T PL IA N M CO *R oH S Features Applications ■ Superior circuit protection ■ Ethernet ports ■ Overcurrent and overvoltage protection ■ Protection modules and dongles ■ Blocks surges up to rated limits ■ Process control equipment ■ High-speed performance ■ Test and measurement equipment ■ Small SMT package ■ General electronics ■ RoHS compliant* ■ Agency listing: TBU-DT Series - TBU® High-Speed Protectors General Information The TBU-DT Series of Bourns® TBU® (Transient Blocking Unit) products are very low capacitance dual unidirectional high-speed surge protection components designed to protect against faults caused by short circuits, AC power cross, induction and lightning surges. Line Side The TBU-DT series is a unidirectional TBU® device; the TBU® protector will trip in less than 1 μs when the current reaches the maximum value in one direction only, that is when Pin 1 is positive in voltage with respect to Pin 2, and Pin 4 is positive with respect to Pin 3. No current limiting exists in the opposite polarity, and the TBU® device appears as resistive in nature. The reverse current should not exceed the maximum trigger current level of the TBU® device. An external diode may be used to prevent reverse current in DC biased applications. 2 4 3 Line Side Load Side Load Side TBU® Device The TBU® protector blocks surges and provides an effective barrier behind which sensitive electronics will not be exposed to large voltages or currents during surge events. After the surge, the TBU® device resets when the voltage across the TBU® device falls to the Vreset level. The TBU® device will automatically reset on lines which have no DC bias or have DC bias below Vreset (such as unpowered signal lines). The TBU® device is provided in a surface mount DFN package and meets industry standard requirements such as RoHS and Pb Free solder reflow profiles. 1 Agency Listing Description File Number: E315805 UL Absolute Maximum Ratings (@ TA = 25 °C Unless Otherwise Noted) Symbol Parameter Vimp Peak impulse voltage withstand with duration less than 10 ms Vrms Continuous A.C. RMS voltage Top Tstg Operating temperature range Storage temperature range Part Number TBU-DT065-xxx-WH TBU-DT085-xxx-WH TBU-DT065-xxx-WH TBU-DT085-xxx-WH Value 650 850 300 425 -40 to +125 -65 to +150 Unit V V °C °C Electrical Characteristics (@ TA = 25 °C Unless Otherwise Noted) Symbol Parameter Itrigger Current required for the device to go from operating state to protected state Part Number TBU-DTxxx-100-WH TBU-DTxxx-200-WH TBU-DTxxx-300-WH TBU-DTxxx-500-WH Min. 100 200 300 500 Typ. 150 300 450 750 Max. 200 400 600 1000 Vimp = 650 V Vimp = 650 V Vimp = 650 V Vimp = 650 V Itrigger (min.) = Itrigger (min.) = Itrigger (min.) = Itrigger (min.) = 100 mA 200 mA 300 mA 500 mA TBU-DT065-100-WH TBU-DT065-200-WH TBU-DT065-300-WH TBU-DT065-500-WH 8.5 5.6 4.6 4.0 10.0 6.6 5.6 4.8 Vimp = 850 V Vimp = 850 V Vimp = 850 V Vimp = 850 V Itrigger (min.) = Itrigger (min.) = Itrigger (min.) = Itrigger (min.) = 100 mA 200 mA 300 mA 500 mA TBU-DT085-100-WH TBU-DT085-200-WH TBU-DT085-300-WH TBU-DT085-500-WH 10.3 7.4 6.5 5.8 12.1 8.7 7.7 6.9 Rdevice Series resistance of the TBU® device Rmatch tblock IQ Vreset Rth(j-l) Rth(j-l) Package resistance matching of the TBU® device #1 - TBU® device #2 Time for the device to go from normal operating state to protected state Current through the triggered TBU® device with 50 Vdc circuit voltage Voltage below which the triggered TBU® device will transition to normal operating state Junction to package pads - FR4 using recommended pad layout Junction to package pads - FR4 using heat sink on board (6 cm2) -0.5 0.25 10 0.50 14 116 96 *RoHS Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 