TBU-CX Series

PL
IA
N
T
Features
CO
M
■ Superior circuit protection
*R
oH
S
■ Overcurrent and overvoltage protection
■ Blocks surges up to rated limits
The TBU-CX Series is obsolete and not
recommended for new designs.
The TBU-CA Series is the
recommended alternative - see data sheet
for specifications.
■ High-speed performance
C
0 0 7X85
5
■ Small SMT package
■ RoHS compliant*
■ Agency recognition:
TBU-CX Series - TBU® High-Speed Protectors
General Information
Agency Approval
The TBU-CX Series of Bourns® TBU®
products are low capacitance dual bidirectional high-speed protection components,
constructed using MOSFET semiconductor
technology, and designed to protect against
faults caused by short circuits, AC power cross,
induction and lightning surges.
External Resistor
Line In/
Line Out
R
Line Out/
Line In
Description
File Number: E315805
UL
The TBU® high-speed protector placed in the system circuit will monitor the current with
the MOSFET detection circuit triggering to provide an effective barrier behind which
sensitive electronics will not be exposed to large voltages or currents during surge
events. The TBU® device is provided in a surface mount DFN package and meets
industry standard requirements such as RoHS and Pb Free solder reflow profiles.
Absolute Maximum Ratings (@ TA = 25 °C Unless Otherwise Noted)
Symbol
Parameter
Vimp
Peak impulse voltage withstand with duration less than 10 ms
Vrms
Continuous A.C. RMS voltage
Top
Tstg
Tjmax
ESD
Part Number
TBU-CX025-VTC-WH
TBU-CX040-VTC-WH
TBU-CX050-VTC-WH
TBU-CX065-VTC-WH
TBU-CX085-VTC-WH
TBU-CX025-VTC-WH
TBU-CX040-VTC-WH
TBU-CX050-VTC-WH
TBU-CX065-VTC-WH
TBU-CX085-VTC-WH
Unit
Operating temperature range
Value
250
400
500
650
850
100
200
250
300
425
-40 to +125
Storage temperature range
Maximum Junction Temperature
HBM ESD Protection per IEC 61000-4-2
-65 to +150
+125
±2
°C
°C
kV
V
V
°C
Electrical Characteristics (@ TA = 25 °C Unless Otherwise Noted)
Symbol
Parameter
Part Number
Min.
Typ.
Max.
Unit
Itrigger
Current required for the device to go from operating state to
protected state (Rexternal = 0 ohm)
TBU-CXxxx-VTC-WH
500
750
1000
mA
Rdevice
Series resistance of
the TBU device
(Rexternal = 0 ohm)
2.6
3.6
5.0
7.0
10.7
3.0
4.2
5.7
8.0
13.0
Ω
tblock
Time for the device to go from normal operating state to protected state
1
µs
IQ
Current through the triggered TBU® device with 50 Vdc circuit voltage
0.50
1.00
mA
Vreset
Voltage below which the triggered TBU® device will transition to normal operating state
16
20
Rth(j-l)
Junction to package pads - FR4 using recommended pad layout
98
°C/W
Rth(j-l)
Junction to package pads - FR4 using heat sink on board (6 cm2) (1 in2)
40
°C/W
Vimp = 250 V
Vimp = 400 V
Vimp = 500 V
Vimp = 650 V
Vimp = 850 V
Itrigger (min.) =
Itrigger (min.) =
Itrigger (min.) =
Itrigger (min.) =
Itrigger (min.) =
500 mA
500 mA
500 mA
500 mA
500 mA
TBU-CX025-VTC-WH
TBU-CX040-VTC-WH
TBU-CX050-VTC-WH
TBU-CX065-VTC-WH
TBU-CX085-VTC-WH
0.25
12
*RoHS Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 2011/65/EU June 8, 2011.
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
V
Applications
■ Voice / VDSL cards
■ Protection modules and dongles
■ Process control equipment
■ Test and measurement equipment
■ General electronics
TBU-CX Series - TBU® High-Speed Protectors
Reference Application
Basic TBU Operation
®
The TBU devices are general use protectors used in a wide
variety of applications. The maximum voltage rating of the TBU
device should never be exceeded. Where necessary, an OVP
should be employed to limit the maximum voltage. A costeffective protection solution combines Bourns® TBU® protection
devices with a pair of Bourns® MOVs. For bandwidth sensitive applications, a Bourns® GDT may be substituted for the MOV. See
“Trigger Current vs External Resistor Value” graph for selecting
the optimum trigger current value using a 0 ohm –
50 ohm resistor value.
