RN4870 DATA SHEET (04/26/2016) DOWNLOAD

RN4870/71
Bluetooth® 4.2 Low Energy Module
Features
Fully Qualified Bluetooth® Smart Module
On-Board Bluetooth 4.2 Low Energy Stack
ASCII Command Interface API over UART
Scripting Engine for Hostless Operation
Compact Form Factor – The RN4870/71 family
comes in four different sizes from 6 mm x 8 mm to
12 mm x 22 mm:
- RN4870: 12 mm x 22 mm
- RN4871: 9 mm x 11.5 mm
- RN4870U: 12 mm x 15 mm
- RN4871U: 6 mm x 8 mm
• Beacon Private Service for Beacon Services
• UART Transparent Service for Serial Data
Applications
• Remote Configuration Over The Air
•
•
•
•
•
Operational
•
•
•
•
Operating Voltage: 1.9V to 3.6V (3.3V typical)
Temperature Range: -20°C to +70°C
Supports UART
Up to Three Pulse Width Modulation (PWM)
Outputs
RF/Analog Features
•
•
•
•
•
ISM Band 2.402 to 2.480 GHz Operation
Channels: 0-39
RX Sensitivity: -90 dBm
TX Power: 0 dBm
RSSI Monitor
MAC/Baseband/Higher Layer Features
• Secure AES128 Encryption
• GAP, GATT, SM, L2CAP and Integrated Public
Profiles
• Customer Can Create up to Five Public and Four
Private Services
• Keyboard I/O Authentication
• Software Configurable Role as Peripheral or
Central and Client or Server
Antenna Options
• Ceramic Chip Antenna (RN4870/RN4871)
• External Antenna Connection via RF pad
(RN4870U/RN4871U)
Applications
•
•
•
•
•
•
•
•
Health/Medical Devices
Sports Activity/Fitness Meters
Beacon Applications
Internet of Things (IoT) Sensor Tag
Remote Control
Wearable Smart Devices and Accessories
Smart Energy/Smart Home
Industrial Control
 2016 Microchip Technology Inc.
Description
The RN487x modules, based on Microchip's IS187x
Bluetooth LE ICs, provide a complete solution to
implement Bluetooth 4.2 Low Energy connectivity.
These modules are interfaced via a two- or four-wire
UART interface with Microchip's simple ASCII
command set for easy integration into most
applications. All products in the RN series can be
dynamically configured by the host microcontroller with
a few simple ASCII commands. The RN487x series
also supports on-board scripting to automate basic
operations without a host microcontroller. The RN4870
(12 mm x 22 mm) and RN4871 (9 mm x 11.5 mm)
modules combine Microchip's Bluetooth LE Silicon with
all necessary peripheral components and an on-board
chip antenna to create an easy to use/drop-in solution.
All modules in this series are Bluetooth SIG qualified.
The RN4870 and RN4871 include FCC modular
certification, as well as most other worldwide
government regulatory approvals. For a listing of the
latest certifications, go to www.microchip.com/wireless.
The RN4870U (12 mm x 15 mm) and RN4871U (6 mm
x 8 mm) offer compact, flexible, unshielded options for
designs that are extremely space constrained or need
to remotely locate the antenna.
DS50002489A-page 1
RN4870/71
Table of Contents
1.0 Device Overview .......................................................................................................................................................................... 3
2.0 Specifications ............................................................................................................................................................................... 9
3.0 Interface PINs..............................................................................................................................................................................11
4.0 Physical Dimensions And Attributes ........................................................................................................................................... 13
5.0 Application Reference Circuits ................................................................................................................................................... 23
6.0 ASCII Command API.................................................................................................................................................................. 29
7.0 Supported Services .................................................................................................................................................................... 31
8.0 Antenna Characteristics ............................................................................................................................................................. 33
9.0 Timing Characteristics ................................................................................................................................................................ 35
10.0 Regulatory Approval ................................................................................................................................................................... 37
11.0 Ordering Information .................................................................................................................................................................. 43
The Microchip Web Site ....................................................................................................................................................................... 45
Customer Change Notification Service ................................................................................................................................................ 45
Customer Support ................................................................................................................................................................................ 45
Product Identification System............................................................................................................................................................... 46
TO OUR VALUED CUSTOMERS
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Most Current Data Sheet
To obtain the most up-to-date version of this data sheet, please register at our Worldwide Web site at:
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You can determine the version of a data sheet by examining its literature number found on the bottom outside corner of any page.
The last character of the literature number is the version number, (e.g., DS30000000A is version A of document DS30000000).
Errata
An errata sheet, describing minor operational differences from the data sheet and recommended workarounds, may exist for current
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To determine if an errata sheet exists for a particular device, please check with one of the following:
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When contacting a sales office, please specify which device, revision of silicon and data sheet (include literature number) you are
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DS50002489A-page 2
 2016 Microchip Technology Inc.
RN4870/71
1.0
DEVICE OVERVIEW
1.1
Overview
Table 1-1 shows the various options for packaging and
features available in the RN4870/71 family. Table 1-2
provides the description of the pin functions for all the
modules in the RN4870/71 family. Figure 1-1 through
Figure 1-4 show the pinout for the different modules.
The RN4870/71 Bluetooth Low Energy (BLE) modules
integrate Bluetooth 4.2 baseband controller, on-board
Bluetooth stack, digital and analog I/O, and RF power
amplifier into one solution.
TABLE 1-1:
RN4870/71 FAMILY
Part Number(1)
Antenna On-Board
Shielding
Number of Pins
Dimensions
RN4870-V/RM118
Yes
Yes
33
12 mm x 22 mm
RN4870U-V/RM118
No
No
30
12 mm x 15 mm
RN4871-V/RM118
Yes
Yes
16
9 mm x 11.5 mm
RN4871U-V/RM118
No
No
17
6 mm x 8 mm
Note 1: The last three digits in P/N indicate firmware version. At the time of publication, the latest firmware version
is 1.18. Ensure to check product webpage for latest part number and firmware version.
TABLE 1-2:
