tisp61089bsd

CO
M
PL
IA
NT
TISP61089BSD
*R
oH
S
DUAL FORWARD-CONDUCTING P-GATE THYRISTORS
PROGRAMMABLE OVERVOLTAGE PROTECTORS
TISP61089BSD High Voltage Ringing SLIC Protector
Dual Voltage-Programmable Protectors
- Supports Battery Voltages Down to -155 V
- Low 5 mA max. Gate Triggering Current
- High 150 mA min. Holding Current
8-SOIC Package (Top View)
(Tip)
K1
1
8
NC
(Gate)
G
2
7
A
(Ground)
NC
3
6
A
(Ground)
K2
4
5
NC
Rated for LSSGR ‘1089 Conditions
2/10 Overshoot Voltage Specified
(Ring)
Impulse
Waveshape
'1089 Test
ITSP
Section
Test #
4.5.7
4
4.5.8
1
10/360
4.5.7
2, 5
30
10/1000
4.5.7
1,3
30
2/10
60 Hz Power
120
'1089 Test
Section
Test #
A
0.5 s
4.5.12
9
6.5
1s
4.5.12
3, 4, 8
4.6
2s
4.5.12
7
3.4
4.5.12
5
4.5.13
2, 3
30 s
900 s
Device Symbol
K1
ITSM
Fault Time
5s
MD6XBE
NC - No internal connection
Terminal typical application names shown in
parenthesis
A
4.5.12
6
4.5.12
1, 2
4.5.13
1, 4, 5
A
G
A
K2
2.3
SD6XAU
1.3
Rated for ITU-T K.20, K.21 and K.45
0.73
Waveshape
4.5.15/16
Element
ITSP
Voltage
Current
A
10/700
5/310
40
ITM = 100 A, di/dt = 80 A/µs
V
Diode
10
SCR
12
..................................................UL Recognized Component
How to Order
Device
Package
Carrier
Order As
Marking Code
Standard Quantity
TISP61089BSD
8-SOIC
Embossed Tape Reeled
TISP61089BSDR-S
1089BS
2500
Description
The TISP61089BSD is a dual forward-conducting buffered p-gate thyristor (SCR) overvoltage protector. It is designed to protect monolithic
SLICs (Subscriber Line Interface Circuits) against overvoltages on the telephone line caused by lightning, a.c. power contact and induction. The
TISP61089BSD limits voltages that exceed the SLIC supply rail voltage. The TISP61089BSD parameters are specified to allow equipment
compliance with Telcordia GR-1089-CORE, Issue 3 and ITU-T recommendations K.20, K.21 and K.45.
*RoHS Directive 2002/95/EC Jan 27 2003 including Annex
SEPTEMBER 2005 - REVISED MAY 2007
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
TISP61089BSD High Voltage Ringing SLIC Protector
Description (Continued)
The SLIC line driver section is typically powered from 0 V (ground) and a negative voltage in the region of -20 V to -150 V. The protector gate is
connected to this negative supply. This references the protection (clipping) voltage to the negative supply voltage. The protection voltage will
then track the negative supply voltage and the overvoltage stress on the SLIC is minimized.
Positive overvoltages are clipped to ground by diode forward conduction. Negative overvoltages are initially clipped close to the SLIC negative
supply rail value. If sufficient current is available from the overvoltage, then the protector SCR will switch into a low voltage on-state condition.
As the overvoltage subsides the high holding current of TISP61089BSD SCR helps prevent d.c. latchup.
The TISP61089BSD is intended to be used with a series combination of a 40 Ω or higher resistance and a suitable overcurrent protector.
Power fault compliance requires the series overcurrent element to open-circuit or become high impedance (see Applications Information). For
equipment compliant to ITU-T recommendations K.20 or K.21 or K.45 only, the series resistor value is set by the coordination requirements. For
coordination with a 400 V limit GDT, a minimum series resistor value of 10 Ω is recommended.
These monolithic protection devices are fabricated in ion-implanted planar vertical power structures for high reliability and in normal system
operation they are virtually transparent. The TISP61089BSD buffered gate design reduces the loading on the SLIC supply during overvoltages
caused by power cross and induction. The TISP61089BSD is available in 8-pin plastic small-outline surface mount package.
Absolute Maximum Ratings, -40 °C ≤ TJ ≤ 85 °C (Unless Otherwise Noted)
Symbol
Value
Unit
Repetitive peak off-state voltage, VGK = 0
Rating
VDRM
-170
V
Repetitive peak gate-cathode voltage, VKA = 0
VGKRM
-167
V
Non-repetitive peak on-state pulse current (see Notes 1 and 2)
10/1000 µs (Telcordia GR-1089-CORE, Issue 3, October 2002, Section 4)
30
5/320 µs (ITU-T K.20, K.21& K.45, K.44 open-circuit voltage wave shape 10/700 µs)
10/360 µs (Telcordia GR-1089-CORE, Issue 3, October 2002, Section 4)
40
ITSP
1.2/50 µs (Telcordia GR-1089-CORE, Issue 3, October 2002, Section 4)
2/10 µs (Telcordia GR-1089-CORE, Issue 3, October 2002, Section 4)
40
A
100
120
TJ = 25 °C
170
Non-repetitive peak on-state current, 60 Hz (see Notes 1, 2 and 3)
0.5 s
6.5
1s
4.6
ITSM
2s
5s
3.4
30 s
1.3
900 s
0.73
Non-repetitive peak gate current,1/2 µs pulse, cathodes commoned (see Notes 1 and 2)
Operating free-air temperature range
Junction temperature
Storage temperature range
A
2.3
IGSM
+40
A
TA
-40 to +85
°C
TJ
-40 to +150
°C
Tstg
-40 to +150
°C
NOTES: 1. Initially the protector must be in thermal equilibrium with -40 °C ≤ T J ≤ 85 °C. The surge may be repeated after the device returns
to its initial conditions.
2. The rated current values may be applied either to the Ring to Ground or to the Tip to Ground terminal pairs. Additionally, both
terminal pairs may have their rated current values applied simultaneously (in this case the Ground terminal current will be twice
the rated current value of an individual terminal pair). Above 85 °C, derate linearly to zero at 150 °C lead temperature.
