MATERIAL DECLARATION SHEET Material CAT16-J2LF Product Line Date Chip Array 31-October-2005 No. Construction element Material group Material weight [g] 1 Ceramic Substrate 0.00448 2 3 4 Conductor Resistive film Overcoat Headquarters Riverside CA Terminal Electrode Resistor Inner 0.00014 0.00003 0.00004 Materials Al2O3 SiO2 Other Ag-Pd Bi2O3 ZrO2 Other Glass RuO2 Ag CaO Al2O3 Pd ZnO MnO2 Other Glass Al2O3 TiO2 www.bourns.com CAS if applicable 1344-28-1 14808-60-7 7440-22-4 1304-86-3 1314-23-4 65997-18-4 12036-10-1 7440-22-4 1305-78-8 1344-28-1 7440-05-3 1314-13-2 1313-13-9 65997-18-4 1344-28-1 13463-67-7 Average mass [%] 96 3 1 92 5 1 2 43 36 7 6 1 1 1 1 4 90 6 4 Sum [%] Traces 100 100 100 100 page 1 of 2 No. Construction element Material group Material weight [g] Materials 5 Overcoat Outer 0.00010 Resin 6 Side termination Thick film 0.00003 Ag-Pd Average mass [%] Sum [%] 100 100 7440-22-4 92 100 Bi2O3 1304-86-3 5 ZrO2 1314-23-4 1 CAS if applicable Other 2 7 Ni plating Inner 0.00011 Ni 7440-02-0 8 Sn plating Outer 0.00007 Sn 7440-31-5 Total weight 0.00500 Headquarters Riverside CA www.bourns.com Traces 100 100 100 100 page 2 of 2