Data Sheet

TDA8566
2 × 40 W/2 Ω stereo BTL car radio power amplifier with
differential inputs and diagnostic outputs
Rev. 06 — 15 October 2007
Product data sheet
1. General description
The TDA8566 is an integrated class-B output amplifier which is available in several
packages. TDA8566TH is contained in a 20-lead small outline plastic package. The
TDA8566TH1 is a 24-lead small outline plastic package which is pin compatible with the
I2C-bus controlled amplifier TDA1566TH for one board layout. TDA8566Q is a 17-pin
DIL-bent-SIL package.
The device contains 2 amplifiers in a Bridge-Tied Load (BTL) configuration. The output
power is 2 × 25 W in a 4 Ω load or 2 × 40 W in a 2 Ω load. It has a differential input stage
and 2 diagnostic outputs. The device is primarily developed for car radio applications.
2. Features
n
n
n
n
n
n
n
n
n
n
n
n
n
n
n
n
n
n
n
n
Differential inputs
Very high Common Mode Rejection Ratio (CMRR)
High common mode input signal handling
Requires very few external components
High output power
4 Ω and 2 Ω load driving capability
Low offset voltage at output
Fixed gain
Diagnostic facility (distortion, short-circuit and temperature pre-warning)
Good ripple rejection
Mode select switch (operating, mute and standby)
Load dump protection
Short-circuit proof to ground, to VP and across the load
Low power dissipation in any short-circuit condition
Thermally protected
Reverse polarity safe
Protected against electrostatic discharge
No switch-on/switch-off plops
Low thermal resistance
TDA8566TH1 is pin compatible with TDA1566TH
TDA8566
NXP Semiconductors
2 × 40 W/2 Ω stereo BTL car radio power amplifier
3. Quick reference data
Table 1.
Quick reference data
VP = 14.4 V; Tamb = 25 °C; fi = 1 kHz; measured in test circuit of Figure 9; unless otherwise
specified.
Symbol Parameter
Conditions
Min
[1]
VP
supply voltage
IORM
repetitive peak output
current
Iq
quiescent current
Istb
standby current
Zi
input impedance
differential
Po
output power
RL = 4 Ω; THD = 10 %
RL = ∞ Ω
RL = 2 Ω; THD = 10 %
SVRR
supply voltage ripple
rejection
operating
αcs
channel separation
Po = 25 W; Rs = 10 kΩ
CMRR
common mode rejection Rs = 0 Ω
ratio
Gv
closed loop voltage gain
Vn(o)
noise output voltage
operating; Rs = 0 Ω
[2]
[3]
[4]
Typ
Max
Unit
6
14.4
18
V
-
-
7.5
A
-
115
180
mA
-
0.1
10
µA
100
120
150
kΩ
21
25
-
W
33
40
-
W
50
60
-
dB
45
50
-
dB
60
75
-
dB
25
26
27
dB
-
85
120
µV
[1]
The circuit is DC adjusted at VP = 6 V to 18 V and AC operating at VP = 8.5 V to 18 V.
[2]
Vripple = Vripple(max) = 2 V (p-p); Rs = 0 Ω.
[3]
Common mode rejection ratio measured at the output (over RL) with both inputs tied together;
Vcommon ≤ 3.5 V (RMS); fi = 100 Hz to 10 kHz; Rs = 0 Ω.
[4]
Noise measured in a bandwidth of 20 Hz to 20 kHz.
4. Ordering information
Table 2.
Ordering information
Type number
Package
Name
Description
Version
TDA8566TH
HSOP20
plastic, heatsink small outline package; 20 leads; low stand-off height
SOT418-3
TDA8566TH1
HSOP24
plastic, heatsink small outline package; 24 leads; low stand-off height
SOT566-3
TDA8566Q
DBS17P
plastic DIL-bent-SIL power package; 17 leads (lead length 12 mm)
SOT243-1
TDA8566_6
Product data sheet
© NXP B.V. 2007. All rights reserved.