3. Values for V GG = -100 V. For values at other voltages see Figure 2.
SEPTEMBER 2005 - REVISED MAY 2007
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
TISP61089BSD High Voltage Ringing SLIC Protector
Recommended Operating Conditions
Component
CG
RS
Min
Typ
TISP61089BSD gate decoupling capacitor
100
220
TISP61089BSD series resistor for GR-1089-CORE first-level and second-level surge survival
40
Ω
TISP61089BSD series resistor for GR-1089-CORE intra-building port surge survival
8
Ω
10
Ω
TISP61089BSD series resistor for K.20, K.21 and K.45 coordination with a 400 V primary
protector
Max
Unit
nF
Electrical Characteristics, TJ = 25 °C (Unless Otherwise Noted)
Parameter
Test Conditions
Max
Unit
TJ = 25 °C
-5
µA
TJ = 85 °C
-50
µA
-112
V
12
V
IF = 5 A, tw = 200 µs
3
V
2/10 µs, IF = 100 A, di/dt = 80 A/µs, RS = 50 Ω, (see Note 4)
10
V
ID
Off-state current
V(BO)
Breakover voltage
2/10 µs, ITM = -100 A, di/dt = -80 A/µs, RS = 50 Ω, VGG = -100 V
Gate-cathode impulse
2/10 µs, ITM = -100 A, di/dt = -80 A/µs, RS = 50 Ω, VGG = -100 V,
VGK(BO)
VF
VFRM
breakover voltage
Forward voltage
Peak forward recovery
voltage
VD = VDRM, VGK = 0
Min
(see Note 4)
IH
Holding current
IGKS
Gate reverse current
VGG = VGK = VGKRM, VKA = 0
Gate trigger current
IGT
VGT
CKA
Gate-cathode trigger
voltage
Cathode-anode offstate capacitance
Typ
IT = -1 A, di/dt = 1A/ms, VGG = -100 V
-150
mA
TJ = 25 °C
-5
µA
TJ = 85 °C
-50
µA
IT = -3 A, tp(g) ≥ 20 µs, VGG = -100 V
5
mA
IT = -3 A, tp(g) ≥ 20 µs, VGG = -100 V
2.5
V
f = 1 MHz, Vd = 1 V, IG = 0, (see Note 5)
VD = -3 V
100
pF
VD = -48 V
50
pF
NOTES: 4. The diode forward recovery and the thyristor gate impulse breakover (overshoot) are not strongly dependent of the gate supply
voltage value (V GG ).
5. These capacitance measurements employ a three terminal capacitance bridge incorporating a guard circuit. The unmeasured
device terminals are a.c. connected to the guard terminal of the bridge.
Thermal Characteristics
Parameter
RθJA
Junction to free air thermal resistance
SEPTEMBER 2005 - REVISED MAY 2007
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
Test Conditions
TA = 25 °C, EIA/JESD51-3 PCB, EIA/
JESD51-2 environment, PTOT = 1.7 W
Min
Typ
Max
Unit
120
°C/W
TISP61089BSD High Voltage Ringing SLIC Protector
Parameter Measurement Information
+i
Quadrant I
IFSP (= |ITSP|)
Forward
Conduction
Characteristic
IFSM (= |ITSM |)
IF
VF
V GK(BO)
V GG
-v
VD
+v
ID
I(BO)
IH
IS
V(BO)
VS
VT
IT
ITSM
Quadrant III
Switching
Characteristic
ITSP
-i
PM6XAAA
Figure 1. Voltage-Current Characteristic
Unless Otherwise Noted, All Voltages are Referenced to the Anode
SEPTEMBER 2005 - REVISED MAY 2007
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
TISP61089BSD High Voltage Ringing SLIC Protector
Thermal Information
ITSM — Peak Non-Recurrent 50 Hz Current — A
20
TI61AF
RING AND TIP TERMINALS:
Equal ITSM values applied
simultaneously
GROUND TERMINAL:
Current twice ITSM value
15
10
8
7
6
5
4
EIA /JESD51
Environment and
PCB, TA = 25 °C
3
VGG = -80 V
V GG = -60 V
2
1.5
1
0.8
0.7
0.6
0.5
0.01
VGG = -100 V
V GG = -120 V
0.1
1
10
100
t — Current Duration — s
Figure 2. Non-Repetitive Peak On-State Current
against Duration
SEPTEMBER 2005 - REVISED MAY 2007
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
1000
20
ITSM — Peak Non-Recurrent 50 Hz Current — A
PEAK NON-RECURRING AC
vs
CURRENT DURATION
TYPICAL PEAK NON-RECURRING AC
vs
CURRENT DURATION
TI61DA
RING AND TIP TERMINALS:
Equal ITSM values applied
simultaneously
GROUND TERMINAL:
Current twice ITSM value
Typical PCB
Mounting,
TA = 25 °C
15
10
8
7
6
5
4
VGG = -80 V
3
VGG = -60 V
2
1.5
1
0.8
0.7
0.6
0.5
0.01
VGG = -100 V
VGG = -120 V
0.1
1
10
100
t — Current Duration — s
1000
Figure 3. Typical Non-Repetitive Peak On-state Current
against Duration
TISP61089BSD High Voltage Ringing SLIC Protector
APPLICATIONS INFORMATION
Operation of Ringing SLICs using Multiple Negative Voltage Supply Rails
Figure 4 shows a typical powering arrangement for a multi-supply rail SLIC. VBATL is a lower (smaller) voltage supply than VBATH. With supply
switch S1 in the position shown, the line driver amplifiers are powered between 0 V and VBATL. This mode minimizes the power consumption
for short loop transmission. For long loops and to generate ringing, the driver voltage is increased by operating S1 to connect VBATH. These
conditions are shown in Figure 5.
SLIC
0V
S1
V BATL
V BATH
LINE
LINE
DRIVERS
SUPPLY
SWITCH
AI6XCC
Figure 4. SLIC with Voltage Supply Switching
0V
0V
0V
V SLICG
V PKRING/2
V BATL
V PKRING/2
V BATH
V DCRING
V PKRING/2
V PKRING/2
V SLICH
V BATH
SHORT LOOP
LONG LOOP
V BATH
RINGING
AI6XCD
Figure 5. Driver Supply Voltage Levels
Conventional ringing is typically unbalanced ground or battery backed. To minimize the supply voltage required, most multi-rail SLICs use
balanced ringing as shown in Figure 5. The ringing has d.c., VDCRING, and a.c., VPKRING, components. A 70 V r.m.s. a.c. sinusoidal ring signal
has a peak value, VPKRING, of 99 V. If the d.c. component was 20 V, then the total voltage swing needed would be 99 + 20 = 119 V. There are
internal losses in the SLIC from ground, VSLICG, and the negative supply, VSLICH. The sum of these two losses generally amounts to a total of
10 V. This makes a total, VBATH, supply rail value of 119 + 10 = 129 V.
In some cases a trapezoidal a.c. ring signal is used. This would have a peak to r.m.s ratio (crest factor) of about 1.25, increasing the r.m.s. a.c.
ring level by 13 %. The d.c. ring voltge may be lowered for short loop applications.
