MATERIAL DECLARATION SHEET Material # CDNBS16 Series Product Line Integrated Passive & Active Devices Date 5/27/2004 RoHS Compliant Yes COMPONENT DETAILS No. 1 Construction element Lead Frame Material group Lead Frame Material weight [g] 0.0757 2 Wafer Silicon 0.01434 3 Gold Bond wire Conductor 0.000352 4 Silver paste Die Attach 0.000808 5 Molding Component Outer 0.0576 Total weight Materials CAS if applicable Average mass [%] Cu Ni Sn 7440-50-8 7440-02-0 7440-31-5 48.23 0 2.447 Silicon 7440-21-3 9.444 Other material Au SI Ag .1927 7440-57-5 7440-22-4 Epoxy Silica fused Epoxy resin Phenol resin .2352 .0023 .4235 .1195 60676-86-0 68928-70-1 29690-82-2 32.90 3.871 2.322 Sum [%] Traces 50.87 9.637 .2365 .5430 38.71 0.1488 Pb Free Part Number Example: CDNBS16-T05C Note: Avg. mass and sum data is a % of the component weight. It is the responsibility of the user to ensure that the latest revision is being accessed on the website. Headquarters Riverside CA www.bourns.com page 1 of 1