IS1870 DATA SHEET (04/25/2016) DOWNLOAD

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IS1870/71
Bluetooth® Low Energy (BLE) SoC
Features
Radio Frequency (RF)/Analog Features
• Bluetooth smart 4.2 Bluetooth Low-Energy (BLE)
compliant
• 256 Kbytes embedded Flash memory
• UART/SPI/I2C interface supported
• Integrated crystal oscillator, operates with 32 MHz
external crystal
• Temperature sensor supported
• Flexible GPIO pins:
- 31 GPIO pins (IS1870)
- 15 GPIO pins (IS1871)
• PWM support:
- 4-channel PWM support (IS1870)
- 1-channel PWM support (IS1871)
• 12 bits ADC (ENOB=10/8-bit) support for battery
and voltage detection. 16-channel (IS1870)/
6-channel (IS1871)
• AES-CMAC hardware engine
• Beacon support
• Low-power consumption
• Peak current: Tx 13 mA, Rx 13 mA at VBAT=3.0V,
buck power
• Compact size:
- IS1871: 4 mm x 4 mm 32QFN package
- IS1870: 6 mm x 6 mm 48QFN package
•
•
•
•
•
ISM band: 2.402 GHz to 2.480 GHz operation
Channels: 0-39
Rx sensitivity: -90 dBm in BLE mode
Tx power: +2 dBm (max)
Received Signal Strength Indicator (RSSI) monitor
Operating Conditions
• Operating voltage: 1.9V to 3.6V
• Operating temperature: -20°C to +70°C
Applications
•
•
•
•
•
•
•
•
Internet of Things (IoT)
Wearable, fitness, or healthcare
Weight scale
Proximity/Find Me services
Payment/Security
Digital Beacons
Consumer appliances or home automation
Industrial
Packages
Type
IS1870
IS1871
Pin Count
48
32
I/O Pins (up to)
31
16
Contact/Lead Pitch
0.4
0.4
Dimensions
6x6x0.9
4x4x0.9
Package
QFN48
QFN32
Note:
All dimensions are in millimeters (mm) unless specified.
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Table of Contents
1.0 Device Overview ............................................................................................................................................................................. 5
2.0 System Block Details .................................................................................................................................................................... 13
3.0 Electrical Characteristics............................................................................................................................................................... 17
4.0 Package Information ..................................................................................................................................................................... 21
5.0 Reflow Profile and Storage Condition ........................................................................................................................................... 27
6.0 Ordering Guide ............................................................................................................................................................................. 31
Appendix A: Reference Circuit ............................................................................................................................................................ 33
Appendix B: Layout Guidelines ........................................................................................................................................................... 37
Appendix C: Revision History ............................................................................................................................................................. 39
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1.0
DEVICE OVERVIEW
Microchip Technology IS1870/71 embedded 2.4 GHz
Bluetooth version 4.2 (BLE) SoC incorporates, 2.4 GHz
transceiver, Power Management Unit (PMU), Bluetooth
LE stack and RF power amplifier. The user can embed
the Bluetooth functionality to IoT applications.
The IS1870/71 is cost effective and designed to provide
developers a simple Bluetooth solution with the following features:
•
•
•
•
Simple integration and programming
Reduced development time
Superior BLE solution with low-cost system
Interoperability with Apple® iOS and Android™
OS
• Wide range of applications
The IS1870/71 supports Beacon technology and
improves user experiences in IoT applications, such as
auto connection/control and cloud connectivity.
The IS1870/71 can maintain a low-power wireless connection. The low-power consumption and flexible
power management maximizes the IS1870/71 lifetime
in battery operated devices. A wide operating temperature range allows use in indoor and outdoor environments (industrial temperature range).
FIGURE 1-1:
The small-form factor package size of the IS1870/71 is
designed for wearable applications. The solution providers can minimize the module size to meet the market requirement. The IS187x SoC is designed for the
application-enabled accessories and IoT applications.
Operating in the 2.4 GHz ISM band radio, the
IS1870/71 is certified for the Bluetooth core specification version 4.2 including support for the enhanced
throughput, and the Federal Information Processing
Standard (FIPS) compliant encryption support for
secure data connections.
The IS1870/71 integrates transceiver and baseband
functions to decrease the external components. A free
Bluetooth stack firmware is provided for building
embedded BLE solutions that use the IS1870/71 SoC.
For portable and wearable applications, the IS1870/71
SoC’s optimized power design helps to minimize current consumption for extended battery life and it minimizes the module size to as small as possible.
