dsPIC33FJ128GP804 AND PIC24HJ128GP504 dsPIC33FJ128GP804 and PIC24HJ128GP504 PIM Information Sheet The dsPIC33FJ128GP804 and PIC24HJ128GP504 Plug-In Modules (PIMs) are designed to demonstrate the capabilities of the dsPIC33FJ128GP804 and PIC24HJ128GP504 families, using the Explorer 16 Development Board and the PICtail™ Plus daughter boards. The dsPIC33FJ128GP804 and PIC24HJ128GP504 are high-performance, 16-bit controllers within a small 44-pin QFN package. They are equipped with Peripheral Pin Select (PPS), which allows many of the digital peripherals to be remapped to use any number of pins on the device. TABLE 1: Device Pin Number The PIMs take advantage of PPS by using zero ohm resistors to connect the I/O to the 100-pin Explorer 16 Development Board. Simply removing the zero ohm resistors, and using the test points associated with each I/O pin (i.e., Pin1, Pin2, etc.), allows the designer to reroute the pin to any of the available pins on the Explorer 16 Development Board. This capability enables easier and faster design times. Table 1 shows the mapping between the Explorer 16 functions and the device pins. 44-PIN TO 100-PIN PINOUT dsPIC33FJ128GP804 and PIC24HJ128GP504 PIM Pin Number Functional Description Device Pin Number dsPIC33FJ128GP804 and PIC24HJ128GP504 PIM Pin Number Functional Description 1 SDA1/RP9/CN21/RB9 87 RF0 23 2 RP22/CN18/RC6 88 RF1 24 AN4/RP2/CN6/RB2 AN5/RP3/CN7/RB3 3 RP23/CN17/RC7 25 AN6/RP16/CN8/RC0 4 RP24/CN20/RC8 26 AN7/RP17/CN9/RC1 5 RP25/CN19/RC9 27 AN8/RP18/CN10/RC2 6 VSS 15 28 VDD 62 7 VCAP/VDDCORE 85 29 VSS 65 8 PGED2/RP10/CN16/RB10 30 OSCI/CLKI/CN30/RA2 63 OSC1 9 PGEC2/RP11/CN15/RB11 31 OSCO/CLKO/CN29/RA3 64 OSC2 10 AN12/RP12/CN14/RB12 41 DAC1 Right P 32 TDO/RA8 38 LED D4 11 AN11/RP13/CN13/RB13 42 DAC1 Right N 33 SOSCI/RP4/CN1/RB4 74 SOSC1 12 TMS/RA10 59 LED D6 34 SOSCO/T1CK/CN0/RA4 73 SOSC2 13 TCK/RA7 17 LED D3 35 TDI/RA9 58 LED D5 14 AN10/RP14/CN12/RB14 36 RP19/CN28/RC3 49 U1 RX 15 AN9/RP15/CN11/RB15 37 RP20/CN25/RC4 50 U1 TX 16 AVSS 36 38 RP21/CN26/RC5 39 U1 RTS 17 AVDD 30 39 VSS 31 18 MCLR 13 40 VDD 2 19 AN0/VREF+/CN2/RA0 25 ADC 41 PGED3/ASDA1/RP5/CN27/ RB5 27 Debug 20 AN1/VREF-/CN3/RA1 20 POT 42 PGEC3/ASCL1/RP6/CN24/ RB6 26 Debug 21 PGED1/AN2/C2IN-/RP0/CN4/ RB0 21 Temp Sensor 43 INT0/RP7/CN23/RB7 83 Switch 3 22 PGEC1/AN3/C2IN+/RP1/CN5/ RB1 44 SCL1/RP8/CN22/RB8 40 U1 CTS 2013 Microchip Technology Inc. DS70325B-page 1 VDD 76 77 78 79 80 81 82 83 SW3 84 85 VDDCAP/CORE 86 87 RF0 89 88 RF1 90 91 92 93 94 95 96 97 99 98 J1 100 100-PIN HEADER SCHEMATIC 1 75 2 74 SOSC1 3 73 SOSC2 4 72 5 71 6 70 7 69 8 68 9 67 10 66 11 65 12 U1TX 50 49 48 47 46 U1RX GND DAC1 RIGHT N DAC1 RIGHT P LED D4 VDD GND 45 51 44 52 42 24 25 43 53 41 54 23 U1CTS 40 55 22 U1RTS 39 56 21 38 20 37 57 36 19 35 58 34 59 18 33 17 32 60 31 16 GND 2013 Microchip Technology Inc. ADC 61 AVDD Temp_Sensor 15 30 POT 62 29 LED D3 63 14 28 VDD 13 PGED3 27 GND 64 100-Pin Header PGEC3 26 MCLR GND GND OSC2 OSC1 VDD