*R & oHS AE C C OM AP P PR LI OV AN ED T Features ■ Compliant with AEC-Q200 Rev-C- Stress Test Qualification for Passive Components in Automotive Applications ■ 100 % electrically compatible with all previous generations of 1812 SMT devices ■ Compatible with Pb and Pb-free solder reflow profiles ■ RoHS compliant* and halogen free** ■ Surface mount packaging for automated assembly ■ Agency recognition: ■ Standard 4532 mm (1812 mils) footprint ■ Patents pending MF-MSMF Series - PTC Resettable Fuses Electrical Characteristics Ihold Model MF-MSMF010 MF-MSMF014 MF-MSMF020 MF-MSMF020/60 MF-MSMF030 MF-MSMF050 MF-MSMF075 MF-MSMF075/24 MF-MSMF110 MF-MSMF110/16 MF-MSMF110/24X MF-MSMF125 MF-MSMF150 MF-MSMF150/24X MF-MSMF160 MF-MSMF200 MF-MSMF250/16X MF-MSMF260 V max. Volts I max. Amps 60.0 60.0 30.0 60.0 30.0 15.0 13.2 24.0 6.0 16.0 24.0 6.0 6.0 24.0 8.0 8.0 16.0 6.0 40 40 80 40 10 100 100 40 100 100 20 100 100 20 100 40 100 100 Itrip Amperes at 23 °C Hold Trip 0.10 0.30 0.14 0.34 0.20 0.40 0.20 0.40 0.30 0.60 0.50 1.00 0.75 1.50 0.75 1.50 1.10 2.20 1.10 2.20 1.10 2.20 1.25 2.50 1.50 3.00 1.50 3.00 1.60 2.80 2.00 4.00 2.50 5.00 2.60 5.20 Resistance Ohms at 23 °C RMin. R1Max. 0.70 15.00 0.40 6.50 0.40 6.00 0.40 6.00 0.30 3.00 0.15 1.00 0.11 0.45 0.11 0.45 0.04 0.21 0.04 0.21 0.06 0.18 0.035 0.14 0.03 0.120 0.03 0.120 0.035 0.099 0.020 0.080 0.015 0.100 0.015 0.080 Max. Time To Trip Amperes at 23 °C Seconds at 23 °C 0.5 1.5 6.0 1.5 8.0 8.0 8.0 8.0 8.0 8.0 8.0 8.0 8.0 8.0 8.0 8.0 8.0 8.0 1.50 0.15 0.06 0.15 0.10 0.15 0.20 0.20 0.30 0.30 0.50 0.40 0.5 1.50 2.0 3.0 5.0 5.0 Tripped Power Dissipation Watts at 23 °C Typ. 0.8 0.8 0.8 0.8 0.8 0.8 0.8 0.8 0.8 0.8 0.8 0.8 0.8 1.0 0.8 0.8 1.2 0.8 Environmental Characteristics Operating Temperature......................................... -40 °C to +85 °C Maximum Device Surface Temperature in Tripped State .................................................... 125 °C Passive Aging ....................................................... +85 °C, 1000 hours ............................................... ±5 % typical resistance change Humidity Aging...................................................... +85 °C, 85 % R.H. 1000 hours ............................. ±5 % typical resistance change Thermal Shock ..................................................... +85 °C to -40 °C, 20 times .................................... ±10 % typical resistance change Solvent Resistance ............................................... MIL-STD-202, Method 215 ................................... No change Vibration ............................................................... MIL-STD-883C, Method 2007.1,........................... No change Condition A Test Procedures And Requirements For Model MF-MSMF Series Test Test Conditions Accept/Reject Criteria Visual/Mech. ......................................................... Verify dimensions and materials ........................... Per MF physical description Resistance ............................................................ In still air @ 23 °C ................................................. Rmin ≤ R ≤ R1max Time to Trip ........................................................... At specified current, Vmax, 23 °C ......................... T ≤ max. time to trip (seconds) Hold Current ......................................................... 