Figure 1-1 and Figure 1-2 illustrate a typical example of
the IS1870 and IS1871 system block diagrams.
Table 1-1 provides key features of the IS1870/71 SoC.
IS1870-BASED SYSTEM BLOCK DIAGRAM
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FIGURE 1-2:
TABLE 1-1:
IS1871-BASED SYSTEM BLOCK DIAGRAM
KEY FEATURES
Features
IS1870
IS1871
UART
1
1
GPIO
31
15
12-bit ADC Channels
16
6
PWM
4
1
SPI
2
1
2
I C
1
1
Pins
48
32
Size
6 mm x 6 mm x 0.9 mm
4 mm x 4 mm x 0.9 mm
Event Counter
2
0
AES-CMAC H/W Engine
Yes
Yes
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IS1870/71
Pin Description
Figure 1-3 and Figure 1-4 illustrate the IS1870 and
IS1871 pin assignment details, and Table 1-2 provides
the functions of the various pins.
FIGURE 1-3:
IS1870 PIN ASSIGNMENT
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FIGURE 1-4:
DS60001371C-Page 8
IS1871 PIN ASSIGNMENT
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TABLE 1-2:
PIN DESCRIPTION
IS1870
Pin No.
IS1871
Pin No.
Pin Name
Type
1
32
P1_0
DIO
AI
GPIO: P1_0
ADC input: AD8
TX_CLS1: Class 1 RF TX Control
2
—
P1_1
DIO
AI
DI
GPIO: P1_1
ADC input: AD9
SPI bus: MISO2: second SPI bus (Master Mode)
3
1
P1_2
DIO
AI
I/O
GPIO: P1_2
ADC input: AD10
I2C SCL
4
2
P1_3
DIO
AI
DIO
GPIO: P1_3
ADC input: AD11
I2C SDA
5
—
P1_4
DIO
AI
DI
GPIO: P1_4
ADC input: AD12
Event Counter
6
—
P1_5
DIO
AI
DI
GPIO: P1_5
ADC input: AD13
Event Counter
7
3
P1_7
DIO
AO
GPIO: P1_7
External 32.768 KHz Crystal Output: XO32K
8
4
P1_6
DIO
AI
GPIO: P1_6
External 32.768 KHz Crystal Input: XI32K
9
5
IOA
HCI_TXD
DIO
DO
GPIO
HCI UART TXD
10
6
IOB
HCI_RXD
DIO
DI
GPIO
HCI UART RXD
Description
11
—
P3_0
DIO
GPIO: P3_0
12
7
P3_1
DIO
DO
GPIO: P3_1
SPI bus: NCS, SPI Flash: CSN
13
8
P3_2
DIO
DI
GPIO: P3_2
SPI bus: MISO, SPI Flash: SDO
14
9
P3_3
DIO
DO
GPIO: P3_3
SPI bus: MOSI, SPI Flash: SDI
15
10
P3_4
DIO
DO
GPIO: P3_4
SPI bus: SCLK, SPI Flash: SCK
16
—
P3_5
DIO
AI
GPIO: P3_5
LED1
17
11
P3_6
DIO
DO
DO
GPIO: P3_6
UART flow-control RTS
PWM0
18
12
RST_N
DI
DIO
AI
DI
GPIO: P0_0
ADC input: AD0
UART flow-control CTS
DIO
AI
GPIO: P0_1
ADC input: AD1
19
13
P0_0
20
—
P0_1
Legend:
A = Analog
D = Digital
 2015-2016 Microchip Technology Inc.
External Reset
I = Input
O = Output
P = Power
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IS1870
Pin No.
IS1871
Pin No.
Pin Name
Type
21
14
P0_2
DIO
AI
AI
GPIO: P0_2
ADC input: AD2
LED0
22
—
P0_3
DIO
AI
GPIO:P0_3
ADC input: AD3
23
—
P0_4
DIO
AI
GPIO:P0_4
ADC input: AD4
24
—
P0_5
DIO
AI
GPIO:P0_5
ADC input: AD5
25
—
P0_6
DIO
AI
GPIO:P0_6
ADC input: AD6
26
—
P0_7
DIO
AI
GPIO:P0_7
ADC input: AD7
27
15
BK_O
P
1.5V (for internal use, do not connect to external devices)
28
16
BK_LX
P
Buck output (1.55V). For internal use, do not connect to external
devices
29
17
BK_IN
P
Buck input. Voltage Range: 1.9V~3.6V
30
18
VBAT
P
Battery input. Voltage Range: 1.9V~3.6V. Connect to BK_IN and
a 10 uF decoupling capacitor as shown in Figure A-1 and
Figure A-3.
