MCP2210 Evaluation Kit User's Guide

MCP2210
Evaluation Kit
User’s Guide
© 2012 Microchip Technology Inc.
DS52057A
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Printed on recycled paper.
ISBN: 978-1-62076-118-2
QUALITY MANAGEMENT SYSTEM
CERTIFIED BY DNV
== ISO/TS 16949 ==
DS52057A-page 2
Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
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analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
© 2012 Microchip Technology Inc.
MCP2210 EVALUATION KIT
USER’S GUIDE
Table of Contents
Preface ........................................................................................................................... 5
Introduction............................................................................................................ 5
Document Layout .................................................................................................. 5
Conventions Used in this Guide ............................................................................ 6
Recommended Reading........................................................................................ 7
The Microchip Web Site ........................................................................................ 7
Customer Support ................................................................................................. 7
Document Revision History ................................................................................... 7
Chapter 1. Product Overview
1.1 Introduction ..................................................................................................... 9
1.2 MCP2210 Evaluation Kit General Description ................................................ 9
1.3 What The MCP2210 Evaluation Kit Includes ................................................. 9
Chapter 2. Installation and Operation
2.1 Introduction ................................................................................................... 11
2.2 Kit Setup ....................................................................................................... 11
2.3 Board Operation ........................................................................................... 12
2.4 MCP2210 Typical Usage Scenarios ............................................................. 17
Appendix A. Schematic and Layouts
A.1 Introduction .................................................................................................. 19
A.2 MCP2210 Breakout Board Schematic and Layouts ..................................... 20
A.3 MCP2210 SPI Slave Motherboard Schematic and Layouts ........................ 27
Appendix B. Bill of Materials
Worldwide Sales and Service .................................................................................... 36
© 2012 Microchip Technology Inc.
DS52057A-page 3
MCP2210 Evaluation Kit User’s Guide
NOTES:
DS52057A-page 4
© 2012 Microchip Technology Inc.
MCP2210 EVALUATION KIT
USER’S GUIDE
Preface
NOTICE TO CUSTOMERS
All documentation becomes dated, and this manual is no exception. Microchip tools and
documentation are constantly evolving to meet customer needs, so some actual dialogs
and/or tool descriptions may differ from those in this document. Please refer to our web site
(www.microchip.com) to obtain the latest documentation available.
Documents are identified with a “DS” number. This number is located on the bottom of each
page, in front of the page number. The numbering convention for the DS number is
“DSXXXXXA”, where “XXXXX” is the document number and “A” is the revision level of the
document.
For the most up-to-date information on development tools, see the MPLAB® IDE online help.
Select the Help menu, and then Topics to open a list of available online help files.
INTRODUCTION
This chapter contains general information that will be useful to know before using the
MCP2210 Evaluation Kit. Items discussed in this chapter include:
•
•
•
•
•
•
Document Layout
Conventions Used in this Guide
Recommended Reading
The Microchip Web Site
Customer Support
Document Revision History
DOCUMENT LAYOUT
This document describes how to use the MCP2210 Evaluation Kit as a development
tool. The manual layout is as follows:
• Chapter 1. “Product Overview” – Important information about the MCP2210
Evaluation Kit
• Chapter 2. “Installation and Operation” – Covers the initial set-up of this board
and Graphical User Interface (GUI)
• Appendix A. “Schematic and Layouts” – Shows the schematic and board
layouts for the MCP2210 Evaluation Kit User’s Guide
• Appendix B. “Bill of Materials” – Lists the parts used to populate the MCP2210
Evaluation Kit
© 2012 Microchip Technology Inc.
DS52057A-page 5
MCP2210 Evaluation Kit User’s Guide
CONVENTIONS USED IN THIS GUIDE
This manual uses the following documentation conventions:
DOCUMENTATION CONVENTIONS
Description
Arial font:
Italic characters
Initial caps
Quotes
Underlined, italic text with
right angle bracket
Bold characters
N‘Rnnnn
Text in angle brackets < >
Courier New font:
Plain Courier New
Represents
Referenced books
Emphasized text
A window
A dialog
A menu selection
A field name in a window or
dialog
A menu path
MPLAB® IDE User’s Guide
...is the only compiler...
the Output window
the Settings dialog
select Enable Programmer
“Save project before build”
A dialog button
A tab
A number in verilog format,
where N is the total number of
digits, R is the radix and n is a
digit.
A key on the keyboard
Click OK
Click the Power tab
4‘b0010, 2‘hF1
Italic Courier New
Sample source code
Filenames
File paths
Keywords
Command-line options
Bit values
Constants
A variable argument
Square brackets [ ]
Optional arguments
Curly brackets and pipe
character: { | }
Ellipses...