PIN DESCRIPTION
RN4870U RN4870 RN4871U RN4871
Name
Type
Description
—
1
—
—
GND
Power
Ground reference
—
2
—
—
GND
Power
Ground reference
1
3
12
13
GND
Power
Ground reference
2
4
11
14
VBAT
Power
Positive supply input. Range: 1.9V~3.6V
—
—
10
—
BK_IN
Power
Buck power supply input
Can be connected to the VBAT pin
Connect to 10 µF low ESR ceramic capacitor
Voltage range: 1.9V to 3.6V
3
5
—
—
P2_2
D I/O
GPIO
PWM1
Default: Input; pulled-high
4
6
—
—
VDD_IO
Power
VDD; power input
Same input pin as VBAT
Can be connected to the VBAT pin
5
7
—
—
VDD_IO
Power
VDD; power input
Same input pin as VBAT
Can be connected to the VBAT pin
6
8
—
—
ULPC_O
Power
1.2V ULPC LDO output
Used for diagnostic purposes
Do not connect to any pin or device
For measurement, connect a bypass 1 µF
capacitor to ground
7
9
—
—
P2_3
D I/O
GPIO
PWM2
Default: Input; pulled-high
8
10
—
—
BK_O
Power
1.55V Buck power supply output for diagnostic
purpose
Do not connect
—
—
13
6
P1_6
D I/O
A O/p
GPIO
—
—
14
5
P1_7
D I/O
A O/p
GPIO
 2016 Microchip Technology Inc.
DS50002489A-page 3
RN4870/71
TABLE 1-2:
PIN DESCRIPTION (CONTINUED)
RN4870U RN4870 RN4871U RN4871
Name
Type
Description
9
11
15
15
P2_7
D I/O
A I/p
GPIO; default: Input; pulled-high
AD14
Configured as the TX_IND pin by default
10
12
—
—
P1_1
D I/O
A I/p
GPIO; default: Input; pulled-high
AD9
Configured as the BLEDK_STATUS1_IND pin by
default
11
13
2
3
P1_2
D I/O
A I/p
GPIO; default: Input; pulled-high
AD10
12
14
3
4
P1_3
D I/O
GPIO; default: Input; pulled-high
AD11
13
15
8
11
P0_0
D I/O
GPIO; default: Input; pulled-high
AD0
Configured as the UART_CTS pin by default
14
16
—
—
P1_0
D I/O
GPIO; default: Input; pulled-high
AD8
Configured as the BLEDK_STATUS2_IND pin by
default
15
17
6
9
P3_6
D I/O
GPIO; default: Input; pulled-high
PWM0
Configured as the UART_RTS pin by default
16
18
16
16
P2_0
D I/p
System configuration input;
1: Application mode
0: Test mode, for Flash update and EEPROM
settings
Default: Input; pulled-high
17
19
—
—
P2_4
D I/O
18
20
—
—
NC
—
GPIO; default: Input; pulled-high
No Connection
19
21
7
10
RST_N
D I/p
Module Reset; active-low; Internally pulled-high
20
22
5
7
UART_RX
D I/p
UART Data input
21
23
4
8
UART_TX
D O/p
UART Data output
22
24
—
—
P3_1
D I/O
GPIO; default: Input; pulled-high
Configured as RSSI_IND pin by default
23
25
—
—
P3_2
D I/p
GPIO; default: Input; pulled-high
Configured as the LINK_DROP pin by default
24
26
—
—
P3_3
D I/p
GPIO; default: Input; pulled-high
Configured as the UART RX Indication pin by
default
25
27
—
—
P3_4
D I/p
GPIO; default: Input; pulled-high
Configured as the PAIRING_KEY pin by default
26
28
—
—
P3_5
D I/O
A I/p
GPIO; default: Input; pulled-high
LED1; provides indication whether the module is
ON/OFF
27
29
—
—
P0_7
D I/O
GPIO; default: Input; pulled-high
Configured to the LOW_BATTERY_INDICATOR
pin by default
28
30
9
12
P0_2
D I/O
AD2
LED0: Provides indication whether the module is
in ON/OFF mode
29
31
17
2
GND
Power
Ground Reference
—
32
—
—
GND
Power
Ground Reference
DS50002489A-page 4
 2016 Microchip Technology Inc.
RN4870/71
TABLE 1-2:
PIN DESCRIPTION (CONTINUED)
RN4870U RN4870 RN4871U RN4871
30
—
1
—
33
—
Legend: Pin Type Abbreviations:
FIGURE 1-1:
Name
Type
1
BT_RF
A I/O
—
GND
Power
A = Analog
D = Digital
Description
External Antenna connection (50 ohms)
Ground Reference
I/O = Input/Output
I/p = Input
O/p = Output
PIN DIAGRAM - RN4870U
Top View
Bottom View
GND 1
VBAT 2
P2_2 3
VDD_IO 4
VDD_IO 5
ULPC_O 6
P2_3 7
BK_O 8
P2_7/TX_IND 9
P1_1 10
P1_2 11
P1_3 12
30 BT_RF
GND
P0_2/LED
P0_7
P3_5
P3_4
P3_3
P3_2
P3_1
UART_TX
UART_RX
TP-3 VCC_RF
TP-1 VCC_PA
TP-3
TP-1
TP-2
TP-2 CLDO_O
P0_0/CTS
P1_0
P3_6/RTS
P2_0/MODE
P2_4
NC
RST_N
13
14
15
16
17
18
19
29
28
27
26
25
24
23
22
21
20
1
30
FIGURE 1-2:
PIN DIAGRAM - RN4870
Top View
1
2
GND
VBAT
P2_2
VDD_IO
VDD_IO
ULPC_O
P2_3
BK_O
P2_7/TX_IND
P1_1
P1_2
P1_3
3
4
5
6
7
8
9
10
11
12
13
14
33 GND
32 GND
31
30
29
28
27
26
25
24
23
22
GND
P0_2/LED
P0_7
P3_5
P3_4
P3_3
P3_2
P3_1
UART_TX
UART_RX
33
1
TP-3
TP-1
TP-2
TP-3 VCC_RF
TP-1 VCC_PA
TP-2 CLDO_O
P0_0/CTS
P1_0
P3_6/RTS
P2_0/MODE
P2_4
NC
RST_N
15
16
17
18
19
20
21
GND
GND
Bottom View
 2016 Microchip Technology Inc.
DS50002489A-page 5
RN4870/71
FIGURE 1-3:
PIN DIAGRAM - RN4871U
Bottom View
4
3
2
1
UART_TX
P1_3
P1_2
BT_RF
Top View
5
6
7
8
9
17 GND
17
16 P2_0
15 P2_7
14 P1_7
VCC_RF TP-2
VCC_PA TP-3
TP-1
TP-2 TP-4
TP-3
TP-5
TP-1 CLDO_O
TP-4 ULPC_O
TP-5 BK_O
BK_IN
VBAT
GND
P1_6
10
11
12
13
UART_RX
P3_6
RST_N
P0_0
P0_2
1
FIGURE 1-4:
PIN DIAGRAM - RN4871
Top View
1
2
3
4
5
16
15
14
13
12
P2_0
P2_7
VBAT
GND
P0_2
TP-3
BK_O TP-1
CLDO_O TP-5
TP-2
TP-1
TP-4
TP-3 VCC_PA
TP-2 VCC_RF
TP-4 ULPC_O
TP-5
P1_6 6
UART_RX 7
UART_TX 8
P3_6 9
RST_N 10
P0_0 11
BT_RF
GND
P1_2
P1_3
P1_7
Bottom View
DS50002489A-page 6
 2016 Microchip Technology Inc.
RN4870/71
1.2
Module Configuration
Table 1-5 shows the status of the module as indicated
by the Status 1 and Status 2 indication pins. Table 1-6
shows the details of test pads that are present on the
bottom side of the module, used for diagnostic
purposes during testing. Figure 1-5 shows all the key
elements of the module.
The GPIO pins of the RN4870 and RN4871 modules
can be configured to different functions using the ASCII
command interface. Table 1-3 shows the various pins
in the RN4870/71 module that are available for
configuration and their default configuration settings.
Table 1-4 provides details on each functions available.
TABLE 1-3:
CONFIGURABLE PINS AND DEFAULT FUNCTIONS IN THE RN4870 AND RN4871
Available in
Pin Name
Default Function
RN4870
RN4871
P0_7
x
—
Low Battery Indication
P1_0
x
—
Status 2
P1_1
x
—
Status 1
P2_2
x
—
None
P2_4
x
—
None
P3_1
x
—
RSSI Indication
P3_2
x
—
Link Drop
P3_3
x
—
UART RX Indication
P3_4
x
—
Pairing Key
P3_5
x
—
None
P1_2
x
x
None
P1_3
x
x
None
P1_6
—
x
UART RX Indication
P1_7
—
x
None
TABLE 1-4:
CONFIGURABLE FUNCTIONS AND DESCRIPTIONS
Function Name
Description
Low Battery Indication
Pin output goes low when the VDD is below a specified level. To set the threshold
level, change the EEPROM settings.
Status 1
Use this indication pin along with the Status 2 pin to indicate the current status of
the module. Refer to Table 1-5 for details of the status indication.
Status 2
Use this indication pin along with the Status 1 pin to indicate the current status of
the module. Refer to Table 1-5 for details of the status indication.
RSSI Indication
Use this indication pin to indicate the quality of the link based on the RSSI level.
If the RSSI level is lower than the specified threshold value, then the RSSI
indication pin goes low. Set the threshold for the RSSI link quality in EEPROM.
Link Drop
Use this pin to force the module to drop the current BLE link with a peer device.
Pulling the Link Drop pin low forces the connection to close. The pin needs to be
pulled low for at least 10 ms.
UART RX Indication
Use this pin to enable communication with the UART when the module is in LowPower mode. When not in Low-Power mode, the module runs on a 16 MHz
clock. If Low-Power mode is enabled on the module by using command SO,1,
the module runs on a 32 kHz clock thus reducing power consumption. However,
in Low-Power mode, the host MCU cannot communicate with the module via the
UART since the UART is not operational. If the user intends to provide data or
commands via UART in the Low-Power mode, then the UART RX INDICATION
pin must be pulled low and the user needs to wait for at least five milliseconds
before sending the data. Pulling the UART RX INDICATION pin low allows the
module to operate the 16 MHz clock and to enable UART.
