IS1870SF_IS1871SF.book Page 1 Thursday, March 31, 2016 10:29 AM IS1870/71 Bluetooth® Low Energy (BLE) SoC Features Radio Frequency (RF)/Analog Features • Bluetooth smart 4.2 Bluetooth Low-Energy (BLE) compliant • 256 Kbytes embedded Flash memory • UART/SPI/I2C interface supported • Integrated crystal oscillator, operates with 32 MHz external crystal • Temperature sensor supported • Flexible GPIO pins: - 31 GPIO pins (IS1870) - 15 GPIO pins (IS1871) • PWM support: - 4-channel PWM support (IS1870) - 1-channel PWM support (IS1871) • 12 bits ADC (ENOB=10/8-bit) support for battery and voltage detection. 16-channel (IS1870)/ 6-channel (IS1871) • AES-CMAC hardware engine • Beacon support • Low-power consumption • Peak current: Tx 13 mA, Rx 13 mA at VBAT=3.0V, buck power • Compact size: - IS1871: 4 mm x 4 mm 32QFN package - IS1870: 6 mm x 6 mm 48QFN package • • • • • ISM band: 2.402 GHz to 2.480 GHz operation Channels: 0-39 Rx sensitivity: -90 dBm in BLE mode Tx power: +2 dBm (max) Received Signal Strength Indicator (RSSI) monitor Operating Conditions • Operating voltage: 1.9V to 3.6V • Operating temperature: -20°C to +70°C Applications • • • • • • • • Internet of Things (IoT) Wearable, fitness, or healthcare Weight scale Proximity/Find Me services Payment/Security Digital Beacons Consumer appliances or home automation Industrial Packages Type IS1870 IS1871 Pin Count 48 32 I/O Pins (up to) 31 16 Contact/Lead Pitch 0.4 0.4 Dimensions 6x6x0.9 4x4x0.9 Package QFN48 QFN32 Note: All dimensions are in millimeters (mm) unless specified. 2015-2016 Microchip Technology Inc. DS60001371C-Page 1 IS1870SF_IS1871SF.book Page 2 Thursday, March 31, 2016 10:29 AM IS1870/71 NOTES: DS60001371C-Page 2 2015-2016 Microchip Technology Inc. IS1870SF_IS1871SF.book Page 3 Thursday, March 31, 2016 10:29 AM IS1870/71 Table of Contents 1.0 Device Overview ............................................................................................................................................................................. 5 2.0 System Block Details .................................................................................................................................................................... 13 3.0 Electrical Characteristics............................................................................................................................................................... 17 4.0 Package Information ..................................................................................................................................................................... 21 5.0 Reflow Profile and Storage Condition ........................................................................................................................................... 27 6.0 Ordering Guide ............................................................................................................................................................................. 31 Appendix A: Reference Circuit ............................................................................................................................................................ 33 Appendix B: Layout Guidelines ........................................................................................................................................................... 37 Appendix C: Revision History ............................................................................................................................................................. 39 TO OUR VALUED CUSTOMERS It is our intention to provide our valued customers with the best documentation possible to ensure successful use of your Microchip products. To this end, we will continue to improve our publications to better suit your needs. Our publications will be refined and enhanced as new volumes and updates are introduced. If you have any questions or comments regarding this publication, please contact the Marketing Communications Department via E-mail at [email protected] or fax the Reader Response Form in the back of this data sheet to (480) 792-4150. We welcome your feedback. Most Current Data Sheet To obtain the most up-to-date version of this data sheet, please register at our Worldwide Web site at: http://www.microchip.com You can determine the version of a data sheet by examining its literature number found on the bottom outside corner of any