Order this document by MOC3081/D SEMICONDUCTOR TECHNICAL DATA [IFT = 15 mA Max] GlobalOptoisolator ! [IFT = 10 mA Max] [IFT = 5 mA Max] (800 Volts Peak) *Motorola Preferred Device The MOC3081, MOC3082 and MOC3083 devices consist of gallium arsenide infrared emitting diodes optically coupled to monolithic silicon detectors performing the function of Zero Voltage Crossing bilateral triac drivers. They are designed for use with a triac in the interface of logic systems to equipment powered from 240 Vac lines, such as solid–state relays, industrial controls, motors, solenoids and consumer appliances, etc. STYLE 6 PLASTIC • • • • Simplifies Logic Control of 240 Vac Power Zero Voltage Crossing dv/dt of 1500 V/µs Typical, 600 V/µs Guaranteed To order devices that are tested and marked per VDE 0884 requirements, the suffix ”V” must be included at end of part number. VDE 0884 is a test option. Recommended for 240 Vac(rms) Applications: • Solenoid/Valve Controls • Temperature Controls • Lighting Controls • Static Power Switches • AC Motor Drives • E.M. Contactors • AC Motor Starters • Solid State Relays MAXIMUM RATINGS Rating Symbol Value COUPLER SCHEMATIC 1 6 2 5 ZERO CROSSING CIRCUIT 3 Reverse Voltage VR 6 Volts Forward Current — Continuous IF 60 mA Total Power Dissipation @ TA = 25°C Negligible Power in Output Driver Derate above 25°C PD 120 mW 1.41 mW/°C OUTPUT DRIVER Off–State Output Terminal Voltage VDRM 800 Volts Peak Repetitive Surge Current (PW = 100 µs, 120 pps) ITSM 1 A PD 150 1.76 mW mW/°C VISO 7500 Vac(pk) PD 250 2.94 mW mW/°C Junction Temperature Range TJ – 40 to +100 °C Ambient Operating Temperature Range(2) TA – 40 to +85 °C Tstg – 40 to +150 °C 1 STANDARD THRU HOLE CASE 730A–04 Unit INPUT LED Total Power Dissipation @ TA = 25°C Derate above 25°C 6 4 1. 2. 3. 4. 5. ANODE CATHODE NC MAIN TERMINAL SUBSTRATE DO NOT CONNECT 6. MAIN TERMINAL TOTAL DEVICE Isolation Surge Voltage(1) (Peak ac Voltage, 60 Hz, 1 Second Duration) Total Power Dissipation @ TA = 25°C Derate above 25°C Storage Temperature Range(2) Soldering Temperature (10 s) TL 260 °C 1. Isolation surge voltage, VISO, is an internal device dielectric breakdown rating. 1. For this test, Pins 1 and 2 are common, and Pins 4, 5 and 6 are common. 2. Refer to Quality and Reliability Section in Opto Data Book for information on test conditions. Preferred devices are Motorola recommended choices for future use and best overall value. GlobalOptoisolator is a trademark of Motorola, Inc. REV 1 Optoelectronics Device Data Motorola Motorola, Inc. 1995 1 ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted) Characteristic Symbol Min Typ Max Unit Reverse Leakage Current (VR = 6 V) IR — 0.05 100 µA Forward Voltage (IF = 30 mA) VF — 1.3 1.5 Volts INPUT LED OUTPUT DETECTOR (IF = 0) Leakage with LED Off, Either Direction (VDRM = 800 V(1)) Critical Rate of Rise of Off–State Voltage(3) IDRM1 — 80 500 nA dv/dt 600 1500 — V/µs — — — — — — 15 10 5 VTM — 1.8 3 Volts IH — 250 — µA VINH — 5 20 Volts IDRM2 — 300 500 µA COUPLED LED Trigger Current, Current Required to Latch Output (Main Terminal Voltage = 3 V(2)) MOC3081 MOC3082 MOC3083 IFT Peak On–State Voltage, Either Direction (ITM = 100 mA, IF = Rated IFT) Holding Current, Either Direction Inhibit Voltage (MT1–MT2 Voltage above which device will not trigger) (IF = Rated IFT) Leakage in Inhibited State (IF = Rated IFT, VDRM = 800 V, Off State) 1. 