 2016 Microchip Technology Inc.
DS50002489A-page 7
RN4870/71
TABLE 1-4:
CONFIGURABLE FUNCTIONS AND DESCRIPTIONS (CONTINUED)
Function Name
Description
Pairing Key
Use this pin to force the module to enter Standby mode. The pin must be pulled
down for at least 160 ms.
RF Active Indication
Use this indication pin to indicate that the module is currently performing an
active transmission and receiving BLE data.
TABLE 1-5:
STATUS INDICATION PINS
Status 1
Status 2
High
High
Power On
High
Low
Standby state
Low
Low
Connection established
Low
High
Data session open (Transparent UART)
TABLE 1-6:
TEST POINTS ON THE BOTTOM SIDE
RN4870U
TP-1
State
RN4870
TP-1
RN4871U
TP-3
RN4871
TP-3
Symbol
VCC_PA
Description
1.55V RF PA LDO
TP-2
TP-2
TP-1
TP-5
CLDO_O
1.2V CLDO Output
TP-3
TP-3
TP-2
TP-2
VCC_RF
1.2V RF LDO Output
—
—
TP-4
TP-4
ULPC_O
1.2V ULPC LDO Output
—
—
TP-5
TP-1
BK_O
1.55V Buck Reg Output
FIGURE 1-5:
BLOCK DIAGRAM OF THE RN4870/71
RN4870/RN4871
DS50002489A-page 8
 2016 Microchip Technology Inc.
RN4870/71
2.0
SPECIFICATIONS
Table 2-1 provides the general specifications for the
module. Table 2-2 and Table 2-3 provide the electrical
characteristics and the current consumption of the
module.
TABLE 2-1:
GENERAL SPECIFICATIONS
Specification
Description
Standard Compliance
Bluetooth 4.2
Frequency Band
2.402 to 2.480 GHz
Modulation Method
GFSK
Maximum Data Rate (Transparent UART)
10 kBps (iOS®9)
Antenna
Ceramic
Interface
UART, AIO, PIO
Operating Range
1.9V to 3.6V
Sensitivity
-90 dBm
RF TX Power
0 dBm
Operating Temperature Range
-20°C to +70°C
Storage Temperature Range
-65°C to +150°C
Operating Relative Humidity Range
10% to 90%
Storage Relative Humidity Range
10% to 90%
Moisture Sensitivity Level
2
TABLE 2-2:
ELECTRICAL CHARACTERISTICS
Parameter
Min.
Typ.
Max.
Units
Supply Voltage (VDD)
1.9
—
3.6
V
I/O Supply Voltage (VDD_IO = VDD)
1.9
—
3.6
V
VIL Input Logic Levels Low
VSS
—
0.3 VDD
V
VIH Input Logic Levels High
I/O Voltage Levels
0.7 VDD
—
VDD
V
VOL Output Logic Levels Low
Vss
—
0.2 VDD
V
VOH Output Logic Levels High
0.8 VDD
—
VDD
V
VTH,RES Threshold Voltage
—
1.6
—
V
Reset Low Duration
63
—
—
ns
Pull-Up Resistance
34
48
74
k
Pull-Down Resistance
29
47
86
k
Leakage Current
-1
—
1
µA
0
3.0
3.6
V
Reset
Input and Tri-State Current with
ADC (Analog to Digital Converter)
Full Scale (BAT_IN)
Full Scale (AD0~AD15)
0
—
3.6
V
Conversion Time (ENOB 8-bit)
—
131
—
µs
Conversion Time (ENOB 10-bit)
—
387
—
µs
Operating Current
—
—
500
µA
 2016 Microchip Technology Inc.
DS50002489A-page 9
RN4870/71
TABLE 2-3:
CURRENT CONSUMPTION
Parameter
Min.
Typ.
Max.
Units
Supply Current
TX mode Peak Current at VDD = 3V, TX = 0 dBm, Buck mode
—
—
13
mA
RX mode Peak Current at VDD = 3V, Buck mode
—
—
13
mA
Link Static Current
—
60
—
µA
Standby Current
1.9
—
2.9
µA
1
—
1.7
µA
Power-Saving
Temperature Sensor (PTS)
Temperature Range Detected
-20
—
+70
°C
1387
—
2448
—
Resolution
—
12
—
units/deg
Accuracy
-3
—
+3
°C
Conversion Time (ENOB 10-bit)
—
12.35
—
ms
Operating Current
—
—
200
µA
Digital Output
TABLE 2-4:
CURRENT CONSUMPTION DURING VARIOUS APPLICATION MODES
Test Condition(1)
Test Mode
Standby mode
Average Current
Consumption
Remarks
Advertising Interval: 100 ms
0.23 mA
—
Advertising Interval: 500 ms
0.077 mA
—
BLE Connected mode
(no data exchange)
Connection Interval: 500 ms
0.08 mA
Module set in Transparent UART
mode
Transparent UART
enabled
Data transmission in
progress
Connection Interval: 18.75 ms
3.87 mA
TX data throughput: 9.863 kBps
Connection Interval: 40 ms
2.77 mA
TX data throughput: 4.676 kBps
Transparent UART
enabled
Data being received
Connection Interval: 18.75 ms
3.06 mA
(write with response)
Throughput: 4.956 kBps
3.9 mA
(write with reliable
Burst Transmit)
Throughput: 9.382 kBps
2.14 mA
(write with response)
Throughput: 2.494 kBps
(write with response)
3.03 mA
(write with reliable
Burst Transmit)
Throughput: 5.056 kBps
1.44 µA
—
Connection Interval: 40 ms
Shutdown mode
—
Note 1: Test conditions: Input voltage: 3.3V; Test phone: iPhone6 with iOS 9.02 version
DS50002489A-page 10
 2016 Microchip Technology Inc.
RN4870/71
3.0
INTERFACE PINS
Figure 3-1 shows the power scheme using a 3.3V
low-dropout regulator to the RN487x and a host MCU.
This scheme ensures that the same voltage is used for
both the module and the MCU.
FIGURE 3-1:
Figure 3-1 also shows the basic UART connections to
the host MCU.
Figure 3-2 shows the recommended connections for
running the RN4870/71 on coin cell battery.
POWER SCHEME
RN4870/71/70U
System Configurator
Note 1:
2:
3:
Ensure VDD_IO and MCU VDD voltages are compatible
Control and Indication ports are configurable
To implement low-power operation, enable the UART_RX_IND
pin and connect to ground.
Note 1:
2:
3:
4:
5:
Ensure VDD_IO and MCU VDD voltages are compatible
Control and Indication ports are configurable
10 µF (X5R) and 330 ohm resistor are required for RN487x
BK_IN connects to VBAT for RN4871U
To implement low-power operation, enable the UART_RX_IND
pin and connect to ground.
RN4871U
System Configurator
 2016 Microchip Technology Inc.
DS50002489A-page 11
RN4870/71
FIGURE 3-2:
RN4870/71 COIN CELL POWER SCHEME
RN4870/71
Note 1:
Application includes ADC, PWM (RN4870), and
I2C bus interface
2:
BK_IN connection is needed only for RN4871U.
3:
To implement low-power operation, enable the
UART_RX_IND pin and connect to ground.
The Configuration pins on the RN4870 can also be
configured through Windows®-based User Interface
(UI) Configuration tool, BLEDK3.
DS50002489A-page 12
 2016 Microchip Technology Inc.
RN4870/71
4.0
PHYSICAL DIMENSIONS AND
ATTRIBUTES
4.1
RN4870 Module
Figure 4-1 shows the physical dimensions of the
RN4870 module. Figure 4-2 illustrates the recommended PCB layout, and Figure 4-3 shows the recommended mounting details.