Rev. 06 — 15 October 2007
2 of 21
TDA8566
NXP Semiconductors
2 × 40 W/2 Ω stereo BTL car radio power amplifier
5. Block diagram
VP1
mute
switch
IN1+
VP2
CM
IN1−
OUT1+
VA
2.3
kΩ
2.3 kΩ
mute
switch
(9×)
CM
OUT1−
VA
60
kΩ
60
kΩ
2.3
kΩ
2.3 kΩ
(9×)
n.c.
standby
switch
MODE
standby
reference
voltage
VA
Vref
SGND
TDA8566
mute
switch
CLIP
CLIP
DIAG
DIAG
1×
60
kΩ
mute
reference
voltage
60
kΩ
mute
switch
IN2+
CM
IN2−
OUT2+
VA
2.3
kΩ
2.3 kΩ
mute
switch
(9×)
CM
OUT2−
VA
2.3
kΩ
HEATTAB(1)
2.3 kΩ
(9×)
PGND2
mgu358
PGND1
(1) Pin HEATTAB is available in TDA8566TH1 only.
Fig 1. Block diagram
TDA8566_6
Product data sheet
© NXP B.V. 2007. All rights reserved.
Rev. 06 — 15 October 2007
3 of 21
TDA8566
NXP Semiconductors
2 × 40 W/2 Ω stereo BTL car radio power amplifier
6. Pinning information
6.1 Pinning
HEATTAB 24
1
MODE 20
1
DIAG
VP2 23
2
IN2+
VP2 19
2
IN2+
n.c. 22
3
IN2−
OUT2− 18
3
IN2−
OUT2− 21
4
n.c.
PGND2 17
4
n.c.
PGND2 20
5
n.c.
5
n.c.
OUT2+ 19
6
n.c.
6
n.c.
OUT1− 18
PGND1 14
7
n.c.
PGND1 17
OUT1+ 13
8
IN1+
OUT1+ 16
VP1 12
9
IN1−
n.c. 15
10 IN1+
VP1 14
11 IN1−
OUT2+ 16
OUT1− 15
TDA8566TH
CLIP 11
10 SGND
TDA8566TH1
DIAG
7
MODE
8
n.c.
9
n.c.
12 SGND
CLIP 13
001aag902
001aah015
Fig 2. Pin configuration TDA8566TH
Fig 3. Pin configuration TDA8566TH1
IN1+
1
IN1−
2
SGND
3
CLIP
4
VP1
5
OUT1+
6
PGND1
7
OUT1−
8
n.c.
9
TDA8566Q
OUT2+ 10
PGND2 11
OUT2− 12
VP2 13
MODE 14
DIAG 15
IN2+ 16
IN2− 17
001aah059
Fig 4. Pin configuration TDA8566Q
TDA8566_6
Product data sheet
© NXP B.V. 2007. All rights reserved.
Rev. 06 — 15 October 2007
4 of 21
TDA8566
NXP Semiconductors
2 × 40 W/2 Ω stereo BTL car radio power amplifier
6.2 Pin description
Table 3.
Symbol
Pin description TDA8566TH and TDA8566TH1
Pin
Description
TDA8566TH
TDA8566TH1
DIAG
1
1
short-circuit and temperature pre-warning
diagnostic output
IN2+
2
2
channel 2 input positive
IN2−
3
3
channel 2 input negative
n.c.
4
4
not connected
n.c.
5
5
not connected
n.c.
6
6
not connected
n.c.
7
-
not connected
n.c.
-
8
not connected
n.c.
-
9
not connected
IN1+
8
10
channel 1 input positive
IN1−
9
11
channel 1 input negative
SGND
10
12
signal ground
CLIP
11
13
clip detection output
VP1
12
14
supply voltage 1
n.c.
-
15
not connected
OUT1+
13
16
channel 1 output positive
PGND1
14
17
power ground 1
OUT1−
15
18
channel 1 output negative
n.c.
-
-
not connected
OUT2+
16
19
channel 2 output positive
PGND2
17
20
power ground 2
OUT2−
18
21
channel 2 output negative
n.c.
-
22
not connected
VP2
19
23
supply voltage 2
MODE
20
7
mode select switch input (standby/mute/operating)
HEATTAB
-
24
connect to ground, used for test purposes only
Table 4.
