PL IA N T Features CO M ■ Superior circuit protection *R oH S ■ Overcurrent and overvoltage protection ■ Blocks surges up to rated limits The TBU-CX Series is obsolete and not recommended for new designs. The TBU-CA Series is the recommended alternative - see data sheet for specifications. ■ High-speed performance C 0 0 7X85 5 ■ Small SMT package ■ RoHS compliant* ■ Agency recognition: TBU-CX Series - TBU® High-Speed Protectors General Information Agency Approval The TBU-CX Series of Bourns® TBU® products are low capacitance dual bidirectional high-speed protection components, constructed using MOSFET semiconductor technology, and designed to protect against faults caused by short circuits, AC power cross, induction and lightning surges. External Resistor Line In/ Line Out R Line Out/ Line In Description File Number: E315805 UL The TBU® high-speed protector placed in the system circuit will monitor the current with the MOSFET detection circuit triggering to provide an effective barrier behind which sensitive electronics will not be exposed to large voltages or currents during surge events. The TBU® device is provided in a surface mount DFN package and meets industry standard requirements such as RoHS and Pb Free solder reflow profiles. Absolute Maximum Ratings (@ TA = 25 °C Unless Otherwise Noted) Symbol Parameter Vimp Peak impulse voltage withstand with duration less than 10 ms Vrms Continuous A.C. RMS voltage Top Tstg Tjmax ESD Part Number TBU-CX025-VTC-WH TBU-CX040-VTC-WH TBU-CX050-VTC-WH TBU-CX065-VTC-WH TBU-CX085-VTC-WH TBU-CX025-VTC-WH TBU-CX040-VTC-WH TBU-CX050-VTC-WH TBU-CX065-VTC-WH TBU-CX085-VTC-WH Unit Operating temperature range Value 250 400 500 650 850 100 200 250 300 425 -40 to +125 Storage temperature range Maximum Junction Temperature HBM ESD Protection per IEC 61000-4-2 -65 to +150 +125 ±2 °C °C kV V V °C Electrical Characteristics (@ TA = 25 °C Unless Otherwise Noted) Symbol Parameter Part Number Min. Typ. Max. Unit Itrigger Current required for the device to go from operating state to protected state (Rexternal = 0 ohm) TBU-CXxxx-VTC-WH 500 750 1000 mA Rdevice Series resistance of the TBU device (Rexternal = 0 ohm) 2.6 3.6 5.0 7.0 10.7 3.0 4.2 5.7 8.0 13.0 Ω tblock Time for the device to go from normal operating state to protected state 1 µs IQ Current through the triggered TBU® device with 50 Vdc circuit voltage 0.50 1.00 mA Vreset Voltage below which the triggered TBU® device will transition to normal operating state 16 20 Rth(j-l) Junction to package pads - FR4 using recommended pad layout 98 °C/W Rth(j-l) Junction to package pads - FR4 using heat sink on board (6 cm2) (1 in2) 40 °C/W Vimp = 250 V Vimp = 400 V Vimp = 500 V Vimp = 650 V Vimp = 850 V Itrigger (min.) = Itrigger (min.) = Itrigger (min.) = Itrigger (min.) = Itrigger (min.) = 500 mA 500 mA 500 mA 500 mA 500 mA TBU-CX025-VTC-WH TBU-CX040-VTC-WH TBU-CX050-VTC-WH TBU-CX065-VTC-WH TBU-CX085-VTC-WH 0.25 12 *RoHS Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 2011/65/EU June 8, 2011. Specifications are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specific applications. V Applications ■ Voice / VDSL cards ■ Protection modules and dongles ■ Process control equipment ■ Test and measurement equipment ■ General electronics TBU-CX Series - TBU® High-Speed Protectors Reference Application Basic TBU Operation ® The TBU devices are general use protectors used in a wide variety of applications. The maximum voltage rating of the TBU device should never be exceeded. Where necessary, an OVP should be employed to limit the maximum voltage. A costeffective