page. The last character of the literature number is the version number, (e.g., DS30000000A is version A of document DS30000000). Errata An errata sheet, describing minor operational differences from the data sheet and recommended workarounds, may exist for current devices. As device/documentation issues become known to us, we will publish an errata sheet. The errata will specify the revision of silicon and revision of document to which it applies. To determine if an errata sheet exists for a particular device, please check with one of the following: • Microchip’s Worldwide Web site; http://www.microchip.com • Your local Microchip sales office (see last page) When contacting a sales office, please specify which device, revision of silicon and data sheet (include literature number) you are using. Customer Notification System Register on our web site at www.microchip.com to receive the most current information on all of our products. 2015-2016 Microchip Technology Inc. DS60001371C-Page 3 IS1870SF_IS1871SF.book Page 4 Thursday, March 31, 2016 10:29 AM IS1870/71 NOTES: DS60001371C-Page 4 2015-2016 Microchip Technology Inc. IS1870SF_IS1871SF.book Page 5 Thursday, March 31, 2016 10:29 AM IS1870/71 1.0 DEVICE OVERVIEW Microchip Technology IS1870/71 embedded 2.4 GHz Bluetooth version 4.2 (BLE) SoC incorporates, 2.4 GHz transceiver, Power Management Unit (PMU), Bluetooth LE stack and RF power amplifier. The user can embed the Bluetooth functionality to IoT applications. The IS1870/71 is cost effective and designed to provide developers a simple Bluetooth solution with the following features: • • • • Simple integration and programming Reduced development time Superior BLE solution with low-cost system Interoperability with Apple® iOS and Android™ OS • Wide range of applications The IS1870/71 supports Beacon technology and improves user experiences in IoT applications, such as auto connection/control and cloud connectivity. The IS1870/71 can maintain a low-power wireless connection. The low-power consumption and flexible power management maximizes the IS1870/71 lifetime in battery operated devices. A wide operating temperature range allows use in indoor and outdoor environments (industrial temperature range). FIGURE 1-1: The small-form factor package size of the IS1870/71 is designed for wearable applications. The solution providers can minimize the module size to meet the market requirement. The IS187x SoC is designed for the application-enabled accessories and IoT applications. Operating in the 2.4 GHz ISM band radio, the IS1870/71 is certified for the Bluetooth core specification version 4.2 including support for the enhanced throughput, and the Federal Information Processing Standard (FIPS) compliant encryption support for secure data connections. The IS1870/71 integrates transceiver and baseband functions to decrease the external components. A free Bluetooth stack firmware is provided for building embedded BLE solutions that use the IS1870/71 SoC. For portable and wearable applications, the IS1870/71 SoC’s optimized power design helps to minimize current consumption for extended battery life and it minimizes the module size to as small as possible. Figure 1-1 and Figure 1-2 illustrate a typical example of the IS1870 and IS1871 system block diagrams. Table 1-1 provides key features of the IS1870/71 SoC. IS1870-BASED SYSTEM BLOCK DIAGRAM 2015-2016 Microchip Technology Inc. DS60001371C-Page 5 IS1870SF_IS1871SF.book Page 6 Thursday, March 31, 2016 10:29 AM IS1870/71 FIGURE 1-2: TABLE 1-1: IS1871-BASED SYSTEM BLOCK DIAGRAM KEY FEATURES Features IS1870 IS1871 UART 1 1 GPIO 31 15 12-bit ADC Channels 16 6 PWM 4 1 SPI 2 1 2 I C 1 1 Pins 48 32 Size 6 mm x 6 mm x 0.9 mm 4 mm x 4 mm x 0.9 mm Event Counter 2 0 AES-CMAC H/W Engine Yes Yes DS60001371C-Page 6 2015-2016 Microchip Technology Inc. IS1870SF_IS1871SF.book Page 7 Thursday, March 31, 2016 10:29 AM IS1870/71 Pin Description Figure 1-3 and Figure 1-4 illustrate the IS1870 and IS1871 pin assignment details, and Table 1-2 provides the functions of the various pins. FIGURE 1-3: IS1870 PIN ASSIGNMENT 2015-2016 Microchip Technology Inc. DS60001371C-Page 7 IS1870SF_IS1871SF.book Page 8 Thursday, March 31, 2016 10:29 AM IS1870/71 FIGURE 1-4: DS60001371C-Page 8 IS1871 PIN ASSIGNMENT 2015-2016 Microchip Technology Inc. IS1870SF_IS1871SF.book Page 9 Thursday, March 31, 2016 10:29 AM IS1870/71 TABLE 1-2: PIN DESCRIPTION IS1870 