567HL

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
WLCSP20, 2.58x2.23
CASE 567HL
ISSUE A
DATE 03 MAR 2015
SCALE 4:1
PIN A1
REFERENCE
ÈÈ
ÈÈ
ÈÈ
E
A
B
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. COPLANARITY APPLIES TO SPHERICAL
CROWNS OF SOLDER BALLS.
DIM
A
A1
A3
b
D
E
e
D
0.05 C
2X
0.05 C
2X
MILLIMETERS
MIN
MAX
−−−
0.65
0.17
0.23
0.38 REF
0.23
0.29
2.58 BSC
2.23 BSC
0.40 BSC
GENERIC
MARKING DIAGRAM*
TOP VIEW
A
0.10 C
XXXXX
XXXXX
ALYW
G
A1
0.08 C
NOTE 3
C
SIDE VIEW
e/2
e
20X
b
0.05 C A B
0.03 C
E
e
D
C
SEATING
PLANE
A
L
Y
W
G
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
*This information is generic. Please refer to device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
RECOMMENDED
SOLDERING FOOTPRINT*
B
A
PACKAGE
OUTLINE
A1
1
2
3
0.40
PITCH
4
BOTTOM VIEW
20X
0.25
0.40
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER:
98AON14648F
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
STATUS: ON SEMICONDUCTOR STANDARD
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
NEW STANDARD:
© Semiconductor Components Industries, LLC, 2002
Case Outline Number:
http://onsemi.com
WLCSP20, 2.58X2.23
DESCRIPTION:
October, 2002
− Rev. 0
PAGE 1 OFXXX
2
1
DOCUMENT NUMBER:
98AON14648F
PAGE 2 OF 2
ISSUE
REVISION
DATE
O
RELEASED FOR PRODUCTION. REQ. BY P. JOHNSON.
28 MAY 2013
A
MODIFIED DIMENSION A1. ADDED GENERIC MARKING INFORMATION. REQ. BY
B. BLAUER.
03 MAR 2015
ON Semiconductor and
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© Semiconductor Components Industries, LLC, 2015
March, 2015 − Rev. A
Case Outline Number:
567HL