SEPTEMBER 2005 - REVISED MAY 2007
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
TISP61089BSD High Voltage Ringing SLIC Protector
SLIC Parameter Values
The table below shows some details of HV SLICs using multiple negative supply rails.
Manufacturer
INFINEON‡
LEGERITY™‡
SLIC Series
SLIC-P‡
ISLIC™‡
SLIC #
PEB 4266
79R241
79R101
79R100
Data Sheet Issue
14/02/2001
-/08/2000
-/07/2000
-/07/2000
Short Circuit Current
110
150
150
150
mA
Unit
VBATH max.
-155
-104
-104
-104
V
VBATL max.
-150
-104
VBATH
VBATH
V
AC Ringing for:
85
45†
50†
55†
V rms
Crest Factor
1.4
1.4
1.4
1.25
VBATH
-70
-90
-99
-99
V
VBATR
-150
-36
-24
-24
V
R or T Power Max. < 10 ms
10
W
R or T Overshoot < 10 ms
TBD
TBD
R or T Overshoot < 1 ms
-10
+10
R or T Overshoot < 1 µs
-10
+30
R or T Overshoot < 250 ns
Line Feed Resistance
-5
5
-10
5
-10
5
-10
10
-15
8
-15
8
15
-20
12
-20
V
-15
20 + 30
V
50
50
12
50
V
V
Ω
† Assumes -20 V battery voltage during ringing.
‡ Legerity, the Legerity logo and ISLIC are the trademarks of Legerity, Inc. (formerly AMD's Communication Products Division).
Other product names used in this publication are for identification purposes only and may be trademarks of their respective
companies.
From the table, the maximum supply voltage, VBATH, is -155 V. In terms of minimum voltage overshoot limits, -10 V and +8 V are needed for
1 µs and -15 V, +12 V are needed for 250 ns. To maintain these voltage limits over the temperature range, 25 °C values of -12 V, +10 V are
needed for 250 ns.
It is important to define the protector overshoot under the actual circuit current conditions. For example, if the series line feed resistor was
40 Ω, R1 in Figure 12, and Telcordia GR-1089-CORE 2/10 and 10/1000 first level impulses were applied, the peak protector currents would be
56 A and 20 A. At the second level, the 2/10 impulse current would be 100 A. Therefore, the protector voltage overshoot should be guaranteed
to not exceed the SLIC voltage ratings at 100 A, 2/10 and 20 A, 10/1000. In practice, as the 2/10 waveshape has the highest current (100 A)
and fastest di/dt (80 A/µs) the overshoot level testing can restricted to the be 2/10 waveshape.
Using the table values for maximum battery voltage and minimum overshoot gives a protection device requirement of -170 V and +12 V from
the output to ground. There needs to be temperature guard banding for the change in protector characteristics with temperature. To cover
down to -40 °C the 25 °C protector minimum values of become -185 V (VDRM) on the cathode and -182 V (VGKS) on the gate.
Gated Protectors
This section covers four topics. Firstly, it is explained why gated protectors are needed. Second, the voltage limiting action of the protector is
described. Third, how the withstand voltages of the TISP61089BSD junctions are set. Fourth, an example application circuit is described.
Purpose of Gated Protectors
Fixed voltage thyristor overvoltage protectors have been used since the early 1980s to protect monolithic SLICs (Subscriber Line Interface
Circuits) against overvoltages on the telephone line caused by lightning, a.c. power contact and induction. As the SLIC was usually powered
from a fixed voltage negative supply rail, the limiting voltage of the protector could also be a fixed value. The TISP1072F3 is a typical example
of a fixed voltage SLIC protector.
SEPTEMBER 2005 - REVISED MAY 2007
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
TISP61089BSD High Voltage Ringing SLIC Protector
Gated Protectors (Continued)
SLICs have become more sophisticated. To minimize power consumption, some designs automatically adjust the driver supply voltage to a
value that is just sufficient to drive the required line current. For short lines the supply voltage would be set low, but for long lines, a higher
supply voltage would be generated to drive sufficient line current. The optimum protection for this type of SLIC would be given by a protection
voltage which tracks the SLIC supply voltage. This can be achieved by connecting the protection thyristor gate to the SLIC VBATH supply,
Figure 6. This gated (programmable) protection arrangement minimizes the voltage stress on the SLIC, no matter what value of supply voltage.
TIP
WIRE
600 Ω
TISP61089BSD
SLIC
R1
40 Ω
V BATL
GENERATOR
SOURCE
RESISTANCE
SWITCHING MODE
POWER SUPPLY
Tx
R2
40 Ω
600 Ω
ISLIC
RING
WIRE
A.C.
GENERATOR
0 - 600 V r.m.s.
C2
IG
C1
220 nF
IBATH
V BATH
D1
AI6XCCa
Figure 6. TISP61089BSD Buffered Gate Protector ('1089 Section 4.5.12 Testing)
SLIC
PROTECTOR
IF
Th5
IK
SLIC
PROTECTOR
SLIC
V BATH
Th5
TISP
61089BSD
TISP
IG
61089BSD
AI6XAHBa
SLIC
C1
220 nF
Figure 7. Negative Overvoltage Condition
V BATH
AI6XAIBa
C1
220 nF
Figure 8. Positive Overvoltage Condition
Operation of Gated Protectors
Figure 7 and Figure 8 show how the TISP61089BSD limits negative and positive overvoltages. Positive overvoltages (Figure 8) are clipped by
the antiparallel diode of Th5 and the resulting current is diverted to ground. Negative overvoltages (Figure 7) are initially clipped close to the
SLIC negative supply rail value (VBATH). If sufficient current is available from the overvoltage, then Th5 will switch into a low voltage on-state
condition. As the overvoltage subsides the high holding current of Th5 prevents d.c. latchup. The protection voltage will be the sum of the gate
supply (VBATH) and the peak gate-cathode voltage (VGK(BO)). The protection voltage will be increased if there is a long connection between the
gate decoupling capacitor, C1, and the gate terminal. During the initial rise of a fast impulse, the gate current (IG) is the same as the cathode
current (IK). Rates of 80 A/µs can cause inductive voltages of 0.8 V in 2.5 cm of printed wiring track. To minimize this inductive voltage increase of
SEPTEMBER 2005 - REVISED MAY 2007
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
TISP61089BSD High Voltage Ringing SLIC Protector
Gated Protectors (Continued)
protection voltage, the length of the capacitor to gate terminal tracking should be minimized. Inductive voltages in the protector cathode wiring
will also increase the protection voltage. These voltages can be minimized by routing the SLIC connection through the protector as shown in
Figure 6.