2011/65/EU June 8, 2011. Specifications are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specific applications. +0.5 1 1.00 18 Unit mA Ω Ω µs mA V °C/W °C/W TBU-DT Series - TBU® High-Speed Protectors Reference Application Basic TBU Operation ® The TBU device can be used to protect against excessive voltage surges in transformer coupled equipment, as shown in the figure below. The TBU® protector prevents any surges from causing damage. An overvoltage protection device, such as an MOV or GDT, may be used to provide additional overvoltage protection if the surge voltage is likely to be above the maximum rating of the TBU® device. 1 Line Side 2 OVP Load The TBU® device is a silicon-based, solid-state, resettable device which is placed in series with a signal path. The TBU® device operates in approximately 1 µs - once line current exceeds the TBU® device’s trigger current Itrigger. When operated, the TBU® device restricts line current to less than 1 mA typically. When operated, the TBU® device will block all system voltages and any other voltages including the surge up to rated limits. After the surge, the TBU® device resets when the voltage across the TBU® device falls to the Vreset level. The TBU® device will automatically reset on lines which have no DC bias or have DC bias below Vreset (such as unpowered signal lines). OVP 4 If the line has a normal DC bias above Vreset, the voltage across the TBU® device may not fall below Vreset after the surge. In such cases, special care needs to be taken to ensure that the TBU® device will reset, otherwise an automatic or manual power down will be required. Bourns application engineers can provide further assistance. 3 TBU® Device Performance Graphs V-I Characteristic - TBU-DT085-300-WH (Pin 2-1 & Pin 3-4) Typical Trigger Current vs. Temperature 1.8 CURRENT (100 mA/div.) VRESET VOLTAGE (5 v/div.) Normalized Trip Current (A) ITRIP 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0.0 -75 -50 -25 0 25 50 75 100 125 150 Junction Temperature (°C) Specifications are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specific applications. TBU-DT Series - TBU® High-Speed Protectors Performance Graphs (Continued) Typical Resistance vs. Temperature Power Derating Curve 2.2 No additional PCB Cu (2 TBU® Protectors) 0.5 sq. in. additional PCB CU (2 TBU® Protectors) No additional PCB Cu (1 TBU® Protector) 0.5 sq. in. additional PCB CU (1 TBU® Protector) Total Max. Power (W) 2.5 2.0 1.5 1.0 0.5 0.0 20 40 60 80 100 120 140 Junction Temperature (°C) Normalized Resistance (Ω) 3.0 2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0.0 -75 -50 -25 0 25 50 75 100 125 150 Junction Temperature (°C) Reflow Profile Profile Feature Average Ramp-Up Rate (Tsmax to Tp) Preheat - Temperature Min. (Tsmin) - Temperature Max. (Tsmax) - Time (tsmin to tsmax) Time maintained above: - Temperature (TL) - Time (tL) Peak/Classification Temperature (Tp) Time within 5 °C of Actual Peak Temp. (tp) Ramp-Down Rate Time 25 °C to Peak Temperature Pb-Free Assembly 3 °C/sec. max. 150 °C 200 °C 60-180 sec. 217 °C 60-150 sec. 260 °C 20-40 sec. 6 °C/sec. max. 8 min. max. Specifications are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specific applications. ® 3312Series - 2 mm SMD Trimming Potentiometer TBU-DT - TBU High-Speed Protectors Product Dimensions 0.75 (.030) 3.05 (.120) 0.60 (.024) 5.00 ± 0.10 (.197 ± .004) 0.70 (.028) 5.00 ± 0.10 (.197 ± .004) SYMMETRY 0.35 (.014) XXXXX YWWLL 1.85 (.073) PIN 1 & BACKSIDE CHAMFER A= C 0.80 - 1.00 (.031 - .039) DIMENSIONS: SEATING PLANE 0.25 PIN 1 (.010) A1 = 0.00 - 0.05 (.000 - .002) MM (INCHES) Recommended Pad Layout TBU® High-Speed Protectors have a 100 % matte-tin termination finish. For improved thermal dissipation, the recommended layout uses PCB copper areas which extend beyond the exposed solder pad. The exposed solder pads should be defined by a solder mask which matches the pad layout of the TBU® device in size and spacing. It is recommended that they should be the same dimension as the TBU® pads but if smaller solder pads are used, they should be centered on the TBU® package terminal pads and not more than 0.10-0.12 mm (0.004-0.005 in.) smaller in overall width or length. Solder pad areas should not be larger than the TBU® pad sizes to ensure adequate clearance is maintained. The recommended stencil thickness is 0.10-0.12 mm (0.004-0.005 in.) with a stencil opening size 0.025 mm (0.0010 in.) less than the solder pad size. Extended copper areas beyond the solder pad significantly improve the junction to ambient thermal resistance, resulting in operation at lower junction temperatures with a corresponding benefit of reliability. All pads should soldered to the PCB, including pads marked as NC or NU but no electrical connection should be made to these pads. For minimum parasitic capacitance, it is recommended that signal, ground or power signals are not routed beneath any pad. Thermal Resistance vs. Additional PCB Cu Area Pad Designation 2 4 1 Pin Out 1 Line Side 1 2 Line Load 1 3 Line Load 2 4 Line Side 2 Dark grey areas show added PCB copper area for better thermal resistance. 120 Thermal Resistance to Ambient (°C/W) 3 Pad # Typical RTH (Power in 1 TBU® Device) Typical RTH (Equal Power in Both TBU® Devices) 100 80 60 40 20 0 0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 Added Cu Area (Sq. In.) Specifications are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specific applications. ® 3312 - 2Series mm SMD Potentiometer TBU-DT - TBUTrimming High-Speed Protectors How to Order Typical Part Marking TBU - DT 065 - 500 - WH MANUFACTURER’S TRADEMARK ® TBU Product Series DT = Dual Uni-Series Impulse Voltage Rating 065 = 650 V 085 = 850 V Trigger Current 100 = 100 mA 200 = 200 mA 5 DIGIT PRODUCT CODE: • 1ST ALPHA CHARACTER INDICATES PRODUCT FAMILY: T = TBU-DT SERIES • 2ND & 3RD DIGITS INDICATE IMPULSE VOLTAGE. • 4TH & 5TH DIGITS INDICATE TRIGGER CURRENT. XXXXX YWWLL 300 = 300 mA 500 = 500 mA Hold to Trip Ratio Suffix W = Hold to Trip Ratio MANUFACTURING DATE CODE: • 1ST DIGIT INDICATES THE YEAR. • 2ND & 3RD DIGITS INDICATE THE WEEK NUMBER. • 4TH & 5TH DIGITS INDICATE LOT CODE. PIN 1 Package Suffix H = DFN Package Packaging Specifications P0 E D t B P2 TOP COVER TAPE A N F W C D B0 K0 CENTER LINES OF CAVITY A0 P D1 EMBOSSMENT G (MEASURED AT HUB) DIMENSIONS: MM (INCHES) QUANTITY: 3000 PIECES PER REEL A Min. 326 (12.835) B Max. 330 (13.002) Min. 1.5 (.059) A0 Min. 5.15 (.203) Min. 5.15 (.203) K0 Min. 1.0 (.039) C Max. 2.5 (.098) B0 Max. 5.35 (.211) Min. 1.5 (.059) P Max. 1.2 (.047) Min. 7.9 (.311) Min. 12.8 (.504) D Max. 13.5 (.531) D Max. 5.35 (.211) Min. 3.8 (.150) Min. 20.2 (.795) Min. 1.5 (.059) E Max. - Min. 1.65 (.065) P2 Max. 4.2 (.165) Min. 1.95 (.077) G Ref. 16.5 (.650) Max. D1 Max. 1.6 (.063) P0 Max. 8.1 (.319) USER DIRECTION OF FEED F Max. 1.85 (.073) Min. 5.45 (.214) Max. 0.35 (.014) Min. 11.7 (.461) t Max. 2.05 (.081) Min. 0.25 (.010) N Ref. 102 (4.016) max. 5.55 (.218) W Asia-Pacific: Tel: +886-2 2562-4117 • Fax: +886-2 2562-4116 EMEA: Tel: +36 88 520 390 • Fax: +36 88 520 211 The Americas: Tel: +1-951 781-5500 • Fax: +1-951 781-5700 www.bourns.com REV. 09/15 “TBU” is a registered trademark of Bourns, Inc. in the United States and other countries. Specifications are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specific applications. Max. 12.3 (.484)