Pin description TDA8566Q
Symbol
Pin
Description
IN1+
1
channel 1 input positive
IN1−
2
channel 1 input negative
SGND
3
signal ground
CLIP
4
clip detection output
VP1
5
supply voltage 1
OUT1+
6
channel 1 output positive
PGND1
7
power ground 1
OUT1−
8
channel 1 output negative
n.c.
9
not connected
TDA8566_6
Product data sheet
© NXP B.V. 2007. All rights reserved.
Rev. 06 — 15 October 2007
5 of 21
TDA8566
NXP Semiconductors
2 × 40 W/2 Ω stereo BTL car radio power amplifier
Table 4.
Pin description TDA8566Q …continued
Symbol
Pin
Description
OUT2+
10
channel 2 output positive
PGND2
11
power ground 2
OUT2−
12
channel 2 output negative
VP2
13
supply voltage 2
MODE
14
mode select switch input (standby/mute/operating)
DIAG
15
short-circuit and temperature pre-warning diagnostic output
IN2+
16
channel 2 input positive
IN2−
17
channel 2 input negative
7. Functional description
The TDA8566 contains 2 identical amplifiers and can be used for BTL applications. The
gain of each amplifier is fixed at 26 dB. Special features of this device are:
•
•
•
•
•
•
Mode select switch
Clip detection
Short-circuit diagnostic
Temperature pre-warning
Open-collector diagnostic outputs
Differential inputs
7.1 Mode select switch (pin MODE)
• Standby: low supply current
• Mute: input signal suppressed
• Operating: normal on condition
Since this pin has a very low input current (< 40 µA), a low-cost supply switch can be
applied. To avoid switch-on plops, it is advisable to keep the amplifier in the mute mode for
a period of ≥ 150 ms (charging the input capacitors at pins IN1+, IN1−, IN2+ and IN2−).
This can be realized by using a microcontroller or by using an external timing circuit as
illustrated in Figure 8.
7.2 Clip detection (pin CLIP)
When clipping occurs at one or more output stages, the dynamic distortion detector
becomes active and pin CLIP goes LOW. This information can be used to drive a sound
processor or a DC volume control to attenuate the input signal and so limit the level of
distortion. The output level of pin CLIP is independent of the number of channels that are
being clipped. The clip detection circuit is disabled in a short-circuit condition, so if a fault
condition occurs at the outputs, pin CLIP will remain at a HIGH level. The clip detection
waveforms are illustrated in Figure 5.
TDA8566_6
Product data sheet
© NXP B.V. 2007. All rights reserved.
Rev. 06 — 15 October 2007
6 of 21
TDA8566
NXP Semiconductors
2 × 40 W/2 Ω stereo BTL car radio power amplifier
VO
(V)
0
VCLIP
(V)
0
t (s)
mgu357
Fig 5. Clip detection waveforms
7.3 Short-circuit diagnostic (pin DIAG)
When a short-circuit occurs at one or more outputs to ground or to the supply voltage, the
output stages are switched off until the short-circuit is removed and the device is switched
on again (with a delay of approximately 20 ms after the removal of the short-circuit).
During this short-circuit condition, pin DIAG is continuously LOW.
When a short-circuit occurs across the load of one or both channels, the output stages are
switched off for approximately 20 ms. After that time the load condition is checked during
approximately 50 µs to see whether the short-circuit is still present. Due to this duty cycle
of 50 µs/20 ms the average current consumption during the short-circuit condition is very
low (approximately 40 mA). During this condition, pin DIAG is LOW for 20 ms and HIGH
for 50 µs; see Figure 6. The power dissipation in any short-circuit condition is very low.
current
in
output
stage
t (s)
short-circuit over the load
VDIAG
20 ms
(V)
t (s)
50 µs
mgu360
Fig 6. Short-circuit diagnostic timing diagram
7.4 Temperature pre-warning (pin DIAG)
When the virtual junction temperature (Tvj) reaches 145 °C, pin DIAG will become
continuously LOW.
7.5 Open-collector diagnostic outputs
Pins DIAG and CLIP are open-collector outputs, therefore more devices can be tied
together. Pins DIAG and CLIP can also be tied together. An external pull-up resistor is
required.
