Classification Reflow Profiles Profile Feature Sn-Pb Eutectic Assembly Pb-Free Assembly 3 °C/second max. 3° C/second max. Preheat – Temperature Min (Tsmin) – Temperature Max (Tsmax) – Time (tsmin to tsmax) 100 °C 150 °C 60-120 seconds 150 °C 200 °C 60-180 seconds Time maintained above: – Temperature (TL) – Time (tL) 183 °C 60-150 seconds 217 °C 60-150 seconds Peak/Classification Temperature (Tp) See Table 4.1 See Table 4.2 Time within 5 °C of actual Peak Temperature (tp) 10-30 seconds 20-40 seconds 6 °C/second max. 6 °C/second max. 6 minutes max. 8 minutes max. Average Ramp-Up Rate (Tsmax to Tp) Ramp-Down Rate Time 25 °C to Peak Temperature Note 1: All temperatures refer to topside of the package, measured on the package body surface. tp Tp Critical Zone TL to Tp Temperature Ramp-up TL tL Tsmax Tsmin Ramp-down ts Preheat 25 Classification Reflow Profile t 25oC to Peak Time Table 4-1 SnPb Eutectic Process – Package Peak Reflow Temperatures Package Thickness Volume mm3 <350 Volume mm3 ≥ 350 <2.5 mm 240 +0/-5 °C 225 +0/-5°C ≥ 2.5 mm 225 +0/-5°C 225 +0/-5°C Table 4-2 Pb-free Process – Package Classification Reflow Temperatures Package Thickness Volume mm3 <350 Volume mm3 350 - 2000 Volume mm3 >2000 <1.6 mm 260 +0 °C * 260 +0 °C * 260 +0 °C * 1.6 mm - 2.5 mm 260 +0 °C * 250 +0 °C * 245 +0 °C * ≥2.5 mm 250 +0 °C * 245 +0 °C * 245 +0 °C * * Tolerance: The device manufacturer/supplier shall assure process compatibility up to and including the stated classification temperature (this means Peak reflow temperature +0 °C. For example 260 °C+0°C) at the rated MSL level. Note 1: The profiling tolerance is + 0 °C, -X °C (based on machine variation capability) whatever is required to control the profile process but at no time will it exceed - 5 °C. The producer assures process compatibility at the peak reflow profile temperatures defined in Table 4.2. Note 2: Package volume excludes external terminals (balls, bumps, lands, leads) and/or nonintegral heat sinks. Note 3: The maximum component temperature reached during reflow depends on package thickness and volume. The use of convection reflow processes reduces the thermal gradients between packages. However, thermal gradients due to differences in thermal mass of SMD packages may still exist. Note 4: Components intended for use in a ‘‘lead-free’’ assembly process shall be evaluated using the ‘‘lead free’’ classification temperatures and profiles defined in Tables 4-1, 4.2 whether or not lead free.