Figure 9, which has a 10 A/µs rate of impulse current rise, shows a positive gate charge (QGS) of about 0.1 µC. With the 0.1 µF gate decoupling
capacitor used, the increase in gate supply is about 1 V (= QGS/C1). This change is just visible on the -72 V gate voltage, VBATH. But, the
voltage increase does not directly add to the protection voltage as the supply voltage change reaches a maximum at 0.4 µs, when the gate
current reverses polarity, and the protection voltage peaks earlier at 0.3 µs. In Figure 9, the peak clamping voltage (V(BO)) is -77.5 V, an increase
of 5.5 V on the nominal gate supply voltage. This 5.5 V increase is the sum of the supply rail increase at that time, (0.5 V), and the protection
circuit’s cathode diode to supply rail breakover voltage (5 V). In practice, use of the recommended 220 nF gate decoupling capacitor would
give a supply rail increase of about 0.3 V and a V(BO) value of about -77.3 V.
0
Voltage - V
-20
VK
-40
VBATH
-60
-80
0.0
0.5
1.0
1.5
Time - µs
AI6XDE
1
QGS
IG
Current - A
0
-1
-2
IK
-3
-4
-5
0.0
0.5
1.0
1.5
Time - µs
Figure 9. Protector Fast Impulse Clamping and Switching Waveforms
Voltage Stress Levels on the TISP61089BSD
Figure 10 shows the protector electrodes. The package terminal designated gate, G, is the transistor base, B, electrode connection and so is
marked as B (G). The following junctions are subject to voltage stress: Transistor EB and CB, SCR AK (off state) and the antiparallel diode
(reverse blocking). This clause covers the necessary testing to ensure the junctions are good.
Testing transistor CB and EB: The maximum voltage stress level for the TISP61089BSD is VBATH with the addition of the short term antiparallel
diode voltage overshoot, VFRM. The current flowing out of the G terminal is measured at VBATH plus VFRM. The SCR K terminal is shorted to
the common (0 V) for this test (see Figure 10). The measured current, IGKS, is the sum of the junction currents ICB and IEB.
SEPTEMBER 2005 - REVISED MAY 2007
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
TISP61089BSD High Voltage Ringing SLIC Protector
Gated Protectors (Continued)
0V
ICB
V BATH
+ VFRM
B (G)
K
IGKS
IEB
TISP
61089BSD
AI6XCEc
Figure 10. Transistor CB AND EB Verification
Testing transistor CB, SCR AK off state and diode reverse blocking: The highest AK voltage occurs during the overshoot period of the protector.
To make sure that the SCR and diode blocking junctions do not break down during this period, a d.c. test for off-state current, ID, can be
applied at the overshoot voltage value. To avoid transistor CB current amplification by the transistor gain, the transistor base-emitter is shorted
during this test (see Figure 11).
0V
0V
ICB
V (BO)
TISP
61089BSD
IR
B (G)
ID(I)
A
K
ID
ID(I) is the internal SCR value of ID
AI6XCFc
Figure 11. Off-State Current Verification
Summary: Two tests are need to verify the protector junctions. Maximum current values for IGKS and ID are required at the specified applied
voltage conditions.
OVERCURRENT
PROTECTION
TIP
WIRE
RING/TEST
PROTECTION
TEST
RELAY
RING
RELAY
SLIC
RELAY
Th1
R1a
SLIC
PROTECTOR
S3a
S1a
SLIC
Th4
S2a
Th3
RING
WIRE
R1b
Th5
Th2
TISP
3xxxF3
OR
7xxxF3
S3b
S1b
TISP
61089BSD
S2b
V BATH
TEST
EQUIPMENT
RING
GENERATOR
C1
220 nF
AI6XAJBa
Figure 12. Typical Application Circuit
SEPTEMBER 2005 - REVISED MAY 2007
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
TISP61089BSD High Voltage Ringing SLIC Protector
Application Circuit
Figure 12 shows a typical TISP61089BSD SLIC card protection circuit. The incoming line conductors, Ring (R) and Tip (T), connect to the relay
matrix via the series overcurrent protection. Fusible resistors, fuses and positive temperature coefficient (PTC) resistors can be used for
overcurrent protection. Resistors will reduce the prospective current from the surge generator for both the TISP61089BSD and the ring/test
protector. The TISP7xxxF3 protector has the same protection voltage for any terminal pair. This protector is used when the ring generator
configuration may be ground or battery-backed. For dedicated ground-backed ringing generators, the TISP3xxxF3 gives better protection as
its inter-conductor protection voltage is twice the conductor to ground value.
Relay contacts 3a and 3b connect the line conductors to the SLIC via the TISP61089BSD protector. The protector gate reference voltage
comes from the SLIC negative supply (VBATH). A 220 nF gate capacitor sources the high gate current pulses caused by fast rising impulses.
LSSGR 1089
GR-1089-CORE, “1089”, covers electromagnetic compatibility and electrical safety generic criteria for US network telecommunication
equipment. It is a module in Volume 3 of LSSGR (LATA (Local Access Transport Area) Switching Systems Generic Requirements, FR-NWT-000064).
In ‘1089 surge and power fault immunity tests are done at two levels. After first-level testing the equipment shall not be damaged and
shall continue to operate correctly. Under second level testing the equipment shall not become a safety hazard. The equipment is permitted to
fail as a result of second-level testing. When the equipment is to be located on customer premises, second-level testing includes a wiring
simulator test, which requires the equipment to reduce the power fault current below certain values.
The following clauses reference the ‘1089 section and calculate the protector stress levels. The TISP61089BSD needs a 40 Ω series resistor to
survive second level surge testing.
‘1089 Section 4.5.5 - Test Generators
The generic form of test generator is shown in Figure 13. It emphasizes that multiple outputs must be independent, i.e. the loading condition of
one output must not affect the waveforms of the other outputs. It is a requirement that the open-circuit voltage and short circuit current
waveforms be recorded for each generator output used for testing. The fictive impedance of a generator output is defined as the peak
opencircuit voltage divided by the peak short-circuit current. Specified impulse waveshapes are maximum rise and minimum decay times. Thus
the 10/1000 waveshape should be interpreted as <10/>1000 and not the usually defined nominal values which have a tolerance.