Choice of mutually exclusive
arguments; an OR selection
Replaces repeated text
Represents code supplied by
user
DS52057A-page 6
Examples
File>Save
Press <Enter>, <F1>
#define START
autoexec.bat
c:\mcc18\h
_asm, _endasm, static
-Opa+, -Opa0, 1
0xFF, ‘A’
file.o, where file can be
any valid filename
mcc18 [options] file
[options]
errorlevel {0|1}
var_name [,
var_name...]
void main (void)
{ ...
}
© 2012 Microchip Technology Inc.
Preface
RECOMMENDED READING
This user's guide describes how to use MCP2210 Evaluation Kit. Other useful
documents are listed below. The following Microchip documents are available and
recommended as supplemental reference resources.
• MCP2210 Data Sheet - “USB-to-SPI Protocol Converter with GPIO (Master
Mode)” (DS22288)
THE MICROCHIP WEB SITE
Microchip provides online support via our web site at www.microchip.com. This web
site is used as a means to make files and information easily available to customers.
Accessible by using your favorite Internet browser, the web site contains the following
information:
• Product Support – Data sheets and errata, application notes and sample
programs, design resources, user’s guides and hardware support documents,
latest software releases and archived software
• General Technical Support – Frequently Asked Questions (FAQs), technical
support requests, online discussion groups, Microchip consultant program
member listing
• Business of Microchip – Product selector and ordering guides, latest Microchip
press releases, listing of seminars and events, listings of Microchip sales offices,
distributors and factory representatives
CUSTOMER SUPPORT
Users of Microchip products can receive assistance through several channels:
•
•
•
•
Distributor or Representative
Local Sales Office
Field Application Engineer (FAE)
Technical Support
Customers should contact their distributor, representative or field application engineer
(FAE) for support. Local sales offices are also available to help customers. A listing of
sales offices and locations is included in the back of this document.
Technical support is available through the web site at: .http://www.microchip.com/support.
DOCUMENT REVISION HISTORY
Revision A (March 2012)
• Initial Release of this Document.
© 2012 Microchip Technology Inc.
DS52057A-page 7
MCP2210 Evaluation Kit User’s Guide
NOTES:
DS52057A-page 8
© 2012 Microchip Technology Inc.
MCP2210 EVALUATION KIT
USER’S GUIDE
Chapter 1. Product Overview
1.1
INTRODUCTION
This chapter provides an overview of the MCP2210 Evaluation Kit and covers the
following topics:
• MCP2210 Evaluation Kit General Description
• What The MCP2210 Evaluation Kit Includes
1.2
MCP2210 EVALUATION KIT GENERAL DESCRIPTION
The MCP2210 Evaluation Kit (ADM00421) is a development and evaluation platform
for the MCP2210 device. The kit is comprised of two connected boards:
• MCP2210 Breakout Board (ADM00419)
• MCP2210 SPI Slave Motherboard (ADM00420)
The MCP2210 SPI Slave Motherboard is designed to work together with the MCP2210
Breakout Board (ADM00419). The motherboard provides the test-points required for
measurements. It also contains the following SPI slave devices:
•
•
•
•
MCP23S08 – 8-bit I/O expander
MCP3204 – 4 channel, 12-bit ADC
25LC02 – 2 kbit EEPROM
TC77 – Temperature sensor
All devices are SPI slaves, controlled by the MCP2210.
Windows®-based PC software is used to evaluate/demonstrate the MCP2210 as a
USB-to-SPI (Master) device. It allows I/O control and custom device configuration. The
software is downloadable from the board web page on www.microchip.com.
A DLL package is also available for development of custom PC applications using the
MCP2210. The DLL package is downloadable from the board’s web page.
1.3
WHAT THE MCP2210 EVALUATION KIT INCLUDES
The MCP2210 Evaluation Kit includes (ADM00421):
•
•
•
•
MCP2210 Breakout Board (ADM00419)
MCP2210 SPI Slave Motherboard (ADM00420)
Mini-USB cable
Important Information Sheet
© 2012 Microchip Technology Inc.
DS52057A-page 9
MCP2210 Evaluation Kit User’s Guide
NOTES:
DS52057A-page 10
© 2012 Microchip Technology Inc.
MCP2210 EVALUATION KIT
USER’S GUIDE
Chapter 2. Installation and Operation
2.1
INTRODUCTION
The MCP2210 Evaluation Kit is designed to demonstrate the device as a USB-to-SPI
(Master) bridge solution.