Ensure that there is no top copper layer near the test
pin area, indicated by the shaded keep out areas, as
shown in Figure 4-2. When laying out the host PCB, the
FIGURE 4-1:
areas under the antenna must not contain any top,
inner layer, or bottom copper as shown in Figure 4-3. A
low-impedance ground plane ensures the best radio
performance (best range; lowest noise). Figure 4-3
also shows a minimum ground plane area to the left
and right side of the module for best antenna
performance. The ground plane can be extended
beyond the minimum recommended as required for
host PCB EMC noise reduction. For best range
performance, keep all external metal at least 30 mm
away from the ceramic chip antenna.
RN4870 MODULE DIMENSIONS
 2016 Microchip Technology Inc.
DS50002489A-page 13
RN4870/71
FIGURE 4-2:
RN4870 RECOMMENDED PCB FOOTPRINT
FIGURE 4-3:
RECOMMENDED MOUNTING DETAILS
DS50002489A-page 14
 2016 Microchip Technology Inc.
RN4870/71
4.2
RN4870U Module
Figure 4-4 shows the physical dimensions of the
RN4870U module. Figure 4-5 illustrates the recommended PCB layout, and Figure 4-6 shows the recommended mounting details.
A low-impedance ground plane ensures the best radio
performance (best range; lowest noise). Pin 30
(BT_RF) is a 50 ohm connection that can be connected
FIGURE 4-4:
to an external antenna such as a PCB trace antenna, a
component (chip) antenna, or through a host PCB 50
ohm micro-strip trace. This trace can be extended to
include passive parts for antenna attenuation padding,
impedance matching, or to provide test posts. It is
recommended that the micro-strip trace to be as short
as possible for minimum loss and best impedance
matching. If the micro-strip trace is longer, a 50 ohm
impedance is recommended.
RN4870U MODULE DIMENSIONS
 2016 Microchip Technology Inc.
DS50002489A-page 15
RN4870/71
FIGURE 4-5:
RN4870U RECOMMENDED PCB FOOTPRINT
FIGURE 4-6:
RN4870U RECOMMENDED PCB MOUNTING
DS50002489A-page 16
 2016 Microchip Technology Inc.
RN4870/71
4.3
RN4871 Module
Figure 4-7 shows the physical dimensions of the
RN4871 module. Figure 4-8 illustrates the recommended PCB layout, and Figure 4-9 shows the recommended mounting details.
Ensure that there is no top copper layer near the test
pin area, indicated by the shaded keep out areas, as
shown in Figure 4-8. When laying out the host PCB, the
areas under the antenna must not contain any top,
FIGURE 4-7:
inner layer, or bottom copper as shown in Figure 4-9. A
low-impedance ground plane ensures the best radio
performance (best range; lowest noise). Figure 4-9
also shows a space area around antenna section for
best antenna performance. The ground plane can be
extended beyond the minimum recommended as
required for host PCB EMC noise reduction. For best
range performance, keep all external metal at least
30 mm away from the ceramic chip antenna.
RN4871 MODULE DIMENSIONS
 2016 Microchip Technology Inc.
DS50002489A-page 17
RN4870/71
FIGURE 4-8:
RN4871 RECOMMENDED PCB FOOTPRINT
FIGURE 4-9:
RN4871 RECOMMENDED PCB MOUNTING SUGGESTION
DS50002489A-page 18
 2016 Microchip Technology Inc.
RN4870/71
4.4
RN4871U Module
Figure 4-10 shows the physical dimensions of the
RN4871U module. Figure 4-11 illustrates the recommended PCB layout. It is highly recommended to
layout the host PCB as suggested in Figure 4-12.
Figure 4-13 shows the recommended placement for
the module on the host PCB board. For optimal
transmission and reception sensitivity, place the
module at the edge of the board.
FIGURE 4-10:
A low-impedance ground plane ensures the best radio
performance (best range; lowest noise). Pin 1 (BT_RF)
is a 50 ohm connection that can be connected to an
external antenna such as a PCB trace antenna, a
component (chip) antenna, or through a host PCB
50 ohm micro-strip trace. This trace can be extended to
include passive parts for antenna attenuation padding,
impedance matching, or to provide test posts. It is
recommended that the micro-strip trace to be as short
as possible for minimum loss and best impedance
matching. If the micro-strip trace is longer, a 50 ohm
impedance is recommended.
RN4871U MODULE DIMENSIONS
Top View
 2016 Microchip Technology Inc.
Side View
Bottom View
DS50002489A-page 19
RN4870/71
FIGURE 4-11:
RN4871U RECOMMENDED PCB FOOTPRINT
FIGURE 4-12:
RN4871U RECOMMENDED PCB MOUNTING
DS50002489A-page 20
 2016 Microchip Technology Inc.
RN4870/71
FIGURE 4-13:
RECOMMENDATIONS FOR THE PLACEMENT OF THE MODULE ON THE HOST
PCB BOARD
Best
Acceptable
Acceptable
Lowest
performance
4.5
Soldering Recommendations
The RN4870/71 Bluetooth modules are assembled
using standard lead-free reflow profile IPC/JEDEC
J-STD-020.
The module can be soldered to the host PCB using
standard leaded and lead-free solder reflow profiles.
To avoid damaging the module, the following recommendations are given:
• Microchip Technology Application Note, “AN233
Solder Reflow Recommendation” (DS00233)
provides solder reflow recommendations
• Do not exceed peak temperature (TP) of 250°C
• Refer to the solder paste data sheet for specific
reflow profile recommendations
• Use no-clean flux solder paste
• Do not wash as moisture can be trapped under
the shield
• Use only one flow. If the PCB requires multiple
flows, apply the module on the final flow.
 2016 Microchip Technology Inc.
DS50002489A-page 21
RN4870/71
NOTES:
DS50002489A-page 22
 2016 Microchip Technology Inc.
RN4870/71
5.0
5.1
APPLICATION REFERENCE
CIRCUITS
5.2
Figure 5-2 through Figure 5-5 show the reference
circuits for various modules under the RN4870/71 family. In the circuits, the power input range is 1.9V ~ 3.6V.
A battery reverse protection circuit is recommended in
case a battery power input is used. Note that the
VDD_IO is the same as the power input. In case of a
LED connection, the power input must be greater than
3.0V. For the RN4870U, an RF antenna matching
circuit must also be included as shown in Figure 5-3.
External Configuration and
Programming
The RN4870/71 modules can be configured and firmware programmed using an external configuration and
programming tool. Figure 5-1 shows the mandatory
connections required between the module and the
external programming header. It is recommended to
include these pin connections on the host PCB for
development. For accessing the various configuration
and indication pins, use Table 1-2, Table 1-3, Table 1-4
and Table 1-5.
FIGURE 5-1:
