Hermetic Packages for Integrated Circuits Ceramic Dual-In-Line Frit Seal Packages (CERDIP) F22.4 MIL-STD-1835 GDIP1-T22 (D-7, CONFIGURATION A) LEAD FINISH c1 22 LEAD CERAMIC DUAL-IN-LINE FRIT SEAL PACKAGE -D- -A- BASE METAL E M -Bbbb S C A-B S -C- S1 0.225 - 5.72 - 0.026 0.36 0.66 2 b1 0.014 0.023 0.36 0.58 3 b2 0.045 0.065 1.14 1.65 - b3 0.023 0.045 0.58 1.14 4 c 0.008 0.018 0.20 0.46 2 c1 0.008 0.015 0.20 0.38 3 D - 1.111 - 28.22 5 E 0.350 0.410 8.89 10.41 5 eA ccc M C A - B S e eA/2 c aaa M C A - B S D S D S NOTES: 1. Index area: A notch or a pin one identification mark shall be located adjacent to pin one and shall be located within the shaded area shown. The manufacturer’s identification shall not be used as a pin one identification mark. 2. The maximum limits of lead dimensions b and c or M shall be measured at the centroid of the finished lead surfaces, when solder dip or tin plate lead finish is applied. 3. Dimensions b1 and c1 apply to lead base metal only. Dimension M applies to lead plating and finish thickness. 4. Corner leads (1, N, N/2, and N/2+1) may be configured with a partial lead paddle. For this configuration dimension b3 replaces dimension b2. 5. This dimension allows for off-center lid, meniscus, and glass overrun. 6. Dimension Q shall be measured from the seating plane to the base plane. 7. Measure dimension S1 at all four corners. 8. N is the maximum number of terminal positions. 9. Dimensioning and tolerancing per ANSI Y14.5M - 1982. 10. Controlling dimension: INCH. 19 NOTES - b2 b MAX 0.014 α A A MIN b A L MAX A Q SEATING PLANE MILLIMETERS MIN M (b) D BASE PLANE SYMBOL b1 SECTION A-A D S INCHES (c) e 0.100 BSC 2.54 BSC - eA 0.400 BSC 10.16 BSC - eA/2 0.200 BSC 5.08 BSC - L 0.125 0.200 3.18 5.08 - Q 0.015 0.070 0.38 1.78 6 S1 0.005 - 0.13 - 7 α 90o 105o 90o 105o - aaa - 0.015 - 0.38 - bbb - 0.030 - 0.76 - ccc - 0.010 - 0.25 - M - 0.0015 - 0.038 2, 3 N 22 22 8 Rev. 0 6/13/95