Plastic Packages for Integrated Circuits Metric Plastic Quad Flatpack Packages (MQFP) D MDP0055 D1 14x20mm 128 LEAD MQFP (WITH AND WITHOUT HEAT SPREADER) 3.2mm FOOTPRINT 128 PIN 1 ID 1 DIMENSIONS (MILLIMETERS) A Max 3.40 20.000 ±0.100 (E1) 19.870 ±0.100 18.500 REF E1 E SYMBOL 12.500 REF C0.600x0.350 (4X) 13.870 ±0.100 A 1 A 14.000 ±0.100 (D1) 12° ALL AROUND Y b T1 T REMARKS Overall height A1 0.250~0.500 Standoff A2 2.750 ±0.250 Package thickness α 0°~7° b 0.220 ±0.050 Foot angle b1 0.200 ±0.030 D 17.200 ±0.250 Lead width 1 Lead base metal width 1 Lead tip to tip D1 14.000 ±0.100 Package length E 23.200 ±0.250 Lead tip to tip E1 20.000 ±0.100 Package width e 0.500 Base Lead pitch L 0.880 ±0.150 Foot length L1 1.600 Ref. Lead length T 0.170 ±0.060 Frame thickness 1 T1 0.152 ±0.040 ccc 0.100 Frame base metal thickness 1 Foot coplanarity ddd 0.100 Foot position Rev. 2 2/07 b1 NOTES: 1 SECTION A-A DROP IN HEAT SPREADER 4 STAND POINTS EXPOSED 1. General tolerance: Distance ±0.100, Angle +2.5°. 2. 1 Matte finish on package body surface except ejection and pin 1 marking (Ra 0.8~2.0um). 3. All molded body sharp corner RADII unless otherwise specified (Max RO.200). 4. Package/Leadframe misalignment (X, Y): Max. 0.127 5. Top/Bottom misalignment (X, Y): Max. 0.127 R0.25 TYP ALL AROUND 6. Drawing does not include plastic or metal protrusion or cutting burr. 0.200 MIN 7. 0° MIN A2 R0.13 MIN ccc C A 0.13~0.30 α SEATING PLANE L e A1 C L1 b ddd M C DETAIL Y 1 GAUGE PLANE 0.25 BASE T 2 Compliant to JEDEC MS-022.