Reference Circuit
EXTERNAL PROGRAMMING HEADER CONFIGURATIONS
RN4870/71
 2016 Microchip Technology Inc.
1
P2_0
P2_0
1
VBAT
VBAT
1
RXD
RXD
1
TXD
TXD
1
GND
GND
DS50002489A-page 23
RN4870 REFERENCE CIRCUIT
1
GND
2
GND
VCC
3
GND
P2_2
C1
2
GND
GND
P2_3
GND
P2_7
P1_1
P1_2
P1_3
10uF 6.3V X5R
Configuration Interface
P2_0
 2016 Microchip Technology Inc.
1
2
3
4
5
GND
VCC
GND
VBAT
P2_2
U1
VDD_IO
RN4870
VDD_IO
ULPC_O
P2_3
BK_O
P2_7/TX_IND
P1_1
P1_2/SCL
P1_3/SDA
LED Option
GND
P0_2
P0_7
P3_5
P3_4
P3_3
P3_2
P3_1
UART_TX
UART_RX
31
P0_2
30
29
P0_7
28
P3_5
27
P3_4
26
P3_3
25
P3_2
P3_1
24
UART_TX
23
22
UART_RX
UART Interface
VCC
R2
15
16
17
18
19
20
21
J2
GND
3
4
5
6
7
8
9
10
11
12
13
14
UART_RX
UART_TX
RST
P2_0
MODE
Low
Test Mode
High
APP Mode
P0_0
P1_0
P3_6
P2_0
P2_4
1
2
1
STS2301
4.7k
C2
1uF
GND
P0_2
R1
LD1
B
Q1
J1
33
GND
32
GND
P0_0/CTS
P1_0
P3_6/RTS
P2_0/MODE
P2_4
NC
RST
Reverse Voltage Protection
Power Input
RN4870/71
DS50002489A-page 24
FIGURE 5-2:
330
Configurable I/O
P2_4
P0_0
P2_7
P0_7
P1_0
P3_1
P1_1
P3_2
P1_2
P3_3
P1_3
P3_4
P2_2
P3_5
P2_3
P3_6
VCC
RN4870U REFERENCE CIRCUIT
ANT1
Antenna Matching
Reverse Voltage Protection
Power Input
VCC
GND
P2_2
C1
2
GND
GND
P2_3
GND
10uF 6.3V X5R
P2_7
P1_1
P1_2
P1_3
Configuration Interface
P2_0
1
2
3
4
5
BT_RF
GND
P0_2
P0_7
P3_5
P3_4
P3_3
P3_2
P3_1
UART_TX
UART_RX
UART_RX
UART_TX
MODE
Low
Test Mode
High
APP Mode
29
P0_2
28
27
P0_7
P3_5
26
P3_4
25
24
P3_3
P3_2
23
P3_1
22
UART_TX
21
UART_RX
20
UART Interface
1nH
GND
C4
GND
LED Option
P0_2
R1
LD1
VCC
330
VCC
R2
RST
P2_0
C3
30
4.7k
C2
1uF
GND
Configurable I/O
P2_4
P0_0
P2_7
P0_7
P1_0
P3_1
P1_1
P3_2
P1_2
P3_3
P1_3
P3_4
P2_2
P3_5
P2_3
P3_6
RN4870/71
DS50002489A-page 25
GND
VCC
GND
VBAT
P2_2
U1
VDD_IO
RN4870U
VDD_IO
ULPC_O
P2_3
BK_O
P2_7/TX_IND
P1_1
P1_2/SCL
P1_3/SDA
13
14
15
16
17
18
19
J2
1
2
3
4
5
6
7
8
9
10
11
12
P0_0
P1_0
P3_6
P2_0
P2_4
1
2
1
STS2301
B
J1
L1
P0_0/CTS
P1_0
P3_6/RTS
P2_0/MODE
P2_4
NC
RST
Q1
3
 2016 Microchip Technology Inc.
FIGURE 5-3:
RN4871 REFERENCE CIRCUIT
P1_3
P1_2
UART_RX
UART_TX
16
P2_0
15
P2_7
14
VBAT
13
GND
P2_0
P2_7
Q1
VCC
J1
STS2301
1
2
C1
2
GND
5
P1_7
U1
6
P1_6
RN4871
7
UART_RX
8
UART_TX
P1_7
P1_6
UART_RX
UART_TX
UART Interface
Reverse Voltage Protection
Power Input
1
VCC
3
1
2
3
4
5
GND
4
P1_3
3
P1_2
2
GND
1
BT_RF
Configuration Interface
P2_0
J2
RN4870/71
DS50002489A-page 26
FIGURE 5-4:
R2
1uF
RST
P0_0
P0_2
C2
P2_0
MODE
Low
Test Mode
High
GND
GND
GND
GND
10uF 6.3V X5R
P3_6
4.7k
GND
APP Mode
LED Option
P0_2
R1
LD1
B
 2016 Microchip Technology Inc.
Configurable I/O
P0_0
P1_7
P2_0
P0_2
P1_2
P2_7
P1_3
P3_6
P1_6
9
P3_6
10
RST
11
P0_0
12
P0_2
VCC
330
VCC
VCC
P0_2
R2
4.7k
330
RST
Reverse Voltage Protection
Power Input
GND
GND
10
BK_I
11
VBAT
12
GND
13
P1_6
GND
10uF 6.3V X5R
Test Mode
High
APP Mode
GND
P1_6
U1
RN4871U
4
UART_TX
3
P1_3
2
P1_2
1
BT_RF
J2
VCC
1
2
UART_RX 3
UART_TX 4
5
GND
P1_3
P1_2
ANT1
Antenna Matching
L1
C3
GND
GND
1nH
C4
GND
DS50002489A-page 27
RN4870/71
Configurable I/O
P0_0
P1_7
P2_0
P0_2
P1_2
P2_7
P1_3
P3_6
P1_6
Low
Configuration Interface
P2_0
UART_RX
UART_TX
UART Interface
9
8
7
6
5
3
1
C1
GND
2
1
2
1uF
VCC
STS2301
MODE
C2
P0_2
P0_0
RST
P3_6
UART_RX
Q1
J1
P3_6
R1
P2_0
14
P1_7
15
P2_7
16
P2_0
17
GND
LD1
P0_2
P0_0
LED Option
P1_7
P2_7
P2_0
VCC
RN4871U REFERENCE CIRCUIT
B
 2016 Microchip Technology Inc.
FIGURE 5-5:
RN4870/71
5.3
Power Drop Protection
To prevent any problems that may arise when the
power supply goes below 1.9V, a power-supply dropprotection circuit is recommended. Essentially, this
circuit consists of a Reset IC which acts as an Open
FIGURE 5-6:
Drain with a Delay =< 10 ms, and is triggered at 1.8V
power supply. Figure 5-6 shows a recommended
power drop protection circuit.
POWER DROP PROTECTION CIRCUIT
VBAT
RN4870/71
RST_N
DS50002489A-page 28
Reset IC
OUT
VDD
 2016 Microchip Technology Inc.
RN4870/71
6.0
ASCII COMMAND API
The RN4870/71 command Application Programming
Interfaces (APIs) are documented in the “RN4870/71
Bluetooth® Low Energy Module User's Guide”
(DS50002466A).
The following are the available command options and
their categories:
• Connection
- Establish connection
- Disconnect
- Bond/Unbond current connection
- Start/Stop scan for other devices
- Add/Delete peer devices to white list
- Read RSSI values
- Stop connection process
• I/O
- Read/Write I2C
- Change settings in the EEPROM
- Configure pin functions
- Configure GPIO mask
- Set/Get GPIO states
- Read and write analog data
- PWM control
• System
- Reboot
- Factory default
- Enter and Exit Command mode
- Enter Low-Power mode
• Scripting
- Enter Script mode
- Declare event handler
- Execute current script
- List current script
- Clear script
- Define user function
 2016 Microchip Technology Inc.
• GATT Services
- Create/Delete public services/characteristics
- Read/Write characteristic values
- Set notification for characteristics
• GAP Role
- Central, Peripheral, Observer and
Broadcaster
• Advertising
- Start/Stop
- Set custom advertisement content
- Set scan response content
- Set beacon content
• Private Service
- Create/Delete private services/characteristics
- Read/Write characteristic values
- Set notification for characteristics
• Transparent UART
- Enable/Disable
- Peripheral side configuration
- Central side configuration
• Remote configuration of the module
• Read individual device Information or Profile
settings
DS50002489A-page 29
RN4870/71
NOTES:
DS50002489A-page 30
 2016 Microchip Technology Inc.
RN4870/71
7.0
SUPPORTED SERVICES
The RN4870 supports four built-in GATT services:
• Device Information public service
• Airpatch private service, which handles Over The
Air (OTA) updates
• BeaconThings, which handles beacon services
control
• UART Transparent private service, which handles
data streaming function
In addition to the above predefined private services, the
RN4870 provides the ability to create private services.
If the services are supported on both end points of a
Bluetooth Low Energy connection, such as Central and
Peripheral devices, data can be exchanged. For
example, two RN4870 modules can define a custom
(private) service with its own unique characteristics.
Data can be exchanged easily via Command API.
Private services are not registered with the Bluetooth
SIG, and therefore not interoperable with other
Bluetooth Low Energy devices, unless the device
implements the private service. An example of a builtin private service is the Transparent UART. For an
example on how to create a custom service using the
RN4870, refer to “RN4870/71 Bluetooth® Low Energy
Module User's Guide” (DS50002466A).
RN4870 allows custom defined services up to five
public and four private services. Each custom defined
service allows up to eight custom defined
characteristics. All service definitions are saved in
on-board Non-Volatile Memory (NVM) where the user
must setup the module only once.
