TEF701X Scalable advanced background receiver Rev. 1 — 30 July 2013 Product short data sheet 1. General description The TEF7016 and TEF7018 are analog single-chip radio background ICs specifically designed for background reception. Both devices support all major global background receiver standards such as Radio Data System (RDS), Radio Broadcast Data System (RBDS), Traffic Message Channel (TMC), DARC (VICS and RTIC) and optional support of digital radio via a co-processor (HD Radio and DRM). The devices are following the industry-proven background receiver TEF7006 and TEF7007 with improved performance and feature set optimizing the total system costs. They are completing NXP Semiconductors Car Radio portfolio to provide an efficient, high performing application. The TEF701X are housed in a HVQFN32 package designed for two- and multi-layer PCB applications. The radio receiver includes the AM/FM front-ends, tuning synthesizer, channel filtering, demodulation, weak signal processing, noise blanking in FM mode, RDS and DARC reception and optional FM multipath improvements. The TEF7018 supports AM and FM, HD Radio and Digital Radio Mondiale (DRM30 and DRM+). The TEF7016 is an FM-only version and supports optionally the digital radio standards FM-HD Radio and DRM+. For both TEF7016 and TEF7018, these digital radio standards are supported when used with NXP Semiconductors’ digital radio coprocessors such as SAF356X and SAF360X. Furthermore the TEF7018 provides the complete feature set including AM IF noise blanking, AM SoftMute on Modulation and the TEF701X provides digital audio output (mono) via I2S. 2. Features and benefits Alignment free digital receiver including tuner and software-defined radio processing Read information with device and tuning status, reception quality and RDS data FM background receiver with a tuning range of 65 MHz to 108 MHz covering Eastern Europe (OIRT), Japan, Europe and US bands AM background receiver (TEF7018) receiver covering LW, MW and full SW Fully integrated tuning system with low phase noise and fast tuning Variable IF bandwidth filtering (FM PACS) and demodulation Baseband I2S output supporting digital radio standards FM-HD Radio and DRM+ (TEF7016) with external digital radio coprocessor TEF701X NXP Semiconductors Scalable advanced background receiver HD Radio and DRM1 (TEF7018) with external digital radio coprocessor AM and FM noise blanking, Signal quality detection and weak signal processing Advanced RDS and RBDS demodulation and decoding Excellent RDS sensitivity performance MPX output supporting an external DARC demodulator and RTIC Two mono audio DACs: one analog output for FM MPX and mono analog audio output. Single 3.3 V supply voltage Fast mode I2C-bus (400 kHz) Configurable GPIO pins for RDS, Quality Status, RDS data available interrupt and generic I2C-bus controlled I/O Qualified in accordance with AEC-Q100 I2S audio output 3. Applications The TEF701X is a background receiver that can be used for Radio Data System (RDS), Radio Broadcast Data System (RBDS), Traffic Message Channel (TMC) and background reception for automotive applications. DARC reception is also supported via the MPX output to VICS/RTIC decoders. When used together with the digital radio coprocessors SAF356X and SAF360X, digital radio standards background reception can be supported. Additionally, due to a common technology platform, the TEF701X can be combined with the TEF665X, TEF668X, SAF775X and SAF360X for optimal system application through common crystal oscillator sharing. 4. Quick reference data Table 1. Quick reference data Symbol Parameter Conditions Min Typ Max Unit Supply voltage VDDA(RF)(3V3) RF analog supply voltage (3.3 V) on pin VDDA_RF 3.0 3.3 3.5 V VDDA(IF)(3V3) IF analog supply voltage (3.3 V) on pin VDDA_IFADC 3.0 3.3 3.5 V VDDD(3V3) digital supply voltage (3.3 V) on pin VDD_DIGITAL 3.0 3.3 3.5 V Current in FM mode IDDA(RF) RF analog supply current on pin VDDA_RF 33 37 42 mA IDDA(IFADC) IF ADC analog supply current on pin VDDA_IFADC 81 94 110 mA IDDD digital supply current on pin VDDD 37 38 48 mA Current in AM - MW/LW mode[1] IDDA(RF) RF analog supply current on pin VDDA_RF 34 40 48 mA IDDA(IFADC) IF ADC analog supply current on pin VDDA_IFADC 63 74 86 mA 1. DRM includes DRM30 and DRM+ (band and ). TEF701X_SDS Product short data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 30 July 2013 © NXP B.V. 2013. All rights reserved. 2 of 8 TEF701X NXP Semiconductors Scalable advanced background receiver Table 1. Quick reference data …continued Symbol Parameter Conditions Min Typ Max Unit IDDD digital supply current on pin VDDD 33 34 46 mA Current in Standby mode IDDA(RF) RF analog supply current on pin VDDA_RF 0 0.3 2 mA IDDA(IFADC) IF ADC analog supply current on pin VDDA_IFADC 25 37 45 mA IDDD digital supply current on pin VDDD 15 24 35 mA [1] TEF7018 only. 5. Ordering information Table 2. Ordering information Type number TEF7016HN/V101 Package Name Description Version HVQFN32 plastic thermal enhanced very thin quad flat package; no leads; 32 terminals; body 5 5 0.85 mm[1] SOT617-3 TEF7018HN/V101 [1] Wettable sides to allow for optical inspection. TEF701X_SDS Product short data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 30 July 2013 © NXP B.V. 2013. All rights reserved. 