Package Outline Drawing (POD)

Plastic Packages for Integrated Circuits
Package Outline Drawing
L11.4x4
11 LEAD DUAL FLAT NO-LEAD PLASTIC PACKAGE
Rev 1, 3/15
2X 2.5
4.00
A
6
PIN 1
INDEX AREA
PIN #1 INDEX AREA
8X 0.50
6
1.0
B
5
1
11X 0 . 45 ± 0 . 1
4.00
(4X)
1.58
0.15
11
6
0.10 M C A B
0.05 M C
TOP VIEW
4 0.25
2.80
BOTTOM VIEW
( 2.80 )
SEE DETAIL "X"
0.10 C
( 11 X 0.65 )
BASE PLANE
0 .9 ± 0.1mm
SIDE VIEW
C
SEATING PLANE
0.08 C
( 3.75 )
( 1.58 )
C
0 . 2 REF
0 . 00 MIN.
0 . 05 MAX.
DETAIL "X"
( 11 X 0 . 25 )
(8X 0.5)
TYPICAL RECOMMENDED LAND PATTERN
NOTES:
1. Dimensions are in millimeters.
Dimensions in ( ) for Reference Only.
2. Dimensioning and tolerancing conform to AMSE Y14.5m-1994.
3. Unless otherwise specified, tolerance : Decimal ± 0.05
4.
Dimension b applies to the metallized terminal and is measured
between 0.15mm and 0.30mm from the terminal tip.
5. Tiebar shown (if present) is a non-functional feature and
may be located on any of the 4 sides (or ends).
6.
1
The configuration of the pin #1 identifier is optional, but must be
located within the zone indicated. The pin #1 indentifier may be
either a mold or mark feature.