30 min. at Ihold ..................................................... No trip Trip Cycle Life ....................................................... Vmax, Imax, 100 cycles ........................................ No arcing or burning Trip Endurance ..................................................... Vmax, 48 hours..................................................... No arcing or burning Solderability .......................................................... ANSI/J-STD-002 ................................................... 95 % min. coverage UL File Number ..................................................... E174545 http://www.ul.com/ Follow link to Certifications, then UL File No., enter E174545 TÜV Certificate Number ....................................... R 02057213 http://www.tuvdotcom.com/ Follow link to “other certificates”, enter File No. 2057213 *RoHS Directive 2002/95/EC Jan 27, 2003 including Annex. **Bourns is using the definition that appears to be the prevalent definition used as the industry standard at this time. The Bourns definition of “halogen-free” is: Bromine (Br) content: ≤ 900 ppm; Chlorine (Cl) content: ≤ 900 ppm; Total Br + Cl content: ≤1500 ppm. Specifications are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specific applications. Applications ■ Overcurrent and overtemperature ■ Point-of-sale (POS) equipment protection of automotive electronics ■ Hard disk drives ■ PC motherboards ■ PC peripherals ■ PCMCIA cards ■ USB port protection - USB 2.0, 3.0 & OTG ■ HDMI 1.4 Source protection MF-MSMF Series - PTC Resettable Fuses Product Dimensions (see next page for outline drawings) Model MF-MSMF010 MF-MSMF014 MF-MSMF020 MF-MSMF020/60 MF-MSMF030 MF-MSMF050 MF-MSMF075 MF-MSMF075/24 MF-MSMF110 MF-MSMF110/16 MF-MSMF110/24X MF-MSMF125 MF-MSMF150 MF-MSMF150/24X MF-MSMF160 MF-MSMF200 MF-MSMF250/16X MF-MSMF260 A Min. 4.37 (0.172) 4.37 (0.172) 4.37 (0.172) 4.37 (0.172) 4.37 (0.172) 4.37 (0.172) 4.37 (0.172) 4.37 (0.172) 4.37 (0.172) 4.37 (0.172) 4.37 (0.172) 4.37 (0.172) 4.37 (0.172) 4.37 (0.172) 4.37 (0.172) 4.37 (0.172) 4.37 (0.172) 4.37 (0.172) B Max. 4.73 (0.186) 4.73 (0.186) 4.73 (0.186) 4.73 (0.186) 4.73 (0.186) 4.73 (0.186) 4.73 (0.186) 4.73 (0.186) 4.73 (0.186) 4.73 (0.186) 4.83 (0.190) 4.73 (0.186) 4.73 (0.186) 4.83 (0.190) 4.73 (0.186) 4.73 (0.186) 4.83 (0.190) 4.73 (0.186) Min. 3.07 (0.121) 3.07 (0.121) 3.07 (0.121) 3.07 (0.121) 3.07 (0.121) 3.07 (0.121) 3.07 (0.121) 3.07 (0.121) 3.07 (0.121) 3.07 (0.121) 3.07 (0.121) 3.07 (0.121) 3.07 (0.121) 3.07 (0.121) 3.07 (0.121) 3.07 (0.121) 3.07 (0.121) 3.07 (0.121) C Max. 3.41 (0.134) 3.41 (0.134) 3.41 (0.134) 3.41 (0.134) 3.41 (0.134) 3.41 (0.134) 3.41 (0.134) 3.41 (0.134) 3.41 (0.134) 3.41 (0.134) 3.41 (0.134) 3.41 (0.134) 3.41 (0.134) 3.41 (0.134) 3.41 (0.134) 3.41 (0.134) 3.41 (0.134) 3.41 (0.134) Packaging: MF-MSMF010 through MF-MSMF030 = 1500 pcs. per reel. MF-MSMF050 through MF-MSMF200 & MF-MSMF260 = 2000 pcs. per reel. MF-MSMF110/24X , MF-MSMF150/24X & MF-MSMF250/16X = 1500 pcs. per reel. Min. 0.70 (0.028) 0.70 (0.028) 0.70 (0.028) 0.70 (0.028) 0.70 (0.028) 0.55 (0.022) 0.55 (0.022) 0.55 (0.022) 