The Evaluation Kit is comprised of two boards that have the following features:
• MCP2210 Breakout Board:
- Small plug-in board with DIP form factor (0.6 inches overall row spacing
between pins)
- Mini-USB connector
- Access to the SPI bus and all GP signals
- PICkit™ Serial Analyzer compatible header
- 3.3 or 5V jumper selectable VDD; the Breakout Board can be used to supply
up to 500 mA to the rest of the system
• MCP2210 SPI Slave Motherboard:
- Socket for plugging in the MCP2210 Breakout Board
- Test-points for the SPI bus and GP signals
- PICkit™ Serial Analyzer header (it can be used to access only one of the SPI
slave chips present on this board – MCP23S08)
- 8-bit I/O expander (MCP23S08) with eight LEDs
- Four channel, 12-bit ADC (MCP3204) – a potentiometer is used to vary the
voltage on the Channel 1 ADC input
- 2 kbit EEPROM – 25LC02
- Temperature sensor – TC77
2.2
KIT SETUP
Follow these steps to set up the MCP2210 Evaluation Kit:
1. Download the support material (PC applications and DLL libraries) that can be
found on the board’s page (www.microchip.com/mcp2210evaluationkit).
2. Plug the MCP2210 Breakout Board into the MCP2210 SPI Slave Motherboard.
3. Connect the MCP2210 Breakout Board to a PC via a USB port.
4. The system will automatically install the driver for this board. When the
installation is complete, the board is ready for operation.
5. Install the downloaded PC software.
6. Start the demo application and exercise the SPI slave chip’s features.
© 2012 Microchip Technology Inc.
DS52057A-page 11
MCP2210 Evaluation Kit User’s Guide
2.3
BOARD OPERATION
The MCP2210 device is detected by a Windows®-based PC host as a Human Interface
Device (HID). The accompanying software can be used to exercise the Evaluation Kit’s
features. It also provides a reference point for users that want to create custom
applications based on the MCP2210.
2.3.1
MCP2210 Breakout Board Operation
The MCP2210 Breakout Board can be used with either the provided motherboard, or
as a stand-alone USB-to-SPI (Master) bridge module. The breakout board provides all
the required signals in order to assist the user in building customized boards using the
MCP2210.
The breakout board has the following features:
• SPI bus signals (MOSI, MISO, SCK)
• 9 GP signals configurable for:
- GPIO functionality (digital input or output pins)
- Chip Select functionality (working with the SPI bus signals)
- Dedicated function pins
• Jumper selectable power supply: 3.3 or 5V (up to 500 mA). The board has a
default connection trace between VDD and 3.3V rail, making the voltage header
mounting unnecessary when powering the board with 3.3V. For 5V operation, a
3-pin header must be mounted on the board.
• PICkit™ Serial Analyzer header using GP4 as the Chip Select signal
Note:
This function is available only on SPI operations, it does not work on I2C or
UART signals.
• Dip form-factor (0.6 inches overall row spacing between pins)
By using the provided software and libraries, the user can create personalized PC
applications using the breakout board as a USB-to-SPI (Master) bridge adapter.
2.3.2
MCP2210 Breakout Board Operation
The MCP2210 Utility software was created for custom device setting requirements. A
few of the settings that this utility can alter include VID, PID, power requirements, and
string descriptors. A download link for this software can be found on the board web
page. For instructions on the use of this software, refer to the software’s supporting
documentation included within the application install package.
2.3.3
SPI Terminal Utility
The SPI Terminal Utility is a tool that allows low-level data exchange at the SPI bus
level. This application is useful for low-level communication and troubleshooting
between the MCP2210 and various SPI slave modules.
The utility window has different sections for GP designation, SPI transfer parameters
and user data area.
DS52057A-page 12
© 2012 Microchip Technology Inc.
Installation and Operation
FIGURE 2-1:
SPI TERMINAL UTILITY WINDOW
SPI user data
section
GP Settings Section
HEX/Decimal
user data
mode
SPI Transfer
Parameters
Section
Status messages
Transfer Data button
GP Direct
Settings section
After the application is started, the state of the connection with the MCP2210 is shown
in the Status Messages bar (in the lower left corner of the screen).
The user can establish the GP configuration. The GPs can be used as chip select pins.
Each GP Active and Idle value can be established by selecting the appropriate checkboxes, or by directly supplying the correct value in the GP Direct Settings section. The
same behavior applies to the GP designation (the GP designation can be established
by clicking the appropriate radio-button, or by directly supplying the GP designation
value in the GP settings Direct Values section).
The SPI settings pertaining to the needed SPI transfer can be established in the SPI
Parameters section.
The data to be sent out is filled in the Tx Data field. To send the data to the SPI slave
device, press the SPI Transfer Data button on the lower right area of the screen. The
data received from the SPI slave device is displayed in the Rx Data field.