Pin No. IS1871 Pin No. Pin Name Type 1 32 P1_0 DIO AI GPIO: P1_0 ADC input: AD8 TX_CLS1: Class 1 RF TX Control 2 — P1_1 DIO AI DI GPIO: P1_1 ADC input: AD9 SPI bus: MISO2: second SPI bus (Master Mode) 3 1 P1_2 DIO AI I/O GPIO: P1_2 ADC input: AD10 I2C SCL 4 2 P1_3 DIO AI DIO GPIO: P1_3 ADC input: AD11 I2C SDA 5 — P1_4 DIO AI DI GPIO: P1_4 ADC input: AD12 Event Counter 6 — P1_5 DIO AI DI GPIO: P1_5 ADC input: AD13 Event Counter 7 3 P1_7 DIO AO GPIO: P1_7 External 32.768 KHz Crystal Output: XO32K 8 4 P1_6 DIO AI GPIO: P1_6 External 32.768 KHz Crystal Input: XI32K 9 5 IOA HCI_TXD DIO DO GPIO HCI UART TXD 10 6 IOB HCI_RXD DIO DI GPIO HCI UART RXD Description 11 — P3_0 DIO GPIO: P3_0 12 7 P3_1 DIO DO GPIO: P3_1 SPI bus: NCS, SPI Flash: CSN 13 8 P3_2 DIO DI GPIO: P3_2 SPI bus: MISO, SPI Flash: SDO 14 9 P3_3 DIO DO GPIO: P3_3 SPI bus: MOSI, SPI Flash: SDI 15 10 P3_4 DIO DO GPIO: P3_4 SPI bus: SCLK, SPI Flash: SCK 16 — P3_5 DIO AI GPIO: P3_5 LED1 17 11 P3_6 DIO DO DO GPIO: P3_6 UART flow-control RTS PWM0 18 12 RST_N DI DIO AI DI GPIO: P0_0 ADC input: AD0 UART flow-control CTS DIO AI GPIO: P0_1 ADC input: AD1 19 13 P0_0 20 — P0_1 Legend: A = Analog D = Digital 2015-2016 Microchip Technology Inc. External Reset I = Input O = Output P = Power DS60001371C-Page 9 IS1870SF_IS1871SF.book Page 10 Thursday, March 31, 2016 10:29 AM IS1870/71 IS1870 Pin No. IS1871 Pin No. Pin Name Type 21 14 P0_2 DIO AI AI GPIO: P0_2 ADC input: AD2 LED0 22 — P0_3 DIO AI GPIO:P0_3 ADC input: AD3 23 — P0_4 DIO AI GPIO:P0_4 ADC input: AD4 24 — P0_5 DIO AI GPIO:P0_5 ADC input: AD5 25 — P0_6 DIO AI GPIO:P0_6 ADC input: AD6 26 — P0_7 DIO AI GPIO:P0_7 ADC input: AD7 27 15 BK_O P 1.5V (for internal use, do not connect to external devices) 28 16 BK_LX P Buck output (1.55V). For internal use, do not connect to external devices 29 17 BK_IN P Buck input. Voltage Range: 1.9V~3.6V 30 18 VBAT P Battery input. Voltage Range: 1.9V~3.6V. Connect to BK_IN and a 10 uF decoupling capacitor as shown in Figure A-1 and Figure A-3. 31 19 AVDD P input of LDOs: CLDO, PALDO, and RFLDO 32 20 CLDO_O P 1.2V CLDO Output: Core-logic and memories supply, connect to 1 μF (X5R/X7R) capacitor 33 21 ULPC_O P 1.2V Programmable ULPC Output: Always On-logic and retention memory supply (for internal use, do not connect to external devices) 34 22 VREF P PMU band-gap reference voltage output for LDOs and buck (for internal use, do not connect to external devices) 35 23 XO_N A 32 MHz crystal input negative 36 24 XO_P A 32 MHz crystal input positive 37 25 VCC_RF P Power input for VCO and RF (1.28V). Connect to 1 μF (X5R/X7R) capacitor 38 26 Rx AI RF receive path 39 27 Tx AO 40 28 VCC_PA P 41 29 P2_0 DIO Mode Configuration H: Application mode L: Test mode 42 — P2_1 DIO DO GPIO: P2_1 PWM0 43 — P2_2 DIO DO GPIO: P2_2 PWM1 44 — P2_3 DIO DO GPIO: P2_3 PWM2 45 30 P2_4 DIO GPIO: P2_4 TX_CLS1: Class 1 RF RX Control Legend: A = Analog DS60001371C-Page 10 D = Digital Description RF transmit path Power supply for power amplifier (1.55V). Connect to 0.22 μF X5R/X7R I = Input O = Output P = Power 2015-2016 Microchip Technology Inc. IS1870SF_IS1871SF.book Page 11 Thursday, March 31, 2016 10:29 AM IS1870/71 IS1870 Pin No. IS1871 Pin No. Pin Name Type 46 — P2_5 DIO AI DO GPIO: P2_5 ADC input: AD15 PWM3 47 — P2_6 DIO P26 48 31 P2_7 DIO AI DO GPIO: P27 ADC input: AD14 SPI bus: NCS2, second SPI bus (Master mode) Legend: A = Analog D = Digital 2015-2016 Microchip Technology Inc. Description I = Input O = Output P = Power DS60001371C-Page 11 IS1870SF_IS1871SF.book Page 12 Thursday, March 31, 2016 10:29 AM IS1870/71 NOTES: DS60001371C-Page 12 2015-2016 Microchip Technology Inc. IS1870SF_IS1871SF.book Page 13 Thursday, March 31, 2016 10:29 AM IS1870/71 2.0 SYSTEM BLOCK DETAILS 2.1 System Block Descriptions Each system block of the IS1870/71 is described in this section. FIGURE 2-1: 2.1.2 2.1.1 PMU The IS1870/71 includes a DC-DC converter and four LDOs. These LDOs can be configured for various operating modes and applications to suppress the peak current and maximize battery life, see Figure 2-1. IS1870/71 POWER TREE AON AON is the hardware-based state machine that controls the power-up and power sequence. It includes a RTC timer and an I/O detector, which can wake-up the system from Standby mode or Power-Saving mode using time-out or I/O transition. 