TDA8566_6
Product data sheet
© NXP B.V. 2007. All rights reserved.
Rev. 06 — 15 October 2007
7 of 21
TDA8566
NXP Semiconductors
2 × 40 W/2 Ω stereo BTL car radio power amplifier
7.6 Differential inputs
The input stage is a high-impedance fully differential balanced input stage that is also
capable of operating in a single-ended mode with one of the inputs capacitively coupled to
an audio ground. It should be noted that if a source resistance is added (input voltage
dividers) the CMRR degrades to lower values.
8. Limiting values
Table 5.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
Min
Max
Unit
VP
supply voltage
operating
-
18
V
non-operating
-
30
V
load dump protection;
during 50 ms; tr ≥ 2.5 ms
-
45
V
IOSM
non-repetitive peak output
current
-
10
A
IORM
repetitive peak output
current
-
7.5
A
Tstg
storage temperature
−55
+150
°C
Tvj
virtual junction temperature
-
150
°C
Tamb
ambient temperature
−40
+85
°C
Vpsc
short-circuit safe voltage
-
18
V
Vrp
reverse polarity voltage
-
6.0
V
Ptot
total power dissipation
-
60
W
9. Thermal characteristics
Table 6.
Thermal characteristics
Thermal characteristics in accordance with IEC 60747-1.
Symbol
Parameter
Conditions
Typ
Unit
Rth(j-c)
thermal resistance from junction to case
see Figure 7
1.3
K/W
Rth(j-a)
thermal resistance from junction to ambient in free air
40
K/W
output 1
output 2
virtual junction
2.2 K/W
2.2 K/W
0.2 K/W
case
001aaa155
Fig 7. Equivalent thermal resistance network
TDA8566_6
Product data sheet
© NXP B.V. 2007. All rights reserved.
Rev. 06 — 15 October 2007
8 of 21
TDA8566
NXP Semiconductors
2 × 40 W/2 Ω stereo BTL car radio power amplifier
10. Static characteristics
Table 7.
Static characteristics
VP = 14.4 V; Tamb = 25 °C; measured in test circuit of Figure 9; unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Supply
VP
supply voltage
Iq
quiescent current
[1]
RL = ∞ Ω
6
14.4
18
V
-
115
180
mA
8.5
-
VP
V
-
15
40
µA
-
7.0
-
V
-
-
100
mV
3.3
-
6.4
V
-
7.0
-
V
-
-
60
mV
-
-
60
mV
Operating condition
VMODE
mode select switch
level
IMODE
mode select switch
current
VO
output voltage
VOO
output offset voltage
VMODE = 14.4 V
[2]
Mute condition
VMODE
mode select switch
level
VO
output voltage
VOO
output offset voltage
∆VOO
output offset voltage
difference
[2]
with respect to
operating condition
Standby condition
VMODE
mode select switch
level
0
-
2
V
Istb
standby current
-
0.1
10
µA
-
-
0.6
V
Diagnostic
VDIAG
diagnostic output
voltage
during any fault
condition
[1]
The circuit is DC adjusted at VP = 6 V to 18 V and AC operating at VP = 8.5 V to 18 V.
[2]
At VP = 18 V to 30 V the DC output voltage is ≤ 0.5VP.
TDA8566_6
Product data sheet
© NXP B.V. 2007. All rights reserved.
Rev. 06 — 15 October 2007
9 of 21
TDA8566
NXP Semiconductors
2 × 40 W/2 Ω stereo BTL car radio power amplifier
11. Dynamic characteristics
Table 8.
Dynamic characteristics
VP = 14.4 V; Tamb = 25 °C; RL = 2 Ω; fi = 1 kHz; measured in test circuit of Figure 9; unless
otherwise specified.