Z
Output 1
Z
Output 2
Z
Output n
Z
Output n + 1
or
Z is the fictive
current-limiting
impedance in
each output feed
Return
Generic Lightning or AC Test Generator
Figure 13. '1089 Test Generators
SEPTEMBER 2005 - REVISED MAY 2007
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
AI6XCJ
TISP61089BSD High Voltage Ringing SLIC Protector
‘1089 Section 4.5.5 - Test Generators (Continued)
The exception to these two conditions of independence and limit waveshape values is the alternative IEEE C.62.41, 1.2/50-8/20 combination
wave generator, which may be used for testing in ‘1089 Sections 4.5.7, 4.5.8 and 4.5.9. Here, the quoted waveshape values are nominal with
defined tolerance. The open-circuit voltage waveshape is 1.2 µs ±0.36 µs front time and 50 µs ±10 µs duration. The short-circuit current
waveshape is 8 µs +1.0 µs, -2.5 µs front time and 20 µs +8 µs, -4 µs duration. The generator fictive source impedance (peak open-circuit
voltage divided by peak short-circuit current) is 2.0 Ω ±0.25 Ω.
To get the same peak short-circuit currents as the 2/10 generator, for the same peak open-circuit voltage setting, ‘1089 specifies that the
1.2/50-8/20 generator be used with external resistors for current limiting and sharing. When working into a finite resistive load the delivered
1.2/50-8/20 generator current waveshape moves towards the 1.2/50 voltage waveshape. Thus, although the 1.2/50-8/20 delivered peak current
is similar to the 2/10 generator, the much longer current duration means that a much higher stress is imposed on the equipment protection
circuit. This can cause fuses to operate which are perfectly satisfactory on the normal 2/10 generator. Testing with the 1.2/50-8/20 generator
gives higher stress levels than the 2/10 generator and, because it is little used, will not be covered in this analysis.
Output 1
Ring
V1
Output 2
Tip
V2
Ground
Return
AI6XCK
Test Generator
EUT
(Equipment
Under Test)
Figure 14. Longtitudinal (also Called Common Mode) Testing
Output 1
Ring
V1
Output 2
Tip
Return
Ground
EUT
(Equipment
Under Test)
Test Generator
Output 1
Ring
Output 2
Tip
V2
Return
Ground
AI6XCM
Test Generator
EUT
(Equipment
Under Test)
Figure 15. Transverse (also Called Differential or Metallic) Testing
SEPTEMBER 2005 - REVISED MAY 2007
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
TISP61089BSD High Voltage Ringing SLIC Protector
‘1089 Section 4.5.6 - Test Connections
The telecommunications port R and T terminals may be tested simultaneously or individually. Figure 14 shows connection for simultaneous
(longitudinal) testing. Figure 15 shows the two connections necessary to individually test the R and T terminals during transverse testing.
The values of protector current are calculated by dividing the open-circuit generator voltage by the total circuit resistance. The total circuit
resistance is the sum of the generator fictive source resistance and the TISP61089BSD series resistor value. The starting point of this analysis
is to calculate the minimum circuit resistance for a test by dividing the generator open-circuit voltage by the TISP61089BSD rating. Subtracting
the generator fictive resistance from the minimum circuit resistance gives the lowest value of series resistance that can be used. This is repeated
for all test connections. As the series resistance must be a fixed value, the value used has to be the highest value calculated from all the
considered test connections. Where both 10/1000 and 2/10 waveshape testing occurs, the 10/1000 test connection gives the highest value of
minimum series resistance. Unless otherwise stated the analysis assumes a -40 °C to +85 °C temperature range.
‘1089 Section 4.5.7 - First-Level Lightning Surge Testing
Table 1 shows the tests for this section. The peak TISP61089BSD current, ITM, is calculated by dividing the generator open voltage by the sum
of the generator fictive source and the line feed, RS, resistance values. Columns 9 and 10 show the resultant currents for RS values of 25 Ω
and 40 Ω. The TISP61089BSD rated current values at the various waveshapes are higher than those listed in Table 1. Used with the specified
values of RS, the TISP61089BSD will survive these tests.
Table 1. First-Level Surge Currents
Surge
#
Waveshape
Open-circuit
Voltage
V
Short-circuit
Current
A
No
of
Tests
Test
Connections
Primary
Fitted
Generator
Fictive
Source
Resistance
Ω
TISP61089BSD ITM
A
Rs = 25 Ω
Rs = 40 Ω
1
10/1000
600
100
+25, -25
Transverse &
Longitudinal
No
6
19 &
2x19
13 &
2x13
2
10/360
1000
100
+25, -25
Transverse &
Longitudinal
No
10
29 &
2x29
20 &
2x20
3
10/1000
1000
100
+25, -25
Transverse &
Longitudinal
No
10
29 &
2x29
20 & 2x20
4
2/10
2500
500
+10, -10
Longitudinal
No
5
2x83
2x56
5
10/360
1000
25
+5, -5
Longitudinal
No
40
2x15
2x13
NOTES: 1. Surge 3 may be used instead of Surge 1 and Surge 2.
2. Surge 5 is applied to multiple line pairs up to a maximum of 12.
3. If the equipment contains a voltage-limiting secondary protector, each test is repeated at a voltage just below the threshold of
limiting.
‘1089 Section 4.5.8 - Second-Level Lightning Surge Testing
Table 2 shows the 2/10 test used for this section. Columns 9 and 10 show the resultant currents for RS values of 25 Ω and 40 Ω. Used with an
RS of 40 Ω, the TISP61089BSD will survive this test. The 25 Ω value of RS is only intended to give first-level (Section 4.5.7) survival. Under
second-level conditions, the peak current will be 2x143 A, which may result in failure of the 2x120 A rated TISP61089B. However, if the testing
is done at or near 25 °C, the TISP61089BSD will survive with an RS value of 25 Ω as the 2/10 rating is 170 A at this temperature.
Table 2. Second-Level Surge Current
Surge
#
Waveshape
Open-circuit
Short-circuit
No
Voltage
Current
of
V
A
Tests
Test
Primary
Connections
Fitted
Generator
TISP61089BSD ITM
Fictive
A
Source
Resistance
Rs = 25 Ω
Rs = 40 Ω
2x143
2x100
Ω
1
NOTE:
2/10
5000
500
+1, -1
Longitudinal
No
10
1. If the equipment contains a voltage-limiting secondary protector, the test is repeated at a voltage just below the threshold of
limiting.