2.1.3 RF The IS1870/71 has an on-chip RF circuit, a controller, and a modulator (Tx)/demodulator (Rx). The Tx is used to control the synthesizer's phase and output power, and modulate the data based on the BLE specifications. The Rx is used to decode the Bluetooth signal and optimize the performance, such as IQimbalance, suppress DC, and flick noise. It is also used to compensate the frequency drift and offset, filter out interference to maximize receiver sensitivity. 2.1.4 PERIPHERALS The IS1870/71 interface is built-in to connect external MCU and sensors. 2.1.5 MCU The IS1870/71 has an 8051 core ROM, RAM, embedded Flash to schedule the BLE tasks, process BLE protocol stacks, and profiles. 2015-2016 Microchip Technology Inc. DS60001371C-Page 13 IS1870SF_IS1871SF.book Page 14 Thursday, March 31, 2016 10:29 AM IS1870/71 2.2 System Block Specification The following are system block specifications: 2.2.1 RF • Bluetooth BT4.2 LE compliant SoC • Frequency: 2.402 GHz to 2.480 GHz • Programmable transmit output power up to +2 dBm maximum • -25 dBm minimum Tx power to search nearby devices • -90 dBm typical receiver power sensitivity • Digital RSSI indicator (-50 dBm~-90 dBm) • -20°C to +70°C BLE RF certified 2.2.2 PMU • • • • • • Operating battery input voltage range: 1.9V~3.6V 1.28V RFLDO: RF IP power supply 1.55V PALDO: RF Tx power amplify supply 1.2V CLDO: Core-logic and memories supply 1.55V DC-DC switching buck converter 1.2V programmable ULPC to supply AON-logic and retention memory • AON-logic to control power-up, power-down and wake up procedures • Internal 32 KHz (±250 ppm) ultra low-power oscillator • Power-on Reset 2.2.3 • • • • background timer in standby mode • Watchdog timer • Event Counter option (P1_4,P1_5) provides capture/counter function to external events for frequency calculation. Provides 1K/32K/1M/16M clock rate option to count the frequency range from 60 Hz to 1 MHz. Continuous/One shot count mode can be selected • Specific GPIO pins (P1_6, P1_7) support external 32.768 KHz crystal option for RTC • PWM: - 16-bit PWM design - 4 Individual frequency and individual duty cycle channel outputs multiplexed with GPIO pin (P2_1, P2_2, P2_3, P2_5) - Three clock source (32K, 1M, 16M) selection to program frequency range from 0.488 Hz to 8 MHz - Double buffers output compare registers and top register to avoid glitch - Two pair output configurable as inverse channel MCU 8051 Core with scalable clock ROM: 32 KB Main SRAM: 24 KB Embedded Flash: 256 KB for Device Firmware Upgrade (DFU) and run-time data storage 2.2.4 PERIPHERALS • Flexible GPIO pin configuration • ADC: - 0V~3.6V, 12-bit SDM-ADC with 16-channel (IS1870) or 6-Channel (IS1871) hybrid-I/O (Multi-Function). It can be configured as ADC or GPIO input • Internal 1.9V~3.6V battery voltage monitor • Precision Temperature Sensor (PTS) (-20°C ~+70°C, ±3°C accuracy) • 4 MHz clock-rate full duplex 4-wire master/slave SPI with 256 bytes buffer DMA • HCI over UART up to 921600 bps with flow-control • 2-wire serial interface (compatible to I2C) • General-purpose I/O pins with input internal pullup /Hi-Z selectable • 24-bit low-power Real Time Counter (RTC) for DS60001371C-Page 14 2015-2016 Microchip Technology Inc. IS1870SF_IS1871SF.book Page 15 Thursday, March 31, 2016 10:29 AM IS1870/71 2.3 Host MCU Interface Over UART Figure 2-2 illustrates IS1870/71 application block diagram. In the diagram the power supply (3.3V), UART interface, and GPIO control and indication are listed. FIGURE 2-2: Note 1: 2: 3: 4: IS1870/71 APPLICATION BLOCK DIAGRAM WITH MCU Ensure BAT_IN (I/O voltage) and MCU VDD voltage are compatible. The control and indication ports are configurable in UI tool. Optional GPIO function includes ADC, PWM, I2C and SPI functions. The GPIO applications of the IS1871 depend on the existing pin out and some of the GPIO pins are not supported in the IS1871. 2015-2016 Microchip Technology Inc. DS60001371C-Page 15 IS1870SF_IS1871SF.book Page 16 Thursday, March 31, 2016 10:29 AM IS1870/71 NOTES: DS60001371C-Page 16 2015-2016 Microchip Technology Inc. IS1870SF_IS1871SF.book Page 17 Thursday, March 31, 2016 10:29 AM IS1870/71 3.0 ELECTRICAL CHARACTERISTICS This section provides an overview of the IS1870/71 electrical characteristics. Additional information will be provided in future revisions of this document. Absolute maximum ratings for the IS1870/71 devices are listed below. Exposure to the maximum rating conditions for extended periods may affect device reliability. Functional operation of the device at these or any other conditions, above the parameters indicated in the operation listings of this specification, is not implied. Absolute Maximum Ratings (See Note 1) Ambient temperature under bias.............................................................................................................. .