 2016 Microchip Technology Inc.
DS50002489A-page 31
RN4870/71
NOTES:
DS50002489A-page 32
 2016 Microchip Technology Inc.
RN4870/71
8.0
ANTENNA CHARACTERISTICS
The RN4870 and RN4871 modules contain an integral
ceramic chip antenna. Figure 8-1 and Figure 8-2 show
the antenna performance on the modules.
FIGURE 8-1:
RN4870 ANTENNA PERFORMANCE
Parameter
Values
Frequency
2450 MHz
Max Gain
1.63 dBi
Efficiency
71.55%
Antenna Description
Manufacturer Part Number
Manufacturer
ANT ANT3216A063R2400A
PIFA 2.4GHz L3 2W1.6
ANT3216A063R2400A
Yageo
 2016 Microchip Technology Inc.
DS50002489A-page 33
RN4870/71
FIGURE 8-2:
RN4871 ANTENNA PERFORMANCE
Parameter
Values
Frequency
2442 MHz
Max Gain
0.1 dBi
Efficiency
42.7%
Antenna Description
Manufacturer Part Number
Manufacturer
ANT AANT3216LL00R2400A
PIFA 2.4GHz L3 2W1.6
ANT3216LL00R2400A
Yageo
DS50002489A-page 34
 2016 Microchip Technology Inc.
RN4870/71
9.0
TIMING CHARACTERISTICS
mode, when RN4870/71 is ready to talk to MCU after
Reset, the module provides a UART response
indicating that the Reset is complete. For more details,
refer to the “RN4870/71 Bluetooth® Low Energy Module User's Guide” (DS50002466A).
Figure 9-1 shows the timing diagram for the RN4870/
71 modules when it is Reset in the Test mode and
Application mode. Figure 9-2 shows the timing diagram
for the module when it is powered on. In Application
FIGURE 9-1:
TIMING DIAGRAM OF RN4870/71 UART READY AFTER RESET (IN TEST AND
APPLICATION MODE)
Ext
Reset
UART Ready
for MCU
1mS
Test Mode
Process
P2_0=0
UART Ready
for MCU
Application
Mode
Process
Status pin/UART
Report Command
P2_0=1
25mS
46mS
68mS
FIGURE 9-2:
TIMING DIAGRAM OF RN4870/71 UART WHEN POWERED ON (IN TEST AND
APPLICATION MODE)
VBAT
Test Mode
Process
Application
Mode
Process
UART Ready
for MCU
P2_0=0
25mS
UART Ready
for MCU
Status pin/UART
Report Command
P2_0=1
46mS
68mS
 2016 Microchip Technology Inc.
DS50002489A-page 35
RN4870/71
Table 9-1 shows the error rate for various UART baud
rates for the RN4870/71 module. The system clock is
running at 16 MHz.
TABLE 9-1:
ERROR RATE FOR VARIOUS BAUD RATES ON THE RN4870/71
Set Baud Rate
Measured Baud Rate
Error
921600
941176
-2.12%
460800
457143
0.79%
307200
307692
-0.16%
230400
231884
-0.64%
115200
115942
-0.64%
57600
57971
-0.64%
38400
38095
0.79%
19200
19048
0.79%
9600
9524
0.79%
DS50002489A-page 36
 2016 Microchip Technology Inc.
RN4870/71
10.0
REGULATORY APPROVAL
This section outlines the regulatory information for the
RN4870/71 module for the following countries:
•
•
•
•
•
•
•
United States
Canada
Europe
Japan
Korea
Taiwan
Other Regulatory Jurisdictions
10.1
United States
The RN4870/71 module has received Federal Communications Commission (FCC) CFR47 Telecommunications, Part 15 Subpart C “Intentional Radiators” singlemodular approval in accordance with Part 15.212 Modular Transmitter approval. Single-modular transmitter
approval is defined as a complete RF transmission
sub-assembly, designed to be incorporated into
another device, that must demonstrate compliance
with FCC rules and policies independent of any host. A
transmitter with a modular grant can be installed in different end-use products (referred to as a host, host
product, or host device) by the grantee or other equipment manufacturer, then the host product may not
require additional testing or equipment authorization
for the transmitter function provided by that specific
module or limited module device.
A host product itself is required to comply with all other
applicable FCC equipment authorization regulations,
requirements, and equipment functions that are not
associated with the transmitter module portion. For
example, compliance must be demonstrated: to regulations for other transmitter components within a host
product; to requirements for unintentional radiators
(Part 15 Subpart B), such as digital devices, computer
peripherals, radio receivers, etc.; and to additional
authorization requirements for the non-transmitter
functions on the transmitter module (i.e., Verification or
Declaration of Conformity) as appropriate (e.g., Bluetooth and Wi-Fi transmitter modules may also contain
digital logic functions).
10.1.1
For the RN4870 module:
Contains Transmitter Module
FCC ID: A8TBM70ABCDEFGH
or
Contains FCC ID: A8TBM70ABCDEFGH
This device complies with Part 15 of the FCC Rules.
Operation is subject to the following two conditions:
(1) this device may not cause harmful interference,
and (2) this device must accept any interference
received, including interference that may cause
undesired operation.
Due to the limited size of the RN4871, the FCC Identifier (FCC ID) is not displayed on the module. Therefore,
the FCC ID must be placed on the outside of the finished product into which the module is installed must
also display a label referring to the enclosed module.
This exterior label can use wording as follows:
For the RN4871 module:
Contains Transmitter Module
FCC ID: A8TBM71S2
or
Contains FCC ID: A8TBM71S2
This device complies with Part 15 of the FCC Rules.
Operation is subject to the following two conditions:
(1) this device may not cause harmful interference,
and (2) this device must accept any interference
received, including interference that may cause
undesired operation.
LABELING AND USER
INFORMATION REQUIREMENTS
The RN4870 module has been labeled with its own
FCC ID number, and if the FCC ID is not visible when
the module is installed inside another device, then the
outside of the finished product into which the module is
installed must also display a label referring to the
enclosed module. This exterior label can use wording
as follows:
 2016 Microchip Technology Inc.
DS50002489A-page 37
RN4870/71
A user’s manual for the product should include the following statement:
This equipment has been tested and found to comply
with the limits for a Class B digital device, pursuant to
part 15 of the FCC Rules. These limits are designed
to provide reasonable protection against harmful
interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy, and if not installed and used in
accordance with the instructions, may cause harmful
interference to radio communications. However,
there is no guarantee that interference will not occur
in a particular installation. If this equipment does
cause harmful interference to radio or television
reception, which can be determined by turning the
equipment off and on, the user is encouraged to try to
correct the interference by one or more of the following measures:
• Reorient or relocate the receiving antenna.
• Increase the separation between the equipment
and receiver.
• Connect the equipment into an outlet on a circuit
different from that to which the receiver is connected.
• Consult the dealer or an experienced radio/TV
technician for help.
Additional information on labeling and user information
requirements for Part 15 devices can be found in KDB
Publication 784748 available at the FCC Office of Engineering and Technology (OET) Laboratory Division
Knowledge Database (KDB)
http://apps.fcc.gov/oetcf/kdb/index.cfm.
10.1.2
RF EXPOSURE
All transmitters regulated by FCC must comply with RF
exposure requirements. KDB Publication 447498 General RF Exposure Guidance provides guidance in
determining whether proposed or existing transmitting
facilities, operations or devices comply with limits for
human exposure to Radio Frequency (RF) fields
adopted by the Federal Communications Commission
(FCC).
FCC Office of Engineering and Technology (OET) Laboratory Division Knowledge Database (KDB):
http://apps.fcc.gov/oetcf/kdb/index.cfm
10.2
Canada
The RN4870/71 module has been certified for use in
Canada under Industry Canada (IC) Radio Standards
Procedure (RSP) RSP-100, Radio Standards
Specification (RSS) RSS-Gen, RSS-210, and RSS247. Modular approval permits the installation of a
module in a host device without the need to recertify
the device.
10.2.1
LABELING AND USER
INFORMATION REQUIREMENTS
Labeling Requirements (from RSP-100 - Issue 10,
Section 3): The host device shall be properly labeled to
identify the module within the host device.