Symbol
Parameter
Po
output power
THD
Conditions
total harmonic
distortion
25
30
-
W
40
-
W
THD = 30 %
45
55
-
W
VP = 13.5 V; THD = 0.5 %
-
25
-
W
VP = 13.5 V; THD = 10 %
-
35
-
W
THD = 0.5 %; RL = 4 Ω
16
19
-
W
THD = 10 %; RL = 4 Ω
21
25
-
W
THD = 30 %; RL = 4 Ω
28
35
-
W
VP = 13.5 V;
THD = 0.5 %; RL = 4 Ω
-
14
-
W
VP = 13.5 V; THD = 10 %;
RL = 4 Ω
-
22
-
W
-
0.1
-
%
-
8
-
%
Po = 1 W; RL = 4 Ω
-
0.05
-
%
-
20 to
20000
-
Hz
-
25
-
Hz
20
-
-
kHz
25
26
27
dB
Po = 1 W
VCLIP = 0.6 V
fro(l)
low frequency roll
off
−1 dB
fro(h)
high frequency roll
off
−1 dB
Gv
closed loop voltage
gain
SVRR
supply voltage
ripple rejection
input impedance
mismatch
Vn(o)
noise output
voltage
αcs
channel separation
|∆Gv|
channel unbalance
[1]
[2]
operating
[3]
50
60
-
dB
mute
[3]
50
-
-
dB
standby
[3]
80
-
-
dB
differential
100
120
150
kΩ
single-ended
50
60
75
kΩ
-
2
-
%
operating; Rs = 0 Ω
[4]
-
85
120
µV
operating; Rs = 10 kΩ
[4]
-
100
-
µV
mute; independent of Rs
[4]
Po = 25 W; Rs = 10 kΩ
TDA8566_6
Product data sheet
Unit
33
THD = 0.5 %; Po = −1 dB
with respect to 25 W
|∆Zi|
Max
THD = 0.5 %
power bandwidth
input impedance
Typ
THD = 10 %
B
Zi
Min
-
60
-
µV
45
50
-
dB
-
-
1
dB
© NXP B.V. 2007. All rights reserved.
Rev. 06 — 15 October 2007
10 of 21
TDA8566
NXP Semiconductors
2 × 40 W/2 Ω stereo BTL car radio power amplifier
Table 8.
Dynamic characteristics …continued
VP = 14.4 V; Tamb = 25 °C; RL = 2 Ω; fi = 1 kHz; measured in test circuit of Figure 9; unless
otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Vo(mute)
output signal
voltage in mute
Vin = Vin(max) = 1 V (RMS)
-
-
2
mV
CMRR
common mode
rejection ratio
Rs = 0 Ω
[5]
60
75
-
dB
Rs = 45 kΩ
[6]
40
-
-
dB
[1]
Dynamic distortion detector active; pin CLIP is LOW.
[2]
Frequency response externally fixed.
[3]
Vripple = Vripple(max) = 2 V (p-p); Rs = 0 Ω.
[4]
Noise measured in a bandwidth of 20 Hz to 20 kHz.
[5]
Common mode rejection ratio measured at the output (over RL) with both inputs tied together;
Vcommon ≤ 3.5 V (RMS); fi = 100 Hz to 10 kHz; Rs = 0 Ω.
[6]
Common mode rejection ratio measured at the output (over RL) with both inputs tied together;
Vcommon ≤ 3.5 V (RMS); fi = 1 kHz; Rs = 45 kΩ. The mismatch of the input coupling capacitors is excluded.
12. Application information
12.1 Diagnostic output
Special care must be taken in the PCB layout to separate pin CLIP from
pins IN1+, IN1−, IN2+ and IN2− to minimize the crosstalk between the CLIP output and
the inputs.
12.2 Mode select switch
To avoid switch-on plops, it is advisable to keep the amplifier in the mute mode during
≥ 150 ms (charging of the input capacitors at pins IN1+, IN1−, IN2+ and IN2−). The circuit
in Figure 8 slowly ramps-up the voltage at the mode select switch pin when switching on
and results in fast muting when switching off.
+VP
S
10 kΩ
+
47 µF
100 Ω
mode
select
switch
100 kΩ
mgd102
Fig 8. Mode select switch circuit
TDA8566_6
Product data sheet
© NXP B.V. 2007. All rights reserved.