-20°C to +70°C Storage temperature .............................................................................................................................. -40°C to +125°C Voltage on VDD with respect to VSS ......................................................................................................... -0.3V to +3.6V Voltage on any pin with respect to VSS .......................................................................................... -0.3V to (VDD + 0.3V) Maximum output current sunk by any I/O pin..........................................................................................................12 mA Maximum output current sourced by any I/O pin....................................................................................................12 mA ESD (according to machine model, JEDEC EIA/JESD22-A115-C) Maximum output for all pins, excluding RF Tx pin .......... .......................................................................................±200V Maximum output for all pins ....................................................................................................................................±150V Maximum output (human-body model)........................................................................................................................±2V Maximum output (charge-device model).................................................................................................................±150V Note 1: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions, above those indicated in the operation listings of this specification, is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. 2015-2016 Microchip Technology Inc. DS60001371C-Page 17 IS1870SF_IS1871SF.book Page 18 Thursday, March 31, 2016 10:29 AM IS1870/71 TABLE 3-1: RECOMMENDED OPERATING CONDITIONS Symbol Ambient operating temperature range Min. Typ. Max. –20°C +25°C +70°C PMU VDD (VBAT, BK_IN), AVDD 1.9V 3.0V 3.6V VCC_RF 1.22V 1.28V 1.34V VCC_PA 1.5V 1.55V 1.98V CLDO_O, VREF 1.1V 1.2V 1.32V ULPC_O 1.1V 1.2V 1.32V RST_N 1.9V 3.0V 3.6V Other I/O 1.9V — 3.6V GPIO VIH (Input High Voltage) 0.7 VDD — VDD VIL (Input Low Voltage) VSS — 0.3 VDD VOH (Output High Voltage) (High drive, 12 mA) 0.8 VDD — VDD VOL (Output Low Voltage) (High drive, 12 mA) VSS — 0.2 VDD Pull-up Resistance 34 K 48 K 74 K Pull-down Resistance 29 K 47 K 86 K Supply Current Tx mode peak current at VDD=3V, Tx=0 dBm, Buck mode — — 13 mA Rx mode peak current at VDD=3V, Buck mode — — 13 mA Link static current Standby current Power-Saving 60 μA 1.9 μA — 2.9 μA 1 μA — 1.7 μA Analog-to-Digital Converter (ADC) Full scale (BAT_IN) 0V 3.0V 3.6V Full scale (AD0~AD15) 0V — 3.6V Conversion time (ENOB 8-bit) — 131 μS — Conversion time (ENOB 10-bit) — 387 μS — Operating current DNL INL — — 500 μA -1.12 LSB — +1.12 LSB -4.38 LSB — +4.38 LSB Precise Temperature Sensor (PTS) Detect range -20°C — +70°C Digital Output 1387 — 2448 Resolution — 12-bits/°C — -3°C — +3°C Conversion time (ENOB 10-bit) — 12.35 ms — Operating current — — 200 μA Accuracy DS60001371C-Page 18 2015-2016 Microchip Technology Inc. IS1870SF_IS1871SF.book Page 19 Thursday, March 31, 2016 10:29 AM IS1870/71 3.1 3.1.1 Current Consumption Details Tx/Rx CURRENT CONSUMPTION DETAILS The peak current of the VBAT input is 12 mA and the average current is around 0.23 mA. In this example the advertising interval is 100 ms and current consumption is measured at 3.3V VBAT input. Figure 3-1 and Figure 3-2 illustrate the Tx/Rx peak and average current consumption of advertising event in the BLEDK3 beacon mode application. FIGURE 3-1: Tx/Rx PEAK CURRENT CONSUMPTION IN BLEDK3 BEACON MODE APPLICATION 2015-2016 Microchip Technology Inc. DS60001371C-Page 19 IS1870SF_IS1871SF.book Page 20 Thursday, March 31, 2016 10:29 AM IS1870/71 FIGURE 3-2: Tx/Rx AVERAGE CURRENT CONSUMPTION IN BLEDK3 BEACON MODE APPLICATION For additional information on the current consumption measurements, test condition, and test environment setup, refer to the “IS187x_BM7x BLEDK3 Application Note”. This Application Note covers detailed information about the status