LED D6 LED D5 dsPIC33FJ128GP804 AND PIC24HJ128GP504 DS70325B-page 2 FIGURE 1: DS70325B-page 3 R11 R10 R3 0R 0R 0R Pin22 Pin21 Pin20 Pin19 AN2 22 AN3 21 20 AN1 19 AN0 MCLR 18 MCLR AVDD 42 43 Pin 43 PGEC3 Pin44 RA4 RA9 RP19 RP20 34 35 36 37 RP21 38 VSS 39 VDD 40 0R 0R R2 R13 R11 R15 R16 0R 0R 0R 0R 0R C1 R17 R18 Pin34 Pin 35 Pin 36 Pin 35 Pin 38 0.1 µF PGED3 41 PGED3 PGEC3 INT0 RP8 44 R4 RP22 RP23 OSCO 31 OSC2 4 RP24 OSCI 30 OSC1 5 RP25 VSS 29 6 VSS dsPIC33FJ128GP804 and PIC24HJ128GP504 RP18 RP10 RP17 RP11 RP16 RP12 AN4 33 RA8 32 VDD 28 27 26 25 AN5 24 23 Pin33 Pin32 Pin27 Pin26 Pin25 Pin24 Pin23 R1 0R R12 0R 0.1 F SOSC1 LED D4 C4 VDD SOSC2 LED D5 U1RX U1TX GND U1RTS VDD SW3 U1CTS dsPIC33FJ128GP804 AND PIC24HJ128GP504 Temp_Sensor POT ADC AVDD 11 RP13 17 10 0.1 µF Pin11 C3 0R 9 VCAP/VDDCORE AVSS 0R Pin9 Pin10 8 RP15 Pin8 16 R7 7 15 Pin5 RP14 Pin4 3 14 Pin3 Pin15 R6 2 CN21 0R Pin14 DAC1 Right N R5 0R Pin2 1 RA7 DAC1 Right P C2 Pin1 13 RF1 0R RA10 1.0 F R4 R9 0R Pin13 12 RF0 LED D3 Pin12 U1 LED D6 R8 2013 Microchip Technology Inc. FIGURE 2: 44-PIN DEVICE SCHEMATIC dsPIC33FJ128GP804 AND PIC24HJ128GP504 NOTES: DS70325B-page 4 2013 Microchip Technology Inc. Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. • Microchip is willing to work with the customer who is concerned about the integrity of their code. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, dsPIC, FlashFlex, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART, PIC32 logo, rfPIC, SST, SST Logo, SuperFlash and UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor, MTP, SEEVAL and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Silicon Storage Technology is a registered trademark of Microchip Technology Inc. in other countries. Analog-for-the-Digital Age, Application Maestro, BodyCom, chipKIT, chipKIT logo, CodeGuard, dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN, ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial Programming, ICSP, Mindi, MiWi, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, mTouch, Omniscient Code Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit, PICtail, REAL ICE, rfLAB, Select Mode, SQI, Serial Quad I/O, Total Endurance, TSHARC, UniWinDriver, WiperLock, ZENA and Z-Scale are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. GestIC and ULPP are registered trademarks of Microchip Technology Germany II GmbH & Co. & KG, a subsidiary of Microchip Technology Inc., in other countries. All other trademarks mentioned herein are property of their respective companies. © 2013, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. ISBN: 978-1-62076-865-5 QUALITY MANAGEMENT SYSTEM CERTIFIED BY DNV == ISO/TS 16949 == 2013 Microchip Technology Inc. Microchip received ISO/TS-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company’s quality system processes and procedures are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified. 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