Rev. 06 — 15 October 2007
11 of 21
TDA8566
NXP Semiconductors
2 × 40 W/2 Ω stereo BTL car radio power amplifier
13. Test information
+
VMODE
_
MODE
Rs/2
220 nF
VP1
VP2
+
2200 µF
(16V)
100
nF
VP =
_ 14.4 V
IN1+
OUT1+
60
kΩ
TDA8566
Vin1
Rs/2
220 nF
IN1−
60
kΩ
OUT1−
−
SGND
220 nF
VP
10
kΩ
Vref
Rs/2
RL1
VP
10
kΩ
CLIP
DETECTOR
CLIP
DIAGNOSTIC
INTERFACE
DIAG
IN2+
OUT2+
60
kΩ
RL2
Vin2
Rs/2
220 nF
60
kΩ
OUT2−
IN2−
PGND1
PGND2
mgu359
Fig 9. Stereo BTL test diagram
TDA8566_6
Product data sheet
© NXP B.V. 2007. All rights reserved.
Rev. 06 — 15 October 2007
12 of 21
TDA8566
NXP Semiconductors
2 × 40 W/2 Ω stereo BTL car radio power amplifier
14. Package outline
HSOP20: plastic, heatsink small outline package; 20 leads; low stand-off height
SOT418-3
E
D
A
x
X
c
E2
y
HE
v M A
D1
D2
10
1
pin 1 index
Q
A
A2
E1
(A3)
A4
θ
Lp
detail X
20
11
Z
w M
bp
e
0
5
10 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
mm
A
A2
max.
3.5
3.5
3.2
A3
0.35
A4(1)
D1
D2
E(2)
E1
E2
e
HE
Lp
Q
+0.08 0.53 0.32 16.0 13.0
−0.04 0.40 0.23 15.8 12.6
1.1
0.9
11.1
10.9
6.2
5.8
2.9
2.5
1.27
14.5
13.9
1.1
0.8
1.7
1.5
bp
c
D(2)
v
w
x
y
0.25 0.25 0.03 0.07
Z
θ
2.5
2.0
8°
0°
Notes
1. Limits per individual lead.
2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
REFERENCES
IEC
JEDEC
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
02-02-12
03-07-23
SOT418-3
Fig 10. Package outline SOT418-3 (HSOP20)
TDA8566_6
Product data sheet
© NXP B.V. 2007. All rights reserved.
Rev. 06 — 15 October 2007
13 of 21
TDA8566
NXP Semiconductors
2 × 40 W/2 Ω stereo BTL car radio power amplifier
HSOP24: plastic, heatsink small outline package; 24 leads; low stand-off height
SOT566-3
E
D
A
x
X
c
E2
y
HE
v M A
D1
D2
12
1
pin 1 index
Q
A
A2
E1
(A3)
A4
θ
Lp
detail X
24
13
Z
w M
bp
e
0
5
10 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
mm
A
A2
max.
3.5
3.5
3.2
A3
0.35
A4(1)
D1
D2
E(2)
E1
E2
e
HE
Lp
Q
+0.08 0.53 0.32 16.0 13.0
−0.04 0.40 0.23 15.8 12.6
1.1
0.9
11.1
10.9
6.2
5.8
2.9
2.5
1
14.5
13.9
1.1
0.8
1.7
1.5
bp
c
D(2)
v
w
x
y
0.25 0.25 0.03 0.07
Z
θ
2.7
2.2
8°
0°
Notes
1. Limits per individual lead.
2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
REFERENCES
IEC
JEDEC
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
03-02-18
03-07-23
SOT566-3
Fig 11. Package outline SOT566-3 (HSOP24)
TDA8566_6
Product data sheet
© NXP B.V. 2007. All rights reserved.
