min.
0.75
(0.030)
0.75
(0.030)
0.35
(0.014)
0.75
(0.030)
Max.
1.60
(0.063)
1.60
(0.063)
0.85
(0.033)
1.60
(0.063)
Packaging: 3000 pcs. per reel.
Top View
D
Min.
0.30
(0.012)
0.30
(0.012)
0.30
(0.012)
0.30
(0.012)
E
Min.
0.25
(.010)
0.25
(.010)
0.25
(.010)
0.25
(.010)
Max.
2.00
(.079)
2.00
(.079)
2.00
(.079)
2.00
(.079)
DIMENSIONS:
Bottom View
Side View
A
Recommended Pad Layout
Terminal material:
Electroless Ni under immersion Au
C
9
5.3 ± 0.10
(.209 ± .004)
B
X
D
2.0 ± 0.05
(.079 ± .002)
E
MM
(INCHES)
4.6 ± 0.10
(.181 ± .004)
Termination pad solderability:
Standard Au finish:
Meets ANSI/J-STD-002 Category 2.
Recommended Storage:
40 °C max./70 % RH max.
Typical Time to Trip at 23 ˚C
100
The Time to Trip curves represent typical performance
of a device in a simulated application environment.
Actual performance in specific customer applications
may differ from these values due to the influence of
other variables.
MF-LSMF260X
Time to Trip (seconds)
10
MF-LSMF185/33X
1
MF-LSMF300/24X
MF-LSMF300X
0.1
0.01
1
10
100
Fault Current (Amps)
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
3312
- 2 mm
SMD
Trimming
Potentiometer
MF-LSMF
Series
- PTC
Resettable
Fuses
Thermal Derating Chart - Ihold (Amps)
Model
Ambient Operating Temperature
23 ˚C
40 ˚C
50 ˚C
1.85
1.54
1.39
-40 ˚C
2.80
-20 ˚C
2.47
0 ˚C
2.17
MF-LSMF260X
3.75
3.35
3.00
2.60
2.35
MF-LSMF300X
4.53
4.02
3.51
3.00
2.52
MF-LSMF300/24X
4.00
3.55
3.20
3.00
2.50
MF-LSMF185/33X
Solder Reflow Recommendations
300
Preheating
70 ˚C
1.07
85 ˚C
0.85
2.15
2.05
1.80
1.30
2.26
1.99
1.75
1.34
2.25
2.15
1.85
1.50
How to Order
Soldering
MF - LSMF 185/33X - 2
Cooling
®
Multifuse Product
Designator
Series
LSMF = 7555 mm (2920 mils)
Surface Mount Component
Hold Current, Ihold
185-300 (1.85 Amps - 3.00 Amps)
Higher Voltage Option
/24 = 24 Volt Rated
/33 = 33 Volt Rated
X = Multifuse® freeXpansion™ Design
MF-LSMF Series
Packaging
Packaged per EIA 481-1
-2 = Tape and Reel
250
Temperature (°C)
60 ˚C
1.22
200
150
100
50
0
10–20
160–220
120
Time (seconds)
Notes:
•
MF-LSMF models cannot be wave soldered. Please contact Bourns for hand soldering
recommendations.
•
If reflow temperatures exceed the recommended profile, devices may not meet the performance
requirements.
•
Compatible with Pb and Pb-free solder reflow profiles.
Typical Part Marking
Represents total content. Layout may vary.
PART IDENTIFICATION EXAMPLES:
MF-LSMF185/33X = 9
MF-LSMF260X = E
MF-LSMF300X = F
MF-LSMF300/24X = J
E
X
BI-WEEKLY DATE CODE:
WEEKS 47-48 = X
MF-LSMF SERIES, REV. E, 08/15
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
MF-LSMF Series Tape and Reel Specifications
NOTE: Effective December 1, 2010 (product date code “X”), the cover tape was changed to the new 3M™ Universal Cover Tape (UCT).
Tape Dimensions
W
P0
P1
P2
A0
B0
B1 max.
D0
F
E1
E2 min.
T max.
T1 max.
K0
Leader min.
Trailer min.
MF-LSMF300X
per EIA 481-2
16.0 ± 0.30
(0.630 ± 0.012)
4.0 ± 0.10
(0.157 ± 0.004)
8.0 ± 0.10
(0.315 ± 0.004)
2.0 ± 0.05
(0.079 ± 0.002)
5.74 ± 0.10
(0.226 ± 0.004)
8.02 ± 0.10
(0.316 ± 0.004)
12.1
(0.476)
1.5 + 0.10/-0.0
(0.059 + 0.004/-0)
7.5 ± 0.05
(0.295 ± 0.002)
1.75 ± 0.10
(0.069 ± 0.004)
14.25
(0.561)
0.6
(0.024)
0.1
(0.004)
0.91 ± 0.10
(0.036 ± 0.004)
390
(15.35)
160
(6.30)
MF-LSMF185/33X, MF-LSMF260X,
MF-LSMF300/24X
per EIA 481-2
16.0 ± 0.30
(0.630 ± 0.012)
4.0 ± 0.10
(0.157 ± 0.004)
8.0 ± 0.10
(0.315 ± 0.004)
2.0 ± 0.05
(0.079 ± 0.002)
5.70 ± 0.10
(0.224 ± 0.004)
8.10 ± 0.10
(0.319 ± 0.004)
12.1
(0.476)
1.5 + 0.10/-0.0
(0.059 + 0.004/-0)
7.5 ± 0.05
(0.295 ± 0.002)
1.75 ± 0.10
(0.069 ± 0.004)
14.25
(0.561)
0.6
(0.024)
0.1
(0.004)
1.70 ± 0.10
(0.067 ± 0.004)
390
(15.35)
160
(6.30)
331
(13.03)
50
(1.97)
16.4 + 2.0/-0.0
(0.646 + 0.079/-0.0)
22.4
(0.882)
331
(13.03)
50
(1.97)
16.4 + 2.0/-0.0
(0.646 + 0.079/-0.0)
22.4
(0.882)
Reel Dimensions
A max.
N min.
W1
W2 max.
DIMENSIONS:
MM
(INCHES)
P0
T
D0
P2
E1
W2(MEASURED
AT HUB)
COVER
TAPE
F
E2 W
B1
A
N(HUB DIA.)
B0
K0
T1
P1
A0
W1(MEASURED
AT HUB)
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.