The user data can be supplied in either HEX or Decimal mode. This can be
accomplished by selecting the HEX mode checkbox. The data in the Tx and Rx Data
fields will be displayed in HEX or Decimal.
© 2012 Microchip Technology Inc.
DS52057A-page 13
MCP2210 Evaluation Kit User’s Guide
A simple test using the SPI Terminal utility shows how the MCP23S08 (an 8-bit I/O
expander) uses the GP4 pin of the MCP2210 device as a chip select line. This line
should be active low. The GP4 must be set as in the Figure 2-1, with the IDLE option
checked (IDLE value is logic ‘1’) and the ACTIVE option unchecked (ACTIVE value is
logic ‘0’).
The SPI parameters are set as follows:
•
•
•
•
Bit rate - 500000 bps
SPI Mode – 0
Number of bytes to transfer – 3
All the SPI related delays are set to 0
The TX Data should contain the following HEX values: 40, 00, 00. Click on the SPI
Transfer Data button to complete the procedure and set the MCP23S08’s port as an
output.
After setting this port, a value can be sent out to the port to light the LEDs on the board.
To make this happen, insert the following three HEX values: 40, 0A, FF. By clicking the
SPI Transfer Data button again, the inserted values are sent out to the MCP23S08
device. This command will light all the LEDs on the board. If any other LED light pattern
is desired, the third value (FF) can be changed to any other 8-bit value.
To verify the value written to the MCP23S08’s port, another set of data must be written
into the TX Data area: 41, 0A and any other 8-bit value (a “Don’t care” value for the third
position is admissible, because the read value from the MCP23S08 is received on the
third byte).
In the RX Data field, the third value should be the identical to the one sent out previously (in the given example, FF).
2.3.4
MCP2210 Evaluation Kit demo application
The provided demo application is designed to work with the MCP2210 SPI Slave
Motherboard using the MCP2210 Breakout Board as a USB-to-SPI bridge.
The application’s source code is provided to facilitate the development of custom PC
applications using the MCP2210 and the accompanying DLL package. This application
was written in Visual Basic.
DS52057A-page 14
© 2012 Microchip Technology Inc.
Installation and Operation
FIGURE 2-2:
VISUAL BASIC APPLICATION WINDOW
I/O Expander Section
I/O Expander
Section
Temperature
Sensor
Section
ADC Section
Selected EEPROM Address
The PC GUI shows typical sections for each of the SPI slave devices present on the
MCP2210 SPI Slave Motherboard.
2.3.5
MCP23S08 GPIO Expander controls
The GUI provides specific controls in order to assist the user in exploring the I/O
expander features. The control for this chip shows eight color-coded buttons, each
representing an I/O option.
FIGURE 2-3:
MCP23S08 GPIO EXPANDER SECTION
I/O buttons
Color coded
reference table
for I/O option
By double-clicking on any of the buttons, the assigned I/O pin will toggle from being a
digital input to digital output and back.
For the I/Os designated as digital inputs, any change on the pins will be shown on the
GUI in yellow (for a logic high value) or in blue (for a logic low value).
For the I/Os designated as digital outputs, a single click on any of the I/O circles will
toggle their output value from logic low (in red) to logic high (in green). When a digital
output is set to logic high, the corresponding LED will be lit.
2.3.6
EEPROM 25LC02 Controls
The EEPROM GUI section presents a data-grid control and three buttons (see
Figure 2-4). The data-grid is organized in eight columns and sixty-four rows. The
EEPROM addresses are read from left to right, top to bottom, starting at location 0 (in
© 2012 Microchip Technology Inc.
DS52057A-page 15
MCP2210 Evaluation Kit User’s Guide
the first line, first column on the left). When, a particular cell in the data grid control is
highlighted, the corresponding EEPROM address is displayed in the bottom left corner
of the application window.
FIGURE 2-4:
EEPROM 25LC02 SECTION
Data-grid
controls
Control
buttons
The EEPROM section also shows three buttons:
• Read EEPROM – Press this button to read the entire EEPROM memory. The
content will show in the data-grid control.
• Write EEPROM – The user can modify the data and add other hex-represented
byte values in the cells. When all the modifications are done, press this button to
write the modified data-grid content on the EEPROM.
• Clear Mem – To verify the EEPROM content, press this button. This action clears
only the data-grid control, not the EEPROM contents. Later, when the Read
EEPROM button is pressed again, the actual EEPROM content will display in the
data-grid control.
2.3.7
TC77 Temp Sensor Section
The temperature sensor displays the temperature of the sensor device present on the
motherboard in either Fahrenheit or Celsius scales.
FIGURE 2-5:
TC77
temperature
DS52057A-page 16
TC77 TEMPERATURE SENSOR SECTION
Temperature
unit selection
© 2012 Microchip Technology Inc.
Installation and Operation
2.3.8
MCP3204 ADC Display Section
The MCP3201 12-bit ADC section displays the board’s measured VDD voltage and a
voltage between 0 and VDD/2, corresponding to the voltage value set by the
motherboard potentiometer.
FIGURE 2-6:
MCP3204 ADC VALUES DISPLAY
Motherboard
potentiometer
settings display
(between 0 and
and VDD/2)
VDD voltage
value display
Custom voltage
value display
The remaining channels (channels 2 and 3) can also display custom user
measurements of voltages between 0V – 2.5V (maximum).
2.4
MCP2210 TYPICAL USAGE SCENARIOS
The MCP2210 can be used in systems where an SPI bus is available. The MCP2210
device can be either the single master on the bus, or one of the masters sharing the
bus, if a proper master-access arbitration scheme is in place.
In cases where the MCP2210 is the only master on the SPI bus, a typical usage
scenario is shown in Figure 2-7. The SPI bus links the SPI slave chips to the system,
while a few GPs (configured for chip select function) can be used as chip select lines.
If SPI slave interrupt monitoring is required, the GP6 needs to be configured for its
dedicated function, in order to monitor the interrupts coming from the SPI slave chips.
The PC application will handle all the details necessary for data transfer between the
MCP2210 and the SPI slave devices.
© 2012 Microchip Technology Inc.
DS52057A-page 17
MCP2210 Evaluation Kit User’s Guide
FIGURE 2-7:
MCP2210 TYPICAL USAGE DIAGRAM
MCP2210
USB
USB-to-SPI
bridge
External
Interrupt
(GP6)
SPI bus
MOSI, MISO, SCK
Chip-Select lines
CS0-CS8
SPI slave chip #1
Interrupt
...
SPI slave chip #n
Interrupt
When a system requires more than one SPI master sharing the same bus, an
arbitration scheme needs to be developed, to prevent multiple SPI masters trying to
access the bus at the same time. MCP2210 has support for such a mechanism, using
GP7 and GP8 (configured for dedicated pin functionality) for this purpose.
When GP8 is configured for its dedicated functionality, the pin can be used as a bus
release request for MCP2210 coming from another master. GP7 (configured for its dedicated functionality) is used as an SPI bus release acknowledge signal towards the
requesting master. When an external SPI master requests that the MCP2210 release
the bus, the MCP2210 completes the current SPI transfer (or it can be cancelled by the
PC application by sending the proper USB command). Then it releases the bus, and
signals this event on the acknowledge pin (GP7). The second master now has ownership of the bus and can keep it as long as the SPI bus request pin (GP8) is kept
asserted.
In conclusion, when the dedicated functionality of the GP7 and GP8 are used,
MCP2210 can be used in a multiple SPI master system.
DS52057A-page 18
© 2012 Microchip Technology Inc.
Installation and Operation
FIGURE 2-8:
MCP2210 TYPICAL USAGE DIAGRAM
MCP2210
SPI Bus Release Request
GP8
GP7
USB
USB-toSPI
bridge
External
Interrupt
(GP6)
SPI Bus Release
Acknowledge
SPI bus
MOSI, MISO, SCK
External
Interrupt
Chip-Select lines
SPI slave chip #1
Interrupt
© 2012 Microchip Technology Inc.
SPI Master #2
...
SPI slave chip #n
Interrupt
DS52057A-page 19
MCP2210 Evaluation Kit User’s Guide
NOTES:
DS52057A-page 20
© 2012 Microchip Technology Inc.
MCP2210 EVALUATION KIT
USER’S GUIDE
Appendix A. Schematic and Layouts
A.1
INTRODUCTION
This appendix contains the following schematics and layouts for the MCP2210
Evaluation Kit:
• MCP2210 Breakout Board Schematic and Layouts
- Board – Schematic
- Board – Top Silk and Pads
- Board – Top Silk, Pads and Copper
- Board – Top Pads and Copper
- Board – Bottom Silk and Pads
- Board – Bottom Silk, Pads and Copper
- Board – Bottom Pads and Copper
• MCP2210 SPI Slave Motherboard Schematic and Layouts
- Board – Schematic
- Board – Top Silk
- Board – Top Silk and Copper
- Board – Top Copper
- Board – Bottom Silk
- Board – Bottom Silk and Copper
© 2012 Microchip Technology Inc.
