Features ■ ■ ■ HIGH PERFORMANCE TERMINATION NETWORK Miniaturized circuitry and packaging for space reduction Designed for gigabit communication networks ■ Controlled impedance CAT16-PT4F4 - Concave Chip Array Electrical Characteristics Product Dimensions Resistance R1 .............................................100 ohms TCR ........................................±200 ppm/˚C Temperature Range .........-55 ˚C to +12 5˚C Max. Operating Voltage ....................5 VDC Max. Power Resistance ................ .0625 W Solderability .....................>95 % Coverage .45 ± .10 (.018 ± .004) .60 ± .10 (.024 ± .004) 16 15 14 13 12 11 10 9 .30 ± .10 DIA. (.012 ± .004) .40 ± .10 (.016 ± .004) 1.60 ± .15 (.063 ± .060) .80 ± .10 (.031 ± .004) 1 DIMENSIONS ARE: .40 ± .10 (.016 ± .004) 6.40 ± .15 (.253 ± .006) 2 3 4 5 6 7 8 MM (INCHES) Packaging Specifications 4000 pcs - per 7 " reel 4.0 ± .10 (.157 ± .004) 2.00 ± 0.20 (.079 ± .008) 0.9 ± 0.1 (.035 ± .004) 6.9 ± 0.2 (.272 ± .008) 13 ± 0.5 DIA. (.512 ± .020) 5.5 ± 0.1 (.217 ± .004) 4.0 ±.10 (.158 ±.004) 60.0 ± 1.0 DIA. (2.36 ± .039) 178.0 ± 2.0 (7.008 ± .080) 21 ± 0.5 (.827 ± .020) 12.0 ± 0.2 (.472 ± .008) 15.4 ± 1.0 (.606 ± .039) 1.75 ± .10 (.069 ± .004) 1.5 +.10/-0 (.060 +.004/-0) Derating Curve Rated power in percentage (%) 2.0 ± .05 (.079 ± .002) 13.0 ± 0.3 (.512 ± .012) Land Pattern Solder resist 100 Land 0.7 to 0.9 (.028 to .035) 80 60 40 Chip resistor array CAT 20 0 -55 0 125 70 (°C) Ambient temperature Schematic 16 15 0.4 to 0.45 (.016 to .0178) 14 R1 1 13 12 R1 2 2.0 to 2.2 (.079 to .087) 3 11 10 R1 4 5 0.80 (.032) 9 R1 6 7 8 REV. 07/03 Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications.