Application Report SNOA549C – February 2010 – Revised February 2010 Absolute Maximum Ratings for Soldering ..................................................................................................................................................... ABSTRACT The specifications contained herein apply only to National Semiconductor products whose datasheets refer to this document and specifically exclude those products that use the package families listed in the tables in this section. 1 2 Contents Scope ......................................................................................................................... Infrared and Convection .................................................................................................... 2.1 Pb-FREE SMT PACKAGES ...................................................................................... 2.2 SnPb SMT PACKAGES ........................................................................................... 2 2 2 2 List of Tables ...................................................................................... .......................................................................................... 1 Pb-Free Peak Body Temperatures 2 2 SnPb Peak Body Temperatures 3 All trademarks are the property of their respective owners. SNOA549C – February 2010 – Revised February 2010 Submit Documentation Feedback Absolute Maximum Ratings for Soldering Copyright © 2010, Texas Instruments Incorporated 1 Scope 1 www.ti.com Scope The specifications contained herein apply only to National Semiconductor products whose datasheets refer to this document and specifically exclude those products that use the package families listed in the tables in this section. NOT applicable to the following Pb-free package families: LAMINATE CSP LCC LTCC NOT applicable to the following SnPb package families: LLP PLCC SSOP PQFP-208 pins SOIC WIDE TEPBGA All specifications in this document are to be interpreted as Absolute Maximum Ratings. Absolute Maximum Ratings indicate limits beyond which damage to the device may occur, including inoperability and degradation of device reliability and/or performance. Functional operation of the device and/or nondegradation at the Absolute Maximum Ratings or other conditions beyond those indicated in the Operating Ratings or Operating Conditions is not implied. The Operating Ratings or Operating Conditions indicate conditions at which the device is functional and the device should not be operated beyond such conditions. 2 Infrared and Convection 2.1 Pb-FREE SMT PACKAGES These specifications meet IPC/JEDEC J-STD-020. Table 1. Pb-Free Peak Body Temperatures Package Thickness Package Volume < 350 mm3 Package Volume 350 – 2000 mm3 Package Volume >2000 mm3 <1.6 mm 260°C 260°C 260°C 1.6 mm – 2.5 mm 260°C 250°C 245°C > 2.5 mm 250°C 245°C 245°C Package volume excludes external terminals (e.g., balls, bumps, lands, leads) and/or nonintegral heat sinks. Dwell time max within 5°C of peak temperature: 30 sec 2.2 SnPb SMT PACKAGES The specifications in Table 1 apply for SnPb package families not listed below. Table 1 exceeds J-STD020 requirements for SnPb packages. For the families listed below, specifications in Table 2 apply. These specifications meet J-STD-020. 2 EQUAD SOIC NARROW TO-252 FBGA PBGA TO-263 FCBGA TBGA CERPACK LBGA TFBGA Absolute Maximum Ratings for Soldering SNOA549C – February 2010 – Revised February 2010 Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Infrared and Convection www.ti.com Table 2. SnPb Peak Body Temperatures Package Volume <350 mm3 Package Thickness Package Volume ≥350 mm3 <2.5 mm 235°C 220°C ≥ 2.5 mm 220°C 220°C Package volume excludes external terminals (e.g., balls, bumps, lands, leads) and/or nonintegral heat sinks. Dwell time max within 5°C of peak temperature: SNOA549C – February 2010 – Revised February 2010 Submit Documentation Feedback 20 sec Absolute Maximum Ratings for Soldering Copyright © 2010, Texas Instruments Incorporated 3 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed. TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications. In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. Nonetheless, such components are subject to these terms. No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties have executed a special agreement specifically governing such use. Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of non-designated products, TI will not be responsible for any failure to meet ISO/TS16949. Products Applications Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps DSP dsp.ti.com Energy and Lighting www.ti.com/energy Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Security www.ti.com/security Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video RFID www.ti-rfid.com OMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.com Wireless Connectivity www.ti.com/wirelessconnectivity Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2013, Texas Instruments Incorporated