DS52057A-page 19
0.1uF
0603
C4
GND D GND D
4.7uF
0603
C3
5V
U2
GND D
1
2
3
4
5
6
7
J1
MCP1825S-3.3V
1
3
VIN
VOUT
GND
DS52057A-page 20
2
C5
HDR M 1x7 VERT
Left Side Header
GP0
GP1
GP2
GP3
GP4
MOSI
SCK
GND D
0.1uF
0603
VDD
1 2 3 4 5 6
PICkit™ Serial Analyzer Header
HDR M 1x6 VERT
VDD
HDR M 1 x 7 VERT
Right Side Header
GP8
GP7
GP6
GP5
MI SO
GND D
Default connection
between 1 - 2. User to
cut the trace if 5V VDD
is needed.
GND D
J3
J4
1 2 3
5V
22uF
1206
C1
GND D
HDR M1 x 3 VERT
NT1
3.3V
VUSB
VDD
1
2
3
4
5
6
7
J2
3
2
12MHz
X1
GND D
1
TP1
Via_1.2x 0.7
GP0
GP1
GP2
GP3
MOSI
GP4
R1
OSC1
OSC2
RST
VDD
390 5%
0603
1
2
3
4
5
6
7
8
9
10
VSS
D+
DVUSB
GP8
GP7
GP6
MI SO
GP5
SCK
20
19
18
17
16
15
14
13
12
11
GND D
MCP2210
U1
0603
VDD
OSC1
OSC2
RST
GP0
GP1
GP2
GP3
MOSI
GP4
0.1uF
C2
USB_D+
USB_DVUSB
GND D
C6 0603
1uF
J5
GND
ID
D+
D-
VBUS
USB-B-Mini SMD
5
4
3
2
1
GP8
GP7
GP6
MI SO
GP5
SCK
GND D
GND D
USB_D+
USB_D-
5V
A.2.1
GP4
A.2
MISO
SCK
MOSI
VDD
MCP2210 Evaluation Kit User’s Guide
MCP2210 BREAKOUT BOARD SCHEMATIC AND LAYOUTS
Board – Schematic
© 2012 Microchip Technology Inc.
Schematic and Layouts
A.2.2
Board – Top Silk and Pads
© 2012 Microchip Technology Inc.
DS52057A-page 21
MCP2210 Evaluation Kit User’s Guide
A.2.3
Board – Top Silk, Pads and Copper
DS52057A-page 22
© 2012 Microchip Technology Inc.
Schematic and Layouts
A.2.4
Board – Top Pads and Copper
© 2012 Microchip Technology Inc.
DS52057A-page 23
MCP2210 Evaluation Kit User’s Guide
A.2.5
Board – Bottom Silk and Pads
DS52057A-page 24
© 2012 Microchip Technology Inc.
Schematic and Layouts
A.2.6
Board – Bottom Silk, Pads and Copper
© 2012 Microchip Technology Inc.
DS52057A-page 25
MCP2210 Evaluation Kit User’s Guide
A.2.7
Board – Bottom Pads and Copper
DS52057A-page 26
© 2012 Microchip Technology Inc.
GP4
GND
GND
MOSI
MI SO
SCK
GP0
1
J7
1
J5
GP0
0603
GP4
0.1uF
C6
2
5
6
1
1
GP6
VDD
VDD
SI
SO
7
8
4
GND
VDD
0603
4.7uF
0603
0.1uF
C1
VREF
5%
0603
GND
1
2
3
4
5
6
7
8
9
VDD
GP7
GP6
GP5
GP4
GP3
GP2
GP1
GP0
MCP23S08
SCK
SI
SO
A1
A0
RESET
CS
INT
VSS
U1
I/O EXPANDER
VSS
0603
1k
1%
R1
10k
R7
VCC
2
HOLD
3
WP
SCK
MOSI
MI SO
SSCK
SC
K
CS
U2
25LC020
EEPROM
GND
VSS
3
VOUT
U5
MCP1525
VIN
C5
18
17
16
15
14
13
12
11
10
C2
0.1uF
VDD
GND
0603
GND
AGND
MOSI
MOSI
J16
1
1k
2 R15
AGND
1
10k
R17
3
0603
10k 1%
R16
VDD
0603
1k
1%
R2
GND
L D2
GND
L D1
0603
1k
1%
R3
0603
GND
L D3
1k
1%
5%
0603
CH3
J21
J18
CH2
1
0603
1k
1%
R5
GND
L D4
0603
1k
1%
R6
GND
L D5
GND
0603
1k
1%
R8
SCK
MISO
0603
1k
1%
R12
1
0603
R13
1%
0603
1
J23
CH0
HDR M 2x8 VERT
J12
33k
R11
CH1
J22
1
1% R14
1k
0603
1k
1%
R4
2 4 6 8 10 12 14 16
1 3 5 7 9 11 13 15
0603
4.7uF
C7
1
2
1
1
2
J19
1
2
1
2
1
2
1
L D6
GND
2
1
0603
1k
1%
R9
SCK
L D7
GND
L D8
0603
1k
1%
C3
0603
VDD
0.1uF
C4
SCK
MI SO
MOSI
GP1
VREF
0.1uF
8
VDD
7
CS
6
NC
5
NC
TC77 SPI 5V
U4
J1
GP1
1
VDD
14
13
12
11
10
9
8
TEMP
1
SI /O
2
SCK
3
NC
4
VSS
R10
GND
1
J20
MISO
Vdd
Vref
AGND
CLK
Dout
Din
CS/SHDN
U3
MCP3204
ADC
CH0
CH1
CH2
CH3
NC
NC
DGND
J17
1
1
2
3
4
5
6
7
GND
2
1
2
© 2012 Microchip Technology Inc.