The TBU® device, constructed using MOSFET semiconductor
technology, placed in the system circuit will monitor the
current with the MOSFET detection circuit triggering to provide
an effective barrier behind which sensitive electronics are not
exposed to large voltages or currents during surge events. The
TBU® device operates in approximately 1 μs - once line
current exceeds the TBU® device’s trigger current Itrigger.
When operated, the TBU® device restricts line current to less
than 1 mA typically. When operated, the TBU® device will
block all voltages including the surge up to rated limits.
Note: Line Resistance =
TBU® Device Resistance + Rexternal Resistance
After the surge, the TBU® device resets when the voltage
across the TBU® device falls to the Vreset level. The TBU®
device will automatically reset on lines which have no DC bias
or have DC bias below Vreset (such as unpowered signal lines).
R
External
Resistor
Line
TBU ®
Device
OVP
TBU ®
Device
OVP
Equip.
If the line has a normal DC bias above Vreset, the voltage
across the TBU® device may not fall below Vreset after the
surge. In such cases, special care needs to be taken to ensure
that the TBU® device will reset, with software monitoring as one
method used to accomplish this. Bourns application
engineers can provide further assistance.
Line
R
External
Resistor
Performance Graphs
Typical V-I Characteristics (TBU-CX050-VTC-WH with Rext = 1 Ω)
Typical Trigger Current vs. Temperature
1.8
ITRIP
VRESET
VOLTAGE
(5 V/div)
Normalized Trip Current (A)
1.6
CURRENT
(100 mA/div)
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
-75 -50
-25
0
25
50
75
100 125
Junction Temperature (°C)
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
TBU-CX Series - TBU® High-Speed Protectors
Performance Graphs (Continued)
Trigger Current vs. External Resistor Value
Power Derating Curve
3.0
1000
No Additional PCB Cu
0.5 sq. in. Additional PCB Cu
Trigger Current (mA)
Total Max. Power (W)
2.5
2.0
1.5
1.0
0.5
100
0.0
40
20
60
80
100
120
140
10
0.1
Junction Temperature (°C)
1
10
100
R (Ohms)
Typical Resistance vs. Temperature
Normalized Resistance (Ω)
2.2
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
-75 -50 -25
0
25
50
75 100 125
Junction Temperature (°C)
Product Dimensions
0.85 ± 0.05
(.033 ± .002)
8.25 ± 0.10
(.325 ± .004)
0.45
(.018)
0.75
(.030)
0.30
(.012)
1.85
(.073)
0.75
(.030)
0.30
(.012)
4.00 ± 0.10
(.157 ± .004)
3.40
(.134)
PIN 1 & BACKSIDE CHAMFER
5
4
3
2
1.85
(.073)
1
0.45
(.039)
0.85
(.033)
0.30
(.012)
0.30
(.012)
DIMENSIONS:
0.85
(.033)
0.70
(.028)
0.50
(.020)
0.00 - 0.05
(.000 - .002)
MM
(INCHES)
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different
applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
0.50
(.020)
Pad Designation
Pad #
1
2
3
4
5
Pin Out
Line In/Out
External R Pad
External R Pad
NU
Line Out/In
C
0.25
PIN 1
(.010)
TBU-CX Series - TBU® High-Speed Protectors
Recommended Pad Layout
Reflow Profile
®
TBU High-Speed Protectors have a 100 % matte-tin termination
finish. For improved thermal dissipation, the recommended layout
uses PCB copper areas which extend beyond the exposed solder
pad. The exposed solder pads should be defined by a solder mask
which matches the pad layout of the TBU® device in size and spacing. It is recommended that they should be the same dimension as
the TBU® pads but if smaller solder pads are used, they should be
centered on the TBU® package terminal pads and not more than
0.10-0.12 mm (0.004-0.005 in.) smaller in overall width or length.
Solder pad areas should not be larger than the TBU® pad sizes
to ensure adequate clearance is maintained. The recommended
stencil thickness is 0.10-0.12 mm (0.004-0.005 in.) with a stencil
opening size 0.025 mm (0.0010 in.) less than the solder pad size.