0.45 (0.018) 0.45 (0.018) 0.70 (0.028) 0.55 (0.022) 0.55 (0.022) 0.70 (0.028) 0.55 (0.022) 0.55 (0.022) 0.70 (0.028) 0.48 (0.019) Max. 1.10 (0.043) 1.10 (0.043) 1.10 (0.043) 1.10 (0.043) 1.10 (0.043) 0.85 (0.033) 0.85 (0.033) 0.85 (0.033) 0.85 (0.033) 0.85 (0.033) 1.60 (0.063) 0.85 (0.033) 0.85 (0.033) 1.60 (0.063) 0.85 (0.033) 0.85 (0.033) 1.60 (0.063) 0.85 (0.033) D Min. 0.30 (0.012) 0.30 (0.012) 0.30 (0.012) 0.30 (0.012) 0.30 (0.012) 0.30 (0.012) 0.30 (0.012) 0.30 (0.012) 0.30 (0.012) 0.30 (0.012) 0.30 (0.012) 0.30 (0.012) 0.30 (0.012) 0.30 (0.012) 0.30 (0.012) 0.30 (0.012) 0.30 (0.012) 0.30 (0.012) DIMENSIONS: Style 1 1 1 1 1 1 1 1 1 1 2 1 1 2 1 1 2 1 MM (INCHES) Specifications are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specific applications. MF-MSMF Series - PTC Resettable Fuses Product Dimensions (see previous page for dimensions) Style 1 Top and Bottom View A Side View Recommended Pad Layout C 1.5 ± 0.05 (.059 ± .002) Terminal material: Electroless Ni under immersion Au 1.5 ± 0.05 (.059 ± .002) Termination pad solderability: Standard Au finish: Meets ANSI/J-STD-002 Category 2. 3.2 ± 0.1 (0.126 ± .004) B Recommended Storage: 40 °C max./70 % RH max. 2.7 ± 0.1 (.106 ± .004) D Style 2 Top View Bottom View Side View A Recommended Pad Layout C 8 C 2.95 ± 0.10 (.114 ± .004) B 1.68 ± 0.05 (.066 ± .002) D 3.1 ± 0.10 (.122 ± .004) Typical Time to Trip at 23 ˚C 100 The Time to Trip curves represent typical performance of a device in a simulated application environment. Actual performance in specific customer applications may differ from these values due to the influence of other variables. MF-MSMF010 MF-MSMF200 10 Time to Trip (Seconds) MF-MSMF030 1 MF-MSMF260 0.1 MF-MSMF160 MF-MSMF150 MF-MSMF125 0.01 MF-MSMF110 MF-MSMF075 MF-MSMF014 MF-MSMF020 MF-MSMF075/24 0.001 MF-MSMF110/16 MF-MSMF050 0.1 1 10 100 Fault Current (Amps) Specifications are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specific applications. MF-MSMF Series - PTC Resettable Fuses Thermal Derating Chart - Ihold (Amps) Model MF-MSMF010 MF-MSMF014 MF-MSMF020 MF-MSMF020/60 MF-MSMF030 MF-MSMF050 MF-MSMF075 MF-MSMF075/24 MF-MSMF110 MF-MSMF110/16 MF-MSMF110/24X MF-MSMF125 MF-MSMF150 MF-MSMF150/24X MF-MSMF160 MF-MSMF200 MF-MSMF250/16X MF-MSMF260 -40 ˚C 0.16 0.23 0.29 0.29 0.44 0.77 1.15 1.15 1.59 1.59 2.00 1.80 2.17 2.10 2.30 3.08 3.90 4.00 -20 ˚C 0.14 0.19 0.26 0.26 0.39 0.68 1.01 1.01 1.43 1.43 1.70 1.63 1.95 1.90 2.20 2.71 3.42 3.52 Ambient Operating Temperature 23 ˚C 40 ˚C 50 ˚C 0.10 0.08 0.07 0.14 0.12 0.10 0.20 0.17 0.15 0.20 0.17 0.15 0.30 0.26 0.23 0.50 0.44 0.40 0.75 0.65 0.60 0.75 0.65 0.60 1.10 0.95 0.87 1.10 0.95 0.87 1.10 0.95 0.88 1.25 1.08 0.99 1.50 1.30 1.18 1.50 1.25 1.13 1.60 1.45 1.30 2.00 1.80 1.60 2.50 2.24 1.98 2.60 2.34 2.08 0 ˚C 0.12 0.17 0.23 0.23 0.35 0.59 0.88 0.88 1.26 1.26 1.40 1.43 1.72 1.70 1.90 2.35 2.96 3.06 60 ˚C 0.06 0.09 0.14 0.14 0.21 0.37 0.55 0.55 0.80 0.80 0.80 0.91 1.09 1.00 1.15 1.50 1.85 1.95 70 ˚C 0.05 0.08 0.12 0.12 0.18 0.33 0.49 0.49 0.71 0.71 0.73 0.81 0.97 0.88 1.03 1.40 1.29 1.39 85 ˚C 0.03 0.06 0.10 0.10 0.15 0.29 0.43 0.43 0.60 0.60 0.61 0.68 0.82 0.69 0.91 1.25 0.94 1.04 Solder Reflow Recommendations Preheating 300 Soldering Cooling Notes: Temperature (°C) 250 200 • MF-MSMF models cannot be wave soldered. Please contact Bourns for hand soldering recommendations. • If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements. • Compatible with Pb and Pb-free solder reflow profiles. • Excess solder may cause a short circuit, especially during hand soldering. Please refer to the Multifuse® Polymer PTC product soldering recommendation guidelines. 