of the BLEDK3 application. TABLE 3-2: Table 3-2 provides the status details of the BLEDK3 application. STATUS DETAILS OF BLEDK3 APPLICATION Status Description Shutdown Mode BLEDK3 is shutdown Standby Mode BLEDK3 sends advertising packets and wait for connection. BLEDK3 is discoverable and connectible BLE Connected Mode BLE link is established and CCCD of ISSC_Transparent_Tx characteristic is disabled (see Note 1) Transparent Service Enabled Mode BLE link is established and CCCD of ISSC_Transparent_Tx characteristic is enabled (see Note 1) Note 1: Client Characteristic Configuration (CCCD) is GATT service characteristics. DS60001371C-Page 20 2015-2016 Microchip Technology Inc. IS1870SF_IS1871SF.book Page 21 Thursday, March 31, 2016 10:29 AM IS1870/71 4.0 PACKAGE INFORMATION Figure 4-1 through Figure 4-5 illustrate the package marking information of the IS1870SF IC. 4.1 48QFN, 6x6 mm Chip Outline (IS1870SF) FIGURE 4-1: 48QFN, 6X6 MM PACKAGE INFORMATION (IS1870SF) 2015-2016 Microchip Technology Inc. DS60001371C-Page 21 48QFN, 6X6 MM FOOTPRINT INFORMATION (IS1870SF) 2015-2016 Microchip Technology Inc. FIGURE 4-2: IS1870/71 DS60001371C-Page 22 IS1870SF_IS1871SF.book Page 23 Thursday, March 31, 2016 10:29 AM IS1870/71 4.2 32QFN, 4x4 mm Chip Outline (IS1871SF) FIGURE 4-3: 32QFN, 4X4 MM PACKAGE SIZE INFORMATION (IS1871SF) 2015-2016 Microchip Technology Inc. DS60001371C-Page 23 32QFN FOOTPRINT INFORMATION (IS1871SF) 2015-2016 Microchip Technology Inc. FIGURE 4-4: IS1870/71 DS60001371C-Page 24 IS1870SF_IS1871SF.book Page 25 Thursday, March 31, 2016 10:29 AM IS1870/71 FIGURE 4-5: PACKAGE MARKING INFORMATION 2015-2016 Microchip Technology Inc. DS60001371C-Page 25 IS1870SF_IS1871SF.book Page 26 Thursday, March 31, 2016 10:29 AM IS1870/71 NOTES: DS60001371C-Page 26 2015-2016 Microchip Technology Inc. IS1870SF_IS1871SF.book Page 27 Thursday, March 31, 2016 10:29 AM IS1870/71 5.0 - Oval-shape opening should be used to get the optimum paste release. - Rounded corners to minimize clogging. - Positive taper walls (5° tapering) with bottom opening larger than the top. REFLOW PROFILE AND STORAGE CONDITION Figure 5-1 and Figure 5-2 illustrate reflow profiles and stencil information of the IS1870/71 SoC. 5.1 5.1.1 5.1.3 Stencil of SMT Assembly Suggestion STENCIL TYPE & THICKNESS • Laser cutting • Stainless steel • Thickness: 0.5 mm pitch, thickness < 0.15 mm 5.1.2 APERTURE SIZE AND SHAPE FOR TERMINAL PAD APERTURE DESIGN FOR THERMAL PAD • Small multiple openings should be used instead of one big opening. • 60~80% solder paste coverage • Rounded corners to minimize clogging • Positive taper walls (5° tapering) with bottom opening larger than the top • Aspect ratio (width/thickness) >1.5 • Aperture shape - The stencil aperture is designed to match the pad size on the PCB. FIGURE 5-1: REFLOW PROFILE Do not recommend Coverage 91% FIGURE 5-2: Recommend Coverage 77% Recommend Coverage 65% STENCIL TYPE 2015-2016 Microchip Technology Inc. DS60001371C-Page 27 IS1870SF_IS1871SF.book Page 28 Thursday, March 31, 2016 10:29 AM IS1870/71 5.2 260 ℃ Reflow Profile Figure 5-3 illustrates the reflow profile and the following are its specific features: • Standard Condition: IPC/JEDEC J-STD-020 • Preheat: 150~200 ℃ ~60~120 seconds • Average ramp-up rate (+217℃ to peak): +3℃/sec max FIGURE 5-3: DS60001371C-Page 28 • Temperature maintained above 217: 60~150 seconds • Time within +5 ℃ of peak temperature: 30 ~ 40 seconds • Peak temperature: 260 +5/-0 ℃ • Ramp-down rate (peak to +217℃): +6℃/sec. max • Time +25 ℃ to peak temperature: 8 minutes max • Cycle interval: 5 minutes REFLOW PROFILE 2015-2016 Microchip Technology Inc. IS1870SF_IS1871SF.book Page 29 Thursday, March 31, 2016 10:29 AM IS1870/71 5.3 Storage Condition Users need to follow these specific storage conditions for the IS1870x SoC. • The calculated shelf life in the sealed bag is 24 months at <40 ℃ and <90% Relative Humidity (RH). • After the bag is opened, devices that are subjected to reflow solder or other high temperature process must be mounted within 168 hours of factory conditions, i.e <30 ℃ /60% RH. 2015-2016 Microchip Technology Inc. DS60001371C-Page 29 IS1870SF_IS1871SF.book Page 30 Thursday, March 31, 2016 10:29 AM IS1870/71 NOTES: DS60001371C-Page 30 2015-2016 Microchip Technology Inc. IS1870SF_IS1871SF.book Page 31 Thursday, March 31, 2016 10:29 AM IS1870/71 6.0 ORDERING GUIDE Table 6-1 provides the ordering information for