31
19
AVDD
P
input of LDOs: CLDO, PALDO, and RFLDO
32
20
CLDO_O
P
1.2V CLDO Output: Core-logic and memories supply, connect to
1 μF (X5R/X7R) capacitor
33
21
ULPC_O
P
1.2V Programmable ULPC Output: Always On-logic and retention memory supply (for internal use, do not connect to external
devices)
34
22
VREF
P
PMU band-gap reference voltage output for LDOs and buck (for
internal use, do not connect to external devices)
35
23
XO_N
A
32 MHz crystal input negative
36
24
XO_P
A
32 MHz crystal input positive
37
25
VCC_RF
P
Power input for VCO and RF (1.28V). Connect to 1 μF
(X5R/X7R) capacitor
38
26
Rx
AI
RF receive path
39
27
Tx
AO
40
28
VCC_PA
P
41
29
P2_0
DIO
Mode Configuration
H: Application mode
L: Test mode
42
—
P2_1
DIO
DO
GPIO: P2_1
PWM0
43
—
P2_2
DIO
DO
GPIO: P2_2
PWM1
44
—
P2_3
DIO
DO
GPIO: P2_3
PWM2
45
30
P2_4
DIO
GPIO: P2_4
TX_CLS1: Class 1 RF RX Control
Legend:
A = Analog
DS60001371C-Page 10
D = Digital
Description
RF transmit path
Power supply for power amplifier (1.55V). Connect to 0.22 μF
X5R/X7R
I = Input
O = Output
P = Power
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IS1870
Pin No.
IS1871
Pin No.
Pin Name
Type
46
—
P2_5
DIO
AI
DO
GPIO: P2_5
ADC input: AD15
PWM3
47
—
P2_6
DIO
P26
48
31
P2_7
DIO
AI
DO
GPIO: P27
ADC input: AD14
SPI bus: NCS2, second SPI bus (Master mode)
Legend:
A = Analog
D = Digital
 2015-2016 Microchip Technology Inc.
Description
I = Input
O = Output
P = Power
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IS1870/71
2.0
SYSTEM BLOCK DETAILS
2.1
System Block Descriptions
Each system block of the IS1870/71 is described in this
section.
FIGURE 2-1:
2.1.2
2.1.1
PMU
The IS1870/71 includes a DC-DC converter and four
LDOs. These LDOs can be configured for various
operating modes and applications to suppress the peak
current and maximize battery life, see Figure 2-1.
IS1870/71 POWER TREE
AON
AON is the hardware-based state machine that controls the power-up and power sequence. It includes a
RTC timer and an I/O detector, which can wake-up the
system from Standby mode or Power-Saving mode
using time-out or I/O transition.
2.1.3
RF
The IS1870/71 has an on-chip RF circuit, a controller,
and a modulator (Tx)/demodulator (Rx). The Tx is used
to control the synthesizer's phase and output power,
and modulate the data based on the BLE
specifications. The Rx is used to decode the Bluetooth
signal and optimize the performance, such as IQimbalance, suppress DC, and flick noise. It is also used
to compensate the frequency drift and offset, filter out
interference to maximize receiver sensitivity.
2.1.4
PERIPHERALS
The IS1870/71 interface is built-in to connect external
MCU and sensors.
2.1.5
MCU
The IS1870/71 has an 8051 core ROM, RAM,
embedded Flash to schedule the BLE tasks, process
BLE protocol stacks, and profiles.