150 100 50 0 160–220 10–20 120 Time (seconds) How to Order MF - MSMF 075/24 - 2 Typical Part Marking Represents total content. Layout may vary. Multifuse Product Designator Series MSMF = 4532 mm (1812 mils) Surface Mount Component Hold Current, Ihold 010-260 (0.10 Amps - 2.60 Amps) Higher Voltage Option __ = Standard Voltage /16 = 16 Volt Rated /24 = 24 Volt Rated /60 = 60 Volt Rated X= Multifuse® freeXpansion Design™ MF-MSMF Series Packaging Packaged per EIA 481-1 -2 = Tape and Reel 115Y ® BI-WEEKLY DATE CODE: WEEKS 49-50 = Y YEAR CODE: 5 = 2005 PART IDENTIFICATION EXAMPLES: MF-MSMF050 = 50 MF-MSMF075 = 75 MF-MSMF110 = 11 MF-MSMF150 = 15 8 C PART IDENTIFICATION EXAMPLES: MF-MSMF110/24X = 6 MF-MSMF150/24X = 8 MF-MSMF250/16X = C BI-WEEKLY DATE CODE: WEEKS 5-6 = C MF-MSMF SERIES, REV. AF, 08/15 “freeXpansion Design” is a trademark of Bourns, Inc. Specifications are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specific applications. MF-MSMF Series Tape and Reel Specifications Tape Dimensions W P0 P1 P2 A0 B0 B1 max. D0 F E1 E2 min. T max. T1 max. K0 Leader min. Trailer min. MF-MSMF010 MF-MSMF030 per EIA-481-1 12.0 ± 0.30 (0.472 ± 0.012) 4.0 ± 0.10 (0.157 ± 0.004) 8.0 ± 0.10 (0.315 ± 0.004) 2.0 ± 0.05 (0.079 ± 0.002) 3.58 ± 0.10 (0.141 ± 0.004) 4.93 ± 0.10 (0.194 ± 0.004) 5.9 (0.232) 1.5 + 0.10/-0.0 (0.059 + 0.004/-0) 5.5 ± 0.05 (0.217 ± 0.002) 1.75 ± 0.10 (0.069 ± 0.004) 10.25 (0.404) 0.6 (0.024) 0.1 (0.004) 1.30 ± 0.10 (0.051 ± 0.004) 390 (15.35) 160 (6.30) MF-MSMF050 MF-MSMF260 per EIA 481-1 12.0 ± 0.30 (0.472 ± 0.012) 4.0 ± 0.10 (0.157 ± 0.004) 8.0 ± 0.10 (0.315 ± 0.004) 2.0 ± 0.05 (0.079 ± 0.002) 3.66 ± 0.15 (0.144 ± 0.006) 4.98 ± 0.10 (0.196 ± 0.004) 5.9 (0.232) 1.5 + 0.10/-0.0 (0.059 + 0.004/-0) 5.5 ± 0.05 (0.217 ± 0.002) 1.75 ± 0.10 (0.069 ± 0.004) 10.25 (0.404) 0.6 (0.024) 0.1 (0.004) 0.95 ± 0.10 (0.037 ± 0.004) 390 (15.35) 160 (6.30) MF-MSMF-110/24X MF-MSMF150/24X MF-MSMF250/16X per EIA 481-1 12.0 ± 0.30 (0.472 ± 0.012) 4.0 ± 0.10 (0.157 ± 0.004) 8.0 ± 0.10 (0.315 ± 0.004) 2.0 ± 0.05 (0.079 ± 0.002) 3.70 ± 0.10 (0.146 ± 0.004) 5.10 ± 0.10 (0.200 ± 0.004) 5.9 (0.232) 1.5 + 0.10/-0.0 (0.059 + 0.004/-0) 5.5 ± 0.05 (0.217 ± 0.002) 1.75 ± 0.10 (0.069 ± 0.004) 10.25 (0.404) 0.6 (0.024) 0.1 (0.004) 1.50 ± 0.10 (0.059 ± 0.004) 390 (15.35) 160 (6.30) 185 (7.28) 50 (1.97) 12.4 + 2.0/-0.0 (0.488 + 0.079/-0.0) 18.4 (0.724) 185 (7.28) 50 (1.97) 12.4 + 2.0/-0.0 (0.488 + 0.079/-0.0) 18.4 (0.724) 185 (7.28) 50 (1.97) 12.4 + 2.0/-0.0 (0.488 + 0.079/-0.0) 18.4 (0.724) Reel Dimensions A max. N min. W1 W2 max. DIMENSIONS: P0 T D0 P2 E1 MM (INCHES) W2(MEASURED AT HUB) COVER TAPE F E2 W B1 A N(HUB DIA.) B0 K0 T1 P1 A0 Specifications are subject to change without notice. Users should verify actual device performance in their specific applications. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. W1(MEASURED AT HUB)