the IS1870/71. TABLE 6-1: ORDERING GUIDE Device Bluetooth Version IS1870 Bluetooth Low Energy SoC, BLE 4.2 compliant IS1871 Bluetooth Low Energy SoC, BLE 4.2 compliant 2015-2016 Microchip Technology Inc. Package Part No. 3 IS1870SF mm3 IS1871SF 48-Lead QFN, 6x6x0.9 mm , 0.4 mm pitch 32-Lead QFN, 4x4x0.9 , 0.4 mm pitch DS60001371C-Page 31 IS1870SF_IS1871SF.book Page 32 Thursday, March 31, 2016 10:29 AM IS1870/71 NOTES: DS60001371C-Page 32 2015-2016 Microchip Technology Inc. REFERENCE CIRCUIT Figure A-1 and Figure A-3 illustrate a typical application circuit of the IS1870 and IS1871. FIGURE A-1: The application circuit lists the RF matching circuit, PMU power tree, LED option, test points, and configuration table. The GPIOs can be configured to general I/O functions or the function of ADC, PTS, PWM, and external 32.768 KHz crystal. IS1870 APPLICATION CIRCUIT 2015-2016 Microchip Technology Inc. Note 1: The C13, C14, L4, C12, C11, C10, C3, and C4 should be as close to the chip as possible. 2: The value of the antenna matching component depends on the user’s antenna and PCB layout. IS1870/71 DS60001371C-Page 33 APPENDIX A: IS1870/71 IS1870 APPLICATION CIRCUIT (OPTIONAL) DS60001371C-Page 34 FIGURE A-2: 2015-2016 Microchip Technology Inc. 2015-2016 Microchip Technology Inc. FIGURE A-3: IS1871 APPLICATION CIRCUIT 2: The value of the antenna matching component depends on the user’s antenna and PCB layout. IS1870/71 DS60001371C-Page 35 Note 1: The C13, C14, L4, C12, C11, C10, C3, and C4 should be as close to the chip as possible. IS1870/71 IS1871 APPLICATION CIRCUIT (OPTIONAL) DS60001371C-Page 36 FIGURE A-4: 2015-2016 Microchip Technology Inc. IS1870SF_IS1871SF.book Page 37 Thursday, March 31, 2016 10:29 AM IS1870/71 APPENDIX B: B.1 LAYOUT GUIDELINES RF Matching The RF traces (including Tx, Rx, and antenna path) on the PCB should match 50Ω impedance. In Figure A-1, value of L1, L3, C1, C2, and C5 are fixed. The antenna matching components C6, C7, and L2 should be adjusted to match the 50Ω 2.4 GHz antenna. B.2 PMU The PMU section components, such as VBAT, BK_IN, BK_O, BK_LX, AVDD, ULPC_O, CLDO_O, VREF should be kept close to the IS1870/71. For additional information on PCB design guidelines, contact your local Microchip sales office. A list of Microchip sales offices is given on the back page of this document,. The L4 and C14 of Buck section, shown in Figure A-1, should be selected carefully. Capacitor C14 is either 4.7 μF/6.3V, X5R, or X7R type. The inductor L4 need to be high current (IDC>300mA) and low DCR (<1Ω) type. B.3 Crystal The XI 32 MHz crystal specification should be within the ±10 ppm range, see Figure A-1. 2015-2016 Microchip Technology Inc. DS60001371C-Page 37 IS1870SF_IS1871SF.book Page 38 Thursday, March 31, 2016 10:29 AM IS1870/71 NOTES: DS60001371C-Page 38 2015-2016 Microchip Technology Inc. IS1870SF_IS1871SF.book Page 39 Thursday, March 31, 2016 10:29 AM IS1870/71 APPENDIX C: REVISION HISTORY Revision A (October 2015) This is the initial released version of this document. Revision B (October 2015) This revision includes the following changes as well as minor updates to text and formatting, which were incorporated throughout the document. Status Description Section “Features” The section has been updated with new information. Section “Packages” The section is updated with the package information. Section 1.0 “Device Overview” Updated Figure 1-1 and Figure 1-2. Added Table 1-1 Revision C (March 2016) This revision includes the following changes and minor updates to text and formatting, which were incorporated throughout the document. Status Description Section “Features” The section is updated with new information. Section 1.0 “Device Overview” Updated Figure 1-1 and Figure 1-2. Updated Table 1-1 and Table 1-2. Section 2.0 “System Block Details” Updated 2.2 “System Block Specification” and 2.3 “Host MCU Interface Over UART” with new information. Section 3.0 “Electrical Character- Updated 3.1.1 “Tx/Rx Current Consumption Details”. istics” Updated Figure 3-1 and Figure 3-2. Updated Table 3-1 and Table 3-2. Section 5.3 “Storage Condition” Deleted Figure 5-4. Section 6.0 “Ordering Guide” Updated Table 6-1 Appendix A: “Reference Circuit” Updated Figure A-1 and Figure A-3 Added Figure A-2 and Figure A-4 Appendix C: Bill of Material Deleted 2015-2016 Microchip Technology Inc. DS60001371C-Page 39 IS1870SF_IS1871SF.book Page 40 Thursday, March 31, 2016 