3 of 8 xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx x x x xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xx xx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxx x x xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxx xxx XTAL OSC DIGITAL TUNING DIVIDERS SYSTEM DCO Rev. 1 — 30 July 2013 All information provided in this document is subject to legal disclaimers. FM BPF TEF701X FM FRONT-END MONO DAC ADC AM BPF NXP Semiconductors TEF701X_SDS Product short data sheet 6. Block diagram RADIO PROCESSING MONO_AUDIO AUDIO PROCESSING DAC MPX_OUT AM FRONT-END(2) IC CONTROL UNIT DR_BCK(2) DR_I_DATA(2) DR_WS(2) DR_Q_DATA(2) (1) GPIO_1 and GPIO_2 are output only. 4 of 8 © NXP B.V. 2013. All rights reserved. Fig 1. Block diagram GPIO_2(1) SCL I2S_WS aaa-001517 TEF701X (2) TEF7016 optionally and TEF7018. GPIO_0 SDA I2S_SD_1 I2S_BCK GPIO_1(1) I2C Scalable advanced background receiver 3.3 V I2S OUTPUT BUFFER DIGITAL RADIO INTERFACE POWER TEF701X NXP Semiconductors Scalable advanced background receiver 7. Limiting values Table 3. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions VDDA(RF)(3V3) RF analog supply voltage (3.3 V) on pin VDDA_RF Min Max Unit 0.5 +3.9 V VDDA(IF)(3V3) IF analog supply voltage (3.3 V) on pin VDDA_IFADC 0.5 +3.9 V VDDD(3V3) digital supply voltage (3.3 V) on pin VDDD 0.5 +3.9 V between pins VDDA_IFADC and VDDA_RF 0.3 +0.3 V 0.5 +VDDD(3V3) + 0.3 V 100 +100 mA VDD(3V3-3V3) supply voltage difference between two 3.3 V supplies Vn voltage on any other pin Ilu latch-up current Vlu latch-up voltage - 1.5 VDDD(3V3) V Tstg storage temperature 55 +150 C Tamb ambient temperature 40 +85 C Tj junction temperature 40 +125 C [1] In accordance with AEC-Q100-004. all supply voltages below the maximum value [1] 8. Revision history Table 4. Revision history Document ID Release date Data sheet status Change notice Supersedes TEF701X_SDS v.1 20130730 Product short data sheet - - TEF701X_SDS Product short data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 30 July 2013 © NXP B.V. 2013. All rights reserved. 5 of 8 TEF701X NXP Semiconductors Scalable advanced background receiver 9. Legal information 9.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 9.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. 9.3 Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP Semiconductors takes no responsibility for the content in this document if provided by an information source outside of NXP Semiconductors. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. TEF701X_SDS Product short data sheet Suitability for use in automotive applications — This NXP Semiconductors product has been qualified for use in automotive applications. Unless otherwise agreed in writing, the product is not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors and its suppliers accept no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer's own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. All information provided in this document is subject to legal disclaimers. Rev. 1 — 30 July 2013 © NXP B.V. 2013. All rights reserved. 6 of 8 TEF701X NXP Semiconductors Scalable advanced background receiver No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. 9.4 Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. NXP Semiconductors ICs with HD Radio functionality are manufactured under license from iBiquity Digital Corporation. Sale or distribution of equipment that includes this device requires a license, which may be obtained at: iBiquity Digital Corporation, 6711 Columbia Gateway Drive, Suite 500, Columbia MD 21046, USA. Telephone: +1 (443) 539 4290, fax: +1 (443) 539 4291, e-mail: [email protected]. Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. Translations — A non-English (translated) version of a document is for reference only. The English version shall prevail in case of any discrepancy between the translated and English versions. Licenses ICs with HD Radio functionality 9.5 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. I2C-bus — logo is a trademark of NXP B.V. HD Radio — is a trademark of iBiquity Digital Corporation. HD Radio — logo is a registered trademark of iBiquity Digital Corporation. 10. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] TEF701X_SDS Product short data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 30 July 2013 © NXP B.V. 2013. All rights reserved. 7 of 8 TEF701X NXP Semiconductors Scalable advanced background receiver 11. Contents 1 2 3 4 5 6 7 8 9 9.1 9.2 9.3 9.4 9.5 10 11 General description . . . . . . . . . . . . . . . . . . . . . . Features and benefits . . . . . . . . . . . . . . . . . . . . Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . Quick reference data . . . . . . . . . . . . . . . . . . . . . Ordering information . . . . . . . . . . . . . . . . . . . . . Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . Revision history . . . . . . . . . . . . . . . . . . . . . . . . . Legal information. . . . . . . . . . . . . . . . . . . . . . . . Data sheet status . . . . . . . . . . . . . . . . . . . . . . . Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . Licenses . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . Contact information. . . . . . . . . . . . . . . . . . . . . . Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1 2 2 3 4 5 5 6 6 6 6 7 7 7 8 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2013. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] Date of release: 30 July 2013 Document identifier: TEF701X_SDS