MA Series

The MA Series is OBSOLETE
ANDnot recommended for new designs.
PL
IA
NT
Features
*R
oH
S
CO
M
Four beads in one package
High speed and high impedance
Nickel barrier
MA Series Chip Ferrite Bead Arrays
General Specifications
Operating Temperature
...................................-55 °C to +125 °C
Storage Temperature ..-55 °C to +125 °C
Storage Condition
......................+40 °C max. at 70 % RH
Impedance Tolerance....................±25 %
Reflow Soldering
......................230 ˚C, 10 seconds max.
Resistance to Soldering Heat
...............................260 ˚C, 10 seconds
Model Designator
M4 ...............................High Impedance
T4 ........................................Low Speed
S4 .......................................High Speed
Rated Current ..................Based on max.
temperature rise of +40 °C
Terminal Strength
(Force “F” applied for 30 seconds)
3216 Series ............................1.2 F (Kg)
Electrical Specifications
Model Number
Impedance
(Ω)
at 100MHz
RDC
(Ω)
Max.
IDC
(mA)
Max.
MA3216-600M4
MA3216-800M4
MA3216-121M4
MA3216-201M4
MA3216-301M4
MA3216-471M4
MA3216-601M4
MA3216-102M4
MA3216-600T4
MA3216-121T4
MA3216-201T4
MA3216-301T4
MA3216-601T4
MA3216-102T4
MA3216-500S4
MA3216-800S4
MA3216-121S4
MA3216-201S4
MA3216-301S4
60
80
120
200
300
470
600
1000
60
120
200
300
600
1000
50
80
120
200
300
0.12
0.15
0.20
0.30
0.45
0.45
0.50
0.80
0.12
0.20
0.30
0.45
0.50
0.80
0.20
0.25
0.25
0.30
0.40
200
150
100
100
100
100
100
100
200
200
150
150
100
50
200
200
200
200
200
E
T
E
L
O
S
B
O
Materials
Core Material .................................Ferrite
Internal Conductor...............................Ag
Terminal .....................................Ag/Ni/Sn
Electrical Specifications (continued)
X
R
0.1
IMPEDANCE (Ω)
10
1
10
100
1000 1800
0.02
1
MA3216-201M4
100
IMPEDANCE (Ω)
X
R
0.1
10
10
100
FREQUENCY (MHz)
1000 1800
1000 1800
Z
100
X
R
10
1
0.1
100
MA3216-601M4
Z
10
1
1
1000
Z
1
R
1
FREQUENCY (MHz)
1000
100
X
10
0.1
1000 1800
Z
100
MA3216-301M4
500
IMPEDANCE (Ω)
10
FREQUENCY (MHz)
FREQUENCY (MHz)
0.05
X
R
1
0.1
0.01
0.001
Z
IMPEDANCE (Ω)
IMPEDANCE (Ω)
10
MA3216-121M4
1000
100
Z
1
MA3216-800M4
200
IMPEDANCE (Ω)
MA3216-600M4
200
100
1
10
100
FREQUENCY (MHz)
1000 1800
100
R
10
X
1
0.1
1
10
100
FREQUENCY (MHz)
*RoHS Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 2011/65/EU June 8, 2011.
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
1000 1800
Surface
Mount
Inductor
MA
Series
ChipChip
Ferrite
BeadCapability
Arrays Matrix
Electrical Specifications (Continued)
MA3216-102M4
MA3216-201T4
MA3216-121T4
200
10000
1000
IMPEDANCE (Ω)
X
10
R
Z
10
R
1
10
100
MA3216-301T4
1
10
100
1000 1800
Z
100
X
10
R
1
0.1
1000 1800
FREQUENCY (MHz)
1
10
100
1000 1800
500
100
Z
X
10
R
1
100
1000 1800
FREQUENCY (MHz)
1000 1800
MA3216-500S4
Z
10
X
1
R
0.02
1
10
100
1000 1800
FREQUENCY (MHz)
MA3216-201S4
5000
100
1000
X
Z
10
R
1
0.1
100
FREQUENCY (MHz)
100
MA3216-121S4
MA3216-800S4
10
10
0.1
FREQUENCY (MHz)
500
1
1
500
IMPEDANCE (Ω)
IMPEDANCE (Ω)
1
IMPEDANCE (Ω)
IMPEDANCE (Ω)
X
R
IMPEDANCE (Ω)
100
MA3216-601T4
Z
0.1
10
X
1
0.1
1
1000
100
0.1
R
10
FREQUENCY (MHz)
1000
10
Z
E
T
E
L
O
S
B
O
0.1
1000 1800
FREQUENCY (MHz)
100
1
1
0.1
X
IMPEDANCE (Ω)
IMPEDANCE (Ω)
Z
100
IMPEDANCE (Ω)
100
1000
1
10
100
FREQUENCY (MHz)
1000 1800
Z
100
X
R
10
1
0.1
1
10
100
1000 1800
FREQUENCY (MHz)
MA3216-301S4
IMPEDANCE (Ω)
1000
100
Z
X
10
R
1
0.2
1
10
100
FREQUENCY (MHz)
1000 1800
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
Surface
Mount
Inductor
MA
Series
ChipChip
Ferrite
BeadCapability
Arrays Matrix
Product Dimensions
Recommended Land Pattern
Recommended Soldering
0.4 ± 0.15
(.016 ± .006)
10 seconds max.
0.8 ± 0.1
(.031 ± .004)
2.5
(.098)
1.6 ± 0.2
(.063 ± .008)
200°C
30 seconds max.
0.4
(.016)
E
T
E
L
O
S
B
O
DIMENSIONS ARE:
MM
(INCHES)
0.8 ± 0.1
(.031 ± .004)
0.2 ± 0.1
(.008 ± .004)
Reel Dimensions
178.0
DIA.
(7.00)
Preheating:
100 to 150°C
2 minutes min.
0.8
(.031)
3.2 ± 0.2
(.126 ± .008)
0.2 MIN. TO 0.45 MAX.
(.008 MIN. TO .018 MAX.)
Soldering 230°C
0.8
(.031)
2.0 ± 0.5
(.079 ± .020)
21.0 ± 0.8
(.827 ± .031)
12.5
(.492)
THICKNESS
0.10
(.004)
MAX.
13.0 ± 0.5
(.512 ± .020)
DIA.
EMBOSSED
CAVITY
50.0
(1.969)
13.0 ± 0.5
DIA.
(.512 ± .020)
3000 pcs. per reel.
Gross weight: 140g.
9.0
(.354)
EMBOSSED
CARRIER
8.0
(.315)
REV. /14
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
CARRIER TAPE WIDTH:
CAVITY PITCH:
4.0
(.157)
8.0
(.315)