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2.2
System Block Specification
The following are system block specifications:
2.2.1
RF
• Bluetooth BT4.2 LE compliant SoC
• Frequency: 2.402 GHz to 2.480 GHz
• Programmable transmit output power up to +2
dBm maximum
• -25 dBm minimum Tx power to search nearby
devices
• -90 dBm typical receiver power sensitivity
• Digital RSSI indicator (-50 dBm~-90 dBm)
• -20°C to +70°C BLE RF certified
2.2.2
PMU
•
•
•
•
•
•
Operating battery input voltage range: 1.9V~3.6V
1.28V RFLDO: RF IP power supply
1.55V PALDO: RF Tx power amplify supply
1.2V CLDO: Core-logic and memories supply
1.55V DC-DC switching buck converter
1.2V programmable ULPC to supply AON-logic
and retention memory
• AON-logic to control power-up, power-down and
wake up procedures
• Internal 32 KHz (±250 ppm) ultra low-power oscillator
• Power-on Reset
2.2.3
•
•
•
•
background timer in standby mode
• Watchdog timer
• Event Counter option (P1_4,P1_5) provides capture/counter function to external events for frequency calculation. Provides 1K/32K/1M/16M
clock rate option to count the frequency range
from 60 Hz to 1 MHz. Continuous/One shot count
mode can be selected
• Specific GPIO pins (P1_6, P1_7) support external
32.768 KHz crystal option for RTC
• PWM:
- 16-bit PWM design
- 4 Individual frequency and individual duty
cycle channel outputs multiplexed with GPIO
pin (P2_1, P2_2, P2_3, P2_5)
- Three clock source (32K, 1M, 16M) selection
to program frequency range from 0.488 Hz to
8 MHz
- Double buffers output compare registers and
top register to avoid glitch
- Two pair output configurable as inverse channel
MCU
8051 Core with scalable clock
ROM: 32 KB
Main SRAM: 24 KB
Embedded Flash: 256 KB for Device Firmware
Upgrade (DFU) and run-time data storage
2.2.4
PERIPHERALS
• Flexible GPIO pin configuration
• ADC:
- 0V~3.6V, 12-bit SDM-ADC with 16-channel
(IS1870) or 6-Channel (IS1871) hybrid-I/O
(Multi-Function). It can be configured as ADC
or GPIO input
• Internal 1.9V~3.6V battery voltage monitor
• Precision Temperature Sensor (PTS)
(-20°C ~+70°C, ±3°C accuracy)
• 4 MHz clock-rate full duplex 4-wire master/slave
SPI with 256 bytes buffer DMA
• HCI over UART up to 921600 bps with flow-control
• 2-wire serial interface (compatible to I2C)
• General-purpose I/O pins with input internal pullup /Hi-Z selectable
• 24-bit low-power Real Time Counter (RTC) for
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2.3
Host MCU Interface Over UART
Figure 2-2 illustrates IS1870/71 application block diagram. In the diagram the power supply (3.3V), UART
interface, and GPIO control and indication are listed.
FIGURE 2-2:
Note 1:
2:
3:
4:
IS1870/71 APPLICATION BLOCK DIAGRAM WITH MCU
Ensure BAT_IN (I/O voltage) and MCU VDD voltage are compatible.
The control and indication ports are configurable in UI tool.
Optional GPIO function includes ADC, PWM, I2C and SPI functions.
The GPIO applications of the IS1871 depend on the existing pin out and some of the GPIO pins are not
supported in the IS1871.
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3.0
ELECTRICAL CHARACTERISTICS
This section provides an overview of the IS1870/71 electrical characteristics. Additional information will be provided
in future revisions of this document.
Absolute maximum ratings for the IS1870/71 devices are listed below. Exposure to the maximum rating conditions for
extended periods may affect device reliability. Functional operation of the device at these or any other conditions, above
the parameters indicated in the operation listings of this specification, is not implied.
Absolute Maximum Ratings
(See Note 1)
Ambient temperature under bias.............................................................................................................. .-20°C to +70°C
Storage temperature .............................................................................................................................. -40°C to +125°C
Voltage on VDD with respect to VSS ......................................................................................................... -0.3V to +3.6V
Voltage on any pin with respect to VSS .......................................................................................... -0.3V to (VDD + 0.3V)
Maximum output current sunk by any I/O pin..........................................................................................................12 mA
Maximum output current sourced by any I/O pin....................................................................................................12 mA
ESD (according to machine model, JEDEC EIA/JESD22-A115-C)
Maximum output for all pins, excluding RF Tx pin .......... .......................................................................................±200V
Maximum output for all pins ....................................................................................................................................±150V
Maximum output (human-body model)........................................................................................................................±2V
Maximum output (charge-device model).................................................................................................................±150V
Note 1: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the
device. This is a stress rating only and functional operation of the device at those or any other conditions,
above those indicated in the operation listings of this specification, is not implied. Exposure to maximum
rating conditions for extended periods may affect device reliability.
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TABLE 3-1:
RECOMMENDED OPERATING CONDITIONS
Symbol
Ambient operating temperature range
Min.
Typ.
Max.
