MATERIAL DECLARATION SHEET Material # 2DTA-5-Q24RLF Product Line Integrated Passive & Active Devices Date 2004/5/27 RoHS Compliant? Yes COMPONENT DETAILS No. 1 Construction element Lead Frame Material group Lead Frame Material weight [g] 0.0744 2 Wafer Silicon 0.01434 3 Gold Bond wire Conductor 0.000352 4 Silver paste Die Attach 0.000808 5 Molding Component Outer 0.0401 Total weight Headquarters Riverside CA Materials Cu Ni Sn CAS if applicable 7440-50-8 7440-02-0 7440-31-5 Average mass [%] 95.53% 0% 4.46% Silicon 98~99% Other material 1~2% Au SI Ag 7440-57-5 Epoxy Silica fused Epoxy resin Phenol resin 99% 1% 78~82% 18~22% 60676-86-0 75-95% 6-10% 2-6% Sum [%] Traces 100 100 100 100 100 0.1300 www.bourns.com page 1 of 1