protection solution combines Bourns® TBU® protection devices with a pair of Bourns® MOVs. For bandwidth sensitive applications, a Bourns® GDT may be substituted for the MOV. See “Trigger Current vs External Resistor Value” graph for selecting the optimum trigger current value using a 0 ohm – 50 ohm resistor value. The TBU® device, constructed using MOSFET semiconductor technology, placed in the system circuit will monitor the current with the MOSFET detection circuit triggering to provide an effective barrier behind which sensitive electronics are not exposed to large voltages or currents during surge events. The TBU® device operates in approximately 1 μs - once line current exceeds the TBU® device’s trigger current Itrigger. When operated, the TBU® device restricts line current to less than 1 mA typically. When operated, the TBU® device will block all voltages including the surge up to rated limits. Note: Line Resistance = TBU® Device Resistance + Rexternal Resistance After the surge, the TBU® device resets when the voltage across the TBU® device falls to the Vreset level. The TBU® device will automatically reset on lines which have no DC bias or have DC bias below Vreset (such as unpowered signal lines). R External Resistor Line TBU ® Device OVP TBU ® Device OVP Equip. If the line has a normal DC bias above Vreset, the voltage across the TBU® device may not fall below Vreset after the surge. In such cases, special care needs to be taken to ensure that the TBU® device will reset, with software monitoring as one method used to accomplish this. Bourns application engineers can provide further assistance. Line R External Resistor Performance Graphs Typical V-I Characteristics (TBU-CX050-VTC-WH with Rext = 1 Ω) Typical Trigger Current vs. Temperature 1.8 ITRIP VRESET VOLTAGE (5 V/div) Normalized Trip Current (A) 1.6 CURRENT (100 mA/div) 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0.0 -75 -50 -25 0 25 50 75 100 125 Junction Temperature (°C) Specifications are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specific applications. TBU-CX Series - TBU® High-Speed Protectors Performance Graphs (Continued) Trigger Current vs. External Resistor Value Power Derating Curve 3.0 1000 No Additional PCB Cu 0.5 sq. in. Additional PCB Cu Trigger Current (mA) Total Max. Power (W) 2.5 2.0 1.5 1.0 0.5 100 0.0 40 20 60 80 100 120 140 10 0.1 Junction Temperature (°C) 1 10 100 R (Ohms) Typical Resistance vs. Temperature Normalized Resistance (Ω) 2.2 2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0.0 -75 -50 -25 0 25 50 75 100 125 Junction Temperature (°C) Product Dimensions 0.85 ± 0.05 (.033 ± .002) 8.25 ± 0.10 (.325 ± .004) 0.45 (.018) 0.75 (.030) 0.30 (.012) 1.85 (.073) 0.75 (.030) 0.30 (.012) 4.00 ± 0.10 (.157 ± .004) 3.40 (.134) PIN 1 & BACKSIDE CHAMFER 5 4 3 2 1.85 (.073) 1 0.45 (.039) 0.85 (.033) 0.30 (.012) 0.30 (.012) DIMENSIONS: 0.85 (.033) 0.70 (.028) 0.50 (.020) 0.00 - 0.05 (.000 - .002) MM (INCHES) Specifications are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specific applications. 0.50 (.020) Pad Designation Pad # 1 2 3 4 5 Pin Out Line In/Out External R Pad External R Pad NU Line Out/In C 0.25 PIN 1 (.010) TBU-CX Series - TBU® High-Speed Protectors Recommended Pad Layout Reflow Profile ® TBU High-Speed Protectors have a 100 % matte-tin termination finish. For improved thermal dissipation, the recommended layout uses PCB copper areas which extend beyond the exposed solder pad. The exposed solder pads should be defined by a solder mask which matches the pad layout of the TBU® device in size and spacing. It is recommended