–20°C
+25°C
+70°C
PMU
VDD (VBAT, BK_IN), AVDD
1.9V
3.0V
3.6V
VCC_RF
1.22V
1.28V
1.34V
VCC_PA
1.5V
1.55V
1.98V
CLDO_O, VREF
1.1V
1.2V
1.32V
ULPC_O
1.1V
1.2V
1.32V
RST_N
1.9V
3.0V
3.6V
Other I/O
1.9V
—
3.6V
GPIO
VIH (Input High Voltage)
0.7 VDD
—
VDD
VIL (Input Low Voltage)
VSS
—
0.3 VDD
VOH (Output High Voltage) (High drive, 12 mA)
0.8 VDD
—
VDD
VOL (Output Low Voltage) (High drive, 12 mA)
VSS
—
0.2 VDD
Pull-up Resistance
34 K
48 K
74 K
Pull-down Resistance
29 K
47 K
86 K
Supply Current
Tx mode peak current at VDD=3V,
Tx=0 dBm, Buck mode
—
—
13 mA
Rx mode peak current at VDD=3V, Buck mode
—
—
13 mA
Link static current
Standby current
Power-Saving
60 μA
1.9 μA
—
2.9 μA
1 μA
—
1.7 μA
Analog-to-Digital Converter (ADC)
Full scale (BAT_IN)
0V
3.0V
3.6V
Full scale (AD0~AD15)
0V
—
3.6V
Conversion time (ENOB 8-bit)
—
131 μS
—
Conversion time (ENOB 10-bit)
—
387 μS
—
Operating current
DNL
INL
—
—
500 μA
-1.12 LSB
—
+1.12 LSB
-4.38 LSB
—
+4.38 LSB
Precise Temperature Sensor (PTS)
Detect range
-20°C
—
+70°C
Digital Output
1387
—
2448
Resolution
—
12-bits/°C
—
-3°C
—
+3°C
Conversion time (ENOB 10-bit)
—
12.35 ms
—
Operating current
—
—
200 μA
Accuracy
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3.1
3.1.1
Current Consumption Details
Tx/Rx CURRENT CONSUMPTION
DETAILS
The peak current of the VBAT input is 12 mA and the
average current is around 0.23 mA. In this example the
advertising interval is 100 ms and current consumption
is measured at 3.3V VBAT input.
Figure 3-1 and Figure 3-2 illustrate the Tx/Rx peak and
average current consumption of advertising event in
the BLEDK3 beacon mode application.
FIGURE 3-1:
Tx/Rx PEAK CURRENT CONSUMPTION IN BLEDK3 BEACON MODE
APPLICATION
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FIGURE 3-2:
Tx/Rx AVERAGE CURRENT CONSUMPTION IN BLEDK3 BEACON MODE
APPLICATION
For additional information on the current consumption
measurements, test condition, and test environment
setup, refer to the “IS187x_BM7x BLEDK3 Application
Note”. This Application Note covers detailed information about the status of the BLEDK3 application.
TABLE 3-2:
Table 3-2 provides the status details of the BLEDK3
application.
STATUS DETAILS OF BLEDK3 APPLICATION
Status
Description
Shutdown Mode
BLEDK3 is shutdown
Standby Mode
BLEDK3 sends advertising packets and wait for connection. BLEDK3 is
discoverable and connectible
BLE Connected Mode
BLE link is established and CCCD of ISSC_Transparent_Tx characteristic is
disabled (see Note 1)
Transparent Service Enabled Mode BLE link is established and CCCD of ISSC_Transparent_Tx characteristic is
enabled (see Note 1)
Note 1:
Client Characteristic Configuration (CCCD) is GATT service characteristics.
DS60001371C-Page 20
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4.0
PACKAGE INFORMATION
Figure 4-1 through Figure 4-5 illustrate the package
marking information of the IS1870SF IC.
4.1
48QFN, 6x6 mm Chip Outline (IS1870SF)
FIGURE 4-1:
48QFN, 6X6 MM PACKAGE INFORMATION (IS1870SF)
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DS60001371C-Page 21
48QFN, 6X6 MM FOOTPRINT INFORMATION (IS1870SF)
 2015-2016 Microchip Technology Inc.
FIGURE 4-2:
IS1870/71
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4.2
32QFN, 4x4 mm Chip Outline (IS1871SF)
FIGURE 4-3:
32QFN, 4X4 MM PACKAGE SIZE INFORMATION (IS1871SF)
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DS60001371C-Page 23
32QFN FOOTPRINT INFORMATION (IS1871SF)
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FIGURE 4-4:
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FIGURE 4-5:
PACKAGE MARKING INFORMATION
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NOTES:
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5.0
- Oval-shape opening should be used to get
the optimum paste release.