Rev. 06 — 15 October 2007
14 of 21
TDA8566
NXP Semiconductors
2 × 40 W/2 Ω stereo BTL car radio power amplifier
DBS17P: plastic DIL-bent-SIL power package; 17 leads (lead length 12 mm)
SOT243-1
non-concave
Dh
x
D
Eh
view B: mounting base side
A2
d
B
j
E
A
L3
L
Q
c
1
v M
17
e1
Z
bp
e
e2
m
w M
0
5
10 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
A2
bp
c
D (1)
d
Dh
E (1)
mm
17.0
15.5
4.6
4.4
0.75
0.60
0.48
0.38
24.0
23.6
20.0
19.6
10
12.2
11.8
e
e2
Eh
j
L
L3
m
Q
v
w
x
Z (1)
5.08
6
3.4
3.1
12.4
11.0
2.4
1.6
4.3
2.1
1.8
0.8
0.4
0.03
2.00
1.45
e1
2.54 1.27
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
REFERENCES
IEC
JEDEC
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
99-12-17
03-03-12
SOT243-1
Fig 12. Package outline SOT243-1 (DBS17P)
TDA8566_6
Product data sheet
© NXP B.V. 2007. All rights reserved.
Rev. 06 — 15 October 2007
15 of 21
TDA8566
NXP Semiconductors
2 × 40 W/2 Ω stereo BTL car radio power amplifier
15. Soldering
This text provides a very brief insight into a complex technology. A more in-depth account
of soldering ICs can be found in Application Note AN10365 “Surface mount reflow
soldering description”.
15.1 Introduction to soldering
Soldering is one of the most common methods through which packages are attached to
Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both
the mechanical and the electrical connection. There is no single soldering method that is
ideal for all IC packages. Wave soldering is often preferred when through-hole and
Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not
suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high
densities that come with increased miniaturization.
15.2 Wave and reflow soldering
Wave soldering is a joining technology in which the joints are made by solder coming from
a standing wave of liquid solder. The wave soldering process is suitable for the following:
• Through-hole components
• Leaded or leadless SMDs, which are glued to the surface of the printed circuit board
Not all SMDs can be wave soldered. Packages with solder balls, and some leadless
packages which have solder lands underneath the body, cannot be wave soldered. Also,
leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered,
due to an increased probability of bridging.
The reflow soldering process involves applying solder paste to a board, followed by
component placement and exposure to a temperature profile. Leaded packages,
packages with solder balls, and leadless packages are all reflow solderable.
Key characteristics in both wave and reflow soldering are:
•
•
•
•
•
•
Board specifications, including the board finish, solder masks and vias
Package footprints, including solder thieves and orientation
The moisture sensitivity level of the packages
Package placement
Inspection and repair
Lead-free soldering versus PbSn soldering
15.3 Wave soldering
Key characteristics in wave soldering are:
• Process issues, such as application of adhesive and flux, clinching of leads, board
transport, the solder wave parameters, and the time during which components are
exposed to the wave
• Solder bath specifications, including temperature and impurities
TDA8566_6
Product data sheet
© NXP B.V. 2007. All rights reserved.
Rev. 06 — 15 October 2007
16 of 21
TDA8566
NXP Semiconductors
2 × 40 W/2 Ω stereo BTL car radio power amplifier
15.4 Reflow soldering
Key characteristics in reflow soldering are:
• Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see Figure 13) than a PbSn process, thus
reducing the process window
• Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
• Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 9 and 10
Table 9.
SnPb eutectic process (from J-STD-020C)
Package thickness (mm)
Package reflow temperature (°C)
Volume (mm3)
< 350
≥ 350
< 2.5
235
220
≥ 2.5
220
220
Table 10.
Lead-free process (from J-STD-020C)
Package thickness (mm)
Package reflow temperature (°C)
Volume (mm3)
< 350
350 to 2000
> 2000
< 1.6
260
260
260
1.6 to 2.5
260
250
245
> 2.5
250
245
245
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see Figure 13.
TDA8566_6
Product data sheet
© NXP B.V. 2007. All rights reserved.
Rev. 06 — 15 October 2007
17 of 21
TDA8566
NXP Semiconductors
2 × 40 W/2 Ω stereo BTL car radio power amplifier
temperature
maximum peak temperature
= MSL limit, damage level
minimum peak temperature
= minimum soldering temperature
peak
temperature
time
001aac844
MSL: Moisture Sensitivity Level
Fig 13. Temperature profiles for large and small components
For further information on temperature profiles, refer to Application Note AN10365
“Surface mount reflow soldering description”.
TDA8566_6
Product data sheet
© NXP B.V. 2007. All rights reserved.
