PWR221T-30

MATERIAL DECLARATION
Material Number
PWR221T-30-XXX
Product Line
Power Resistor
Compliance Date
RoHS Compliant
No.
1
2
3
4
yes
Construction
Element (subpart)
Housing
Terminal
Substrate
Term Ink
MSL
Homogeneous
Material
Epoxy Molding
Compound
N/A
Material
weight [g]
0.6443
Copper
0.2510
Plating
0.016
Alumina
Ink
0.3089
0.0011
if applicable
Materials
Mass %
Material
Mass % of
total unit wt.
Silica
14808-60-7
53
27.88
Homogeneous Material/
Substances
Epoxy Resin
29690-82-2
25
13.15
Phenolic Resin
9003-35-4
15
7.89
Antimony trioxide
1309-64-4
3
1.58
Brominated epoxy resin
40039-93-8
3
1.58
Carbon Black
1333-86-4
1
0.58
Copper
7440-50-8
99.95
20.48
0.05
0.01
100
1.30
Other
Tin
7440-31-5
Aluminum Oxide
1344-28-1
88
22.19
Manganese dioxide
1313-13-9
3.5
0.88
Titanium-dioxide
13463-67-7
3.5
0.88
Chromium(III)oxide
1308-38-9
2.5
0.63
Quartz (Silicon dioxide)
14808-60-7
2.5
0.63
Silver
7440-22-4
96
0.09
Lead-Oxide
1309-60-0
1
0.001
Dibismuth-trioxide
1304-76-3
1
0.001
Platinum
7440-06-4
1
0.001
1
0.001
Confidential Substances
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Subpart
mass of
total wt. (%)
52.6
20.49
1.30
25.21
0.09
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MATERIAL DECLARATION
5
8
Resistor Paste
Encapsulant
Ink
Ink
0.0023
0.0005
Palladium
7440-05-3
25
0.05
Boraluminosilicate glass
Trimethylpentanediol
monoisobutyrate
Silver
65997-17-3
30
0.06
25265-77-4
25
0.05
7440-22-4
15
0.03
Ruthenium dioxide
12036-10-1
1
0.002
Manganese dioxide
1313-13-9
1
0.002
Alumina
1344-28-1
3
0.006
Lead-monoxide
1317-36-8
56.63
0.07
Silicon dioxide
7631-86-9
27.89
0.03
Diboron-trioxide
1303-86-2
9.15
0.01
Chromium(III)oxide
1308-38-9
3.15
0.004
3.15
0.004
Confidential Substances
Total weight
0.18
0.12
1.225
This Document was updated on: June 22, 2010
Important remarks:
1. It is the responsibility of the user to verify they are accessing the latest version.
2. RoHS exemptions: 5c – lead in glass of electronic components.
Headquarters Riverside CA
www.bourns.com
CASRN: CAS Registry Number® is a Registered Trademark of the American Chemical Society
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