- Rounded corners to minimize clogging.
- Positive taper walls (5° tapering) with bottom
opening larger than the top.
REFLOW PROFILE AND
STORAGE CONDITION
Figure 5-1 and Figure 5-2 illustrate reflow profiles and
stencil information of the IS1870/71 SoC.
5.1
5.1.1
5.1.3
Stencil of SMT Assembly
Suggestion
STENCIL TYPE & THICKNESS
• Laser cutting
• Stainless steel
• Thickness: 0.5 mm pitch, thickness < 0.15 mm
5.1.2
APERTURE SIZE AND SHAPE FOR
TERMINAL PAD
APERTURE DESIGN FOR THERMAL
PAD
• Small multiple openings should be used instead
of one big opening.
• 60~80% solder paste coverage
• Rounded corners to minimize clogging
• Positive taper walls (5° tapering) with bottom
opening larger than the top
• Aspect ratio (width/thickness) >1.5
• Aperture shape
- The stencil aperture is designed to match the
pad size on the PCB.
FIGURE 5-1:
REFLOW PROFILE
Do not recommend
Coverage 91%
FIGURE 5-2:
Recommend
Coverage 77%
Recommend
Coverage 65%
STENCIL TYPE
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5.2
260 ℃ Reflow Profile
Figure 5-3 illustrates the reflow profile and the following
are its specific features:
• Standard Condition: IPC/JEDEC J-STD-020
• Preheat: 150~200 ℃ ~60~120 seconds
• Average ramp-up rate (+217℃ to peak): +3℃/sec
max
FIGURE 5-3:
DS60001371C-Page 28
• Temperature maintained above 217: 60~150 seconds
• Time within +5 ℃ of peak temperature: 30 ~ 40
seconds
• Peak temperature: 260 +5/-0 ℃
• Ramp-down rate (peak to +217℃): +6℃/sec. max
• Time +25 ℃ to peak temperature: 8 minutes max
• Cycle interval: 5 minutes
REFLOW PROFILE
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5.3
Storage Condition
Users need to follow these specific storage conditions
for the IS1870x SoC.
• The calculated shelf life in the sealed bag is 24
months at <40 ℃ and <90% Relative Humidity
(RH).
• After the bag is opened, devices that are subjected to reflow solder or other high temperature
process must be mounted within 168 hours of factory conditions, i.e <30 ℃ /60% RH.
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NOTES:
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6.0
ORDERING GUIDE
Table 6-1 provides the ordering information for the
IS1870/71.
TABLE 6-1:
ORDERING GUIDE
Device
Bluetooth Version
IS1870
Bluetooth Low Energy SoC, BLE 4.2 compliant
IS1871
Bluetooth Low Energy SoC, BLE 4.2 compliant
 2015-2016 Microchip Technology Inc.
Package
Part No.
3
IS1870SF
mm3
IS1871SF
48-Lead QFN, 6x6x0.9 mm , 0.4 mm pitch
32-Lead QFN, 4x4x0.9
, 0.4 mm pitch
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NOTES:
DS60001371C-Page 32
 2015-2016 Microchip Technology Inc.
REFERENCE CIRCUIT
Figure A-1 and Figure A-3 illustrate a typical application circuit of the IS1870
and IS1871.
FIGURE A-1:
The application circuit lists the RF matching circuit, PMU power tree, LED
option, test points, and configuration table. The GPIOs can be configured to
general I/O functions or the function of ADC, PTS, PWM, and external
32.768 KHz crystal.
IS1870 APPLICATION CIRCUIT
 2015-2016 Microchip Technology Inc.
Note 1: The C13, C14, L4, C12, C11, C10, C3, and C4 should be as close to the chip as possible.
2: The value of the antenna matching component depends on the user’s antenna and PCB layout.
IS1870/71
DS60001371C-Page 33
APPENDIX A:
IS1870/71
IS1870 APPLICATION CIRCUIT (OPTIONAL)
DS60001371C-Page 34
FIGURE A-2:
 2015-2016 Microchip Technology Inc.
 2015-2016 Microchip Technology Inc.
FIGURE A-3:
IS1871 APPLICATION CIRCUIT
2: The value of the antenna matching component depends on the user’s antenna and PCB layout.
IS1870/71
DS60001371C-Page 35
Note 1: The C13, C14, L4, C12, C11, C10, C3, and C4 should be as close to the chip as possible.