Rev. 06 — 15 October 2007
18 of 21
TDA8566
NXP Semiconductors
2 × 40 W/2 Ω stereo BTL car radio power amplifier
16. Revision history
Table 11.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
TDA8566_6
20071015
Product data sheet
-
TDA8566Q_5
TDA8566TH_2
Modifications:
•
The format of this data sheet has been redesigned to comply with the new identity
guidelines of NXP Semiconductors.
•
•
•
•
Legal texts have been adapted to the new company name where appropriate.
Section 9 “Thermal characteristics”: changed value of Rth(j-c) to 1.3 K/W
Figure 7: values updated
Included TDA8566TH1 and TDA8566Q in the data sheet
TDA8566Q_5
20010221
Product specification
-
-
TDA8566TH_2
20030708
Product specification
-
-
TDA8566_6
Product data sheet
© NXP B.V. 2007. All rights reserved.
Rev. 06 — 15 October 2007
19 of 21
TDA8566
NXP Semiconductors
2 × 40 W/2 Ω stereo BTL car radio power amplifier
17. Legal information
17.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
17.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
17.3 Disclaimers
General — Information in this document is believed to be accurate and
reliable. However, NXP Semiconductors does not give any representations or
warranties, expressed or implied, as to the accuracy or completeness of such
information and shall have no liability for the consequences of use of such
information.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
malfunction of a NXP Semiconductors product can reasonably be expected to
result in personal injury, death or severe property or environmental damage.
NXP Semiconductors accepts no liability for inclusion and/or use of NXP
Semiconductors products in such equipment or applications and therefore
such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.
Terms and conditions of sale — NXP Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at http://www.nxp.com/profile/terms, including those pertaining to warranty,
intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conflict between information in this document and such
terms and conditions, the latter will prevail.
No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or the
grant, conveyance or implication of any license under any copyrights, patents
or other industrial or intellectual property rights.
17.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
18. Contact information
For additional information, please visit: http://www.nxp.com
For sales office addresses, send an email to: [email protected]
TDA8566_6
Product data sheet
© NXP B.V. 2007. All rights reserved.
Rev. 06 — 15 October 2007
20 of 21
TDA8566
NXP Semiconductors
2 × 40 W/2 Ω stereo BTL car radio power amplifier
19. Contents
1
2
3
4
5
6
6.1
6.2
7
7.1
7.2
7.3
7.4
7.5
7.6
8
9
10
11
12
12.1
12.2
13
14
15
15.1
15.2
15.3
15.4
16
17
17.1
17.2
17.3
17.4
18
19
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Quick reference data . . . . . . . . . . . . . . . . . . . . . 2
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Pinning information . . . . . . . . . . . . . . . . . . . . . . 4
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 5
Functional description . . . . . . . . . . . . . . . . . . . 6
Mode select switch (pin MODE) . . . . . . . . . . . . 6
Clip detection (pin CLIP). . . . . . . . . . . . . . . . . . 6
Short-circuit diagnostic (pin DIAG) . . . . . . . . . . 7
Temperature pre-warning (pin DIAG) . . . . . . . . 7
Open-collector diagnostic outputs . . . . . . . . . . 7
Differential inputs . . . . . . . . . . . . . . . . . . . . . . . 8
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 8
Thermal characteristics. . . . . . . . . . . . . . . . . . . 8
Static characteristics. . . . . . . . . . . . . . . . . . . . . 9
Dynamic characteristics . . . . . . . . . . . . . . . . . 10
Application information. . . . . . . . . . . . . . . . . . 11
Diagnostic output . . . . . . . . . . . . . . . . . . . . . . 11
Mode select switch . . . . . . . . . . . . . . . . . . . . . 11
Test information . . . . . . . . . . . . . . . . . . . . . . . . 12
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 13
Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Introduction to soldering . . . . . . . . . . . . . . . . . 16
Wave and reflow soldering . . . . . . . . . . . . . . . 16
Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 16
Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 17
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 19
Legal information. . . . . . . . . . . . . . . . . . . . . . . 20
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 20
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Contact information. . . . . . . . . . . . . . . . . . . . . 20
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2007.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 15 October 2007
Document identifier: TDA8566_6