Extended copper areas beyond the solder pad significantly improve
the junction to ambient thermal resistance, resulting in operation
at lower junction temperatures with a corresponding benefit of reliability. All pads should soldered to the PCB, including pads marked
as NC or NU but no electrical connection should be made to these
pads. For minimum parasitic capacitance, it is recommended that
signal, ground or power signals are not routed beneath any pad.
55
4
3
2
Profile Feature
Average Ramp-Up Rate (Tsmax to Tp)
Preheat
- Temperature Min. (Tsmin)
- Temperature Max. (Tsmax)
- Time (tsmin to tsmax)
Time maintained above:
- Temperature (TL)
- Time (tL)
Peak/Classification Temperature (Tp)
Time within 5 °C of Actual Peak Temp. (tp)
Ramp-Down Rate
Time 25 °C to Peak Temperature
Pb-Free Assembly
3 °C/sec. max.
150 °C
200 °C
60-180 sec.
217 °C
60-150 sec.
260 °C
20-40 sec.
6 °C/sec. max.
8 min. max.
11
Thermal Resistance vs Additional PCB Cu Area
Dark grey areas show added PCB copper area for better
thermal resistance.
Thermal Resistance (°C/W)
120
100
80
60
40
20
0
0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
Added Cu Area (Sq. In.)
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
TBU-CX Series - TBU® High-Speed Protectors
How to Order
Typical Part Marking
TBU - CX 085 - VTC - WH
MANUFACTURER’S
TRADEMARK
®
TBU Product
PRODUCT CODE
- 1ST & 2ND DIGITS INDICATE PRODUCT FAMILY:
CX = TBU-CX SERIES
- 3RD & 4TH DIGITS INDICATE IMPULSE VOLTAGE:
25 = 250 V
50 = 500 V
85 = 850 V
40 = 400 V
65 = 650 V
Series
CX = Bi-Series
Impulse Voltage Rating
025 = 250 V
040 = 400 V
050 = 500 V
065 = 650 V
085 = 850 V
PIN 1
MANUFACTURING
DATE CODE
- 1ST DIGIT INDICATES THE YEAR’S 6-MONTH PERIOD.
- 2ND DIGIT INDICATES THE WEEK NUMBER IN THE 6-MONTH PERIOD.
- 3RD & 4TH DIGITS INDICATE SPECIFIC LOT FOR THE WEEK.
Trigger Current
VTC = Variable Trigger Current
Hold to Trip Ratio Suffix
W = Hold to Trip Ratio
6-MONTH PERIOD CODES:
A = JAN-JUN 2009
C = JAN-JUN 2010
B = JUL-DEC 2009
D = JUL-DEC 2010
Package Suffix
H = DFN Package
E = JAN-JUN 2011
F = JUL-DEC 2011
Packaging Specifications
P0
E
D
t
B
P2
TOP
COVER
TAPE
A
N
F
W
C
D
B0
K0
CENTER
LINES OF
CAVITY
A0
P
D1
EMBOSSMENT
G (MEASURED AT HUB)
USER DIRECTION OF FEED
QUANTITY: 3000 PIECES PER REEL
A
Min.
326
(12.835)
B
Max.
330
(13.002)
Min.
1.5
(.059)
A0
Min.
4.3
(.169)
B0
Max.
4.5
(.177)
Min.
8.45
(.333)
Max.
1.2
(.047)
Min.
7.9
(.311)
K0
Min.
1.0
(.039)
C
Max.
2.5
(.098)
Min.
12.8
(.504)
D
Max.
13.5
(.531)
D
Max.
8.65
(.341)
Min.
1.5
(.059)
Max.
8.1
(.319)
Min.
3.9
(.159)
P
Min.
20.2
(.795)
-
D1
Max.
1.6
(.063)
Min.
1.5
(.059)
Max.
4.1
(.161)
Min.
1.9
(.075)
P0
G
Ref.
16.5
(.650)
Max.
E
Max.
-
Min.
1.65
(.065)
P2
F
Max.
1.85
(.073)
Min.
7.4
(.291)
Max.
0.35
(.014)
Min.
15.7
(.618)
t
Max.
2.1
(.083)
Min.
0.25
(.010)
N
Ref.
102
(4.016)
max.
7.6
(.299)
W
DIMENSIONS:
REV. 07/14
“TBU” is a registered trademark of Bourns, Inc. in the United States and other countries.
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
Max.
16.3
(.642)
MM
(INCHES)