Transient Voltage Suppression Diodes Surface Mount > 3.0SMC series 3.0SMC Series RoHS Pb e3 Description Uni-directional The 3.0SMC series is designed specifically to protect sensitive electronic equipment from voltage transients induced by lightning and other transient voltage events. Features Maximum Ratings and Thermal Characteristics (TA=25OC unless otherwise noted) Parameter Symbol Value Unit Power Dissipation on Infinite Heat Sink at TL=50OC PD 6.5 W Peak Forward Surge Current, 8.3ms Single Half Sine Wave (Note 1) IFSM 300 A VF 3.5 V TJ -65 to 150 °C Maximum Instantaneous Forward Voltage at 100A for Unidirectional Only Operating Temperature Range Storage Temperature Range TSTG -65 to 175 °C Typical Thermal Resistance Junction to Lead RθJL 15 °C/W Typical Thermal Resistance Junction to Ambient RθJA 75 °C/W Notes: 1. Measured on 8.3ms single half sine wave or equivalent square wave for unidirectional device only, duty cycle=4 per minute maximum. Functional Diagram Bi-directional Cathode • For surface mounted applications in order to optimize board space • Low profile package • Typical failure mode is short from over-specified voltage or current • Whisker test is conducted based on JEDEC JESD201A per its table 4a and 4c • IEC-61000-4-2 ESD 30kV(Air), 30kV (Contact) • IPP is specified @ 8/20µS surge waveform • Built-in strain relief • VBR @ TJ= VBR@25°C x (1+αT x (TJ - 25)) (αT:Temperature Coefficient, typical value is 0.1%) • Glass passivated chip junction • Fast response time: typically less than 1.0ps from 0V to BV min • Excellent clamping capability • Low incremental surge resistance • High temperature to reflow soldering guaranteed: 260°C/40sec • Meet MSL level1, per J-STD-020, LF maximun peak of 260°C • Matte tin lead–free plated • Halogen free and RoHS compliant • Pb-free E3 means 2nd level interconnect is Pb-free and the terminal finish material is tin(Sn) (IPC/JEDEC J-STD609A.01) Anode Uni-directional Applications Additional Infomarion Datasheet Resources © 2015 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 11/20/15 Samples TVS devices are ideal for the protection of I/O Interfaces, VCC bus and other vulnerable circuits used in Telecom, Computer, Industrial and Consumer electronic applications. Transient Voltage Suppression Diodes Surface Mount > 3.0SMC series Electrical Characteristics (T =25°C unless otherwise noted) A Breakdown ™ Maximum TVSReverse Diode Arrays FamilyTest of Products) Voltage(SPA V Part Number (Uni) Marking 3.0SMC20A 3.0SMC24A 3.0SMC28A 3.0SMC30A 3.0SMC33A YLA YLC YLE YLF YLG BR Stand off Voltage VR (Volts) MIN MAX Current IT (mA) 22.20 26.70 31.10 33.30 36.70 24.50 29.50 34.40 36.80 40.60 1 1 1 1 1 (Volts) @ IT 20.0 24.0 28.0 30.0 33.0 Clamping Voltage VC @ 8/20µS Ipp (V) 42 51 59 62 70 Maximum Peak Maximum Pulse Current Reverse Ipp @ 8/20µS Leakage IR @ VR (A) (µA) 570 520 470 420 365 1 1 1 1 1 I-V Curve Characteristics Uni-directional Vc VBR VR V IR VF IT Ipp PPPM VR VBR VC IR VF Peak Pulse Power Dissipation -- Max power dissipation Stand-off Voltage -- Maximum voltage that can be applied to the TVS without operation Breakdown Voltage -- Maximum voltage that flows though the TVS at a specified test current (IT) Clamping Voltage -- Peak voltage measured across the TVS at a specified Ippm (peak impulse current) Reverse Leakage Current -- Current measured at VR Forward Voltage Drop for Uni-directional Ratings and Characteristic Curves (T =25°C unless otherwise noted) A Figure 1 - TVS Transients Clamping Waveform Figure 2 - Peak Pulse Power Rating 1000 Voltage Transients PPPM-Peak Pulse Power (KW) TJ initial = Tamb Voltage or Current Voltage Across TVS Current Through TVS 100 10 1 0.31x0.31" (8.0x8.0mm) 0.1 Copper Pad Area 0.001 Time 0.01 0.1 1 td-Pulse Width (ms) 10 continues on next page. © 2015 