Package Outline Drawing (POD)

Plastic Packages for Integrated Circuits
Package Outline Drawing
L8.2x3
8 LEAD DUAL FLAT NO-LEAD PLASTIC PACKAGE
Rev 2, 3/15
2.00
A
2X 1.50
PIN 1
INDEX AREA
6
PIN #1
INDEX AREA
6X 0.50
1
1.80 +0.10/-0.15
3.00
B
(4X)
0.15
8
8X 0.40 ±0.10
TOP VIEW
1.65 +0.10/-0.15
8X 0.25 +0.07/-0.05 4
0.10 M C A B
BOTTOM VIEW
SEE DETAIL "X"
0.90 ±0.10
0.10 C
(1.65)
(1.50)
(8X 0.60)
C
BASE PLANE
SEATING PLANE
0.08 C
0.05 MAX
SIDE VIEW
(2.80)(1.80)
0.20 REF
C
(6X 0.50)
0.05 MAX
(8X 0.25)
DETAIL "X"
TYPICAL RECOMMENDED LAND PATTERN
NOTES:
1
1.
Dimensions are in millimeters.
Dimensions in ( ) for Reference Only.
2.
Dimensioning and tolerancing conform to ASME Y14.5m-1994.
3.
Unless otherwise specified, tolerance : Decimal ± 0.05
4.
Dimension applies to the metallized terminal and is measured
between 0.25mm and 0.30mm from the terminal tip.
5.
Tiebar shown (if present) is a non-functional feature and may be
located on any of the 4 sides (or ends).
6.
The configuration of the pin #1 identifier is optional, but must be
located within the zone indicated. The pin #1 identifier may be
either a mold or mark feature.
7.
Compies to JEDEC MO-229 VCED-2.