SEPTEMBER 2005 - REVISED MAY 2007
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
TISP61089BSD High Voltage Ringing SLIC Protector
‘1089 Section 4.5.9 - Intra-Building Lightning Surge Testing
This test is for network equipment ports that do not serve outside lines. Table 3 shows the 2/10 tests used for this section. Dedicated intrabuilding ports may use an RS value of 8 Ω. The 8 Ω value is set by the intra-building second level a.c. testing of Section 4.5.16. Columns 9, 10
and 11 show the resultant currents for RS values of 8 Ω, 25 Ω and 40 Ω. The listed currents are lower than the TISP61089BSD current rating of
2x120 A and the TISP61089BSD will survive these tests.
Table 3. Intra-building Lightning Surge Currents
Surge
#
Waveshape
Open-circuit
Short-circuit
No
Voltage
Current
of
V
A
Tests
Test
Primary
Connections
Fitted
Generator
TISP61089BSD ITM
Fictive
A
Source
Resistance
Rs = 8 Ω
Rs = 25 Ω
Rs = 40 Ω
Ω
1
2/10
800
100
+1, -1
Transverse
NA
8
50
24
17
2
2/10
1500
100
+1, -1
Longitudinal
NA
15
2x65
2x38
2x27
NOTE:
1. If the equipment contains a voltage-limiting secondary protector, the test is repeated at a voltage just below the threshold of
limiting.
‘1089 Section 4.5.11 - Current-Limiting Protector Testing
Equipment that allows unacceptable current to flow during power faults (Figure 16) shall be specified to use an appropriate current-limiting
protector. The equipment performance can be determined by testing with a series fuse, which simulates the safe current levels of a telephone
cable. If this fuse opens, the equipment allows unacceptable current flow and an external current-limiting protector must be specified. For
acceptable currents, the equipment must not allow current flows for times that would operate the simulator. The wiring simulator fuse currenttime characteristic shall match the boundary of Figure 16. A Bussmann MDQ-16/10 fuse often specified as meeting this requirement, Figure 17.
MDQ-16/10 OPERATING CURRENT
vs
AVERAGE MELT TIME
TI6LAH
80
70
60
50
80
70
60
50
40
40
30
25
30
25
Current — A rms
Current — A rms
'1089 WIRING SIMULATOR CURRENT
vs
TIME
TI6LAG
20
UNACCEPTABLE
REGION
15
10
8
7
6
5
ACCEPTABLE
REGION
4
20
UNACCEPTABLE
REGION
15
10
MDQ-16/10
8
7
6
5
4
3
2.5
3
2.5
2
0.01
0.1
1
10
t - Current Duration - s
100
Figure 16. Wiring Simulator Current-Time
1000
2
0.01
0.1
1
10
t - Current Duration - s
100
1000
Figure 17. MDQ-16/10 Current-Time
SEPTEMBER 2005 - REVISED MAY 2007
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
TISP61089BSD High Voltage Ringing SLIC Protector
‘1089 Section 4.5.11 - Current-Limiting Protector Testing (Continued)
The test generator has a voltage source that can be varied from zero to 600 V rms and an output resistance of 20 Ω to each conductor. Table 4
shows the range of currents conducted by the TISP61089BSD.
Table 4. Wiring Simulator Testing
AC Duration
s
Open-Circuit
Short-Circuit
RMS Voltage
RMS Current
V
A
0 to 600
0 to 30
900
Test
Primary
Connections
Fitted
Transverse & Longitudinal
No
Source
TISP61089BSD ITM
Resistance
A (peak)
Ω
Rs = 25 Ω
Rs = 40 Ω
20
0 to 2x19
0 to 2x14
‘1089 Section 4.5.12 - First-Level Power Fault Testing
Table 5 shows the nine tests used for this section. The TISP61089BSD will survive these peak current values as they are lower than the
TISP61089BSD current-time ratings.
Table 5. First-Level Power Fault Currents
Open-circuit
Short-circuit
No
RMS Voltage
RMS Current
of
V
A
Tests
900
50
0.33
1
2
900
100
0.17
1
200
0.33
60
3
1
400
0.67
60
600
1.00
60
Test
AC Duration
#
s
1
4
1
1000
1
60
5
5
600
0.09
60
6
30
600
0.5
1
7
2
600
2.2
1
8
1
600
3.0
1
9
0.5
1000
5
1
Test
Primary
Connections
Fitted
Transverse &
Longitudinal
Transverse &
Longitudinal
Transverse &
Longitudinal
Source
Resistance
TISP61089BSD ITM
A (peak)
Ω
Rs = 25 Ω
Rs = 40 Ω
No
150
2x0.40
2x0.37
No
600
2x0.23
2x0.22
2x0.45
2x0.44
No
600
2x0.90
2x0.89
2x1.36
2x1.33
Longitudinal
Yes
1000
2x1.38
2x1.30
Differential
No
Capacitive
2x0.12
2x0.12
No
1200
2x0.69
2x0.68
No
273
2x2.85
2x2.71
No
200
2x3.77
2x3.54
Yes
200
2x6.28
2x5.89
Transverse &
Longitudinal
Transverse &
Longitudinal
Transverse &
Longitudinal
Longitudinal
NOTES: 1. If the equipment contains a voltage-limiting device or a current-limiting device, tests 1, 2 and 3 are repeated at a level just below
the thresholds of the limiting devices.
2. Test 5 uses a special circuit with transformer coupled a.c. and capacitive feed.
3. Tests 1 through 5 are requirements and the equipment shall not be damaged after these tests.
4. Tests 6 through 9 are desirable objectives and the equipment can be damaged after these tests.
‘1089 Section 4.5.13 - Second-Level Power Fault Testing for Central Office Equipment
Table 6 shows the five tests used for this section. Columns 9 and 10 show the prospective currents for these tests using RS values of 25 Ω and
40 Ω. The two most stressful tests of this section are test 1 and test 2. As shown in Table 6, the peak currents for these tests are 2x17 A and
2x7.7 A respectively. With the exception of test 5, all the other tests require the series overcurrent protection to operate before the
TISP61089BSD current-time ratings are exceeded. In the case of test 2, with an RS of 25 Ω, the overcurrent protection must operate within the
initial a.c. half cycle to prevent damage.