J4
GP7
1
0603
L1
GP7
GND
GND
Ferrite Bead 0603
AGND
GND
J11
MI SO
SCK
MOSI
GP4
VDD
GP0
GP1
GP2
GP3
GP4
MOSI
SCK
VDD
GND
1
J15
GND
J13
1
J3
GP5
HDR M 1x7 VERT
GP8
GP7
GP6
GP5
MI SO
GND
1
J9
GP8
GND
Right Side Header
VDD
1
1
J14
VDD
GP6
J8
1
1
J2
GP3
GP2
J6
HDR M 1x6 RA
PICkit™ Serial Analyzer Header
HDR M 1x7 VERT
GP6
GP2
GP3
GP8
GP5
J10
Left Side Header
7 6 5 4 3 2 1
A.3.1
6 5 4 3 2 1
A.3
7 6 5 4 3 2 1
VREF
Schematic and Layouts
MCP2210 SPI SLAVE MOTHERBOARD SCHEMATIC AND LAYOUTS
Board – Schematic
DS52057A-page 27
MCP2210 Evaluation Kit User’s Guide
A.3.2
Board – Top Silk
DS52057A-page 28
© 2012 Microchip Technology Inc.
Schematic and Layouts
A.3.3
Board – Top Silk and Copper
© 2012 Microchip Technology Inc.
DS52057A-page 29
MCP2210 Evaluation Kit User’s Guide
A.3.4
Board – Top Copper
DS52057A-page 30
© 2012 Microchip Technology Inc.
Schematic and Layouts
A.3.5
Board – Bottom Silk
© 2012 Microchip Technology Inc.
DS52057A-page 31
MCP2210 Evaluation Kit User’s Guide
A.3.6
Board – Bottom Silk and Copper
DS52057A-page 32
© 2012 Microchip Technology Inc.
MCP2210 EVALUATION KIT
USER’S GUIDE
Appendix B. Bill of Materials
TABLE B-1:
Qty
BILL OF MATERIALS - MCP2210 BREAKOUT BOARD
Reference
Description_
Manufacturer
Part Number
1
C1
Cap. Cer. 22 uF 10V 20% Y5V 1206
TDK®
3
C2, C4, C5
Cap. Cer. 1 uF 10% 16V X7R 0603
AVX Corporation
0603YC104KAT2A
1
C3
Cap. Cer. 4.7 uF 6.3V 10% X5R 0603
TDK Corporation
C1608X5R0J475K
1
C6
Cap. Cer. 1 uF 16V 10% X7R 0603
TDK Corporation
C1608X7R1C105K
2
J1, J2
DO NOT POPULATE
Conn. Hdr. Male .100 1x7 POS Vert.
TE Connectivity Ltd.
HDR M 1x7 Vertical
1
J3
DO NOT POPULATE
Conn. Hdr. Male .100 1x6 POS Vert.
TE Connectivity Ltd.
HDR M 1x6 Vertical
1
J4
DO NOT POPULATE
Conn. Hdr. Male .100 1x3 POS Vert.
TE Connectivity Ltd.
HDR M 1x3 Vertical
1
J5
Conn. Rcpt. USB Mini B R/A SMD
Hirose Electric Co. Ltd.
UX60SC-MB-5ST(80)
1
PCB
RoHS compliant bare PCB, MCP2210
Breakout Board
—
104-00419
1
R1
Res. 390 Ohm 1/10W 5% 0603 SMD
Panasonic® - ECG
ERJ-3GEYJ391V
1
U1
IC USB-TO-SPI SSOP-20
Microchip Technology
Inc.