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 11/20/15 Transient Voltage Suppression Diodes Surface Mount > 3.0SMC series Ratings and Characteristic Curves (T =25°C unless otherwise noted) (Continued) A TVS Diode Arrays (SPA™ Family of Products) Figure 4 - Pulse Waveform Figure 3 - Peak Pulse Power Derating Curve 60 40 20 0 25 50 75 100 125 150 TJ - Initial Junction Temperature (ºC) Uni-direconal V=0V Uni-direconal V=VR 100 10 1 10 0 tr=8µS td=20µS Figure 6 - Typical Transient Thermal Impedance 10000 1 Half Value t-Time (µS) 100000 Cj(pF) 50 175 Figure 5 - Typical Junction Capacitance 1000 100 100 10 1 0.1 0.01 0.001 0.01 0.1 1 10 100 1000 TP - Pulse Duration (s) VBR - Reverse Breakdown Voltage(V) Figure 7 - Maximum Non-Repetitive Peak Forward Surge Current Uni-Directional only Figure 8 - Peak Forward Voltage Drop vs Peak Forward Current (Typical Values) 100.0 350 300 IF - Peak Forward Current(A) IFSM - Peak Forward Surve Current(A) tr= rise time to peak value td= decaytime to half value Waveform = tr x td 0 0 Peak Value 100 IPP- Peak Pulse Current, % IPP 80 Transient Thermal Impedance (°C/W) Peak Pulse Power (PPP) or Current (IPP) Derating in Percentage % 100 250 200 150 100 10.0 1.0 50 0 1 10 Number of Cycles at 60 Hz © 2015 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 11/20/15 100 0.1 0.0 1.0 2.0 3.0 VF - Peak Forward Voltage(V) 4.0 5.0 Transient Voltage Suppression Diodes Surface Mount > 3.0SMC series Soldering Parameters TVS Diode Arrays (SPA™ Family of Products) Lead–free Reflow Condition - Temperature Min (Ts(min)) 150°C - Temperature Max (Ts(max)) 200°C - Time (min to max) (ts) 60 – 180 secs Average ramp up rate (Liquidus Temp (TA) to peak 3°C/second max TS(max) to TA - Ramp-up Rate 3°C/second max Reflow - Temperature (TA) (Liquidus) 217°C - Time (min to max) (ts) 60 – 150 seconds Peak Temperature (TP) 260+0/-5 °C Time within 5°C of actual peak Temperature (tp) 20 – 40 seconds Ramp-down Rate 6°C/second max Time 25°C to peak Temperature (TP) 8 minutes Max. Do not exceed 260°C Physical Specifications tp TP Ramp-up TL Temperature (T) Pre Heat assembly tL Critical Zone TL to TP Ts(max) Ramp-down Ts(min) ts Preheat 25˚C t 25˚C to Peak Time (t) Environmental Specifications High Temp. Storage JESD22-A103 HTRB JESD22-A108 Weight 0.007 ounce, 0.21 grams Temperature Cycling JESD22-A104 Case JEDEC DO214AB. Molded plastic body over glass passivated junction MSL JEDEC-J-STD-020, Level 1 Polarity Color band denotes positive end (cathode) except Bidirectional. H3TRB JESD22-A101 Terminal Matte Tin-plated leads, Solderable per JESD22-B102 RSH JESD22-A111 Dimensions DO-214AB (SMC J-Bend) Dimensions Cathode Band C A B H D F E J G K L I Inches Min Millimeters Max Min Max A 0.114 0.126 2.900 3.200 B 0.260 0.280 6.600 7.110 C 0.220 0.245 5.590 6.220 D 0.079 0.103 2.060 2.620 E 0.030 0.060 0.760 1.520 F - 0.008 - 0.203 G 0.305 0.320 7.750 8.130 H 0.006 0.012 0.152 0.305 I 0.129 - 3.300 - J 0.094 - 2.400 - K - 0.165 L 0.094 - 4.200 2.400 - Solder Pads (all dimensions in mm) © 2015 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 11/20/15 Transient Voltage Suppression Diodes Surface Mount > 3.0SMC series Part Numbering System Part Marking System 3.0SMC XX A F Cathode Band 5% VBR VOLTAGE TOLERANCE XXX VR VOLTAGE YMXXX SERIES Littelfuse Logo Marking Code Trace Code Marking Y:Year Code M: Month Code XXX: Lot Code Packaging Options Part number Component Package 3.0SMCxxX DO-214AB Packaging Option Quantity 3000 Tape & Reel - 16mm tape/13” reel Packaging Specification EIA STD RS-481 Tape and Reel Specification 0.157 (4.0) 0.47 (12.0) Cathode 0.157 (4.0) 0.059 DIA (1.5) Cover tape 13.0 (330) 0.80 (20.2) Arbor Hole Dia. 0.49 (12.5) © 2015 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 11/20/15 Dimensions are in inches (and millimeters). Direction of Feed