that they should be the same dimension as the TBU® pads but if smaller solder pads are used, they should be centered on the TBU® package terminal pads and not more than 0.10-0.12 mm (0.004-0.005 in.) smaller in overall width or length. Solder pad areas should not be larger than the TBU® pad sizes to ensure adequate clearance is maintained. The recommended stencil thickness is 0.10-0.12 mm (0.004-0.005 in.) with a stencil opening size 0.025 mm (0.0010 in.) less than the solder pad size. Extended copper areas beyond the solder pad significantly improve the junction to ambient thermal resistance, resulting in operation at lower junction temperatures with a corresponding benefit of reliability. All pads should soldered to the PCB, including pads marked as NC or NU but no electrical connection should be made to these pads. For minimum parasitic capacitance, it is recommended that signal, ground or power signals are not routed beneath any pad. 55 4 3 2 Profile Feature Average Ramp-Up Rate (Tsmax to Tp) Preheat - Temperature Min. (Tsmin) - Temperature Max. (Tsmax) - Time (tsmin to tsmax) Time maintained above: - Temperature (TL) - Time (tL) Peak/Classification Temperature (Tp) Time within 5 °C of Actual Peak Temp. (tp) Ramp-Down Rate Time 25 °C to Peak Temperature Pb-Free Assembly 3 °C/sec. max. 150 °C 200 °C 60-180 sec. 217 °C 60-150 sec. 260 °C 20-40 sec. 6 °C/sec. max. 8 min. max. 11 Thermal Resistance vs Additional PCB Cu Area Dark grey areas show added PCB copper area for better thermal resistance. Thermal Resistance (°C/W) 120 100 80 60 40 20 0 0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 Added Cu Area (Sq. In.) Specifications are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specific applications. TBU-CX Series - TBU® High-Speed Protectors How to Order Typical Part Marking TBU - CX 085 - VTC - WH MANUFACTURER’S TRADEMARK ® TBU Product PRODUCT CODE - 1ST & 2ND DIGITS INDICATE PRODUCT FAMILY: CX = TBU-CX SERIES - 3RD & 4TH DIGITS INDICATE IMPULSE VOLTAGE: 25 = 250 V 50 = 500 V 85 = 850 V 40 = 400 V 65 = 650 V Series CX = Bi-Series Impulse Voltage Rating 025 = 250 V 040 = 400 V 050 = 500 V 065 = 650 V 085 = 850 V PIN 1 MANUFACTURING DATE CODE - 1ST DIGIT INDICATES THE YEAR’S 6-MONTH PERIOD. - 2ND DIGIT INDICATES THE WEEK NUMBER IN THE 6-MONTH PERIOD. - 3RD & 4TH DIGITS INDICATE SPECIFIC LOT FOR THE WEEK. Trigger Current VTC = Variable Trigger Current Hold to Trip Ratio Suffix W = Hold to Trip Ratio 6-MONTH PERIOD CODES: A = JAN-JUN 2009 C = JAN-JUN 2010 B = JUL-DEC 2009 D = JUL-DEC 2010 Package Suffix H = DFN Package E = JAN-JUN 2011 F = JUL-DEC 2011 Packaging Specifications P0 E D t B P2 TOP COVER TAPE A N F W C D B0 K0 CENTER LINES OF CAVITY A0 P D1 EMBOSSMENT G (MEASURED AT HUB) USER DIRECTION OF FEED QUANTITY: 3000 PIECES PER REEL A Min. 326 (12.835) B Max. 330 (13.002) Min. 1.5 (.059) A0 Min. 4.3 (.169) B0 Max. 4.5 (.177) Min. 8.45 (.333) Max. 1.2 (.047) Min. 7.9 (.311) K0 Min. 1.0 (.039) C Max. 2.5 (.098) Min. 12.8 (.504) D Max. 13.5 (.531) D Max. 8.65 (.341) Min. 1.5 (.059) Max. 8.1 (.319) Min. 3.9 (.159) P Min. 20.2 (.795) - D1 Max. 1.6 (.063) Min. 1.5 (.059) Max. 4.1 (.161) Min. 1.9 (.075) P0 G Ref. 16.5 (.650) Max. E Max. - Min. 1.65 (.065) P2 F Max. 1.85 (.073) Min. 7.4 (.291) Max. 0.35 (.014) Min. 15.7 (.618) t Max. 2.1 (.083) Min. 0.25 (.010) N Ref. 102 (4.016) max. 7.6 (.299) W DIMENSIONS: REV. 07/14 “TBU” is a registered trademark of Bourns, Inc. in the United States and other countries. Specifications are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specific applications. Max. 16.3 (.642) MM (INCHES)