10:29 AM IS1870/71 NOTES: DS60001371C-Page 40 2015-2016 Microchip Technology Inc. IS1870SF_IS1871SF.book Page 41 Thursday, March 31, 2016 10:29 AM IS1870/71 THE MICROCHIP WEB SITE CUSTOMER SUPPORT Microchip provides online support via our WWW site at www.microchip.com. This web site is used as a means to make files and information easily available to customers. Accessible by using your favorite Internet browser, the web site contains the following information: Users of Microchip products can receive assistance through several channels: • Product Support – Data sheets and errata, application notes and sample programs, design resources, user’s guides and hardware support documents, latest software releases and archived software • General Technical Support – Frequently Asked Questions (FAQ), technical support requests, online discussion groups, Microchip consultant program member listing • Business of Microchip – Product selector and ordering guides, latest Microchip press releases, listing of seminars and events, listings of Microchip sales offices, distributors and factory representatives • • • • Distributor or Representative Local Sales Office Field Application Engineer (FAE) Technical Support Customers should contact their distributor, representative or Field Application Engineer (FAE) for support. Local sales offices are also available to help customers. A listing of sales offices and locations is included in the back of this document. Technical support is available through the web site at: http://microchip.com/support. CUSTOMER CHANGE NOTIFICATION SERVICE Microchip’s customer notification service helps keep customers current on Microchip products. Subscribers will receive e-mail notification whenever there are changes, updates, revisions or errata related to a specified product family or development tool of interest. To register, access the Microchip web site at www.microchip.com. Under “Support”, click on “Customer Change Notification” and follow the registration instructions. 2015-2016 Microchip Technology Inc. DS60001371C-Page 41 IS1870SF_IS1871SF.book Page 42 Thursday, March 31, 2016 10:29 AM IS1870/71 NOTES: DS60001371C-Page 42 2015-2016 Microchip Technology Inc. IS1870SF_IS1871SF.book Page 43 Thursday, March 31, 2016 10:29 AM Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. • Microchip is willing to work with the customer who is concerned about the integrity of their code. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights unless otherwise stated. Trademarks The Microchip name and logo, the Microchip logo, AnyRate, dsPIC, FlashFlex, flexPWR, Heldo, JukeBlox, KeeLoq, KeeLoq logo, Kleer, LANCheck, LINK MD, MediaLB, MOST, MOST logo, MPLAB, OptoLyzer, PIC, PICSTART, PIC32 logo, RightTouch, SpyNIC, SST, SST Logo, SuperFlash and UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. ClockWorks, The Embedded Control Solutions Company, ETHERSYNCH, Hyper Speed Control, HyperLight Load, IntelliMOS, mTouch, Precision Edge, and QUIET-WIRE are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, Any Capacitor, AnyIn, AnyOut, BodyCom, chipKIT, chipKIT logo, CodeGuard, dsPICDEM, dsPICDEM.net, Dynamic Average Matching, DAM, ECAN, EtherGREEN, In-Circuit Serial Programming, ICSP, Inter-Chip Connectivity, JitterBlocker, KleerNet, KleerNet logo, MiWi, motorBench, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach, Omniscient Code Generation, PICDEM, PICDEM.net, PICkit, PICtail, PureSilicon, RightTouch logo, REAL ICE, Ripple Blocker, Serial Quad I/O, SQI, SuperSwitcher, SuperSwitcher II, Total Endurance, TSHARC, USBCheck, VariSense, ViewSpan, WiperLock, Wireless DNA, and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. Microchip received ISO/TS-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company’s quality system processes and procedures are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified. QUALITY MANAGEMENT SYSTEM CERTIFIED BY DNV == ISO/TS 16949 == 2015-2016 Microchip Technology Inc. Silicon Storage Technology is a registered trademark of Microchip Technology Inc. in other countries. GestIC is a registered trademarks of Microchip Technology Germany II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in other countries. All other trademarks mentioned herein are property of their respective companies. © 2015-2016, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. 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