2. 2. 3. mA Test voltage must be applied within dv/dt rating. All devices are guaranteed to trigger at an IF value less than or equal to max IFT. Therefore, recommended operating IF lies between max IFT (15 mA for MOC3081, 10 mA for MOC3082, 5 mA for MOC3083) and absolute max IF (60 mA). This is static dv/dt. See Figure 7 for test circuit. Commutating dv/dt is a function of the load–driving thyristor(s) only. TYPICAL CHARACTERISTICS 1.5 +600 +400 OUTPUT PULSE WIDTH – 80 µs IF = 30 mA f = 60 Hz TA = 25°C 1.4 +200 0 –200 –400 1.2 1.1 1 0.9 0.8 –600 0.7 –800 0.6 0.5 –40 –4 –3 –2 –1 0 1 2 3 VTM, ON–STATE VOLTAGE (VOLTS) Figure 1. On–State Characteristics 2 NORMALIZED TO TA = 25°C 1.3 V INH, NORMALIZED ITM , ON-STATE CURRENT (mA) +800 4 5 –20 0 20 40 60 TA, AMBIENT TEMPERATURE (°C) 80 100 Figure 2. Inhibit Voltage versus Temperature Motorola Optoelectronics Device Data 1.5 1.4 200 1.3 IDRM2, NORMALIZED I DRM1, PEAK BLOCKING CURRENT (mA) 500 100 50 20 VDRM = 800 V IF = RATED IFT 1.2 1.1 1 0.9 0.8 0.7 10 0.6 5 –40 –20 0 20 40 60 80 100 TA, AMBIENT TEMPERATURE (°C) –40 –20 IFT, NORMALIZED 1.5 1.4 NORMALIZED TO TA = 25°C 1.3 1.2 1.1 1 0.9 0.8 0.7 –40 –20 0 20 40 60 TA, AMBIENT TEMPERATURE (°C) 80 100 25 NORMALIZED TO: PWin 100 µs q 20 15 10 5 0 1 Figure 5. Trigger Current versus Temperature +400 Vdc PULSE INPUT APPLIED VOLTAGE WAVEFORM RTEST 5 10 20 PWin, LED TRIGGER PULSE WIDTH (µs) 50 100 1. The mercury wetted relay provides a high speed repeated pulse to the D.U.T. 2. 100x scope probes are used, to allow high speeds and voltages. 3. The worst–case condition for static dv/dt is established by triggering the D.U.T. with a normal LED input current, then removing the current. The variable RTEST allows the dv/dt to be gradually increased until the D.U.T. continues to trigger in response to the applied voltage pulse, even after the LED current has been removed. The dv/dt is then decreased until the D.U.T. stops triggering. tRC is measured at this point and recorded. CTEST D.U.T. 2 Figure 6. LED Current Required to Trigger versus LED Pulse Width 10 kΩ MERCURY WETTED RELAY 20 40 60 80 100 TA, AMBIENT TEMPERATURE (°C) Figure 4. IDRM2, Leakage in Inhibit State versus Temperature IFT, NORMALIZED LED TRIGGER CURRENT Figure 3. Leakage with LED Off versus Temperature 0 X100 SCOPE PROBE Vmax = 400 V 252 V ń + 0.63 RCVmax + 504 RC dv dt 0 VOLTS t t tRC Figure 7. Static dv/dt Test Circuit Motorola Optoelectronics Device Data 3 VCC Rin 1 360 Ω 6 HOT 2 MOC3081–83 5 39 240 Vac 4 3 0.01 330 LOAD NEUTRAL Typical circuit for use when hot line switching is required. In this circuit the “hot” side of the line is switched and the load connected to the cold or neutral side. The load may be connected to either the neutral or hot line. Rin is calculated so that IF is equal to the rated IFT of the part, 15 mA for the MOC3081, 10 mA for the MOC3082, and 