SEPTEMBER 2005 - REVISED MAY 2007
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
TISP61089BSD High Voltage Ringing SLIC Protector
‘1089 Section 4.5.13 - Second-Level Power Fault Testing for Central Office Equipment (Continued)
Table 6. Second-Level Power Fault Currents
Test
AC Duration
#
s
1
900
Open-circuit
Short-circuit
No
RMS Voltage
RMS Current
of
V
A
Tests
120
25
277
Test
Primary
Connections
Fitted
1
Transverse &
1
Longitudinal
2
5
600
60
1
3
5
600
7
1
4
900
100 to
0.37 to
Transverse &
600
2.2
Longitudinal
5
900
600
0.09
Longitudinal
Transverse &
Longitudinal
60
Differential
A (peak)
Ω
Rs = 25 Ω
Rs = 40 Ω
5
2x5.78
2x3.8
11
2x11
2x7.7
No
10
2x24
2x17
No
86
2x7.7
2x6.8
No
270
2x2.9
2x2.7
No
Capacitive
2x0.09
2x0.09
No
Transverse &
TISP61089BSD ITM
Source
Resistance
NOTES: 1. If the equipment contains a voltage-limiting device or a current-limiting device, these tests are repeated at a level just below the
thresholds of the limiting devices.
2. Test 5 uses a special circuit with transformer coupled a.c. and capacitive feed.
‘1089 Section 4.5.15 - Second-Level Power Fault Testing for Equipment Located on the Customer Premise
This test, Table 7, is for network equipment located on the customer premises. The purpose is to ensure that the feed wiring does not become
a hazard due to excessive current. This testing is similar to the Section 4.5.11 testing. If the equipment is directly wired, the wiring simulator
described in Section 4.5.11 is replaced by a one-foot section of 26 AWG wrapped in cheesecloth. The equipment fails if an open circuit occurs
or the cheesecloth is damaged. Table 7 shows the test conditions for this section. Columns 7 and 8 show the prospective currents using RS
values of 25 Ω and 40 Ω. For the TISP61089BSD to survive, the series overcurrent protection to operate before the TISP61089BSD current-time
ratings are exceeded.
Table 7. Customer Premise Wiring Simulator Testing
AC Duration
s
Open-circuit
Short-circuit
RMS Voltage
RMS Current
V
A
0 to 600
0 to 30
900
NOTE:
Test
Primary
Connections
Fitted
Transverse & Longitudinal
No
TISP61089BSD ITM
Source
A (peak)
Resistance
Ω
Rs = 25 Ω
Rs = 40 Ω
20
0 to 2x19
0 to 2x14
1. If the equipment interrupts the current before the 600 V rms level is reached a second piece of equipment is tested. The second
piece of equipment shall withstand 600 V rms applied for 900 s without causing a hazard.
‘1089 Section 4.5.16 - Second-Level Intra-Building Power Fault Testing for Equipment Located on the Customer Premise
This test, Table 8, is for network equipment ports that do not serve outside lines. For standard plugable premise wiring, the wiring simulator
fuse shall be used for testing. Where direct wiring occurs, the simulator shall consist of a length of the wire used wrapped in cheesecloth. The
equipment fails if a hazard occurs or a wiring simulator open circuit occurs or the cheesecloth is damaged.
Table 8. Second-level Power Fault Currents
Test
AC Duration
#
s
1
900
NOTE:
Open-circuit
Short-circuit
RMS Voltage
RMS Current
V
A
120
25
No of
Test
Primary
Tests
Connections
Fitted
1
Transverse &
Longitudinal
No
Source
Resistance
Ω
5
TISP61089BSD ITM A (peak)
Rs = 8 Ω
Rs = 25 Ω
Rs = 40 Ω
2x13
2x5.7
2x3.8
1. If the equipment contains a voltage-limiting device or a current-limiting device, these tests are repeated at a level just below the
thresholds of the limiting devices.
SEPTEMBER 2005 - REVISED MAY 2007
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
TISP61089BSD High Voltage Ringing SLIC Protector
‘1089 Section 4.5.16 (Continued)
Dedicated intra-building ports may use an RS value of 8 Ω. The 8 Ω value limits the initial current to 13 A, which is within the TISP61089BSD
single cycle rating. For the TISP61089BSD to survive the full 900 s test, the series overcurrent protection has to operate before the
TISP61089BSD current-time ratings are exceeded.
Overcurrent and Overvoltage Protection Coordination
To meet ‘1089, the overcurrent protection must be coordinated with the requirements of Sections 4.5.7, 4.5.8, 4.5.9, 4.5.12, 4.5.13, 4.5.15 and
the TISP61089BSD. The overcurrent protection must not fail in the first level tests of Sections 4.5.7, 4.5.9 and 4.5.12 (tests 1 through 5). Test 6
through 9 of Section 4.5.12 are not requirements. The test current levels and their duration are shown in Figure 18. First level tests have a high
source resistance and the current levels are not strongly dependent on the TISP61089BSD series resistor value.
Second-level tests have a low source resistance and the current levels are dependent on the TISP61089BSD RS resistor value. The two
stepped lines at the top of Figure 18 are for the 25 Ω and 40 Ω series resistor cases. The unacceptable current region (Section 4.5.11) is also
shown in Figure 18. If current flows for the full second-level test time the unacceptable current region will be entered. The series overcurrent
protector must operate before the unacceptable region is reached.
MAXIMUM RMS CURRENT
vs
TIME
30
AI6XAKB
50
40
30
Second Level Tests, 25 Ω
10
7
5
Second Level
Tests, 40 Ω
3
Objective
First Level
Tests # 6
through 9
2
1
0.7
0.5
First Level
0.3
through 5,
0.2
25 Ω & 40 Ω
0.1
0.01
Unacceptable
Tests # 1
0.1
1
10
100
Time - s
Figure 18. '1089 Test Current Levels
1000
Peak 50 Hz / 60 Hz Current — A
Maximum RMS Current - A
20
PEAK AC
vs
CURRENT DURATION
Second Level
Tests, 25 Ω
AI6XDM
Unacceptable
20
15
Second Level
Tests, 40 Ω
10
8
6
5
4
3
VGG = -60 V
2
1.5
1
0.8
0.6
0.5
0.4
0.3
0.2
0.15
0.01
First Level
Tests # 1
through 5,
25 Ω & 40 Ω
0.1
VGG = -120 V
1
10
100
t — Current Duration — s
1000
Figure 19. TISP61089BSD Overlay
Fusible overcurrent protectors cannot operate at first level current levels. Thus the permissible low current time-current boundary for fusible
overcurrent protectors is formed by the first-level test currents. Automatically resetable overcurrent protectors (e.g. Positive Temperature
Coefficient Thermistors) may operate during first level testing, but normal equipment working must be restored after the test has ended.