Modular Devices (from RSP-100 - Issue 10, Section 7):
The Industry Canada certification label of a module
shall be clearly visible at all times when installed in the
host device, otherwise the host device must be labeled
to display the Industry Canada certification number of
the module, preceded by the words “Contains transmitter module”, or the word “Contains”, or similar wording
expressing the same meaning, as follows:
For the RN4870 module:
Contains transmitter module
IC: 12246A-BM70BLES1F2
Due to the limited size of the RN4871, the Industry
Canada certification number is not displayed on the
module. Therefore, the host device must be labeled to
display the Industry Canada certification number of the
module, preceded by the words “Contains transmitter
module”, or the word “Contains”, or similar wording
expressing the same meaning, as follows:
Contains transmitter module
IC: 12246A-BM71S2
Output power listed is conducted. This grant is valid
only when the module is sold to OEM integrators and
must be installed by the OEM or OEM integrators. This
transmitter is restricted for use with the specific
antenna(s) tested in this application for Certification
and must not be co-located or operating in conjunction
with any other antenna or transmitters within a host
device, except in accordance with FCC multi-transmitter product procedures. This module is approved for
installation into mobile or/and portable host platforms.
10.1.3
HELPFUL WEB SITES
Federal Communications Commission (FCC):
http://www.fcc.gov
DS50002489A-page 38
 2016 Microchip Technology Inc.
RN4870/71
User Manual Notice for License-Exempt Radio Apparatus (from Section 8.4, RSS-Gen, Issue 4, November
2014): User manuals for license-exempt radio apparatus shall contain the following or equivalent notice in a
conspicuous location in the user manual or alternatively on the device or both:
The R&TTE Compliance Association provides guidance on modular devices in document Technical
Guidance Note 01 available at
http://www.rtteca.com/html/download_area.htm.
Note:
This device complies with Industry Canada's licenseexempt RSSs. Operation is subject to the following
two conditions:
(1) This device may not cause interference; and
(2) This device must accept any interference, including interference that may cause undesired operation
of the device.
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts
de licence. L'exploitation est autorisée aux deux conditions suivantes:
(1) l'appareil ne doit pas produire de brouillage;
(2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est
susceptible d'en compromettre le fonctionnement.
10.2.2
RF EXPOSURE
All transmitters regulated by IC must comply with RF
exposure requirements listed in RSS-102 - Radio Frequency (RF) Exposure Compliance of Radiocommunication Apparatus (All Frequency Bands).
10.2.3
To maintain conformance to the testing
listed in Table 10-1, the module shall be
installed in accordance with the installation instructions in this data sheet and
shall not be modified.
When integrating a radio module into a
completed
product
the
integrator
becomes the manufacturer of the final
product and is therefore responsible for
demonstrating compliance of the final
product with the essential requirements of
the R&TTE Directive.
10.3.1
LABELING AND USER
INFORMATION REQUIREMENTS
The label on the final product which contains the
RN4870/71 module must follow CE marking requirements. The R&TTE Compliance Association Technical
Guidance Note 01 provides guidance on final product
CE marking.
HELPFUL WEB SITES
Industry Canada: http://www.ic.gc.ca/
10.3
Europe
The RN4870/71 module is an R&TTE Directive
assessed radio module that is CE marked and has
been manufactured and tested with the intention of
being integrated into a final product.
The RN4870/71 module has been tested to R&TTE
Directive 1999/5/EC Essential Requirements for Health
and Safety (Article (3.1(a)), Electromagnetic Compatibility (EMC) (Article 3.1(b)), and Radio (Article 3.2) and
are summarized in Table 10-1 and Table 10-2 European Compliance Testing. A Notified Body Opinion has
also been issued. All test reports are available on the
RN4870/71 product web page at http://www.microchip.com.
 2016 Microchip Technology Inc.
DS50002489A-page 39
RN4870/71
10.3.2
HELPFUL WEB SITES
A document that can be used as a starting point in
understanding the use of Short Range Devices (SRD)
in Europe is the European Radio Communications
Committee (ERC) Recommendation 70-03 E, which
can be downloaded from the European Radio Communications Office (ERO) at: http://www.ero.dk/.
Additional helpful web sites are:
• Radio and Telecommunications Terminal Equipment (R&TTE):
http://ec.europa.eu/enterprise/rtte/index_en.htm
TABLE 10-1:
• European Conference of Postal and Telecommunications Administrations (CEPT):
http://www.cept.org/
• European Telecommunications Standards Institute (ETSI):
http://www.etsi.org
• European Radio Communications Office (ERO):
http://www.ero.dk/
• The Radio and Telecommunications Terminal
Equipment Compliance Association (R&TTE CA):
http://www.rtteca.com/
EUROPEAN COMPLIANCE TESTING FOR RN4870
Certification
Standards
Safety
EN60950-1:2006/A11:2009/A1:2010/
A12:2011/A2:2013
Health
EN 62479:2010
EMC
EN 301 489-1 V1.9.2
Article
Laboratory
(3.1(a))
(3.1(b))
Report Number
10051261 003
TUV
Rheinland
10053580 001
10051137 002
EN 301 489-17 V2.2.1
Radio
EN 300 328 V1.9.1
(3.2)
10053580 001
Notified Body
Opinion
TABLE 10-2:
10048935 001
EUROPEAN COMPLIANCE TESTING FOR RN4871
Certification
Standards
Safety
EN60950-1:2006/A11:2009/A1:2010/
A12:2011/A2:2013
Health
EN 62479:2010
EMC
EN 301 489-1 V1.9.2
Article
Laboratory
(3.1(a))
(3.1(b))
Report Number
10053210 001
TUV
Rheinland
10053433 001
10052964 001
EN 301 489-17 V2.2.1
Radio
EN 300 328 V1.9.1
Notified Body
Opinion
DS50002489A-page 40
(3.2)
10053433 001
10048936 001
 2016 Microchip Technology Inc.
RN4870/71
10.4
Japan
The RN4870/71 module has received type certification
and is labeled with its own technical conformity mark
and certification number as required to conform to the
technical standards regulated by the Ministry of Internal
Affairs and Communications (MIC) of Japan pursuant
to the Radio Act of Japan.
Integration of this module into a final product does not
require additional radio certification provided installation instructions are followed and no modifications of
the module are allowed. Additional testing may be
required:
• If the host product is subject to electrical appliance safety (for example, powered from an AC
mains), the host product may require Product
Safety Electrical Appliance and Material (PSE)
testing. The integrator should contact their conformance laboratory to determine if this testing is
required.
• There is a voluntary Electromagnetic Compatibility (EMC) test for the host product administered
by VCCII: http://www.vcci.jp/vcci_e/index.html
10.4.1
LABELING AND USER
INFORMATION REQUIREMENTS
10.4.2
HELPFUL WEB SITES
Ministry of Internal Affairs and Communications (MIC):
http://www.tele.soumu.go.jp/e/index.htm
Association of Radio Industries and Businesses
(ARIB): http://www.arib.or.jp/english/
10.5
Korea
The RN4870/71 module has received certification of
conformity in accordance with the Radio Waves Act.
Integration of this module into a final product does not
require additional radio certification provided installation instructions are followed and no modifications of
the module are allowed.
10.5.1
LABELING AND USER
INFORMATION REQUIREMENTS
The label on the final product which contains the
RN4870/71 module must follow KC marking requirements. The integrator of the module should refer to the
labeling requirements for Korea available on the Korea
Communications Commission (KCC) website.
The RN4870 module is labeled with its own KC mark.
The final product requires the KC mark and certificate
number of the module:
The label on the final product which contains the
RN4870/71 module must follow Japan marking
requirements. The integrator of the module should refer
to the labeling requirements for Japan available at the
Ministry of Internal Affairs and Communications (MIC)
website.
The RN4870 module is labeled with its own technical
conformity mark and certification number. The final
product in which this module is being used must have
a label referring to the type certified module inside:
Due to the limited size of the RN4871, the KC mark is
not displayed on the module. Therefore, final product
requires the KC mark and certificate number of the
module:
Contains transmitter module with certificate number:
10.5.2
Due to the limited size of the RN4871, the technical
conformity mark and certification number is not displayed on the module. Therefore, the final product in
which this module is being used must have a label
referring to the type certified module inside:
HELPFUL WEB SITES
Korea Communications Commission (KCC):
http://www.kcc.go.kr.