5 mA for the MOC3083. The 39 ohm resistor and 0.01 µF capacitor are for snubbing of the triac and may or may not be necessary depending upon the particular triac and load used. * For highly inductive loads (power factor < 0.5), change this value to 360 ohms. Figure 8. Hot–Line Switching Application Circuit 240 Vac R1 VCC 3 Suggested method of firing two, back–to–back SCR’s, with a Motorola triac driver. Diodes can be 1N4001; resistors, R1 and R2, are optional 330 ohms. 6 1 Rin 2 D1 MOC3081–83 SCR 5 4 SCR 360 Ω NOTE: This device should not be used to drive a load directly. It is intended to be a trigger device only. D2 R2 LOAD Figure 9. Inverse–Parallel SCR Driver Circuit 4 Motorola Optoelectronics Device Data PACKAGE DIMENSIONS –A– 6 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEAD WHEN FORMED PARALLEL. 4 –B– 1 3 F 4 PL C N –T– L K SEATING PLANE J 6 PL 0.13 (0.005) G M E 6 PL D 6 PL 0.13 (0.005) M T A B M M T B M A M DIM A B C D E F G J K L M N M INCHES MIN MAX 0.320 0.350 0.240 0.260 0.115 0.200 0.016 0.020 0.040 0.070 0.010 0.014 0.100 BSC 0.008 0.012 0.100 0.150 0.300 BSC 0_ 15 _ 0.015 0.100 STYLE 6: PIN 1. 2. 3. 4. 5. 6. MILLIMETERS MIN MAX 8.13 8.89 6.10 6.60 2.93 5.08 0.41 0.50 1.02 1.77 0.25 0.36 2.54 BSC 0.21 0.30 2.54 3.81 7.62 BSC 0_ 15 _ 0.38 2.54 ANODE CATHODE NC MAIN TERMINAL SUBSTRATE MAIN TERMINAL CASE 730A–04 ISSUE G –A– 6 4 –B– 1 S NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3 F 4 PL L H C –T– G J K 6 PL E 6 PL 0.13 (0.005) D 6 PL 0.13 (0.005) M T A M B M SEATING PLANE T B M A M CASE 730C–04 ISSUE D Motorola Optoelectronics Device Data M DIM A B C D E F G H J K L S INCHES MIN MAX 0.320 0.350 0.240 0.260 0.115 0.200 0.016 0.020 0.040 0.070 0.010 0.014 0.100 BSC 0.020 0.025 0.008 0.012 0.006 0.035 0.320 BSC 0.332 0.390 MILLIMETERS MIN MAX 8.13 8.89 6.10 6.60 2.93 5.08 0.41 0.50 1.02 1.77 0.25 0.36 2.54 BSC 0.51 0.63 0.20 0.30 0.16 0.88 8.13 BSC 8.43 9.90 *Consult factory for leadform option availability 5 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEAD WHEN FORMED PARALLEL. –A– 6 4 –B– 1 3 L N F 4 PL C –T– SEATING PLANE G J K DIM A B C D E F G J K L N INCHES MIN MAX 0.320 0.350 0.240 0.260 0.115 0.200 0.016 0.020 0.040 0.070 0.010 0.014 0.100 BSC 0.008 0.012 0.100 0.150 0.400 0.425 0.015 0.040 MILLIMETERS MIN MAX 8.13 8.89 6.10 6.60 2.93 5.08 0.41 0.50 1.02 1.77 0.25 0.36 2.54 BSC 0.21 0.30 2.54 3.81 10.16 10.80 0.38 1.02 D 6 PL E 6 PL 0.13 (0.005) M T A M B M *Consult factory for leadform option availability CASE 730D–05 ISSUE D Motorola reserves the right to make changes without further notice to any products herein. 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Box 20912; Phoenix, Arizona 85036. 1–800–441–2447 JAPAN: Nippon Motorola Ltd.; Tatsumi–SPD–JLDC, Toshikatsu Otsuki, 6F Seibu–Butsuryu–Center, 3–14–2 Tatsumi Koto–Ku, Tokyo 135, Japan. 03–3521–8315 MFAX: [email protected] – TOUCHTONE (602) 244–6609 INTERNET: http://Design–NET.com HONG KONG: Motorola Semiconductors H.K. Ltd.; 8B Tai Ping Industrial Park, 51 Ting Kok Road, Tai Po, N.T., Hong Kong. 852–26629298 6 ◊ *MOC3081/D* Motorola OptoelectronicsMOC3081/D Device Data