IS1870/71
IS1871 APPLICATION CIRCUIT (OPTIONAL)
DS60001371C-Page 36
FIGURE A-4:
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APPENDIX B:
B.1
LAYOUT
GUIDELINES
RF Matching
The RF traces (including Tx, Rx, and antenna path) on
the PCB should match 50Ω impedance. In Figure A-1,
value of L1, L3, C1, C2, and C5 are fixed. The antenna
matching components C6, C7, and L2 should be
adjusted to match the 50Ω 2.4 GHz antenna.
B.2
PMU
The PMU section components, such as VBAT, BK_IN,
BK_O, BK_LX, AVDD, ULPC_O, CLDO_O, VREF
should be kept close to the IS1870/71.
For additional information on PCB design guidelines,
contact your local Microchip sales office. A list of Microchip sales offices is given on the back page of this document,.
The L4 and C14 of Buck section, shown in Figure A-1,
should be selected carefully. Capacitor C14 is either
4.7 μF/6.3V, X5R, or X7R type. The inductor L4 need to
be high current (IDC>300mA) and low DCR (<1Ω) type.
B.3
Crystal
The XI 32 MHz crystal specification should be within
the ±10 ppm range, see Figure A-1.
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NOTES:
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APPENDIX C:
REVISION HISTORY
Revision A (October 2015)
This is the initial released version of this document.
Revision B (October 2015)
This revision includes the following changes as well as minor updates to text and formatting, which were incorporated
throughout the document.
Status
Description
Section “Features”
The section has been updated with new information.
Section “Packages”
The section is updated with the package information.
Section 1.0 “Device Overview”
Updated Figure 1-1 and Figure 1-2.
Added Table 1-1
Revision C (March 2016)
This revision includes the following changes and minor updates to text and formatting, which were incorporated throughout the document.
Status
Description
Section “Features”
The section is updated with new information.
Section 1.0 “Device Overview”
Updated Figure 1-1 and Figure 1-2.
Updated Table 1-1 and Table 1-2.
Section 2.0 “System Block
Details”
Updated 2.2 “System Block Specification” and 2.3 “Host MCU Interface
Over UART” with new information.
Section 3.0 “Electrical Character- Updated 3.1.1 “Tx/Rx Current Consumption Details”.
istics”
Updated Figure 3-1 and Figure 3-2.
Updated Table 3-1 and Table 3-2.
Section 5.3 “Storage Condition”
Deleted Figure 5-4.
Section 6.0 “Ordering Guide”
Updated Table 6-1
Appendix A: “Reference Circuit”
Updated Figure A-1 and Figure A-3
Added Figure A-2 and Figure A-4
Appendix C: Bill of Material
Deleted
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NOTES:
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IS1870/71
THE MICROCHIP WEB SITE
CUSTOMER SUPPORT
Microchip provides online support via our WWW site at
www.microchip.com. This web site is used as a means
to make files and information easily available to
customers. Accessible by using your favorite Internet
browser, the web site contains the following
information:
Users of Microchip products can receive assistance
through several channels:
• Product Support – Data sheets and errata,
application notes and sample programs, design
resources, user’s guides and hardware support
documents, latest software releases and archived
software
• General Technical Support – Frequently Asked
Questions (FAQ), technical support requests,
online discussion groups, Microchip consultant
program member listing
• Business of Microchip – Product selector and
ordering guides, latest Microchip press releases,
listing of seminars and events, listings of
Microchip sales offices, distributors and factory
representatives
•
•
•
•
Distributor or Representative
Local Sales Office
Field Application Engineer (FAE)
Technical Support
Customers
should
contact
their
distributor,
representative or Field Application Engineer (FAE) for
support. Local sales offices are also available to help
customers. A listing of sales offices and locations is
included in the back of this document.
Technical support is available through the web site at:
http://microchip.com/support.
CUSTOMER CHANGE NOTIFICATION
SERVICE
Microchip’s customer notification service helps keep
customers current on Microchip products. Subscribers
will receive e-mail notification whenever there are
changes, updates, revisions or errata related to a
specified product family or development tool of interest.
To register, access the Microchip web site at
www.microchip.com. Under “Support”, click on
“Customer Change Notification” and follow the
registration instructions.
 2015-2016 Microchip Technology Inc.
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NOTES:
DS60001371C-Page 42
 2015-2016 Microchip Technology Inc.