At system level, the high current boundary is formed by the unacceptable region. However, component and printed wiring, PW, current
limitations will typically lower the high current boundary. Although the series line feed resistance, RS, limits the maximum available current in
second-level testing, after about 0.5 s this limitation will exceed the acceptable current flow values.
These three boundaries, first-level, second-level and unacceptable, are replotted in terms of peak current rather than rms current values in
Figure 19. Using a peak current scale allows the TISP61089BSD longitudinal current rating curves (Figure 3) to be added to Figure 19.
Assuming the PW is sized to adequately carry any currents that may flow, the high current boundary for the overcurrent protector is formed by
the TISP61089BSD rated current. Note that the TISP61089BSD rated current curve also depends on the value of gate supply voltage
SEPTEMBER 2005 - REVISED MAY 2007
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
TISP61089BSD High Voltage Ringing SLIC Protector
Overcurrent and Overvoltage Protection Coordination (Continued)
The overcurrent protector should not allow current-time durations greater than the TISP61089BSD current ratings otherwise the
TISP61089BSD may fail. A satisfactory fusible resistor performance is shown in Figure 20. The line feed resistor (LFR) current-time curve is
above the first level currents and below the TISP61089BSD rated current for VGG > -100 V. This particular curve is for a Bourns® 4B04B-523-400
2 x 40 Ω, 2 % tolerance, 0.5 % matched resistor module. Fusible resistors are also available with integrated thermal fuses or PTC thermistors.
Thermal fuses will cause a rapid drop in the operating current after about 10 s. Figure 20 shows the fused LFR curve for a Bourns® 4B04B-524400 2 x 40 Ω, 2 % tolerance, 0.5 % matched resistor module with an integrated thermal fuse links. The Bourns® 4B04B-524-400 allows the
TISP61089BSD to operate down to its full rated voltage of VGG = -155 V. An LFR with integrated PTC thermistors will give an automatically
resetable current limiting function for all but the highest currents.
PEAK AC
vs
CURRENT DURATION
AI6XDKA
Peak 50 Hz / 60 Hz Current — A
50
40
30
20
15
10
8
6
5
4
3
VGG = -120 V
VGG = -60 V
2
1.5
LFR
1
0.8
0.6
0.5
0.4
0.3
First Level
0.2
0.15
0.01
Tests # 1
Fused LFR
through 5,
25 Ω & 40 Ω
0.1
1
10
100
t — Current Duration — s
1000
Figure 20. Line Feed Resistor - with and without Thermal Fuse
Ceramic PTC thermistors are available in suitable ohmic values to be used as the series line feed resistor RS. Figure 21 overlays a typical
ceramic PTC thermistor operating characteristic. Some of the first level tests will cause thermistor operation. Generally the resistance matching
stability of the two PTC thermistors after power fault switching lightning will meet the required line balance performance.
Ceramic PTC thermistors reduce in resistance value under high voltage conditions. Under high current impulse conditions the resistance can
be less than 50 % of the d.c. resistance. This means that more current than expected will flow under high voltage impulse conditions. The
manufacturer should be consulted on the 2/10 currents conducted by their product under ‘1089 conditions. To keep the 2/10 current below
120 A may need an increase of the PTC thermistor d.c. resistance value to 50 Ω or more. In controlled temperature environments, where the
temperature does not drop below freezing, the TISP61089BSD 2/10 capability is about 170 A, and this would allow a lower value of resistance.
Generally polymer PTC thermistors are not available in sufficiently high ohmic values to be used as the only line feed resistance. To meet the
required resistance value, an addition (fixed) series resistance can be used. Figure 22 overlays a typical polymer PTC thermistor operating
characteristic. Compared to ceramic PTC thermistors, the lower thermal mass of the polymer type will generally give a faster current reduction
time than the ceramic type. However, in this case the polymer resistance value is much less than the ceramic value. For the same current level,
the dissipation in the polymer thermistor is much less than the ceramic thermistor. As a result the polymer thermistor is slower to operate than
the ceramic one.
The resistance stability of polymer PTC thermistors is not as good as ceramic ones. However, the thermistor resistance change will be diluted
by additional series resistance. If a SLIC with adaptive line balance is used, thermistor resistance stability may not be a problem. Polymer PTC
thermistors do not have a resistance decrease under high voltage conditions.
SEPTEMBER 2005 - REVISED MAY 2007
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
TISP61089BSD High Voltage Ringing SLIC Protector
Overcurrent and Overvoltage Protection Coordination (Continued)
PEAK AC
vs
CURRENT DURATION
AI6XDIA
20
15
VGG = -120 V
VGG = -60 V
1.5
1
0.8
0.6
0.5
0.4
0.3
0.2
0.15
0.01
First Level
Tests # 1
through 5,
25 Ω & 40 Ω
0.1
1
10
100
t — Current Duration — s
Figure 21. Ceramic PTC Thermistor
SEPTEMBER 2005 - REVISED MAY 2007
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
1000
AI6XDJA
50
40
30
Peak 50 Hz / 60 Hz Current — A
Peak 50 Hz / 60 Hz Current — A
50
40
30
10
8
6
5
4
3 Ceramic PTC
2 Thermistor
PEAK AC
vs
CURRENT DURATION
20
15
10
8
6
5
4
3
VGG = -120 V
Polymer PTC
Thermistor
VGG = -60 V
2
1.5
1
0.8
0.6
0.5
0.4
0.3
0.2
0.15
0.01
First Level
Tests # 1
through 5,
25 Ω & 40 Ω
0.1
1
10
100
t — Current Duration — s
Figure 22. Polymer PTC Thermistor
1000
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+41-41-7685555
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Phone
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+886-2-25624117
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+41-41-7685510
+886-2-25624116
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Bourns® products are available through an extensive network of manufacturer’s representatives, agents and distributors.
To obtain technical applications assistance, a quotation, or to place an order, contact a Bourns representative in your area.
“TISP” is a trademark of Bourns, Ltd., a Bourns Company, and is Registered in U.S. Patent and Trademark Office.
“Bourns” is a registered trademark of Bourns, Inc. in the U.S. and other countries.
COPYRIGHT© 2005, BOURNS, INC. LITHO IN U.S.A. e 10/05 TSP0505
SEPTEMBER 2005 - REVISED MAY 2007
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.