MCP2210-I/SS
1
U2
IC LDO Reg. 500 mA 3.3V SOT-223-3
Microchip Technology
Inc.
MCP1825S-3302E/DB
1
X1
Cer. Resonator 12.0 MHz SMD
Murata Electronics®
CSTCE12M0G55-R0
Note 1:
5
C3216Y5V1A226Z
The components listed in this Bill of Materials are representative of the PCB assembly. The released BOM
used in manufacturing uses all RoHS-compliant components.
TABLE B-2:
Qty
Corporation
BILL OF MATERIALS - MCP2210 SPI SLAVE MOTHERBOARD
Reference
Description_
Manufacturer
Part Number
C1, C2, C3,
C4, C6
Cap. Cer. 0.1 uF 50V X7R 10% 0603
TDK Corporation
C1608X7R1H104K
Cap. Cer. 4.7 uF 6.3V 10% X5R 0603
2
C5, C7
TDK Corporation
C1608X5R0J475K
19
J1, J2, J3, J4, PC test point Tin SMD
J5, J6, J7, J8,
J9, J14, J15,
J16, J17, J18,
J19, J20, J21,
J22, J23
Harwin Plc.
S1751-46R
1
J10
Conn. Hdr. Male .100 1x6 Pos. RA
TE Connectivity Ltd.
HDR M 1x6 RA
2
J11, J13
Conn. Hdr. Male .100 1x7 Pos. Vert.
TE Connectivity Ltd.
HDR M 1x7 Vertical
1
J12
Conn. Hdr. Male .100 2x8 Pos. Vert.
TE Connectivity Ltd.
HDR M 2x8 Vertical
Ferrite Chip 47 Ohms 500 mA 0603
®
1
L1
Note 1:
Laird Technologies
LI0603E470R-10
The components listed in this Bill of Materials are representative of the PCB assembly. The released BOM
used in manufacturing uses all RoHS-compliant components.
© 2012 Microchip Technology Inc.
DS52057A-page 33
MCP2210 Evaluation Kit User’s Guide
TABLE B-2:
Qty
BILL OF MATERIALS - MCP2210 SPI SLAVE MOTHERBOARD (CONTINUED)
Reference
Description_
Manufacturer
Part Number
8
LD1, LD2,
LD3, LD4,
LD5, LD6,
LD7, LD8
LED Smartled Red 630 nm 0603
OSRAM Opto
Semiconductors
GmbH.
LS L29K-G1J2-1-0-2-R18-Z
1
PCB
RoHS compliant bare PCB, MCP2210
SPI Slave Motherboard
—
104-00420
13
R1, R2, R3,
R4, R5, R6,
R8, R9, R10,
R12, R13,
R14, R15
Res. 1k Ohm 1/10W 1% 0603 SMD
Panasonic - ECG
ERJ-3EKF1001V
1
R7
Res. 10k Ohm 1/10W 5% 0603 SMD
Panasonic - ECG
ERJ-3GEYJ103V
1
R11
Res. 33k Ohm 1/10W 5% 0603 SMD
Panasonic - ECG
ERJ-3GEYJ333V
1
R16
Res. 10k Ohm 1/10W 1% 0603 SMD
Panasonic - ECG
ERJ-3EKF1002V
1
R17
Trimmer 10K OHM 0.5W TH
Bourns®, Inc.
3386F-1-103TLF
1
U1
IC I/O Expander SPI 8B SOIC-18
Microchip Technology
Inc.
MCP23S08-E/SO
1
U2
IC EEPROM 2k Bit 10 MHz SOIC-8
Microchip Technology
Inc.
25LC020A-I/SN
1
U3
IC ADC 12 BIT 2.7V 4 Ch. SPI SOIC-14 Microchip Technology
Inc.
MCP3204T-CI/SL
1
U4
IC Sensor Thermal SPI 5V SOIC-8
Microchip Technology
Inc.
TC77-5.0MOA
1
U5
IC Volt. Ref. 2.5V SOT-23-3
Microchip Technology
Inc.
MCP1525T-I/TT
Note 1:
The components listed in this Bill of Materials are representative of the PCB assembly. The released BOM
used in manufacturing uses all RoHS-compliant components.
DS52057A-page 34
© 2012 Microchip Technology Inc.
Bill of Materials
NOTES:
© 2012 Microchip Technology Inc.
DS52057A-page 35
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Tel: 66-2-694-1351
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Tel: 39-0331-742611
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Tel: 34-91-708-08-90
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DS52057A-page 36
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Tel: 81-45-471- 6166
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11/29/11
© 2012 Microchip Technology Inc.