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Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
•
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights unless otherwise stated.
Trademarks
The Microchip name and logo, the Microchip logo, AnyRate,
dsPIC, FlashFlex, flexPWR, Heldo, JukeBlox, KeeLoq,
KeeLoq logo, Kleer, LANCheck, LINK MD, MediaLB, MOST,
MOST logo, MPLAB, OptoLyzer, PIC, PICSTART, PIC32 logo,
RightTouch, SpyNIC, SST, SST Logo, SuperFlash and UNI/O
are registered trademarks of Microchip Technology
Incorporated in the U.S.A. and other countries.
ClockWorks, The Embedded Control Solutions Company,
ETHERSYNCH, Hyper Speed Control, HyperLight Load,
IntelliMOS, mTouch, Precision Edge, and QUIET-WIRE are
registered trademarks of Microchip Technology Incorporated
in the U.S.A.
Analog-for-the-Digital Age, Any Capacitor, AnyIn, AnyOut,
BodyCom, chipKIT, chipKIT logo, CodeGuard, dsPICDEM,
dsPICDEM.net, Dynamic Average Matching, DAM, ECAN,
EtherGREEN, In-Circuit Serial Programming, ICSP, Inter-Chip
Connectivity, JitterBlocker, KleerNet, KleerNet logo, MiWi,
motorBench, MPASM, MPF, MPLAB Certified logo, MPLIB,
MPLINK, MultiTRAK, NetDetach, Omniscient Code
Generation, PICDEM, PICDEM.net, PICkit, PICtail,
PureSilicon, RightTouch logo, REAL ICE, Ripple Blocker,
Serial Quad I/O, SQI, SuperSwitcher, SuperSwitcher II, Total
Endurance, TSHARC, USBCheck, VariSense, ViewSpan,
WiperLock, Wireless DNA, and ZENA are trademarks of
Microchip Technology Incorporated in the U.S.A. and other
countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
QUALITY MANAGEMENT SYSTEM
CERTIFIED BY DNV
== ISO/TS 16949 ==
 2015-2016 Microchip Technology Inc.
Silicon Storage Technology is a registered trademark of
Microchip Technology Inc. in other countries.
GestIC is a registered trademarks of Microchip Technology
Germany II GmbH & Co. KG, a subsidiary of Microchip
Technology Inc., in other countries.
All other trademarks mentioned herein are property of their
respective companies.
© 2015-2016, Microchip Technology Incorporated, Printed in
the U.S.A., All Rights Reserved.
ISBN: 978-1-5224-0411-8
DS60001371C-Page 43
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Worldwide Sales and Service
AMERICAS
ASIA/PACIFIC
ASIA/PACIFIC
EUROPE
Corporate Office
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200
Fax: 480-792-7277
Technical Support:
http://www.microchip.com/
support
Web Address:
www.microchip.com
Asia Pacific Office
Suites 3707-14, 37th Floor
Tower 6, The Gateway
Harbour City, Kowloon
China - Xiamen
Tel: 86-592-2388138
Fax: 86-592-2388130
Austria - Wels
Tel: 43-7242-2244-39
Fax: 43-7242-2244-393
China - Zhuhai
Tel: 86-756-3210040
Fax: 86-756-3210049
Denmark - Copenhagen
Tel: 45-4450-2828
Fax: 45-4485-2829
India - Bangalore
Tel: 91-80-3090-4444
Fax: 91-80-3090-4123
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Tel: 33-1-69-53-63-20
Fax: 33-1-69-30-90-79
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Tel: 91-11-4160-8631
Fax: 91-11-4160-8632
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Tel: 49-2129-3766400
Atlanta
Duluth, GA
Tel: 678-957-9614
Fax: 678-957-1455
Hong Kong
Tel: 852-2943-5100
Fax: 852-2401-3431
Australia - Sydney
Tel: 61-2-9868-6733
Fax: 61-2-9868-6755
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Tel: 86-10-8569-7000
Fax: 86-10-8528-2104
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Tel: 512-257-3370
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Fax: 317-773-5453
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Tel: 949-462-9523
Fax: 949-462-9608
New York, NY
Tel: 631-435-6000
San Jose, CA
Tel: 408-735-9110
Canada - Toronto
Tel: 905-673-0699
Fax: 905-673-6509
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Tel: 86-769-8702-9880
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Fax: 82-2-558-5932 or
82-2-558-5934
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07/14/15
DS60001371C-Page 44
 2015-2016 Microchip Technology Inc.