National Radio Research Agency (RRA):
http://rra.go.kr.
Contains transmitter module with certificate number:
 2016 Microchip Technology Inc.
DS50002489A-page 41
RN4870/71
10.6
Taiwan
電機設備之干擾。
The RN4870/71 module has received compliance
approval in accordance with the Telecommunications
Act. Customers seeking to use the compliance
approval in their product should contact Microchip
Technology sales or distribution partners to obtain a
Letter of Authority.
10.6.2
Integration of this module into a final product does not
require additional radio certification provided installation instructions are followed and no modifications of
the module are allowed.
Should other regulatory jurisdiction certification be
required by the customer, or the customer need to
recertify the module for other reasons, a certification
utility is available. For further regulatory Certification
Utility and documentation, contact your local Microchip
Technology sales office.
10.6.1
LABELING AND USER
INFORMATION REQUIREMENTS
HELPFUL WEB SITES
National Communications Commission (NCC):
http://www.ncc.gov.tw.
10.7
Other Regulatory Jurisdictions
The RN4870 module is labeled with its own NCC ID
number, and if the NCC ID is not visible when the module is installed inside another device, then the outside
of the device must also display a label referring to the
enclosed module. This exterior label can use wording
such as the following:
Due to the limited size of the RN4871, the NCC ID is
not displayed on the module. Therefore, the outside of
the device must also display a label referring to the
enclosed module. This exterior label can use wording
such as the following:
The user's manual should contain below warning (for
RF device) in traditional Chinese:
注意 !
依據 低功率電波輻射性電機管理辦法
第十二條 經型式認證合格之低功率射頻電機，
非經許可，
公司、商號或使用者均不得擅自變更頻率、加大
功率或變更原設計
之特性及功能。
第十四條 低功率射頻電機之使用不得影響飛航安
全及干擾合法通信；
經發現有干擾現象時，應立即停用，並改善至無
干擾時方得繼續使用。
前項合法通信，指依電信規定作業之無線電信。
低功率射頻電機須忍受合法通信或工業、科學及
醫療用電波輻射性
DS50002489A-page 42
 2016 Microchip Technology Inc.
RN4870/71
11.0
ORDERING INFORMATION
Table 11-1 provides ordering information for the RN4870/71 module.
TABLE 11-1:
ORDERING INFORMATION
Part Number
Description
RN4870-V/RM118
Bluetooth 4.2 BLE Single mode, Class 2, Surface mount module with antenna
and shield. Size: 12 mm x 22 mm
RN4870U-V/RM118
Bluetooth 4.2 BLE Single mode, Class 2, Surface mount module, external
antenna, no shield. Size: 12 mm x15 mm
RN4871-V/RM118
Bluetooth 4.2 BLE Single mode, Class 2, Surface mount module with antenna
and shield. Size: 9 mm x 11.5 mm
RN4871U-V/RM118
Bluetooth 4.2 BLE Single mode, Class 2, Surface mount module, external
antenna, no shield. Size: 6 mm x 8 mm
Go to http://www.microchip.com for current pricing and a list of distributors carrying Microchip products.
 2016 Microchip Technology Inc.
DS50002489A-page 43
RN4870/71
APPENDIX A:
REVISION HISTORY
Revision A (April 2016)
This is the initial release of this document.
DS50002489A-page 44
 2016 Microchip Technology Inc.
RN4870/71
THE MICROCHIP WEB SITE
CUSTOMER SUPPORT
Microchip provides online support via our WWW site at
www.microchip.com. This web site is used as a means
to make files and information easily available to
customers. Accessible by using your favorite Internet
browser, the web site contains the following
information:
Users of Microchip products can receive assistance
through several channels:
• Product Support – Data sheets and errata,
application notes and sample programs, design
resources, user’s guides and hardware support
documents, latest software releases and archived
software
• General Technical Support – Frequently Asked
Questions (FAQ), technical support requests,
online discussion groups, Microchip consultant
program member listing
• Business of Microchip – Product selector and
ordering guides, latest Microchip press releases,
listing of seminars and events, listings of
Microchip sales offices, distributors and factory
representatives
•
•
•
•
Distributor or Representative
Local Sales Office
Field Application Engineer (FAE)
Technical Support
Customers
should
contact
their
distributor,
representative or Field Application Engineer (FAE) for
support. Local sales offices are also available to help
customers. A listing of sales offices and locations is
included in the back of this document.
Technical support is available through the web site
at: http://microchip.com/support
CUSTOMER CHANGE NOTIFICATION
SERVICE
Microchip’s customer notification service helps keep
customers current on Microchip products. Subscribers
will receive e-mail notification whenever there are
changes, updates, revisions or errata related to a
specified product family or development tool of interest.
To register, access the Microchip web site at
www.microchip.com. Under “Support”, click on
“Customer Change Notification” and follow the
registration instructions.
 2016 Microchip Technology Inc.
DS50002489A-page 45
RN4870/71
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, for example, on pricing or delivery, refer to the factory or the listed sales office.
V
PART NO.
Temperature
Range
Device
RM
XXX
Package
Firmware
Revision
Number
Device:
RN4870:
RN4870U:
RN4871:
RN4871U:
Temperature
Range:
V
= -20C to
Package:
RM
= Radio Module
DS50002489A-page 46
Example:
RN4870-V/RM118: Various temperature
Ceramic Chip Antenna
External Antenna
Ceramic Chip Antenna
External Antenna
+70C
(Various)
Note 1:
Tape and Reel identifier only appears in the
catalog part number description. This
identifier is used for ordering purposes and
is not printed on the device package. Check
with your Microchip Sales Office for package
availability with the Tape and Reel option.
 2016 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
•
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights unless otherwise stated.
Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
QUALITYMANAGEMENTSYSTEM
CERTIFIEDBYDNV
== ISO/TS16949==
 2016 Microchip Technology Inc.
Trademarks
The Microchip name and logo, the Microchip logo, AnyRate,
dsPIC, FlashFlex, flexPWR, Heldo, JukeBlox, KeeLoq,
KeeLoq logo, Kleer, LANCheck, LINK MD, MediaLB, MOST,
MOST logo, MPLAB, OptoLyzer, PIC, PICSTART, PIC32 logo,
RightTouch, SpyNIC, SST, SST Logo, SuperFlash and UNI/O
are registered trademarks of Microchip Technology
Incorporated in the U.S.A. and other countries.
ClockWorks, The Embedded Control Solutions Company,
ETHERSYNCH, Hyper Speed Control, HyperLight Load,
IntelliMOS, mTouch, Precision Edge, and QUIET-WIRE are
registered trademarks of Microchip Technology Incorporated
in the U.S.A.
Analog-for-the-Digital Age, Any Capacitor, AnyIn, AnyOut,
BodyCom, chipKIT, chipKIT logo, CodeGuard, dsPICDEM,
dsPICDEM.net, Dynamic Average Matching, DAM, ECAN,
EtherGREEN, In-Circuit Serial Programming, ICSP, Inter-Chip
Connectivity, JitterBlocker, KleerNet, KleerNet logo, MiWi,
motorBench, MPASM, MPF, MPLAB Certified logo, MPLIB,
MPLINK, MultiTRAK, NetDetach, Omniscient Code
Generation, PICDEM, PICDEM.net, PICkit, PICtail,
PureSilicon, RightTouch logo, REAL ICE, Ripple Blocker,
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Endurance, TSHARC, USBCheck, VariSense, ViewSpan,
WiperLock, Wireless DNA, and ZENA are trademarks of
Microchip Technology Incorporated in the U.S.A. and other
countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
Silicon Storage Technology is a registered trademark of
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GestIC is a registered trademarks of Microchip Technology
Germany II GmbH & Co. KG, a subsidiary of Microchip
Technology Inc., in other countries.
All other trademarks mentioned herein are property of their
respective companies.
© 2016, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
ISBN: 978-1-5224-0514-6
DS50002489A-page 47
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07/14/15
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